JP2019120491A - Method for inspecting defects and defects inspection system - Google Patents

Abstract

An object of the present invention is to control the arrangement of photographing devices for defects so that visual inspection of defects is easy. A defect inspection system refers to a defect extraction processing unit that extracts a defect area in which a defect is captured from an acquired image captured by an imaging device, and refers to characteristic information of defect type data. A defect determination processing unit 53 for classifying the type of the defect 12 in the defect area 92 extracted by the defect extraction processing unit 52; and a type of the defect 12 classified by the defect determination processing unit 53 with reference to the device control data 51b. Is determined, and a device arrangement control unit 54 that controls the image pickup device 21 so that the arrangement is determined, and an acquired image captured by the image pickup device 21 controlled by the device position control unit 54 And a display control unit 55 for displaying 91 on the display device 60. [Selection diagram] Fig. 1

Description

  The present invention relates to a defect inspection method and a defect inspection system.

In a social infrastructure structure such as a tunnel or a power plant, visual inspection (VT) may be applied as a method of checking the soundness of the structure. In the visual inspection, the inspector directly visually recognizes the area to be inspected or indirectly visually recognizes the image acquired by the imaging device such as a camera from the display device, and detects the presence or absence of the detection target defect on the object area. It is to judge.
When the structure to be inspected is in a harsh environment such as high places or narrow parts or high temperature or high radiation environment, and it is difficult to visually recognize the object to be inspected directly, it is acquired by the imaging device mounted on the remote control device Use the video that has been As a result, the inspector can visually inspect the image from a distant place.

The images obtained for visual inspection differ in the visibility of the defects in the captured image depending on the nature of the defect, the surface condition of the structure to be inspected, the imaging device, and the conditions of illumination used in combination. Therefore, a method for quantitatively evaluating the visibility of an imaging system has been proposed.
For example, Patent Document 1 describes a method of imaging an object having a predetermined spatial resolution with an imaging system and evaluating the contrast.

JP, 2008-197087, A

  In order to reliably detect a defect in visual inspection, it is desirable to adjust the arrangement of equipment for imaging the defect under conditions that allow the defect to be clearly visible. This is because, even if the image data is obtained by imaging the same defect, if the arrangement of the devices is different, the shape of the defect, the surface state, the contrast, and the like appearing in the image data may be different.

  Therefore, it is more convenient if there is a support system that positively controls the arrangement of the device to improve the visibility of the defect than the system for evaluating the visibility of the defect as in Patent Document 1 or the like. In addition, the arrangement of the imaging device in which the defect is easy to see may be different between the crack that cuts a deep flaw on the wall and the peeling that is a shallow flaw on the wall. Therefore, it is desirable to optimize the arrangement of the imaging device in accordance with the specific content of the defect.

  Then, this invention makes it a main subject to control arrangement | positioning of the imaging | photography apparatus of a defect so that it may be easy to carry out the visual inspection of a defect.

In order to solve the above-mentioned subject, the defect inspection method of the present invention has the following features.
According to the present invention, the defect inspection system includes a database, a defect extraction processing unit, a defect determination processing unit, a device arrangement control unit, and a display control unit.
In the database, defect type data in which feature information is associated with each type of defect relating to a structure, and device control data defining an arrangement of an easy-to-see imaging device in association with each type of defect are associated and registered. Yes,
The defect extraction processing unit extracts a defect area in which the defect is shown from a captured image captured by an imaging device,
The defect determination processing unit refers to the feature information of the defect type data to classify the type of the defect in the defect area extracted by the defect extraction processing unit;
The device placement control unit refers to the device control data to determine the placement of the imaging device corresponding to the type of the defect classified by the defect determination processing unit, and performs the imaging so as to be the determined placement. Control the machine,
The display control unit causes the display device to display the captured image captured by the image capturing device controlled by the device arrangement control unit.
Other means will be described later.

  According to the present invention, the arrangement of imaging devices for defects can be controlled to facilitate visual inspection of the defects.

BRIEF DESCRIPTION OF THE DRAWINGS It is a whole block diagram of the defect inspection system regarding one Embodiment of this invention. It is a flow chart which shows processing of a defect inspection system about one embodiment of the present invention. It is a perspective view for explaining the three-dimensional coordinate system of the defect inspection system concerning one embodiment of the present invention. It is xy top view when it sees from the front of the area | region to be examined regarding one Embodiment of this invention. 5 is a cross-sectional view of the imager of FIG. 4 in accordance with an embodiment of the present invention. FIG. 5 is a cross-sectional view of the illumination of FIG. 4 in accordance with an embodiment of the present invention. It is a perspective view which shows the positional relationship of the defect inspection system in the image imaging process regarding one Embodiment of this invention. FIG. 8 is a side view focusing on the crack of FIG. 7 according to an embodiment of the present invention. It is a screen figure showing an acquired image which photoed an inspection object field concerning an embodiment of the present invention from the front. 10 is a luminance distribution graph in the acquired image of FIG. 9 according to an embodiment of the present invention. It is a block diagram explaining the defect kind determination processing regarding one Embodiment of this invention. It is a perspective view which shows the arrangement | positioning determination processing which paid its attention to azimuth (theta) of each apparatus regarding one Embodiment of this invention. It is a perspective view which shows the arrangement | positioning determination processing which paid its attention to the angle (phi) of each apparatus with respect to the crack concerning one Embodiment of this invention. It is a perspective view which shows the arrangement | positioning determination processing which paid its attention to angle (phi) of each apparatus with respect to peeling of the surface layer concerning one Embodiment of this invention.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an overall configuration diagram of a defect inspection system. The defect inspection system includes an imaging machine drive mechanism 20, an illumination drive mechanism 30, a PC 50, and a display device 60.
The imaging device drive mechanism 20 holds and moves the imaging device 21 and the self-position measuring device 22. The illumination drive mechanism 30 holds and moves the illumination 31 and the relative position measuring device 32. The imaging device drive mechanism 20 and the illumination drive mechanism 30 are respectively remotely controlled by manual commands such as remote control operation by a human or automatic commands by the PC 50.

The imaging device drive mechanism 20 and the illumination drive mechanism 30 are configured as an underwater moving device in which the underwater position and posture are controlled using, for example, a plurality of thrusters. Alternatively, instead of the underwater moving device, a flying device such as a drone may be used, or a traveling device equipped with wheels may be used.
Furthermore, although the example illustrated in FIG. 1 as two devices for moving the imaging device drive mechanism 20 and the illumination drive mechanism 30 separately, the two mechanisms may be integrated and configured. For example, the imaging machine drive mechanism 20 may have an arm supporting the illumination drive mechanism 30, and the position of the illumination drive mechanism 30 may be freely moved by the relative position from the imaging machine drive mechanism 20.

The imaging device 21 images the defect 12 on the inspection target area 11. The illumination 31 emits light toward the defect 12 on the inspection target area 11.
The self-position measuring device 22 measures the position of the imaging device 21. The relative position measuring device 32 measures the position of the illumination 31 with respect to the imaging device 21. For the self-position measuring machine 22 and the relative position measuring machine 32, for example, a position measuring device based on a surrounding structure using a laser range finder is used.

  In addition, as a position measurement means in the space of each of the imaging device 21 and the illumination 31, it measures the relative position of the self position measurement machine 22 which can measure its own position alone, and itself when seen from other devices An example has been shown in combination with a possible relative position measuring machine 32. On the other hand, a position measuring machine may be used to measure the position of the illumination 31, and a relative position measuring machine may be used to measure the position of the imaging device 21, or a position measuring machine may be used to measure the positions of the imaging device 21 and the illumination 31. May be

Furthermore, the position measuring unit of the imaging device 21 and the illumination 31 may appropriately adopt the method illustrated below.
-Method of estimating the positional relationship with surrounding structures by laser distance measurement-Method of acquiring a distance image of the surrounding structures with a camera and estimating the position-Method of estimating the relative position by tracking the marker position with a laser-Radio wave or Position estimation method using ultrasound

The PC 50 incorporates the defect extraction processing unit 52, the defect determination processing unit 53, the device arrangement control unit 54, the display control unit 55, and the database 51, and is connected to the display device 60. The PC 50 is configured as a computer having a CPU (Central Processing Unit), a memory, a storage unit (storage unit) such as a hard disk, and a network interface.
The computer operates a control unit (control means) configured of each processing unit by the CPU executing a program (also called an application or an abbreviation of the application) read into the memory.

  The database 51 stores defect type data 51a and device control data 51b in association with each other. The defect type data 51 a is data for classifying types of defects such as “cracks” and “peeling of the surface layer”. The device control data 51 b is data for specifying the positions of the imaging device 21 and the illumination 31 that make the defect easy to see. For example, if the defect is a "crack", it is defined that the imaging device 21 is arranged closer to the surface layer in the height direction (vertical direction) as the device control data 51b so that the depth of the crack can be easily viewed.

When the defect extraction processing unit 52 receives the captured image data 23 of the imaging device 21 as the acquired image 91, the defect extraction processing unit 52 extracts the defect area 92 in the acquired image 91.
The defect determination processing unit 53 determines the type of the defect 12 by collating the defect 12 shown in the defect area 92 with the defect type data 51 a registered in the database 51.
The device arrangement control unit 54 refers to the device control data 51 b registered in the database 51 to determine the arrangement of the imaging device 21 and the illumination 31 suitable for each type of defect 12 determined by the defect determination processing unit 53. And controls the imaging device drive mechanism 20 and the illumination drive mechanism 30 according to the arrangement.
The display control unit 55 controls the display device 60 to display the acquired image 91 from the imaging device 21 on the screen. Thereby, the inspector can visually recognize from the screen display the acquired image 91 photographed at the position suitable for the defect 12 automatically without manually operating the positions of the imaging device 21 and the illumination 31 by himself. Therefore, since the inspector can concentrate on the display content of the defect 12, the visual inspection of the defect 12 can be performed quickly and stably.

FIG. 2 is a flowchart showing processing of the defect inspection system.
In the device movement process of S101, each device (imager drive mechanism 20, illumination drive mechanism 30) moves toward the inspection target area 11.
In the inspection target area attainment process at S102, each device at S101 reaches a position approaching the extent to which the defect 12 in the inspection target area 11 can be photographed.
In the image pickup process of S103, the image pickup machine 21 picks up the inspection object area 11 including the defect 12 as the pickup image data 23 (details are shown in FIGS. 7 and 8).
In the defect extraction process of S104, the defect extraction processing unit 52 receives the captured image data 23 from the imaging device 21 as the acquired image 91, and the defect area 92 where the defect 12 appears from the acquired image 91 and other surface areas. And 93 are extracted (for details, see FIGS. 9 and 10).

In the defect existence determination process of S111, the defect extraction processing unit 52 determines whether or not the defect area 92 exists in the acquired image 91 as a result of S104. If YES in S111, the process proceeds to S112, and if NO, the process proceeds to S115.
In the defect type determination process of S112, the defect determination processing unit 53 uses the image data of the defect area 92 as a search key and refers to the defect type data 51a stored in the database 51 to be reflected in the defect area 92. The type of defect 12 is determined (specified) (details are shown in FIG. 11).

  In the defect visual recognition determination process of S113, the defect determination processing unit 53 visually recognizes the defect 12 by evaluating the defect 12 shown in the defect area 92 determined in S112 using a predetermined defect visibility parameter. Determine whether it is possible (whether human beings are easy to see). This determination process is, for example, a process that is determined to be viewable when the defect visibility parameter exceeds a predetermined threshold. If YES in step S113, the process advances to step S114. If NO in step S113, the process advances to step S121.

In the defect image display process of S114, the display control unit 55 causes the display device 60 to display the acquired image 91 as an imaging result of the defect 12.
In the whole area inspection completion determination process of S115, the defect extraction processing unit 52 determines whether or not imaging of all of the planned inspection area 11 is completed. If Yes in S115, the process of FIG. 2 is ended, and if No, the process returns to S101 and each device moves to the next (remaining) imaging position.

In the device arrangement determination process of S121, the device arrangement control unit 54 refers to the device control data 51b corresponding to the defect type data 51a determined in S112, and determines the device arrangement determined by the type of defect 12 (details will be described) 12-14). As described later, the device placement control unit 54 may determine not only the position but also the posture (orientation) of each device when viewed from that position.
In the device position adjustment process of S122, the device arrangement control unit 54 adjusts the position of each device (the imaging device drive mechanism 20 and the illumination drive mechanism 30) in accordance with the device arrangement determined in S121. That is, the device placement control unit 54 causes the imaging device drive mechanism 20 and the illumination drive mechanism 30 to have the positions measured by the self-position measuring device 22 and the relative position measuring device 32 coincide with the positions of the devices determined in S121. In response, a drive command signal is transmitted. Then, the process returns to S103.

Hereinafter, a three-dimensional coordinate system of the defect inspection system will be defined with reference to FIGS.
FIG. 3 is a perspective view for explaining a three-dimensional coordinate system of the defect inspection system. In the three-dimensional space of the defect inspection system, the plane of the inspection area 11 is (x, y), and the vertical line 13 from the plane of the inspection area 11 is z axis (x, y, z) It is defined.
In addition, the three-dimensional position (x, y, z) is a polar coordinate system (bearing θ, angle φ, distance L) whose origin is the intersection point between the inspection object area 11 and the vertical line 13 (substantially central position of the defect 12). Is also defined.
That is, the three-dimensional position of the imaging device 21 is (azimuth θ1, angle φ1, distance L1). Similarly, the three-dimensional position of the illumination 31 is (azimuth θ2, angle φ2, distance L2).

  Here, when the inspection target area 11 is not a flat surface such as a curved surface or an uneven surface, a plane perpendicular to the vertical line 13 from the position of the defect 12 may be defined as the reference xy plane. Further, instead of expressing the positional information of the imaging device 21 and the illumination 31 with respect to the defect 12 in the polar coordinate system (azimuth θ, angle φ, distance L), it may be a world coordinate system (x, y, z), or 3 The position may be determined by three arbitrary parameters whose position in the dimensional space is determined.

FIG. 4 is an xy plan view when viewed from the front of the inspection target area 11. Assuming that the inspection target area 11 is a reference plane (xy plane), the azimuth θ is a counterclockwise angle with the x axis set to 0 degrees.
A cross-sectional line 14L-14R along the azimuth θ1 at which the imaging device 21 is located and a cross-sectional line 15L-15R along the azimuth θ2 at which the illumination 31 is located are illustrated. Cross sectional views along these cross sectional lines are described below.

FIG. 5 is a cross sectional view taken along a cross sectional line 14L-14R of the imaging device 21 of FIG. The angle φ1 indicates how much the imaging device 21 is present at a position inclined with respect to the vertical line 13 in the direction of the cross-sectional line 14L-14R.
6 is a cross-sectional view of the illumination 31 of FIG. 4 at cross-sectional line 15L-15R. The angle φ2 indicates how much the illumination 31 is present at a position inclined with respect to the vertical line 13 in the direction of the cross-sectional line 15L-15R.

Next, with reference to FIG. 7 and FIG. 8, the image pickup process of S103 will be described.
FIG. 7 is a perspective view showing the positional relationship of the defect inspection system in the image capturing process of S103. The imaging device 21 captures the inspection target area 11 including the defect 12 as the captured image data 23 in a state where the light 31 of the illumination 31 is applied.
A crack which is an example of the defect 12 occurs with time on the surface of the structure, and has a shape having an opening width W, an opening length L, and a depth D with respect to the surface to be inspected.
FIG. 8 is a side view focusing on the crack which is the defect 12 of FIG. As the depth D is deeper, the light from the illumination 31 is less likely to hit, so that in the captured image data 23, shading of the image occurs at the defect position.

Further, with reference to FIGS. 9 and 10, the defect extraction process of S104 will be described.
FIG. 9 is a screen view showing an acquired image 91 obtained by imaging the inspection target area 11 from the front as an example of the imaged image data 23. The vertical direction of the acquired image 91 is a Y-axis of upper case, and the horizontal direction is a X-axis of upper case.
In the acquired image 91, illumination light is irradiated to the surface area 93 without the defect 12 and the luminance is high (white), and the defect area 92 with the defect 12 decreases the irradiation amount of the illumination light and the luminance becomes low (black). In addition, the cross-sectional line 94L-94R which cross | intersects the surface area 93 centering on the defect area | region 92 was shown in figure for description of FIG.

FIG. 10 is a luminance distribution graph at the section line 94L-94R in the acquired image 91 of FIG. The horizontal axis of this graph indicates the X axis of the acquired image 91, and the vertical axis indicates the luminance value at each position of the X axis.
The defect extraction processing unit 52 performs image processing on the acquired image 91 to extract a defect area 92 with low luminance. Specifically, the defect extraction processing unit 52 sets an arbitrary defect threshold to the luminance value which is gray-scale information and applies a binarization process to extract an area below the defect threshold as a defect.
Note that the defect extraction processing unit 52 is not limited to binarization processing as long as it is a method of extracting a defect area having low luminance, and for example, a defect boundary portion is extracted using edge extraction processing. You may classify it.

The luminance distribution graph of FIG. 10 is useful not only for determining the presence or absence of a defect (defect extraction processing of S104), but also for determining the visibility when there is a defect (defect visual approval determination processing of S113). The defect determination processing unit 53 sets the contrast C of the two areas C = (L 2), where L 1 is the average luminance value of the defect area 92, L 2 is the average luminance value of the surface area 93, and N is the luminance variation width of the surface area 93. Calculate L1) / N as the defect visibility parameter.
Then, in the case of C> 2 (predetermined threshold value), the defect determination processing unit 53 determines that the defect area and the surface area can be clearly classified when they are visually recognized. The calculation method of the determination is not limited to this, as long as the visibility of the defect area and the surface area is quantitatively represented and the calculation result can be threshold-determined.
In order to improve the defect visibility parameter C, for example, the average luminance value of the defect area 92 is made lower than L1, and the average luminance value of the surface area 93 is made higher than L2, the luminance of the surface area 93 is made higher. The arrangement of each device may be changed so as to reduce the variation width N.

FIG. 11 is a configuration diagram for explaining the defect type determination process of S112.
The defect determination processing unit 53 determines the type of defect shown in the defect area 92 by applying a predetermined shape so as to surround the defect area 92. Therefore, the defect determination processing unit 53 refers to defect type data 51a which is correspondence data between a predetermined shape and a defect type.
Note that, as an example of the defect type data 51a, FIG. 11 shows a case where an elongated ellipse has a predetermined shape, and a defect that fits the elongated ellipse is determined as a "crack". The elongated ellipse is, for example, an elongated shape in which the major diameter a is considerably longer than the minor diameter b because the ratio of the major diameter a / the minor diameter b is larger than a predetermined value (such as 5).
The defect determination processing unit 53 obtains the minimum elliptical shape circumscribing the defect 12 of the defect area 92, and calculates the major axis a, the minor axis b, and the major axis inclination θ with respect to the coordinate system. Then, the defect determination processing unit 53 determines the arrangement orientation of the imaging device 21 and the illumination 31 from the calculated θ, and the arrangement angle of the imaging device 21 and the illumination 31 from the ratio a / b of the major diameter a to the minor diameter b. .

As described below, the defect targeted by the present embodiment is not limited to a crack, but may be a defect having a shape in which image density is generated at discontinuous portions of the surface shape when irradiated with reference light and imaged. For example, swelling, adhesion of foreign matter, peeling of the surface layer, or the like may be detected.
For example, as another example of the predetermined shape to be applied, the defect is “peeling of the surface layer” when the ratio of the major axis a / minor axis b is smaller (closer to a perfect circle) than the elongated ellipse for the crack. The defect type data 51a may be used.
Furthermore, in the case where the defect area 92 corresponds to a shape in which the defect area 92 protrudes in the z-axis height direction (is convex) with respect to the xy plane of the inspection object area 11, the defect is “bulged” or "Defect type data 51a" may be used. As described above, the defect type data 51a is not limited to the method of fitting to an ellipse, and any other method may be used as long as it can calculate the directionality and orientation of the defect area.

The device arrangement determination process of S121 based on the device control data 51b will be described below with reference to FIGS.
The distance L1 of the imaging device 21 sets the resolution for the defect width in advance, and is determined by the number of pixels of the imaging device and the pixel size. Alternatively, the distance L1 of the imaging device 21 may be determined by the existing auto-focusing mechanism so that the defect 12 is in focus.
The distance L2 of the illumination 31 is determined by the required surface area luminance and the illumination intensity.

FIG. 12 is a perspective view showing a placement determination process focusing on the orientation θ of each device.
As an apparatus arrangement for improving the defect visibility parameter C, for example, the direction θ2 of the illumination 31 is made to be the direction perpendicular to the long axis of the defect area 92. Thereby, the amount of light irradiated to the inner cross section of the defect 12 may be reduced by lowering the luminance of the defect area 92.
On the other hand, the azimuth θ1 of the image pickup device 21 is an azimuth perpendicular to the long axis of the defect area 92 and an azimuth facing the illumination 31. Thus, the luminance of the defect area 92 may be lowered by reducing the amount of light which is reflected or diffused from the inner cross section of the defect 12 and is incident on the image pickup device 21.
As described above, the device control data 51b may be defined as data for determining the direction of the device so that the defect 12 can be easily viewed based on the direction in which the defect 12 defined by the defect type data 51a is present.

FIG. 13 is a perspective view showing an arrangement determination process focusing on the angle φ of each device with respect to a crack.
The angle φ2 of the illumination 31 is an angle narrower (on the vertical line 13 side) than the defect inclination angle = tan (short diameter b / long diameter a). In FIG. 13, the defect inclination is indicated by a thick line, and the defect inclination angles are angles formed by three points (a point Pd on the vertical line 13, a deepest point Pc of the defect 12, and a surface point Pb of the defect 12). In this manner, the angle φ 2 of the illumination 31 is disposed almost directly above the crack and directed almost directly downward so that the incident light can reach toward the deepest point Pc of the defect 12 so that the reflection from the internal cross section of the defect 12 It can reduce light and enhance contrast.
The relationship between the defect inclination angle and the illumination angle is, for example, equal to or greater than a predetermined angle difference, and is determined in a range in which the illumination does not interfere with the inspection object. In addition, about the inclination angle of a defect, although an example calculated | required from "tan (short diameter b / long diameter a)" was shown, the estimation method is not restricted to this, you may use another means with which the same effect is acquired. .

On the other hand, when the surface area 93 is a mirror surface, the angle φ1 of the image pickup device 21 makes the installation angles of the image pickup device 21 and the illumination 31 equal. That is, the imaging device has an angle (on the side of the vertical line 13) narrower than an angle formed by three points (point Pd on the vertical line 13, the deepest point Pc of the defect 12 and surface point Pa of the defect 12) It is assumed that the angle φ1 is 21 degrees. Thereby, by causing the specular reflection light from the illumination 31 to be incident on the imaging device 21, the brightness of the surface area 93 can be increased, and the contrast can be increased.
In addition, when the surface area 93 is a rough surface, the diffused light from the surface area 93 is isometric depending on the arrangement angle of the imaging device 21, so that it is possible to image a large number of portions to be the shadow area of the defect 12. By arranging the imaging device 21 in the direction immediately above the defect (in the direction of the vertical line 13), the visibility of the defect can be increased.

FIG. 14 is a perspective view showing a placement determination process focusing on the angle φ of each device with respect to peeling of the surface layer. Unlike the cracks in FIG. 13, the peeling in FIG. 14 can be seen more easily by arranging the device in a direction to lay the device along the xy plane of the inspection target area 11.
Therefore, the angle φ1 of the imaging device 21 is set on the extension of the peeling bottom point Pf and the peeling surface point Pa. Similarly, the angle φ1 of the defect 12 is set on the extension of the peeling bottom point Pe and the peeling surface point Pb.

As described above, the device placement control unit 54 sets the position of the imaging device 21 to improve defect visibility according to the type (crack, peeling, etc.) of the defect 12 determined by the defect determination processing unit 53. The azimuth θ1, the angle φ1, the distance L1) and the position of the illumination 31 (the azimuth θ2, the angle φ2, the distance L2) are determined.
In addition, the device placement control unit 54 may also determine the orientation (direction) of the imaging device 21 and the illumination 31 so as to face the position where the defect 12 exists as viewed from the determined position.

In the embodiment described above, the defect extraction processing unit 52 extracts the defect area 92 in which the defect 12 is shown from the acquired image 91 received from the imaging device 21. Then, the defect determination processing unit 53 classifies the defect type on the basis of feature information such as the shape and density of the defect 12 in the defect area 92. Furthermore, the device control data 51b corresponding to the classified defect type data 51a is read out from the database 51, and control is performed on the imaging device drive mechanism 20 and the illumination drive mechanism 30.
Here, the defect type data 51a and the device control data 51b are defined in advance for the arrangement of the easy-to-see imaging devices for each type of defect 12. A high acquired image 91 can be taken. Therefore, stable defect determination can be efficiently performed even if there is a personality (variation in skill) of the inspector.

The present invention is not limited to the embodiments described above, but includes various modifications. For example, the above-described embodiments are described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the described configurations.
Also, part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment.
In addition, with respect to a part of the configuration of each embodiment, it is possible to add, delete, and replace other configurations. Further, each of the configurations, functions, processing units, processing means, etc. described above may be realized by hardware, for example, by designing part or all of them with an integrated circuit.
Further, each configuration, function, and the like described above may be realized by software by a processor interpreting and executing a program that realizes each function.

Information such as programs, tables, and files that realize each function is a memory, a hard disk, a recording device such as a solid state drive (SSD), an integrated circuit (IC) card, an SD card, a digital versatile disc (DVD), etc. Can be placed on the
Further, control lines and information lines indicate what is considered to be necessary for the description, and not all control lines and information lines in the product are necessarily shown. In practice, almost all configurations may be considered to be mutually connected.
Furthermore, the communication means connecting the respective devices is not limited to the wireless LAN, and may be changed to a wired LAN or other communication means.

11 inspection target area 12 defect 13 vertical line 20 image pickup machine drive mechanism 21 image pickup machine 22 self-position measuring machine 23 picked-up image data 30 illumination drive mechanism 31 illumination 32 relative position measurement machine 50 PC
51 database 51a defect type data 51b device control data 52 defect extraction processing unit 53 defect determination processing unit 54 device arrangement control unit 55 display control unit 60 display device 91 acquired image 92 defect area 93 surface area

Claims (5)

The defect inspection system includes a database, a defect extraction processing unit, a defect determination processing unit, a device placement control unit, and a display control unit.
In the database, defect type data in which feature information is associated with each type of defect relating to a structure, and device control data defining an arrangement of an easy-to-see imaging device in association with each type of defect are associated and registered. Yes,
The defect extraction processing unit extracts a defect area in which the defect is shown from a captured image captured by an imaging device,
The defect determination processing unit refers to the feature information of the defect type data to classify the type of the defect in the defect area extracted by the defect extraction processing unit.
The device placement control unit refers to the device control data to determine the placement of the imaging device corresponding to the type of the defect classified by the defect determination processing unit, and performs the imaging so as to be the determined placement. Control the machine,
The defect inspection method, wherein the display control unit causes the display device to display the captured image captured by the imaging device controlled by the device placement control unit. In the database, a crack for the plane of the structure is registered as the type of the defect;
The defect determination processing unit refers to the defect type data of a crack, and when the ratio of the major axis to the minor axis of the elliptical shape circumscribing the defect area is larger than a predetermined value, the defect determination processing unit reflects the defect area. Determine the type of defect as a crack,
The device placement control unit places the image pickup device at a position where the angle with respect to the plane of the structure is high enough to make the deepest point of the crack visible with reference to the device control data of the crack. The defect inspection method according to claim 1. The device placement control unit is a drooping of the major axis of the elliptical shape circumscribing the crack, regarding the position of the illuminator that emits light toward the crack in the plane coordinates of the structure, and the positional relationship of the imaging device that photographs the crack. The defect inspection method according to claim 2, wherein the illuminator is disposed at one end point on a line, and the image pickup device is disposed at the other end point. In the database, peeling of the structure with respect to the plane is registered as the type of the defect;
The defect determination processing unit refers to the defect type data of peeling and reflects the defect area when the ratio of the major axis to the minor axis of the elliptical shape circumscribing the defect area is smaller than a predetermined value. Determine the type of defect as peeling,
The device placement control unit places the imaging device at a position on an extension of a bottom point of peeling and a surface point of a structure with reference to the device control data of peeling. The defect inspection method described in. A database in which defect type data in which feature information is associated with each type of defect relating to a structure, and device control data defining an arrangement of an easy-to-see imaging device in association with each type of defect are associated with each other;
A defect extraction processing unit that extracts a defect area in which the defect appears from a captured image captured by an imaging device;
A defect determination processing unit that classifies types of the defects in the defect area extracted by the defect extraction processing unit with reference to feature information of the defect type data;
The arrangement control of the image pickup device is performed to determine the arrangement of the image pickup device corresponding to the type of the defect classified by the defect determination processing unit with reference to the device control data, and control the image pickup device to be the determined arrangement. Department,
A defect inspection system comprising: a display control unit that causes a display device to display the captured image captured by the image capturing device controlled by the device placement control unit.

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