JP2019186180A - 超加速熱素材を用いた発熱デバイス及びその製造方法 - Google Patents
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Abstract
【解決手段】一つの観点は、基板201と、基板上に形成された金属酸化物層202と、金属酸化物層上に形成され、格子状に配列された球状の超加速熱素材ドットと、金属酸化物層及び超加速熱素材ドット上に形成された導電性接着剤層204とを含んでなり、球状の超加速熱素材ドットは、下部が金属酸化物層に含まれ、上部は導電性接着剤層に含まれる、発熱デバイス。
【選択図】図1
Description
基板と、
前記基板上に形成された金属酸化物層と、
前記金属酸化物層上に形成され、格子状に配列された球状の超加速熱素材ドットと、
前記金属酸化物層及び超加速熱素材ドット上に形成された導電性接着剤層とを含み、
前記球状の超加速熱素材ドットは、下部が金属酸化物層に含まれ、上部は導電性接着剤層に含まれ得る。
第1基板上に金属酸化物層を形成する段階と、
第2基板の導電性接着剤層上に、常温化学連続工程によって球状の超加速熱素材ドットを格子配列状に形成する段階と、
前記球状の超加速熱素材ドットが形成された第2基板、および金属酸化物層が形成された第1基板をローラーに通過させ、第2基板の導電性接着剤層から第1基板の金属酸化物層に球状の超加速熱素材ドットをラミネート付着させる段階とを含んでなり、
ここで、前記球状の超加速熱素材ドットは、下部が金属酸化物層に含まれ、上部は導電性接着剤層に含まれ得る。
マイクロ波発生器から発生したマイクロ波を磁界形成空間へ案内する段階と、
前記磁界形成空間内へプラズマソースガスを流入させる段階と、
前記磁界形成空間内でプラズマソースガスをマイクロ波に露出させてプラズマ状態に維持する段階と、
前記プラズマ内の電子とイオンを磁界の影響で電子サイクロトロン共鳴(ECR;Electro Cyclotron Resonance)させて高いエネルギー密度のプラズマを維持する段階と、
高いエネルギー密度のプラズマ領域内に蒸着膜形成用超加速熱素材ソースガスを投入させて、活性化されたイオンとして提供する段階と、
前記活性化されたイオンを第2基板の表面で瞬間表面化学反応させることにより、超加速熱素材ドットを連続的に形成する段階とを含むことができる。
前記球状の超加速熱素材ドット上に保護フィルムを形成する段階と、
前記超加速熱素材ドットから保護フィルムを除去する段階とをさらに含むことができる。
実施例1
2 : 断面積
101 : 前方加熱領域
102 : 中間加熱領域
103 : 熱損失
104 : 拡散
105 : 拡散層
106 : 熱加速領域
107 : 熱貯蔵領域
108 : 超加速熱領域
201 : 基板
202 : 金属酸化物
203 : 超加速熱素材
204 : 導電性接着剤
205 : 第2基板
206 : 超加速熱素材ベースフィルム
207 : 金属複合酸化物フィルム
208 : 第1基板(金属酸化物ベースフィルム)
209 : 電極
210 : 超加速熱素材フィルム
300 : ノーマルタイプ 発熱デバイス
301 : アセンブリリングタイプ発熱デバイス
302 : 絶縁フィルム
303 : 発熱デバイス
304 : 接着フィルム
305 : レンズ
Claims (15)
- SnF2、SnF4、スズニッケルフッ化物(SnNiF)、スズクロムフッ化物(SnCrF)、スズ亜鉛フッ化物(SnZnF)、亜鉛ニッケルフッ化物(ZnNiF)及びこれらの組み合わせよりなる群から選択される、発熱デバイス用超加速熱素材。
- 前記超加速熱素材は、直径50〜100nmの球状の超加速熱素材ドットであって、発熱デバイス上に格子状に配列される、請求項1に記載の発熱デバイス用超加速熱素材。
- 前記超加速熱素材ドットは10〜20nmの間隔をおいて配列される、請求項2に記載の発熱デバイス用超加速熱素材。
- 基板と、
前記基板上に形成された金属酸化物層と、
前記金属酸化物層上に形成され、格子状に配列された球状の超加速熱素材ドットと、
前記金属酸化物層及び超加速熱素材ドット上に形成された導電性接着剤層とを含んでなり、
前記球状の超加速熱素材ドットは、下部が金属酸化物層に含まれ、上部は導電性接着剤層に含まれる、発熱デバイス。 - 前記超加速熱素材はSnF2、SnF4、スズニッケルフッ化物(SnNiF)、スズクロムフッ化物(SnCrF)、スズ亜鉛フッ化物(SnZnF)、亜鉛ニッケルフッ化物(ZnNiF)及びこれらの組み合わせよりなる群から選択される、請求項4に記載の発熱デバイス。
- 前記超加速熱素材ドットは、50〜100nmの直径を有し、10〜20nmの間隔をおいて配列される、請求項4に記載の発熱デバイス。
- 前記金属酸化物は、アルミニウム酸化物、銅酸化物、鉄酸化物、スズ酸化物、カドミウム酸化物、亜鉛酸化物及びこれらの組み合わせよりなる群から選択される、請求項4に記載の発熱デバイス。
- 前記導電性接着剤は光学的に透明な接着剤である、請求項4に記載の発熱デバイス。
- 第1基板上に金属酸化物層を形成する段階と、
第2基板の導電性接着剤層上に、常温化学連続工程によって球状の超加速熱素材ドットを格子配列状に形成する段階と、
前記球状の超加速熱素材ドットが形成された第2基板、および金属酸化物層が形成された第1基板をローラーに通過させ、第2基板の導電性接着剤層から第1基板の金属酸化物層に球状の超加速熱素材ドットをラミネート付着させる段階とを含んでなり、
前記球状の超加速熱素材ドットは、下部が金属酸化物層に含まれ、上部は導電性接着剤層に含まれる、発熱デバイスを製造する方法。 - 前記常温化学連続工程は、
マイクロ波発生器から発生したマイクロ波を磁界形成空間へ案内する段階と、
前記磁界形成空間内へプラズマソースガスを流入させる段階と、
前記磁界形成空間内でプラズマソースガスをマイクロ波に露出させてプラズマ状態に維持する段階と、
前記プラズマ内の電子とイオンを磁界の影響で電子サイクロトロン共鳴(ECR;ElectroCyclotronResonance)させて高いエネルギー密度のプラズマを維持する段階と、
高いエネルギー密度のプラズマ領域内に蒸着膜形成用超加速熱素材ソースガスを投入させて、活性化されたイオンとして提供する段階と、
前記活性化されたイオンを第2基板の表面で瞬間表面化学反応させることにより超加速熱素材ドットを連続的に形成する段階とを含んでなる、請求項9に記載の発熱デバイスを製造する方法。 - 前記超加速熱素材ドットは、50〜100nmの直径を有し、10〜20nmの間隔をおいて配列される、請求項9に記載の発熱デバイスを製造する方法。
- 前記超加速熱素材は、SnF2、SnF4、SnNiF、SnCrF、SnZnF、ZnNiFおよびこれらの組み合わせよりなる群から選択される、請求項9に記載の発熱デバイスを製造する方法。
- 前記金属酸化物は、アルミニウム酸化物、銅酸化物、鉄酸化物、スズ酸化物、カドミウム酸化物、亜鉛酸化物及びこれらの組み合わせよりなる群から選択される、請求項9に記載の発熱デバイスを製造する方法。
- 前記導電性接着剤は光学的に透明な接着剤である、請求項9に記載の発熱デバイスを製造する方法。
- 前記超加速熱素材ドットを格子配列状に形成する段階の後に、
前記球状の超加速熱素材ドット上に保護フィルムを形成する段階と、
前記超加速熱素材ドットから保護フィルムを除去する段階とをさらに含む、請求項9に記載の発熱デバイスを製造する方法。
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281726A (ja) * | 2004-03-26 | 2005-10-13 | Ntt Afty Corp | プラズマ成膜方法及びその装置 |
| JP2008141037A (ja) * | 2006-12-04 | 2008-06-19 | Fujifilm Corp | 固体撮像装置 |
| US20100123409A1 (en) * | 2008-11-18 | 2010-05-20 | Industrial Technology Research Institute | Light-emitting devices utilizing gaseous sulfur compounds |
| JP2010153963A (ja) * | 2008-12-24 | 2010-07-08 | Nikon Corp | 冷却カメラ |
| JP2011066560A (ja) * | 2009-09-15 | 2011-03-31 | Sharp Corp | カメラモジュールおよび電子情報機器 |
| WO2014097943A1 (ja) * | 2012-12-18 | 2014-06-26 | 東レ株式会社 | 金属ドット基板および金属ドット基板の製造方法 |
| JP2015135932A (ja) * | 2014-01-20 | 2015-07-27 | アイアールスペック株式会社 | ペルチェ冷却型icパッケージ |
| JP2015182334A (ja) * | 2014-03-25 | 2015-10-22 | 東レ株式会社 | 金属ドット基板およびその製造方法 |
| JP2017517893A (ja) * | 2014-05-28 | 2017-06-29 | アーエムエス アクチエンゲゼルシャフトams AG | 一体化ピクセル加熱機構を有する半導体画像センサおよび半導体画像センサを作動させる方法 |
Family Cites Families (92)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3710074A (en) * | 1970-10-08 | 1973-01-09 | Ppg Industries Inc | Electrically heated multiple glazed window having an iridescence masking film |
| GB2061075B (en) * | 1979-10-11 | 1983-08-10 | Tdk Electronics Co Ltd | Ptc heating apparatus |
| US5780313A (en) * | 1985-02-14 | 1998-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device |
| JPS61111939A (ja) * | 1984-11-02 | 1986-05-30 | Nippon Sheet Glass Co Ltd | 板ガラス |
| JPS6289873A (ja) * | 1985-10-14 | 1987-04-24 | Semiconductor Energy Lab Co Ltd | 透明導電膜形成方法 |
| DE3780824T2 (de) | 1987-12-17 | 1993-02-04 | Uop Inc | Dehydrierungskatalysatorteilchen mit schichtstruktur. |
| US4908330A (en) * | 1988-02-01 | 1990-03-13 | Canon Kabushiki Kaisha | Process for the formation of a functional deposited film containing group IV atoms or silicon atoms and group IV atoms by microwave plasma chemical vapor deposition process |
| US4920254A (en) * | 1988-02-22 | 1990-04-24 | Sierracin Corporation | Electrically conductive window and a method for its manufacture |
| US4922024A (en) * | 1988-04-14 | 1990-05-01 | The Dow Chemical Company | Amination process employing group vib metal catalysts |
| US4941929A (en) * | 1989-08-24 | 1990-07-17 | E. I. Du Pont De Nemours And Company | Solder paste formulation containing stannous fluoride |
| US5506037A (en) * | 1989-12-09 | 1996-04-09 | Saint Gobain Vitrage International | Heat-reflecting and/or electrically heatable laminated glass pane |
| US5229205A (en) * | 1990-12-20 | 1993-07-20 | Ford Motor Company | Laminated glazing unit having improved interfacial adhesion |
| US5069968A (en) * | 1990-12-20 | 1991-12-03 | Ford Motor Company | Laminated glazing unit having improved interfacial adhesion |
| JPH07295409A (ja) * | 1994-04-25 | 1995-11-10 | Canon Inc | 加熱定着装置及びその製造方法 |
| US5582770A (en) * | 1994-06-08 | 1996-12-10 | Raychem Corporation | Conductive polymer composition |
| KR0150721B1 (ko) * | 1995-04-07 | 1998-12-15 | 이진주 | 고전기저항 투명 발열 도전막의 제조방법 및 장치 |
| DE69635908T2 (de) * | 1995-08-03 | 2006-11-23 | Ngk Insulators, Ltd., Nagoya | Gesinterte Aluminiumnitridkörper und deren Verwendung als Subtrat in einer Vorrichtung zur Herstellung von Halbleitern |
| JP3220635B2 (ja) * | 1996-02-09 | 2001-10-22 | 松下電器産業株式会社 | はんだ合金及びクリームはんだ |
| US5935340A (en) * | 1996-11-13 | 1999-08-10 | Applied Materials, Inc. | Method and apparatus for gettering fluorine from chamber material surfaces |
| RU2232448C2 (ru) | 1997-06-18 | 2004-07-10 | Массачусетс Инститьют Оф Текнолоджи | Способ получения пленки оксидного сверхпроводника и оксидное сверхпроводниковое изделие |
| DE19844046C2 (de) * | 1998-09-25 | 2001-08-23 | Schott Glas | Mehrscheibenisolierglas |
| US6512203B2 (en) * | 1999-05-06 | 2003-01-28 | Polymore Circuit Technologies | Polymer thick film heating element on a glass substrate |
| US6204480B1 (en) * | 2000-02-01 | 2001-03-20 | Southwall Technologies, Inc. | Vacuum deposition of bus bars onto conductive transparent films |
| JP2001242726A (ja) * | 2000-02-25 | 2001-09-07 | Toshiba Lighting & Technology Corp | 定着ヒータおよび画像形成装置 |
| US6625875B2 (en) * | 2001-03-26 | 2003-09-30 | Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique S.A. (C.R.V.C.) | Method of attaching bus bars to a conductive coating for a heatable vehicle window |
| US20070111094A1 (en) * | 2001-08-31 | 2007-05-17 | Thackeray Michael M | Synthesis of intermetallic negative electrodes for lithium cells and batteries |
| ATE400481T1 (de) * | 2002-03-11 | 2008-07-15 | Nippon Sheet Glass Co Ltd | Durch eine metallbefestigung verbundener glasartikel und diesen verwendende verbindungskonstruktion |
| AU2003290791A1 (en) | 2002-11-14 | 2004-06-15 | Donnelly Corporation | Imaging system for vehicle |
| JP4441211B2 (ja) * | 2003-08-13 | 2010-03-31 | シチズン電子株式会社 | 小型撮像モジュール |
| EP1668702A1 (en) | 2003-09-05 | 2006-06-14 | Adrian H. Kitai | Sphere-supported thin film phosphor electroluminescent devices |
| US20050067681A1 (en) * | 2003-09-26 | 2005-03-31 | Tessera, Inc. | Package having integral lens and wafer-scale fabrication method therefor |
| KR101100625B1 (ko) * | 2003-10-02 | 2012-01-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 배선 기판 및 그 제조방법, 및 박막트랜지스터 및 그제조방법 |
| US7632713B2 (en) * | 2004-04-27 | 2009-12-15 | Aptina Imaging Corporation | Methods of packaging microelectronic imaging devices |
| US20060042076A1 (en) | 2004-08-24 | 2006-03-02 | Fry's Metals, Inc. | Bus bar system for heatable glass |
| FR2875669B1 (fr) | 2004-09-17 | 2007-07-06 | Saint Gobain | Structure chauffante electrique |
| US20060154425A1 (en) * | 2005-01-10 | 2006-07-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and method for fabricating the same |
| US20070272827A1 (en) * | 2005-04-27 | 2007-11-29 | Amkor Technology, Inc. | Image sensor package having mount holder attached to image sensor die |
| US8117683B2 (en) * | 2005-06-29 | 2012-02-21 | Panasonic Corporation | Toilet seat device and toilet seat apparatus having the same |
| KR20070096303A (ko) * | 2006-03-23 | 2007-10-02 | 엘지이노텍 주식회사 | 카메라 모듈용 인쇄회로기판 및 그 제조 방법 |
| US8658309B2 (en) * | 2006-08-11 | 2014-02-25 | California Institute Of Technology | Dissociating agents, formulations and methods providing enhanced solubility of fluorides |
| JP5405729B2 (ja) * | 2007-03-12 | 2014-02-05 | パナソニック株式会社 | 便座装置 |
| CN101286520A (zh) * | 2007-04-10 | 2008-10-15 | 鸿富锦精密工业(深圳)有限公司 | 影像感测晶片封装结构及其封装方法 |
| CN101285921A (zh) * | 2007-04-13 | 2008-10-15 | 鸿富锦精密工业(深圳)有限公司 | 成像模组 |
| KR100909970B1 (ko) * | 2007-11-01 | 2009-07-29 | 삼성전자주식회사 | 카메라 모듈 |
| KR100959922B1 (ko) * | 2007-11-20 | 2010-05-26 | 삼성전자주식회사 | 카메라 모듈 및 그 제조방법 |
| US8110884B2 (en) * | 2007-12-18 | 2012-02-07 | Micron Technology, Inc. | Methods of packaging imager devices and optics modules, and resulting assemblies |
| DE102008018147A1 (de) * | 2008-04-10 | 2009-10-15 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Transparente Scheibe mit einer beheizbaren Beschichtung und niederohmigen leitenden Strukturen |
| JP5425459B2 (ja) * | 2008-05-19 | 2014-02-26 | 富士フイルム株式会社 | 導電性フイルム及び透明発熱体 |
| US10412788B2 (en) * | 2008-06-13 | 2019-09-10 | Lg Chem, Ltd. | Heating element and manufacturing method thereof |
| JP5021842B2 (ja) * | 2008-06-13 | 2012-09-12 | エルジー・ケム・リミテッド | 発熱体およびその製造方法 |
| KR20090129927A (ko) * | 2008-06-13 | 2009-12-17 | 주식회사 엘지화학 | 발열체 및 이의 제조방법 |
| US8048708B2 (en) * | 2008-06-25 | 2011-11-01 | Micron Technology, Inc. | Method and apparatus providing an imager module with a permanent carrier |
| JP5478126B2 (ja) * | 2008-06-25 | 2014-04-23 | 富士フイルム株式会社 | 導電膜形成用感光材料、導電性材料及びエレクトロルミネッセンス素子 |
| US9012073B2 (en) * | 2008-11-11 | 2015-04-21 | Envia Systems, Inc. | Composite compositions, negative electrodes with composite compositions and corresponding batteries |
| DE102009012003A1 (de) * | 2009-02-26 | 2010-09-02 | Basf Se | Schutzbeschichtung für metallische Oberflächen und ihre Herstellung |
| JP5375219B2 (ja) * | 2009-03-11 | 2013-12-25 | 富士通セミコンダクター株式会社 | 撮像装置 |
| TWI372558B (en) * | 2009-04-08 | 2012-09-11 | Flexible thin image-sensing module with anti-emi function and flexible thin pcb module with anti-emi function | |
| EP2278851B1 (de) * | 2009-07-24 | 2013-05-29 | THERM-IC Products GmbH Nfg. & Co. KG | Elektrisch beheizbare Glasscheibe, Verfahren zu deren Herstellung sowie Fenster |
| TWI513810B (zh) * | 2010-01-29 | 2015-12-21 | 日東電工股份有限公司 | 攝像零件 |
| FR2956556B1 (fr) | 2010-02-17 | 2012-02-03 | Saint Gobain | Procede d'obtention d'un vitrage chauffant |
| US9085051B2 (en) * | 2010-03-29 | 2015-07-21 | Gaurdian Industries Corp. | Fluorinated silver paste for forming electrical connections in highly dielectric films, and related products and methods |
| KR20110110721A (ko) * | 2010-04-01 | 2011-10-07 | 주식회사 엘지화학 | 발열체 및 이의 제조방법 |
| PL2569189T3 (pl) * | 2010-05-10 | 2017-04-28 | Saint-Gobain Glass France | Przezroczysta szyba z ogrzewaną powłoką oraz sposób jej wytwarzania |
| KR20110127913A (ko) * | 2010-05-20 | 2011-11-28 | 삼성전자주식회사 | 카메라 모듈 |
| TW201210326A (en) * | 2010-08-19 | 2012-03-01 | Hon Hai Prec Ind Co Ltd | Camera module and manufacturing method of the same |
| EA023042B1 (ru) * | 2010-09-09 | 2016-04-29 | Сэн-Гобэн Гласс Франс | Прозрачное стекло с нагреваемым покрытием |
| US9247587B2 (en) * | 2010-09-14 | 2016-01-26 | Lg Chem, Ltd. | Heating element and a manufacturing method thereof |
| US8492737B2 (en) * | 2010-11-18 | 2013-07-23 | The Arizona Board Of Regents On Behalf Of The University Of Arizona | Tunable infrared emitter |
| CN103141157A (zh) * | 2011-01-13 | 2013-06-05 | Lg化学株式会社 | 加热元件及其制造方法 |
| US20130327757A1 (en) * | 2011-01-13 | 2013-12-12 | Lg Chem, Ltd. | Heating element and method for manufacturing same |
| JP5372986B2 (ja) * | 2011-03-11 | 2013-12-18 | シャープ株式会社 | カメラモジュールおよびその製造方法 |
| US8605211B2 (en) * | 2011-04-28 | 2013-12-10 | Apple Inc. | Low rise camera module |
| US9755229B2 (en) * | 2011-06-14 | 2017-09-05 | Brookhaven Science Associates, Llc | Intermetallic M—Sn5 (M=Fe, Cu, Co, Ni) compound and a method of synthesis thereof |
| EP2742772B1 (de) * | 2011-08-09 | 2019-04-24 | Saint-Gobain Glass France | Elektrische kontaktverbunde, verfahren zur herstellung elektrischer kontaktverbunde |
| JP5529820B2 (ja) * | 2011-09-22 | 2014-06-25 | 富士フイルム株式会社 | 暖房便座 |
| JP5993725B2 (ja) | 2012-05-18 | 2016-09-14 | 協立化学産業株式会社 | 光学部品の製造方法、接着組成物キット及びコーティング組成物 |
| EP2928264B1 (en) * | 2013-02-22 | 2019-07-24 | LG Chem, Ltd. | Heating element and method for manufacturing same |
| CN105190370A (zh) | 2013-04-05 | 2015-12-23 | 三菱丽阳株式会社 | 光学膜和面发光体 |
| JP6415111B2 (ja) * | 2013-06-20 | 2018-10-31 | キヤノン株式会社 | プリント回路板、半導体装置の接合構造及びプリント回路板の製造方法 |
| WO2015021177A1 (en) * | 2013-08-06 | 2015-02-12 | Massachusetts Institute Of Technology | Production of non-sintered transition metal carbide nanoparticles |
| WO2015037182A1 (ja) | 2013-09-10 | 2015-03-19 | ロック技研工業株式会社 | 透明導電性基材及び透明導電性基材の製造方法 |
| JP5590259B1 (ja) | 2014-01-28 | 2014-09-17 | 千住金属工業株式会社 | Cu核ボール、はんだペーストおよびはんだ継手 |
| KR101865441B1 (ko) * | 2014-09-29 | 2018-06-07 | 주식회사 엘지화학 | 발열체 및 이의 제조방법 |
| US10912155B2 (en) * | 2014-11-17 | 2021-02-02 | Dai Nippon Printing Co., Ltd. | Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate |
| US10384649B2 (en) * | 2014-11-17 | 2019-08-20 | Dai Nippon Printing Co., Ltd. | Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate |
| JP2018504749A (ja) * | 2014-12-31 | 2018-02-15 | コーロン インダストリーズ インク | 透明面状発熱体 |
| CN104822187A (zh) | 2015-03-10 | 2015-08-05 | 宁波华尔克应用材料有限公司 | 一种挡风玻璃高效除霜雾镀膜及其制备方法和装置 |
| KR102441534B1 (ko) | 2015-08-17 | 2022-09-07 | 엘지이노텍 주식회사 | 카메라 모듈 |
| US11565936B2 (en) | 2016-05-25 | 2023-01-31 | The Regents Of The University Of Colorado | Atomic layer etching on microdevices and nanodevices |
| KR102452409B1 (ko) | 2016-10-19 | 2022-10-11 | 삼성전자주식회사 | 방사 부재를 포함하는 전자 장치 |
| US10645760B2 (en) * | 2017-05-16 | 2020-05-05 | Murata Manufacturing Co., Ltd. | Heater device and method for producing the same |
| US11162192B2 (en) * | 2017-12-01 | 2021-11-02 | Arizona Board Of Regents On Behalf Of Arizona State University | Materials and methods relating to single molecule arrays |
-
2018
- 2018-04-12 KR KR1020180042904A patent/KR102058865B1/ko active Active
- 2018-06-01 US US15/995,903 patent/US11647568B2/en active Active
- 2018-06-07 CN CN201810580256.2A patent/CN110381617B/zh active Active
- 2018-06-07 JP JP2018109715A patent/JP6698749B2/ja active Active
- 2018-06-11 EP EP18177082.7A patent/EP3554191B1/en active Active
- 2018-06-11 DE DE102018004630.4A patent/DE102018004630A1/de not_active Withdrawn
- 2018-06-14 RU RU2018121983A patent/RU2700975C1/ru active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281726A (ja) * | 2004-03-26 | 2005-10-13 | Ntt Afty Corp | プラズマ成膜方法及びその装置 |
| JP2008141037A (ja) * | 2006-12-04 | 2008-06-19 | Fujifilm Corp | 固体撮像装置 |
| US20100123409A1 (en) * | 2008-11-18 | 2010-05-20 | Industrial Technology Research Institute | Light-emitting devices utilizing gaseous sulfur compounds |
| JP2010153963A (ja) * | 2008-12-24 | 2010-07-08 | Nikon Corp | 冷却カメラ |
| JP2011066560A (ja) * | 2009-09-15 | 2011-03-31 | Sharp Corp | カメラモジュールおよび電子情報機器 |
| WO2014097943A1 (ja) * | 2012-12-18 | 2014-06-26 | 東レ株式会社 | 金属ドット基板および金属ドット基板の製造方法 |
| JP2015135932A (ja) * | 2014-01-20 | 2015-07-27 | アイアールスペック株式会社 | ペルチェ冷却型icパッケージ |
| JP2015182334A (ja) * | 2014-03-25 | 2015-10-22 | 東レ株式会社 | 金属ドット基板およびその製造方法 |
| JP2017517893A (ja) * | 2014-05-28 | 2017-06-29 | アーエムエス アクチエンゲゼルシャフトams AG | 一体化ピクセル加熱機構を有する半導体画像センサおよび半導体画像センサを作動させる方法 |
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| US20190320504A1 (en) | 2019-10-17 |
| KR102058865B1 (ko) | 2019-12-24 |
| EP3554191B1 (en) | 2020-08-05 |
| RU2700975C1 (ru) | 2019-09-24 |
| KR20190119446A (ko) | 2019-10-22 |
| CN110381617B (zh) | 2022-02-11 |
| CN110381617A (zh) | 2019-10-25 |
| US11647568B2 (en) | 2023-05-09 |
| EP3554191A1 (en) | 2019-10-16 |
| DE102018004630A1 (de) | 2019-10-17 |
| JP6698749B2 (ja) | 2020-05-27 |
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