JP2019160904A - Orientation recognition apparatus, orientation recognition method, positioning apparatus, and positioning method - Google Patents

Abstract

To provide an orientation recognition apparatus capable of recognizing an orientation of an object to be inspected even if there is no orientation mark on the object to be inspected.SOLUTION: An azimuth recognition device 30 includes a detection unit 31 that detects a cut WF1 formed in a to-be-inspected object WF. The to-be-inspected object WF has an uncut region where the cut WF1 is not formed at a predetermined site in an outer periphery. The detection unit 31 includes uncut region detection means 31A for detecting a position of the uncut region of the to-be-inspected object WF. On the basis of a detection result of the uncut region detection means 31A, an orientation of the to-be-inspected object WF is recognized.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an azimuth recognition device, an azimuth recognition method, a positioning device, and a positioning method.

  2. Description of the Related Art Conventionally, there has been known a positioning device that positions an object to be inspected at a predetermined position by detecting a cut formed in the object to be inspected and an orientation mark such as a V notch or an orientation flat (for example, Patent Document 1). reference).

Japanese Patent Laid-Open No. 2004-287992

  However, since the conventional positioning device as described in Patent Document 1 detects the orientation mark and recognizes the orientation of the semiconductor wafer (inspected object), when the orientation mark is not formed on the inspected object, There is an inconvenience that the orientation of the object to be inspected cannot be recognized.

  An object of the present invention is to provide an azimuth recognition apparatus, an azimuth recognition method, a positioning apparatus, and a positioning method capable of recognizing the azimuth of the inspected object even when the inspected object does not have an azimuth mark.

  The present invention employs the configurations described in the claims.

According to the present invention, since the orientation of the inspection object is recognized by detecting the position of the uncut region of the inspection object, the orientation of the inspection object is recognized even when the inspection object has no orientation mark. be able to.
Furthermore, since the orientation of the inspection object is recognized by detecting the position of the uncut region of the inspection object, the orientation of the inspection object can be recognized and positioned even when the inspection object does not have an orientation mark. Can do.

The side view of the positioning device using the azimuth | direction recognition apparatus which concerns on one Embodiment of this invention. (A), (B), (C) is operation | movement explanatory drawing of a positioning device.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ The “left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction.

  In FIG. 1, a positioning apparatus 10 recognizes the orientation of a wafer WF on which a holding means 20 for holding a semiconductor wafer (hereinafter also simply referred to as “wafer”) WF as an object to be inspected and an intersecting cut WF1 are formed. Azimuth recognizing device 30 and moving means 40 for moving the holding means 20 are provided.

  In the present embodiment, the wafer WF has an uncut region WF2 in which the cut WF1 is not formed at a predetermined portion in the outer peripheral portion. That is, as shown in FIG. 1, an adhesive sheet AS is temporarily attached to one surface of the wafer WF to form an integrated object WK, and as shown in FIG. There is an uncut region WF2 in which the cut WF1 is not formed in any one of the four outer peripheral portions formed in the extending direction of the plurality of cuts WF1 orthogonal to each other, and the uncut region WF2 Is formed in a region surrounded by the notch WF1A in which the central portion is missing and the notch WF1B that does not reach the other end of the wafer WF and is surrounded by the end not contacting the outer edge of the wafer WF. It is provided in the direction.

  The holding unit 20 includes a holding surface 20A that sucks and holds the integrated object WK from the adhesive sheet AS side by a decompression unit (not shown) such as a decompression pump or a vacuum ejector.

  The azimuth recognition device 30 includes a detection unit 31 that detects a cut WF1 formed in the wafer WF. The detection unit 31 serves as an uncut region detection unit that detects the position of the uncut region WF2 of the wafer WF. The first imaging means 31A and the second imaging means 31B as the inspection object center detection means for detecting the wafer center WF3 (see FIG. 2A) by imaging the outer edge of the wafer WF are provided.

  The moving means 40 is supported by a first linear motor 41 as a driving device, a second linear motor 42 as a driving device supported by the slider 41A of the first linear motor 41, and a slider 42A of the second linear motor 42. In addition, the holding means 20 is supported by the output shaft 43A, and a rotation motor 43 is provided as a drive device that rotates the holding means 20 with the holding surface center 20B of the holding surface 20A as a rotation axis.

A procedure for positioning the wafer WF at a predetermined position in the above positioning apparatus 10 will be described.
First, with respect to the positioning device 10 in the state shown in FIG. 1 in which each member is arranged at the initial position, the user of the positioning device 10 (hereinafter simply referred to as “user”), a belt conveyor, an articulated robot, or the like is illustrated. As shown in FIG. 1 and FIG. 2 (A), when the non-conveying means places the integrated object WK on the holding surface 20A, the holding means 20 drives the decompressing means (not shown) and the integrated object on the holding surface 20A. WK adsorption holding is started.

  Next, the azimuth recognition device 30 drives the first imaging means 31A, and images an imaging area centered on the intersection of the first virtual line LK1 parallel to the X axis and the second virtual line LK2 parallel to the Y axis. The extension direction of the cut WF1 is detected. Thereafter, the moving means 40 drives the rotation motor 43 based on the detection result of the first image pickup means 31A, and as shown in FIG. 2B, one of the orthogonal cuts WF1 is the cut WF1. The holding means 20 is rotated so that it is parallel to the first virtual line LK1 and the other cut WF1 is parallel to the second virtual line LK2.

  Thereafter, the moving unit 40 drives the rotation motor 43 to rotate the holding unit 20, and the azimuth recognition device 30 drives the second image pickup unit 31B, and the wafer WF is rotated every time the holding unit 20 rotates 120 °. And the wafer center WF3 is detected based on the positions of the three outer edges of the wafer WF. Then, the moving means 40 drives the first linear motor 41 and the second linear motor 42 based on the detection result of the second imaging means 31B, and the wafer center WF3 is the first in the plan view as shown in FIG. The holding means 20 is moved so as to overlap the center of the imaging area of the first imaging means 31A.

  Next, the moving unit 40 drives the first linear motor 41 and the second linear motor 42 to move the holding unit 20 forward, right, rearward, and leftward with respect to the wafer center WF3 by the same distance. The first imaging means 31A images the first inspection object outer periphery WF4, the second inspection object outer periphery WF5, the third inspection object outer periphery WF6, and the fourth inspection object outer periphery WF7 of the wafer WF. The position of the uncut region WF2 present in any one of the fourth outer peripheral portions WF4 to WF7 is detected. Thereby, the orientation recognition device 30 recognizes the orientation of the wafer WF based on the detection result of the first imaging means 31A. Thereafter, based on the recognition result of the azimuth recognition device 30, the moving means 40 drives the rotation motor 43, rotates the holding means 20 so that the uncut region WF2 faces a desired direction, and holds the wafer WF in a desired manner. To position.

  Thereafter, after the holding means 20 stops driving the decompression means (not shown) and releases the suction and holding of the integrated object WK on the holding surface 20A, the user or the transfer means (not shown) transports the integrated object WK to the next process. The moving means 40 drives the first linear motor 41 and the second linear motor 42 to return the holding means 20 to the initial position, and thereafter the same operation as described above is repeated.

  According to the embodiment as described above, since the orientation of the wafer WF is recognized by detecting the position of the uncut region WF2 of the wafer WF, the orientation of the wafer WF is recognized even when the wafer WF has no orientation mark. can do.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

For example, the cut WF1 may intersect at an angle of less than 90 ° or 90 ° or more, and the shape formed inside the cut WF1 forms a polygon other than a rectangle such as a triangle or a pentagon. You may cross.
The uncut region WF2 may be provided at two or more locations in the extending direction of the plurality of orthogonal cuts WF1, or among the multiple locations in the extending direction of the plurality of intersecting cuts WF1. Any one or more locations may be provided, or one or more locations may be provided on the outer peripheral portion other than the extending direction of the plurality of cuts WF1 that intersect.

The holding means 20 may have a centering member such as a pin or a guide that contacts the outer edge of the wafer WF and positions the wafer center WF3 so as to overlap the holding surface center 20B. 30 may not be provided.
The initial position of the holding means 20 may be a position where the holding surface center 20B overlaps the center of the imaging area of the first imaging means 31A in a plan view as in the above-described embodiment, or may be a position where they do not overlap. Good.

The azimuth recognition device 30 may not include the second imaging unit 31B, the first imaging unit 31A may include a single detection unit having the function of the second imaging unit 31B, When the wafer center WF3 is detected by the two imaging means 31B, the outer edge may be imaged every time the wafer WF is rotated at an angle other than 120 °, for example, every 30 °, 45 °, 90 ° rotation. Alternatively, the interval between the imaging locations may be different, the imaging may be performed during the rotation, or the wafer center WF3 is not matched with the center of the imaging area of the first imaging unit 31A by the moving unit 40. The uncut area WF2 may be detected, or when the uncut area WF2 is detected, the wafer center WF3 may not overlap the center of the imaging area of the first imaging means 31A in plan view. Good, first shot The moving distance of the holding means 20 to the front, rear, left and right with respect to the center of the imaging area of the means 31A may be different, the number of imaging locations on the outer periphery of the object to be inspected may be 3 or less, or 5 locations or more. The intervals may be equal or different, and when multiple locations are imaged, it is determined whether or not the uncut region WF2 can be detected each time the image is captured, In this case, the imaging may be terminated, the wafer center WF3 may be detected and then the extending direction of the cut WF1 may be detected, or an optical sensor, an ultrasonic sensor, or the like instead of or in combination with the imaging means Various sensors may be used.
The azimuth recognition device 30 may detect the cut WF1, the uncut region WF2, and the wafer center WF3 by collectively imaging the entire wafer WF. In this case, the first image pickup unit 31A performs the first to fourth objects. When imaging the test object outer peripheral parts WF4 to WF7, the moving means 40 may not drive the first linear motor 41 and the second linear motor 42.

  The moving means 40 may include only at least one of the first linear motor 41, the second linear motor 42, and the rotation motor 43, or may not be included in the azimuth recognition device 30 of the present invention.

A user or a transfer means (not shown) places the wafer WF centered by a centering device such as a mechanical chuck or a sensor on the holding surface 20A so that the wafer center WF3 overlaps the holding surface center 20B in plan view. May be.
After the wafer center WF3 is detected, the user or the transfer means (not shown) repositions the wafer WF on the holding surface 20A so that the wafer center WF3 overlaps the holding surface center 20B in a plan view, The wafer WF on 20A may be shifted.

  In addition, the material, type, shape, and the like of the adhesive sheet and the object to be inspected in the present invention are not particularly limited. For example, the adhesive sheet may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be of an adhesive form such as pressure sensitive adhesive or heat sensitive adhesive. When an adhesive adhesive sheet is employed, it may be bonded by an appropriate method such as providing a heating means such as an appropriate coil heater or a heat pipe for heating the adhesive sheet. Moreover, such an adhesive sheet has, for example, a single layer having only an adhesive layer, an intermediate layer between the base material sheet and the adhesive layer, a cover layer on the upper surface of the base material sheet, etc. 3 It may be a layer or more, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer. Or a single layer or multiple layers without an intermediate layer. In addition, as the object to be inspected, for example, food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, the detection means is not limited as long as it can detect the cut formed in the object to be inspected in light of the technical common sense at the beginning of the application and is within the technical scope ( Description of other means and steps is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).
In the above-described embodiment, when rollers are employed, a drive device that rotationally drives each roller may be provided, or the surface of each roller may be configured with a member capable of elastic deformation such as rubber or resin. In addition, each roller may be constituted by a member that does not elastically deform, or when a pressing means or pressing member such as a pressing roller or a pressing head is employed, instead of or in combination with those exemplified above, a roller , A pressing member made of a round bar, blade material, rubber, resin, sponge, etc., or a structure of pressing by blowing air such as air or gas, or a pressing means or pressing member The part may be composed of a member that can be elastically deformed, such as rubber or resin, or may be composed of a member that is not elastically deformed, and when a peeling means or a peeling member is employed, a plate-like member, Consists of round bars, rollers, etc. Alternatively, when a structure that supports or holds a supported member such as a supporting (holding) means or a supporting (holding) member is employed, a gripping means such as a mechanical chuck or a chuck cylinder, coulomb force, adhesion A configuration in which a supported member is supported (held) by an agent, an adhesive, magnetic force, Bernoulli adsorption, a drive device, or the like may be employed, and when a cutting means or a cutting blade is employed, the configuration exemplified above Instead or in combination, cutting blades, laser cutters, ion beams, thermal power, heat, water pressure, heating wires, cutting members such as spraying of gas or liquid, etc., or a combination of appropriate driving equipment You may make it cut | disconnect by moving a cutting member.

DESCRIPTION OF SYMBOLS 10 Positioning device 20 Holding means 30 Orientation recognition apparatus 31 Detection means 31A 1st imaging means (uncut area detection means)
40 Moving means WF Wafer (inspected object)
WF1 Cut WF2 Uncut area WF3 Center of test object

Claims (5)

An apparatus for recognizing an orientation of an object to be inspected, in which intersecting cuts are formed,
Comprising detection means for detecting a cut formed in the object to be inspected,
The object to be inspected has an uncut region in which the cut is not formed at a predetermined site in the outer peripheral portion,
The detection means includes an uncut area detecting means for detecting a position of the uncut area of the object to be inspected, and recognizes an orientation of the object to be inspected based on a detection result of the uncut area detecting means. An azimuth recognition device characterized by: A positioning device for an object to be inspected using the azimuth recognition device according to claim 1,
Holding means for holding the object to be inspected;
Moving means for moving the holding means,
The said moving means moves the said holding means so that the said uncut area | region may face a desired direction based on the recognition result of the said azimuth | direction recognition apparatus, The positioning apparatus characterized by the above-mentioned. The detection means is provided so as to be able to detect the center of the inspection object,
The positioning device according to claim 2, wherein the moving unit moves the holding unit based on a detection result of the detecting unit so that a center of the object to be inspected is a desired position. A method for recognizing the orientation of an object to be inspected having intersecting cuts,
A detection step of detecting a cut formed in the object to be inspected,
The object to be inspected has an uncut region in which the cut is not formed at a predetermined site in the outer peripheral portion,
The detecting step performs an uncut region detecting step for detecting a position of the uncut region of the object to be inspected, and recognizes the orientation of the object to be inspected based on a result of the uncut region detecting step. A direction recognition method characterized by: A method for positioning an object to be inspected using the azimuth recognition method according to claim 4,
Holding step of holding the object to be inspected by holding means;
Carrying out a moving step of moving the object to be inspected;
The positioning method characterized in that the moving step moves the holding means so that the uncut region is oriented in a desired direction based on a recognition result of the orientation recognition method.

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