JP2019119644A - Method and apparatus for scribing bonded substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a scribing method and a scribing device for a laminated substrate capable of suppressing deformation of a terminal region at the time of scribing to obtain a high-quality product. SOLUTION: A bonded board in which a part of an edge portion of a first substrate 1 is cut off and a terminal region T is formed in the edge portion of a second substrate 2 is moved up and down in the direction of the terminal region T. A scribe line for division is machined on the upper and lower surfaces of the substrate by the cutter wheels 3a and 3b of the above, and a step of selecting an appropriate cutting amount that does not exceed the terminal break point at which the terminal region is broken is set in advance. , A step of scribing a region other than the terminal region of the bonded board with the first scribe load, a step of scribing the terminal region with a second scribe load smaller than the first scribe load, and the terminal. A step of retracting the cutter wheel from the terminal portion without stopping at the terminal portion of the region is included. [Selection diagram] FIG. 9

Description

  The present invention relates to a scribing method for processing a scribing line for division into a bonded substrate (or bonded mother substrate, hereinafter referred to as a "mother substrate") formed by bonding two substrates, and in particular The present invention relates to a method and apparatus for scribing a mother substrate having a terminal area at an edge.

  The mother substrate for manufacturing a liquid crystal display panel includes a first substrate (also referred to as a CF side substrate) on which a plurality of color filters are pattern formed, and a second substrate (a TFT side substrate) on which a plurality of TFTs and terminal regions are pattern formed. And the seal material sandwiching the sealing material for sealing the liquid crystal. Then, the mother substrate is divided into unit products by processing a scribing line with a cutter wheel or the like along a grid-like planned dividing line. In addition, the terminal region is formed by cutting the upper CF side substrate from the edge at a position inside the required width (terminal width) (see Patent Documents 1 and 2).

2 to 4 show an example of the step of cutting out a unit product from the mother substrate. Here, a case where eight unit products are cut out from the mother substrate M will be described.
First, as shown in FIG. 1 and FIG. 7A, the mother substrate M is configured using the first and second cutter wheels 3a and 3b arranged to be opposite to each other with the mother substrate M in between. The scribing line S1 is formed on each of the substrates by pressing the first and second cutter wheels 3a and 3b into contact with the CF side substrate 1 and the TFT side substrate 2 along the line to be divided in the X direction. Engrave. Next, as shown in FIG. 7B, a scribe line S2 for forming a terminal area is formed on the CF side substrate 1 by the first cutter wheel 3a. The scribe line S1 is formed by a cut that can cause a crack in the thickness direction of the substrate, and is divided by bending the substrate or the like in a later step. As shown in FIG. 3, the mother substrate M divided from the scribe line S1 becomes a strip-shaped substrate M1 including four unit products, and the end of the CF side substrate 1 divided by the scribe line S2 is an end material It is removed as E and the terminal area T is exposed.

Next, after rotating the strip-like substrate M1 by 90 degrees, the first and second cutter wheels 3a and 3b are simultaneously pressed along the line to be divided while scribing to scribe the scribe line S3 on each substrate, and the scribe line It divides along S3 and cuts out the unit product M2 shown in FIG.
In addition to the case where the terminal area T is formed on only one side of the unit product as described above, the terminal area T may be formed on both left and right sides as shown in FIG. 5A, or as shown in FIG. When it forms in L shape along 2 sides which adjoin, or although illustration is abbreviate | omitted, it may be formed in a U-shape along 3 sides of a unit product.

  When scribing the upper and lower surfaces of the substrate with the first and second cutter wheels 3a and 3b, in addition to "simultaneous cutting" in which the first and second cutter wheels 3a and 3b travel at the same opposing position, As shown in FIG. 6 (b), the first and second cutter wheels 3a and 3b are displaced in the back and forth direction with respect to the scribing direction as shown in FIG. 6 (a). When the cutter wheels 3a and 3b travel with the left and right shifted with respect to the scribing direction as "shift off", although not shown, the first and second cutter wheels travel with the front, back, left and right shifted with respect to the scribing direction There is a "precedence / shift cut", which is selected depending on the thickness and type of the substrate, the position of the upper and lower dividing lines, and the like. Generally, when there is a terminal area at the start point or end point of scribing, "leading cutting" or "leading shift" so that the first and second cutter wheels simultaneously contact the substrate or leave the substrate simultaneously. The “cutting” method is often used.

WO 2005/087458 JP, 2015-13783, A

  In the process of dividing the mother substrate described above, in the product region, the upper and lower surfaces of the mother substrate M are scribed by the first and second cutter wheels 3a and 3b in the CF side substrate 1 and the TFT side substrate 2, respectively. At this time, conventionally, after the cutter wheel travels and stops at a predetermined pressing load to the end of the substrate, an operation of retracting up and down away from the substrate is performed.

  On the other hand, when scribing the portion where the terminal area is formed, as shown in FIG. 8, the second cutter wheel 3b is on the lower TFT side without the upper CF side substrate 1 at the terminal area T. Only the substrate 2 is pushed in and scribed. Normally, scribing with a load of 4N to 8N using a cutter wheel with a diameter of 2 mm to 3 mm with respect to a thin TFT side substrate of 0.3 mm to 1.0 mm, but when scribing the terminal region T, Since the upper substrate is cut off and the terminal area T can not be supported by the upper CF side substrate 1 and the opposing first cutter wheel 3a, as shown in FIG. 9, the terminal area T is pressed by the second cutter wheel 3b. A phenomenon occurs in which the part of R is deformed with the root R as a base point. Such deformation of the terminal region T becomes larger as the substrate is thinner and the terminal width is longer.

  In addition, after the cutter wheel stops at the end of the substrate, there is a slight time (0.18 seconds in measured value) to retract up and down, so the substrate continues to be loaded during the stop time, This is a major cause of the deformation of the terminal region T. If such deformation occurs, breakage of the terminal region T may occur, or a crack in the scribe line may extend forward from directly under the wheel to the scribing direction, leading to a forward phenomenon that does not occur on the planned scribe line. It causes good products.

  In addition, when "preceding / shifting off" is performed, the first and second cutter wheels travel while being shifted to the left and right with respect to the scribing direction. For this reason, viewed from the scribing advancing direction, the deformation of the substrate is asymmetrical, and a phenomenon called “sog” in which a crack of the scribing line is formed to be inclined with respect to the thickness direction of the substrate is likely to occur.

  Therefore, in view of the above-described problems, the present invention is to obtain a high quality product free from breakage, leading, and sog without suppressing the deformation phenomenon of the terminal area at the time of scribing even if the substrate is thin and the terminal width is long. It is a main object of the present invention to provide a scribing method and a scribing apparatus for bonded substrates that can be used.

  In order to achieve the above object, the present invention takes the following technical measures. That is, in the scribing method of the present invention, a bonded substrate in which a part of the edge of the first substrate is cut away and a terminal region is formed at the edge of the second substrate is A scribing method for processing scribing lines for division on the upper and lower surfaces of a substrate by scribing upper and lower cutter wheels in a direction, which does not exceed a preset terminal breaking point at which the terminal area is broken A step of selecting an appropriate infeed amount, a step of scribing a product region of the bonded substrate with a first scribing load, and a scribing of the terminal region with a second scribing load smaller than the first scribing load And a step of retracting the cutter wheel from the end without stopping at the end of the terminal area.

  Further, according to the present invention, a scribing line for cutting is processed on the upper and lower surfaces of a bonded substrate in which a terminal region is formed at the edge of the second substrate by cutting out part of the edge of the first substrate. A scribing apparatus, which is a table holding a bonded substrate to be processed, and is vertically movable above and below the bonded substrate held by the table via an elevating mechanism, and a direction of a terminal area of the bonded substrate And a control unit for performing processing of the entire substrate processing process by the cutter wheel, and a scribing recipe stored in the control unit, wherein the scribing recipe includes the cutter wheel A scribing amount that does not cause destruction of the terminal area when cutting into the terminal area and scribing the product area of the bonded substrate Data of processing conditions including a first scribe load for scribing and a second scribe load smaller than the first scribe load for scribing the terminal region are described; A scribing apparatus is also provided in which one is selected and scribing is performed based on the processing condition, and the elevating mechanism is moved up and down so that the cutter wheel retracts from the terminal area before the terminal end of the terminal area. It features.

  In the present invention, as described above, when the terminal area portion is cut by the cutter wheel and scribed, the appropriate cutting amount not exceeding the terminal breaking point where the terminal area is deformed and breakage occurs is selected and the processing condition is selected. Since the scribing is performed based on the deformation of the terminal area at the time of the scribing end of the cutter wheel is suppressed. In addition, when the second substrate having the terminal area is scribed with the cutter wheel, the terminal travels away from the surface of the terminal area gradually from near the terminal position of the terminal area to the terminal position. Since the pressing force on the area portion is alleviated and the cutter wheel retracts from the terminal area instantaneously at zero stop time when the cutter wheel reaches the end position of the terminal area, the terminal area can be used during the conventional stop time. There will be no continuing load. As a result, even under conditions where the deformation of the terminal area tends to be large, such as when the substrate is thin or when the terminal width is long, there is an effect that breakage of the terminal area, forward movement, and generation of soge can be reliably prevented. . Furthermore, the product area is scribed with a relatively high first scribing load, and when scribing a terminal area susceptible to deformation, the scribing is performed with a second scribing load smaller than the first scribing load. Deeper vertical cracks can be formed in the product area that occupies most of the scribe line while suppressing deformation. As a result, the separability of the subsequent process can be enhanced, and the parting process can be simplified, and the deterioration of the product quality caused by the parting failure can be suppressed.

In the above invention, the scribing recipe includes, in addition to the thickness of the substrate, information of the width of the terminal area, the diameter of the cutter wheel used and the type of the cutting edge, the traveling speed of the cutter wheel, subordinate thereto. That's good.
As a result, the selection range of the scribing recipe is expanded, and it becomes possible to cope with scribing of various substrates.

The figure which shows an example of the scribing apparatus for enforcing the scribing method of this invention. The top view and front view which show an example of the mother board | substrate used as a process target. The top view and side view which show the strip-shaped board | substrate cut | disconnected from the mother board | substrate of FIG. The perspective view which shows the unit product cut out from the strip-shaped board | substrate of FIG. The perspective view which shows another example of formation of the terminal area | region formed in a unit product. Explanatory drawing which shows the scribing means of advance cutting and shift cutting. Explanatory drawing when processing a scribing line to a mother board | substrate. Explanatory drawing when scribing a terminal area | region with a 2nd cutter wheel. Explanatory drawing which shows the curvature up phenomenon when scribing a terminal area | region with a 2nd cutter wheel. Explanatory drawing which shows a favorable state when scribing a terminal area | region with a 2nd cutter wheel. Explanatory drawing which shows the scribing process by a 1st, 2nd cutter wheel. Explanatory drawing which shows the scribing process of the terminal area | region by the 1st, 2nd cutter wheel. Explanatory drawing which shows an example of a scribe recipe. FIG. 2 is a block diagram showing the structure of a computer attached to a scribing device. The figure which displayed the maximum variation | change_quantity of Z-axis address for every cutting amount.

The details of the present invention will be described below.
FIG. 1 is a perspective view schematically showing an example of a scribing apparatus for carrying out the scribing method of the present invention. The scribing apparatus includes a horizontal table 4 for sucking and holding a mother substrate M to be processed, and a first cutter wheel 3a disposed above and below the table 4 so as to face each other with the table 4 interposed therebetween. And a second cutter wheel 3b. The table 4 is divided back and forth at a predetermined interval along the Y direction in FIG. 1, and the first cutter wheel 3a and the second cutter wheel 3b are disposed within this interval.

  The first and second cutter wheels 3a and 3b are held by the upper and lower holders 5 and 5, respectively, and the holders 5 and 5 are mounted on the scribing heads 6 and 6 so as to be able to move up and down via elevating mechanisms (not shown). ing. The scribing heads 6, 6 are movably attached along the guides 9, 9 of the upper and lower guide bars 8, 8 horizontally bridged in the X direction by the support columns 7, 7 on both sides, and the motors 10, 10 are provided. It is formed to be able to move in the X direction by the rotation of.

  Using the first and second cutter wheels 3a and 3b of this scribing apparatus, the scribing lines S1 and S2 are processed on the mother substrate M in the same procedure as the procedure shown in FIGS. A strip-like substrate M1 having a region T is cut out. Thereafter, the scribe line S3 is processed into the strip-like substrate M1 along the line to be divided, and the unit product M2 having the product area P and the terminal area T is cut out. Here, the product area P is an area having each of the first substrate (CF side substrate) 1 and the second substrate (TFT side substrate) 2, and the terminal area T is obtained by cutting the CF side substrate 1 by the terminal width in advance. This is an area where only the TFT side substrate is left.

  In the present invention, when processing the scribe line S3 to the strip-like substrate M1 having the terminal area T, the following means is used. That is, when the second substrate (TFT side substrate) 2 having the terminal area T is scribed by pressing with the second cutter wheel 3b, the cutting amount of the cutter wheel 3b to the substrate in which the destruction occurs in the terminal area T is broken in advance. The deformation of the terminal area T is alleviated by searching for and setting as the cutting amount, and pressing and scribing the cutter wheel 3b within the range of processing conditions of the proper cutting amount not exceeding the destruction cutting amount at the time of scribing Thus, the occurrence of breakage in the terminal region T is eliminated.

  The inventors used the first and second cutter wheels 3a and 3b with a diameter of 2 mm to “advance the bonded substrate (strip-like substrate M1) having a thickness of 0.3 mm on the TFT side substrate 2 and a terminal width of 6 mm. A scribing experiment was conducted to process a scribing line with a cutting amount of 1.0 mm by the "scribing" method. As a result, as shown in FIG. 9, it was confirmed that the deformation occurred in the terminal area T, and the change h in the Z-axis address of the second cutter wheel 3b was 0.41 mm. The Z-axis address refers to the position of the movement locus of the cutter wheel along the substrate thickness direction at the time of scribing, and the variation h is set based on the position where the cutter wheel contacts the substrate (0 point) The amount of change in the actual position of the cutter wheel according to the amount of infeed.

  Moreover, the scribing experiment was performed by setting a cutting amount of 0.1 mm to 0.9 mm for each of the same bonded substrate as described above. The results are shown in FIG. According to this, when the cutting amount is 0.1 mm to 0.3 mm, the maximum variation of the Z-axis address in the terminal area T is 0.4 mm or less, and is within the range not exceeding the above-mentioned terminal breakage point However, if the cutting amount is 0.5 mm or more, the maximum amount of change in the Z-axis address exceeds the terminal breakage point, and the possibility of breakage occurring in the terminal region T becomes high. Therefore, 0.1 mm-0.3 mm becomes the appropriate cutting amount. Actually, the maximum variation of the Z-axis address in FIG. 10 with a depth of 0.3 mm in FIG. 15 is 0.253 mm, the deformation of the terminal area T is suppressed to a small degree, and the breakage of the terminal area T occurs do not do.

  By performing such a scribing experiment on each bonded substrate with a thickness of 0.1 mm to 1.0 mm, each thickness of the plate can be properly cut so that the maximum change amount of the Z-axis address does not exceed the terminal breakage point. Classify and set each. Then, the setting value is stored as a scribing recipe in the control unit of the computer attached to the scribing apparatus, and at the start of scribing, a desired cutting amount corresponding to the substrate to be processed is selected from the recipe and scribing is performed by computer control. It was made to do.

  Next, referring to FIGS. 11 and 12, in the second substrate including terminal area T, the process is performed when the start point of the scribe line is positioned at product area P and the terminal area T is positioned at the end point of the scribe line. The scribing process will be described. FIG. 11 is an explanatory view showing a scribing process by the first and second cutter wheels, and FIG. 12 is an explanatory view showing a scribing process of the terminal area by the first and second cutter wheels.

  The appropriate cutting amount and the first scribing load are selected with respect to the TFT side substrate 2, and the second cutter wheel 3b is pressed against the scribing start point. A scribe line is formed in the product area P by rolling the second cutter wheel 3b at a predetermined traveling speed (scribing speed). Subsequently, when scribing the terminal region T, a second scribing load smaller by, for example, 20 to 50% than the first scribing load is selected. Specifically, the scribing load changes from the inside of the terminal area T by a predetermined distance from the inside of the terminal area T, and a scribing line is formed by the second scribing load from the root R of the terminal area T to the end. In order to make the second scribe load reliably from the root portion R of the terminal area T, it is preferable that the load starts to change inside the terminal area T, that is, in the vicinity of the terminal area T of the product area P. On the other hand, when the scribing load in the product region P is small, the depth of the vertical crack becomes small, and there is a possibility that division failure occurs in the subsequent division step. For this reason, it is preferable to change the load from the position of 1 to 2 mm inside of the root portion R of the terminal area T in the product area P. Thereby, the deformation of the terminal region can be further suppressed, and in particular, when the deformation of the substrate becomes asymmetrical as viewed from the scribing advancing direction by the shift cutting, it is possible to suppress the occurrence of sog.

  Furthermore, at the end portion of the terminal area T, as shown in FIG. 10, the vicinity N of the end position of the terminal area T is shifted along the horizontal traveling line 15, and from the vicinity N of the end position of the terminal area T The terminal area T is traveled gradually and slightly away from the surface of the terminal area T up to the end position of the terminal area T. Then, when the end position of the terminal area T is reached, it is made to retract in the vertical direction instantaneously at the stop time zero. Specifically, when the second cutter wheel 3b starts to move away from the surface of the terminal area T from, for example, 10 μm from the end position, it is possible to reliably retract in the vertical direction without stopping at the terminal position of the terminal area T It is.

  Next, the scribing operation of the first substrate (CF side substrate) 1 will be described. In the present embodiment, in the first substrate (CF side substrate) 1 and the second substrate (TFT side substrate) 2, the scribing operation is simultaneously performed by the first cutter wheel 3a and the second cutter wheel 3b. In the CF side substrate 1 as well as the TFT side substrate 2, the incised amount and the above-mentioned first scribing load are selected, and the first cutter wheel 3a is pressed against the scribing start point, and the product is produced at a predetermined scribing speed. The scribing of the area P is performed. Subsequently, while the terminal region T of the opposing TFT substrate is scribed, scribing is performed with a second scribing load which is, for example, 20 to 50% smaller than the first scribing load. Specifically, at the same time when the load applied by the second cutter wheel 3b of the TFT side substrate starts to change, the load is also changed in the CF side substrate, and the distance corresponding to the terminal width w of the TFT side substrate is The scribing is performed with the second scribing load. That is, it is preferable to change the load from the position of 1 to 2 mm inside the terminal width w from the end of the product area P. As described above, since the loads of the first cutter wheel 3a and the second cutter wheel 3b simultaneously change, the loads applied to the mother substrate do not become uneven. Therefore, the deformation of the entire mother substrate can be suppressed.

  Further, the first cutter wheel 3a is moved along the horizontal traveling line to the first substrate surface up to the vicinity of the first substrate end position, and the vicinity of the end position of the CF side substrate 1 to the end position is the first substrate Drive the vehicle gradually and slightly away from the surface. Then, when the end position of the first substrate is reached, it is retracted in the vertical direction instantaneously at a stop time of zero. Specifically, the first cutter wheel 3a starts to move away from the surface of the CF side substrate 1 from, for example, 10 μm from the end position, so that it retracts in the vertical direction reliably without stopping at the end position of the CF side substrate 1 Is possible. As described above, the first cutter wheel 3a for scribing the CF side substrate 1 is also retracted immediately at the end of the substrate, so that the load does not continue to be applied only to the end of the CF side substrate 1 during the stop time of the first cutter wheel . Therefore, the deformation of the entire CF side substrate 1 and the mother substrate M can be suppressed.

  At this time, the first cutter wheel 3a and the second cutter wheel 3b simultaneously retract from the mother substrate M, in other words, the first cutter wheel 3a reaches the end position of the CF side substrate at the same time as the second cutter wheel It is preferable to set scribing conditions such as scribing speed so that 3b reaches the end position of the terminal region T of the TFT side substrate 2. As a result, the first cutter wheel 3a and the second cutter wheel 3b retract immediately at the end of the mother substrate M, so the load applied to the mother substrate M does not become uneven. Therefore, the deformation of the entire mother substrate can also be suppressed.

  In addition, since the terminal area T does not exist in the CF side substrate 1, the same proper cutting amount as the TFT side substrate 2 may be used as a cutting amount in the CF side substrate 1, and a cutting larger than the proper cutting amount may be used. An amount of loading may be used. In the product region P, the CF side substrate 1 and the TFT side substrate 2 are bonded to each other, and in the CF side substrate 1, even if the cut amount exceeding the terminal breaking point is used, no deformation leading to the breaking of the substrate occurs. It is.

  FIG. 13 is a diagram showing an example of the scribe recipe SD. For each scribe recipe SD, recipe no. 1 ... No. Numbers for identifying each recipe are attached like n. In each scribing recipe SD, the thickness of the substrate, cutting depth, terminal width, diameter of cutter wheel used and type of cutting edge, traveling speed of cutter wheel, scribing load etc. are classified and described as scribing information There is. Then, when one of the recipes suitable for the scribing process to be executed is selected by the operator, the control unit reads the recipe to control the amount of rise of the cutter wheel based on the contents described in the scribing recipe SD. And the scribing process is performed.

  FIG. 14 is a block diagram showing the structure of the computer 11. The computer 11 includes a control unit 12 realized by computer hardware such as a CPU, a RAM, and a ROM, an input unit 13, and a display unit 14 on which a processing menu and an operation status are displayed. The control unit 12 controls the overall processing operation on the substrate, such as suction holding of the substrate by the table 4, movement of the scribing heads 6 and 6 by the motor 10, and elevation operation of the cutter wheels 3a and 3b by the elevation mechanism. The input unit 13 is an interface for the operator to input various operation instructions and data to the scribing apparatus.

  In the present invention, as described above, when a portion of the terminal area T is cut and scribed by the second cutter wheel 3b, the position of the cutter wheel at which the terminal area T is deformed and breakage occurs is taken as a terminal breakage point. An appropriate cutting amount not exceeding the point is selected for scribing, and the cutter wheel is retracted from the terminal area without stopping at the end of the terminal area. Thereby, even under the condition that the thickness of the substrate is small and deformation of the terminal area T having a large terminal width is likely to occur, the deformation of the terminal area T is suppressed at the time of scribing termination of the second cutter wheel 3b. Can be reliably prevented from being destroyed. In addition, by reducing the scribing load at the time of scribing of the terminal area T, it is possible to suppress problems such as forward running and soge even when increasing the scribing load other than the terminal area T, and to obtain a high quality product it can.

As mentioned above, although the typical example of the present invention was described, the present invention is not necessarily specified to the above-mentioned embodiment, but the object of the present invention is achieved, and it is corrected suitably within the range which does not deviate from a claim. It is possible to change.
For example, in the present embodiment, the mother substrate M is disposed on the table 4 so that the CF side substrate 1 is on the top, but the TFT side substrate 2 may be disposed on the top. In this case, the first cutter wheel 3a is disposed below the table, and the second cutter wheel 3b is disposed above the table.

  The scribing method and scribing apparatus of a bonded substrate according to the present invention can be utilized when processing a scribing line for division into a bonded substrate having a terminal area.

M Mother board M1 Strip-like board M2 Unit product SD scribe recipe T terminal area 1 first board (CF side board)
2 Second substrate (TFT side substrate)
3a 1st cutter wheel 3b 2nd cutter wheel 4 table 11 computer 12 control part

Claims (3)

Bonding having a product region in which a first substrate and a second substrate are bonded, and a terminal region formed by cutting a part of the edge of the first substrate and forming the edge of the second substrate A scribing method for processing a scribing line for division on the upper and lower surfaces of a substrate by scribing the laminated substrate in the direction of the terminal region from the product region using two cutter wheels facing each other,
Selecting a proper cutting amount not exceeding the terminal breaking point where destruction of the previously set terminal area occurs;
Scribing a product region of the bonded substrate by a first scribing load;
Scribing at least the terminal area with a second scribing load less than the first scribing load;
And, at the end of the terminal area, retracting the cutter wheel from the end without stopping.
How to scribe bonded substrates.   In the step of scribing at least the terminal area with the second scribing load, the second scribing load scribes a distance at least equal to the width of the terminal area from the end of the product area of the first substrate. The scribing method according to Item 1. Bonding having a product region in which a first substrate and a second substrate are bonded, and a terminal region in which a part of an edge of the first substrate is cut out and formed at the edge of the second substrate A scribing apparatus for processing a scribing line for division on the upper and lower surfaces of a substrate, comprising:
A table for holding a bonded substrate to be processed;
Upper and lower cutter wheels disposed up and down movably on the upper and lower sides of the bonded substrate held on the table via an elevating mechanism, and traveling toward the terminal area of the bonded substrate;
A control unit that performs overall processing of substrate processing by the cutter wheel;
And a scribe recipe stored in the control unit;
The scribe recipe is
When the cutter wheel cuts and scribes into the terminal area portion, the amount of cut does not cause destruction of the terminal area;
A first scribing load for scribing the product area;
Data of processing conditions including a second scribing load smaller than the first scribing load for scribing the terminal area is described;
The control unit
Select one of these scribing recipes and scribe based on the processing conditions,
The scribing device for a bonded substrate stack, wherein the elevating mechanism is moved up and down so that the cutter wheel retracts from the terminal area before the terminal end of the terminal area.

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