JP2019169533A - Cooler and electric apparatus comprising the same - Google Patents

Abstract

An object of the present invention is to provide a cooling device capable of sufficiently cooling each of a plurality of cooled portions to be cooled with a refrigerant. A coolant passage (5) is provided between the support surface (10) and a surface portion (21) spaced apart from a support surface (10). And a second flow path 4 communicating with the refrigerant outlet 2 and a first flow path 3 communicating with the refrigerant inlet 1 and a second flow path 4 communicating with the refrigerant outlet 2. And a wall portion 23 extending so as to continuously connect each of the cooled portions 12. The flow channel forming member 20 includes: A plurality of recesses 24 are formed to cool. [Selection diagram] FIG.

Description

  The present invention relates to a cooling device and an electric apparatus including the same.

  Electrical devices such as electronic devices and high power devices include electronic components such as semiconductor chips and electrodes. The electronic component generates heat due to the current flow to the electronic component. Therefore, it is preferable that the electronic component is sufficiently cooled from the viewpoint of improving the stability and durability of the electronic component. In particular, the heat generation density of the electronic component tends to increase due to an increase in the current passed through the electronic component. Therefore, it is preferable to sufficiently cool the electronic component with a cooling device having sufficient cooling performance.

  As a technique related to cooling of electrical equipment, a technique described in Patent Document 1 is known. Patent Document 1 describes a cooling device for cooling a heating element (semiconductor) (see particularly paragraph 0015). In this cooling device, the heating element is cooled for a heating element in which a portion where the heat generation density gradually decreases toward the periphery centering on a portion having a large heat generation density (a large amount of heat generation). (See especially paragraph 0017, FIG. 8). Specifically, a plurality of flow paths for reciprocating the refrigerant are formed below the heat generating elements, and the heat generating elements are cooled by reciprocating the refrigerant through the respective flow paths (in particular, paragraphs 0015, 0016, (See FIG. 1).

JP 2008-300447 A

  In the technique described in Patent Document 1, as described above, the heating element having the heat generation density at the center is cooled. However, depending on the type of heating element, there may be a plurality of portions having a large heat generation density. In this case, the technique disclosed in Patent Document 1 in which the heating element having only one portion having a large heat generation density is to be cooled can cope with the problem that the flow path is significantly complicated and the pressure loss is significantly increased. difficult.

  The present invention has been made in view of the above problems, and at least one embodiment of the present invention provides a cooling device capable of sufficiently cooling each of a plurality of cooled parts to be cooled with a refrigerant and an electric device including the same. The purpose is to provide equipment.

  (1) A cooling device according to an embodiment of the present invention is a cooling device for cooling a plurality of parts to be cooled on a support surface with a refrigerant, and is a surface portion that is disposed apart from the support surface. A surface portion for forming a refrigerant flow path for allowing the refrigerant flowing from the refrigerant inlet to flow toward the refrigerant outlet between the support surface, a first flow path communicating with the refrigerant inlet, The flow path includes a wall section that divides the refrigerant flow path into two flow paths, a second flow path that communicates with the refrigerant outlet, and extends so as to continuously connect each of the plurality of cooled portions. A path forming member is provided, and the wall portion is formed with a plurality of recesses formed so as to cool each of the plurality of cooled portions by the refrigerant passing therethrough.

  According to the configuration of (1) above, since the refrigerant flows in the recess where the flow path cross-sectional area becomes narrow, the refrigerant speed in the recess can be increased. Thereby, each to-be-cooled site | part can fully be cooled. Further, since the refrigerant flow toward the recess having a narrow channel cross-sectional area is generated, the temperature boundary layer in the cooled portion can be thinned, and each cooled portion can be sufficiently cooled by the leading edge effect. Furthermore, since the wall portion is formed so as to continuously connect each of the parts to be cooled, the refrigerant that has passed through the recess in the wall portion is prevented from flowing into another recess again. Thereby, the increase in pressure loss can be suppressed and each cooled part can be cooled with little energy.

  (2) In some embodiments, in the configuration of the above (1), the lower end portion of the wall portion faces the portion to be cooled.

  According to the configuration of (2) above, since the flow velocity is the fastest inside the recess, the portion to be cooled is arranged at the portion where the flow velocity is the fastest, and thus the portion to be cooled can be cooled more sufficiently.

  (3) In some embodiments, in the configuration of (2), the wall portion facing the cooled portion has an inclination toward the cooled portion toward the flow direction of the refrigerant. And

  According to the configuration of (3) above, it is possible to form a jet flow toward the cooled portion along the inclined wall portion, and even if the heat generation density of the cooled portion is large, the cooled portion can be sufficiently cooled. .

  (4) In some embodiments, in the configuration of the above (1), the cooling target portion is located between the flow direction center portion and the downstream end of the wall portion in the dent at the refrigerant flow upstream end, The refrigerant flow downstream end is disposed so as to be located further downstream than the downstream end in the flow direction of the wall portion in the recess.

  According to the configuration of (4) above, even when the refrigerant is subcooled and boiled due to the heat of the part to be cooled, the generated bubble can easily flow into the second flow path on the downstream side of the dent. Thereby, inadequate cooling inside the dent resulting from the presence of bubbles can be suppressed, and the part to be cooled can be sufficiently cooled.

  (5) In some embodiments, in the configuration of the above (1), the wall portion is formed on the downstream side of the coolant flow in the cooled portion, and the first wall portion erected from the surface portion; And a second wall portion that is formed on the coolant flow upstream side of the portion to be cooled and is erected from the support surface.

  According to the configuration of (5) above, the refrigerant flows through the vertical flow path formed between the first wall portion and the second wall portion, so that a jet directed toward the cooled portion can be formed, and the cooled portion Even if the heat generation density is large, the portion to be cooled can be sufficiently cooled.

  (6) In some embodiments, in any one of the above configurations (1) to (5), the channel cross-sectional area in the first channel and the channel cross-sectional area in the second channel are Both are characterized by being larger than the cross-sectional area of the channel of the recess.

  According to the configuration of (6) above, the existence of a locally narrowed portion in each of the first flow path and the second flow path is suppressed, and the refrigerant is allowed to flow uniformly from the first flow path to each recess. Easy to do. Thereby, each to-be-cooled part can be cooled uniformly. In addition, it is possible to easily flow the refrigerant from each recess to the second flow path. Thereby, the refrigerant | coolant speed in a dent inside can be made quick, and a to-be-cooled site | part can fully be cooled.

  (7) In some embodiments, in any one of the configurations (1) to (6), fins are arranged in the cooled portion.

  According to the configuration of (7), for example, when a refrigerant having a small critical heat flux such as Freon is used, the heat transfer area can be increased by the fins to suppress boiling. Thereby, generation | occurrence | production of a bubble can be suppressed and the inadequate cooling resulting from presence of a bubble can be suppressed. As a result, the part to be cooled can be cooled more sufficiently. In addition, since the heat transfer area is large, the above-described boiling can be suppressed and the portion to be cooled can be sufficiently cooled even when the refrigerant speed is slowed from the viewpoint of suppressing pressure loss and erosion.

  (8) In some embodiments, in any one of the configurations (1) to (7), the refrigerant inlet faces a second cooled portion different from the plurality of cooled portions. The surface portion is formed.

  According to the configuration of (8) above, since the refrigerant is introduced into the first flow path through the refrigerant inlet formed in the surface portion, it is possible to generate a jet of refrigerant to the second cooled part facing the refrigerant inlet. it can. As a result, when there is a second cooled portion having a heat flux different from the heat flux of the cooled portion (a calorific value per unit area unit time), the second covered portion is caused without causing excessive pressure loss. The cooling part can be cooled independently.

  (9) In some embodiments, in any one of the configurations (1) to (8), an insulating film is formed on the support surface facing the refrigerant flow path. .

  According to the configuration of (9) above, since the insulating film functions as a heat spreader that performs heat transfer, the heat transfer area to the refrigerant can be increased. Thereby, the heat dissipation rate can be increased.

  (10) An electrical device according to an embodiment of the present invention includes the substrate having the support surface and the cooling device according to any one of (1) to (9).

  According to the configuration of (10) above, the part to be cooled on the support surface included in the substrate can be cooled by the cooling device. Thereby, an electric equipment can be drive | operated stably.

  According to at least one embodiment of the present invention, it is possible to provide a cooling device capable of sufficiently cooling each of a plurality of cooled parts to be cooled by a refrigerant, and an electric device including the same.

It is an external appearance perspective view of the cooling device concerning one embodiment of the present invention. It is a disassembled perspective view of the cooling device which concerns on one Embodiment of this invention. It is AA sectional view taken on the line of FIG. 2, and is a sectional view when a wall part is cut | disconnected so that a dent may be included and the downward view is seen. FIG. 3 is a sectional view taken along line B-B in FIG. 2. It is sectional drawing of the dent vicinity formed in the wall part of the cooling device which concerns on two embodiment of this invention. It is sectional drawing of the dent vicinity formed in the wall part of the cooling device which concerns on three embodiment of this invention. It is sectional drawing of the dent vicinity formed in the wall part of the cooling device which concerns on four embodiment of this invention. It is a perspective view of the dent vicinity formed in the wall part of the cooling device which concerns on 5 embodiment of this invention. It is an external appearance perspective view of the cooling device which concerns on 6 embodiment of this invention. It is sectional drawing of the cooling device which concerns on 6th embodiment of this invention, and is sectional drawing when a wall part is cut | disconnected so that a dent may be included and it looked at the downward direction. It is sectional drawing of the dent vicinity formed in the wall part of the cooling device which concerns on seven embodiment of this invention.

  Hereinafter, some embodiments of the present invention will be described with reference to the accompanying drawings. However, the contents described in the following embodiments or the contents described in the drawings are merely examples, and can be arbitrarily changed and implemented without departing from the gist of the present invention. Moreover, each embodiment can be implemented in any combination of two or more. Furthermore, in each embodiment, the same code | symbol shall be attached | subjected about a common member, and the overlapping description is abbreviate | omitted for the simplification of description.

In addition, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments or shown in the drawings are not intended to limit the scope of the present invention, but are merely illustrative examples. Absent.
For example, expressions expressing relative or absolute arrangements such as “in a certain direction”, “along a certain direction”, “parallel”, “orthogonal”, “center”, “concentric” or “coaxial” are strictly In addition to such an arrangement, it is also possible to represent a state of relative displacement with an angle or a distance such that tolerance or the same function can be obtained.
For example, an expression indicating that things such as “identical”, “equal”, and “homogeneous” are in an equal state not only represents an exactly equal state, but also has a tolerance or a difference that can provide the same function. It also represents the existing state.
For example, expressions representing shapes such as quadrangular shapes and cylindrical shapes represent not only geometrically strict shapes such as quadrangular shapes and cylindrical shapes, but also irregularities and chamfers as long as the same effects can be obtained. A shape including a part or the like is also expressed.
On the other hand, the expressions “comprising”, “comprising”, “comprising”, “including”, or “having” one constituent element are not exclusive expressions for excluding the existence of the other constituent elements.

  FIG. 1 is an external perspective view of a cooling device 100 according to an embodiment of the present invention. The cooling device 100 is for cooling a plurality of cooled portions 12 (see FIG. 3, not shown in FIG. 1) on the support surface 10 with a refrigerant. Here, “on the support surface 10” refers to a structure in which the portion to be cooled 12 is configured as a part of the support surface 10 as described below, or a separate object to be cooled on the surface of the support surface 10. Including the structure where the part 12 is installed. That is, the support surface 10 may have any structure as long as it can support the cooled portion 12 on the support surface 10.

  The support surface 10 is, for example, a semiconductor chip or an electrode. The support surface 10 is supported on the surface of a substrate (not shown). And the to-be-cooled site | part 12 is comprised as a site | part (high heat generation | occurrence | production part) which becomes locally hot among a semiconductor chip, an electrode, etc., for example. Moreover, the refrigerant | coolant for cooling the to-be-cooled site | part 12 is water, a chlorofluorocarbon, a carbon dioxide, etc., for example. However, in the case of using a conductive coolant (such as water) as the coolant, it is preferable to form an insulating film 60 (described later with reference to FIG. 11) on the surface of the support surface 10. Furthermore, the temperature of the refrigerant used in the cooling device 100 (the refrigerant temperature at the refrigerant inlet 1 described later) is preferably equal to or lower than the saturation temperature.

  The cooling device 100 includes a flow path forming member 20 for forming the refrigerant flow path 5 between the cooling apparatus 100 and the support surface 10. Specifically, the flow path forming member 20 is a surface portion 21 that is spaced apart from the support surface 10, and is a refrigerant flow path for allowing the refrigerant flowing from the refrigerant inlet 1 to flow toward the refrigerant outlet 2. 5 is formed between the support surface 10 and the surface portion 21.

  Note that the refrigerant inlet 1 and the refrigerant outlet 2 do not have to be formed facing each other as shown in FIG. 1, and may be formed on adjacent surfaces, the same surface, or the like. Specifically, for example, when the refrigerant inlet 1 and the refrigerant outlet 2 are formed on adjacent surfaces, the refrigerant inlet 1 is formed on the left surface, for example, and the refrigerant outlet 2 is formed on the back surface, for example. Is a case of flowing through an L shape in a top view. For example, when the refrigerant inlet 1 and the refrigerant outlet 2 are formed on the same surface, the refrigerant inlet 1 and the refrigerant outlet 2 are both formed adjacent to the left surface, for example, and the refrigerant reciprocates in a top view. This is the case.

  Further, the flow path forming member 20 includes edge wall portions 22 and 22 erected from respective edges of opposite sides (front side and back side) of the support surface 10 formed in a rectangular shape in FIG. Prepare. The surface portion 21 is disposed on the upper surfaces of the edge wall portions 22 and 22, and the refrigerant flow path 5 is formed in a space surrounded by the support surface 10, the surface portion 21, and the edge wall portions 22 and 22.

  The height of the refrigerant flow path 5 (the length between the support surface 10 and the surface portion 21) varies depending on the heat generation density at the portion to be cooled 12 and the type of refrigerant. can do.

  FIG. 2 is an exploded perspective view of the cooling device 100 according to the embodiment of the present invention. In FIG. 2, the surface portion 21 is indicated by a two-dot chain line. The refrigerant flow path 5 is divided into two flow paths, a first flow path 3 communicating with the refrigerant inlet 1 and a second flow path 4 communicating with the refrigerant outlet 2, and a plurality of cooled objects A wall portion 23 extending so as to continuously connect each of the portions 12 is installed. The meaning of “continuously connected” here will be described later with reference to FIG. The flow path forming member 20 includes a wall portion 23.

  The wall portion 23 is formed with a plurality of recesses 24 for allowing the coolant to flow from the first flow path 3 to the second flow path 4. The channel cross-sectional area of the recess 24 is much smaller than the channel cross-sectional areas of the first channel 3 and the second channel 4. And the to-be-cooled site | part 12 is contained in the inside of each dent 24 and on the support surface 10. FIG. Therefore, when the refrigerant flows inside the recess 24, the refrigerant contacts the part to be cooled 12. Accordingly, the plurality of recesses 24 are formed so as to cool each of the plurality of cooled parts 12 with the refrigerant passing therethrough.

  3 is a cross-sectional view taken along the line AA in FIG. 2, and is a cross-sectional view of the wall portion 23 cut so as to include the recess 24 and viewed from below. In the cooling device 100, the cross-sectional area of the first flow path 3 is larger than the cross-sectional area of the recess 24. More specifically, the channel cross-sectional area (the product of the width W1 and the height of the first channel 3 (not shown)) in the first channel 3 is the channel cross-sectional area of the recess 24 (the width W2 and the recess). 24 (product of height (not shown)). Accordingly, in the first flow path 3, the flow path cross-sectional area is larger than the flow path cross-sectional area of the recess 24 in the entire region.

  Further, in the cooling device 100, the flow path cross-sectional area in the second flow path 4 is larger than the flow path cross-sectional area of the recess 24. More specifically, the cross-sectional area of the second flow path 4 (the product of the width W3 and the height of the second flow path 4 (not shown)) is the cross-sectional area of the recess 24 (the width W2 and the recess). 24 (product of height (not shown)). Therefore, in the second channel 4, the channel cross-sectional area is larger than the channel cross-sectional area of the recess 24 in the entire region.

  By forming the first flow path 3 and the second flow path 4 as described above, the presence of a locally narrowed portion in each of the first flow path 3 and the second flow path 4 is suppressed, It is possible to easily flow the refrigerant uniformly from the first flow path 3 to the recess 24. Thereby, each to-be-cooled part 12 can be cooled uniformly. Further, the refrigerant can be easily flowed from the respective recesses 24 to the second flow path 4. Thereby, the refrigerant | coolant speed in the inside of the dent 24 can be made quick, and the to-be-cooled site | part 12 can fully be cooled.

  As described above, the wall portion 23 partitions the refrigerant flow path 5 into the first flow path 3 and the second flow path 4. Therefore, as indicated by a thick solid arrow in FIG. 3, the refrigerant that has flowed into the recess 24 from the first flow path 3 flows into the second flow path 4 partitioned from the first flow path 3. At this time, since the flow from the first flow path 3 to the second flow path 4 is formed, the refrigerant that has flowed into the second flow path 4 is suppressed from flowing into another recess 24 again. Accordingly, the refrigerant flowing into the refrigerant flow path 5 from the refrigerant inlet 1 passes through the recess 24 only once (only one recess 24) and is discharged from the refrigerant outlet 2.

  In particular, the wall portion 23 extends so as to continuously connect each of the plurality of cooled portions 12 as described above. Therefore, the refrigerant that has flowed into the second flow path 4 through the recess 24 of the wall portion 23 is discharged from the refrigerant outlet 2 without causing a large pressure loss such as flowing into another recess 24. As a result, an increase in pressure loss can be suppressed, and each cooled portion 12 can be cooled with less energy.

  In the present specification, regarding “the wall portion 23 that continuously connects each of the cooled portions 12”, “continuous” means that the wall portion 23 is connected so as to connect all the cooled portions 12 in a top view. Represents a structure that can be formed with a single stroke. As shown in FIGS. 2 and 3, the “connection” includes the following structure in addition to the structure in which the portion to be cooled 12 and the wall portion 23 face each other (see also FIG. 4). Shall be included. Specifically, for example, as shown in FIGS. 6 and 7 to be described later, a structure in which the lower end portion 23a of the wall portion 23 and the portion to be cooled 12 are in contact with each other in a top view and a structure in which these overlap each other are also included.

Specifically, for example, in the example illustrated in FIG. 6, the downstream end 23 b of the lower end portion 23 a of the wall portion 23 and the upstream end 12 a of the cooled portion 12 are arranged at the same position in the refrigerant flow direction. That is, in the top view, the portion to be cooled 12 and the wall portion 23 are in contact with each other. Furthermore, in the example shown in FIG. 7, the upstream end 23c of the lower end part 23a of the wall part 23 and the downstream end 12b of the to-be-cooled part 12 are arrange | positioned in the same position in a refrigerant | coolant flow direction. That is, in the top view, the portion to be cooled 12 and the wall portion 23 are in contact with each other. Although not shown, for example, a part of the cooled portion 12 faces the lower end 23a of the wall 23, and the remaining part faces at least one of the first flow path 3 and the second flow path 4. Such a structure may be used. In this case, the to-be-cooled part 12 and the wall part 23 overlap in said top view.
These structures are also included in the “wall portion 23 that continuously connects each of the cooled parts 12”.

  In addition, as long as the wall part 23 is formed so that all the to-be-cooled parts 12 may be connected, another wall part may branch from the middle of the wall part 23. FIG. That is, as long as all the cooled parts 12 are continuously connected by the wall part 23, another wall part that is not connected to the cooled part 12 may be formed.

  Moreover, when forming the wall part 23 continuously so that all the to-be-cooled parts 12 may be connected, a specific structure is not restricted to the example of illustration at all. Therefore, as long as the wall part 23 is continuously formed so that all the to-be-cooled parts 12 may be connected, the wall part 23 may have any structure. However, as described above, it is preferable that the flow path cross-sectional area in the first flow path 3 is larger than the flow path cross-sectional area of the recess 24. In addition, it is preferable that the cross-sectional area of the second flow path 4 is larger than the cross-sectional area of the recess 24.

  4 is a cross-sectional view taken along line BB in FIG. As shown in FIG. 4, the lower end portion 23 a of the wall portion 23 faces the portion to be cooled 12. In particular, the coolant speed is fastest inside the recess 24. For this reason, by making the lower end part 23a oppose to the to-be-cooled part 12, the to-be-cooled part 12 is arrange | positioned in the part with the fastest refrigerant | coolant speed | velocity | rate, and the to-be-cooled part 12 can be cooled more fully. Further, the refrigerant flowing through the first flow path 3 flows toward the dent 24 having a small flow path cross-sectional area as shown by a thick solid arrow in FIG. Thereby, the temperature boundary layer in the to-be-cooled site | part 12 can be made thin. As a result, the cooled portion 12 can be sufficiently cooled by the leading edge effect.

  In the example shown in FIG. 4, the length of the cooled portion 12 (the length in the left-right direction in FIG. 4) is the same as the length of the lower end portion 23a of the wall 23 (the length in the left-right direction in FIG. 4). It has become. Thereby, the to-be-cooled site | part 12 is arrange | positioned in the whole region of the inside of the dent 24, and the refrigerant | coolant speed is the fastest, Thereby, the to-be-cooled site | part 12 can be cooled uniformly.

  The height h1 of the dent 24 is not unclear because it differs depending on the heat generation density in the cooled portion 12 and the type of refrigerant, but is, for example, a fraction of the height of the refrigerant flow path 5 (for example, 1 / About 5). However, the height h1 of the recess 24 is not limited to this value.

  According to the cooling device 100 as described above, since the refrigerant flows into the recess 24 where the flow path cross-sectional area becomes narrow, the refrigerant speed in the recess 24 can be increased. Thereby, each to-be-cooled site | part 12 can fully be cooled. Moreover, the refrigerant | coolant flow toward the dent 24 with a narrow flow-path cross-sectional area produces, The temperature boundary layer in the to-be-cooled site | part 12 is made thin, and each to-be-cooled site | part 12 can fully be cooled by the leading edge effect. Furthermore, since the wall part 23 is formed so that each of the to-be-cooled part 12 may be connected continuously, it is suppressed that the refrigerant | coolant which passed the dent 24 of the wall part 23 flows into another dent 24 again. . Thereby, the increase in pressure loss can be suppressed and each to-be-cooled site | part 12 can be cooled with little energy.

  The cooling device 100 described above can be applied to, for example, any electric device. Specifically, an electric device (not shown) including the substrate (not shown) having the support surface 10 and the cooling device 100 can be used. According to such an electric device, the cooled portion 12 on the support surface 10 included in the substrate can be cooled by the cooling device 100. Thereby, an electric equipment can be drive | operated stably.

  FIG. 5 is a cross-sectional view of the vicinity of the recess 42 formed in the wall portion 23 of the cooling device 100B according to the second embodiment of the present invention. Also in the example shown in FIG. 5, the lower end portion 23 a of the wall portion 23 faces the portion to be cooled 12 as in the example shown in FIG. 4.

  However, in the example shown in FIG. 5, the wall portion 23 facing the cooled portion 12 has an inclination toward the cooled portion 12 in the refrigerant flow direction. That is, the wall portion 23 has a tapered shape that is inclined so as to descend toward the cooled portion. By making the shape of the wall portion 23 in this way, it is possible to form a jet directed toward the cooled portion 12 along the inclined wall portion 23 as shown by a thick solid arrow in FIG. Thereby, even if the heat generation density of the cooled part 12 is large, the cooled part 12 can be sufficiently cooled.

  FIG. 6 is a cross-sectional view of the vicinity of the recess 42 formed in the wall portion 23 of the cooling device 100C according to the third embodiment of the present invention. Also in the example shown in FIG. 6, although not shown, the wall portion 23 is continuously formed so as to connect all the cooled parts 12. However, the wall portion 23 and the cooled portion 12 are not opposed to each other, and the cooled portion 12 and the wall portion 23 are in contact with each other in the top view described with reference to FIG.

  Specifically, in the cooled portion 12, the upstream end 12 a of the refrigerant flow is located between the flow direction center portion 23 d and the downstream end 23 b of the wall portion 23 in the recess 24. However, in the example shown in FIG. 6, the position of the upstream end 12 a of the refrigerant flow coincides with the downstream end 23 b of the wall portion 23. Further, the downstream end 12 b of the refrigerant flow is located further downstream than the downstream end 23 b of the wall portion 23 in the recess 24.

  When the heat generation density of the portion to be cooled 12 is large, the refrigerant may be subcooled at the contact portion between the portion to be cooled 12 and the refrigerant, and bubbles 28 may be generated. In particular, in the case of a refrigerant (water, chlorofluorocarbon, etc.) having a small critical heat flux, bubbles 28 are likely to be generated. Therefore, the cooled portion 12 is arranged on the downstream side of the wall portion 23 in order to make the generated bubbles 28 flow easily downstream of the cooled portion 12, that is, inside the second flow path 4.

  By arranging the cooled portion 12 in this way, even when the refrigerant is subcooled by the heat of the cooled portion 12 to generate bubbles 28, the generated bubbles 28 are moved into the second flow path 4 on the downstream side of the recess 24. It can be easily washed. In particular, in the second flow path 4, since the cross-sectional area of the flow path (both in the height direction and the width direction) is larger than that of the recess 24, the bubbles 28 move away from the cooled portion 12 quickly. Thereby, inadequate cooling inside the dent 24 caused by the presence of the bubbles 28 can be suppressed, and the cooled portion 12 can be sufficiently cooled.

  FIG. 7 is a cross-sectional view of the vicinity of the recess 24 formed in the wall portion of the cooling device 100D according to the fourth embodiment of the present invention. In the example shown in FIG. 7, in addition to the wall portion 23 extending downward from the surface portion 21, a second wall portion 25 extending upward from the support surface 10 is formed. The second wall portion 25 is included in the wall portion 23 described above. Therefore, in the cooling device 100D shown in FIG. 7, the wall portion 23 is formed on the downstream side of the coolant flow in the cooled portion 12 and the wall portion 23 (first wall portion) standing from the surface portion 21 is provided. And a second wall portion 25 that is formed on the coolant flow upstream side of the cooled portion 12 and that stands from the support surface 10.

  In the example shown in FIG. 7, the downstream end 25a of the second wall portion 25 and the upstream end 12a of the cooled portion 12 are arranged at the same position in the refrigerant flow direction. That is, in the top view described with reference to FIG. 3, the portion to be cooled 12 and the second wall portion 25 are in contact with each other. Moreover, the upstream end 23c of the wall part 23 (1st wall part) and the downstream end 12b of the to-be-cooled site | part 12 are arrange | positioned in the same position in a refrigerant | coolant flow direction. That is, in the top view described with reference to FIG. 3, the portion to be cooled 12 and the wall portion 23 are in contact with each other. Then, a vertical flow path 29 toward the cooled portion 12 is formed between the wall portion 23 and the second wall portion 25.

  The refrigerant that has flowed into the vertical flow path 29 from the recess 24 formed above the second wall portion 25 changes the flow direction downward by flowing through the vertical flow path 29 and heads toward the cooled portion 12. Thereby, a jet flow is generated in the cooled portion 12. Then, the refrigerant that has collided with the cooled portion 12 flows out to the second flow path 4 through the recess 24 formed below the wall portion 23.

  As described above, the refrigerant flows through the vertical flow path 29 formed between the wall portion 23 (first wall portion) and the second wall portion 25, so that a jet directed toward the cooled portion 12 can be formed. Thereby, even if the heat generation density of the cooled part 12 is large, the cooled part 12 can be sufficiently cooled.

  FIG. 8 is a perspective view of the vicinity of the recess 24 formed in the wall portion 23 of the cooling device 100E according to the fifth embodiment of the present invention. In the example shown in FIG. 8, fins 40 are arranged in the cooled portion 12. The fin 40 is composed of a plurality of unit metal plates 40 a and is erected on the cooled portion 12. The unit metal plate 40a is made of a highly heat conductive metal (for example, aluminum, copper, silver, etc.).

  In addition, the fin 40 is disposed inside the recess 24, and a gap is formed between adjacent unit metal plates 40 a constituting the fin 40. Although this gap differs depending on the heat generation density at the cooled portion 12 and the type of refrigerant, it cannot be generally stated, but it is, for example, about 5 μm to 50 μm, but is not limited to this range. Further, the height of the unit metal plate 40a is equal to or less than the height of the recess 24, specifically, for example, about several hundred μm, but is not limited to this value. Note that the length of the fin 40 in the refrigerant flow direction matches the length of the cooled portion 12 in the refrigerant flow direction.

  The refrigerant in the first flow path 3 (not shown in FIG. 8) that has flowed into the recess 24 flows out to the second flow path 4 through the gaps between the adjacent unit metal plates 40a. And when a refrigerant | coolant flows through the dent 24, a refrigerant | coolant and the unit metal plate 40a contact. Here, since the unit metal plate 40a (that is, the fin 40) is erected on the cooled portion 12, the heat of the cooled portion 12 is transferred to the unit metal plate 40a. Thereby, the heat of the part 12 to be cooled is radiated to the refrigerant through the unit metal plate 40a. As a result, cooling of the cooled portion 12 is promoted.

  Thus, the heat transfer area to the refrigerant is increased by the fins 40. Therefore, for example, when a refrigerant having a particularly small critical heat flux such as Freon is used, boiling can be suppressed by increasing the heat transfer area with the fins 40. Thereby, generation | occurrence | production of the bubble 28 (not shown in FIG. 8) can be suppressed, and the inadequate cooling resulting from presence of the bubble 28 can be suppressed. As a result, the portion to be cooled 12 can be sufficiently cooled. Moreover, since the heat transfer area is large, even when the refrigerant speed is slowed from the viewpoint of suppression of pressure loss and erosion, the above boiling can be suppressed and the portion to be cooled 12 can be sufficiently cooled.

  FIG. 9 is an external perspective view of the cooling device 100F according to the sixth embodiment of the present invention. In the cooling device 100 shown in FIG. 1 described above, the edge walls 22 and 22 are provided at the front and back edges, and the refrigerant inlet 1 is formed on the left side. However, in the example shown in FIG. 9, in addition to the edge wall portions 22, 22 provided on the front side and back side edges, the left side edge (not shown in FIG. 9, see FIG. 10) also has the edge wall portion 22 ( 9 (not shown in FIG. 9, see FIG. 10). And a refrigerant | coolant flows in into the refrigerant | coolant flow path 5 of the cooling device 100F through the refrigerant | coolant inlet 1 formed in the surface part 21. As shown in FIG.

  FIG. 10 is a cross-sectional view of the cooling device 100F according to the sixth embodiment of the present invention, and is a cross-sectional view when the wall portion 23 is cut so as to include the recess 24 and viewed downward. In the example shown in FIG. 10, a second cooled portion 50 having a smaller heat flux than the cooled portion 12 is formed on the support surface 10 in addition to the cooled portion 12 described above. And the refrigerant inlet 1 shown with a dashed-two dotted line in FIG. 10 is formed above the 2nd to-be-cooled site | part 50. As shown in FIG. That is, in the example shown in FIG. 10, the refrigerant inlet 1 is formed on the surface portion 21 (not shown in FIG. 10, see FIG. 9) so as to face the second cooled portion 50 different from the plurality of cooled portions 12. Is done.

  Since the refrigerant inlet 1 is formed at this position, the refrigerant is introduced into the first flow path 3 through the refrigerant inlet 1 formed in the surface portion 21, so that the second cooling portion 50 facing the refrigerant inlet 1 is connected to the second cooled portion 50. A jet of refrigerant can be generated. As a result, when there is a second cooled portion 50 having a heat flux different from the heat flux of the cooled portion 12 (the amount of heat generated per unit area per unit time), the first loss is not caused excessively without causing pressure loss. 2 Cooled parts 50 can be cooled independently. In particular, when the heat flux of the second cooled portion 50 is smaller than the heat flow rate of the cooled portion 12 as described above, the second cooled portion 50 can be cooled with a simple configuration.

  FIG. 11 is a cross-sectional view of the vicinity of the recess 24 formed in the wall portion 23 of the cooling device 100G according to the seventh embodiment of the present invention. In the example shown in FIG. 11, an insulating film 60 is formed on the surface of the support surface 10 facing the refrigerant flow path 5. The insulating film 60 is made of, for example, diamond. By forming the insulating film 60, for example, even when a conductive coolant such as water flows through the coolant channel 5, a short circuit on the support surface 10 constituted by a semiconductor chip, an electrode, and the like is suppressed. The

  The insulating film 60 is formed on the surface of the support surface 10 as described above. Therefore, the part to be cooled 12 formed on the support surface 10 and the insulating film 60 are in contact with each other. For this reason, the insulating film 60 functions as a heat spreader, and the heat generated from the cooled portion 12 is diffused toward the refrigerant flow path 5 as indicated by a broken line S1 in FIG. That is, as a result, the heat transfer area to the refrigerant can be increased, and the heat dissipation rate can be increased.

  And in the cooling device 100G, the refrigerant | coolant flow direction length of the lower end part 23a of the wall part 23 is the same length as the refrigerant | coolant flow direction length of the diffused part. Thereby, the flow velocity of the refrigerant can be increased in the entire diffused portion, and the cooled portion 12 can be sufficiently cooled.

  Further, the height of the refrigerant flow path 5 inside the recess 24 is also different from that of the cooling device 100 described above. Specifically, the height h2 of the refrigerant flow path 5 shown in FIG. 11 (the distance from the lower end portion 23a of the wall portion 23 to the insulating film 60) is the height h1 (wall portion) of the refrigerant flow path 5 shown in FIG. The distance from the lower end 23a of the 23 to the support surface 10) is shorter. Thereby, compared with said cooling device 100, a refrigerant | coolant speed can be sped up. As a result, the refrigerant can pass through the portion expanded by diffusion more quickly than in the case of the cooling device 100. Thereby, the to-be-cooled site | part 12 can fully be cooled, suppressing the boiling of a refrigerant | coolant.

DESCRIPTION OF SYMBOLS 1 Refrigerant inlet 2 Refrigerant outlet 3 1st flow path 4 2nd flow path 5 Refrigerant flow path 10 Support surface 12 Cooling part 12a, 23c Upstream end 12b, 23b, 25a Downstream end 20 Flow path formation member 21 Surface part 22 Edge wall part 23 Wall portion 23a Lower end portion 25 Second wall portion 28 Air bubble 29 Vertical flow path 40 Fin 40a Unit metal plate 50 Second cooled portion 60 Insulating coating 100, 100B, 100C, 100D, 100E, 100F, 100G Cooling device

Claims (10)

A cooling device for cooling a plurality of parts to be cooled on a support surface with a refrigerant,
A surface portion disposed away from the support surface, the surface portion forming a refrigerant flow path for allowing the refrigerant flowing from the refrigerant inlet to flow toward the refrigerant outlet; ,
The refrigerant flow path is divided into two flow paths, a first flow path communicating with the refrigerant inlet and a second flow path communicating with the refrigerant outlet, and each of the plurality of portions to be cooled is continuously connected. A flow path forming member including a wall portion extending in a manner as described above,
The cooling device according to claim 1, wherein a plurality of recesses are formed in the wall portion so as to cool each of the plurality of parts to be cooled by the refrigerant passing therethrough. The cooling device according to claim 1, wherein a lower end portion of the wall portion faces the portion to be cooled. The cooling device according to claim 2, wherein the wall portion facing the cooled portion has an inclination toward the cooled portion in a flow direction of the refrigerant. The coolant flow upstream end of the coolant flow is positioned between the center of the wall in the flow direction and the downstream end of the wall, and the downstream end of the coolant flow is lower than the downstream end of the wall of the recess in the flow direction. The cooling device according to claim 1, wherein the cooling device is further disposed on the downstream side. The wall portion is formed on the downstream side of the refrigerant flow in the cooled portion and is erected from the surface portion. The wall portion is formed on the upstream side of the refrigerant flow in the cooled portion and is raised from the support surface. The cooling device according to claim 1, further comprising: a second wall portion to be provided. The flow path cross-sectional area in the first flow path and the flow path cross-sectional area in the second flow path are both larger than the flow path cross-sectional area of the recess. The cooling apparatus of any one of -5. The cooling device according to any one of claims 1 to 6, wherein fins are arranged in the portion to be cooled. The said refrigerant | coolant inlet_port | entrance was formed in the said surface part so that the 2nd to-be-cooled site | part different from these several to-be-cooled site | parts may be formed. The any one of Claims 1-7 characterized by the above-mentioned. Cooling system. The cooling device according to any one of claims 1 to 8, wherein an insulating film is formed on the support surface facing the refrigerant flow path. A substrate having the support surface;
An electrical apparatus comprising: the cooling device according to any one of claims 1 to 9.

Images