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JP2019105462A - Temperature measurement system and method thereof - Google Patents

Temperature measurement system and method thereof Download PDF

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JP2019105462A
JP2019105462A JP2017236500A JP2017236500A JP2019105462A JP 2019105462 A JP2019105462 A JP 2019105462A JP 2017236500 A JP2017236500 A JP 2017236500A JP 2017236500 A JP2017236500 A JP 2017236500A JP 2019105462 A JP2019105462 A JP 2019105462A
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temperature
front panel
rack
ict
temperature distribution
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敏雄 渡辺
Toshio Watanabe
敏雄 渡辺
克也 林
Katsuya Hayashi
克也 林
崇 古谷
Takashi Furuya
崇 古谷
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NTT Inc
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Nippon Telegraph and Telephone Corp
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Abstract

To provide a temperature measurement system and method thereof capable of easily extracting the temperature of an ICT device from the measurement result obtained by measuring the temperature of the ICT device housed in a rack over a panel of the rack.SOLUTION: A thermography 110 focuses on a front panel 12 of a rack 10 (S401), and measures the temperatures of the front panel 12 and ICT devices 11-1 to 11-m from the front of the rack 10 with the front panel 12 closed (S402). A measurement result processing computer 120 extracts the temperature (distribution) of the ICT devices 11-1 to 11-m by excluding the temperature distribution of the front panel 12 from the measurement result transferred from the thermography. Specifically, the measurement result which is recorded by replacing the color for each pixel is converted into a temperature (S403), and is divided into a low temperature area and a high temperature area (S404). It is determined that the area where the temperature is low is the temperature of the front panel 12, and the area where the temperature is high is the temperature of the ICT devices 11-1 to 11-m (S405).SELECTED DRAWING: Figure 4

Description

本技術は、温度測定システムおよびその方法に関し、データセンタや通信機械室の多数の通信装置・計算機の装置毎の温度計測を実施する温度測定システムおよびその方法に関する。   The present technology relates to a temperature measurement system and method thereof, and relates to a temperature measurement system and method for performing temperature measurement of each communication device / computer of many communication devices in a data center or communication machine room.

データセンタや通信機械室の通信装置や計算機などの情報通信技術用装置(以降、単に「ICT装置」と記す)の温度監視には、従来温度センサがよく用いられている。IoT技術の進展により、小型の省電力(電池駆動)の温度センサの利用が容易になり、センサのネットワーク化による温度監視や、空調装置との連携による空調システムの効率化などの実用化、サービス導入が進められている(非特許文献1参照)。   Conventionally, a temperature sensor is often used to monitor the temperature of an apparatus for information communication technology (hereinafter simply referred to as "ICT apparatus") such as a communication apparatus in a data center or a communication machine room or a computer. Advances in IoT technology facilitate the use of small, power-saving (battery-powered) temperature sensors, temperature monitoring by networking sensors, practicalization of efficiency of air conditioning systems by cooperation with air conditioners, services Introduction is in progress (see Non-Patent Document 1).

データセンタや通信機械室においては、正常な動作に向けたICT装置の温度管理が重要であるが、昨今のICT装置の高性能化に伴い、発熱量・発熱密度が増加傾向にあり、適切な空調の運用・管理を行っても局所的な熱だまりなどが容易に発生し得る。ICT装置には適切な動作温度が存在するので、熱だまりなどのICT装置の適切な動作温度からの逸脱をいち早く発見する必要がある。   In data centers and communication equipment rooms, temperature management of ICT equipment for normal operation is important, but with the recent advancement of ICT equipment, the calorific value and calorific density tend to increase, and appropriate. Even when operating and managing air conditioning, local heat accumulation can easily occur. Because there is a proper operating temperature for ICT devices, it is necessary to quickly detect deviations from the proper operating temperature of the ICT device, such as heat pools.

温度センサは、センサ近傍の狭い範囲の温度を計測するものであるため、局所的な熱だまりの把握のような目的では、ICT装置毎の温度監視、すなわち温度センサの設置が必要となり、通常の温度監視や空調効率化の場合より温度センサの設置数を大幅に増加させる必要がある。   Since the temperature sensor measures the temperature in a narrow range near the sensor, for the purpose of grasping the local heat pool, it is necessary to monitor the temperature of each ICT device, that is, to install the temperature sensor. In the case of temperature monitoring and air conditioning efficiency improvement, it is necessary to significantly increase the number of installed temperature sensors.

しかしながら、温度センサの設置数が増加すると、装置コストやシステム構築の工数が増加するとともに、ICT装置の新設、廃止、移動の際の温度センサのネットワークの再構築、センサと測定対象の対応関係の管理などが煩雑となる。 However, as the number of installed temperature sensors increases, the cost of the system and the number of man-hours for system construction increase, as well as the installation and removal of ICT devices, reconstruction of the network of temperature sensors when moving, correspondence between sensors and measurement targets Management is complicated.

そのため、規模の大きいデータセンタや通信機械室における局所的な熱だまりのような緻密な温度監視を、温度センサを用いたシステムで実現することは困難であった。   Therefore, it has been difficult to realize precise temperature monitoring such as local heat accumulation in a large scale data center or communication machine room by a system using a temperature sensor.

これに対し、複数のICT装置の温度状態の網羅的・効率的な計測手法として、サーモグラフィ(赤外線カメラ)を利用する方法がある。通常、データセンタ、通信機械室のICT装置は、通信用ラック(以下、単に「ラック」と記す)に収納されるが、サーモグラフィを用いれば、ラック内の複数のICT装置の温度分布を一度の計測(撮影)により、網羅的に捉えることが可能である(非特許文献2参照)。   On the other hand, there is a method using thermography (infrared camera) as a comprehensive and efficient measurement method of the temperature state of a plurality of ICT devices. Normally, ICT devices in a data center and a communication machine room are housed in a communication rack (hereinafter simply referred to as a "rack"), but if thermography is used, the temperature distribution of a plurality of ICT devices in the rack is It is possible to capture comprehensively by measurement (shooting) (see Non-Patent Document 2).

ラックの前面にはパネル(以下、「前面パネル」と記す)があり、通常、施錠された状態で運用されるが、前面パネルには、データセンタや通信機械室の空調装置から排出された冷気の効率的な取り込みのため、パンチング加工等により多数の吸気孔が設けられている。最近では、ラック外よりラック内のICT装置が視認できるほどに開口率が高い(概ね60%以上、最近では80%を超える事例もある)ものが多い。サーモグラフィは、計測対象との間に遮るものがない状態で計測するのが原則であるが、原理的には、吸気孔を通して、ラック外からラック内のICT装置の温度計測も可能である。   There is a panel (hereinafter referred to as "front panel") on the front of the rack, which is usually operated in a locked state, but on the front panel, cold air discharged from the air conditioners of the data center and the communication machine room In order to take in efficiently, a large number of intake holes are provided by punching or the like. Recently, there are many cases where the aperture ratio is so high that the ICT devices in the rack can be seen from outside the rack (approximately 60% or more, and in some cases recently more than 80% in some cases). In principle, thermography is to be performed without interference with the object to be measured, but in principle, it is also possible to measure the temperature of the ICT device in the rack from outside the rack through the air intake holes.

西田 龍一、外3名、「データセンタ用空調機とマルチ温度センサの連係制御に関する検討」、空気調和・衛生工学会人会学術講演論文集、2010年9月、pp.2115−2118Ryuichi Nishida, 3 others, “A study on linked control of air conditioners and multi-temperature sensors for data centers,” Proceedings of the Annual Meeting of the Air Harmony and Sanitation Engineering Association, September 2010, pp. 2115-2118 伊藤 史人、外2名、「学内サーバ室の環境温度の考察」、学術情報処理研究 No.15、2011年、pp.98−107Fumihito Ito, 2 others, "Discussion of the environmental temperature in the on-campus server room", Academic Information Processing No. 15, 2011, pp. 98-107

しかしながら、サーモグラフィを使用したラックの前面パネル越しの計測では、前面パネルの温度分布と混ざった計測結果(画像)となるため、以下の2つの課題がある。   However, in the measurement through the front panel of the rack using thermography, the measurement result (image) mixed with the temperature distribution of the front panel is encountered, and there are the following two problems.

通常、サーモグラフィによる計測では、計測対象であるICT装置にフォーカスを合わせるが、このような場合、前面パネルにはフォーカスが合っていないため、撮影される画像には前面パネルに起因したぼけ(ブラー)が発生する。前面パネルにはミリ単位の小さな吸気孔が多数集積して存在するため、その吸気孔越しに計測されたラック内のICT装置の計測結果は、吸気孔全体に渡り前面パネルの温度が混ざった値となってしまう。通常、前面パネルの温度はICT装置の温度より低いため、ICT装置の温度と前面パネルの温度とが混ざって計測される場合、ICT装置の計測結果は実際より低い温度を示すこととなり、結果として熱だまりなどの発生を見逃す危険性がある。   Usually, in thermography measurement, the ICT device to be measured is focused, but in such a case, the front panel is not in focus, so the image to be photographed is blurred due to the front panel Occurs. Since many small intake holes in the millimeter unit are accumulated in the front panel, the measurement results of the ICT equipment in the rack measured through the intake holes show the value where the temperature of the front panel is mixed over the entire intake holes. It becomes. Usually, since the temperature of the front panel is lower than the temperature of the ICT device, when the temperature of the ICT device and the temperature of the front panel are mixed and measured, the measurement result of the ICT device indicates a lower temperature than the actual temperature. There is a risk of missing an outbreak such as a heat pool.

また、仮に、ICT装置の温度の計測結果が前面パネルの影響を受けなかったとしても、計測結果(画像)の中から、ICT装置の温度のみを抽出する必要がある。予め、計測結果(画像)の各画素とICT装置/前面パネルの対応関係が明らかであれば、ICT装置の計測結果のみを抽出することも原理的には可能であるが、正確に位置決めして計測することは容易ではない。   Also, even if the measurement result of the temperature of the ICT device is not influenced by the front panel, it is necessary to extract only the temperature of the ICT device from the measurement result (image). If the correspondence between each pixel of the measurement result (image) and the ICT device / front panel is clear in advance, it is possible in principle to extract only the measurement result of the ICT device, but It is not easy to measure.

ラックの前面パネルを開けて計測を行えば、前記のような課題は発生しないが、数百以上のラックが存在するようなデータセンタ、通信機械室では、通常施錠されている前面パネルの開閉だけでも大きな手間であり、そのような手法は現実的には実現が困難である。   If the front panel of the rack is opened and measurement is performed, the above problem does not occur, but in a data center or communication machine room where there are several hundred or more racks, only opening and closing of the normally locked front panel But it is a lot of work, and such a method is practically difficult to realize.

本発明は、このような課題に鑑みてなされたもので、その目的とするところは、ラック内に収容されたICT装置の温度をラックのパネル越しに測定した測定結果から、ICT装置の温度を容易に抽出可能な温度測定システムおよびその方法を提供することにある。   The present invention has been made in view of such problems, and an object of the present invention is to measure the temperature of the ICT apparatus from the measurement result of measuring the temperature of the ICT apparatus housed in the rack over the panel of the rack. It is an object of the present invention to provide an easily extractable temperature measurement system and its method.

上記の課題を解決するために、本発明の一態様の温度測定システムは、ICT装置を収容したラックが備える多数の開口部が設けられた吸気側パネルから放射された赤外線を、前記吸気側パネルに焦点を合わせて計測する赤外線測定部と、前記赤外線測定部で測定された赤外線画像を温度分布データに変換し、前記温度分布データを高温領域と低温領域とに分離する二値化処理を行う二値化処理部と、二値化処理により分離された前記温度分布データの高温領域を前記ICT装置の温度分布として出力するICT装置温度抽出部と、を備えたことを特徴する。   In order to solve the above problems, the temperature measurement system according to one aspect of the present invention is characterized in that the infrared ray radiated from the intake side panel provided with a large number of openings provided in the rack that accommodates the ICT device is the intake side panel An infrared measuring unit for measuring with focus on the infrared light, and converting the infrared image measured by the infrared measuring unit into temperature distribution data, and performing binarization processing for separating the temperature distribution data into a high temperature region and a low temperature region A binarization processing unit and an ICT apparatus temperature extraction unit for outputting a high temperature area of the temperature distribution data separated by the binarization processing as a temperature distribution of the ICT apparatus.

本発明の別の態様では、さらに前記赤外線測定部は、前記吸気側パネルの開口部を判別できる解像度を有することを特徴とする。   In another aspect of the present invention, the infrared measurement unit further has a resolution capable of determining an opening of the intake side panel.

本発明の別の態様では、さらに前記二値化処理は、2つの領域のクラス内分散の和に対する2つの領域のクラス間分散を最大にするように閾値を決定する判別分析法による処理であることを特徴とする。   In another aspect of the present invention, the binarization process is a discriminant analysis process in which a threshold value is determined so as to maximize the interclass variance of the two areas to the sum of the intraclass variance of the two areas. It is characterized by

本発明の一態様の温度測定方法では、ICT装置を収容したラックが備える多数の開口部が設けられた吸気側パネルから放射された赤外線を、前記吸気側パネルに焦点を合わせた赤外線カメラで計測するステップと、前記赤外線カメラで測定された赤外線画像を温度分布データに変換し、前記温度分布データを高温領域と低温領域とに分離する二値化処理を行うステップと、二値化処理により分離された前記温度分布データの高温領域を前記ICT装置の温度分布として出力するステップと、を有することを特徴する。   In the temperature measurement method according to one aspect of the present invention, the infrared ray emitted from the intake side panel provided with a large number of openings provided in the rack containing the ICT device is measured by the infrared camera focused on the intake side panel Separating, converting the infrared image measured by the infrared camera into temperature distribution data, and separating the temperature distribution data into a high temperature region and a low temperature region; Outputting the high temperature region of the temperature distribution data obtained as the temperature distribution of the ICT device.

本発明の別の態様では、さらに前記赤外線カメラは、前記吸気側パネルの開口部を判別できる解像度を有することを特徴とする。   According to another aspect of the present invention, the infrared camera is characterized by having a resolution capable of determining the opening of the intake side panel.

本発明の別の態様では、さらに前記二値化処理は、2つの領域のクラス内分散の和に対する2つの領域のクラス間分散を最大にするように閾値を決定する判別分析法による処理であることを特徴とする。   In another aspect of the present invention, the binarization process is a discriminant analysis process in which a threshold value is determined so as to maximize the interclass variance of the two areas to the sum of the intraclass variance of the two areas. It is characterized by

本発明の技術を適用することにより、データセンタや通信機械室内の、通信装置、計算機の温度状態の装置毎な把握が効率的に実施可能となり、ひいては迅速な熱対策の実施が可能となる。結果として、熱だまりの発生による障害の未然の防止や、効果的な空調システムの運用による電力コスト削減などの効果を奏する。   By applying the technology of the present invention, it becomes possible to efficiently carry out grasping of the temperature condition of the communication device and computer in the data center and the communication machine room efficiently, and in turn, it is possible to implement the heat countermeasure quickly. As a result, there are effects such as prevention of failure due to heat accumulation and power cost reduction by the operation of an effective air conditioning system.

本発明の一実施形態に係る温度測定システムの構成例を示す図である。It is a figure showing an example of composition of a temperature measurement system concerning one embodiment of the present invention. 本発明の一実施形態に係る温度測定システムの計測結果処理用計算機の機能ブロック例を示す図である。It is a figure which shows the example of a functional block of the computer for measurement result processing of the temperature measurement system which concerns on one Embodiment of this invention. 一般的なラックの前面パネルの構造例を示す図である。It is a figure which shows the constructional example of the front panel of a general rack. 本発明の一実施形態に係る温度測定方法の処理手順例を示す図である。It is a figure which shows the process procedure example of the temperature measurement method which concerns on one Embodiment of this invention. サーモグラフィで前面パネルにフォーカスを合わせて計測した計測結果例を示す図である。It is a figure which shows the example of a measurement result which made the front panel focus and measured by thermography. サーモグラフィによる計測結果の二値化処理イメージを示す図である。It is a figure which shows the binarization processing image of the measurement result by thermography. (a)は、前面パネル12とICT装置11−1〜11−mとの温度分布をそれぞれ区別して示す図であり、(b)は、前面パネル12とICT装置11−1〜11−mとの温度分布を合わせて示す図である。(A) is a figure which distinguishes and shows temperature distribution of front panel 12 and ICT apparatus 11-1-11-m, respectively, (b) is front panel 12 and ICT apparatus 11-1-11-m, It is a figure collectively showing the temperature distribution of.

近年では、ラック内のICT装置の冷却効率向上のため、高い開口率(概ね60%以上、最近では80%を超える事例も少なくない)の前面パネルを持つラックが増えている。高い開口率の前面パネルを有するラックに収容されたICT装置であることを前提条件として、前面パネルが閉じた状態で、前面パネル越しにサーモグラフィで計測する。前面パネル越しの計測のため、サーモグラフィで計測結果は、ラック内の装置の温度と前面パネルの温度が混ざった結果となるため、両者を切り分けることが求められる。   In recent years, racks having a front panel with a high aperture ratio (generally 60% or more, and often 80% or more often) have been increasing to improve the cooling efficiency of the ICT devices in the rack. It is measured by thermography over the front panel with the front panel closed, assuming that the ICT apparatus is housed in a rack having a front panel with a high aperture ratio. Since the measurement result by thermography is a result of mixing the temperature of the device in the rack and the temperature of the front panel for measurement through the front panel, it is required to separate the both.

第1の切り分け手段は、サーモグラフィの計測に際して、直接の計測対象ではない前面パネルに焦点を合わせることである。通常は測定対象、すなわちラック内のICT装置に焦点を合わせるが、本発明ではラックの前面パネルに焦点を合わせる。前面パネルに焦点を合わせることで、前面パネルの温度を精度よく計測でき、それ以外の部分(パネル越しに見えるラック内部のICT装置)の温度から切り分けることが可能となる。   The first separation means is to focus on the front panel which is not a direct measurement object at the time of thermography measurement. Usually the focus is on the measurement object, ie the ICT equipment in the rack, but in the present invention the focus is on the front panel of the rack. By focusing on the front panel, it is possible to measure the temperature of the front panel with high accuracy and to separate it from the temperature of the other part (ICT device inside the rack viewed through the panel).

但し、ラック内部のICT装置の温度については、サーモグラフィの焦点が合わないため、前面パネル以外の周辺領域と平準化された計測値となる。しかしこのことは、1)ICT装置の温度は焦点が合っている前面パネルの温度とは混ざらないこと、2)本発明の目的がICT装置単位での熱だまりの発生の認識であり、ICT装置内部の細かな温度分布の計測ではないことから、本発明の目的達成を妨げるような問題とはならない。   However, since the temperature of the ICT apparatus inside the rack is not focused on the thermography, the measured value is leveled with the peripheral area other than the front panel. However, this means that 1) the temperature of the ICT device is not mixed with the temperature of the focused front panel, and 2) the object of the present invention is the recognition of the generation of heat pool in the ICT device unit, and the ICT device Since this is not a measurement of the internal temperature distribution, it does not pose a problem that hinders the achievement of the object of the present invention.

第2の切り分け手段は、サーモグラフィによる計測結果を温度分布(ヒストグラム)として表し、判別分析法(大津の二値化)などの二値化手法を用いて温度が低い領域と温度が高い領域に分割することである。前面パネルが空調装置の冷気の吸入口となって冷気に曝され、ラック内のICT装置より低い温度分布(少なくとも同等以下の温度分布)を示すため、低い温度分布の領域を前面パネル部分、高い温度分布の領域を内部のICT装置の温度と見なすことができ、前面パネルとICT装置の温度を切り分けることができる。これにより、サーモグラフィの計測結果(画像)において画素毎の前面パネル/ICT装置の対応関係が不明であっても、前面パネルの温度情報を除外することでラック内部のICT装置の温度情報を容易に抽出することが可能となる。なお二値化手法については、k−means法などのクラスタリング手法などの判別分析法以外の手法を用いることも、むろん可能である。   The second dividing means represents the measurement result by thermography as a temperature distribution (histogram), and divides it into a low temperature region and a high temperature region using a binarization method such as discriminant analysis (binarization of Otsu) It is to be. The front panel is exposed to cold air as the cold air inlet of the air conditioner, and it exhibits lower temperature distribution (at least equal temperature distribution) than the ICT device in the rack, so the area of low temperature distribution is the front panel part, high The region of the temperature distribution can be regarded as the temperature of the internal ICT device, and the temperature of the front panel and the ICT device can be separated. Thereby, even if the correspondence between the front panel / ICT device for each pixel is unknown in the measurement result (image) of the thermography, the temperature information of the ICT device inside the rack can be easily by excluding the temperature information of the front panel It becomes possible to extract. As the binarization method, it is possible to use a method other than the discriminant analysis method such as a clustering method such as the k-means method.

以下、本発明の実施の形態について、詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail.

図1に、本発明の一実施形態に係る温度測定システムの構成例を示す。図1は、データセンタ等で、通信用ラック内に設置されたICT装置の温度計測を行う場合の典型的なシステム構成である。温度測定システムは通信用ラック10(以下単に「ラック」と記す)の前面パネル12越しにICT装置11−1〜11−mの温度計測を行うサーモグラフィ(赤外線カメラ)110と計測結果処理用計算機(PCなど)120で構成される。   FIG. 1 shows an exemplary configuration of a temperature measurement system according to an embodiment of the present invention. FIG. 1 is a typical system configuration in the case of performing temperature measurement of an ICT apparatus installed in a communication rack in a data center or the like. The temperature measurement system is a thermography (infrared camera) 110 that measures the temperature of the ICT devices 11-1 to 11-m through the front panel 12 of the communication rack 10 (hereinafter simply referred to as "rack") and a computer for processing measurement results ( PC etc.) 120 is comprised.

サーモグラフィ110は、フォーカスを調整する機能を備えており、前面パネル12の開口部を判別可能な解像度を有し、ラック10全体または一部の温度を計測する。計測結果は、温度と一対一に対応する色情報に変換され、画像として記録される。この計測結果は、サーモグラフィ110から計測結果処理用計算機120に転送される。尚、計測結果はサーモグラフィ110の記録メディアに記録され、その記録メディアから計測結果処理用計算機120に転送されてもよい。   The thermography 110 has a function of adjusting the focus, has a resolution capable of determining the opening of the front panel 12, and measures the temperature of the entire rack 10 or a part thereof. The measurement result is converted into color information corresponding to temperature one to one and recorded as an image. The measurement result is transferred from the thermography 110 to the measurement result processing computer 120. The measurement result may be recorded on the recording medium of the thermography 110 and transferred from the recording medium to the measurement result processing computer 120.

図2に、本発明の一実施形態に係る温度測定システムの計測結果処理用計算機の機能ブロック例を示す。結果処理用計算機120は、サーモグラフィ110から転送された計測結果を読み取るデータ読み取り部121、色情報に置き換えられた計測結果を温度に変換するデータ変換部122、温度データを判別分析法(大津の二値化)などの二値化手法を用いて温度が低い領域と高い領域に分離する二値化処理部123、温度が高い領域の温度分布より、ICT装置11−1〜11−mの温度分布を推定するICT装置温度抽出部124を含む。結果処理用計算機120は、最終的に、ラック内のICT装置11−1〜11−mの温度分布を出力する。   FIG. 2 shows an example of a functional block of a computer for processing measurement results of the temperature measurement system according to an embodiment of the present invention. The result processing computer 120 reads the measurement result transferred from the thermography 110. The data conversion unit 122 converts the measurement result replaced by the color information into temperature. Temperature distribution of the ICT devices 11-1 to 11-m from the temperature distribution of the region where the temperature is high and the binarization processing unit 123 that divides the region into a low temperature region and a high temperature region using a binarization method such as And an ICT apparatus temperature extraction unit 124 for estimating the Finally, the result processing computer 120 outputs the temperature distribution of the ICT devices 11-1 to 11-m in the rack.

温度計測の対象となるICT装置11−1〜11−mは、ラック10に収納されている。データセンタ等では、このラック10に米国電子工業会(EIA)規格の通称19インチラックと呼ばれるものが用いられることが多く、ラックマウント型といわれる薄型のサーバが40台程度搭載できる構造となっている。ラック10の典型的なサイズ(外形)は、幅600mm、高さ1900mm、奥行き1000mm程度である。ICT装置11−1〜11−mの寸法は、シャーシの幅が482.6mm(19インチ)、高さが44.45mm(1.75インチ=1U)の倍数となっており、ラック内に集積・収納される。   The ICT devices 11-1 to 11-m to be subjected to temperature measurement are stored in the rack 10. In data centers, etc., racks often use what is commonly referred to as 19-inch racks of the Electronic Industries Alliance (EIA) standard for this rack 10, and a structure capable of mounting about 40 thin servers called rack mount type is adopted. There is. A typical size (outer shape) of the rack 10 is about 600 mm wide, 1900 mm high, and 1000 mm deep. The dimensions of the ICT devices 11-1 to 11-m are as follows: chassis width is 482.6 mm (19 inches) and height is 44.45 mm (1.75 inches = 1 U) multiples and integrated in the rack・ It is stored.

図3に、一般的なラックの前面パネルの構造例を示す。ラック10の前面パネル12には、ラック10内のICT装置11−1〜11−mの冷却のため、多数の吸気孔13が設けられており、最近では外からラック内のICT装置11−1〜11−mが視認できるほどに開口率が高い(概ね60%以上、最近では80%を超える事例もある)ものが多い。吸気孔13の形態(パターン)は様々であるが、開口率が高いものには、ハニカム構造をとるものが多い。図3に示すように吸気孔13の対向する辺の間の距離を6mm、各辺の幅を1mmとすると、開口率は約73%となる。   FIG. 3 shows an example of the structure of the front panel of a general rack. A large number of intake holes 13 are provided in the front panel 12 of the rack 10 for cooling the ICT devices 11-1 to 11-m in the rack 10. Recently, the ICT devices 11-1 in the rack from the outside are provided. There are many cases where the aperture ratio is high (approximately 60% or more, and in some cases recently more than 80% in some cases) so that ~ 1 1-m can be seen. Although the shape (pattern) of the intake holes 13 is various, the one having a high aperture ratio often has a honeycomb structure. As shown in FIG. 3, when the distance between opposite sides of the intake hole 13 is 6 mm and the width of each side is 1 mm, the aperture ratio is about 73%.

図4に、本発明の一実施形態に係る温度測定方法の処理手順例を示す。サーモグラフィ110は、ラック10の前面パネル12に焦点を合わせ(S401)、前面パネル12が閉じた状態で、ラック10の正面から前面パネル12およびICT装置11−1〜11−mの温度を計測する(S402)。サーモグラフィ110で計測された計測結果は、温度を一対一に対応する色に置き換えて画像とし、計測結果処理用計算機120に転送される。   FIG. 4 shows an example of the processing procedure of the temperature measurement method according to the embodiment of the present invention. The thermography 110 focuses on the front panel 12 of the rack 10 (S401) and measures the temperatures of the front panel 12 and the ICT devices 11-1 to 11-m from the front of the rack 10 with the front panel 12 closed. (S402). The measurement results measured by the thermography 110 are transferred to the measurement result processing computer 120 by converting the temperatures into one-to-one corresponding colors to form an image.

図5に、サーモグラフィで前面パネルにフォーカスを合わせて計測した計測結果例を示す。図5に示す画像は計測結果例であるが、前面パネル12に焦点を合わせているため、前面パネル12の構造、輪郭が明確な計測結果が得られている。   FIG. 5 shows an example of measurement results obtained by focusing on the front panel by thermography. The image shown in FIG. 5 is an example of the measurement result, but since the front panel 12 is focused, the measurement result with clear structure and contour of the front panel 12 is obtained.

計測結果処理用計算機120では、サーモグラフィから転送された計測結果から前面パネル12の温度分布を除外することで、ICT装置11−1〜11−mの温度(分布)を抽出する。具体的には、画素毎に色に置き換えて記録された計測結果を温度に変換し(S403)、温度が低い領域と高い領域に分離する(S404)。2つの領域の分割方法には様々な方法があるが、例えば2つの領域のクラス内分散の和に対する2つの領域のクラス間分散を最大にするように閾値を決定する判別分析法(大津の二値化)は計算コストも小さく実装も容易である。   The measurement result processing computer 120 extracts the temperature (distribution) of the ICT devices 11-1 to 11-m by excluding the temperature distribution of the front panel 12 from the measurement result transferred from the thermography. Specifically, the measurement result which is recorded by replacing the color for each pixel is converted into a temperature (S403), and the temperature is divided into a low area and a high area (S404). There are various methods for dividing two regions, for example, a discriminant analysis method (Otsu's 2) that determines the threshold value so as to maximize the interclass dispersion of the two regions to the sum of the intraclass variance of the two regions. Quantification) is small in calculation cost and easy to implement.

図6に、サーモグラフィによる計測結果の二値化処理イメージを示す。データセンタ、通信機械室の空調装置の冷気に直接曝される前面パネル12の温度分布は、ICT装置11−1〜11−mの温度分布より低いため、温度が低い領域を前面パネル12、温度が高い領域をラック10に収納されたICT装置11−1〜11−mの温度と判定する(S405)。   FIG. 6 shows a binarized processing image of the measurement result by thermography. The temperature distribution of the front panel 12 directly exposed to the cold air of the air conditioner in the data center and the communication machine room is lower than the temperature distribution of the ICT devices 11-1 to 11-m, so the area where the temperature is low is the front panel 12, the temperature Is determined as the temperature of the ICT devices 11-1 to 11-m stored in the rack 10 (S405).

尚、ICT装置11−1〜11−mが非稼働の場合や、ラック10内部の熱が前面パネル12に強く伝達されている場合は、前面パネル12とICT装置11−1〜11−mの温度分布に重複がある場合もある。図7(a)、(b)に、前面パネル12とICT装置11−1〜11−mの温度分布に重複がある場合の二値化処理イメージを示す。図7(a)は、前面パネル12とICT装置11−1〜11−mとの温度分布をそれぞれ区別して示したものであり、図7(b)は、前面パネル12とICT装置11−1〜11−mとの温度分布を合わせて示したものである。   When the ICT devices 11-1 to 11-m are not in operation or the heat in the rack 10 is strongly transmitted to the front panel 12, the front panel 12 and the ICT devices 11-1 to 11-m There may be overlap in temperature distribution. FIGS. 7A and 7B show binarization processing images in the case where there is an overlap in the temperature distribution of the front panel 12 and the ICT devices 11-1 to 11-m. Fig. 7 (a) shows the temperature distribution of the front panel 12 and the ICT devices 11-1 to 11-m separately, and Fig. 7 (b) shows the front panel 12 and the ICT device 11-1. It is what put together and showed temperature distribution with-1 1-m.

このような場合では、前面パネル12とICT装置11−1〜11−mとの温度分布の二値化処理による正確な分離は困難であり、二値化処理を適用し、図7(b)に示すように高温側をラック10に収納されたICT装置11−1〜11−mの温度とみなすと、図7(a)に示す実際の温度分布と比較して、低温側の温度分布が欠けた、高温側に偏った温度分布との評価結果となる。しかしながら、本発明の目的がICT装置11−1〜11−mの熱だまりの把握であることを踏まえれば、このような前面パネル12とICT装置11−1〜11−mの温度分布に重複がある場合でも、従来のように実際よりも低い温度と計測されることはなく、熱だまりのリスクとなる高い高温度領域については的確に把握できるため、実用上の支障は生じない。   In such a case, accurate separation of the temperature distribution between the front panel 12 and the ICT devices 11-1 to 11-m by binarization is difficult, and binarization is applied as shown in FIG. 7 (b). Assuming that the high temperature side is the temperature of the ICT devices 11-1 to 11-m housed in the rack 10 as shown in FIG. 7, the temperature distribution on the low temperature side is lower than the actual temperature distribution shown in FIG. It is the evaluation result of the temperature distribution which is missing and biased to the high temperature side. However, considering that the purpose of the present invention is to understand the heat pool of the ICT devices 11-1 to 11-m, the temperature distribution of the front panel 12 and the ICT devices 11-1 to 11-m overlap. Even in some cases, the temperature is not measured lower than the actual temperature as in the prior art, and a high temperature region which is a risk of heat accumulation can be accurately grasped, thus causing no practical problem.

10 ラック
11−1〜11−m ICT装置
12 前面パネル
13 吸気孔
110 サーモグラフィ
120 計測結果処理用計算機
Reference Signs List 10 rack 11-1 to 11-m ICT apparatus 12 front panel 13 air intake hole 110 thermography 120 computer for processing measurement results

Claims (6)

ICT装置を収容したラックが備える多数の開口部が設けられた吸気側パネルから放射された赤外線を、前記吸気側パネルに焦点を合わせて計測する赤外線測定部と、
前記赤外線測定部で測定された赤外線画像を温度分布データに変換し、前記温度分布データを高温領域と低温領域とに分離する二値化処理を行う二値化処理部と、
二値化処理により分離された前記温度分布データの高温領域を前記ICT装置の温度分布として出力するICT装置温度抽出部と、
を備えたことを特徴する温度測定システム。
An infrared measurement unit that measures infrared radiation emitted from an intake side panel provided with a large number of openings provided in a rack that accommodates an ICT device, focusing on the intake side panel;
A binarization processing unit that converts the infrared image measured by the infrared measurement unit into temperature distribution data, and performs binarization processing to separate the temperature distribution data into a high temperature region and a low temperature region;
An ICT device temperature extraction unit that outputs the high temperature region of the temperature distribution data separated by the binarization processing as the temperature distribution of the ICT device;
The temperature measurement system characterized by having.
前記赤外線測定部は、前記吸気側パネルの開口部を判別できる解像度を有することを特徴とする請求項1に記載の温度測定システム。   The temperature measurement system according to claim 1, wherein the infrared measurement unit has a resolution capable of determining an opening of the intake side panel. 前記二値化処理は、2つの領域のクラス内分散の和に対する2つの領域のクラス間分散を最大にするように閾値を決定する判別分析法による処理であることを特徴とする請求項1又は2に記載の温度測定システム。   The binarization process is a process according to a discriminant analysis method in which a threshold value is determined so as to maximize the interclass variance of the two areas with respect to the sum of the intraclass variance of the two areas. The temperature measurement system according to 2. ICT装置を収容したラックが備える多数の開口部が設けられた吸気側パネルから放射された赤外線を、前記吸気側パネルに焦点を合わせた赤外線カメラで計測するステップと、
前記赤外線カメラで測定された赤外線画像を温度分布データに変換し、前記温度分布データを高温領域と低温領域とに分離する二値化処理を行うステップと、
二値化処理により分離された前記温度分布データの高温領域を前記ICT装置の温度分布として出力するステップと、
を有することを特徴する温度測定方法。
Measuring infrared radiation emitted from an intake side panel provided with a large number of openings provided in a rack accommodating an ICT device, with an infrared camera focused on the intake side panel;
Performing a binarization process of converting the infrared image measured by the infrared camera into temperature distribution data and separating the temperature distribution data into a high temperature region and a low temperature region;
Outputting the high temperature region of the temperature distribution data separated by the binarization process as the temperature distribution of the ICT device;
A temperature measurement method characterized by having:
前記赤外線カメラは、前記吸気側パネルの開口部を判別できる解像度を有することを特徴とする請求項4に記載の温度測定方法。   The temperature measuring method according to claim 4, wherein the infrared camera has a resolution capable of determining an opening of the intake side panel. 前記二値化処理は、2つの領域のクラス内分散の和に対する2つの領域のクラス間分散を最大にするように閾値を決定する判別分析法による処理であることを特徴とする請求項4又は5に記載の温度測定方法。   5. The process according to claim 4, wherein the binarization process is a process by discriminant analysis in which a threshold is determined so as to maximize the interclass variance of the two areas with respect to the sum of the intraclass variance of the two areas. The temperature measurement method as described in 5.
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