JP2019114688A - Board for loading electronic component and electronic component loading board - Google Patents

Abstract

A substrate for mounting an electronic component is provided. An electronic component mounting substrate having an electronic component mounting surface and a heat radiation surface opposite to the electronic component mounting surface, wherein the electronic component mounting substrate is a metal plate in order from the heat radiation surface side. A heat conductive adhesive layer and a main body are laminated and formed, and the main body is an insulating layer having a first main surface on the electronic component mounting surface side and a second main surface on the heat dissipation surface side. A first conductor layer arranged on the first main surface of the insulating layer, a second conductor layer arranged on the second main surface of the insulating layer, the first conductor layer, the insulating layer and the first conductor layer. 2 through conductors that penetrate the conductor layer, at least a portion of the second conductor layer is in contact with the heat conductive adhesive layer, the outer edge of the second main surface of the insulating layer, A coverlay is disposed, and the coverlay covers a part of the second conductor layer. [Selection diagram]

Description

The present invention relates to an electronic component mounting substrate and an electronic component mounting substrate.

Patent Document 1 discloses a device (a substrate for mounting an electronic component) used for an electronic control device with improved heat dissipation.
More specifically, the electronic component mounting substrate described in Patent Document 1 has the following configuration.

FIG. 11 is a cross-sectional view schematically showing the electronic component mounting substrate of Patent Document 1. As shown in FIG.
As shown in FIG. 11, in Patent Document 1, at least one power where the support substrate (502) is disposed on the first side (508) on the large area first conductor track (510) A second conductor track (511) with a large area is provided on the second side (509) comprising the structural part (503) and facing the power structural part (503), in which case the first of the large area The conductor track (510) and the large-area second conductor track (511) are thermally coupled to one another via at least one through contact (504), and in that case a support substrate ( 502) comprises a support substrate (502) and a cooling member (501) mounted for thermal conduction on the cooling member (501) by the second side (509), particularly for use in an electronic control device Supporting substrate (5 2) are disposed on the cooling member (501) using spacer members (517, 518) disposed on the second side (509) of the support substrate (502), and the cooling member (501) A gap formed by the spacing between the support substrate (502) and the cooling member (501) is filled with the thermally conductive filler material (507). An apparatus is disclosed, in particular for use in an electronic control unit, comprising a support substrate (502) and a cooling member (501).

In such an electronic component mounting substrate, the heat generated by the function of the power structure portion (503) is transferred to the filling material (507) thermally conducted by the through contact portion (504), and the cooling member ( It is transmitted to 501) and will be dissipated.

Japanese Patent Publication No. 2001-505000

In the electronic component mounting substrate as described in Patent Document 1, as the material of the support substrate (502), a resin such as polyimide resin is usually used.
However, polyimide resins and the like do not have sufficient strength, and there is a problem that they are broken when using the electronic component mounting substrate.
In addition, at the time of use of the electronic component mounting substrate, the support substrate (502) and the filling material (507) are peeled off, and a short circuit is caused between the second conductive path (511) and the other conductive member. Could occur.

The electronic component mounting substrate of the present invention is an electronic component mounting substrate having an electronic component mounting surface and a heat dissipation surface opposite to the electronic component mounting surface,
The electronic component mounting substrate is formed by sequentially laminating a metal plate, a thermally conductive adhesive layer, and a main body portion from the heat dissipation surface side,
The main unit is
An insulating layer having a first main surface on the electronic component mounting surface side and a second main surface on the heat dissipation surface side;
A first conductor layer disposed on the first major surface of the insulating layer;
A second conductor layer disposed on the second major surface of the insulating layer;
And a through conductor penetrating the first conductor layer, the insulating layer, and the second conductor layer,
At least a portion of the second conductor layer is in contact with the thermally conductive adhesive layer,
A coverlay is disposed at the outer edge of the second main surface of the insulating layer,
The cover lay covers a part of the second conductor layer.

The electronic component mounting board of the present invention is
Electronic parts,
It is characterized by comprising the substrate for mounting an electronic component of the present invention on which the electronic component is mounted.

FIG. 1 is a cross-sectional view schematically showing an example of the electronic component mounting substrate of the present invention. FIG. 2 is a cross-sectional view schematically showing an example of the electronic component mounting board in which the electronic component is mounted on the electronic component mounting board shown in FIG. FIG. 3 is a schematic view schematically showing an outer edge portion of the second main surface of the insulating layer in the electronic component mounting substrate of the present invention. FIG. 4 is a cross-sectional view schematically showing another example of the electronic component mounting substrate of the present invention. FIG. 5: is process drawing which shows typically an example of the insulating layer preparatory process in the manufacturing method of the board | substrate for electronic component mounting of this invention. FIG. 6 is a process chart schematically showing an example of a conductor layer disposing step in the method of manufacturing an electronic component mounting substrate of the present invention. FIGS. 7A and 7B are process diagrams schematically showing an example of the through conductor arranging step in the method of manufacturing an electronic component mounting substrate of the present invention. FIG. 8 is a process chart schematically showing an example of a coverlay arranging step in the method of manufacturing an electronic component mounting substrate of the present invention. FIG. 9 is a process chart schematically showing one example of a heat conductive adhesive layer arranging step in the method of manufacturing an electronic component mounting substrate of the present invention. FIG. 10: is process drawing which shows typically an example of the metal plate adhesion process in the manufacturing method of the board | substrate for electronic component mounting of this invention. FIG. 11 is a cross-sectional view schematically showing the electronic component mounting substrate of Patent Document 1. As shown in FIG.

(Detailed Description of the Invention)
Hereinafter, the present invention will be specifically described. The present invention is not limited to the following description, and can be appropriately modified and applied without departing from the scope of the present invention.

Hereinafter, the configuration of the electronic component mounting substrate according to the embodiment of the present invention will be described in more detail.
FIG. 1 is a cross-sectional view schematically showing an example of the electronic component mounting substrate of the present invention.
FIG. 2 is a cross-sectional view schematically showing an example of the electronic component mounting board in which the electronic component is mounted on the electronic component mounting board shown in FIG.

The electronic component mounting substrate 1 shown in FIG. 1 is an electronic component mounting substrate having an electronic component mounting surface 2 and a heat dissipation surface 3 opposite to the electronic component mounting surface 2, and the electronic component mounting substrate 1 is The metal plate 4, the thermally conductive adhesive layer 5, and the main body portion 6 are laminated and formed in order from the heat dissipation surface 3 side.

The main body portion 6 includes an insulating layer 10 having a first major surface 11 on the electronic component mounting surface 2 side and a second major surface 12 on the heat dissipation surface 3 side, and a first conductor layer 20 disposed on the first major surface 11. The second conductor layer 30a and the second conductor layer 30b disposed on the second major surface 12, and the through conductor 40 penetrating the first conductor layer 20, the insulating layer 10, and the second conductor layer 30a.
In the direction from the inside to the outer edge of the second major surface 12 of the insulating layer 10, the second conductor layer 30a is located more inward than the second conductor layer 30b.

In the electronic component mounting substrate 1, a part of the second conductor layer 30 a is in contact with the thermally conductive adhesive layer 5.
In the electronic component mounting substrate 1, the cover lay 50 and the second conductor layer 30 b are disposed in order from the inside to the outer edge portion 12 a of the second main surface 12.
Further, in the electronic component mounting substrate 1, the cover lay 50 covers a part of the second conductor layer 30 a.
That is, the part 51a of the coverlay is arranged to overlap with a part of the second conductor layer 30a.
Furthermore, in the electronic component mounting substrate 1, the cover lay portion 51 b covers the second conductor layer 30 b.

In the electronic component mounting substrate 1, the cover lay 50 is disposed at the outer edge 12 a of the second major surface 12.
When the cover lay is not disposed, a step is generated between the place where the second conductor layer is disposed and the place where the second conductor layer is not disposed on the second main surface of the insulating layer, and the thermally conductive adhesive layer Cause voids in the
However, covering such a step with the coverlay 50 can prevent the heat conductive adhesive layer 5 from being voided. In addition, the thickness of the heat conductive adhesive layer 5 can be easily made constant.

Further, when the cover lay is not disposed on the electronic component mounting substrate and the thermally conductive adhesive layer is disposed on the outer edge portion of the second main surface of the insulating layer, the outer edge of the second main surface of the insulating layer The part and the heat conductive adhesive layer are easily peeled off. When such peeling occurs, a short circuit is likely to occur between the second conductor layer and another conductive member such as a metal plate.
However, in the electronic component mounting substrate 1, since the cover lay 50 is disposed at the outer edge portion 12 a of the second main surface 12, it is possible to prevent the thermally conductive adhesive layer 5 from peeling off from the main body 6.
Furthermore, the occurrence of a short circuit due to the heat conductive adhesive layer 5 peeling off from the main body 6 can be prevented.

Further, by arranging the cover lay 50, the main body portion 6 can be reinforced, and the main body portion 6 can be prevented from being broken when the electronic component mounting substrate 1 is used.

Furthermore, in the electronic component mounting substrate 1, the cover lay 50 covers a part of the second conductor layer 30 a. By arranging the cover lay 50 in this manner, the adhesion between the second conductor layer 30 a and the cover lay 50 can be improved. Therefore, it is possible to prevent the cover lay 50 and the heat conductive adhesive layer 5 from peeling off from the main body 6.
Further, the second conductor layer 30a and the cover lay 50 are in close contact with each other, whereby sufficient insulation can be secured.

In the electronic component mounting substrate 1, it is desirable that the width of the portion 51a of the coverlay (the width indicated by the symbol D in FIG. 1) covering a portion of the second conductor layer 30a is 100 to 500 μm. .
If the width of the second conductor layer 30 a or the cover lay 50 is deviated at the time of manufacturing the electronic component mounting substrate 1 if the width is less than 100 μm, the second conductor layer 30 a and the cover lay 50 A gap is likely to occur. When such a gap is generated, the second conductor layer 30a and the cover lay 50 are easily peeled off.
If this width exceeds 500 μm, the contact area between a part of the second conductor layer 30 a and the heat conductive adhesive layer 5 becomes narrow, and the heat generated on the electronic component mounting surface 2 side is conducted to the heat dissipation surface 3 It becomes difficult to be done.

Further, as shown in FIG. 2, the electronic component 60 is mounted on the first conductor layer 20 of the electronic component mounting substrate 1 and is used as the electronic component mounting substrate 70.
Heat is generated when the electronic component 60 functions.
In the electronic component mounting substrate 1, the through conductor 40 penetrating the first conductor layer 20, the insulating layer 10, and the second conductor layer 30 a is disposed in the main body 6.
Therefore, the heat generated from the electronic component 60 can be rapidly transmitted to the thermally conductive adhesive layer 5 through the through conductor 40, and furthermore, the heat can be released through the metal plate 4.

Although the material of the insulating layer 10 in the electronic component mounting substrate 1 is not particularly limited, polyimide, liquid crystal polymer, glass epoxy, etc. may be mentioned, and among these, polyimide is desirable.
When the insulating layer 10 is polyimide, sufficient insulation can be ensured.
The thickness of the insulating layer 10 is preferably, but not limited to, 30 to 70 μm.
When the thickness of the insulating layer is smaller than 30 μm, it is easily bent, and the junction with other members is easily broken.
When the diameter is larger than 70 μm of the insulating layer, when the hole is formed by punching for disposing the through conductor, a crack is easily generated around the hole, which may lower the reliability.

In the electronic component mounting substrate 1, the material of the first conductor layer 20 is not particularly limited, but copper, nickel or the like is desirable.

In the electronic component mounting substrate 1, materials of the second conductor layer 30 a and the second conductor layer 30 b are not particularly limited, but copper, nickel or the like is desirable.

In the electronic component mounting substrate 1, the first conductor layer 20, the second conductor layer 30a, and the second conductor layer 30b may be made of the same material, or may be made of different materials.

In the electronic component mounting substrate 1, the thermal conductivity of the through conductor 40 is preferably 80 to 500 W / m · K.
When the thermal conductivity of the through conductor is less than 80 W / m · K, it becomes difficult to conduct the heat generated from the electronic component to the heat dissipation surface side.
If it is attempted to produce a through conductor whose thermal conductivity exceeds 500 W / m · K, it is expensive and uneconomical.

In the electronic component mounting substrate 1, the through conductor 40 may have any configuration as long as it can conduct heat to the heat dissipation surface side.
For example, a metal block may be inserted into a hole penetrating the first conductor layer 20, the insulating layer 10, and the second conductor layer 30a to form the through conductor 40.
Alternatively, the through conductor 40 may be formed by filling the holes penetrating the first conductor layer 20, the insulating layer 10, and the second conductor layer 30a by metal plating.
Alternatively, a thermally conductive non-metallic block may be inserted into a hole penetrating the first conductor layer 20, the insulating layer 10, and the second conductor layer 30a to form the through conductor 40.

When the through conductor 40 is a metal block, the material of the metal block is not particularly limited, but is preferably copper or aluminum. These materials have high thermal conductivity and are suitable as materials for the through conductor 40.

When the through conductor 40 is metal plating, the material of the metal plating is not particularly limited, but is preferably copper. Copper has high thermal conductivity and is suitable as a material of the through conductor 40.

When the through conductor 40 is made of a thermally conductive nonmetal block, the material of the thermally conductive nonmetal block is preferably ceramic, graphite or the like. These materials have high thermal conductivity and are suitable as materials for the through conductor 40.

In the electronic component mounting substrate 1, in the case where the through conductor 40 is a metal block or metal plating, since these also have electrical conductivity, they can also function as a conductive member.

In the electronic component mounting substrate 1, the shape of the through conductor 40 is not particularly limited, but it is desirable that the through conductor 40 has a columnar shape such as a cylinder, a triangular prism, a quadrangular prism, a hexagonal prism, or an octagonal prism.

When the shape of the through conductor 40 is columnar, the area of the end face is desirably 0.01 to 100 mm ² .
If the area of the through conductor is less than 0.01 mm ² , the mass of the through conductor becomes small, and it becomes difficult to conduct the heat generated from the electronic component to the heat dissipation surface.
When the area of the through conductor exceeds 100 mm ² , the through conductor is easily detached from the main body.

In the present specification, "the outer edge portion of the second main surface" means the following range.
FIG. 3 is a schematic view schematically showing an outer edge portion of the second main surface of the insulating layer in the electronic component mounting substrate of the present invention. In the present specification, “the outer edge portion of the second main surface” refers to the range from the edge 12 e of the second main surface 12 to the inside 10 mm (the range shown by oblique lines in FIG. 3) as shown in FIG. Means

Although the electrical resistivity of the cover lay 50 is not particularly limited in the electronic component mounting substrate 1, it is desirable that the electrical resistivity is 1 × 10 ¹² to 1 × 10 ¹⁸ Ω · m.
If the electrical resistivity of the coverlay is less than 1 × 10 ¹² Ω · m, a short circuit is likely to occur between the second conductor layer and the other conductive member through the coverlay.
When the electrical resistivity of the coverlay exceeds 1 × 10 ¹⁸ Ω · m, the insulation property approaches the upper limit and the cost effectiveness becomes worse.

The material of the coverlay 50 is not particularly limited, but is preferably epoxy resin, acrylic resin, polyimide resin, or the like. Among these, epoxy resins are more preferable.
When the coverlay 50 is made of these materials, the strength is sufficiently strong, and the outer edge 12a of the second major surface 12 and the coverlay 50, and the coverlay 50 and the heat conductive adhesive layer 5 are sufficiently strong. It can be glued.
Furthermore, sufficient insulation can be ensured.

The thickness of the cover lay 50 of the portion in contact with the insulating layer 10 in the electronic component mounting substrate 1 is not particularly limited, but is preferably 10 to 100 μm, and more preferably 25 to 75 μm.
When the thickness of the coverlay is less than 10 μm, the coverlay is too thin, and it becomes difficult to sufficiently strengthen the substrate for mounting electronic parts. In addition, it becomes difficult to sufficiently bond the outer edge portion and the coverlay of the second main surface, and the coverlay and the thermally conductive adhesive layer.
When the thickness of the coverlay exceeds 100 μm, the entire electronic component mounting substrate becomes thick, and it becomes difficult to arrange the electronic component mounting substrate on the electronic device.

In the electronic component mounting substrate 1, the thermal conductivity of the thermally conductive adhesive layer 5 is desirably 1.5 to 20 W / m · K.
When the thermal conductivity of the thermally conductive adhesive layer is less than 1.5 W / m · K, it becomes difficult to conduct the heat generated from the electronic component conducted through the through conductor to the heat dissipation surface side.
Attempting to produce a thermally conductive adhesive layer having a thermal conductivity of more than 20 W / m · K is expensive and uneconomical.

In the electronic component mounting substrate 1, the material of the thermally conductive adhesive layer 5 is not particularly limited, but is preferably an epoxy resin or the like containing a high thermal conductivity filler.
When the thermally conductive adhesive layer 5 is made of these materials, sufficient thermal conductivity can be secured, and adhesiveness can also be secured.

In the electronic component mounting substrate 1, the thickness of the thermally conductive adhesive layer 5 at the portion where the second conductive layer 30 a and the thermally conductive adhesive layer 5 are in contact with each other is preferably 50 to 200 μm.
When the thickness of the thermally conductive adhesive layer 5 at the portion where the second conductive layer 30 a and the thermally conductive adhesive layer 5 are in contact is less than 50 μm, the adhesion is difficult to be sufficient.
If the thickness of the thermally conductive adhesive layer 5 at the portion where the second conductive layer 30a and the thermally conductive adhesive layer 5 are in contact exceeds 200 μm, the thermally conductive adhesive layer is too thick, so from the electronic component It becomes difficult to conduct the generated heat to the heat dissipation surface side. In addition, the entire electronic component mounting substrate becomes thick, which makes it difficult to arrange the electronic component mounting substrate in the electronic device.

In the electronic component mounting substrate 1, the material of the metal plate 4 is not particularly limited, and copper, iron, stainless steel, aluminum or the like may be used.
These metals have high thermal conductivity and are suitable as materials for metal plates that are heat sinks.

The thickness of the metal plate 4 is not particularly limited, but is preferably 35 to 4000 μm.
If the thickness of the metal plate is less than 35 μm, the mass of the metal plate becomes small and it becomes difficult to sufficiently function as a heat sink.
When the thickness of the metal plate exceeds 4000 μm, the entire electronic component mounting substrate becomes thick, and it becomes difficult to arrange the electronic component mounting substrate on the electronic device.

In the electronic component mounting substrate 1, it is desirable that the distance from the second major surface 12 to the metal plate 4 be substantially constant.
When the distance from the second major surface 12 to the metal plate 4 is substantially constant, the thickness of the entire electronic component mounting substrate 1 is also substantially constant, so that the electronic component mounting substrate can be easily disposed in the electronic device.
In order to make the distance from the second major surface 12 to the metal plate 4 substantially constant, there is a method of setting the thickness of the thermally conductive adhesive layer 5 in consideration of the thickness of the cover lay.

The electronic component 60 mounted on the electronic component mounting substrate 1 is not particularly limited, but is not particularly limited, but may be a light emitting element, a transistor, a capacitor, an IC chip or the like. It is desirable that these electronic components be surface-mounted.

When the electronic component 60 is a light emitting element, in the electronic component mounting substrate 1, a cover lay may be disposed on the first conductor layer 20 and a reflective layer may be disposed on the cover lay.
When such a reflective layer is disposed, light generated from the light emitting element can be reflected, and emission intensity can be increased.
The material of the reflective layer is not particularly limited, and titanium oxide and the like conventionally used can be used.

Next, an electronic component mounting board according to another embodiment of the present invention will be described.
FIG. 4 is a cross-sectional view schematically showing another example of the electronic component mounting substrate of the present invention.
The electronic component mounting substrate 101 shown in FIG. 4 has the same configuration as the electronic component mounting substrate 1 except that the second conductor layer 30 b is not disposed.
The electronic component mounting substrate of the present invention may have such a configuration.

Next, a method of manufacturing the electronic component mounting substrate of the present embodiment will be described.
The method of manufacturing the electronic component mounting substrate of the present embodiment includes (1) insulating layer preparation step, (2) conductor layer arrangement step, (3) through conductor arrangement step, (4) cover lay arrangement step, (5) It consists of a heat conductive adhesive layer arrangement process, and (6) metal plate adhesion process.
FIG. 5: is process drawing which shows typically an example of the insulating layer preparatory process in the manufacturing method of the board | substrate for electronic component mounting of this invention.
FIG. 6 is a process chart schematically showing an example of a conductor layer disposing step in the method of manufacturing an electronic component mounting substrate of the present invention.
FIGS. 7A and 7B are process diagrams schematically showing an example of the through conductor arranging step in the method of manufacturing an electronic component mounting substrate of the present invention.
FIG. 8 is a process chart schematically showing an example of a coverlay arranging step in the method of manufacturing an electronic component mounting substrate of the present invention.
FIG. 9 is a process chart schematically showing one example of a heat conductive adhesive layer arranging step in the method of manufacturing an electronic component mounting substrate of the present invention.
FIG. 10: is process drawing which shows typically an example of the metal plate adhesion process in the manufacturing method of the board | substrate for electronic component mounting of this invention.

(1) Insulating Layer Preparation Step First, as shown in FIG. 5, an insulating layer 10 having a first major surface 11 and a second major surface 12 opposite to the first major surface 11 is prepared.
Since the desirable material, thickness and the like of the insulating layer 10 have already been described, the description here is omitted.

(2) Conductor Layer Placement Step Next, as shown in FIG. 6, the first conductor layer 20 is disposed on the first major surface 11, and the second conductor layer 30a and the second conductor layer 30b are disposed on the second major surface 12. Do.
At this time, the second conductor layer 30 b is disposed at the outer edge 12 a of the second major surface 12.
Desirable materials and the like for the respective conductor layers have already been described, and thus the description thereof is omitted here.

(3) Through conductor disposing step Next, as shown in FIG. 7A, through holes 41 penetrating the first conductor layer 20, the insulating layer 10, and the second conductor layer 30a are formed.
The method of forming the through hole 41 is not particularly limited, and may be formed by a punch or a laser.

Then, as shown in FIG. 7 (b), the through conductor 40 is disposed in the through hole 41.
When the through conductor 40 is a metal block or a thermally conductive non-metal block, the through conductor 40 can be disposed by inserting these blocks into the through holes 41.
When the through conductor 40 is metal plated, the through conductor 40 can be disposed by filling the through hole 41 with metal plating.
Since desirable shapes, materials, and the like of the metal block, the metal plating, and the thermally conductive nonmetal block have already been described, the description here is omitted.

The main body 6 can be manufactured through the above steps.

(4) Coverlay Arrangement Step Next, as shown in FIG. 8, the coverlay 50 is arranged at the outer edge 12 a of the second major surface 12. At this time, the cover lay 50 is disposed so as to cover a part of the second conductor layer 30a and the second conductor layer 30b.
Since the desired thickness, material, etc. of the cover lay 50 have already been described, the description here is omitted.

(5) Thermally Conductive Adhesive Layer Arrangement Step Next, as shown in FIG. 9, the thermally conductive adhesive layer 5 is placed in a manner such that the second conductive layer 30a and the thermally conductive adhesive layer 5 are in contact with each other. The second conductor layer 30 a and the cover lay 50 are disposed.
Since the thickness, material, and the like of the heat conductive adhesive layer 5 have already been described, the description here is omitted.

(6) Metal Plate Bonding Step Next, as shown in FIG. 10, the metal plate 4 is bonded to the thermally conductive adhesive layer 5.
Thus, the electronic component mounting substrate 1 can be manufactured.

DESCRIPTION OF SYMBOLS 1, 101 Electronic component mounting substrate 2 Electronic component mounting surface 3 Heat dissipation surface 4 Metal plate 5 Thermally conductive adhesive layer 6 Body part 10 Insulating layer 11 1st main surface 12 2nd main surface 12a Outer edge part 12e Edge 20 1st Conductor layers 30a, 30b second conductor layer 40 through conductor 41 through hole 50 cover lay 51a, 51b part of cover lay 60 electronic component 70 electronic component mounting substrate

Claims (9)

An electronic component mounting substrate having an electronic component mounting surface and a heat dissipation surface opposite to the electronic component mounting surface,
The electronic component mounting substrate is formed by sequentially laminating a metal plate, a thermally conductive adhesive layer, and a main body portion from the heat dissipation surface side,
The body portion is
An insulating layer having a first major surface on the electronic component mounting surface side and a second major surface on the heat dissipation surface side;
A first conductor layer disposed on the first major surface of the insulating layer;
A second conductor layer disposed on the second major surface of the insulating layer;
And a through conductor penetrating the first conductor layer, the insulating layer, and the second conductor layer,
At least a portion of the second conductor layer is in contact with the thermally conductive adhesive layer,
A coverlay is disposed at the outer edge of the second main surface of the insulating layer,
The said coverlay covers a part of said 2nd conductor layer, The electronic component mounting substrate characterized by the above-mentioned. The substrate for mounting an electronic component according to claim 1, wherein a thermal conductivity of the through conductor is 80 to 500 W / m · K. The substrate for mounting an electronic component according to claim 1, wherein a thermal conductivity of the thermally conductive adhesive layer is 1.5 to 20 W / m · K. The substrate according to any one of claims 1 to 3, wherein the electrical resistivity of the coverlay is 1 × 10 ¹² to 1 × 10 ¹⁸ Ω · m. The substrate for mounting an electronic component according to any one of claims 1 to 4, wherein a width of a part of the coverlay covering a part of the second conductor layer is 100 to 500 m. The substrate for mounting an electronic component according to any one of claims 1 to 5, wherein the distance from the second main surface of the insulating layer to the metal plate is substantially constant. The electron according to any one of claims 1 to 6, wherein a thickness of the thermally conductive adhesive layer at a portion where the second conductive layer and the thermally conductive adhesive layer are in contact with each other is 50 to 200 μm. Component mounting board. The substrate for mounting an electronic component according to any one of claims 1 to 7, wherein the through conductor is a metal block. Electronic parts,
An electronic component mounting board comprising the electronic component mounting board according to any one of claims 1 to 8, wherein the electronic component is mounted.

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