JP2019149465A - Circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit module having high adhesion between an insulating resin layer and an electronic component and a wiring structure. A circuit module 2 is arranged on an upper surface of a wiring structure 4 and a wiring structure having a plurality of wiring layers 14 and a non-wiring portion S1 other than the wiring layer 14 on the upper surface thereof. An electronic component 6b having a plurality of terminal portions 18 and a non-terminal portion S2b other than the terminal portion 18 and the terminal portion 18 of the electronic component 6b and the wiring layer 14 of the wiring structure 4 are connected to each other on the surface facing the terminal portion 18. A plurality of connecting portions 22 and an electronic component 6b and a connecting portion 22 provided on the upper surface of the wiring structure 4 are embedded between the non-terminal portion S2b of the electronic component 6b and the non-wiring portion S1 of the wiring structure 4. An insulating resin layer 8 having a gap sealing portion P located, a first contact layer 42 provided between the non-terminal portion S2b of the electronic component 6b and the gap sealing portion P of the insulating resin layer 8, and a wiring structure. A second close contact layer 44 provided between the non-wiring portion S1 of the body 4 and the gap sealing portion P of the insulating resin layer 8 is provided. [Selection diagram] Fig. 2

Description

  The present invention relates to a circuit module.

  There is known a circuit module including a wiring structure, an electronic component arranged on the upper surface of the wiring structure, and an insulating resin layer in which the electronic component is embedded.

JP 2010-114291 A

  However, in the conventional circuit module, the adhesiveness between the insulating resin layer, the electronic component, and the wiring structure is not sufficient.

  The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to provide a circuit module having high adhesion between an insulating resin layer, an electronic component, and a wiring structure.

  A circuit module according to one aspect of the present invention is arranged on a top surface of a wiring structure having a plurality of wiring layers and a non-wiring portion other than the wiring layer, and is opposed to the wiring structure. An electronic component having a plurality of terminal portions and a non-terminal portion other than the terminal portion on the surface, a plurality of connection portions for connecting the terminal portion of the electronic component and the wiring layer of the wiring structure, and a wiring structure An insulating resin layer provided on the upper surface to embed an electronic component and a connection portion and having a gap sealing portion located between the non-terminal portion of the electronic component and the non-wiring portion of the wiring structure, and the non-terminal portion of the electronic component A first adhesion layer provided between the gap sealing portion of the insulating resin layer and a second adhesion layer provided between the non-wiring portion of the wiring structure and the gap sealing portion of the insulating resin layer; .

  In the circuit module, the first adhesion layer is provided between the electronic component and the gap sealing portion of the insulating resin layer, and the second adhesion layer is provided between the wiring structure and the gap sealing portion of the insulating resin layer. It has been. Therefore, the adhesiveness between the insulating resin layer, the electronic component, and the wiring structure is high.

  In the circuit module according to one aspect of the present invention, the first adhesion layer and the second adhesion layer may contain a reaction product of a silane coupling agent. According to this aspect, the adhesion between the insulating resin layer, the electronic component, and the wiring structure can be further improved.

  In the circuit module according to one aspect of the present invention, the silane coupling agent may include an amino group. According to this aspect, the adhesion between the insulating resin layer, the electronic component, and the wiring structure can be further improved.

  In the circuit module according to one aspect of the present invention, the interval between the non-terminal portion of the electronic component and the non-wiring portion of the wiring structure may be 10 to 100 μm. According to this aspect, the adhesion between the insulating resin layer, the electronic component, and the wiring structure can be further improved.

  The circuit module according to one aspect of the present invention may include a plurality of electronic components, and the interval between the non-terminal portion of at least one electronic component and the non-wiring portion of the wiring structure, and the non-connection of at least one other electronic component. The distance between the terminal portion and the non-wiring portion of the wiring structure may be different from each other. According to this aspect, the adhesion between the insulating resin layer, the electronic component, and the wiring structure can be further improved.

  ADVANTAGE OF THE INVENTION According to this invention, the circuit module with high adhesiveness of an insulating resin layer, an electronic component, and a wiring structure is provided.

FIG. 1 is a cross-sectional view of a circuit module according to an embodiment of the present invention. FIG. 2 is an enlarged view of a part II of the cross section of the circuit module shown in FIG. FIG. 3 is a cross-sectional view of a circuit module according to an embodiment of the present invention. FIG. 4 is an enlarged view of a part IV of a cross section of the circuit module shown in FIG.

  Hereinafter, preferred embodiments of the present invention will be described in detail. In the drawings, the same or equivalent elements are denoted by the same reference numerals. The upper limit value and the lower limit value of the numerical ranges described in this specification can be arbitrarily combined.

  A circuit module 2 according to this embodiment will be described with reference to FIGS. The circuit module 2 includes the wiring structure 4, the electronic components 6a and 6b, the connection portions 20 and 22, the insulating resin layer 8, the first adhesion layer 42, the second adhesion layer 44, the metal layer 10, Is provided.

  The wiring structure 4 includes an insulating layer 24 and a plurality of wiring layers 12 and 14 provided on the upper surface of the insulating layer 24. The upper surface of the wiring structure 4 is divided into a plurality of wiring layers 12 and 14 and a non-wiring portion S1 other than the wiring layers 12 and 14 (upper surface of the insulating layer 24). The material of the insulating layer 24 may be, for example, resin, ceramic, resin-impregnated glass fiber, or the like. The resin may be an epoxy resin or the like. The ceramic may be alumina or the like. The ceramic may be LTCC (Low Temperature Co-fired Ceramics), HTCC (High Temperature Co-fired Ceramics), or the like. The resin-impregnated glass fiber may be CCL (Copper Clad Laminate) or the like. The material of the wiring layers 12 and 14 may be copper (Cu), nickel (Ni), or the like, for example. Although illustration is saved, an insulating layer different from the insulating layer 24 such as a solder resist may be formed on at least a part of the surfaces of the insulating layer 24 and the wiring layers 12 and 14.

  The electronic component 6 a is disposed on the upper surface of the wiring structure 4. The electronic component 6 a includes a main body portion 36 and a plurality of terminal portions 37 provided on the back surface of the main body portion 36. Although not shown, the main body portion 36 is provided with an electric circuit electrically connected to each terminal portion 37.

  The electronic component 6 b is disposed on the upper surface of the wiring structure 4. The electronic component 6 b includes a main body portion 16 and a pair of terminal portions 18 provided at both end portions of the main body portion 16. Although not shown, the main body portion 16 is provided with an electric circuit electrically connected to each terminal portion 18.

  The electronic components 6a and 6b may be capacitors, inductors, resistors, semiconductors, SAW (Surface Acoustic Wave) filters, and the like, for example. The capacitor may be a multi-layer ceramic capacitor (MLCC) or the like. The inductor may be made of a material such as resin, alumina, ferrite, or metal. The electronic components 6a and 6b may be integrated circuits (IC).

  The surface of the electronic component 6 a that faces the wiring structure 4 is divided into a plurality of terminal portions 37 and a non-terminal portion S 2 a other than the terminal portions 37. The surface of the electronic component 6 b that faces the wiring structure 4 is divided into a pair of terminal portions 18 and a non-terminal portion S 2 b other than the terminal portions 18.

  The distance D between the non-terminal portion of each electronic component and the non-wiring portion S1 of the wiring structure 4 may be, for example, 10 to 100 μm. When the distance D is within the above range, the adhesion between the insulating resin layer 8 and the electronic component and the wiring structure 4 can be further improved.

  The interval between the non-terminal portion S2a of the electronic component 6a and the non-wiring portion S1 of the wiring structure 4 is different from the interval between the non-terminal portion S2b of another electronic component 6b and the non-wiring portion S1 of the wiring structure 4. It's okay. In this case, the adhesiveness between the insulating resin layer 8, the electronic component 6b, and the wiring structure 4 can be further improved.

  Each connection part 20 electrically connects each terminal part 37 of the electronic component 6 a and each wiring layer 12 of the wiring structure 4. In the present embodiment, the connection portion 20 can be formed by reflow of solder bumps provided on the terminal portion 37 of the electronic component 6a. Each connection part 22 electrically connects each terminal part 18 of the electronic component 6 b and each wiring layer 14 of the wiring structure 4. The connection part 22 can be formed by reflow of printing solder provided on the terminal part 18 of the electronic component 6b.

  The insulating resin layer 8 is provided on the upper surface of the wiring structure 4. The insulating resin layer 8 embeds the electronic components 6a and 6b. The insulating resin layer 8 is a layer containing a resin. The resin may be, for example, an epoxy resin. The insulating resin layer 8 may be made of only a resin or may contain other components in addition to the resin. The insulating resin layer 8 may include a filler, for example.

  The insulating resin layer 8 has a gap sealing portion P located between the non-terminal portion S2b of the electronic component 6b and the non-wiring portion S1 of the wiring structure 4. The gap sealing portion P of the insulating resin layer 8 is also provided between the non-terminal portion S2a of the electronic component 6a and the non-wiring portion S1 of the wiring structure 4.

  The first adhesion layer 42 bonds the electronic components 6 a and 6 b and the gap sealing portion P between the insulating resin layers 8. The first adhesion layer 42 is provided between the non-terminal portion S2a of the electronic component 6a and the gap sealing portion P of the insulating resin layer 8 located immediately below the non-terminal portion S2a of the electronic component 6a. In FIG. 1, the 1st contact | adherence layer 42 is provided in the whole surface of the main-body part 36 of the electronic component 6a. The first adhesion layer 42 is provided between the non-terminal portion S2b of the electronic component 6b and the gap sealing portion P of the insulating resin layer 8 located immediately below the non-terminal portion S2b of the electronic component 6b. . In FIG. 1, the first adhesion layer 42 is provided on the entire surface of the main body 16 of the electronic component 6 b.

The first adhesion layer 42 may include, for example, a reaction product of a silane coupling agent. A silane coupling agent may contain an amino group, a benzene ring, etc., for example. The silane coupling agent may have an amino group at the end of the molecular chain. The silane coupling agent may have a nitrogen atom between carbon atoms. Silane coupling agent is a group represented by -C-NH _2, a group represented by the following chemical formula _{(1), -CH 2 -NH-} CH 2 - , a group represented by the tables in the following chemical formula (2) Or the like.

［式（２）中、Ｒ^１及びＲ^２は、それぞれ独立に、炭素数１〜８のアルキル基を表す。］

[In Formula (2), R < ¹ > and R < ² > represents a C1-C8 alkyl group each independently. ]

  Examples of the silane coupling agent include N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane (trade name: KBM-602) and N-2- (aminoethyl) -3 manufactured by Shin-Etsu Chemical Co., Ltd. -Aminopropyltrimethoxysilane (trade name: KBM-603), 3-aminopropyltrimethoxysilane (trade name: KBM-903), 3-aminopropyltriethoxysilane (trade name: KBE-903), 3-tri It may be ethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine (trade name: KBE-9103), N-phenyl-3-aminopropyltrimethoxysilane (trade name: KBM-573), or the like.

The molecular weight of the silane coupling agent may be, for example, 150 to 350, or 150 to 300. The minimum coverage area of the silane coupling agent may be, for example, 250 to 450 m ² / g, or 300 to 450 m ² / g.

  A silane coupling agent can be used individually by 1 type or in combination of 2 or more types.

  The thickness of the first adhesion layer 42 may be, for example, 5 to 200 nm.

  The second adhesion layer 44 bonds the wiring structure 4 and the gap sealing portion P between the insulating resin layers 8. The second adhesion layer 44 is provided between the non-wiring portion S1 of the wiring structure 4 and the gap sealing portion P of the insulating resin layer 8 located immediately above the non-wiring portion S1 of the wiring structure 4. .

The second adhesion layer 44 may include, for example, a reaction product of a silane coupling agent. A silane coupling agent may contain an amino group, a benzene ring, etc., for example. The silane coupling agent may have an amino group at the end of the molecular chain. The silane coupling agent may have a nitrogen atom between carbon atoms. The silane coupling agent is represented by a group represented by —C—NH ₂ , a group represented by the above chemical formula (1), a group represented by —CH ₂ —NH—CH ₂ —, and the above chemical formula (2). Or the like. Examples of the silane coupling agent include N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane (trade name: KBM-602) and N-2- (aminoethyl) -3 manufactured by Shin-Etsu Chemical Co., Ltd. -Aminopropyltrimethoxysilane (trade name: KBM-603), 3-aminopropyltrimethoxysilane (trade name: KBM-903), 3-aminopropyltriethoxysilane (trade name: KBE-903), 3-tri It may be ethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine (trade name: KBE-9103), N-phenyl-3-aminopropyltrimethoxysilane (trade name: KBM-573), or the like. The molecular weight of the silane coupling agent may be, for example, 150 to 350, or 150 to 300. The minimum coverage area of the silane coupling agent may be, for example, 250 to 450 m ² / g, or 300 to 450 m ² / g. A silane coupling agent can be used individually by 1 type or in combination of 2 or more types. The material of the second adhesion layer 44 may be the same as or different from the material of the first adhesion layer 42.

  The thickness of the second adhesion layer 44 may be, for example, 5 to 200 nm.

  The metal layer 10 is provided on the upper surface and side surfaces of the insulating resin layer 8 and the side surfaces of the wiring structure 4. The metal layer 10 functions as an electromagnetic shield or wiring layer for electronic components. The metal layer 10 is a layer containing a metal. The material of the metal layer 10 is not particularly limited as long as it is an electromagnetic shield or wiring material. The material of the metal layer 10 should just be comprised with electroconductive elements or magnetic elements, such as Cu, Ni, and Fe, for example. The metal layer 10 may be a single layer or a plurality of layers. The metal layer 10 may not be formed.

  The circuit module 2 according to the present embodiment can be manufactured, for example, by the following method. However, the manufacturing method of the circuit module 2 is not limited to the following method.

  First, the wiring structure 4 and the electronic components 6a and 6b are prepared. By using a known reflow method or the like, the wiring layer of the wiring structure 4 and the terminal portions of the electronic components 6a and 6b are connected via the connecting portions 20 and 22, thereby obtaining a laminate.

  Next, the laminate is immersed in a liquid containing a silane coupling agent that is a raw material for the first adhesion layer 42 and the second adhesion layer 44. The laminate is removed from the liquid and dried.

  Next, an insulating resin layer 8 is formed on the upper surface of the wiring structure 4, and the electronic components 6a and 6b are sealed. The formation method of the insulating resin layer 8 may be, for example, transfer molding, compression molding, printing method, laminating method, casting method or the like.

  Thereafter, the metal layer 10 is formed on the upper surface and side surfaces of the insulating resin layer 8. The formation method of the metal layer 10 may be plating, sputtering, etc., for example.

  In the circuit module 2 according to the present embodiment, the first adhesion layer 42 is provided between the electronic components 6a and 6b and the gap sealing portion P of the insulating resin layer 8, and the gap between the wiring structure 4 and the insulating resin layer 8 is provided. Between the sealing portion P, the second adhesion layer 44 is provided. Therefore, the adhesiveness between the insulating resin layer 8 and the electronic components 6 a and 6 b and the wiring structure 4 is high.

  As mentioned above, although embodiment of this invention was described in detail, this invention is not limited to the said embodiment.

  For example, in the circuit module 2, a wiring layer may be further provided on the lower surface of the insulating layer 24 included in the wiring structure 4. A wiring layer may be further provided inside the insulating layer 24. The wiring structure 4 may be a single layer or a multilayer substrate (build-up substrate). The wiring structure 4 may further include an insulating coating layer provided on the upper surface of the insulating layer 24. The insulating coating layer may cover a part of the wiring layers 12 and 14. The insulating coating layer may be, for example, a solder resist layer.

  In the circuit module 2, the number of electronic components is two, but at least one is sufficient, and there may be one, or three or more. The size and shape of the electronic component are not particularly limited. The number of terminal parts of the electronic component, the number of wiring layers of the wiring structure, and the number of connection parts are not particularly limited.

  In the circuit module 2, the first adhesion layer 42 may be provided at least between the non-terminal portion of one electronic component and the gap sealing portion P of the insulating resin layer 8.

  In the manufacture of the circuit module 2 described above, the first adhesion layer 42 and the second adhesion layer 44 are provided by immersing the laminate in a liquid containing a silane coupling agent. It may be provided by exposure to a gas containing an agent.

  In the circuit module 2, the metal layer 10 is provided on the upper surface and side surfaces of the insulating resin layer 8 and the side surface of the wiring structure 4, but may not be provided on these.

  3 and 4, all surfaces of the electronic components 6a and 6b that are in contact with the insulating resin layer 8, all surfaces of the connecting portions 20 and 22 that are in contact with the insulating resin layer 8, and a wiring structure The first adhesion layer 42 or the second adhesion layer 44 may be provided over all surfaces in contact with the four insulating resin layers 8.

  DESCRIPTION OF SYMBOLS 2,52 ... Circuit module, 4 ... Wiring structure, 6a, 6b ... Electronic component, 8 ... Insulating resin layer, 10 ... Metal layer, 12, 14 ... Wiring layer, 16, 36 ... Main part, 18, 37 ... Terminal Part, 20, 22 ... connection part, 24 ... insulating layer, 42 ... first adhesion layer, 44 ... second adhesion layer.

Claims (5)

A wiring structure having a plurality of wiring layers on the upper surface and a non-wiring part other than the wiring layers;
An electronic component that is disposed on the upper surface of the wiring structure and has a plurality of terminal portions and a non-terminal portion other than the terminal portions on a surface facing the wiring structure;
A plurality of connection portions for connecting the terminal portion of the electronic component and the wiring layer of the wiring structure, respectively;
Provided on an upper surface of the wiring structure, the electronic component and the connection portion are embedded, and a gap sealing portion is provided between the non-terminal portion of the electronic component and the non-wiring portion of the wiring structure. An insulating resin layer;
A first adhesion layer provided between the non-terminal portion of the electronic component and the gap sealing portion of the insulating resin layer;
A second adhesion layer provided between the non-wiring portion of the wiring structure and the gap sealing portion of the insulating resin layer;
A circuit module comprising:   The circuit module according to claim 1, wherein the first adhesion layer and the second adhesion layer include a reaction product of a silane coupling agent.   The circuit module according to claim 2, wherein the silane coupling agent includes an amino group.   The circuit module as described in any one of Claims 1-3 whose space | interval of the said non-terminal part of the said electronic component and the said non-wiring part of the said wiring structure is 10-100 micrometers. A plurality of the electronic components;
An interval between the non-terminal portion of the at least one electronic component and the non-wiring portion of the wiring structure; and the non-terminal portion of the at least one other electronic component and the non-wiring portion of the wiring structure. The circuit module according to claim 1, wherein the intervals are different from each other.

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