JP2019161026A - Component mounting device and manufacturing method of mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device and a method for manufacturing a mounting board capable of quickly detecting the height of the upper surface of a load measuring unit. SOLUTION: In the method of manufacturing a mounting board, a nozzle is in contact with a load measuring unit at a first height (lower height) (Yes in ST3), and the nozzle is at a second height (upper height). When it is confirmed that there is no contact at (No in ST5), a contact determination is executed to determine whether or not the contact is made at a height intermediate between the height of the last contact and the height of the last non-contact (ST9, 10). ), In the case of contact at the middle height, the middle height is the last contact height, and in the case of no contact at the middle height, the middle height is the last non-contact height (ST7). ), The contact determination is repeated at a height intermediate between the height of the last contact and the height of the last non-contact, and the height of the upper surface of the load measuring unit is determined (ST11). [Selection diagram] FIG. 8

Description

  The present invention relates to a component mounting apparatus for mounting a component adsorbed by a nozzle on a substrate, and a method for manufacturing the mounting substrate.

  By urging the nozzle body downward with a spring or the like, the impact when the adsorbed component comes into contact with the substrate is alleviated, and the abutted component is pushed in by a predetermined pushing amount to generate a desired load. 2. Description of the Related Art A component mounting apparatus having a nozzle that is mounted on is known. The correlation data between the amount of pushing of the nozzle and the generated load is obtained by changing the amount of pushing that causes the nozzle to contact the load cell (load measurement unit) from above and lowering the tip of the nozzle further from the top surface of the load cell. Is obtained by measuring. To obtain accurate correlation data, accurate information on the height of the top of the load cell is required. In the component mounting apparatus described in Patent Document 1, the height at which the output (load) of the load cell is rapidly lowered by pushing the nozzle from the upper surface of the load cell and then rapidly decreasing is defined as the height of the upper surface of the load cell.

Japanese Patent Laid-Open No. 10-224088

  However, the conventional techniques including Patent Document 1 have a problem that many measurements are required to detect the upper surface of the load cell, and it takes time to detect the height of the upper surface of the load cell.

  In view of the above, an object of the present invention is to provide a component mounting apparatus and a mounting board manufacturing method capable of quickly detecting the height of the upper surface of a load measuring unit.

  The component mounting apparatus according to the present invention includes a nozzle that generates a load when the sucked component is pushed into a substrate, a nozzle lifting mechanism that lifts and lowers the nozzle, and a load generated on the nozzle by contacting the nozzle from above. Generated by the load measuring unit to be measured, the upper surface height search processing unit for searching for the height of the upper surface of the load measuring unit, and the pushing amount of the nozzle from the upper surface of the load measuring unit by the load measuring unit In a component mounting apparatus comprising: a correlation data acquisition processing unit that measures a load and acquires correlation data indicating a correlation between a pushing amount of the nozzle and a load generated in the nozzle; and the upper surface height search processing unit includes: Confirm that the nozzle contacts the load measuring unit at a first height, and that the nozzle does not contact the load measuring unit at a second height higher than the first height. It is determined whether or not the nozzle contacts the load measuring unit at a height intermediate between the first height that is the last contact height and the second height that is the last contact height. The contact determination is performed based on the load measured by the load measuring unit, and when the contact is made at the intermediate height, the intermediate height is set as the last contact height, and the contact is not made at the intermediate height. In this case, the intermediate height is regarded as the height that was not touched last, and the contact determination is repeated at a height intermediate between the height that was touched last and the height that was not touched last. The height of the upper surface of the load measuring unit is a height that is in contact with the height of the load measuring unit, or a height that is not in contact with the last time, or a height that is intermediate between the height of the last contact and the height of the last contact. .

  The mounting substrate manufacturing method of the present invention includes a nozzle that generates a load by pushing an adsorbed component into the substrate, a nozzle lifting mechanism that lifts and lowers the nozzle, and a load that is generated on the nozzle by contacting the nozzle from above. A mounting substrate manufacturing method in which a component is mounted on a substrate by a component mounting apparatus including a load measuring unit that measures the nozzle, wherein the nozzle contacts the load measuring unit at a first height, and the nozzle The second height higher than the first height is confirmed not to contact the load measuring unit, and the first height that is the last contact height and the last height that is not contacted. The contact determination is performed based on the load measured by the load measurement unit to determine whether or not the nozzle contacts the load measurement unit at an intermediate height between 2 and the contact at the intermediate height If you want to In the case of not contacting at the intermediate height, the intermediate height is defined as the height that was not contacted last, and the height between the last contact and the height that was not contacted last. Repeating the contact determination at a height, the last touched height, the last touched height, or the intermediate height between the last touched height and the last touched height Determined as the height of the upper surface of the load measuring unit, and the load measuring unit measures the load generated with respect to the pushing amount of the nozzle from the upper surface of the load measuring unit, and is generated in the pushing amount of the nozzle and the nozzle Correlation data indicating a correlation with a load to be acquired is obtained.

  According to the present invention, it is possible to quickly detect the height of the upper surface of the load measuring unit.

The top view which shows the structure of the component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the vacuum suction system of the component mounting apparatus of one embodiment of this invention Sectional drawing of the nozzle with which the mounting head with which the component mounting apparatus of one embodiment of this invention is equipped is mounted | worn (A) (b) Explanatory drawing which lowered the nozzle with which the mounting head with which the component mounting apparatus of one embodiment of this invention is equipped was dropped to the load measurement part. Explanatory drawing which shows the example of the correlation data of the pushing amount of the nozzle with which the mounting head with which the component mounting apparatus of one embodiment of this invention is equipped is mounted | worn, and the load which generate | occur | produces The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention The flowchart of the upper surface height search method of one embodiment of this invention Process explanatory drawing which shows the example of the upper surface height search process in the component mounting apparatus of one embodiment of this invention The flowchart of the manufacturing method of the mounting substrate of one embodiment of the present invention

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configuration, shape, and the like described below are illustrative examples, and can be appropriately changed according to the specifications of the component mounting apparatus and the nozzle. Below, the same code | symbol is attached | subjected to the element which respond | corresponds in all the drawings, and the overlapping description is abbreviate | omitted. In FIG. 1 and a part to be described later, as a biaxial direction orthogonal to each other in a horizontal plane, an X direction (horizontal direction in FIG. 1) in the substrate transport direction and a Y direction (vertical direction in FIG. 1) orthogonal to the substrate transport direction. Is shown. 2 and a part to be described later, the Z direction (vertical direction in FIG. 2) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal plane.

  First, the configuration of the component mounting apparatus 1 will be described with reference to FIGS. 1 and 2. In FIG. 1, a substrate transport mechanism 2 is installed in the X direction at the center of a base 1a. The substrate transport mechanism 2 transports the substrate 3 carried in from the upstream side in the X direction, and positions and holds it at a mounting work position by a mounting head described below. Moreover, the board | substrate conveyance mechanism 2 carries out the board | substrate 3 which the component mounting operation was completed downstream. On both sides of the substrate transport mechanism 2, component supply units 4 are installed.

  A plurality of tape feeders 5 are attached to the component supply unit 4 in parallel in the X direction. The tape feeder 5 picks up the component by pitch-feeding the carrier tape on which the pocket for storing the component is formed in the direction (tape feeding direction) from the outside of the component supply unit 4 toward the substrate transport mechanism 2. Parts are supplied to the parts removal position.

  In FIG. 1, Y-axis tables 6 each having a linear drive mechanism are disposed at both ends in the X direction on the upper surface of the base 1a. Similarly, a beam 7 having a linear mechanism is coupled to the Y-axis table 6 so as to be movable in the Y direction. A mounting head 8 is mounted on the beam 7 so as to be movable in the X direction. The mounting head 8 includes a plurality of (here, eight) nozzle units 8a.

  In FIG. 2, each nozzle unit 8a has a configuration in which a nozzle shaft 8c extends downward from a mechanism portion 8b. A nozzle 10 is detachably attached to the nozzle holding portion 9 coupled to the lower end portion of the nozzle shaft 8c. The nozzle 10 has a function of holding the component D using the suction force generated by the negative pressure generation source 25 (see FIG. 3). Each mechanism portion 8b incorporates a nozzle elevating mechanism 8d that elevates and lowers the nozzle shaft 8c and a position detection sensor 8e that detects the elevating position of the nozzle shaft 8c. By driving the nozzle lifting / lowering mechanism 8d, the nozzles 10 mounted on the nozzle holding unit 9 are lifted / lowered individually. Thus, the nozzle lifting mechanism 8d moves the nozzle 10 up and down, and the position detection sensor 8e detects the height position of the nozzle 10.

  In FIG. 1, the Y-axis table 6 and the beam 7 constitute a mounting head moving mechanism 11 that moves the mounting head 8 in the horizontal direction (X direction, Y direction). The mounting head moving mechanism 11 and the mounting head 8 pick up the component D by picking up the component D from the component take-out position of the tape feeder 5 mounted on the component supply unit 4 by the nozzle 10 and holding the substrate 3 on the substrate transport mechanism 2. The component mounting operation for transferring and mounting to the mounting position is executed.

  In FIG. 1 and FIG. 2, a head camera 12 that is located on the lower surface side of the beam 7 and moves integrally with the mounting head 8 is attached to the beam 7. As the mounting head 8 moves, the head camera 12 moves above the substrate 3 positioned at the mounting operation position of the substrate transport mechanism 2 and images a substrate mark (not shown) provided on the substrate 3. The position of the substrate 3 is recognized.

  In FIG. 1, a component recognition camera 13 and a load measurement unit 14 are installed between the component supply unit 4 and the board transport mechanism 2. The component recognition camera 13 recognizes the shape by imaging the component D held by the nozzle 10 when the mounting head 8 that has taken out the component D from the component supply unit 4 moves upward. In the component mounting operation of the component D on the substrate 3 by the mounting head 8, the mounting position is corrected in consideration of the recognition result of the substrate 3 by the head camera 12 and the recognition result of the component D by the component recognition camera 13.

  In FIG. 1, the load measuring unit 14 is provided with a load cell for measuring a force (load) applied to the upper surface from above. The load measuring unit 14 contacts the nozzle 10 from above and measures a load generated on the nozzle 10. At the positions where the worker works on both sides of the component mounting apparatus 1, touch panels 15 operated by the worker are respectively installed. The touch panel 15 displays various types of information on its display unit, and the operator inputs data and operates the component mounting apparatus 1 using operation buttons displayed on the display unit.

  In FIG. 2, a carriage 16 is coupled to the component supply unit 4. A plurality of tape feeders 5 are attached to the top of the carriage 16 side by side in the X direction. On the front side of the carriage 16, a reel 18 around which a carrier tape 17 that houses the component D is wound is held. The tape feeder 5 transports the carrier tape 17 accommodated in the reel 18 in the tape feeding direction, and supplies the component D to the component removal position by the mounting head 8.

  Next, the configuration of the nozzle 10 will be described with reference to FIGS. FIG. 3 shows a state in which the upper part of the nozzle 10 is held by the nozzle holding part 9. FIG. 4 shows a cross section of the nozzle 10 removed from the nozzle holder 9. 3 and 4, the nozzle 10 includes a nozzle main body 19 and a nozzle main body holding portion 20. The nozzle body 19 is configured to include a base end portion 21 and a lower end portion 22 that is inserted and joined from below into an upper suction hole 21 a that is formed inside the base end portion 21 and penetrates vertically. A disc-shaped spring seat portion 21 b is formed at the lower end of the base end portion 21 so as to extend from the outer periphery. A lower suction hole 22b is formed in the lower end portion 22 so as to penetrate vertically and open to the component suction surface 22a at the lower end.

  3 and 4, the nozzle body holding portion 20 is formed with a disc-shaped flange portion 20 a on the outer periphery below the center, and a fitting hole 20 b penetrating vertically is formed inside. The nozzle body 19 is inserted into the fitting hole 20b from below with the coil spring 23, which is an elastic body, mounted between the flange portion 20a and the spring seat portion 21b. The two opposing side surfaces of the nozzle body holding part 20 are each formed with a long hole 20c that is long in the vertical direction in which the nozzle body 19 slides and penetrates from the outer periphery of the nozzle body holding part 20 to the fitting hole 20b. .

  A pin 24 is inserted into the nozzle body 19 so as to penetrate between the opposed long holes 20c, and is moved up and down along the long holes 20c. As a result, the nozzle body 19 is restricted from rotating in the vertical direction as a rotation axis, and moves up and down in the nozzle body holding portion 20. The nozzle body 19 is urged downward by the coil spring 23, and the downward movement is restricted at a position where the pin 24 abuts against the lower end surface of the long hole 20c (hereinafter referred to as "downward restriction position").

  As shown in FIG. 3, when the nozzle 10 is held by the nozzle holding portion 9, the vacuum suction path 8 f formed inside the nozzle shaft 8 c is connected to the connection hole 9 a and nozzle formed inside the nozzle holding portion 9. 10 fitting holes 20b, upper suction holes 21a, and lower suction holes 22b. The vacuum suction path 8f is connected to a negative pressure generation source 25. When the negative pressure generation source 25 is operated, air is sucked from the opening of the component suction surface 22a of the nozzle 10 to generate a vacuum force, and the component suction surface 22a. Part D is adsorbed to the surface.

  A flow rate sensor 26 for measuring the flow rate of air flowing through the vacuum suction path 8f is disposed in the vacuum suction path 8f. As the negative pressure generation source 25, a vacuum supply source provided as factory equipment is used, and a vacuum generation device such as a vacuum pump or an ejector device installed in the component mounting apparatus 1 is used. Hereinafter, the position of the upper end of the nozzle 10 held by the nozzle holding unit 9 is referred to as a nozzle height position H, and the length of the nozzle 10 in a state where the nozzle body 19 is in the downward restriction position is referred to as a nozzle length L.

  Next, with reference to FIG. 5 and FIG. 6, the measurement of the load generated in the nozzle 10 having the above-described configuration and the load generated in the nozzle 10 by the load measuring unit 14 will be described. 5A, the nozzle 10 positioned above the load measuring unit 14 is lowered by operating the nozzle lifting mechanism 8d (arrow a), and the component suction surface 22a of the nozzle 10 is moved to the upper surface 14a of the load measuring unit 14. It shows the state of landing. The height position H of the nozzle at this time is referred to as the upper surface height Hm. The height of the upper surface 14a of the load measuring unit 14 is a position below the nozzle height position H (upper surface height Hm) by a nozzle length L at this time.

  FIG. 5B shows a state where the nozzle 10 is lowered (arrow b) by the pushing amount ΔH from the state shown in FIG. At this time, the nozzle body 19 is relatively pushed into the nozzle body holding part 20 by the pushing amount ΔH from the lower restriction position. The coil spring 23 is compressed by the pushing amount ΔH, and the load F generated thereby is applied to the load measuring unit 14. The load F generated in the nozzle 10 in this way is measured by the load measuring unit 14 that makes the nozzle 10 contact from above. The pushing amount ΔH corresponds to a descending amount obtained by moving the nozzle height position H downward from the upper surface height Hm.

  In FIG. 6, the pushing amount ΔH is changed by changing the height position H of the nozzle, and the pushing amount ΔH of the nozzle 10 obtained by measuring the generated load F by the load measuring unit 14 and the nozzle 10 are generated. Correlation data CP indicating the correlation with the load F is shown. Similarly, in the component mounting operation, when the sucked component D is mounted on the substrate 3, the load F corresponding to the correlation data CP can be generated in the nozzle 10 by pressing it by a predetermined pressing amount ΔH.

  Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. The control unit 30 included in the component mounting apparatus 1 includes a substrate transport mechanism 2, a component supply unit 4, a mounting head 8, a mounting head moving mechanism 11, a head camera 12, a component recognition camera 13, a load measurement unit 14, a touch panel 15, a negative A pressure source 25 and a flow sensor 26 are connected. The control unit 30 includes a mounting data storage unit 31, an upper surface height search processing unit 32, a correlation data acquisition processing unit 33, a nozzle state determination unit 34, and a mounting control unit 35.

  The mounting data storage unit 31 is a storage device, and stores component data 31a, mounting data 31b, nozzle data 31c, correlation data CP, upper surface height Hm, correction value Hc, and the like. The component data 31a includes, for each type of component D, a component name (type), a size such as the height of the component D, a load F applied when mounting on the substrate 3, and the like. The mounting data 31b includes the component name (type) and mounting position (XY coordinates) of the component D mounted on the substrate 3 for each type of mounted substrate to be manufactured. The nozzle data 31c includes, for each type of nozzle 10, a nozzle name (type), the size of the nozzle 10 (nozzle length L), a standard value SP that is the range of the correlation data CP of the nozzle 10 in a normal state, and the like. ing.

  In FIG. 7, the upper surface height search processing unit 32 controls the nozzle lifting mechanism 8 d, the position detection sensor 8 e, the mounting head moving mechanism 11, and the load measuring unit 14 included in the mounting head 8, and the upper surface 14 a of the load measuring unit 14. The upper surface height search process for searching for the height (upper surface height Hm) is executed, and the searched upper surface height Hm is stored in the mounting data storage unit 31.

  Details of the upper surface height search process (upper surface height search method) by the upper surface height search processing unit 32 will be described along the flow of FIG. 8 with reference to FIG. In FIG. 8, first, the upper surface height search processing unit 32 controls the mounting head moving mechanism 11 to move the nozzle 10 used for the upper surface height search above the load measuring unit 14. Next, the upper surface height search processing unit 32, based on the nozzle length L included in the nozzle data 31c, the height position H of the nozzle that the component suction surface 22a of the nozzle 10 is expected to coincide with the upper surface 14a of the load measuring unit 14 A target height Ht (reference height) is calculated.

  Next, the upper surface height search processing unit 32 has a lower height H1 (first height) lower than the target height Ht (reference height) by a predetermined first distance and a target height Ht (reference height). The upper side height H2 (second height) higher by a predetermined second distance is calculated. The lower height H1 and the upper height H2 are the lower limit and the upper limit of the nozzle height position H where the upper surface 14a of the load measuring unit 14 can be found even when the maximum tolerance of each part of the component mounting apparatus 1 is taken into consideration. As described above, the upper surface height search processing unit 32 calculates the target height Ht, the lower side height H1, and the upper side height H2 (ST1).

  In FIG. 8, the upper surface height search processing unit 32 then controls the nozzle lifting mechanism 8d to move (lower) the nozzle 10 from the upper standby position H0 to the lower height H1 (ST2) (time in FIG. 9). T1). Next, the upper surface height search processing unit 32 measures the load F using the load measuring unit 14 and determines whether the component suction surface 22a of the nozzle 10 is in contact with the upper surface 14a of the load measuring unit 14 based on the measurement result. A contact determination is executed (ST3). In the contact determination, the upper surface height search processing unit 32 determines that the nozzle 10 is in contact with the load measurement unit 14 when the load F measured by the load measurement unit 14 is equal to or greater than the contact determination value (predetermined value). The contact determination value is set to a value that is larger than the noise generated in the load measuring unit 14 and that does not erroneously determine the presence or absence of contact.

  When the measurement by the load measuring unit 14 ends, the upper surface height search processing unit 32 moves (raises) the nozzle 10 to the standby position H0 (time T2 in FIG. 9). That is, the contact determination at the lower height H1 is executed between time T1 and time T2. The load measurement by the load measurement unit 14 may be performed once or a plurality of times (predetermined number) in contact determination between time T1 and time T2. That is, in the contact determination, the load F may be repeatedly measured a predetermined number of times to determine the presence or absence of contact. As a result, it is possible to prevent sudden misjudgment caused by noise or vibration.

  In FIG. 8, when the nozzle 10 is in contact with the load measuring unit 14 at the lower height H1 (Yes in ST3), the upper surface height search processing unit 32 controls the nozzle lifting mechanism 8d to move the nozzle 10 upward. Is moved (lowered) from the standby position H0 to the upper height H2 (ST4) (time T3 in FIG. 9). Next, the upper surface height search processing unit 32 measures the load F using the load measuring unit 14 and determines contact (ST5). When the measurement by the load measuring unit 14 is finished, the upper surface height search processing unit 32 moves (rises) the nozzle 10 to the standby position H0 (time T4 in FIG. 9).

  When the nozzle 10 does not contact the load measuring unit 14 at the lower height H1 (first height) (No in ST3), or the nozzle 10 is the load measuring unit at the upper height H2 (second height). 14 (Yes in ST5), the upper surface height search processing unit 32 determines that the load measuring unit 14 is not properly mounted, or that the load measuring unit 14 has an attachment error or a failure of the load measuring unit 14. (ST6). If it determines with an error, the upper surface height search process part 32 will notify the touch panel 15 of that.

  In FIG. 8, when the nozzle 10 is not in contact with the load measuring unit 14 at the upper height H2 (No in ST5), the upper surface height search processing unit 32 makes the last contact with the nozzle 10 at the lower height H1. The height (hereinafter referred to as “contact height Hy”) is determined, and the upper height H2 is determined as the height at which the nozzle 10 did not contact last (hereinafter referred to as “non-contact height Hn”). (ST7: Contact height determination step).

  That is, in the upper surface height search processing unit 32, the nozzle 10 contacts the load measuring unit 14 at the lower height H1 (first height) (Yes in ST3), and the nozzle 10 is from the lower height H1. When it is confirmed that the load measuring unit 14 is not contacted at the high upper height H2 (second height) (No in ST5), the lower height H1 is the contact height Hy, and the upper height H2 is the non-contact height. Hn is determined.

  In FIG. 8, the upper surface height search processing unit 32 then determines whether or not the difference between the non-contact height Hn and the contact height Hy is equal to or smaller than a predetermined continuation determination value (predetermined distance) (ST8: Continuation determination step). The continuation determination value is set to a minimum step size in which the nozzle lifting mechanism 8d can move the height of the nozzle 10 appropriately. When the difference between the non-contact height Hn and the contact height Hy is larger than the continuation determination value (No in ST8), the upper surface height search processing unit 32 controls the nozzle lifting mechanism 8d to move the nozzle 10 to the contact height Hy ( It is moved (lowered) to an intermediate height H3 (intermediate height) that is intermediate between the first height) and the non-contact height Hn (second height) (ST9: intermediate height moving step) (FIG. 9 time T5).

  Next, the upper surface height search processing unit 32 measures the load F using the load measuring unit 14 and performs contact determination (ST10: contact determination step). In the example of FIG. 9, it is determined that the nozzle 10 contacts the load measuring unit 14 at the intermediate height H3. When the measurement by the load measuring unit 14 is completed, the upper surface height search processing unit 32 moves (rises) the nozzle 10 to the standby position H0 (time T6 in FIG. 9).

  In this way, the upper surface height search processing unit 32 is intermediate between the lower side height H1 (first height) that was last contacted and the upper side height H2 (second height) that was not last contacted. A contact determination is performed to determine whether or not the nozzle 10 contacts the load measurement unit 14 at a certain intermediate height H3 (intermediate height) based on the load F measured by the load measurement unit 14.

  In FIG. 8, the process then returns to the contact height setting step (ST7), where the last contacted height of the nozzle 10 is referred to as the contact height Hy, and the last contacted height of the nozzle 10 is referred to as the non-contact height Hn. decide. In the example of FIG. 9, since it is determined that the nozzle 10 contacts the load measuring unit 14 at the intermediate height H3, the intermediate height H3 (intermediate height) is the contact height Hy, and the non-contact height Hn is the upper side. Maintained at height H2. That is, when the contact is made at the intermediate height (intermediate height H3), the intermediate height is set as the last contacted height (contact height Hy).

  Next, when the difference between the non-contact height Hn (upper height H2) and the contact height Hy (intermediate height H3) is greater than the continuation determination value (No) in the continuation determination process (ST8), the intermediate height movement process (ST9). ) Is executed. In the current intermediate height moving step (ST9), the nozzle 10 moves to an intermediate height (intermediate height H4) between the non-contact height Hn (upper height H2) and the contact height Hy (intermediate height H3). (Time T7 in FIG. 9).

  Next, a contact determination step (ST10) is performed, and it is determined that the nozzle 10 does not contact the load measuring unit 14 at the intermediate height H4. When the measurement by the load measuring unit 14 is completed, the nozzle 10 moves (rises) to the standby position H0 (time T8 in FIG. 9). Next, in the contact height setting step (ST7), the intermediate height H4 (intermediate height) becomes the non-contact height Hn, and the contact height Hy is maintained at the intermediate height H3. That is, when the contact is not made at the intermediate height (intermediate height H4), the intermediate height is set to a height at which the contact is not made last (non-contact height Hn).

  Hereinafter, the continuation determination step (ST8), the intermediate height movement step (ST9), the contact determination step (ST10), and the contact height setting step (ST7) are repeatedly executed. In the example of FIG. 9, at time T9, the nozzle 10 moves to the intermediate height H5 (intermediate height H4 and intermediate height H3), and the contact determination is executed at the intermediate height H5, and at time T10. The nozzle 10 moves to the standby position H0. Similarly, contact determination is performed at intermediate height H6 (time T11 to T12), intermediate height H7 (time T13 to T14), intermediate height H8 (time T15 to T16), and intermediate height H9 (time T17 to T18). Executed.

  As described above, the contact determination is performed based on the intermediate height (intermediate heights H3 to H9) between the last contact height (contact height Hy) and the last contact height (non-contact height Hn). The execution is repeated. In the contact height setting step (ST7) after the contact determination at the intermediate height H9, the intermediate height H8 becomes the non-contact height Hn, and the intermediate height H9 becomes the contact height Hy. Then, in the continuation determination step (ST8) after the contact determination at the intermediate height H9, the difference between the non-contact height Hn (intermediate height H8) and the contact height Hn (intermediate height H9) is equal to or less than the continuation determination value. It is determined (Yes in ST8).

  In FIG. 9, the upper surface height search processing unit 32 then makes the last contact height (intermediate height H9), the last contact height (intermediate height H8), or the last contact height (intermediate height H9). The height (upper surface height Hm) of the upper surface 14a of the load measuring unit 14 is set to any one of the intermediate heights between the height H9) and the height that has not been contacted last (intermediate height H8) (ST11: Top surface height determination process). As described above, the upper surface height search processing unit 32 determines that the difference between the last contact height (intermediate height H9) and the last contact height (intermediate height H8) is a predetermined distance (continuation determination value). ) Repeated contact determination is terminated in the following cases.

  The upper surface height search processing unit 32 stores the upper surface height Hm in the mounting data storage unit 31. Further, the upper surface height search processing unit 32 stores the difference between the upper surface height Hm and the target height Ht in the mounting data storage unit 31 as the correction value Hc. The correction value Hc is the difference (deviation amount) between the height of the ideal nozzle 10 and the actual height of the nozzle 10 due to the tolerance of each part of the component mounting apparatus 1.

  Thus, the upper surface height search processing unit 32 performs contact determination discretely at an intermediate height, instead of continuously performing contact determination while changing the height of the nozzle 10 minutely. By determining the upper surface height Hm, the number of contact determinations can be reduced. Thereby, the height (upper surface height Hm) of the upper surface 14a of the load measuring unit 14 can be quickly detected. In the example of FIG. 9, the position of the nozzle 10 is returned to the standby position H0 after the contact determination, but may be moved to the next intermediate height without returning to the standby position H0. Thereby, processing time can be shortened.

  In FIG. 7, the correlation data acquisition processing unit 33 is generated by the load measuring unit 14 with respect to the pushing amount ΔH of the nozzle 10 from the upper surface 14a (upper surface height Hm) of the load measuring unit 14 based on the upper surface height Hm. The load F to be measured is measured, and correlation data CP indicating the correlation between the pushing amount ΔH of the nozzle 10 and the load F generated on the nozzle 10 is acquired. Specifically, the correlation data acquisition processing unit 33 measures a plurality of loads F by changing the pushing amount ΔH of the nozzle 10, and calculates a relational expression (such as a linear model) between the pushing amounts ΔH and the load F by a least square method or the like. Then, it is stored in the mounting data storage unit 31. Note that the correlation data CP may be raw data (data before processing) of the load F with respect to the push amount ΔH.

  In FIG. 7, the nozzle state determination unit 34 compares the acquired correlation data CP with the standard value SP included in the nozzle data 31c, and executes a nozzle state determination process for determining whether or not the state of the nozzle 10 is normal. . Here, the nozzle state determination processing will be described in detail with reference to FIG. In this example, the upper limit SU and the lower limit SL of the correlation data CP are set as the standard value SP. The nozzle state determination unit 34 determines that the correlation data CP acquired by the correlation data acquisition processing unit 33 is normal when the correlation data CP is between the upper limit SU and the lower limit SL of the standard value SP, and determines that the correlation data CP is abnormal.

  The solid line shown in FIG. 6 is that of the normal nozzle 10 in which the correlation data CP is between the upper limit SU and the lower limit SL of the standard value SP. A one-dot chain line is that of the abnormal nozzle 10 in which the correlation data CP is larger than the upper limit SU of the standard value SP. For example, if the frictional force when the nozzle body 19 slides up and down in the fitting hole 20b of the nozzle body holding part 20 due to deterioration over time or the elastic force of the coil spring 23 deviates from the standard, the correlation data CP deviates from the standard value SP and it is determined that the nozzle 10 is abnormal.

  In FIG. 7, the mounting control unit 35 controls the substrate transport mechanism 2, the component supply unit 4, the mounting head 8, and the mounting head moving mechanism 11 to execute a component mounting operation for mounting the component D on the substrate 3. More specifically, the mounting control unit 35 controls the nozzle elevating mechanism 8d based on the correlation data CP, the nozzle length L, and the height of the component D included in the component data 31a, and lowers the nozzle 10 to lower the nozzle 10. Is mounted on the substrate 3 with a predetermined load F included in the component data 31a. At that time, the mounting control unit 35 corrects the downward movement amount of the nozzle 10 based on the correction value Hc.

  Next, a mounting board manufacturing method for mounting the component D on the substrate 3 by the component mounting apparatus 1 will be described along the flow of FIG. First, the upper surface height search processing unit 32 executes the above-described upper surface height search processing to determine the upper surface height Hm (the height of the upper surface 14a of the load measuring unit 14) (ST21). Next, the correlation data acquisition processing unit 33 measures the load F generated with respect to the pushing amount ΔH of the nozzle 10 from the upper surface 14a (upper surface height Hm) of the load measuring unit 14 by the load measuring unit 14 (ST22). Correlation data CP indicating the correlation between the pushing amount ΔH of 10 and the load F generated on the nozzle 10 is acquired (ST23).

  Next, the nozzle state determination unit 34 compares the acquired correlation data CP with a predetermined standard value SP to determine whether or not the state of the nozzle 10 is normal (ST24). When the state of the nozzle 10 is normal (Yes in ST24), the mounting control unit 35 mounts the component D attracted by the nozzle 10 on the substrate 3 with a predetermined load F based on the acquired correlation data CP (ST25). . The mounting control unit 35 repeatedly executes (ST25) until the scheduled component D is mounted on the substrate 3 to manufacture the mounting substrate. When the state of the nozzle 10 is abnormal (No in ST24), the nozzle state determination unit 34 informs the touch panel 15 that the state of the nozzle 10 is abnormal (ST26).

  As described above, the component mounting apparatus 1 according to the present embodiment includes the nozzle 10 that generates the load F by pushing the sucked component D into the substrate 3, the nozzle lifting mechanism 8 d that lifts and lowers the nozzle 10, and the nozzle 10. The load measuring unit 14 that measures the load F from above, the upper surface height search processing unit 32 that searches for the height (upper surface height Hm) of the upper surface 14a of the load measuring unit 14, and the load measuring unit 14 A correlation data acquisition processing unit 33 that measures the load F generated with respect to the pushing amount ΔH of the nozzle 10 from the upper surface 14a of the load measuring unit 14 and obtains the correlation data CP between the pushing amount ΔH and the load F is provided. .

  Then, the upper surface height search processing unit 32 has a second height at which the nozzle 10 contacts the load measuring unit 14 at the first height (lower height H1), and the nozzle 10 is higher than the first height. It is confirmed that the load measuring unit 14 is not touched at the (upper height H2), and is intermediate between the last touched height (contact height Hy) and the last touched height (non-contact height Hn). A contact determination is performed to determine whether or not the nozzle 10 contacts the load measuring unit 14 at a height. When the nozzle 10 contacts at an intermediate height, the intermediate height is set as the last contact height, and the intermediate height is determined. If there is no contact, the middle height is regarded as the height that was not touched last, and the contact judgment is repeated at the middle height, and the last touched height or the last touched height Or the intermediate height between the last contact height and the last contact height The height of the fourth upper surface 14a and (the upper surface height Hm).

  As a result, the number of contact determinations can be reduced, and the height of the upper surface 14a (upper surface height Hm) of the load measuring unit 14 can be detected quickly.

  INDUSTRIAL APPLICABILITY The component mounting apparatus and the mounting substrate manufacturing method of the present invention have an effect that the height of the upper surface of the load measuring unit can be quickly detected, and are useful in the field of mounting components on a substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Board | substrate 8d Nozzle raising / lowering mechanism 10 Nozzle 14 Load measurement part D Component F Load (DELTA) H Push amount

Claims (20)

A nozzle that generates a load by pushing the sucked parts into the substrate;
A nozzle lifting mechanism for lifting and lowering the nozzle;
A load measuring unit for contacting the nozzle from above and measuring a load generated on the nozzle;
An upper surface height search processing unit for searching for an upper surface height of the load measuring unit;
The load measuring unit measures the load generated with respect to the pushing amount of the nozzle from the upper surface of the load measuring unit, and obtains correlation data indicating the correlation between the pushing amount of the nozzle and the load generated on the nozzle. In a component mounting apparatus comprising a correlation data acquisition processing unit,
The upper surface height search processing unit
Check that the nozzle contacts the load measuring unit at a first height, and that the nozzle does not contact the load measuring unit at a second height higher than the first height,
It is determined whether or not the nozzle contacts the load measuring unit at a height intermediate between the first height that is the last contact height and the second height that is the last contact height. Execute contact determination based on the load measured by the load measurement unit,
When contacting at the intermediate height, the intermediate height is defined as the last contacted height, and when not contacting at the intermediate height, the intermediate height is defined as the height not contacted last. , Repeatedly performing the contact determination at an intermediate height between the last contact height and the last contact height,
The height of the upper surface of the load measuring unit is the height of the upper surface of the load measuring unit, which is the last contact height, the last contact height, or the intermediate contact height between the last contact height and the last contact height. A component mounting device.   The component mounting apparatus according to claim 1, further comprising a nozzle state determination unit that compares the acquired correlation data with a predetermined standard value to determine whether or not the state of the nozzle is normal. .   2. The apparatus according to claim 1, further comprising a mounting control unit that controls the nozzle lifting mechanism based on the acquired correlation data and mounts a component sucked by the nozzle on a substrate with a predetermined load. Component mounting equipment.   The upper surface height search processing unit ends the repeated execution of the contact determination when a difference between the last contact height and the last contact height is equal to or less than a predetermined distance. Item 4. The component mounting apparatus according to any one of Items 1 to 3.   The upper surface height search processing unit determines that the nozzle is in contact with the load measurement unit when the load measured by the load measurement unit is equal to or greater than a predetermined value. 4. The component mounting apparatus according to any one of 4 above.   The component mounting apparatus according to claim 1, wherein the first height is lower by a predetermined first distance than a reference height.   The upper surface height search processing unit determines an attachment error of the load measurement unit when the nozzle does not contact the load measurement unit at the first height. The component mounting apparatus according to any one of 6.   The component mounting apparatus according to claim 1, wherein the second height is a predetermined second distance higher than a reference height.   The upper surface height search processing unit determines an attachment error of the load measurement unit when the nozzle contacts the load measurement unit at the second height. 9. The component mounting apparatus according to any one of 1 to 8.   10. The component mounting apparatus according to claim 1, wherein the upper surface height search processing unit repeatedly performs load measurement by the load measurement unit a predetermined number of times in the contact determination. 10. A nozzle that generates a load by pushing an adsorbed component into the substrate, a nozzle lifting mechanism that lifts and lowers the nozzle, and a load measuring unit that measures the load generated on the nozzle by contacting the nozzle from above. A mounting substrate manufacturing method for mounting a component on a substrate by a component mounting apparatus,
Check that the nozzle contacts the load measuring unit at a first height, and that the nozzle does not contact the load measuring unit at a second height higher than the first height,
It is determined whether or not the nozzle contacts the load measuring unit at a height intermediate between the first height that is the last contact height and the second height that is the last contact height. Execute contact determination based on the load measured by the load measurement unit,
When contacting at the intermediate height, the intermediate height is defined as the last contacted height, and when not contacting at the intermediate height, the intermediate height is defined as the height not contacted last. , Repeatedly performing the contact determination at an intermediate height between the last contact height and the last contact height,
The last contact height or the last contact height or the intermediate height between the last contact height and the last contact height is determined as the height of the upper surface of the load measuring unit,
The load measuring unit measures a load generated with respect to the pushing amount of the nozzle from the upper surface of the load measuring unit,
A method of manufacturing a mounting board, comprising: obtaining correlation data indicating a correlation between a pushing amount of the nozzle and a load generated in the nozzle.   Furthermore, the acquired correlation data is compared with a predetermined standard value, and it is determined whether or not the state of the nozzle is normal.   Furthermore, based on the acquired said correlation data, the components which the said nozzle adsorb | sucked are mounted in a board | substrate with a predetermined load, The manufacturing method of the mounting board | substrate of Claim 11 characterized by the above-mentioned.   The repeated execution of the contact determination is terminated when the difference between the last contact height and the last contact height is equal to or less than a predetermined distance. Manufacturing method of the mounting board.   The mounting board according to claim 11, wherein when the load measured by the load measuring unit is equal to or greater than a predetermined value, it is determined that the nozzle is in contact with the load measuring unit. Manufacturing method.   The method for manufacturing a mounting board according to claim 11, wherein the first height is lower than a reference height by a predetermined first distance.   The mounting board according to claim 11, wherein when the nozzle does not contact the load measurement unit at the first height, the load measurement unit is determined to be an attachment error. Manufacturing method.   The method for manufacturing a mounting board according to claim 11, wherein the second height is a predetermined second distance higher than a reference height.   The mounting according to any one of claims 11 to 18, wherein when the nozzle comes into contact with the load measurement unit at the second height, it is determined that the load measurement unit has an attachment error. A method for manufacturing a substrate.   The method for manufacturing a mounting board according to claim 11, wherein in the contact determination, the load measurement by the load measurement unit is repeatedly performed a predetermined number of times.

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