JP2019145745A - Component and electronic device - Google Patents

Abstract

To enable heat from an electronic component housed in a housing to be easily released.SOLUTION: An electronic device 400 has a structure in which an electronic component 700 is disposed in a component including a housing 500 and a heat radiation member 600. At least one surface 620 of the heat radiation member 600 is made of metal. The housing 500 is formed by using resin. A surface 512 of a side wall 510 of the housing 500 which faces the one surface 620 is joined to the one surface 620. At least a part of an area of the one surface 620 which is enclosed by the side wall 510 does not contact with the housing 500 and is not covered. The electronic component is stored in a space enclosed by the side wall 510 and the one surface 620 of the heat radiation member 600.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a component in which an electronic component is accommodated and an electronic apparatus.

  In-vehicle devices such as audio devices, mobile phone devices mounted on vehicles, car navigation devices, and the like employ electronic devices using high-performance ICs that generate a large amount of heat as vehicles become more electronic and have higher performance. It has become like this. On the other hand, problems due to electromagnetic waves generated by these electronic devices, that is, EMI (electromagnetic interference) must be suppressed as much as possible. For this reason, the shield material of the housing containing the electronic equipment is mainly composed of a highly conductive material (for example, galvanized steel plate, copper foil, aluminum foil, etc.) and shielded by reflecting the surface of the radio wave. I came. By using such a shield material, it is also possible to enjoy the merit that it is easy to dissipate the amount of heat generated in the device (see, for example, Patent Documents 1, 2, and 3).

JP 2002-176282 A JP 2005-108328 A Japanese Utility Model Publication No. 5-72180

  Electronic parts generate heat. If the temperature of the electronic component rises too much, the reliability of the electronic component will decrease. On the other hand, since electronic components are often housed in a housing, it is difficult for heat to escape. An object of the present invention is to make it easy to escape heat from an electronic component housed in a housing.

  According to the present invention, the following components and electronic devices are provided.

[1] A heat dissipation member having at least one surface made of metal;
A housing fixed to the one surface of the heat dissipation member;
With
The housing is formed using a resin,
The one side surface of the side wall of the housing is joined to the one surface;
A part of at least a part of the area surrounded by the side surface of the casing is not covered with the casing.

[2] The above-described component, and the electronic component disposed inside the above-described casing,
An electronic device comprising:

  According to the present invention, the heat from the electronic component housed in the housing can easily escape.

It is the perspective view which showed typically an example of the structure of the housing | casing for electronic devices of a reference example. It is the perspective view which showed typically an example of the structure of the cover board of a reference example. It is the perspective view which showed typically an example of the structure of the expansion | deployment figure-like metal plate to which the thermoplastic resin member of the reference example was joined. It is the perspective view which showed typically an example of the structure of the expansion | deployment drawing metal plate (development drawing metal resin bonding plate) to which the thermoplastic resin member of the reference example was joined. It is the perspective view which showed typically an example of the structure of the expansion | deployment drawing metal plate (development drawing metal resin bonding plate) to which the thermoplastic resin member of the reference example was joined. It is a perspective view which shows the structure of the electronic device which concerns on embodiment. It is AA sectional drawing of FIG. It is a perspective view which shows the structure of the electronic device which concerns on a modification. It is a perspective view of the metal resin joining plate for mechanical property evaluation used in Example 1 of the reference example. It is a perspective view of the expansion | deployment figure-like metal plate which concerns on Example 2 of a reference example. It is a perspective view of the expansion | deployment figure-like metal resin joining board which concerns on Example 2 of a reference example. Explains the measurement points of a total of 6 linear parts consisting of arbitrary 3 linear parts in parallel relation and arbitrary 3 linear parts orthogonal to the 3 linear parts on the joint surface of the metal member (M) according to the reference example. It is a schematic diagram for doing.

  Reference examples and embodiments of the present invention will be described below with reference to the drawings. In all the drawings, similar constituent elements are denoted by common reference numerals, and description thereof is omitted as appropriate. Moreover, the figure is a schematic diagram and does not match the actual dimensional ratio. Unless otherwise specified, “˜” between numbers in the sentence represents the following.

(Reference example)
[Case for electronic equipment]
First, an electronic device casing 100 according to a reference example will be described with reference to FIGS.
FIG. 1 is a perspective view schematically showing an example of the structure of an electronic device casing 100 of a reference example. FIG. 2 is a perspective view schematically showing an example of the structure of the cover plate 203 of the reference example.

The electronic device casing 100 according to the reference example includes a metal bottom plate 201 and metal side plates 202 (202-1, 202-2, 202-3, and 202) that are integrally bent and connected to the bottom plate. -4), and a housing for housing an electronic component that is at least a part of an electronic device, and in a metal member (M) including at least a bottom plate 201 and a side plate 202, a plate-like metal The thermoplastic resin member 301 is joined to a part of the surface of the member (M), preferably directly joined, and the metal member (M) is reinforced by the thermoplastic resin member 301, so that the plate-like metal member (M) The thermoplastic resin member 301 is joined to both surfaces. In addition, in this reference example and embodiment, direct joining means joining in which no intervening layer such as an adhesive-containing layer exists between the metal member (M) and the thermoplastic resin member 301.
Here, the side plates 202 are preferably engaged by, for example, mechanical means. The mechanical engagement means (also referred to as physical engagement means) is not particularly limited, and examples thereof include screwing. The side plate 202 and the lid plate 203 provided as necessary may be engaged by the mechanical means described above, or may be integrally bent and connected to one arbitrary side plate. In FIG. 1, four side plates 202-1, 202-2, 202-3, and 202-4 are included, but the present invention includes an embodiment in which the side plates are three pieces selected from these. However, in this case, it is preferable that the lid plate is integrally bent and connected to one of the three side plates.

  Electronic components housed in the electronic device casing 100 include, for example, circuit boards, semiconductor devices such as microcomputers and CPUs, discrete type elements (for example, capacitive elements, coils, resistance elements, etc.), and ventilation or cooling devices. At least one of the fans.

The electronic device casing 100 according to the present reference example is partially reduced from a heavy metal member to a lightweight resin member, so that the entire casing is lighter than a conventional casing that is configured by a metal member. can do.
Further, the electronic device casing 100 according to the present reference example includes a metal bottom plate 201 and a metal side plate 202 in a part thereof, so that the entire casing is configured by a metal member. An electromagnetic wave shielding function equivalent to the above can be obtained.
Further, in the electronic device casing 100 according to the present reference example, the metal member (M) including at least the bottom plate 201 and the side plate 202 is reinforced by the thermoplastic resin member 301, thereby reducing the thickness of the metal member (M). Accordingly, it is possible to suppress a decrease in the mechanical strength of the electronic device casing 100. That is, it is possible to maintain the mechanical strength while realizing the weight reduction of the electronic device casing 100.
Further, in the electronic device casing 100 according to the present reference example, the metal bottom plate 201 and the metal side plate 202 are integrally connected, so that a component for connecting the bottom plate and the side plate is not necessary. The number of points can be reduced, and as a result, process management can be simplified. It is also possible to reduce the number of ground installation locations. Since the electronic device casing 100 according to the present reference example can reduce the number of parts and the number of ground installation points, the lighter electronic device casing 100 can be realized.
Furthermore, since the thermoplastic resin member 301 is formed only on a part of the surface of the plate-like metal member (M), the entire surface of the metal member (M) is covered by the thermoplastic resin member 301. The heat dissipation characteristics of the electronic device casing 100 can be maintained well.

  In the electronic device casing 100 according to the present reference example, thermoplastic resin members 301 are bonded to both surfaces of the plate-like metal member (M). By carrying out like this, since the metal member (M) can be reinforced from both surfaces of a metal member (M), the mechanical strength of the housing | casing 100 for electronic devices can be made favorable. Thereby, the thickness of a metal member (M) can be made thin and the housing | casing 100 for lightweight electronic devices can be obtained.

  As described above, the electronic device casing 100 according to the present reference example is excellent in the balance of lightness, electromagnetic shielding properties, heat dissipation characteristics, and mechanical strength.

  The metal member (M) according to this reference example preferably has a fine concavo-convex structure on the surface of the joint portion with the thermoplastic resin member 301. In this case, since the metal member (M) and the thermoplastic resin member 301 are joined by part of the thermoplastic resin member 301 entering the fine concavo-convex structure, the metal member (M) and the thermoplastic resin member 301 The bonding strength can be improved. Thereby, since the mechanical strength of the housing | casing 100 for electronic devices can be made more favorable, the thickness of the metal member (M) which comprises the housing | casing 100 for electronic devices can be made thinner. As a result, a lighter electronic device casing 100 can be obtained.

  In addition, the thermoplastic resin member 301 bonded to one surface of the plate-shaped metal member (M) and at least a part of the thermoplastic resin member 301 bonded to the other surface of the metal member (M) It is preferable that they are arranged so as to face each other in the direction perpendicular to the plate surface. By carrying out like this, it can suppress that a metal member (M) deform | transforms by shrinkage | contraction at the time of shaping | molding of the thermoplastic resin member 301. FIG.

  In the electronic device casing 100 according to the present reference example, the surface area of the joined portion of the thermoplastic resin member 301 occupying the total surface area of the metal member (M) (hereinafter, may be abbreviated as a joined portion area ratio) is, for example, 1 area% or more and 50 area% or less, preferably 2 area% or more and 40 area% or less, more preferably 5 area% or more and 30 area% or less. When the joint area ratio is equal to or higher than the lower limit, the mechanical strength of the electronic device casing 100 can be further improved. When the joint area ratio is equal to or less than the above upper limit value, it is possible to obtain a lightweight electronic device casing 100 that is more excellent in heat dissipation characteristics.

In the electronic device casing 100 according to this reference example, the thermoplastic resin member 301 is preferably joined to at least a peripheral portion of the surface of the metal member (M) as shown in FIGS. By doing so, the metal member (M) can be reinforced more effectively with a smaller amount of the thermoplastic resin member 301. Furthermore, since the usage-amount of the thermoplastic resin member 301 can be reduced, it can suppress that a metal member (M) deform | transforms by the shrinkage | contraction at the time of shaping | molding of the thermoplastic resin member 301. FIG.
Moreover, in the electronic device casing 100 according to the present reference example, at least a part of the thermoplastic resin member 301 is formed in a skeleton shape on the surface of the metal member (M), for example, as shown in FIGS. It is preferable. Examples of the frame shape include at least one shape selected from a brace shape, a lattice shape, a truss shape, and a ramen shape. It is preferable to form the thermoplastic resin member 301 in a framework on the surface of the metal member (M) because the metal member (M) can be more effectively reinforced with a smaller amount of the thermoplastic resin member 301.
Furthermore, since the amount of the thermoplastic resin member 301 can be reduced by forming the thermoplastic resin member 301 in a framework shape on the surface of the metal member (M), the thermoplastic resin member 301 is contracted during molding. It can suppress that a metal member (M) deform | transforms and the thermal radiation characteristic of the housing | casing 100 for electronic devices falls by the thermoplastic resin member 301. FIG.

The thickness of the thermoplastic resin member 301 according to the present reference example may be the same at all locations, or may vary depending on the location.
In the electronic device casing 100 according to this reference example, the average thickness of the thermoplastic resin member 301 bonded to the surface of the metal member (M) is equal to the average thickness of the metal member (M) or the size of the entire casing. However, it is, for example, 1.0 mm to 10 mm, preferably 1.5 mm to 8 mm, and more preferably 1.5 mm to 5.0 mm.
When the average thickness of the thermoplastic resin member 301 is not less than the above lower limit value, the mechanical strength of the obtained electronic device casing 100 can be further improved.
When the average thickness of the thermoplastic resin member 301 is equal to or less than the above upper limit value, the obtained electronic device casing 100 can be made lighter. Moreover, since the usage-amount of the thermoplastic resin member 301 can be reduced, it can suppress that a metal member (M) deform | transforms by the shrinkage | contraction at the time of shaping | molding of the thermoplastic resin member 301. FIG.

  In the electronic device casing 100 according to the present reference example, it is preferable that the thermoplastic resin member 301 is bonded to both surfaces of the metal member (M). By carrying out like this, since the metal member (M) can be reinforced from both surfaces of a metal member (M), the mechanical strength of the housing | casing 100 for electronic devices can be made more favorable. Thereby, the thickness of a metal member (M) can be made thinner and the housing 100 for electronic devices more lightweight can be obtained.

  Further, when the thermoplastic resin member 301 is bonded to both surfaces of the metal member (M), at least a part of the thermoplastic resin member 301 bonded to one surface of the metal member (M) is on the other surface. The bonded thermoplastic resin member 301 and the metal member (M) are preferably disposed at the same position so as to face each other in the direction perpendicular to the plate surface of the metal member (M). By carrying out like this, it can suppress that a metal member (M) deform | transforms by shrinkage | contraction at the time of shaping | molding of the thermoplastic resin member 301. FIG. In this case, in a plan view, at least a part of the thermoplastic resin member 301 bonded to one surface may not overlap with the thermoplastic resin member 301 bonded to the other surface.

  In the electronic device casing 100 according to this reference example, as shown in FIG. 1, the thermoplastic resin member 301 is preferably bonded to at least the peripheral portion of the surface of the metal member (M), preferably around the entire periphery. preferable. By doing so, the metal member (M) can be reinforced more effectively with a smaller amount of the thermoplastic resin member 301.

  On one surface of the electronic device casing 100 (for example, the bottom plate 201 and any one of the side plates 202), the thermoplastic resin member 301 is formed in a frame shape. For example, as illustrated in FIG. 3, the thermoplastic resin member 301 includes a first portion 301 a extending in the first direction and a second direction extending in a second direction different from the first direction. Part 301b. In the example shown in FIG. 3, the first portion 301a is orthogonal to one side of the bottom plate 201, and the second portion 301b is orthogonal to the other side of the bottom plate 201 and the first portion 301a. Note that the first portion 301 a and the second portion 301 b may extend obliquely with respect to the side of the bottom plate 201. For example, the first portion 301a and the second portion 301b may extend along a diagonal line of the bottom plate 201, or may have a portion extending radially around a certain point in the bottom plate 201. Good. Further, the thermoplastic resin member 301 may have a portion extending in a lattice shape. Furthermore, the thermoplastic resin member 301 may have a portion extending in a spider web shape.

  In any of the examples, when the thermoplastic resin member 301 is formed by injection molding, any portion of the thermoplastic resin member 301 is connected to the thermoplastic resin member 301 located at the edge of the electronic device casing 100. It is preferable. If it does in this way, all the thermoplastic resin members 301 can be formed by one injection molding.

  In the electronic device casing 100 according to the present reference example, the thermoplastic resin member 301 is not joined to the boundary portion 205 (that is, the side of the electronic device casing 100 (three-dimensional)) between the bottom plate 201 and the side plate 202. It is preferable. By doing so, it becomes easier to bend the boundary line portion 205 between the bottom plate 201 and the side plate 202, and the electronic device casing 100 can be obtained more easily.

  In the metal member (M) according to this reference example, the surface of the metal bottom plate 201 and all the side plates 202 made of metal (in the example shown in FIG. 1, 202-1, 202-2, 202-3, and 202- It is preferable that the thermoplastic resin member 301 is bonded to each surface of 4). By carrying out like this, the mechanical strength of the housing | casing 100 for electronic devices can be made more favorable, and the thickness of a metal member (M) can be made thinner. As a result, a lighter electronic device casing 100 can be obtained.

  Moreover, it is preferable that the electronic device casing 100 according to this reference example further includes a metal lid plate 203 that is integrally bent and connected to the side plate 202. In this case, as shown in FIGS. 2 to 4, it is preferable that a thermoplastic resin member 301 is joined to a part of the surface of the lid plate 203, and the lid plate 203 is reinforced by the thermoplastic resin member 301. By doing so, the mechanical strength of the electronic device casing 100 can be further improved, and the thickness of the metal member (M) constituting the electronic device casing 100 can be further reduced. As a result, a lighter electronic device casing 100 can be obtained. In this case, it is preferable that the thermoplastic resin member 301 is not joined to the boundary portion between the side plate 202 and the lid plate 203 in order to facilitate bending. The metal lid plate 203 may be prepared separately from the metal member (M) and engaged with the side plate 202 using mechanical means or an engagement mechanism (for example, a hinge).

  The lid plate 203 according to this reference example preferably has the same fine uneven structure on the surface of the joint portion with the thermoplastic resin member 301 as the surface of the joint portion of the metal member (M). In this case, since the lid plate 203 and the thermoplastic resin member 301 are joined when a part of the thermoplastic resin member 301 enters the fine concavo-convex structure, the joining strength between the lid plate 203 and the thermoplastic resin member 301 is increased. Can be better. Thereby, since the mechanical strength of the electronic device casing 100 can be improved, the thickness of the cover plate 203 constituting the electronic device casing 100 can be further reduced. As a result, a lighter electronic device casing 100 can be obtained.

Here, the metal member (M) including the cover plate 203 and the fine concavo-convex structure on the surface of the cover plate 203 are, for example, a fine concavo-convex structure in which convex portions having an interval period of 5 nm to 500 μm stand.
Since a portion of the thermoplastic resin member 301 enters and is positioned in such a fine concavo-convex structure, the thermoplastic resin member 301 can be bonded to the metal member (M) or the cover plate 203. By doing so, physical resistance (anchor effect) is effectively expressed between the metal member (M) or the cover plate 203 and the thermoplastic resin member 301, and the metal member (M) or the cover plate 203 It becomes possible to join the thermoplastic resin member 301 more firmly.

Moreover, the electronic device casing 100 according to the present reference example may have an opening 207 and a slit 209 in the side plate 202 as shown in FIG. By providing the opening 207 in the side plate 202, air can be sent from the opening 207 into the electronic device casing 100 using a blower or the like. As a result, the electronic device in the electronic device casing 100 is heated. This electronic device can be cooled by blowing air.
Further, by providing the side plate 202 with the slit 209, the wind taken from the opening 207 can be discharged to the outside of the electronic device casing 100. Note that the opening 207 and the slit 209 may be provided in the bottom plate 201.

  The electronic device according to this reference example includes an electronic device casing 100 and an electronic device accommodated in the electronic device casing 100. Examples of the electronic device in which the electronic device is housed in the electronic device casing 100 according to the present reference example include an audio device, a vehicle-mounted mobile phone device, a car navigation device, an in-vehicle camera, a drive recorder, and the like. Is mentioned.

  Hereafter, each member which comprises the housing | casing 100 for electronic devices which concerns on this reference example is demonstrated taking FIG. 1 and FIG. 2 as an example.

<Metal member (M)>
The metal member (M) according to this reference example includes a bottom plate 201 and at least one side plate 202 selected from the side plate 202-1, the side plate 202-2, the side plate 202-3, and the side plate 202-4. One of the preferred embodiments includes a bottom plate 201, a side plate 202-1, a side plate 202-2, a side plate 202-3, and a side plate 202-4. The second preferred embodiment includes a bottom plate 201, a side plate (front plate) 202-1, side plates (both side plates) 202-2 and 202-4, and a lid plate 203. The third preferred embodiment includes a bottom plate 201, a side plate 202-1, a side plate 202-2, a side plate 202-3, a side plate 202-4, and a lid plate 203. Among these embodiments, the embodiments 2 and 3 are particularly preferable.
In this way, the number of parts of the electronic device casing 100 can be further reduced, and as a result, process management can be facilitated and the number of ground installation locations can be further reduced. And since the number of parts and the ground installation location can be further reduced, it is possible to realize the electronic device casing 100 that is much lighter.

Although the metal material which comprises the metal member (M) which concerns on this reference example is not specifically limited, The metal which has electromagnetic wave shielding property is preferable, for example, iron, steel materials, stainless steel, aluminum, aluminum alloy, magnesium, magnesium alloy, copper , Copper alloy, titanium and titanium alloy. These may be used alone or in combination of two or more.
Among these, aluminum (aluminum alone) and an aluminum alloy are preferable, and an aluminum alloy is more preferable from the viewpoint of light weight, low cost, and high strength.

The aluminum alloy is not particularly limited, but is an alloy containing aluminum as a main component. Specifically, an alloy of aluminum and at least one metal selected from copper, manganese, silicon, magnesium, zinc, nickel and the like can be exemplified.
As an aluminum alloy according to this reference example, a 4-digit number of an international aluminum alloy name defined in Japanese Industrial Standard (JIS H4140) is an aluminum / copper alloy in the 2000s, an aluminum / manganese alloy in the 3000s 4000 series aluminum / silicon alloys, 5000 series aluminum / magnesium alloys, 6000 series aluminum / magnesium / silicon alloys, 7000 series aluminum / zinc / magnesium alloys, aluminum / zinc / magnesium / copper alloys Etc. are preferably used. Among these, aluminum / magnesium alloys in the 5000s are particularly preferred from the viewpoint of availability and mechanical / thermal properties.

The thickness of the metal member (M) according to this reference example may be the same thickness at all locations, or the thickness may vary depending on the location. The average thickness of the metal member (M) is preferably from 0.2 mm to 1.0 mm, more preferably from 0.2 mm to 1.0 mm, and particularly preferably from 0.2 mm to 0.8 mm.
When the average thickness of the metal member (M) is equal to or more than the above lower limit value, the mechanical strength, heat dissipation characteristics, and electromagnetic wave shielding characteristics of the obtained electronic device casing 100 can be further improved.
When the average thickness of the metal member (M) is equal to or less than the above upper limit value, the obtained electronic device casing 100 can be made lighter. Furthermore, when the average thickness of the metal member (M) is less than or equal to the above upper limit value, it is easier to bend the metal member (M), and the productivity of the electronic device casing 100 can be further improved.

  The shape of the metal member (M) can be a plate shape, for example. The metal member (M) is formed by processing the metal material into a predetermined shape by a known method such as plastic working by cutting, pressing, etc., punching, cutting, polishing, electric discharge machining, etc. Those that have been subjected to crystallization treatment are preferred. In short, it is preferable to use a material processed into a necessary shape by various processing methods.

On the surface of the joint portion between the metal member (M) and the thermoplastic resin member 301, for example, a fine concavo-convex structure in which convex portions having an interval period of 5 nm or more and 500 μm or less stand is formed.
Here, the interval period of the fine concavo-convex structure is an average value of the distance from the convex portion to the adjacent convex portion, and can be obtained using a photograph taken with an electron microscope or a laser microscope, or a surface roughness measuring device.
The interval period measured by an electron microscope or a laser microscope is usually an interval period of less than 500 nm, and specifically, the surface of the joint portion of the metal member (M) with the thermoplastic resin member 301 is photographed. From the photograph, 50 arbitrary convex portions are selected, and the distances from those convex portions to adjacent convex portions are measured. An interval period is defined by integrating all the distances from the convex portion to the adjacent convex portion and dividing the sum by 50. On the other hand, the interval period exceeding 500 nm is usually determined using a surface roughness measuring device.
Usually, not only the surface of the joint part of the metal member (M) but also the entire surface of the metal member (M) is subjected to the surface roughening treatment, and therefore the same as the surface of the joint part of the metal member (M). It is also possible to measure the interval period from a location other than the joint surface.

The interval period is preferably 10 nm to 300 μm, more preferably 20 nm to 200 μm.
When the interval period is equal to or more than the lower limit value, the thermoplastic resin composition (P) constituting the thermoplastic resin member 301 can sufficiently enter the concave portion of the fine concavo-convex structure, and the metal member (M) and the heat The bonding strength with the plastic resin member 301 can be further improved. Moreover, it can suppress that a clearance gap produces in the junction part of the metal member (M) and the thermoplastic resin member 301 as the said space | interval period is below the said upper limit. As a result, since impurities such as moisture can be prevented from entering through the gap between the metal-resin interface, it is possible to suppress a decrease in strength when the electronic device casing 100 is used at high temperature and high humidity.

As a method of forming the fine concavo-convex structure having the above-mentioned interval cycle, a method of immersing a metal member in an inorganic base aqueous solution containing NaOH or the like and / or an inorganic acid aqueous solution containing HCl, HNO ₃ or the like; Method of processing a member; method of forming irregularities on a metal member surface by pressing a die punch having irregularities produced by mechanical cutting such as diamond abrasive grinding or blasting, sandblasting, knurling, laser processing A method for producing a concavo-convex shape on the surface of a metal member by using a metal member in one or more aqueous solutions selected from hydrated hydrazine, ammonia, and a water-soluble amine compound as disclosed in WO2009 / 31632 And the like. These methods can be selectively used depending on the type of the metal material constituting the metal member (M) and the uneven shape formed within the range of the interval period. In this reference example, the method of immersing a metal member in an inorganic base aqueous solution containing NaOH or the like and / or an inorganic acid aqueous solution containing HCl, HNO ₃ or the like can process the metal member over a wide range, Moreover, it is preferable because the bonding strength between the metal member (M) and the thermoplastic resin member 301 is excellent.

Further, from the viewpoint of further improving the bonding strength between the metal member (M) and the thermoplastic resin member 301, any three linear portions in parallel relation on the bonding portion surface 104 of the metal member (M), and Surface roughness measured according to JIS B0601 (corresponding international standard: ISO 4287) for a total of 6 straight line parts composed of arbitrary 3 straight line parts orthogonal to the 3 straight line parts satisfies the following requirements (1) and (2). It is preferable to satisfy them simultaneously.
(1) Includes one or more straight line portions with a load length ratio (Rmr) of a roughness curve at a cutting level of 20% and an evaluation length of 4 mm of 30% or less. (2) Evaluation length of all straight line portions. Ten point average roughness (Rz) at 4 mm exceeds 2 μm

FIG. 12 is a diagram for explaining a total of six straight portions including arbitrary three straight portions in parallel relation on the joint surface 104 of the metal member (M) and arbitrary three straight portions orthogonal to the three straight portions. FIG.
As the six straight line portions, for example, six straight line portions B1 to B6 as shown in FIG. 12 can be selected. First, a center line B1 passing through the center A of the joint surface 104 of the metal member (M) is selected as the reference line. Next, straight lines B2 and B3 that are parallel to the center line B1 are selected. Next, a center line B4 orthogonal to the center line B1 is selected, and straight lines B5 and B6 orthogonal to the center line B1 and parallel to the center line B4 are selected. Here, the vertical distances D1 to D4 between the straight lines are, for example, 2 to 5 mm.
In general, the metal member (M) is subjected to surface roughening treatment not only on the surface 104 of the metal member (M) with the thermoplastic resin member 301 but also on the entire metal member (M). Therefore, for example, the six straight portions may be selected from locations other than the joint surface 104 on the same surface as the joint surface 104 of the metal member (M) with the thermoplastic resin member 301 or on the opposite surface.

  When the above requirements (1) and (2) are satisfied at the same time, it is not always clear why the electronic device casing 100 can be obtained with better bonding strength between the metal member (M) and the thermoplastic resin member 301. The joint surface 104 of the metal member (M) with the thermoplastic resin member 301 has a structure that can effectively develop an anchor effect between the metal member (M) and the thermoplastic resin member 301. It is done.

From the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, any three straight portions in parallel relation on the joint surface 104 of the metal member (M) and the three straight lines. The surface roughness measured in accordance with JIS B0601 (corresponding international standard: ISO4287) for a total of six straight line parts composed of arbitrary three straight line parts orthogonal to the part is one of the following requirements (1A) to (1C) It is preferable to further satisfy one or more requirements, and it is particularly preferable to satisfy requirement (1C).
(1A) A straight line portion with a load length ratio (Rmr) of a roughness curve at a cutting level of 20% and an evaluation length of 4 mm is preferably 30% or less, preferably 2 straight portions or more, more preferably 3 straight portions or more, most preferably (1B) including 6 straight portions, preferably a straight portion having a load level ratio (Rmr) of 20% or less of a roughness curve at a cutting level of 20% and an evaluation length of 4 mm, preferably 1 straight portion or more, more preferably 2 straight lines. More than 3 parts, more preferably 3 straight parts or more, most preferably 6 straight parts (1C) A straight part where the cutting length is 40% and the load length ratio (Rmr) of the roughness curve at an evaluation length of 4 mm is 60% or less Is preferably 1 straight part or more, more preferably 2 straight parts or more, further preferably 3 straight parts or more, and most preferably 6 straight parts

Further, from the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, it conforms to JIS B0601 (corresponding international standard: ISO 4287) on the joint surface 104 of the metal member (M). The average value of the load length ratio (Rmr) of the roughness curve at a cutting level of 20% and an evaluation length of 4 mm is preferably 0.1% or more and 40% or less, more preferably 0.5% or more. It is 30% or less, more preferably 1% or more and 20% or less, and most preferably 2% or more and 15% or less.
In addition, what averaged the load length rate (Rmr) of the above-mentioned arbitrary 6 linear parts can be employ | adopted for the average value of the said load length rate (Rmr).

The load length ratio (Rmr) of the joint surface 104 of the metal member (M) according to this reference example can be controlled by appropriately adjusting the conditions of the roughening treatment on the surface of the metal member.
In this reference example, the type and concentration of the etching agent, the temperature and time of the roughening treatment, the timing of the etching treatment, and the like are particularly cited as factors for controlling the load length ratio (Rmr).

From the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, any three straight portions in parallel relation on the joint surface 104 of the metal member (M) and the three straight lines. It is preferable that the surface roughness measured in accordance with JIS B0601 (corresponding international standard: ISO4287) further satisfies the following requirement (2A) for a total of six straight line parts composed of arbitrary three straight line parts orthogonal to the part.
(2A) The 10-point average roughness (Rz) at an evaluation length of 4 mm of all straight portions is preferably more than 5 μm, more preferably 10 μm or more, and further preferably 15 μm or more.

From the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, the average value of the ten-point average roughness (Rz) on the joint surface 104 of the metal member (M) is preferably It is more than 2 μm and 50 μm or less, more preferably more than 5 μm and 45 μm or less, further preferably 10 μm or more and 40 μm or less, and particularly preferably 15 μm or more and 30 μm or less.
In addition, what averaged the 10-point average roughness (Rz) of the above-mentioned arbitrary 6 linear parts can be employ | adopted for the average value of the said 10-point average roughness (Rz).

From the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, any three straight portions in parallel relation on the joint surface 104 of the metal member (M) and the three straight lines. It is preferable that the surface roughness measured in accordance with JIS B0601 (corresponding international standard: ISO4287) further satisfies the following requirement (4) for a total of six straight line parts composed of arbitrary three straight line parts orthogonal to the part.
(4) The average length (RSm) of the roughness curve elements of all the linear portions is more than 10 μm and less than 300 μm, more preferably 20 μm or more and 200 μm or less.

From the viewpoint of further improving the joint strength between the metal member (M) and the thermoplastic resin member 301, the average value of the average length (RSm) of the roughness curve elements on the joint surface 104 of the metal member (M). Is preferably more than 10 μm and less than 300 μm, more preferably 20 μm or more and 200 μm or less.
In addition, what averaged the 10-point average roughness (Rz) of the above-mentioned arbitrary 6 linear parts can be employ | adopted for the average value of the average length (RSm) of the said roughness curve element.
Here, in this reference example, when the average thickness of the metal member (M) is in the range of 500 μm or more, the average value of the average length (RSm) of the roughness curve element is the interval period.

The ten-point average roughness (Rz) of the joint surface 104 of the metal member (M) according to this reference example and the average length (RSm) of the roughness curve element are appropriate for the conditions of the roughening treatment on the surface of the metal member. It is possible to control by adjusting to.
In this reference example, the temperature and time of the roughening treatment, the etching amount, etc. are particularly cited as factors for controlling the ten-point average roughness (Rz) and the average length (RSm) of the roughness curve elements. .

Next, a method for preparing the metal member (M) that satisfies the above-described interval period, load length ratio (Rmr), ten-point average roughness (Rz), average length of roughness curve elements (RSm), and the like will be described.
Such a metal member (M) can be formed, for example, by roughening the surface of the metal member using an etching agent.
Hereinafter, the roughness of the metal member for obtaining the metal member (M) satisfying the interval period, the load length ratio (Rmr), the ten-point average roughness (Rz), the average length of the roughness curve element (RSm), etc. 2 shows an example of a crystallization processing method. However, the roughening method of the metal member which concerns on this reference example is not limited to the following examples.

(1) Pretreatment process First, it is desirable that the metal member does not have a thick film made of an oxide film, a hydroxide, or the like on the surface on the joining side with the thermoplastic resin member 301. In order to remove such a thick film, the surface layer may be polished by mechanical polishing such as sand blasting, shot blasting, grinding, barrel processing, or chemical polishing before the next etching step. Good. Further, when there is significant contamination of machine oil or the like on the surface on the joining side with the thermoplastic resin member 301, it is preferable to perform treatment with an alkaline aqueous solution such as a sodium hydroxide aqueous solution or a potassium hydroxide aqueous solution, or degreasing.

(2) Surface Roughening Treatment Step In this reference example, as a surface roughening treatment method for a metal member, it is preferable to perform treatment with an acid-based etching agent described later at a specific timing. Specifically, the treatment with the acid-based etching agent is preferably performed at the final stage of the surface roughening treatment step.

  Examples of the roughening treatment using the acid-based etching agent include treatment methods such as immersion and spraying. The treatment temperature is preferably 20 to 40 ° C., the treatment time is preferably about 5 to 350 seconds, 20 to 300 seconds are more preferred, and 50 to 300 seconds are particularly preferred from the viewpoint that the surface of the metal member can be more uniformly roughened.

  By the roughening treatment using the acid-based etching agent, the surface of the metal member is roughened into an uneven shape. The etching amount (dissolution amount) in the depth direction of the metal member when the acid-based etching agent is used is preferably 0.1 to 500 μm when calculated from the mass, specific gravity and surface area of the dissolved metal member. 5 to 500 μm is more preferable, and 5 to 100 μm is even more preferable. When the etching amount is equal to or greater than the lower limit, the bonding strength between the metal member (M) and the thermoplastic resin member 301 can be further improved. Further, if the etching amount is equal to or less than the above upper limit value, the processing cost can be reduced. The etching amount can be adjusted by the processing temperature, processing time, and the like.

  In this reference example, when the metal member is roughened using the acid-based etchant, the entire surface of the metal member may be roughened, and only the surface to which the thermoplastic resin member 301 is bonded is used. Partial roughening treatment may be performed.

(3) Post-treatment step In this reference example, it is usually preferable to perform washing and drying after the surface roughening treatment step. Although there is no restriction | limiting in particular about the method of water washing, It is preferable to wash | clean for predetermined time with immersion or flowing water.

  Furthermore, as a post-treatment step, it is preferable to perform ultrasonic cleaning in order to remove smut and the like generated by the treatment using the acid-based etching agent. The ultrasonic cleaning conditions are not particularly limited as long as the generated smut and the like can be removed, but the solvent used is preferably water, and the treatment time is preferably 1 to 20 minutes.

(Acid etching agent)
In this reference example, as the etching agent used for the roughening treatment on the surface of the metal member, a specific acid-based etching agent described later is preferable. By treating with the specific etching agent, a fine concavo-convex structure suitable for improving the adhesiveness with the thermoplastic resin member 301 is formed on the surface of the metal member, and the metal member (M) and the heat are formed by the anchor effect. It is considered that the bonding strength with the plastic resin member 301 is further improved.

  Hereinafter, the components of the acid-based etching agent that can be used in this reference example will be described.

  The acid-based etching agent contains at least one of ferric ions and cupric ions and an acid, and may contain manganese ions, various additives, and the like as necessary.

-Ferric ion The said ferric ion is a component which oxidizes a metal member, and this ferric ion can be contained in an acid type etching agent by mix | blending a ferric ion source. Examples of the ferric ion source include ferric nitrate, ferric sulfate, and ferric chloride. Among the ferric ion sources, ferric chloride is preferable because it has excellent solubility and is inexpensive.

  In this reference example, the content of the ferric ion in the acid-based etching agent is preferably 0.01 to 20% by mass, more preferably 0.1 to 12% by mass, and still more preferably 0.5 to 7%. % By mass, still more preferably 1-6% by mass, particularly preferably 1-5% by mass. If content of the said ferric ion is more than the said lower limit, the fall of the roughening rate (dissolution rate) of a metal member can be prevented. On the other hand, if the content of the ferric ion is not more than the above upper limit value, the roughening rate can be properly maintained, so that the bonding strength between the metal member (M) and the thermoplastic resin member 301 is improved. More suitable uniform roughening becomes possible.

-Cupric ion The said cupric ion is a component which oxidizes a metal member, and can mix | blend this cupric ion in an acid type etching agent by mix | blending a cupric ion source. Examples of the cupric ion source include cupric sulfate, cupric chloride, cupric nitrate, and cupric hydroxide. Of the cupric ion sources, cupric sulfate and cupric chloride are preferred because they are inexpensive.

  In this reference example, the content of the cupric ion in the acid-based etching agent is preferably 0.001 to 10% by mass, more preferably 0.01 to 7% by mass, and still more preferably 0.00. It is 05-1 mass%, More preferably, it is 0.1-0.8 mass%, More preferably, it is 0.15-0.7 mass%, Most preferably, it is 0.15-0.4 mass%. If content of the said cupric ion is more than the said lower limit, the fall of the roughening rate (dissolution rate) of a metal member can be prevented. On the other hand, if the content of the cupric ion is less than or equal to the above upper limit value, the roughening rate can be properly maintained, so that the bonding strength between the metal member (M) and the thermoplastic resin member 301 is improved. More suitable uniform roughening becomes possible.

  The acid-based etching agent may contain only one of ferric ion and cupric ion, or may contain both, but both ferric ion and cupric ion It is preferable to contain. Since the acid-based etching agent contains both ferric ions and cupric ions, a good roughened shape suitable for improving the bonding strength between the metal member (M) and the thermoplastic resin member 301 can be easily obtained. can get.

  When the acid-based etching agent contains both ferric ions and cupric ions, the contents of ferric ions and cupric ions are preferably in the above ranges. The total content of ferric ions and cupric ions in the acid-based etching agent is preferably 0.011 to 20% by mass, more preferably 0.1 to 15% by mass, and even more preferably. Is 0.5 to 10% by mass, particularly preferably 1 to 5% by mass.

Manganese ions The acid-based etching agent may contain manganese ions in order to uniformly roughen the surface of the metal member. Manganese ions can be contained in the acid-based etching agent by blending a manganese ion source. Examples of the manganese ion source include manganese sulfate, manganese chloride, manganese acetate, manganese fluoride, and manganese nitrate. Among the above manganese ion sources, manganese sulfate and manganese chloride are preferable from the viewpoint of being inexpensive.

  In this reference example, the content of the manganese ion in the acid-based etching agent is preferably 0 to 1% by mass, and more preferably 0 to 0.5% by mass. The present inventors show that the manganese ion content exhibits sufficient bonding strength even when the thermoplastic resin (P1) constituting the thermoplastic resin member 301 is 0% by mass when it is a polyolefin resin. I have confirmed. That is, when a polyolefin resin is used as the thermoplastic resin (P1), the manganese ion content is preferably 0% by mass. On the other hand, when a thermoplastic resin other than the polyolefin resin is used, the content is not more than the upper limit. Manganese ions are used as appropriate.

-Acid The acid is a component that dissolves a metal oxidized by ferric ions and / or cupric ions. Examples of the acid include inorganic acids such as hydrochloric acid, hydrobromic acid, sulfuric acid, nitric acid, phosphoric acid, perchloric acid, and sulfamic acid, and organic acids such as sulfonic acid and carboxylic acid. Examples of the carboxylic acid include formic acid, acetic acid, citric acid, oxalic acid, malic acid and the like. One or more of these acids can be added to the acid-based etching agent. Of the inorganic acids, sulfuric acid is preferred because it has almost no odor and is inexpensive. Among the organic acids, carboxylic acid is preferable from the viewpoint of uniformity of the roughened shape.

  In this reference example, the acid content in the acid-based etching agent is preferably 0.1 to 50% by mass, more preferably 0.5 to 50% by mass, and 1 to 50% by mass. It is still more preferable, it is still more preferable that it is 1-30 mass%, it is still more preferable that it is 1-25 mass%, and it is still more preferable that it is 2-18 mass%. If content of the said acid is more than the said lower limit, the fall of the roughening rate (dissolution rate) of a metal member can be prevented. On the other hand, if the content of the acid is not more than the above upper limit, workability can be improved because crystal precipitation of the metal salt of the metal member when the liquid temperature is lowered can be prevented.

・ Other components To the acid-based etching agent that can be used in this reference example, a surfactant may be added to prevent unevenness due to surface contaminants such as fingerprints, and other additives may be added as necessary. May be. Other additives include halide ion sources added to form deep irregularities, such as sodium chloride, potassium chloride, sodium bromide, potassium bromide and the like. Alternatively, thio compounds such as thiosulfate ions and thiourea added to increase the roughening treatment speed, azoles such as imidazole, triazole and tetrazole added to obtain a more uniform roughened shape, Examples thereof include a pH adjuster added to control the oxidization reaction. When these other components are added, the total content is preferably about 0.01 to 10% by mass in the acid-based etching agent.

  The acid-based etching agent of this reference example can be easily prepared by dissolving the above components in ion-exchanged water or the like.

<Thermoplastic resin member>
Hereinafter, the thermoplastic resin member 301 according to this reference example will be described.
The thermoplastic resin member 301 according to this reference example is made of a thermoplastic resin composition (P). The thermoplastic resin composition (P) contains the thermoplastic resin (P1) as an essential component, and optionally contains other compounding agents (P2). For convenience, it is described that the thermoplastic resin member 301 is made of the thermoplastic resin composition (P) even when the thermoplastic resin member 301 is made of only the thermoplastic resin (P1).

(Thermoplastic resin (P1))
Although it does not specifically limit as a thermoplastic resin (P1), For example, (meth) acrylic-type resin, such as polyolefin resin and poly (meth) acrylic acid methyl resin, polystyrene resin, polyvinyl alcohol-polyvinyl chloride copolymer resin, Aromatic polyether such as polyvinyl acetal resin, polyvinyl butyral resin, polyvinyl formal resin, polymethylpentene resin, maleic anhydride-styrene copolymer resin, polycarbonate resin, polyphenylene ether resin, polyether ether ketone resin, polyether ketone resin Ketone, polyester resin, polyamide resin, polyamideimide resin, polyimide resin, polyetherimide resin, styrene elastomer, polyolefin elastomer, polyurethane elastomer, poly Steal elastomer, polyamide elastomer, ionomer, aminopolyacrylamide resin, isobutylene maleic anhydride copolymer, ABS, ACS, AES, AS, ASA, MBS, ethylene-vinyl chloride copolymer, ethylene-vinyl acetate copolymer, ethylene-vinyl acetate Vinyl chloride graft polymer, ethylene-vinyl alcohol copolymer, chlorinated polyvinyl chloride resin, chlorinated polyethylene resin, chlorinated polypropylene resin, carboxyvinyl polymer, ketone resin, amorphous copolyester resin, norbornene resin, fluoroplastic, polytetra Fluoroethylene resin, fluorinated ethylene polypropylene resin, PFA, polychlorofluoroethylene resin, ethylenetetrafluoroethylene copolymer, polyfluoride Vinylidene resin, polyvinyl fluoride resin, polyarylate resin, thermoplastic polyimide resin, polyvinylidene chloride resin, polyvinyl chloride resin, polyvinyl acetate resin, polysulfone resin, polyparamethylstyrene resin, polyallylamine resin, polyvinyl ether resin, polyphenylene Oxide resin, polyphenylene sulfide (PPS) resin, polymethylpentene resin, oligoester acrylate, xylene resin, maleic acid resin, polyhydroxybutyrate resin, polysulfone resin, polylactic acid resin, polyglutamic acid resin, polycaprolactone resin, polyethersulfone Resin, polyacrylonitrile resin, styrene-acrylonitrile copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, polyacetal resin, etc. I can get lost. These thermoplastic resins may be used individually by 1 type, and may be used in combination of 2 or more types.

  Among these, polyolefin resin, polyester resin, polyamide resin, polyphenylene sulfide resin, polycarbonate from the viewpoint that the effect of improving the bonding strength between the metal member (M) and the thermoplastic resin member 301 can be obtained more effectively. Resin, polyether ether ketone resin, polyether ketone resin, polyimide resin, polyether sulfone resin, polystyrene resin, polyacrylonitrile resin, styrene-acrylonitrile copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, (meth) acrylic One or two or more thermoplastic resins selected from a series resin and a polyacetal resin are preferably used.

As the polyolefin-based resin, a polymer obtained by polymerizing olefin can be used without any particular limitation.
Examples of the olefin constituting the polyolefin resin include ethylene, α-olefin, cyclic olefin, and polar olefin.

  Examples of the α-olefin include linear or branched α-olefins having 3 to 30 carbon atoms, preferably 3 to 20 carbon atoms. More specifically, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-octene, 1-octene, Decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicocene and the like can be mentioned.

  As said cyclic olefin, a C3-C30 cyclic olefin is mentioned, Preferably it is C3-C20. More specifically, cyclopentene, cycloheptene, norbornene, 5-methyl-2-norbornene, tetracyclododecene, 2-methyl-1,4,5,8-dimethano-1,2,3,4,4a, 5 , 8,8a-octahydronaphthalene and the like.

  Examples of the polar olefin include vinyl acetate, methyl methacrylate, methyl acrylate, and ethyl acrylate.

  As the olefin constituting the polyolefin resin, ethylene, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1- Examples include pentene. Of these, ethylene, propylene, 1-butene, 1-hexene and 4-methyl-1-pentene are more preferable, and ethylene or propylene is more preferable.

  The polyolefin resin may be obtained by polymerizing the above-mentioned olefin alone, or may be obtained by random copolymerization, block copolymerization, or graft copolymerization in combination of two or more. .

  The polyolefin resin may be a blend of polyolefins having different properties. Examples thereof include one or more selected from propylene homopolymer, propylene random copolymer, and propylene block copolymer, propylene / ethylene copolymer rubber, ethylene / α-olefin copolymer (here α- Examples of olefins include blends with elastomers such as 1-butene, 1-hexene, 1-octene and the like.

  The polyolefin resin may be a linear resin or a resin having a branched structure.

  Examples of the polyester resin include aliphatic polyesters such as polylactic acid, polyglycolic acid, polycaprolactone, and polyethylene succinate, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate (PBT), and polycyclohexylenedimethylene terephthalate (PCT). ) And the like.

  Examples of the polyamide resins include ring-opening polymerization aliphatic polyamides such as PA6 and PA12; polycondensation polyamides such as PA66, PA46, PA610, PA612, and PA11; MXD6, PA6T, PA9T, PA6T / 66, PA6T / 6. Semi-aromatic polyamides such as amorphous PA; polyaromatic polyamides such as poly (p-phenylene terephthalamide), poly (m-phenylene terephthalamide), poly (m-phenylene isophthalamide), amide elastomers, etc. It is done.

(Other compounding agents (P2))
The thermoplastic resin composition (P) may contain other compounding agents (P2) for the purpose of imparting individual functions. Examples of the compounding agent (P2) include fillers, flame retardants, flame retardant aids, heat stabilizers, antioxidants, pigments, weathering agents, plasticizers, dispersants, lubricants, mold release agents, antistatic agents, Examples include impact modifiers.

In this reference example, from the viewpoint of adjusting the difference in linear expansion coefficient between the metal member (M) and the thermoplastic resin member 301 and improving the mechanical strength of the thermoplastic resin member 301, the thermoplastic resin member 301 further includes a filler. It is preferable to include.
As the filler, for example, one or more kinds selected from the group consisting of hydrotalcite, glass fiber, carbon fiber, metal fiber, organic fiber, carbon particle, clay, talc, silica, mineral, and cellulose fiber are selected. Can do. Among these, Preferably, it is 1 type, or 2 or more types selected from hydrotalcite, glass fiber, carbon fiber, talc, and a mineral.
The shape of the filler is not particularly limited, and may be any shape such as a fiber shape, a particle shape, or a plate shape.

  When the thermoplastic resin member 301 includes a filler, the content is, for example, 5% by mass to 95% by mass, preferably 10% by mass to 90% by mass, when the entire thermoplastic resin member 301 is 100% by mass. % Or less, more preferably 20% by mass or more and 90% by mass or less, further preferably 30% by mass or more and 90% by mass or less, and particularly preferably 50% by mass or more and 90% by mass or less.

  The filler has the effect of controlling the linear expansion coefficient of the thermoplastic resin member 301 in addition to the effect of increasing the rigidity of the thermoplastic resin member 301. In particular, in the case of the electronic device casing 100 of the present reference example, the temperature dependence of the shape stability of the metal member (M) and the thermoplastic resin member 301 is often greatly different, so that a large temperature change occurs. The electronic device casing 100 is likely to be distorted. This distortion can be reduced when the thermoplastic resin member 301 contains a filler. Moreover, reduction of toughness can be suppressed because content of a filler exists in the said range.

In this reference example, the filler is preferably a fibrous filler, more preferably glass fiber and carbon fiber, and particularly preferably glass fiber.
Thereby, since shrinkage | contraction of the thermoplastic resin member 301 after shaping | molding can be suppressed, joining to the metal member (M) and the thermoplastic resin member 301 can be made stronger.

Examples of the hydrotalcites include natural products and synthetic products, and examples include hydrous basic carbonates such as magnesium, calcium, zinc, aluminum, and bismuth or those that do not contain crystal water. Examples of natural products include those having the structure of Mg ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O. As synthetic products, Mg _0.7 Al _0.3 (OH) ₂ (CO ₃ ) _0.15 · 0.54H ₂ O, Mg _4.5 Al ₂ (OH) ₁₃ CO ₃ · 3.5H ₂ O, Mg _4.2 Al ₂ (OH) _12.4 (CO ₃ ) _0.15 , Zn ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O, Ca ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O, Mg ₁₄ Bi ₂ (OH) _29.6 · 4.2H ₂ O and the like. The blending amount of the hydrotalcite is preferably 0.01 parts by mass or more and 2 parts by mass or less per 100 parts by mass of the thermoplastic resin composition (P). The heat resistance of the thermoplastic resin member 301 obtained can be made more favorable as the compounding quantity of hydrotalcite is more than the said lower limit. The flame retardance of the thermoplastic resin member 301 obtained can be made more favorable as the compounding quantity of hydrotalcite is below the said upper limit.

  Examples of the flame retardant include bis (2,3-dibromopropyl) ether of tetrabromobisphenol A, bis (2,3-dibromopropyl) ether of tetrabromobisphenol S, and bis (2,3 of tetrabromobisphenol A). -Dibromopropyl) ether, tris (2,3-dibromopropyl) isocyanurate and mixtures of two or more of these. Content of a flame retardant is 5-25 mass parts per 100 mass parts of thermoplastic resin compositions (P), Preferably it is 10-20 mass parts. When the content of the flame retardant is not less than the above lower limit value, the flame retardancy of the obtained thermoplastic resin member 301 can be further improved. When the content of the flame retardant is not more than the above upper limit value, the mechanical properties of the obtained thermoplastic resin member 301 can be further improved.

The thermoplastic resin composition (P) can contain a flame retardant aid. When the thermoplastic resin composition (P) contains a flame retardant aid, the content thereof is 0.5 to 20 parts by mass, preferably 1 to 10 parts by mass, per 100 parts by mass of the thermoplastic resin composition (P). is there. When the content of the flame retardant auxiliary is not less than the above lower limit, a sufficient synergistic effect with the flame retardant can be obtained. When the content of the flame retardant aid is not more than the above upper limit value, the mechanical properties of the obtained thermoplastic resin member 301 can be further improved. Examples of the flame retardant aid include antimony trioxide (Sb ₂ O ₃ ) and antimony pentoxide (Sb ₂ O ₅ ).

  The thermoplastic resin composition (P) preferably has high fluidity in order to facilitate entry into the fine uneven structure provided on the surface of the metal member (M). Therefore, in this reference example, the thermoplastic resin composition (P) preferably has an MFR of 1 to 200 g / 10 min measured at 230 ° C. under a load of 2.16 kg in accordance with ASTM D1238. More preferably, it is -50g / 10min.

(Method for producing thermoplastic resin composition (P))
The manufacturing method of a thermoplastic resin composition (P) is not specifically limited, Generally, it can manufacture by a well-known method. For example, the following method is mentioned. First, the thermoplastic resin (P1) and, if necessary, other compounding agent (P2) are mixed or mixed using a Banbury mixer, a single screw extruder, a twin screw extruder, a high speed twin screw extruder or the like. A thermoplastic resin composition (P) is obtained by melt-mixing.

[Method of manufacturing casing for electronic device]
Next, a method for manufacturing the electronic device casing 100 according to the present reference example will be described.
3, 4 and 5 schematically show an example of the structure of the developed figure metal plate (development figure metal resin bonded plate 20, plate material) to which the thermoplastic resin member 301 of the reference example according to the present invention is joined. FIG.
The method for manufacturing the electronic device casing 100 according to the present reference example includes, for example, the following steps (A) to (C).
(A) a metal bottom plate 201 and metal side plates 202 (202-1, 202-2, 202-3, and 202-4) integrally connected to the metal bottom plate 201, Step of preparing a developed graphic metal plate having a fine concavo-convex structure on at least the surface of the joining portion to which the thermoplastic resin member 301 is joined (B) The developed graphic metal plate is placed in a mold, and a thermoplastic resin composition ( (P) A step of producing the developed graphic metal resin bonding plate 20 by injecting P into the mold and bonding the thermoplastic resin member 301 to the surface of the developed graphic metal plate. The process of bending the boundary line portion 205 between the bottom plate 201 and the side plate 202 of the plate 20 and forming the developed view-like metal-resin bonding plate 20 into a box shape is made by bending the electronic device casing 100 according to this reference example. Expanded figure metal plate and development that are the previous intermediate products The shape of the Jo metal-resin bonding plate 20 is flat, there is a merit of improving the storage efficiency and transportation efficiency of mass intermediate product.

(Process (A))
First, a metal bottom plate 201 and a metal side plate 202 (202-1, 202-2, 202-3, and 202-4) integrally connected to the metal bottom plate 201 are provided, and at least A development-form metal plate that is a shape of the development view of the electronic device casing 100 having a fine concavo-convex structure on the surface of the joint portion to which the thermoplastic resin member 301 is joined is prepared. Here, the development view metal plate 20 may be a part (for example, two or more) of the development view of the electronic device casing 100. For example, the developed metal plate may further include a metal lid plate 203 integrally connected to one side plate 202 as shown in FIG. 3, or the lid plate 203 as shown in FIG. May not be provided. Moreover, as shown in FIG. 4, it is not necessary to provide one of the side plates (back plate) 202-3. When the lid plate 203 is not provided, the lid plate 203 shown in FIG. 2 is prepared separately, and the lid plate 203 can be engaged with one side plate 202 by, for example, the mechanical engagement means. Similarly, when the back plate 202-3 is not provided, a back plate 202-3 (not shown) is prepared separately, and a surface composed of the bottom plate 201, both side plates 202-2 and 202-4, and the cover plate 203 is provided. For example, it can be engaged by the mechanical engagement means.
Here, the developed figure-like metal plate corresponds to the metal member (M) constituting the casing 100 for the electronic device. For example, the development shown in FIGS. 3, 4, and 5 is performed by punching the plate-like metal member. It can be obtained by processing in the shape of a figure and subjecting at least the surface of the joint to which the thermoplastic resin member 301 is joined to the roughening treatment described above.
Details of the metal member and the roughening treatment are omitted here.

(Process (B))
Next, the developed metal plate 20 is placed in the mold, and the thermoplastic resin composition (P) is injected into the mold to join the thermoplastic resin member 301 to the surface of the developed metal plate 20. .
Examples of the method for joining the thermoplastic resin member 301 include an injection molding method, a transfer molding method, a compression molding method, a reaction injection molding method, a blow molding method, a thermoforming method, and a press molding method. Among these, the injection molding method is preferable. That is, the thermoplastic resin member 301 is preferably an injection molded body. Hereinafter, an example using the injection molding method will be described.

The method for joining the thermoplastic resin member 301 to the developed graphic metal plate 20 using the injection molding method includes, for example, the following steps (i) to (ii).
(I) Step of disposing the developed graphic metal plate 20 in the injection mold (ii) Thermoplastic in the mold so that at least a part of the thermoplastic resin member 301 is in contact with the developed graphic metal plate 20. Step of injection molding the resin composition (P) and molding the thermoplastic resin member 301 Hereinafter, a specific description will be given.

  First, (i) an injection mold is prepared, the mold is opened, and a developed metal plate is placed in the cavity (space). (Ii) Thereafter, the mold is closed, and the thermoplastic resin composition (P) is injected into the cavity portion of the mold so that at least a part of the thermoplastic resin member 301 is in contact with the developed metal plate. It solidifies and joins the developed figure metal plate and the thermoplastic resin member 301. Thereafter, by opening the mold and releasing the mold, the developed graphic metal resin bonded plate 20 in which the thermoplastic resin member 301 is bonded to the developed graphic metal plate can be obtained. As the mold, for example, an injection mold generally used in high-speed heat cycle molding (RHCM, heat & cool molding) can be used.

Here, in the step (ii), when adopting high-speed heat cycle molding, the surface temperature of the mold is preferably set between the start of injection of the thermoplastic resin composition (P) and the completion of pressure holding, preferably heat. It is preferable to maintain the glass transition temperature of the plastic resin member 301 (hereinafter also referred to as Tg) or higher, more preferably Tg + (5 or higher and 150 or lower) ° C. or higher.
Thereby, the thermoplastic resin composition (P) can be brought into contact with the surface of the developed metal plate at a high pressure for a longer time while keeping the thermoplastic resin composition (P) in a softened state.
As a result, since the adhesiveness between the developed metal plate and the thermoplastic resin member 301 can be improved, it is possible to more stably obtain the electronic device casing 100 that is more excellent in bonding strength.

As a heating method, any one of a steam type, a pressurized hot water type, a hot water type, a hot oil type, an electric heater type, an electromagnetic induction overheating type, or a combination of them may be used.
Specifically, the surface temperature of the mold is introduced by introducing a heating medium selected from water vapor, hot water and hot oil into a flow path provided near the surface of the mold, or using electromagnetic induction heating. Is preferably maintained at a temperature equal to or higher than the glass transition temperature of the thermoplastic resin member 301.

In the step (ii), the time from the start of injection to the completion of the pressure holding is preferably 1 second to 60 seconds, and more preferably 10 seconds to 50 seconds.
The thermoplastic resin member 301 is brought into contact with the fine concavo-convex structure of the developed metal plate 20 at a high pressure for a longer time while keeping the thermoplastic resin member 301 in a molten state when the time is equal to or greater than the lower limit. Can do. Thereby, the housing | casing 100 for electronic devices which was further excellent by joining strength can be obtained more stably.
Moreover, since the molding cycle of the electronic device casing 100 can be shortened when the time is equal to or less than the upper limit value, the electronic device casing 100 can be obtained more efficiently.

In the method for manufacturing the electronic device casing 100 according to the present reference example, in the step (B), the thermoplastic resin composition is used so that the thermoplastic resin member 301 is not bonded to the boundary line portion 205 between the bottom plate 201 and the side plate 202. It is preferable to inject (P) into the mold.
By doing so, it is possible to obtain the developed metal resin bonding plate 20 in which the thermoplastic resin member 301 is not bonded to the boundary line portion 205 between the bottom plate 201 and the side plate 202, and as a result, the bottom plate 201 and the side plate 202. It is easier to bend the boundary line portion 205 and the developed view-shaped metal resin bonding plate 20 is more easily box-shaped. Therefore, the productivity of the electronic device casing 100 can be further improved.

(Process (C))
Next, the boundary line portion 205 between the bottom plate 201 and the side plate 202 is bent to form the developed view-like metal resin bonding plate 20 in a box shape, thereby obtaining the electronic device casing 100.
There is no particular limitation on the method for forming the developed metal resin bonding plate 20 in a box shape, and generally known methods can be used. For example, the electronic device casing 100 is obtained by bending the boundary line portion 205 between the bottom plate 201 and the side plate 202 and attaching the cover plate 203 as necessary.
At this time, the adjacent side plates 202 and the lid plate 203 connected to the side plates 202 as necessary may be engaged by mechanical means. Although it does not specifically limit as a mechanical engagement means, Screwing etc. are mentioned.
(Embodiment)
FIG. 6 is a perspective view illustrating a configuration of the electronic apparatus 400 according to the embodiment. FIG. 7 is a cross-sectional view taken along the line AA of FIG. The electronic device 400 according to the present embodiment has a configuration in which an electronic component 700 is disposed in a component including a housing 500 and a heat dissipation member 600. At least one surface 620 of the heat radiating member 600 is a metal. The casing 500 is formed using a resin. A surface 512 of the side wall 510 of the housing 500 that faces the one surface 620 is joined to the one surface 620. In addition, at least a part of the area surrounded by the side wall 510 of the one surface 620 is not in contact with the casing 500 and is not covered. An electronic component is accommodated in a space surrounded by the side wall 510 and the one surface 620 of the heat dissipation member 600. Hereinafter, the electronic device 400 will be described in detail.

  The heat radiating member 600 is, for example, a heat sink, and as described above, at least one surface 620 is a metal. The part comprised by this metal among the heat radiating members 600 may occupy 80% or more of the heat radiating members 600 by volume ratio. The metal which comprises the heat radiating member 600 contains 1 type, or 2 or more types chosen from iron, stainless steel, zinc, an aluminum alloy, a copper alloy, and a magnesium alloy.

  In the example shown in FIG. 6, the heat dissipation member 600 has a plurality of heat dissipation fins 640. For example, the fin is provided on a surface opposite to the one surface 620. However, the heat dissipation member 600 may not have the fins 640. As a case where the heat radiating member 600 does not have the fins 640, for example, a so-called cold plate in which a refrigerant flow path as a cooling means is formed can be exemplified.

  The casing 500 is formed using a resin. The resin constituting the housing 500 is at least one of the resins exemplified as the resin constituting the thermoplastic resin member 301 shown in the reference example. And the joining structure of the housing | casing 500 and the one surface 620 of the heat radiating member 600 is the same as the joining structure of the thermoplastic resin member 301 and the metal member (M) shown in the reference example.

  That is, a fine concavo-convex structure in which convex portions having an interval period of 5 nm or more and 500 μm or less are formed on at least the surface of the region 620 where the surface 620 is joined with the housing 500 is formed. A part of the housing 500 is located in the fine uneven structure. Specifically, since a part of the housing 500 enters the concave portion of the fine concavo-convex structure, the bonding strength between the housing 500 and the one surface 620 is improved.

  In the example shown in FIG. 6, the housing 500 does not have a bottom surface. A surface 512 of the side wall 510 of the housing 500 that faces the one surface 620 is joined to the one surface 620 of the heat dissipation member 600. Here, the surface 512 is preferably joined to the one surface 620 over the entire circumference. If it does in this way, it will suppress that water permeates from the interface of the housing | casing 500 and the thermal radiation member 600. FIG.

  Further, since the bottom surface of the housing 500 is not provided, the entire region surrounded by the side wall 510 of the one surface 620 is not covered with the housing 500. Since the uncovered area is exposed from the bottom surface of the housing 500, the electronic component 700 can be fixed as will be described later.

  When viewed from a direction perpendicular to the surface 620, the side wall 510 is preferably along the edge of the surface 620. For example, when the one surface 620 is rectangular, the side wall 510 has a shape corresponding to the four side surfaces of the rectangular parallelepiped.

  The height of the side wall 510 is determined by the size of the electronic component housed inside the housing 500, for example. In the example shown in FIG. 6, the height of the housing 500 is lower than the height of the heat dissipation member 600. However, the height of the housing 500 may be substantially the same as the height of the heat dissipation member 600 or may be higher than 600.

  Although not shown in FIG. 6, a lid may be attached to the housing 500. This lid is prepared separately from the casing 500. The lid is attached to the housing 500 after the electronic component is accommodated in the space surrounded by the side wall 510 and the heat radiating member 600.

  The housing 500 further includes a first convex member 520 and a second convex member 540. The 1st convex member 520 and the 2nd convex member 540 are formed using the same resin as the heat radiating member 600, and are provided in order to fix an electronic component.

  The lower surface of the first convex member 520 is joined to one surface 620 of the heat dissipation member 600. The joining structure of the first convex member 520 and the one surface 620 is the same as the joining steel structure of the side wall 510 and the one surface 620. A part of the side portion of the first convex member 520 is connected to the inner wall of the side wall 510. If it does in this way, the side wall 510 and the 1st convex member 520 can be formed by one injection molding. The first convex member 520 may not be connected to the inner wall of the side wall 510.

  On the other hand, the second convex member 540 is integrated with the side wall 510 and protrudes from the inner side surface of the side wall 510. For this reason, the second convex member 540 is formed in the same process as the side wall 510.

  In the example shown in FIG. 6, both the upper surface of the first projecting member 520 and the upper surface of the second projecting member 540 have a recess. A jig (for example, a screw) for fixing the electronic component is inserted into the recess. The electronic components fixed to the first convex member 520 are, for example, a circuit board, a semiconductor device such as a microcomputer or a CPU, a discrete type element (for example, a capacitive element, a coil, a resistance element, etc.), and a fan for ventilation or cooling Is at least one of The same applies to the electronic components fixed to the second convex member 540.

  The electronic component 700 is an element that generates heat when energized, and is, for example, a circuit board, a semiconductor device such as a microcomputer or a CPU, or a discrete type element (for example, a capacitor element, a coil, or a resistance element). Electronic component 700 is fixed to one surface 620 of heat dissipation member 600 using fixed layer 720. The fixing layer 720 is, for example, a resin such as an adhesive or a pressure-sensitive adhesive, but preferably has a high heat transfer coefficient. Since the electronic component 700 is fixed to the one surface 620 of the heat radiating member 600, the heat generated by the electronic component 700 efficiently moves to the heat radiating member 600.

  Next, a method for manufacturing the electronic device 400 will be described. First, the heat radiating member 600 is prepared. Next, the side wall 510, the first convex member 520, and the second convex member 540 of the housing 500 are formed on the one surface 620 of the heat dissipation member 600. The side wall 510, the first convex member 520, and the second convex member 540 are formed using the same method as the thermoplastic resin member 301 in the reference example. Next, the electronic component 700 and other electronic components are fixed in a space surrounded by the one surface 620 and the side wall 510 of the heat dissipation member 600. Thereafter, a lid of the housing 500 is attached to the upper part of the side wall 510 as necessary.

  As described above, according to the present embodiment, the side wall 510 of the housing 500 is directly joined to the one surface 620 of the heat dissipation member 600. For this reason, the manufacturing cost of the electronic device 400 can be reduced. Further, since one surface 620 of the heat radiating member 600 is exposed on the inner surface of the housing 500, the heat generated by the electronic components including the electronic component 700 is efficiently transmitted to the heat radiating member 600.

(Modification)
FIG. 8 is a perspective view showing a configuration of an electronic apparatus 400 according to a modification, and corresponds to FIG. 6 in the embodiment. The electronic device 400 according to the present modification has the same configuration as the electronic device 400 according to the embodiment, except that the bottom portion 560 of the side wall 510 extends toward the inside of the housing 500.

  The thickness of the bottom 560 may be substantially the same as the thickness of the main body of the side wall 510, or may be thinner. The bottom portion 560 can also be regarded as a part of the bottom surface of the housing 500. A surface of the bottom portion 560 facing the one surface 620 of the heat dissipation member 600 is joined to the one surface 620. This joining structure is also the same as the joining structure of the thermoplastic resin member 301 and the metal member (M) shown in the reference example.

  According to this modification, since the area where the housing 500 and the one surface 620 are joined increases, the joining strength between the housing 500 and the one surface 620 increases. Note that most of the region surrounded by the side wall 510 is not covered with the housing 500. Therefore, a plurality of electronic components 700 can be fixed to 610 also in this modification.

  Hereinafter, the above reference examples will be described in detail with reference to examples and comparative examples. Note that the reference examples described above are not limited to the description of these examples. In addition, FIG.9, FIG10 and FIG.11 is utilized as a figure for demonstrating an Example.

[Example 1]
In Example 1, attention was paid to a metal resin bonding plate constituting a part of the electronic device casing according to the present reference example. The metal member which comprises a metal resin joining board was made into the aluminum alloy, and the thermoplastic resin member was joined to both surfaces of the metal member, and the metal resin joining board E10 was produced. Next, an experimental result in which the metal resin bonding plate E10 exhibits a high weight reduction effect while maintaining a strength comparable to that of the metal plate used in Comparative Example 1 made of only steel plate material (SECC) which is an existing technology. Show.

(Preparation of roughened aluminum alloy plate E101, which is a metal member constituting metal resin bonding plate E10)
An aluminum alloy plate (alloy number 5052 defined in JIS H4000) having a shape of 180 mm (horizontal width) × 129 mm (vertical width) × 0.3 mm (thickness) was prepared. The aluminum alloy plate is provided with a plurality of small holes (not shown) for penetrating resin so that the resin can flow and communicate from the fixed side (cavity side) to the movable side (core side). Yes.
Next, the aluminum alloy plate was degreased using a commercially available degreasing agent, and then a treatment tank 1 filled with an alkaline etching agent (30 ° C.) containing 15% by mass of sodium hydroxide and 3% by mass of zinc oxide. For 3 minutes (may be abbreviated as “alkaline etchant treatment” in the following description), and then immersed in 30% by mass of nitric acid (30 ° C.) for 1 minute to further perform the alkaline etchant treatment. Repeated twice. Next, the obtained aluminum alloy plate was subjected to an acid etching aqueous solution containing 3.9% by mass of ferric chloride, 0.2% by mass of cupric chloride, and 4.1% by mass of sulfuric acid. It was immersed in the filled processing tank 2 at 30 ° C. for 5 minutes and allowed to swing (in the following description, it may be abbreviated as “acid-based etching agent treatment”). Subsequently, ultrasonic cleaning (in water, 1 minute) was performed with running water, and then dried to obtain a roughened aluminum alloy plate E101.

The surface roughness of the obtained roughened aluminum alloy plate E101 is measured according to JIS B0601 (corresponding international standard: ISO4287) using a surface roughness measuring device “Surfcom 1400D (manufactured by Tokyo Seimitsu Co., Ltd.)”. Among the surface roughnesses, the load length ratio (Rmr), ten-point average roughness (Rz) and average length (RSm) of the roughness curve elements were measured. The obtained results are shown below. In addition, as shown in FIG. 12, a measurement place is a total of 6 linear parts which consist of arbitrary 3 linear parts on the fine uneven | corrugated surface of the roughening aluminum alloy plate E101, and arbitrary 3 linear parts orthogonal to the said linear part. is there.
-Load length ratio (Rmr) of roughness curve at cutting level 20%, evaluation length 4 mm: Longitudinal 3 points = 6.4% / 4.0% / 3.7%, Short 3 points = 6.9 % / 2.0% / 6.4%
-Load length ratio (Rmr) of the roughness curve at a cutting level of 40% and an evaluation length of 4 mm: 3 long points: 28.5% / 28.3% / 26.5%, 3 short points = 38.5 % / 18.4% / 19.3%
-Ten-point average roughness (Rz): Longitudinal 3 points = 17.0 μm / 18.4 μm / 16.6 μm, Short 3 points = 17.9 μm / 18.0 μm / 19.8 μm
Average length of roughness curve element (RSm): 3 long points = 120 μm / 165 μm / 127 μm, 3 short points = 119 μm / 145 μm / 156 μm

(Preparation of metal resin bonded plate E10 by insert molding)
A dedicated metal insert mold was attached to an injection molding machine (JSW J180AD110H) manufactured by Nippon Steel Works, and the roughened aluminum alloy plate E101 obtained by the above method was installed in the mold. Next, as a thermoplastic resin composition in the mold, glass fiber reinforced polypropylene (V7100 manufactured by Prime Polymer Co., Ltd., polypropylene (230 ° C., MFR of 2.16 kg load = 80 g / 10 min) 80 parts by mass, glass fiber 20 masses) Part) was subjected to injection molding under the conditions of a cylinder temperature of 230 ° C., a mold temperature of 100 ° C., an injection speed of 100 mm / second, a pressure holding pressure of 80 MPa, a pressure holding time of 5 seconds, and a cooling time of 50 seconds to produce a metal resin bonded plate E10. did. In the metal resin bonding plate E10, all the thermoplastic resin members E102 are bonded so as to face both surfaces of the roughened aluminum alloy plate E101. The widths of the joined thermoplastic resin members (hereinafter sometimes referred to as “resin rib portions”) were 3.6 mm in common and the height of the resin rib portion was 2.1 mm in common. The total weight of the metal resin bonding plate E10 was 39.6 g.
Moreover, the junction area ratio was 14 area%.

(Measurement of displacement in bending test)
Results of measuring displacement (25 ° C.) when a stress of 2 kgf in the vertical direction is applied to the center portion of the metal-resin bonding plate E10 (reference numeral F in FIG. 9) using an autograph manufactured by Shimadzu Corporation. 1.8 mm.

[Comparative Example 1]
An existing material (zinc) showing the same displacement (1.8 mm) as the metal-resin-bonded plate E10 obtained in Example 1 when a stress of 2 kgf is applied in the same manner as the displacement measurement in Example 1. The thickness of the plated steel sheet (SECC) was determined. That is, as a result of measuring the amount of displacement when 2 kgf buoyancy was applied to a commercially available SECC material having the same vertical and horizontal dimensions as the aluminum alloy plate used in Example 1 but only the thickness, SECC having a thickness of 0.8 mm was found to be an example. It was found that the same displacement (1.8 mm) as that of the metal resin bonding plate E10 obtained in 1 was exhibited. The total weight of the SECC plate was 146.2 g.

  Example 1 and Comparative Example 1 are compared. It was found that the metal-resin bonding plate E10 according to this reference example achieved a weight reduction of about 73% despite the same amount of displacement under a constant load as compared to the existing SECC plate.

[Example 2]
(Preparation of roughened aluminum alloy plate E20, which is a metal member constituting the developed metal resin bonding plate E30)
A commercially available 0.3 mm-thick aluminum alloy plate (alloy number 5052 defined in JIS H4000) is cut into the shape (unit: mm) shown in FIG. 10, and the opening shown in FIG. A portion E207 and a slit portion E209 are provided. The aluminum alloy plate (element plate) is provided with a plurality of small holes (not shown) for penetrating the resin so that the resin can flow from the fixed side (cavity side) to the movable side (core side). It has been. The number of small holes for penetrating resin is not particularly limited, but is usually 2 to 5 per side plate, each side plate, and lid plate.

  Next, the aluminum alloy plate was subjected to surface roughening treatment in exactly the same manner as in Example 1 to obtain a roughened aluminum alloy plate E20 having a bottom plate E201, a side plate E202, and a lid plate E203.

  The surface roughness of the obtained roughened aluminum alloy plate E20 is measured according to JIS B0601 (corresponding international standard: ISO4287) using a surface roughness measuring device “Surfcom 1400D (manufactured by Tokyo Seimitsu Co., Ltd.)”. Among the surface roughnesses, the load length ratio (Rmr), ten-point average roughness (Rz) and average length (RSm) of the roughness curve elements were measured. As a result, it was confirmed that a value reproducing the surface roughness parameter shown in Example 1 was exhibited.

(Production of developed figure metal resin bonding plate E30 by insert molding)
A dedicated metal insert mold was attached to an injection molding machine (JSW J180AD110H) manufactured by Nippon Steel Works, and the roughened aluminum alloy plate E20 obtained by the above method was installed in the mold. Next, as a thermoplastic resin composition in the mold, glass fiber reinforced polypropylene (V7100 manufactured by Prime Polymer Co., Ltd., polypropylene (230 ° C., MFR of 2.16 kg load = 80 g / 10 min) 80 parts by mass, glass fiber 20 masses) Part) was subjected to injection molding under the conditions of a cylinder temperature of 230 ° C., a mold temperature of 100 ° C., an injection speed of 100 mm / second, a pressure holding pressure of 80 MPa, a pressure holding time of 5 seconds, and a cooling time of 50 seconds. A metal-metal-bonded plate E30 was produced. As shown in FIG. 11, it was confirmed that the thermoplastic resin member was bonded to both surfaces of the roughened aluminum alloy plate E20 (in FIG. 11, the resin portion on the back surface side is not shown). Although not shown in FIG. 11, a convex portion (claw portion) and a concave portion are formed at any location of the thermoplastic resin member so that the cover plate and the side plates can be snap-fit engaged with each other.

(Fabrication of electronic equipment casing by bending the boundary)
In the developed developed metal resin bonding plate E30 obtained, each boundary line portion E205 is bent inward at a right angle, and then the convex portion and the concave portion provided in the resin portion are snap-fitted to stop the box-shaped electron. An equipment casing was produced. No warpage or peeling of metal and resin was observed in this electronic device casing. This casing is subjected to a heat cycle test in a heat cycle tester (test conditions: held at −20 ° C. for 2 hours, then held at 80 ° C. for 2 hours, heated and lowered for 1 hour each four times a day. As a result of repeating for 7 days, the metal member and the thermoplastic resin member were maintained in a strongly joined state, and no occurrence of warping or peeling phenomenon was observed.
Moreover, the junction area ratio was 21 area%.

[Comparative Example 2]
In Example 2, the same operation was performed under the same conditions as in Example 2 except that an aluminum alloy plate (element plate) having no small holes for resin penetration was used. A developed graphic metal resin bonded plate in which the thermoplastic resin composition was bonded only to the fixed side (cavity side) of the developed graphic metal plate was obtained by insert molding. Immediately after molding, peeling was already visually observed on a part of the metal member and the thermoplastic resin member. The developed figure-like metal resin bonding plate in which the resin was bonded only on one side was bent in the same manner as in Example 2 to form a box shape. At this time, the joined thermoplastic resin member is bent so as to be inside the box. Next, this electronic device casing was subjected to a heat cycle test in the same manner as in Example 2. As a result, each surface is deformed into a convex shape for all of the bottom plate, all side plates, and the cover plate, and most of the joint portion between the metal member and the thermoplastic resin member (90% or more of the entire joint portion area) is peeled off, It was also confirmed that the boundary line connecting the sides of each surface was deformed to form a gap.

  As mentioned above, although the reference example and embodiment of this invention were described, these are illustrations of this invention and can also employ | adopt various structures other than the above.

DESCRIPTION OF SYMBOLS 20 Expanded figure metal plate 100 Case for electronic devices 104 Joint surface 201 Bottom plate 202 Side plate 202-1 Side plate 202-2 Side plate 202-3 Side plate 202-4 Side plate 203 Cover plate 205 Boundary portion 207 Opening portion 209 Slit 301 Heat Plastic resin member 400 Electronic device 500 Housing 600 Heat dissipation member 700 Electronic component

Claims (7)

A heat dissipating member having at least one surface made of metal;
A housing fixed to the one surface of the heat dissipation member;
With
The housing is formed using a resin,
The one side surface of the side wall of the housing is joined to the one surface;
A part of at least a part of the area surrounded by the side surface of the casing is not covered with the casing. The component of claim 1,
A component that is joined to the portion of the one surface and includes a first convex member for fixing an electronic component. The component according to claim 1 or 2,
A component that protrudes from the inner surface of the side wall and includes a second convex member for fixing the electronic component. In the component as described in any one of Claims 1-3,
The one surface has a fine concavo-convex structure at least in a region bonded to the side wall,
A part in which a part of the side wall is located in the fine concavo-convex structure. In the component as described in any one of Claims 1-4,
The metal is a component including one or more selected from iron, stainless steel, zinc, aluminum alloy, copper alloy, and magnesium alloy. The component according to any one of claims 1 to 5,
An electronic component disposed inside the housing;
An electronic device comprising: The electronic device according to claim 6.
The electronic device is fixed to the part of the one surface.

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