JP2019192709A - Bus bar module, electric power conversion system and manufacturing method for bus bar module - Google Patents

Abstract

To provide a bus bar module with high resistance to transfer of a thermal stress against a resin sealing body and to short service life.SOLUTION: The bus bar module includes: a pair of bus bar 2 (2,2) and a resin sealing body 30 for sealing the pair of bus bars 2,2. The pair of bus bars 2 adjoins to each other at a predetermined interval in the thickness direction of the bus bar 2. The resin sealing body 30 has a first resin part 3and a second resin part 3in contact with each other. Between the pair of bus bar 2, 2, there exists an interface 4 of the first resin part 3to the second resin part 3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a bus bar module in which a plurality of bus bars are sealed, a power converter using the bus bar module, and a method for manufacturing the bus bar module.

  Conventionally, a bus bar module including a plurality of bus bars and a resin sealing body that seals the plurality of bus bars is known (see Patent Document 1 below). This bus bar module is used in, for example, a power converter.

JP 2004-304874 A

  However, the bus bar module has a problem that thermal stress is easily applied to the resin sealing body. That is, since heat is generated when a current flows through the bus bar, the temperature of the resin sealing body rises and expands, and thermal stress is applied to the resin sealing body. In particular, in the resin sealing body, a portion existing between a pair of bus bars adjacent to each other is prevented from free thermal expansion by the bus bar, and high thermal stress is easily applied. If a high thermal stress is applied to the resin sealing body, there is a possibility that the resin sealing body may have a reduced life.

  The present invention has been made in view of the above problems, and a bus bar module in which high thermal stress is not easily applied to a resin sealing body and the life of the resin is not easily reduced, a power conversion device using the bus bar module, and manufacture of the bus bar module Is to provide a method.

A first aspect of the present invention includes a plurality of bus bars (2),
A resin sealing body (30) made of resin and sealing the plurality of bus bars,
The individual bus bars are adjacent to each other at a predetermined interval in the thickness direction of the bus bar,
The resin sealing body has a first resin portion (3 _A ) and a second resin portion (3 _B ) in contact with each other, and the first resin portion and the pair of bus bars adjacent to each other The bus bar module (1) has an interface (4) with the second resin portion.

A second aspect of the present invention is a power conversion device (10) including the bus bar module,
The resin sealing body also serves as the case (30 _C ) of the power converter,
A semiconductor module (5) housed in the case and electrically connected to the pair of bus bars,
A control circuit board (6) housed in the case and controlling the operation of the semiconductor module;
A case sealing member (7) for sealing the semiconductor module and the control circuit board in the case;
The case is formed with a fixing portion (39) for fixing the in-vehicle alternator (11) electrically connected to the semiconductor module at a position closing the opening (38) of the case,
The power conversion device is configured so that an interface between the first resin portion and the second resin portion is not exposed on an outer surface of the case.

A third aspect of the present invention is a method of manufacturing the bus bar module,
One bus bar of the pair of bus bars is accommodated in a primary mold and resin molding is performed, whereby the one bus bar and the first resin portion are integrally formed, and the other bus bar is formed on the first resin portion. A primary molding step of forming a primary molded body (301) provided with a recess (37) for fixing
A bus bar fixing step of inserting and fixing the other bus bar in the recess;
A secondary molding step of accommodating the primary molded body to which the other bus bar is fixed in a secondary mold and molding the second resin portion;
A method of manufacturing a bus bar module.

The bus bar module according to the first invention includes a resin sealing body having the first resin portion and the second resin portion. And it is comprised so that the interface of a 1st resin part and a 2nd resin part may exist between a pair of said bus-bars.
Therefore, the thermal stress applied to the resin sealing body can be relaxed. That is, the first resin portion and the second resin portion are not completely in close contact with each other, and a slight gap exists between them. Therefore, when a current flows through the bus bar to generate heat and the temperature of the resin sealing body rises, the thermal expansion of the resin sealing body can be mitigated by the gap. Therefore, cracks and the like are less likely to occur in the resin sealing body, and the lifetime reduction of the resin sealing body can be suppressed. In particular, a portion of the resin-sealed body existing between a pair of bus bars is likely to be subjected to high thermal stress because free thermal expansion is prevented by the bus bar. If it forms between, thermal stress can be relieve | moderated effectively and the lifetime reduction of a resin sealing body can be suppressed.

Moreover, in the said 2nd invention, the bus-bar module is used for the power converter device. Since a large current flows through the bus bar of the power converter, heat is easily generated. Therefore, the temperature of the resin sealing body tends to be particularly high. However, in the present invention, since the interface between the two resin parts is provided between the pair of bus bars and the thermal stress is relaxed by the gaps existing between the two resin parts, even if the temperature is particularly high, It can suppress that a big thermal stress is added to a resin sealing body, and can suppress lifetime reduction.
Moreover, the power converter device according to the second aspect of the invention is attached to the in-vehicle alternator. The power conversion device used in such an environment is easily exposed to rainwater or the like that bounces when the vehicle travels. However, since the power converter is configured so that the interface between the first resin portion and the second resin portion is not exposed on the outer surface of the resin sealing body (that is, the case), water enters from the interface. A problem that the pair of bus bars is short-circuited can be suppressed.

Moreover, in the said 3rd invention, the said primary shaping | molding process, a bus-bar fixing process, and a secondary shaping | molding process are performed. In the primary molding step, only one bus bar of the pair of bus bars is accommodated in the mold, and resin molding is performed to manufacture the primary molded body. The said recessed part is formed in the primary molded object, After fixing the other bus bar to this recessed part, the said secondary shaping | molding process is performed.
If it does in this way, it can control that a manufacturing variation arises in the interval of a pair of bus bars, a pair of bus bars approach and it short-circuits, and the malfunction that a manufacturing variation arises in the inductance between a pair of bus bars can be controlled. That is, if a pair of bus bars are both housed in a mold and a bus bar module is manufactured by a single resin molding, the bus bar is pushed by the pressure of the resin, and the interval between the pair of bus bars tends to vary. On the other hand, as in the third aspect of the invention, first, one of the bus bars is put into a mold to produce the primary molded body, and the other bus bar is fixed to the recess formed in the primary molded body. If the next molding step is performed, the secondary molding step can be performed in a state where the pair of bus bars are sufficiently fixed by the first resin portion. Therefore, even if the pressure of the resin is applied to the bus bar in the secondary molding process, the interval between the pair of bus bars is difficult to change.

As described above, according to the above aspect, it is possible to provide a bus bar module in which a high thermal stress is not easily applied to the resin sealing body and a lifetime is difficult to be reduced, a power conversion device using the bus bar module, and a method for manufacturing the bus bar module. Can do.
In addition, the code | symbol in the parenthesis described in the means to solve a claim and a subject shows the correspondence with the specific means as described in embodiment mentioned later, and limits the technical scope of this invention. It is not a thing.

It is an expanded sectional view of the power converter device in Embodiment 1, Comprising: II sectional drawing of FIG. The perspective view of the power converter device seen from the vehicle-mounted alternator side in Embodiment 1. FIG. The top view of the power converter device in Embodiment 1. FIG. FIG. 3 is a plan view of a pair of bus bars in the first embodiment. The top view of the bus-bar module in Embodiment 1. FIG. The partial expansion perspective view of the bus-bar module in Embodiment 1. FIG. The principal part expansion perspective view of a pair of bus bar in Embodiment 1. FIG. The principal part expansion perspective view of the bus-bar module in Embodiment 1. FIG. 1 is a perspective view of a semiconductor module in Embodiment 1. FIG. The manufacturing process explanatory drawing of the power converter device in Embodiment 1. FIG. The figure following FIG. The figure following FIG. The figure following FIG. The figure following FIG. The figure following FIG. FIG. 3 is an enlarged cross-sectional view of a resin interface in the first embodiment. The side view of the power converter device and vehicle-mounted alternator in Embodiment 1. FIG. The circuit diagram of the power converter device in Embodiment 1. FIG. The expanded sectional view of the power converter device in Embodiment 2. FIG. The expanded sectional view of the power converter device in Embodiment 3. FIG. The expanded sectional view of the power converter device in Embodiment 4. FIG. The expanded sectional view of the power converter device in Embodiment 5. FIG. The expanded sectional view of the power converter device in Embodiment 6. FIG. The expanded sectional view of the power converter device in Embodiment 7. FIG. The expanded sectional view of the power converter device in Embodiment 8. FIG. The expanded sectional view of the power converter which changed the magnitude relationship of the thermal expansion coefficient of the two resin parts in Embodiment 8. The expanded sectional view of the power converter device 1 in Embodiment 9. FIG.

(Embodiment 1)
Embodiments according to the bus bar module and the power conversion device will be described with reference to FIGS. As shown in FIGS. 1 and 15, the bus bar module 1 of the present embodiment includes a pair of bus bars 2 (2 _P , 2 _N ) and a resin sealing body 30 that seals the pair of bus bars 2 _P , 2 _N. Prepare. The individual bus bars 2 are adjacent to each other at a predetermined interval in the thickness direction of the bus bar 2.

Resin sealing body 30 is in contact with each other, having a first resin portion 3 _A and the second resin portion 3 _B. An interface 4 between the first resin portion 3 _A and the second resin portion 3 _B exists between the pair of bus bars 2 _P and 2 _N.

The bus bar module 1 of this embodiment is used for a power conversion device 10 as shown in FIGS. The power conversion device 10 includes a bus bar module 1, a semiconductor module 5, a control circuit board 6, and a case sealing member 7. The resin sealing body 30 of the bus bar module 1 also serves as the case 30 _C of the power conversion device 10. The semiconductor module 5 is accommodated in the case 30 _C. As shown in FIG. 1, the semiconductor module 5 is electrically connected to a pair of bus bars 2 _P and 2 _N , respectively.

The control circuit board 6 is connected to the semiconductor module 5. The control circuit board 6 controls the operation of the semiconductor module 5. The case sealing member 7 seals the semiconductor module 5 and the control circuit board 6 to the case 30 _C.

As shown in FIGS. 2 and 3, the case 30 _C, automotive alternator 11 (see FIGS. 1 and 17) fixing portion 39 for fixing the can is formed. Using this fixing portion 39, the vehicle alternator 11, is fixed to a position closing the opening 38 of the case 30 _C.

Further, as shown in FIG. 1, the power conversion device of this embodiment, the outer surface of the case 30 _C, the interface 4 is constituted so as not to expose the first resin portion 3 _A and the second resin portion 3 _B.

  As shown in FIG. 17, a belt 111 is attached to the in-vehicle alternator 11. Via this belt 111, the rotational force of an engine (not shown) is transmitted to the in-vehicle alternator 11 to generate AC power. The power converter 10 rectifies this AC power into DC power and charges the DC power supply 82. Further, when starting the engine, the DC power of the DC power source 82 is converted into AC power using the power converter 10 and the vehicle-mounted alternator 11 is rotated. This starts the engine.

As shown in FIG. 2, three semiconductor modules 5 are accommodated in the case 30 _C (that is, the resin sealing body 30). Each semiconductor module 5 includes a power terminal 52 (52 _P , 52 _N ) and a control terminal 53. The power terminal 52 is connected to the connection portion 23 (23 _P , 23 _N ) of the bus bar 2. The control terminal 53 is connected to the control circuit board 6 as shown in FIG. The inside of the case 30 _C is sealed with a waterproof case sealing member 7.

As shown in FIGS. 1 to 3, the case 30 _C, are the heat radiating plate 51 and the insert. The heat radiation plate 51 is used to radiate heat from the semiconductor module 5.

As shown in FIGS. 4 and 5, the bus bar 2 is bent into a square shape. The bus bar 2 includes a positive bus bar 2 _P connected to the positive electrode of the DC power supply 82 (see FIGS. 17 and 18) and a negative bus bar 2 _N connected to the ground. The positive electrode bus bar 2 _P is formed with a power supply connection terminal 21 for connection to the positive electrode of the DC power supply 82. The negative electrode bus bar 2 _N is formed with a ground terminal 22 for connection to the ground via the in-vehicle alternator 11.

As shown in FIG. 18, each semiconductor module 5 includes four switching elements 55 (MOSFETs). The on-vehicle alternator 11 includes two winding portions 19 _A and 19 _B. And four switching elements 55 included in the first semiconductor module 5 _A, the two switching elements 55 included in the second semiconductor module 5 _B, is connected to the first winding part 19 _A. Further, the other two switching elements 55 included in the second semiconductor module 5 _B and the four switching elements 55 included in the third semiconductor module 5 _C are connected to the second winding portion 19 _B. Yes.

As shown in FIG. 9, the semiconductor module 5 includes a module main body 54 having a built-in switching element 55, a power terminal 52 protruding from the module main body 54, and a control terminal 53. The power terminal 52 is a positive terminal 52 _P to connect to the positive bus bar 2 _P, and the negative terminal 52 _N to connect to the negative bus bar 2 _N, and the AC terminal 52 _A to be connected to the winding unit 19. The control terminal 53 is connected to the above-described control circuit board 6 (see FIG. 1).

The semiconductor module 5 comprises two positive terminal 52 _P, and a negative two terminal 52 _N. As described above, the case 30 _C (that is, the resin sealing body 30) seals the bus bar 2 (see FIG. 1). In this case 30 _C , the connecting portion 23 (23 _P , 23 _N ) of the bus bar 2 protrudes. These connecting portions 23 are overlapped and welded to the power terminals 52 _P and 52 _N of the semiconductor module 5.

6, as shown in FIG. 8, the outer first resin section 3 _A, an intermediate portion 31 interposed between the pair of bus bars 2 _P, 2 _N, disposed outside the pair of bus bars 2 _P, 2 _N A portion 32 and a bottom portion 33 are provided. As shown in FIG. 8, the end surface 310 of the interposition part 31 is located between both end parts 29 _A and 29 _B of the bus bar 2 in the protruding direction (Z direction) of the connection part 23.

As shown in FIGS. 5 and 6, the first resin portion 3 _A has a plurality of recesses 36 formed therein. An intervening portion 31 is also formed in the recess 36. The recess 36 is formed because the primary mold 81 is inserted when performing the primary molding process described later. Thereby, the deformation | transformation of the bus-bar 2 is suppressed in the primary shaping | molding process, or the thickness dispersion | variation of the interposition part 31 is suppressed.

  Further, as shown in FIGS. 5 and 6, in this embodiment, the outer portion 32 is not provided in all portions of the bus bar 2, and there are a plurality of regions where the outer portion 32 is not formed.

As shown in FIG. 15, the end surface 310 of the interposition part 31 exists in a position farther from the connection part 23 than the center part M of the bus bar 2 in the Z direction. Further, the end surface 320 of the outer side portion 32 is present at a position closer to the connection portion 23 than the center portion M in the Z direction. The second resin portion 3 _B covers the outer portion 32, the pair of bus bars 2 _P and 2 _N, and the interposition portion 31 from the outside.
As described above, the first resin portion 3 _A, recess 36 is a plurality of locations is formed (see FIGS. 5 and 6). The end surface 310 of the interposition part 31 in the recess 36 is also located farther from the connection part 23 than the center part M of the bus bar 2 in the Z direction.

Next, a method for manufacturing the bus bar module 1 will be described. As shown in FIG. 10, first, a primary molding process is performed. In the primary molding step, one bus bar 2 (positive bus bar 2 _{P in} this embodiment) of the pair of bus bars 2 is accommodated in the primary mold 81 and resin molding is performed. That is, first, the bus bar 2 _P is accommodated in the two primary molds 81 _A and 81 _B , and molten resin is injected from the gate 810. Then, the resin is solidified, and the molds 81 _A and 81 _B are released. Thus, as shown in FIG. 11, one of the bus bars 2 _P and the first resin portion 3 _A to form a primary molded body 301 formed integrally. The first resin portion 3 _A, is formed a recess 37 for fixing the other bus bar 2 _N.

Next, as shown in FIG. 12, a bus bar fixing step is performed. The bus bar fixing step, the recess 37 of the first resin section 3 _A and insert the other bus bar 2 _N, fixed.

Thereafter, as shown in FIG. 13, a secondary forming step is performed. In the secondary molding step, the primary molded body 301 to which the other bus bar 2 _N is fixed is accommodated in a secondary mold (not shown), and resin molding is performed. Thereby forming a second resin portion 3 _B. In the secondary molding process, the heat sink 51 is also accommodated in the secondary mold. And the heat sink 51 is insert-molded. The bus bar module 1 is manufactured by performing the above steps.

Thereafter, as shown in FIG. 14, the semiconductor module 5 is accommodated in the case 30 _C (that is, the resin sealing body 30), and the power terminals 52 _P and 52 _N of the semiconductor module 5 are connected to the connection portions 23 _P and 23 of the bus bar 2. Weld to _N. Next, as shown in FIG. 15, the control circuit board 6 is connected to the control terminal 53 (see FIG. 1), and the inside of the case 30 _C is sealed with the case sealing member 7. The power converter device 10 is manufactured by performing the above process.

The effect of this form is demonstrated. As shown in FIGS. 1 and 15, the bus bar module 1 of the present embodiment includes a pair of bus bars 2 _P and 2 _N and a resin sealing body 30. Resin sealing body 30 has a first resin section 3 _A and the second resin portion 3 _B. An interface 4 between the first resin portion 3 _A and the second resin portion 3 _B exists between the pair of bus bars 2 _P and 2 _N.
Therefore, the thermal stress applied to the resin sealing body 30 can be relaxed. That is, as shown in FIG. 16, the first resin portion 3 _A and the second resin portion 3 _B are not completely in close contact with each other, and a slight gap G exists between them. Therefore, when the current flows through the bus bar 2 to generate heat and the temperature of the resin sealing body 30 rises, the thermal expansion of the resin sealing body 30 can be mitigated by the gap G. Therefore, cracks and the like are less likely to occur in the resin sealing body 30, and the lifetime reduction of the resin sealing body 30 can be suppressed. In particular, a portion of the resin sealing body 30 between the pair of bus bars 2 _P and 2 _N is easily subjected to high thermal stress because free thermal expansion is hindered by the bus bars 2 _P and 2 _N. If the interface 4 is formed between the pair of bus bars 2 _P and 2 _N as in the present embodiment, the thermal stress can be effectively relieved, and the lifetime reduction of the resin sealing body 30 can be suppressed.

Further, the power conversion device 10 of the present embodiment includes the bus bar module 1. Since a large current flows through the bus bar 2 of the power conversion device 10, heat is likely to be generated. Moreover, when connecting to the vehicle-mounted alternator 11, the temperature of the resin sealing body 30 tends to be particularly high due to heat from the engine or the vehicle-mounted alternator 11 present around the power conversion device 10. However, in this embodiment, the interface 4 between the two resin portions 3 _A and 3 _B is provided between the pair of bus bars 2 _P and 2 _N , and the gap G existing between the two resin portions 3 _A and 3 _B is provided. Since the thermal stress is relaxed, even if the temperature is particularly high, it is possible to suppress a large thermal stress from being applied to the resin sealing body 30 and to reduce the lifetime.

Further, as described above, the power conversion device 10 of this embodiment is attached to the in-vehicle alternator 11. The power conversion device 10 used in such an environment is easily exposed to rainwater and the like that bounces when the vehicle travels. However, in this embodiment, since the outer surface of the resin sealing body 30 (i.e. casing 30 _C), the first resin portion 3 _A and the interface 4 between the second resin portion 3 _B is are constituted so as not to be exposed, the interface The problem that water enters from 4 and the pair of bus bars 2 _P and 2 _N are short-circuited can be suppressed.

Moreover, in the manufacturing method of the bus-bar module 1 which concerns on this form, a primary shaping | molding process (refer FIG. 10, FIG. 11), a bus-bar fixing process (refer FIG. 12), and a secondary shaping | molding process (refer FIG. 13) are performed. In the primary molding step, only one bus bar 2 (positive bus bar 2 _{P in} this embodiment) of the pair of bus bars 2 is accommodated in the primary mold 81, and resin molding is performed to manufacture the primary molded body 301. A concave portion 37 is formed in the primary molded body 301, and the other bus bar 2 (in this embodiment, the negative electrode bus bar 2 _N ) is fixed to the concave portion 37, and then the secondary molding step is performed.
In this way, the pair of bus bars 2 _P, two interval _N can suppress the production variation occurs, or a short circuit close a pair of bus bars 2 _P, 2 _N, a pair of bus bars 2 _P, between 2 _N It is possible to suppress problems such as manufacturing variations in inductance. That is, if a pair of bus bars 2 _P and 2 _N are both housed in a mold and the bus bar module 1 is manufactured by a single resin molding, the bus bars 2 _P and 2 _N are pushed by the pressure of the resin. The distance between the pair of bus bars 2 _P and 2 _N tends to fluctuate. In contrast, as in the present embodiment, first one of the bus bars 2 _P to prepare a first shaped body 301 is put in a mold, the other bus bar 2 _N fixed in a recess 37 formed in the primary molded body 301 Then, if the secondary molding step is performed, the secondary molding step can be performed in a state where the pair of bus bars 2 _P and 2 _N are sufficiently fixed by the first resin portion 3 _A. Therefore, even if the pressure of the resin is applied to the bus bar 2 in the secondary molding process, the interval between the pair of bus bars 2 _P and 2 _N hardly changes.

As described above, in this embodiment, by forming the first resin portion 3 _A in the primary molding step, molding the second resin portion 3 _B in a secondary molding step. The first resin part 3 _A and the second resin part 3 _B are made of the same resin material. As shown in FIG. 13, the volume of a portion (intervening portion 31) interposed between a pair of bus bars 2 _P, 2 _N of the first resin section 3 _A, a pair of bus bars 2 _P of the second resin portion 3 _B , 2 _N is larger than the volume of the portion 34 interposed.
In this way, easily and more constant distance between the pair of bus bars 2 _P, 2 _N. That is, the intermediate portion 31 of the first resin section 3 _A is, as shown in FIG. 10, when performing the primary molding step, is formed between the bus bars 2 _P mold 81 _A. Since the mold 81 _A hard to move even joined by the resin pressure, the thickness of the intervening portion 31, manufacturing variation is unlikely to occur. Therefore, hardly occurs thickness variation, by increasing the volume of the intervening portion 31 of the first resin section 3 _A, easily the distance between the pair of bus bars 2 _P, 2 _N constant. Moreover, when the volume of the interposition part 31 is enlarged, it becomes easy to hold | maintain the other bus-bar _2N in the recessed part 37. FIG. Further, when the volume of the interposition part 31 is increased, as shown in FIG. 13, even when the resin pressure P is applied to each bus bar 2 _P , 2 _N when the secondary molding process is performed, each bus bar 2 is inserted by the interposition part 31. _{Since P 1} and 2 _N can be supported over a wide area, the deformation of the bus bars 2 _P and 2 _N due to the resin pressure P can be suppressed.

  As described above, according to the present embodiment, it is possible to provide a bus bar module in which a high thermal stress is not easily applied to the resin sealing body and a lifetime is not easily reduced, a power converter using the bus bar module, and a method for manufacturing the bus bar module. Can do.

  In the following embodiments, the same reference numerals used in the drawings among the reference numerals used in the drawings represent the same constituent elements as those in the first embodiment unless otherwise specified.

(Embodiment 2)
This embodiment is an example of changing the shape of the first resin section 3 _A. As shown in FIG. 19, in this embodiment, the end surface 310 of the interposition part 31 of the first resin part 3 _A and the end surface 320 of the outer part 32 are equal in the Z direction. These end surfaces 310 and 320 exist in a position closer to the connection portion 23 than the intermediate portion M of the bus bar 2 in the Z direction.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 3)
This embodiment is an example of changing the shape of the first resin section 3 _A. As shown in FIG. 20, in this embodiment, the end surface 310 of the interposition part 31 of the first resin part 3 _A is located closer to the connection part 23 in the Z direction than the end face 320 of the outer part 32. The end surface 320 of the outer side portion 32 has the same position in the Z direction as the central portion M of the bus bar 2.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 4)
This embodiment is an example of changing the shape of the first resin section 3 _A. As shown in FIG. 21, in the present embodiment, the end surface 310 of the interposition part 31 of the first resin portion 3 _A is positioned closer to the connection part 23 side in the Z direction than the end surface 320 of the outer side part 32, as in the third embodiment. is doing. The end surface 310 of the interposition part 31 is located closer to the connection part 23 in the Z direction than the central part M of the bus bar 2. Further, the end surface 320 of the outer portion 32 is formed at a position farther from the connection portion 23 in the Z direction than the central portion M of the bus bar 2.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 5)
This embodiment is an example of changing the shape of the first resin section 3 _A. As shown in FIG. 22, in this embodiment, the outer portion 32 is formed only on one side in the arrangement direction (X direction) of the pair of bus bars 2 _P and 2 _N. The end surface 310 of the interposition part 31 is located closer to the connection part 23 in the Z direction than the end surface 320 of the outer side part 32. Further, the end surface 320 of the outer portion 32, in the Z-direction, than the end 29 _A of the bus bar 2 is present at a position farther from the connection part 23.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 6)
This embodiment is an example of changing the shape of the first resin section 3 _A. As shown in FIG. 23, the first resin portion 3 _A of this embodiment does not include the outer portion 32. The first resin portion 3 _A includes only the interposition portion 31 and the bottom portion 33.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 7)
This embodiment is an example of changing the shape of the first resin section 3 _A. As shown in FIG. 24, the first resin portion 3 _A of this embodiment includes only the interposition portion 31. Two interfaces 4 (4 _A , 4 _B ) are formed between the pair of bus bars 2 _P , 2 _N.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 8)
This embodiment is an example of changing a first resin section 3 _A resin material of the second resin portion 3 _B. As shown in FIG. 25, the first resin portion 3 _A of the present embodiment includes two outer portions 32 and an interposition portion 31 as in the first embodiment. The second resin part 3 _B has a larger thermal expansion coefficient than the first resin part 3 _A. Of the second resin portion 3 _B, the portion interposed between the pair of bus bars 2 _P, 2 _N (intervening portion 34), of the first resin section 3 _A, between a pair of bus bars 2 _P, 2 _N Volume is smaller than the intervening part (intervening part 31)

Thus, in this embodiment, of the two resin portions 3 _A and 3 _B , the resin portion 3 (second resin portion 3 _B ) having a large thermal expansion coefficient is the resin portion 3 (first resin) having a small thermal expansion coefficient. The volume of the portion interposed between the pair of bus bars 2 _P and 2 _N is smaller than that of the portion 3 _A ).

The effect of this form is demonstrated. With the above configuration, even when a current flows through the bus bar 2 to generate heat and the temperature of the resin sealing body 30 increases, the volume of the resin part 3 (second resin part 3 _B ) having a large thermal expansion coefficient is small. , The amount of expansion can be reduced. Therefore, the thermal stress applied to the resin sealing body 30 can be reduced.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

In the present embodiment, the thermal expansion coefficient of the second resin portion 3 _B, has been greater than the first resin section 3 _A, the present invention is not limited thereto. That is, the thermal expansion coefficient of the first resin part 3 _A is made larger than that of the second resin part 3 _{B. As} shown in FIG. 26, the first resin part 3 _A is more than the second resin part 3 _B. it may be configured to the volume of a portion interposed between a pair of bus bars 2 _P, 2 _N is reduced.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 9)
In this embodiment, the number of bus bars 2 is changed. As shown in FIG. 27, the bus bar module 1 of the present embodiment includes three bus bars 2 (2 _U , 2 _V , 2 _W ). The individual bus bars 2 are adjacent to each other at a predetermined interval in the thickness direction of the bus bar 2. Further, similarly to Embodiment 1, the resin sealing body 30 includes a first resin portion 3 _A and the second resin portion 3 _B. An interface 4 between the first resin portion 3 _A and the second resin portion 3 _B exists between a pair of adjacent bus bars 2. The interface 4 exists in a position farther from the outer portion 32 than the central portion M of the bus bar 2 in the Z direction.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

  In the present embodiment, three bus bars 2 are sealed, but the present invention is not limited to this, and four or more bus bars 2 may be sealed.

  The present invention is not limited to the above embodiments, and can be applied to various embodiments without departing from the scope of the invention.

DESCRIPTION OF SYMBOLS 1 Bus bar module 10 Power converter 2 Bus bar 3 _A 1st resin part 3 _B 2nd resin part 30 Resin sealing body 4 Interface 5 Semiconductor module 6 Control circuit board 7 Case sealing member

Claims (5)

Multiple bus bars (2),
A resin sealing body (30) made of resin and sealing the plurality of bus bars,
The individual bus bars are adjacent to each other at a predetermined interval in the thickness direction of the bus bar,
The resin sealing body has a first resin portion (3 _A ) and a second resin portion (3 _B ) in contact with each other, and the first resin portion and the pair of bus bars adjacent to each other A bus bar module (1) in which an interface (4) with the second resin part exists.   The two resin parts (3) of the first resin part and the second resin part have different thermal expansion coefficients, and the resin part having a large thermal expansion coefficient among the two resin parts has a thermal expansion coefficient. The bus bar module according to claim 1, wherein a volume of a portion existing between the pair of bus bars is smaller than that of the small resin portion. It is a power converter device (10) provided with the bus-bar module of Claim 1 or 2, Comprising:
The resin sealing body also serves as the case (30 _C ) of the power converter,
A semiconductor module (5) housed in the case and electrically connected to the pair of bus bars,
A control circuit board (6) housed in the case and controlling the operation of the semiconductor module;
A case sealing member (7) for sealing the semiconductor module and the control circuit board in the case;
The case is formed with a fixing portion (39) for fixing the in-vehicle alternator (11) electrically connected to the semiconductor module at a position closing the opening (38) of the case,
The power converter device comprised so that the interface of the said 1st resin part and the said 2nd resin part may not be exposed in the outer surface of the said case. It is a manufacturing method of the bus-bar module according to claim 1,
One bus bar of the pair of bus bars is accommodated in a primary mold and resin molding is performed, whereby the one bus bar and the first resin part are integrally formed, and the other bus bar is formed on the first resin part. A primary molding step of forming a primary molded body (301) provided with a recess (37) for fixing
A bus bar fixing step of inserting and fixing the other bus bar in the recess;
A secondary molding step of accommodating the primary molded body to which the other bus bar is fixed in a secondary mold and molding the second resin portion;
A method of manufacturing a bus bar module.   The bus bar module manufacturing method according to claim 4, wherein the first resin portion has a larger volume of a portion existing between the pair of bus bars than the second resin portion.

Images