JP2019196944A - Radiation image photographing device - Google Patents

Abstract

To provide a radiation image photographing device that can improve the resistance to a load or the like while reducing the weight of a support body for supporting a sensor panel.SOLUTION: A radiation image photographing device includes: a sensor panel having, on its upper surface side, a sensor for detecting a radiation ray radiated to a subject; an electronic component disposed on the lower surface side of the sensor panel; a support body for supporting the sensor panel and the electronic component; and a housing for storing the sensor panel, electronic component, and support body. The support body has a cavity, and supports the lower surface of the sensor panel in the thickness direction and plane direction without a gap.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a radiographic image capturing apparatus.

  There are various methods used for diagnosis by photographing the inside of a subject using X-rays for medical and industrial purposes. Conventionally, a method of obtaining an image with a film and a computed radiograph (CR) using a stimulable phosphor plate have been used. In recent years, digital radiographs (DR) that receive an X-ray distribution by a sensor and convert it into image data by a processing circuit have become mainstream as X-ray imaging apparatuses. In this DR, an X-ray imaging apparatus called a flat panel detector (FPD) is used. For convenience in imaging, a portable X-ray imaging apparatus (hereinafter also referred to as FPD) has recently been used. Many have been used (see, for example, Patent Document 1 and Patent Document 2).

  The FPD includes a large number of sensors (elements such as photodiodes) that detect X-rays irradiated on the subject and output them as electrical signals. These sensors are produced on a glass substrate from the viewpoint of thermal stability and are housed in a housing as a sensor panel. The sensor panel outputs the detected X-ray as an electrical signal. A circuit board or battery provided with an electronic device (element) for generating image data based on the output electric signal on the back surface (surface opposite to the X-ray irradiation surface) side of the sensor panel Various electronic components such as are arranged.

JP 2004-184679 A Japanese Patent Laid-Open No. 11-160439

  By the way, in the FPD, there is a case where a subject such as a human body is placed on a casing to perform X-ray imaging, and in this case, a large load of several tens of kilograms to 100 kilograms or more is applied. For this reason, in FPD, the structure which protects a sensor panel (especially glass substrate which is easy to break) from external forces, such as such a load and an impact, is needed. Further, the above-described electronic components, particularly the circuit board and the elements on the circuit board, are likely to be damaged by an external force such as a load or an impact, and thus need to be protected. In recent FPDs, the thickness of the casing is often compliant with the JIS standard (for example, 16 mm or less), and in such a thin FPD, a structure that protects sensor panels, circuit boards, and the like from weight, impact, etc. Building is a very important issue.

  In response to such a problem, in a conventional FPD, a sensor panel is supported by a highly rigid support such as metal, and a space is formed by providing a spacer or the like between the back side of the sensor panel and the housing. Various electronic parts such as the circuit board described above were accommodated.

  On the other hand, the FPD is required to reduce the weight of the entire apparatus in order to further improve convenience such as easy transportation, and therefore, the above-described support having a relatively large weight can be reduced in weight. Is being considered. However, if the support has a lower rigidity than metal, for example, a resin, when the large load described above is applied, both the sensor panel and the support may bend and the glass substrate may be distorted and cracked. The elements on the circuit board may be damaged.

  The technique described in Patent Document 1 describes that a curable resin such as epoxy is injected into the housing to prevent the sensor panel from moving in response to an impact. However, since such a filler is heavy, it cannot satisfy the demand for weight reduction. Moreover, in the technique described in Patent Document 2, in order to improve the bending rigidity while reducing the weight of the apparatus, the base that supports the glass substrate of the sensor panel has a plurality of spaces partitioned by walls. However, the technique described in Patent Document 2 has a structure in which there is no support between the circuit board and the housing, and the support between the circuit board and the glass support base is fragile, and a load such as a human body is applied. In such a case, the distortion of the circuit board or sensor panel (glass substrate) may not be suppressed.

  An object of the present invention is to provide a radiographic imaging apparatus in which resistance to load or the like is improved while reducing the weight of a support that supports a sensor panel.

The radiographic imaging device according to the present invention is:
A sensor panel provided with a sensor on the upper surface side for detecting radiation applied to the subject;
Electronic components disposed on the lower surface side of the sensor panel;
A support for supporting the sensor panel and the electronic component;
A housing for housing the sensor panel, the electronic component, and the support;
With
The said support body has a space | gap and is comprised so that the lower surface of the said sensor panel may be supported without a gap | interval in thickness direction and a plane direction.

  ADVANTAGE OF THE INVENTION According to this invention, the tolerance with respect to a load etc. is improved, reducing the support body which supports an imaging panel.

1A and 1B are schematic configuration diagrams of a radiographic image capturing system according to the present embodiment. 2A and 2B are diagrams for explaining an example of a support structure of an imaging panel in a conventional FPD. 3A and 3B are diagrams illustrating another example of a support structure for an imaging panel in a conventional FPD. It is sectional drawing explaining the structural example of FPD in this Embodiment. It is sectional drawing explaining the other structural example of FPD in this Embodiment. It is sectional drawing explaining the other structural example of FPD in this Embodiment. It is sectional drawing explaining the other structural example of FPD in this Embodiment. It is sectional drawing explaining the other structural example of FPD in this Embodiment. It is sectional drawing explaining the other structural example of FPD in this Embodiment. It is sectional drawing explaining the other structural example of FPD in this Embodiment. It is a table | surface which shows the experimental result about durability of FPD in this Embodiment.

  Hereinafter, the present embodiment will be described in detail with reference to the drawings. First, before describing the X-ray imaging apparatus (FPD) according to the present invention, an outline of an X-ray imaging system using such an FPD will be described.

  FIG. 1 (FIGS. 1A and 1B) shows a main configuration of an X-ray imaging system 100 as a radiographic imaging system. The X-ray imaging system 100 according to the present embodiment is a system that performs imaging of an X-ray image (radiation image) by irradiating a patient (hereinafter referred to as a subject) S with X-rays in a hospital.

  The X-ray imaging system 100 includes an FPD (flat panel detector) 1 serving as a radiographic imaging apparatus that detects X-rays (radiation) irradiated to a subject S and outputs the X-rays (radiation) as a radiographic image (photographed image). An X-ray irradiation device 8 that generates and outputs a line is included. In addition, the X-ray imaging system 100 includes a console device 3 that displays a captured image output from the FPD 1, and a cradle device (hereinafter simply referred to as a cradle) 5 as a peripheral device that charges a battery (to be described later) in the FPD 1. And a base station 7 for performing wireless communication between the above devices. The X-ray imaging system 100 further includes a host computer 4 that manages various data in the hospital. Each of the above devices constituting the X-ray imaging system 100 is connected to each other via a network N.

  In the example illustrated in FIG. 1, the FPD 1, the base station 7, and the X-ray irradiation apparatus 8 are installed in a radiographing room 6 that is protected from radiation leakage to the outside using, for example, lead. On the other hand, the console device 3 and the cradle 5 are installed in the front room 9 of the photographing room 6. A user (such as a doctor) and the subject S can move between the imaging room 6 and the anterior room 9 through the door 9b of the anterior room 9, and other hospital rooms through the door 6a of the imagining room 6 and the door 9a of the anterior room 9. Etc. The host computer 4 is installed in a data management room (not shown) of the hospital.

  The X-ray irradiation apparatus 8 includes a known X-ray tube (vacuum tube) (not shown) and is used in the vicinity of the subject S. The X-ray irradiation unit 81 (see FIG. 1B) and the X-rays output from the X-ray irradiation unit 81 The control part 82 etc. which control are provided. The control unit 82 includes a power supply unit that applies a voltage to the X-ray tube of the X-ray irradiation unit 81, a processor that controls the power supply unit, and the like. Among these, the power supply unit includes a filament power source for heating a filament provided on the cathode of the X-ray tube and a high-voltage power source for accelerating electrons colliding with the target on the anode surface of the X-ray tube. The processor controls X-rays output from the X-ray tube of the X-ray irradiation unit 81 by controlling the power supply of the filament power supply and the high-voltage power supply.

  The console device 3 is a computer that mainly performs control of radiographic imaging (hereinafter, also simply referred to as X-ray imaging), display of an X-ray image acquired from the FPD 1, and image processing content related to the data of the X-ray image. It is. The console device 3 includes a processor, an operation input unit such as a mouse and a keyboard, and a display unit 36 such as an LCD (Liquid Crystal Display). The above-described control and display are performed through various screens such as a menu screen displayed on the display unit 36. Give instructions.

  The host computer 4 performs in-hospital X-ray imaging reservation management, sends an imaging request (imaging order) instruction to the console device 3 when an imaging reservation is made, and a radiographic image transferred from the console device 3 after X-ray imaging. Store the data.

  In the FPD 1, a sensor panel SP (see FIG. 1B) that detects X-rays is housed in a housing 2 that has a substantially rectangular plate-like outer shape. Although not shown in detail, the sensor panel SP of the FPD 1 has a configuration in which a plurality of radiation detection elements (sensors such as photodiodes) are arranged in a two-dimensional matrix of n × m on a glass substrate. X-rays irradiated on the subject S are detected by the detection element. The radiation detection element of the sensor panel SP detects X-rays transmitted through the exposure surface R of the housing 2. In addition, a plurality of layers such as TFT layers are provided on the glass substrate of the sensor panel SP, and these are well-known configurations, and thus detailed description thereof is omitted. In FIG. 1B and FIG. 2 and later described below, the exposure surface R side of the housing 2 is shown facing up.

  The FPD 1 is a conversion unit that converts X-rays detected by the radiation detection element into an electric signal, an A / D conversion unit that digitizes the converted electric signal, and outputs the digitized signal to the console device 3 as a captured image. And an output unit for supplying power to each unit. Other configurations of the FPD 1 will be described later.

  The cradle 5 has a function as a peripheral device or an accessory device of the FPD 1, functions as a charging device that charges the battery of the FPD 1, a power supply unit that supplies power (charging current) to the FPD 1, the power supply unit, and the cradle It is equipped with a processor that controls the entire system.

  Hereinafter, a schematic operation of the X-ray imaging system 100 will be described by taking as an example a case where X-ray imaging of the chest of the subject S is performed.

  Prior to this X-ray imaging, a menu screen (not shown) is displayed on the display unit 36 of the console device 3. In the present embodiment, the patient database is accessed from the menu screen by operating the mouse or the like of the console device 3, and various information (patient ID, name, year of birth) relating to the patient to be the subject S (hereinafter simply referred to as the subject S). The patient database is registered or updated by inputting in advance the date, sex, name of the affected part to be photographed (in this example, the chest), and the like.

  Prior to X-ray imaging, the position of the FPD 1 attached to the prone position table 6b is adjusted to be the position of the chest of the subject S. Subsequently, the subject S is laid on his / her back on the prone position table 6b, the position of the subject S is adjusted so that the back corresponds to the FPD 1, and the X-ray irradiation unit 81 is opposed to the front of the chest of the patient. Let

  Furthermore, an operation screen (not shown) for executing X-ray imaging is displayed on the display unit 36 through the menu screen, and parameters such as the intensity of X-rays output from the X-ray irradiation unit 81 through the operation screen are It is input by an input operation using a mouse or the like of the console device 3. Subsequently, when a radiographing button (not shown) displayed on the operation screen is selected, the X-ray irradiation apparatus 8 is operated, and X-rays are output from the X-ray irradiation unit 81 according to the set parameters.

  The X-rays thus output pass through the affected area of the subject S and are irradiated on the sensor panel SP of the FPD 1. The FPD 1 detects the intensity (strong and weak distribution) of X-rays transmitted through the affected part of the subject S by the sensor panel SP, converts the detected X-rays into electric signals, and digitizes the converted electric signals. Generate a captured image. The generated captured image data is then transferred from the FPD 1 to the console device 3 and displayed on the display unit 36 as an X-ray image. The X-ray image is appropriately processed by the console device 3, transferred to the host computer 4, and stored in a patient database held by the host computer 4.

  FIG. 1B shows an example in which the back of the subject S is placed on the FPD 1 and X-ray imaging of the chest is performed. However, for example, X-ray imaging is performed by placing the feet of the subject S on the FPD 1. There can be various shooting modes.

  By the way, the FPD 1 includes a large number of sensors (elements such as photodiodes) that detect X-rays and output them as electric signals on the sensor panel SP. These many sensors are produced on a glass substrate from the viewpoint of thermal stability and the like, and are housed in the housing 2 as a sensor panel SP (imaging panel).

  In addition, as shown in FIG. 1B, the FPD 1 may be photographed with a subject S such as a human body on the surface. In such a case, a large load of, for example, several tens of kilograms is applied, and thus the FPD 1 is easily damaged. A structure for protecting the sensor panel SP including the glass substrate is required. On the other hand, in the conventional FPD, the imaging panel is supported by a highly rigid support such as metal, and a space is formed between the housing and a spacer, and a processor for data processing and various kinds of data are formed in this space. Various electronic components such as a circuit board and a battery on which elements are mounted were held. On the other hand, in such a conventional support structure, there is a problem that the strength is remarkably reduced when the material of the support is changed in order to meet the demand for weight reduction of the entire FPD.

  Hereinafter, examples and problems of the internal structure of the casing (support structure of the sensor panel SP) in such a conventional FPD will be described with reference to FIGS. 2 (FIGS. 2A and 2B) and 3 (FIGS. 3A and 3B). explain. For simplification, illustration of the upper plate of the housing is omitted in each of these drawings.

  FIG. 2A shows an example of a support structure of the sensor panel SP in the conventional FPD, and only the bottom plate 2A side of the housing 2 that houses the sensor panel SP is shown in the drawing. In this conventional example, the sensor panel SP is supported on the substantially entire surface of the support 121 from below (the back side) by the metal plate-like support 121.

  In the conventional example, a plurality of spacers 122 are arranged between the bottom plate 2A of the housing 2 and the support body 121, thereby providing a space for accommodating other various components of the FPD. In the example shown in FIG. 2A, a circuit board 126 on which a circuit element for data processing (hereinafter simply referred to as an element) is mounted is fixed to the lower surface of the support 121 by screws or an adhesive.

  In such a conventional structure, there is no particular problem in a normal use state in which a subject S such as a human body is placed on top. On the other hand, from the demand for weight reduction of the entire apparatus, it is necessary to make the support body 121 having a high weight ratio with respect to the entire apparatus lighter.

  However, if the thickness and material of the support 121 are changed to make the support 121 lighter, the rigidity of the support 121 becomes lower. Therefore, the durability when the human body is placed on the top is used. There is a risk of not being able to keep. That is, when the rigidity of the support 121 is lowered, as shown in an exaggerated manner in FIG. 2B, both of the sensor panel SP and the support 121 are caused by an external force applied by a load or an impact when the subject S is placed on the top. Further, the circuit board 126 is bent. Here, depending on the magnitude of the external force applied (see the downward arrow in FIG. 2B), the glass substrate of the sensor panel SP may be distorted and cracked, elements on the circuit board 126, and further, the circuit board 126 itself may be damaged. There is a risk of damage.

  FIG. 3A shows another example of the support structure of the sensor panel SP in the conventional FPD, and the same reference numerals are given to the same portions as FIG. 2A. 3A is different from the example in FIG. 2A in that an additional spacer 123 is disposed between the bottom plate 2A of the housing 2 and the circuit board 126. In the example illustrated in FIG.

  In the structure shown in FIG. 2A described above, the center portion of the sensor panel SP in the drawing is greatly bent by an external force. Therefore, in the example of FIG. 3A, in order to suppress such bending, the circuit board 126 and the casing 2 (bottom plate) 2A), a spacer 123 as a support is interposed. On the other hand, in the structure shown in FIG. 3A, when the support body 121 is lighter and its rigidity is lowered, the durability can be expected to be somewhat higher than the structure of FIG. 2A, but there are the following restrictions.

  That is, in many FPDs, various elements are arranged on the lower surface of the circuit board 126. For this reason, the spacer 123 disposed under the circuit board 126 cannot be sized to support the entire circuit board 126 (entire surface). That is, if the planar shape of the spacer 123 is the same as the planar shape of the circuit board 126, when the above-described external force such as load or impact is applied, the external force acts on the element through the spacer 123, and the element is damaged. It becomes easy to do. Therefore, the spacer 123 arranged under the circuit board 126 is configured to locally support a part of the circuit board 126 where no element is arranged (see FIG. 3A).

  Thus, in the conventional support structure as shown in FIG. 3A, when a load is applied from above in the figure, as shown exaggeratedly in FIG. 3B, the sensor panel SP and the support body are different from the structure of FIG. Both of 121 are bent and the circuit board 126 is also bent. That is, in the conventional support structure shown in FIG. 3, a large distortion is generated in the vicinity of the boundary between the location where the spacer (122 or 123) is present and the location where the spacer is not present. Depending on the magnitude of the applied external force (see the downward arrow in FIG. 3B), the glass substrate of the sensor panel SP may be distorted and cracked, or the circuit board 126 itself may be damaged.

  As a result of conducting various experiments as described above, the present inventors, as a support for supporting the sensor panel SP, the circuit board, and the like in the FPD, have a back surface (surface inside the housing) of the sensor panel SP. It was found that the structure that supports the entire surface and the entire surface of the circuit board is ideal. And it was found that by using such a support structure, damage to components such as the sensor panel SP and the circuit board can be effectively suppressed even when the support is changed to a lightweight material.

  A configuration example for supporting the sensor panel SP and various electronic components in the FPD 1 in the present embodiment will be described with reference to FIG.

(First configuration example)
FIG. 4 is a schematic cross-sectional view of a first configuration example for supporting the sensor panel SP and the like. In the FPD 1 shown in FIG. 4, the housing 2 includes a bottom plate 2A having a substantially rectangular plane, a top plate 2B having an exposure surface R that has substantially the same planar shape as the bottom plate 2A and is irradiated with X-rays, and a bottom plate 2A. And side plates 2C and 2D interposed on both sides of the upper plate 2B. Of these, the upper plate 2B is formed of a material that transmits X-rays, and is, for example, a carbon plate that transmits radiation (carbon fibers are solidified with a resin or the like). The bottom plate 2A and the side plates 2C and 2D can be formed of the same material as the upper plate 2B or a different material (for example, a magnesium alloy).

  The FPD 1 is a support body in which the sensor panel SP and various electronic components are accommodated in a space surrounded by the plates 2A to 2D of the housing 2, and the sensor panel SP and various components are supported from the bottom plate 2A side. 20 is provided. Here, the sensor panel SP is arranged such that the upper surface (the surface on the side that detects X-rays, also referred to as “surface”) is in contact with the inner surface of the upper plate 2B, and the electronic components other than the sensor panel SP. Is arranged at a predetermined position below the sensor panel SP. In FIG. 4, as electronic components other than the sensor panel SP, from the left side, a circuit connected to the sensor panel SP via a battery 25 as a power supply unit that supplies power to the entire FPD 1, a main circuit board 26, and a flexible board 28. A substrate 27 is shown.

  The battery 25 is a battery that can be repeatedly charged and discharged, such as a lithium ion battery, and is powered by the power supplied from the cradle 5 described above via a charging connector (not shown) provided on the side surface of the housing 2. Charged. The circuit board 27 has the function of the A / D conversion unit described above, and performs A / D conversion on the charges (the intensity state of the irradiated X-rays) detected by each sensor in the sensor panel SP. Then, the converted digital data is supplied to the main circuit board 26. The main circuit board 26 integrates the digital data to generate X-ray image data (captured image data) of the entire affected area of the subject, and temporarily stores the generated captured image data in the FPD 1. Further, the main circuit board 26 transmits the generated captured image data (hereinafter simply referred to as image data) to an external device such as the console device 3 described above through an input / output interface (not shown) provided on the side surface of the housing 2. Output to.

  In the present embodiment, the support 20 is configured to support the lower surface of the sensor panel SP without gaps in the thickness direction (up and down direction in FIG. 4) and the plane direction. The support body 20 is disposed so as to substantially fill the space formed between the housing 2 and the sensor panel SP and the space between the housing 2 and the electronic component described above, and for weight reduction. There are voids. Here, in the aspect of “gap for weight reduction”, (1) when a gap is formed in the support 20 itself (that is, when the material of the support 20 is a foam (porous member)) And (2) the support 20 is a set of a large number of hard members, and the hard members are roughly divided into a case where the hard members are arranged at intervals. In addition, it is good also as a structure with which one support body is provided with both "a foam" and "a group of hard members." The configuration example shown in FIG. 4 is a case where the entire support 20 is a foam (porous member) (an example of (1) above), and the material and the like of the support 20 will be described later. The example (2) will be described later with reference to FIG.

  In the example shown in FIG. 4, the support 20 has a planar shape that is the same as or slightly larger than the planar shape of the sensor panel SP, and the vertical direction between the bottom plate 2A of the housing 2 and the back surface (lower surface) of the sensor panel SP. It is arranged so as to fill (fill) the space.

  From a functional viewpoint, the support body 20 is disposed on the first support body 21 that supports the sensor panel SP by contacting the back surface of the sensor panel SP, and the bottom plate 2A of the housing 2. And the second support 22 that supports the electronic components (25, 26, 27). Hereinafter, when the support 20 is simply referred to, both the first support 21 and the second support 22 may be included.

  In the example shown in FIG. 4, the support 20 (the first support 21 and the second support 22) is a porous member having a large number of voids for weight reduction. It consists of a foam of hard resin such as styrene. Such a porous member has a significantly smaller specific gravity than a metal or the like, and thus can contribute to weight reduction of the entire FPD 1.

  The first support 21 has a planar shape slightly larger than the sensor panel SP, and the side portions of the first support 21 are in contact with the side plates 2C and 2D so as not to shift in the housing 2. . The sensor panel SP is fixed to the first support 21 by applying an adhesive between the lower surface (back surface) of the sensor panel SP and the upper surface of the first support 21. On the other hand, in this example, the sensor panel SP is not fixed to the upper plate 2B of the housing 2. The first support 21 is provided with a long hole through which the flexible substrate 28 described above is passed on the right end side in the drawing.

  The second support body 22 has substantially the same planar shape as the sensor panel SP. For this reason, in the example shown in FIG. 4, there is a slight surplus space between the second support 22 and the side plates 2C and 2D of the housing 2, and other electronic components (not shown) such as wiring are present in this surplus space. It can be arranged. On the upper surface of the second support 22, a concave portion (a first shape corresponding to the planar shape of the electronic components (the power supply unit 25, the main circuit board 26, and the circuit board 27 in the example of FIG. 4) accommodated in the FPD 1 is formed. (Concave part) 22a is formed.

  On the other hand, various elements for processing X-ray information detected by the sensor panel SP and generating an X-ray image are provided on the lower surfaces of the main circuit board 26 and the circuit board 27 facing the second support 22. It has been. For this reason, the first recess 22a corresponding to the main circuit board 26 and the circuit board 27 in the second support 22 has a shape corresponding to the outer shape of various elements protruding from the lower surfaces of the boards 26 and 27. The recessed part (2nd recessed part for element protection) which becomes is provided. Hereinafter, with reference to FIG. 5A and FIG. 5B, the 2nd recessed part for element protection provided in the 1st recessed part 22a for main circuit boards 26 is demonstrated.

  FIG. 5A is a cross-sectional view showing an example of a second recess 22b for protecting an element, which is configured in the first recess 22a of the second support 22 corresponding to the main circuit board 26. As shown in FIG. 5A, the second support 22 includes a second recess 22b into which elements 261 and 262 protruding from the main circuit board 26 are inserted. Here, the depth of each second recess 22b is formed to a depth corresponding to the height of the elements 261 and 262 to be inserted.

  Here, if the depth of the first recess 22a for the main circuit board 26 in the second support 22 is uniform, the second support 22 is formed by the elements 261 and 262 protruding from the main circuit board 26. Is partially compressed, and there is a problem that an extra load is applied to these elements 261 and 262. On the other hand, in the example shown in FIG. 5A, the second concave portion 22b for element protection is provided so that the thickness of the corresponding portion of the second support 22 is changed according to the height of the inserted elements 261 and 262. It is additionally formed. According to such a configuration, when a load or the like is applied to the housing 2, an excessive force is not applied to the elements 261 and 262, and the elements 261 and 262 are prevented from being damaged.

  FIG. 5B is a cross-sectional view illustrating another example of the second recess 22 b for protecting the element in the first recess 22 a of the second support 22 corresponding to the main circuit board 26. As shown in FIG. 5B, each of the second recesses 22b corresponding to the elements 261 and 262 protruding from the main circuit board 26 may have a through hole (that is, hollow) configuration. By adopting such a configuration, the same effect as the configuration of FIG. 5A can be obtained, and the weight can be reduced as compared with the configuration of FIG. 5A. In addition, when there is an element with a large calorific value, the element 261 and the bottom plate of the housing 2 are utilized by utilizing the hollow surplus space in the second recess 22b (that is, the through hole) into which the element (for example, the element 261) is inserted. You may arrange | position the heat-transfer material which is not illustrated between 2A. In this case, the element 261 and the bottom plate 2A are thermally connected via the heat transfer material, and the heat generated from the element 261 can be radiated from the housing 2 (bottom plate 2A).

  The element-protecting second recess 22b shown in FIGS. 5A and 5B has the same configuration with respect to the circuit board 27, and illustration and description thereof are omitted.

  Since the second support 22 including the first recess 22a and the second recess 22b described above is in close contact with both the housing 2 (bottom plate 2A) and the area where the elements are not disposed at least on the circuit boards 26 and 27. The circuit boards 26 and 27 can be supported uniformly. For this reason, according to the present embodiment, when a load or an impact is applied to the casing 2, the distortion of the circuit boards 26 and 27 caused by the conventional local support structure (see FIG. 3) occurs. In addition, the elements protruding from the circuit boards 26 and 27 can be protected.

  Next, an example of a method for assembling the FPD 1 will be described. The flexible substrate 28 is passed through the long hole of the first support 21 and the back surface of the sensor panel SP and the top surface of the first support 21 are attached with an adhesive. In addition, the battery 25, the main circuit board 26, and the circuit board 27 are attached to the corresponding recesses of the second support 22, respectively, so that they are substantially flush with the upper surface of the second support 22 ( (See FIG. 4). Subsequently, the upper surface of the second support 22 to which each component is attached and the lower surface of the first support 21 to which the sensor panel SP is fixed are aligned and housed in the housing 2. When aligning the upper surface of the second support 22 and the lower surface of the first support 21, it may be temporarily fixed with, for example, an adhesive tape. Or it is good also as a structure which provides the recessed part for embedding the upper surface side of the 2nd support body 22 in the lower surface of the 1st support body 21. FIG. As yet another example, the planar shape of the second support 22 may be the same as the planar shape of the first support 21.

  Thus, the space in the housing 2 is filled from the lower side of FIG. 4 with the second support 22, various electronic components, the first support 21, and the sensor panel SP, and these are in close contact with each other. It becomes. Therefore, the space below the sensor panel SP in the housing 2 is supported by the support 20 so that there is no gap in the thickness direction.

  As described above, in the FPD 1, the sensor panel SP is supported on the entire surface of the first support 21, and various electronic components such as the circuit boards 26 and 27 and the battery 25 are used on the entire surface of the second support 22. The structure is supported uniformly. With this configuration, when a load or impact is applied to the housing 2, this external force (see the arrows in FIGS. 2B and 3B) is adequately absorbed by the support 20 made of foam material, and as a result, the sensor panel SP. Deflection and local distortion, and further deflection of the circuit boards 26 and 27 are suppressed. Therefore, according to the present embodiment, it is possible to prevent the glass substrate of the sensor panel SP from being broken or the elements on the circuit boards 26 and 27 from being damaged due to local strain or the like while reducing the weight of the entire FPD 1. .

  Although not shown in FIG. 4, it is preferable that conductive layers (metal thin film, ITO film, etc.) are disposed on the upper surface and the rear surface of the sensor panel SP and connected to a predetermined potential or grounded when the FPD 1 is used. Specifically, the glass substrate of the sensor panel SP does not break depending on the degree of weight applied from the outside of the housing 2 during use, but the entire sensor panel SP may be slightly bent temporarily. . Here, when a deflection occurs in the sensor panel SP, the state of the element in the sensor panel SP (for example, the distance between the TFT layer and another charged layer) changes, and the capacitance changes to generate the sensor panel SP. The image data is likely to be affected by noise. Therefore, the above-described conductive layer may be disposed in order to ensure the quality of image data generated by the sensor panel SP even when some deflection occurs in the sensor panel SP.

  Although not shown in FIG. 4, a layer made of a material having a high magnetic permeability may be provided between the sensor panel SP and the circuit boards 26 and 27. That is, in the configuration example shown in FIG. 4, the first support 21 is interposed between the sensor panel SP and the substrates 26 and 27, so that the distance between the sensor panel SP and the substrates 26 and 27 is secured to some extent. Yes. On the other hand, the distance between the sensor panel SP and the substrates 26 and 27 decreases depending on the thickness of the first support 21 (see also FIG. 9 and the like described later). Here, the sensor panel SP is more susceptible to a magnetic field (magnetic field fluctuation) generated when the elements on the circuit boards 26 and 27 operate as the distance from the boards 26 and 27 becomes smaller, and the generated image data. The noise is likely to occur. Therefore, in order to ensure the quality of the image data generated by the sensor panel SP regardless of the thickness of the first support 21, a high magnetic permeability is provided between the sensor panel SP and the substrates 26 and 27. It is desirable to provide a layer made of a material.

  The support 20 can be made of various porous materials, and may be, for example, a hard resin foam, a metal foam, or a ceramic foam.

  Alternatively, the support 20 may have antistatic properties in which, for example, carbon is kneaded. When the support 20 is made of such a material, or when the support 20 is made of a metal foam, the generation of noise due to charging of the support 20 is prevented, and the electric signal of the FPD 1 is affected. It is prevented from occurring.

  Further, as a result of various experiments conducted by the present inventors, it is preferable that the support 20 is made of a material having a compressive elastic modulus of 10 MPa or more from the viewpoint of ensuring the durability of the sensor panel SP against a load or the like. I understood. Such an experiment will be described later.

(Second configuration example)
FIG. 6 is a schematic cross-sectional view of an FPD 1A as a second configuration example. Hereinafter, the parts described in FIG. 4 are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  In the FPD 1A, the support 20A includes a first support 21A that supports the sensor panel SP, and a second support 22A that supports each component positioned below the sensor panel SP. Hereinafter, when the support 20A is simply referred to, both the first support 21A and the second support 22A may be included.

  The support 20A is a porous member having a large number of voids for weight reduction, and is made of, for example, a hard resin foam material such as acrylic or styrene.

  The top surface of the first support 21A is attached to the back surface of the sensor panel SP with an adhesive or the like, similar to the configuration described above with reference to FIG.

  The second support body 22A is arranged so as to be divided into regions corresponding to the respective electronic components such as the battery 25 and the circuit boards 26 and 27 described above, and has substantially the same planar shape as the corresponding electronic component. That is, the second support body 22A is provided for each electronic component arranged on the lower side of the sensor panel SP. The second support 22A that supports the circuit boards 26 and 27 includes a second recess 22b (see FIGS. 5A and 5B) for protecting elements into which elements protruding from the circuit boards 26 and 27 are inserted. ing.

  As shown in FIG. 6, the bottom plate 2 </ b> A (low) of the housing 2 is formed in a region where the second support 22 </ b> A is not disposed on the lower surface of the first support 21 </ b> A (that is, a region where no electronic component is disposed). Legs 21a extending downward are formed so as to contact the surface.

  The second configuration example shown in FIG. 6 also supports the sensor panel SP on the entire surface of the first support 21A, similarly to the first configuration example described above. In addition, various components such as the circuit boards 26 and 27 and the battery 25 are uniformly supported by using the entire surface of each second support 22A arranged correspondingly. Therefore, the second configuration example can achieve the same effects as the first configuration example.

(Third configuration example)
FIG. 7 is a schematic cross-sectional view of an FPD 1B as a third configuration example.

  The FPD 1B in the third configuration example includes a first support 21A that supports the sensor panel SP, and a second support 22B that supports each electronic component located below the sensor panel SP. Among these, the first support 21A has the same configuration as that described above with reference to FIG. Moreover, the 2nd support body 22B is provided for every electronic component (25,26,27) similarly to the example of FIG.

  On the other hand, the second support 22B includes a plurality of support members 220 arranged in regions corresponding to the respective components such as the battery 25 and the circuit boards 26 and 27 described above. These support members 220 are members harder than the first support 21A, and the material of the support members 220 is, for example, resin. In addition, each support member 220 is disposed so as to have a gap on the bottom plate 21A of the housing 2 (that is, in the planar direction) so as to have a gap for reducing the weight of the entire second support 22B. ing.

  In the example shown in FIG. 7, each support member 220 is a columnar member having the same height, and a gap or interval (pitch) with a predetermined distance between the bottom plate 2 </ b> A and each component. Is arranged. Such an interval between the support members 220 is an interval equal to or less than a predetermined value. Specifically, when an external force is applied to the housing 2, local distortion is not generated in the corresponding component. The interval is set to 60 mm or less in this example. Further, in order to reduce the overall weight of the second support 22B as much as possible, the support members 220 are arranged at intervals of 30 mm or more. Further, each support member 220 in the area of the circuit boards 26 and 27 is provided at a position where it does not interfere with an element protruding from the circuit boards 26 and 27. The upper surface of each support member 220 is fixed to the lower surface of the corresponding electronic component (battery 25, circuit board 26, 27) by, for example, an adhesive. Or, conversely, the lower surface of each support member 220 may be fixed to the bottom plate 2 </ b> A of the housing 2.

  According to the FPD 1B configured as described above, various electronic components such as the circuit boards 26 and 27 and the battery 25 are uniformly supported by the corresponding support members 220 arranged as described above, and are described above with reference to FIG. It is possible to prevent distortion of the electronic component due to such a local support structure. Also in this configuration example, the sensor panel SP is supported on the entire surface of the first support 21 </ b> A, similarly to the first and second configuration examples described above. Therefore, the third configuration example can achieve the same effect as the first configuration example.

  The planar shape (columnar shape) of the support member 220 is not particularly limited, and may be various shapes such as a circle, a rectangle, and a hexagon, and may be a hollow cylindrical body. Good. Further, the arrangement form of the respective support members 220 is also arbitrary. For example, the support members 220 can be arranged in a lattice shape, or may be arranged in a honeycomb shape.

  In the third configuration example shown in FIG. 7, the first support 21A is formed of a porous member (foaming material), and each support member 220 constituting the second support 22B is used as the first support. It was formed of a member harder than the body 21A. There may be various modifications regarding the third configuration example. For example, with respect to the configuration of the second support 22B, the member that supports the battery 25, the main circuit board 26, or the circuit board 27 is configured as shown in FIG. 6, that is, formed of a porous member (foam). Also good. Further, a part of the first support 21A may be formed of a member harder than the porous member (foaming material).

  Alternatively, the first support 21 </ b> A may be formed into a plurality of layers stacked in the vertical direction, and each layer may be formed of foams of different materials.

  In the first to third configuration examples described above, various components in the housing 2 are fixed to the support 20 (20A, 20B) and fixed to the housing 2 (the upper plate 2B or the bottom plate 2A). The explanation has been made on the assumption that it is not allowed. On the other hand, in the first to third configuration examples, the sensor panel SP may be fixed to the upper plate 2B (inner surface) of the housing 2. In this case, for example, the upper surface of the sensor panel SP and the upper plate 2B of the housing 2 are bonded using a double-sided tape, an adhesive, or the like. With this configuration, even when an external impact is applied to the housing 2, problems such as the sensor panel SP colliding with the side plate 2 </ b> C or the side plate 2 </ b> D of the housing 2 and being damaged can be prevented.

  In the configuration example described below, the movement of all the components housed in the housing 2 (a construction of all components including a support and a cushioning material, etc., hereinafter collectively referred to as “internal module”) is suppressed. In order to achieve this, the components of the internal module are fixed to the top plate 2B side or the bottom plate 2A side.

(Fourth configuration example)
FIG. 8 is a schematic cross-sectional view of an FPD 1C as a fourth configuration example. In the fourth configuration example, the support body 20 includes the first support body 21 and the second support body 22 similar to those of the first configuration example described above with reference to FIG. On the other hand, as shown in FIG. 8, in the FPD 1 </ b> C in the fourth configuration example, the cushioning material 30 is disposed between the upper surface of the sensor panel SP and the upper plate 2 </ b> B of the housing 2. The buffer material 30 is not particularly limited as long as it is made of a material that transmits radiation, and various materials such as a foam sheet, a bubble buffer material (air cushion), and a wound cardboard can be used.

  Both surfaces (upper surface and lower surface) of the buffer material 30 are fixed to the upper surface of the upper plate 2B of the housing 2 and the sensor panel SP by a fixing layer such as an adhesive or a double-sided tape. That is, a fixed layer 31 is provided between the upper plate 2B of the housing 2 and the upper surface of the buffer material 30, and a fixed layer 32 is provided between the lower surface of the buffer material 30 and the upper surface of the sensor panel SP. Yes. Similarly to the first configuration example described above, the back surface of the sensor panel SP is fixed to the upper surface of the first support 21 with an adhesive.

  By adopting the configuration as described above, the same effects as those of the first to third configuration examples described above can be obtained, and further, the movement of the internal module can be suppressed and the protection against the sensor panel SP can be enhanced. it can.

  Specifically, in the fourth configuration example, the lower surface (back surface) and the upper surface (irradiated surface) of the sensor panel SP are fixed to the upper surface of the support body 20 and the lower surface of the cushioning material 30, and the sensor panel SP is the housing 2. It is hold | maintained so that it may be pinched | interposed between the support body 20 and the buffer material 30 inside. For this reason, the sensor panel SP does not directly contact any of the upper plate 2B and the side plates 2C and 2D of the housing 2 and is fixed to the upper plate 2B via the cushioning material 30.

  With such a configuration, even when a large load or a strong impact is applied from the up and down direction, the force is absorbed or alleviated by the buffer material 30, so that protection of the sensor panel SP can be enhanced. Further, even when an impact in a direction parallel to the surface of the sensor panel SP is applied, for example, when the FPD 1C is dropped from the side plate 2C (or 2D) side, the sensor panel SP moves in the housing 2 and moves to the side plate 2C. Or it can prevent colliding with 2D of side plates.

  In the first to third configuration examples, for example, when the upper plate 2B of the housing 2 and the upper surface of the sensor panel SP are bonded using a double-sided tape, the upper plate 2B and the sensor panel SP are warped or swelled. If there is, there is a possibility that the state of the contact surface between the upper plate 2B and the sensor panel SP, and hence the state of adhesion, will be uneven. On the other hand, in the fourth configuration example, since the cushioning material 30 is interposed between the upper plate 2B of the housing 2 and the upper surface of the sensor panel SP, the upper plate 2B and the sensor panel SP are warped or swelled. Even in such a case, the cushioning material 30 can absorb the non-uniformity in the distance between both surfaces due to the warp or swell. Therefore, according to the fourth configuration example, the upper plate 2 </ b> B of the housing 2 and the upper surface of the buffer material 30, the lower surface of the buffer material 30, and the lower surface of the sensor panel SP are uniformly bonded by the fixing layers 31 and 32, respectively. Further, the protection of the sensor panel SP (glass substrate or the like) against a load or an impact can be enhanced by the intervention of the cushioning material 30. In general, in the fourth configuration example, protection for the sensor panel SP can be enhanced, and movement of all components (internal modules) in the housing 2 can be suppressed.

(Fifth configuration example)
FIG. 9 is a schematic cross-sectional view of an FPD 1D as a fifth configuration example. As can be seen from comparison with FIG. 8, the fifth configuration example shown in FIG. 9 has a structure in which the first support 21 is removed from the fourth configuration example described above with reference to FIG. In the fifth configuration example, electronic components such as the circuit boards 26 and 27 and the battery 25 are in contact with the back surface of the sensor panel SP, and each component in the housing 2 including the sensor panel SP is the second. This structure is supported by the support 22. By setting it as such a structure, the further weight reduction of the whole apparatus can be achieved.

  On the other hand, in the fifth configuration example, since the distance between the sensor panel SP and other electronic components is short, it is easily affected by a magnetic field (magnetic field fluctuation) generated when the elements on the circuit boards 26 and 27 are operated. . For this reason, it is desirable to provide a layer made of a material with high magnetic permeability between the sensor panel SP and the substrates 26 and 27.

  In the above-described fourth and fifth configuration examples, the cushioning material 30 is interposed between the upper plate 2B of the housing 2 and the upper surface of the sensor panel SP. As another example, the cushioning material 30 may not be used, and the upper plate 2B itself of the housing 2 may have a function as a cushioning material. As such a configuration, the upper plate 2B of the housing 2 has a laminated structure in which a plurality of plate members are laminated, and one of the layers, for example, the layer of the exposed surface R is made of the foam material as described above. Form. Furthermore, the bottom plate 2A and the side plate 2C (2D) of the housing 2 may have a similar laminated structure using a foam material. By adopting such a configuration, it is possible to mitigate the load and impact applied to the housing 2 from the outside by the housing 2 itself, and to enhance the protection of the sensor panel SP, the circuit boards 26 and 27, and the like. it can.

(Sixth configuration example)
FIG. 10 is a schematic cross-sectional view of an FPD 1E as a sixth configuration example. As can be seen from comparison with FIG. 8, in the sixth configuration example, there are no fixed layers (31, 32) on both sides of the cushioning material 30, and the cushioning material 30 is formed of the sensor panel SP and the housing 2 (upper plate 2B). Neither is fixed (bonded). On the other hand, in the sixth configuration example, a fixing layer 33 made of an adhesive, a double-sided tape, or the like is provided between the bottom plate 2B of the housing 2 and the lower surface of the second support 22, and the second support 22 is fixed to the inner wall of the bottom plate 2B which is the surface opposite to the surface irradiated with radiation in the housing 2. That is, the fourth and fifth configuration examples (see FIGS. 8 and 9) are structures in which the internal module in the housing 2 is fixed (held) to the surface on the exposure surface R side. The sixth configuration example shown in FIG. 10 has a structure in which the internal module in the housing 2 is fixed (held) to the surface opposite to the exposure surface R through the support body 20. According to the sixth configuration example, the same effect as in the fourth configuration example can be obtained.

  Further, as described above, when an internal module in which the components housed in the housing 2 are integrated is configured and the internal module is housed so as not to move in the housing 2, It has been found that the rigidity of the upper surface 2B may be lower than before. Therefore, by reducing the weight of the upper surface 2B of the housing 2, further weight reduction and cost reduction can be achieved.

  In the sixth configuration example, the bottom plate 2A of the housing 2 and the support body 20 (second support body 22) are fixed using the fixing layer 33 made of an adhesive, double-sided tape, or the like. Various modifications are possible. For example, the lower surface of the second support 22 is not formed into a planar shape as shown in FIG. 8, and one or more convex portions protrude from the lower surface, and the convex portions are located at corresponding positions of the bottom plate 2 </ b> A of the housing 2. It is good also as a fixed structure by providing the recessed part to engage and engaging these convex parts and recessed parts. Or you may provide a recessed part in the lower surface of the 2nd support body 22, and provide the convex part which the said recessed part engages in the corresponding position of the baseplate 2A of the housing | casing 2. FIG.

  Each structural example mentioned above can be arbitrarily combined according to the objective etc.

[Example]
Hereinafter, experimental examples for effect confirmation performed by the present inventors will be described.

  The inventors changed the compression elastic modulus of the support 20 (the first support 21 and the second support 22) to the housing 2 in the FPD 1 according to the first configuration example shown in FIG. An impact was applied, and an experiment and simulation (estimation) were performed as to whether or not the glass substrate of the sensor panel SP would break. In addition, the thickness of the housing | casing 2 was made into 16 mm or less based on JIS. The test results are shown in a table in FIG.

  As shown in the table in FIG. 11, when the compression elastic modulus of the support 20 is 63 MPa, 29.3 MPa, and 10 MPa, the glass substrate of the sensor panel SP is not cracked, and the support 20 When the compression modulus was 7.4 MPa and 2 MPa, the glass substrate was cracked. As a result, it was found that the material (material) of the support 20 is preferably a material having a compressive elastic modulus of 10 MPa or more.

  As described above, according to the present embodiment, the support 20 (20A, 20B) for supporting the sensor panel SP and various electronic components is a low-density member having a gap. It is possible to reduce the weight of the entire FPD. In addition, since the support 20 (20A, 20B) according to the present embodiment is configured to support the lower surface of the sensor panel SP without gaps in the thickness direction and the plane direction, the sensor panel against load, impact, and the like. SP protection is enhanced (resistance is improved).

  In addition, according to the present embodiment, the sensor panel SP and various electronic components are configured to be uniformly supported over a wide area, so that the housing 2 can be protected against loads such as load and impact applied to the housing 2. It is possible to prevent or suppress the occurrence of local distortion in the internal components. Therefore, according to the present embodiment, breakage of the glass substrate of the sensor panel SP and breakage of the circuit boards 26 and 27 are effectively prevented against loads such as load and impact. Furthermore, according to the present embodiment, since the second support 22 is provided with the recesses for protecting the elements, the elements on the circuit boards 26 and 27 are damaged by a load such as a load or an impact. Prevented or suppressed.

  In addition, each of the above-described embodiments is merely an example of actualization in carrying out the present invention, and the technical scope of the present invention should not be construed as being limited thereto. That is, the present invention can be implemented in various forms without departing from the gist or the main features thereof.

100 X-ray imaging system 1,1A-1E FPD
2 Housing 2A Bottom plate 2B Top plate 2C, 2D Side plate 20, 20A, 20B Supports 21, 21A First support 21a Legs 22, 22A, 22B Second support 22a First recess 22b Second recess 220 Support Member 25 Battery 26, 27 Circuit board 261, 262 Element 30 Buffer material 31, 32, 33 Fixed layer SP Sensor panel S Subject

Claims (23)

A sensor panel provided with a sensor on the upper surface side for detecting radiation applied to the subject;
Electronic components disposed on the lower surface side of the sensor panel;
A support for supporting the sensor panel and the electronic component;
A housing for housing the sensor panel, the electronic component, and the support;
With
The support has a gap and is configured to support the lower surface of the sensor panel without gaps in the thickness direction and the plane direction.
Radiation imaging device. The support is
A first support that holds the sensor panel on one surface facing the sensor panel and holds the electronic component on a surface opposite to the one surface;
A second support member disposed between the electronic component and the housing and supporting the electronic component;
Comprising
The radiographic imaging device according to claim 1. The second support body supports a region where a circuit element is not arranged in a circuit board included in the electronic component.
The radiographic imaging apparatus according to claim 2. The second support includes: a first recess having a shape corresponding to the shape of the electronic component; and a second recess having a shape corresponding to the shape of the circuit element in the circuit board formed in the first recess. Prepare
The radiographic imaging device according to claim 3. The second recess has a depth corresponding to the height of the circuit element;
The radiographic imaging device according to claim 4. The second recess is a hole penetrating the second support.
The radiographic imaging device according to claim 4. Legs that contact the bottom surface of the housing are formed in a region where the electronic component is not disposed on the lower surface of the first support.
The radiographic imaging apparatus according to claim 2. A plurality of the electronic components are provided,
The second support is provided for each electronic component.
The radiographic imaging device according to claim 7. The support is a porous member,
The radiographic imaging apparatus according to claim 1. The porous member is a member including at least one of a resin foam, a metal foam, and a ceramic foam.
The radiographic imaging apparatus according to claim 9. The support has a plurality of support members arranged in a planar direction,
The gap includes gaps between the plurality of support members.
The radiographic imaging device according to any one of claims 1 to 5. The second support body includes a plurality of support members arranged in a plane direction,
The gap includes gaps between the plurality of support members.
The radiographic imaging device according to claim 2 or 3. The support member has a column shape,
The radiographic imaging apparatus of Claim 11 or 12. The plurality of support members are arranged in a lattice shape,
The radiographic imaging apparatus according to claim 11. The plurality of support members are arranged in a honeycomb shape,
The radiographic imaging apparatus according to claim 11. The support is configured using a porous member and a plurality of support members.
The radiographic imaging apparatus in any one of Claim 1 to 15. The sensor panel is fixed to the inner surface of the housing.
The radiographic imaging apparatus according to any one of claims 1 to 16. The sensor panel is fixed to an irradiation surface side on which the radiation is irradiated on the inner surface of the housing.
The radiographic imaging apparatus of Claim 17. A cushioning material is provided between the sensor panel and the housing.
The radiographic imaging apparatus of Claim 18. At least the irradiation surface side of the housing is formed by laminating a plurality of plate materials including a foam material.
The radiographic imaging apparatus of Claim 18 or 19. The support is fixed to the opposite surface so that the sensor panel and the electronic component are held on the opposite surface of the housing to the surface irradiated with the radiation.
The radiographic imaging apparatus of Claim 18. The support is bonded to the housing;
The radiographic image capturing apparatus according to claim 21. The support has a convex portion or a concave portion corresponding to the concave portion or the convex portion provided on the inner wall of the casing,
The support is fixed to the housing by engaging the convex or concave portion of the support with the concave or convex portion of the housing.
The radiographic imaging apparatus according to any one of claims 1 to 22.

Images