JP2019021793A - Wiring board, package for electronic component, and electronic device - Google Patents

Abstract

A wiring board electronic component package and an electronic device are provided which are effective in improving the reliability of hermetic sealing. A wiring board (10) includes an insulating substrate (1), a signal through conductor (2) penetrating through a plurality of insulating layers (1a), a ground conductor layer (3) positioned on the surface of the insulating layer (1a) and having an opening (3a), A plurality of ground through conductors 4 penetrating a plurality of insulating layers 1a and positioned at the edge of an opening 3a to surround a signal through conductor 2, and a plurality of signal land conductors 5 connected to the signal through conductor 2. and a plurality of ground land conductors 6 connected to the ground through conductors 4 . The signal land conductor 5 has a cross shape having a center portion 5a connected to the signal through conductor 2 and a linear portion 5b that intersects with each other at the center portion 5a. The linear portions 5b of the land conductors 5 are shifted from each other. [Selection drawing] Fig. 1

Description

  The present invention relates to a wiring board, a package for electronic components, and an electronic device having a signal through conductor through which a high-frequency signal is transmitted.

  A wiring board having a signal line through which a high-frequency signal is transmitted is used as a component constituting a package in which an electronic component such as an optical semiconductor element is accommodated. In the wiring board, for example, a plurality of signal lines are arranged above and below the upper and lower surfaces of the wiring board. The signal lines that are positioned one above the other are electrically connected to each other via a signal through conductor.

  In this case, a ground conductor layer is disposed adjacent to the signal line in order to reduce electromagnetic noise with respect to the signal line. In addition, a land conductor is disposed in the length direction of the signal through conductor in order to improve conductivity in the signal through conductor (see, for example, Patent Document 1).

  In addition, an unnecessary capacitance component may be generated between the land conductor and the ground conductor layer. On the other hand, for example, as described in Patent Document 2, it has been proposed to make the land conductor a cross shape or the like.

JP 2006-93325 A Japanese Utility Model Publication No. 6-13181

  In the above conventional technique, for example, when a plurality of land conductors having a cross shape are stacked one above the other, the thickness of the land conductors increases up and down. May occur, or a gap may be generated inside the wiring board.

  A wiring board according to an aspect of the present invention includes an insulating substrate including a plurality of insulating layers stacked on each other, a signal through conductor continuously passing through the plurality of insulating layers in a thickness direction, and the insulating layer. A ground conductor layer that is located between the layers and has an opening surrounding the signal through conductor, and each of the plurality of insulating layers is continuously penetrated, and in plan view, the opening of the ground conductor layer A plurality of ground through conductors that are located at the edge portion and surround the signal through conductors, and a plurality of signal land conductors that are located between the plurality of layers of the plurality of insulating layers and connected to the signal through conductors And a plurality of ground land conductors located between a plurality of layers of the plurality of insulating layers and connected to the ground through conductor. Each of the plurality of signal land conductors has a cross shape having a central portion connected to the signal through conductor and a linear portion intersecting each other at the central portion. Further, in a plan view, the linear portions of the signal land conductors positioned between the upper and lower layers are displaced from each other.

  An electronic component package according to one aspect of the present invention includes a wiring board having the above-described configuration, and a housing having a recess, and the wiring board is fixed in the recess.

An electronic device according to an aspect of the present invention includes an electronic component package having the above configuration, an electronic component electrically connected to the wiring board in a recess of the casing, and the casing so as to close the recess. And a lid joined to each other.

  According to the wiring board of one aspect of the present invention, since the cross-shaped signal land conductor is included, the possibility that unnecessary capacitance is generated between the signal land conductor and the ground conductor layer is effectively reduced. ing. Further, in the cross-shaped signal land conductor, since the linear portions of the signal land conductors located between the upper and lower layers are shifted from each other, the multiple signal land conductors are prevented from overlapping vertically only in the linear portion. . Therefore, it is possible to effectively suppress the occurrence of unevenness in a part of the wiring board due to the thickness of the linear portion.

  According to the electronic component package of one aspect of the present invention, since the wiring board having the above-described configuration is included, an electronic device that is advantageous in improving reliability such as airtightness, in which unevenness of the wiring board portion is suppressed. Can be provided.

  According to the electronic device of one aspect of the present invention, since the electronic component package having the above-described configuration is included, an electronic device advantageous in improving reliability such as airtightness can be provided.

(A) is a top view which shows an example of the wiring board of embodiment of this invention, (b) is sectional drawing which shows an example of the wiring board of embodiment of this invention. (A) And (b) is a top view which shows an example of the interlayer mutually adjoined up and down in the wiring board shown in FIG. 1, respectively. It is a perspective view which decomposes | disassembles and shows an example of the package for electronic components of embodiment of this invention. It is a perspective view which decomposes | disassembles and shows an example of the electronic device of embodiment of this invention. It is a top view which shows the modification of the wiring board shown in FIG. (A) And (b) is a top view which expands and shows an example of the interlayer which adjoins up and down in the wiring board shown in FIG. 5, respectively. It is a graph which shows the high frequency characteristic in the wiring board of the embodiment of the present invention. (A)-(c) is a top view which shows the modification of FIG. 6, respectively.

  A wiring board, an electronic component package, and an electronic device according to an embodiment of the present invention will be described with reference to the accompanying drawings. Note that the distinction between the upper and lower sides in the following description is for convenience of explanation, and does not limit the upper and lower sides when the wiring board, the package for electronic components or the electronic device is actually used. The impedance in the following description is characteristic impedance.

  FIG. 1A is a plan view showing an example of a wiring board according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view showing an example of a wiring board according to an embodiment of the present invention. FIGS. 2A and 2B are plan views showing examples of layers adjacent to each other vertically in the wiring board shown in FIG. FIG. 3 is an exploded perspective view showing an example of an electronic component package according to an embodiment of the present invention. FIG. 4 is an exploded perspective view showing an example of the electronic device according to the embodiment of the present invention.

The wiring board 10 of the embodiment includes an insulating substrate 1 including a plurality of insulating layers 1a stacked on each other, a signal through conductor 2 that continuously penetrates the plurality of insulating layers 1a in the thickness direction, and an insulating layer 1a. A grounding conductor layer 3 having an opening 3a surrounding the signal through conductor 2 and a plurality of grounding through conductors 4 electrically connecting the grounding conductor layers 3 located between the upper and lower layers; It has. Each of the plurality of ground through conductors 4 continuously penetrates the plurality of insulating layers 1a and surrounds the signal through conductor 2 at the edge of the opening 3a of the ground conductor layer 3 in plan view. .
In addition, the wiring board 10 of the embodiment is located between a plurality of layers of the plurality of insulating layers 1a, and includes a plurality of signal land conductors 5 connected to the signal through conductors 2 and a plurality of insulating layers 1a. A plurality of ground land conductors 6 which are located between the layers and connected to the ground through conductor 4 are provided.

  Further, for example, the electronic component package 20 of the embodiment is basically configured by the wiring substrate 10 of the above-described embodiment and the casing 21 having the recess 21a and the wiring substrate 10 being fixed in the recess 21a. Has been. Also, the electronic component package 20 having the above configuration, the electronic component 31 electrically connected to the wiring board 10 in the recess 21a of the casing 21, and the lid joined to the casing 21 so as to close the recess 21a 32, the electronic device 30 of the embodiment is basically configured.

  The insulating substrate 1 has, for example, a rectangular plate shape such as a rectangular shape in plan view, and has an upper surface such as a rectangular shape. The insulating substrate 1 functions as a base for positioning the conductor portions such as the signal through conductor 2 and the ground conductor layer 3 in a predetermined positional relationship while being electrically insulated from each other. The insulating substrate 1 may have a mounting portion (not shown) on which an electronic component is mounted on a surface such as an upper surface thereof. A wiring board (not shown) having a mounting portion can be used alone as a mounting board for electronic components.

  The insulating substrate 1 is basically configured by laminating a plurality of (two layers in the example shown in FIG. 1B) insulating layers 1a that are rectangular in plan view. In the example shown in FIG. 1B, another insulating layer 1b is laminated on the upper surface of the upper insulating layer 1a. That is, the insulating substrate 1 is basically composed of two insulating layers 1a and one other insulating layer 1b. The insulating layer 1a and the other insulating layer 1b in this example differ only in the configuration of conductors arranged as will be described later, and the insulating layers themselves are similar to each other, and are formed of the same material. Has been.

  In the example shown in FIG. 1A, the insulating substrate 1 does not have another insulating layer 1b. That is, the insulating substrate 1 may be composed of only a plurality of insulating layers 1a stacked on each other. 1A may be regarded as a plan view in which the other uppermost insulating layer 1b is omitted from FIG.

  The insulating substrate 1 is formed of, for example, a ceramic sintered body such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. The insulating substrate 1 can be manufactured as follows, for example, when the plurality of insulating layers 1a and the other insulating layers 1b are both made of an aluminum oxide sintered body. First, raw material powders such as aluminum oxide and silicon oxide are formed into a sheet shape together with an appropriate organic binder and an organic solvent to produce a plurality of ceramic green sheets in the form of a square sheet. Next, these ceramic green sheets are laminated to produce a laminate. Thereafter, the laminate is fired at a temperature of 1300 to 1600 ° C. The insulating substrate 1 can be manufactured by the above process.

  The signal through conductor 2 continuously penetrates the plurality of insulating layers 1a in the thickness direction. That is, a through conductor for signal transmission (not indicated as this through conductor) that penetrates at least a part in the thickness direction of the insulating substrate 1 in the thickness direction is located in the insulating substrate 1. The signal through conductor 2 has a function as a transmission path for transmitting a signal between the upper surface side and the lower surface side of the insulating substrate 1. In the wiring board 10 of this embodiment, for example, as shown in FIG. 1B, the wiring conductor 7 is disposed on the upper surface of the insulating substrate 1. It can be said that the other insulating layer 1b described above is for arranging such a wiring conductor 7. The wiring conductor 7 and the signal through conductor 2 are electrically connected to each other through a via conductor 8 that penetrates the other insulating layer 1b in the thickness direction.

  The wiring conductor 7 is electrically connected to the electronic component 31 accommodated in the electronic component package 20, for example. The electronic component 31 electrically connected to the wiring conductor 7 is electrically led out to the lower surface side of the insulating substrate 1 through the signal through conductor 2. If the lower end portion or the like of the signal through conductor 2 is electrically connected to the external electric circuit, the electronic component 31 housed in the recess 21a and the external electric circuit (not shown) are electrically connected to each other. . As a result, signals can be transmitted and received between the electronic component 31 and the external electric circuit. For the electrical connection between the wiring conductor 7 and the electronic component 31, for example, the wiring conductor 7 and the electrode 31a on the upper surface of the electronic component 31 are connected via a conductive connecting material (not shown) such as a bonding wire or solder. Can be done.

  In the example shown in FIG. 1, a conductor layer (not labeled) having a relatively large area is connected to a portion (a lower end portion electrically derived) of the signal through conductor 2 that is located on the lower surface of the insulating substrate 1. Yes. This conductor layer is, for example, a pad for external connection. This conductor layer can be formed by the same method using the same metal material as that of other conductor portions such as the signal through conductor 2 described later.

  The ground conductor layer 3 located between the insulating layers 1a is provided with an opening surrounding the signal through conductor 2 in plan view in order to prevent an electrical short circuit between the ground conductor layer 3 and the signal through conductor 2. Part (so-called clearance part) 3a. In the opening 3a, the surface of the insulating layer 1a is exposed between the layers. The ground conductor layer 3 has a function of impedance matching of the signal through conductor 2. The ground conductor layer 3 also has a function of electromagnetically shielding the signal through conductor 2 and the wiring conductor 7 from the outside. In the wiring board 10 of the embodiment, the ground conductor layer 3 is located between the plurality of layers. In other words, a plurality of ground conductor layers 3 are arranged along the length direction of the signal through conductor 2. As a result, a predetermined capacitance component is generated in the signal through conductor 2 and the signal land conductor 5 described later, and the impedance can be adjusted respectively.

  The signal land conductor 5 is located between the insulating layers 1a, and has a function of facilitating electrical connection between the signal through conductors 2 located on the upper and lower insulating layers 1a between the insulating layers 1a. That is, even if a positional shift occurs between the insulating layers 1 a positioned vertically, each signal through conductor 2 can effectively ensure mutual electrical connection via the signal land conductor 5. . The signal land conductors 5 having such a function are respectively arranged such that the outermost portion (outer peripheral position) is positioned outside the outer peripheral position such as the circular shape of the signal through conductor 2 in plan view. The Details of the signal land conductor 5 in the wiring board 10 of this embodiment will be described later.

  Each of the plurality of ground through conductors 4 continuously penetrates the plurality of insulating layers 1a and has a function of electrically connecting the ground conductor layers 3 positioned between the upper and lower layers. As a result, the variation in potential between the plurality of ground conductor layers 3 located between the plurality of layers is suppressed, and a stable ground potential can be applied. The grounding through conductor 4 has a function of surrounding the signal through conductor 2 in a plan view and electromagnetically shielding the signal through conductor 2 from the outside. In this case, the adjacent interval in a plan view of the plurality of ground through conductors 4 surrounding one signal through conductor 2 between one layer is, for example, ¼ or less of the wavelength of a signal transmitted through the signal through conductor 2. Set to In other words, in a plan view, the plurality of ground through conductors 4 are adjacent to each other at a distance equal to or less than ¼ of the wavelength of the signal transmitted through the signal through conductor 2 along a circle (circumference) surrounding the signal through conductor 2. It is arranged.

  A portion (for example, the circumference) where the plurality of ground through conductors 4 are arranged is the periphery of the opening 3 a of the ground conductor layer 3 described above. That is, the plurality of ground through conductors 4 continuously penetrate the plurality of insulating layers 1a and surround the signal through conductor 2 at the edge portion of the opening 3a of the ground conductor layer 3 in plan view. It is out.

  Also in the ground through conductor 4, land conductors (ground land conductors 6) are arranged between the insulating layers 1 a in order to cope with, for example, positional deviation between the insulating layers 1 a adjacent to each other in the vertical direction. Similarly to the signal land conductor 5, the ground land conductor 6 also has a portion located on the outer side in the plan view than the ground through conductor 4 to be connected. That is, the plurality of ground land conductors 6 are respectively arranged such that the outermost portion (outer peripheral position) is positioned outside the outer peripheral position such as the circular shape of the ground penetrating conductor 4 in plan view. . Details of the ground land conductor 6 in the wiring board 10 of this embodiment will also be described later.

  The conductor portions such as the signal through conductor 2, the ground conductor layer 3, the ground through conductor 4, the signal land conductor 5, the ground land conductor 6, the wiring conductor 7 and the via conductor 8 are, for example, tungsten, molybdenum, manganese, copper, silver, palladium. , Gold, platinum, nickel or cobalt. Further, the conductor portion may include a plurality of the above metal materials, or may be formed of an alloy material or the like whose main component is the above metal material. Such a metal material is provided in a predetermined portion of the insulating substrate 1 as a conductor such as a metallized conductor or a plated conductor. This conductor is provided in a layered manner between the exposed surface of the insulating layer 1a or between the insulating layers 1a, and a columnar one filled in a through hole (not indicated) penetrating the insulating layer 1a in the thickness direction. Is included.

  For example, when the conductor portion is a metallized layer of tungsten, the conductor portion can be formed as follows. That is, first, tungsten powder is mixed with an organic solvent and an organic binder to produce a metal paste. Next, this metal paste is printed on a predetermined position of the ceramic green sheet to be the insulating substrate 1 by a method such as a screen printing method. At this time, through holes are provided in the ceramic green sheet at the portions where the signal through conductor 2, the ground through conductor 4, and the via conductor 8 are formed, and the metal paste as described above is filled in the through holes and fired. Then, the signal through conductor 2, the ground through conductor 4, and the via conductor 8 can be formed on the insulating substrate 1. In addition, said through-hole can be formed in a ceramic green sheet by punching processes, such as a mechanical punching process using a metal mold | die, or laser processing, for example.

  Further, when such a conductor portion is formed of a metallized layer, the exposed surface of the metallized layer may be covered with a plating layer appropriately selected from nickel, cobalt, palladium, gold and the like. In this case, characteristics such as suppression of oxidative corrosion in the conductor portion and bonding property of the bonding wire can be performed.

  In the wiring board 10, the electronic component package 20, and the electronic device 30 according to the embodiment, for example, as shown in FIGS. 1 and 2, a plurality of signal land conductors 5 are connected to the signal through conductors 2, respectively. And it is the cross shape which has the linear part 5b which mutually cross | intersects in the center part 5a. Further, the linear portions 5b of the signal land conductors 5 located between the upper and lower layers are shifted from each other in plan view. That is, for example, the linear portion 5b of the signal land conductor 5 in the interlayer shown in FIG. 2A and the linear portion 5b of the signal land conductor 5 in the interlayer shown in FIG. The angle is 45 degrees. The linear portion 5b between the upper layers is located at the center of the adjacent line portions of the linear portion 5b between the lower layers. That is, the deviation between the linear portions 5b between the signal land conductors 5 adjacent to each other in the vertical direction is a relative rotation deviation and corresponds to a so-called θ deviation.

According to the wiring board 10 of the above embodiment, since the cross-shaped signal land conductor 5 is included, the distance between the signal land conductor 5 and the ground conductor layer 3 is increased in part, and there is no need to be generated between the two. Effective capacitance is effectively reduced. Therefore, impedance matching in the signal through conductor 2 is easy, and the wiring board 10 and the like that are advantageous for improving the transmission characteristics of the high-frequency signal can be obtained. Further, the signal land conductor 5 includes a portion located on the outer side of the outer peripheral position of the signal through conductor 2 in plan view with respect to the outer peripheral position. Therefore, even if a positional shift occurs between the upper and lower insulating layers 1a, it is easy to ensure electrical connection between the signal through conductors 2 positioned on the upper and lower insulating layers 1a.

  Further, since the cross-shaped signal land conductor 5 has the linear portions 5b of the signal land conductor 5 located between the upper and lower layers shifted from each other, the plurality of signal land conductors 5 are vertically moved only in the linear portion 5b. Overlapping is suppressed. Therefore, it is possible to effectively suppress the occurrence of unevenness in a part of the wiring board 10 due to the thickness of the linear portion 5b. Moreover, generation | occurrence | production of a space | gap (so-called delamination) etc. between the insulating layers 1a can be suppressed effectively. Therefore, it is possible to provide the wiring board 10 that is effective for improving the transmission characteristics and reliability of high-frequency signals.

  In addition, since the electronic component package 20 of the embodiment includes the wiring board 10 having the above-described configuration, it is possible to manufacture the electronic device 30 that is advantageous in improving reliability such as airtightness, in which unevenness of the wiring board 10 portion is suppressed. It is possible to provide the electronic component package 20 that is easy to implement.

  In addition, since the electronic device 30 of the embodiment includes the electronic component package 20 having the above-described configuration, it is possible to provide the electronic device 30 that is advantageous for improving reliability such as airtightness.

  In order to shift the linear portions 5b of the signal land conductors 5 positioned between the plurality of layers adjacent to each other between the upper and lower layers in a plan view, for example, in the manufacturing process described above, the metal for the signal land conductors 5 What is necessary is just to make the printing pattern of a paste into a predetermined pattern (the linear parts 5b have shifted | deviated vertically).

  In the example shown in FIGS. 1 and 2, the linear portions 5b of the signal land conductors 5 positioned between the upper and lower layers have a crossing angle θ1 (hereinafter also simply referred to as a crossing angle) θ1 of 45 degrees in plan view. When the crossing angle is 45 degrees, it is effective to suppress the overlapping range of the linear portions 5b adjacent in the vertical direction as small as possible. Therefore, it is possible to effectively reduce the occurrence of irregularities on a part of the wiring substrate 10 due to the linear portions 5b being adjacent (overlapping), for example, on the upper and lower surfaces of the insulating substrate 1 positioned above and below the linear portions 5b. be able to. Note that the above-mentioned crossing angle is not limited to the case where the angle is exactly 45 degrees, and for example, an error of a degree caused by a shift or the like when the upper and lower insulating layers are stacked is allowed. Specifically, if the crossing angle is about 42 to 48 degrees, it is effective for improving the deformation suppressing effect of the insulating substrate 1.

  Even in this case, the central portions 5a of the signal land conductors 5 are adjacent to each other in the vertical direction, and this overlap has an effect on the unevenness in a part of the wiring board 10 as described above. Is small. That is, the central portion 5a of the signal land conductor 5 is a portion where the signal through conductor 2 is located in plan view, and the signal through conductor 2 and the signal land conductor 5 (5b) are integrated with each other. Therefore, it is unlikely that the overlapping of the central portions 5a of the signal land conductor 5 will lead to the occurrence of unevenness in a part of the wiring board 10. In other words, the signal land conductor 5 can be allowed to overlap vertically in a portion where the signal through conductor 2 is located in plan view.

  Further, when the crossing angle θ1 between the linear portions 5b of the signal land conductor 5 is 45 degrees, it is effective in reducing the facing area of the linear portions 5b positioned above and below the insulating layer 1a. is there. Therefore, the capacitance generated between the upper and lower linear portions 5b can be effectively reduced. As a result, an effect of improving reflection characteristics by suppressing impedance discontinuity can be obtained.

FIG. 3 shows an example of an electronic component package 20 according to an embodiment of the present invention. As previously mentioned,
FIG. 3 is an exploded perspective view showing the electronic component package 20. In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals. The electronic component package 20 includes the wiring board 10 having the above-described configuration, and a housing 21 in which the wiring board 10 is fixed in the recess 21a. In the example shown in FIG. 2, the wiring board 10 in a form in which two main parts (portions including the signal line 3 etc.) shown in FIG. The wiring board 10 may include only one such essential part, or may include three or more.

  The wiring board 10 is accommodated in the recess 21a of the housing 21, and the wiring board 10 is bonded and fixed to the inner surface such as the bottom surface of the recess 21a. The wiring substrate 10 is bonded to the inner surface of the recess 21a by, for example, a bonding material (not shown) such as a brazing material. In FIG. 2, the casing 21 and the wiring board 10 are shown separated from each other for easy understanding of the structure. The wiring board 10 is fixed to a portion indicated by a virtual line (two-dot chain line) on the bottom surface of the recess 21a.

  For example, the wiring board 10 is electrically connected to an electronic component 31 (a specific example will be described later) accommodated in the recess 21a, and performs electrical connection between the electronic component 31 and the outside. In this case, a through portion (not shown) is provided in a portion of the housing 21 where the wiring substrate 10 is mounted, and the wiring substrate 10 and an external electric circuit are electrically connected through the through portion. Further, the penetrating portion is blocked by the wiring board 10. At this time, the wiring board 10 also functions as one member for sealing the recess 21a.

  The housing 21 has, for example, a rectangular shape in plan view and a rectangular parallelepiped shape having a concave portion 21a on the upper surface. The housing 21 functions as a base for mounting the wiring board 10, the electronic component 31, and the like. The casing 21 functions as a member constituting a container for hermetically sealing the wiring substrate 10, the electronic component 31, and the like together with a lid 32 described later. In the example shown in FIG. 3, a rectangular region surrounded by a virtual line (two-dot chain line) on the bottom surface of the recess 21 a is a region where the electronic component 31 is mounted. The wiring board 10 and the electronic component 31 are respectively carried in the directions indicated by the arrows and mounted at predetermined positions on the bottom surface of the recess 21a.

  The casing 21 is made of, for example, an alloy material (so-called stainless steel) such as iron-nickel-chromium alloy, iron-nickel-chromium-molybdenum alloy, or a metal material such as iron-nickel-cobalt alloy. The casing 21 can be manufactured by subjecting such a raw material of the metal material to processing appropriately selected from processing methods such as cutting, cutting, polishing, and etching.

  Further, the housing 21 may be composed of a flat bottom portion and a frame portion such as a square frame located on the outer periphery of the upper surface of the bottom portion (not shown). In this case, a recess (not shown) that accommodates the wiring board 10 and the electronic component 31 is configured by the upper surface of the bottom portion and the inside of the frame portion. In this case, for example, the frame portion may be made of a ceramic material such as an aluminum oxide sintered body. When the frame portion is made of a ceramic material, it is easy to ensure electrical insulation between the connection terminals when a plurality of connection terminals or the like penetrating the housing 21 are provided as will be described later. In this case, if the bottom portion is made of metal, the electromagnetic shielding effect between the electronic component 31 and the like and the outside can be enhanced.

  In the example shown in FIG. 3, the casing 21 penetrates the casing 21 in the thickness direction (inward and outward direction of the recess 21a) on the surface of the recess 21a on the side opposite to the side on which the wiring board 10 is mounted. A pair of through holes 21b. Each of the pair of through holes 21b has a function as a light input / output unit to which a light input / output terminal (not shown) is inserted and fixed. The optical input / output terminal includes, for example, an optical fiber and a ferrule to which a tip portion of the optical fiber is fixed.

  According to the electronic component package 20 of the embodiment, since the wiring board 10 having the above-described configuration is included, the unevenness of the wiring board 10 portion is suppressed, and the electronic device 30 that is advantageous in improving reliability such as airtightness is manufactured. It is possible to provide the electronic component package 20 that is easy to implement.

  FIG. 4 shows an example of the electronic device 30 according to the embodiment of the present invention. FIG. 4 is an exploded perspective view showing the electronic device 30 according to the embodiment as described above. 4, parts similar to those in FIGS. 1 to 3 are denoted by the same reference numerals. The electronic device 30 of the embodiment includes an electronic component package 20 having the above-described configuration, an electronic component 31 that is electrically connected to the wiring board 10 in the recess 21a of the casing 21, and the casing 21 so as to close the recess 21a. And a lid body 32 joined to each other.

  The electronic component 31 is, for example, a semiconductor element including a semiconductor integrated circuit element (so-called IC or the like), an optical modulator, a photoelectric conversion element, a sensor element, or the like. The photoelectric conversion element may be an optical modulator such as an LN (lithium niobate) modulator. The electronic component 31 is electrically connected to the wiring conductor 7 of the wiring board 10 via, for example, a conductive connecting material (not shown) such as a bonding wire. The electronic component 31 electrically connected to the wiring conductor 7 is electrically led out to the lower surface side of the insulating substrate 1 through the signal through conductor 2. If the signal through conductor 2 is electrically connected to the external electric circuit via the through portion of the casing 21 on the lower surface of the insulating substrate 1, the electronic component 31 and the external electric circuit are electrically connected to each other. .

  The lid 32 has a function of closing and sealing the recess 21a in which the electronic component 31 is accommodated. The lid 32 is made of, for example, the same metal material as that of the casing 21, and is manufactured by the same method (metal processing). The lid 32 is joined to the upper surface of the casing 21 by a joining method through a joining material such as a brazing material or a welding method such as seam welding. That is, the casing 21, the lid 32, the optical input / output terminal, and the wiring board 10 constitute a container that hermetically seals the electronic component 31 and the like. According to the electronic device 30 of the embodiment, since the wiring board 10 having the above-described configuration is included, it is possible to provide the electronic device 30 that is advantageous for improving reliability such as airtightness.

  FIG. 5 is a plan view showing a modification of the wiring board 10 shown in FIG. 5, parts similar to those in FIGS. 1 and 2 are denoted by the same reference numerals. In the example shown in FIGS. 1, 2, and 5, the plurality of ground land conductors 6 cross each other at the center 6 a and the center 6 a that are connected to the ground conductor layer 3 at the edge of the opening 3 a. It is a cross-shaped part having a linear portion 6b.

  In these examples, the ground land conductor 6 can be regarded as one in which the portion located in the ground conductor layer 3 is integrated with the ground conductor layer 3. At this time, in FIG. 1 and FIG. 5, the portion of the ground land conductor 6 that is integrated with the ground conductor layer 3 is indicated by a virtual line (two-dot chain line), that is, the portion located on the opening 3a side, that is, actually The portion that can be recognized as the ground land conductor 6 is indicated by a solid line. A shape obtained by combining the virtual line portion and the solid line portion is a cross shape. FIG. 2 shows patterns that can be actually recognized between layers. In other words, the ground land conductor 6 is a part of a cross shape.

  In the example shown in FIG. 5, the linear portions 6b of the ground land conductors 6 located between the upper and lower layers are shifted from each other in plan view. Similarly to the case of the signal land conductor 5, this deviation is also a deviation in a direction in which the ground land conductors 6 positioned above and below rotate in a plan view, which is a so-called θ deviation.

In this case, in the ground land conductor 6 which is a part of the cross shape, the linear portions 6b of the ground land conductor 6 located between the upper and lower layers are shifted from each other, and therefore, a plurality of grounds are formed only in the linear portion 6b. The land conductor 6 is suppressed from overlapping in the vertical direction. Therefore, even in the vicinity of the opening 3a of the ground conductor layer 3, it is possible to effectively suppress the occurrence of unevenness in a part of the wiring board 10 due to the thickness of the linear portion 6b. Further, it is possible to effectively suppress the occurrence of delamination or the like between the insulating layers 1a even in the portion where the ground conductor layer 3 is located. Therefore, it is possible to provide the wiring board 10 that is effective for improving the transmission characteristics and reliability of high-frequency signals. Further, it is possible to provide the electronic component package 20 and the electronic device 30 that are effective in improving the transmission characteristics and reliability of high-frequency signals.

  Further, in the example shown in FIG. 5, the linear portions 6b of the ground land conductor 6 positioned between the upper and lower layers have a crossing angle θ2 (hereinafter, also simply referred to as a crossing angle) θ2 of 45 degrees in plan view. Similar to the case of the signal land conductor 5, even when the crossing angle of the ground land conductor 6 is 45 degrees, the overlapping range of the linear portions 6b adjacent in the vertical direction can be suppressed as small as possible. Therefore, it is possible to effectively reduce the occurrence of irregularities in a part of the wiring board 10 due to the linear portions 6b being vertically adjacent (overlapping). Similarly to the signal land conductor 5, the ground land conductor 6 may overlap vertically in the center portions 6 a where the ground through conductor 4 is located. Also in this case, the above-mentioned crossing angle is not limited to exactly 45 degrees, and an error to the extent that is caused by, for example, a shift between the upper and lower insulating layers is allowed. Specifically, if the crossing angle is about 42 to 48 degrees, it is effective for improving the deformation suppressing effect of the insulating substrate 1.

  FIGS. 6A and 6B are plan views showing enlarged examples of the layers adjacent to each other in the wiring board 10 shown in FIG. In FIG. 6, the same parts as those in FIGS. In the example shown in FIG. 6, the signal land conductor 5 and the ground land conductor 6 positioned between the same layers of the plurality of insulating layers 1a are arranged so that the ends of the respective linear portions 5b and 6a are adjacent to each other while being shifted from each other. Has been. That is, between the signal land conductor 5 and the ground land conductor 6 which are adjacent to each other with the opening 3a interposed therebetween, the virtual line K1 obtained by extending the linear portion 5b of the signal land conductor 5 and the linear portion 6b of the ground land conductor 6 are provided. The extended virtual line K2 crosses each other diagonally. In other words, the virtual lines K1 obtained by extending the linear portions 5a of the signal land conductor 5 in the direction of the ground land conductor 6 facing each other across the opening 3a are adjacent to each other among the linear portions 6b of the ground land conductor 6. It overlaps the part between things.

  In the example shown in FIG. 6, the angle of intersection between the virtual line K1 and the virtual line K2 is about 45 degrees. If the tip of the linear portion 5b of the signal land conductor 5 and the tip of the linear portion 6b of the ground land conductor 6 are shifted from each other in such a positional relationship, the distance between the tips of the linear portions 5b is increased. be able to. Therefore, the electrostatic capacitance between these linear parts 5b can be reduced. Thereby, the improvement effect of the reflective characteristic by impedance discontinuity suppression is acquired.

  In addition to the fact that the vertical overlap of the linear portion 5b of the signal land conductor 5 and the linear portion 6b of the ground land conductor 6 is suppressed, the linear portion 5b of the signal land conductor 5 and the ground land conductor 6 are suppressed. Since the distance facing the opening 3a with respect to the linear portion 6b can be increased, it is possible to effectively suppress the occurrence of unevenness in a part of the wiring substrate 10, particularly in the portion overlapping the opening 3a in plan view.

  The effects of the wiring board 10 of the above embodiment, the electronic component package 20 and the electronic device 30 including the wiring board 10 were confirmed by simulation. FIG. 7 is a graph showing high-frequency characteristics in the wiring board 10 of the embodiment of the present invention. FIG. 7 also shows the high-frequency characteristics of the wiring board of the comparative example. The wiring board of the comparative example has both the signal land conductor and the ground land conductor in a circular shape, and the wiring board 10 of the embodiment and the wiring board of the comparative example are set to the same conditions with respect to other points. . In the wiring board of the comparative example, the circular signal land conductor was arranged concentrically with the cylindrical signal through conductor in plan view. Further, the circular ground land conductor was arranged concentrically with the cylindrical ground through conductor in plan view.

The set conditions are as follows. That is, the dielectric constant of the insulating substrate 1 was 8.9, and the signal through conductor 2 and the ground through conductor 4 were cylindrical with a diameter of 75 μm. The insulating layer 1a had a thickness of about 250 μm, and an insulating substrate 1 was formed by laminating the upper and lower layers. A wiring conductor 7 having a line width of 90 μm is disposed on the upper surface of the insulating substrate 1, and the upper end of the signal through conductor 2 and the wiring conductor 7 are connected in an ambiguous manner. The signal land conductor 5 has a central portion 5a having the same diameter as the signal penetrating conductor 2 and a linear portion 5b having a line width of 50 μm and a length of 150 μm. The ground land conductor 6 has a central portion 6a having the same diameter as the ground penetrating conductor 4, and the linear portion 6b has a line width of 50 μm and a length of 150 μm. Further, the opening 3a as a whole has a circular shape with a diameter of 720 μm. That is, the distance between the tip of the linear portion 5b of the signal land conductor 5 and the tip of the linear portion 6b of the ground land conductor 6 facing each other across the opening 3a was set to 210 μm.

  The simulation results are shown in FIG. In FIG. 7, the reflection characteristic in the embodiment shown in FIGS. 1 and 2 is indicated by a solid line P1, the reflection characteristic in the embodiment shown in FIG. 6 is indicated by an alternate long and short dash line P2, and the reflection characteristic of the wiring board of the comparative example is indicated by a broken line P0. Show. In FIG. 7, the vertical axis represents the reflection loss (dB), and the horizontal axis represents the frequency f (GHz) of the signal transmitted through the signal through conductor 2.

  As can be seen from this simulation example, in the wiring board 10 of the embodiment, the reflection loss of the high-frequency signal is reduced as compared with the wiring board of the comparative example. In particular, in the wavelength region exceeding 50 GHz, the signal transmission characteristics are effectively improved in the wiring board 10 of the embodiment. In addition, the embodiment shown in FIGS. 1 and 2 (the form in which only the signal land conductor 5 is shifted up and down) has a relatively large loss reduction effect even in a wavelength region exceeding 50 GHz. It can also be seen that the reflection loss can be effectively reduced also in the embodiment shown in FIG. In this case, in addition to the effect of reducing reflection loss, the effect of suppressing peeling between the upper and lower insulating layers 1a is also improved.

  The wiring board, electronic component package, and electronic device of the present invention are not limited to the above embodiments, and various modifications are possible within the scope of the present invention. For example, as shown in FIG. 7, the linear portion 5 b of the signal land conductor 5 may be shifted by 30 degrees in the top-bottom order between three layers that are vertically continuous. Further, the linear portion 6b of the ground land conductor 6 may be shifted by 30 degrees in the top-bottom order between the three layers that are vertically continuous. Further, both the linear portion 5b of the signal land conductor 5 and the linear portion 6b of the ground land conductor 6 may be shifted by 30 degrees in the vertical direction.

  Also in this case, the overlap between the linear portions 5b and 6a is effectively suppressed in a plurality of layers that are vertically continuous. Therefore, the occurrence of unevenness in a part of the wiring board 10 can be effectively suppressed.

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a ... Insulating layer 2 ... Signal penetration conductor 3 ... Grounding conductor layer 3a ... Opening part 4 ... Grounding penetration conductor 5 ... Signal land conductor 5a ... Center part 5b ... Linear part 6 ... Ground land conductor 6a ... Center part 6b ... Linear part 7 ... Wiring conductor 8 ... Via conductor
10 ... wiring board
20 ... Packaging for electronic components
21 ・ ・ ・ Case
21a ... recess
21b ... Through hole
30 ・ ・ ・ Electronic device
31 ... Electronic components
31a ... Electrode
32 ... Lid K1, K2 ... Virtual line (extension line)

Claims (7)

An insulating substrate including a plurality of insulating layers stacked on each other;
A signal through conductor continuously passing through the plurality of insulating layers in the thickness direction; and
A grounding conductor layer located on the surface of the insulating layer and having an opening surrounding the signal through conductor;
A plurality of grounding through conductors that continuously penetrate each of the plurality of insulating layers and are located at an edge portion of the opening of the grounding conductor layer in plan view and surround the signal through conductors;
A plurality of signal land conductors located between a plurality of layers of the plurality of insulating layers and connected to the signal through conductors;
A plurality of ground land conductors located between a plurality of layers of the plurality of insulating layers and connected to the ground through conductor;
The plurality of signal land conductors each have a cross shape having a central portion connected to the signal through conductor and a linear portion intersecting each other at the central portion, and are positioned between the upper and lower layers in plan view. A wiring board in which the linear portions of the signal land conductor are shifted from each other. The wiring board according to claim 1, wherein the linear portions of the signal land conductors positioned between the upper and lower layers have a crossing angle of 45 degrees in a plan view. Each of the plurality of ground land conductors is a cross-shaped part having a center portion connected to the ground conductor layer at an edge portion of the opening and a linear portion intersecting each other at the center portion, 3. The wiring board according to claim 1, wherein the linear portions of the ground land conductors located between upper and lower layers are shifted from each other when viewed. 4. The wiring board according to claim 3, wherein the linear portions of the ground land conductor located between the upper and lower layers have a crossing angle of 45 degrees in plan view. 5. The wiring according to claim 4, wherein the signal land conductor and the ground land conductor located between the same layers of the plurality of insulating layers are arranged such that the ends of the linear portions are adjacent to each other while being shifted from each other. substrate. The wiring board according to any one of claims 1 to 5,
An electronic component package comprising a recess and a housing in which the wiring board is fixed in the recess. An electronic component package according to claim 6;
An electronic component electrically connected to the wiring board in the recess of the housing;
An electronic device comprising: a lid joined to the housing so as to close the recess.

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