JP2019186264A - Assembly jig and manufacturing method of semiconductor device - Google Patents

Abstract

An object of the present invention is to improve the positioning accuracy of a connection terminal in a vertical direction with respect to a substrate. A holding jig (50) is disposed on the back surface of wiring boards (15a, 16a) and has vertical holding parts (52a, 52b) supported from the back surfaces of wiring boards (15a, 16a), and is disposed on the front surface of wiring boards (15a, 16a). Further, a terminal fixing jig having vertical holding portions 52a, 52b and vertical holding plates 42, 44 for holding the wiring boards 15a, 16a is provided. That is, the bonding portions 15c and 16c of the connection terminals 15 and 16 held by the vertical holding portions 52a and 52b formed on the back surfaces 51a7 and 51b7 of the supported plates 51a and 51b of the holding jig 50 with respect to the semiconductor elements 12a and 12c. Height is maintained. [Selection diagram] FIG.

Description

  The present invention relates to an assembly jig and a method for manufacturing a semiconductor device.

  The semiconductor device includes, for example, semiconductor elements such as an IGBT (Insulted Gate Bipolar Transistor) and a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor). Such a semiconductor device is used as, for example, a power conversion device.

  The semiconductor device includes a ceramic circuit board having an insulating plate and a conductive pattern formed on the front surface of the insulating plate, and a semiconductor element and a connection terminal that is a lead frame are arranged on the conductive pattern. In such a semiconductor device, a signal applied from the connection terminal is input to the semiconductor element via the conductive pattern.

  In a semiconductor device, a jig used for positioning a semiconductor element or the like is arranged on a ceramic circuit board, and the semiconductor element is arranged at a predetermined position on the ceramic circuit board. Then, the two connection terminals are arranged with the plate interposed therebetween so that the joint portions of the connection terminals are positioned on the electrodes of such a semiconductor element.

JP 2017-037892 A

  As described above, when the two connection terminals are arranged on the electrodes of the semiconductor element of the ceramic circuit board, the joint portions of the connection terminals are arranged on the electrodes of the semiconductor element via solder. However, if the solder is melted by heating in order to join the connection terminal to the semiconductor element after such arrangement, it is difficult to control the solder thickness due to the weight of the connection terminal. That is, it is difficult to control the position of the connection terminal in the direction perpendicular to the front surface of the ceramic circuit board, which causes a displacement of the connection terminal.

  The present invention has been made in view of such a point, and an object thereof is to provide an assembly jig and a method for manufacturing a semiconductor device, which improve the accuracy of alignment of a connection terminal in a direction perpendicular to a substrate. To do.

  According to an aspect of the present invention, a substrate on which a semiconductor element is disposed in a conductive pattern, a bonding portion bonded to the semiconductor element or the conductive pattern, a connecting portion connected to the bonding portion, and the connecting portion And a connection terminal having a wiring board provided at a distance from the joint portion, and a vertical holding device that is disposed on the back surface of the wiring board and supports the wiring board from the back surface. There is provided an assembly jig having a holding jig having a portion and a terminal fixing jig that is disposed on the front surface of the wiring board and has the vertical holding part and a vertical holding plate that holds the wiring board. The

  The holding jig further includes a horizontal holding part connected to the vertical holding part and having a surface perpendicular to the vertical holding part, and the terminal fixing jig is connected to the vertical holding plate. It further has a horizontal clamping plate that has a surface perpendicular to the plate and clamps the horizontal holding portion and the connecting portion.

  The holding jig further includes a supported plate provided at a distance from the vertical holding portion and having a horizontal surface on the vertical holding portion.

  Moreover, the 1st opening part in which a part of said connection terminal, the said holding jig, and the said terminal fixing jig is inserted is formed, and the 1st support member arrange | positioned in the back surface of the said supported plate of the said holding jig And a terminal guide part that is connected to the first support member and surrounds at least a part of a peripheral part of a joining region to which the joining part of the connection terminal is joined.

  Further, the device fixing jig further includes an element fixing jig formed on the substrate and formed with a second opening portion surrounding a part of a peripheral portion of the arrangement region where the semiconductor element is arranged.

  The element fixing jig is disposed on a back surface of the first support member of the guide jig, has a second support member that supports the guide jig from the back surface, and the terminal guide portion has the second opening. It arrange | positions adjacent to the said joining area | region through a part.

  The holding jig has a rod-like shape that maintains a predetermined distance between the back surface of the supported plate and the front surface of the substrate, with a tip portion in contact with the back surface of the supported plate. With legs.

  In addition, for the semiconductor device including a pair of the connection terminals having the connection portions arranged in two rows and having the coupling portions facing each other, the terminal fixing jig includes the vertical clamping plate and the vertical clamping plate The horizontal clamping plate is connected to the vicinity of the center of the vertical clamping plate and has a surface perpendicular to the vertical clamping plate. The vertical clamping plate and the horizontal clamping plate constitute a T-shaped cross section, and the holding jig The tools are arranged in two rows corresponding to the connection terminals, the horizontal holding portions facing each other, and connected to the horizontal holding portion and extending from the horizontal holding portion toward the horizontal holding portion of the other row. A plurality of the connection terminals arranged around the horizontal holding plate, and held between the horizontal holding portions opposed to each other, with the vertical holding portion and the vertical holding plate, The wiring board of the connection terminal, It is clamped perpendicularly to the clamping direction of the straight clamping plates.

  According to another aspect of the present invention, a substrate on which a semiconductor element is disposed in a conductive pattern, a bonding portion bonded to the semiconductor element or the conductive pattern, a connecting portion connected to the bonding portion, A preparation step of preparing a connection terminal having a wiring board connected to a connecting portion and spaced from the joint portion, and the connection terminal is arranged on the front surface of the wiring board A first attachment step of attaching a terminal fixing jig having a vertical holding plate, and the vertical holding plate and the wiring for supporting the wiring board from the back surface of the wiring board with respect to the connection terminal to which the terminal fixing jig is attached A second attachment step of attaching a holding jig having a vertical holding portion for holding the plate; and the holding jig so that the bonding portion is arranged on the semiconductor element or the conductive pattern with respect to the substrate. The method of manufacturing a semiconductor device having a connection terminal arrangement step of arranging is provided.

  Further, in the first mounting step, the terminal fixing jig further includes a horizontal clamping plate connected to the vertical clamping plate and having a surface perpendicular to the vertical clamping plate, on the outer surface of the connecting portion, In the second mounting step, the holding jig further includes the horizontal holding part connected to the vertical holding part and having a surface perpendicular to the vertical holding part, and the horizontal holding plate to hold the connecting part. It is clamped perpendicular to the clamping direction of the plate.

  Moreover, before the said connection terminal arrangement | positioning process, it is connected with the 1st support member in which the 1st opening part was formed with respect to the said board | substrate, and the said 1st support member, and the junction area | region where the junction part of the said connection terminal is joined A guide jig having a terminal guide portion that surrounds at least a part of the peripheral edge of the holding portion, and the holding jig is provided at a distance from the vertical holding portion and is horizontally disposed on the vertical holding portion. A support plate having a flat surface, and in the connection terminal arrangement step, the holding jig is arranged on the guide jig, and the connection terminal, the holding jig and the first opening are arranged. A part of the terminal fixing jig is inserted, the back surface of the supported plate is supported by the first support member, and the joining portion is aligned with the joining region by the terminal guide portion.

  In the preparation step, an element fixing jig in which a second opening surrounding the part of the peripheral area of the arrangement region where the semiconductor element is arranged is formed on the substrate. The semiconductor element is arranged in the arrangement region in the second opening.

  Further, before the connection terminal arrangement step, the guide jig is arranged on the element fixing jig, and the terminal guide portion is arranged in the joining region through the second opening.

  Further, the holding jig has a rod-like leg on the back surface of the supported plate, and the holding jig is arranged with respect to the substrate in the connection terminal arranging step, The front end is in contact with the front surface of the substrate, and a predetermined distance is maintained between the back surface of the supported plate and the front surface of the substrate.

  According to the disclosed technique, it is possible to improve the accuracy of alignment in the vertical direction with respect to the substrate of the connection terminal.

It is a perspective view of the front side of a semiconductor device. It is a perspective view of the side part of a semiconductor device. It is a figure for demonstrating the connecting terminal contained in a semiconductor device. It is a figure for demonstrating the terminal fixing jig of the holding jig which comprises the assembly jig utilized by manufacture of the semiconductor device of 1st Embodiment. It is a figure for demonstrating the holding jig which comprises the assembly jig utilized by manufacture of the semiconductor device of 1st Embodiment. It is FIG. (1) for demonstrating the attachment with respect to the connecting terminal of the holding jig and the terminal fixing jig which comprise the assembly jig utilized with the manufacturing method of the semiconductor device of 1st Embodiment. FIG. 6 is a diagram (No. 2) for explaining the attachment of the holding jig and the terminal fixing jig constituting the assembly jig used in the semiconductor device manufacturing method of the first embodiment to the connection terminal; It is a figure for demonstrating the guide jig | tool which comprises the assembly jig | tool utilized by manufacture of the semiconductor device of 1st Embodiment. It is a figure for demonstrating the element fixing jig which comprises the assembly jig utilized by manufacture of the semiconductor device of 1st Embodiment. FIG. 6 is a diagram (part 1) for explaining the method of manufacturing the semiconductor device according to the first embodiment; FIG. 6 is a diagram (part 2) for explaining the method of manufacturing the semiconductor device of the first embodiment; FIG. 6 is a view (No. 3) for explaining the method of manufacturing the semiconductor device of the first embodiment; FIG. 6 is a view (No. 4) for explaining the method of manufacturing the semiconductor device of the first embodiment; It is FIG. (1) for demonstrating the manufacturing method of the semiconductor device of 2nd Embodiment. It is FIG. (2) for demonstrating the manufacturing method of the semiconductor device of 2nd Embodiment.

  Hereinafter, embodiments will be described with reference to the drawings.

[First Embodiment]
First, a semiconductor device will be described with reference to FIGS. FIG. 1 is a perspective view of the front side of a semiconductor device, and FIG. 2 is a perspective view of a side portion of the semiconductor device. FIG. 2 shows a case where the semiconductor device 10 of FIG. 1 is viewed from the right side.

  The semiconductor device 10 electrically connects the ceramic circuit board 11 and the semiconductor elements 12a to 12d joined to the front surface of the ceramic circuit board 11 and the terminal blocks 14a, 14b and 14c to the electrodes of the semiconductor elements 12a to 12d. A pair of connection terminals 15 and 16 is included.

  The ceramic circuit board 11 includes an insulating plate 11a, conductive patterns 11b1, 11b2, 11b3 formed on the front surface of the insulating plate 11a, and a metal plate 11c formed on the back surface of the insulating plate 11a. In the following description, the conductive patterns 11b1, 11b2, and 11b3 are expressed as the conductive pattern 11b unless otherwise distinguished.

  The insulating plate 11a is made of ceramics having high thermal conductivity, such as aluminum oxide, aluminum nitride, silicon nitride, and the like. The thickness of the insulating plate 11a is preferably 0.2 mm or more and 1.5 mm or less, and more preferably 0.25 mm or more and 1.0 mm or less.

  The conductive pattern 11b is made of a material having excellent conductivity. As such a material, for example, copper, aluminum, or an alloy containing at least one of them is used. The thickness of the conductive pattern 11b is preferably 0.1 mm or more and 2.0 mm or less, and more preferably 0.125 mm or more and 1.2 mm or less. Further, the conductive pattern 11b can be plated with a material having excellent corrosion resistance. Examples of such materials include aluminum, nickel, titanium, chromium, molybdenum, tantalum, niobium, tungsten, vanadium, bismuth, zirconium, hafnium, gold, silver, platinum, palladium, or an alloy containing at least one of these. It is. Note that the number, the arrangement position, and the shape of the conductive patterns 11b are merely examples, and the number, the arrangement position, and the shape can be determined as appropriate by design without being limited to this case.

  The metal plate 11c is made of a metal such as copper, aluminum, iron, silver, or an alloy containing at least one of them having excellent thermal conductivity. The thickness of the metal plate 11c is preferably 0.1 mm or more and 2.0 mm or less, and more preferably 0.125 mm or more and 1.2 mm or less.

  As the ceramic circuit board 11 having such a configuration, for example, a DCB (Direct Copper Bonding) board or an AMB (Active Metal Blazed) board can be used. The ceramic circuit board 11 can conduct heat generated in semiconductor elements 12a to 12d described later to the lower side of the ceramic circuit board 11 through the conductive pattern 11b, the insulating plate 11a, and the metal plate 11c. Note that the insulating plate 11a has, for example, a rectangular shape in plan view. The metal plate 11c has a rectangular shape with a smaller area than the insulating plate 11a in plan view. Therefore, the ceramic circuit board 11 has, for example, a rectangular shape.

  Further, the number, the arrangement position, and the shape of the ceramic circuit board 11 shown in FIGS. 1 and 2 are examples. The number, the arrangement position, and the shape can be appropriately determined by design without being limited to this case.

  The semiconductor elements 12a to 12d include switching elements such as IGBTs and power MOSFETs made of silicon or silicon carbide. Such semiconductor elements 12a to 12d include, for example, a drain electrode (or collector electrode) on the back surface and a gate electrode and a source electrode (or emitter electrode) on the front surfaces 12a1 to 12d1, respectively. Moreover, the semiconductor elements 12a to 12d include diodes such as SBD (Schottky Barrier Diode) and FWD (Free Wheeling Diode) as necessary. Such semiconductor elements 12a to 12d are each provided with a cathode electrode on the back surface and an anode electrode on the front surface. The number (4) and arrangement (2 rows) of the semiconductor elements 12a to 12d on the ceramic circuit board 11 shown in FIGS. 1 and 2 are examples, and the number is not limited to this case. Can be determined.

  Such semiconductor elements 12a to 12d are joined to the conductive pattern 11b via solder (not shown). In addition to the semiconductor elements 12a to 12d, wiring parts such as thermistors and capacitors, bonding wires, lead frames, connection terminals, and the like are appropriately disposed on the conductive pattern 11b as necessary. can do.

  The terminal blocks 14a, 14b, and 14c are joined to the conductive patterns 11b1, 11b2, and 11b3 via solder (not shown). Such terminal blocks 14a, 14b, and 14c are made of a material having excellent conductivity. As such a material, for example, copper, aluminum, or an alloy containing at least one of them is used. The terminal blocks 14a, 14b, and 14c can also be plated with a material having excellent corrosion resistance. Examples of such materials include aluminum, nickel, titanium, chromium, molybdenum, tantalum, niobium, tungsten, vanadium, bismuth, zirconium, hafnium, gold, silver, platinum, palladium, or an alloy containing at least one of these. It is.

  Next, connection terminals included in the semiconductor device 10 will be described with reference to FIG. FIG. 3 is a diagram for explaining connection terminals included in the semiconductor device. 3A is a rear view of the pair of connection terminals 15 and 16, and FIG. 3B is a view as viewed in the direction of the arrow in FIG.

  The connection terminal 15 has joint parts 15b and 15c, a connection part 15e, a wiring board 15a, and a connection part 15d. In addition, the joining parts 15b and 15c, the connection part 15e, the wiring board 15a, and the connection part 15d may be integrally connected in this order.

  The joint portions 15 b and 15 c have a main surface parallel to the front surface of the ceramic circuit board 11. The joint portions 15 b and 15 c may extend in the short side direction of the ceramic circuit board 11. The joint portions 15b and 15c may be joined to the electrodes of the semiconductor elements 12b and 12a (see FIG. 1). However, the present invention is not limited to this case, and the joint portions 15 b and 15 c may be joined to the conductive pattern 11 b of the ceramic circuit board 11.

  The connecting portion 15e separates the wiring board 15a from the joint portions 15b and 15c in a direction perpendicular to the front surface of the ceramic circuit board 11. As shown in FIG. 3B, the ceramic circuit board 11 may have a main surface that is perpendicular to the front surface of the ceramic circuit board 11 (the bonding portion 15b to be bonded). Moreover, the connection part 15e connects the junction parts 15b and 15c and the wiring board 15a integrally. For example, the connecting portion 15e extends upward (in a direction away from the front surface of the ceramic circuit board 11) from the end portions of the joint portions 15b and 15c, and is connected to the end portion of the wiring board 15a.

  The wiring board 15a has a main surface parallel to the front surface of the ceramic circuit board 11, and integrally connects the connecting portion 15e and the connecting portion 15d. For example, the wiring board 15a has a rectangular shape extending in parallel with the long side of the ceramic circuit board 11, and a part of the long side is connected to the connecting part 15e and the short side is connected to the connecting part 15d. Moreover, the wiring board 15a may straddle the semiconductor elements 12c and 12d arranged in parallel with the long side of the ceramic circuit board 11 (see FIG. 1). In addition, the cross section of the wiring board 15a and the connection part 15e may comprise the cross-sectional U-shaped part.

  The connecting portion 15d has a main surface parallel to the front surface of the ceramic circuit board 11, and is integrally connected to the end portion of the wiring board 15a. For example, the connecting portion 15d has a rectangular shape extending in parallel with the short side of the ceramic circuit board 11, and a part of the long side is connected to the wiring board 15a.

  In such a connection terminal 15, the joint portions 15b and 15c are joined to the main electrodes of the semiconductor elements 12d and 12c via the solders 13d and 13c, respectively. The joint portions 15b and 15c may be joined to the conductive pattern 11b of the ceramic circuit board 11 via solder. The connection terminal 15 has a connection portion 15d joined to the terminal block 14a via solder (not shown).

  The connection terminal 16 also has joint portions 16b and 16c, a connection portion 16e, a wiring board 16a, and a connection portion 16d. Note that the joint portions 16b and 16c, the connecting portion 16e, the wiring board 16a, and the connecting portion 16d may be integrally connected in this order.

  The joint portions 16 b and 16 c have a main surface parallel to the front surface of the ceramic circuit board 11. The joint portions 16 b and 16 c may extend in the short side direction of the ceramic circuit board 11. The joining portions 16b and 16c may be joined to the electrodes of the semiconductor elements 12b and 12a (see FIG. 1). However, the present invention is not limited to this case, and the joint portions 16 b and 16 c may be joined to the conductive pattern 11 b of the ceramic circuit board 11.

  The connecting portion 16e separates the wiring board 16a from the joint portions 16b and 16c in a direction perpendicular to the front surface of the ceramic circuit board 11. As shown in FIG. 3B, the ceramic circuit board 11 may have a main surface that is perpendicular to the front surface of the ceramic circuit board 11 (the bonding portion 16c bonded thereto). Moreover, the connection part 16e connects the junction parts 16b and 16c and the wiring board 16a integrally. For example, the connecting portion 16e extends upward (in a direction away from the front surface of the ceramic circuit board 11) from the end portions of the joint portions 16b and 16c, and is connected to the end portion of the wiring board 16a.

  The wiring board 16a has a main surface parallel to the front surface of the ceramic circuit board 11, and integrally connects the connecting portion 16e and the connecting portion 16d. For example, the wiring board 16a has a rectangular shape extending in parallel with the long side of the ceramic circuit board 11, and a part of the long side is connected to the connecting part 16e and the short side is connected to the connecting part 16d. Further, the wiring board 16a may straddle the semiconductor elements 12c and 12d arranged in parallel with the long sides of the ceramic circuit board 11 (see FIG. 1). In addition, the cross section of the wiring board 16a and the connection part 16e may comprise the cross-sectional U-shaped part.

  The connecting portion 16d has a main surface parallel to the front surface of the ceramic circuit board 11, and is integrally connected to the end portion of the wiring board 16a. For example, the connecting portion 16d has a rectangular shape extending in parallel with the short side of the ceramic circuit board 11, and a part of the long side is connected to the wiring board 16a.

  In such a connection terminal 16, the connection part 16e is adjacent to the connection part 15e of the connection terminal 15, and the joint parts 16b and 16c are joined to the main electrodes of the semiconductor elements 12b and 12a via the solders 13b and 13a. Further, the joint portions 16b and 16c may be joined to the conductive pattern 11b of the ceramic circuit board 11 via solder. The connection terminal 16 has a connection portion 16d bonded to the terminal block 14b via solder (not shown).

  The connection terminals 15 and 16 are made of aluminum, iron, silver, copper, or an alloy containing at least one of them having excellent conductivity. The connection terminals 15 and 16 are made of, for example, aluminum, nickel, titanium, chromium, molybdenum, tantalum, niobium, tungsten, vanadium, bismuth, zirconium, hafnium, gold, silver, platinum, palladium, or the like in order to improve corrosion resistance. Alternatively, an alloy containing at least one of these may be plated.

  Also, the solders 13a to 13d (and other solders not shown) used in such a semiconductor device 10 are, for example, alloys composed of tin-silver-copper, alloys composed of tin-zinc-bismuth, tin -It is comprised with the lead-free solder which has as a main component at least any alloy among the alloy which consists of copper, and the alloy which consists of a tin-silver-indium-bismuth. Furthermore, additives such as nickel, germanium, cobalt, or silicon may be included.

  In such a semiconductor device 10, the thickness of the solder between the conductive pattern 11 b and the semiconductor elements 12 a to 12 d is preferably 10 μm or more and 400 μm or less. The thickness of the solders 13a to 13d between the semiconductor elements 12a to 12d and the joint portions 15b, 15c, 16b, and 16c of the connection terminals 15 and 16 is preferably 100 μm or more and 800 μm or less. In addition, when the conductive pattern 11b and the joint portions 15b, 15c, 16b, and 16c of the connection terminals 15 and 16 are joined, the solder thickness is preferably 100 μm or more and 800 μm or less. Controlling the solder thickness within the above range is preferable in terms of conductivity, heat dissipation, and stress relaxation.

  In addition, the heat sink which abbreviate | omits illustration can be provided in the back surface (back surface of the metal plate 11c of the ceramic circuit board 11) of the semiconductor device 10 via solder. The heat sink has excellent thermal conductivity, for example, aluminum, iron, silver, copper, or an alloy composed of at least one of these, a composite material composed of aluminum and silicon carbide, a composite material composed of magnesium and silicon carbide It is composed of materials. In order to improve corrosion resistance, for example, aluminum, nickel, titanium, chromium, molybdenum, tantalum, niobium, tungsten, vanadium, bismuth, zirconium, hafnium, gold, silver, platinum, palladium, or at least one of these The surface may be plated with an alloy or the like.

  Furthermore, it is possible to improve heat dissipation by joining a cooler (not shown) to the back side of this heat sink via solder or silver solder, or mechanically attaching it via thermal paste or the like. It is. The cooler in this case is made of, for example, aluminum, iron, silver, copper, or an alloy composed of at least one of them having excellent thermal conductivity. As the cooler, a fin, a heat sink composed of a plurality of fins, a cooling device using water cooling, or the like can be applied. Moreover, a heat sink may be comprised integrally with such a cooler. In that case, it is comprised with aluminum, iron, silver, copper excellent in thermal conductivity, or at least one of these. In order to improve the corrosion resistance, for example, aluminum, nickel, titanium, chromium, molybdenum, tantalum, niobium, tungsten, vanadium, bismuth, zirconium, hafnium, gold, silver, platinum, palladium, or at least one of these The surface may be plated with an alloy or the like. Moreover, you may join said cooler to the back surface of the ceramic circuit board 11 via solder instead of said heat sink.

  Further, the semiconductor device 10 is housed in a case (not shown). Such a case has a frame shape having an opening for housing the semiconductor device 10. The semiconductor device 10 housed in the case is surrounded by the periphery, and the lower part is supported by the heat sink. In such a case, for example, connection terminals that are electrically connected to the terminal blocks 14a, 14b, and 14c of the semiconductor device 10 are integrally formed. Such a case is made of a thermoplastic resin. Examples of such a resin include polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) resin, polybutylene succinate (PBS) resin, polyamide (PA) resin, and acrylonitrile butadiene styrene (ABS) resin.

  And the semiconductor device 10 in a case is sealed in the opening part of a case with sealing resin. Such a sealing resin is composed of, for example, a thermosetting resin such as an epoxy resin, a phenol resin, and a maleimide resin and a filler contained in the thermosetting resin. Moreover, the sealing member may be comprised with the gel.

  The assembly jig includes an element fixing jig, a guide jig, and a holding jig. Further, the holding jig is used with a terminal fixing jig. Note that such an assembly jig is made of a material that can withstand the heating temperature during the soldering process. Such materials are, for example, carbon, machinable ceramics, stainless steel materials with high heat resistance, and the like.

  First, the holding jig 50 and the terminal fixing jig 40 used together with the holding jig 50 will be described. First, the terminal fixing jig 40 will be described with reference to FIG. FIG. 4 is a view for explaining a terminal fixing jig of a holding jig that constitutes an assembly jig used in the manufacture of the semiconductor device of the first embodiment. 4A is a perspective view of the front surface side of the terminal fixing jig 40, and FIG. 4B is a rear view of the terminal fixing jig 40.

  The terminal fixing jig 40 has vertical clamping plates 42 and 44 parallel to the front surface of the ceramic circuit board 11 and horizontal clamping plates 41 and 43 which are also perpendicular to the ceramic circuit board 11. The terminal fixing jig 40 is, for example, a vertical clamping plate 42, 44, a horizontal clamping plate 43 extending toward the ceramic circuit board 11 from a connection location of the vertical clamping plates 42, 44, and a direction away from the ceramic circuit board 11. A horizontal clamping plate 41. In this case, the terminal fixing jig 40 has a cross-shaped cross section. In addition, the terminal fixing jig 40 includes, for example, a vertical clamping plate 42, 44 and a horizontal clamping plate 43 extending from the approximate center of the plate-like portion including the vertical clamping plates 42, 44 toward the ceramic circuit board 11. Have. In this case, a T-shaped cross section is configured. Furthermore, the terminal fixing jig 40 has, for example, a vertical clamping plate 42 and a horizontal clamping plate 43 that is connected to the end of the vertical clamping plate 42 and extends from the vertical clamping plate 42 toward the ceramic circuit board 11. And the cross-sectional L-shape may be comprised. In addition, for example, columnar protrusions 42a1 and 44a1 are formed at substantially central portions of the front surfaces of the vertical clamping plates 42 and 44, respectively. Convex portions 42a2, 42a3, 44a2, and 44a3 are formed in contact with the horizontal clamping plate 41 on the front surface of the vertical clamping plates 42 and 44. Further, for example, cylindrical protrusions 42b1 and 44b1 are also formed at substantially the center of the back surface of the vertical clamping plates 42 and 44, for example. Convex portions 42b2, 42b3, 44b2, and 44b3 are formed in contact with the horizontal clamping plate 43 on the back surface of the vertical clamping plates 42 and 44.

  Next, the holding jig 50 will be described with reference to FIG. FIG. 5 is a view for explaining a holding jig constituting an assembly jig used in manufacturing the semiconductor device according to the first embodiment. 5A is a plan view of the holding jig 50, and FIG. 5B is a perspective view of the holding jig 50 on the back surfaces 51a7 and 51b7 side.

  The holding jig 50 includes a supported plate 51a, a vertical holding portion 52a formed integrally with the back surface 51a7 of the supported plate 51a, and a horizontal holding portion 53a having a surface perpendicular to the vertical holding portion 52a. Yes. Further, the holding jig 50 includes a supported plate 51b, a vertical holding portion 52b integrally formed on the back surface 51b7 of the supported plate 51b, and a horizontal holding portion 53b having a surface perpendicular to the vertical holding portion 52b. is doing.

  The back surfaces 51a7 and 51b7 of the supported plates 51a and 51b are parallel to the front surface of the ceramic circuit board 11. Further, the supported plates 51a and 51b are formed with slit portions 51a1 and 51b1 and engaging portions 51a2, 51a3, 51b2 and 51b3 on opposite sides.

  The vertical holding portions 52a and 52b and the horizontal holding portions 53a and 53b are formed so as to face the rear surfaces 51a7 and 51b7 of the parallel supported plates 51a and 51b, respectively. The horizontal holding portions 53a and 53b have, for example, main surfaces perpendicular to the back surfaces 51a7 and 51b7 of the supported plates 51a and 51b, and the vertical holding portions 52a and 52b are, for example, the back surfaces of the supported plates 51a and 51b. The main surface is parallel to 51a7 and 51b7. The vertical holding portions 52a and 52b and the horizontal holding portions 53a and 53b have a L-shaped cross section. The main surface parallel to the back surfaces 51a7 and 51b7 of the supported plates 51a and 51b is parallel to the front surface of the ceramic circuit board 11. The vertical holding parts 52a and 52b and the horizontal holding parts 53a and 53b are U-shaped sections 52a1 having a U-shaped surface having three straight sides in cross section with the back surfaces 51a7 and 51b7 of the supported plates 51a and 51b. 52b1 is configured.

  Here, the relationship between the holding jig 50 and the terminal fixing jig 40 will be described with reference to FIGS. 6 and 7. 6 and 7 are views for explaining attachment of the holding jig and the terminal fixing jig constituting the assembly jig used in the manufacturing method of the semiconductor device of the first embodiment to the connection terminals. . 6A is a plan view after attachment, and FIG. 6B is a cross-sectional view taken along one-dot chain line XX in FIG. 6A. FIG. 7 shows a perspective view of the back side with respect to FIG.

  The wiring board 15 a and the vertical clamping plate 42 are arranged together in the U-shaped section 52 a 1 of the holding jig 50. Similarly, the wiring board 16a and the vertical clamping plate 44 are arranged together in the U-shaped section 52b1 of the holding jig 50 (FIG. 6B). In this way, the wiring boards 15 a and 16 a of the connection terminal 15 are connected to the horizontal plane of the vertical holding portions 52 a and 52 b of the holding jig 50 (a plane parallel to the front surface of the ceramic circuit board 11) and the vertical of the terminal fixing jig 40. It is sandwiched in the vertical direction (direction perpendicular to the front surface of the ceramic circuit board 11) by the sandwiching plate 42. By doing so, it is possible to hold the wiring board 15 a (and hence the joint 15 c) of the connection terminal 15 in parallel with the front surface of the ceramic circuit board 11. Here, the wiring boards 15a, 16a and the vertical clamping plates 42, 44 may be fitted together in the U-shaped sections 52a1, 52b1. There may also be a gap between the vertical clamping plates 42 and 44 and the supported plates 51a and 51b. This is because even if there is a gap, it can be pressed by the load of the terminal fixing jig 40. Here, an example in which two connection terminals 15 and 16 are installed is shown. However, there may be only one instead of two. In that case, the same effect can be obtained.

  In addition, by pressing the connecting portion 15e of the wiring board 15a with the horizontal clamping plate 43 into the U-shaped section 52a1 of the holding jig 50, the wiring board 15a is pushed into the back side of the U-shaped section 52a1 and the U-shaped section is formed. The end surface of the wiring board 15a is disposed in contact with the vertical surface of the portion 52a1 (surface perpendicular to the front surface of the ceramic circuit board 11). Similarly, by pressing the connecting portion 16e of the wiring board 16a with the horizontal clamping plate 43 into the U-shaped section 52b1 of the holding jig 50, the wiring board 16a is pushed into the rear side of the U-shaped section 52b1, and the cross section The end surface of the wiring board 16a is disposed so as to abut on the vertical surface of the U-shaped portion 52b1 (surface perpendicular to the front surface of the ceramic circuit board 11). Thus, the wiring boards 15a and 16a of the connection terminals 15 and 16 and the connecting portions 15e and 16e are vertical surfaces of the horizontal holding portions 53a and 53b of the holding jig 50 (surfaces perpendicular to the front surface of the ceramic circuit board 11). And the horizontal clamping plate 43 of the terminal fixing jig 40 are sandwiched in the horizontal direction (a surface parallel to the front surface of the ceramic circuit board 11). By doing so, the wiring board 15a (and hence the joint 15c) of the connection terminal 15 can be accurately aligned with a predetermined horizontal position on the front surface of the ceramic circuit board 11. Here, an example in which two connection terminals 15 and 16 are installed is shown. However, there may be only one instead of two. In that case, the same effect can be obtained.

  Next, the guide jig 30 will be described with reference to FIG. FIG. 8 is a view for explaining a guide jig constituting the assembly jig used in the manufacture of the semiconductor device of the first embodiment. 8A shows a front view of the guide jig 30, and FIG. 8B shows a perspective view of the back surface of the guide jig 30.

  The guide jig 30 includes a flat support member 31 and terminal guide portions 33a, 33b, 33c, and 33d. In such a guide jig 30, terminal guide parts 33 a, 33 b, 33 c, and 33 d enter the opening 22 of the element fixing jig 20 described later, and the back surface of the support member 31 is the outer peripheral edge of the opening 22 of the support member 21. It is supported on the element and placed on the element fixing jig 20. The support member 31 has an opening 32 that is open on the front surface. When the guide jig 30 is arranged on the element fixing jig 20, the openings 32 are provided with the joint portions 16 b, 16 c, 15 b, 15 c of the connection terminals 16, 15 on the electrodes of the semiconductor elements 12 a to 12 d. Arrangement areas 32a to 32d and arrangement areas 32e and 32f in which the connection portions 16d and 15d of the connection terminals 16 and 15 are arranged (on the terminal blocks 14b and 14a).

  The terminal guide portion 33a surrounds at least a part of the peripheral portion of the joint region where the joint portion 16c of the connection terminal 16 is joined. For example, the terminal guide portion 33a is arranged on the outer periphery (side portion of the arrangement region 32a) of the main electrode of the semiconductor element 12b when the guide jig 30 is arranged on the element fixing jig 20. It is formed in the opening 32 of the support member 31 via hanging parts 33a1 and 33a2. Similarly, the terminal guide portions 33b, 33c, and 33d are formed in the opening of the support member 31 so as to be disposed on the outer periphery of the main electrode of the semiconductor elements 12a, 12d, and 12c (side portions of the placement regions 32b, 32c, and 32d). The part 32 is formed through hanging parts 33b1, 33b2, 33c1, 33c2, 33d1, and 33d2. The hanging portions 33a1, 33a2, 33b1, 33b2, 33c1, 33c2, 33d1, and 33d2 have the same height and are set according to the heights of the connection terminals 15 and 16. The terminal guide portions 33a, 33b, 33c, 33d and the hanging portions 33a1, 33a2, 33b1, 33b2, 33c1, 33c2, 33d1, 33d2 constitute openings 34a, 34b, 34c, 34d.

  Next, the element fixing jig 20 will be described with reference to FIG. FIG. 9 is a diagram for explaining an element fixing jig constituting an assembly jig used in manufacturing the semiconductor device according to the first embodiment. 9A shows the front surface of the element fixing jig 20, and FIG. 9B shows the back surface of the element fixing jig 20.

  The element fixing jig 20 is disposed on the ceramic circuit board 11. Such an element fixing jig 20 includes a flat support member 21. The support member 21 has openings 22 and 23 that are open on the front surface. When the element fixing jig 20 is arranged on the ceramic circuit board 11, the opening 22 has arrangement areas 22a to 22d in which the semiconductor elements 12a to 12d are arranged and arrangement areas in which the terminal blocks 14b and 14a are arranged. 22e and 22f. The opening 23 is provided with the terminal block 14 c when the element fixing jig 20 is arranged on the ceramic circuit board 11.

  Next, a manufacturing method of the semiconductor device 10 using such an assembly jig including the element fixing jig 20, the guide jig 30, and the holding jig 50 will be described with reference to FIGS. 6 and 7 and FIGS. I will explain.

  10 to 13 are views for explaining the method of manufacturing the semiconductor device according to the first embodiment. 10A, FIG. 10B, FIG. 11A, FIG. 11B, FIG. 12 and FIG. 13 show the method of manufacturing the semiconductor device 10 using an assembly jig in time series. Represents. 12A is a plan view of the semiconductor device 10 assembled by the assembly jig, and FIG. 12B is a cross-sectional view taken along one-dot chain line XX in FIG. .

  Before manufacturing the semiconductor device 10, a ceramic circuit board 11, semiconductor elements 12a to 12d, terminal blocks 14a, 14b and 14c, connection terminals 15 and 16, a solder plate (not shown), an assembly jig, and the like are prepared in advance. Keep it.

  First, as shown in FIG. 10A, the ceramic circuit board 11 is set in the arrangement area 81 of the predetermined carbon tray 80. The ceramic circuit board 11 is disposed with the conductive patterns 11 b 1, 11 b 2, and 11 b 3 on the upper surface and the metal plate 11 c on the lower surface so as to contact the arrangement region 81 of the carbon tray 80. As a result, the ceramic circuit board 11 is fixed to the carbon tray 80, and the positional displacement of the ceramic circuit board 11 is prevented in the subsequent manufacturing process.

  Next, as shown in FIG. 10B, the element fixing jig 20 is set on the ceramic circuit board 11. Thereby, the arrangement areas 22a and 22b of the opening 22 correspond to the conductive pattern 11b1 and the arrangement areas 22c and 22d of the opening 22 correspond to the conductive pattern 11b3 with respect to the ceramic circuit board 11. The opening 23 corresponds to the conductive pattern 11b3. Further, the arrangement region 22e of the opening 22 corresponds to the conductive pattern 11b2, and the arrangement region 22f of the opening 22 corresponds to the conductive pattern 11b1.

  Next, as shown in FIG. 11A, the semiconductor elements 12b and 12a are set in the arrangement regions 22a and 22b of the opening 22 of the conductive pattern 11b1 via plate solder (not shown). The semiconductor elements 12d and 12c are set in the arrangement regions 22c and 22d of the opening 22 of the conductive pattern 11b2 via plate solder (not shown). Further, the terminal blocks 14a and 14b are set on the arrangement regions 22f and 22e of the opening 22 of the conductive pattern 11b1 via plate solder (not shown). The terminal block 14c is set in the opening 23 of the conductive pattern 11b3 via sheet solder (not shown).

  Next, as shown in FIG. 11B, a guide jig 30 is set on the element fixing jig 20. At this time, it is formed in the opening 22 of the element fixing jig 20 in the opening 32 of the support member 31 of the guide jig 30 via the hanging parts 33a1, 33a2, 33b1, 33b2, 33c1, 33c2, 33d1, 33d2. The terminal guide portions 33a, 33b, 33c, and 33d are fitted. As a result, the terminal guide portions 33a, 33b, 33c, and 33d abut adjacent to the arrangement regions 32a, 32b, 32c, and 32d corresponding to the electrodes of the semiconductor elements 12b, 12a, 12d, and 12c.

  Here, the setting of the connection terminals 15 and 16 with respect to the holding jig 50 will be described with reference to FIGS. 6 and 7. First, the wiring board 15a of the connection terminal 15 is disposed in the U-shaped section 52a1 formed by the vertical holding portion 52a and the horizontal holding portion 53a of the holding jig 50. Similarly, the wiring board 16a of the connection terminal 16 is disposed in the U-shaped section 52b1 formed by the vertical holding portion 52b and the horizontal holding portion 53b of the holding jig 50. Next, the connecting portions 15e and 16e are made to face each other, and the horizontal holding plate 43 of the terminal fixing jig 40 is sandwiched between the connecting portions 15e and 16e so as to be held by the connecting portions 15e and 16e. At this time, the vertical clamping plate 42 of the terminal fixing jig 40 is disposed on the wiring board 15a of the connection terminal 15 in the U-shaped section 52a1, and the vertical clamping plate 44 is connected in the U-shaped section 52b1. The terminal 16 is disposed on the wiring board 16a.

  At this time, as shown in FIG. 6A, the protruding portion 42a1 of the terminal fixing jig 40 is fitted to the slit portion 51a1 and the engaging portions 51a2 and 51a3 of the supported plate 51a, and the convex portions 42a2 and 42a3. Engage each other. Similarly, the protrusion 44a1 of the terminal fixing jig 40 is fitted to the slit 51b1 and the engagement portions 51b2 and 51b3 of the supported plate 51b, and the protrusions 44a2 and 44a3 are engaged. In this manner, as shown in FIGS. 6 and 7, the connection terminals 15 and 16 are held by the holding jig 50 using the terminal fixing jig 40.

  Next, plate solder is set in the arrangement regions 32a, 32b, 32c, 32d, 32e, and 32f of the opening 32 of the guide jig 30 shown in FIG. Then, the connection terminals 15 and 16 to which the holding jig 50 is attached together with the terminal fixing jig 40 are fitted into the opening 32 of the guide jig 30.

  Then, as shown in part in FIG. 12, the joint portions 15b and 15c of the connection terminal 15 are arranged in the semiconductor elements 12d and 12c. Further, the connection portion 15d of the connection terminal 15 is arranged in the terminal block 14a. Similarly, the joint portions 16b and 16c of the connection terminal 16 are disposed in the semiconductor elements 12b and 12a. Further, the connection portion 16d of the connection terminal 16 is arranged in the terminal block 14b.

  For example, at this time, the joint portions 15c and 16c of the connection terminals 15 and 16 are the terminal guide portions 33d and 33b of the guide jig 30, or the vertical holding portions 52a and 52b and the horizontal holding portions 53a and 53b of the holding jig 50, respectively. And are reliably brought into contact with the main electrodes of the semiconductor elements 12c and 12a together with the sheet solders 13c1 and 13a1.

  Further, the back surfaces 51 a 7 and 51 b 7 of the supported plates 51 a and 51 b of the holding jig 50 are supported by the openings 32 of the support member 31 of the guide jig 30. For this reason, the height of the joint portions 15c, 16c of the connection terminals 15, 16 with respect to the semiconductor elements 12c, 12a is maintained.

  In addition, although illustration is abbreviate | omitted here, it is suitable with respect to the semiconductor elements 12d and 12b similarly by the terminal guide parts 33c and 33a of the guide jig 30 also about the junction parts 15b and 16b of the connection terminals 15 and 16. The height of the semiconductor elements 12d and 12b is maintained by the alignment.

  Next, as shown in FIG. 13, a weight 70 is arranged at the center of the holding jig 50 of the assembly jig 60 on the supported plates 51 a and 51 b. In this state, the sheet solder is melted by heating, and the melted solder is solidified. Accordingly, the joint portions 15b, 15c, 16b, and 16c of the connection terminals 15 and 16 are fixed to the semiconductor elements 12d, 12c, 12b, and 12a by the solders 13d, 13c, 13b, and 13a. Further, the connection portions 15d and 16d of the connection terminals 15 and 16 are fixed to the terminal blocks 14a and 14b.

  When the weight 70 is removed and the holding jig 50 (and the terminal fixing jig 40), the guide jig 30, and the element fixing jig 20 are removed, the semiconductor device 10 shown in FIGS. 10 is removed from the carbon tray 80.

  As described above, the semiconductor device 10 shown in FIGS. 1 and 2 can be manufactured. After that, the semiconductor device 10 manufactured in this way is housed in the opening of the case, a heat sink is attached to the back surface of the semiconductor device 10, and the external connection terminal integrally formed with the case and the terminal of the semiconductor device 10 The blocks 14a, 14b, and 14c are electrically connected. A semiconductor module is configured by sealing the opening with a sealing resin.

  The assembly jig 60 includes the ceramic circuit board 11 in which the semiconductor elements 12a to 12d are arranged in the conductive patterns 11b1 to 11b3, and the joint portions 15c and 15b that are joined to the semiconductor elements 12a to 12d or the conductive patterns 11b1 to 11b3. 16c, 16b and connecting portions 15e, 16e connected to the connecting portions 15c, 15b, 16c, 16b and wiring connected to the connecting portions 15e, 16e and spaced from the connecting portions 15c, 15b, 16c, 16b And connection terminals 15 and 16 having plates 15a and 16a. Such an assembly jig 60 is arranged on the back surfaces of the wiring boards 15a and 16a, and the holding jig 50 having the vertical holding portions 52a and 52b for supporting the wiring boards 15a and 16a from the back surface and the wiring boards 15a and 16a. The terminal fixing jig 40 is provided on the front surface and has vertical holding plates 42 and 44 for holding the vertical holding portions 52a and 52b and the wiring boards 15a and 16a.

  That is, the semiconductor elements of the joint portions 16c, 16b, 15c, 15b of the connection terminals 16, 15 held by the vertical holding portions 52b, 52a formed on the back surfaces 51b7, 51a7 of the supported plates 51b, 51a of the holding jig 50. The height with respect to 12a-12d is maintained.

  The assembly jig 60 is opposed to the ceramic circuit board 11 and terminal guide portions 33c, 33d, 33a, 33b disposed adjacent to the electrodes of the semiconductor elements 12a to 12d and the front surface. The guide jig 30 further includes a support member 31 having an opening 32 provided at a predetermined interval from the terminal guide portions 33c, 33d, 33a, and 33b. At this time, the holding jig 50 is disposed on the guide jig 30, and the back surfaces of the supported plates 51b and 51a are supported by the support member 31, and the joint portions 16c, 16b, 15c, and 15b are connected to the terminal guide portion 33c, 33d, 33a and 33b are respectively aligned with the electrodes.

  That is, in the assembly jig 60, the joint portions 16c, 16b, 15c, and 15b of the connection terminals 16 and 15 become the main electrodes of the semiconductor elements 12a to 12d by the terminal guide portions 33a, 33b, 33c, and 33d of the guide jig 30. Aligned and securely placed.

  For this reason, it becomes possible to fix the connection terminals 16 and 15 with respect to the semiconductor elements 12a to 12d while maintaining the height, and to make the thickness of the solders 13a to 13d uniform. It becomes possible to keep. Here, an example in which two connection terminals 15 and 16 are installed at the same time is shown. However, there may be only one instead of two. In that case, the same effect can be obtained. Here, an example is shown in which the connection terminals 16 and 15 are joined to the semiconductor elements 12a to 12d. Not limited to this example, the connection terminals 16 and 15 may be joined to the conductive patterns 11b1 to 11b3. Moreover, the connection terminals 16 and 15 may be joined to the conductive block arranged on the conductive patterns 11b1 to 11b3. In that case, the same effect can be obtained.

[Second Embodiment]
In the second embodiment, another form of an assembly jig used in manufacturing the semiconductor device 10 of the first embodiment will be described with reference to FIGS. 14 and 15. Note that, in the second embodiment, the same components as those of the assembly jig 60 of the first embodiment are denoted by the same reference numerals, and descriptions thereof are omitted. 14 and 15 are views for explaining the method for manufacturing the semiconductor device of the second embodiment. 14 is a cross-sectional view taken along one-dot chain line YY in FIG. FIG. 15 corresponds to a plan view in FIG.

  In the second embodiment, the insertion hole 21a is aligned when the guide jig 30a is attached to the element fixing jig 20a to the support member 21 of the element fixing jig 20a and the support member 31 of the guide jig 30a. , 31a are formed.

  Further, as shown in FIG. 15, leg portions 51a4, 51a5, 51a6, 51b4, 51b5, 51b6 are formed on the supported plates 51a, 51b of the holding jig 50a. The leg portions 51a4, 51a5, 51a6, 51b4, 51b5, 51b6 are inserted into the support member 21 of the element fixing jig 20a and the support member 31 of the guide jig 30a when the holding jig 50a is attached to the guide jig 30a. It is inserted into 21a and 31a and contacts the conductive pattern 11b of the ceramic circuit board 11. At this time, the height of the leg portions 51a4, 51a5, 51a6, 51b4, 51b5, 51b6 is the same as that of the back surfaces 51a7, 51b7 of the supported plates 51a, 51b of the holding jig 50a and the support member 31 of the guide jig 30a. A space is provided between the front surface and the front surface. In FIG. 14, only the insertion holes 21a and 31a are shown. However, corresponding to the leg portions 51a5, 51a6, 51b5 and 51b6, the support member 21 of the element fixing jig 20a and the support member 31 of the guide jig 30a. The insertion holes are formed in the same manner as the insertion holes 21a and 31a.

  Further, the formation positions and the number of leg portions 51a4, 51a5, 51a6 and leg portions 51b4, 51b5, 51b6 as shown in FIG. 15 are merely examples, and the present invention is not limited to this. Further, the leg portions 51a4, 51a5 and 51a6 and the leg portions 51b4, 51b5 and 51b6 have a columnar shape, and the cross section thereof may be circular, rectangular or elliptical. The insertion holes 21a and 31a of the support member 21 of the element fixing jig 20a and the support member 31 of the guide jig 30a have shapes corresponding to the shapes of the leg portions 51a4 and 51b4.

  Incidentally, in the first embodiment, for example, the thickness (length A) of the support member 21 of the element fixing jig 20 and the thickness of the support member 31 of the guide jig 30 shown in FIG. The tolerances for the length (length C) of the horizontal holding portions 53a and 53b of the holding jig 50 are required to be ± 50 μm, ± 50 μm, and ± 50 μm. Therefore, the tolerance of the distance between the ceramic circuit board 11 and the joint portions 15b, 15c, 16b, and 16c of the connection terminals 15 and 16 is the same as that when the element fixing jig 20, the guide jig 30, and the holding jig 50 are attached in order. The overall tolerance of the assembly jig 60 requires ± 150 μm.

  On the other hand, in the second embodiment, the supported plates 51a and 51b of the holding jig 50a are guided by the legs 51a4, 51a5, 51a6, 51b4, 51b5 and 51b6 formed on the supported plates 51a and 51b. As a result, the legs 51 a 4, 51 a 5, 51 a 6, 51 b 4, 51 b 5, 51 b 6 come into direct contact with the ceramic circuit board 11. For this reason, the tolerance of the distance between the ceramic circuit board 11 and the joint portions 15b, 15c, 16b, 16c of the connection terminals 15, 16 is the length (length C) of the horizontal holding portions 53a, 53b of the holding jig 50a. Only the tolerance ± 50 μm depending on the length (length C ′) of the legs 51a4, 51a5, 51a6, 51b4, 51b5, 51b6 has to be considered, and the tolerance can be reduced.

  Since the tolerances of the element fixing jig 20a and the guide jig 30a can be reduced in this way, the joint portions 15b, 15c, 16b, and 16c of the connection terminals 15 and 16 are replaced with the semiconductor elements 12d, 12c, 12b, and 12a. It becomes possible to control the thickness of the solders 13d, 13c, 13b, and 13a to be joined with high accuracy.

  Furthermore, since the element fixing jig 20a and the guide jig 30a do not require high processing accuracy, the manufacturing cost of the element fixing jig 20a and the guide jig 30a can be reduced.

  Also in the second embodiment, as in the first embodiment, the connection terminals 16 and 15 are properly aligned with the semiconductor elements 12a to 12d, and the height is maintained and fixed. In addition, the thicknesses of the solders 13a to 13d can be kept uniform.

  Further, the assembly jigs 60 and 60a of the first and second embodiments are examples including the holding jig 50 (and the terminal fixing jig 40), the guide jig 30, and the element fixing jig 20. It is listed and explained. The assembly jigs 60 and 60a are not limited to this case, and the assembly jigs 60 and 60a may include at least the holding jig 50 (and the terminal fixing jig 40), and the ceramic circuit board 11 to which the semiconductor elements 12a to 12d are fixed. Thus, it is possible to use only the holding jig 50 (and the terminal fixing jig 40) and the guide jig 30. Moreover, in those cases, the leg part of 2nd Embodiment is applicable, respectively.

  In the first and second embodiments, the example in which the two connection terminals 15 and 16 are installed simultaneously has been described. However, there may be only one instead of two. In that case, the same effect can be obtained. Here, an example in which the connection terminals 15 and 16 are joined to the semiconductor elements 12a to 12d is shown. Not limited to this example, the connection terminals 15 and 16 may be joined to the conductive patterns 11b1 to 11b3. Moreover, the connection terminals 15 and 16 may be joined to the conductive block arranged on the conductive patterns 11b1 to 11b3. In that case, the same effect can be obtained.

DESCRIPTION OF SYMBOLS 10 Semiconductor device 11 Ceramic circuit board 11a Insulation plate 11b, 11b1, 11b2, 11b3 Conductive pattern 11c Metal plate 12a, 12b, 12c, 12d Semiconductor element 12a1, 12b1, 12c1, 12d1 Front surface 13a, 13b, 13c, 13d Solder 14a, 14b, 14c Terminal block 15, 16 Connection terminal 15a, 16a Wiring board 15b, 15c, 16b, 16c Joint part 15d, 16d Connection part 15e, 16e Connection part 20 Element fixing jig 21 Support member 22, 23, 32, 34a, 34b, 34c, 34d Opening 22a, 22b, 22c, 22d, 22e, 22f, 32a, 32b, 32c, 32d, 32e, 32f Arrangement area 30 Guide jig 31 Support member 33a, 33b, 33c, 33d Terminal guide Part 33a1 33 a 2, 33 b 1, 33 b 2, 33 c 1, 33 c 2, 33 d 1, 33 d 2 Hanging part 40 Terminal fixing jig 41, 43 Horizontal clamping plate 42, 44 Vertical clamping plate 42 a 1, 42 b 1, 44 a 1, 44 b 1 Protruding part 42 a 2, 42 a 3, 42 b 2, 42 b 3, 44 a 2 , 44a3, 44b2, 44b3 Convex part 50 Holding jig 51a, 51b Supported plate 51a1, 51b1 Slit part 51a2, 51a3, 51b2, 51b3 Engagement part 51a7, 51b7 Back face 52a, 52b Vertical holding part 52a1, 52b1 U-shaped section 53a, 53b Horizontal holding part

Claims (14)

A substrate on which a semiconductor element is arranged in a conductive pattern;
A connection having a bonding portion bonded to the semiconductor element or the conductive pattern, a connecting portion connected to the bonding portion, and a wiring board connected to the connecting portion and spaced from the bonding portion. A semiconductor device comprising a terminal,
A holding jig that is disposed on the back surface of the wiring board and has a vertical holding portion that supports the wiring board from the back surface;
A terminal fixing jig which is disposed on the front surface of the wiring board and has a vertical holding plate for holding the vertical holding portion and the wiring board;
Assembly jig having. The holding jig further includes a horizontal holding portion connected to the vertical holding portion and having a surface perpendicular to the vertical holding portion,
The terminal fixing jig has a surface that is connected to the vertical clamping plate and is perpendicular to the vertical clamping plate, and further includes a horizontal clamping plate that clamps the horizontal holding portion and the connecting portion.
The assembly jig according to claim 1. The holding jig further includes a supported plate provided at a distance from the vertical holding portion and having a horizontal surface on the vertical holding portion.
The assembly jig according to claim 1 or 2. A first support member formed with a first opening into which a part of the connection terminal, the holding jig and the terminal fixing jig is inserted, and disposed on the back surface of the supported plate of the holding jig; A guide jig having a terminal guide portion that is connected to the first support member and surrounds at least a part of a peripheral edge portion of a joint region to which the joint portion of the connection terminal is joined.
The assembly jig according to claim 3. An element fixing jig formed on the substrate and having a second opening surrounding a part of a peripheral edge of an arrangement region where the semiconductor element is arranged;
Furthermore, the assembly jig of Claim 4 which has. The element fixing jig is disposed on the back surface of the first support member of the guide jig, has a second support member that supports the guide jig from the back surface, and the terminal guide portion has the second opening portion. Disposed adjacent to the joining region,
The assembly jig according to claim 5. The holding jig has a rod-like leg that maintains a predetermined distance between the back surface of the supported plate and the front surface of the substrate, with a tip portion in contact with the back surface of the supported plate. Having a part,
The assembly jig according to claim 3. For the semiconductor device comprising a pair of the connection terminals, the connection terminals being arranged in two rows and having the connecting portions facing each other.
The terminal fixing jig includes the vertical clamping plate and the horizontal clamping plate connected to the vicinity of the center of the vertical clamping plate and having a surface perpendicular to the vertical clamping plate, and the vertical clamping plate and the horizontal clamping plate T-shaped cross section is configured with the sandwich plate,
The holding jigs are arranged in two rows corresponding to the connection terminals, the horizontal holding portions facing each other, and connected to the horizontal holding portion from the horizontal holding portion toward the horizontal holding portion in the other row. The vertical holding portion extending
A plurality of the connection terminals are arranged around the horizontal holding plate, and are held by the horizontal holding portions facing each other,
The wiring board of the connection terminal is clamped perpendicularly to the clamping direction of the vertical clamping plate with the vertical holding portion and the vertical clamping plate.
The assembly jig according to any one of claims 2 to 6. A substrate on which a semiconductor element is arranged in a conductive pattern, a junction part bonded to the semiconductor element or the conductive pattern, a connection part connected to the connection part, and a distance from the connection part connected to the connection part A preparation step of preparing a connection terminal having a wiring board provided with a gap;
A first attachment step of attaching a terminal fixing jig having a vertical clamping plate disposed on the front surface of the wiring board to the connection terminal;
Second attachment for attaching a holding jig having a vertical holding part for holding the wiring board and the vertical holding plate for holding the wiring board to the connection terminal to which the terminal fixing jig is attached. Process,
A connection terminal arrangement step of arranging the holding jig so that the bonding portion is arranged on the semiconductor element or the conductive pattern with respect to the substrate;
A method for manufacturing a semiconductor device comprising: In the first mounting step, the terminal fixing jig further has a horizontal clamping plate connected to the vertical clamping plate and having a surface perpendicular to the vertical clamping plate, arranged on the outer surface of the connecting portion,
In the second mounting step, the holding jig further includes the horizontal holding part connected to the vertical holding part and having a surface perpendicular to the vertical holding part, and the horizontal holding plate to hold the connecting part. Clamping perpendicular to the clamping direction of the plate,
A method for manufacturing a semiconductor device according to claim 9. Prior to the connection terminal arrangement step, the peripheral edge of the bonding region where the first support member in which the first opening is formed and the first support member are connected to the substrate, and the connection portion of the connection terminal is bonded. A guide jig having a terminal guide portion surrounding at least a part of the portion,
The holding jig further includes a supported plate provided at a distance from the vertical holding portion and having a horizontal surface on the vertical holding portion,
In the connection terminal arrangement step, the holding jig is arranged on the guide jig, and the connection terminal, the holding jig, and a part of the terminal fixing jig are inserted into the first opening. The back surface of the supported plate is supported by the first support member, and the joining portion is aligned with the joining region by the terminal guide portion.
11. A method for manufacturing a semiconductor device according to claim 9 or 10. In the preparing step, an element fixing jig in which a second opening surrounding the part of the peripheral area of the arrangement area where the semiconductor element is arranged is formed on the substrate, and the second fixing jig is arranged. Placing the semiconductor element in the placement region in the opening;
A method for manufacturing a semiconductor device according to claim 9. Before the connection terminal arrangement step, the guide jig is arranged on the element fixing jig, and the terminal guide portion is arranged in the joining region through the second opening.
A method for manufacturing a semiconductor device according to claim 12. The holding jig has a rod-like leg on the back surface of the supported plate,
In the connecting terminal arranging step, the holding jig is arranged with respect to the substrate, the tip of the leg is in contact with the front surface of the substrate, and the back surface of the supported plate and the substrate Maintain a certain distance from the front surface,
A method for manufacturing a semiconductor device according to claim 11.

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