JP2019029591A - Connector connection part of circuit board and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector connection portion of a circuit board and a method for manufacturing the same, which can be easily manufactured even if the width dimension can be reduced and the thickness of the base material is reduced. SOLUTION: A shield pattern 30 and a shield pattern connecting portion 37 are formed only on one side of a base film 10, a first insulating layer film 40 is formed so as to cover the shield pattern 30, and a first insulating layer film 40 is formed. The circuit pattern 50 and the circuit pattern connection portion 55 are formed on the upper surface of the circuit pattern 50, and the second insulating layer film 60 is formed so as to cover the circuit pattern 50. The connector connection portion 15 has a circuit pattern formed on the first insulating layer film 40 by arranging the first insulating layer film 40 on the upper surface thereof so that the shield pattern connecting portion 37 formed on the base film 10 is exposed. A second insulating layer film 60 is arranged on the upper surface of the connecting portion 55 so as to be exposed. The shield pattern connecting portion 37 is provided on the end side of the connector connecting portion 15 with respect to the circuit pattern connecting portion 55. [Selection diagram] Fig. 1

Description

  The present invention relates to a connector connecting portion of a circuit board suitable for use in a living body and the like, and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, a circuit board provided with a living body electrode for detecting a weak current generated in the living body by contacting the living body skin has been used. As this type of circuit board, for example, in FIGS. 1 and 2 of Patent Document 1, an electrode (13) is formed on the upper surface of a portion to be a detection part (11) of a flexible circuit board (21), and the detection part ( 11) forming a shielding conductive layer on the lower surface, while forming a circuit pattern (33) connected to the electrode (13) on the upper surface of the portion of the flexible circuit board (21) to be the flat cable (31), A biological circuit board in which a shield pattern (37) is formed on the upper surface of the circuit pattern (33) via an insulating layer (35) and a shield pattern (43) is also formed on the lower surface of the flat cable (31). (1-1) is disclosed. The shield pattern (37) and the shield pattern (43) are connected by a through hole. And on the upper surface side (same surface side) of the terminal connection part (40) formed in the front-end | tip part of a flat cable (31), the connection pattern (41) connected to the said circuit pattern (33), and the said shield pattern Both connection patterns (41) connected to (37) and (43) are arranged in parallel.

JP 2014-42707 A

However, the circuit board having the above configuration has the following problems.
(1) A pair of connection patterns (41), (41) formed on the upper surface side (same surface side) of the terminal connection portion (40) of the conventional biological circuit board (1-1) are arranged in parallel. Since they are arranged, the dimension (width dimension) in the width direction of the terminal connection part (40) (direction perpendicular to the insertion direction of the terminal connection part (40)) becomes large. For this reason, there is a case where it is desired to reduce the width dimension due to the structure of the device to which the terminal connection portion (40) is attached. In other words, if the width dimension of this terminal connection part (40) is made small according to the apparatus which inserts this, the width dimension of each connection pattern (41), (41) will become small, and it will be with the metal terminal by the side of an apparatus. There was a risk of poor connection between the two.

(2) The circuit pattern (33) is formed on the upper surface of the circuit board having the above-described configuration, that is, the flexible circuit board (base material) (21) having flexibility, and the circuit pattern (33) is shielded. In order to reduce the thickness of the circuit board in which the shield pattern (43) is formed on the lower surface side of the circuit pattern (33), the flexible circuit board (21) is thinned to reduce the thickness. 21) The elastic restoring force (force to return to the original shape) in the direction perpendicular to the surface is weakened (for example, when the heel is brought in, it remains in the heeled state even if the hand is released). For this reason, it becomes difficult to form various patterns directly on such a very thin flexible circuit board (21) by screen printing or the like. For this reason, when the circuit pattern (31) or the shield pattern (43) is printed on such a very thin flexible circuit board (21), the bottom surface of the flexible circuit board (21) It is necessary to stick a thick support material (separator film) having an elastic restoring force in advance. However, when both the circuit pattern (33) and the shield pattern (43) are printed on the upper and lower surfaces of the flexible circuit board (21) as in Patent Document 1, the flexible circuit board (21) is supported on the lower surface. After the circuit pattern (33) is printed on the upper surface with the material attached, the support material is peeled off, and then the support material is pasted on the upper surface, and the shield pattern (43) is printed on the lower surface. There is a possibility that the manufacturing process becomes complicated and handling becomes difficult. Further, as in Patent Document 1, both connection patterns (41) of the connection pattern (41) connected to the circuit pattern (33) and the connection pattern (41) connected to the shield patterns (37) and (43). , (41) are provided on the same surface side, through holes for electrically connecting the shield pattern (43) on the lower surface side of the flexible circuit board (21) to the connection pattern (41) on the upper surface side are formed. Although it is necessary, when the thickness of the flexible circuit board (21) is very thin as described above, it may be difficult to form a through hole.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a circuit board connector connection that can be easily reduced in width and can be easily manufactured even if the thickness of the base material is reduced. It is in providing a part and its manufacturing method.

The present invention is a connector connecting portion of a circuit board formed by laminating a shield pattern and a circuit pattern shielded by the shield pattern directly or via another layer on the surface of a base material, the connector The connection portion includes a shield pattern connection portion that is connected to the shield pattern, and a circuit pattern connection portion that is connected to the circuit pattern, and the shield pattern connection portion is connected to the connector more than the circuit pattern connection portion. It is provided in the position extended toward the edge part of the part.
Since the shield pattern connection part and the circuit pattern connection part constituting the connector connection part are installed in series toward the end of the connector connection part, the connector connection part is compared with the case where they are installed in parallel (parallel). The width dimension can be reduced. In other words, it is not necessary to reduce the width dimension of the shield pattern connection portion and the circuit pattern connection portion as compared with the case where the shield pattern connection portion and the circuit pattern connection portion are provided side by side. A good connection state with the terminal connected to the connection portion can be maintained.

According to the present invention, the circuit board forms the shield pattern and the shield pattern connection portion on one side of the base material, forms a first insulating layer so as to cover the shield pattern, and the first insulating layer. The circuit pattern and the circuit pattern connection portion are formed on the upper surface of the substrate, and a second insulating layer is formed so as to cover the circuit pattern, and the connector connection portion is a shield formed on the base material. The first insulating layer is disposed on the upper surface so that the pattern connecting portion is exposed, and the second insulating layer is disposed on the upper surface so that the circuit pattern connecting portion formed on the first insulating layer is exposed. It is characterized by being arranged.
As a result, the shield pattern connection portion and the circuit pattern connection portion can be easily formed on one surface side of the base material without using a through hole or the like, and at the same time, the shield pattern connection portion and the circuit can be easily formed. The pattern connecting portion can be installed in series toward the end of the connector connecting portion.

In the present invention, the base material, the first insulating layer, and the second insulating layer may all be formed of a film and may be bonded to each other by thermocompression bonding.
Thereby, the connector connecting portion of the circuit board can be easily manufactured. In other words, for example, a support material (separator film) is attached to and supported on one surface of a substrate made of film to increase the strength, and a shield pattern or shield pattern connection portion is formed on the opposite surface. It is possible to manufacture a connector connecting portion of a circuit board by stacking and thermocompression-bonding a first insulating layer and a second insulating layer on which a circuit pattern or a circuit pattern connecting portion is formed as it is, for example. Therefore, even if the base material is thin and there is almost no elastic restoring force in the direction perpendicular to the surface, it can be manufactured easily.
On the other hand, the first insulating layer and the second insulating layer may be formed by printing such as screen printing.

The present invention also relates to a method for manufacturing a connector connecting portion of a circuit board, in which a shield pattern and a circuit pattern shielded by the shield pattern are laminated on the surface of a base material directly or via another layer. And a first insulating layer formed with a circuit pattern connection portion connected to the circuit pattern and the circuit pattern on one side, and a base film on which the shield pattern and a shield pattern connection portion connected to the shield pattern are formed on one side. A film and a second insulating layer film are prepared, and the first insulating layer film and the second insulating layer film are placed on the base film, and then formed on the base film. The shield pattern connection portion exposed from the first insulating layer film, and the circuit pattern connection formed on the first insulating layer film Was exposed from the second insulating layer film, each were these laminated films is characterized by bonding by thermal compression bonding.
According to the present invention, even if the thickness of the base film is thin and the elastic restoring force is small with respect to the direction perpendicular to the surface, the shield pattern connecting portion can be easily formed on the surface of the base. A connector connecting portion of a circuit board formed by exposing the circuit pattern connecting portion can be manufactured.

  The present invention also relates to a method for manufacturing a connector connecting portion of a circuit board, in which a shield pattern and a circuit pattern shielded by the shield pattern are laminated on the surface of a base material directly or via another layer. Then, a base film having the shield pattern and a shield pattern connection portion connected to the shield pattern formed on one side is prepared, and a first insulating layer is printed on the base film, and the base film Exposing the shield pattern connection part formed in step 1 to the first insulating layer, forming the circuit pattern and a circuit pattern connection part connected to the circuit pattern on the first insulation layer, and A second insulating layer is printed on the first insulating layer, and at that time, the circuit pattern connection portion formed on the first insulating layer film is connected to the second insulating layer. It is characterized by having a step of exposed.

  According to the present invention, it is possible to easily reduce the width dimension of the connector connecting portion, and it is possible to easily manufacture the connector connecting portion even if the thickness of the base material is reduced.

1A is a schematic plan view of a circuit board (biological circuit board) 1-1, and FIG. 1B is a schematic cross-sectional view taken along line AA of FIG. 1A. It is manufacturing method explanatory drawing of the circuit board (biological circuit board) 1-1. It is manufacturing method explanatory drawing of the circuit board (biological circuit board) 1-1. It is a schematic plan view of the circuit board (biological circuit board) 1-2. It is BB schematic sectional drawing of FIG. It is CC schematic sectional drawing of FIG. It is manufacturing method explanatory drawing of the circuit board (biological circuit board) 1-2. It is manufacturing method explanatory drawing of the circuit board (biological circuit board) 1-3. It is manufacturing method explanatory drawing of the circuit board (biological circuit board) 1-4.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 3 are diagrams showing a circuit board (hereinafter, referred to as “biological circuit board”) 1-1 configured by using the connector connecting portion 15 according to the first embodiment of the present invention. 1A is a schematic plan view of the biological circuit board 1-1, FIG. 1B is a schematic cross-sectional view taken along line AA of FIG. 1A, and FIGS. 2 and 3 are methods for manufacturing the biological circuit board 1-1. It is explanatory drawing. As shown in FIG. 1, the biological circuit board 1-1 includes a circular detection unit 11 that detects a signal generated from the biological body attached to the biological body, and a belt-like flat cable that extracts the signal detected by the detection unit 11 to the outside. 13 and a connector connecting portion 15 provided at the tip of the flat cable 13, and a shield is provided on the upper surface (surface, one surface) of a flexible base material (hereinafter also referred to as “base film”) 10. A pattern 30; a first insulating layer (hereinafter also referred to as “first insulating layer film”) 40; a circuit pattern 50 shielded by the shield pattern 30; and a second insulating layer (hereinafter referred to as “second insulating layer”). Layered film 60). In the following description, “upper” refers to the direction in which the first insulating layer film 40 is viewed from the substrate 10, and “lower” refers to the opposite direction.

  The base film 10 is made of a urethane sheet, and, as shown in FIG. 3, a strip-shaped cable constituting part constituting the flat cable 13 on the outer periphery of a circular detecting part constituting part 21 constituting the detecting part 11. 23 and a belt-like connector constituting part 25 constituting the connector connecting part 15 are connected. The thickness of the base film 10 is about 40 μm and is very thin. The urethane sheet having this thickness has a very small elastic restoring force with respect to a direction perpendicular to the surface. Moreover, a urethane sheet has the property to expand-contract in the surface direction. In addition, the urethane sheet has a property of being easily crimped onto another urethane sheet or a carbon layer. These properties are the same in the first and second insulating layer films 40 and 60 described below.

  The shield pattern 30 is connected to the outer periphery of the detection part shield part 33 and the circular detection part shield part 33 formed in the whole part (center part) excluding the vicinity of the outer periphery of the detection part constituting part 21 and the cable. A wiring shield part 35 formed on the entire part excluding the vicinity of the outer periphery of the component part 23, and formed on the entire part of the connector part 25 except for the vicinity of the outer periphery thereof connected to the tip of the wiring shield part 35. And a shield pattern connecting portion 37. In this example, the width dimension of the wiring shield part 35 and the width dimension of the shield pattern connection part 37 are the same. The shield pattern 30 is formed on the base film 10 by screen printing a carbon paste (a conductive paste obtained by kneading carbon powder in an elastomer resin).

  The first insulating layer film 40 is composed of the same film as the base film 10. That is, it is made of a urethane sheet having a thickness of about 40 μm, and as shown in FIG. 3, a strip-shaped cable constituting part constituting the flat cable 13 is arranged on the outer periphery of a circular detecting part constituting part 41 constituting the detecting part 11. 43 and a belt-like connector constituting part 45 constituting the connector connecting part 15 are connected. The detection unit configuration unit 41 has the same outer diameter as the detection unit configuration unit 21 of the base film 10, and the cable configuration unit 43 has the same width and the same as the cable configuration unit 23 of the base film 10. The connector component 45 has the same width as the connector component 25 of the base film 10 and has a slightly shorter length. Similarly to the base film 10, the first insulating layer film 40 also has a very small elastic restoring force in the direction perpendicular to the surface thereof, and can be easily crimped onto another urethane sheet or carbon layer. Has properties.

  The circuit pattern 50 includes a circular electrode 51 formed on the upper surface of the detection unit constituting portion 41 of the first insulating layer film 40, and a cable of the first insulating layer film 40 connected to the outer periphery of the electrode 51. A strip-shaped wiring pattern 53 formed on the upper surface of the component 43 and a strip-shaped circuit pattern connection formed on the upper surface of the connector component 45 of the first insulating layer film 40 connected to the tip of the wiring pattern 53 Part 55. An overcoat layer 52 is formed on the upper surface of the electrode 51 so as to cover it. The overcoat layer 52 constitutes a part of the electrode 51. In this example, the width dimension of the wiring pattern 53 and the width dimension of the circuit pattern connection portion 55 are the same. The circuit pattern 50 is formed on the first insulating layer film 40 by screen printing a silver paste (a conductive paste obtained by kneading silver powder in an elastomer resin). The overcoat layer 52 is formed by screen printing a carbon paste (a conductive paste obtained by kneading carbon powder in an elastomer resin).

  The second insulating layer film 60 is composed of the same film as the base film 10 and the first insulating layer film 40. That is, it is made of a urethane sheet having a thickness of about 40 μm, and as shown in FIG. 3, a strip-shaped cable constituting part constituting the flat cable 13 on the outer periphery of a circular detecting part constituting part 61 constituting the detecting part 11. 63 is connected. The detecting portion constituting portion 61 has the same outer diameter as that of the detecting portion constituting portion 21 of the base film 10, and a circular penetration having an outer diameter slightly smaller than the outer diameter size of the electrode 51 at the center thereof. A hole (electrode exposure hole) 65 is formed. Further, the cable component 63 has the same width and length as the cable component 23 of the base film 10. Similarly to the base material 10, the second insulating layer film 60 has a very small elastic restoring force with respect to a direction perpendicular to the surface, and can easily be pressure-bonded onto another urethane sheet or carbon layer. Have

  Next, the manufacturing method of the said biological circuit board 1-1 is demonstrated using FIG. 2, FIG. That is, first, as shown in FIG. 3, the base film 10 having the shield pattern 30 formed on one side, the first insulating layer film 40 having the circuit pattern 50 formed on one side, and the second insulating layer film. 60 are prepared.

  When the shield pattern 30 is formed on one surface (upper surface) of the base film 10, a support material (hereinafter referred to as “separator film”) is attached in advance to the other surface (lower surface) of the base film 10. As described above, since the base film 10 is very thin and has a small elastic restoring force in the direction perpendicular to the surface, it is difficult to form the shield pattern 30 on the surface of the base film 10 alone. The shield pattern 30 can be easily printed by attaching the support material.

  In addition, when the circuit pattern 50 is formed on one surface (upper surface) of the first insulating layer film 40, a support material (hereinafter referred to as “below”) is formed on the other surface (lower surface) of the first insulating layer film 40 as described above. A "separator film" is attached. Furthermore, a support material (hereinafter referred to as “separator film”) may be attached to one side of the second insulating layer film 60.

  Next, as shown in FIG. 2, the first insulating layer film 40 in which the separator film is peeled off on the upper surface of the base film 10 with the separator film (not shown) attached thereto, and the separator The second insulating layer film 60 from which the film has been peeled is placed and laminated so as to overlap. At this time, the shield pattern connection portion 37 of the shield pattern 30 is exposed without being covered with the first insulating layer film 40, and the circuit pattern connection portion 55 of the circuit pattern 50 is not covered with the second insulating layer film 60. Exposed. Thus, the connector connection having the circuit pattern connection portion 55 and the shield pattern connection portion 37 provided at a position extending from the circuit pattern connection portion 55 toward the end portion (tip portion) side of the connector connection portion 15. Part 15 is configured. Next, thermocompression bonding is performed from the upper and lower surfaces thereof, whereby the upper and lower films are bonded together to form a single film. The base film 10, the first insulating layer film 40, and the second insulating layer film 60, which are urethane sheets, are easily attached with high strength by thermocompression bonding. The urethane sheet is easily attached to the surface of the shield pattern 30 or the circuit pattern 50 by thermocompression bonding, but in the case of this embodiment, the outer periphery of the base film 10 on which the shield pattern 30 is formed is surrounded. Since the exposed surface of the base film 10 that does not have the shield pattern 30 is provided on the upper surface near the outer periphery, it can be directly thermocompression bonded to the lower surface of the first insulating layer film 40 made of the same film as the base film 10. The exposed surface of the first insulating layer film 40 in which the circuit pattern 50 is not provided on the upper surface portion in the vicinity of the outer periphery surrounding the outer periphery where the circuit pattern 50 of the first insulating layer film 40 is formed. So that the lower surface of the second insulating layer film 60 made of the same film as the first insulating layer film 40 is directly thermocompression bonded. Can the adhesive strength can be further firmly by. Thereby, the biological circuit board 1-1 shown in FIG. 1 is completed. For convenience of illustration, in FIGS. 1 to 3 (the same applies to FIGS. 4 to 7 described below), the length of the flat cable 13 (13-2) is relatively short. The length of (13-2) is long.

  According to the manufacturing method described above, even if the thickness of the base film 10 is thin and there is almost no elastic restoring force in the direction perpendicular to the surface, the base film 10 A biological circuit board 1-1 having a shield pattern 30 and a circuit pattern 50 laminated on the surface and the connector connecting portion 15 thereof can be manufactured. In addition, the said manufacturing procedure is the example, and it cannot be overemphasized that you may manufacture using another various different manufacturing procedure.

  And the part of the detection part 11 is affixed on the desired part of the living body, the part of the connector connection part 15 at the tip of the flat cable 13 is inserted into a female connector (not shown), and a pair of terminals A1, installed in the female connector A2 (see FIG. 1B) is connected to the shield pattern connection part 37 and the circuit pattern connection part 55 of the connector connection part 15, respectively, and an output signal from the living body is input to a measuring device (not shown) to perform various measurements. .

  As described above, the connector connecting portion 15 is formed by laminating the shield pattern 30 and the circuit pattern 50 shielded by the shield pattern 30 on the surface of the base film 10 as shown in FIG. The connector connection part 15 of the circuit board 1-1 has a shield pattern connection part 37 to be connected to the shield pattern 30, and a circuit pattern connection part 55 to be connected to the circuit pattern 50. Further, the shield pattern connection part 37 has The circuit pattern connection portion 55 is provided at a position extending toward the end of the connector connection portion 15.

  Thus, since the shield pattern connection part 37 and the circuit pattern connection part 55 which comprise the connector connection part 15 were installed in series toward the edge part of the said connector connection part 15, these are installed in parallel (parallel) Compared with the case where it does, the width dimension of the connector connection part 15 can be made small. In other words, it is not necessary to reduce the width dimension of the shield pattern connection part 37 and the circuit pattern connection part 55 as compared with the case where the shield pattern connection part 37 and the circuit pattern connection part 55 are provided side by side. A good connection state between the terminal 37 and the terminals A1 and A2 connected to the circuit pattern connecting portion 55 can be maintained.

  In addition, the biological circuit board 1-1 includes the shield pattern 30 and the shield pattern connection portion 37 formed on only one surface of the base film 10, and the first insulating layer film 40 is formed so as to cover the shield pattern 30. The circuit pattern 50 and the circuit pattern connection portion 55 are formed on the upper surface of the first insulating layer film 40, and the second insulating layer film 60 is formed so as to cover the circuit pattern 50, and the connector The connecting portion 15 is formed on the first insulating layer film 40 by arranging the first insulating layer film 40 on the upper surface thereof so that the shield pattern connecting portion 37 formed on the base film 10 is exposed. Since the second insulating layer film 60 is arranged on the upper surface so that the circuit pattern connection portion 55 is exposed, a through hole or the like should not be used. The shield pattern connection part 37 and the circuit pattern connection part 55 can be easily formed on one surface side of the base film 10, and at the same time, the shield pattern connection part 37 and the circuit pattern connection part 55 can be easily formed. Can be installed in series toward the end of the connector connecting portion 15.

  Moreover, since the base film 10, the first insulating layer film 40, and the second insulating layer film 60 are made of the same material (specifically, urethane resin), each of these films is more It can be integrated easily and firmly by thermocompression bonding.

  Further, as the biological circuit board 1-1, a thin circuit board that has almost no elastic restoring force in the direction perpendicular to the surface and expands and contracts in the surface direction is used. Even when the flat cable 13 or the like is attached to a living body, it easily deforms following the change in the shape of the skin of the living body, and it is easy to maintain the state of sticking to the skin without causing a sense of incongruity to humans. Furthermore, since the circuit pattern 50 and the shield pattern 30 used for the above-described biological circuit board 1-1 use an elastomeric resin as a resin binder, they can easily cope with bending and expansion / contraction, and are suitable.

  4 to 7 are views showing a circuit board (hereinafter referred to as “biological circuit board”) 1-2 according to the second embodiment of the present invention, and FIG. 4 is a schematic plan view of the biological circuit board 1-2. 5, FIG. 5 is a schematic cross-sectional view taken along line BB in FIG. 4, FIG. 6 is a schematic cross-sectional view taken along CC in FIG. 4, and FIG. ). In the biological circuit board 1-2 shown in the figure, the same or corresponding parts as those of the biological circuit board 1-1 according to the embodiment shown in FIGS. Subscript "-2"). Note that matters other than those described below are the same as those in the embodiment shown in FIGS.

  This biological circuit board 1-2 is different from the biological circuit board 1-1 in that it has a pair of detection units 11-2 having the same structure, and one flat cable 13-2 drawn from both. Thus, the connector connecting portion 15-2 provided at the tip of the flat cable 13-2 is configured as one. By comprising in this way, the signal of the multiple places of a biological body can be taken out to one connector connection part 15-2.

  In the case of this example, the connector connection portion 15-2 is provided with a pair of circuit pattern connection portions 55-2 in parallel. On the other hand, the shield pattern connection part 37-2 is formed in a rectangular shape that is long in the width direction in front of the circuit pattern connection part 55-2 (front end side). As described above, the connector connecting portion 15-2 can also maintain a good connection state between the shield pattern connecting portion 37-2 and the terminal connected to the circuit pattern connecting portion 55-2, but a pair of circuit patterns. Since the connection portion 55-2 is provided in parallel, the shield pattern connection portion 37-2 can be formed long (wide) over the length of the adjacent portions, and more reliable electrical connection between the shield pattern connection portion 37-2 and the terminal can be achieved. Connection (decrease in contact resistance value) can be made, and noise is less likely to enter the detection output. There is a possibility that noise having a large energy may enter the shield pattern 30-2. However, according to the present invention, the size of the shield pattern connection portion 37-2 can be easily secured, so that the contact resistance value with the terminal can be increased. It can be lowered and a more reliable shielding effect can be exhibited. In this respect, since the size (area, width dimension) of the shield pattern connection portion 37 is larger than that of the circuit pattern connection portion 55 in the first embodiment, the same effect is produced.

  FIG. 8 is an explanatory diagram of a manufacturing method of a circuit board (hereinafter referred to as “biological circuit board”) 1-3 configured using the connector connecting portion 15-3 according to the third embodiment of the present invention (refer to FIG. 2). Corresponding figure). In the biological circuit board 1-3 shown in the figure, the same or corresponding parts as those of the biological circuit board 1-1 according to the embodiment shown in FIGS. Subscripts “−3” and “−3 ′” are added). Note that matters other than those described below are the same as those in the embodiment shown in FIGS.

  This biological circuit board 1-3 is different from the biological circuit board 1-1 in that two biological circuit boards having the same structure as the biological circuit board 1-1 are prepared, and the base materials of both are provided. The surfaces of the films (base materials) 10-3 and 10-3 ′ where the shield patterns 30-3 and 30-3 ′ are not formed are brought into contact with each other and bonded together by thermocompression bonding. If comprised in this way, the detection part 11-3, the flat cable 13-3, and the connector connection part 15-3 can each be arrange | positioned on the front and back both surface side of the biological circuit board 1-3, and it is more complicated. It can meet the demand for circuit pattern structure.

  FIG. 9 is an explanatory diagram of a manufacturing method of a circuit board (hereinafter referred to as “biological circuit board”) 1-4 configured using the connector connecting portion 15-4 according to the fourth embodiment of the present invention (refer to FIG. 2). Corresponding figure). In the biological circuit board 1-4 shown in the figure, the same or corresponding parts as those of the biological circuit board 1-1 according to the embodiment shown in FIGS. Subscript "-4"). Note that matters other than those described below are the same as those in the embodiment shown in FIGS.

  This biological circuit board 1-4 is different from the biological circuit board 1-1 in that the shield pattern 30-4 is screen-printed with a carbon paste on the lower surface (one surface) of the base film 10-4. Thus, when the base film 10-4, the first insulating layer film 40-4, and the second insulating layer film 60-4 are attached by thermocompression bonding, It is the point which carried out the thermocompression bonding of the insulating layer film 40-4 of 1 directly. Even if comprised in this way, since the biological circuit board 1-4 and the connector connection part 15-4 are comprised by the thermocompression bonding of a film, even if the thickness of the biological circuit board 1-4 and the connector connection part 15-4 is formed, for example. Even if it is thin, it can be easily manufactured. The surface of the base film 10-4 on which the shield pattern 30-4 is formed is covered with the shield pattern 30-4 (however, with the shield pattern connection portion 37-4 exposed). 3 insulating layer films (which may have the same shape as the first insulating layer film 40-4) may be attached by thermocompression bonding.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in each of the above-described embodiments, a urethane film that can be thermocompression bonded and is stretchable is used as the material of the film. However, in some cases, other various synthetic resins such as a silicon rubber film and a PET (polyethylene terephthalate) film are used. A film or a film made of a nonwoven fabric may be used. Some synthetic resin films cannot be directly thermocompression bonded, and of course, non-woven fabric films cannot be directly thermocompression bonded.In such a case, if a hot melt type adhesive layer is formed between the films, Thermocompression bonding becomes possible.

  Moreover, although the said embodiment showed the example which utilized this invention for the circuit board for biological bodies, the circuit board using the connector connection part which concerns on this invention may be a circuit board used for other various uses. good. In that case, formation of an electrode etc. is also unnecessary. In short, what is the connector connection part used for the circuit board formed by laminating the shield pattern and the circuit pattern shielded by the shield pattern directly or through another layer on the surface of the base material? The present invention can also be applied to a connector connecting portion of a simple circuit board.

  Further, in the present invention, various changes can be made in the shape and configuration depending on the application, the configuration of the equipment, etc., and three or more detection units may be provided, and a flat cable or connector connection unit may be provided. The shape and number of these may be changed as appropriate.

  Moreover, in the said embodiment, although the base film in which the shield pattern was formed, the 1st insulating layer film in which the circuit pattern was formed, and the 2nd insulating layer film were laminated | stacked directly, other various layers are among them. The present invention can also be applied to a circuit board laminated with a (film or the like) interposed therebetween.

  In the above-described embodiment, the base film, the first insulating layer film, and the second insulating layer film are all made of the same material, and thereby, integration by easy and reliable thermocompression between the films is achieved. However, depending on the case, different materials or different thickness films may be used.

  A second shield pattern that covers the circuit pattern may be further formed on the upper surface of the second insulating layer film. In this case, the connector connecting portion includes a shield pattern connecting portion provided on the base film, a circuit pattern connecting portion provided on the first insulating layer film, and a second provided on the second insulating layer film. The shield pattern connection portions are arranged in series (in a straight line) in this order. That is, the shield pattern connection part is arranged at the tip end side of the connector connection part, the circuit pattern connection part is arranged at an intermediate position of the connector connection part, and the second shield pattern connection part is arranged at the base side of the connector connection part.

  Moreover, in the said embodiment, although the 1st insulating layer and the 2nd insulating layer were both comprised with the film, instead of the 1st insulating layer and the 2nd insulating layer, either (or any) Alternatively, it may be formed by printing. The manufacturing method in this case is as follows, for example. That is, first, a base film having a shield pattern and a shield pattern connection portion connected to the shield pattern on one side is prepared. Next, a 1st insulating layer is printed on the said base film, The said shield pattern connection part formed in the said base film is exposed from the said 1st insulating layer in that case. Next, the circuit pattern and a circuit pattern connection portion connected to the circuit pattern are formed on the first insulating layer. Next, a second insulating layer is printed on the first insulating layer, and at this time, the circuit pattern connection portion formed on the first insulating layer film is exposed from the second insulating layer. Even if comprised in this way, the connector connection part of the circuit board based on this invention can be manufactured.

  Moreover, as long as there is no contradiction in the objective, a structure, etc., the embodiment shown by the said description and each figure can combine the description content of each other. In addition, the above description and the description of each drawing can be an independent embodiment even if it is a part of it, and the embodiment of the present invention is an embodiment in which the above description and each drawing are combined. It is not limited to.

1-1 (1-2 to 1-4) Biological circuit board (circuit board)
10 (10-2 to 10-4) base material (base material film)
11 (11-2 to 11-4) Detection unit 13 (13-2 to 13-4) Flat cable 15 (15-2 to 15-4) Connector connection unit 30 (30-2 to 30-4) Shield pattern 37 (37-2 to 37-4) Shield pattern connection part 40 (40-2 to 40-4) 1st insulating layer film (1st insulating layer)
50 (50-2 to 50-4) Circuit pattern 55 (55-2 to 55-4) Circuit pattern connection portion 60 (60-2 to 60-4) Second insulating layer film (second insulating layer)

Claims (4)

On the surface of the base material, directly or through another layer, a connector connection portion of a circuit board formed by laminating a shield pattern and a circuit pattern shielded by the shield pattern,
The connector connecting portion has a shield pattern connecting portion that connects to the shield pattern, and a circuit pattern connecting portion that connects to the circuit pattern, and the shield pattern connecting portion is more than the circuit pattern connecting portion. A connector connecting portion of a circuit board, wherein the connector connecting portion is provided at a position extending toward an end of the connector connecting portion. A connector connecting portion of a circuit board according to claim 1,
The circuit board has the shield pattern and the shield pattern connection portion formed on one side of the base material, a first insulating layer is formed so as to cover the shield pattern, and the circuit is formed on the upper surface of the first insulating layer. Forming a pattern and a circuit pattern connection part, and having a structure formed by forming a second insulating layer so as to cover the circuit pattern;
The connector connecting portion is
The first insulating layer is disposed on the upper surface so that the shield pattern connection portion formed on the base material is exposed,
A connector connecting portion of a circuit board, wherein the second insulating layer is arranged on an upper surface thereof so that a circuit pattern connecting portion formed in the first insulating layer is exposed. A method for manufacturing a connector connecting portion of a circuit board, in which a shield pattern and a circuit pattern shielded by the shield pattern are laminated directly or through another layer on the surface of a base material,
A base film formed with a shield pattern connection portion connected to the shield pattern and the shield pattern on one side;
A first insulating layer film having a circuit pattern connection portion connected to the circuit pattern and the circuit pattern on one side;
A second insulating layer film;
Prepare
The first insulating layer film and the second insulating layer film are placed on the base film, and the shield pattern connection portion formed on the base film is then removed from the first insulating layer film. Exposing the circuit pattern connecting portion formed in the first insulating layer film from the second insulating layer film;
A method of manufacturing a connector connecting portion of a circuit board, wherein the laminated films are bonded by thermocompression bonding. A method for manufacturing a connector connecting portion of a circuit board, in which a shield pattern and a circuit pattern shielded by the shield pattern are laminated directly or through another layer on the surface of a base material,
Prepare a base film in which a shield pattern connection part connected to the shield pattern and the shield pattern is formed on one side,
Printing the first insulating layer on the base film, and in that case, exposing the shield pattern connection portion formed on the base film from the first insulating layer;
Forming the circuit pattern and a circuit pattern connection portion connected to the circuit pattern on the first insulating layer;
Printing a second insulating layer on the first insulating layer, and in this case, exposing the circuit pattern connection portion formed on the first insulating layer film from the second insulating layer;
A method for manufacturing a connector connecting portion of a circuit board, comprising:

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