JP2019158982A - Electronic apparatus - Google Patents

Abstract

Kind Code: A1 An electronic device is provided which can prevent a recording medium from being rubbed or damaged when it is inserted or removed, and which can dissipate the heat of the recording medium more satisfactorily. A recording medium mounting portion for removably mounting a recording medium, a heat dissipation member that has a projection and dissipates heat generated from the recording medium to the outside of the recording medium, and an opening and closing that protects the recording medium. and a protective cover provided so as to be able to move the recording medium mounting portion to a first position in the closed state of the protective cover and a and a second position, wherein the recording medium mounted in the recording medium mounting portion is in contact with the projection of the heat radiating member at the first position, and at the second position, The recording medium mounted in the recording medium mounting portion and the protrusion of the heat dissipation member are separated from each other. [Selection drawing] Fig. 8

Description

  The present invention relates to an electronic device, and more particularly to an electronic device that holds a recording medium in a detachable manner and effectively radiates heat generated from the recording medium.

  In imaging apparatuses represented by digital cameras, digital video cameras, and the like, portable recording media have been used as means for recording and storing captured image data. As a typical example in recent years, a small memory card having a built-in control circuit and a recording memory has been widely used.

  On the other hand, the bit rate of image data to be photographed has rapidly increased as the image becomes higher in definition and frame rate. The speed at which data is written to the memory card during shooting has been increased, and the amount of heat generated from the memory card has risen to a level that cannot be ignored. If the heat generated by the memory card stays inside and the temperature rises, the memory card itself will be affected, possibly causing abnormal operation and destruction of internal elements.

  Therefore, it is desirable to provide means for effectively radiating the recording medium in an electronic device that can be loaded with a recording medium that has a processing circuit inside and serves as a heat source, such as a memory card.

  As a means for cooling a portable recording medium, a technique has been proposed in which a heat radiating member such as a heat sink is brought into contact with the recording medium to release heat to the outside of the apparatus (Patent Document 1). In the conventional example shown in Patent Document 1, a technique is disclosed in which a heat dissipating means for an IC card that is a recording medium and an elastic body that presses the IC card against the IC card are disclosed. With this technology, the heat dissipation performance of the recording medium is ensured, but when inserting the recording medium, the heat dissipation means is inserted while being spread out, so the insertion / extraction is not good, and the recording medium may be damaged by rubbing against the heat dissipation means. There is.

  In order to solve such a problem, a technique for releasing the contact with the heat radiating means when the recording medium is inserted and removed has been proposed (Patent Document 2). In the conventional example shown in Patent Document 2, a mechanism for moving a heat radiating member is provided, and a mechanism for releasing and contacting the heat radiating member with the recording medium in conjunction with opening and closing of the protective cover of the recording medium is disclosed.

Japanese Patent Laid-Open No. 3-188589 JP 2012-9614 A

  However, as in Patent Document 2, providing the moving mechanism on the heat radiating member side causes the heat radiating performance to deteriorate in the following points. First, the number of parts constituting the heat radiation means increases, and the path until the heat of the recording medium is finally released out of the apparatus becomes long. Secondly, the movement of the parts constituting the heat radiation path causes the heat resistance variation in the movable part, the tolerance of the component parts, and the like to deteriorate the adhesion, and the heat resistance of the entire heat radiation system increases.

  An object of the present invention is to provide an electronic apparatus that can prevent the recording medium from being rubbed and damaged during insertion and removal and can radiate the recording medium better.

  In order to achieve the above object, an electronic apparatus according to the present invention includes a recording medium mounting portion on which a recording medium is removably mounted and a projection, and dissipates heat generated from the recording medium to the outside of the recording medium. A heat-dissipating member, and a protective cover provided to be openable and closable to protect the recording medium, wherein the recording medium mounting portion is a first member in a closed state of the protective cover according to an open / closed state of the protective cover. And a second position in the open state of the protective cover, and in the first position, the recording medium mounted on the recording medium mounting part and the protrusion of the heat radiating member. At the second position, the recording medium mounted on the recording medium mounting portion and the protrusion of the heat radiating member are separated from each other.

  According to the present invention, it is possible to prevent the recording medium from being rubbed and damaged during insertion and removal, and to radiate the recording medium better.

The front perspective view showing the appearance of the imaging device of the embodiment of the present invention The rear perspective view of the imaging device of an embodiment of the present invention Control diagram showing the operation of the embodiment of the present invention 1 is a schematic cross-sectional view showing a schematic structure of an imaging apparatus according to an embodiment of the present invention The exploded perspective view of the heat dissipation block of the embodiment of the present invention The disassembled perspective view of the card connector unit of embodiment of this invention Sectional drawing of the card connector unit of embodiment of this invention Sectional drawing which shows operation | movement of the card connector unit of embodiment of this invention Sectional drawing which shows operation | movement of the card connector unit of embodiment of this invention The perspective view which shows the attachment structure of the card cover of embodiment of this invention Sectional drawing which shows the card cover opening-and-closing spring mounting structure of embodiment of this invention The disassembled perspective view of the card connector unit of embodiment of this invention The perspective view which shows the relationship between the duct and card board of embodiment of this invention 1 is an exploded view showing a memory card urging mechanism according to an embodiment of the present invention. The perspective view which shows the memory card biasing mechanism of embodiment of this invention The side view which shows the thermal radiation structure of embodiment of this invention The side view which shows the thermal radiation structure of embodiment of this invention Sectional drawing which shows the thermal radiation structure of embodiment of this invention Sectional drawing which shows the thermal radiation structure of embodiment of this invention Sectional drawing which shows the thermal radiation structure of embodiment of this invention

<First Embodiment>
Hereinafter, preferred embodiments of the imaging device according to the present invention will be described in detail. In the description, the left side when viewed from the photographer is the X axis plus direction or L side, the right side is the X axis minus direction or R side, the upper side is the Y axis plus direction or the upper surface side, and the lower side is the Y axis minus direction or the bottom side. The direction approaching the subject is the Z axis plus direction or the front side, and the Z axis minus direction is the back side.
The bottom surface of the imaging device is a horizontal plane. In addition, it demonstrates centering on the part to which this invention relates, and the part which is not directly related to invention is abbreviate | omitted.

(External appearance explanation)
FIG. 1 is a front perspective view illustrating an appearance of an imaging apparatus according to an embodiment of the present invention. FIG. 2 is a rear perspective view of the imaging apparatus according to the embodiment of the present invention. A cylindrical barrel portion 2 is provided near the center of the front of the camera 1, and the barrel portion 2 includes a lens portion 30.

  On the upper surface of the camera 1, a microphone 13, a power switch 11, a trigger 12, and various other operation buttons 15, 16, and 17 are provided. Further, the back surface portion 4 includes an image display portion 210 with a touch panel. Further, on the side surface on the X axis plus side, there is provided an L cover 9 which is connected to an air cooling duct which will be described later and which has a rectangular intake port 7 formed vertically. Further, the side surface appearance on the X axis minus side is provided with an exhaust port 6 which is connected to the air cooling duct and is rectangular in the Y axis direction. A card lid 400 is provided in the vicinity of the air inlet 7. Further, a card lid opening / closing knob 8 is provided adjacent to the upper side of the card lid 400.

(Explanation of operation control)
FIG. 3 is a block diagram showing a configuration of operation control of the camera 1 according to the embodiment of the present invention. The camera 1 includes an optical lens group including an optical control system such as focus and zoom, and a lens unit 30 including an aperture. Further, a main imaging unit 502 including an imaging element 31 and an imaging substrate unit 32 described later is provided. The camera signal processing unit 503, the compression / decompression processing unit 504, the image display unit 210, the recording / playback processing unit 506, the card control unit 507 for controlling the memory card 519, and the large-capacity internal memory control unit for controlling the large-capacity built-in memory 520 508.

  In addition, the audio signal processing unit 510, the memory 511, the memory 511, the memory control unit 512, the operation unit 514, the digital I / F 515 used for connection with the external device 521, the input / output unit 516 for connecting with the external device 522, the GPS A receiving unit 524, a GPS signal processing unit 525, a power control unit 517, a battery 523, and a fan 70 for cooling the main body are provided. The functional blocks are connected to each other via a data bus 518 so that data communication is possible.

  In such a camera 1, the memory 511 has a program storage area and a data work area, is used by time sharing in each functional block via the data bus 518, and is controlled and managed by the memory control unit 512. . A CPU 513 is a central processing circuit that performs overall control of the entire camera 1 by executing a predetermined program. The operation unit 514 includes the image display unit 210 with the touch panel, the power switch 11, the trigger 12, and the like.

  As described above, the power switch 11 is turned on and off by sliding operation. The trigger 12 can be pressed / started to start / stop moving image shooting. As described above, the operation unit 514 has a function of instructing the CPU 513 to perform an operation based on a key operation from the user. The digital I / F 515 exchanges signals with the external device 521 in accordance with a standard such as USB (not shown).

  The memory card 519 is a detachable flash memory such as an SD card or a compact flash (registered trademark), and records shooting data and audio data.

  The power supply control unit 517 includes a battery detection circuit, a DC-DC converter, a switch circuit that switches a block to be energized, and the like, and detects whether or not the battery 523 is attached, the type of battery, and the remaining battery level. The battery 523 is lithium ion or the like and supplies power to the camera 1.

  The GPS receiving unit 524 acquires position and time data from GPS satellites. This data is processed by the GPS signal processor 525, and the position of the GPS receiver 524 and the time at that position are calculated. In the camera 1, the calculated position information and time information are written in the large-capacity built-in memory 520 or the memory card 519 together with the image data. At the time of reproduction, the position information and time information can be referred to and used for organizing data and storage.

  Next, the photographing operation, recording operation, and reproduction operation of the camera 1 will be described. For example, when a photographing operation and a recording operation are instructed by the operation unit 514, the light from the subject becomes an optical signal whose predetermined brightness, angle of view, focus, and the like are controlled by the lens unit 30, and is input to the main imaging unit 502. Input. The main imaging unit 502 converts the input optical signal into an electric signal and outputs it to the camera signal processing unit 503. The camera signal processing unit 503 converts this electric signal into a digital image signal.

  The image signal is subjected to signal processing such as color separation, gradation correction, and white balance adjustment, and then output. The audio signal processing unit 510 outputs the audio signal as audio data by gain-controlling the audio signal input from the microphone 13 to a predetermined level and digitizing it.

  The compression / decompression processing unit 504 compresses and encodes the image data output from the camera signal processing unit 503 and the audio data output from the audio signal processing unit 510 by a predetermined compression encoding method. Shooting data to be compressed and encoded processed by the compression / decompression processing unit 504 is displayed on the image display unit 210, and the operation status of the camera 1 is also displayed as necessary.

  The recording / playback processing unit 506 performs error correction code processing, modulation processing, and the like on the compression-coded data obtained by the compression / decompression processing unit 504. Further, after adding data such as position information and time information calculated from the synchronization, ID, GPS receiving unit 524 and GPS signal processing unit 525 to convert the data into a form suitable for recording, the large-capacity built-in memory 520 or the memory card 519 is used. And so on. At this time, the large-capacity internal memory control unit 508 performs recording control of the large-capacity built-in memory 520, and the card control unit 507 performs recording control of the memory card 519.

  On the other hand, when a reproduction operation is instructed by the operation unit 514, the recording / reproduction processing unit 506 detects the base digital data from the data read from the large-capacity built-in memory 520 or the memory card 519, and performs error correction and demodulation processing. Further, a clock synchronized with the reproduction data is generated by a PLL circuit.

  The compression / decompression processing unit 504 performs decompression processing corresponding to a predetermined compression encoding method on the data output from the recording / playback processing unit 506, and acquires shooting data and audio data before compression encoding. The image display unit 210 displays the reproduction data obtained by the compression / decompression processing unit 504.

  When the operation unit 514 instructs to record input data from the digital I / F 515, the CPU 513 inputs image data or audio data from the external device 521 in a digital signal state using the digital I / F 515. The data is sent to the recording / playback processing unit 506. At this time, it is assumed that the image data and audio data from the external device 521 have already been encoded, and the recording / playback processing unit 506 performs processing necessary for recording on the input data as described above to incorporate a large capacity. Recording is performed on a recording medium such as the memory 520 or the memory card 519.

  When the operation unit 514 instructs to record an input signal from the input / output unit 516, the CPU 513 controls the input / output unit 516 and inputs an image and audio signal output from the external device 522.

  The input / output unit 516 converts the image and audio signals output from the external device 522 into digital data and outputs the digital data to the memory 511. The CPU 513 outputs the image and audio data stored in the memory 511 to the compression / decompression processing unit 504, compression-codes them, and sends them to the recording / reproduction processing unit 506.

  The recording / playback processing unit 506 performs processing necessary for recording on the encoded data as described above, and records the data in a recording medium such as the large-capacity built-in memory 520 or the memory card 519.

  Further, when the power is turned on, the fan 70 starts to be driven, and the sound output from the speaker is controlled by the speaker control unit 600 that supplies and exhausts air through a heat dissipation block 900 described later.

(Schematic structure inside the camera 1)
FIG. 4 is a schematic cross-sectional view when the camera 1 is cut along an XZ plane including the optical axis of the lens unit 30. The lens barrel part 2 includes a lens part 30. In the negative Z-axis direction (backward) of the lens unit 30, an imaging substrate unit 32 on which the imaging element 31 including the main imaging unit 502 is mounted is fixed with a screw (not shown). The imaging substrate unit 32 includes the camera signal processing unit 503.

  A main board portion 33 is arranged in parallel with the imaging board portion 32 behind the imaging board portion 32, and the imaging board portion 32 and the main board portion 33 are connected by a cable (not shown). The main board unit 33 includes various signal processing and control functions such as a compression / decompression processing unit 504, a recording / reproduction processing unit 506, and an audio signal processing unit 510. Therefore, the electrical component mounted on the main board portion 33 generates heat. On the mounting surface 33b on the negative side of the Z-axis of the main board portion 33, the heat generating electrical component (not shown) is provided.

  In FIG. 4, a heat dissipation block 900 is provided behind the main board portion 33 (in the negative Z-axis direction of the lens portion 30). Further, a card connector unit 501 (FIG. 9) is provided behind the heat dissipation block 900. A memory card urging mechanism 700 (FIG. 4) is provided behind the card connector unit 501.

(Structure of heat dissipation block 900)
FIG. 5 shows an exploded perspective view of the heat dissipation block 900 (FIG. 4). The front duct 40, the fan 70, and the rear duct 50 are arranged in this order from the Z-axis plus side. The front duct 40 and the rear duct 50 are parts made of a material such as a metal having high thermal conductivity, and a plurality of ribs are provided inside. It has a rectangular shape, and a fan 70 is provided inside the rectangular shape.

  By assembling the front duct 40 and the rear duct 50, a box shape having a duct intake portion 900a and a duct exhaust portion 900b is obtained as shown in FIG. Then, by rotating the fan 70, an air flow is generated in the heat dissipation block 900 by the flow of the air current 901, the air current 902, and the air current 903 as shown in FIG.

  The outer appearance of the rear duct 50 includes a surface 50a substantially parallel to the XY plane and a heat radiation contact surface 51a of a substantially rectangular protrusion 51 protruding in the Z-axis plus direction. Then, both ends of the protrusion 51 in the Y-axis direction are provided with a surface 53 a and a surface 53 b that are one step lower than the protrusion 51.

  From the surface 50a, a boss 55a, a boss 55b, and a boss 55c protrude in the negative Z-axis direction and are formed at the same height. Further, a rib 54 is formed in parallel with the Y axis on the X axis minus side of the boss 55a. At both ends of the rib 54, a protruding shaft 54a and a protruding shaft 54b protrude along the Y axis. Further, the surface 52 is a surface parallel to the YZ plane, and a protruding portion 52a is formed to protrude in the X-axis direction.

(Structure of card connector unit 501)
FIG. 6 is an exploded perspective view of the card connector unit 501 (FIGS. 8 and 9), and FIG. 7 is a schematic cross-sectional view of the card connector unit 501. The card connector unit 501 is a unit configured by mounting a card connector 560 on a card substrate 550.

  The card connector 560 has a substantially flat rectangular shape and includes an opening 561 into which the memory card 519 is inserted and removed. The memory card 519 is inserted into the card connector 560 by pushing the front surface portion 519b with a finger and pushing it in the direction of the arrow 500a (FIG. 6). The rear end portion of the memory card 519 is provided with a contact portion 519a that forms an elongated recess. The rear end of the card connector 560 includes a terminal portion 563 that is parallel to the arrow 500a and protrudes toward the opening 561. When the memory card 519 is inserted, the contact portion 519a and the terminal portion 563 are pressed. Fits and becomes conductive.

  One side of the card connector 560 is provided with an eject lever 564 that is operated when the card is removed, and the memory card 519 is ejected by an eject mechanism (not shown) when operated in the direction of the arrow 500a.

  As shown in FIG. 6, a rectangular hole 560a is formed in the surface 562 of the card connector 560, and a rectangular hole 550a is formed in the card substrate 550. Further, as shown in FIG. 7, a connector 570 is mounted on the bottom surface of the card substrate 550 and is connected to the main substrate portion 33 by a cable 571.

(Card board operation)
The operation of the card connector unit 501 accompanying opening and closing of the card lid 400 is shown in FIGS. FIG. 8 shows a state in which the card cover 400 is opened and the memory card 519 is being inserted. FIG. 9 shows a state where the memory card 519 is mounted in the card card connector unit 501 and the card cover 400 is also closed.

  The card connector unit 501 is rotatable about a hole 606c and a hole 606d shown in FIG. 12 that are supported by the protrusion shaft 54a and the protrusion shaft 54b shown in FIG. As shown in FIGS. 8 and 9, the card cover 400 is rotated about the shaft 410a and the shaft 410b to open and close. When the card lid 400 is closed (FIG. 9), the card connector unit 501 is a surface substantially parallel to the heat radiation contact surface 51a of the rear duct 50 described above. On the other hand, when the card cover 400 is opened (FIG. 8), the angle formed by the card connector unit 501 and the heat radiation contact surface 51a is the angle Θ1. The mechanism will be described later.

(Open / close card cover)
FIG. 10 shows an assembled perspective view of the card cover 400 attached to the L cover 9 as viewed from the inside of the product. A shaft 410a and a shaft 410b are formed on the upper portions of both side surfaces of the rectangular card cover 400. The shaft 410a is supported by being sandwiched between the L cover 9 and the shaft fixing member 91, and the shaft 410b is supported by the L cover 9. And is supported by being pinched by the shaft fixing member 92. Further, an elongated arm portion 420 that is slightly bent protrudes in the plus direction of the Z axis on the upper portion of the card lid 400. Also,
A lower surface of the card lid 400 is provided with a surface 401.

  FIG. 11 shows a cross-section when a torsion coil spring 450 that generates a turning force at the time of opening is attached. On the card lid 400, a torsion coil spring 450 is pivotally supported on a shaft portion (not shown). The arm 450a of the torsion coil spring 450 abuts on the inner surface of the card lid 400, and the other arm 450b is the surface of the front duct 40. 52 abuts against the protrusion 52a formed on 52 and generates a clockwise spring force.

  By operating the card lid opening / closing knob 8 (FIG. 2), a lock portion (not shown) is released, and the card lid 400 is opened to the outside by the force of the torsion coil spring 450.

(Holding card connector unit)
FIG. 12 shows a structure for holding the card connector unit 501. The substrate holder 601 has a surface 601 a parallel to the card substrate 550. The surface 601a is provided with a screw hole 602a, a screw hole 602b, a screw hole 602c, a screw hole 602d, and a substantially rectangular hole 608, and the card 550a, the screw 505b, the screw 505c, and the screw 505d The connector 560 is screwed onto the back surface of the surface on which the connector 560 is mounted.

  On both sides parallel to the X-axis of the substrate holder 601, a working shaft fixing portion 607a, a working shaft fixing portion 607b, a fixing arm portion 606a, and a fixing arm portion 606b are provided as four bent portions. In the vicinity of the card insertion portion, a working shaft fixing portion 607a and a working shaft fixing portion 607b are provided parallel to the Y axis, and a fixed arm portion 606a and a fixing arm portion 606b are provided parallel to the Y axis on the rear end side of the card connector 560. . The fixed arm portion 606a and the fixed arm portion 606b are provided with a hole 606c and a hole 606d, respectively.

  The action shaft 650 has an elongated rod shape, and both ends of the action shaft 650 are supported by the action shaft fixing portion 607a and the action shaft fixing portion 607b, and the action shaft 650 is held parallel to the Y axis. A spring locking portion 605 is provided between the fixed arm portion 606a and the action shaft fixing portion 607a.

  FIG. 13 shows a state in which the substrate holder 601 is attached to the rear duct 50. The protrusion shaft 54a and the protrusion shaft 54b are engaged with the hole 606c and the hole 606d. The diameters of the hole 606c and the hole 606d are larger than the diameters of the protruding shaft 54a and the protruding shaft 54b, and the substrate holder 601 is rotatable.

  A surface 50b parallel to the ZX plane of the rear duct 50 is provided with a spring locking portion 56a and a spring locking portion 56b which are two protrusions. The tension coil spring 430 has one end locked to the spring locking portion 56 a and the other end locked to the spring locking portion 605 of the substrate holder 601 to urge the substrate holder 601 and the rear duct 50 in the proximity direction. ing.

(Structure of memory card urging mechanism 700)
A mechanism for urging the memory card 519 mounted in the card connector unit 501 will be described with reference to FIGS. FIG. 14 is an exploded perspective view, and FIG. 15 is a perspective view in an assembled state.

  A plurality of members are provided on a base member 750 formed of a resin material or the like. In the base member 750, two support columns 751 and a support column 752 are arranged in the Y-axis direction on a surface on a rectangular flat plate. The support column portion 751 and the support column portion 752 have a long and thin plate shape with semicircular tips, and both have a hole 751a and a hole 752a formed at the tip portion. The hole 751a and the hole 752a are arranged on a coaxial line, and the axis is substantially parallel to the Y axis.

  A sliding hole 753 extending in the X-axis direction is formed in the vicinity of the column portion 751 of the base member 750. Further, a semi-disc-shaped protrusion 754 is formed at a corner near the sliding hole 753, and a locking part 754 a protrudes from the protrusion 754 in the negative Y-axis direction.

  Further, a hole 756b and a hole 756c are formed in the vicinity of the column portion 751. Further, as shown in FIG. 14, holes 756 a (FIG. 14) are formed in the rectangular shape of the base member 750 at positions substantially diagonal to the support column 751.

  In FIG. 14, the lever 790 is a resin member having slidability, and a slope portion 791, a lid contact surface 792, two engagement feet 794, and an engagement foot 795 are arranged in the X-axis direction. . In addition, a spring locking shaft 796 protrudes in the Y-axis plus direction from the side surface of the inclined surface portion 791.

  The engaging foot 794 and the engaging foot 795 projecting in the negative Z-axis direction engage with the sliding hole 753 of the base member 750 so that the lever 790 can slide substantially in parallel with the X-axis. Become. Both ends of the tension coil spring 770 are formed in an arc shape, the end 770b is locked to the locking portion 754a of the base member 750, and the end 770a is locked to the locking portion 754a of the lever 790. Then, the lever 790 is urged in the positive direction of the X axis.

Next, the assembly around the card urging member 710 will be described. In FIG. 14, the card urging member 710 includes a urging portion 711 on a thick cylinder at the center and a thin shaft portion 713 similar to the thin shaft portion 712 at both ends. The urging portion 711 and the shaft portion 712 And the shaft part 713 is coaxial. The fixed plate 730 has a flat plate shape in which four holes 731, a hole 732, a hole 733, and a hole 734 are formed.
The fixed plate 740 has a flat plate shape in which three holes 741, a hole 742, and a hole 743 are formed, and a sliding shaft 744 that protrudes in the Y-axis direction is formed.

  The connecting rod 720 has a rod shape with a round cross section, one end is constituted by a tip portion 720a and the other end is constituted by a head portion 720b. The tip portion 720a is narrower than the central portion of the connecting rod 720, and the head portion 720b is thick. The connecting rod 720 is inserted through the hole 743 of the fixing plate 740 and the hole 734 of the fixing plate 730, and the distal end portion 720a is prevented from coming off into the hole 743 by an E ring or the like (not shown). The fixing plate 740 has a head 720b. Abut.

  The connecting rod 725 has a rod shape with a round cross section, one end is formed by a tip end portion 725a and the other end is formed by a head portion 725b. The tip end portion 725a is narrower and the head portion 725b is thicker than the central portion of the connecting rod 725. The connecting rod 725 is inserted through the hole 742 of the fixing plate 740, the hole 751a of the column 751 is inserted, the hole 732 of the fixing plate 730 is inserted, and the tip 725a is inserted into the hole 752a of the column 752 (not shown). The fixing plate 740 comes into contact with the head 725b.

  A shaft portion 712 of the card urging member 710 is pivotally supported by a hole 731 of the fixing plate 730, a shaft portion 713 is pivotally supported by a hole 741 of the fixing plate 740, and a tension coil spring 80 is provided at a shaft tip 714 protruding from the hole 741. One end 81a is locked. The holes 756a, 756b, and 756c of the base member 750 are fixed to the boss 55b, boss 55a, and boss 55c shown in FIG. 5 with screws (not shown).

(Explanation of interlocking mechanism between card lid and card connector unit)
The interlocking between the card cover 400 and the card connector unit 501 will be described with reference to FIGS. 16, 17, 18, 19, and 20. 17 shows a state in which the card lid 400 is opened, and FIG. 16 shows a state in which the card lid 400 is closed. The card connector unit 501 can rotate around the Y axis passing through the center of the hole 606c. Further, a spring force is generated in the clockwise direction by the tension coil spring 430 locked to the spring locking portion 605 of the connector unit 501.

  FIG. 18 is a schematic cross-sectional view when the memory card 519 is mounted and the card cover 400 is closed. FIG. 19 is a schematic cross-sectional view when the memory card 519 is not attached and the card cover 400 is closed.

  When the card cover 400 is closed, a part of the card urging member 710 enters the hole 560 a of the card connector 560 by the spring force of the tension coil spring 80. When the card cover 400 is closed, the protrusion 51 of the rear duct 50 is inserted through the hole 550a of the card board 550 by the spring force of the tension coil spring 430 and enters the card connector unit 501.

  In FIG. 18, when the memory card 519 is mounted, the heat radiation contact surface 51a of the protrusion 51 is in contact with one surface of the memory card 519, so that the heat of the memory card 519 during the operation of the camera 1 is transferred to the rear duct. Move to 50 to dissipate heat.

  However, since the internal dimensions of the card connector unit 501 are larger than the thickness of the memory card 519, the contact between the memory card 519 and the heat radiation contact surface 51a becomes unstable. In order to ensure contact, the operation of the card biasing member will be described below. When the card lid 400 is closed, the lower surface 401 of the card lid 400 abuts against the lid abutment surface 792 of the lever 790 and resists the compressive force of the tension coil spring 770 so that the lever 790 moves in the minus direction of the X axis. Energized. Therefore, the card urging member 710 rotates counterclockwise, is inserted through the hole 560a of the card connector 560, and enters the card connector unit 501.

  When the memory card 519 is not mounted, the position of the card urging member 710 is determined by the sliding shaft 744 of the fixing plate 740 coming into contact with the inclined surface 791 of the lever 790. At this time, the distance t between the heat radiation contact surface 51 a and the card urging member 710 is smaller than the thickness of the memory card 519.

  On the other hand, when the memory card 519 is mounted, the card urging member 710 comes into contact with one surface of the memory card 519 to determine the position. At this time, there is a gap between the column portion 752 and the slope portion 791, and the card biasing member 710 is always biased counterclockwise about the connecting rod 725 by the pulling force of the pulling coil spring 80.

  FIG. 20 is a schematic cross-sectional view when the memory card 519 is not attached and is cut along the ZY plane in a state where the card cover 400 is closed (FIG. 9). As described above, the card connector unit 501 (FIGS. 8 and 9) is urged upward in the Z-axis, but in FIG. 20, the surface deviated from the heat radiation contact surface 51a of the rear duct 50 in the one-step Z-axis plus direction. The substrate holder 601 comes into contact with 53a and the surface 53b.

  When the card cover 400 is opened (FIG. 8), the following operation is performed. As the card cover 400 rotates about the axis 410a, the arm portion 420 (FIG. 10) pushes down the action shaft 650 (FIGS. 12 and 13) of the substrate holder 601. In FIG. 12, the substrate holder 601 rotates about the hole 606c, so that the heat radiation contact surface 51a of the rear duct 50 is retracted from the hole 550a of the card substrate 550 (FIG. 8).

  At this time, the force with which the torsion coil spring 450 (FIG. 11) pushes down the action shaft 650 (FIG. 12) is larger than the force with which the tension coil spring 430 (FIG. 13) lifts the substrate holder 601 (FIG. 12). Due to the spring force of the tension coil spring 770 (FIG. 14), the lever 790 (FIG. 14) moves in the positive direction of the X axis and rotates the fixing plate 740 (FIG. 14) clockwise. As a result, the card urging member 710 (FIG. 14) rotates clockwise and retracts from the hole 560a (FIG. 8).

  Therefore, when the card cover 400 is opened when the memory card 519 is mounted, the memory card 519, the rear duct 50, and the card urging member 710 are not in contact with each other. Therefore, the memory card 519 is not damaged when the memory card 519 is inserted / removed, and when the card cover 400 is closed, the memory card 519 mounted is urged from both sides along the Z-axis, The contact of the memory card 519 can be ensured and the heat radiation can be reliably performed.

  Although the present invention has been described in detail in the preferred embodiments thereof, the present invention is not limited to these specific embodiments. Various forms within the scope of the present invention are also included in the present invention.

DESCRIPTION OF SYMBOLS 1 ... Camera 2 ... Lens-barrel part 4 ... Back part 6 ... Exhaust port 7 ... Intake port 30 ... Lens part 31 ... Imaging element 32・ ・ ・ ・ Imaging board 33 ・ ・ ・ ・ Main board

Claims (5)

A recording medium mounting section for mounting the recording medium in a removable manner;
A heat dissipating member that includes a protrusion and dissipates heat generated from the recording medium to the outside of the recording medium;
A protective cover provided to be openable and closable to protect the recording medium;
Have
The recording medium mounting unit is configured according to the open / closed state of the protective cover.
It is movable between a first position in the closed state of the protective cover and a second position in the opened state of the protective cover,
In the first position, the recording medium mounted on the recording medium mounting portion and the protrusion of the heat radiating member are in contact with each other,
In the second position, the recording medium mounted on the recording medium mounting portion and the protrusion of the heat radiating member are separated from each other.   The electronic apparatus according to claim 1, wherein the recording medium mounting portion includes an opening, and the protrusion of the heat radiating member can enter the opening. A recording medium biasing member that is on the opposite side of the heat dissipation member of the recording medium mounting portion and is movable to the first position and the second position according to the open / close state of the protective cover;
In the first position, the recording medium mounted on the recording medium mounting portion and the recording medium biasing member are in contact with each other,
3. The electronic apparatus according to claim 1, wherein at the second position, the recording medium attached to the recording medium is separated from a pre-recording medium biasing member.   4. The electronic apparatus according to claim 3, wherein at the first position, the recording medium urging member is urged by an elastic member in a direction that strengthens contact with the recording medium.   5. The electronic apparatus according to claim 1, wherein the tip of the protrusion is an elastic member having high thermal conductivity.