JP2019169593A - Substrate transfer system - Google Patents

Abstract

To provide a technology capable of reducing a transfer time per substrate and reducing an apparatus installation area in a substrate transfer system for transferring the substrate.SOLUTION: A wafer transfer system 12 is provided with a chamber 30, a load lock chamber 31 provided above the chamber 30, and connected to the chamber 30 so as to be able to communicate with or be disconnected from the chamber, and a load lock chamber 32 provided below the chamber 30, and connected to the chamber 30 so as to be able to communicate with or be disconnected from the chamber. The wafer transfer system 12 includes a stocker 33 provided so as to be movable up and down between the inside of the load lock chamber 31 and the inside of the chamber 30, and a stocker 34 provided to be movable up and down between the inside of the load lock chamber 32 and the inside of the chamber 30.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a substrate transfer system for transferring a substrate.

  As semiconductor devices formed on a substrate are highly integrated or miniaturized, a substrate inspection apparatus having high resolution and high throughput is required. As a substrate inspection apparatus having high resolution, for example, a wafer as a substrate is carried into a evacuated sample chamber, a sample such as a carried wafer is irradiated with an electron beam, and secondary electrons emitted from the sample are detected. 2. Description of the Related Art An image generating apparatus including a scanning electron microscope (SEM) that generates a fine pattern image is used.

  In a substrate inspection apparatus as an image generation apparatus provided with the SEM described above, a substrate transfer system for carrying a wafer into and out of a sample chamber that has been evacuated is provided. Japanese Patent Laying-Open No. 2004-363085 (Patent Document 1) includes a load lock chamber in which a transfer robot places a substrate in a substrate inspection apparatus, and the load lock chamber carries a wafer to be inspected into a stage apparatus. In addition, a technique including a plurality of stages of elevator mechanisms for carrying out an inspected substrate from a stage apparatus is disclosed.

JP 2004-363085 A

  In the technique described in Patent Document 1, a load lock chamber (load lock chamber) is provided on the side of a transfer chamber (chamber) in which a vacuum transfer robot is provided, and the load lock chamber can be moved up and down. A simple wafer rack (stocker) is formed.

  As described above, when the elevating type stocker is provided in the load lock chamber, the number of substrates transported per unit time, that is, the throughput can be improved as compared with the case where the elevating type stocker is not provided. In other words, the transport time per substrate can be shortened. However, it is necessary to increase the internal volume of the load lock chamber as much as the stocker moves up and down, and it takes time to evacuate the load lock chamber, so there is a problem that the effect of improving the throughput is small.

  Further, when the load lock chamber is provided on the side of the chamber in which the vacuum transfer robot is provided, there is a problem that the apparatus installation area (footprint) of the wafer transfer system increases. The above-described problem is the same when transferring not only a wafer such as a silicon substrate having a disk shape as a planar shape but also various substrates such as a glass substrate having a rectangular shape as a planar shape.

  An object of the present invention is to provide a technique capable of shortening the transport time per substrate and reducing the apparatus installation area in a substrate transport system for transporting a substrate.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A substrate transfer system according to an embodiment of the present invention includes a chamber that can be evacuated inside, a first chamber that is provided above the chamber, is connected to be able to communicate with or shut off from the chamber, and can be evacuated inside. A load lock chamber; and a second load lock chamber that is provided below the chamber, is connected to the chamber so as to be able to communicate or be cut off, and can be evacuated inside. In addition, the substrate transfer system is provided so as to be movable up and down between a first position inside the first load lock chamber and a second position inside the chamber, and one or more first substrates are provided. The first accommodating portion to be accommodated, the third position inside the second load lock chamber, and the fourth position inside the chamber can be moved up and down, and one or more second substrates are provided. And a second accommodating portion for accommodating. The substrate transfer system is provided outside the chamber, and loads and unloads the first substrate between the outside of the first load lock chamber and the first accommodating portion disposed at the first position. And a second substrate loading / unloading portion that is provided outside the chamber and that loads and unloads the second substrate between the outside of the second load lock chamber and the second accommodating portion disposed at the third position; A third substrate that is provided therein and that carries the first substrate into and out of the first accommodating portion disposed at the second position, and that carries the second substrate into and out of the second accommodating portion disposed at the fourth position. And a carry-in / out part.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  According to a typical embodiment of the present invention, in a substrate transfer system for transferring a substrate, the transfer time per substrate can be shortened, and the apparatus installation area can be reduced.

It is a side view which shows typically the image generation apparatus provided with the wafer conveyance system of embodiment. It is a top view which shows typically the image generation apparatus provided with the wafer conveyance system of embodiment. It is a side view including the partial cross section which shows typically the image generation apparatus provided with the wafer conveyance system of embodiment. 1 is a perspective view schematically illustrating a part of an image generation apparatus including a wafer transfer system according to an embodiment. It is sectional drawing which expands and shows the periphery of the two load lock chambers of the wafer conveyance system of an embodiment. It is a side view including the partial cross section in the wafer conveyance process of the image generation apparatus provided with the wafer conveyance system of an embodiment. It is a side view including the partial cross section in the wafer conveyance process of the image generation apparatus provided with the wafer conveyance system of an embodiment. It is a side view including the partial cross section in the wafer conveyance process of the image generation apparatus provided with the wafer conveyance system of an embodiment. It is a side view including the partial cross section in the wafer conveyance process of the image generation apparatus provided with the wafer conveyance system of an embodiment. It is a side view including the partial cross section in the wafer conveyance process of the image generation apparatus provided with the wafer conveyance system of an embodiment. It is a side view including the partial cross section in the wafer conveyance process of the image generation apparatus provided with the wafer conveyance system of an embodiment. It is a side view including the partial cross section in the wafer conveyance process of the image generation apparatus provided with the wafer conveyance system of an embodiment. It is a side view including the partial cross section in the wafer conveyance process of the image generation apparatus provided with the wafer conveyance system of an embodiment. It is sectional drawing which expands and shows the periphery of two load lock chambers in the wafer conveyance process of the wafer conveyance system of embodiment. It is sectional drawing which expands and shows the periphery of two load lock chambers in the wafer conveyance process of the wafer conveyance system of embodiment. It is sectional drawing which expands and shows the periphery of two load lock chambers in the wafer conveyance process of the wafer conveyance system of embodiment. It is sectional drawing which expands and shows the periphery of two load lock chambers in the wafer conveyance process of the wafer conveyance system of embodiment. It is sectional drawing which expands and shows the periphery of two load lock chambers in the wafer conveyance process of the wafer conveyance system of embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted.

(Embodiment)
Hereinafter, a wafer transfer system as a substrate transfer system according to an embodiment of the present invention and an image generation apparatus including the wafer transfer system will be described.

<Image generation device>
First, an image generation apparatus provided with a wafer transfer system as a substrate transfer system of the present embodiment will be described. FIG. 1 is a side view schematically illustrating an image generation apparatus including a wafer transfer system according to an embodiment.

  As shown in FIG. 1, the image generation apparatus includes an electron optical column 1 and a sample chamber 2. The electron optical column 1 includes an electron gun 3 that emits a charged particle beam made of primary electrons, a focusing lens 4 that focuses the charged particle beam emitted from the electron gun 3, and an X-axis direction and a Y-axis of the charged particle beam. A deflector 5 that deflects in a direction (see FIG. 2 described later), an objective lens 7 that focuses a charged particle beam on a wafer W as a sample, and secondary electron detection that detects secondary electrons emitted from the wafer W. And a pedestal 9 made of a rigid body fixed to the lower end of the electron optical column 1. The electron gun 3, the focusing lens 4, the secondary electron detector 8, the deflector 5, and the objective lens 7 are arranged in this order. The lower end of the electron optical column 1 is connected to the sample chamber 2 via a pedestal 9.

  The sample chamber 2 is disposed below the objective lens 7. The sample chamber 2 has an XY stage 10. The XY stage 10 is disposed in the sample chamber 2 and is a two-dimensional stage movable in the X-axis direction and the Y-axis direction (see FIG. 2 described later). The XY stage 10 includes an electrostatic chuck 11, and the wafer W is fixed to the XY stage 10 by the electrostatic chuck 11.

  Further, the image generation apparatus includes a wafer transfer system 12, and the wafer W is carried into and out of the sample chamber 2 by the wafer transfer system 12. The wafer transfer system 12 will be described in detail with reference to FIGS. 2 to 5 described later.

  The charged particle beam emitted from the electron gun 3 is focused by the focusing lens 4, then focused by the objective lens 7 while being deflected by the deflector 5, and irradiated onto the surface of the wafer W. When the wafer W is irradiated with primary electrons of charged particles, secondary electrons are emitted from the wafer W. Secondary electrons are detected by the secondary electron detector 8.

  The focusing lens 4 and the objective lens 7 are connected to a lens control device 13, and the lens control device 13 is connected to a control computer 14. The electron gun 3 is connected to a high voltage control device 6, and the high voltage control device 6 is connected to a control computer 14. The secondary electron detector 8 is connected to the imaging device 15. The imaging device 15 converts the output signal of the secondary electron detector 8 into an image. The imaging device 15 is connected to the control computer 14. The deflector 5 is connected to the deflection control device 16, and the deflection operation of the deflector 5 is controlled by the deflection control device 16. The deflection control device 16 is connected to the control computer 14.

  The XY stage 10 is connected to an XY stage controller 17, and the position of the XY stage 10 is controlled by the XY stage controller 17. The XY stage controller 17 is connected to the control computer 14. The wafer transfer system 12 is connected to the control computer 14. The operations of the lens control device 13, the imaging device 15, the deflection control device 16, the XY stage control device 17 and the wafer transfer system 12 are controlled by the control computer 14. The control computer 14 is connected to the operation computer 18.

  Further, the image generation apparatus includes a laser interferometer 19. The laser interferometer 19 is a displacement detector for detecting the displacement of the XY stage 10. The laser interferometer 19 is disposed outside the sample chamber 2. The laser interferometer 19 includes a reference mirror 19 a disposed in the vicinity of the objective lens 7 and a measurement mirror 19 b fixed to the XY stage 10.

  The reference mirror 19a is attached to a position that vibrates in synchronization with the objective lens 7 of the electron optical column 1. In the present embodiment, the reference mirror 19 a is installed on the pedestal 9. The pedestal 9 has an exposed surface located in the sample chamber 2, and the reference mirror 19 a is fixed to the exposed surface of the pedestal 9.

  The reference mirror 19 a is fixed to a base 9 that is a highly rigid member, and in addition, the wafer W is held by the electrostatic chuck 11. Therefore, unnecessary components can be prevented from being included in the position information of the XY stage 10.

  The measurement mirror 19b is attached to a position that vibrates in synchronization with the wafer W that is the object to be measured. The laser interferometer 19 is connected to the stage position measuring device 20. The stage position measurement device 20 specifies the position of the XY stage 10 based on the displacement signal output from the laser interferometer 19. The stage position measuring device 20 is connected to the XY stage control device 17 and the deflection control device 16.

  Deflection setting values such as pixel size, scan size, and scan speed are sent from the control computer 14 to the deflection controller 16. The deflection control device 16 generates a deflection operation signal to the deflector 5. The deflector 5 operates according to the deflection operation signal and deflects the charged particle beam.

  The accelerometer 21 attached to the sample chamber 2 is formed of an element capable of measuring acceleration in three directions along the X axis, the Y axis, and the Z axis that are orthogonal to each other. In the example shown in FIG. 1, the accelerometer 21 is attached to the sample chamber 2. The accelerometer 21 is connected to the acceleration signal processing device 22, and the output signal of the accelerometer 21 is processed by the acceleration signal processing device 22. The acceleration signal processing device 22 is connected to the deflection control device 16 and the control computer 14. The operation of the acceleration signal processing device 22 is controlled by the control computer 14.

<Wafer transfer system>
Next, a wafer transfer system as the substrate transfer system of the present embodiment will be described. FIG. 2 is a plan view schematically illustrating an image generation apparatus including the wafer conveyance system according to the embodiment. FIG. 3 is a side view including a partial cross-section schematically illustrating an image generation apparatus including the wafer transfer system according to the embodiment. FIG. 4 is a perspective view schematically illustrating a part of the image generation apparatus including the wafer conveyance system according to the embodiment. Note that FIG. 2 shows a state in which a portion disposed below the removed portion is seen through by removing a part of the upper portion of the wafer transfer system as appropriate. Moreover, in FIG. 4, the state which looked through the part arrange | positioned in the back | inner side rather than the said removed side surface is shown by removing the side surface arrange | positioned in the near side in the figure.

  As described with reference to FIG. 1 described above and as shown in FIGS. 2 to 4, the image generating apparatus includes the sample chamber 2, the wafer transfer system 12, and the laser interferometer 19. . Further, the sample chamber 2 has an XY stage 10 disposed in the sample chamber 2. The sample chamber 2 is installed on the chamber table 2a. In FIG. 2, a locus 19c of the laser beam of the laser interferometer 19 is shown.

  As shown in FIGS. 2 to 4, the wafer transfer system 12 includes a chamber 30, a load lock chamber (first load lock chamber) 31, a load lock chamber (second load lock chamber) 32, a stocker 33, And a stocker 34. The wafer transfer system 12 includes an atmospheric transfer robot 35, a vacuum transfer robot 36, an aligner 37, a load port 38, and a load port 39. The wafer transfer system 12 includes a gate valve 40, a gate valve 41, and a gate valve 42.

  The sample chamber 2, the chamber 30, and the load lock chambers 31 and 32 form a main unit 43 of the image generation apparatus. The atmospheric transfer robot 35 and the aligner 37 form the atmospheric transfer unit 44 of the image generation apparatus. Is formed.

  The chamber 30 is provided on the side of the sample chamber 2 via the gate valve 40, is connected to the sample chamber 2 by the gate valve 40 so as to be able to communicate with or be cut off, and the inside can be evacuated.

  The load lock chamber 31 is provided above the chamber 30, is connected to the chamber 30 so as to be able to communicate or be cut off, and the inside thereof can be evacuated. The load lock chamber 31 is provided so as to be able to communicate with or shut off from the outside of the load lock chamber 31 via the gate valve 41.

  The load lock chamber 32 is provided below the chamber 30, is connected to the chamber 30 so as to be able to communicate with or be cut off, and can be evacuated inside. The load lock chamber 32 is provided to be able to communicate with or shut off from the outside of the load lock chamber 32 via a gate valve 42.

  The stocker 33 includes, for example, a motor 33a and a ball screw 33b between a position PS1 (see FIGS. 3 and 4) inside the load lock chamber 31 and a position PS2 inside the chamber 30 (see FIG. 10 described later). It can be moved up and down by a lifting device 33c including The stocker 33 is a storage unit that stores a wafer W as one or a plurality of substrates.

  The stocker 34 is disposed between a position PS3 (see FIG. 3) inside the load lock chamber 32 and a position PS4 (see FIG. 4) inside the chamber 30, for example, an elevating device 34c including a motor 34a and a ball screw 34b. Therefore, it can be moved up and down. The stocker 34 is a storage unit that stores a wafer W as one or a plurality of substrates.

  In the example shown in FIGS. 3 and 4, each of the stockers 33 and 34 accommodates five wafers W as substrates. In this manner, each of the stockers 33 and 34 accommodates a plurality of wafers, so that each of the plurality of wafers can be evacuated at a time, and each of the plurality of wafers can be opened to the atmosphere. The gate valves 40, 41, and 42 can be opened and closed all at once when transporting each of a plurality of wafers. Therefore, the number of wafers transferred per unit time, that is, throughput can be improved.

  Note that the position PS2 (see FIG. 10 described later) and the position PS4 (see FIG. 4) are substantially the same position, but the position PS2 and the position PS4 do not necessarily have to be the same position, and the vertical direction or the horizontal direction. The positions may be separated from each other in the direction.

  The atmospheric transfer robot 35 includes a base portion 35a provided outside the chamber 30, an arm 35b connected to the base portion 35a and capable of bending and extending by bending, for example, and a hand 35c connected to the tip of the arm 35b. ,including. The atmospheric transfer robot 35 is a substrate loading / unloading unit that loads and unloads a wafer W as a substrate through the opening of the gate valve 41 between the outside of the load lock chamber 31 and the stocker 33 disposed at the position PS1. . In addition, the atmospheric transfer robot 35 carries a substrate loading / unloading unit that loads and unloads a wafer W as a substrate through the opening of the gate valve 42 between the outside of the load lock chamber 32 and the stocker 34 disposed at the position PS3. It is. Two atmospheric transfer robots 35 may be provided, one for the stocker 33 and the other for the stocker 34.

  A stocker for accommodating one or a plurality of substrates can be disposed on each of the load ports 38 and 39. In the example shown in FIG. 2, a stocker 38 a that accommodates the wafer W is disposed on the load port 38.

  The vacuum transfer robot 36 includes a base portion 36a provided in the chamber 30, an arm (not shown) that is connected to the base portion 36a and can be bent and extended, and a hand connected to the tip of the arm (not shown). 36c. The vacuum transfer robot 36 is a substrate loading / unloading unit that loads and unloads the wafer W as a substrate with respect to the stocker 33 disposed at the position PS <b> 2 inside the chamber 30. The vacuum transfer robot 36 is a substrate loading / unloading unit that loads and unloads a wafer W as a substrate with respect to the stocker 34 disposed at the position PS4 inside the chamber 30.

  In the technique described in Patent Document 1, a load lock chamber (load lock chamber) is provided on the side of a transfer chamber (chamber) in which a vacuum transfer robot is provided, and the load lock chamber can be moved up and down. A simple wafer rack (stocker) is formed.

  As described above, when the elevating type stocker is provided in the load lock chamber, the number of substrates transported per unit time, that is, the throughput can be improved as compared with the case where the elevating type stocker is not provided. In other words, the transport time per substrate can be shortened. However, it is necessary to increase the internal volume of the load lock chamber as much as the stocker moves up and down, and it takes time to evacuate the load lock chamber, so there is a problem that the effect of improving the throughput is small.

  Further, when the load lock chamber is provided on the side of the chamber in which the vacuum transfer robot is provided, there is a problem that the apparatus installation area (footprint) of the wafer transfer system increases.

  On the other hand, the wafer transfer system of the present embodiment includes a load lock chamber 31 provided above the chamber 30, a load lock chamber 32 provided below the chamber 30, the inside of the load lock chamber 31, and the chamber. 30 and a stocker 33 provided so as to be movable up and down between the interior of the chamber 30 and a stocker 34 provided so as to be movable up and down between the interior of the load lock chamber 32 and the interior of the chamber 30.

  In such a case, even if the internal volume of the load lock chamber 31 is small, the sum of the internal volume of the load lock chamber 31 and the internal volume of the chamber 30 can be increased, and the amount of up and down movement of the stocker 33 can be increased. can do. Therefore, compared with the case where the load lock chamber 31 is provided on the side of the chamber 30, the volume inside the load lock chamber 31 can be halved, and the time required for evacuating the load lock chamber 31 is reduced. be able to.

  Similarly, even if the internal volume of the load lock chamber 32 is small, the sum of the internal volume of the load lock chamber 32 and the internal volume of the chamber 30 can be increased, and the amount of up and down movement of the stocker 34 can be increased. can do. Therefore, compared with the case where the load lock chamber 32 is provided on the side of the chamber 30, the volume inside the load lock chamber 32 can be halved, and the time required for evacuating the load lock chamber 32 is reduced. be able to.

  Further, since the load lock chambers 31 and 32 are provided above and below the chamber 30, when one of the load lock chambers 31 and 32 is evacuated and communicated with the evacuated chamber 30. The other of the load lock chambers 31 and 32 can be opened to the atmosphere, and a wafer can be carried in and out of the outside. As a result, the transfer time per wafer in the wafer transfer system can be shortened.

  Further, the load lock chamber 31 is provided above the chamber 30 and the load lock chamber 32 is provided below the chamber 30, so that the apparatus installation area (footprint) of the wafer transfer system can be reduced.

  That is, according to the wafer transfer system of the present embodiment, the load lock chambers 31 and 32 are installed above and below the chamber 30, and the stockers 33 and 34 as elevating wafer racks for loading a plurality of wafers are installed. . As a result, the plurality of wafers can be evacuated or released to the atmosphere at a time, and the time for performing the evacuation or opening to the atmosphere and the device installation area (footprint) can be reduced simultaneously. Further, by installing the load lock chambers 31 and 32 above and below the chamber 30, two load lock chambers can be used alternately. Therefore, since the wafer transfer under vacuum and the wafer transfer / intake under atmospheric pressure can be performed in parallel, the wafer transfer time can be reduced and the cost can be reduced by reducing the vacuum system.

  FIG. 5 is an enlarged cross-sectional view of the periphery of two load lock chambers of the wafer transfer system of the embodiment.

  As shown in FIG. 5, the wafer transfer system 12 includes a vacuum exhaust unit 50 that exhausts the inside of each of the load lock chambers 31 and 32.

  In the example shown in FIG. 5, the evacuation unit 50 includes an evacuation device 51 that evacuates the inside of each of the load lock chambers 31 and 32, and an evacuation pipe 52 having one end connected to the evacuation device 51. The vacuum exhaust unit 50 includes an exhaust pipe 53 that connects the other end of the exhaust pipe 52 and the load lock chamber 31, and an exhaust pipe 54 that connects the other end of the exhaust pipe 52 and the load lock chamber 32. . The evacuation unit 50 includes a valve 55 provided on the exhaust pipe 53, that is, in the middle of the exhaust pipe 53, a valve 56 provided on the exhaust pipe 54, that is, in the middle of the exhaust pipe 54, and the exhaust pipe 52. That is, a valve 57 provided in the middle of the exhaust pipe 52 is included.

  In such a case, the load lock chamber 31 can be evacuated by the exhaust device 51 through the exhaust pipes 53 and 52 by opening the valves 55 and 57 with the valve 56 closed. Further, by opening the valves 56 and 57 with the valve 55 closed, the load lock chamber 32 can be evacuated by the exhaust device 51 through the exhaust pipes 54 and 52.

  In the example shown in FIG. 5, the valves 55 and 56 are opened with the valve 57 closed, whereby the load lock chamber 31 and the load lock chamber 32 are disconnected from the exhaust device 51 in the exhaust pipe 51. Communicating with each other via 53 and 54. In such a case, the exhaust pipes 52, 53 and 54 and the valves 55, 56 and 57 are provided outside the chamber 30 so that the inside of the load lock chamber 31 and the inside of the load lock chamber 32 can be communicated or blocked. A connecting portion 58 is formed to connect to the.

  The connection portion 58 may not be included in the vacuum exhaust portion 50 as long as the load lock chamber 31 and the load lock chamber 32 are connected. For example, the exhaust portions 53 and 54 shown in FIG. A portion corresponding to either 55 or 56 may be provided separately from the vacuum exhaust section.

  Preferably, the evacuation unit 50 evacuates one of the load lock chambers 31 and 32 in a state where the interior of the chamber 30 is evacuated. By performing such an operation, as will be described with reference to FIGS. 6 to 18 described later, one of the load lock chambers 31 and 32 that is evacuated and the chamber 30 that is evacuated communicate with each other. Therefore, one of the stockers 33 and 34 can be moved into the chamber 30.

  As shown in FIG. 5, the wafer transfer system 12 includes an atmosphere release unit 60 that opens the interior of each of the load lock chambers 31 and 32 to the atmosphere.

In the example shown in FIG. 5, the atmosphere opening unit 60 includes supply sources 61 and 62 that supply an inert gas such as nitrogen (N ₂ ) gas or a gas such as air, the supply source 61, and the load lock chamber 31. A supply pipe 63 to be connected, and a supply pipe 64 to connect the supply source 62 and the load lock chamber 32 are included. In addition, the atmosphere opening portion 60 includes a valve 65 provided on the supply pipe 63, that is, in the middle of the supply pipe 63, and a valve 66 provided on the supply pipe 64, that is, in the middle of the supply pipe 64.

  In such a case, by opening the valve 65 with the valve 55 closed, gas is supplied from the supply source 61 to the inside of the load lock chamber 31 through the supply pipe 63 to open the inside of the load lock chamber 31 to the atmosphere. can do. Further, by opening the valve 66 with the valve 56 closed, gas can be supplied from the supply source 62 to the inside of the load lock chamber 32 via the supply pipe 64 to release the inside of the load lock chamber 32 to the atmosphere. it can.

  When the load lock chamber 31 is evacuated, the valves 55 and 57 are opened while the valve 65 is closed in addition to the valve 56. Further, when the load lock chamber 32 is evacuated, the valves 56 and 57 are opened while the valve 66 is closed in addition to the valve 55.

  Preferably, the atmosphere release unit 60 opens the other of the load lock chambers 31 and 32 to the atmosphere when the vacuum exhaust unit 50 evacuates one of the load lock chambers 31 and 32. By performing such an operation, as described above and as described with reference to FIGS. 6 to 18 described later, one of the load lock chambers 31 and 32 is evacuated, and the evacuated chamber is evacuated. When communicating with 30, the other of the load lock chambers 31 and 32 can be opened to the atmosphere, and a wafer can be carried in and out of the outside. That is, in the wafer transfer system 12 according to the present embodiment, one of the load lock chambers 31 and 32 is used for wafer transfer (wafer transfer) in a vacuum exhausted state (under vacuum). And 32 are used for loading / unloading wafers (under atmospheric pressure) to / from the outside of the load lock chambers 31 and 32. Therefore, the transfer time per wafer in the wafer transfer system can be shortened, and the number of wafers transferred per unit time, that is, the throughput can be improved.

  Preferably, the wafer transfer system 12 includes a flange 71 provided below the stocker 33, preferably below the stocker 33, and a flange 72 provided above the stocker 33, preferably above the stocker 33. And having. A through hole 74 is formed in the top plate portion 73 of the chamber 30 which is also the bottom plate portion of the load lock chamber 31. The stocker 33 is disposed in the through hole 74 in plan view, and is provided so as to be able to pass through the through hole 74 when the stocker 33 moves up and down.

  The flange 71 is a blocking portion that blocks communication between the load lock chamber 31 and the chamber 30 when the stocker 33 is disposed at the position PS <b> 1 inside the load lock chamber 31. The flange 71 includes a flange portion 71a that protrudes outward from the stocker 33 in a plan view. When the stocker 33 is disposed at the position PS1 inside the load lock chamber 31, the upper surface of the flange portion 71a is, for example, an O-ring or the like. The communication between the load lock chamber 31 and the chamber 30 is blocked by being pressed and contacted with the top plate portion 73 of the chamber 30 through a seal 71b made of an elastic body. As a result, it is not necessary to provide a separate gate valve between the load lock chamber 31 and the chamber 30, so that the apparatus cost of the wafer transfer system 12 can be reduced.

  The flange 72 is formed above the stocker 33 and to the side of the stocker 33 by contacting the upper part of the load lock chamber 31 when the stocker 33 is disposed at the position PS1 inside the load lock chamber 31. This is a partial space forming part that forms a partial space SP2 (buffer chamber) that is blocked from the partial space SP1.

  In the example shown in FIG. 5, the top plate portion 75 of the load lock chamber 31 includes a peripheral portion 76 that is a portion disposed on the periphery of the top plate portion 75 in plan view, and a peripheral portion 76 of the top plate portion 75 in plan view. And a projecting portion 77 projecting upward from the peripheral edge portion 76. The flange 72 includes an edge portion 72a that protrudes more outward than the protrusion portion 77 in plan view. When the stocker 33 is disposed at the position PS1 inside the load lock chamber 31, the upper surface of the edge portion 72a is, for example, an O-ring. A partial space SP2 is formed between the flange 72 and the projecting portion 77 of the top plate portion 75 by being pressed and brought into contact with the peripheral edge portion 76 of the top plate portion 75 via a seal 72b made of an elastic body such as To do. At this time, the partial space SP1 can be formed inside the load lock chamber 31 and on the side of the stocker 33, and the partial space SP2 can be blocked from the partial space SP1.

  Moreover, the vacuum exhaust part 50 has the connection pipe 78 which connects and communicates the partial space SP2 and the chamber 30 without passing through the partial space SP1. By having the connecting pipe 78, even when the partial space SP1 is opened to the atmosphere with the stocker 33 disposed at the position PS1, communication between the partial space SP2 and the chamber 30 is ensured, and the partial space SP2 is evacuated. Because of this state, the upper surface of the edge portion 72a of the flange 72 is pressed against and contacted with the peripheral edge portion 76 of the top plate portion 75. Therefore, the state where the upper surface of the flange portion 71a of the flange 71 is pressed against and contacted with the top plate portion 73 of the chamber 30 can be maintained, and the communication between the partial space SP1 and the chamber 30 can be reliably blocked.

  Suitably, the wafer transfer system 12 includes a flange 81 provided above the stocker 34, preferably above the stocker 34, and a flange 82 provided below the stocker 34, preferably below the stocker 34. And having. A through hole 84 is formed in the bottom plate portion 83 of the chamber 30 which is also the top plate portion of the load lock chamber 32. The stocker 34 is disposed in the through hole 84 in a plan view, and is provided so as to be able to pass through the through hole 84 when the stocker 34 moves up and down.

  The flange 81 is a blocking portion that blocks communication between the load lock chamber 32 and the chamber 30 when the stocker 34 is disposed at the position PS3 inside the load lock chamber 32. The flange 81 includes a flange 81a that protrudes more outward than the stocker 34 in a plan view. When the stocker 34 is disposed at the position PS3 inside the load lock chamber 32, the lower surface of the flange 81a is, for example, an O-ring. By pressing and contacting the bottom plate portion 83 of the chamber 30 from above via the seal 81b made of the elastic body, the communication between the load lock chamber 32 and the chamber 30 is blocked. Thereby, it is not necessary to provide a separate gate valve between the load lock chamber 32 and the chamber 30, so that the apparatus cost of the wafer transfer system 12 can be reduced.

  The flange 82 is formed below the stocker 34 and to the side of the stocker 34 by contacting the lower part of the load lock chamber 32 when the stocker 34 is disposed at the position PS3 inside the load lock chamber 32. This is a partial space forming part that forms a partial space SP4 (buffer chamber) that is blocked from the partial space SP3.

  In the example shown in FIG. 5, the bottom plate portion 85 of the load lock chamber 32 is surrounded by a peripheral portion 86 that is a portion disposed on the periphery of the bottom plate portion 85 in plan view, and a peripheral portion 86 of the bottom plate portion 85 in plan view. And a projecting portion 87 that projects downward from the peripheral edge portion 86. The flange 82 includes an edge portion 82a that protrudes outward from the protrusion portion 87 in plan view. When the stocker 34 is disposed at the position PS3 inside the load lock chamber 32, the lower surface of the edge portion 82a is, for example, an O-ring. A partial space SP <b> 4 is formed between the flange 82 and the protruding portion 87 of the bottom plate portion 85 by being pressed and brought into contact with the peripheral edge portion 86 of the bottom plate portion 85 through a seal 82 b made of an elastic body such as the like. At this time, the partial space SP3 can be formed inside the load lock chamber 32 and on the side of the stocker 34, and the partial space SP4 can be blocked from the partial space SP3.

  Moreover, the vacuum exhaust part 50 has the connection pipe 88 which connects and communicates the partial space SP4 and the chamber 30 without passing through the partial space SP3. By having the connection pipe 88, even when the partial space SP3 is opened to the atmosphere with the stocker 34 disposed at the position PS3, communication between the partial space SP4 and the chamber 30 is ensured, and the partial space SP4 is evacuated. Because of this state, the lower surface of the edge portion 82 a of the flange 82 is pressed against and contacted with the peripheral edge portion 86 of the bottom plate portion 85. Therefore, the state in which the lower surface of the flange portion 81a of the flange 81 is pressed against and contacted with the bottom plate portion 83 of the chamber 30 can be maintained, and the communication between the partial space SP3 and the chamber 30 can be reliably blocked.

<Wafer transfer method>
Next, as a substrate transfer method of the present embodiment, a wafer transfer method using the wafer transfer system of the embodiment will be described.

  6 to 13 are side views including a partial cross-section during the wafer transfer process of the image generating apparatus including the wafer transfer system according to the embodiment. 14 to 18 are enlarged cross-sectional views showing the periphery of two load lock chambers during the wafer transfer process of the wafer transfer system of the embodiment. Each of FIGS. 14 to 18 corresponds to the wafer transfer process of FIGS. 6 to 10. 6 to 18, the space that is evacuated by the exhaust device is displayed with hatching, the space that is released to the atmosphere is displayed without hatching, and is not evacuated but is at atmospheric pressure. The decompressed space is displayed with hatching that is wider than the space being evacuated. In FIG. 14 to FIG. 18, the opened valve is displayed with hatching, and the closed valve is displayed without hatching.

  The step of loading / unloading the wafer between the outside of the load lock chamber 31 and the stocker 33 and the step of loading / unloading the wafer between the outside of the load lock chamber 32 and the stocker 34 are alternately repeated. In the following description, after the wafer is loaded / unloaded between the outside of the load lock chamber 31 and the stocker 33, the wafer is placed between the outside of the load lock chamber 32 and the stocker 34. An example of carrying in and out will be described.

  In the example shown in FIGS. 6 to 18, first, as shown in FIGS. 6 and 14, the load lock chamber 31 is opened to the atmosphere, and a wafer is placed between the outside of the load lock chamber 31 opened to the atmosphere and the stocker 33. At the same time as loading / unloading, a wafer is loaded / unloaded between the stocker 34 and the sample chamber 2 (step S1).

  In this step S 1, as shown in FIG. 6, the stocker 33 is disposed at a position PS 1 inside the load lock chamber 31, and the communication between the load lock chamber 31 and the chamber 30 is blocked by the flange 71. In the state where the internal pressure of the chamber becomes atmospheric pressure, the gate valve 41 is opened to release the interior of the load lock chamber 31 to the atmosphere. Then, the wafer is carried in and out between the outside of the load lock chamber 31 opened to the atmosphere and the stocker 33 by the atmospheric transfer robot 35. 6 and 14 show a state where the wafer W1 is loaded into the stocker 33 after performing Step S1.

  In step S1, as shown in FIG. 6, the load lock chamber 32 is communicated with the chamber 30 in a state where each of the load lock chamber 32 and the chamber 30 is evacuated, and the stocker 34 is moved up and down by the lifting device 34c. And is disposed at a position PS4 inside the chamber 30. Then, the wafer is carried in and out of the stocker 34 by the vacuum transfer robot 36 (see FIG. 2). Further, by opening the gate valve 40, a wafer is carried in and out between the stocker 34 and the sample chamber 2 by the vacuum transfer robot 36 (see FIG. 2) in a state where the chamber 30 is in communication with the sample chamber 2. 6 and 14 show a state in which the wafer W2 is loaded into the stocker 34 after step S1 is performed.

  Specifically, for example, as shown in FIG. 14, the load lock chamber 32 is evacuated while the valves 55 and 66 are closed and the valves 56 and 57 are opened. Although not shown in FIG. 14, with the valve 65 opened, gas is supplied from the supply source 61 to the inside of the load lock chamber 31 through the supply pipe 63 to increase the pressure inside the load lock chamber 31. After returning to atmospheric pressure, the valve 65 is closed as shown in FIG. Thereby, the inside of the load lock chamber 31 can be opened to the atmosphere and the gate valve 41 (see FIG. 6) can be opened in a state where the load lock chamber 32 is evacuated by the exhaust device 51 through the exhaust pipes 54 and 52. .

  Since the partial space SP2 between the flange 72 and the projecting portion 77 of the top plate portion 75 communicates with the chamber 30 via the connecting pipe 78, the exhaust device that evacuates the chamber 30 from the partial space SP2. (The illustration is omitted).

  Next, as shown in FIGS. 7 and 15, the communication between the outside of the load lock chamber 31 and the inside of the load lock chamber 31 is blocked, and the communication between the load lock chamber 32 and the chamber 30 is blocked (step S2). .

  In this step S2, as shown in FIG. 7, the stocker 33 is disposed at the position PS1 inside the load lock chamber 31, and the communication between the load lock chamber 31 and the chamber 30 is blocked by the flange 71. By closing 41, communication between the outside of the load lock chamber 31 and the inside of the load lock chamber 31 is blocked. Further, the wafer is not carried in / out by the atmospheric transfer robot 35.

  In step S2, as shown in FIG. 7, the stocker 34 is lowered by the elevating device 34c while the inside of each of the load lock chamber 32 and the chamber 30 is evacuated, and the inside of the load lock chamber 32 The communication between the load lock chamber 32 and the chamber 30 is blocked by the flange 81. Further, the communication between the chamber 30 and the sample chamber 2 is blocked by closing the gate valve 40. Further, the wafer is not carried in / out by the vacuum transfer robot 36 (see FIG. 2).

  Specifically, for example, as shown in FIG. 15, the stocker 34 is moved to a position PS3 inside the load lock chamber 32, the valves 55, 65 and 66 are closed, and the valve 57 is closed while the valve 56 is opened. . As a result, the evacuation of the load lock chamber 32 that is disconnected from the chamber 30 is temporarily stopped, but the inside of the load lock chamber 32 can be maintained in the evacuated state, and the gate valve 41 ( By closing (see FIG. 7), communication between the outside of the load lock chamber 31 and the inside of the load lock chamber 31 can be blocked.

  Note that the partial space SP2 can be evacuated similarly to step S1. In addition, since the partial space SP4 between the flange 82 and the protruding portion 87 of the bottom plate portion 85 communicates with the chamber 30 via the connecting pipe 88, the exhaust device ( The vacuum evacuation can be performed by (not shown).

  Next, as shown in FIGS. 8 and 16, the load lock chamber 31 and the load lock chamber 32 are communicated with each other (step S3).

  In this step S3, as shown in FIG. 8, the stocker 33 is disposed at the position PS1 inside the load lock chamber 31, the communication between the load lock chamber 31 and the chamber 30 is blocked by the flange 71, and the stocker 34 is loaded. The load lock chamber 31 and the load lock chamber 32 are connected to each other in a state where the load lock chamber 32 and the chamber 30 are disconnected from each other by the flange 81.

  Specifically, as shown in FIG. 16, for example, the valves 57, 65 and 66 are closed, and the valve 56 is opened while the valve 56 is opened, whereby the load lock chamber 31 and the load lock chamber 32 are exhausted. The pipes 53 and 54 are communicated with each other.

  As a result, the pressure P1 inside the load lock chamber 32 (partial space SP3) can be slightly increased preliminarily before returning to the atmospheric pressure, so step S4 described with reference to FIGS. 9 and 17 described later. Thus, for example, by reducing the amount of gas supplied from the supply source 62, the load lock chamber 32 can be efficiently opened to the atmosphere. In FIG. 8 and FIG. 16, the portions (partial spaces SP1 and SP3) having a pressure P1 that has been slightly increased preliminarily before returning to atmospheric pressure in the space inside the load lock chambers 31 and 32 are evacuated. The hatching having a larger interval than the hatching attached to the space inside the chamber 30 having the pressure P2 in the state is shown.

  In step S3, as in step S2, the partial space SP2 is communicated with the chamber 30 via the connection pipe 78, and the partial space SP4 is communicated with the chamber 30 via the connection pipe 88. SP4 can be evacuated.

  Next, as shown in FIGS. 9 and 17, the load lock chamber 31 is evacuated and the pressure inside the load lock chamber 32 is returned to atmospheric pressure (step S4).

  In step S4, as shown in FIG. 9, the stocker 33 is disposed at the position PS1 inside the load lock chamber 31, and the load lock chamber 31 and the chamber 30 are disconnected from each other by the flange 71. The chamber 31 is evacuated.

  In step S4, as shown in FIG. 9, the stocker 34 is disposed at the position PS3 inside the load lock chamber 32, and the communication between the load lock chamber 32 and the chamber 30 is blocked by the flange 81. The pressure inside the lock chamber 32 is returned to atmospheric pressure.

  Specifically, for example, as shown in FIG. 17, with the valve 65 closed and the valve 55 open, the valve 56 is closed and the valves 57 and 66 are opened. As a result, the partial space SP1 formed on the side of the stocker 33 in the space inside the load lock chamber 31 is evacuated and formed on the side of the stocker 34 in the space inside the load lock chamber 32. The gas in the partial space SP3 can be returned to atmospheric pressure by supplying gas to the partial space SP3 through the supply pipe 64 from the supply source 62.

  In step S4, as in step S2, the partial space SP2 is communicated with the chamber 30 via the connection pipe 78, and the partial space SP4 is communicated with the chamber 30 via the connection pipe 88. SP4 can be evacuated.

  In step S4, when the valve 56 is closed and the valves 57 and 66 are opened while the valve 55 is open, if the valves 57 and 66 are opened before the valve 56 is closed, gas is supplied to the load lock chamber 32. In such a state, the load lock chamber 32 may be evacuated. Therefore, in step S4, when the valve 55 is opened and the valve 56 is closed and the valves 57 and 66 are opened, it is preferable to close the valve 56 and then open the valves 57 and 66.

  Next, as shown in FIGS. 10 and 18, the wafer is loaded and unloaded between the stocker 33 and the sample chamber 2, the load lock chamber 32 is opened to the atmosphere, and the outside of the load lock chamber 32 opened to the atmosphere is opened. A wafer is carried into and out of the stocker 34 (step S5).

  In step S5, as shown in FIG. 10, the load lock chamber 31 is communicated with the chamber 30 in a state where each of the load lock chamber 31 and the chamber 30 is evacuated, and the stocker 33 is moved by the lifting device 33c. It is lowered and placed at a position PS 2 inside the chamber 30. Then, the wafer is carried in and out of the stocker 33 by the vacuum transfer robot 36 (see FIG. 2). Further, by opening the gate valve 40, the wafer is carried in and out between the stocker 33 and the sample chamber 2 by the vacuum transfer robot 36 (see FIG. 2) in a state where the chamber 30 is in communication with the sample chamber 2. 10 and 18 show a state in which the wafer W3 is loaded into the stocker 33 after performing Step S5.

  In step S5, as shown in FIG. 10, the stocker 34 is disposed at the position PS3 inside the load lock chamber 32, and the communication between the load lock chamber 32 and the chamber 30 is blocked by the flange 81, so that the load lock chamber 32 In the state where the pressure inside 32 is atmospheric pressure, the inside of the load lock chamber 32 is opened to the atmosphere by opening the gate valve 42. Then, the wafer is carried in and out between the outside of the load lock chamber 32 opened to the atmosphere and the stocker 34 by the atmospheric transfer robot 35. 10 and 18 show a state in which the wafer W4 is loaded into the stocker 34 after step S5 is performed.

  Specifically, for example, as shown in FIG. 18, the valves 56 and 65 are closed, and the valves 66 are closed with the valves 55 and 57 open. Thereby, in a state where the load lock chamber 31 is evacuated, the inside of the load lock chamber 32 can be opened to the atmosphere, and the gate valve 42 (see FIG. 10) can be opened.

  In addition, since the partial space SP4 between the flange 82 and the protruding portion 87 of the bottom plate portion 85 communicates with the chamber 30 via the connecting pipe 88, the partial space SP4 is evacuated to evacuate the chamber 30 ( The vacuum evacuation can be performed by (not shown).

  Next, as shown in FIG. 11, the communication between the load lock chamber 31 and the chamber 30 is blocked, and the communication between the outside of the load lock chamber 32 and the inside of the load lock chamber 32 is blocked (step S6).

  In this step S6, as shown in FIG. 11, the stocker 33 is raised by the elevating device 33c while the inside of each of the load lock chamber 31 and the chamber 30 is evacuated, and the inside of the load lock chamber 31 is It is arranged at the position PS1 and the communication between the load lock chamber 31 and the chamber 30 is blocked by the flange 71. Further, the communication between the chamber 30 and the sample chamber 2 is blocked by closing the gate valve 40. Further, the wafer is not carried in / out by the vacuum transfer robot 36 (see FIG. 2).

  In step S6, as shown in FIG. 11, the stocker 34 is disposed at the position PS3 inside the load lock chamber 32, and the communication between the load lock chamber 32 and the chamber 30 is blocked by the flange 81. By closing the valve 42, communication between the outside of the load lock chamber 32 and the inside of the load lock chamber 32 is blocked. Further, the wafer is not carried in / out by the atmospheric transfer robot 35.

  Next, as shown in FIG. 12, the load lock chamber 31 and the load lock chamber 32 are communicated with each other (step S7).

  In step S7, as shown in FIG. 12, the stocker 33 is disposed at the position PS1 inside the load lock chamber 31, the communication between the load lock chamber 31 and the chamber 30 is blocked by the flange 71, and the stocker 34 is loaded. The load lock chamber 31 and the load lock chamber 32 are connected to each other in a state where the load lock chamber 32 and the chamber 30 are disconnected from each other by the flange 81.

  As a result, as in step S3, the pressure P3 inside the load lock chamber 31 (corresponding to the partial space SP1 in FIG. 5) can be slightly increased preliminarily before returning to atmospheric pressure. In step S8 described using FIG. 13, for example, the supply amount of gas supplied from the supply source 61 (see FIG. 5) can be reduced, and thus the load lock chamber 31 can be efficiently released to the atmosphere. In FIG. 12, a portion of the space inside the load lock chambers 31 and 32 having a pressure P3 slightly increased before returning to atmospheric pressure (corresponding to the partial spaces SP1 and SP3 in FIG. 5) is vacuumed. A hatching having a wider interval than the hatching attached to the space inside the chamber 30 having the pressure P4 in the exhausted state is shown.

  Next, as shown in FIG. 13, the pressure inside the load lock chamber 31 is returned to atmospheric pressure, and the load lock chamber 32 is evacuated (step S8).

  In step S8, as shown in FIG. 13, the stocker 33 is disposed at the position PS1 inside the load lock chamber 31, and the communication between the load lock chamber 31 and the chamber 30 is blocked by the flange 71. The pressure inside the chamber 31 is returned to atmospheric pressure.

  In step S8, as shown in FIG. 13, the stocker 34 is disposed at the position PS3 inside the load lock chamber 32, and the load 81 is disconnected from the load lock chamber 32 by the flange 81. The lock chamber 32 is evacuated.

  After performing Step S8, it is possible to return to Step S1 and perform Step S1. In this way, the wafer transfer method using the wafer transfer system according to the present embodiment can be performed by repeatedly repeating steps S1 to S8.

  In the wafer transfer method using the wafer transfer system of the present embodiment, one of the load lock chambers 31 and 32 is evacuated while the inside of the chamber 30 is evacuated. By performing such an operation, one of the load lock chambers 31 and 32 that has been evacuated and the chamber 30 that has been evacuated can communicate with each other. It can be moved into the chamber 30.

  Further, in the wafer transfer method using the wafer transfer system of the present embodiment, when the inside of one of the load lock chambers 31 and 32 is evacuated, the other of the load lock chambers 31 and 32 is exposed to the atmosphere. Open. By performing such an operation, when one of the load lock chambers 31 and 32 is evacuated and communicated with the evacuated chamber 30, the other of the load lock chambers 31 and 32 is kept in the atmosphere. The wafer can be carried in and out from the outside. That is, in the present embodiment, one of the load lock chambers 31 and 32 is used for loading / unloading a wafer (wafer transfer) in a vacuum exhausted state (under vacuum), and the other of the load lock chambers 31 and 32 is used. Is used for loading / unloading wafers (under atmospheric pressure) to / from the outside of the load lock chambers 31 and 32. Therefore, the transfer time per wafer in the wafer transfer system can be shortened, and the number of wafers transferred per unit time, that is, the throughput can be improved.

  In addition, when one of the load lock chambers 31 and 32 is evacuated, the load lock chambers 31 and 32 are opened to the atmosphere so that the load lock is performed at a timing different from the wafer inspection in the sample chamber. The chamber can be evacuated and released to the atmosphere at the same time. Therefore, when the wafer is inspected, vibrations generated by evacuation can be prevented from being applied to the sample chamber.

<Throughput improvement effect>
Next, the effect of improving the number of wafers transferred per unit time by the wafer transfer system of this embodiment, that is, the throughput will be described.

  First, an example of the wafer transfer system of the present embodiment is referred to as an example. On the other hand, as described in Patent Document 1, for example, a load lock chamber is provided at a side of a chamber in which a vacuum transfer robot is provided, and a stocker capable of moving up and down is formed in the load lock chamber. An example of a wafer transfer system is referred to as a comparative example.

  In the following, with respect to the example and the comparative example, the time required for each of the wafer conveyance and the wafer inspection when performing the wafer conveyance and the wafer inspection for ten wafers under a certain same condition is as follows. Was measured and converted into the required time per wafer. Table 1 shows the results of measurement and conversion.

  As shown in Table 1, with respect to the time required for 10 wafers, in the comparative example, the time required to transfer 10 wafers was 3000 seconds, whereas in the example, 10 wafers were transferred. The time required to do this was 1530 seconds. That is, in the comparative example, the time required to transfer one wafer was 300 seconds, whereas in the example, the time required to transfer one wafer was 153 seconds. 147 seconds per wafer could be reduced compared to

  Further, as shown in Table 1, regarding the time required for 10 wafers, in the comparative example, the total time required for transporting and inspecting 10 wafers was 6000 seconds, whereas in the example, 10 wafers were required. The total time required to transport and inspect a single wafer was 4530 seconds. That is, in the comparative example, the total time required for transporting and inspecting one wafer was 600 seconds, whereas in the example, the total time required for transporting and inspecting one wafer was 453. The time was 147 seconds per wafer compared to the comparative example.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  Further, the above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to one having all the configurations described. For example, part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. . Moreover, you may add, delete, and replace another structure about a part of structure of each embodiment.

  DESCRIPTION OF SYMBOLS 1 ... Electro-optic lens barrel, 2 ... Sample chamber, 2a ... Chamber stand, 3 ... Electron gun, 4 ... Condensing lens, 5 ... Deflector, 6 ... High-voltage control apparatus, 7 ... Objective lens, 8 ... Secondary electron detector , 9 pedestal, 10 XY stage, 11 electrostatic chuck, 12 wafer transfer system, 13 lens control device, 14 control computer, 15 imaging device, 16 deflection control device, 17 XY stage control Device 18 ... Operation computer 19 ... Laser interferometer 19a Reference mirror 19b Measurement mirror 19c Trajectory 20 Stage position measuring device 21 Accelerometer 22 Acceleration signal processor 30 Chamber 31, 32 ... Load lock chamber, 33 ... Stocker, 33a ... Motor, 33b ... Ball screw, 33c ... Lifting device, 34 ... Stocker, 34a ... Motor, 3 b ... Ball screw, 34c ... Lifting device, 35 ... Atmospheric transfer robot, 35a ... Base, 35b ... Arm, 35c ... Hand, 36 ... Vacuum transfer robot, 36a ... Base, 36c ... Hand, 37 ... Aligner, 38 ... Load port 38a ... stocker, 39 ... load port, 40-42 ... gate valve, 43 ... main unit, 44 ... atmospheric transfer unit, 50 ... vacuum exhaust part, 51 ... exhaust device, 52-54 ... exhaust pipe, 55-57 ... Valve, 58 ... Connection part, 60 ... Air release part, 61, 62 ... Supply source, 63, 64 ... Supply pipe, 65, 66 ... Valve, 71 ... Flange, 71a ... Gutter part, 71b ... Seal, 72 ... Flange, 72a ... edge portion, 72b ... seal, 73 ... top plate portion, 74 ... through hole, 75 ... top plate portion, 76 ... peripheral portion, 77 ... projection portion, 78 ... connecting pipe, 81 ... flange, 8 a ... collar part, 81b ... seal, 82 ... flange, 82a ... edge part, 82b ... seal, 83 ... bottom plate part, 84 ... through hole, 85 ... bottom plate part, 86 ... peripheral edge part, 87 ... projecting part, 88 ... connection Tube, P1-P4 ... Pressure, PS1-PS4 ... Position, SP1-SP4 ... Partial space, W, W1-W4 ... Wafer.

Claims (5)

A chamber that can be evacuated inside,
A first load lock chamber provided above the chamber, connected to the chamber so as to be able to communicate with or shut off, and capable of being evacuated inside;
A second load lock chamber provided below the chamber, connected to the chamber so as to be able to communicate with or shut off, and capable of being evacuated inside;
A first accommodating portion that is provided to be movable up and down between a first position inside the first load lock chamber and a second position inside the chamber, and that accommodates one or more first substrates. When,
A second accommodating portion that is provided to be movable up and down between a third position inside the second load lock chamber and a fourth position inside the chamber, and that accommodates one or more second substrates. When,
A first substrate loading / unloading portion that is provided outside the chamber, and loads and unloads the first substrate between the outside of the first load lock chamber and the first accommodating portion disposed at the first position;
A second substrate loading / unloading unit that is provided outside the chamber and loads / unloads the second substrate between the outside of the second load lock chamber and the second accommodating unit disposed at the third position;
The first substrate is loaded into and unloaded from the first housing portion provided in the chamber and disposed at the second position, and the first substrate is disposed at the fourth position. A third substrate loading / unloading unit for loading / unloading two substrates;
A substrate transfer system. The substrate transfer system according to claim 1,
A substrate transfer system, comprising: a vacuum evacuation unit configured to evacuate one of the first load lock chamber and the second load lock chamber in a state where the inside of the chamber is evacuated. The substrate transfer system according to claim 2,
When the evacuation unit evacuates one of the first load lock chamber and the second load lock chamber, the other of the first load lock chamber and the second load lock chamber is evacuated. A substrate transfer system having an air release part that opens to the atmosphere. In the board | substrate conveyance system as described in any one of Claims 1 thru | or 3,
A substrate transfer system provided outside the chamber, and having a connecting portion that connects the inside of the first load lock chamber and the inside of the second load lock chamber so as to be able to communicate or be blocked. The substrate transfer system according to any one of claims 1 to 4,
A first blocking portion provided at a lower portion of the first receiving portion and blocking communication between the first load lock chamber and the chamber when the first receiving portion is disposed at the first position;
Provided above the first housing portion and when the first housing portion is arranged at the first position, formed above the first housing portion and laterally from the first housing portion. A first partial space forming part that forms a second partial space blocked from the first partial space to be
A second blocking portion provided on an upper portion of the second receiving portion and blocking communication between the second load lock chamber and the chamber when the second receiving portion is disposed at the third position;
Provided below the second housing portion, and when the second housing portion is disposed at the third position, formed below the second housing portion and lateral to the second housing portion. A second partial space forming part that forms a fourth partial space blocked from the third partial space to be
A substrate transfer system.

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