JP2019165048A - Stretchable wiring board and manufacturing method of the same - Google Patents

Abstract

An elastic wiring board having a smooth main surface is provided. An elastic wiring board (10) includes a hot melt layer (30), a conductor (60) supported by the hot melt layer (30), and an overcoat layer (70) covering at least a part of the conductor (60). 60 has a wiring portion 61 covered with an overcoat layer and a connection portion 62 exposed from the overcoat layer 70, and an exposed surface 622 of the connection portion 62 from the overcoat layer 70 It is flush with the surface 702 of the layer 70. [Selection] Fig. 3

Description

  The present invention relates to a stretchable wiring board and a method for producing a stretchable wiring board.

  Wearable devices and medical devices are provided on clothes and appliances, and sensing and monitoring are performed when the user wears these clothes and appliances. Therefore, an elastic wiring board that can expand and contract following the movement of the human body is used for these devices. As such a stretchable wiring board, a stretchable sheet-like stretchable base material, a stretchable wiring portion formed on at least one side of the main surface of the stretchable base material, and an external terminal connected to the wiring portion (For example, refer to Patent Document 1).

JP 2017-34038 A

  However, the unevenness of the main surface of the stretchable wiring board is increased due to the level difference caused by the wiring part protruding from the main surface of the stretchable base material and the external terminal, and the user of wearable devices etc. feels strange or uneven There was a problem of being caught.

  The problem to be solved by the present invention is to provide a stretchable wiring board having a smooth main surface.

[1] A stretchable wiring board according to the present invention includes a hot melt layer, an overcoat layer, and a conductor portion at least partially interposed between the hot melt layer and the overcoat layer, and the conductor A wiring part covered with the overcoat layer, and a connection part exposed from the overcoat layer, and an exposed surface of the connection part from the overcoat layer is the overcoat layer It is characterized by being flush with the surface.

[2] In the above invention, the stretchable wiring board includes a reinforcing material interposed between the hot melt layer and the conductor portion, and the reinforcing material is seen from the thickness direction of the conductor portion. You may arrange | position so that it may overlap with at least one part of a connection part.

[3] In the above invention, the reinforcing material may be embedded in the hot melt layer.

[4] In the above invention, the stretchable wiring board may include a primer layer interposed between the hot melt layer and the conductor portion.

[5] In the above invention, the stretchable wiring board may include a fabric to which the hot melt layer is attached.

[6] A method for manufacturing a stretchable wiring board according to the present invention is the above-described method for manufacturing a stretchable wiring board, the first step of preparing a release film, and the overcoat layer on the release film. A second step of forming the connecting portion of the conductor portion on the release film, and a fourth step of forming the wiring portion of the conductor portion on the overcoat layer. And a fifth step of forming the hot melt layer.

[7] The method for producing a stretchable wiring board of the present invention may include a sixth step of attaching a fabric to the hot melt layer and a seventh step of peeling the release film.

  According to the present invention, since the exposed surface of the connection portion and the surface of the overcoat layer are flush with each other, the unevenness of the main surface of the stretchable wiring board can be reduced.

FIG. 1 is a perspective view showing a stretchable wiring board according to an embodiment of the present invention. FIG. 2 is a plan view showing the stretchable wiring board according to the embodiment of the present invention. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a plan view showing the stretchable substrate according to the embodiment of the present invention. 5A is a cross-sectional view taken along line VA-VA in FIG. 4, and FIG. 5B is a cross-sectional view taken along line VB-VB in FIG. FIG. 6 is a process diagram showing a method for manufacturing a stretchable wiring board according to an embodiment of the present invention. FIG. 7A to FIG. 7H are cross-sectional views showing each step of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 is a perspective view showing a stretchable wiring board according to the present embodiment, FIG. 2 is a plan view showing the stretchable wiring board according to the present embodiment, FIG. 3 is a cross-sectional view taken along line III-III, and FIG. FIG. 5A is a cross-sectional view taken along line VA-VA in FIG. 4, and FIG. 5B is a cross-sectional view taken along line VB-VB in FIG. It is.

  The stretchable wiring board 10 shown in FIGS. 1 and 2 is used, for example, in a place where stretchability is required in a wearable device such as a biosensor or a medical device such as a biometric information monitor. Since the wearable device and the medical device are provided in clothes and appliances, the stretchable wiring board 10 needs to sufficiently follow the bending of the human body. The use of the stretchable wiring board 10 is not particularly limited as long as stretchability is required.

  As shown in the cross-sectional view of FIG. 3, the stretchable wiring board 10 of the present embodiment includes a fabric 20, a hot melt layer 30, a reinforcing material 40, a primer layer 50, a conductor portion 60, and an overcoat layer 70. And. The “stretchable wiring board 10” in the present embodiment corresponds to the “stretchable wiring board” in the present invention, the “fabric 20” in the present embodiment corresponds to the “fabric” in the present invention, and the “hot” in the present embodiment. The “melt layer 30” corresponds to the “hot melt layer” in the present invention, the “reinforcing material 40” in the present embodiment corresponds to the “reinforcing material” in the present invention, and the “primer layer 50” in the present embodiment corresponds to the present invention. The “conductor portion 60” in the present embodiment corresponds to the “conductor portion” in the present invention, and the “overcoat layer 70” in the present embodiment corresponds to the “overcoat layer” in the present invention. Equivalent to.

The fabric 20 is an object to which the hot melt layer 30 is attached, and is a fabric portion of clothes or an appliance provided with a wearable device or the like. The fabric 20 is composed of a woven fabric (fabric) composed of a plurality of fibers. More specifically, as shown in FIG. 4, the first fiber bundle 21 and the second fiber bundle 21 intersect each other. The fiber bundle 22 is used. In FIG. 4, only the stretchable base material portion composed of the fabric 20 and the hot melt layer 30 is extracted and shown. The first fiber bundle 21 is configured by assembling one or two or more first fibers 211. First fiber bundle 21 extends in the Y direction of the drawing direction D ₁ which is inclined with respect to (stretching planned direction of stretch wiring board 10) _{(hereinafter,} also the first direction D ₁ refers.), A plurality The first fiber bundles 21 are arranged in parallel in a direction D ₂ (hereinafter also referred to as a _second direction D ₂ ) that intersects the first direction D ₁ . The second fiber bundle 22 is configured by assembling one or more second fibers 221. The second fiber bundle 22 extends in the second direction D _2, the plurality of second fiber bundles 22 is parallel to the first direction D _1. The fabric 20 is configured by weaving a plurality of first fiber bundles 21 and a plurality of second fiber bundles 22 so as to cross each other in plan view.

  As the first fiber 211 and the second fiber 221, for example, rayon, nylon, polyester, acrylic, polyurethane, vinylon, polyethylene, Nafion (registered trademark), aramid, cotton, or the like can be used. The first fibers 211 and the second fibers 221 may have stretchability. The first fibers 211 and the second fibers 221 may be the same or different from each other. Moreover, the quantity of the 1st fiber 211 and the quantity of the 2nd fiber 221 may mutually be the same, and may differ.

  In plan view, a rectangular gap 23 is formed between the first fiber bundle 21 and the second fiber bundle 22 that intersect each other. The gap 23 is defined by the first fiber bundles 21 and 21 adjacent to each other and the second fiber bundles 22 and 22 adjacent to each other in a plan view.

  The gap 23 opens on one main surface 201 of the fabric 20 and also opens on the other main surface 202 of the fabric 20 (see FIGS. 5A and 5B). The main surface 201 communicates with the other main surface 202. The gap 23 does not have to extend straight along the thickness direction of the fabric 20, and may be open at both the main surfaces 201 and 202 and communicate with both the main surfaces 201 and 202. . The gap 23 is deformed in accordance with the deformation of the stretchable wiring board 10, thereby exhibiting stretchability as the entire fabric 20.

The Young's modulus E _f of the fabric 20 is preferably 0.1 to 35 MPa (0.1 MPa ≦ E _f ≦ 35 MPa). The breaking elongation _Bf of the fabric 20 is preferably 50% or more ( _Bf ≧ 50%). The “elongation at break” means the elongation percentage of the material up to the breaking point with respect to the natural length. Further, the thickness T _f of the fabric 20 is preferably 20 to 300 μm (20 μm ≦ T _f ≦ 300 μm).

  1 to 4, the overall shape of the fabric 20 is rectangular, but is not particularly limited thereto. The overall shape of the fabric 20 varies depending on the shape of the clothes or the brace on which the wearable device is provided.

  As shown in FIG. 3, the hot melt layer 30 is affixed to the main surface 201 of the fabric 20 and is formed on the fabric 20. As shown in FIGS. 5A and 5B, the hot melt layer 30 is in close contact with the first fibers 211 and the second fibers 221 located on the main surface 201 of the fabric 20. The first fibers 211 constituting the first fiber bundle 21 and the second fibers 221 constituting one second fiber bundle 22 are entered. The hot melt layer 30 is slightly impregnated in the vicinity of the surfaces of the first fiber 211 and the second fiber 221 that are in contact with each other, but the inside of the first fiber 211 and the second fiber 221 is impregnated. Absent. That is, in this embodiment, the hot melt layer 30 is not completely impregnated in the first fibers 211 and the second fibers 221.

  The hot melt layer 30 is formed in a bridge shape between the first fiber bundles 21 adjacent to each other through the gap 23. Similarly, the hot melt layer 30 is formed in a bridge shape between the adjacent second fiber bundles 22 with the gap 23 interposed therebetween. As a result, the hot melt layer 30 covers the gap 23 opened in the main surface 201 of the fabric 20. Further, the hot melt layer 30 does not enter the gap 23, and the gap 23 is not filled with the hot melt layer 30. The hot melt layer 30 may slightly enter the gap 23 in the vicinity of the opening of the gap 23 as long as it does not fill the gap 23.

  The hot melt layer 30 has stretchability, and a hot melt resin material such as polyester, polyurethane, acrylic, styrene butadiene rubber, or silicon can be used as a constituent material thereof.

  Returning to FIG. 3, the reinforcing member 40 is located between the hot melt layer 30 and the primer layer 50, and is embedded in the hot melt layer 30 in this embodiment. Further, the conductor portion 60 is located above the reinforcing member 40 with the primer layer 50 interposed therebetween. In other words, the reinforcing material 40 is interposed between the hot melt layer 30 and the conductor portion 60. The connecting portion 62 of the present embodiment corresponds to a “connecting portion” of the present invention.

  The reinforcing member 40 is disposed so as to overlap with the connecting portion 62 when viewed from the thickness direction of the conductor portion 60 (the Z direction in the drawing and also the thickness direction of the stretchable wiring board 10). The reinforcing member 40 arranged in this manner particularly reinforces the connecting portion 62. Since the connection portion 62 is connected to an external device and the like, stress is likely to be applied, but the reinforcement by the reinforcing member 40 can prevent the connection portion 62 from being damaged. Since the reinforcing material 40 is embedded in the hot melt layer 30, even if the reinforcing material 40 is arranged, there is no step in the stretchable wiring board 10, so the smoothness of both main surfaces of the stretchable wiring board 10 is improved. can do. Further, since the reinforcing material 40 is interposed between the hot melt layer 30 and the conductor portion 60, the reinforcing material 40 is disposed at a position close to the conductor portion 60, so that the connection portion 62 is reliably reinforced. be able to.

  Although it does not specifically limit as the reinforcing material 40, For example, an adhesive tape etc. can be used. Although it does not specifically limit as an adhesive tape, For example, what was provided with the acrylic adhesive layer in the main surface of the polyester film can be used, and a reinforcement material is affixed by sticking an acrylic adhesive layer to the primer layer 50. 40 is arranged.

  The primer layer 50 is provided on the hot melt layer 30 and the reinforcing material 40, and is interposed between the hot melt layer 30 and the conductor portion 60. The primer layer 50 covers the lower surface 601 and the side surface 602 of the conductor part 60, and the planar shape of the primer layer 50 is substantially the same as the planar shape of the conductor part 60. Furthermore, the primer layer 50 has elasticity like the fabric 20 and the like.

  The primer layer 50 functions as a buffer layer for preventing breakage of the conductor portion 60 when the stretchable wiring board 10 is extended, and also functions as a waterproof layer. Examples of the material constituting the primer layer 50 include polyester resin, polyurethane resin, acrylic resin, and silicon resin.

The Young's modulus E _p of the primer layer 50 is preferably equal to or less than the Young's modulus E _f of the fabric 20 (E _p ≦ E _f ), from the viewpoint of enhancing the function as a relaxation layer between the fabric 20 and the conductor portion 60. More preferably, the Young's modulus E _f of the fabric 20 is lower (E _p <E _f ). The Young's modulus _{E p} of such a primer layer 50 is preferably _{0.1~10MPa (0.1MPa ≦ E p ≦ 10MPa} ). As the elongation at break _{B p} of the primer layer 50, preferably 50% or more _{(B p} ≧ 50%). Further, the thickness T _p of the primer layer 50 is preferably 10 to 50 μm (10 μm ≦ T _P ≦ 50 μm).

  The conductor portion 60 is provided on the primer layer 50 and includes a wiring portion 61 covered with the overcoat layer 70 and a connection portion 62 exposed to the outside from the overcoat layer 70. That is, the wiring part 61 that is a part of the conductor part 60 is interposed between the hot melt layer 30 and the overcoat layer 70. The “wiring section 61” in the present embodiment corresponds to the “wiring section” in the present invention, and the “connecting section 62” in the present embodiment corresponds to the “connecting section” in the present invention.

  The wiring portion 61 is formed integrally with the connection portion 62 and electrically connects the plurality of connection portions 62 to each other. In the present embodiment, the wiring portion 61 has a single band-like planar shape as shown in FIGS. 1 and 2, but is not limited thereto. For example, the wiring part 61 may have an arbitrary pattern such as a branched planar shape according to the use of the stretchable wiring board 10.

  The connecting portion 62 has a convex protruding portion 621 protruding in a direction away from the hot melt layer 30, and the exposed surface 622 of the protruding portion 621 is exposed from the overcoat layer 70. The “exposed surface 622” in the present embodiment corresponds to the “exposed surface” in the present invention.

  Although this connection part 62 is not specifically limited, It can be used as a connection terminal with an electronic device, and the conduction | electrical_connection with an electronic device is ensured in the exposed surface 622. FIG. In the present embodiment, an example in which two connection portions 62 are provided is illustrated, but the present invention is not limited to this, and three or more connection portions 62 are provided depending on the use of the stretchable wiring board 10. May be.

  The conductor part 60 is configured by dispersing conductive particles in a binder and has elasticity. Here, since the binder contained in the conductor part 60 is made of a material having elasticity, the conductor part 60 is given elasticity, but it is preferable to use an elastomer as such a binder, For example, acrylic rubber, urethane rubber, nitrile rubber, silicone rubber, fluororubber, a composite of two or more of these can be used. As the conductive particles, a metal such as gold, silver, platinum, ruthenium, lead, tin, zinc, bismuth, or a metal material made of an alloy thereof, or a non-metallic material such as carbon can be used. The shape of the conductive particles is preferably a scaly or irregular shape.

  Note that the conductive particles contained in the protruding portion 621 and the conductive particles contained in the wiring portion 61 may be different depending on the application of the stretchable wiring board 10. For example, although not particularly limited, carbon may be used as the conductive particles included in the protruding portion 621 and silver may be used as the conductive particles included in the wiring portion 61.

The Young's modulus E _c of the conductor part 60 may be higher than the Young's modulus E _f of the fabric 20 (E _c > E _f ), or may be lower than the Young's modulus E _f of the fabric 20 (E _c < E _f ), which may be the same as the Young's modulus E _f of the fabric 20 (E _c = E _f ). In particular, the Young's modulus E _c of the conductor part 60 is preferably higher than the Young's modulus E _f of the fabric 20 (E _c > E _f ). The Young's modulus E _c of the conductor part 60 is preferably 10 to 200 MPa (10 MPa ≦ E _c ≦ 200 MPa). As the maximum elongation LE _c of the conductive portion 60, preferably from _{5~50% (5% ≦ LE c} ≦ 50%). As the elongation at break _{B c} of the conductive portion 60, preferably from _{10~100% (10% ≦ B c} ≦ 100%).

  The overcoat layer 70 is provided on the conductor part 60 and the primer layer 50, and protects the conductor part 60 by covering at least a part of the conductor part 60. Specifically, the upper surface of the wiring part 61 and the side surface of the protruding part 621 are covered with the overcoat layer 70. The overcoat layer 70 is formed with a hole 701 penetrating from one main surface to the other main surface, and a protrusion 621 is formed inside the hole 701.

  Further, the surface 702 of the overcoat layer 70 (the main surface not in contact with the conductor portion 60 of the overcoat layer 70) is flush with the exposed surface 622 of the connection portion 62. “Same surface” in the present invention means that the surface 702 of the overcoat layer 70 and the exposed surface 622 of the connecting portion 62 are located on the same plane, or the step size D is 5 μm or less. (0 μm ≦ D ≦ 5 μm). In particular, the step size D is more preferably 1 μm or less (0 μm ≦ D ≦ 1 μm).

  The overcoat layer 70 is preferably stretchable like the fabric 20. Examples of the material constituting the overcoat layer 70 include polyester, polyurethane, acrylic, and silicon.

The Young's modulus _{E o} of the overcoat layer 70, preferably higher than the Young's modulus _{E p} of the primer layer 50 _{(E o> E} p), and more preferably lower than the Young's modulus _{E c} of the conductor portion 60 ( E _o <E _c ). The Young's modulus E _o of such an overcoat layer 70 is preferably 5 to 100 MPa (5 MPa ≦ E _o ≦ 100 MPa). In addition, the maximum elongation LE _o of the overcoat layer 70 is preferably 10 to 50% (10% ≦ LE _o ≦ 50%). Further, the breaking elongation B _o of the overcoat layer 70 is preferably 50% or more (B _o ≧ 50%). The thickness _{T o} of the overcoat layer 70 is preferably _{10~20μm (10μm ≦ T o ≦ 20μm} ).

  Moreover, it is preferable that the material constituting the overcoat layer 70 and the material constituting the primer layer 50 are substantially the same material. In this case, the interface between the primer layer 50 and the overcoat layer 70 is slightly visible, and the primer layer 50 and the overcoat layer 70 are substantially integrated.

  Moreover, in order to improve waterproofness, you may affix a stretchable base material (not shown) on the overcoat layer 70 so that the boundary part of the overcoat layer 70 and the connection part 62 may be covered. As the stretchable base material, a resin material can be used, and the resin material preferably has waterproofness. The waterproof resin material is not particularly limited, and a seam tape can be used. Moreover, the below-mentioned release film 80 may be affixed on the overcoat layer 70 (refer FIG.7 (g)).

  The stretchable wiring board 10 of the present embodiment as described above has the following effects.

  In the stretchable wiring board 10 according to the present embodiment, since the surface 702 of the overcoat layer 70 and the exposed surface 622 of the connecting portion 62 are flush with each other, the user does not feel uncomfortable in a wearable device or the like. Unevenness on the surface of the stretchable wiring board 10 can be reduced.

  Further, the hot melt layer 30 exhibits fluidity when heated, for example, when it is attached to the fabric 20. The fluidity of the hot melt layer 30 can absorb the unevenness on the surface of the fabric 20 and can also absorb the level difference between the primer layer 50 and the reinforcing material 40. Therefore, the unevenness of the stretchable wiring board 10 as a whole. Can be reduced.

  Next, a method for manufacturing the stretchable wiring board according to the present embodiment will be described with reference to FIGS. 6 and 7A to 7H. FIG. 6 is a process diagram illustrating a method for manufacturing a stretchable wiring board according to the present embodiment. FIGS. 7A to 7H are diagrams showing each step of FIG. 6, and specifically, FIG. 7A is a cross-sectional view illustrating a step of preparing a release film. FIG. 7B is a cross-sectional view for explaining the process of forming the overcoat layer, FIG. 7C is a cross-sectional view for explaining the process of forming the conductor part, and FIG. 7D shows the primer layer. FIG. 7E is a cross-sectional view illustrating the step of forming the reinforcing material, and FIG. 7F is a cross-sectional view illustrating the step of forming the hot melt layer. FIG. 7 (g) is a cross-sectional view illustrating a process of attaching a fabric, and FIG. 7 (h) is a cross-sectional view illustrating a process of peeling the release film.

  As shown in FIG. 6, the method for manufacturing a stretchable wiring board according to this embodiment includes a step of preparing a release film (step S <b> 1), a step of forming an overcoat layer (step S <b> 2), and a conductor portion. Step (step S3), forming a primer layer (step S4), placing a reinforcing material (step S5), forming a hot melt layer (step S6), and pasting the fabric (Step S7) and a step of peeling the release film (Step S8).

  First, in step S1 of FIG. 6, a release film 80 is prepared as shown in FIG. 7 (a). The release film 80 is a resin film that has been subjected to a release treatment and is not particularly limited. For example, a release-treated PET film can be used as the release film 80. Step S1 in the present embodiment corresponds to the “first step” of the present invention.

  Next, in step S <b> 2 of FIG. 6, an overcoat layer 70 having a predetermined pattern is formed on one main surface of the release film 80 as shown in FIG. 7B. Here, a hole 701 in which the overcoat layer 70 is not formed on the release film 80 is also formed at the same time. The overcoat layer 70 is formed by applying the material constituting the overcoat layer 70 on the release film 80 and curing it. As the coating method, various coating methods such as a screen printing method, a spray coating method, a bar coating method, a dip method, and an ink jet method can be employed. As a curing method, irradiation with energy rays such as ultraviolet rays and infrared laser light, heating, heating / cooling, and drying can be employed. Step S2 in the present embodiment corresponds to a “second step” of the present invention.

  Next, in step S3 of FIG. 6, as shown in FIG. 7C, the conductor portion 60 is formed. At this time, the connection part 62 is formed inside the hole 701, and the wiring part 61 is formed on the overcoat layer 70. The conductor portion 60 is formed by applying a conductive paste to the inside of the hole 701 and the overcoat layer 70 and curing it. Specific examples of the conductive paste forming the conductor portion 60 include a conductive paste configured by mixing conductive particles, a binder, water or a solvent, and various additives. Examples of the solvent contained in the conductive paste include butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, dipropylene glycol monobutyl ether, diethylene glycol monoethyl ether, cyclohexanone, isophorone, and terpineol. As the coating method and the curing method, the same method as that used when forming the overcoat layer 70 can be used. Step S3 in the present embodiment corresponds to “a third step of forming a connecting portion on the release film” and “fourth step of forming a wiring portion on the overcoat layer” of the present invention. Thus, in the present embodiment, the “third step” and the “fourth step” of the present invention are performed simultaneously.

  Next, in step S4 of FIG. 6, the primer layer 50 is formed on the conductor portion 60 as shown in FIG. The primer layer 50 is formed by applying the resin material described above to the conductor portion 60 and curing it. As the coating method and the curing method, the same method as that used when forming the overcoat layer 70 can be used.

  Next, in step S <b> 5 of FIG. 6, the reinforcing material 40 is disposed on the primer layer 50 as shown in FIG. The reinforcing member 40 is disposed at a position overlapping the connecting portion 62 when viewed from the thickness direction of the conductor portion 60. Although it does not specifically limit, Specifically, the reinforcing material 40 is formed by sticking the adhesive layer of the said adhesive tape to the primer layer 50 using the above-mentioned adhesive tape.

  Next, in step S6 of FIG. 6, the hot melt layer 30 is formed on the reinforcing material 40 and the primer layer 50, as shown in FIG. The hot melt layer 30 can be formed by disposing the above-described thermoplastic hot melt adhesive on the reinforcing material 40 and the primer layer 50. At this time, the hot melt adhesive may be heated to form an arbitrary shape. Moreover, you may use a sheet-like hot-melt-type adhesive agent as this adhesive agent. Step S6 in the present embodiment corresponds to the “fifth step” of the present invention.

  Next, in step S <b> 7 of FIG. 6, as shown in FIG. 7G, the fabric 20 is attached to the hot melt layer 30. Although it does not specifically limit, Specifically, it affixes on the fabric 20 in the state softened by heating the hot-melt layer 30. FIG. Step S7 in the present embodiment corresponds to the “sixth step” of the present invention.

  Next, in step S8 of FIG. 6, the release film 80 is peeled from the stretchable wiring board 10 as shown in FIG. Step S8 in the present embodiment corresponds to the “seventh step” of the present invention. In addition, the timing which peels the release film 80 is not limited only after the fabric 20 is stuck. For example, the release film 80 may be peeled after the hot melt layer 30 is formed (after step S6 in FIG. 6) and before the fabric 20 is attached (before step S7 in FIG. 6).

  In the manufacturing method of the stretchable wiring board 10 according to the present embodiment, the smooth surface shape of the release film 80 is transferred to the exposed surface 622 of the connecting portion 62 and the surface 702 of the overcoat layer 70, so both surfaces In addition to being smooth, it is possible to suppress the occurrence of a step at the boundary between the two. As a result, the unevenness on the surface of the stretchable wiring board 10 can be reduced to such an extent that a user of a wearable device or the like does not feel uncomfortable.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention. For example, the primer layer 50 may be omitted if sufficient waterproofness can be secured. Further, when the strength of the connecting portion 62 can be sufficiently ensured, the reinforcing member 40 may not be provided.

  Moreover, the manufacturing method of the elastic wiring board 10 is not limited only to said embodiment, The order which implements a 2nd-7th process is not limited only to the order in said embodiment. For example, the third step may be performed before the second step. That is, the connection part 62 may be formed on the release film 80 before the overcoat layer 70 is formed, then the overcoat layer 70 may be formed, and then the wiring part 61 may be formed.

  Further, before forming the overcoat layer 70, a part of the connection part 62 is formed on the release film 80, and then the overcoat layer 70 is formed, and then the remaining part of the connection part 62 and the wiring part 61 may be formed simultaneously. For example, such a manufacturing method is used when a part of the connection part 62 includes conductive particles of a different type from the wiring part 61 and the remaining part of the connection part 62 includes conductive particles of the same type as the wiring part 61. be able to. More specifically, such a manufacturing method is used when a part of the connection part 62 contains carbon as conductive particles and the remaining part of the connection part 62 and the wiring part 61 contain silver as conductive particles. Can do.

DESCRIPTION OF SYMBOLS 10 ... Elastic wiring board 20 ... Fabric 21 ... 1st fiber bundle 22 ... 2nd fiber bundle 23 ... Gap
201 ... one main surface
202 ... The other main surface 30 ... Hot melt layer 40 ... Reinforcing material 50 ... Primer layer 60 ... Conductor part 61 ... Wiring part 62 ... Connection part
601 ... bottom surface
602 ... Side
621 ... Projection
622 ... exposed surface 70 ... overcoat layer 701 ... hole 702 ... surface 80 ... release film

Claims (7)

A hot melt layer;
An overcoat layer;
A conductor part at least partially interposed between the hot melt layer and the overcoat layer,
The conductor portion is
A wiring portion covered with the overcoat layer;
A connection part exposed from the overcoat layer,
The stretchable wiring board, wherein an exposed surface of the connection portion from the overcoat layer is flush with a surface of the overcoat layer. The stretchable wiring board according to claim 1,
The stretchable wiring board includes a reinforcing material interposed between the hot melt layer and the conductor portion,
The stretchable wiring board, wherein the reinforcing material is disposed so as to overlap with at least a part of the connection portion when viewed from the thickness direction of the conductor portion. The stretchable wiring board according to claim 2,
The reinforcing material is a stretchable wiring board embedded in the hot melt layer. The stretchable wiring board according to any one of claims 1 to 3,
The stretchable wiring board is a stretchable wiring board provided with a primer layer interposed between the hot melt layer and the conductor portion. The stretchable wiring board according to any one of claims 1 to 4,
The stretchable wiring board is a stretchable wiring board comprising a fabric to which the hot melt layer is attached. It is a manufacturing method of the elastic wiring board according to any one of claims 1 to 5,
A first step of preparing a release film;
A second step of forming the overcoat layer on the release film;
A third step of forming the connecting portion of the conductor portion on the release film;
A fourth step of forming the wiring portion of the conductor portion on the overcoat layer;
A fifth step of forming the hot melt layer;
A method for producing a stretchable wiring board comprising: It is a manufacturing method of the elastic wiring board according to claim 6,
A sixth step of attaching a fabric to the hot melt layer;
And a seventh step of peeling the release film.

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