JP2019174331A - Sensor and sensor manufacturing method - Google Patents

Abstract

An object of the present invention is to provide a sensor capable of detecting an object with high accuracy. A sensor 1 has a flat body shape, a first end 1321 in a first direction is supported, and a main body having an accommodation space opened at at least one of both end faces in a thickness direction. 132, a volume that changes according to the amount of the object, a volume change body 14 supported by the main body 132 so that at least a part thereof is housed in the housing space, and a first direction of the main body 132. And a detecting unit 133 that is connected to the second end 1322 in the first and second and detects a stress generated due to a change in the volume of the volume changing body 14. The volume change body 14 is made of a material whose elastic modulus is lower than that of the main body 132. [Selection diagram] Fig. 1

Description

  The present invention relates to a sensor and a sensor manufacturing method.

  2. Description of the Related Art A sensor is known that includes a volume change body whose volume changes according to the amount of a target (for example, a molecule constituting a gas or a liquid) and detects a stress caused by a change in the volume of the volume change body. . For example, the sensor described in Patent Document 1 includes a main body portion, a volume change body, and a detection portion. The main body has a flat plate shape. The volume change body changes the volume by receiving the object, and covers both end faces in the thickness direction of the main body. The detection unit extends from the end of the main body and is supported at the tip. The detection unit includes a piezoresistive element and detects a stress generated with a change in volume of the volume change body.

International Publication No. 2013/157582

  By the way, in the said sensor, stress may arise in the thickness direction of a main-body part by the difference in the quantity of the object received by a volume change body. In this case, the main body may be bent. As a result, there is a possibility that the volume change of the volume change body cannot be reflected with high accuracy on the stress generated in the detection unit. In other words, the sensor may not be able to detect the target with high accuracy.

  One of the objects of the present invention is to detect an object with high accuracy.

In one aspect, the sensor
A main body portion that is flat and has a housing space that is supported at the first end in the first direction and opens at at least one of both end surfaces in the thickness direction;
The volume changes according to the amount of the object, and the volume change body supported by the main body so that at least a part is accommodated in the accommodation space,
A detecting unit connected to the second end in the first direction of the main body unit and detecting a stress caused by a change in volume of the volume changing body;
With
The volume change body is made of a material having an elastic modulus lower than that of the main body.

In another aspect, a sensor manufacturing method includes:
In the first member that is flat and supports the first end in the first direction, an accommodation space that opens at at least one of both end surfaces in the thickness direction is formed. An element for detecting stress is provided in the second member connected to the second end in the first direction,
The elastic member is made of a material having a higher elastic modulus than the first member, and at least a part of the volume changing body whose volume changes according to the amount of the object is accommodated in the accommodating space so as to be supported by the first member. , Including that.

  The target can be detected with high accuracy.

It is a front right upper perspective view of the sensor of a 1st embodiment. It is a front right upper perspective view of a sensor in the state where a sensor of a 1st embodiment was disassembled. It is a right view of the sensor of a 1st embodiment. It is a top view of the sensor of a 1st embodiment. It is a bottom view of the sensor of a 1st embodiment. It is sectional drawing of the sensor cut | disconnected by the plane represented by the VI-VI line of FIG. It is sectional drawing of the sensor cut | disconnected by the plane represented by the VII-VII line | wire of FIG. It is a block diagram showing the electric circuit to which the sensor of 1st Embodiment is connected. It is explanatory drawing showing the manufacturing process of the sensor of 1st Embodiment. It is explanatory drawing showing the manufacturing process of the sensor of 1st Embodiment. It is sectional drawing of the sensor of the 3rd modification of 1st Embodiment. It is sectional drawing of the sensor of the 4th modification of 1st Embodiment. It is a top view of the sensor of the 5th modification of a 1st embodiment. It is a top view of the sensor of the 6th modification of a 1st embodiment. It is a graph showing the responsiveness with respect to humidity of the sensor of 1st Example of 1st Embodiment. It is a graph showing the responsiveness with respect to humidity of the sensor of 1st Example of 1st Embodiment. It is a graph showing the responsiveness with respect to humidity of the sensor of 1st Example of 1st Embodiment. It is a graph showing the responsiveness with respect to hydrogen sulfide of the sensor of the 1st Example of 1st Embodiment. It is a graph showing the responsiveness with respect to humidity of the sensor of 2nd Example of 1st Embodiment. It is a graph showing the responsiveness with respect to hydrogen sulfide of the sensor of 2nd Example of 1st Embodiment. It is a graph showing the responsiveness with respect to hydrogen sulfide of the sensor of 2nd Example of 1st Embodiment. It is a graph showing the responsiveness with respect to humidity of the sensor of 3rd Example of 1st Embodiment. It is a graph showing the responsiveness with respect to hydrogen sulfide of the sensor of 3rd Example of 1st Embodiment. It is a front right upper perspective view of the sensor of a 2nd embodiment. It is a front right upper perspective view of a sensor in the state where a sensor of a 2nd embodiment was disassembled. It is a top view of the sensor of a 2nd embodiment. It is sectional drawing of the sensor cut | disconnected by the plane represented by the XVIII-XVIII line | wire of FIG. It is a top view of the sensor of the 3rd modification of 2nd Embodiment. It is a top view of the sensor of the 4th modification of a 2nd embodiment. It is a top view of the sensor of the 5th modification of a 2nd embodiment. It is a top view of the sensor of the 6th modification of a 2nd embodiment. It is a top view of the sensor of the 7th modification of a 2nd embodiment.

  Hereinafter, embodiments of the sensor and the sensor manufacturing method according to the present invention will be described with reference to FIGS.

<First Embodiment>
(Overview)
The sensor of 1st Embodiment is provided with a main-body part, a volume change body, and a detection part.
The main body has a flat plate shape, and has a receiving space that is supported at the first end in the first direction and opens at at least one of both end faces in the thickness direction.
The volume changing body is supported by the main body so that the volume changes according to the amount of the object and at least a part of the volume changing body is accommodated in the accommodation space.
A detection part is connected with the 2nd end in a 1st direction among the main-body parts, and detects the stress which arises with the change of the volume of a volume change body.
The volume change body is made of a material whose elastic modulus is lower than that of the main body.

  According to this, since the volume change body is accommodated in the accommodation space, it is possible to suppress the occurrence of stress in the thickness direction of the main body even when the volume of the volume change body changes. Thereby, it can suppress that a main-body part bends. Therefore, it is possible to suppress the occurrence of stress in the thickness direction of the main body at the second end. As a result, the change in the volume of the volume change body can be reflected with high accuracy in the stress in the direction along the main body generated at the second end. In other words, according to the sensor, the object can be detected with high accuracy.

Furthermore, since the volume change body is made of a material having an elastic modulus lower than that of the main body, the stress distribution in the volume change body, which is caused by a change in the volume of the volume change body, can be brought close to a uniform state. Thereby, the change of the volume of the volume change body can be reflected with high accuracy on the stress generated in the main body. As a result, the target can be detected with high accuracy.
Next, the sensor according to the first embodiment will be described in detail.

(Constitution)
Hereinafter, as shown in FIGS. 1 to 7, the sensor 1 according to the first embodiment will be described using a right-handed orthogonal coordinate system having an x-axis, a y-axis, and a z-axis. In this specification, the same coordinate system is used in FIGS. 11 to 14 and FIGS. 24 to 32 described later.
The sensor 1 detects a target. For example, the object is a molecule constituting a gas, a liquid, or a solid. In addition, for example, the target is a molecule constituting a mixture composed of at least two of a gas, a liquid, and a solid. Further, for example, the target is fine particles, temperature, humidity, electromagnetic waves, or the like.

  In this example, the x-axis direction, the y-axis direction, and the z-axis direction may be expressed as the left-right direction of the sensor 1, the front-rear direction of the sensor 1, and the up-down direction of the sensor 1, respectively. In this example, the positive direction of the x axis, the negative direction of the x axis, the positive direction of the y axis, the negative direction of the y axis, the positive direction of the z axis, and the negative direction of the z axis are the right direction of the sensor 1. , Left direction of sensor 1, forward direction of sensor 1, backward direction of sensor 1, upward direction of sensor 1, and downward direction of sensor 1.

  FIG. 1 is a view (in other words, a front right upper perspective view) of the sensor 1 viewed from a position on the right side of the sensor 1, in front of the sensor 1 and above the sensor 1. FIG. 2 is a front right upper perspective view of the sensor 1 in a state where the sensor 1 is disassembled. FIG. 3 is a view (in other words, a right side view) of the sensor 1 as viewed from the right side of the sensor 1.

  FIG. 4 is a view (in other words, a plan view) of the sensor 1 as viewed from above the sensor 1. FIG. 5 is a view (in other words, a bottom view) of the sensor 1 as viewed from below the sensor 1. FIG. 6 is a view of the cross section of the sensor 1 cut along the plane represented by the line VI-VI in FIG. 4 as viewed in the negative direction of the x axis. FIG. 7 is a view of the cross section of the sensor 1 cut along the plane represented by the line VII-VII in FIG. 4 as viewed in the negative direction of the y-axis.

  As shown in FIG. 1, the sensor 1 has a columnar shape extending in the z-axis direction. In this example, the cross section of the sensor 1 cut by a plane orthogonal to the z axis (in other words, the xy plane) is a square shape. The cross section of the sensor 1 cut along the xy plane may be a shape different from a square shape (for example, a circular shape, an elliptical shape, or a rectangular shape).

  For example, the length of one side of the cross section of the sensor 1 cut along the xy plane is 50 μm to 5 mm. In this example, the length of one side of the cross section of the sensor 1 cut by the xy plane is 500 μm. For example, the sensor 1 may be manufactured using a technique called microfabrication or nanofabrication.

  The sensor 1 includes a first layered body 11, a second layered body 12, a third layered body 13, and a volume changing body 14. The first layered body 11, the second layered body 12, and the third layered body 13 are stacked so as to be sequentially arranged in the z-axis direction. In other words, the second layered body 12 is in contact with the first layered body 11, and the third layered body 13 is in contact with the second layered body 12 on the side opposite to the first layered body 11. In other words, the second layered body 12 is sandwiched between the first layered body 11 and the third layered body 13.

  For example, the first layered body 11 has a thickness of 0.5 μm to 50 μm, the second layered body 12 has a thickness of 0.05 μm to 5 μm, and the third layered body 13 has a thickness of The thickness is 50 μm to 5 mm. In this example, the thickness of the first layered body 11 is 5 μm, the thickness of the second layered body 12 is 0.5 μm, and the thickness of the third layered body 13 is 500 μm.

In this example, the first layered body 11 is made of silicon. As shown in FIGS. 1 and 2, the first layered body 11 has a hollow columnar shape that extends in the z-axis direction and opens at both end faces in the z-axis direction.
In this example, the second layered body 12 is made of silicon dioxide. As shown in FIGS. 1 and 2, the second layered body 12 has a flat plate shape. The second layered body 12 has holes that open at both end surfaces in the z-axis direction of the second layered body 12. In this example, the cross section of the second layered body 12 cut along the xy plane has the same shape as the cross section of the first layered body 11 cut along the xy plane.

  In this example, the third layered body 13 is made of silicon. As shown in FIGS. 1 and 2, the third layered body 13 has a flat plate shape. In this example, the exposed surface of the third layered body 13 is covered with an insulating thin film (not shown).

The third layered body 13 includes a frame part 131, a main body part 132, and a detection part 133.
The frame part 131 has holes that open at both end surfaces in the z-axis direction of the frame part 131. In this example, the cross section of the frame part 131 cut along the xy plane has the same shape as the cross section of the first layered body 11 cut along the xy plane.

  As shown in FIG. 4, the main body 132 has a rectangular shape having a long side extending in the y-axis direction and a short side extending in the x-axis direction. The main body 132 may be square. The length of the main body 132 in the y-axis direction is shorter than the length of the hole in the frame 131 in the y-axis direction. In this example, the length of the main body 132 in the y-axis direction is 367 μm. The length of the main body 132 in the x-axis direction is shorter than the length of the hole in the frame 131 in the x-axis direction. In this example, the length of the main body 132 in the x-axis direction is 300 μm. Both ends of the main body portion 132 in the x-axis direction are separated from the frame portion 131.

  The main body 132 is connected to the frame 131 at a first end 1321 of the main body 132 in the positive direction of the y-axis. In other words, the main body part 132 is supported by the frame part 131 at the first end 1321 of the main body part 132 in the positive direction of the y-axis.

  Both end portions in the x-axis direction of the second end 1322 in the negative direction of the y-axis of the main body portion 132 are connected to the frame portion 131 via the detection unit 133. A central portion in the x-axis direction in the second end 1322 in the negative direction of the y-axis of the main body portion 132 is separated from the frame portion 131.

  The main body portion 132 includes a space forming portion 1323 that forms an accommodation space that opens at both end surfaces of the main body portion 132 in the z-axis direction (in other words, the thickness direction of the main body portion 132). The accommodation space includes a plurality of slit-like holes extending in the x-axis direction. In this example, each hole included in the accommodation space is a through hole that penetrates the main body 132 in the z-axis direction. In this example, the plurality of holes included in the accommodation space are arranged at equal intervals along the y-axis direction.

For example, the length in the y-axis direction of each hole included in the accommodation space is 0.1 μm to 10 μm. In this example, the length of each hole included in the accommodation space in the y-axis direction is 1 μm. For example, the distance in the y-axis direction between the holes included in the accommodation space is a length of 0.1 μm to 10 μm. In this example, the interval in the y-axis direction between the holes included in the accommodation space is 1 μm. In this example, there are 133 holes included in the accommodation space. In addition, in FIG. 1 thru | or FIG. 7, the several hole contained in accommodation space is illustrated in the aspect expanded in the y-axis direction. Therefore, in FIG. 1 thru | or FIG. 7, the some hole contained in accommodation space is shown in the aspect where the number was reduced.
In this example, the length in the x-axis direction of the plurality of slit-shaped holes included in the accommodation space is 280 μm.

  The detection unit 133 includes a first supported portion 1331, a second supported portion 1332, a first wiring 1333, and a second wiring 1334.

  As shown in FIG. 4, the first supported portion 1331 has a strip shape extending in the y-axis direction. An end of the first supported portion 1331 in the negative direction of the y axis is connected to the frame portion 131. An end of the first supported portion 1331 in the positive direction of the y axis is connected to an end portion of the second end 1322 of the main body portion 132 in the negative direction of the x axis. In other words, the first supported portion 1331 extends from the second end 1322 of the main body portion 132 in the negative direction of the y-axis, and the tip is supported by the frame portion 131.

  The width of the first supported portion 1331 (in other words, the length of the first supported portion 1331 in the x-axis direction) is larger than the width of the main body portion 132 (in other words, the length of the main body portion 132 in the x-axis direction). narrow. Of the first supported portion 1331, the width of the central portion in the extending direction (in this example, the y-axis direction) that is the direction in which the first supported portion 1331 extends is the same as that of the first supported portion 1331. It is narrower than the width of both ends in the extending direction.

  The first supported portion 1331 includes a piezoresistive element PZ located at the center of the first supported portion 1331 in the extending direction. The piezoresistive element PZ is an element whose electric resistance changes according to the stress applied to the piezoresistive element PZ. In other words, the piezoresistive element PZ is an element having a piezoresistive effect or a piezoresistive effect.

In this example, as shown in FIG. 7, the piezoresistive element PZ is embedded in the first supported portion 1331 so as to be exposed at the end surface of the first supported portion 1331 in the positive direction of the z-axis. Yes.
With such a configuration, the detection unit 133 detects the stress transmitted from the main body unit 132 at the center of the first supported portion 1331 in the extending direction.

  As shown in FIG. 4, the second supported portion 1332 has a strip shape extending in the y-axis direction. An end of the second supported portion 1332 in the negative direction of the y-axis is connected to the frame portion 131. An end of the second supported portion 1332 in the positive direction of the y axis is connected to an end portion of the second end 1322 of the main body portion 132 in the positive direction of the x axis. In other words, the second supported portion 1332 extends from the second end 1322 of the main body portion 132 in the negative direction of the y axis, and the tip is supported by the frame portion 131.

  The width of the second supported portion 1332 (in other words, the length of the second supported portion 1332 in the x-axis direction) is narrower than the width of the main body portion 132. Of the second supported portion 1332, the width of the central portion in the extending direction (in this example, the y-axis direction), which is the direction in which the second supported portion 1332 extends, is the second supported portion 1332. It is narrower than the width of both ends in the extending direction.

  The first wiring 1333 and the second wiring 1334 are made of a conductor (in this example, aluminum). The first wiring 1333 and the second wiring 1334 are laid on the end surface of the third layered body 13 in the positive direction of the z-axis.

  For example, the thickness of the first wiring 1333 and the second wiring 1334 (in other words, the length of the first wiring 1333 and the second wiring 1334 in the z-axis direction) is 10 nm to 1 μm. In this example, the thickness of the first wiring 1333 and the second wiring 1334 is 100 nm.

  In this example, a part of the exposed surface of the first wiring 1333 and the second wiring 1334 is covered with an oxide thin film (not shown). For example, a portion of the exposed surface of the first wiring 1333 and the second wiring 1334 that is not covered with the oxide thin film may be used as a connection terminal.

  As shown in FIGS. 4 and 6, one end portion of the first wiring 1333 is in contact with an end portion of the piezoresistive element PZ in the negative direction of the y-axis. The other end of the first wiring 1333 is located on the outer edge of the frame portion 131. The first wiring 1333 extends from the end of the piezoresistive element PZ in the negative y-axis direction to the tip of the first supported portion 1331 (in other words, the frame portion 131 of the first supported portion 1331). It extends to the outer edge of the frame 131 through the connecting end). In other words, the first wiring 1333 connects the piezoresistive element PZ and the tip of the first supported portion 1331.

  One end of the second wiring 1334 is in contact with the end of the piezoresistive element PZ in the positive direction of the y axis. The other end of the second wiring 1334 is located on the outer edge of the frame portion 131. The second wiring 1334 extends from the end of the piezoresistive element PZ in the positive direction of the y-axis to the base end of the first supported portion 1331 (in other words, the main body portion 132 of the first supported portion 1331). The end of the body portion 132 in the negative direction of the y-axis, and the second supported portion 1332 to the outer edge of the frame portion 131.

  In other words, the second wiring 1334 connects the piezoresistive element PZ and the tip of the second supported portion 1332 (in other words, the end connected to the frame portion 131 of the second supported portion 1332) to the main body portion 132. Tie through.

  The volume changing body 14 is made of a sensing material whose volume changes according to the amount of the object. Details of the sensing material will be described later. The volume changing body 14 may be expressed as a sensing body or a sensing body. In this example, the volume changing body 14 increases (in other words, expands) by receiving (for example, adsorbing, absorbing, or sorbing) a target. In this example, the volume change body 14 may be represented as a receptor. In this example, the volume of the volume change body 14 increases as the amount of the received object increases. Note that the volume of the volume change body 14 may be reduced (in other words, contracted) by desorbing or detaching a substance from the volume change body 14 according to the amount of the target.

  The volume change body 14 is supported by the main body 132 so as to be accommodated in the accommodation space of the main body 132. In this example, the volume changing body 14 fills the accommodation space of the main body 132. In this example, the volume changing body 14 is fixed to the space forming portion 1323 of the main body portion 132.

In this example, the volume change body 14 is made of a material having an elastic modulus (for example, Young's modulus) lower than that of the main body 132. For example, the elastic modulus of the main body 132 is preferably at least twice the elastic modulus of the volume change body 14.
In this example, the elastic modulus of the volume change body 14 is larger than that of the main body portion 132 before and after the change of the volume of the volume change body 14.

  For example, the volume change body 14 includes a material that adsorbs, dissolves, or diffuses a molecule by interacting with a predetermined molecule.

  According to this, when the target is a predetermined molecule, the volume change body 14 interacts with the molecule, thereby adsorbing, dissolving, or diffusing the molecule. Thereby, the volume of the volume change body 14 changes. Therefore, the amount of the object can be reflected in the change in volume of the volume change body 14 with high accuracy. As a result, the target can be detected with high accuracy.

  For example, the volume change body 14 contains the material which superposes | polymerizes by absorbing the heat or light mentioned later.

  According to this, when the object is heat or light, the volume of the volume change body 14 changes due to polymerization of the volume change body 14. Thereby, the quantity of object can be reflected in the change of the volume of the volume change body 14 with high precision. As a result, the target can be detected with high accuracy.

  When the target is heat, it is preferable that at least a part of the space forming portion 1323 of the main body portion 132 has higher thermal conductivity than the other portions of the main body portion 132. For example, when a portion other than the space forming portion 1323 in the main body portion 132 is made of silicon, at least a part of the space forming portion 1323 may be made of gold, silver, aluminum, or copper.

  According to this, the amount of heat absorbed by the volume change body 14 can be increased. Thereby, the quantity of object can be reflected in the change of the volume of the volume change body 14 with high precision. As a result, the target can be detected with high accuracy.

  When the target is light, it is preferable that at least a part of the space forming part 1323 of the main body part 132 has higher light transmittance than the other parts of the main body part 132. For example, when the portion other than the space forming portion 1323 of the main body portion 132 is made of silicon, at least a part of the space forming portion 1323 is made of glass, polycarbonate resin, polyvinyl chloride resin, polyvinyl acetate, polyvinyl alcohol resin, fluorine. You may consist of resin, a polystyrene elastomer, polyolefin elastomer, or an acrylic resin.

  According to this, the amount of light absorbed by the volume change body 14 can be increased. Thereby, the quantity of object can be reflected in the change of the volume of the volume change body 14 with high precision. As a result, the target can be detected with high accuracy.

  For example, the volume change body 14 contains a porous body or a foam.

  According to this, when the object is fine particles (for example, pollen, particulate matter (for example, PM2.5, etc.)) or aerosol (mist, smoke, etc.), the volume change body 14 has. When the target enters the pores or the recesses, the amount of the target that is adsorbed or absorbed by the volume change body 14 can be increased. Thereby, the quantity of object can be reflected in the change of the volume of the volume change body 14 with high precision. As a result, the target can be detected with high accuracy.

  Further, the first wiring 1333 and the second wiring 1334 are connected to an electric circuit not shown in FIGS. Thereby, the sensor 1 comprises the electric circuit 100 represented by FIG. The electric circuit 100 includes a first power supply 101, a second power supply 102, a first resistor 103, a second resistor 104, an amplifier 105, and a storage device 106.

  The second power source 102, the first power source 101, the first resistor 103, and the second resistor 104 are connected in series in order. The electric circuit 100 is grounded between the first power supply 101 and the second power supply 102. The amplifier 105 receives the potential between the first resistor 103 and the second resistor 104, amplifies the input potential, and outputs the amplified potential to the storage device 106. The storage device 106 stores a signal represented by the potential input from the amplifier 105.

The voltage of the first power supply 101 is + V _A [V]. The voltage of the second power supply 102 is −V _B [V]. The electric resistance of the first resistor 103 is R _S [Ω]. The electrical resistance of the second resistor 104 is R _R [Ω]. In this example, the piezoresistive element PZ of the sensor 1 constitutes the first resistor 103. Therefore, the first resistor 103 may be regarded as a variable resistor. Further, the second resistor 104 may be regarded as a reference resistor.
With such a configuration, the storage device 106 stores a signal corresponding to the difference between the electrical resistance of the first resistor 103 and the electrical resistance of the second resistor 104.

(Sensing material)
Next, the sensing material will be described.
In this example, the sensing material has fluidity. For example, in order to form the volume changing body 14 by filling the accommodation space with the sensing material, the viscosity of the sensing material is low, the wettability of the sensing material to the wall surface forming the accommodation space is good, the sensing material Are easy to flow into the receiving space, and the sensing material is easy to solidify without flowing out of the receiving space.

Accordingly, the sensing material preferably has a viscosity of 1000 [mPa · sec] or less, more preferably 500 [mPa · sec] or less, more preferably 250 [mPa · sec] or less according to a Brookfield type (in other words, B type) viscometer. mPa · sec] or less is more preferable, 200 [mPa · sec] or less is particularly preferable, and 100 [mPa · sec] or less is most preferable.
Note that the optimum viscosity of the sensing material may differ depending on the material constituting the third layered body 13, the state of the wall surface forming the accommodation space, the shape of the accommodation space, and the size of the accommodation space.
When the viscosity of the sensing material is smaller than 1 [mPa · sec], the concentration of the solute contained in the sensing material is likely to be excessively low, so that the solute is likely to be unevenly distributed in the accommodation space. For this reason, the viscosity of the sensing material is preferably 1 [mPa · sec] or more.
In addition, when the viscosity of the sensing material is larger than 1000 [mPa · sec], the fluidity of the sensing material tends to be excessively low, so that it is difficult to fill the accommodation space with the sensing material. For this reason, it is preferable that the viscosity of the sensing material is 1000 [mPa · sec] or less.
Therefore, in this example, the sensing material has a viscosity of 1 [mPa · sec] to 1000 [mPa · sec] as measured by the B-type viscometer.

In addition, for example, in the case where the sensing material is caused to flow into the accommodation space using capillary phenomenon, when the main material constituting the wall surface forming the accommodation space is silicon, the surface tension of the solvent contained in the sensing material is sufficiently low. Is preferred. The solvent may be expressed as a solvent.
Note that the optimum surface tension of the solvent may vary depending on the sensing material filling method described below.

  As a method for filling the accommodation material into the accommodation space, a technique called a dipping method (in other words, a dip coating method or a dip coating method), a spray coating method, or a spin coating method may be used. In addition, the sensing space may be filled with the sensing material using an ink jet printer or a needle dispenser. For example, the dipping method is suitable for increasing the efficiency of the work of filling the accommodation space with the sensing material.

  The solvent contained in the sensing material only needs to dissolve at least a part of the solute contained in the sensing material. The solvent constitutes a solution or a suspension (for example, a colloidal solution or a slurry solution) by dissolving at least a part of the solute contained in the sensing material.

  For example, the solvent is water, an alcohol solvent (eg, isopropyl alcohol, ethanol, or phenoxyethanol), a formamide solvent (eg, N, N-dimethylformamide, etc.), a ketone solvent (eg, acetone, cyclohexanone, or , 2-butanone, etc.), ether solvents (for example, diethyl ether), halogen solvents (for example, dichloroform or chloroform), polar solvents having cyclic compounds (for example, 2-pyrrolidone, N-methyl) -2-pyrrolidone or tetrahydrofuran), or a benzene-based solvent (for example, toluene or xylene).

  For example, the sensing material may be a synthetic polymer (eg, a thermoplastic polymer, a thermosetting polymer, or a photocurable polymer), a natural product-derived polymer (eg, a biopolymer), an inorganic material (eg, Metal, ceramics, etc.), carbon material, or a composition containing at least one of them. For example, the sensing material may include fine particles such as an inorganic material, a carbon material, a low molecular compound, or a polymer.

In addition, the manufacturing method of a synthetic polymer is disclosed by the nonpatent literature 1, for example.
(Non-Patent Document 1) “Practical Plastic Encyclopedia”, Practical Plastic Encyclopedia Editorial Committee, Industrial Research Committee, 1993

The sensing material may include one type of thermoplastic polymer and may include two or more types of thermoplastic polymers.
For example, the thermoplastic polymer may be a polyolefin resin (eg, polyethylene, polypropylene, polystyrene, polyvinyl chloride, or polyvinyl alcohol), a polyolefin wax (eg, polyethylene oligomer or polypropylene oligomer), or a thermoplastic acrylic resin. , Polycarbonate resin, thermoplastic polyester resin, polyamide resin, polyimide resin, ABS (acrylonitrile butylene styrene) resin, elastomer (for example, polyolefin elastomer, hydrogenated styrene block copolymer, or hydrogenated styrene random copolymer) Etc.), super engineering plastics (for example, polyphenylene sulfide, polyamideimide, polyethersulfone, or poly Ether ketone, etc.), or may be a syndiotactic polystyrene.

  For example, thermosetting polymer or photocurable polymer is acrylic resin, unsaturated polyester resin, epoxy resin, phenol resin, urea resin, polyurethane resin, melamine resin, silicone resin, alkyd resin, or thermosetting. A conductive polyimide. When the sensing material contains a thermosetting polymer or a photo-curable polymer, the monomer and initiator before curing are mixed, and immediately after that, the mixture is filled into the accommodation space, and the mixture is cured by heat or light. By doing so, the volume change body 14 may be formed.

  For example, a natural product-derived polymer is a polysaccharide derived from a natural product (eg, cellulose, chitin, chitosan, hyaluronic acid, or xanthan gum), a derivative of a polysaccharide derived from a natural product, an amino acid polymer, or a derivative of an amino acid polymer. A protein (eg, gelatin or collagen) or a protein derivative.

For example, the inorganic material is made of at least one material selected from a material group consisting of glass fibers, carbon fibers, and inorganic fillers.
For example, the inorganic filler is an amorphous filler (for example, calcium carbonate, silica, kaolin, clay, titanium oxide, barium sulfate, zinc oxide, aluminum hydroxide, alumina, or magnesium hydroxide), a plate-like filler (for example, Talc, mica, glass flakes, etc.), acicular filler (eg, wollastonite, potassium titanate, basic magnesium sulfate, sepiolite, zonotlite, aluminum borate, etc.), conductive filler (eg, metal powder) Metal flakes, carbon black, or carbon nanotubes), glass beads, glass powder, apatite, or zeolite.

  The sensing material may contain one type of inorganic filler, and may contain two or more types of inorganic fillers. Further, the surface of the inorganic filler may be coated with carbon, or may be subjected to silane coupling treatment or the like.

  For example, the carbon material is made of at least one material selected from the material group consisting of activated carbon, carbon nanotubes, and graphite.

  For example, the sensing material may comprise a synthesized porous body such as a metal organic structure (MOF). The metal organic structure may be referred to as a porous coordination polymer. For example, the metal organic structure may be Basolite (registered trademark) C300 (manufactured by BASF).

  The sensing material may also contain an additive. For example, the additive may be a flame retardant (eg, brominated bisphenol, brominated epoxy resin, brominated polystyrene, brominated polycarbonate, triphenyl phosphate, phosphonic acid amide, or red phosphorus), a flame retardant aid (eg, Antimony trioxide or sodium antimonate, etc.), heat stabilizer (eg phosphate ester or phosphite ester), antioxidant (eg hindered phenol etc.), heat-resistant agent, weathering agent, light It may be a stabilizer, a release agent, a flow modifier, a colorant, a pigment, a lubricant, an antistatic agent, a crystal nucleating agent, a plasticizer, a foaming agent, a halogen catcher, or an anti-drip agent.

  The sensing material may also include spherical particles. According to this, since the fluidity is higher than when the sensing material includes non-spherical particles, the accommodation space can be easily filled with the sensing material including spherical particles.

  For example, if the subject is carbon dioxide, the sensing material may include potassium hydroxide. For example, if the subject is temperature, the sensing material may include polyethylene. For example, if the subject is humidity, the sensing material may include nylon. For example, if the object is an electromagnetic wave, the sensing material may include black carbon.

(Production method)
Next, a manufacturing method (in other words, a sensor manufacturing method) of the sensor 1 of the first embodiment will be described.
In this example, the sensor 1 is manufactured according to the steps shown in FIGS. Note that at least a part of the sensor 1 may be manufactured according to a process different from the process shown in FIGS. 9 and 10.

  First, as shown in FIG. 9A, an SOI (a first silicon layer LA, an insulating layer LB in contact with the first silicon layer LA, and a second silicon layer LC in contact with the insulating layer LB). A silicon on insulator) substrate is prepared. In this example, the insulating layer LB is made of silicon dioxide.

  Next, as shown in FIG. 9B, boron is added to the second silicon layer LC. In this example, the addition of boron is performed using a technique called doping. According to the second silicon layer LCA to which boron is added, the contact resistance of the conductor can be reduced.

  Next, as shown in FIG. 9C, a thin film made of aluminum is formed on the surface of the second silicon layer LCA opposite to the insulating layer LB. In this example, the thin film made of aluminum is formed using a technique called sputtering. Further, the first wiring 1333 and the second wiring 1334 are formed by removing a part of the formed thin film. In this example, part of the thin film is removed using a technique called metal etching. In this example, the second silicon layer LCA corresponds to the first member and the second member.

  Next, as shown in FIG. 9D, the third layered body 13 is formed by removing a part of the second silicon layer LCA. In this example, part of the second silicon layer LCA is removed using a technique called dry etching.

  Next, as shown in FIG. 10E, by removing a part of the first silicon layer LA and a part of the insulating layer LB, the first layered body 11 and the second layered body are removed. Each body 12 is formed. In this example, removal of a part of the first silicon layer LA and a part of the insulating layer LB is a technique called deep RIE (Deep Reactive Ion Etching) and vapor phase hydrofluoric acid etching (Vapor HF Etching). It is done using.

  Next, as illustrated in FIG. 10F, the insulating thin film OL is formed on the exposed surface of the third layered body 13, the first wiring 1333, and the second wiring 1334. . In this example, the insulator thin film OL is made of aluminum oxide. In this example, the insulating thin film is formed by using a technique called atomic layer deposition (Atomic Layer Deposition). For example, the thickness of the insulator thin film is 5 nm to 50 nm. In this example, the thickness of the insulator thin film is 20 nm.

  Next, a part of the insulating thin film OL formed on the surface of the first wiring 1333 and a part of the insulating thin film OL formed on the surface of the second wiring 1334 are removed, thereby connecting terminals for connection. Form. In this example, the connection terminals are formed using a technique called ion milling.

Next, as shown in FIG. 10G, the volume change body 14 is formed by filling the accommodating space of the main body 132 with the sensing material. In this example, the volume change body 14 is formed using a technique called an immersion method. For example, by immersing the main body portion 132 in a solution that is a sensing material, the sensing material is filled in the accommodation space of the main body portion 132, and the filled sensing material is dried at a temperature of 10 to 350 degrees Celsius to thereby increase the volume. A change body 14 is formed.
In this way, the sensor 1 is manufactured.

(Operation)
Next, operation | movement of the sensor 1 of 1st Embodiment is demonstrated.
Assume that the target exists in the vicinity of the sensor 1. In this case, the volume changing body 14 increases in volume according to the amount of the object by receiving the object.

  Thereby, the volume changing body 14 generates a stress including a negative component of the y-axis at the second end 1322 of the main body 132. The stress generated at the second end 1322 of the main body part 132 is transmitted to the detection part 133.

The electrical resistance of the piezoresistive element PZ of the detection unit 133 changes according to the stress transmitted from the main body 132. The electric circuit 100 stores a signal corresponding to the difference between the electric resistance of the piezoresistive element PZ of the detection unit 133 (in this example, the electric resistance of the first resistor 103) and the electric resistance of the second resistor 104 in the storage device 106. Remember me.
In this way, the sensor 1 detects the target.

  As described above, in the sensor 1 of the first embodiment, the main body 132 has a flat plate shape, and the first end 1321 in the first direction (the y-axis direction in this example) is supported. The housing portion has an opening space that opens at at least one of both end faces in the thickness direction of the main body 132. Furthermore, the volume changing body 14 is supported by the main body 132 so that the volume changes according to the amount of the object and at least a part of the volume changing body 14 is accommodated in the accommodation space. Furthermore, the detection unit 133 detects the stress that is connected to the second end 1322 in the first direction in the main body 132 and that is generated as the volume of the volume change body 14 changes.

  According to this, since the volume change body 14 is accommodated in the accommodation space, even if the volume of the volume change body 14 changes, it can suppress that a stress arises in the thickness direction of the main-body part 132. . Thereby, it can suppress that the main-body part 132 bends. Therefore, it is possible to suppress the occurrence of stress in the thickness direction of the main body portion 132 at the second end 1322. As a result, the change in the volume of the volume change body 14 can be reflected with high accuracy on the stress in the direction along the main body 132 generated at the second end 1322. In other words, the sensor 1 can detect the object with high accuracy.

  Furthermore, in the sensor 1 of the first embodiment, the accommodation space opens at both end surfaces in the thickness direction of the main body 132.

  According to this, when the volume of the volume change body 14 changes, the stress generated in the thickness direction of the main body portion 132 is suppressed more than when the accommodation space opens only at one end in the thickness direction of the main body portion. it can. Therefore, the change in volume of the volume change body 14 can be reflected with high accuracy on the stress generated at the second end 1322. As a result, the target can be detected with high accuracy.

  Furthermore, in the sensor 1 of the first embodiment, the accommodation space has a slit-like hole extending in a second direction (in this example, the x-axis direction) orthogonal to the first direction (in this example, the y-axis direction). Including.

  According to this, the volume change body 14 can be easily accommodated in the accommodation space. Moreover, the component of the 1st direction among the stress which arises in the main-body part 132 with the change of the volume of the volume change body 14 can be enlarged. Therefore, the change in volume of the volume change body 14 can be reflected with high accuracy on the stress generated at the second end 1322. As a result, the target can be detected with high accuracy.

  Furthermore, in the sensor 1 of the first embodiment, the accommodation space includes a plurality of holes, and the plurality of holes are arranged along the first direction (in this example, the y-axis direction).

By the way, the larger the hole, the more difficult it is to support the volume changing body 14 by the main body 132. Therefore, it is difficult to increase the amount of the volume change body 14.
On the other hand, according to the sensor 1, the quantity of the volume change body 14 can be increased easily by increasing the number of holes. In addition, since the plurality of holes are arranged along the first direction, the component in the first direction can be increased in the stress generated in the main body 132 due to the change in the volume of the volume change body 14. Therefore, the change in volume of the volume change body 14 can be reflected with high accuracy on the stress generated at the second end 1322. As a result, the target can be detected with high accuracy.

  Furthermore, in the sensor 1 of the first embodiment, the detection unit 133 includes a first supported portion 1331 that extends from the second end 1322 in the first direction (in this example, the y-axis direction) and that supports the tip. At the same time, the first supported portion 1331 detects the stress that occurs with the change in volume of the volume change body 14.

  According to this, it is possible to increase the compressive stress or tensile stress generated in the first supported portion 1331 as the volume of the volume change body 14 changes. Therefore, the change in volume of the volume change body 14 can be reflected with high accuracy on the stress generated in the first supported portion 1331. As a result, the target can be detected with high accuracy.

  Further, in the sensor 1 according to the first embodiment, the width of the first supported portion 1331 is set to a second direction (in this example, x-axis) orthogonal to the first direction (in this example, the y-axis direction). Narrower than the length in the axial direction).

  According to this, the stress generated in the first supported portion 1331 as the volume of the volume change body 14 changes can be made larger than the stress generated in the main body portion 132. Therefore, the change in volume of the volume change body 14 can be reflected with high accuracy on the stress generated in the first supported portion 1331. As a result, the target can be detected with high accuracy.

  Furthermore, in the sensor 1 of the first embodiment, the detection unit 133 includes a second supported portion 1332 that extends from the second end 1322 in the first direction (in this example, the y-axis direction) and that supports the tip. . The detection unit 133 includes a piezoresistive element PZ located on the first supported portion 1331. The detection unit 133 connects the first wiring 1333 that connects the piezoresistive element PZ and the tip of the first supported portion 1331, and the piezoresistive element PZ and the tip of the second supported portion 1332 through the main body 132. Second wiring 1334.

  According to this, the leakage current generated between the first wiring 1333 and the second wiring 1334 can be suppressed. Therefore, the object can be detected with high accuracy.

  Furthermore, in the sensor 1 of the first embodiment, the width of the central portion in the extending direction, which is the direction in which the first supported portion 1331 extends, of the first supported portion 1331 is the same as that of the first supported portion 1331. It is narrower than the width of both ends in the extending direction. The detection unit 133 detects a stress that is caused by a change in the volume of the volume change body 14 at a central portion in the extending direction of the first supported portion 1331.

  According to this, as the volume of the volume change body 14 changes, the stress generated in the central portion in the extending direction of the first supported portion 1331 is increased in the first supported portion 1331. It can be made larger than the stress generated at both ends in the present direction. Therefore, the change in volume of the volume change body 14 can be reflected with high accuracy on the stress generated in the central portion. As a result, the target can be detected with high accuracy.

  Furthermore, in the sensor 1 of the first embodiment, the volume changing body 14 is made of a material having an elastic modulus lower than that of the main body 132.

  According to this, the stress distribution in the volume change body 14 generated with the change in the volume of the volume change body 14 can be brought close to a uniform state. Thereby, the change of the volume of the volume change body 14 can be reflected in the stress which arises in the main-body part 132 with high precision. As a result, the target can be detected with high accuracy.

  In the sensor 1 of the first embodiment, the volume changing body 14 may be made of a material having an elastic modulus higher than that of the main body 132.

  In this case, it is possible to increase the deformation of the main body 132 caused by the change in the volume of the volume change body 14. Thereby, the change in the volume of the volume change body 14 can be reflected with high accuracy in the stress in the direction along the main body 132 generated at the second end 1322. In other words, the sensor 1 can detect the object with high accuracy.

  Further, in the sensor 1 of the first embodiment, the elastic modulus of the volume change body 14 is larger than that of the main body 132 before and after the change of the volume of the volume change body 14.

  For example, before and after the change of the volume of the volume change body 14, when the elastic modulus of the volume change body 14 is significantly lower than that of the main body 132, the strength of the sensor 1 before the volume change of the volume change body 14 is increased. it can. Further, in this case, after the volume of the volume change body 14 is changed, the stress distribution in the volume change body 14 caused by the change of the volume of the volume change body 14 can be made closer to a uniform state. Thereby, the change of the volume of the volume change body 14 can be reflected in the stress which arises in the main-body part 132 with high precision. As a result, the target can be detected with high accuracy.

  Furthermore, the manufacturing method of the sensor 1 of the first embodiment includes filling the accommodation space with a flowable sensing material, and forming the volume change body 14 by drying the filled sensing material.

  According to this, the volume changing body 14 filling the accommodation space can be easily formed.

  Furthermore, in the method for manufacturing the sensor 1 of the first embodiment, the viscosity of the sensing material is 1 [mPa · sec] to 1000 [mPa · sec].

  According to this, since the fluidity of the sensing material is sufficiently high, the accommodation space can be easily filled with the sensing material.

  In the sensor 1 according to the first embodiment, the entire volume change body 14 is accommodated in the accommodation space of the main body 132. In the sensor 1 of the first modified example of the first embodiment, the volume change body 14 is configured such that a part of the volume change body 14 is accommodated in the accommodation space and the other part of the volume change body 14 is the main body portion. Of 132, at least a part of both end faces in the thickness direction of the main body 132 may be covered. For example, the volume changing body 14 may cover a region where the space forming portion 1323 exists in both end surfaces in the thickness direction of the main body portion 132.

  In the sensor 1 of the first embodiment, the main body portion 132 is attached to the frame portion 131 at the second end 1322 via two supported portions including the first supported portion 1331 and the second supported portion 1332. Connect. In the sensor 1 of the second modified example of the first embodiment, the main body portion 132 may be connected to the frame portion 131 via one supported portion at the second end 1322, or three or more. You may connect with the frame part 131 through the supported part. Further, the main body part 132 may be connected to the frame part 131 via one or more supported parts at the first end 1321.

  Further, as shown in FIG. 6, in the sensor 1 of the first embodiment, each hole included in the accommodation space formed by the space forming portion 1323 of the main body portion 132 is the main body in the thickness direction of the main body portion 132. It is a through hole that penetrates the portion 132. As shown in FIG. 11, in the sensor 1 of the third modified example of the first embodiment, each hole included in the accommodation space formed by the space forming portion 1323 </ b> A of the main body portion 132 is included in the main body portion 132. A bottomed hole that opens at the end face in the positive direction of the z-axis may be used.

  Also, as shown in FIG. 12, in the sensor 1 of the fourth modified example of the first embodiment, each hole included in the accommodation space formed by the space forming portion 1323 </ b> B of the main body portion 132 is included in the main body portion 132. The bottomed first hole that opens at the end face in the positive direction of the z-axis, or the bottomed second hole that opens at the end face in the negative direction of the z-axis of the main body 132. Good. For example, as illustrated in FIG. 12, the plurality of holes included in the accommodation space may have the first holes and the second holes alternately arranged along the y-axis direction.

  Further, as shown in FIG. 4, in the sensor 1 of the first embodiment, the number of holes included in the accommodation space formed by the space forming portion 1323 of the main body portion 132 is two or more. As shown in FIG. 13, in the sensor 1 of the fifth modification of the first embodiment, the number of holes included in the accommodation space formed by the space forming portion 1323C of the main body portion 132 is one. May be. For example, as shown in FIG. 13, the space forming portion 1323 </ b> C of the main body 132 has a comb-like shape in a plan view of the main body 132 (in other words, when the main body 132 is viewed in the negative direction of the z axis). It may be.

  In addition, as illustrated in FIG. 4, in the sensor 1 of the first embodiment, the accommodation space formed by the space forming portion 1323 of the main body portion 132 includes a plurality of slit-shaped holes. As shown in FIG. 14, in the sensor 1 of the sixth modification of the first embodiment, the space forming portion 1323 </ b> C of the main body 132 is a plan view of the main body 132 (in other words, the main body 132 is moved to the z position). In the negative direction of the shaft). For example, as shown in FIG. 14, each hole included in the accommodation space may be a regular hexagon in the plan view of the main body 132. Each hole included in the accommodation space may have a shape other than a regular hexagon (such as a circle, an ellipse, or a polygon other than a regular hexagon) in the plan view of the main body 132.

  Further, in the sensor 1 of the first embodiment, the corner portion of the accommodation space formed by the space forming portion 1323 of the main body portion 132 may have a curved surface shape or a chamfered shape.

  When the volume change body 14 is formed by filling the accommodation space with a sensing material having fluidity, when the corner of the accommodation space forms a ridge, it may be difficult to spread the sensing material to the corner. In other words, the volume changing body 14 may not be able to fill the accommodation space. In this case, the change in the volume of the volume change body 14 may not be reflected with high accuracy in the stress in the direction along the main body 132 generated at the second end 1322.

  On the other hand, when the corner portion of the accommodation space has a curved surface shape or a chamfered shape, when the volume change body 14 is formed by filling the accommodation space with a fluid sensing material, the sensing material is cornered. Can be distributed to the department. Therefore, the volume changing body 14 can fill the accommodation space. As a result, the change in the volume of the volume change body 14 can be reflected with high accuracy on the stress in the direction along the main body 132 generated at the second end 1322. In other words, the object can be detected with high accuracy.

  The sensor 1 of the first embodiment may be applied to a detection device that detects each of a plurality of different objects. In this case, the detection device preferably includes a plurality of sensors 1 having different sensing materials. For example, the plurality of sensors 1 may have a grid-like arrangement.

(First embodiment)
Next, a first example of the sensor 1 according to the first embodiment will be described.
In the sensor 1 of the first embodiment, the sensing material is a solution obtained by dissolving olester Q517 (registered trademark, manufactured by Mitsui Chemicals, Inc.), which is a solute, in a mixed solvent composed of cyclohexanone and dimethylformamide. In this example, the mixed solvent has a mixing ratio of cyclohexanone and dimethylformamide of 2: 1. In this example, the weight ratio of the solute and the mixed solvent in the sensing material is 1: 7.

  In this example, the viscosity of the sensing material is 2 [mPa · sec]. In this example, the viscosity was measured by using a B-type rotational viscometer (TV-35 type viscometer, manufactured by Toki Sangyo Co., Ltd.), putting 1 mL of the solution into a measurement container, 25 ° C. and 50% RH (relative It is measured after rotating for 60 seconds at a rotation speed of 50 rpm in an atmosphere of Humidity). The viscosity described below is also measured in the same manner as in this example.

  In this example, the main body 132 is immersed in a solution that is a sensing material to fill the accommodation space of the main body 132 and the filled sensing material is dried at room temperature for 8 to 12 hours. By doing so, the volume change body 14 is formed.

  In this example, the elastic modulus (in this example, Young's modulus) of the volume change body 14 is 2.5 GPa. In this example, the elastic modulus was measured using an ultra micro hardness tester (DUH-W201S, manufactured by Shimadzu Corporation), the test force was 0.5 mN, the load speed was 0.142 mN / sec, and It is measured under the condition that the holding time is 5 seconds. The elastic modulus described later is also measured in the same manner as in this example.

In this example, for the electrical resistance _{R S} of the first resistor 103, the ratio [Delta] R / _{R S} of the variation [Delta] R of the electrical resistance _{R S} of the first resistor 103 is represented by Equation 1. Here, V _OUT represents a potential output from the amplifier 105 (in other words, a potential representing a signal stored in the storage device 106). G represents the amplification factor of the amplifier 105 (in other words, the ratio of the potential output from the amplifier 105 to the potential input to the amplifier 105). In addition, I represents the current flowing through the electric circuit shown in FIG.

As expressed in Equation 1, the potential _VOUT representing the signal stored in the storage device 106 is a change amount ΔR of the electric resistance R _S of the first resistor 103 with respect to the electric resistance R _S of the first resistor 103. The ratio changes in proportion to the ratio ΔR / R _S.

In the first operation example, the sensor 1 detects humidity as a target. In the second operation example, the sensor 1 detects hydrogen sulfide (H ₂ S) as a target.
In both the first operation example and the second operation example, the sensor 1 is installed inside the gas chamber. In both the first operation example and the second operation example, a humidity sensor for measuring a humidity reference value is installed inside the gas chamber.

  In the first operation example, a gas composed of nitrogen (in other words, nitrogen gas) is supplied into the gas chamber for a predetermined period, and then a gas composed of water and nitrogen (in other words, a water mixed gas) is supplied. The humidity inside the gas chamber was changed over time by supplying the gas chamber into the gas chamber over a predetermined period.

  As shown in FIG. 15, the signal S11 stored in the storage device 106 in the sensor 1 changes so as to follow the reference signal S10 represented by the reference value measured by the humidity sensor with sufficiently high accuracy. .

  Further, in the first operation example, nitrogen gas is supplied to the inside of the gas chamber for a predetermined period, and then the water mixed gas is supplied to the inside of the gas chamber for a predetermined period. Changing the humidity inside the gas chamber over time was repeatedly performed.

  As shown in FIG. 16, the signal S21 stored in the storage device 106 in the sensor 1 is sufficiently larger than the reference signal S20 represented by the reference value measured by the humidity sensor even for repeated changes in humidity. It changes to follow with high accuracy.

As shown in FIG. 17, the potential represented by the signal stored in the storage device 106 in the sensor 1 and the reference value measured by the humidity sensor have a strong correlation (in this example, a linear relationship).
Thus, according to the sensor 1 of the first embodiment, the humidity can be detected with high accuracy over a relatively wide humidity range.

In the second operation example, nitrogen gas is supplied to the inside of the gas chamber for a predetermined period, and then a gas composed of nitrogen and hydrogen sulfide and having a hydrogen sulfide concentration of 4.75 ppm (in other words, sulfide gas). The hydrogen sulfide concentration in the gas chamber was changed over time by supplying the hydrogen mixed gas) to the inside of the gas chamber over a predetermined period. In this example, the concentration of hydrogen sulfide (H ₂ S) is measured by a gas detector tube (hydrogen sulfide 4LB, manufactured by Gastec Corporation).

  As shown in FIG. 18, the reference signal S30 represented by the reference value measured by the humidity sensor after time t1 when the gas supplied into the gas chamber is switched from nitrogen gas to hydrogen sulfide mixed gas is The reference value decreases with time. On the other hand, after the time t1, the potential of the signal S31 stored in the storage device 106 of the sensor 1 increases with time.

Therefore, it is presumed that the volume changing body 14 of the sensor 1 interacts (for example, adsorbs or sorbs hydrogen sulfide) with molecules other than humidity (in this example, hydrogen sulfide).
Thus, in the sensor 1, the volume of the volume change body 14 changes as the volume change body 14 interacts with the target. Therefore, the amount of the object can be reflected in the change in volume of the volume change body 14 with high accuracy. As a result, the target can be detected with high accuracy.

(Second embodiment)
Next, a second example of the sensor 1 according to the first embodiment will be described.
In the sensor 1 of the second embodiment, the sensing material is a solution obtained by dissolving Yuban 20SE60 (registered trademark, manufactured by Mitsui Chemicals, Inc.), which is a solute, in a solvent composed of dimethylformamide. In this example, the weight ratio of the solute and the mixed solvent in the sensing material is 1: 3. Also in this example, similarly to the first example, the volume change body 14 is formed using the dipping method.

Similar to the first embodiment, in the first operation example, the sensor 1 detects humidity as a target. Similar to the first embodiment, in the second operation example, the sensor 1 detects hydrogen sulfide (H ₂ S) as a target.

  In the first operation example, nitrogen gas is supplied to the inside of the gas chamber for a predetermined period, and then the water mixed gas is supplied to the inside of the gas chamber for a predetermined period. The internal humidity was changed over time.

  As shown in FIG. 19, the signal S41 stored in the storage device 106 in the sensor 1 does not change so as to follow the reference signal S40 represented by the reference value measured by the humidity sensor. In other words, the responsiveness to the humidity of the sensor 1 of the second embodiment is lower than that of the sensor 1 of the first embodiment.

  In the second operation example, the hydrogen sulfide mixed gas was supplied to the inside of the gas chamber over a predetermined period, whereby the concentration of hydrogen sulfide inside the gas chamber was changed over time.

  As shown in FIG. 20 and FIG. 21, the reference signals S50 and S60 represented by the reference value measured by the humidity sensor after time t2 when the hydrogen sulfide mixed gas starts to be supplied into the gas chamber The reference value decreases with the passage of time. On the other hand, after the time t2, the potentials of the signals S51 and S61 stored in the storage device 106 of the sensor 1 increase with time.

Therefore, it is presumed that the volume changing body 14 of the sensor 1 interacts (for example, adsorbs or sorbs hydrogen sulfide) with molecules other than humidity (in this example, hydrogen sulfide).
Thus, in the sensor 1, the volume of the volume change body 14 changes as the volume change body 14 interacts with the target. Therefore, the amount of the object can be reflected in the change in volume of the volume change body 14 with high accuracy. As a result, the target can be detected with high accuracy.

(Third embodiment)
Next, a third example of the sensor 1 according to the first embodiment will be described.
In the sensor 1 of the third embodiment, the sensing material is a solution in which EPOKEY 863 (registered trademark, manufactured by Mitsui Chemicals, Inc.), which is a solute, is dissolved in a solvent composed of dimethylformamide. In this example, the weight ratio of the solute and the mixed solvent in the sensing material is 1: 7. Also in this example, similarly to the first example, the volume change body 14 is formed using the dipping method. In this example, the elastic modulus (in this example, Young's modulus) of the volume change body 14 is 2.5 GPa.

Similar to the first embodiment, in the first operation example, the sensor 1 detects humidity as a target. Similar to the first embodiment, in the second operation example, the sensor 1 detects hydrogen sulfide (H ₂ S) as a target.

  In the first operation example, nitrogen gas is supplied to the inside of the gas chamber for a predetermined period, and then the water mixed gas is supplied to the inside of the gas chamber for a predetermined period. The internal humidity was changed over time.

  As shown in FIG. 22, the signal S71 stored in the storage device 106 in the sensor 1 changes so as to follow the reference signal S70 represented by the reference value measured by the humidity sensor with sufficiently high accuracy. . In this example, the responsiveness to the humidity of the sensor 1 of the third embodiment is lower than that of the sensor 1 of the first embodiment.

  In the second operation example, nitrogen gas is supplied to the inside of the gas chamber for a predetermined period, and then the hydrogen sulfide mixed gas is supplied to the inside of the gas chamber for a predetermined period. The concentration of hydrogen sulfide inside was changed with time.

  As shown in FIG. 23, the signal S81 stored in the storage device 106 of the sensor 1 after time t3 when the gas supplied into the gas chamber is switched from nitrogen gas to hydrogen sulfide mixed gas is Similar to the reference signal S80 represented by the reference value measured by the humidity sensor, it decreases substantially monotonously with time.

  Therefore, it is estimated that the volume changing body 14 of the sensor 1 is unlikely to interact (for example, adsorb or sorb hydrogen sulfide) with molecules other than humidity (in this example, hydrogen sulfide).

The responsiveness of the sensor 1 of each example is expressed as shown in Table 1. In Table 1, a double circle indicates that the response is higher than that of the circle, and a circle indicates that the response is higher than that of the triangle.

<Second Embodiment>
Next, the sensor of the second embodiment will be described. The sensor according to the second embodiment is different from the sensor according to the first embodiment in that an object is detected based on bending stress. Hereinafter, the difference will be mainly described. In addition, in description of 2nd Embodiment, what attached | subjected the code | symbol same as the code | symbol used in 1st Embodiment is the same or substantially the same.

  As shown in FIGS. 24 to 27, the sensor 1A of the second embodiment is similar to the sensor 1 of the first embodiment in that the first layered body 11, the second layered body 12, and the third layered body. 13 and a volume change body 14.

  FIG. 24 is a front right upper perspective view of the sensor 1A. FIG. 25 is a front right upper perspective view of the sensor 1A in a state where the sensor 1A is disassembled. FIG. 26 is a plan view of the sensor 1A. FIG. 27 is a view of the cross section of the sensor 1A cut along the plane represented by the line XVIII-XVIII in FIG. 26 as viewed in the negative direction of the x axis.

  As shown in FIG. 26, the third layered body 13 includes a frame part 131, a main body part 132, and a detection part 133. The detection unit 133 includes, in addition to the first supported unit 1331, the second supported unit 1332, the first wiring 1333, and the second wiring 1334, which are included in the detection unit 133 of the first embodiment, the extending unit 1335. Is provided.

The frame part 131 has the same configuration as the frame part 131 of the first embodiment.
The main body 132 has a rectangular shape having a long side extending in the y-axis direction and a short side extending in the x-axis direction. The main body 132 may be square. The length of the main body 132 in the y-axis direction is shorter than the length of the hole in the frame 131 in the y-axis direction. In this example, the length of the main body 132 in the y-axis direction is 260 μm. The length of the main body 132 in the x-axis direction is shorter than the length of the hole in the frame 131 in the x-axis direction. In this example, the length of the main body 132 in the x-axis direction is 240 μm. An end of the main body portion 132 in the positive direction of the x axis is separated from the frame portion 131.

  The main body 132 is connected to the frame 131 at a first end 1321 of the main body 132 in the positive direction of the y-axis. In other words, the main body part 132 is supported by the frame part 131 at the first end 1321 of the main body part 132 in the positive direction of the y-axis.

  Of the second end 1322 in the negative y-axis direction of the main body 132, a portion other than the end in the negative x-axis direction is connected to the extending portion 1335. Of the second end 1322 in the negative y-axis direction of the main body 132, the end in the negative x-axis direction is separated from the frame 131.

  The main body 132 is connected to the frame 131 at a third end 1324 in the negative x-axis direction of the main body 132. In other words, the main body part 132 is supported by the frame part 131 at the third end 1324 in the negative direction of the x-axis of the main body part 132.

  The main body portion 132 includes a space forming portion 1323 that forms an accommodation space that opens at both end surfaces of the main body portion 132 in the z-axis direction (in other words, the thickness direction of the main body portion 132). In this example, the accommodation space is a through hole that penetrates the main body 132 in the z-axis direction.

  The accommodation space includes a plurality of slit-like slit portions extending in the x-axis direction, and includes a connecting portion that connects two adjacent slit portions at the central portion in the x-axis direction. In this example, the plurality of slit portions included in the accommodation space are arranged at equal intervals along the y-axis direction.

For example, the length in the y-axis direction of each slit portion included in the accommodation space is 1 μm to 10 μm. In this example, the length in the y-axis direction of each slit portion included in the accommodation space is 5 μm. For example, the distance in the y-axis direction between the slit portions included in the accommodation space is 1 μm to 10 μm long. In this example, the space | interval in the y-axis direction between the slit parts contained in accommodation space is 1 micrometer. In this example, there are 40 slit portions included in the accommodation space. 24 to 27, the plurality of slit portions included in the accommodation space are illustrated in an enlarged manner in the y-axis direction. Accordingly, in FIGS. 24 to 27, the plurality of slit portions included in the accommodation space are illustrated in a manner in which the number is reduced.
In this example, the length in the x-axis direction of the plurality of slit portions included in the accommodation space is 220 μm.

  As illustrated in FIG. 26, the extending portion 1335 has a rectangular shape having a long side extending in the x-axis direction and a short side extending in the y-axis direction. An end of the extending portion 1335 in the negative direction of the x-axis is separated from the frame portion 131. An end of the extending portion 1335 in the negative direction of the y-axis is separated from the frame portion 131.

  Of the end of the extending portion 1335 in the positive direction of the y-axis, a portion other than the end in the positive direction of the x-axis is connected to the second end 1322 of the main body 132. Of the ends of the extending portion 1335 in the positive direction of the y-axis, the end portion in the positive direction of the x-axis is separated from the frame portion 131.

  Thus, the extending portion 1335 is located at a position different from the position connected to the second end 1322 and the position in the x-axis direction (in this example, the position in the positive direction of the x-axis rather than the position connected to the second end 1322). ) Extending from the second end 1322.

  Of the ends of the extending portion 1335 in the positive direction of the x-axis (in other words, the tips of the extending portions 1335), both end portions in the y-axis direction are the first supported portion 1331 and the second supported portion. It is connected to the frame part 131 via 1332. Of the ends of the extending portion 1335, the center portion in the y-axis direction is separated from the frame portion 131.

  The first supported portion 1331 has a strip shape extending in the x-axis direction. An end of the first supported portion 1331 in the positive direction of the x axis is connected to the frame portion 131. An end of the first supported portion 1331 in the negative direction of the x axis is connected to an end portion of the extended portion 1335 in the negative direction of the y axis. In other words, the first supported portion 1331 extends in the positive direction of the x axis from the tip of the extending portion 1335, and the tip is supported by the frame portion 131.

  The width of the first supported portion 1331 (in other words, the length of the first supported portion 1331 in the y-axis direction) is the width of the extending portion 1335 (in other words, the length of the extending portion 1335 in the y-axis direction). Narrower than.

  The first supported portion 1331 has a notch NT. In this example, as the position in the x-axis direction approaches the center of the first supported portion 1331 from the end in the x-axis direction, the end in the negative direction of the y-axis of the notch NT is the y-axis. Located in the positive direction. Therefore, the width of the central portion in the extending direction (in this example, the x-axis direction), which is the direction in which the first supported portion 1331 extends, of the first supported portion 1331 is the same as that of the first supported portion 1331. It is narrower than the width of both ends in the extending direction.

  The first supported portion 1331 includes a piezoresistive element PZ located at the center of the first supported portion 1331 in the extending direction. The piezoresistive element PZ is an element whose electric resistance changes according to the stress applied to the piezoresistive element PZ. In other words, the piezoresistive element PZ is an element having a piezoresistive effect or a piezoresistive effect.

The piezoresistive element PZ is embedded in the first supported part 1331 so as to be exposed at the end face of the first supported part 1331 in the positive direction of the z-axis, like the piezoresistive element PZ of the first embodiment. Yes.
With such a configuration, the detection unit 133 detects the stress transmitted from the main body unit 132 at the center of the first supported portion 1331 in the extending direction.

  The second supported portion 1332 has a strip shape extending in the x-axis direction. An end of the second supported portion 1332 in the positive direction of the x axis is connected to the frame portion 131. The end of the second supported portion 1332 in the negative x-axis direction is connected to the end of the extending portion 1335 in the positive y-axis direction. In other words, the second supported portion 1332 extends from the tip of the extending portion 1335 in the positive direction of the x axis, and the tip is supported by the frame portion 131.

  The width of the second supported portion 1332 (in other words, the length of the second supported portion 1332 in the y-axis direction) is narrower than the width of the extending portion 1335. Of the second supported parts 1332, the width of the central part in the extending direction (in this example, the x-axis direction), which is the direction in which the second supported parts 1332 extend, is the second supported part 1332. It is equal to the width of both ends in the extending direction.

The first wiring 1333 and the second wiring 1334 have the same configuration as the first wiring 1333 and the second wiring 1334 of the first embodiment, except that the positions are different.
In this example, one end of the first wiring 1333 is in contact with the end of the piezoresistive element PZ in the positive direction of the x axis. The other end of the first wiring 1333 is located on the outer edge of the frame portion 131. The first wiring 1333 extends from the end of the piezoresistive element PZ in the positive x-axis direction to the tip of the first supported portion 1331 (in other words, the frame portion 131 of the first supported portion 1331). It extends to the outer edge of the frame 131 through the connecting end). In other words, the first wiring 1333 connects the piezoresistive element PZ and the tip of the first supported portion 1331.

  One end of the second wiring 1334 is in contact with the end of the piezoresistive element PZ in the negative direction of the x axis. The other end of the second wiring 1334 is located on the outer edge of the frame portion 131. The second wiring 1334 extends from the end of the piezoresistive element PZ in the negative x-axis direction to the base end of the first supported portion 1331 (in other words, the extended portion of the first supported portion 1331). End extending to 1335), extending in the positive direction of the x-axis of the extending portion 1335, and extending to the outer edge of the frame portion 131 through the second supported portion 1332.

  In other words, the second wiring 1334 extends between the piezoresistive element PZ and the tip of the second supported portion 1332 (in other words, the end of the second supported portion 1332 connected to the frame portion 131). Tie through 1335.

The volume change body 14 is supported by the main body portion 132 so as to be accommodated in the accommodation space of the main body portion 132, similarly to the volume change body 14 of the first embodiment.
Furthermore, the first wiring 1333 and the second wiring 1334 are connected to the same electrical circuit as in the first embodiment.

As described above, according to the sensor 1A of the second embodiment, the same operations and effects as the sensor 1 of the first embodiment are exhibited.
Further, in the sensor 1A of the second embodiment, the extending portion 1335 includes a position connected to the second end 1322 and a second direction (in this example, the y-axis direction) perpendicular to the first direction (in this example, the y-axis direction). The second end 1322 extends to a position where the position in the x-axis direction is different. The first supported portion 1331 extends from the tip of the extending portion 1335 and the tip of the first supported portion 1331 is supported. The detection unit 133 detects, in the first supported portion 1331, the stress generated with the volume change of the volume change body 14.

  According to this, it is possible to increase the bending stress generated in the first supported portion 1331 as the volume of the volume change body 14 changes. Therefore, the change in volume of the volume change body 14 can be reflected with high accuracy on the stress generated in the first supported portion 1331. As a result, the target can be detected with high accuracy.

  Furthermore, in the sensor 1 </ b> A of the second embodiment, the width of the first supported portion 1331 is narrower than the width of the extending portion 1335.

  According to this, the stress generated in the first supported portion 1331 as the volume of the volume changing body 14 changes can be made larger than the stress generated in the extending portion 1335. Therefore, the change in volume of the volume change body 14 can be reflected with high accuracy on the stress generated in the first supported portion 1331. As a result, the target can be detected with high accuracy.

  Furthermore, in the sensor 1A of the second embodiment, the detection unit 133 includes a second supported portion 1332 that extends from the tip of the extending portion 1335 and supports the tip. The detection unit 133 includes a piezoresistive element PZ located on the first supported portion 1331. The detection unit 133 passes the first wiring 1333 connecting the piezoresistive element PZ and the tip of the first supported portion 1331, and the piezoresistive element PZ and the tip of the second supported portion 1332 through the extending portion 1335. A second wiring 1334 to be connected.

  According to this, the leakage current generated between the first wiring 1333 and the second wiring 1334 can be suppressed. Therefore, the object can be detected with high accuracy.

  Furthermore, in the sensor 1 </ b> A of the second embodiment, the width of the central portion in the extending direction, which is the direction in which the first supported portion 1331 extends, of the first supported portion 1331 is the same as that of the first supported portion 1331. It is narrower than the width of both ends in the extending direction. The detection unit 133 detects a stress that is caused by a change in the volume of the volume change body 14 at a central portion in the extending direction of the first supported portion 1331.

  According to this, as the volume of the volume change body 14 changes, the stress generated in the central portion in the extending direction of the first supported portion 1331 is increased in the first supported portion 1331. It can be made larger than the stress generated at both ends in the present direction. Therefore, the change in volume of the volume change body 14 can be reflected with high accuracy on the stress generated in the central portion. As a result, the target can be detected with high accuracy.

  In the sensor 1 </ b> A of the second embodiment, the entire volume change body 14 is accommodated in the accommodation space of the main body 132. In the sensor 1A of the first modified example of the second embodiment, the volume change body 14 is configured such that a part of the volume change body 14 is accommodated in the accommodation space and the other part of the volume change body 14 is the main body portion. Of 132, at least a part of both end faces in the thickness direction of the main body 132 may be covered. For example, the volume changing body 14 may cover a region where the space forming portion 1323 exists in both end surfaces in the thickness direction of the main body portion 132.

  Further, in the sensor 1A of the second embodiment, the extending portion 1335 is a frame through two supported portions including the first supported portion 1331 and the second supported portion 1332 at the tip of the extending portion 1335. It is connected to the part 131. In the sensor 1A of the second modified example of the second embodiment, the extending part 1335 may be connected to the frame part 131 through one supported part at the tip of the extending part 1335, You may connect with the frame part 131 via three or more to-be-supported parts.

  In addition, as illustrated in FIG. 26, in the sensor 1 </ b> A of the second embodiment, the first supported portion 1331 and the second supported portion 1332 are the positive direction of the x-axis of the extending portion 1335. In both ends in the y-axis direction, respectively, in the positive direction of the x-axis. As shown in FIG. 28, in the sensor 1A of the third modified example of the second embodiment, the first supported portion 1331J and the second supported portion 1332J are of the extending portion 1335. Of the ends in the negative direction of the y-axis, the end portions in the positive direction of the x-axis may extend in the negative direction of the y-axis, respectively.

  29, in the sensor 1A of the fourth modified example of the second embodiment, the first supported portion 1331K and the second supported portion 1332K are the extended portions 1335. Of the ends in the positive direction of the y-axis, the end portions in the positive direction of the x-axis may extend in the positive direction of the y-axis, respectively. In this case, the detection unit 133 may include a connecting portion 1336 that connects the first supported portion 1331K, the second supported portion 1332K, and the frame portion 131.

  In addition, as illustrated in FIG. 26, in the sensor 1 </ b> A of the second embodiment, the accommodation space formed by the space forming portion 1323 of the main body portion 132 is one hole including a plurality of slit portions. As shown in FIG. 30, in the sensor 1A of the fifth modification of the second embodiment, the accommodation space formed by the space forming portion 1323L of the main body 132 is the same as the space forming portion 1323 of the first embodiment. Similarly, a plurality of slit-like holes extending in the x-axis direction may be included. In this case, each hole included in the accommodation space may be a bottomed hole that opens at the end face in the positive direction of the z-axis of the main body 132. In addition, each hole included in the accommodation space is a bottomed first hole that opens at an end face in the positive direction of the z-axis of the main body 132 or a negative direction of the z-axis of the main body 132. It may be a bottomed second hole that opens at the end face.

  In addition, as shown in FIG. 26, in the sensor 1 </ b> A of the second embodiment, the housing space formed by the space forming portion 1323 of the main body portion 132 connects a plurality of slit portions and the slit portions at the central portion. And a connecting portion. As shown in FIG. 31, in the sensor 1A of the sixth modification of the second embodiment, the space forming portion 1323M of the main body 132 is a plan view of the main body 132 (in other words, the main body 132 is moved to z. (When viewed in the negative direction of the shaft).

  32, in the sensor 1A of the seventh modified example of the second embodiment, the space forming portion 1323N of the main body 132 is a plan view of the main body 132 (in other words, the main body 132 is moved to the z position). In the negative direction of the shaft). For example, as shown in FIG. 32, each hole included in the accommodation space may be a regular hexagon in the plan view of the main body 132. Each hole included in the accommodation space may have a shape other than a regular hexagon (such as a circle, an ellipse, or a polygon other than a regular hexagon) in the plan view of the main body 132.

  The sensor 1A of the second embodiment may be applied to a detection device that detects each of a plurality of different objects. In this case, the detection apparatus preferably includes a plurality of sensors 1A having different sensing materials. For example, the plurality of sensors 1A may have a grid-like arrangement.

  In addition, this invention is not limited to embodiment mentioned above. For example, various modifications that can be understood by those skilled in the art may be added to the above-described embodiments without departing from the spirit of the present invention.

1, 1A Sensor 11 First layered body 12 Second layered body 13 Third layered body 131 Frame portion 132 Main body portion 1321 First end 1322 Second end 1323, 1323A to 1323C, 1323L to 1323N Space forming portion 1324 Third end 133 Detecting parts 1331, 1331J, 1331K First supported parts 1332, 1332J, 1332K Second supported parts 1333 First wiring 1334 Second wiring 1335 Extension part 1336 Connection part 14 Volume change body 100 Electric circuit 101 First power supply 102 First Two power sources 103 First resistor 104 Second resistor 105 Amplifier 106 Memory device LA First silicon layer LB Insulating layer LC, LCA Second silicon layer NT Notch OL Oxide thin film PZ Piezoresistive element

Claims (13)

A main body portion that is flat and has a housing space that is supported at the first end in the first direction and opens at at least one of both end surfaces in the thickness direction;
The volume changes according to the amount of the object, and the volume change body supported by the main body so that at least a part is accommodated in the accommodation space,
A detecting unit connected to the second end in the first direction of the main body unit and detecting a stress caused by a change in volume of the volume changing body;
With
The said volume change body is a sensor which consists of a material whose elastic modulus is lower than the said main-body part. The sensor according to claim 1,
The elastic modulus of the main body is a sensor that is at least twice the elastic modulus of the volume change body. The sensor according to claim 1 or 2,
The elastic modulus of the volume change body is a sensor in which a change before and after the change in volume is larger than that of the main body. The sensor according to any one of claims 1 to 3,
The said volume change body is a sensor containing the material which adsorb | sucks, melt | dissolves or diffuses the said molecule | numerator by interacting with a predetermined | prescribed molecule | numerator. The sensor according to any one of claims 1 to 3,
The volume change body includes a material that polymerizes by absorbing heat or light. The sensor according to claim 5,
A sensor in which at least a part of the wall surface forming the accommodation space in the main body has higher thermal conductivity than the other parts in the main body. The sensor according to claim 5,
A sensor in which at least a part of a wall surface forming the accommodation space in the main body has a higher light transmittance than the other parts in the main body. The sensor according to any one of claims 1 to 3,
The said volume change body is a sensor containing a porous body or a foam. A sensor according to any one of claims 1 to 8,
The corner of the housing space has a curved surface shape or a chamfered shape. In the first member that is flat and supports the first end in the first direction, an accommodation space that opens at at least one of both end surfaces in the thickness direction is formed, and the first member An element for detecting stress is provided on the second member connected to the second end in the first direction,
The elastic member is made of a material having a higher elastic modulus than the first member, and at least a part of the volume changing body whose volume changes according to the amount of the object is accommodated in the accommodating space so as to be supported by the first member. A method for manufacturing a sensor. The sensor manufacturing method according to claim 10, comprising:
Filling the accommodation space with a fluid material;
A sensor manufacturing method comprising: forming the volume change body by drying the filled material. A sensor manufacturing method according to claim 11,
The sensor manufacturing method, wherein the viscosity of the material filled in the housing space is a value of 1 [mPa · sec] to 1000 [mPa · sec]. A sensor according to claim 11 or claim 12,
The method for manufacturing a sensor, wherein the material filled in the accommodation space includes spherical particles.

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