JP2019038203A - Bonding method and manufacturing method of bonded body - Google Patents

Abstract

To provide a bonding method capable of performing strong bonding while improving assembly accuracy without depending on surface roughness, area, etc. of bonding surfaces.SOLUTION: The method includes a surface activation step of performing an activation treatment to activate at least one of a first bonding surface 10c of an optical element 10 as a first member and a second bonding surface 20c of a substrate 20 as a second member, a positioning step of positioning the optical element 10 and the substrate 20 through hydrogen bonding by applying pressure in a state in which the first and second bonding surfaces 10c and 20c are put together, and a main fixing step of bonding the first and second bonding surfaces 10c and 20c by bonding processing stronger than the hydrogen bonding in the positioning step. The surface roughness of at least one of the first and second bonding surfaces 10c and 20c before the surface activation step is greater than 1 nm.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for bonding a plurality of members constituting a bonded body and a method for manufacturing a bonded body using the bonding method.

  Conventionally, an adhesive is used for assembling lenses and the like. However, in a product that requires high accuracy, a dimensional error due to misalignment or the like due to curing shrinkage after bonding becomes a problem. In order to solve this problem, a method of providing an inspection standard with a high resolving power in the evaluation after assembling can be considered. However, the adhesive cannot be redone after being applied once, and the number of defective products increases. As a result, the yield may deteriorate, resulting in an increase in cost.

  Here, there is a component assembling method in which a DNA single-stranded structure is supported on the surface of a base material and the surface of a component to perform bonding based on hydrogen bonding between both members (for example, see Patent Document 1). However, since the method of Patent Document 1 is a bonding with a single hydrogen bond, the bonding may be weakened by moisture or the like.

  Further, the bonding surface of the object to be bonded is hydrophilized by switching the strength of the chemical treatment between the first half of the plasma treatment and the second half of the plasma treatment, and the surfaces of the objects to be bonded are hydrogen bonded to each other at a temperature of about 200 to about 200. There is a bonding method in which annealing ring is performed at a temperature (for example, see Patent Document 2). However, in the method of Patent Document 2, since it is premised on bonding between wafers formed of a material having high surface accuracy and high hardness, temporary bonding can be performed with a certain bonding force by hydrogen bonding even without pressure, If the surface accuracy is poor, the bond at the time of temporary bonding becomes weak, and there is a possibility that a position shift occurs before annealing.

  In addition, there is a bonding method in which a plasma polymer (organic substance) is formed on one of the members to be bonded, and both surfaces of the member to be bonded are hydrophilized and then pressurized and heated to perform bonding with high accuracy (for example, And Patent Document 3). However, since hydrogen bonding and dehydration condensation proceed simultaneously by pressurization and heating, a strong bond is formed after bonding, and positioning cannot be performed again even if a positional shift occurs.

JP 2007-237299 A JP 2006-339363 A JP 2010-184499 A

  It is an object of the present invention to provide a bonding method that enables strong bonding while improving assembly accuracy without depending on the surface roughness or area of the bonding surface.

  An object of this invention is to provide the manufacturing method of the conjugate | zygote using the said joining method.

  In order to solve the above-described problem, the bonding method according to the present invention activates at least one of the first bonding surface of the first member facing the second member and the second bonding surface of the second member facing the first member. A surface activation step for performing an activation process for bringing the first and second joint surfaces into a combined state, a positioning step for positioning and temporarily fixing the first and second members by hydrogen bonding with the first and second joining surfaces being combined, and a positioning step And a main fixing step of bonding the first and second bonding surfaces by a bonding process stronger than the hydrogen bonding in step, and the surface roughness of at least one of the first and second bonding surfaces before the surface activation step is Greater than 1 nm.

  According to the above joining method, the joining of the first and second members by hydrogen bonding in the positioning step is temporary fixation that can be removed by moisture or the like, so that the positioning can be easily performed again, and the member can be re-used. Can be used. This temporary fixing at the time of positioning can be performed even if the surface accuracy of the member is larger than 1 nm. In addition, since the main fixing is performed in the state of positioning, there is no curing shrinkage of the adhesive or the like that causes an assembly error at the time of positioning, and the influence of the curing shrinkage that can be generated by the main fixing can be reduced, and the assembly accuracy is improved. Can be made.

  In a specific aspect or viewpoint of the present invention, in the above-described joining method, when the elastic modulus of at least one material of the first and second members is equal to or lower than a predetermined value, the pressure of pressurization is reduced. In this case, the pressurization at the time of positioning is optimal, and an excessive load is not applied to the member, and a combined state sufficient for positioning can be obtained.

  In another aspect of the present invention, the pressure of pressurization is 0.05 MPa or more and 10 MPa or less. In this case, an excessive load is not applied to the member, and the coupling state sufficient for positioning can be obtained.

  In still another aspect of the present invention, the elastic modulus of at least one of the first joint portion of the first member and the second joint portion of the second member where the first joint surface and the second joint surface are joined is 3000 MPa or less. It is. In this case, since it joins even if the applied pressure at the time of positioning is comparatively weak, it can fix temporarily, without damaging a member.

  In still another aspect of the present invention, the environmental temperature of the positioning step is 170 ° C. or lower. In this case, since it can be temporarily fixed without dehydration condensation at the time of positioning, the coupled state can be easily released at the time of positioning again.

  In still another aspect of the present invention, at least one of the first and second bonding surfaces has an adhesive layer having a silane coupling agent. This method can be applied even when at least one of the first and second members is a ceramic material such as glass that hardly develops hydrogen bonds.

  In still another aspect of the present invention, at least one of the first and second members is formed of a resin material. In this case, the resin material can easily develop hydrogen bonds by plasma treatment or the like, and can maintain the bonds.

  In still another embodiment of the present invention, dehydration condensation by heating is performed in the fixing step. In this case, in the main fixing step, the main fixing can be performed without applying external pressure, so that higher dimensional accuracy can be achieved.

  In still another aspect of the present invention, the fixing is performed using an adhesive in the main fixing step. In this case, regardless of the shape of the material, if there is a gap between the first joint surface and the second joint surface, it can be joined, and the area of the joint portion of the first and second joining members can be increased. Thus, the bonding strength can be easily increased.

  In still another embodiment of the present invention, in the main fixing step, bonding is performed with an adhesive tape having a moisture-resistant protective film. In this case, the time required for curing shrinkage of the adhesive or the like is not necessary, and the hydrogen bond bonding strength can be maintained by protecting the hydrogen bond having no moisture resistance from the surrounding environment by the protective film.

  In still another aspect of the present invention, an inspection process for inspecting the arrangement of the first and second members is provided between the positioning process and the main fixing process. When the arrangement of the first and second members is as designed, the final fixing, which is the next process, can be performed with high accuracy in the temporarily fixed state after the positioning process. On the other hand, if the arrangement of the first and second members is different from the intended design, the first and second members will release the bonding of the joints due to moisture etc. and perform the surface activation process and positioning process again. Can do. As a result, an increase in cost caused by a decrease in yield can be prevented.

  In order to solve the above-described problem, a method for manufacturing a joined body according to the present invention is a method for producing a joined body including a first member and a second member, and the first joint facing the second member of the first member. A surface activation process for performing an activation process for activating at least one of the surface and the second joint surface of the second member facing the first member, and adding the first and second joint surfaces together. A positioning step of positioning the first and second members by compressed hydrogen bonding, and a main fixing step of bonding the first and second bonding surfaces by a bonding process stronger than the hydrogen bonding in the positioning step, before the surface activation step The surface roughness of at least one of the first and second joint surfaces is greater than 1 nm.

  According to the method for manufacturing the joined body, the joining by the hydrogen bonding of the first and second members in the positioning step is temporary fixing that can be removed with moisture or the like, so that the positioning can be easily performed again. The member can be reused. In addition, since the main fixing is performed in the state of positioning, there is no curing shrinkage of the adhesive or the like that causes an assembly error at the time of positioning, and the influence of the curing shrinkage that can be generated by the main fixing can be reduced, and the assembly accuracy is improved. Can be made.

(A) is sectional drawing of the light source unit containing the conjugate | zygote of 1st Embodiment, (B) is a top view of the conjugate | zygote shown to (A). (A)-(G) is a figure explaining the manufacturing method of a zygote. It is a figure explaining the manufacturing method of a joined object. (A) is sectional drawing explaining the conjugate | zygote of 2nd Embodiment, (B) is a top view of the conjugate | zygote shown to (A). (A) is sectional drawing explaining the conjugate | zygote of 3rd Embodiment, (B) is a top view of the conjugate | zygote shown to (A).

[First Embodiment]
Hereinafter, a joined body manufactured by a joined body joining method and a joined body manufacturing method according to a first embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1A and 1B, the joined body 100 includes an optical element 10 that is a first member and a substrate 20 that is a second member. The optical element 10 and the substrate 20 are stacked and bonded in the Z-axis direction perpendicular to the XY plane from which the substrate 20 extends. The joined body 100 can be used as the light source unit 200 by providing the light emitting element 22 on the substrate 20, for example. The joined body 100 is joined through a two-step joining process (specifically, a positioning process and a main fixing process) described later.

  The optical element 10 is a member having optical transparency that can transmit light in a wavelength range to be used. For example, the optical element 10 is a transparent member when transmitting light having a wavelength in the visible light region. The optical element 10 is made of a resin material. As the resin material, for example, a thermoplastic resin, an energy curable resin, a two-component curable resin, or the like is used. Examples of the thermoplastic resin include COP (cycloolefin polymer), COC (cycloolefin copolymer), PMMA (acrylic), PC (polycarbonate), and the like. As the energy curable resin, for example, an ultraviolet curable resin, a thermosetting resin, or the like is used. As the two-component curable resin, for example, epoxy, silicone or the like is used. The optical element 10 has a rectangular outline when viewed from the optical axis OA direction. The optical element 10 includes a lens element 10a and a support portion 10b that supports the lens element 10a from the periphery. The lens element 10a is a biconvex aspheric lens, for example, and has a first optical surface 11a and a second optical surface 11b. The support portion 10b has a flat plate portion 12a and a pair of leg portions 12b extending from the flat plate portion 12a in parallel to the optical axis OA. The leg portion 12b is formed corresponding to a portion where the optical element 10 and the substrate 20 are to be joined. In the illustrated example, the leg portion 12b has a quadrangular prism shape having a pair of elongated horizontal cross sections parallel to each other. The arrangement and shape of the leg portions 12b can be changed as appropriate as long as the flat plate portion 12a of the support portion 10b can be kept parallel and stable to the substrate 20. Although details will be described later, the optical element 10 and the substrate 20 are firmly joined by temporary fixing after temporary fixing at the time of positioning. The optical element 10 is used as a condensing lens, for example.

  The substrate 20 is a transparent and light-transmitting plate-like member, and is a glass substrate formed of glass that is an inorganic substance. The optical element 10 is bonded to the first surface 20 a of the substrate 20. As already described, in the illustrated example, the light emitting element 22 is provided on the second surface 20 b of the substrate 20. The center of the light emitting element 22 is disposed on the optical axis OA of the optical element 10. As the light emitting element 22, for example, an organic EL element or an LED element is used.

  An adhesive layer having a silane coupling agent (or silanol-containing adhesive) between the first bonding surface 10c facing the substrate 20 of the optical element 10 and the second bonding surface 20c facing the optical element 10 of the substrate 20 30 is provided.

  Before the bonded body 100 is bonded, the surface roughness of at least one of the first bonding surface 10c and the second bonding surface 20c is greater than 1 nm. Elastic modulus of at least one of the first joint 10d of the optical element (first member) 10 and the second joint 20d of the substrate (second member) 20 where the first joint surface 10c and the second joint surface 20c are joined. Is 3000 MPa or less. Thereby, in manufacture of the joined body 100, since it joins even if the applied pressure at the time of positioning is comparatively weak, it can fix temporarily, without damaging a member. In this embodiment, the elastic modulus of the optical element 10 as the first member is 3000 MPa or less.

  Hereinafter, the manufacturing method of the joined body 100 will be described with reference to FIGS. 2 (A) to 2 (G) and FIG. 3. In joining the joined body 100, a surface activation process, a positioning process, an inspection process, and a main fixing process are performed. 2A to 2F are enlarged views mainly in the vicinity of the leg portion 12b of the optical element 10. FIG.

[Preparation of first and second members]
First, the optical element 10 as the first member is molded (step S11 in FIG. 3). As a molding method, injection molding, mold molding, or the like is used. Moreover, the board | substrate 20 which is a 2nd member is prepared (step S11 of FIG. 3).

(Formation of adhesive layer)
As shown in FIGS. 2 (A) and 2 (B), a silane coupling agent (or silanol-containing adhesive) is applied to at least one of the first bonding surface 10c of the optical element 10 and the second bonding surface 20c of the substrate 20. The adhesive layer 30 is provided (step S12 in FIG. 3). As a result, the bonding method described later can be applied to a ceramic material such as glass that is unlikely to generate hydrogen bonds, such as the substrate 20.

[Surface activation]
As shown in FIGS. 2C and 2D, an activation process is performed to activate at least one of the first and second bonding surfaces 10c and 20c (step S13 in FIG. 3). The activated state refers to a state in which polar groups such as OH group (hydroxyl group) and CHO group (aldehyde group) are connected to the element on the material surface of the member. Specifically, as the activation treatment, corona treatment, plasma treatment, ozone treatment, ultraviolet (UV) treatment, or the like is performed, and the activated state is caused by applying energy to the material. As shown in FIGS. 2C and 2D, the activation process is performed on a part or the whole of the end surface 12 c of the leg portion 12 b of the optical element 10 and the first surface 20 a of the substrate 20. Thereby, the surfaces SS1 and SS2 of the adhesive layer 30 on the optical element 10 side and the substrate 20 side are activated. The activation treatment can be preferably performed at room temperature in the atmosphere. Here, normal temperature means 20 ° C. ± 15 ° C.

  When the joined body 100 is used for the light source unit 200, it is conceivable to attach the light emitting element 22 to the second surface 20 b of the substrate 20. In this case, it is preferable to attach the light emitting element 22 to the substrate 20 before performing the above processing.

  By forming the optical element 10 from a resin material, the resin material can easily develop a hydrogen bond by plasma treatment or the like and can maintain the bond. A hydrogen bond is a weak bond in which polar groups represented by OH groups and the like attract each other.

[Positioning]
Next, a positioning process is performed in which the first and second bonding surfaces 10c and 20c are pressed together to position and temporarily fix the optical element 10 and the substrate 20 by hydrogen bonding (step S14 in FIG. 3). The environmental temperature of the positioning process is 170 ° C. or lower. In this case, since it can be temporarily fixed without dehydration condensation at the time of positioning, the coupled state can be easily released at the time of positioning again. In the positioning step, it is desirable to set a time during which dehydration condensation does not occur when working at 170 ° C. or lower (particularly 100 ° C. or higher and 170 ° C. or lower).

  First, as shown in FIG. 2 (E), the first bonding surface 10c on the optical element 10 side and the second bonding surface 20c on the substrate 20 side are opposed to each other, and the surfaces of the first and second bonding surfaces 10c and 20c are set. While maintaining the activated state, the optical element 10 and the substrate 20 are arranged at the bonding position with a gap therebetween. The distance between the optical element 10 and the substrate 20 at the time of positioning is preferably 100 nm or more. In positioning, either one of the optical element 10 and the substrate 20 may be moved, or both may be moved relatively. The optical element 10 and the substrate 20 are provided with positioning marks, for example, and positioning is performed by matching the mark positions. In addition, if an abutting portion serving as a positioning reference is provided on the optical element 10 and the substrate 20, positioning can be performed by abutting the abutting portion.

  After the positioning, as shown in FIG. 2 (F), the optical element 10 and the substrate 20 are brought into contact with each other and bonded in a state where the first and second bonding surfaces 10c and 20c are activated. At the time of contact, the first and second bonding surfaces 10c and 20c are brought into close contact with each other by pressurizing with a pressure higher than a predetermined pressure. It is also possible to join at a temperature higher than room temperature within a range where dehydration condensation does not occur.

  As for pressurization during positioning or temporary fixing, it is desirable to change the pressure according to the elastic modulus of the material of the optical element 10 and the substrate 20. For example, when the elastic modulus of the material of the member is equal to or lower than a predetermined value like the optical element 10 of the present embodiment, the pressurizing pressure is reduced. In other words, when the elastic modulus of the material of the member is low, the pressurizing pressure is reduced. Thereby, the pressurization at the time of positioning becomes optimal, and an excessive load is not applied to the member, and a combined state sufficient for positioning can be obtained. Specifically, the pressure of pressurization is 0.05 MPa or more and 10 MPa or less, for example. The optimum pressure value of the material to be used varies depending on the material and temperature within the above range, and the pressure may be smaller as the material becomes softer. In addition, the said predetermined value regarding the elasticity modulus of the material of a member changes with members.

  In the above positioning step, the optical element 10 and the substrate 20 are temporarily fixed by hydrogen bonding. In the temporary fixing, the optical element 10 and the substrate 20 are temporarily fixed at predetermined positions, and can be freely removed by immersing them in water or the like.

[Inspection]
After the positioning process, an inspection process for inspecting the arrangement of the optical element 10 and the substrate 20 is performed (step S15 in FIG. 3). In a state where the joined body 100 is temporarily fixed, it is inspected by using a microscope or the like whether the arrangement of the optical element 10 and the substrate 20 is as designed. When the arrangement of the optical element 10 and the substrate 20 is as designed, the final fixing, which is the next process, can be accurately performed in the temporarily fixed state after the positioning process. On the other hand, when the arrangement of the optical element 10 and the substrate 20 is different from the intended design, the optical element 10 and the substrate 20 cancel the bonding of the joint portions 10d and 20d with moisture or the like, and again the surface activation process and the positioning process. It can be performed.

[Fixed]
Next, as shown in FIG. 2G, a main fixing step is performed in which the first and second bonding surfaces 10c and 20c are bonded by a bonding process stronger than hydrogen bonding in the positioning process (step S16 in FIG. 3). Specifically, in this fixing step, dehydration condensation by heating is performed using a heating device 300 including a heater. Thereby, in the main fixing step, the main fixing can be performed without applying an external pressure, so that higher dimensional accuracy can be obtained. The heating temperature is desirably 100 ° C. or higher. The dehydration condensation reaction proceeds at 100 ° C. or higher, and the reaction time tends to be shorter as the temperature is higher. In addition, since the temperature at which the main fixing is completed in the time required for the temporary fixing or temporary bonding (cannot be removed by moisture) is 170 ° C. or higher, the fixing is generally not complete if it is 170 ° C. or lower in the positioning step described above.

  By the main fixing described above, the optical element 10 and the substrate 20 are completely fixed at a predetermined place with a predetermined accuracy.

  According to the joining method and the joined body manufacturing method described above, the first and second members in the positioning step are temporarily fixed so that they can be removed by moisture or the like. And the member can be reused. Temporary fixing by this positioning can be performed even if the surface accuracy of the member is greater than 1 nm. In addition, positioning can be evaluated at the time of positioning. For products that are not inspected, it is possible to permanently fix the components without wasting them by releasing the connection between the members and re-positioning. Can do. As a result, an increase in cost caused by a decrease in yield can be prevented. In addition, since the main fixing is performed in the state of positioning, there is no curing shrinkage of the adhesive or the like that causes an assembly error at the time of positioning, and the influence of the curing shrinkage that can be generated by the main fixing can be reduced, and the assembly accuracy is improved. Can be made. The joining method can be applied even when the surface roughness of the first and second members is poor.

(Example)
Hereinafter, examples of the present embodiment will be described. COP (cycloolefin polymer: Nippon ZEON E48R) having a surface roughness of 3 nm was prepared as a base material for the first and second members. As a comparative example, a silicon wafer having a surface roughness of 1 nm was prepared. Details of the materials of the first and second members are shown in Table 1.
[Table 1]

Table 2 shows the conditions of each step of the examples and comparative examples. In the surface activation step, the first and second bonding surfaces were activated using a vacuum plasma apparatus with respect to the first bonding surface of the first member and the second bonding surface of the second member. Whether or not joining is possible is determined by whether or not the joined body is separated based on the weight of the first or second member. When the joined body is not separated, the sign is “◯”, and when it is separated, the sign is “x”. Separation by moisture is determined by immersing the joined body in water and determining whether or not the joined body is separated. When not separated, the sign is “◯”, and when separated, the sign is “x”.
[Table 2]

  As shown in Table 2, it was confirmed that the first and second members can be separated by immersing the joined body temporarily joined by performing the positioning step under the conditions of Examples 1 to 3 in water. In the final fixing step, it was confirmed that the bonded body was not separated by immersing the bonded body fixed by heating with an adhesive or heating in water. As can be seen from Example 2 and Comparative Example 1, when the material of the member is COP, when the pressing force during the positioning step is 0.1 MPa and the temperature during pressurization is 25 ° C., the first and second The members were not joined, but the first and second members could be joined by setting the temperature to 130 ° C. Further, as can be seen from Example 3, when the material of the member is made of silicone resin, it can be temporarily fixed in the positioning step even if the applied pressure is 0.1 MPa and the temperature at the time of pressurization is 25 ° C. It was. Thereby, when the elastic modulus of a member is low, it turns out that a pressurizing force can be made small. Further, as shown in Comparative Example 2, in the positioning step, even if the applied pressure is 1 MPa, if the temperature at the time of pressurization is 200 ° C., the joined body is completely fixed and separation by water is possible. There wasn't. Further, as shown in Comparative Example 3, when the pressure was 0 MPa, even a member having a low elastic modulus could not be temporarily fixed. As shown in Comparative Example 4 given as a reference, a member having a surface roughness of 1 nm could be temporarily fixed even when the applied pressure was 0 MPa. Thus, it can be seen that a member having a surface roughness greater than 1 nm needs to be pressurized at least 0.05 MPa at the time of temporary fixing.

[Second Embodiment]
Hereinafter, the joining method and the like of the joined body according to the second embodiment will be described. In addition, the joining method and the like of the joined body according to the second embodiment are obtained by partially changing the joining method and the like of the joined body of the first embodiment, and items that are not particularly described are the same as those of the first embodiment. .

  As shown in FIGS. 4A and 4B, the optical element 10 as the first member and the substrate 20 as the second member are included. A lattice-shaped groove 12d is formed on the end surface 12c of the leg portion 12b of the optical element 10. In the present embodiment, the first joint surface 10c is a flat portion excluding the groove 12d of the end surface 12c. An adhesive 40 is filled between the groove 12d and the second bonding surface 20c of the substrate 20 to firmly fix the optical element 10 and the substrate 20.

  In the present embodiment, after the positioning step, in the main fixing step, the optical element 10 that is the first member and the substrate 20 that is the second member are bonded using the adhesive 40. Specifically, the space between the groove 12d of the leg portion 12b of the optical element 10 and the second bonding surface 20c of the substrate 20 is filled with the adhesive 40 and solidified or cured. Thereby, it can be joined if there is a gap between the first joining surface 10c and the second joining surface 20c regardless of the shape of the material, and the area of the joining portion of the optical element 10 and the substrate 20 can be increased. Thus, the bonding strength can be easily increased.

[Third Embodiment]
Hereinafter, the joining method and the like of the joined body according to the third embodiment will be described. Note that the joining method and the like of the joined body according to the third embodiment are obtained by partially changing the joining method and the like of the joined body of the first embodiment, and items that are not particularly described are the same as those of the first embodiment. .

  As shown in FIGS. 5A and 5B, the joined body 100 of the present embodiment includes an optical element 10 that is a first member and a substrate 20 that is a second member. The optical element 10 has a leg portion 12b having a bowl shape or a square tube shape surrounding the periphery of the lens element 10a. The sizes of the optical element 10 and the substrate 20 when viewed from the Z-axis direction or the optical axis OA direction are substantially the same. The bonded body 100 is provided with an adhesive tape 50 having a moisture-resistant (or low moisture-permeable) protective film so as to surround the first bonded portion 10d of the optical element 10 and the second bonded portion 20d of the substrate 20. ing.

  In the present embodiment, after the positioning step, in the final fixing step, the optical element 10 that is the first member and the substrate 20 that is the second member are joined by the adhesive tape 50. Specifically, the adhesive tape 50 is applied so as to cover the entire boundary portion where the first bonding surface 10c of the optical element 10 and the second bonding surface 20c of the substrate 20 are bonded. In this case, the time required for curing shrinkage of the adhesive or the like is not necessary, and the hydrogen bond bonding strength can be maintained by protecting the hydrogen bond having no moisture resistance from the surrounding environment by the protective film.

  Although the joined body and the like according to the present embodiment have been described above, the joined body and the like according to the present invention are not limited to the above. For example, in the above-described embodiment, the shapes and sizes of the optical element 10 and the substrate 20 can be appropriately changed according to applications and functions.

  Moreover, in the said embodiment, the thickness of the 1st and 2nd member can be changed suitably, and may be thick or thin.

  In the above-described embodiment, the first and second members are not limited to the optical element 10 and the substrate 20, but can be appropriately changed according to the application. In addition to the optical unit, the bonded body may be, for example, an electronic component, an inspection device, a semiconductor device, a micro component, or the like. Further, the first and second members may be, for example, a combination of an optical element and an optical element or a combination of an optical element and a barrel depending on the use of each member. Further, the number of members joined is not limited to two, and may be three or more.

  In the above embodiment, the materials of the first and second members may be different from each other or the same.

  In the first and second embodiments, a joined body in which an array-like structure is joined to a substrate may be manufactured, the joined body may be cut, and the joined body may be separated into pieces.

  Moreover, in the said embodiment, although the contact bonding layer 30 was provided in both the 1st and 2nd members, you may provide in any one. Further, the adhesive layer 30 may not be provided.

  Moreover, in the said embodiment, about the method of this fixing, any combination of a heating, an adhesive agent, and an adhesive tape may be sufficient.

DESCRIPTION OF SYMBOLS 10 ... Optical element, 10a ... Lens element, 10b ... Support part, 10c ... 1st junction surface, 10d ... 1st junction part, 11a, 11b ... Optical surface, 12a ... Flat plate part, 12b ... Leg part, 12d ... Groove, DESCRIPTION OF SYMBOLS 20 ... Board | substrate, 20c ... 2nd junction surface, 20d ... 2nd junction part, 22 ... Light emitting element, 30 ... Adhesive layer, 40 ... Adhesive, 50 ... Adhesive tape, 100 ... Bonded body, 112d ... Recessed part, 200 ... Light source Unit, 300 ... heating device, OA ... optical axis

Claims (12)

A surface activation step of performing an activation process for activating at least one of a first joint surface of the first member facing the second member and a second joint surface of the second member facing the first member. When,
A positioning step of positioning and temporarily fixing the first and second members by hydrogen bonding and pressurizing the first and second joint surfaces together;
A main fixing step of bonding the first and second bonding surfaces by a bonding process stronger than the hydrogen bonding in the positioning step;
With
The bonding method according to claim 1, wherein a surface roughness of at least one of the first and second bonding surfaces before the surface activation step is greater than 1 nm.   2. The joining method according to claim 1, wherein when the elastic modulus of at least one of the first and second members is equal to or lower than a predetermined value, the pressure of the pressurization is reduced.   The joining method according to any one of claims 1 and 2, wherein the pressure of the pressurization is 0.05 MPa or more and 10 MPa or less.   The elastic modulus of at least one of the first joint portion of the first member and the second joint portion of the second member where the first joint surface and the second joint surface are joined is 3000 MPa or less. The joining method according to any one of claims 1 to 3.   The joining method according to claim 1, wherein an environmental temperature of the positioning step is 170 ° C. or less.   6. The bonding method according to claim 1, wherein at least one of the first and second bonding surfaces includes an adhesive layer having a silane coupling agent.   The joining method according to any one of claims 1 to 6, wherein at least one of the first and second members is formed of a resin material.   The joining method according to any one of claims 1 to 7, wherein dehydration condensation by heating is performed in the main fixing step.   In the said main fixing process, it joins with an adhesive agent, The joining method as described in any one of Claim 1-8 characterized by the above-mentioned. The joining method according to any one of claims 1 to 9, wherein in the main fixing step, joining is performed with an adhesive tape having a moisture-resistant protective film.   The joining method according to any one of claims 1 to 10, further comprising an inspection step of inspecting the arrangement of the first and second members between the positioning step and the main fixing step. A method of manufacturing a joined body including a first member and a second member,
Surface activation for performing an activation process for activating at least one of a first joint surface of the first member facing the second member and a second joint surface of the second member facing the first member. Conversion process,
A positioning step of positioning the first and second members by hydrogen bonding with the first and second joining surfaces being combined, and
A main fixing step of bonding the first and second bonding surfaces by a bonding process stronger than the hydrogen bonding in the positioning step;
With
A method of manufacturing a joined body, wherein a surface roughness of at least one of the first and second joint surfaces before the surface activation step is greater than 1 nm.

Images