JP2019186240A - Substrate support base - Google Patents

Abstract

A substrate support that can be easily and inexpensively repaired is provided. A plate-like member having (a) a base (10a) and (b) a plurality of protrusions (11) protruding from the surface and supporting a substrate (PO), the material being used for a display panel, for example, It is composed of a glass substrate GS and an organic material 10b1 used for an insulating film, and a support plate 10b which is exchangeably mounted on a base 10a. [Selection diagram] FIG.

Description

  The present invention relates to a substrate support base for supporting a substrate which is provided in various apparatuses used for manufacturing a display panel and constitutes the display panel.

  In a process of manufacturing a display panel such as a liquid crystal panel or an organic EL panel, various processes are performed on a substrate constituting the display panel. Some apparatuses that perform the various processes are provided with a substrate support for supporting the substrate. For example, the substrate support described in Patent Document 1 below is provided with a plurality of convex portions on the surface of the plate-like member for the purpose of avoiding the adhesion of foreign matters to the back surface of the substrate. The substrate is configured to be supported at the tip. Note that the substrate support described in Patent Document 1 below has a plurality of protrusions formed by sticking a plurality of resin protrusions on a surface that supports the substrate.

JP 2012-28622 A

  When the substrate is supported by a plurality of convex portions, such as the substrate support described in Patent Document 1, the plurality of convex portions are worn by contact with the substrate, plasma Due to the chemical solution or the like, it may deteriorate over time, for example, sticking of the substrate, peeling charging, exposure failure, scratches on the back surface of the substrate, etc. may occur. Therefore, when the plurality of convex portions deteriorates over time, it is necessary to repair the substrate support base. The board | substrate support stand of the said patent document 1 can repair a some convex part by peeling a some resin protrusion and sticking a new some resin protrusion. However, the substrate support described in Patent Document 1 must be prepared by manufacturing a plurality of resin protrusions, and a special operation of attaching the resin protrusions is required. .

  This invention is made | formed in view of such a situation, and makes it a subject to provide the board | substrate support stand which can be repaired easily and cheaply, when a some convex part deteriorates over time.

In order to solve the above problems, the substrate support of the present invention is
A substrate support for supporting a substrate constituting a display panel,
The base,
A plate-like member protruding from the surface and having a plurality of protrusions for supporting the substrate, made of a material used for the display panel, and a support plate attached to the base in a replaceable manner;
It is characterized by including.

  According to the substrate support base configured as described above, since the support plate is formed of the material used for the display panel, no new material is required to manufacture the support plate, and the cost for repair is reduced. be able to. In addition, by simply replacing the support plate made of the material used for the display panel, the repair of the substrate support base is completed, reducing the time required for repair, in other words, stopping the production of the display panel It is possible to shorten the running time. Further, in the substrate support base having this configuration, the plurality of convex portions of the support plate are patterned on the glass substrate by, for example, a photolithography method by using various apparatuses and techniques used for manufacturing a display panel. It can be easily formed by a technique or the like.

  In the substrate support base having this configuration, the material used for the support plate is not particularly limited, but the plurality of convex portions are softer than the substrate, such as a material that does not damage the back surface of the substrate, for example, a resin-based material. It is desirable to be formed of a material. In addition, the material used for the support plate should take into consideration various viewpoints, such as a material that can reduce the deterioration of the plurality of protrusions, and a material that is unlikely to generate dust due to wear of the plurality of protrusions. Can be selected. Furthermore, the support plate may be formed of a single material or may be formed of two or more materials.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate support stand which can be repaired easily and cheaply in the case where several convex part deteriorates aged can be provided.

It is a figure which shows schematically the substrate processing apparatus provided with the substrate support stand of embodiment of this invention. It is a top view of the display panel comprised including the board | substrate which the board | substrate support stand of embodiment of this invention supports. FIG. 3 is a plan view showing a pixel array of the display panel shown in FIG. 2. FIG. 3 is a cross-sectional view of the display panel shown in FIG. 2 (AA cross section in FIG. 3). It is a perspective view of the board | substrate support stand of embodiment of this invention. It is sectional drawing which expands and shows the board | substrate support stand of embodiment of this invention. It is a figure for demonstrating the manufacturing process of the support plate shown in FIG. It is a figure for demonstrating the attachment to the base of the support plate shown in FIG.

  The substrate support 10 which is an embodiment of the present invention is provided in various substrate processing apparatuses that perform processing on a substrate constituting the liquid crystal panel in the manufacturing process of the liquid crystal panel. FIG. 1 shows a CVD apparatus 12 for forming an insulating film as one of the substrate processing apparatuses. The CVD apparatus 12 will be described as an example for the substrate support 10 of this embodiment.

<Configuration of substrate processing apparatus>
As will be described in detail later, the substrate constituting the liquid crystal panel is patterned by sequentially forming each conductive film and each insulating film constituting various wirings on the glass substrate using a known photolithography method. Manufactured by. The CVD apparatus 12 performs a film forming process by a chemical vapor deposition method when forming the conductive film or the insulating film. The CVD apparatus 12 includes a processing chamber 14 that accommodates a processing object PO such as a glass substrate, a decompression unit 16 that decompresses the inside of the processing chamber 14, and a pressure in the processing chamber 14 that is connected to the decompression unit 16. A pressure regulating valve 18 for adjusting, a film material supplying unit 20 for supplying a film material, and a CVD film forming unit 22 which is disposed in the processing chamber 14 and chemically deposits the film material on the processing object PO. Consists of including.

  Specifically, the substrate support 10 of this embodiment for supporting the processing object PO is provided on the bottom side of the processing chamber 14. A shower head 24 is provided on the ceiling side of the processing chamber 14 so as to face the substrate support 10 and to eject the film material supplied from the film material supply unit 20 into the processing chamber 14. Yes. The shower head 24 is integrally provided with an upper electrode connected to an AC power source AC. The film material supply unit 20 is connected to the shower head 24 through the pipe 20a so as to be able to supply the mixed gas and the insulating film material, respectively. Further, a membrane material supply amount adjustment valve 20b for adjusting the supply amount of the membrane material is provided in the middle of the pipe 20a of the membrane material supply unit 20, and the opening degree is electrically controlled. Thus, the supply amount of the material supplied into the processing chamber 14 can be finely adjusted. On the other hand, the substrate support base 10 includes a base 10a and a support plate 10b which is a plate-like member fixed on the base 10a and supporting the object to be processed PO, which will be described in detail later. Consists of. The base 10a is integrally provided with a lower electrode connected to the ground GND. By forming an electric field between the lower electrode and the upper electrode provided on the shower head 24, a processing target is formed. The deposition of the film material on the object PO can be promoted. Incidentally, the CVD film forming unit 22 is configured including the substrate support 10 and the shower head 24. The decompression unit 16 is connected to the processing chamber 14 via an exhaust pipe 16 a and has a vacuum pump that sucks air in the processing chamber 14. The pressure adjustment valve 18 is provided in the middle of the exhaust pipe 16a, and the pressure in the processing chamber 14 can be finely adjusted by electrically controlling the opening degree.

  The base 10a of the substrate support 10 includes a substrate lifting / lowering device 26 that lifts and lowers the processing object PO on the support plate 10b. The substrate lifting device 26 includes a plurality of lift pins 26a and a motor (not shown) that moves the lift pins 26a in the vertical direction. The base 10a is formed with a pin receiving recess 10a1 for receiving the lift pin 26a, and the lift pin 26a is normally kept at a position retracted from the upper surface of the base 10a (standby position). The substrate lifting device 26 supports the processing object PO in a state where it is lifted from the support plate 10b by moving the lift pin 26a from the standby position to a predetermined height position (delivery position) protruding on the support plate 10b. can do. As a result, the processing object PO can be delivered to and from an external robot arm (not shown). Specifically, when the processing object PO is accommodated in the processing chamber 14, when the processing object PO is carried into the processing chamber 14 by the robot arm, the lift pin raised to the delivery position. The workpiece PO is placed on the support plate 10b by placing it on the substrate support table 10 and lowering the lift pins 26a to the standby position. On the other hand, when the processing object PO is taken out of the processing chamber 14, the lift pins 26 a are raised to lift the processing object PO from the substrate support 10 and position it at the delivery position, and the robot arm moves the processing object PO to the processing chamber 14. It is received and carried out of the processing chamber 14.

<Configuration of display panel>
Next, a liquid crystal panel 30 as a display panel including a substrate supported by the substrate support 10 will be described with reference to FIGS. Note that what is to be supported by the substrate support 10 of the present embodiment is not limited to a substrate of a liquid crystal panel, and may be a substrate such as an organic EL panel.

  As shown in FIG. 2, the liquid crystal panel 30 has a horizontally long rectangular shape as a whole. The display surface of the liquid crystal panel 30 includes a display area (active area) AA on which an image is displayed, a non-display area (non-active area) NAA that has a frame shape (frame shape) surrounding the display area AA and no image is displayed. It is divided into. Incidentally, in FIG. 2, the inner one-dot chain line represents the outer shape of the display area AA, and the outer area from the inner one-dot chain line is the non-display area NAA. A part of each drawing shows an X-axis, a Y-axis, and a Z-axis, and each axis direction is drawn in a common direction in each drawing. The long side direction in the liquid crystal panel 30 matches the X-axis direction of each drawing, and the short side direction matches the Y-axis direction of each drawing. Further, the vertical direction (front and back direction) is based on FIG. 4, and the upper side of the figure may be referred to as the front side and the lower side of the figure may be referred to as the back side.

  As shown in FIG. 4, the present liquid crystal panel 30 is interposed between a pair of substrates 30a and 30b that are substantially transparent and have excellent translucency, and has optical characteristics due to application of an electric field interposed between the substrates 30a and 30b. A liquid crystal layer 30c containing liquid crystal molecules as a changing substance, and both substrates 30a and 30b are bonded together with a sealing agent (not shown) while maintaining a cell gap corresponding to the thickness of the liquid crystal layer 30c. Of the pair of substrates 30a and 30b constituting the liquid crystal panel 30, the front side (front side) substrate is a CF substrate (counter substrate) 30a, and the back side (rear side) substrate is an array substrate (display substrate, active matrix substrate, TFT substrate) 30b. The CF substrate 30a and the array substrate 30b are each formed by laminating various films on the inner surface side of the glass substrate GS. As shown in FIG. 2, the array substrate 30b is larger than the CF substrate 30a, and a part of the array substrate 30b extends to the CF substrate 30a. The extended portion (non-display area NAA) The driver (panel drive component) 32 and the flexible substrate (signal transmission member) 34 are mounted as components for supplying various signals.

  Next, the internal structure of the liquid crystal panel 30 will be described. As shown in FIG. 3, on the inner surface side of the display area AA of the array substrate 30b, a large number of TFTs (thin film transistors) 40 and pixel electrodes 42 which are switching elements are arranged along the X-axis direction and the Y-axis direction. The gate wiring (scanning wiring) 44 and the source wiring (signal wiring, data wiring) 46 are arranged around the TFT 40 and the pixel electrode 42 so as to surround the TFT 40 and the pixel electrode 42. It is installed. The gate wiring 44 extends substantially straight along the X-axis direction, while the source wiring 46 extends substantially along the Y-axis direction, and a part of the gate wiring 44 extends along the X-axis direction and the Y-axis. It is set as the diagonally extending part 46a extended along the diagonal direction with respect to an axial direction. The gate wiring 44 and the source wiring 46 are connected to the gate electrode 40a and the source electrode 40b of the TFT 40, respectively, and the pixel electrode 42 is connected to the drain electrode 40c of the TFT 40. The TFT 40 is driven based on various signals respectively supplied to the gate wiring 44 and the source wiring 46, and the supply of the potential to the pixel electrode 42 is controlled in accordance with the driving. The pixel electrode 42 is a substantially parallelogram having a vertically long planar shape, and the source wiring 46 is connected to the adjacent pixel electrode 42 in the short side direction (X-axis direction) in the long side direction (Y-axis direction). ) Between the adjacent pixel electrodes 42, respectively. The long side of the pixel electrode 42 is parallel to the obliquely extending portion 46 a of the source wiring 46.

  As shown in FIGS. 3 and 4, on the inner surface side of the display area AA of the array substrate 30b, the common electrode 48 overlaps with all the pixel electrodes 42 so as to overlap the pixel electrodes 42 (closer to the liquid crystal layer 30c). Side). The common electrode 48 is always supplied with a substantially constant reference potential, extends over substantially the entire area of the display area AA, and has a vertically elongated pixel overlapping opening in a portion overlapping each pixel electrode 42. A plurality (two in FIG. 3) of openings (pixel overlapping slits and alignment control slits) 48a are formed. The pixel overlapping opening portion 48 a extends along the obliquely extending portion 46 a of the source wiring 46. When a potential difference is generated between the pixel electrode 42 and the common electrode 48 that overlap each other as the pixel electrode 42 is charged, an array is formed between the opening edge of the pixel overlapping opening 48 a and the pixel electrode 42. Since a fringe electric field (an oblique electric field) including a component in a normal direction with respect to the plate surface of the array substrate 30b is generated in addition to the component along the plate surface of the substrate 30b, the liquid crystal contained in the liquid crystal layer 30c is generated using the fringe electric field. The orientation state of the molecule can be controlled. That is, the operation mode of the liquid crystal panel 30 according to the present embodiment is the FFS (Fringe Field Switching) mode.

  On the other hand, in the display area AA on the inner surface side of the CF substrate 30a, as shown in FIG. 4, three color filters 50 exhibiting red (R), green (G), and blue (B) are provided. As the color filter 50, a plurality of color filters having different colors are repeatedly arranged along the gate wiring 44 (X-axis direction), and they extend along the source wiring 46 (generally in the Y-axis direction). They are arranged in stripes. These color filters 50 are arranged so as to overlap each pixel electrode 42 on the array substrate 30b side in a plan view. The color filters 50 adjacent to each other in the X-axis direction and exhibiting different colors are arranged so that the boundary (color boundary) overlaps with the source wiring 46 and a light shielding unit 52 described later. In the liquid crystal panel 30, the R, G, B color filters 50 arranged along the X-axis direction and the three pixel electrodes 42 facing each color filter 50 constitute a three-color pixel portion PX. ing. In the liquid crystal panel 30, display pixels capable of color display with a predetermined gradation are configured by the pixel portions PX of three colors R, G, and B adjacent along the X-axis direction. The arrangement pitch in the X-axis direction in the pixel unit PX is, for example, about several tens of μm.

  In the display area AA on the inner surface side of the CF substrate 30a, as shown in FIGS. 3 and 4, a light shielding portion (inter-pixel light shielding portion, black matrix) 52 that shields light is formed. The light shielding portion 52 has a substantially lattice shape so as to partition between adjacent pixel portions PX (pixel electrodes 42), and overlaps with most of the pixel electrodes 42 on the array substrate 30b side in a plan view. Has a pixel opening 52a that transmits light. A plurality of pixel openings 52a are arranged in a matrix in the X-axis direction and the Y-axis direction in the same manner as the pixel electrode 42 in the plate surface of the CF substrate 30a. The light-shielding part 52 functions to prevent light from passing between adjacent pixel parts PX and to ensure the independence of the gradation of each pixel part PX, and particularly extends along the source wiring 46. The portion prevents color mixture between the pixel portions PX exhibiting different colors. The light shielding portion 52 is arranged so as to overlap the gate wiring 44 and the source wiring 46 on the array substrate 30b side in a plan view.

  As shown in FIG. 4, a spacer member 54 is disposed between the substrates 30a and 30b in the display area AA so as to maintain a constant thickness (cell gap, interval) of the liquid crystal layer 30c. Yes. The spacer member 54 is provided on the upper layer side of the common electrode 48 in the array substrate 30b so as to penetrate the liquid crystal layer 30c, and is in contact with the color filter 50 of the CF substrate 30a. The spacer member 54 is disposed at the color boundary of the color filter 50. Alignment films 56a and 56b for aligning liquid crystal molecules contained in the liquid crystal layer 30c are respectively formed on the innermost surfaces of both the substrates 30a and 30b that are in contact with the liquid crystal layer 30c. Both alignment films 56a and 56b are made of, for example, polyimide, and are formed in a solid shape at least over almost the entire display area AA of each of the substrates 30a and 30b. Both alignment films 56a and 56b are photo-alignment films capable of aligning liquid crystal molecules along the irradiation direction of light in a specific wavelength region (for example, ultraviolet rays). In the CF substrate 30a, a planarizing film may be formed between the alignment film 56a and the color filter 50.

  Here, various films laminated on the inner surface side of the array substrate 30b will be described. As shown in FIG. 4, the glass substrate GS constituting the array substrate 30b includes a first metal film (gate metal film, conductive film) 30b1, a gate insulating film 30b2, and a semiconductor film in order from the lower layer side (glass substrate GS side). 30b3, second metal film (source metal film, conductive film) 30b4, planarization film (insulating film, organic insulating film) 30b5, first transparent electrode film (conductive film) 30b6, interlayer insulating film (insulating film, inorganic insulating film) ) 30b7, a second transparent electrode film (conductive film) 30b8, and an organic insulating film 30b9 are stacked.

The first metal film 30b1 and the second metal film 30b4 are each a single layer film made of one kind of metal material selected from Ag, Al, Cu, Ti, Mo, or the like, or a laminated film made of different kinds of metal materials. Since it is made of or alloy, it has electrical conductivity and light shielding properties, and is arranged so as to straddle the display area AA and the non-display area NAA. Among these, the first metal film 30b1 constitutes the gate wiring 44, the gate electrode 40a of the TFT 40, and the like. The second metal film 30b4 constitutes the source wiring 46, the source electrode 40b and the drain electrode 40c of the TFT 40, and the like. The gate insulating film 30b2 and the interlayer insulating film 30b7 are each made of an inorganic material such as silicon nitride (SiN _x ), silicon oxide (SiO ₂ ), and the second metal film 30b4 and the second transparent electrode film 30b8 on the upper layer side, and the lower layer The first metal film 30b1 and the first transparent electrode film 30b6 on the side are kept in an insulating state. Each of the insulating films 30b2 and 30b7 made of an inorganic material is disposed so as to straddle the display area AA and the non-display area NAA. Each of the insulating films 30b2 and 30b7 made of an inorganic material has a smaller film thickness than a planarizing film 30b5 and an organic insulating film 30b9 described later. The planarizing film 30b5 and the organic insulating film 30b9 are made of an organic material such as an acrylic resin (for example, PMMA). The planarizing film 30b5 functions to planarize a step generated on the lower layer side than itself. The organic insulating film 30b9 constitutes the spacer member 54 and the like. The semiconductor film 30b3 is made of a thin film using, for example, amorphous silicon or an oxide semiconductor as a material, and constitutes a channel portion (semiconductor portion) 40d connected to the source electrode 40b and the drain electrode 40c in the TFT 40. The first transparent electrode film 30b6 and the second transparent electrode film 30b8 are made of a transparent electrode material (for example, ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), etc.), and straddle the display area AA and the non-display area NAA, respectively. Arranged in the form. Among these, the first transparent electrode film 30b6 constitutes the pixel electrode 42 and the like, and the second transparent electrode film 30b8 constitutes the common electrode 48 and the like.

  Next, the configuration of the TFT 40 and the pixel electrode 42 will be described in detail. As shown in FIG. 3, the drain electrode 40c is substantially L-shaped in plan view, and one end of the drain electrode 40c is opposed to the source electrode 40b and connected to the channel portion 40d, whereas the other end The side is connected to the pixel electrode 42. The pixel electrode 42 made of the first transparent electrode film 30b6 protrudes toward the TFT 40 side along the Y-axis direction from the electrode main body 42a and the substantially parallelogram-shaped electrode main body 42a overlapping the pixel opening 52a of the light shielding portion 52. The contact portion 42b is connected to the drain electrode 40c. The contact portion 42b made of the first transparent electrode film 30b6 and the drain electrode 40c made of the second metal film 30b4 are partially overlapped with each other, and the overlapping portions are located on the planarizing film 30b5 interposed therebetween. They are connected to each other through contact holes 58 formed with openings. When the TFT 40 is driven based on the scanning signal supplied from the gate wiring 44 to the gate electrode 40a, the potential related to the image signal supplied to the source wiring 46 is supplied from the source electrode 40b through the channel portion 40d. This is supplied to the drain electrode 40c, whereby the pixel electrode 42 is charged.

<Configuration of substrate support>
In the process of manufacturing the pair of substrates 30a and 30b of the liquid crystal panel 30 described above, various substrate processing apparatuses that perform processing on them are used. For example, a sputtering apparatus for forming the first metal film 30b1 and the second metal film 30b4 on the array substrate 30b, the electrode films 30b6, 30b8, the insulating films 30b2, 30b5, 30b7, 30b9, and the semiconductor film 30b3 on the array substrate 30b. CVD equipment that performs film formation, exposure equipment that uses a photomask on a resist material applied on the substrate to expose the circuit pattern shape, etc., and inspection that inspects the pattern formed on the substrate for defects Equipment, etching equipment that removes exposed parts of the film (where it is not covered with resist material) by etching, annealing equipment that heat-treats the film to improve the performance of elements on the substrate, and manufactures in large sizes A cutting apparatus for cutting the liquid crystal panel into a predetermined size.

  The substrate support 10 of this embodiment is provided in at least one of these various substrate processing apparatuses. Hereinafter, the substrate support 10 of the present embodiment will be described in detail with reference to FIGS. As described above, the substrate support base 10 includes a base 10a, a support plate 10b fixed on the base 10a to support a processing target, and a substrate lifting device 26. Composed. As shown in FIG. 6, the support plate 10 b has a plurality of convex portions 11 on the surface, and supports the processing object PO at the tips of the plurality of convex portions 11.

  When the processing object PO is supported by the plurality of convex portions 11, it is possible to suppress adhesion of foreign matters to the back surface of the processing object PO, as compared to the case where the processing object PO is supported by a flat surface. However, the plurality of convex portions 11 are deteriorated with age due to wear due to contact with the processing object PO, plasma / chemical solution, etc., for example, sticking of substrates, peeling charging, poor exposure, scratches on the back surface of the substrate. Etc. may occur. Therefore, the substrate support base configured to support the processing object PO by the plurality of convex portions needs to be repaired in the above case. In view of this, the substrate support base 10 of the present embodiment has a configuration that can be easily repaired, more specifically, a configuration in which the support plate 10b can be replaced with respect to the base 10a. . Below, the structure of the support plate 10b and the attachment of the base 10a of the support plate 10b will be described in detail.

  As shown in FIGS. 6 and 7D, the support plate 10b uses a glass substrate GS used as a pair of substrates 30a and 30b of the liquid crystal panel 30 as a base material, and a plurality of glass plates GS on the surface of the glass substrate GS. Protrusions 11 are formed. The plurality of convex portions 11 are patterned by using the technique and apparatus for manufacturing the pair of substrates 30a and 30b of the liquid crystal panel 30, more specifically, by using the above-described various substrate processing apparatuses and by photolithography. It has come to be.

  Specifically, as shown in FIG. 7A, an organic material such as an acrylic resin used for the planarizing film 30b5 and the organic insulating film 30b9 is first formed on the glass substrate GS using a CVD apparatus. A film 10b1 is formed. In addition, since an organic material becomes a comparatively film thickness, it is suitable for forming the some convex part 11. FIG. Next, a resist material Re is applied on the organic film 10b1, and as shown in FIG. 7B, exposure and development are performed using a photomask FM, and the positions corresponding to the plurality of convex portions 11 are formed. The resist material Re is left. Subsequently, as shown in FIG. 7C, etching is performed, and portions other than the portion where the resist material Re of the organic film 10b1 is left are removed by a predetermined thickness. Finally, the resist material Re is peeled off, and a plurality of convex portions 11 are formed by the organic film 10b1.

  In the present embodiment, the photomask FM used when patterning the plurality of convex portions 11 is a photomask used when forming the TFT 40 on the array substrate 30b, more specifically, contacts the planarizing film 30b5. It is a photomask used when patterning the hole 58. Incidentally, when patterning the contact hole 58 in the planarizing film 30b5, a positive photolithography method is used, whereas when patterning the plurality of protrusions 11, a negative photolithography method is used.

  In addition, although the photomask FM may prepare a thing for exclusive use for forming the some convex part 11, if the thing used at the time of manufacture of the liquid crystal panel 30 is used, the repair cost of the support plate 10b will be reduced. Can be suppressed. The photomask FM used when patterning the plurality of convex portions 11 is used for patterning the spacer member 54 on the organic insulating film 30b9, for example, besides the one used for patterning the contact hole 58 in the planarizing film 30b5. What is used can also be adopted. Since the contact hole 58 and the spacer member 54 are regularly arranged on the glass substrate GS, the plurality of convex portions 11 are regularly formed on the glass substrate GS by using these photomasks. be able to. Although a detailed description is omitted, those used when manufacturing the CF substrate 30a may be used.

In the present embodiment, the plurality of convex portions 11 are formed only from the organic film 10b1 that is one film, but may be formed by stacking two or more films. For example, silicon nitride (SiN) used for the gate insulating film 30b2 and the interlayer insulating film 30b7 having relatively high hardness compared to that shown in FIG. 7D for the purpose of suppressing wear of the plurality of convex portions 11. _x ) can be laminated to form a plurality of convex portions 11.

  Furthermore, as shown in FIG. 7B, the support plate 10b can be used in a state where the resist material Re at positions corresponding to the plurality of convex portions 11 is left by exposure and development. That is, the resist material Re can be used as the plurality of convex portions 11. Since the supporting plate having this structure does not require the etching and resist stripping steps described above, the manufacturing time of the supporting plate can be shortened and, in turn, the repair time of the substrate supporting table can be shortened.

  As shown in FIGS. 5 and 8, the base 10a is provided with a plurality of lift pins 26a of the substrate lifting device 26 in a cross shape. In the manufacturing process of the support plate 10b, patterning of the plurality of convex portions 11 is performed on the glass substrate GS having substantially the same size as the base 10a. As shown in FIG. 8, the support plate 10b is divided into four parts 10bp to avoid the plurality of lift pins 26a, and these four parts 10bp are attached to the base 10a. In the manufacturing process, the liquid crystal panel 30 is divided into a predetermined size by dividing a liquid crystal panel manufactured in a large size by a dividing device, and the supporting plate 10b is divided into four by using the dividing device. It is. Incidentally, since the plurality of lift pins 26a are arranged in a cross shape in the substrate support base 10, the support plate 10b is divided into four parts. However, the support plate 10b is arranged according to the arrangement position of the plurality of lift pins 26a. It can be cut into an appropriate shape and size by a cutting device.

  In the substrate support base 10 of this embodiment, as shown in FIG. 6, the support plate 10b is fixed to the base 10a by an adhesive 10c such as a resin or silicon base. The method for fixing the support plate 10b to the base 10a is not limited thereto, and for example, an electrostatic chuck may be provided on the base and electrically fixed. Further, depending on the type of the substrate processing apparatus, the surface of the base and the back surface of the support plate may be merely mirror-finished and mounted without fixing the support plate to the base.

  The support plate 10b having the above-described structure is manufactured using a glass substrate and a film forming material that have a large stock for manufacturing the liquid crystal panel 30, and uses only an apparatus for manufacturing the liquid crystal panel 30. Manufactured. Therefore, according to this board | substrate support stand 10, in order to manufacture the support plate 10b, a material and a new installation are not required and the cost concerning repair can be held down. Further, since the support plate 10b is formed only of the material used for the liquid crystal panel 30, it is possible to immediately start manufacturing the support plate 10b, and only by replacing the manufactured support plate 10b, the substrate support base Since the repair of 10 is completed, it is possible to reduce the time required for the repair, in other words, the time during which the production of the liquid crystal panel is stopped.

DESCRIPTION OF SYMBOLS 10 ... Substrate support stand, 10a ... Base, 10b ... Support plate, 10b1 ... Organic film, 11 ... Convex part, 12 ... CVD apparatus (substrate processing apparatus), 26 ... Substrate lifting device, 26a ... Lift pin, 30: Liquid crystal panel , 30a ... CF substrate, 30b ... array substrate, 40 ... TFT [switching element], 54 ... spacer member, 58 ... contact hole, GS ... glass substrate, PO ... processing object (substrate), FM ... photomask, Re ... Resist material

Claims (7)

A substrate support for supporting a substrate constituting a display panel,
The base,
A plate-like member that protrudes from the surface and has a plurality of convex portions for supporting the substrate, and is made of a material used for the display panel and is attached to the base in a replaceable manner. The board,
A substrate support base comprising: The substrate constituting the display panel is a laminate of a plurality of films on a glass substrate,
The support plate is
The substrate support table according to claim 1, wherein the plurality of convex portions are formed on the glass substrate by a material used for at least one of the plurality of films.   The substrate support table according to claim 2, wherein the plurality of convex portions are patterned on the glass substrate using a photomask used when forming the plurality of films. The substrate constituting the display panel is a plurality of switching elements formed by laminating the plurality of films on the glass substrate,
The board | substrate support stand of Claim 3 by which the said several convex part was patterned on the said glass substrate using the photomask used when forming these switching elements.   The board | substrate support stand as described in any one of Claims 2-4 in which these convex parts were formed with the organic material used for an insulating film among these films. The support plate is
2. The substrate support according to claim 1, wherein the plurality of convex portions are formed by exposing and developing a resist material on a glass substrate. The substrate support is
It has a plurality of lift pins provided on the base so as to be movable in the vertical direction, and includes a substrate lifting device that lifts and lowers the substrate on the support plate by moving the lift pins in the vertical direction.
The support plate is
The board | substrate support stand as described in any one of Claims 1-5 which were divided | segmented into plurality and each divided | segmented into the plurality was attached on the said base avoiding these several lift pins.

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