JP2019162708A - Device and method for cutting thick-fried soy bean curd - Google Patents

Abstract

To provide a device for cutting a thick-fried soy bean curd capable of setting a mass of thick-fried soy bean curd in automatic machine cutting.SOLUTION: An device for cutting a thick-fried soy bean curd has a base 11, a work table 10, provided on the base, having a horizontal top face, keeping a thick-fried soy bean curd, and moved in a first direction, a work table moving device 12 provided between the base and the work table to move the work table in the first direction, a cutting device 30 for cutting a thick-fried soy bean curd, an insertion device 40, a discharge device 45 that discharges a cut thick-fried soy bean curd, and a control device, to cut a thick-fried soy bean curd, where the cutting device 30 is provided by keeping the work table spaced out from the thick-fried soy bean curd to move a cutting blade 20, on which ultrasonic waves are impressed, by reciprocation between a position above the thick-fried soy bean curd and a position close to the top face of the work table, thereby cutting the thick-fried soy bean curd.SELECTED DRAWING: Figure 1

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a deep-fried tofu cutting device and a cutting method thereof, and more particularly to a thick-fried tofu cutting device and a cutting method for cutting deep-fried tofu that is hard to cut on the surface and soft inside and easily collapses.

There are two types of deep-fried tofu that has been deep-fried tofu: oil-dried thinly cut tofu and oil-dried tofu that has been cut into relatively thick tofu. Of these, deep-fried tofu has a soft and soft tofu flavor inside, and the surface is soft and covered with thin skin, and has a different taste and texture than tofu and fried tofu. It was commonly eaten with food, boiled or baked with other foods.
In recent years, deep-fried tofu has attracted attention as a food ingredient for lunch as a well-balanced and inexpensive food containing abundant and high-quality proteins, fats and carbohydrates.

  However, in order to use deep-fried tofu as an ingredient for school lunch, the deep-fried tofu is cut into uniform shapes and sizes for each serving of the meal, and then divided into a serving for the user. Although it has to be provided, the deep-fried tofu is difficult to cut, so it was difficult to cut and provide it in an equal shape and size.

  The traditional method of cutting deep-fried tofu is to place the deep-fried tofu on a cutting board and quickly move the knife back and forth while supporting it so as not to lose its shape by attaching a finger near the cutting part. there were. However, it is difficult to cut a large amount of deep-fried tofu in such a manual work at the cooking site of lunch, and it is desirable from the food supplier to supply thick-fried tofu that has been cut to a certain size. It was.

In order to cut a large amount of deep-fried tofu, it is necessary to apply a push-cut (guillotine-type cutting) method in which thick deep-fried tofu is placed on a table and pressed from above to cut. However, when trying to push through deep-fried tofu, the entire skin often collapsed without breaking the epidermis.
In addition, the cut deep-fried tofu sometimes has the exposed side portion of the tofu side broken during transportation. This phenomenon is mainly caused by the collision between deep-fried tofu cut by vibration during transportation. If the deep-fried tofu is cut and packed tightly in its original shape, such collapse during transportation of the deep-fried tofu can be largely prevented, but the deep-fried tofu is kept in its original form continuously. An automatic device and method for cutting tofu and packing it in its original shape is not disclosed.

  In recent years, a method using ultrasonic vibration has been disclosed as a method for cutting foods that are difficult to cut. For example, Patent Document 1 discloses a cake cutting device. However, thick fried tofu has a special property, and an apparatus and a method for cutting the deep fried tofu into a desired shape using ultrasonic vibration are not disclosed. Moreover, the automatic apparatus and method which cut | disconnect thick fried tofu, maintaining the external shape before cutting | disconnection are not disclosed.

JP 2007-313611 A

  A first object of the present invention is to provide a cutting apparatus for deep-fried tofu that can automatically machine a large amount of deep-fried tofu. To do.

  Further, the method for cutting deep-fried tofu according to the present invention provides a method for cutting deep-fried tofu that can cut deep-fried tofu while maintaining the original external shape and package the original external shape. This is a second problem.

An apparatus for cutting thick fried tofu according to the present invention for solving such problems is a base, a work table moving device that is provided on the base and moves the work table in a first direction, and an upper surface of the work table moving device. A work table that has a horizontal upper surface and on which one or more thick fried tofu is placed and is moved in a first direction, a cutting device that cuts the one or more thick fried tofu, and one or more thicknesses An insertion device for placing the fried tofu in a predetermined position on the workbench such that either side of each of the one or more thick fried tofu has an angle of 90 degrees with the first direction; and the cut one or more thicknesses A discharge device that discharges the fried tofu, and a control device that controls the work table moving device, the cutting device, the insertion device, and the discharge device;
The cutting device is provided above the workbench with a space for placing the workbench and the one or more thick tofu pieces, the blade edge is at an angle of 90 degrees with the first direction, and the blade edge is directed vertically downward. A cutting blade to which ultrasonic waves are applied, an ultrasonic oscillation member that applies ultrasonic waves to the cutting blade, a cutting blade and an ultrasonic oscillation member that are provided on the base, and that has one or more cutting blades And a cutting blade vertical movement member that reciprocates between a position above the thick fried tofu and a position close to the upper surface of the workbench to cut one or more deep fried tofu.

A work table rotating device for rotating the work table by 90 degrees in a horizontal plane may be further interposed between the base and the work table.
It is preferable that the functions / operations of the work table, the work table moving device, the insertion device, and the discharge device are further executed in combination with an automatic conveyance device.

The apparatus for cutting thick tofu according to the present invention is provided on a base, a work table provided on the base, having a horizontal upper surface on which one or more thick tofu is placed, and the base. A cutting device moving device that moves the cutting device in the second direction, a cutting device that cuts the one or more thick tofu while being moved in the second direction, and the one or more thick fried tofu at a predetermined position on the work table. In addition, an insertion device for placing any one side of each of the one or more thick fried tofu so as to have an angle of 90 degrees with the second direction, a discharge device for discharging the cut one or more deep fried tofu, A control device for controlling the cutting device moving device, the cutting device, the inserting device, and the discharging device,
The cutting device is provided above the workbench with a space for placing the workbench and the one or more thick tofu pieces, the cutting edge forms an angle of 90 degrees with the first direction, and the cutting edge is directed vertically downward. And a cutting blade to which ultrasonic waves are applied, an ultrasonic oscillation member that applies ultrasonic waves to the cutting blade, a cutting blade and an ultrasonic oscillation member that are provided on the base, and are provided on the base. It has a cutting blade up-and-down moving member which reciprocates between the position above the above-mentioned thick fried tofu, and the position near the upper surface of a work table, and cuts one or more deep fried tofu.

A work table rotating device for rotating the work table by 90 degrees in a horizontal plane may be further interposed between the base and the work table.
It is preferable that cooking oil is applied to the surface of the work table as a lubricant.

The one or more deep-fried tofu can be accommodated in a deep-fried tofu storage member and placed or stopped on a work table.
The thick fried tofu containing member has a side wall lower than the height of the fried tofu, and a groove corresponding to the cutting position of the deep fried tofu is engraved on the bottom surface. A continuous notch is provided up to the upper edge of the side wall.

The ultrasonic wave may have a frequency of 15 to 100 kHz.
The apparatus for cutting the deep-fried tofu has an ultrasonic frequency, an ultrasonic intensity, a moving speed of the work table, a moving speed of the cutting blade, so as to cut while maintaining the original appearance shape of the deep-fried tofu, and It is preferred that one or more of the moving speeds of one or more fried tofu are adjusted.

  Moreover, the method of cutting the deep-fried tofu according to the present invention is a method of cutting one or more deep-fried tofu using the thick-fried tofu cutting device according to claim 1, wherein the control device controls the insertion device. Then, a positioning step in which any side surface of each of the one or more deep-fried tofu is positioned on the work table so as to form an angle of 90 degrees with the first direction in which the work table moves, and the work table movement The device and the cutting device are controlled, the work table is moved in the first direction and stopped at a predetermined position, and the cutting edge of the cutting blade is installed in a direction 90 degrees perpendicular to the first direction and vertically downward. Apply one or more operations to reciprocate the cutting blade between a position above the one or more deep-fried tofu and a position close to the upper surface of the workbench, and each of the one or more deep-fried tofu Cutting step of cutting into two or more parallel sections having a direction and a 90 degree cut surface Controls the discharge device, a discharge step of discharging sections of the cut thickness fried tofu, characterized in that it successively with a.

  Moreover, the method of cutting thick fried tofu according to another embodiment is a method of cutting one or more deep fried tofu using the thick fried tofu cutting device according to claim 2, wherein the control device includes an insertion device. A positioning step in which any one side surface of each of the one or more deep-fried tofu is positioned on the work table so as to form an angle of 90 degrees with the first direction in which the work table moves; By controlling the table moving device and the cutting device, the work table is moved in the first direction and stopped at a predetermined position, and the cutting edge of the cutting blade is installed in a direction 90 degrees and vertically downward with respect to the first direction. Apply one or more operations to reciprocate the cutting blade between the position above the one or more deep fried tofu and the position close to the top surface of the workbench, and apply each of the one or more deep fried tofu. Cut into two or more parallel sections with a second direction and a 90 degree cut surface A cutting step that controls the work table rotating device to rotate the work table by 90 degrees, and a work table moving device that controls the cut one or more deep fried tofu. 2 The positioning step, the work table moving device and the cutting device are controlled, the work table is moved in the first direction, stopped at a predetermined position, and the operation of reciprocating the cutting blade is performed at least once to be cut. A second cutting step of cutting each of the one or more deep-fried tofu into two or more rows of cut pieces having a cutting surface parallel to the first direction and 90 degrees; and controlling the discharge device to cut the deep-fried tofu And a discharging step of discharging tofu sequentially.

  Furthermore, the method for cutting the deep-fried tofu according to another embodiment is a method for cutting one or more deep-fried tofu using the thick-fried tofu cutting device according to claim 4, wherein A method of cutting one or more deep-fried tofu using the thick-fried tofu cutting device, wherein the control device controls the insertion device, and any one side surface of the one or more deep-fried tofu is a cutting device. A positioning step of positioning the head 90 degrees with the second direction in which it moves and placing it on the work table, and controlling the cutting device moving device and the cutting device to move the cutting device in the second direction. Stop at a predetermined position, place the cutting edge of the cutting blade 90 degrees in the second direction and vertically downward, apply ultrasonic waves, place the cutting blade above one or more deep-fried tofu and worktable One or more operations to reciprocate between the position close to the top surface The cutting process of cutting each of the one or more deep-fried tofu into two or more parallel sections having a cutting plane parallel to the second direction and 90 degrees, and the discharging device to control the cut deep-fried tofu And a discharging step of discharging the water in sequence.

  Furthermore, the method of cutting thick fried tofu according to another embodiment is a method of cutting one or more deep fried tofu using the thick fried tofu cutting device according to claim 5, wherein the control device is an insertion device. A positioning step in which any side surface of each of the one or more deep-fried tofu is positioned on the work table so as to form an angle of 90 degrees with the second direction in which the cutting device moves, and cutting By controlling the device moving device and the cutting device, the cutting device is moved in the second direction and stopped at a predetermined position, and the cutting edge of the cutting blade is installed 90 degrees in the second direction and vertically downward. Applying a sound wave, performing an operation of reciprocating the cutting blade between the position above the one or more thick fried tofu and the position close to the upper surface of the workbench one or more times, each of the one or more deep fried tofu In two or more parallel sections with a second direction and a 90 degree cut surface Cutting the cutting step, controlling the work table rotating device to rotate the work table by 90 degrees, and controlling the cutting device moving device to position the cut one or more deep fried tofu The second positioning step, the cutting device moving device and the cutting device are controlled, the cutting device is moved in the second direction and stopped at a predetermined position, and the operation of reciprocating the cutting blade is performed one or more times for cutting. In addition, a second cutting step of cutting each of the one or more deep-fried tofu pieces into two or more rows of cut pieces having a cutting plane parallel to the second direction and 90 degrees, and the discharge device was controlled to cut the tofu. And a discharge process for discharging the deep-fried tofu sequentially.

  The method of cutting the deep-fried tofu is characterized by adjusting the frequency and strength of the ultrasonic wave and the moving speed of the work table and the cutting blade so as to cut the deep-fried tofu while maintaining the original appearance shape. And

  In the deep-fried tofu cutting device of the present invention, since the ultrasonic vibration is applied to the cutting blade, the cutting blade is moved relative to the thick-fried tofu and the position above the deep-fried tofu and the position close to the work surface. Since the thick fried tofu can be continuously cut and cut (guillotine type) by an automatic device by reciprocating between the two, the cut deep fried tofu can be provided easily and in large quantities.

  Since the ultrasonic blade is applied to the cutting blade of the deep-fried tofu cutting device of the present invention, the deep-fried tofu is cut with a clean cross-section only by applying a slight force while the cutting blade is in contact with the surface of the deep-fried tofu. be able to. Therefore, it can be cut while keeping the original appearance of deep-fried tofu and packed and shipped in a compact manner while keeping the original shape. Can be prevented from colliding and collapsing.

It is a front view which shows the outline of the thick fried tofu cutting device of the 1st Embodiment of this invention. It is a side view which shows the outline of the deep-fried tofu cutting device of the 1st Embodiment of this invention. It is a perspective view which shows the cutting device of the 1st Embodiment of this invention. It is a perspective view of the principal part of the deep-fried tofu cutting device of the 1st Embodiment of this invention. It is an image which shows a mode that thick fried tofu is cut | disconnected using the thick fried tofu cutting device of the 1st Embodiment of this invention. It is a front view which shows the outline of the deep-fried tofu cutting device of the 2nd Embodiment of this invention. It is a perspective view which shows the state after completion | finish of the cutting process of 2nd Embodiment. It is a perspective view which shows the state which rotated the worktable rotation apparatus 90 degree | times after completion | finish of the cutting process of 2nd Embodiment. It is a front view which shows the outline of the deep-fried tofu cutting device of the 3rd Embodiment of this invention. It is a perspective view which shows the outline of the cutting device of the 3rd Embodiment of this invention. It is a front view which shows the outline of the deep-fried tofu cutting device of the 4th Embodiment of this invention. It is a perspective view which shows the container which accommodates the thick fried tofu of the modification of this invention. It is the image which packed the deep-fried tofu cut | disconnected using the deep-fried tofu cutting apparatus of this invention with the transparent resin bag.

Embodiments of the present invention will be described below in detail with reference to the drawings. This description is for explaining the present invention, and is not intended to limit the technical scope of the present invention. The present invention can be implemented with various modifications without departing from the technical scope of the present invention.
In addition, the same code | symbol was provided to the element which has the same effect | action function.

(First embodiment)
FIG. 1 is a front view showing an outline of a thick fried tofu cutting device according to a first embodiment of the present invention, and FIG. 2 is a side view thereof.
As shown in FIGS. 1 and 2, the deep-fried tofu cutting device 1 according to the first embodiment of the present invention includes a base 11, a work table 10, a work table moving device 12, and a cutting blade 20. 30, an insertion device 40, a discharge device 45, and a control device 50 (not shown) are preferably provided. In addition, what is shown with the code | symbol 2 is the deep fried tofu cut | disconnected.

  The work table 10 according to the first embodiment of the present invention is preferably provided close to the upper surface of the base 11, has a horizontal upper surface, and preferably has a space on which the deep-fried tofu 2 is placed. Further, the work table 10 places the thick fried tofu 2 in a predetermined position while sliding the upper surface using the insertion device 40, and the thick fried tofu cut using the discharge device 45 is placed on the upper surface of the work table 10. It is preferable that the upper surface of the work table 10 is made of a material that is deeply fried and slippery tofu so that it can be discharged while being slid. For example, a small amount of edible oil can be applied as a lubricant so that thick fried tofu is slippery. Furthermore, a positioning member for positioning the thick fried tofu at a predetermined position can be provided on the upper surface of the work table 10.

  In addition, the work table moving device 12 is interposed between the work table 10 and the base 11 to reciprocate the work table 10 along the first direction 7 and accurately stop at one or more positions. Is preferred. The form of the work table moving device 12 is not particularly limited as long as it can be used in the present invention. Such a moving device is known and can be configured by using a power device such as a step motor, a servo motor, or a linear motor.

Further, the insertion device 40 of the first embodiment is predetermined so that any side surface 3 of the thick fried tofu is at an angle of 90 degrees with the moving direction of the work table 10 (first direction 7). It is preferable that the device is placed at a position.
Furthermore, the discharge device 45 of the first embodiment can be a device that discharges the cut deep-fried tofu and transfers it to a packaging device not described, or can be part of a packaging device.

Moreover, it is preferable to provide the control apparatus 50 which is not illustrated in the thick fried tofu cutting device of 1st Embodiment. It is preferable that the control device 50 includes an input unit (not shown) and controls the work table moving device 12, the cutting device 30, the insertion device 40, and the discharge device 45 through a communication circuit (not shown) according to an input command.
Note that the functions and operations of the work table 10, the work table moving device 12, the insertion device 40, and the discharge device 45 according to the first embodiment of the present invention can be executed in combination with an automatic conveyance device.

FIG. 3 is a perspective view showing the cutting device according to the first embodiment of the present invention.
As shown in FIG. 3, the cutting device 30 can include a cutting blade 20, a cutting blade vertical movement member 23, and an ultrasonic oscillation member 21, and the cutting blade vertical movement member 23 is further provided with a cutting support blade member and 22. And the main pillar 24 may be included.

  The cutting blade 20 has a blade span that is long enough to push through the deep-fried tofu 2. The cutting blade 20 is provided above the work table 10 with a space for placing the deep-fried tofu between the work table 10 and the cutting blade 20. It is preferable. Here, it is preferable that the cutting blade 20 is installed at an angle of 90 degrees with the moving direction 7 (first direction) of the work table 10 and with the blade tip vertically downward.

Further, the cutting blade 20 can be connected to the cutting blade vertical movement member 23 via an ultrasonic oscillation member 21 that applies ultrasonic waves and a cutting blade support member 22.
It is preferable that the cutting blade vertical movement member 23 moves the cutting blade 20 in the vertical direction along the support column 24 in accordance with a control command from the control device 50.

FIG. 4 is a perspective view of a main part of the deep-fried tofu cutting device 1 according to the first embodiment of the present invention.
As shown in FIG. 4, it is preferable that the deep-fried tofu 2 is placed so that one of the side surfaces 3 has an angle of 90 degrees with the traveling direction of the work table (first direction 7).
FIG. 4 illustrates an example in which the insertion device 40 and the discharge device 45 are the same device, but the present invention is not limited to this.

In the thick fried tofu cutting method according to the first embodiment of the present invention, the control device 50 controls the insertion device 40 so that the tofu 2 is moved and the work table 10 is moved on any side surface 3 of the thick fried tofu. A positioning step of positioning the work table so as to form an angle of 90 degrees with one direction and placing it on the work table, and the work table moving device 12 and the cutting device 30 are controlled to move the work table 10 in the first direction 7. Stop at a predetermined position, place the cutting edge of the cutting blade 20 in the first direction 7 and 90 degrees and vertically downward, and apply ultrasonic waves to move the cutting blade 20 above the thick fried tofu 2 and work The operation of reciprocating between the position close to the upper surface of the table 10 is performed one or more times, cutting the deep-fried tofu into two or more pieces having parallel cutting surfaces, and controlling the discharge device And a discharging step of discharging the cut slices of deep-fried tofu. The features.
The deep-fried tofu can be 1 or more.

  In particular, the deep-fried tofu cutting device according to the present invention can cut the deep-fried tofu 2 while maintaining the original external shape of the deep-fried tofu 2, so that the deep-fried tofu that has been cut while maintaining the original external shape is restored to the original appearance. It is preferable to transfer to a packaging device while maintaining the shape. As such an apparatus, for example, as shown in FIG. 4, the discharging apparatus 45 may have a structure that surrounds at least three side surfaces excluding the direction in which the thick fried tofu is moved.

FIG. 5 is an image showing a state of cutting deep-fried tofu using the thick-fried tofu cutting device according to the first embodiment of the present invention.
As shown in FIG. 5, the deep-fried tofu cutting apparatus of the present invention adjusts one or more of the ultrasonic frequency, the ultrasonic intensity, the moving speed of the work table, and the moving speed of the cutting blade. It can be cut while keeping the original appearance of thick fried tofu.

(Second Embodiment)
FIG. 6: is a front view which shows the outline of the deep-fried tofu cutting device of the 2nd Embodiment of this invention.
As shown in FIG. 6, the deep-fried tofu cutting device 100 according to the second embodiment of the present invention includes a base 11, a work table 110, a work table moving device 12, a work table rotating device 13, and a cutting. The cutting device 30 provided with the blade 20, the insertion device 40, the discharge device 45, and a control device 50 (not shown) can be provided.

  Here, among the constituent elements of the second embodiment, the work table 110 is connected to the work table 10 of the first embodiment with a work table rotating member 13 that further rotates the work table 10 by 90 degrees in a horizontal plane. The other components are the same as those in the first embodiment. Moreover, the vertical arrangement | positioning of the worktable moving apparatus 12 and the worktable rotation apparatus 13 is arbitrary, and can also be comprised as an apparatus which united both.

  In the deep-fried tofu cutting method according to the second embodiment of the present invention, the control device 50 controls the insertion device 40 so that the deep-fried tofu 2 and any side surface 3 of the thick-fried tofu are in the first direction 7. A positioning step of positioning and mounting so as to form an angle of 90 degrees, and the work table moving device 12 is controlled to move the work table 110 in the first direction 7 and stop at a predetermined position to control the cutting device. Then, the cutting edge 20 is placed with the cutting edge 20 oriented in the first direction 7 and 90 degrees and vertically downward, ultrasonic vibration is applied, the cutting blade 20 is thickened, the position 5 above the tofu and the work table A cutting step in which the deep-fried tofu 2 is reciprocated once or more in parallel so as to have a cut surface of an angle of 90 degrees with respect to the first direction 7 by reciprocating once or more between the position 6 close to the upper surface. And can have.

FIG. 7 is a perspective view showing a state after the cutting process according to the second embodiment is finished, and FIG. 8 is a perspective view showing a state where the work table rotating device is rotated 90 degrees after the cutting process is finished.
As shown in FIG. 7, the control device 50 controls the cutting motion device 30 to perform a cutting process for cutting the deep-fried tofu 2, and then controls the work table rotation device 13 as shown in FIG. 8. A rotation process for rotating the work table 110 by 90 degrees can be performed.

Furthermore, the control device 50 controls the cutting device moving device 31 to control the second positioning step for positioning the cut deep-fried tofu and the cutting blade 20, and the work table moving device 12 and the cutting device 30. One or more operations of reciprocating the cutting blade 20 between the position 5 above the cut deep-fried tofu 2 and the position 6 close to the work table while moving the cutting device 30 in the first direction 7 And then cutting the deep-fried tofu into 2 × 2 rows or more of cut pieces having a cutting plane parallel to the first direction and 90 °, and the discharge device 45 to be cut. The discharging step of discharging the thick fried tofu can be performed, and the deep fried tofu 2 can be cut into an eyelet or a rectangular parallelepiped.
The deep-fried tofu can be 1 or more.

  That is, the deep-fried tofu cutting device 100 according to the second embodiment including the work table 110 is 90 degrees at the first direction 7 and 90 degrees in which the cut surface is the moving direction of the work table 10 by the thick-fried tofu cutting device 1 according to the first embodiment. The deep-fried tofu 2 cut in parallel so as to have the angle can be further rotated 90 degrees and cut once or more in parallel, and the deep-fried tofu 2 can be cut into an eyelet or a rectangular parallelepiped.

(Third embodiment)
FIG. 9 is a front view showing an outline of a thick fried tofu cutting device according to a third embodiment of the present invention.
As shown in FIG. 9, the deep-fried tofu cutting device 200 according to the third embodiment of the present invention includes a base 11, a work table 210, a cutting device 230 including a cutting blade 20, a cutting device moving device 31, and An insertion device 40, a discharge device 45, and a control device 50 (not shown) can be provided.
Among the components of the third embodiment, the cutting device 230 is movably provided by connecting a cutting device moving device 31 for moving the cutting device 30 to the cutting device 30 of the first embodiment. The work table 210 is fixed to the base 11, and other components can be the same as those in the first embodiment.

FIG. 10 is a perspective view schematically showing a cutting device according to the third embodiment of the present invention. As shown in FIG. 10, the cutting device 230 moves the cutting device 230 in the second direction 8. It can be installed close to the upper surface or the upper surface of the base 11 via
In the first embodiment of the present invention, the work table 10 is moved in the first direction by the work table moving device 12, and the cutting device 30 is fixed to the base 11. However, in the third embodiment, the work table 210 is It is fixed to the base 11 and is different from the first embodiment in that the cutting device 230 has a function of being connected to the cutting device moving device 31 and moving in the second direction 8.

  The cutting device moving device 31 reciprocally moves the cutting device 230 along the second direction 8 in accordance with the control command of the control device 50, and can accurately stop at one or more positions and has little vibration. The format is not particularly limited. Such a moving device is publicly known and can be configured by using a power device such as a step motor, a servo motor, a linear motor, etc., and thus detailed description thereof is omitted.

  In the deep-fried tofu cutting method according to the third embodiment of the present invention, the control device 50 controls the insertion device 40, and the side 3 of either deep-fried tofu is the direction in which the cutting device 230 moves. A positioning step of positioning the thick fried tofu 2 at a predetermined position by positioning it so as to form an angle of 90 degrees with the direction 8, and controlling the work table moving device 31 and the cutting device 230 to make the cutting device 230 the second The cutting blade 20 is moved to the direction 8 and stopped at a predetermined position, the cutting edge 20 is placed in the second direction 8 and 90 degrees and vertically downward, and an ultrasonic wave is applied to make the cutting blade 20 deep fried tofu 2 The operation of reciprocating between the position above the upper surface of the work table 210 and the position close to the upper surface of the work table 210 is performed one or more times, and the deep fried tofu 2 is cut into two or more having a cut surface parallel to the second direction by 90 degrees The cutting process of cutting into sections and the discharge device 45 are controlled to cut It characterized by having a a discharge step of discharging the thickness fried tofu that is. Note that the deep fried tofu can be one or more

(Fourth embodiment)
FIG. 11: is a front view which shows the outline of the deep-fried tofu cutting device of the 4th Embodiment of this invention.
As shown in FIG. 11, the deep-fried tofu cutting device 300 according to the fourth embodiment of the present invention includes a base 11, a work table 310, a cutting device 330 including the cutting blade 20, a cutting device moving device 31, and the like. The work table rotating device 13, the inserting device 40, the discharging device 45, and a control device 50 (not shown) are preferably provided.

  Among the components of the deep-fried tofu cutting device 300 according to the fourth embodiment of the present invention, the work table 310 is a work for causing the work table 210 according to the third embodiment to rotate the work table 210 by 90 degrees in a horizontal plane. The table rotation device 13 is connected, the cutting device 330 is the same as the cutting device 230 of the second embodiment, and other components can be the same as those of the third embodiment.

In the invention according to the fourth embodiment of the present invention, the control device 50 controls the insertion device 40 so that the side surface 3 of the deep-fried tofu 2 moves in the cutting device 330. Positioning step of positioning and mounting so as to form an angle of 90 degrees with
By controlling the cutting device moving device 31 and the cutting blade moving device 330, the cutting device 330 is moved in the second direction 8 and stopped at a predetermined position, and the cutting edge of the cutting blade 20 is moved in the second direction 7 and 90 degrees and Once installed vertically downward, an ultrasonic wave is applied to the cutting blade 20, and the cutting blade 20 is moved back and forth between the position above the tofu 2 and the position close to the upper surface of the work table 10 once. Performing the above, cutting the deep-fried tofu into two or more sections having a cut surface parallel to the second direction and 90 degrees, and controlling the discharge device 45 to discharge the cut deep-fried tofu And a discharging step.

  Further, in the invention according to the fourth embodiment of the present invention, the control device 50 controls the work table rotating device 13 to rotate the work table 310 by 90 degrees, and the cutting device moving device 31. The second alignment step of aligning the cut deep-fried tofu and the cutting blade 20 by controlling the cutting device 20, and then the control device 50 controls the cutting device moving device 31 and the cutting device 330 to control the cutting device. 330 is moved in the second direction 8 to stop at a predetermined position, the cutting edge of the cutting blade 20 is set in the second direction 8 and 90 degrees in the vertical downward direction, ultrasonic waves are applied, and the cutting blade 20 is moved. The operation of reciprocating between the position above the deep fried tofu 2 and the position close to the upper surface of the work table 10 is performed at least once, and the cut deep fried tofu is parallel to the second direction 8 and 90 degrees. Cutting process of cutting into two or more rows of cut pieces having a cut surface, and discharging By controlling the location 45, and a discharge step of discharging the cut thickness fried tofu, it can have. Deep fried tofu can be one or more.

  That is, the deep-fried tofu cutting device 300 according to the fourth embodiment is cut in parallel by the thick-fried tofu cutting device 200 according to the third embodiment so that the cut surface has an angle of 90 degrees with the second direction 8. The deep-fried tofu 2 can be further rotated 90 degrees and cut, and the deep-fried tofu can be cut into squares or rectangles.

(Modification)
As a modification of the first to fourth embodiments, deep-fried tofu can be accommodated in a container and placed on a work table.
FIG. 12 is a perspective view showing a container for storing thick fried tofu according to a modification of the present invention.
As shown in FIG. 12, the container 61 has a side wall 62 lower than the height of the fried tofu, and a groove 63 corresponding to the cutting position of the fried tofu 2 is formed on the bottom surface of the container 61. Is preferably provided from the upper edge of the side wall 62 to the bottom of the groove 63. Furthermore, the insertion device connection means 64 and the discharge device connection means 65 can be provided on the outer periphery of the container.

FIG. 13 is an image in which thick fried tofu cut using the thick fried tofu cutting device of the present invention is packaged in a transparent resin bag.
As shown in FIG. 13, the deep-fried tofu cut by the deep-fried tofu cutting device of the present invention can be packed in the original outer shape. By packing in such a form, the beauty is increased and the commercial value is increased, and it is possible to prevent the deep-fried tofu from colliding and collapsing during transportation.

  The ultrasonic vibration of the present invention may have a frequency of 15 to 100 kHz. A sound wave having a frequency of 15 kHz or less may have too little energy and an effect too weak. Ultrasonic waves exceeding 100 kHz are not preferable because the apparatus is expensive and the energy of the oscillated ultrasonic waves is too high and the inside of the thick fried tofu may be liquefied. The amplitude of the ultrasonic wave can be 0.1 to 100 μm.

A preferable example of the ultrasonic oscillation member 21 is a lead zirconate titanate vibrator having a drive frequency of 20 KHz and an amplitude of 50 μm. However, the vibration frequency and amplitude are only examples, and other numerical values may be used. Good.
Further, the material of the cutting blade 20 is not particularly limited as long as it can transmit the applied ultrasonic wave and cut the deep-fried tofu, but preferable examples include metals such as titanium, aluminum, and stainless steel. it can.

  As mentioned above, although preferred embodiment regarding this invention was described, this invention is not limited to embodiment, All the changes in the range which does not deviate from the technical scope to which this invention belongs are included.

1, 100, 200, 300 Thick fried tofu cutting device 2 Thick fried tofu 7 First direction 8 Second direction 10, 110, 21, 310, Work table 11 Base 12 Work table moving device 13 Work table rotating device 20 Cutting Blade 21 Ultrasonic oscillating member 22 Cutting support blade member 23 Cutting blade vertical moving member 24 Post 30, 30, 230 Cutting device 31 Cutting device moving device 40 Inserting device 45 Ejecting device 50 Control device 61 Thick fried tofu containing member 62 Side wall 63 Groove 64 Inserting device connecting means 65 Discharging device connecting means

Claims (15)

A device for cutting thick fried tofu,
The base,
A work table moving device provided on the base for moving the work table in the first direction;
A work table provided on an upper surface of the work table moving device, having a horizontal upper surface, on which one or more thick fried tofu is placed and moved in the first direction;
A cutting device for cutting the one or more deep-fried tofu;
An insertion device for placing the one or more deep-fried tofu at a predetermined position of the work table such that any side surface of each of the one or more deep-fried tofu has an angle of 90 degrees with the first direction; ,
A discharge device for discharging the one or more deep-fried tofu that has been cut;
A control device for controlling the work table moving device, the cutting device, the inserting device, and the discharging device;
Have
The cutting device is
Above the workbench, provided with a space for placing the workbench and the one or more thick tofu pieces, the blade edge forms an angle of 90 degrees with the first direction, and the blade edge is directed vertically downward. A cutting blade installed and ultrasonically applied;
An ultrasonic oscillation member that applies ultrasonic waves to the cutting blade;
The cutting blade and the ultrasonic oscillation member are supported on the base, and the cutting blade reciprocates between a position above the one or more deep-fried tofu and a position close to the upper surface of the work table. A cutting blade vertical movement member that moves and cuts the one or more deep-fried tofu;
A deep-fried tofu cutting device characterized by comprising:   The deep-fried tofu cutting according to claim 1, wherein a work table rotating device for rotating the work table by 90 degrees in a horizontal plane is further interposed between the base and the work table. apparatus.   The deep-fried tofu cutting device according to claim 1 or 2, wherein the work table, the work table moving device, the insertion device, and the discharge device are executed by applying an automatic conveyance device. A device for cutting thick fried tofu,
The base,
A work table provided on the base, having a horizontal upper surface, on which one or more thick fried tofu is placed;
A cutting device moving device that is provided on the base and moves the cutting device in the second direction;
A cutting device for cutting the one or more thick fried tofu while being moved in the second direction;
An insertion device for placing the one or more deep-fried tofu at a predetermined position of the work table such that any side surface of the one or more deep-fried tofu has an angle of 90 degrees with the second direction; ,
A discharge device for discharging the one or more deep-fried tofu that has been cut;
A control device for controlling the cutting device moving device, the cutting device, the inserting device, and the discharging device;
Have
The cutting device is
Above the workbench, provided with a space for placing the workbench and the one or more thick tofu pieces, the blade edge forms an angle of 90 degrees with the first direction, and the blade edge is directed vertically downward. A cutting blade installed and applied with ultrasonic waves;
An ultrasonic oscillation member that applies ultrasonic waves to the cutting blade;
The cutting blade and the ultrasonic oscillation member are supported on the base, and the cutting blade reciprocates between a position above the one or more deep-fried tofu and a position close to the upper surface of the work table. A cutting blade vertical movement member that moves and cuts the one or more deep-fried tofu;
A deep-fried tofu cutting device characterized by comprising:   The thick fried tofu cutting device according to claim 4, further comprising a work table rotating device for rotating the work table by 90 degrees in a horizontal plane between the base and the work table. .   The deep-fried tofu cutting device according to any one of claims 1 to 5, wherein cooking oil is applied as a lubricant to a surface of the work table.   6. The deep-fried tofu according to claim 1, wherein the one or more deep-fried tofu is accommodated in a deep-fried tofu accommodating member and placed or positioned on the work table. Cutting device.   The deep-fried tofu containing member has a side wall lower than the height of the one or more deep-fried tofu, and a groove corresponding to the cutting position of the deep-fried tofu is engraved on the bottom surface. The deep-fried tofu cutting device according to claim 7, wherein a continuous cut is provided on the side wall of the groove from the bottom of the groove to the upper edge of the side wall.   The deep-fried tofu cutting device according to any one of claims 1 to 5, wherein the ultrasonic wave has a frequency of 15 to 100 kHz.   The apparatus for cutting the deep-fried tofu has the ultrasonic frequency, the intensity of the ultrasonic wave, the moving speed of the work table, and the cutting blade so as to cut while maintaining the original appearance shape of the deep-fried tofu. The thick fried tofu cutting device according to any one of claims 1 to 5, wherein one or more of a moving speed and a moving speed of the one or more fried tofu are adjusted. A method for cutting one or more deep-fried tofu using the deep-fried tofu cutting device according to claim 1,
The control unit
Positioning by controlling the insertion device so that any one of the one or more thick fried tofu forms an angle of 90 degrees with the first direction in which the work table moves, and is placed on the work table Process,
The work table moving device and the cutting device are controlled, the work table is moved in the first direction and stopped at a predetermined position, and the cutting edge of the cutting blade is directed 90 degrees and vertically downward with respect to the first direction. Installing and applying ultrasonic waves, performing the operation of reciprocating the cutting blade between a position above the one or more deep-fried tofu and a position close to the upper surface of the workbench at least once; A cutting step of cutting each of the above deep fried tofu into two or more parallel sections having the first direction and a 90-degree cut surface,
A discharge step of controlling the discharge device to discharge the cut slices of deep-fried tofu;
A method for cutting deep-fried tofu, comprising: A method for cutting one or more deep-fried tofu using the deep-fried tofu cutting device according to claim 2,
The control unit
Positioning by controlling the insertion device so that any one of the one or more deep-fried tofu has an angle of 90 degrees with the first direction in which the workbench moves and is placed on the workbench Process,
The work table moving device and the cutting device are controlled, the work table is moved in the first direction and stopped at a predetermined position, and the cutting edge of the cutting blade is directed 90 degrees and vertically downward with respect to the first direction. Installing and applying ultrasonic waves, performing the operation of reciprocating the cutting blade between a position above the one or more deep-fried tofu and a position close to the upper surface of the work table at least once, A cutting step of cutting each of the above thick fried tofu into two or more parallel sections having the second direction and a 90-degree cut surface,
A rotation step of controlling the work table rotation device to rotate the work table by 90 degrees;
A second positioning step of controlling the work table moving device to position the cut one or more deep fried tofu;
The work table moving device and the cutting device are controlled, the work table is moved in the first direction, stopped at a predetermined position, and an operation of reciprocating the cutting blade is performed at least once, and the cutting is performed. A second cutting step of cutting each of the one or more deep-fried tofu into two or more rows of cut pieces having a cut surface parallel to the first direction and 90 degrees;
A thick fried tofu cutting method characterized by comprising a discharge step of controlling the discharge device and discharging the cut deep fried tofu. A method for cutting one or more deep-fried tofu using the deep-fried tofu cutting device according to claim 4,
The control unit
A positioning step of controlling the insertion device and positioning the side surface of each of the one or more thick fried tofu so as to form an angle of 90 degrees with the second direction in which the cutting device moves and placing it on the work table When,
By controlling the cutting device moving device and the cutting device, the cutting device is moved in the second direction and stopped at a predetermined position, and the cutting edge of the cutting blade is directed 90 degrees to the second direction and vertically downward. Applying ultrasonic waves, performing the operation of reciprocating the cutting blade between a position above the one or more deep-fried tofu and a position close to the top surface of the workbench at least once, A cutting step of cutting each of the one or more deep-fried tofu into two or more parallel sections having a cutting plane parallel to the second direction and 90 degrees;
A discharge process for controlling the discharge device to discharge the cut deep-fried tofu;
A method for cutting deep-fried tofu, comprising: A method for cutting one or more deep-fried tofu using the deep-fried tofu cutting device according to claim 5,
The control unit
A positioning step of controlling the insertion device and positioning the side surface of each of the one or more thick fried tofu so as to form an angle of 90 degrees with the second direction in which the cutting device moves and placing it on the work table When,
By controlling the cutting device moving device and the cutting device, the cutting device is moved in the second direction and stopped at a predetermined position, and the cutting edge of the cutting blade is directed 90 degrees to the second direction and vertically downward. Applying ultrasonic waves, performing one or more operations of reciprocating the cutting blade between a position above the one or more thick fried tofu and a position close to the upper surface of the workbench, A cutting step of cutting each of the one or more deep-fried tofu into two or more parallel sections having the second direction and a 90-degree cut surface;
A rotation step of controlling the work table rotation device to rotate the work table by 90 degrees;
A second positioning step of controlling the cutting device moving device to position the cut one or more deep fried tofu;
The cutting device moving device and the cutting device are controlled, the cutting device is moved in the second direction, stopped at a predetermined position, and the cutting blade is reciprocated one or more times to perform the cutting. A second cutting step of cutting each of the one or more deep-fried tofu into two or more rows of cut pieces having a cut surface parallel to the second direction and 90 degrees;
A thick fried tofu cutting method characterized by comprising a discharge step of controlling the discharge device and discharging the cut deep fried tofu.   A method for cutting deep-fried tofu using the apparatus for cutting deep-fried tofu according to any one of claims 1 to 10, wherein one or more deep-fried tofu is cut while maintaining its original external shape. .

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