JP2019091596A - Manufacturing method of power storage module - Google Patents

Abstract

To provide a manufacturing method of a power storage module capable of improving the sealing performance between a current collector plate and a resin portion.SOLUTION: A power storage module 12 is manufactured in which a plurality of bipolar electrodes 32 in each of which includes an electrode plates 34 having projections and depressions formed on at least one of the surfaces, a positive electrode 36 provided on a first surface 34b of the electrode plate 34, and a negative electrode 38 provided on a second surface 34c of the electrode plate 34 are laminated. First, the plurality of electrode plates 34 and a plurality of first resin portions 52 are stacked such that edge portions 34a of the electrode plates 34 and first resin portions 52 are alternately arranged (stacking step S2). Next, ultrasonic vibration is applied to the plurality of stacked first resin portions 52, thereby welding the plurality of first resin portions 52 to the edge portions 34a of the plurality of electrode plates 34 (welding step S3).SELECTED DRAWING: Figure 6

Description

  One aspect of the present invention relates to a method of manufacturing a storage module.

  There is known a secondary battery having a laminate obtained by laminating an electrode having an active material coated on at least one surface of a sheet-like current collector. For example, Patent Document 1 describes a bipolar battery that surrounds the unit cell and has a resin sealing layer provided between current collectors. In this bipolar battery, adjacent seal layers are adhered to each other by heat and pressure.

Patent No. 4370902

  When the seal layers are adhered to each other by heat and pressure, the laminated seal layers are pressurized in the laminating direction by the heater. Therefore, it takes time for heat to reach the seal layer farthest from the heater. In particular, when the number of stacked bipolar battery plates is increased, heat may not be properly transferred to the seal layer farthest from the heater, and the seal layer may not be sufficiently melted. In that case, the sealability between the current collector and the seal layer may be reduced.

  One aspect of the present invention aims to provide a method of manufacturing a power storage module capable of improving the sealability between a current collector plate and a resin portion.

  In the method of manufacturing a storage module according to one aspect of the present invention, a current collector plate having projections and depressions formed on at least one surface, a positive electrode provided on a first surface of the current collector plate, and a second of the current collector plate A manufacturing method of a storage module in which a plurality of bipolar electrodes respectively including a negative electrode provided on a surface are stacked, wherein a plurality of edge portions of the current collector plate and the first resin portion are alternately arranged. Stacking the plurality of first resin portions and the plurality of first resin portions, and applying the ultrasonic vibration to the plurality of first resin portions stacked after the plurality of stacking steps; And welding the plurality of first resin portions to the edge portion of the electric plate.

  In this method of manufacturing a storage module, ultrasonic vibration is instantaneously transmitted to the first resin portions, so that the first resin portions melt almost simultaneously. Therefore, the first resin portion farthest from the ultrasonic vibration supply portion can be sufficiently melted. Therefore, the sealability between the current collector plate and the first resin portion can be improved as compared to heat and pressure.

  The first surface and the second surface of the current collector plate have a rectangular shape, and in the welding step, the first resin portion is simultaneously applied to the edges of the current collector plate at a plurality of sides of the rectangular shape. It may be welded to the part. In this case, welding can be performed at high speed.

  The method of manufacturing the storage module includes, after the welding step, forming a second resin portion covering the outer surface of the plurality of first resin portions extending in the stacking direction of the first resin portion by injection molding It may further include. In this case, the sealability between the adjacent first resin portions can be enhanced by the second resin portion, so that the sealability of the storage module can be enhanced.

  According to one aspect of the present invention, there can be provided a method of manufacturing a power storage module capable of improving the sealability between the current collector plate and the resin portion.

It is a schematic sectional drawing which shows an electrical storage apparatus provided with the electrical storage module which concerns on one Embodiment. It is a schematic sectional drawing which shows the electrical storage module which comprises the electrical storage apparatus of FIG. It is a figure which shows schematic structure of the manufacturing apparatus of the electrical storage module which concerns on one Embodiment. It is a flowchart of the manufacturing method of the electrical storage module which concerns on one Embodiment. It is sectional drawing which shows the lamination process of the manufacturing method of the electrical storage module which concerns on one Embodiment. It is sectional drawing which shows the welding process of the manufacturing method of the electrical storage module which concerns on one Embodiment. It is a figure for demonstrating a welding process. It is a figure which shows an example of the current collection board and 1st resin part seen from the direction orthogonal to the 1st surface of a current collection board.

  Hereinafter, with reference to the drawings, a method of manufacturing a storage module of an embodiment will be described in detail. In the description of the drawings, the same elements will be denoted by the same reference symbols, without redundant description. In the drawings, an XYZ orthogonal coordinate system is shown as needed.

  FIG. 1 is a schematic cross-sectional view showing an embodiment of a power storage device provided with a power storage module. Power storage device 10 shown in the figure is used, for example, as a battery of various vehicles such as a forklift, a hybrid car, and an electric car. The storage device 10 includes a plurality of (three in the present embodiment) storage modules 12, but may include a single storage module 12. The storage module 12 is, for example, a bipolar battery. The storage module 12 is, for example, a secondary battery such as a nickel hydrogen battery or a lithium ion secondary battery, but may be an electric double layer capacitor. The following description exemplifies a nickel hydrogen battery.

  The plurality of storage modules 12 may be stacked via a conductive plate 14 such as a metal plate, for example. When viewed from the stacking direction D1, the storage module 12 and the conductive plate 14 have, for example, a rectangular shape. Details of each storage module 12 will be described later. The conductive plates 14 are also disposed outside the storage modules 12 positioned at both ends in the stacking direction D1 (Z direction) of the storage modules 12. Conductive plate 14 is electrically connected to adjacent power storage module 12. Thereby, the plurality of power storage modules 12 are connected in series in the stacking direction D1. In the stacking direction D1, the lead-out portion 24 is connected to the conductive plate 14 located at one end, and the lead-out portion 26 is connected to the conductive plate 14 located at the other end. The takeout portion 24 may be integral with the conductive plate 14 to be connected. The takeout portion 26 may be integral with the conductive plate 14 to be connected. The takeout portion 24 and the takeout portion 26 extend in a direction (X direction) intersecting the stacking direction D1. Charging and discharging of power storage device 10 can be performed by taking out part 24 and taking out part 26.

  Conductive plate 14 can also function as a heat sink for releasing the heat generated in storage module 12. By passing a refrigerant such as air through the plurality of air gaps 14 a provided inside the conductive plate 14, the heat from the storage module 12 can be efficiently released to the outside. Each void 14a extends, for example, in a direction (Y direction) intersecting the stacking direction D1. The conductive plate 14 is smaller than the storage module 12 when viewed from the stacking direction D1, but may be the same as or larger than the storage module 12.

  The storage device 10 may include a restraint member 16 for restraining the storage modules 12 and the conductive plates 14 stacked alternately in the stacking direction D1. The constraining member 16 includes a pair of constraining plates 16A and 16B and a connecting member (bolt 18 and nut 20) that interconnects the constraining plates 16A and 16B. An insulating film 22 such as a resin film, for example, is disposed between the restraint plates 16A and 16B and the conductive plate 14. Each restraint plate 16A, 16B is made of, for example, a metal such as iron. When viewed from the stacking direction D1, each of the restraint plates 16A, 16B and the insulating film 22 has, for example, a rectangular shape. The insulating film 22 is larger than the conductive plate 14, and the restraint plates 16 </ b> A and 16 </ b> B are larger than the storage module 12. As seen from the stacking direction D1, at the edge of the restraint plate 16A, an insertion hole H1 through which the shaft of the bolt 18 is inserted is provided at a position outside the storage module 12. Similarly, as viewed from the stacking direction D1, an insertion hole H2 through which the shaft portion of the bolt 18 is inserted is provided at a position outside the storage module 12 at the edge of the restraint plate 16B. When the constraining plates 16A and 16B have a rectangular shape when viewed from the stacking direction D1, the insertion holes H1 and H2 are located at the corners of the constraining plates 16A and 16B.

  One constraining plate 16A is abutted against the conductive plate 14 connected to the takeout portion 26 via the insulating film 22, and the other constraining plate 16B is bonded to the conductive plate 14 connected to the takeout portion 24 with the insulating film 22. It is hit through. The bolt 18 is, for example, passed through the insertion hole H1 from one restraint plate 16A side to the other restraint plate 16B side, and a nut 20 is screwed into the tip of the bolt 18 projecting from the other restraint plate 16B. There is. As a result, the insulating film 22, the conductive plate 14 and the storage module 12 are sandwiched to form a unit, and a restraint load is applied in the stacking direction D1.

  FIG. 2 is a schematic cross-sectional view showing an electricity storage module constituting the electricity storage device of FIG. A storage module 12 shown in the figure includes a stacked body 30 in which a plurality of bipolar electrodes 32 are stacked. The laminate 30 has, for example, a rectangular shape as viewed in the stacking direction D1 of the bipolar electrode 32. A separator 40 may be disposed between adjacent bipolar electrodes 32.

  The bipolar electrode 32 includes an electrode plate 34 (current collecting plate), a positive electrode 36 provided on the first surface 34 b of the electrode plate 34, and a negative electrode 38 provided on the second surface 34 c of the electrode plate 34. In the laminate 30, the positive electrode 36 of one bipolar electrode 32 faces the negative electrode 38 of one bipolar electrode 32 adjacent in the stacking direction D1 with the separator 40 interposed therebetween, and the negative electrode 38 of one bipolar electrode 32 is a separator 40. And the positive electrode 36 of the other bipolar electrode 32 adjacent in the stacking direction D1. In the stacking direction D1, an electrode plate 34 (a negative electrode side termination electrode) having the negative electrode 38 disposed on the inner surface is disposed at one end of the laminate 30 and a positive electrode 36 is disposed on the inner surface at the other end of the laminate 30. The arranged electrode plate 34 (positive electrode side end electrode) is arranged. The negative electrode 38 of the negative electrode side termination electrode faces the positive electrode 36 of the uppermost bipolar electrode 32 via the separator 40. The positive electrode 36 of the positive electrode side termination electrode faces the negative electrode 38 of the lowermost bipolar electrode 32 via the separator 40. The electrode plates 34 of these terminal electrodes are connected to the adjacent conductive plates 14 (see FIG. 1).

  The storage module 12 includes a frame 50 that holds the edge 34 a of the electrode plate 34 on the side surface 30 a of the stack 30 extending in the stacking direction D 1. The frame 50 is configured to surround the side surface 30 a of the stacked body 30. The frame 50 may include a first resin portion 52 for holding the edge 34 a of the electrode plate 34 and a second resin portion 54 provided around the first resin portion 52 when viewed in the stacking direction D1.

  The first resin portion 52 constituting the inner wall of the frame 50 is provided from the first surface 34 b (the surface on which the positive electrode 36 is formed) of the electrode plate 34 of each bipolar electrode 32 to the end face of the electrode plate 34 at the edge 34 a ing. As viewed in the stacking direction D1, each first resin portion 52 is provided over the entire circumference of the edge portion 34a of the electrode plate 34 of each bipolar electrode 32. Adjacent first resin portions 52 abut each other on a surface extending outside the second surface 34 c (the surface on which the negative electrode 38 is formed) of the electrode plate 34 of each bipolar electrode 32. As a result, similarly to the electrode plate 34 of each bipolar electrode 32, the edge portions 34a of the electrode plate 34 disposed on both sides of the laminated body 30 are also buried in the first resin portion 52 and held. As a result, a plurality of internal spaces V airtightly partitioned by the electrode plates 34 and 34 and the first resin portion 52 are formed between the electrode plates 34 and 34 adjacent in the stacking direction D1. In the internal space V, an electrolytic solution (not shown) made of an alkaline solution such as a potassium hydroxide aqueous solution is accommodated.

  The second resin portion 54 constituting the outer wall of the frame 50 is a cylindrical portion extending with the stacking direction D1 as an axial direction. The second resin portion 54 extends over the entire length of the stacked body 30 in the stacking direction D1. The second resin portion 54 covers the outer side surface 52s of the first resin portion 52 extending in the stacking direction D1. The second resin portion 54 is welded to the first resin portion 52 on the inner side when viewed from the stacking direction D1. The second resin portion 54 is welded to the outer side surface 52s of the first resin portion 52, for example, by heat at the time of injection molding.

  The first resin portion 52 and the second resin portion 54 are formed in, for example, a rectangular cylindrical shape by an insulating resin having alkali resistance. As a resin material which comprises the 1st resin part 52 and the 2nd resin part 54, polypropylene (PP), polyphenylene sulfide (PPS), or denaturation poly phenylene ether (modification PPE) etc. are mentioned, for example.

  The electrode plate 34 is made of metal, and is made of, for example, a nickel or a plate in which the surface of a steel plate is plated with nickel. The electrode plate 34 is a rectangular metal plate made of, for example, nickel, but may be a metal foil. The edge 34 a of the electrode plate 34 is an uncoated region on which the positive electrode active material and the negative electrode active material are not coated, and the uncoated region is buried in the first resin portion 52 constituting the inner wall of the frame 50. It is an area to be held. As a positive electrode active material which comprises the positive electrode 36, nickel hydroxide is mentioned, for example. As a negative electrode active material which comprises the negative electrode 38, a hydrogen storage alloy is mentioned, for example. The formation region of the negative electrode 38 in the second surface 34 c of the electrode plate 34 is slightly larger than the formation region of the positive electrode 36 in the first surface 34 b of the electrode plate 34. Irregularities are formed on at least one surface (the first surface 34 b or the second surface 34 c) of the electrode plate 34. The unevenness is formed on the surface of the electrode plate 34 at the edge 34a. In the present embodiment, as the first surface 34 b and the second surface 34 c are both subjected to the electrolytic plating process, irregularities are formed on both the first surface 34 b and the second surface 34 c. The range to be subjected to the electrolytic plating process may be all of the first surface 34 b and the second surface 34 c or a part of the first surface 34 b and the second surface 34 c (of the first surface 34 b and the second surface 34 c A portion at the edge 34a).

  The separator 40 is formed, for example, in a sheet shape. Examples of the material for forming the separator 40 include porous films made of polyolefin resins such as polyethylene (PE) and polypropylene (PP), and woven or non-woven fabrics made of polypropylene and the like. The separator 40 may be reinforced with a vinylidene fluoride resin compound or the like.

  Next, a manufacturing apparatus 70 (hereinafter, also simply referred to as “manufacturing apparatus”) of the power storage module 12 used in the method of manufacturing the power storage module 12 described above will be described. The manufacturing device 70 is a device for manufacturing the storage module 12 (ultrasonic welding device), and is a device for welding the first resin portion 52 and the edge portion 34 a of the electrode plate 34 by ultrasonic waves.

  FIG. 3 is a view showing a schematic configuration of a storage module manufacturing apparatus according to one embodiment. As shown in FIG. 3, the manufacturing apparatus 70 includes an anvil 71, an ultrasonic wave generator 72, a horn 75, a driver 74, and a controller 80. The anvil 71 is disposed to face the tip of the horn 75. Below, let the opposing direction of the anvil 71 and the horn 75 be an up-down direction.

  The anvil 71 has a placement surface 71a on which the ultrasonic welding target is placed. An object to be welded is, for example, a laminated unit U (see FIG. 5) in which the electrode plates 34 and the first resin portions 52 are alternately arranged. The mounting surface 71a is made of, for example, a highly rigid metal such as SUS.

  The ultrasonic wave generation unit 72 generates ultrasonic vibration using, for example, an ultrasonic transducer made of a piezo element. The ultrasonic wave generator 72 generates, for example, vertical vibration. The ultrasonic wave generator 72 adjusts the amplitude with a booster and then inputs ultrasonic vibration to the horn 75.

  The horn 75 is connected to the ultrasonic wave generator 72, and transmits the ultrasonic vibration generated in the ultrasonic wave generator 72 to the first resin part 52 to be welded. The horn 75 is formed of, for example, a metal material such as aluminum or titanium.

  The driving unit 74 is, for example, an air cylinder, and the horn 75 is attached to a piston of the air cylinder so as to be vertically movable. The driving unit 74 presses the horn 75 against the first resin portion 52 with a predetermined load by driving the horn 75 downward toward the welding target.

  The controller (control unit) 80 controls the ultrasonic wave generation unit 72 and the drive unit 74. The controller 80 is configured of a central processing unit (CPU), a random access memory (RAM), a read only memory (ROM), an input / output interface, and the like. Various programs or data are stored in the ROM. The controller 80 according to the present embodiment, for example, applies ultrasonic vibration to the first resin portion 52 via the horn 75 in a state where the first resin portion 52 disposed at the edge portion 34 a of the electrode plate 34 is pressed by the horn 75. The ultrasonic wave generator 72 and the driver 74 are controlled so as to apply

  FIG. 4 is a flowchart of a method of manufacturing a power storage module according to an embodiment. As shown in FIG. 4, the method of manufacturing the storage module 12 of the present embodiment may include a concavo-convex forming step S <b> 1, a laminating step S <b> 2, a welding step S <b> 3 and a sealing step S <b> 4.

  In the unevenness forming step S1, the unevenness is formed on the first surface 34b and the second surface 34c of the electrode plate 34. The unevenness is formed on the surface (the first surface 34 b and the second surface 34 c) to which the first resin portion 52 is welded at the edge 34 a. The unevenness may be formed on the end face of the electrode plate 34 connecting the first surface 34 b and the second surface 34 c. The unevenness is formed, for example, by electrolytic plating. The size of the unevenness is not particularly limited, but if the thickness of the electrode plate 34 is 0.1 μm to 1000 μm, the size of the unevenness may be set to 0.1 μm to 30 μm. Thereafter, a positive electrode active material layer is formed on the first surface 34b of the electrode plate 34, and a negative electrode active material layer is formed on the second surface 34c. Thereby, the bipolar electrode 32 is obtained.

  After the unevenness forming step S1, a stacking step S2 is performed. In the stacking step S2, as shown in FIG. 5, the plurality of electrode plates 34 and the plurality of first resin portions 52 are stacked so that the electrode plates 34 and the first resin portions 52 are alternately arranged. The number of stacked layers of the electrode plate 34 is, for example, 5 to 30. In the present embodiment, a plurality of bipolar electrodes 32 and an electrode plate 34 as a termination electrode are stacked. The first resin portion 52 may be a frame extending along the edge 34 a of the electrode plate 34. In this case, the electrode plate 34 and the first resin portion 52 are firmly joined at all parts of the edge portion 34a of the electrode plate 34 by performing the welding step S3 described later. In the laminating step S2, the first resin portion 52 may be attached only to the first surface 34b of each electrode plate 34, or the first resin portion 52 may be respectively attached to the first surface 34b and the second surface 34c of each electrode plate 34. May be attached. In the stacking step S2, the separators 40 are disposed between the adjacent electrode plates 34. The separator 40 is surrounded by the first resin portion 52. Thus, a laminated unit U in which the bipolar electrode 32, the electrode plate 34 as the terminal electrode, the separator 40, and the first resin portion 52 are laminated is formed.

  After the lamination step S2, a welding step S3 is performed. The welding step S3 can be performed using the above-described manufacturing apparatus 70. In the welding step S3, as shown in FIG. 6, by applying ultrasonic vibration to the lamination unit U (in particular, the first resin portion 52 laminated), a plurality of edge portions 34a of the plurality of electrode plates 34 are (1) The resin parts 52 are respectively welded. The ultrasonic vibration may be, for example, ultrasonic vibration in the stacking direction of the plurality of bipolar electrodes 32, or may be ultrasonic vibration in the direction crossing the stacking direction. Specifically, ultrasonic vibration is applied to the first resin portion 52 via the horn 75 in a state in which the first resin portion 52 arranged in a frame shape at the edge portion 34 a of the electrode plate 34 is pressed by the horn 75 . First, ultrasonic vibration is generated by the ultrasonic wave generator 72 to vibrate the horn 75. Subsequently, the horn 75 is moved downward toward the first resin portion 52 by the drive portion 74, and the horn 75 is pressed against the first resin portion 52 with a predetermined load. The horn 75 applies vibration energy of the ultrasonic vibration generated in the ultrasonic wave generation unit 72 to each first resin unit 52. The ultrasonic vibration is instantaneously transmitted from the first resin portion 52 closest to the horn 75 to the first resin portion 52 farthest from the horn 75. Between adjacent first resin portions 52, ultrasonic vibration can be transmitted from one of the first resin portions 52 to the other first resin portion 52 through the edge portion 34a of the electrode plate 34. Thereby, heat (frictional heat) due to friction is generated at the interface between each first resin portion 52 and the electrode plate 34, and the temperature of the first resin portion 52 rises. As a result, the first resin portion 52 melts. Thereafter, the generation of the ultrasonic vibration by the ultrasonic wave generation unit 72 is stopped, and the temperature of the first resin unit 52 is lowered in a state where the first resin unit 52 is pressurized. As a result, the first resin portion 52 changes from a molten state (liquid) to a solidified state (solid), and the first resin portion 52 is welded to the edge portion 34 a. The first resin portions 52 are respectively welded to the electrode plates 34 located on both sides thereof. That is, each first resin portion 52 includes the second surface 34 c of the electrode plate 34 located above the first resin portion 52 and the first surface of the electrode plate 34 located below the first resin portion 52. Each is welded to 34b. In this case, the internal space V (see FIG. 2) surrounded by one first resin portion 52 and the electrode plate 34 positioned on both sides can be sealed without performing the sealing step S4 described later. Further, in the sealing step S4 described later, even if the melted second resin portion 54 presses the electrode plate 34 in the direction orthogonal to the laminating direction of the electrode plate 34, the adjacent electrode plates 34 are the first resin portion Since it is fixed by 52, it is hard to produce position shift of electrode plate 34. As shown in FIG.

  The timing of driving by the driving unit 74 and the timing of ultrasonic vibration generation by the ultrasonic wave generating unit 72 are not limited to the contents described above. In addition, the melted first resin portion 52 can move downward by gravity to fill the space between the adjacent first resin portions 52. As a result, as shown in FIG. 2, the solidified first resin portions 52 may be welded to each other.

  The case where the first surface 34b of the electrode plate 34 is roughened will be described in detail with reference to FIGS. 7 (A) and 7 (B). As shown in FIGS. 7A and 7B, the first surface 34b of the electrode plate 34 is roughened to form a plurality of protrusions 34d. The protrusion 34d may have, for example, a shape in which the diameter increases from the proximal end toward the distal end. 7A and 7B are schematic views, and the shape, density, and the like of the protrusions 34d are not particularly limited. FIG. 7A shows the first resin portion 52 and the electrode plate 34 before ultrasonic welding. The 1st resin part 52 and the electrode plate 34 after ultrasonic welding are shown by FIG. 7 (B). The first resin portion 52 melted by the ultrasonic vibration enters the recess between the protrusions 34 d, and an anchor effect is exhibited. Also in the case where the second surface 34 c of the electrode plate 34 is roughened, the anchor effect is similarly exhibited between the second surface 34 c of the electrode plate 34 and the first resin portion 52.

  FIG. 8 is a view showing an example of the electrode plate 34 and the first resin portion 52 viewed from the direction orthogonal to the first surface 34 b of the electrode plate 34. As shown in FIG. As shown in FIG. 8, the first surface 34 b and the second surface 34 c of the electrode plate 34 have, for example, a rectangular shape. In this case, the first resin portion 52 may be welded to the edge 34 a of the electrode plate 34 simultaneously on the plurality of sides of the rectangular shape. The first resin portion 52 may be simultaneously welded to the edge portion 34a at two adjacent sides or two opposite sides of the rectangular shape, or the first resin portion 52 may be simultaneously welded to the edge portion 34a at four sides .

  After the welding step S3, a sealing step S4 is performed. In the sealing step S4, the second resin portion 54 covering the outer side surface 52s of the plurality of first resin portions 52 is formed by injection molding (see FIG. 2). Subsequently, an electrolytic solution is injected from the liquid injection ports provided in the first resin portion 52 and the second resin portion 54 into the internal space V. Thereafter, the liquid injection port is sealed by, for example, a pressure control valve or the like. Thus, the storage module 12 shown in FIG. 2 is manufactured.

  As described above, according to the method of manufacturing the storage module 12 of the above embodiment, since the ultrasonic vibration is instantaneously transmitted to the first resin portions 52, the first resin portions 52 melt almost simultaneously. Therefore, the first resin portion 52 farthest from the horn 75 which is a supply portion of the ultrasonic vibration can be sufficiently melted. Therefore, the sealability between the electrode plate 34 and the first resin portion 52 can be improved as compared to heat and pressure. That is, a more robust seal state can be secured between the electrode plate 34 and the first resin portion 52. Furthermore, in the method of manufacturing the storage module 12 of the above embodiment, since the plurality of first resin portions 52 are respectively welded to the edge portions 34a of the plurality of electrode plates 34 substantially simultaneously, one first resin portion 52 is one electrode As compared with the case of welding to the edge portion 34a of the plate 34, the time of the welding step S3 can be significantly shortened.

  Further, in the welding step S3, the first surface 34b and the second surface 34c of the electrode plate 34 have a rectangular shape, and the first resin portion 52 is simultaneously formed on the edge of the electrode plate 34 at a plurality of sides of the rectangular shape. It may be welded to 34a. In this case, welding can be performed at high speed.

  Moreover, you may perform sealing process S4 after welding process S3. In this case, since the sealability between the adjacent first resin portions 52 can be enhanced by the second resin portion 54, the sealability of the storage module 12 can be enhanced.

  The preferred embodiments of the present invention have been described above in detail, but the present invention is not limited to the above embodiments.

  For example, although the above-mentioned embodiment gave and explained the example which formed unevenness in both the 1st field 34b of the electrode plate 34, and the 2nd field 34c, unevenness may be formed only in the 1st field 34b. In this case, each first resin portion 52 is welded to the first surface 34 b of the electrode plate 34. Similarly, asperities may be formed only on the second surface 34c. In this case, each first resin portion 52 is welded to the second surface 34 c of the electrode plate 34.

  In the above embodiment, the method of manufacturing the storage module 12 has been described by way of an example including the unevenness forming step S1. However, the manufacturing method of the storage module 12 is formed by the unevenness forming step S1 instead of the unevenness forming step S1. The method may include a preparation step of preparing the electrode plate 34 having the concavities and convexities equal to the size.

  In the above embodiment, an example in which all the electrode plates 34 are stacked to form one stacked unit U in the stacking step S2 has been described, but all the electrode plates 34 are divided into a plurality of groups and each group is described. The lamination unit U may be formed. In this case, after the welding step S3 is performed on each of the plurality of stacked units U, the plurality of stacked units U are welded to each other. Thus, even if the number of stacked electrode plates 34 increases, the welding step S3 can be performed without largely changing the welding conditions.

  12: storage module, 32: bipolar electrode, 34: electrode plate (current collector), 34a: edge, 34b: first surface, 34c: second surface, 36: positive electrode, 38: negative electrode, 52: first resin Part, 54: second resin part.

Claims (3)

A plurality of bipolar electrodes including a current collector plate having irregularities formed on at least one surface, a positive electrode provided on the first surface of the current collector plate, and a negative electrode provided on the second surface of the current collector plate Is a method of manufacturing a storage module in which
Stacking the plurality of current collector plates and the plurality of first resin portions such that the edge portion of the current collector plate and the first resin portion are alternately disposed;
A welding step of welding the plurality of first resin portions to the edge portion of the plurality of current collector plates by applying ultrasonic vibration to the plurality of first resin portions stacked after the step of stacking When,
A method of manufacturing a storage module, including: The first surface and the second surface of the current collector plate have a rectangular shape,
2. The method according to claim 1, wherein in the welding step, the first resin portion is welded to the edge portion of the current collector plate simultaneously on the plurality of sides of the rectangular shape.   3. The method according to claim 1, further comprising the step of forming a second resin portion covering the outer surface of the plurality of first resin portions extending in the stacking direction of the first resin portion by injection molding after the welding step. The manufacturing method of the electrical storage module as described in-.

Images