JP2019188716A - Recording device and wiring member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To sufficiently radiate heat at a connecting portion between a recording head and a wiring member. A head unit 25 and a rigid substrate 23 are connected by a COF 22. The COF 22 is bent at a first bent portion 71 connected to the joint portion with the head unit 25 and a second bent portion 72 connected to the joint portion with the rigid substrate 23. Wirings 66 to 68 are arranged on one surface 61a of the base material 61 of the COF 22, and a driver IC 62 is mounted thereon. On the other surface 61b of the base material 61, a metal part 69 which is not electrically connected to any part is arranged. The metal portion 69 is disposed in a portion of the base material 61 between the first bent portion 71 and the second bent portion 72, and overlaps the wirings 66 to 68 and the driver IC 62 in the thickness direction of the base material 61. [Selection diagram] Fig. 7

Description

  The present invention relates to a recording apparatus and a wiring member constituting the recording apparatus.

  As an example of a recording apparatus, Patent Document 1 describes a printer that records an image by ejecting ink from nozzles. In the printer of Patent Document 1, the head unit has a plurality of nozzles. Further, the head unit is provided with a plurality of piezoelectric elements corresponding to a plurality of nozzles for applying pressure to ink in a pressure chamber communicating with the nozzles. In Patent Document 1, a flexible cable is connected to a plurality of piezoelectric elements.

JP-A-2017-222182

  In recent years, ink jet printers such as those described in Patent Document 1 are increasingly used for applications that eject various types of liquids, such as industrial use. At this time, depending on the type of liquid, the viscosity may be high at room temperature and may not be suitable for ejection from a nozzle. In this case, for example, it is conceivable to set a temperature at which the ink in the head unit has a viscosity suitable for ejection by providing a heater for heating the head unit. In the printer of Patent Document 1, when the head unit is heated, heat is also transmitted to the connection portion between the head unit and the flexible cable. At this time, if the heat of the connection portion cannot be sufficiently radiated, the flexible cable may be peeled off from the head unit due to the difference in the linear expansion coefficient between the head unit and the flexible cable.

  Moreover, in patent document 1, there exists a possibility that a flexible cable may peel from a head unit also when the heat which generate | occur | produced in IC mounted on a flexible cable is transmitted to the connection part of a head unit and a flexible cable, for example. .

  An object of the present invention is to provide a recording apparatus and a wiring member that can sufficiently dissipate heat at a connection portion between a recording head and a wiring member.

  The recording apparatus of the present invention includes a recording head and a wiring member connected to the recording head, and the wiring member is disposed on a flexible substrate and one surface of the substrate. A wiring connected to the recording head; and a metal part that is disposed on the other surface of the base material and is not electrically connected to the other part. The base material is bent at the first folding part. The metal portion extends in a direction away from the recording head, and the metal portion is disposed at a portion of the other surface of the base material that is at least farther from the recording head than the first bent portion.

1 is a schematic top view of a printer 1 according to an embodiment of the present invention. 3 is a perspective view of the ink ejection device 3. FIG. 3 is an exploded perspective view of the ink ejection device 3. FIG. It is the IV-IV sectional view taken on the line of FIG. 3 is a plan view of a head unit 25. FIG. FIG. 6 is a sectional view taken along line VI-VI in FIG. 5. (A) is sectional drawing along the length direction of COF22 in the part in which the ground wiring 66 is arrange | positioned, (b) is COF22 in the part in which the individual wiring 67 and the control wiring 68 are arrange | positioned. It is sectional drawing along the length direction. (A) is a figure which shows arrangement | positioning of the wiring in the one surface 61a of the base material 61 of COF22, (b) is a figure which shows arrangement | positioning of the metal part 62 in the other surface 61b of the base material 61 of COF22. is there. (A) is the IXA-IXA sectional view taken on the line of FIG.8 (b), (b) is the IXB-IXB sectional view taken on the line of FIG.8 (b), (c) is FIG.8 (b). FIG. 9D is a cross-sectional view taken along the line IXC-IXC, and FIG. 9D is a cross-sectional view taken along the line IXD-IXD of FIG. (A) is an exploded perspective view of the heat dissipation member 24, and (b) is a plan view of the heat dissipation member 24. It is a figure which shows arrangement | positioning of the metal part 102 in the other surface 61b of the base material 61 of COF101 of the modification 1. FIG. (A) is a cross-sectional view along the length direction of the COF 111 at a portion where the ground wiring 66 is disposed, and (b) is a COF 111 at a portion where the individual wiring 67 and the control wiring 68 are disposed. It is sectional drawing along the length direction. (A) is sectional drawing along the length direction of COF22 in the part in which the ground wiring 66 is arrange | positioned of the modification 3, (b) is individual wiring 67 and control wiring of the modification 3. It is sectional drawing along the length direction of COF22 in the part in which 68 is arrange | positioned. FIG. 6 is a cross-sectional view corresponding to FIG. (A) is sectional drawing along the length direction of COF22 in the part in which the ground wiring 66 is arrange | positioned of the modification 5, (b) is individual wiring 67 and control wiring of the modification 5. It is sectional drawing along the length direction of COF22 in the part in which 68 is arrange | positioned.

  Hereinafter, preferred embodiments of the present invention will be described.

<Schematic configuration of printer>
As shown in FIG. 1, the inkjet printer 1 includes a platen 2, an ink ejection device 3, a cartridge holder 4, and a transport mechanism 5. In the following, the front, rear, left, and right directions shown in FIG. 1 are defined as “front”, “rear”, “left”, and “right” of the printer. Also, the front side of the page is defined as “up”, and the other side of the page is defined as “down”.

  On the upper surface of the platen 2, a recording paper P that is a recording medium is placed. The ink ejection device 3 includes an inkjet head 21 (“recording head” of the present invention). The ink jet head 21 includes four head units 25 that eject ink onto the recording paper P placed on the platen 2. The ink ejection device 3 is configured to be capable of reciprocating in the left-right direction (hereinafter also referred to as the scanning direction) along the two guide rails 11 and 12 in a region facing the platen 2. An endless belt 13 is connected to the ink discharge device 3, and the endless belt 13 is driven by the drive motor 14, so that the ink discharge device 3 moves in the scanning direction. The ink ejection device 3 ejects ink from the nozzles 30 (see FIG. 5) of each head unit 25 toward the recording paper P placed on the platen 2 while moving in the scanning direction. The detailed configuration of the ink ejection device 3 will be described later.

  Four cartridges (black, yellow, cyan, magenta) of ink cartridges 15 are detachably mounted on the cartridge holder 4. The cartridge holder 4 is connected to the ink ejection device 3 by a tube (not shown). The four color inks respectively stored in the four ink cartridges 15 of the cartridge holder 4 are supplied to the ink ejection device 3 through the tubes.

  The transport mechanism 5 includes two transport rollers 16 and 17 arranged so as to sandwich the platen 2 in the front-rear direction. The two transport rollers 16 and 17 are driven in synchronization with each other by a transport motor (not shown). The transport mechanism 5 transports the recording paper P placed on the platen 2 forward (hereinafter also referred to as a transport direction) by two transport rollers 16 and 17.

<Ink ejection device>
Next, the detailed configuration of the ink ejection device 3 will be described. As shown in FIGS. 2 to 6, the ink ejection device 3 includes a head holder 20 (the “flow path member” of the present invention), an inkjet head 21 having four head units 25, and four COFs 22 (the present invention). 2), a rigid substrate 23, and a heat radiating member 24.

<Head holder 20>
The head holder 20 is a member having a rectangular planar shape that is long in the scanning direction. The head holder 20 is connected to an endless belt 13 (see FIG. 1) driven by the drive motor 14 and is movable along the guide rails 11 and 12 in the scanning direction. As shown in FIG. 4, a concave unit accommodating portion 20a is formed in the lower portion of the head holder 20, and the four head units 25 of the inkjet head 21 are accommodated in the unit accommodating portion 20a. A concave substrate housing portion 20b is formed in the upper portion of the head holder 20, and a rigid substrate 23 and a heat dissipation member 24 are housed in the substrate housing portion 20b.

  As shown in FIGS. 3 and 4, in the substrate holder 20b of the head holder 20, there are eight cylindrical channel portions 27 (mainly extending from the bottom surface of the substrate holder 20b and having ink channels formed therein. The “liquid channel” of the invention is provided. The eight cylindrical flow path portions 27 respectively correspond to the eight nozzle rows 31 of the four head units 25 of the inkjet head 21 described later.

  As shown in FIG. 4, a flow path member 81 is disposed above the ink ejection device 3. In the flow path member 81, ink flow paths (not shown) connected to the eight cylindrical flow path portions 27 are formed. The flow path member 81 is connected to the cartridge holder 4 (see FIG. 1) via a tube or the like (not shown). The eight cylindrical flow path portions 27 are respectively stored in the four ink cartridges 15 of the cartridge holder 4. Four colors of ink are supplied. One color ink from one ink cartridge 15 is supplied to two cylindrical flow path portions 27. In addition, a heater 82 (“heating section” of the present invention) is disposed on the upper surface of the flow path member 81. The heater 82 heats the ink flowing in the flow path member 81. The heater 82 may be disposed at another position as long as it can heat the ink. The temperature of the heater 82 is set to, for example, about 40 to 60 ° C. according to the viscosity of the ink at normal temperature and the desired viscosity of the ink at the time of ejection.

  Although not shown in FIG. 4, ink flow paths that connect the eight cylindrical flow path portions 27 and the four head units 25 are formed in the head holder 20. As shown in FIGS. 3 and 4, the head holder 20 is also formed with four passage holes 20c through which the four COFs 22 corresponding to the four head units 25 pass.

<Inkjet head 21>
As shown in FIGS. 3 and 4, the inkjet head 21 includes four head units 25 and a unit holding plate 26 that holds the four head units 25. The four head units 25 are accommodated in the unit accommodating portion 20a of the head holder 20 in a state of being arranged at intervals in the scanning direction.

  As shown in FIGS. 5 and 6, each head unit 25 includes a plurality of nozzles 30 arranged on the lower surface thereof. The area where the ejection ports of the plurality of nozzles 30 are formed on the lower surface of the head unit 25 is hereinafter referred to as an ink ejection surface 25a. The plurality of nozzles 30 on the ink ejection surface 25a constitutes two nozzle rows 31 arranged in the transport direction and arranged in the scanning direction.

  Since one head unit 25 has two nozzle rows 31, the inkjet head 21 has a total of eight nozzle rows 31. The eight nozzle rows 31 and the eight cylindrical flow path portions 27 of the head holder 20 correspond to each other, and each nozzle row 31 has one of four color inks from the corresponding cylindrical flow passage portion 27. Is supplied. That is, the ink of one color supplied from one ink cartridge 15 (see FIG. 1) to the ink ejection device 3 passes through the two cylindrical flow path portions 27 and the two nozzles in the eight nozzle rows 31. Supplied to column 31. It should be noted that the color of each of the eight nozzle rows 31 that is ejected is not limited to a specific combination, and can be selected as appropriate. For example, the two nozzle rows 31 of one head unit 25 may be nozzle rows 31 that discharge the same color. Alternatively, four types of nozzle rows 31 that respectively eject four colors of ink may be arranged symmetrically in the scanning direction. For example, four types of nozzle rows 31 may be arranged in the order of black, magenta, cyan, and yellow from the center in the scanning direction toward the left and right sides.

  As shown in FIGS. 3 and 4, the unit holding plate 26 has four openings 26 a that expose the ink discharge surfaces 25 a of the four head units 25. The unit holding plate 26 is disposed below the head holder 20 with a spacer 49 interposed therebetween so as to cover the four head units 25 from below. However, the ink discharge surface 25 a of each head unit 25 is exposed from the opening 26 a of the unit holding plate 26.

<Head unit 25>
Next, the structure of the head unit 25 will be specifically described. As shown in FIG. 5, the head unit 25 has an outer shape that is long in the transport direction and has a substantially rectangular shape in plan view. As shown in FIG. 6, the head unit 25 includes a holder member 32 and a head main body portion 33 held by the holder member 32. Two ink supply channels 34 are formed in the holder member 32. These two ink supply channels 34 are connected to the two cylindrical channel portions 27 via ink channels (not shown) formed in the head holder 20.

  The head main body 33 includes a first flow path substrate 36, a second flow path substrate 37, a nozzle plate 38, a plurality of piezoelectric elements 39, a protection member 40, and the like.

  A plurality of pressure chambers 41 are formed in the first flow path substrate 36. The plurality of pressure chambers 41 are arranged in the transport direction corresponding to the plurality of nozzles 30 and constitute two pressure chamber rows arranged in the scanning direction. Further, the first flow path substrate 36 includes a vibration film 45 that covers the plurality of pressure chambers 41.

  The second flow path substrate 37 is bonded to the lower surface of the first flow path substrate 36. The second flow path substrate 37 is formed with two manifolds 42 communicating with the two ink supply flow paths 34 of the holder member 32. The ink supplied from the ink cartridge 15 (see FIG. 1) to the cylindrical flow path portion 27 via the flow path member 81 is supplied to the manifold 42 via the ink supply flow path 34 of the holder member 32.

  The two manifolds 42 respectively extend in the transport direction (in the direction perpendicular to the plane of FIG. 6) in the region overlapping the plurality of pressure chambers 41 of the first flow path substrate 36. The lower end of each manifold 42 is covered with a synthetic resin film 46. A unit holding plate 26 that holds the head unit 25 with a spacer 49 interposed therebetween is disposed below the film 46. Thereby, a damper chamber 48 is formed between the film 46 and the unit holding plate 26, and the film 46 can be deformed. And the deformation | transformation of the film 46 suppresses the pressure fluctuation of the manifold 42.

  The second flow path substrate 37 is formed with a plurality of communication holes 43 that allow the manifold 42 and the plurality of pressure chambers 41 to communicate with each other. Further, the second flow path substrate 37 is also formed with a plurality of communication holes 44 for communicating the plurality of pressure chambers 41 with the plurality of nozzles 30 formed in the nozzle plate 38 described below.

  The nozzle plate 38 is bonded to the lower surface of the second flow path substrate 37. A plurality of nozzles 30 arranged in the transport direction are formed on the nozzle plate 38. As described above, the plurality of nozzles 30 constitute two nozzle rows 31. Each nozzle 30 communicates with the pressure chamber 41 of the first flow path substrate 36 through a communication hole 44 formed in the second flow path substrate 37.

  The plurality of piezoelectric elements 39 are disposed on the upper surface of the vibration film 45 parallel to the ink discharge surface 25a. The plurality of piezoelectric elements 39 are arranged in the transport direction corresponding to the plurality of pressure chambers 41, respectively, and constitute two rows of piezoelectric elements arranged in the scanning direction. The piezoelectric element 39 vibrates the vibration film 45 using piezoelectric strain when the applied voltage changes, and applies ejection energy for ejecting from the nozzle 30 to the ink in the pressure chamber 41. A drive wiring 47 for applying a predetermined drive voltage to the piezoelectric element 39 is connected to each piezoelectric element 39. The drive wiring 47 is led out from each piezoelectric element 39 to the inside in the scanning direction. A drive contact 47 a to which the COF 22 described below is connected is provided at the end of each drive wiring 47 opposite to the piezoelectric element 39. The drive contacts 47a of the plurality of drive wires 47 are arranged in a region between the two piezoelectric element rows on the upper surface of the vibration film 45 of the first flow path substrate 36. In the present embodiment, each piezoelectric element 39, the pressure chamber 41 corresponding to the piezoelectric element 39, the nozzle 30, the ink flow path connecting them, and the portion of the vibration film 45 covering the upper surface of the pressure chamber Is a combination of the above and "recording element" of the present invention.

  On the upper surface of the vibration film 45 of the first flow path substrate 36, two protective members 40 that respectively cover the two piezoelectric element arrays are disposed. The protection member 40 is provided for the purpose of blocking the piezoelectric element 39 from the outside air and preventing it from coming into contact with moisture.

<Rigid substrate 23>
As shown in FIGS. 2 to 4, the rigid substrate 23 is disposed above the four head units 25 with the head holder 20 interposed therebetween, and is accommodated in the substrate accommodating portion 20 b of the head holder 20. The rigid substrate 23 is disposed so as to overlap the four head units 25 in the vertical direction. As shown in FIGS. 2 to 4, connectors 53 (53 a and 53 b) are provided on the upper surfaces of the left end portion and the right end portion of the rigid board 23, respectively. In addition, an insertion port 20d into which an FFC (not shown) for connecting the rigid board 23 and a control device (not shown) is inserted is formed in the left wall portion and the right wall portion of the head holder 20, respectively. The connector 53 may be provided on the lower surface of the rigid board 23, or may be provided on both the upper surface and the lower surface. In the rigid substrate 23, four through holes 50a to 50d through which the four COFs 22 extending from the lower four head units 25 pass are formed side by side in the scanning direction. The rigid substrate 23 is also formed with eight channel holes 51a to 51h through which the eight cylindrical channel parts 27 of the head holder 20 pass. In the present embodiment, as shown in FIG. 3, among the eight channel holes 51 a to 51 h, the six channel holes 51 b to 51 g are connected to the through hole 50, but the through hole 50 and the channel The holes 51 may not be connected but may be provided independently of each other.

  As shown in FIG. 4, four connection terminals 52 are provided in the vicinity of the edge portions of the four through holes 50 a to 50 d on the upper surface of the rigid substrate 23. More specifically, the connection terminals 52 are provided on the left side (connector 53a side) of the two through holes 50a and 50b located on the left side. Further, the connection terminals 52 are provided on the right side (connector 53b side) of the two through holes 50c and 50d located on the right side. The two left connection terminals 52 are connected to the left connector 53a through wiring and circuit elements (not shown) arranged on the rigid board 23. Similarly, the two right connection terminals 52 are connected to the right connector 53b via wiring and circuit elements (not shown) arranged on the rigid board 23. Each COF 22 extends through the corresponding through hole 50 and is connected to a connection terminal 52 provided on the upper surface of the rigid substrate 23.

<COF>
Next, the COF 22 will be described in detail. As shown in FIG. 4, each head unit 25 and the rigid substrate 23 are electrically connected by a COF (Chip On Film) 22. In each head unit 25, the COF 22 has one end in the length direction of the COF 22 disposed between the two left and right piezoelectric element arrays, and is bonded to a portion of the head unit 25 where the plurality of drive contacts 47a are disposed. Yes. As shown in FIGS. 3 and 4, the four COFs 22 are arranged in the scanning direction from the four head units 25, respectively, through holes 20 c of the head holder 20 and through holes to be described later of the heat radiating member 24. 94 and the through holes 50 a to 50 d of the rigid substrate 23 and extend upward to the upper surface of the rigid substrate 23. The other end of the COF 22 in the length direction is joined to the portion of the rigid board 23 where the connection terminals 52 are disposed.

  As shown in FIGS. 7 to 9, the COF 22 includes a substrate 61, a driver IC 62, two ground wirings 66, a plurality of individual wirings 67, a plurality of control wirings 68, and a metal part 69. ing. The substrate 61 is a flexible film-like member made of a synthetic resin material such as polyimide. The base member 61 has one surface 61 a bonded to a portion of the upper surface of the head unit 25 where the conduction contact 47 a is disposed at one end in the length direction. In addition, the base material 61 is bent at the first bent portion 71 in the vicinity of the joint portion with the head unit 25, and as described above, the passage hole 20c of the head holder 20, the through hole 94 described later of the heat dissipation member 24, The through hole 50 a to 50 d of the rigid substrate 23 extends upward from the rigid substrate 23. Further, the base material 61 is bent at a second bent portion 72 above the rigid substrate 23. The base 61 has one surface 61 a bonded to the portion of the upper surface of the rigid substrate 23 where the connection terminals 52 are disposed at the other end in the length direction.

  The driver IC 62 is mounted on a portion of the one surface 61a of the base member 61 that extends in the vertical direction. The two ground wirings 66 are made of a conductive material such as Cu, and are arranged on one surface 61 a of the substrate 61. The two ground wirings 66 are disposed at both ends in the width direction (conveying direction) of the base material 61 and extend along the length direction of the base material 61 over the entire length of the base material 61.

  The plurality of individual wirings 67 are individual wirings for the plurality of piezoelectric elements 39. The plurality of individual wirings 67 are made of a conductive material such as Cu, and are arranged on one surface 61 a of the substrate 61. The plurality of individual wirings 67 are located between the two ground wirings 66 in the width direction of the substrate 61. Each of the plurality of individual wires 67 extends in the length direction of the base material 61 over a portion between the joint portion with the head unit 25 and the portion on which the driver IC 62 is mounted, and is spaced in the width direction of the base material 61. Are lined up.

  The plurality of control wirings 68 are made of a conductive material such as Cu, and are disposed on one surface 61 a of the substrate 61. The plurality of control wirings 68 are located between the two ground wirings 66 in the width direction of the base material 61 of the base material 61. Each of the plurality of control wires 68 extends in a length direction of the base member 61 over a portion between the portion where the driver IC 62 is mounted and the joint portion with the rigid substrate 23, and extends in the width direction of the base member 61. They are lined up at intervals.

  And as above-mentioned, by arrange | positioning the some wiring 66-68 on the base material 61, it arrange | positions among the ground wiring 66 and the individual wiring 67 in the junction part with the head unit 25 of the base material 61. FIG. These parts are electrically connected to the head unit 25. In addition, the portion of the ground wiring 66 and the control wiring 68 that is disposed at the joint portion of the base 61 with the rigid substrate 23 is electrically connected to the rigid substrate 23.

  As a result, a signal for controlling the driver IC 62 can be transmitted from the rigid board 23 to the driver IC 62 via the plurality of control wirings 68. In addition, a drive signal can be individually transmitted from the driver IC 62 to the plurality of piezoelectric elements 39 of the head unit 25 via the plurality of individual wirings 67 to change the voltage applied to the piezoelectric elements 39. The ground wiring 66 is connected to a ground terminal of a power source (not shown) through the rigid substrate 23.

  A solder resist 76 that covers the two ground wirings 66, the plurality of individual wirings 67, and the plurality of control wirings 68 is disposed on one surface 61 a of the base material 61. However, portions of the ground wiring 66 and the individual wiring 67 that are connected to the piezoelectric element 39 and a portion of the control wiring 68 that is connected to the rigid substrate 23 are not covered with the solder resist 76 and are exposed. is doing.

  As shown in FIGS. 7 to 9, the metal part 69 is made of the same metal material as the wirings 66 to 68 or a metal material having a higher thermal conductivity than the wirings 66 to 68 such as Ag and Au. The metal part 69 is disposed on the other surface 61 b of the base 61 opposite to the one surface 61 a. The metal portion 69 extends over substantially the entire length of the base material 61 in the width direction of the base material 61. The metal portion 69 extends between the first bent portion 71 and the second bent portion 72 in the length direction of the base member 61. As a result, the metal portion 69 overlaps the portion of the wirings 66 to 68 positioned between the first bent portion 71 and the second bent portion 72, the driver IC 62, and the base material 61 in the thickness direction.

  Here, the metal part 69 is not electrically connected to other parts. Here, the other parts are parts such as the wirings 66 to 68 and the driver IC 62 where electric signals related to driving the head unit 25 are transmitted. Further, the metal part 69 is not covered with the solder resist and is exposed.

<Heat dissipation member 24>
As shown in FIGS. 3 and 4, the heat radiating member 24 is accommodated in the substrate accommodating portion 20 b and is located below the rigid substrate 23. As shown in FIGS. 3, 4, and 10, the heat dissipation member 24 is a substantially rectangular parallelepiped member made of a metal material, a synthetic resin material, or the like. A circulation channel 91 through which a coolant such as water circulates is formed inside the heat dissipation member 24. In addition, an inflow channel 92 and an outflow channel 93 that communicate with the circulation channel 91 are provided at the front end of the heat radiating member 24.

  The inflow channel 92 is connected to the pump 98 via a tube (not shown). The pump 98 is connected to a coolant tank 99 in which coolant is stored via a tube (not shown). The outflow channel 93 is connected to the coolant tank 99 through a tube (not shown). When the pump 98 is driven, the coolant in the coolant tank 99 flows from the inflow channel 92 into the circulation channel 91, and the coolant in the circulation channel 91 flows from the outflow channel 93 to the coolant tank 99. To leak. Thereby, the coolant in the circulation channel 91 circulates.

  In addition, as shown in FIGS. 3, 4, and 10, the heat dissipation member 24 is formed with four through holes 94 through which the four COFs 22 penetrate. An inner wall surface of the through hole 94 is defined by a partition wall 96, and the circulation channel 91 and the through hole 94 are separated by the partition wall 96. In the through hole 94, a portion of the COF 22 located between the driver IC 62 and the second bent portion 72 is disposed, and both sides in the thickness direction of the portion located in the through hole 94 of the COF 22 are separated from each other by a partition wall. 96 is in contact. Further, as shown in FIG. 7, in order to improve the adhesion between the COF 22 and the partition wall 96, a heat conductive grease 86 is interposed therebetween. However, the COF 22 and the partition wall 96 may be in direct contact with each other without using the heat conductive grease 86. Note that the heat dissipation member 24 is not in contact with the driver IC 62.

  As shown in FIGS. 3, 4, and 10, the heat radiating member 24 is formed with eight through holes 95 through which the eight cylindrical flow passage portions 27 penetrate. An inner wall surface of the through hole 95 is defined by a cylindrical partition wall 97, and the circulation channel 91 and the through hole 95 are separated by the partition wall 97. Further, as shown in FIG. 4, a heat insulating material 85 such as a sponge is interposed between the cylindrical flow path portion 27 and the partition wall 97.

  As shown in FIGS. 3, 4, and 10, the heat radiating member 24 is formed by superimposing an upper member 24 a and a lower member 24 b vertically. As shown in FIG. 10A, the upper member 24 a includes an upper part of the circulation channel 91, an upper part of the inflow channel 92, an upper part of the outflow channel 93, and an opening above the through hole 94. A portion 94a, an opening 95a above the through hole 95, and the like are formed. The lower member 24b includes a lower part of the circulation channel 91, a lower part of the inflow channel 92, a lower part of the outflow channel 93, a partition wall 96 defining an inner wall surface of the through hole 94, and a through hole. A partition wall 97 or the like that defines the inner wall surface of the hole 95 is formed.

<Effect>
Here, in this embodiment, the ink is heated by the heater 82, but the heat generated by the heater 82 is also applied to the joint portion between the COF 22 and the head unit 25 and the joint portion between the COF 22 and the rigid substrate 23. Communicated. Further, when the head unit 25 is driven, the driver IC 62 generates heat, but the heat generated by the driver IC 62 is also transmitted to the bonding portion between the COF 22 and the head unit 25 and the bonding portion between the COF 22 and the rigid substrate 23. When heat is transferred to the joint portion between the COF 22 and the head unit 25, stress is generated at the joint portion between the COF 22 and the head unit 25 due to the difference in the linear expansion coefficient between the COF 22 and the head unit 25, and the COF 22 is peeled off from the head unit 25. There is a risk that. When heat is transferred to the bonding portion between the COF 22 and the rigid substrate 23, stress is generated at the bonding portion between the COF 22 and the rigid substrate 23 due to the difference in the coefficient of linear expansion between the COF 22 and the rigid substrate 23, and the COF 22 is peeled off from the rigid substrate 23. There is a risk that. For example, the linear expansion coefficient of the COF 22 is about 5 ppm / ° C., whereas the linear expansion coefficient of silicon constituting the head unit 25 is about 3.4 ppm / ° C., and the linear expansion coefficient of the rigid substrate is 10 to 15 ppm. / ° C or so.

  Therefore, in the present embodiment, in the COF 22 in which the wirings 66 to 68 are disposed on the one surface 61 a of the base material 61, the metal portion 69 is disposed on the other surface 61 b of the base material 61. Thereby, heat is easily radiated from the COF 22 through the metal portion 69. In the present embodiment, the COF 22 is bent at the first bending portion 71 and extends in a direction away from the head. Therefore, the portion of the COF 22 that is farther from the head unit 25 than the first bent portion 71 faces a relatively large space. Therefore, by providing the metal portion 69 in a portion of the base member 61 that is farther from the head unit 25 than the first bent portion 71, the metal portion 69 faces a relatively wide space, and the heat dissipation effect by the metal portion 69 is achieved. Can be high.

  Further, since the piezoelectric element 39 also generates heat when the head unit 25 is driven, the temperature around the head unit 25 becomes high. Further, a portion of the COF 52 that is closer to the head unit 25 than the first bent portion 71 has a short distance from the head unit 25. For these reasons, unlike the present embodiment, even if the metal part 69 is provided only in the COF 52 at a part closer to the head unit 25 than the first bent part 71, a sufficient heat dissipation effect by the metal part 69 cannot be obtained. . On the other hand, in the present embodiment, as described above, the metal portion 69 is provided in a portion relatively distant from the head unit 25 of the COF 22. Thereby, the temperature of the air around the metal part 69 is low, and the heat dissipation effect by the metal part 69 can be enhanced.

  In the present embodiment, the metal part 69 overlaps the driver IC 62 and the base material 61 in the thickness direction. Thereby, the heat generated in the driver IC 62 can be effectively radiated through the metal portion 69. As a result, the heat generated by the driver IC 62 becomes difficult to be transmitted to the joint portion between the COF 22, the head unit 25, and the rigid substrate 23.

  Further, the heat generated in the driver IC 62 is mainly transmitted to the joint portion between the head unit 25 and the rigid substrate 23 of the COF 22 via the wirings 66 to 68. On the other hand, in the present embodiment, the metal portion 69 overlaps the wirings 66 to 68 and the thickness direction of the base material 61. Thereby, the heat of the wirings 66 to 68 can be effectively radiated through the metal part 69.

  Moreover, in this embodiment, the area of the metal part 69 becomes large because the metal part 69 extends over the entire length in the width direction of the base material 61. Thereby, the heat of the COF 22 can be effectively radiated through the metal part 69.

  Here, considering the fact that the area of the metal part 69 is increased and the heat of the COF 22 is effectively radiated through the metal part 69, the metal part 69 is spread over the entire area of the base material 61 in the length direction. It may be extended. However, if the metal part 69 extends to the first bent part 71, the COF 22 becomes stiff due to an increase in thickness at the first bent part 71, and the COF 22 becomes difficult to be bent at the first bent part 71. Similarly, when the metal portion 69 extends to the second bent portion 72, the COF 22 becomes rigid as the thickness increases at the second bent portion 72, and the COF 22 becomes difficult to be bent at the second bent portion 72.

  Therefore, in the present embodiment, the metal portion 69 is disposed in a portion between the first bent portion 71 and the second bent portion 72 of the base material 61, and the first bent portion 71 and the second bent portion 72 have a metal portion. 69 is not arranged. As a result, the COF 22 can be easily bent at the first bent portion 71 and the second bent portion 72 by reducing the thickness of the first bent portion 71 and the second bent portion 72, thereby reducing the rigidity. .

  Further, in the present embodiment, in order to prevent a short circuit between the wirings, the solder resist 76 covering the wirings 66 to 68 is disposed on one surface 61a of the base 61, while The non-conducting metal part 69 is exposed without being covered with a solder resist. Thereby, the heat from the metal part 69 is not hindered by the solder resist, and the heat of the COF 22 can be effectively radiated through the metal part 69.

  In the present embodiment, the metal part 69 is made of the same material as the wirings 66 to 68 or made of a material having a higher thermal conductivity than the wirings 66 to 68. When the metal part 69 is made of the same material as the wirings 66 to 68, the manufacturing of the heat dissipation member 24 is simplified. On the other hand, when the metal part 69 is made of a material having a higher thermal conductivity than the wirings 66 to 68, the heat of the COF 22 can be radiated more effectively through the metal part 69.

  Moreover, in this embodiment, the heat radiating member 24 is contacting the part by which the metal part 69 of COF22 is arrange | positioned. Thereby, the heat of the metal part 69 is radiated through the heat radiating member 24, and the heat radiating effect can be further enhanced.

  In the present embodiment, the circulation channel 91 is formed inside the heat dissipation member 24, and the coolant circulates in the circulation channel 91. Thereby, the heat transmitted from the metal part 69 to the heat radiating member 24 is efficiently radiated.

  In the present embodiment, the heat radiating member 24 is in contact with a portion above the driver IC 62 (a portion away from the head unit 25) in the portion where the metal portion 69 of the COF 22 is disposed. The portion of the COF 22 above the driver IC 62 is somewhat away from the head unit 25 and has a relatively large space around it. Therefore, when the heat dissipating member 24 is disposed so as to come into contact with a portion above the driver IC 62 among the portions where the metal portion 69 of the COF 22 is disposed, it is easy to secure a space for disposing the heat dissipating member 24.

  In the present embodiment, both surfaces in the thickness direction of the portion located in the through hole 94 of the COF 22 are in contact with the partition wall 96 of the heat dissipation member 24. Thereby, in addition to the heat radiated from the metal part 69 to the heat radiating member 24, the heat is also radiated from the wires 66 and 68 to the heat radiating member 24. Therefore, the heat of the COF 22 can be effectively radiated to the heat radiating member 24.

  Further, in the COF 22, heat is easily transmitted through the wirings 66 to 68. Therefore, heat from the wirings 66 to 68 is easily transmitted to a portion of the metal portion 69 that overlaps the thickness direction of the wirings 66 to 68 and the base material 61. . On the other hand, in this embodiment, the heat radiating member 24 is in contact with the portion where the wirings 66 and 68 of the COF 22 are disposed. Thereby, the thermal radiation effect by the thermal radiation member 24 can be made high.

  The COF 22 is bonded to the head unit 25 and the rigid substrate 23 with the central portion in the width direction as a base point. Therefore, due to the difference in the linear expansion coefficient as described above, the stress generated at the joint portion between the COF 22, the head unit 25, and the rigid substrate 23 is smaller at the center portion in the width direction and larger at the outer portion in the width direction. Therefore, the COF 22 is more easily peeled off from the head unit 25 and the rigid substrate 23 at both ends in the width direction of the base material 61 than at the inner portion. On the other hand, in this embodiment, in the width direction of the base material 61, the heat radiating member 24 extends over the entire length including both ends of the COF 22, and is in contact with the COF 22. This makes it difficult for the COF 22 to peel off from the head unit 25 and the rigid substrate 23 at all portions including both ends in the width direction where the COF 22 easily peels off.

  In the present embodiment, the ink heated by the heater 82 is supplied to the head unit 25 through the cylindrical flow path portion 27, whereas the cylindrical flow path portion 27 is a through hole of the heat dissipation member 24. 95 extends through. At this time, for example, when the cylindrical flow path portion 27 and the heat dissipation member 24 (partition wall 96) are in contact, heat is easily transferred between the cylindrical flow path portion 27 and the heat dissipation member 24. The heat of the ink that is heated by the heater 82 and flows through the cylindrical flow path portion 27 is radiated through the heat radiating member 24, and the efficiency of heating the ink is deteriorated.

  Therefore, in this embodiment, the heat insulating material 85 is interposed between the cylindrical flow path portion 27 and the partition wall 96 that defines the through hole 94 of the heat radiating member 24. Thereby, it is possible to make it difficult for heat to be transmitted between the cylindrical flow path portion 27 and the heat dissipation member 24.

  Unlike the present embodiment, when the heat dissipation member 24 is in contact with the driver IC 62, the heat of the driver IC 62 is mainly transmitted to the heat dissipation member 24, and the temperature of the heat dissipation member 24 becomes high. As a result, the heat transmitted from the wirings 66 to 68 and the like to the metal part 69 is not easily transmitted from the metal part 69 to the heat dissipation member 24. Therefore, in the present embodiment, the heat dissipation member 24 is disposed so as not to contact the driver IC 62. Thereby, heat can be easily transmitted from the metal part 69 to the heat dissipation member 24.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made as long as they are described in the claims.

  In the above-described embodiment, the wirings 66 to 68 are covered with the solder resist 76, whereas the metal part 69 is not covered with the solder resist. However, for example, for the purpose of preventing corrosion, the metal part 69 is not covered with the solder resist. It may be covered with a solder resist.

  Further, in the above-described embodiment, the metal portion 69 is disposed only in the portion between the first bent portion 71 and the second bent portion 72 of the base material 61, but is not limited thereto.

  In the first modification, as shown in FIG. 11, in the COF 101, the metal portion 102 extends over the entire length in the length direction of the other surface 61 b of the base material 61. In addition, a slit 103 extending over the entire length in the width direction of the base member 61 is formed in a portion of the metal portion 102 located on the first bent portion 71. In addition, a slit 104 extending over the entire length in the width direction of the substrate 61 is formed in a portion of the metal portion 102 located on the second bent portion 72.

  The metal part 102 has a larger area than the metal part 69 of the above-described embodiment, and the heat dissipation effect becomes higher. Here, as described above, when the metal portion is disposed in the first bent portion 71 and the second bent portion 72, the rigidity of the COF in the first bent portion 71 and the second bent portion 72 is increased, and the COF is reduced. It becomes difficult to bend at the first bent portion 71 and the second bent portion. However, in the first modification, slits 103 and 104 are formed in portions of the metal portion 102 located above the first bent portion 71 and the second bent portion 72, respectively. Thereby, in the COF 101, the rigidity of the first bent portion 71 and the second bent portion 72 is not increased, and the COF 101 is easily bent at the first bent portion 71 and the second bent portion 72.

  In Modification 1, slits 103 and 104 are formed in the first bent portion 71 and the second bent portion 72 so as to extend over substantially the entire length in the width direction of the base material 61, respectively. In the direction, the portions located on both sides of the slits 103 and 104 of the metal portion 102 are connected to each other via both end portions in the width direction of the base material 61, but this is not restrictive. For example, a plurality of slits extending in the length direction of the base material 61 and arranged in the width direction of the base material 61 may be formed in the first bent portion 71 and the second bent portion 72.

  In this case, although the rigidity of the first bent portion 71 and the second bent portion 72 is slightly increased as compared with the case of the modified example 1, the first bent portion 71 and the second bent portion 71 and the second bent portion 72 are compared with the case where there is no slit. The rigidity of the second bent portion 72 is reduced. Therefore, it is easy to bend the COF at the first bent portion 71 and the second bent portion 72.

  In this case, in the length direction of the base material 61, portions located on both sides of the slit of the metal portion 102 are connected at a plurality of locations in the width direction of the base material 61. Therefore, heat can be more easily transferred between the portions located on both sides of the slit of the metal portion 102 in the length direction of the base member 61 than in the case of the first modification.

  Further, when a plurality of slits are formed in the first bent portion 71 and the second bent portion 72, each of the slits extends in the width direction of the base material 61 and forms a plurality of slits arranged in the length direction of the base material 61. May be.

  In the first modification, the metal part 102 extends to the first bent part 71 and the second bent part 72, but the present invention is not limited to this. For example, the metal portion is disposed only in a portion of the other surface 61 b of the base 61 that is closer to the head unit 25 than the second bent portion 72, and is slit in a portion located on the first bent portion 71 of the metal portion. A slit similar to 103 may be formed. Alternatively, the metal portion is disposed only in a portion of the other surface 61b of the base member 61 that is farther from the head unit 25 than the first bent portion 71 and is located on the second bent portion 72 of the metal portion. A slit similar to the slit 104 may be formed.

  In the first modification, the metal portion 102 extends to the first bent portion 71 and the second bent portion 72, whereas the metal portion 102 is positioned on the first bent portion 71 and the second bent portion 72 of the metal portion 102. The slits 103 and 104 are formed in the portions to be performed, but the present invention is not limited to this. Only one of the slits 103 and 104 may be formed in the metal portion 102. Furthermore, the slit does not need to be formed in the part located on the 1st bending part 71 and the 2nd bending part 72 of the metal part 102. FIG.

  In the above-described embodiment, the metal portion 69 extends in the length direction of the base material 61 over the portion between the first bent portion 71 and the second bent portion 72 of the base material 61, and the base material 61. The metal part 69 overlaps in the thickness direction of the base material 61 with both the driver IC 62 and the wirings 66 to 68 by extending over the entire length in the width direction, but is not limited thereto. The metal part may be disposed only in a part of the part of the base member 61 where the metal part 69 is disposed in the above-described embodiment. At this time, the metal portion may not overlap the thickness direction of the driver IC 62 and the base material 61, and at least a part of the wirings 66 to 68 may not overlap the thickness direction of the base material 61. Good. In this case, one continuous metal portion is not limited to being disposed, and a plurality of metal portions separated from each other may be disposed.

  In the above-described embodiment, the metal part 69 is made of the same material as the wirings 66 to 68 or a material having a higher thermal conductivity than the wirings 66 to 68, but is not limited thereto. The metal part 69 may be made of a material having a lower thermal conductivity than the wirings 66 to 68. Even in this case, the heat of the COF is easily radiated as compared with the case where the metal part 69 is not provided.

  Moreover, in the above-mentioned embodiment, although the surface on the opposite side to the base material 61 of the metal part 69 was a plane, it is not restricted to this. For example, in Modification 2, as shown in FIGS. 12A and 12B, a plurality of protrusions 113 are formed on the surface of the COF 111 opposite to the base 61 of the metal portion 112. The thickness of the protrusion 113 is, for example, about 2 to 3 times the thickness of the portion of the metal portion 112 where the protrusion 113 is not formed. In this case, the surface area of the metal portion 112 is increased by the provision of the plurality of protrusions 113, and the heat dissipation effect by the metal portion 112 is higher.

  Further, in the above-described embodiment, the partition wall 96 of the heat dissipation member 24 is in contact with a portion of the COF 22 that is positioned between the driver IC 62 and the second bent portion 72, but is not limited thereto. For example, in the modification 3, as shown to Fig.13 (a), (b), the thermal radiation member 24 is arrange | positioned below rather than the above-mentioned embodiment. Of the portion where the metal portion 69 of the COF 22 is disposed in the through hole 94 of the heat radiating member 24, the portion located between the first bent portion 71 and the driver IC 62 (closer to the head unit 25 than the driver IC 62). The two portions in the thickness direction of the portion located in the through hole 94 of the COF 22 are in contact with the partition wall 96. Also in the third modification, the thermally conductive grease 86 is interposed between the COF 22 and the partition wall 96. Thereby, in the modification 3, the heat radiating member 24 is contacting the part of the COF 22 where the plurality of individual wirings 67 are arranged. In the third modification, the heat radiating member 24 is not in contact with the driver IC 62.

  In Modification 3, since the heat dissipation member 24 is in contact with the COF 22 at a position closer to the head unit 25 than the driver IC 62, the heat generated by the driver IC 62 is not transmitted to the joint portion between the COF 22 and the head unit 25. In addition, heat is dissipated through both the metal part 69 and the heat dissipating member 24. Thereby, it is possible to reliably prevent heat from being transferred to the joint portion between the COF 22 and the head unit 25.

  In the above-described embodiment and Modification 3, the heat dissipation member 24 is disposed so as not to contact the driver IC 62. However, the heat dissipation member 24 may be disposed so as to contact the driver IC 62.

  In the above-described embodiment, the partition walls 96 of the heat dissipation member 24 are in contact with both surfaces in the thickness direction of the COF 22, but the partition walls 96 of the heat dissipation member 24 may be in contact with only one surface of the COF 22. For example, the partition wall 96 of the heat radiating member 24 is in contact with the surface of the COF 22 on which the metal portion 69 is disposed (the other surface 61b of the base member 61), and on the opposite side from where the metal portion 69 is disposed. The surface (one surface 61a of the base material 61) may not be in contact.

  Further, in the above-described embodiment, in the thickness direction of the base material 61, the heat dissipation member 24 is in contact with a portion of the COF 22 where the wirings 66 and 68 are disposed. In Modification 3, in the thickness direction of the base material 61, Although the heat radiating member 24 is in contact with the portion of the COF 22 where the wirings 66 and 67 are disposed, the present invention is not limited to this. The heat radiating member may be in contact only with a portion of the COF where none of the wirings 66 to 68 is disposed.

  Further, in the above-described embodiment, the heat radiating member 24 extends over the entire length in the width direction of the base material 61 and is in contact with the portion including both ends of the COF 22 in the width direction of the base material 61. I can't. The heat dissipating member 24 may be in contact with only both ends of the COF 22 in the width direction of the base member 61, and may not be in contact with portions inside the both ends of the COF 22. Alternatively, the heat dissipating member 24 may be in contact with only the inner portion of both ends of the COF 22 in the width direction of the base member 61. Here, in these cases, the portion inside the both ends of the COF 22 in the width direction of the substrate 61 is, for example, a portion inside the ground wiring 66.

  Further, in the above-described embodiment, the heat insulating material 85 is interposed between the tubular flow path portion 27 and the partition wall 96 of the heat dissipation member 24, but the present invention is not limited to this. For example, as illustrated in FIG. 14, the ink ejection device 121 of Modification 4 is obtained by removing the heat insulating material 85 (see FIG. 4) from the ink ejection device 3 of the above-described embodiment. In the ink ejection device 121, there is a gap 122 between the cylindrical flow path portion 27 and the partition wall 96 of the heat radiating member 24, and the cylindrical flow path portion 27 and the partition wall 96 are not in contact with each other. That is, the heat radiating member 24 extends to avoid the cylindrical flow path portion 27.

  Even in this case, since the cylindrical flow path portion 27 and the partition wall 96 are separated from each other, the heat of the ink heated by the heater 82 and flowing through the cylindrical flow path portion 27 is hardly radiated through the heat radiating member 24.

  Furthermore, although the efficiency of heating the ink by the heater 82 is somewhat deteriorated, the cylindrical flow path portion 27 and the partition wall 96 may be in contact with each other.

  Further, in the above-described embodiment, the heat dissipation member 24 performs heat dissipation via the coolant flowing through the circulation channel 91, but is not limited thereto. For example, in Modification 5, as shown in FIGS. 15A and 15B, the heat radiating member 131 is individually provided for each COF 22. The heat dissipating member 131 has two members 131a and 131b made of a metal material. The member 131a and the member 131b are disposed so as to sandwich a portion extending between the driver IC 62 of the COF 22 and the second bent portion 72 and extending in the vertical direction from the thickness direction of the COF 22. The members 131a and 131b have flat plate portions 132a and 132b and a plurality of protrusions 133a and 133b, respectively. The flat plate portions 132a and 132b extend over the entire length of the COF 22 in the width direction of the substrate 61 (the direction orthogonal to the plane of FIG. 15A and FIG. 15B), and are in contact with the COF 22 via the thermally conductive grease 86. . The plurality of protrusions 133a and 133b protrude from the flat plate portions 132a and 132b to the side opposite to the COF 22, respectively.

  The heat radiating member 131 is a so-called air-cooled heat sink that radiates heat transferred from the metal part 69 or the like of the COF 22 to the surrounding air. The heat dissipating member 131 has a large surface area and a high heat dissipating effect because the members 131a and 131b have a plurality of protrusions 133a and 133b, respectively.

  Moreover, in the modified example 5, although the heat radiating member 131 had several protrusion 133a, 133b, it is not restricted to this. For example, the heat radiating member may be a metal plate made of a material having a higher thermal conductivity than the metal portion 69 and having no plurality of protrusions. Alternatively, a heat sink may be used as an air-cooled heat sink, in which a flow path through which air flows is formed, and heat is radiated by flowing air through the flow path with a blower or the like.

  In the above example, in addition to the fact that the COF has a metal part, the heat dissipating member that contacts the part where the metal part of the COF is disposed is provided, but the heat dissipating member may not be provided. Even in this case, compared with the case where the COF has no metal portion, heat is easily radiated in the COF, and heat is hardly transmitted to the joint portion between the COF, the head unit 25 and the rigid substrate 23.

  In the above-described embodiment, the ink in the flow path member 81 is heated by the heater 82, but the heater 82 may not be provided. Even in this case, for example, the driver IC 62 generates heat when the head unit 25 is driven, and this heat is transmitted to the joint portion between the COF and the head unit 25. Therefore, even when there is no heater 82, it is meaningful to provide a metal part to easily dissipate the heat of COF.

  Moreover, although the example which applied this invention to the inkjet printer provided with the inkjet head which discharges an ink from a nozzle was demonstrated above, it is not restricted to this. For example, the present invention can also be applied to a recording apparatus that includes a recording head that performs recording by a method other than ejecting ink from nozzles, such as a thermal head, and a wiring member that constitutes the recording apparatus.

1 Printer 20 Head Holder 21 Inkjet Head 22 COF
24 Heat Dissipation Member 27 Cylindrical Channel 30 Nozzle 61 Base 62 Driver IC
66 to 68 Wiring 69 Metal part 71 First bent part 72 Second bent part 76 Solder resist 81 Circulation channel 101 COF
102 Metal part 103, 104 Slit 111 COF
112 Metal part 113 Projection 131 Heat dissipation member

Claims (26)

A recording head;
A wiring member connected to the recording head,
The wiring member is
A flexible substrate;
A wiring disposed on one surface of the substrate and connected to the recording head;
A metal part that is disposed on the other surface of the substrate and is not electrically connected to the other part;
The substrate is
The first bent portion is bent and extends away from the recording head;
The metal part is
The recording apparatus, wherein the other surface of the base material is disposed at a position farther from the recording head than at least the first bent portion. The wiring member is
A driver IC mounted on the one surface of the substrate and connected to the wiring;
The recording apparatus according to claim 1, wherein the metal portion overlaps the driver IC in a thickness direction of the base material.   The recording apparatus according to claim 1, wherein the metal portion overlaps the wiring in a thickness direction of the base material.   The recording apparatus according to claim 1, wherein the metal portion extends over the entire length in the width direction of the base material.   The recording apparatus according to claim 1, wherein the metal part is made of the same material as the wiring.   The recording apparatus according to claim 1, wherein the metal part is made of a material having a higher thermal conductivity than the wiring. The metal portion extends across a portion of the base material that is closer to the recording head than the first bent portion and a portion that is farther from the recording head than the first bent portion,
The recording apparatus according to claim 1, wherein a slit is formed in a portion of the metal portion located on the first bent portion.   The recording apparatus according to claim 1, wherein the metal part is not disposed on the first bent part.   The recording apparatus according to claim 1, wherein the metal part has a plurality of protrusions protruding to the opposite side of the base in the thickness direction of the base. The wiring member is
A resist disposed on the one surface of the base material and covering the wiring,
The recording apparatus according to claim 1, wherein a resist that covers the metal part is not disposed on the other surface of the base material. A rigid substrate connected to the recording head via the wiring member,
The base material is bent at a second bent portion closer to the rigid substrate than the first bent portion, and extends toward a connection portion with the rigid substrate,
The said metal part is arrange | positioned in the part between the said 1st bending part and the said 2nd bending part among said other surfaces of the said base material, The any one of Claims 1-10 characterized by the above-mentioned. A recording apparatus according to claim 1. The metal portion extends across a portion of the base material that is closer to the rigid substrate than the second bent portion and a portion that is farther from the rigid substrate than the second bent portion,
The recording apparatus according to claim 11, wherein a slit is formed in a portion of the metal portion located on the second bent portion.   The recording apparatus according to claim 11, wherein the metal part is not disposed on the second bent part.   The recording apparatus according to claim 1, further comprising a heat radiating member that contacts a portion of the wiring member where the metal portion is disposed. The wiring member is
A driver IC mounted on the one surface of the substrate and connected to the wiring;
The metal part is disposed on at least a portion of the other surface of the base material that is farther from the recording head than the driver IC,
The recording apparatus according to claim 14, wherein the heat radiating member is in contact with a portion of the wiring member that is farther from the recording head than the driver IC. The wiring member is
A driver IC mounted on the one surface of the substrate and connected to the wiring;
The metal part is disposed on at least a portion of the other surface of the base material closer to the recording head than the driver IC,
The recording apparatus according to claim 14, wherein the heat radiating member is in contact with a portion of the wiring member that is closer to the recording head than the driver IC.   The recording apparatus according to claim 14, wherein the heat radiating member is in contact with both surfaces of the wiring member.   The recording apparatus according to claim 17, wherein the heat radiating member is in contact with a portion of the wiring member where the wiring is disposed.   The recording apparatus according to claim 14, wherein the heat radiating member is in contact with both end portions in the width direction of the wiring member. The recording head has a nozzle for discharging liquid,
A flow path member formed with a liquid flow path through which the liquid supplied to the recording head flows,
The recording apparatus according to claim 14, wherein a heat insulating material is disposed between the flow path member and the heat dissipation member. The recording head has a nozzle for discharging liquid,
A flow path member formed with a liquid flow path through which the liquid supplied to the recording head flows,
21. The recording apparatus according to claim 14, wherein the heat radiating member extends to avoid a portion of the flow path member where the liquid flow path is formed.   The recording apparatus according to claim 14, wherein the heat radiating member is an air-cooled heat sink.   The recording apparatus according to claim 14, wherein the heat radiating member has a circulation channel in which a cooling liquid circulates. A driver IC mounted on the one surface of the substrate and connected to the wiring;
The recording apparatus according to claim 14, wherein the heat radiating member is not in contact with the driver IC. The recording head has a nozzle for discharging a liquid;
The recording apparatus according to claim 1, further comprising a heating unit that heats the liquid. A wiring member connected to the recording head,
A flexible substrate;
Wiring disposed on one side of the substrate and connected to the recording head;
A metal part that is disposed on the other surface of the substrate and is not electrically connected to the other part;
The base material is bent at a bent portion and extends in a direction away from the recording head,
The metal part is
The wiring member, wherein the wiring member is disposed at least in a portion of the other surface of the base material that is further away from the recording head than the bent portion.

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