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JP2019174354A - Light receiving and emitting device and optical concentration measuring device - Google Patents

Light receiving and emitting device and optical concentration measuring device Download PDF

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JP2019174354A
JP2019174354A JP2018064724A JP2018064724A JP2019174354A JP 2019174354 A JP2019174354 A JP 2019174354A JP 2018064724 A JP2018064724 A JP 2018064724A JP 2018064724 A JP2018064724 A JP 2018064724A JP 2019174354 A JP2019174354 A JP 2019174354A
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light
light emitting
photodiode
semiconductor substrate
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JP7123599B2 (en
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大貴 安田
Daiki Yasuda
大貴 安田
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Asahi Kasei Electronics Co Ltd
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Abstract

To further improve the accuracy of measuring a gas concentration in an optical concentration measuring device.SOLUTION: A light receiving and emitting device 20 comprises a light emitting unit 21 having a light emission surface 21a and radiating light that includes infrared light, a light condensation unit 23 for condensing the light radiated from the light emission surface 21a, and a photodiode 22 having a light receiving surface 22a, with the light receiving surface 22a arranged at a light condensed point by the light condensation unit 23, the photodiode 22 including a first semiconductor substrate and a first semiconductor multilayer unit formed on one side of the first semiconductor substrate. At least a portion of the other side of the first semiconductor substrate is the light receiving surface 22a, and a short side a [μm] and long side b [μm] of the light receiving surface 22a and a short side c [μm] and long side d [μm] of the light emission surface 21a satisfy the formulas a-c>40 and b-d>40. The concentration of a substance in an optical path from the light emitting unit 21 to the photodiode 22 is measured by a concentration computation unit on the basis of a signal from the photodiode 22 of this light receiving and emitting unit 20.SELECTED DRAWING: Figure 5

Description

本発明は受発光装置及び光学式濃度測定装置に関する。   The present invention relates to a light emitting / receiving device and an optical density measuring device.

従来から大気中の測定対象ガスの濃度測定を行うガス濃度測定装置として、ガスの種類によって吸収される赤外線の波長が異なることを利用し、この吸収量を検出することによりそのガス濃度を測定する非分散赤外吸収型(Non−Dispersive Infrared)ガス濃度測定装置が知られている。
例えば、特許文献1に記載の受発光装置は、発光部と、集光部と、集光された光を反射させる反射部と、を有するガスセルを備える。発光部及び受光部をこれら発光部及び受光部それぞれに対応して設けた集光部の集光点に配置し、発光部から出射された光を集光部と反射部とを経由して受光部に入射させる。その際、測定対象ガスをガスセル内に導入することにより、受光部の出力信号に応じて測定対象のガスの濃度を検出するようになっている。
Conventionally, as a gas concentration measurement device that measures the concentration of the gas to be measured in the atmosphere, the gas concentration is measured by detecting the amount of absorption using the fact that the wavelength of infrared rays that are absorbed depends on the type of gas. Non-dispersive Infrared gas concentration measuring devices are known.
For example, the light receiving and emitting device described in Patent Literature 1 includes a gas cell that includes a light emitting unit, a light collecting unit, and a reflecting unit that reflects the collected light. The light emitting part and the light receiving part are arranged at the condensing points of the light collecting parts provided corresponding to the light emitting part and the light receiving part, respectively, and the light emitted from the light emitting part is received through the light collecting part and the reflecting part. Incident light. At that time, by introducing the measurement target gas into the gas cell, the concentration of the measurement target gas is detected according to the output signal of the light receiving unit.

特開2017−15567号公報JP 2017-15567 A

発光部から放射された光を効率よく受光部へ入射させるために、集光部を用いることが一般的であるが、このような光学式の濃度測定装置では集光部、発光部及び受光部の配置に高い精度が必要とされるため、個体差やロット差が発生しやすいという問題がある。
本発明は、以上の問題に鑑みてなされたもので、その目的とするところは、ロバスト性が強く、より高精度なガス濃度の検知に有利な受発光装置及びこれを用いた光学式濃度測定装置を提供することにある。
In order to make the light emitted from the light emitting part efficiently enter the light receiving part, it is common to use a light collecting part. In such an optical concentration measuring device, the light collecting part, the light emitting part and the light receiving part are used. Therefore, there is a problem that individual differences and lot differences are likely to occur.
The present invention has been made in view of the above problems, and the object of the present invention is a light receiving and emitting device that is highly robust and advantageous for detecting gas concentration with higher accuracy, and optical concentration measurement using the same. To provide an apparatus.

上記目的を達成するために、本発明の一態様に係る受発光装置は、発光面を有し、赤外光を含む光を放射する発光部と、発光面から放射された光を集光する集光部と、受光面を有し、受光面が集光部による集光点に配置されたフォトダイオードと、を備え、フォトダイオードは、第1半導体基板と、第1半導体基板の一方の面に形成された第1半導体積層部と、を有し、第1半導体基板の他方の面の少なくとも一部が前記受光面であり、受光面の短辺a[μm]及び長辺b[μm]と、発光面の短辺c[μm]及び長辺d[μm]とは、a−c>40、且つ、b−d>40を満たすことを特徴としている。   In order to achieve the above object, a light receiving and emitting device according to one embodiment of the present invention has a light emitting surface, emits light including infrared light, and collects light emitted from the light emitting surface. And a photodiode having a light collecting portion and a light receiving surface, the light receiving surface being disposed at a light collecting point by the light collecting portion, wherein the photodiode is a first semiconductor substrate and one surface of the first semiconductor substrate. And at least a part of the other surface of the first semiconductor substrate is the light-receiving surface, and the short side a [μm] and the long side b [μm] of the light-receiving surface In addition, the short side c [μm] and the long side d [μm] of the light emitting surface are characterized by satisfying a−c> 40 and b−d> 40.

また、本発明の一態様に係る光学式濃度測定装置は、上記態様の受発光装置と、受発光装置のフォトダイオードからの信号が入力され、発光部からフォトダイオードまでの光路中の物質の濃度を測定する濃度演算部と、を備えることを特徴としている。   Further, an optical concentration measurement device according to one embodiment of the present invention receives a signal from the light emitting / receiving device of the above embodiment and a photodiode of the light emitting / receiving device, and a concentration of a substance in an optical path from the light emitting unit to the photodiode. And a concentration calculation unit that measures the above.

本発明によれば、ロバスト性が強く、より高精度にガス濃度を検知することができる。   According to the present invention, the robustness is strong and the gas concentration can be detected with higher accuracy.

発光部の発光面及びフォトダイオードの受光面の短辺及び長辺を規定するための説明図である。It is explanatory drawing for prescribing | regulating the short side and long side of the light emission surface of a light emission part, and the light-receiving surface of a photodiode. 発光部が複数の発光面を有する場合の発光面の短辺及び長辺を規定するための説明図である。It is explanatory drawing for prescribing | regulating the short side and long side of a light emission surface in case a light emission part has a several light emission surface. 発光ダイオードの一例を説明するための概略構成図である。It is a schematic block diagram for demonstrating an example of a light emitting diode. フォトダイオードの一例を説明するための概略構成図である。It is a schematic block diagram for demonstrating an example of a photodiode. 受発光装置の一例を示す概略構成図である。It is a schematic block diagram which shows an example of a light emitting / receiving device. 光学式濃度測定装置の一例を示す概略構成図である。It is a schematic block diagram which shows an example of an optical density | concentration measuring apparatus.

以下、本発明を実施するための形態について説明する。
なお、以下の実施形態は、特許請求の範囲にかかる発明を限定するものではない。また、実施形態の中で説明されている特徴の組み合わせの全てが発明の解決手段に必須であるとは限らない。
Hereinafter, modes for carrying out the present invention will be described.
The following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

<光学式濃度測定装置>
本発明の一実施形態に係る光学式濃度測定装置は、受発光装置と、受発光装置のフォトダイオードからの信号が入力され、発光部からフォトダイオードまでの光路中の物質の濃度を測定する濃度演算部と、を備える。
受発光装置は、発光面を有し、赤外光を含む光を放射する発光部と、発光面から放射された光を集光する集光部と、受光面を有し、受光面が集光部による集光点に配置されたフォトダイオードと、を備え、フォトダイオードは、第1半導体基板と、第1半導体基板の一方の面に形成された第1半導体積層部と、を有し、第1半導体基板の他方の面の少なくとも一部が前記受光面であり、受光面の短辺a[μm]及び長辺b[μm]と、発光面の短辺c[μm]及び長辺d[μm]とが、a−c>40、且つ、b−d>40を満たす。
<Optical concentration measuring device>
An optical concentration measuring apparatus according to an embodiment of the present invention is a concentration that receives a signal from a light emitting / receiving device and a photodiode of the light emitting / receiving device and measures the concentration of a substance in an optical path from the light emitting unit to the photodiode. And an arithmetic unit.
The light receiving and emitting device has a light emitting surface, and includes a light emitting unit that emits light including infrared light, a light collecting unit that collects light emitted from the light emitting surface, and a light receiving surface. A photodiode disposed at a light condensing point by the optical unit, the photodiode having a first semiconductor substrate and a first semiconductor stacked unit formed on one surface of the first semiconductor substrate; At least a part of the other surface of the first semiconductor substrate is the light receiving surface, the short side a [μm] and the long side b [μm] of the light receiving surface, and the short side c [μm] and the long side d of the light emitting surface. [Μm] satisfies a−c> 40 and b−d> 40.

ここでいう、受光面及び発光面の短辺及び長辺とは、例えば、図1(a)に示すように、フォトダイオードの受光面が長方形である場合、又は発光部の発光面が長方形である場合には、長方形の短辺を受光面の短辺a又は発光面の短辺cといい、長方形の長辺を受光面の長辺b又は発光面の長辺dという。a、b、c及びdは、一例として、200μm以上2000μm以下の範囲から適宜選択することができる。
受光面及び発光面の形状は、図1(a)に示すように、長方形である場合に限るものではなく任意の形状とすることができる。
Here, the short side and the long side of the light receiving surface and the light emitting surface are, for example, as shown in FIG. 1A, when the light receiving surface of the photodiode is rectangular, or the light emitting surface of the light emitting unit is rectangular. In some cases, the short side of the rectangle is referred to as the short side a of the light receiving surface or the short side c of the light emitting surface, and the long side of the rectangle is referred to as the long side b of the light receiving surface or the long side d of the light emitting surface. For example, a, b, c, and d can be appropriately selected from a range of 200 μm to 2000 μm.
The shape of the light receiving surface and the light emitting surface is not limited to a rectangular shape as shown in FIG.

例えば、図1(b)に示すように、受光面が楕円形又は発光面が楕円形であってもよく、この場合には、楕円に外接する、面積が最小である長方形の短辺、つまり短径を受光面の短辺a又は発光面の短辺cとし、外接する長方形の長辺、つまり長径を受光面の長辺b又は発光面の長辺dとする。
また、図1(c)に示すように、受光面が平行な二辺を有する六角形又は発光面が平行な二辺を有する六角形であってもよく、この場合には、六角形に外接する長方形のうち、六角形の平行な二辺を長方形の二辺の一部に有し且つ面積が最小となる長方形の短辺を受光面の短辺a又は発光面の短辺cとし、外接する長方形の長辺を受光面の長辺b又は発光面の長辺dとする。
For example, as shown in FIG. 1B, the light receiving surface may be elliptical or the light emitting surface may be elliptical. In this case, the short side of the rectangle that circumscribes the ellipse and has the smallest area, that is, The short diameter is the short side a of the light receiving surface or the short side c of the light emitting surface, and the long side of the circumscribed rectangle, that is, the long diameter is the long side b of the light receiving surface or the long side d of the light emitting surface.
Further, as shown in FIG. 1C, the light receiving surface may be a hexagon having two parallel sides or a light emitting surface having two parallel sides. In this case, the hexagon is circumscribed. Of the rectangles having two parallel sides of the hexagon as part of the two sides of the rectangle and having the smallest area, the short side a of the light receiving surface or the short side c of the light emitting surface is circumscribed. The long side of the rectangle to be used is the long side b of the light receiving surface or the long side d of the light emitting surface.

また、図2(a)、図2(b)に示すように、発光部が複数の発光面を持つ場合には、複数の発光面に外接し、複数の発光面全てを内部に含む長方形のうち、面積が最小である長方形の短辺を短辺cとし、外接する長方形の長辺を長辺dとする。
ここで、発光部から放射された光を無駄なくフォトダイオードに入射させ、フォトダイオードの出力信号を大きくするためには、集光部は光をなるべく小さい範囲に集光する方が良い。しかし、発光部の発光面は有限の面積を持つため、集光部は、発光面の面積以下の範囲に収まるように集光することは困難である。そのため、発光部から放射され、集光部で集光された光がフォトダイオードの受光面と同一面内で入射する面(以下、光集光面と呼ぶ)の面積は、小さくても発光面と同等の面積となる。
In addition, as shown in FIGS. 2A and 2B, when the light emitting unit has a plurality of light emitting surfaces, a rectangular shape that circumscribes the plurality of light emitting surfaces and includes all of the plurality of light emitting surfaces inside. Among them, the short side of the rectangle having the smallest area is defined as the short side c, and the long side of the circumscribed rectangle is defined as the long side d.
Here, in order to make the light emitted from the light emitting part incident on the photodiode without waste and to increase the output signal of the photodiode, it is preferable that the light collecting part condenses the light in as small a range as possible. However, since the light emitting surface of the light emitting unit has a finite area, it is difficult for the light collecting unit to collect light so as to be within the range of the area of the light emitting surface. Therefore, even if the area of the surface (hereinafter referred to as the light condensing surface) where the light emitted from the light emitting unit and collected by the light condensing unit is incident on the same plane as the light receiving surface of the photodiode is small, the light emitting surface The area is equivalent to

しかしながら、発光部及びフォトダイオードをプリント基板等に実装する際に製造上少なくても20μm程度の位置ずれが生じてしまう。そのため、発光部又はフォトダイオードが実装ずれを起こしたとき、光集光面はフォトダイオードの受光面に対して、同一面内で上下左右に20μmずれてしまい、フォトダイオードの出力信号が減少してしまう。
ここで、受光面及び発光面の短辺及び長辺を表すa〜dを、a−c>40、b−d>40を満足するように設定した場合、発光部又はフォトダイオードに実装の位置ずれが起こった場合でも、光集光面は受光面内に含まれる。そのため、製造上のばらつきによるフォトダイオードの出力信号の個体差やロット差を小さくすることができる。したがって、ロバスト性が強く、より高精度にガス濃度を検知することができる光学式濃度測定装置を実現することができる。
However, when the light emitting unit and the photodiode are mounted on a printed circuit board or the like, a positional deviation of about 20 μm occurs at least in manufacturing. For this reason, when the light emitting part or the photodiode is displaced, the light converging surface is shifted 20 μm vertically and horizontally within the same plane with respect to the light receiving surface of the photodiode, and the output signal of the photodiode is reduced. End up.
Here, when a to d representing the short side and the long side of the light receiving surface and the light emitting surface are set so as to satisfy ac> 40 and bd> 40, the mounting positions of the light emitting unit or the photodiode are provided. Even when the deviation occurs, the light condensing surface is included in the light receiving surface. Therefore, individual differences and lot differences in the output signals of the photodiodes due to manufacturing variations can be reduced. Therefore, it is possible to realize an optical concentration measuring device that is robust and can detect the gas concentration with higher accuracy.

なお、製造上のばらつきによるフォトダイオードの出力信号の個体差やロット差をより小さくするという観点から、フォトダイオードの受光面の短辺a[μm]、受光面の長辺b[μm]、発光部の発光面の短辺c[μm]、発光面の長辺d[μm]は、a−c>80[μm]、且つ、b−d>80[μm]を満たすことがより好ましい。この場合、発光部とフォトダイオードが、光集光面が最も受光面からずれる方向に同時に実装の位置ずれを起こした場合でも、光集光面を受光面内に含むことができる。
また、フォトダイオードのコストの観点から、フォトダイオードの受光面の短辺a[μm]、受光面の長辺b[μm]、発光部の発光面の短辺c[μm]、発光面の長辺d[μm]は、a−c<500[μm]、且つ、b−d<500[μm]を満たすことが好ましい。
From the viewpoint of reducing individual differences and lot differences in the output signals of the photodiode due to manufacturing variations, the short side a [μm] of the light receiving surface of the photodiode, the long side b [μm] of the light receiving surface, and light emission More preferably, the short side c [μm] of the light emitting surface and the long side d [μm] of the light emitting surface satisfy a−c> 80 [μm] and b−d> 80 [μm]. In this case, the light condensing surface can be included in the light receiving surface even when the light emitting portion and the photodiode are simultaneously displaced in the direction in which the light condensing surface is most displaced from the light receiving surface.
From the viewpoint of the cost of the photodiode, the short side a [μm] of the light receiving surface of the photodiode, the long side b [μm] of the light receiving surface, the short side c [μm] of the light emitting surface of the light emitting unit, and the length of the light emitting surface The side d [μm] preferably satisfies a−c <500 [μm] and b−d <500 [μm].

また、フォトダイオードが表面入射型で複数の半導体積層部の直列又は並列接続からなる場合は、受光面の一部に光が入射し、複数の半導体積層部で光分布が生じることによって、入射する光が少ない半導体積層部が出力する光電流に律速されて、フォトダイオードの出力信号が下がってしまうことがある。本発明の一実施形態では、フォトダイオードとして、裏面入射型のフォトダイオードを用いる。そのため、同一の基板上に複数の半導体積層部が形成されてなるフォトダイオードにおいて、フォトダイオードの基板側から入射された光は、基板内で拡散し、その結果、複数の半導体積層部にある程度均一に光が入射させることができる。しかしながら、フォトダイオードの受光面と発光部の発光面の大きさに著しい差がある場合はやはりフォトダイオードの出力信号が下がってしまう。そのため、フォトダイオードの受光面の短辺a[μm]、受光面の長辺b[μm]、発光部の発光面の短辺c[μm]、発光面の長辺d[μm]は、a−c<500[μm]、且つ、b−d<500[μm]を満たすことが好ましい。また、フォトダイオードのコストの観点からもこれを満たすことが好ましい。   In addition, when the photodiode is a front-illuminated type and includes a series or parallel connection of a plurality of semiconductor stacked portions, light is incident on a part of the light receiving surface, and light is incident on the plurality of semiconductor stacked portions. The output signal of the photodiode may decrease due to the rate of the photocurrent output from the semiconductor stacked portion with less light. In one embodiment of the present invention, a back-illuminated photodiode is used as the photodiode. Therefore, in a photodiode in which a plurality of semiconductor stacked portions are formed on the same substrate, light incident from the substrate side of the photodiode is diffused in the substrate, and as a result, is uniform to some extent in the plurality of semiconductor stacked portions. The light can be incident on the. However, if there is a significant difference in the size of the light receiving surface of the photodiode and the light emitting surface of the light emitting portion, the output signal of the photodiode is also lowered. Therefore, the short side a [μm] of the light receiving surface of the photodiode, the long side b [μm] of the light receiving surface, the short side c [μm] of the light emitting surface of the light emitting unit, and the long side d [μm] of the light emitting surface are: It is preferable that −c <500 [μm] and bd <500 [μm] are satisfied. It is also preferable to satisfy this from the viewpoint of the cost of the photodiode.

以下、光学式濃度測定装置を構成する各構成要件について、具体例を挙げて説明する。
<集光部>
本発明の一実施形態に係る光学式濃度測定装置において、集光部は発光部から放射された光を、集光点がフォトダイオードの受光面と重なる位置となるように集光する。集光部は具体的には反射鏡を含む。
ここで集光点とは発光部と集光部との相対位置関係及び反射鏡の形状から一意に決まる位置である。
Hereinafter, each component constituting the optical density measuring device will be described with specific examples.
<Condensing part>
In the optical concentration measurement apparatus according to an embodiment of the present invention, the light collecting unit condenses the light emitted from the light emitting unit so that the light condensing point is positioned to overlap the light receiving surface of the photodiode. Specifically, the condensing unit includes a reflecting mirror.
Here, the condensing point is a position uniquely determined from the relative positional relationship between the light emitting unit and the condensing unit and the shape of the reflecting mirror.

また集光部は反射鏡を複数有していてもよい。これにより光路長の長い光学式濃度測定装置が実現され、ガス濃度検知の精度を向上させることができる。
反射鏡は、金属材料で形成されていてもよいし、樹脂製の基材で特定の形状を形成した後に、光を反射する部分にアルミニウム、金、銀を含む合金、又はこれらの積層体等が蒸着又はめっきされることで形成されてもよい。
集光点を持つ反射鏡の種類としては、球面鏡、楕円鏡、放物面鏡等が挙げられる。球面鏡又は放物面鏡を用いて光を平行光に変換する場合は、光路長を長くするために、二つの球面鏡又は放物面鏡の間にさらに平面鏡を含んでいてもよい。
Further, the light collecting unit may have a plurality of reflecting mirrors. Thereby, an optical concentration measuring device having a long optical path length is realized, and the accuracy of gas concentration detection can be improved.
The reflecting mirror may be formed of a metal material, and after forming a specific shape with a resin base material, an alloy containing aluminum, gold, silver in a portion that reflects light, or a laminate thereof, etc. May be formed by vapor deposition or plating.
Examples of the reflecting mirror having a condensing point include a spherical mirror, an elliptical mirror, and a parabolic mirror. When light is converted into parallel light using a spherical mirror or a parabolic mirror, a plane mirror may be further included between the two spherical mirrors or the parabolic mirror in order to increase the optical path length.

<発光部>
本発明の一実施形態に係る光学式濃度測定装置において、発光部は発光面を有する。発光部は、発光面から照射した光が、集光部により集光され、その集光点がフォトダイオードの受光面と重なる位置に設置される。
発光部は、測定対象ガスによって吸収される波長を含む光を出力するものであれば特に制限されない。具体的な例としては、MEMS(microelectromechanical systems)光源や発光ダイオードが挙げられる。その中でも、測定対象ガス以外の成分の光吸収によるノイズを低減する観点から、測定対象ガスの吸収が大きい波長帯の光のみを出力するものであることが好ましい。
<Light emitting part>
In the optical density measurement device according to an embodiment of the present invention, the light emitting unit has a light emitting surface. The light emitting unit is installed at a position where the light emitted from the light emitting surface is collected by the light collecting unit, and the light collecting point overlaps the light receiving surface of the photodiode.
A light emission part will not be restrict | limited especially if it outputs the light containing the wavelength absorbed by measurement object gas. Specific examples include a MEMS (microelectromechanical systems) light source and a light emitting diode. Among these, from the viewpoint of reducing noise due to light absorption of components other than the measurement target gas, it is preferable that only light in a wavelength band in which the measurement target gas absorption is large is output.

具体的には、発光波長帯をアクティブ層のバンドギャップでコントロールできるという観点から、発光部は、発光ダイオード構造が望ましい場合がある。発光ダイオードは半導体基板上に形成されていてもよく、また、発光強度を増強させるために配線により直列又は並列接続されていることも好ましい。さらに、発光ダイオードから放射され、半導体基板の裏面で反射した光が入射する位置に発光量を監視するためのセンサ部が設けられていてもよい。
また発光部は、第2半導体基板と、第2半導体基板の一方の面上に形成された第2半導体積層部と、を有し、第2半導体基板の他方の面の少なくとも一部が発光面である発光ダイオードであってもよい。
Specifically, from the viewpoint that the emission wavelength band can be controlled by the band gap of the active layer, the light emitting unit may have a light emitting diode structure in some cases. The light emitting diodes may be formed on a semiconductor substrate, and are preferably connected in series or in parallel by wiring in order to enhance the light emission intensity. Further, a sensor unit for monitoring the light emission amount may be provided at a position where light emitted from the light emitting diode and reflected by the back surface of the semiconductor substrate is incident.
The light emitting unit includes a second semiconductor substrate and a second semiconductor stacked unit formed on one surface of the second semiconductor substrate, and at least a part of the other surface of the second semiconductor substrate is a light emitting surface. It may be a light emitting diode.

また、発光部が発光ダイオードを含んで構成される場合には、図3に示すように、発光ダイオード1は、第2半導体積層部2とは電気的に絶縁された第3半導体積層部3をさらに有する。第3半導体積層部3の配置位置は、第2半導体積層部2が形成された第2半導体基板4の一方の面上であって、第2半導体積層部2から出力された光のうち、第2半導体基板4の他方の面で反射した光が入射する位置に設定されていることが好ましい。この場合、第3半導体積層部3から出力される光電流を、発光部からの光出力の劣化による経時変化や動作時の温度による出力変動の補償に用いることができる。第2半導体積層部2と第3半導体積層部3とは、第2半導体基板4の他方の面の少なくとも一部を除いて封止することによって封止部5により一体に封止される。第2半導体基板4の他方の面の封止部5により覆われていない部分が発光面1aとなる。なお、図3において、(a)は発光ダイオード1の底面図、(b)は発光ダイオード1の断面図である。   When the light emitting unit includes a light emitting diode, as shown in FIG. 3, the light emitting diode 1 includes a third semiconductor stacked unit 3 that is electrically insulated from the second semiconductor stacked unit 2. Also have. The arrangement position of the third semiconductor stacked unit 3 is on one surface of the second semiconductor substrate 4 on which the second semiconductor stacked unit 2 is formed, and among the light output from the second semiconductor stacked unit 2, (2) It is preferably set at a position where light reflected by the other surface of the semiconductor substrate 4 enters. In this case, the photocurrent output from the third semiconductor stacked unit 3 can be used to compensate for changes with time due to deterioration of the optical output from the light emitting unit and output fluctuation due to temperature during operation. The second semiconductor stacked unit 2 and the third semiconductor stacked unit 3 are sealed together by the sealing unit 5 by sealing at least a part of the other surface of the second semiconductor substrate 4. The portion not covered with the sealing portion 5 on the other surface of the second semiconductor substrate 4 becomes the light emitting surface 1a. 3A is a bottom view of the light-emitting diode 1, and FIG. 3B is a cross-sectional view of the light-emitting diode 1. FIG.

発光部は、測定対象ガスに併せて所望の光学特性を有する光学フィルタをさらに備えていてもよい。例えば、測定対象ガスが炭酸ガスの場合、発光部には炭酸ガスによる赤外線吸収が多く生じる波長帯(代表的には4.3μm付近)の赤外線を濾波できるバンドパスフィルタを搭載する形態が例示される。   The light emitting unit may further include an optical filter having desired optical characteristics in combination with the measurement target gas. For example, when the measurement target gas is carbon dioxide, a configuration in which a band pass filter capable of filtering infrared light in a wavelength band (typically around 4.3 μm) in which infrared absorption by carbon dioxide gas is large is exemplified in the light emitting part. The

<発光面>
本発明の一実施形態に係る光学式濃度測定装置において、発光面は発光部の光出射面である。
発光部が発光ダイオードで形成され、発光ダイオードが基板上に半導体積層部が形成された構成を有し、基板側から光を出射する裏面出射型の場合、発光面は光が出射される基板露出面のことを指す。ここで基板露出面の表面には反射防止膜や光学フィルタが形成されていてもよい。発光ダイオードが基板上に形成した半導体積層部側から光を出射する表面出射型の場合、発光面は光を出射するアクティブ層のことを指す。
また、発光部がMEMSヒーターを含んで構成される場合、発光面は加熱されることで光を放射する部材のことを指す。
<Light emitting surface>
In the optical concentration measurement apparatus according to the embodiment of the present invention, the light emitting surface is a light emitting surface of the light emitting unit.
In the case of the back emission type in which the light emitting part is formed of a light emitting diode, the light emitting diode is formed on the substrate and the semiconductor laminated part is formed, and the light is emitted from the substrate side, the light emitting surface is exposed to the substrate from which the light is emitted. Refers to the surface. Here, an antireflection film or an optical filter may be formed on the surface of the substrate exposed surface. In the case of the surface emission type in which the light emitting diode emits light from the side of the semiconductor stacked portion formed on the substrate, the light emitting surface indicates an active layer that emits light.
Moreover, when a light emission part is comprised including a MEMS heater, the light emission surface points out the member which radiates | emits light by being heated.

<フォトダイオード>
本発明の一実施形態に係る光学式濃度測定装置において、フォトダイオードの受光面が集光部の集光点と重なる位置に設置される。
フォトダイオードは、第1半導体基板と、第1半導体基板の一方の面上に形成された一又は複数の第1半導体積層部と、を有し、第1半導体基板の他方の面の少なくとも一部が受光面を形成している。
フォトダイオードは測定対象ガスによって吸収される波長を含む光の帯域に感度を有する。フォトダイオードの形状は十分なS/N比が得られるものであれば特に制限されない。
<Photodiode>
In the optical density measuring device according to the embodiment of the present invention, the light receiving surface of the photodiode is installed at a position where it overlaps with the condensing point of the condensing unit.
The photodiode includes a first semiconductor substrate and one or more first semiconductor stacked portions formed on one surface of the first semiconductor substrate, and at least a part of the other surface of the first semiconductor substrate. Forms a light receiving surface.
The photodiode has sensitivity in a light band including a wavelength absorbed by the measurement target gas. The shape of the photodiode is not particularly limited as long as a sufficient S / N ratio can be obtained.

半導体積層部は半導体基板上に形成されている。半導体積層部は、複数個直列接続されていてもよいし、複数個並列接続されていてもよい。フォトダイオードは半導体基板側から光を入射する裏面入射型であるため、受光面の一部に光が入射した場合でも、光は半導体基板内で拡散し、複数の半導体積層部にある程度均一に光が入射する。
フォトダイオードに含まれる半導体基板の裏面の二乗平均平方根粗さは30nm以上である(以下、「粗面化されている」と表記する)ことがより好ましい。この場合には、粗面化されていない場合に比べて複数の半導体積層部に、より均一に光が入射する。なお、二乗平均平方根粗さ(Rq)は、例えば、接触式段差計や原子間力顕微鏡(AFM)等を用い、対応する面に対して、数μmから数mmの範囲のラインスキャン、或いは2次元スキャンを行って測定された高さから算出される。
The semiconductor stacked portion is formed on a semiconductor substrate. A plurality of semiconductor stacked portions may be connected in series, or a plurality of semiconductor stacked portions may be connected in parallel. Since the photodiode is a back-illuminated type in which light is incident from the semiconductor substrate side, even when light is incident on a part of the light receiving surface, the light diffuses in the semiconductor substrate and is uniformly distributed to a plurality of semiconductor stacked portions. Is incident.
More preferably, the root mean square roughness of the back surface of the semiconductor substrate included in the photodiode is 30 nm or more (hereinafter referred to as “roughened”). In this case, light is incident more uniformly on the plurality of semiconductor stacked portions than in the case where the surface is not roughened. Note that the root mean square roughness (Rq) is, for example, a line scan in the range of several μm to several mm with respect to the corresponding surface using a contact step meter, an atomic force microscope (AFM), or the like. It is calculated from the height measured by performing a dimension scan.

フォトダイオードは、測定対象ガスに併せて所望の光学特性を有する光学フィルタをさらに備えていてもよい。例えば、測定対象ガスが炭酸ガスの場合、フォトダイオードには炭酸ガスによる赤外線吸収が多く生じる波長帯(代表的には4.3μm付近)の赤外線を濾波できるバンドパスフィルタを搭載する形態が例示される。
また、フォトダイオードは受光面となる半導体基板裏面の少なくとも一部を露出した状態で半導体積層部を封止する封止部をさらに備えていてもよい。封止部の材料としては、例えば、樹脂モールド材料等を用いることができる。
The photodiode may further include an optical filter having desired optical characteristics in combination with the measurement target gas. For example, when the measurement target gas is carbon dioxide, the photodiode is exemplified by a band-pass filter that can filter infrared light in a wavelength band (typically around 4.3 μm) in which infrared absorption by carbon dioxide occurs a lot. The
The photodiode may further include a sealing portion that seals the semiconductor stacked portion in a state where at least a part of the back surface of the semiconductor substrate serving as the light receiving surface is exposed. As a material for the sealing portion, for example, a resin mold material or the like can be used.

図4は、フォトダイオードの一例を示す概略構成図である。フォトダイオード10は、第1半導体基板11と、第1半導体基板11の一方の面上に形成された一又は複数の第1半導体積層部12と、を有する。第1半導体基板11の他方の面の少なくとも一部を除いて、第1半導体基板11と第1半導体積層部12とは封止部13によって一体に封止され、第1半導体基板11の他方の面の、封止されていない領域が受光面10aを形成している。なお、図4は、一つの第1半導体積層部12を備える場合を示す。図4において(a)はフォトダイオード10の底面図、(b)はフォトダイオード10の断面図を示す。   FIG. 4 is a schematic configuration diagram illustrating an example of a photodiode. The photodiode 10 includes a first semiconductor substrate 11 and one or a plurality of first semiconductor stacked portions 12 formed on one surface of the first semiconductor substrate 11. Except for at least a part of the other surface of the first semiconductor substrate 11, the first semiconductor substrate 11 and the first semiconductor stacked portion 12 are integrally sealed by the sealing portion 13, and the other side of the first semiconductor substrate 11 is sealed. An unsealed region of the surface forms the light receiving surface 10a. FIG. 4 shows a case where one first semiconductor stacked unit 12 is provided. 4A is a bottom view of the photodiode 10, and FIG. 4B is a cross-sectional view of the photodiode 10.

<受光面>
本発明の一実施形態に係る光学式濃度測定装置において、受光面は半導体基板が露出した、フォトダイオードの光入射面である。受光面は前述のように粗面化されていてもよい。粗面化させる手法としては、研削やエッチングによるパターン形成などが挙げられる。また、受光面の表面には、反射防止膜や光学フィルタが直接形成されていてもよい。フォトダイオードに前述のバンドパスフィルタが搭載されている場合であっても、受光面は光が入射できる半導体基板裏面の露出部を指す。
<Light receiving surface>
In the optical concentration measurement apparatus according to an embodiment of the present invention, the light receiving surface is a light incident surface of a photodiode with the semiconductor substrate exposed. The light receiving surface may be roughened as described above. Examples of the roughening method include pattern formation by grinding and etching. Further, an antireflection film or an optical filter may be directly formed on the surface of the light receiving surface. Even in the case where the above-described bandpass filter is mounted on the photodiode, the light receiving surface indicates an exposed portion on the back surface of the semiconductor substrate where light can enter.

<筐体>
本発明の一実施形態に係る光学式濃度測定装置は、発光部及びフォトダイオードが実装された基板と集光部とを含む受発光装置を収納する筐体をさらに備えていてもよい。基板及び/又は集光部は、筐体に、樹脂製の接着剤で固定されている。本発明によれば、樹脂製の接着剤が外部環境因によって伸長収縮を起こし、集光部の位置ずれが発生した場合にも、ロバスト性が強く、高精度にガス濃度を検知することができる。これによって安価な樹脂製の接着剤を用いることが可能となる。
<Case>
The optical concentration measurement apparatus according to an embodiment of the present invention may further include a housing that houses a light receiving and emitting device including a substrate on which a light emitting unit and a photodiode are mounted and a light collecting unit. The board | substrate and / or the condensing part are being fixed to the housing | casing with the resin-made adhesives. According to the present invention, even when the resin adhesive expands and contracts due to an external environmental factor and the light collector is displaced, the robustness is strong and the gas concentration can be detected with high accuracy. . This makes it possible to use an inexpensive resin adhesive.

<具体例>
次に、本発明の一実施形態に係る受発光装置20の一例を、図5を参照して説明する。なお、図5は模式的なものであり、各層の厚さは現実のものとは異なり、各層の厚さの比率も現実のものとは異なる場合がある。具体的な厚さと寸法は、本発明の一実施形態の説明を参酌して判断すべきものである。
図5は、本発明の一実施形態に係る受発光装置20の一例を示す断面図である。
本発明の一実施形態に係る受発光装置20は、発光面21aを有し、赤外光を含む光を放射する発光部21と、受光面22aを有し、発光部21から放射された光の少なくとも一部を受光するフォトダイオード22と、集光部23とを備える。
<Specific example>
Next, an example of the light emitting / receiving device 20 according to an embodiment of the present invention will be described with reference to FIG. FIG. 5 is schematic, and the thickness of each layer is different from the actual one, and the ratio of the thickness of each layer may be different from the actual one. Specific thicknesses and dimensions should be determined in consideration of the description of one embodiment of the present invention.
FIG. 5 is a cross-sectional view showing an example of the light emitting / receiving device 20 according to an embodiment of the present invention.
The light emitting / receiving device 20 according to the embodiment of the present invention has a light emitting surface 21a, a light emitting unit 21 that emits light including infrared light, and a light receiving surface 22a, and light emitted from the light emitting unit 21. Are provided with a photodiode 22 that receives at least a part thereof, and a light collecting unit 23.

そして、発光部21及びフォトダイオード22と、集光部23との間に測定対象ガスを導入し、このときのフォトダイオード22の出力信号に基づき、演算装置からなる図示しない濃度演算部により測定対象ガスの濃度を演算するようになっている。
発光部21とフォトダイオード22と集光部23とは、発光部21の発光面21aから放射された光を、集光部23がフォトダイオード22の受光面22aに集光する位置に配置される。
発光部21とフォトダイオード22とは同一基板24上に配置されている。基板24は、ベース基板としても機能する回路基板であり、たとえばプリント基板を用いることができる。なお、発光部21とフォトダイオード22は同じ基板24上に実装されている場合に限るものではなく、別々の基板に実装されていてもよい。
Then, a measurement target gas is introduced between the light emitting unit 21 and the photodiode 22 and the light collecting unit 23, and based on the output signal of the photodiode 22 at this time, a concentration calculation unit (not shown) composed of a calculation device is used to measure the measurement target. The gas concentration is calculated.
The light emitting unit 21, the photodiode 22, and the light collecting unit 23 are arranged at a position where the light collecting unit 23 collects the light emitted from the light emitting surface 21 a of the light emitting unit 21 on the light receiving surface 22 a of the photodiode 22. .
The light emitting unit 21 and the photodiode 22 are disposed on the same substrate 24. The board 24 is a circuit board that also functions as a base board, and for example, a printed board can be used. The light emitting unit 21 and the photodiode 22 are not limited to being mounted on the same substrate 24, and may be mounted on different substrates.

ここで、発光部21とフォトダイオード22とは、受光面22aの短辺a[μm]、受光面22aの長辺b[μm]、発光面21aの短辺c[μm]及び発光面21aの長辺d[μm]が、a−c>40、且つ、b−d>40を満たしている。
そのため、発光部21とフォトダイオード22の実装の位置ずれが生じた場合であっても、集光部23が集光した光のほとんどをフォトダイオード22の受光面で受けることができる。特に、a−c>80、且つ、b−d>80を満たすように配置することにより、発光部21とフォトダイオード22の実装の位置ずれが最も大きくなるときでも、集光部23が集光した光をフォトダイオード22の受光面で受けることができる。また、フォトダイオード22のコストの観点から、a−c<500、且つ、b−d<500を満たすように配置すると効果的である。
Here, the light emitting unit 21 and the photodiode 22 are composed of a short side a [μm] of the light receiving surface 22a, a long side b [μm] of the light receiving surface 22a, a short side c [μm] of the light emitting surface 21a, and the light emitting surface 21a. The long side d [μm] satisfies a−c> 40 and b−d> 40.
For this reason, even when a positional deviation occurs between the light emitting unit 21 and the photodiode 22, most of the light collected by the light collecting unit 23 can be received by the light receiving surface of the photodiode 22. In particular, by arranging so as to satisfy a−c> 80 and b−d> 80, the light condensing unit 23 collects light even when the positional deviation between the mounting of the light emitting unit 21 and the photodiode 22 becomes the largest. The received light can be received by the light receiving surface of the photodiode 22. From the viewpoint of the cost of the photodiode 22, it is effective to arrange so that a−c <500 and b−d <500.

また、フォトダイオード22として、裏面入射型のフォトダイオードを用いている。そのため、フォトダイオード22の入射された光はフォトダイオード22に含まれる基板内で拡散するため、フォトダイオード22が複数の半導体積層部を備えている場合であっても、複数の半導体積層部にある程度均一に光が入射する。その結果、フォトダイオード22の出力信号を減少させることなく、受光面を発光面より大きくすることができる。また、受光面22aを粗面化しているため、粗面化していない場合に比較して、光を基板内でより拡散させることができる。   Further, as the photodiode 22, a back-illuminated photodiode is used. Therefore, since the light incident on the photodiode 22 is diffused in the substrate included in the photodiode 22, even if the photodiode 22 includes a plurality of semiconductor stacked portions, the light is incident on the plurality of semiconductor stacked portions to some extent. Light enters uniformly. As a result, the light receiving surface can be made larger than the light emitting surface without reducing the output signal of the photodiode 22. Further, since the light receiving surface 22a is roughened, the light can be diffused more in the substrate than when the light receiving surface 22a is not roughened.

図6は、本発明の一実施形態に係る光学式濃度測定装置40の一例を示す概略構成図である。
光学式濃度測定装置40は、受発光装置20aと、受発光装置20aを収容する筐体30と、を備える。
受発光装置20aは、図6に示すように、発光部21及びフォトダイオード22が実装された基板24と、集光部23と、発光部21及びフォトダイオード22用の集光部25と、を備える。集光部25は、発光部21から入射した光を集光する集光部25aと集光部23で反射された光を集光する集光部25bとを備える。集光部25を備えることによって、光学式濃度測定装置40では、発光部21から放射されたより多くの光を集光部23に入射し、集光部23で反射されたより多くの光をフォトダイオード22に入射するようになっている。
FIG. 6 is a schematic configuration diagram showing an example of the optical density measuring device 40 according to an embodiment of the present invention.
The optical concentration measuring device 40 includes a light emitting / receiving device 20a and a housing 30 that houses the light emitting / receiving device 20a.
As shown in FIG. 6, the light receiving and emitting device 20 a includes a substrate 24 on which the light emitting unit 21 and the photodiode 22 are mounted, a light collecting unit 23, and a light collecting unit 25 for the light emitting unit 21 and the photodiode 22. Prepare. The light collecting unit 25 includes a light collecting unit 25 a that collects the light incident from the light emitting unit 21 and a light collecting unit 25 b that collects the light reflected by the light collecting unit 23. By providing the light collecting unit 25, the optical concentration measuring device 40 makes more light emitted from the light emitting unit 21 incident on the light collecting unit 23, and more light reflected by the light collecting unit 23 is received by the photodiode. 22 is incident.

そして、筐体30に設けられた図示しないガス導入口から測定対象ガスを筐体30内に導入し、発光部21及びフォトダイオード22と集光部23との間を通過させて図示しないガス排出口から測定対象ガスを筐体30外に排出させ、このときのフォトダイオード22の出力信号に基づき、濃度演算部(図示せず)により測定対象ガスの濃度を演算する。
受発光装置20aは、例えば、基板24を筐体30の底面に樹脂製の接着剤で固定し、集光部23及び25を、筐体30の上面及び側面に樹脂製の接着剤で固定することで、筐体30に固定される。
Then, a measurement target gas is introduced into the housing 30 from a gas inlet (not shown) provided in the housing 30 and is passed between the light emitting unit 21, the photodiode 22, and the light collecting unit 23 to exhaust a gas (not shown). The measurement target gas is discharged out of the housing 30 from the outlet, and the concentration of the measurement target gas is calculated by a concentration calculation unit (not shown) based on the output signal of the photodiode 22 at this time.
In the light emitting / receiving device 20a, for example, the substrate 24 is fixed to the bottom surface of the housing 30 with a resin adhesive, and the light collecting portions 23 and 25 are fixed to the top surface and side surfaces of the housing 30 with a resin adhesive. As a result, it is fixed to the housing 30.

ここで、このように、樹脂製の接着剤を用いて、受発光装置20aを筐体30に固定した場合、接着剤が外部環境因によって伸長収縮を起こすと、集光部23が発光部21及びフォトダイオード22に対して位置ずれしてしまう可能性がある。このように位置ずれが生じた場合、測定対象ガスのガス濃度が変化していないにもかかわらず、フォトダイオード22の出力信号が変化してしまい、十分な精度でガス濃度が検知できない場合がある。
本発明の一実施形態では、集光部23が集光した光のほとんどをフォトダイオード22の受光面22aで受けることができるため、接着剤の影響による、フォトダイオード22の出力信号の変化を抑制することができる。
Here, when the light emitting / receiving device 20a is fixed to the housing 30 using the resin adhesive, the light condensing unit 23 is caused to emit the light 21 when the adhesive expands and contracts due to external environmental factors. In addition, there is a possibility that the position of the photodiode 22 is displaced. When the positional deviation occurs in this way, the output signal of the photodiode 22 may change even though the gas concentration of the measurement target gas has not changed, and the gas concentration may not be detected with sufficient accuracy. .
In one embodiment of the present invention, most of the light collected by the light condensing unit 23 can be received by the light receiving surface 22a of the photodiode 22, so that a change in the output signal of the photodiode 22 due to the influence of the adhesive is suppressed. can do.

なお、上記実施形態は、本発明の技術的思想を具体化するための装置や方法を例示するものであって、本発明の技術的思想は、構成部品の材質、形状、構造、配置等を特定するものでない。本発明の技術的思想は、特許請求の範囲に記載された請求項が規定する技術的範囲内において、種々の変更を加えることができる。   The above embodiment exemplifies an apparatus and a method for embodying the technical idea of the present invention, and the technical idea of the present invention includes the material, shape, structure, arrangement, etc. of the component parts. Not specific. The technical idea of the present invention can be variously modified within the technical scope defined by the claims described in the claims.

1 発光ダイオード
1a 発光面
2、3 半導体積層部
4 半導体基板
5 封止部
10 フォトダイオード
10a 受光面
11 半導体基板
12 半導体積層部
13 封止部
20、20a 受発光装置
21 発光部
21a 発光面
22 フォトダイオード
22a 受光面
23 集光部
24 基板
40 光学式濃度測定装置
DESCRIPTION OF SYMBOLS 1 Light emitting diode 1a Light emitting surface 2, 3 Semiconductor laminated part 4 Semiconductor substrate 5 Sealing part 10 Photodiode 10a Light receiving surface 11 Semiconductor substrate 12 Semiconductor laminated part 13 Sealing part 20, 20a Light receiving / emitting device 21 Light emitting part 21a Light emitting surface 22 Photo Diode 22a Light-receiving surface 23 Condensing part 24 Substrate 40 Optical density measuring device

Claims (12)

発光面を有し、赤外光を含む光を放射する発光部と、
前記発光面から放射された光を集光する集光部と、
受光面を有し、当該受光面が前記集光部による集光点に配置されたフォトダイオードと、
を備え、
前記フォトダイオードは、第1半導体基板と、当該第1半導体基板の一方の面に形成された第1半導体積層部と、を有し、前記第1半導体基板の他方の面の少なくとも一部が前記受光面であり、
前記受光面の短辺a[μm]及び長辺b[μm]と、前記発光面の短辺c[μm]及び長辺d[μm]とは、a−c>40、且つ、b−d>40を満たす受発光装置。
A light emitting unit having a light emitting surface and emitting light including infrared light;
A light collecting section for collecting light emitted from the light emitting surface;
A photodiode having a light receiving surface, the light receiving surface being disposed at a light collecting point by the light collecting unit;
With
The photodiode includes a first semiconductor substrate and a first semiconductor stacked portion formed on one surface of the first semiconductor substrate, and at least a part of the other surface of the first semiconductor substrate is the first semiconductor substrate. A light receiving surface,
The short side a [μm] and the long side b [μm] of the light receiving surface, and the short side c [μm] and the long side d [μm] of the light emitting surface are ac> 40 and bd Light emitting / receiving device satisfying> 40.
前記受光面の短辺a[μm]及び長辺b[μm]と、前記発光面の短辺c[μm]及び長辺d[μm]とは、a−c>80、且つ、b−d>80を満たす請求項1に記載の受発光装置。   The short side a [μm] and the long side b [μm] of the light receiving surface, and the short side c [μm] and the long side d [μm] of the light emitting surface are a c> 80 and b d The light emitting / receiving device according to claim 1, satisfying> 80. 前記受光面の短辺a[μm]及び長辺b[μm]と、前記発光面の短辺c[μm]及び長辺d[μm]とは、a−c<500、且つ、b−d<500を満たす請求項1又は請求項2に記載の受発光装置。   The short side a [μm] and the long side b [μm] of the light receiving surface, and the short side c [μm] and the long side d [μm] of the light emitting surface are ac <500 and bd The light emitting and receiving device according to claim 1 or 2, wherein <500 is satisfied. 前記集光部は、複数の反射鏡を有し、前記発光部から放射された赤外光を含む光が複数の前記反射鏡で反射される請求項1から請求項3のいずれか一項に記載の受発光装置。   The said condensing part has a some reflective mirror, The light containing the infrared light radiated | emitted from the said light emission part is reflected in the said some reflective mirror. The light emitting / receiving device described. 前記第1半導体基板の他方の面の二乗平均平方根粗さは30nm以上である請求項1から請求項4のいずれか一項に記載の受発光装置。   5. The light receiving and emitting device according to claim 1, wherein the root mean square roughness of the other surface of the first semiconductor substrate is 30 nm or more. 前記フォトダイオードは、複数の前記第1半導体積層部が互いに直列に接続されている請求項1から請求項5のいずれか一項に記載の受発光装置。   6. The light emitting / receiving device according to claim 1, wherein the photodiode includes a plurality of first semiconductor stacked portions connected in series with each other. 7. 前記フォトダイオードは、複数の前記第1半導体積層部が互いに並列に接続されている請求項1から請求項5のいずれか一項に記載の受発光装置。   6. The light receiving and emitting device according to claim 1, wherein the photodiode includes a plurality of first semiconductor stacked portions connected in parallel to each other. 前記フォトダイオードは、第1半導体基板の他方の面の少なくとも一部を露出した状態で前記第1半導体基板と前記第1半導体積層部とを封止する封止部をさらに有する請求項1から請求項7のいずれか一項に記載の受発光装置。   The said photodiode further has the sealing part which seals the said 1st semiconductor substrate and the said 1st semiconductor laminated part in the state which exposed at least one part of the other surface of the 1st semiconductor substrate. Item 8. The light emitting and receiving device according to any one of Items 7. 前記発光部は、第2半導体基板と、当該第2半導体基板の一方の面に形成された第2半導体積層部と、を有する発光ダイオードを含み、
前記第2半導体基板の他方の面の少なくとも一部が前記発光面を形成している請求項1から請求項8のいずれか一項に記載の受発光装置。
The light emitting unit includes a light emitting diode having a second semiconductor substrate and a second semiconductor stacked unit formed on one surface of the second semiconductor substrate,
The light emitting / receiving device according to any one of claims 1 to 8, wherein at least a part of the other surface of the second semiconductor substrate forms the light emitting surface.
前記発光ダイオードは、前記第2半導体積層部とは電気的に絶縁された第3半導体積層部を有し、
当該第3半導体積層部は、前記第2半導体基板の前記一方の面であり、前記第2半導体積層部から出力された光のうち前記第2半導体基板の前記他方の面で反射した光が入射する位置に配置されている請求項9に記載の受発光装置。
The light emitting diode has a third semiconductor stacked portion that is electrically insulated from the second semiconductor stacked portion,
The third semiconductor stacked unit is the one surface of the second semiconductor substrate, and light reflected from the other surface of the second semiconductor substrate is incident on the light output from the second semiconductor stacked unit. The light emitting / receiving device according to claim 9, wherein the light emitting and receiving device is disposed at a position where
前記集光部を保持する筐体をさらに備え、
前記集光部は、樹脂製の接着剤で前記筐体に固定されている請求項1から請求項10のいずれか一項に記載の受発光装置。
A housing for holding the light collecting unit;
The light receiving and emitting device according to any one of claims 1 to 10, wherein the light collecting unit is fixed to the housing with a resin adhesive.
請求項1から請求項11のいずれか一項に記載の受発光装置と、
前記受発光装置前記フォトダイオードからの信号が入力され、前記発光部から前記フォトダイオードまでの光路中の物質の濃度を測定する濃度演算部と、を備える光学式濃度測定装置。
The light emitting and receiving device according to any one of claims 1 to 11,
An optical concentration measuring apparatus comprising: a light receiving / emitting device; and a concentration calculating unit that receives a signal from the photodiode and measures a concentration of a substance in an optical path from the light emitting unit to the photodiode.
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