JP2019155475A - Laser processing unit and work processing method - Google Patents

Abstract

To improve mass productivity of various products including a work, by shortening a cycle time of product manufacturing, by improving a process of processing to the work.SOLUTION: A laser processing unit 1 is provided with a supply unit 10 of an unprocessed work W, a carrying-out unit 20 of a processed work W, a carrying passage 30 provided between both units, processing areas 40A and 40B faceably contacting with the carrying passage 30, a carrier machine 50A for supplying the work W to both processing areas, a carrier machine 50B for carrying out the work W from the processing areas 40A and 40B, a laser beam oscillation unit, a branch unit 81 for distributing a laser beam oscillated from the laser beam oscillation unit to the processing areas 40A and 40B, laser beam irradiation units 60A1 and 60A2 for irradiating the laser beam distributed to the processing area 40A to the work W and laser beam irradiation units 60B1 and 60B2 for irradiating the laser beam distributed to the processing area 40B to the work W.SELECTED DRAWING: Figure 1

Description

  The present invention supplies a processing object (hereinafter referred to as a workpiece) conveyed on a conveyance path to a processing apparatus provided facing the conveyance path, and performs a laser processing apparatus that performs laser processing, and processing such as laser processing. The present invention relates to a processing method performed using a processing apparatus.

Cutting optically transparent substrates such as large glass substrates and display modules such as LCDs and OLEDs are often mechanically cut. For example, by using a dicing saw such as a diamond cutter, a plurality of glass substrate pieces are multi-faced from the glass substrate.
On the other hand, there is a method of cutting an optically transparent substrate using a laser beam instead of mechanical cutting (see Patent Document 1). Specifically, first, a perforated scribe line is formed on the glass substrate by irradiating the glass substrate with laser light having an extremely short pulse width. Thereafter, the glass substrate is divided along the scribe line, whereby a plurality of glass substrate pieces are multi-faced from the glass substrate.

JP 2007-260749 A

  With the spread of portable terminals and information terminals in recent years, various products of these terminals are always required to improve cost and productivity. For this reason, also in the processing method of the glass substrate using the laser beam mentioned above, it is a subject to improve the mass productivity by shortening the cycle time of product manufacture.

  The present invention has been made in view of the above circumstances, a laser processing apparatus for improving the mass-productivity of various products including workpieces by improving the machining process for workpieces and shortening the cycle time of product manufacturing, and The object is to provide a processing method.

A first aspect of the laser processing apparatus according to the present invention includes a transporter that holds a workpiece, a transport path on which the transporter travels, and a processing area that is provided facing the transport path. A laser processing apparatus for supplying the work to the processing area and irradiating the work with laser light,
A first conveyor for supplying untreated workpieces to the treatment area;
A second transporter that unloads the processed workpiece irradiated with laser light from the processing area;
A supply unit for supplying the untreated workpiece to the first transporter;
An unloading unit that receives the processed workpiece from the second transporter;
The processing area is
A first processing area and a second processing area;
One laser beam oscillation unit that oscillates the laser beam;
A branching unit that divides the laser light oscillated from the laser light oscillation unit into the first processing area and the second processing area;
A first laser light irradiation unit that is provided in the first processing area and that irradiates the workpiece supplied to the first processing area with the laser light distributed to the first processing area by the branch unit. When,
A second laser light irradiation unit that is provided in the second processing area and that irradiates the workpiece supplied to the second processing area with the laser light distributed to the second processing area by the branch unit. It is a laser processing apparatus provided with these.

A second aspect of the laser processing apparatus according to the present invention includes a transporter that holds a workpiece, a transport path on which the transporter travels, and a processing area that faces the transport path, and the transporter A laser processing apparatus for supplying the work to the processing area and irradiating the work with laser light,
An inversion unit that faces the conveyance path and is provided on the upstream side in the conveyance direction from the processing area, and reverses the workpiece.
A first transporter for supplying unprocessed workpieces to the reversing unit;
A second transporter for supplying unprocessed workpieces to the processing area;
A third transfer machine for carrying out the processed workpiece irradiated with laser light from the processing area;
A supply unit for supplying the untreated workpiece to the first transporter;
A carry-out unit that receives the processed workpiece from the third transfer machine,
The processing area is
A first processing area and a second processing area;
One laser beam oscillation unit that oscillates the laser beam;
A branching unit that distributes the laser light oscillated from the laser light oscillation unit to the first processing area or the second processing area;
A first laser light irradiation unit that is provided in the first processing area and that irradiates the workpiece supplied to the first processing area with the laser light distributed to the first processing area by the branch unit. When,
A second laser light irradiation unit that is provided in the second processing area and that irradiates the workpiece supplied to the second processing area with the laser light distributed to the second processing area by the branch unit. It is a laser processing apparatus provided with these.

A first aspect of the processing method according to the present invention includes an unprocessed workpiece supply unit, a processed workpiece unloading unit, a conveyance path provided between the supply unit and the unloading unit, A processing area provided facing the transport path, a first transport machine that travels on the transport path and supplies the unprocessed work to the processing area, travels on the transport path, and is processed A processing method for processing the workpiece, using a processing apparatus including a second transporter that carries the processed workpiece out of the processing area,
While moving the first transporter in the vicinity of the supply unit, moving the second transporter between the processing area and the unloading unit,
The unprocessed work is supplied to the supply unit, the unprocessed work is taken out by the first transporter, and the first transporter is moved from the supply unit to the processing area,
The unprocessed work held by the first transfer machine is thrown into the processing area,
Moving the first transporter to the supply unit and moving the second transporter to the processing area;
Processing the unprocessed work put in the processing area,
The processed workpiece that has been processed is taken out by the second transporter, the second transporter is moved from the processing area to the unloading unit, and the processed workpiece is moved to the second transporter. This is a processing method for delivering from a transport machine to the carry-out unit.

A second aspect of the processing method according to the present invention includes an unprocessed workpiece supply unit, a processed workpiece unloading unit, a conveyance path provided between the supply unit and the unloading unit, A traveling area that faces the transport path, a reversing unit that faces the transport path and is located upstream of the processing area in the transport direction of the work, and reverses the work, and travels on the transport path A first transporter that supplies unprocessed workpieces to the processing area, a second transporter that travels on the transport path and supplies unprocessed workpieces to the processing area, and travels on the transport path Is a processing method for processing the workpiece using a processing device comprising a third transporter that carries out the processed workpiece that has been processed from the processing area,
The first transporter is moved to the vicinity of the supply unit, the second transporter is moved between the reversing unit and the processing area, and the third transporter is moved to the processing area and the unloading unit. Move to the middle of the unit,
The unprocessed work is supplied to the supply unit, the unprocessed work is taken out by the first transporter, and the first transporter is moved from the supply unit to the reversing unit,
While passing the unprocessed work from the first transporter to the reversing unit, reversing the work,
Moving the first transporter to the supply unit and moving the second transporter to the reversing unit;
While taking the reversed work to the second transport machine, moving the second transport machine from the reversing unit to the processing area,
Put the inverted work held by the second transporter into the processing area,
While moving the second transport machine in the middle of the reversing unit and the processing area, moving the third transport machine to the processing area,
Processing is performed on the inverted workpiece put in the processing area,
The processed workpiece that has been processed is taken out by the third transfer device, and the third transfer device is moved from the processing area to the unloading unit, and the processed workpiece is transferred to the third transfer device. This is a processing method for delivering from a machine to the carry-out unit.

  According to the present invention, it is possible to reduce idle time that occurs between when a workpiece is taken out from the supply unit and finished after being processed and delivered to the unloading unit, that is, when the workpiece is waiting without being conveyed or processed. be able to. As a result, the machining process for the workpiece is improved, the cycle time of product manufacture can be shortened, and the mass productivity of various products including the workpiece is improved.

1 is a plan view of a laser processing apparatus 1 (first embodiment) according to the present invention. FIG. 2 is a part of an elevation view taken in the direction of arrow II in FIG. 1. It is a top view which shows each part structure contained in the lower layer of the said laser processing apparatus. It is the schematic which shows the structure of the optical system component of the said laser processing apparatus. It is a top view of the laser processing apparatus 2 (2nd embodiment) which concerns on this invention. FIG. 6 is a part of an elevation view taken in the direction of the arrow VI in FIG. 5. 3 is a plan view showing a structure of each part included in a lower layer of the laser processing apparatus 2. FIG. It is a top view of the laser processing apparatus 3 (3rd embodiment) which concerns on this invention. It is a part of IX direction arrow elevation view of FIG. 3 is a plan view showing a structure of each part included in a lower layer of the laser processing apparatus 3. FIG.

A laser processing apparatus and a processing method performed using the processing apparatus according to the present invention will be described below. As an embodiment of the present invention, a case where a laser processing apparatus is used as a processing apparatus will be described below as an example, but the processing apparatus is not limited to the laser processing apparatus. Examples of processing equipment include welding equipment, cutting / cutting equipment, assembly / assembly equipment, heat treatment equipment, plasma gas irradiation equipment, liquid / gel coating equipment, etc. The processing method that has been used is an object to which the present invention is applied.
(First embodiment)
As shown in FIGS. 1 to 4, the laser processing apparatus 1 according to the first embodiment of the present invention includes an unprocessed work (such as an optically transparent substrate such as a large glass substrate, an LCD, or an OLED). Display module) Supply unit 10 for supplying W, unloading unit 20 for unloading processed workpiece W after laser processing, transport path 30 provided between supply unit 10 and unloading unit 20, A processing area 40 that performs laser processing on W, a transporter (first transporter) 50A and a transporter (second transporter) 50B that travel on the transport path 30 and transport the workpiece W, and a laser processing apparatus The control part 100 which controls the action | operation of each part of 1 is provided. The processing area 40 includes two processing areas (first and second processing areas) 40A and 40B.

  The supply unit 10 is sequentially supplied with a tray on which two workpieces Wa and Wb are placed, and laser processing is performed with the two workpieces Wa and Wb as a set. The unloading unit 20 includes an inspection device for the workpiece W that has been subjected to laser processing (not shown), and after sorting out a non-defective product and a defective product, the work W determined to be a non-defective product is sent to a subsequent process.

  The processing areas 40A and 40B face the conveyance path 30 and are arranged side by side in the arrangement direction of the conveyance path 30 (that is, the conveyance direction of the workpiece W). In the processing area 40A, two laser beam irradiation units (first laser beam irradiation units) 60A1 and 60A2 that simultaneously irradiate laser beams to the two workpieces Wa and Wb, and the workpieces Wa and Wb are orthogonal to each other in the horizontal plane. Two XY tables 70A1 and 70A2 that are horizontally moved independently in two directions (hereinafter also referred to as XY directions) are provided. Similarly, two laser light irradiation units (second laser light irradiation units) 60B1 and 60B2 and two XY tables 70B1 and 70B2 are provided in the processing area 40B. Although not shown, the processing areas 40A and 40B include a first suction device that removes surplus pieces of the glass substrate and a glass piece on the surfaces of the XY tables 70A1, 70A2, 70B1, and 70B2. 2 suction devices are installed.

The conveyor 50A includes a gripper 51 having a pair of arms that simultaneously attract and grip two workpieces W, and a rotating unit 52 that rotates the gripper 51 around a vertical axis (Z axis) orthogonal to the horizontal plane. And a traveling carriage 53 that moves along the conveyance path 30. The transport machine 50A sucks unprocessed workpieces Wa and Wb using the gripper 51 and removes them from the supply unit 10, and sets the orientation of the workpieces Wa and Wb in the horizontal plane by 90 ° (counterclockwise in FIG. 1). 90 [deg.] And then moved on the transport path 30 toward the processing area 40A or 40B, and the workpieces Wa and Wb are put into the XY tables 70A1 and 70A2 or the XY tables 70B1 and 70B2.
The transport machine 50B also has the same structure as the transport machine 50A, and includes a gripping part 51, a rotating part 52, and a traveling carriage 53. The transport machine 50B sucks the processed workpieces Wa and Wb using the gripping portion 51 and takes them out of the processing area 40A or 40B, and moves them on the transport path 30 toward the unloading unit 20 so that the workpiece Wa in the horizontal plane is obtained. , Wb is turned 90 ° (90 ° counterclockwise in FIG. 1), and then the workpieces Wa and Wb are delivered to the carry-out unit 20.
Adsorption, rotation and movement in the transporters 50A and 50B are controlled by the control unit 100.

  The processing areas 40 </ b> A and 40 </ b> B have a three-layer structure in which three plates 41, 42, and 43 are arranged in parallel via the legs 5. On the upper plate 41 of the upper layer, a laser light oscillation unit 80 that oscillates laser light is disposed. Laser light irradiation units 60A1 and 60A2 included in the processing area 40A, laser light irradiation units 60B1 and 60B2 included in the processing area 40B, and lasers are alternately applied to the processing area 40A and the processing area 40B. A branching unit 81 that distributes light is arranged. On the lower plate 43 in the lower layer, XY tables 70A1 and 70A2 included in the processing area 40A and XY tables 70B1 and 70B2 included in the processing area 40B are arranged.

  The laser light oscillation unit 80 and the branch unit 81 are disposed between the processing areas 40A and 40B. On the middle plate 42, mirror units 82 a to 82 c that totally reflect the laser light emitted from the laser light oscillation unit 80 and enter the branch unit 81 are disposed. The branch unit 81 includes a total reflection mirror unit 81a and a drive unit 81b that rotates the mirror unit 81a by 90 ° around the Z axis. The branch unit 81 rotates the mirror unit 81a by 90 ° to change the traveling direction of the laser light incident from the laser light oscillation unit 80 through the mirror units 82a to 82c by 180 °. Thereby, the laser beam can be selectively distributed to the processing areas 40A and 40B.

  On the middle plate 42, a spectroscopic unit (first spectroscopic unit) 63A for splitting the laser light distributed to the processing area 40A by the branching unit 81 in two is installed. In the processing area 40B, the branching unit 81 A spectroscopic unit (second spectroscopic unit) 63B that splits the laser light distributed to the processing area 40B into two is disposed. The spectroscopic units 63A and 63B incorporate a so-called half mirror.

  The laser light irradiation unit 60A1 includes mirror units 64A1 to 64A5 that totally reflect the laser light transmitted through the half mirror among the laser light split into two by the spectroscopic unit 63A, a lens barrel 65A that includes a condensing lens, It includes a shutter 66A that blocks laser light between the mirror units 64A1 and 64A2. The laser light incident on the laser light irradiation unit 60A1 is totally reflected by the mirror units 64A1 to 64A5 by being opened by the shutter 66A, is incident on the lens barrel 65A, and the work is passed through the condenser lens in the lens barrel 65A. Wa is irradiated.

  The laser beam irradiation unit 60A2 includes a mirror unit 67A1 to 67A4 that totally reflects the laser beam half-reflected without passing through the half mirror among the laser beams split into two by the spectroscopic unit 63A, and a condensing lens. It includes a lens barrel 68A and a shutter 69A that blocks laser light between the spectroscopic unit 63A and the mirror unit 67A1. The laser light incident on the laser light irradiation unit 60A2 is totally reflected by the mirror units 67A1 to 67A4 by being opened by the shutter 69A, is incident on the lens barrel 68A, and the work is passed through the condenser lens in the lens barrel 68A. Wb is irradiated.

  The XY table 70A1 is disposed below the laser light irradiation unit 60A1, and the XY table 70A2 is disposed below the laser light irradiation unit 60A2. The optical axes of the lens barrels 65A and 68A are both fixed (parallel to the Z axis), and the laser beams are irradiated perpendicularly to the workpieces Wa and Wb on the XY tables 70A1 and 70A2. The scanning tables (XY drive units) of the XY tables 70A1 and 70A2 are horizontally moved independently in the XY axis directions on the workpieces Wa and Wb. Thereby, a laser beam can be irradiated to any position in the horizontal direction on the workpieces Wa and Wb, and an arbitrary scribe line is formed on the surfaces of the workpieces Wa and Wb.

  The laser light irradiation unit 60B1 incorporates mirror units 64B1 to 64B4 that totally reflect the laser light that is half-reflected without passing through the half mirror among the laser light split into two by the spectroscopic unit 63B, and a condensing lens. It includes a lens barrel 65B and a shutter 66B that blocks laser light between the spectroscopic unit 63B and the mirror unit 64B1. The laser light incident on the laser light irradiation unit 60B1 is totally reflected by the mirror units 64B1 to 64B5 and incident on the lens barrel 65B by opening the shutter 66B, and the work is passed through the condenser lens in the lens barrel 65B. Wa is irradiated.

  The laser light irradiation unit 60B2 includes mirror units 67B1 to 67B5 that totally reflect the laser light transmitted through the half mirror among the laser light split into two by the spectroscopic unit 63B, a lens barrel 68B that incorporates a condensing lens, It includes a shutter 69B that shields laser light between the mirror units 67B1 and 67B2. The laser light incident on the laser light irradiation unit 60B2 is totally reflected by the mirror units 67B1 to 67B4 by being opened by the shutter 69B, and is incident on the lens barrel 68B. The work is passed through the condenser lens in the lens barrel 68B. Wb is irradiated.

  The XY table 70B1 is disposed below the laser light irradiation unit 60B1, and the XY table 70B2 is disposed below the laser light irradiation unit 60B2. The optical axes of the lens barrels 65B and 68B are both fixed in parallel to the Z axis, and laser beams are irradiated perpendicularly to the workpieces Wa and Wb on the XY tables 70B1 and 70B2. The scanning table (XY drive unit) of the XY tables 70B1 and 70B2 is horizontally moved in the XY axis direction with the workpieces Wa and Wb mounted thereon. Thereby, a laser beam can be irradiated to any position in the horizontal direction on the workpieces Wa and Wb, and an arbitrary scribe line is formed on the surfaces of the workpieces Wa and Wb.

  The control unit 100 includes each unit of the laser processing apparatus 1, that is, the supply unit 10, the carry-out unit 20, the transporters 50A and 50B, the laser light irradiation units 60A1, 60A2, 60B1 and 60B2, the XY tables 70A1, 70A2, 70B1 and 70B2, and the laser. The following laser processing is performed by controlling the operation of the optical oscillation unit 80 and the branch unit 81.

Next, laser processing performed by the laser processing apparatus 1 will be described.
First, in the pre-stage of laser processing, the conveyor 50A is disposed in the vicinity of the supply unit 10, and the conveyor 50B is disposed between the processing area 40 and the unloading unit 20. Concurrently with the start of laser processing, the conveyor 50A sucks the first set of unprocessed workpieces Wa and Wb using the gripper 51 and takes them out of the supply unit 10, and rotates the gripper 51 to rotate the workpieces Wa and Wb. Is shifted to the processing area 40 side. Subsequently, the transporter 50A is moved from the supply unit 10 to the processing area 40A together with the workpieces Wa and Wb. The transporter 50A moved to the processing area 40A inputs the first set of unprocessed workpieces Wa and Wb into the processing area 40A under the condition (trigger) that a workpiece input permission signal is transmitted to the processing area 40A. To do. That is, the transporter 50A releases the suction of the first set of workpieces Wa and Wb from the gripper 51, places the workpiece Wa on the scanning platform of the XY table 70A1, and also places the workpiece Wb on the scanning platform of the XY table 70A2. Place on top.
The conveyor 50A that has loaded the first set of workpieces Wa and Wb into the processing area 40A is moved from the processing area 40A to the supply unit 10 in order to take out the second set of unprocessed workpieces.

The transporter 50A that has returned to the supply unit 10 sucks the second unprocessed workpieces Wa and Wb using the gripper 51 and removes them from the supply unit 10, and processes the orientation of the workpieces Wa and Wb in the same manner as described above. After shifting to the area 40 side, the supply unit 10 moves to the processing area 40B. The transporter 50A moved to the processing area 40B inputs the second set of unprocessed workpieces Wa and Wb to the processing area 40B on condition that a workpiece input permission signal is transmitted to the processing area 40B. That is, the conveyance device 50A releases the suction of the second set of workpieces Wa and Wb from the gripper 51, places the workpiece Wa on the scanning table of the XY table 70B1, and also places the workpiece Wb on the scanning table of the XY table 70B2. Place on top.
The conveyor 50A that has loaded the second set of workpieces Wa and Wb into the processing area 40B is moved from the processing area 40B to the supply unit 10 in order to take out the third set of unprocessed workpieces Wa and Wb.

  In the processing area 40A, the XY tables 70A1 and 70A2 move the first set of workpieces Wa and Wb to predetermined positions, respectively. Thereafter, the laser beam irradiation units 60A1 and 60A2 simultaneously irradiate the workpieces Wa and Wb with laser beams, and horizontally move the XY tables 70A1 and 70A2. Thereby, arbitrary scribe lines are formed on the surfaces of the first set of workpieces Wa and Wb. Thereafter, the workpieces Wa and Wb are divided along the scribe line, and the workpieces Wa and Wb are divided into necessary portions (work body portions) and surplus pieces. Unnecessary surplus pieces are collected by a first suction device (not shown). The cutting process is performed, for example, by bringing an ultrasonic transducer into contact along the scribe line. Further, the suction and recovery of the surplus pieces may be performed at the same time as the parting process or at any timing after the parting process.

In the processing area 40B, the XY tables 70B1 and 70B2 move the second set of workpieces Wa and Wb to predetermined positions, respectively. Thereafter, the laser beam irradiation units 60B1 and 60B2 simultaneously irradiate the workpieces Wa and Wb with laser beams, and move the XY tables 70A1 and 70A2 horizontally in an arbitrary direction. Thereby, arbitrary scribe lines are formed on the surfaces of the second set of workpieces Wa and Wb. Thereafter, the workpieces Wa and Wb are divided along the scribe line, and the workpieces Wa and Wb are divided into necessary portions (work body portions) and surplus pieces. Unnecessary surplus pieces are collected by the first suction device (not shown).
After the conveyor 50A is moved from the processing area 40B to the supply unit 10 to take out the third set of unprocessed workpieces, the conveyor 50B moves to the processing area 40A to take out the first set of workpieces Wa and Wb. Moved.

The transfer machine 50B moved to the processing area 40A uses the gripper 51 to transfer the first set of workpieces Wa and Wb that have undergone the cutting process on condition that a workpiece removal permission signal is transmitted to the processing area 40A. It is adsorbed and taken out from the processing area 40A, and the orientation of the gripping part 51 is further changed by 90 ° before being moved to the carry-out unit 20. Thereafter, the first set of workpieces Wa and Wb that have been subjected to the dividing process are transferred from the transport device 50B to the carry-out unit 20.
The transporter 50B that has transferred the first set of workpieces Wa and Wb to the carry-out unit 20 is moved to the processing area 40B to take out the second set of workpieces Wa and Wb.

While the transfer machine 50B delivers the first set of workpieces Wa and Wb to the carry-out unit 20, the transfer machine 50A takes out the third set of unprocessed works Wa and Wb from the supply unit 10 to the processing area 40A. Moved. In the meantime, in the processing area 40A, a second suction device (not shown) sucks the surface of the scanning table of the XY tables 70A1 and 70A2, thereby removing glass debris. When the cleaning of the processing area 40A is completed, the transporter 50A puts the third set of workpieces Wa and Wb into the processing area 40A.
The conveyor 50A that has loaded the third set of workpieces Wa and Wb into the processing area 40A is moved from the processing area 40A to the supply unit 10 in order to take out the fourth set of unprocessed workpieces Wa and Wb.

The conveyor 50B moved to the processing area 40B uses the gripper 51 to transfer the second set of workpieces Wa and Wb that have been subjected to the cutting process, on condition that a workpiece removal permission signal is transmitted to the processing area 40B. It is adsorbed and taken out from the processing area 40B and is moved to the carry-out unit 20 in the same manner as described above. Thereafter, the second set of processed workpieces Wa and Wb that have been subjected to the dividing process are delivered from the transport device 50B to the carry-out unit 20.
The transporter 50B that has transferred the second set of workpieces Wa and Wb to the carry-out unit 20 is moved between the processing area 40B and the carry-out unit 20 and is put on standby.

While the transfer machine 50B delivers the second set of workpieces Wa and Wb to the carry-out unit 20, the transfer machine 50A takes out the fourth set of unprocessed works Wa and Wb from the supply unit 10 to the processing area 40B. Moved. In the meantime, in the processing area 40B, the second suction device (not shown) sucks the surface of the scanning table of the XY tables 70B1 and 70B2, thereby removing glass debris. When the cleaning of the processing area 40B is completed, the transporter 50A puts the fourth set of workpieces Wa and Wb into the processing area 40B.
The transporter 50A that has loaded the fourth set of workpieces Wa and Wb into the processing area 40B is moved to the supply unit 10 and placed on standby.
Thereafter, the above steps are repeated, and the plurality of workpieces Wa and Wb are sequentially subjected to laser processing.

According to this embodiment, during the idle time of laser processing in the processing area 40A (or 40B), preparation for laser processing in the processing area 40B (or 40A) is performed, and work in the processing area during laser processing and laser processing preparation are performed. It is possible to apparently reduce the idle time by alternately performing the operations in the inside processing area and superimposing them in time. For example, in the processing area 40A,
1) a step in which the transporter 50A takes out a workpiece from the supply unit 10 and is moved to the processing area 40A, and puts the workpiece into the processing area 40A;
2) A step of performing laser processing on the workpiece in the processing area 40A,
3) a step in which the transport machine 50B takes out the processed workpiece (the workpiece after the division processing) from the processing area 40A and carries the workpiece to the carry-out unit 20;
4) a step of moving the transport machine 50A from the processing area 40A to the supply unit 10;
5) When a process such as a process of moving the transporter 50B from the carry-out unit 20 to the processing area 40A is performed, the predetermined process in the above 1) -5) is performed in the processing area 40B by superimposing in time. Thereby, it is possible to reduce the idle time that occurs between the time when the workpieces Wa and Wb are taken out from the supply unit 10 and after the parting process is finished and delivered to the carry-out unit 20. As a result, the laser processing process for the workpieces Wa and Wb is improved, and the cycle time of product manufacture can be shortened, and the mass productivity of various products including workpieces is improved.

  By the way, in this embodiment, when the workpiece feeding permission signal is transmitted to either the processing area 40A or the processing area 40B, the transport machine 50A moves the workpiece to the processing area where the workpiece loading permission signal is transmitted. Wa and Wb are input. In addition, when the work input permission signal is transmitted to both the processing area 40A and the processing area 40B, the transfer machine 50A is arbitrarily selected from the processing area 40A or the processing area 40B. Alternatively, the workpieces Wa and Wb may be loaded.

  In the present embodiment, when the workpiece removal permission signal is transmitted to either the processing area 40A or the processing area 40B, the transport machine 50B receives the workpiece Wa from the processing area from which the workpiece removal permission signal is transmitted. , Wb is taken out. In addition, when the workpiece take-out permission signal is transmitted to both the processing area 40A and the processing area 40B, the transport machine 50A can arbitrarily select one of the processing areas 40A or 40B. Then, the workpieces Wa and Wb may be taken out.

(Second embodiment)
As shown in FIGS. 5 to 7, the laser processing apparatus 2 as the second embodiment of the present invention includes a reversing unit 90 that reverses the workpiece W in addition to the configuration included in the first embodiment. Yes.
The reversing unit 90 is provided facing the transport path 30 upstream of the processing area 40 in the transport direction of the workpiece W, that is, between the supply unit 10 and the processing area 40A. The reversing unit 90 includes suction arms 91a and 91b that suck and grip two workpieces Wa and Wb, and reversing bases 92a and 92b on which the workpieces Wa and Wb are placed. The operation of the reversing unit 90 is also controlled by the control unit 100. The suction arms 91a and 91b receive the workpieces Wa and Wb from the transport machine 50A, are rotated 180 ° around the Y axis (horizontal axis orthogonal to the arrangement direction of the workpieces Wa and Wb), and then the workpieces Wa and Wb are reversed. It is mounted on 92a and 92b, respectively. As a result, the workpieces Wa and Wb are reversed and the front and back sides are reversed.

  In the present embodiment, the transport machine 50A transports the workpieces Wa and Wb between the supply unit 10 and the reversing unit 90, and further transfers the workpieces Wa and Wb between the reversing unit 90 and the processing area 40A (or 40B). Transport. The conveyor 50B conveys the workpieces Wa and Wb between the processing area 40A (or 40B) and the carry-out unit 20.

Next, laser processing performed by the laser processing apparatus 2 will be described.
First, in the pre-stage of laser processing, the conveyor 50A is disposed in the vicinity of the supply unit 10, and the conveyor 50B is disposed between the processing area 40B and the unloading unit 20. Concurrently with the start of laser processing, the conveyor 50A picks up the first set of unprocessed workpieces Wa and Wb using the gripper 51 and removes them from the supply unit 10 and rotates the gripper 51 to rotate the workpieces Wa and Wb. Is shifted to the processing area 40 side. Subsequently, the transporter 50A is moved from the supply unit 10 to the processing area 40A. The transporter 50A moved to the processing area 40A places the work Wa on the scanning table of the XY table 70A1, and places the work Wb on the scanning table of the XY table 70A2.
The conveyor 50A that has loaded the first set of workpieces Wa and Wb into the processing area 40A is moved from the processing area 40A to the supply unit 10 in order to take out the second set of unprocessed workpieces.

The transporter 50A that has returned to the supply unit 10 takes out the second unprocessed workpieces Wa and Wb from the supply unit 10, shifts the orientation of the workpieces Wa and Wb toward the processing area 40 in the same manner as described above, and then supplies the workpieces. The unit 10 is moved to the processing area 40B. The transporter 50A moved to the processing area 40B places the work Wa on the scanning table of the XY table 70B1, and places the work Wb on the scanning table of the XY table 70B2.
The conveyor 50A that has loaded the second set of workpieces Wa and Wb into the processing area 40B is moved to the processing area 40A.

  In the processing area 40A, the controller 100 causes the laser light irradiation units 60A1 and 60A2 and the XY tables 70A1 and 70A2 to cooperate to form a scribe line on one surface of the first set of workpieces Wa and Wb. Similarly, in the processing area 40B, the control unit 100 causes the laser light irradiation units 60B1 and 60B2 and the XY tables 70B1 and 70B2 to cooperate to form a scribe line on one surface of the second set of workpieces Wa and Wb. The

  After a scribe line is formed on one surface of the first set of workpieces Wa and Wb, the transfer device 50A takes out the first set of workpieces Wa and Wb that have finished laser processing on the one surface from the processing area 40A. The transporter 50A that has taken out the first set of workpieces Wa and Wb from the processing area 40A is moved to the reversing unit 90, and delivers the first set of workpieces Wa and Wb to the reversing unit 90. The reversing unit 90 reverses the front and back of the first set of workpieces Wa and Wb. The transporter 50A takes out the first set of workpieces Wa and Wb whose front and back are reversed from the reversing unit 90, and then moves to the processing area 40A. In the meantime, in the processing area 40A, a suction process is performed on the scanning tables of the XY tables 70A1 and 70A2 by a second suction device (not shown) to remove glass debris. After the cleaning of the processing area 40A is completed, the transporter 50A puts the first set of workpieces Wa and Wb with the front and back reversed into the processing area 40A.

  After the scribe line is formed on one surface of the second set of workpieces Wa and Wb, the transfer device 50A is moved to the processing area 40B, and the second set that has finished laser processing on one surface from the processing area 40B. The workpieces Wa and Wb are taken out. The transporter 50A that has taken out the second set of workpieces Wa and Wb from the processing area 40B is moved to the reversing unit 90 and transfers the second set of workpieces Wa and Wb to the reversing unit 90. The reversing unit 90 reverses the front and back of the second set of workpieces Wa and Wb. The transporter 50A takes the second set of workpieces Wa and Wb whose front and back are reversed from the reversing unit 90, and then moves to the processing area 40B. In the meantime, in the processing area 40B, a suction process is performed on the scanning tables of the XY tables 70B1 and 70B2 by a second suction device (not shown) to remove glass debris. After the cleaning of the processing area 40B is completed, the transporter 50A puts the second set of workpieces Wa and Wb with the front and back reversed into the processing area 40B again.

  In the processing area 40A, the control unit 100 causes the laser light irradiation units 60A1 and 60A2 and the XY tables 70A1 and 70A2 to cooperate with each other, and is already formed on the other surface of the first set of workpieces Wa and Wb. A new scribe line that traces the scribe line from the back is formed. Thereafter, the workpieces Wa and Wb are divided along the scribe line, and the workpieces Wa and Wb are divided into necessary portions (work body portions) and surplus pieces. Unnecessary surplus pieces are collected by a first suction device (not shown).

Thereafter, the conveyor 50 </ b> B takes out the first set of workpieces Wa and Wb that have been subjected to the dividing process from the processing area 40 </ b> A and moves them to the carry-out unit 20. The conveyor 50 </ b> B moved to the carry-out unit 20 delivers the first set of workpieces Wa and Wb that have been subjected to the cutting process to the carry-out unit 20.
The transporter 50B that has transferred the first set of workpieces Wa and Wb to the carry-out unit 20 is moved to the processing area 40B to take out the second set of workpieces Wa and Wb.

While the transfer machine 50B delivers the first set of workpieces Wa and Wb to the carry-out unit 20, the transfer machine 50A takes out the third set of unprocessed works Wa and Wb from the supply unit 10 to the processing area 40A. Moved. In the meantime, in the processing area 40A, a suction process is performed on the scanning tables of the XY tables 70A1 and 70A2 in the same manner as described above, and glass debris is removed. After the cleaning of the processing area 40A is completed, the transporter 50A puts the third set of workpieces Wa and Wb into the processing area 40A.
The conveyor 50A that has loaded the third set of workpieces Wa and Wb into the processing area 40A is moved from the processing area 40A to the supply unit 10 in order to take out the fourth set of unprocessed workpieces Wa and Wb.

  In the processing area 40B, the control unit 100 causes the laser light irradiation units 60B1 and 60B2 and the XY tables 70B1 and 70B2 to cooperate with each other and is already formed on the other surface of the second set of workpieces Wa and Wb. A new scribe line that traces the scribe line from the back is formed. Thereafter, the workpieces Wa and Wb are divided along the scribe line, and the workpieces Wa and Wb are divided into necessary portions (work body portions) and surplus pieces. Unnecessary surplus pieces are collected by a first suction device (not shown).

Thereafter, the conveyor 50B takes out the second set of workpieces Wa and Wb that have been subjected to the dividing process from the processing area 40A and moves them to the carry-out unit 20. The transfer machine 50 </ b> B moved to the carry-out unit 20 delivers the second set of workpieces Wa and Wb that have undergone the cutting process to the carry-out unit 20.
The transfer machine 50B that has transferred the second set of workpieces Wa and Wb to the carry-out unit 20 is moved between the process area 40B and the carry-out unit 20 or to the process area 40A, and is put on standby. It is set in advance according to the length of the cycle time that accompanies the workpiece processing to which the transport machine 50B is moved. Alternatively, the control unit 100 may determine and determine which of the transport machines 50B should be moved according to the operation status of the processing areas 40A and 40B and the transport status of the transport machine 50A.

While the transfer machine 50B delivers the second set of workpieces Wa and Wb to the carry-out unit 20, the transfer machine 50A takes out the fourth set of unprocessed works Wa and Wb from the supply unit 10 to the processing area 40B. Moved. During this time, in the processing area 40B, suction processing is performed on the scanning tables of the XY tables 70B1 and 70B2 in the same manner as described above, and glass debris is removed. When the cleaning of the processing area 40B is completed, the transporter 50A puts the fourth set of workpieces Wa and Wb into the processing area 40B.
The transporter 50A that has loaded the fourth set of workpieces Wa and Wb into the processing area 40B is moved to the vicinity of the supply unit 10 and placed on standby.
Thereafter, the above cycle is repeated to sequentially perform laser processing on the plurality of workpieces Wa and Wb.

  According to the present embodiment, it is possible to reduce the idle time that occurs between the time when the workpieces Wa and Wb are taken out from the supply unit 10, finished with laser processing and division processing, and delivered to the carry-out unit 20. As a result, the laser processing process for the workpieces Wa and Wb is improved, and the cycle time of product manufacture can be shortened, and the mass productivity of various products including workpieces is improved.

(Third embodiment)
As shown in FIGS. 8 to 10, the laser processing apparatus 3 as the third embodiment of the present invention includes, on the transport path 30, transporters 50 </ b> A and 50 </ b> B in addition to the configuration included in the second embodiment. 50C is provided with a transporter (third transporter) 50C that transports the workpiece W in cooperation.
Similarly to the transporters 50A and 50B, the transporter 50C has a gripping part 51 having a pair of arms that simultaneously attract and grip two workpieces W, and a rotation that rotates the gripping part 51 around a vertical Z axis. A moving part 52 and a traveling carriage 53 that is moved along the conveyance path 30 are provided. Adsorption, rotation, and movement in the transport machine 50C are controlled by the control unit 100 as in the transport machines 50A and 50B.

  In the present embodiment, the transport device 50A transports the workpiece W between the supply unit 10 and the reversing unit 90, and the transport device 50B transports the work W between the reversing unit 90 and the processing area 40A (or 40B). The conveyor 50C conveys the workpiece W between the processing area 40A (or 40B) and the carry-out unit 20.

Next, laser processing performed by the laser processing apparatus 3 will be described.
First, in the pre-stage of laser processing, the transporter 50A is disposed in the vicinity of the supply unit 10, and the transporter 50B is disposed between the reversing unit 90 and the processing area 40. Further, the conveyor 50C is disposed between the processing area 40B and the carry-out unit 20. Concurrently with the start of laser processing, the conveyor 50A sucks the first set of unprocessed workpieces Wa and Wb using the gripper 51 and takes them out of the supply unit 10, and rotates the gripper 51 to rotate the workpieces Wa and Wb. Is shifted to the reversing unit 90 side. Subsequently, the conveyor 50A is moved from the supply unit 10 to the reversing unit 90 together with the first set of works Wa and Wb, and delivers the work Wa and Wb to the reversing unit 90.
The transfer machine 50A that has transferred the first set of workpieces Wa and Wb to the reversing unit 90 is moved to the supply unit 10 to take out the second set of unprocessed workpieces Wa and Wb.

The reversing unit 90 that has received the first set of workpieces Wa and Wb reverses the front and back of the workpieces Wa and Wb. The conveyor 50B takes out the first set of workpieces Wa and Wb whose front and back are reversed from the reversing unit 90 and moves them to the processing area 40A. The transporter 50B moved to the processing area 40A places the workpiece Wa on the scanning table of the XY table 70A1 and places the workpiece Wb on the scanning table of the XY table 70A2.
The conveyor 50B that has loaded the first set of workpieces Wa and Wb into the processing area 40A is moved to the reversing unit 90 in order to take out the second set of unprocessed workpieces.
The conveyor 50A that has returned to the supply unit 10 takes out the second unprocessed workpieces Wa and Wb from the supply unit 10 and transfers them to the reversing unit 90 in the same manner as described above.

  The reversing unit 90 that has received the second set of workpieces Wa and Wb reverses the front and back of the workpieces Wa and Wb. The conveyor 50B takes out the second set of workpieces Wa and Wb whose front and back are reversed from the reversing unit 90 and moves them to the processing area 40B. The transporter 50B moved to the processing area 40B places the work Wa on the scanning table of the XY table 70B1, and places the work Wb on the scanning table of the XY table 70B2.

  In the processing area 40A, the controller 100 causes the laser light irradiation units 60A1 and 60A2 and the XY tables 70A1 and 70A2 to cooperate to form a scribe line on one surface of the first set of workpieces Wa and Wb. Similarly, in the processing area 40B, the control unit 100 causes the laser light irradiation units 60A1 and 60A2 and the XY tables 70A1 and 70A2 to cooperate to form a scribe line on one surface of the second set of workpieces Wa and Wb. The

  When the scribe line is formed on one surface of the first set of workpieces Wa and Wb, the transfer device 50B is moved to the processing area 40A, and the first set of workpieces Wa and Wb that has finished laser processing on the one surface is transferred. Take out. The conveyor 50B that has taken out the first set of workpieces Wa and Wb from the processing area 40A is moved to the reversing unit 90, and delivers the first set of workpieces Wa and Wb to the reversing unit 90. The reversing unit 90 reverses the front and back of the first set of workpieces Wa and Wb. The conveyor 50B takes out the first set of workpieces Wa and Wb whose front and back are reversed from the reversing unit 90 and moves them to the processing area 40A. In the meantime, in the processing area 40A, a suction process is performed on the scanning tables of the XY tables 70A1 and 70A2 by a second suction device (not shown) to remove glass debris. After the cleaning of the processing area 40A is completed, the transporter 50B inputs the first set of workpieces Wa and Wb whose front and back are reversed into the processing area 40A again.

  After the scribe line is formed on one surface of the second set of workpieces Wa and Wb, the transfer device 50B is moved to the processing area 40B, and the second set of workpieces Wa and Wb that has finished laser processing on one side. Take out. The transporter 50B that has taken out the second set of workpieces Wa and Wb from the processing area 40B is moved to the reversing unit 90, and transfers the second set of workpieces Wa and Wb to the reversing unit 90. The reversing unit 90 reverses the front and back of the second set of workpieces Wa and Wb. The conveyor 50B takes out the second set of workpieces Wa and Wb whose front and back are reversed from the reversing unit 90 and moves them to the processing area 40B. In the meantime, in the processing area 40B, a suction process is performed on the scanning tables of the XY tables 70B1 and 70B2 by a second suction device (not shown) to remove glass debris. After the cleaning of the processing area 40A is completed, the transporter 50B puts the second set of workpieces Wa and Wb whose front and back are reversed into the processing area 40B again.

  While the transfer machine 50B puts the second set of workpieces Wa and Wb into the processing area 40B, the transfer machine 50A takes out the third set of unprocessed works Wa and Wb from the supply unit 10 and receives them by the reversing unit 90. hand over. The reversing unit 90 reverses the front and back of the third set of workpieces Wa and Wb.

  In the processing area 40A, the control unit 100 causes the laser light irradiation units 60A1 and 60A2 and the XY tables 70A1 and 70A2 to cooperate with each other, and is already formed on the other surface of the first set of workpieces Wa and Wb. A new scribe line that traces the scribe line from the back is formed. Thereafter, the workpieces Wa and Wb are divided along the scribe line, and the workpieces Wa and Wb are divided into necessary portions (work body portions) and surplus pieces. Unnecessary surplus pieces are collected by a first suction device (not shown).

Thereafter, the conveyor 50 </ b> C takes out the first set of workpieces Wa and Wb that have been subjected to the dividing process from the processing area 40 </ b> A and moves them to the carry-out unit 20. The conveyor 50 </ b> C moved to the carry-out unit 20 delivers the first set of workpieces Wa and Wb that have undergone the cutting process to the carry-out unit 20.
The conveyor 50C that has transferred the first set of workpieces Wa and Wb to the carry-out unit 20 is moved to the processing area 40B in order to take out the second set of workpieces Wa and Wb.

While the conveyor 50C transfers the first set of workpieces Wa and Wb to the unloading unit 20, the conveyor 50B takes out the third set of workpieces Wa and Wb whose front and back are reversed from the reversing unit 90, and processes them. Moved to area 40A. In the meantime, in the processing area 40A, a suction process is performed on the scanning tables of the XY tables 70A1 and 70A2 in the same manner as described above, and glass debris is removed. After the cleaning of the processing area 40A is completed, the transporter 50B inputs the third set of workpieces Wa and Wb into the processing area 40A.
The conveyor 50B that has loaded the third set of workpieces Wa and Wb into the processing area 40A is moved from the processing area 40A to the reversing unit 90 in order to receive the fourth set of unprocessed workpieces Wa and Wb.

While the transfer machine 50B puts the third set of workpieces Wa and Wb into the processing area 40A, the transfer machine 50A takes out the fourth set of unprocessed works Wa and Wb from the supply unit 10 and receives them by the reversing unit 90. hand over. The reversing unit 90 reverses the front and back of the fourth set of workpieces Wa and Wb.
The transfer machine 50A that has transferred the fourth set of unprocessed workpieces Wa and Wb to the reversing unit 90 is moved to the vicinity of the supply unit 10 and placed on standby.

  In the processing area 40B, the control unit 100 causes the laser light irradiation units 60B1 and 60B2 and the XY tables 70B1 and 70B2 to cooperate with each other and is already formed on the other surface of the second set of workpieces Wa and Wb. A new scribe line that traces the scribe line from the back is formed. Thereafter, the workpieces Wa and Wb are divided along the scribe line, and the workpieces Wa and Wb are divided into necessary portions (work body portions) and surplus pieces. Unnecessary surplus pieces are collected by a first suction device (not shown).

Thereafter, the conveyor 50 </ b> C takes out the second set of workpieces Wa and Wb that have been subjected to the dividing process from the processing area 40 </ b> A and moves them to the carry-out unit 20. The conveyor 50 </ b> C moved to the carry-out unit 20 delivers the second set of workpieces Wa and Wb that have been subjected to the cutting process to the carry-out unit 20.
The conveyor 50C that has transferred the second set of workpieces Wa and Wb to the carry-out unit 20 is moved between the processing area 40 and the carry-out unit 20 and is put on standby.

While the transfer machine 50C delivers the second set of workpieces Wa and Wb to the carry-out unit 20, the transfer machine 50B takes out the fourth set of works Wa and Wb whose front and back are reversed from the reversing unit 90 and processes them. Moved to area 40B. During this time, in the processing area 40B, suction processing is performed on the scanning tables of the XY tables 70B1 and 70B2 in the same manner as described above, and glass debris is removed. After the cleaning of the processing area 40B is completed, the transporter 50B inputs the fourth set of workpieces Wa and Wb into the processing area 40B.
The transporter 50B that has loaded the fourth set of workpieces Wa and Wb into the processing area 40B is moved between the reversing unit 90 and the processing area 40A and is put on standby.
Thereafter, the above cycle is repeated, and the plurality of workpieces Wa and Wb are sequentially subjected to laser processing.

  According to the present embodiment, it is possible to reduce the idle time that occurs between the time when the workpieces Wa and Wb are taken out from the supply unit 10, finished with laser processing and division processing, and delivered to the carry-out unit 20. As a result, the laser processing process for the workpieces Wa and Wb is improved, and the cycle time of product manufacture can be shortened, and the mass productivity of various products including workpieces is improved.

  By the way, in this embodiment, the workpieces Wa and Wb taken out from the supply unit 10 are transferred to the reversing unit 90 and reversed, and one surface of the workpieces Wa and Wb is irradiated with laser light to form a scribe line. Subsequently, the workpieces Wa and Wb on which one of the scribe lines is formed are transferred again to the reversing unit 90 and reversed, and the other surface of the workpieces Wa and Wb is irradiated with laser light to form a scribe line. The However, without forming a scribe line on the other surface of the workpieces Wa and Wb, a scribe line is formed only on one surface, and then a parting process is performed, and the workpieces Wa and Wb are transferred to the carry-out unit 20. You may do it.

  The present invention relates to a laser processing apparatus that performs laser processing on a workpiece and a processing method for the workpiece. According to the present invention, the mass productivity of various products including workpieces can be improved.

Claims (12)

A conveyor that holds the workpiece; a conveyance path on which the conveyor travels; and a processing area that is provided facing the conveyance path. The workpiece is supplied to the processing area by the conveyor, and a laser is applied to the workpiece. A laser processing apparatus for irradiating light,
A first conveyor for supplying untreated workpieces to the treatment area;
A second transporter that unloads the processed workpiece irradiated with laser light from the processing area;
A supply unit for supplying the untreated workpiece to the first transporter;
An unloading unit that receives the processed workpiece from the second transporter;
The processing area is
A first processing area and a second processing area;
One laser beam oscillation unit that oscillates the laser beam;
A branching unit that divides the laser light oscillated from the laser light oscillation unit into the first processing area and the second processing area;
A first laser light irradiation unit that is provided in the first processing area and that irradiates the workpiece supplied to the first processing area with the laser light distributed to the first processing area by the branch unit. When,
A second laser light irradiation unit that is provided in the second processing area and that irradiates the workpiece supplied to the second processing area with the laser light distributed to the second processing area by the branch unit. A laser processing apparatus. A reversing unit that faces the transport path and is provided on the upstream side of the first processing area in the transport direction, and further reverses the workpiece,
The said 1st conveying machine conveys the said un-processed workpiece | work or the said processed workpiece | work between the said inversion unit and said 1st processing area or said 2nd processing area. Laser processing equipment. The processing area is
A spectroscopic unit that splits the laser light distributed by the branch unit into at least two laser lights;
A first irradiation unit configured to irradiate each workpiece supplied to the first processing area with at least two laser beams provided in the first processing area and distributed to the first processing area by the spectroscopic unit. A group of laser light irradiation units,
A second laser beam is provided in the second processing area, and irradiates each workpiece supplied to the second processing area with at least two laser beams distributed to the second processing area by the spectroscopic unit. The laser processing apparatus according to claim 1, further comprising: a laser beam irradiation unit group. A transport machine that holds the work, a transport path on which the transport machine travels, and a processing area that is provided facing the transport path. A laser processing apparatus for irradiating a laser beam,
An inversion unit that faces the conveyance path and is provided on the upstream side in the conveyance direction from the processing area, and reverses the workpiece.
A first transporter for supplying unprocessed workpieces to the reversing unit;
A second transporter for supplying unprocessed workpieces to the processing area;
A third transfer machine for carrying out the processed workpiece irradiated with laser light from the processing area;
A supply unit for supplying the untreated workpiece to the first transporter;
A carry-out unit for receiving the processed workpiece from the third transfer machine,
The processing area is
A first processing area and a second processing area;
One laser beam oscillation unit that oscillates the laser beam;
A branching unit that distributes the laser light oscillated from the laser light oscillation unit to the first processing area or the second processing area;
A first laser light irradiation unit that is provided in the first processing area and that irradiates the workpiece supplied to the first processing area with the laser light distributed to the first processing area by the branch unit. When,
A second laser light irradiation unit that is provided in the second processing area and that irradiates the workpiece supplied to the second processing area with the laser light distributed to the second processing area by the branch unit. A laser processing apparatus. The processing area is
A spectroscopic unit that splits the laser light distributed by the branch unit into at least two laser lights;
A first irradiation unit configured to irradiate each workpiece supplied to the first processing area with at least two laser beams provided in the first processing area and distributed to the first processing area by the spectroscopic unit. A group of laser light irradiation units,
A second laser beam is provided in the second processing area, and irradiates each workpiece supplied to the second processing area with at least two laser beams distributed to the second processing area by the spectroscopic unit. The laser processing apparatus according to claim 4, further comprising a laser beam irradiation unit group. An unprocessed workpiece supply unit, a processed workpiece unloading unit, a transfer path provided between the supply unit and the unloading unit, a processing area provided facing the transfer path, and the transfer A first transporter that travels on a road and supplies the unprocessed work to the processing area; and a second transporter that transports the processed work that has traveled and processed on the transport path from the processing area. A processing method for processing the workpiece using a processing apparatus including a transfer machine,
While moving the first transporter in the vicinity of the supply unit, moving the second transporter between the processing area and the unloading unit,
The unprocessed work is supplied to the supply unit, the unprocessed work is taken out by the first transporter, and the first transporter is moved from the supply unit to the processing area,
The unprocessed work held by the first transfer machine is thrown into the processing area,
Moving the first transporter to the supply unit and moving the second transporter to the processing area;
Processing the unprocessed work put in the processing area,
The processed workpiece that has been processed is taken out by the second transporter, the second transporter is moved from the processing area to the unloading unit, and the processed workpiece is moved to the second transporter. A processing method for delivering from a transfer machine to the carry-out unit. A reversing unit that faces the transport path and is provided on the upstream side of the processing area in the transport direction, and further reverses the workpiece,
While moving the first transporter in the vicinity of the supply unit, moving the second transporter between the processing area and the unloading unit,
The unprocessed work is supplied to the supply unit, the unprocessed work is taken out by the first transporter, and the first transporter is moved from the supply unit to the processing area,
The unprocessed work held by the first transfer machine is thrown into the processing area,
Processing the unprocessed work put in the processing area,
The processed workpiece subjected to processing is taken out by the first transfer machine, and the first transfer machine is moved from the processing area to the reversing unit,
While passing the processed work from the first transporter to the reversing unit, reversing the work,
The first work machine is caused to take out the reversed work and the first work machine is moved from the reversing unit to the processing area.
Put the inverted work held by the first transporter into the processing area,
Moving the first transporter to the supply unit and moving the second transporter to the processing area;
Processing is performed on the inverted workpiece put in the processing area,
The processed workpiece with the front and back processed is taken out by the second transporter, and the second transporter is moved from the processing area to the unloading unit, and the processed workpiece is moved to the second transporter. The processing method according to claim 6, wherein the transfer unit is transferred to the carry-out unit. The processing area comprises a first processing area and a second processing area provided facing the transport path,
Moving the first transporter in the vicinity of the supply unit and moving the second transporter in the middle of the first processing area or the second processing area and the unloading unit;
One unprocessed work is supplied to the supply unit, the one unprocessed work is taken out by the first transporter, and the first transporter is removed from the supply unit to the first processing area. Move to
Letting the first unprocessed work held by the first transporter into the first processing area,
The first transfer machine is moved from the first processing area to the supply unit, and the one unprocessed workpiece put into the first processing area is processed,
The supply unit is supplied with another unprocessed work, the other unprocessed work is taken out by the first transport device, and the first transport device is removed from the supply unit to the second processing area. Move to
The other unprocessed work held by the first transfer machine is put into the second processing area,
The first transporter is moved from the second processing area to the supply unit, the second transporter is moved to the first processing area, and the second processing area is put into the second processing area. Processing other untreated workpieces,
One processed workpiece processed in the first processing area is taken out by the second transporter, and the second transporter is moved from the first processing area to the unloading unit. , Passing the one processed workpiece from the second transporter to the unloading unit,
The supply unit is further supplied with another unprocessed workpiece, the further unprocessed workpiece is taken out by the first conveyor, and the first conveyor is removed from the supply unit to the first Move to the processing area, put another unprocessed work held by the first transporter into the first processing area,
Moving the second transporter from the unloading unit to the second processing area;
The other processed work processed in the second processing area is taken out by the second transporter, and the second transporter is moved from the second processing area to the unloading unit. The processing method according to claim 6, wherein the other processed workpiece is transferred from the second transporter to the unloading unit. The input of the unprocessed work to the first processing area or the second processing area is input to the processing area to which a work input permission signal is transmitted, and the input from both processing areas. When the permission signal is sent, it is thrown into the arbitrarily selected processing area.
The processing method according to claim 8.   The removal of the processed workpiece from the first processing area or the second processing area is performed from the processing area to which the workpiece removal permission signal is transmitted, and the removal is permitted from both processing areas. The processing method according to claim 8, wherein when the signal is transmitted, the processing method is taken out from an arbitrarily selected processing area. An unprocessed workpiece supply unit, a processed workpiece unloading unit, a transfer path provided between the supply unit and the unloading unit, a processing area provided facing the transfer path, and the transfer A reversing unit that faces the road and that is upstream of the processing area in the conveyance direction of the workpiece, reverses the workpiece, travels on the conveyance path, and supplies unprocessed workpieces to the processing area. One transporter, a second transporter that travels on the transport path and supplies unprocessed work to the processing area, and a processed work that has traveled on the transport path and has been processed. A processing method that performs processing on the workpiece using a processing device including a third transporter that is carried out of an area,
The first transporter is moved to the vicinity of the supply unit, the second transporter is moved between the reversing unit and the processing area, and the third transporter is moved to the processing area and the unloading unit. Move to the middle of the unit,
The unprocessed work is supplied to the supply unit, the unprocessed work is taken out by the first transporter, and the first transporter is moved from the supply unit to the reversing unit,
While passing the unprocessed work from the first transporter to the reversing unit, reversing the work,
Moving the first transporter to the supply unit and moving the second transporter to the reversing unit;
While taking the reversed work to the second transport machine, moving the second transport machine from the reversing unit to the processing area,
Put the inverted work held by the second transporter into the processing area,
While moving the second transport machine in the middle of the reversing unit and the processing area, moving the third transport machine to the processing area,
Processing is performed on the inverted workpiece put in the processing area,
The processed workpiece that has been processed is taken out by the third transfer device, and the third transfer device is moved from the processing area to the unloading unit, and the processed workpiece is transferred to the third transfer device. A processing method for delivering from a machine to the carry-out unit. While moving the first transporter in the vicinity of the supply unit, moving the second transporter between the processing area and the unloading unit,
The unprocessed work is supplied to the supply unit, the unprocessed work is taken out by the first transporter, and the first transporter is moved from the supply unit to the reversing unit,
While passing the unprocessed work from the first transporter to the reversing unit, reversing the work,
Moving the first transporter to the supply unit and moving the second transporter to the reversing unit;
The reversing work is taken out by the second transfer machine, the second transfer machine is moved from the reversing unit to the processing area, and another unprocessed work is supplied to the supply unit. Let other unprocessed workpieces be taken out by the first conveyor,
Put the inverted work held by the second transporter into the processing area,
Processing is performed on the inverted workpiece put in the processing area,
The processed workpiece that has been processed is taken out by the second transporter, and the second transporter is moved from the processing area to the reversing unit,
While passing the processed work from the second transport machine to the reversing unit, reversing the work,
The reversed workpiece is taken out by the second transfer device, the second transfer device is moved from the reversing unit to the processing area, and the first transfer device is moved from the supply unit to the reversing unit. Move
While passing other untreated workpieces from the first transporter to the reversing unit, reversing the workpieces,
Put the inverted work held by the second transporter into the processing area,
Moving the first transporter to the supply unit, moving the second transporter to the reversing unit, moving the third transporter to the processing area;
Processing is performed on the inverted workpiece put in the processing area,
The processed workpiece with the front and back processed is taken out by the third transporter, and the third transporter is moved from the processing area to the unloading unit, and the processed workpiece is moved to the third transporter. The processing method of Claim 11 which is made to deliver to the said carrying-out unit from a conveyance machine.

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