JP2019090016A - Polyamide resin composition and molding - Google Patents

Abstract

To provide a polyamide resin composition capable of forming a molding excellent in extrusion productivity.SOLUTION: The polyamide resin composition comprises (A) a polyamide, and (B) at least one compound selected from the group consisting of compounds represented by general formula (I-a), compounds represented by general formula (II-a), compounds represented by general formula (I-b), compounds represented by general formula (II-b), compounds represented by general formula (I-c), and compounds represented by general formula (II-c).SELECTED DRAWING: None

Description

  The present invention relates to a polyamide resin composition and a molded body.

  Polyamide resins are used in various industrial fields because of their excellent mechanical properties. Among these, the inorganic filler reinforced polyamide resin composition is attracting attention because of its high improvement effect on mechanical properties. In recent years, from the viewpoint of weight reduction, cost reduction and assembly process rationalization for improving fuel consumption, there is a marked movement to convert automobile parts in which conventional metals are used to glass fiber reinforced polyamide resin. With the increase in size and thickness of molded articles using polyamide resin and the complication of design, various properties are required.

  For example, Patent Document 1 discloses a polyamide resin composition comprising a polyamide resin, an inorganic filler, and a bisamide compound. This polyamide resin composition is excellent in heat resistance, electrical characteristics and dimensional characteristics, and has a low mold deposit. Further, Patent Document 2 discloses a polyamide resin composition comprising a polyamide resin, an aliphatic bisamide compound, a higher fatty acid metal salt and an inorganic filler. This polyamide resin composition has an improved plasticity variation during injection molding.

JP-A-8-199063 JP 2002-294068 A

  Although it is known to mix | blend an amide compound as a technique of the improvement effect of the plasticization at the time of shaping | molding, extrusion productivity (torque reduction of an extruder) may become inadequate. In addition, in automotive applications and industrial parts, there is an increasing demand for shape such as upsizing of molded products, and it is necessary to manufacture such a resin composition at a good, stable and high production rate. It becomes.

  This invention is made in view of the said situation, Comprising: The polyamide resin composition which can obtain the molded object which is excellent in extrusion productivity is provided.

That is, the present invention includes the following aspects.
The polyamide resin composition according to the first aspect of the present invention comprises (A) a polyamide, (B) a compound represented by the following general formula (I-a), and a compound represented by the following general formula (II-a) A compound represented by the following general formula (I-b), a compound represented by the following general formula (II-b), a compound represented by the following general formula (I-c), and a compound represented by the following general formula (II) And at least one compound selected from the group consisting of compounds represented by -c).

(In the general formula (I-a), R ^11a and R ^12a each independently represent a linear alkyl group or a linear alkenyl group having 6 to 30 carbon atoms. N ^11a , n ^12a and n ^13a are each independently Is an integer from 3 to 10. m ^11a is an integer from 0 to 2)

(In the general formula (II-a), R ^21a and R ^22a are each independently a linear alkyl group or a linear alkenyl group having 6 to 30 carbon atoms. N ^21a , n ^22a and n ^23a are each independently Is an integer of 3 to 10. m ^21a is an integer of 0 to 2).

(In the general formula (I-b), R ^11b and R ^12b are each independently a linear alkyl having 2 to 22 carbon atoms which may contain one or more at least one selected from the group consisting of a hydroxyl group and an amino group At least one of R ^11b and R ^12b contains at least one selected from the group consisting of a hydroxyl group and an amino group, and n ^11b , n ^12b and n ^13b are each independently 4 or more and 12 or more. It is an integer below, m ^{11 b} is an integer of 0 or more and 2 or less.)

(In General Formula (II-b), R ^21b and R ^22b are each independently a linear alkyl having 2 to 22 carbon atoms which may contain one or more selected from the group consisting of a hydroxyl group and a carboxy group And at least one of R ^21b and R ^22b contains one or more selected from the group consisting of a hydroxyl group and a carboxy group, n ^21b , n ^22b and n ^23b are each independently 4 or more and 12 or more. It is the following integer: m ^{21 b} is an integer of 0 or more and 2 or less.)

(In the general formula (I-c), R ^11c and R ^12c are each independently a linear alkyl having 6 to 30 carbon atoms which may contain at least one selected from the group consisting of a hydroxyl group and an amino group And n ^11c , n ^12c and n ^13c are each independently an integer of 2 or more and 10 or less, and m ^11c is an integer of 0 or more and 2 or less)

(In the general formula (II-c), R ^21c and R ^22c are each independently a chain of 6 to 30 carbon atoms which may contain one or more at least one selected from the group consisting of an amino group and a carboxy group N ^21c , n ^22c and n ^23c each independently represent an integer of 2 or more and 10 or less, and m ^21c is an integer of 0 or more and 2 or less)

  The structure in which the (A) polyamide is represented by the following general formula (III), the structure represented by the following general formula (IV), the structure represented by the following general formula (V), and the following general formula (VI) And at least one structure selected from the group consisting of the structures represented by

(In the general formula (III), n ³¹ and n ³² are each independently an integer of 4 or more and 11 or less)

(In the general formula (IV), n ⁴¹ is an integer of 4 or more and 11 or less. Ar is an arylene group.)

(In the general formula (V), n ⁵¹ is an integer of 4 or more and 11 or less. Ar is an arylene group.)

(In the general formula (VI), n ⁶¹ is an integer of 4 or more and 11 or less).

In the polyamide resin composition according to the first aspect, selected from the group consisting of the (A) wherein ^{n 31} is a number of repetitions of the methylene groups in the polyamide, it said ^{n 32,} wherein ^{n 41,} wherein ^{n 51} and the ^{n 61} at least one, wherein (B) compound wherein ^{n 11a} is a repetition number of methylene groups, wherein ^{n 12a,} the ^{n 13a,} the ^{n 21a,} the ^{n 22a,} the ^{n 23a,} the ^{n 11b} is, the ^{n 12b} And at least one selected from the group consisting of n ^13b , n ^21b , n ^22b , n ^23b , n ^11c , n ^12c , n ^13c , n ^21c , n ^22c and n ^23c The difference may be 3 or less.

In the polyamide resin composition according to the above first aspect, the following (i-a) to (iv-a), (i-b) to (iv-b), and (i-c) to (iv-c) The difference between any of the above may be 3 or less.
(Ia) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the above (A) polyamide, and the above n ^12a , the above n ^{21 a} and the above n ²³ a in the above (B) compound The difference from at least one more selected;
(Ii-a) at least one selected from the group consisting of the n ³² and the n ⁵¹ in the (A) polyamide, the n ^11a in the compound (B), the n ^12a , the n ^13a and the n ^21a , a difference from at least one selected from the group consisting of the above n ^22a and the above n ^23a ;
(Iii-a) a group consisting of the above n ⁶¹ in the above (A) polyamide, the above n ^11a in the above (B) compound, the above n ^12a , the above n ^13a , the above n ^21a , the above n ^21a , the above n ^22a and the above n ^23a The difference from at least one more selected;
(Iv-a) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^12a in the compound (B), the n ^21a and the n ^23a ;
(I-b) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the (A) polyamide, the above n ^{12 b} in the above compound (B), the above n ^{21 b} and the above n ^{23 b} The difference from at least one more selected;
(Ii-b) a group consisting of at least one selected from the group consisting of the above n ³² and the above n ⁵¹ in the above (A) polyamide, and the above n ^{11 b} , the above n ^{13 b} and the above n ^{22 b in} the above (B) compound The difference from at least one more selected;
(Iii-b) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^11b , the n ^13b and the n ^{22b in the} (B) compound;
(Iv-b) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^12b , the n ^21b and the n ^{23b in the} (B) compound;
(Ic) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the (A) polyamide, and the above n ^{21 c} , the above n ^{22 c} and the above n ^{23 c in} the above (B) compound The difference from at least one more selected;
(Ii-c) a group consisting of at least one selected from the group consisting of the above n ³² and the above n ⁵¹ in the above (A) polyamide, and the above n ^{11 c} , the above n ^{12 c} and the above n ^{13 c in} the above (B) compound The difference from at least one more selected;
(Iii-c) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^11c , the n ^12c and the n ^{13c in the} (B) compound;
(Iv-c) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^21c , the n ^22c and the n ^{23c in the} (B) compound

In the polyamide resin composition according to the first aspect, the following (i-a), (ii-a), (i-b), (ii-b), (i-c) or (ii-c) Or the difference between any of the following (iii-a), (iv-a), (iii-b), (iv-b), (iii-c) or (iv-c): May be 1 or less.
(Ia) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the above (A) polyamide, and the above n ^12a , the above n ^{21 a} and the above n ²³ a in the above (B) compound The difference from at least one more selected;
(Ii-a) at least one selected from the group consisting of the n ³² and the n ⁵¹ in the (A) polyamide, the n ^11a in the compound (B), the n ^12a , the n ^13a and the n ^21a , a difference from at least one selected from the group consisting of the above n ^22a and the above n ^23a ;
(Iii-a) a group consisting of the above n ⁶¹ in the above (A) polyamide, the above n ^11a in the above (B) compound, the above n ^12a , the above n ^13a , the above n ^21a , the above n ^21a , the above n ^22a and the above n ^23a The difference from at least one more selected;
(Iv-a) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^12a in the compound (B), the n ^21a and the n ^23a ;
(I-b) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the (A) polyamide, the above n ^{12 b} in the above compound (B), the above n ^{21 b} and the above n ^{23 b} The difference from at least one more selected;
(Ii-b) a group consisting of at least one selected from the group consisting of the above n ³² and the above n ⁵¹ in the above (A) polyamide, and the above n ^{11 b} , the above n ^{13 b} and the above n ^{22 b in} the above (B) compound The difference from at least one more selected;
(Iii-b) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^11b , the n ^13b and the n ^{22b in the} (B) compound;
(Iv-b) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^12b , the n ^21b and the n ^{23b in the} (B) compound;
(Ic) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the (A) polyamide, and the above n ^{21 c} , the above n ^{22 c} and the above n ^{23 c in} the above (B) compound The difference from at least one more selected;
(Ii-c) a group consisting of at least one selected from the group consisting of the above n ³² and the above n ⁵¹ in the above (A) polyamide, and the above n ^{11 c} , the above n ^{12 c} and the above n ^{13 c in} the above (B) compound The difference from at least one more selected;
(Iii-c) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^11c , the n ^12c and the n ^{13c in the} (B) compound;
(Iv-c) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^21c , the n ^22c and the n ^{23c in the} (B) compound

  In the polyamide resin composition according to the first aspect, the viscosity number of the (A) polyamide measured with sulfuric acid having a mass fraction of 96% according to ISO 307 may be 100 mL / g or more and 135 mL / g or less .

The polyamide resin composition according to the first aspect may further contain (C) an inorganic filler.
The (C) inorganic filler may be at least one selected from the group consisting of glass fibers, glass flakes, glass beads, carbon fibers, talc, mica, kaolin, wollastonite, calcium carbonate and potassium titanate. .
The (C) inorganic filler is at least one selected from the group consisting of glass fibers and carbon fibers, the fiber cross section is at least one selected from the group consisting of circular and elliptical, and the cross section is short The ratio of the major axis to the major axis may be 1 or more and 5 or less.

The polyamide resin composition according to the first aspect may further include (D) a copper compound.
The polyamide resin composition according to the first aspect may further contain at least one compound selected from the group consisting of (E) halides of alkali metals and halides of alkaline earth metals.
The polyamide resin composition according to the first aspect may further contain (F) a fatty acid metal salt.

  The molded object which concerns on a 2nd aspect of this invention inject-molds the polyamide resin composition which concerns on a said 1st aspect.

  According to the polyamide resin composition of the above aspect, a molded article having excellent extrusion productivity can be obtained.

  Hereinafter, modes for carrying out the present invention (hereinafter simply referred to as “the present embodiment”) will be described in detail. The following present embodiment is an example for describing the present invention, and is not intended to limit the present invention to the following contents. The present invention can be appropriately modified and implemented within the scope of the gist of the present invention.

«Polyamide resin composition»
The polyamide resin composition of this embodiment contains (A) polyamide and (B) a compound.
The compound (B) is represented by a compound represented by the following formula (I-a) (hereinafter sometimes referred to as “compound (I-a)”), a compound represented by the following formula (II-a) A compound (hereinafter sometimes referred to as “compound (II-a)”), a compound represented by the following general formula (I-b) (hereinafter sometimes referred to as “the compound (I-b)”), Compounds represented by the following general formula (II-b) (hereinafter sometimes referred to as "compound (II-b)"), compounds represented by the following general formula (I-c) (hereinafter referred to as "compound (II) It is selected from the group consisting of compounds represented by the following general formula (II-c) (hereinafter sometimes referred to as “compound (II-c)”): It is at least one compound.

In the general formula (I-a), each of R ^11a and R ^12a is independently a linear alkyl group or a linear alkenyl group having 6 to 30 carbon atoms. n ^11a , n ^12a and n ^13a are each independently an integer of 3 or more and 10 or less. m ^{11 a} is an integer of 0 or more and 2 or less.

In Formula (II-a), each of R ^21a and R ^22a is independently a linear alkyl group or a linear alkenyl group having 6 to 30 carbon atoms. n ^21a , n ^22a and n ^23a are each independently an integer of 3 or more and 10 or less. m ^{21 a} is an integer of 0 or more and 2 or less.

In the general formula (I-b), each of R ^11b and R ^12b independently represents a linear alkyl having 2 to 22 carbon atoms which may contain one or more selected from the group consisting of a hydroxyl group and an amino group. It is a group. At least one of R ^11b and R ^12b contains one or more of at least one selected from the group consisting of a hydroxyl group and an amino group. n ^{11 b} , n ^{12 b} and n ^{13 b} are each independently an integer of 4 or more and 12 or less. m ^{11 b} is an integer of 0 or more and 2 or less.

In the general formula (II-b), each of R ^21b and R ^22b independently represents a linear alkyl having 2 or more and 22 or less carbon atoms which may contain at least one selected from the group consisting of a hydroxyl group and a carboxy group. It is a group. At least one of R ^{21 b} and R ^{22 b} contains one or more of at least one selected from the group consisting of a hydroxyl group and a carboxy group. n ^{21 b} , n ^{22 b} and n ^{23 b} are each independently an integer of 4 or more and 12 or less. m ^{21 b} is an integer of 0 or more and 2 or less.

In the general formula (I-c), each of R ^11c and R ^12c independently represents one or more of at least one selected from the group consisting of a hydroxyl group and an amino group; It is a group or a chain alkenyl group. n ^11c , n ^12c and n ^13c are each independently an integer of 2 or more and 10 or less. m ^{11 c} is an integer of 0 or more and 2 or less.

In the general formula (II-c), each of R ^21c and R ^22c independently represents one or more of at least one selected from the group consisting of an amino group and a carboxy group; It is an alkyl group or a chain alkenyl group. n ^21c , n ^22c and n ^23c are each independently an integer of 2 or more and 10 or less. m ^{21 c} is an integer of 0 or more and 2 or less.

  The respective components of the polyamide resin composition of the present embodiment will be described in detail below.

<(A) Polyamide>
In general, “polyamide” means a polymer compound having an amide (—CO—NH— or —NH—CO—) bond in the main chain.

  Specific examples of the polyamide contained in the polyamide resin composition of the present embodiment include a structure represented by the following general formula (III) (hereinafter abbreviated as “structure (III)”), a general formula (IV) A structure (hereinafter abbreviated as “structure (IV)”), a structure represented by the following general formula (V) (hereinafter abbreviated as “structure (V)”), The polyamide etc. which contain at least 1 sort (s) chosen from the group which consists of a structure represented by (VI) (It abbreviates as "the structure (VI)" hereafter), etc. are mentioned.

In the general formula (III), n ³¹ and n ³² are each independently an integer of 4 or more and 11 or less.

In the general formula (IV), n ⁴¹ is an integer of 4 or more and 11 or less. Ar is an arylene group.

In the formula (V), n ⁵¹ is an integer of 4 or more and 11 or less. Ar is an arylene group.

In the general formula (VI), n ⁶¹ is an integer of 4 or more and 11 or less.

  As an arylene group, a phenylene group, a naphthylene group, an anthracenylene group, a pyrene diyl group, a fluorenediyl group etc. are mentioned, for example. Among them, the arylene group is preferably a phenylene group.

  Examples of preferable polyamides containing the structure (III) include polyamide 46 (polytetramethylene adipamide), polyamide 66 (polyhexamethylene adipamide), polyamide 610, polyamide 612 and the like.

  Examples of preferable polyamides containing the structure (IV) include polyamide 6T (polyhexamethylene terephthalamide), polyamide 9T (polynonane methylene terephthalamide), polyamide 6I (polyhexamethylene isophthalamide) and the like.

  Preferred polyamides containing the structure (V) include, for example, polyamide MXD6 (polymetaxylylene adipamide), polyamide PXD6 (polyparaxylylene adipamide), polyamide MXD10 (polymetaxylylene sebacamide), polyamide PXD10 (polymetaxylylene sebacamide) Polyparaxylylene sebacamide) and the like.

  Examples of preferable polyamides containing the structure (VI) include polyamide 4 (poly α-pyrrolidone), polyamide 6 (polycaproamide), polyamide 11 (polyundecane amide), polyamide 12 (poly dodecane amide) and the like.

  In addition, it may be a copolyamide containing at least one of these polyamides.

  The copolymerized polyamide containing the structure (III) and the structure (IV) is not particularly limited, and examples thereof include copolymers of hexamethylene adipamide and hexamethylene terephthalamide, hexamethylene adipamide and hexamethylene isophthalamide. Copolymers etc. may be mentioned.

  The copolymerized polyamide containing the structure (III) and the structure (V) is not particularly limited, and examples thereof include a copolymer of hexamethylene adipamide and metaxylylene adipamide.

  The copolymerized polyamide containing the structure (III) and the structure (VI) is not particularly limited, and examples thereof include a copolymer of hexamethylene adipamide and caproamide, and the like.

  The copolymerized polyamide containing two structures (IV) is not particularly limited, and examples thereof include copolymers of hexamethylene terephthalamide and 2-methylpentanediamine terephthalamide.

  Among them, as the polyamide contained in the polyamide resin composition of the present embodiment, polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 6T, polyamide 6I, polyamide 9T, or copoly containing at least one of these polyamides It is preferably a polymeric polyamide. In addition, polyamide 66 is more preferable because the creep properties of a molded article obtained using the polyamide resin composition of the present embodiment are improved.

[Production method of polyamide]
The method for producing the polyamide contained in the polyamide resin composition of the present embodiment is not particularly limited. For example, a method for ring-opening polymerization of lactam, a method for self-condensing ω-aminocarboxylic acid, condensation of diamine and dicarboxylic acid And the like. The polyamide resin composition of the present embodiment may contain one type of polyamide obtained by these methods, or may contain two or more types in combination.

The lactam is not particularly limited, and examples thereof include pyrrolidone, caprolactam, undecalactam, dodecalactam and the like.
The ω-aminocarboxylic acid is not particularly limited, and examples thereof include ω-amino fatty acid which is a ring-opening compound of the lactam exemplified above with water, and the like.
The lactam or the ω-aminocarboxylic acid may be condensed either singly or in combination of two or more.

The diamine is not particularly limited, and examples thereof include linear aliphatic diamines, branched aliphatic diamines, cyclic aliphatic diamines, and aromatic diamines.
The linear aliphatic diamine is not particularly limited, and examples thereof include hexamethylene diamine, pentamethylene diamine and the like.
The branched aliphatic diamine is not particularly limited, and examples thereof include 2-methylpentanediamine, 2-ethylhexamethylenediamine and the like.
The cyclic aliphatic diamine is not particularly limited, and examples thereof include cyclohexane diamine, cyclopentane diamine, cyclooctane diamine and the like.
The aromatic diamine is not particularly limited, and examples thereof include p-xylylenediamine, m-xylylenediamine and the like.

The dicarboxylic acid is not particularly limited, and examples thereof include linear or cyclic aliphatic dicarboxylic acids and aromatic dicarboxylic acids.
The linear aliphatic dicarboxylic acid is not particularly limited, and examples thereof include adipic acid, pimelic acid, sebacic acid and the like.
The cyclic aliphatic dicarboxylic acid is not particularly limited, and examples thereof include cyclohexane dicarboxylic acid and the like.
The aromatic dicarboxylic acid is not particularly limited, and examples thereof include phthalic acid and isophthalic acid.

  The diamine and the dicarboxylic acid may be condensed alone or in combination of two or more.

  Moreover, it does not specifically limit as a polymerization method of polyamide, For example, melt polymerization, interfacial polymerization, solution polymerization, bulk polymerization, solid phase polymerization, and the method etc. which combined these etc. can be utilized.

[Polyamide viscosity number]
The degree of polymerization of the polyamide is not particularly limited. However, when an inorganic filler or the like is blended, the viscosity number measured using 96% sulfuric acid according to ISO 307 is 100 mL / h because the injection molding processability is more excellent. It is preferable that it is more than g and 135 mL / g or less.

<(B) Compound>
The compound (B) contained in the polyamide resin composition of the present embodiment is a compound (I-a), a compound (II-a), a compound (I-b), a compound (II-b), a compound (I-c) And at least one compound selected from the group consisting of compounds (II-c).

When the compound (B) is the compound (I-a) or the compound (II-a), the impact resistance is particularly excellent.
When the compound (B) is a compound (I-b) or a compound (II-b), it is particularly excellent in heat aging resistance, creep characteristics and appearance.
When the compound (B) is the compound (Ic) or the compound (II-c), the plasticization time stability at the time of molding and the reduction of the amount of generated chips are particularly excellent.

[Compound (I-a) and Compound (II-a)]
The compound (I-a) is represented by the following general formula (I-a).
The compound (I-b) is represented by the following general formula (I-b).

In the general formula (I-a), each of R ^11a and R ^12a is independently a linear alkyl group or a linear alkenyl group having 6 to 30 carbon atoms. n ^11a , n ^12a and n ^13a are each independently an integer of 3 or more and 10 or less. m ^{11 a} is an integer of 0 or more and 2 or less.

In Formula (II-a), each of R ^21a and R ^22a is independently a linear alkyl group or a linear alkenyl group having 6 to 30 carbon atoms. n ^21a , n ^22a and n ^23a are each independently an integer of 3 or more and 10 or less. m ^{21 a} is an integer of 0 or more and 2 or less.

(R ^11a and R ^12a )
R ^11a and R ^12a are each independently a chained alkyl group or a chained alkenyl group having 6 to 30 carbon atoms. R ^11a and R ^12a may be the same or different. Among them, R ^11a and R ^12a are preferably identical because they are easy to synthesize.

Examples of the linear alkyl group having 6 to 30 carbon atoms in R ^11a and R ^12a include, for example, a linear alkyl group having 6 to 30 carbon atoms and a branched alkyl group having 6 to 30 carbon atoms. .

  Examples of the linear alkyl group having 6 to 30 carbon atoms include n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group Group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, n-icosyl group, n-henycosyl group, n-docosyl group Groups, n-tricosyl group, n-tetracosyl group, n-pentacosyl group, n-hexacosyl group, n-heptacosyl group, n-octacosyl group, n-nonacosyl group, n-triaconcyl group and the like.

  The branched alkyl group having 6 to 30 carbon atoms is, for example, isohexyl group, sec-hexyl group, tert-hexyl group, isoheptyl group, sec-heptyl group, tert-heptyl group, isooctyl group, sec-octyl group , Tert-octyl group, isononyl group, sec-nonyl group, tert-nonyl group, isodecyl group, sec-decyl group, tert-decyl group, isoundecyl group, sec-undecyl group, tert-undecyl group, isolauryl group, sec- Lauryl group, tert-lauryl group, isotridecyl group, sec-tridecyl group, tert-tridecyl group, isotetradecyl group, sec-tetradecyl group, tert-tetradecyl group, isopentadecyl group, sec-pentadecyl group, tert-pentadecyl group , Iso Ethyl group, isohexadecyl group, sec-hexadecyl group, tert-hexadecyl group, isoheptadecyl group, sec-heptadecyl group, tert-heptadecyl group, isostearyl group, isononadecyl group, sec-nonadecyl group, tert-nonadecyl group, isoicosyl group , Sec-icosyl group, tert-icosyl group, isohenicosyl group, sec-henicocyl group, tert-henicosyl group, isodocosyl group, sec-docosyl group, tert-docosyl group, tert-docosyl group, isotricosyl group, sec-tricosyl group, tert-tricosyl group, Isotetracosyl group, sec-tetracosyl group, tert-tetracosyl group, isopentacosyl group, sec-pentacosyl group, tert-pentacosyl group, isohexacosyl group, sec-hexacosyl group, ert-hexacosyl, isoheptacosyl, sec-heptacosyl, tert-heptacosyl, isooctacosyl, sec-octacosyl, sec-octacosyl, tert-octacosyl, isononacosyl, sec-nonacosyl, tert-nonacosyl, isotriacontyl, isotriacontyl A sec- tria contyl group, a tert- tria contyl group etc. are mentioned.

Examples of the chain alkenyl group having 6 to 30 carbon atoms in R ^11a and R ^12a include, for example, a linear alkenyl group having 6 to 30 carbon atoms and a branched alkenyl group having 6 to 30 carbon atoms. .

  Examples of the linear alkenyl group having 6 to 30 carbon atoms include n-hexenyl group, n-heptenyl group, n-octenyl group, n-nonenyl group, n-decenyl group, n-undecenyl group, n-dodecenyl group Group, n-tridecenyl group, n-tetradecenyl group, n-pentadecenyl group, n-hexadecenyl group, n-heptadecenyl group, n-oleyl group, n-nonadecenyl group, n-icosenyl group, n-henicosenyl group, n-docosenyl group Groups, n-tricocenyl group, n-tetracocenyl group, n-pentacocenyl group, n-hexacocenyl group, n-heptacosenyl group, n-octacocenyl group, n-nonacosenyl group, n-triacontenyl group and the like.

  The branched alkenyl group having 6 to 30 carbon atoms is, for example, isohexenyl group, sec-hexenyl group, tert-hexenyl group, isoheptenyl group, sec-heptenyl group, tert-heptenyl group, isooctenyl group, sec-octenyl Group, tert-octenyl group, isononenyl group, sec-nonenyl group, tert-nonenyl group, isodecenyl group, sec-decenyl group, t-decenyl group, isoundecenyl group, sec-undecenyl group, tert-undecenyl group, isododecenyl group, sec -Dodecenyl group, tert-dodecenyl group, isotridecenyl group, sec-tridecenyl group, tert-tridecenyl group, isotetradecenyl group, sec-tetradecenyl group, tert-tetradecenyl group, isopentadecenyl group, s c-Pentadecenyl group, tert-pentadecenyl group, isohexadecenyl group, sec-hexadecenyl group, tert-hexadecenyl group, isoheptadecenyl group, sec-heptadecenyl group, tert-heptadecenyl group, isooleoyl group, sec-oleyl Group, tert-oleyl group, isononadecenyl group, sec-nonadecenyl group, tert-nonadecenyl group, isoeicosenyl group, sec-eicosenyl group, tert-eicosenyl group, isohenicosenyl group, sec-henicosenyl group, tert-henicosenyl group, Isodococenyl group, sec-dococenyl group, tert-dococenyl group, isotrichocenyl group, sec-tricosecenyl group, tert-tricosecenyl group, isotetracocenyl group, sec-tetracocenyl group, ter -Tetracocenyl group, isopentacocenyl group, sec-pentacocenyl group, tert-pentacocenyl group, isohexacocenyl group, sec-hexacocenyl group, tert-hexacocenyl group, tert-hexacocenyl group, isoheptacosenyl group, sec-heptacosenyl group, tert-heptacosenyl group Group, isooctacosenyl group, sec-octacosenyl group, tert-octacosenyl group, isononacosenyl group, sec-nonacosenyl group, tert-nonacosenyl group, isotriacontenyl group, sec-triacontenyl group, tert-triacontenyl group Etc.

Among them, from the viewpoint of heat resistance, each of R ^11a and R ^12a is preferably a linear alkyl group having 12 to 30 carbon atoms or a linear alkenyl group, and a linear alkyl group having 15 to 30 carbon atoms or It is more preferable that it is a chain alkenyl group.

(R ^21a and R ^22a )
R ^21a and R ^22a are each independently a chained alkyl group or a chained alkenyl group having 6 to 30 carbon atoms. R ^21a and R ^22a may be the same or different. Among them, R ^21a and R ^22a are preferably identical because they are easy to synthesize.

Examples of the chained alkyl group or chained alkenyl group having 6 to 30 carbon atoms in R ^21a and R ^22a include the same ones as exemplified for R ^11a and R ^12a described above.

Among them, from the viewpoint of heat resistance, each of R ^21a and R ^22a is preferably a linear alkyl group having 12 to 30 carbon atoms or a linear alkenyl group, and a linear alkyl group having 15 to 30 carbon atoms or It is more preferable that it is a chain alkenyl group.

( ^N11a , ^n12a , ^n13a , ^n21a , ^n22a and ^n23a )
^n11a , ^n12a , ^n13a , ^n21a , ^n22a and ^n23a are the number of repetition of methylene groups. n ^11a , n ^12a , n ^13a , n ^21a , n ^22a and n ^23a are each an integer of 3 or more and 10 or less.

In addition, at least one member selected from the group consisting of n ³¹ , n ³² , n ⁴¹ , n ⁵¹ and n ⁶¹ , which is the repeating number of the methylene group in the above-mentioned (A) polyamide, a compound (I-a) and a compound It is preferable that the difference between the repeating number of methylene groups in II-a) and at least one selected from the group consisting of n ^11a , n ^12a , n ^13a , n ^21a , n ^22a and n ^23a is 3 or less, It is more preferably 2 or less, still more preferably 1 or less, and particularly preferably 0. When the difference is less than or equal to the above upper limit, the compatibility between the (A) polyamide and the (B) compound becomes higher, and the impact resistance and the viscosity reduction effect at the time of melting become higher.

For example, in the case where the polyamide resin composition of the present embodiment contains a polyamide obtained from a diamine and a dicarboxylic acid (a polyamide having a structure (III)) and the compound (I-a), n ³¹ and n ^{11a combination,} a combination of ^{n 31} and ^{n 12a,} a combination of ^{n 31} and ^{n 13a,} a combination of a combination of ^{n 32} and ^{n 11a, n 32} and ^{n 12a,} and ^may be a combination of ^{n 32} and ^{n 13a.}

For example, in the case where the polyamide resin composition of the present embodiment includes a polyamide obtained from a diamine and a dicarboxylic acid (a polyamide having a structure (III)) and the compound (II-a), the composition of n ³¹ and n ²¹ a ^combination, a combination of ^{n 31} and ^{n 22a,} a combination of a combination of ^{n 31} and ^{n 23a,} a combination of ^{n 32} and ^{n 21a, n 32} and ^{n 22a,} and ^may be a combination of ^{n 32} and ^{n 23a.}

For example, when the polyamide resin composition of the present embodiment contains a polyamide obtained from a lactam or an ω-aminocarboxylic acid (a polyamide having a structure (VI)) and the compound (I-a), n ⁶¹ and n the combination of ^11a, a combination of ^{n 61} and ^{n 12a,} and ^may be a combination of ^{n 61} and ^{n 13a.}

For example, when the polyamide resin composition of the present embodiment contains a polyamide obtained from a lactam or an ω-aminocarboxylic acid (a polyamide having a structure (VI)) and the compound (II-a), n ⁶¹ and n the combination of ^21a, a combination of ^{n 61} and ^{n 22a,} and ^may be a combination of ^{n 61} and ^{n 23a.}

For example, the polyamide resin composition of this embodiment is a copolymer of polyamide obtained from diamine and dicarboxylic acid (polyamide having structure (III)) and polyamide obtained from lactam (polyamide having structure (VI)) When the polyamide and the compound (I-a) are contained, a combination of n ³¹ and n ^11a, a combination of n ³¹ and n ^12a, a combination of n ³¹ and n ^13a, a combination of n ³² and n ^11a , n ³² and There may be a combination of n ^12a, a combination of n ³² and n ^13a, a combination of n ⁶¹ and n ^11a, a combination of n ⁶¹ and n ^{12a, and} a combination of n ⁶¹ and n ^13a .

For example, when the polyamide resin composition of the present embodiment contains two or more types of polyamides or two or more types of (B) compounds, n ³¹ , n ³² , n ⁴¹ , n ⁵¹ and n ⁶¹ and n ^{11 a} , N ^12a , n ^13a , n ^21a , n ^22a and n ^23a may have a plurality of combinations.

Especially, it is preferable that the difference in any one of the following (ia)-(iv-a) is the said range. Further, it is particularly preferable that the difference between (i-a) or (ii-a) is 0, or the difference between (iii-a) or (iv-a) is 1 or less.
(Ia) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the above (A) polyamide, and the above n ^12a , the above n ^{21 a} and the above n ²³ a in the above (B) compound The difference from at least one more selected;
(Ii-a) at least one selected from the group consisting of the n ³² and the n ⁵¹ in the (A) polyamide, the n ^11a in the compound (B), the n ^12a , the n ^13a and the n ^21a , a difference from at least one selected from the group consisting of the above n ^22a and the above n ^23a ;
(Iii-a) a group consisting of the above n ⁶¹ in the above (A) polyamide, the above n ^11a in the above (B) compound, the above n ^12a , the above n ^13a , the above n ^21a , the above n ^21a , the above n ^22a and the above n ^23a The difference from at least one more selected;
(Iv-a) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^12a in the compound (B), the n ^21a and the n ^23a

(M ^11a and m ^21a )
m ^11a and m ^21a are the repeat number of the unit in parentheses. m ^{11 a} and m ^{21 a} are each an integer of 0 or more and 2 or less. Among them, m ^11a and m ^21a are each preferably 0, because they are easy to synthesize and have good compatibility with polyamide.

Preferred examples of the compound (I-a) include hexamethylenebisstearic acid amide, hexamethylenebisbehenic acid amide, heptamethylenebisbehenic acid amide and the like.
As preferable compounds (II-a), for example, N, N′-distearyl adipamide, N, N′-dibehenyl adipamide, N, N′-dilauryl adipamide, N, N Examples thereof include '-dioleyl adipic acid amide, N, N'-distearyl sebacic acid amide, N, N'-didodecyl adipic acid amide, and N, N'-dihexyl adipic acid amide.
In addition, these compounds are only an example of preferable compound (Ia) and compound (II-a), and preferable compound (Ia) and compound (II-a) are not limited to these.

Among them, hexamethylene bis-stearic acid amide is preferable as the compound (I-a).
Among them, as the compound (II-a), N, N′-distearyl adipic acid amide or N, N′-distearyl sebacic acid amide is preferable.

(Method for Producing Compound (I-a) and Compound (II-a))
When the (B) compound contained in the polyamide resin composition of the present embodiment is, for example, the compound (I-a), a diamine, a saturated fatty acid having 6 to 30 carbon atoms, or a non-linear having 6 to 30 carbon atoms It can be produced by condensation reaction with a saturated fatty acid.

  Examples of the diamine include trimethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decamethylenediamine and the like. These diamines may be used alone or in combination of two or more.

  Examples of the saturated fatty acid having 6 to 30 carbon atoms include caproic acid, enanthate, caprylic acid, pelargonic acid, capric acid, caprylic acid, lauric acid, tridecylic acid, myristic acid, pentadecylic acid, palmitic acid, margaric acid, stearic acid Nonadecylic acid, arachidic acid, henicosic acid, behenic acid, tricosylic acid, lignoceric acid, serotic acid, montanic acid, melisic acid and the like.

  The unsaturated fatty acid having 6 to 30 carbon atoms may be a fatty acid having one unsaturated bond, and specifically, for example, myristoleic acid, palmitoleic acid, sabienic acid, oleic acid, elaidic acid, There may be mentioned vaccenic acid, gadeuric acid, eicosenic acid, erucic acid, nervonic acid and the like.

  Among them, the unsaturated fatty acid having 6 to 30 carbon atoms is preferably an unsaturated fatty acid having 12 to 30 carbon atoms, from the viewpoint of the heat resistance of the compound (B), and is unsaturated having 15 to 30 carbon atoms. It is more preferable that it is a saturated fatty acid.

  For example, when the compound (B) is a compound (II-a), it is produced by condensation reaction of a dicarboxylic acid and an alkylamine having 6 to 30 carbon atoms or an alkenylamine having 6 to 30 carbon atoms. can do.

  Examples of the dicarboxylic acids include glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid and the like. These dicarboxylic acids may be used alone or in combination of two or more.

The chain alkyl group having 6 to 30 carbon atoms and the chain alkenyl group having 6 to 30 carbon atoms, which are contained in the alkyl amine having 6 to 30 carbon atoms and the alkenyl amine having 6 to 30 carbon atoms As the same, the same as those exemplified for the above-mentioned R ¹¹ and R ¹² can be mentioned. Among them, from the viewpoint of the heat resistance of the compound (B), an amine having a linear alkyl group or linear alkenyl group having 12 to 30 carbon atoms is preferable, and a linear alkyl group having 15 to 30 carbon atoms or It is more preferable that it is an amine having a chain alkenyl group.

[Compound (I-b) and Compound (II-b)]
The compound (I-b) is represented by the following general formula (I-b).
The compound (II-b) is represented by the following general formula (II-b).

In the general formula (I-b), each of R ^11b and R ^12b independently represents a linear alkyl having 2 to 22 carbon atoms which may contain one or more selected from the group consisting of a hydroxyl group and an amino group. It is a group. At least one of R ^11b and R ^12b contains one or more of at least one selected from the group consisting of a hydroxyl group and an amino group. n ^{11 b} , n ^{12 b} and n ^{13 b} are each independently an integer of 4 or more and 12 or less. m ^{11 b} is an integer of 0 or more and 2 or less.

In the general formula (II-b), each of R ^21b and R ^22b independently represents a linear alkyl having 2 or more and 22 or less carbon atoms which may contain at least one selected from the group consisting of a hydroxyl group and a carboxy group. It is a group. At least one of R ^{21 b} and R ^{22 b} contains one or more of at least one selected from the group consisting of a hydroxyl group and a carboxy group. n ^{21 b} , n ^{22 b} and n ^{23 b} are each independently an integer of 4 or more and 12 or less. m ^{21 b} is an integer of 0 or more and 2 or less.

(R ^{11 b} and R ^{12 b} )
R ^{11 b} and R ^{12 b} are each independently a chained alkyl group having 2 to 22 carbon atoms which may contain one or more of at least one selected from the group consisting of a hydroxyl group and an amino group. At least one of R ^11b and R ^12b contains one or more of at least one selected from the group consisting of a hydroxyl group and an amino group. R ^11b and R ^12b may be the same or different. Among them, R ^11b and R ^12b are preferably identical because they are easy to synthesize.

As a chain alkyl group having 2 to 22 carbon atoms which does not contain at least one selected from the group consisting of a hydroxyl group and an amino group in R ^{11 b} and R ^{12 b} , for example, a linear alkyl group having 2 to 22 carbon atoms And a branched alkyl group having 3 to 22 carbon atoms.

  Examples of the linear alkyl group having 2 to 22 carbon atoms include an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group and an n-octyl group n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, n-icosyl group, n-henicosyl group, n-docosyl group etc. are mentioned.

  As a branched alkyl group having 3 to 22 carbon atoms, for example, isopropyl group, isobutyl group, sec-butyl group, tert-butyl group, isopentyl group, sec-pentyl group, 3-pentyl group, tert-pentyl group , Isohexyl group, sec-hexyl group, tert-hexyl group, isoheptyl group, sec-heptyl group, tert-heptyl group, isooctyl group, sec-octyl group, tert-octyl group, isononyl group, sec-nonyl group, tert- Nonyl, isodecyl, sec-decyl, tert-decyl, isoundecyl, sec-undecyl, tert-undecyl, isolauryl, sec-lauryl, tert-lauryl, isotridecyl, sec-tridecyl, tert-tridecyl group, i Tetradecyl group, sec-tetradecyl group, tert-tetradecyl group, isopentadecyl group, sec-pentadecyl group, tert-pentadecyl group, isocetyl group, isohexadecyl group, sec-hexadecyl group, tert-hexadecyl group, isoheptadecyl group, sec -Heptadecyl group, tert-heptadecyl group, isostearyl group, isononadecyl group, sec-nonadecyl group, tert-nonadecyl group, tert-nonadecyl group, isoicosyl group, sec-icosyl group, tert-icosyl group, isohenicosyl group, sec-henicosyl group, tert-henicosyl group Groups, isodocosyl groups, sec-docosyl groups, tert-docosyl groups and the like.

The chain alkyl group having 2 to 22 carbon atoms containing at least one selected from the group consisting of a hydroxyl group and an amino group in R ^11b and R ^12b is at least one selected from the group consisting of a hydroxyl group and an amino group described above And those in which at least one hydrogen atom of a linear alkyl group having 2 to 22 carbon atoms which does not contain is substituted by at least one selected from the group consisting of a hydroxyl group and an amino group are mentioned.

  In addition, as described above, a hydroxyl group and an amino group are substituents in a hydrocarbon group. Among them, as a substituent, it is preferable to include a hydroxyl group. By containing a hydroxyl group, a hydrogen bond can be formed with an amide bond in the polyamide. Thereby, it is possible to further improve the physical properties (heat aging resistance, creep characteristics and appearance of the formed body) in the formed body using the polyamide resin composition of the present embodiment.

The chain alkyl group having 2 to 22 carbon atoms containing at least one selected from the group consisting of a hydroxyl group and an amino group in R ^11b and R ^12b is at least one selected from the group consisting of a hydroxyl group and an amino group as a substituent. One species may be included, or two or more species may be included.

Among them, each of R ^11b and R ^12b is preferably a linear alkyl group having 2 to 22 carbon atoms including a hydroxyl group.

Specifically, preferable examples of R ^11b and R ^12b include a group represented by the following general formula (VII) (hereinafter sometimes abbreviated as “group (VII)”) or the following general formula (VIII) Groups (hereinafter sometimes abbreviated as "group (VIII)") and the like can be mentioned.

In the general formula (VII), n ⁷¹ and n ⁷² are each independently an integer of 0 or more and 10 or less. Asterisks indicate binding sites.

In the general formula (VIII), n ⁸¹ is an integer of 0 or more and 10 or less. Asterisks indicate binding sites.

(N ⁷¹ , n ⁷² and n ⁸¹ )
n ⁷¹ , n ⁷² and n ⁸¹ are each independently an integer of 0 or more and 10 or less. Also, n ⁷¹ and n ⁷² may be the same or different. n ⁷¹ , n ⁷² and n ⁸¹ each independently are preferably an integer of 1 or more and 8 or less, more preferably an integer of 1 or more and 5 or less. When n ⁷¹ , n ⁷² and n ⁸¹ are in the above ranges, hydrogen bonds with amide bonds in the polyamide are easily formed, and physical properties (heat resistance aging resistance) in a molded article using the polyamide resin composition of the present embodiment Creep properties and appearance of the molded body can be further improved.

(R ^{21 b} and R ^{22 b} )
R ^{21 b} and R ^{22 b} are each independently, and R ^{21 b} and R ^{22 b} are each independently a linear alkyl having 2 or more and 22 or less carbon atoms that may contain at least one selected from the group consisting of a hydroxyl group and a carboxy group. It is a group. At least one of R ^{21 b} and R ^{22 b} contains one or more of at least one selected from the group consisting of a hydroxyl group and a carboxy group. R ^21b and R ^22b may be the same or different. Among them, R ^21b and R ^22b are preferably identical because they are easy to synthesize.

The chain alkyl group having 2 to 22 carbon atoms which does not contain at least one selected from the group consisting of a hydroxyl group and a carboxy group in R ^{21 b} and R ^{22 b} is the same as those exemplified for R ^{11 b} and R ^{12 b} above. The ones of

Examples of the chain alkyl group having 2 to 22 carbon atoms containing at least one selected from the group consisting of a hydroxyl group and a carboxy group in R ^{21 b} and R ^{22 b} are the same as those exemplified for R ^{11 b} and R ^{12 b} above. The thing is mentioned.

  In addition, as described above, a hydroxyl group and a carboxy group are substituents in a hydrocarbon group. Among them, as a substituent, it is preferable to include a hydroxyl group. By containing a hydroxyl group, a hydrogen bond can be formed with an amide bond in the polyamide. Thereby, it is possible to further improve the physical properties (heat aging resistance, creep characteristics and appearance of the formed body) in the formed body using the polyamide resin composition of the present embodiment.

The chain alkyl group having 2 to 22 carbon atoms containing at least one selected from the group consisting of a hydroxyl group and a carboxy group in R ^{21 b} and R ^{22 b} is at least one selected from the group consisting of a hydroxyl group and a carboxy group as a substituent. One species may be included, or two or more species may be included.

Among them, each of R ^{21 b} and R ^{22 b} is preferably a linear alkyl group having 2 to 22 carbon atoms including a hydroxyl group.

Specific examples of preferable R ^21b and R ^22b include the group (VII) and the group (VIII).

( ^N11b , ^n12b , ^n13b , ^n21b , ^n22b and ^n23b )
n ^{11 b} , n ^{12 b} , n ^{13 b} , n ^{21 b} , n ^{22 b} and n ^{23 b} are the number of repetition of methylene groups. n ^{11 b} , n ^{12 b} , n ^{13 b} , n ^{21 b} , n ^{22 b} and n ^{23 b} are each independently an integer of 4 or more and 12 or less.

In addition, at least one member selected from the group consisting of n ³¹ , n ³² , n ⁴¹ , n ⁵¹ and n ⁶¹ , which is the repeating number of methylene groups in the above-mentioned (A) polyamide, a compound (I-b) and a compound ((b) The difference between the repeating number of methylene groups in II-b) and at least one selected from the group consisting of n ^{11 b} , n ^{12 b} , n ^{13 b} , n ^{21 b} , n ^{22 b} and n ^{23 b} is preferably 3 or less, It is more preferably 2 or less, still more preferably 1 or less, and particularly preferably 0. When the difference is less than or equal to the above upper limit, the compatibility between the (A) polyamide and the (B) compound becomes higher, and the impact resistance and the viscosity reduction effect at the time of melting become higher.

For example, in the case where the polyamide resin composition of the present embodiment contains a polyamide obtained from a diamine and a dicarboxylic acid (a polyamide having a structure (III)) and the compound (I-b), n ³¹ and n ^{11b combination,} the combination of ^{n 31} and ^{n 12b,} a combination of ^{n 31} and ^{n 13b,} the combination of the combination of ^{n 32} and ^{n 11b, n 32} and ^{n 12b,} and ^may be a combination of ^{n 32} and ^{n 13b.}

For example, in the case where the polyamide resin composition of the present embodiment contains a polyamide obtained from a diamine and a dicarboxylic acid (polyamide having a structure (III)) and the compound (II-b), n ³¹ and n ^{21 b} There may be combinations, combinations of n ³¹ and n ^{22 b} , combinations of n ³¹ and n ^{23 b} , combinations of n ³² and n ^{21 b} , combinations of n ³² and n ^{22 b} , and combinations of n ³² and n ^{23 b} .

For example, when the polyamide resin composition of the present embodiment contains a polyamide obtained from a lactam or an ω-aminocarboxylic acid (a polyamide having a structure (VI)) and the compound (I-b), n ⁶¹ and n There may be a combination of ^{11 b,} a combination of n ⁶¹ and n ^{12 b, and} a combination of n ⁶¹ and n ^{13 b} .

For example, when the polyamide resin composition of the present embodiment contains a polyamide obtained from a lactam or an ω-aminocarboxylic acid (a polyamide having a structure (VI)) and the compound (II-b), n ⁶¹ and n the combination of ^21b, a combination of ^{n 61} and ^{n 22b,} and ^may be a combination of ^{n 61} and ^{n 23b.}

For example, the polyamide resin composition of this embodiment is a copolymer of polyamide obtained from diamine and dicarboxylic acid (polyamide having structure (III)) and polyamide obtained from lactam (polyamide having structure (VI)) When the polyamide and the compound (I-b) are contained, a combination of n ³¹ and n ^{11 b,} a combination of n ³¹ and n ^{12 b,} a combination of n ³¹ and n ^{13 b,} a combination of n ³² and n ^{11 b} , n ³² and There may be a combination of n ^12b, a combination of n ³² and n ^13b, a combination of n ⁶¹ and n ^11b, a combination of n ⁶¹ and n ^{12b, and} a combination of n ⁶¹ and n ^13b .

For example, when the polyamide resin composition of the present embodiment contains two or more types of polyamides or two or more types of (B) compounds, n ³¹ , n ³² , n ⁴¹ , n ⁵¹ and n ⁶¹ and n ^{11 b} , N ^12b , n ^13b , n ^21b , n ^22b and n ^23b may be a plurality of combinations.

Especially, it is preferable that the difference in any one of the following (i-b)-(iv-b) is the said range. Moreover, it is especially preferable that the difference of (ib) or (ii-b) is 0, or the difference of (iii-b) or (iv-b) is 1 or less.
(I-b) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the (A) polyamide, the above n ^{12 b} in the above compound (B), the above n ^{21 b} and the above n ^{23 b} The difference from at least one more selected;
(Ii-b) a group consisting of at least one selected from the group consisting of the above n ³² and the above n ⁵¹ in the above (A) polyamide, and the above n ^{11 b} , the above n ^{13 b} and the above n ^{22 b in} the above (B) compound The difference from at least one more selected;
(Iii-b) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^11b , the n ^13b and the n ^{22b in the} (B) compound;
And (iv-b) wherein ^{n 61} of the (A) polyamide, (B) the said ^{n 12b} in the compound, at least one of the differences is selected from the group consisting of the ^{n 21b} and the ^{n 23b}

(M ^{11 b} and m ^{21 b} )
m ^{11 b} and m ^{21 b} are the repeat number of the unit in parentheses. m ^{11 b} and m ^{21 b} are each an integer of 0 or more and 2 or less. Among them, m ^{11 b} and m ^{21 b} are each preferably 0, because they are easy to synthesize and have good compatibility with polyamide.

Preferred examples of the compound (I-b) include N, N′-butylenebis-11-hydroxyarachidonamide, N, N′-hexamethylenebis-11-hydroxyarachidonamide, and N, N′-tetra Methylenebis (3-hydroxy) propionic acid amide, N, N'-hexamethylenebis (3-hydroxy) propionic acid amide, N, N'-butylenebis-8-hydroxycapric acid amide, N, N'-hexamethylene bis -8-hydroxycapric acid amide, N, N'-butylenebis-10-hydroxy lauric acid amide, N, N'-hexamethylene bis-10-hydroxy lauric acid amide, N, N'-hexamethylene bis-8-hydroxy Capric acid amide, N, N'-butylene bis-10-hydroxy lauric acid amide, N, N'-hexene Methylene bis-10-hydroxy lauric acid amide, N, N'-butylene bis-11-hydroxy myritic acid amide, N, N'-hexamethylene bis-11-hydroxy myriistic acid amide, N, N'-butylene bis-16-hydroxypalmitin Acid amide, N, N'-hexamethylene bis-16-hydroxypalmitic acid amide, N, N'-butylene bis-12-hydroxystearic acid amide, N, N'-hexamethylene bis-12-hydroxystearic acid amide, N , N'-butylenebis-2-hydroxyarachidic acid amide, N, N'-hexamethylenebis-2-hydroxyarachidic acid amide, N, N'-butylenebis-2-hydroxybehenic acid amide, N, N'- Hexamethylene bis-2-hydroxybehenic acid amide, N, N'-butylene 2-hydroxy lignoceric acid amide, N, N'-hexamethylene bis-2-hydroxy lignoceric acid amide, N, N'-butylene bis-12-hydroxy oleic acid amide, N, N'-hexamethylene bis- 12-hydroxy oleic acid amide, N, N'-butylene bis-11-hydroxy linoleic acid amide, N, N'-hexamethylene bis-11-hydroxy linoleic acid amide etc. are mentioned.
Preferred examples of the compound (II-b) include N, N′-bis (2-hydroxyethyl) succinic acid amide and N, N′-bis (2-hydroxyethyl) adipic acid amide.
In addition, these compounds are only an example of preferable compound (Ib) and compound (II-b), and preferable compound (Ib) and compound (II-b) are not limited to these.

(Method for Producing Compound (I-b) and Compound (II-b))
The compound (I-b) and the compound (II-b) contained in the polyamide resin composition of the present embodiment are, for example, a method of reacting a hydroxyalkylamine with a dibasic acid, a hydroxyalkylamine and a dibasic acid ester By reacting the hydroxycarboxylic acid with the diamine, by reacting the lactone with the diamine, by reacting the aminocarboxylic acid with the dibasic acid, by reacting the aminocarboxylic acid with the diamine, etc. It can be manufactured.

[Compound (I-c) and Compound (II-c)]
The compound (I-c) is represented by the following general formula (I-c).
The compound (II-c) is represented by the following general formula (II-c).

In the general formula (I-c), each of R ^11c and R ^12c independently represents one or more of at least one selected from the group consisting of a hydroxyl group and an amino group; It is a group or a chain alkenyl group. n ^11c , n ^12c and n ^13c are each independently an integer of 2 or more and 10 or less. m ^{11 c} is an integer of 0 or more and 2 or less.

In the general formula (II-c), each of R ^21c and R ^22c independently represents one or more of at least one selected from the group consisting of an amino group and a carboxy group; It is an alkyl group or a chain alkenyl group. n ^21c , n ^22c and n ^23c are each independently an integer of 2 or more and 10 or less. m ^{21 c} is an integer of 0 or more and 2 or less.

(R ^11c and R ^12c )
Each of R ^11c and R ^12c independently represents a linear alkyl group having 6 to 30 carbon atoms or a linear alkenyl group which may contain one or more of at least one selected from the group consisting of a hydroxyl group and an amino group. R ^11c and R ^12c may be the same or different. Among them, R ^11c and R ^12c are preferably identical because they are easy to synthesize.

The R ^11c and at least one of one or more 30 6 or more carbon atoms that does not contain the following chain alkyl group selected from the group consisting of hydroxyl group and amino group in R ^12c, for example, a straight chain having 6 to 30 carbon atoms Cyclic alkyl groups, branched alkyl groups having 6 to 30 carbon atoms can be mentioned.

  Examples of the linear alkyl group having 6 to 30 carbon atoms include n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group Group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, n-icosyl group, n-henycosyl group, n-docosyl group Groups, n-tricosyl group, n-tetracosyl group, n-pentacosyl group, n-hexacosyl group, n-heptacosyl group, n-octacosyl group, n-nonacosyl group, n-triaconcyl group and the like.

  The branched alkyl group having 6 to 30 carbon atoms is, for example, isohexyl group, sec-hexyl group, tert-hexyl group, isoheptyl group, sec-heptyl group, tert-heptyl group, isooctyl group, sec-octyl group , Tert-octyl group, isononyl group, sec-nonyl group, tert-nonyl group, isodecyl group, sec-decyl group, tert-decyl group, isoundecyl group, sec-undecyl group, tert-undecyl group, isolauryl group, sec- Lauryl group, tert-lauryl group, isotridecyl group, sec-tridecyl group, tert-tridecyl group, isotetradecyl group, sec-tetradecyl group, tert-tetradecyl group, isopentadecyl group, sec-pentadecyl group, tert-pentadecyl group , Iso Ethyl group, isohexadecyl group, sec-hexadecyl group, tert-hexadecyl group, isoheptadecyl group, sec-heptadecyl group, tert-heptadecyl group, isostearyl group, isononadecyl group, sec-nonadecyl group, tert-nonadecyl group, isoicosyl group , Sec-icosyl group, tert-icosyl group, isohenicosyl group, sec-henicocyl group, tert-henicosyl group, isodocosyl group, sec-docosyl group, tert-docosyl group, tert-docosyl group, isotricosyl group, sec-tricosyl group, tert-tricosyl group, Isotetracosyl group, sec-tetracosyl group, tert-tetracosyl group, isopentacosyl group, sec-pentacosyl group, tert-pentacosyl group, isohexacosyl group, sec-hexacosyl group, ert-hexacosyl, isoheptacosyl, sec-heptacosyl, tert-heptacosyl, isooctacosyl, sec-octacosyl, sec-octacosyl, tert-octacosyl, isononacosyl, sec-nonacosyl, tert-nonacosyl, isotriacontyl, isotriacontyl A sec- tria contyl group, a tert- tria contyl group etc. are mentioned.

The R ^11c and at least one of one or more 30 6 or more carbon atoms that does not contain the following chain alkenyl group selected from the group consisting of hydroxyl group and amino group in R ^12c, for example, a straight chain having 6 to 30 carbon atoms -Like alkenyl groups and branched alkenyl groups having 6 to 30 carbon atoms.

  Examples of the linear alkenyl group having 6 to 30 carbon atoms include n-hexenyl group, n-heptenyl group, n-octenyl group, n-nonenyl group, n-decenyl group, n-undecenyl group, n-dodecenyl group Group, n-tridecenyl group, n-tetradecenyl group, n-pentadecenyl group, n-hexadecenyl group, n-heptadecenyl group, n-oleyl group, n-nonadecenyl group, n-icosenyl group, n-henicosenyl group, n-docosenyl group Groups, n-tricocenyl group, n-tetracocenyl group, n-pentacocenyl group, n-hexacocenyl group, n-heptacosenyl group, n-octacocenyl group, n-nonacosenyl group, n-triacontenyl group and the like.

  The branched alkenyl group having 6 to 30 carbon atoms is, for example, isohexenyl group, sec-hexenyl group, tert-hexenyl group, isoheptenyl group, sec-heptenyl group, tert-heptenyl group, isooctenyl group, sec-octenyl Group, tert-octenyl group, isononenyl group, sec-nonenyl group, tert-nonenyl group, isodecenyl group, sec-decenyl group, t-decenyl group, isoundecenyl group, sec-undecenyl group, tert-undecenyl group, isododecenyl group, sec -Dodecenyl group, tert-dodecenyl group, isotridecenyl group, sec-tridecenyl group, tert-tridecenyl group, isotetradecenyl group, sec-tetradecenyl group, tert-tetradecenyl group, isopentadecenyl group, s c-Pentadecenyl group, tert-pentadecenyl group, isohexadecenyl group, sec-hexadecenyl group, tert-hexadecenyl group, isoheptadecenyl group, sec-heptadecenyl group, tert-heptadecenyl group, isooleoyl group, sec-oleyl Group, tert-oleyl group, isononadecenyl group, sec-nonadecenyl group, tert-nonadecenyl group, isoeicosenyl group, sec-eicosenyl group, tert-eicosenyl group, isohenicosenyl group, sec-henicosenyl group, tert-henicosenyl group, Isodococenyl group, sec-dococenyl group, tert-dococenyl group, isotrichocenyl group, sec-tricosecenyl group, tert-tricosecenyl group, isotetracocenyl group, sec-tetracocenyl group, ter -Tetracocenyl group, isopentacocenyl group, sec-pentacocenyl group, tert-pentacocenyl group, isohexacocenyl group, sec-hexacocenyl group, tert-hexacocenyl group, tert-hexacocenyl group, isoheptacosenyl group, sec-heptacosenyl group, tert-heptacosenyl group Group, isooctacosenyl group, sec-octacosenyl group, tert-octacosenyl group, isononacosenyl group, sec-nonacosenyl group, tert-nonacosenyl group, isotriacontenyl group, sec-triacontenyl group, tert-triacontenyl group Etc.

  The chain alkyl group or chain alkenyl group having 6 to 30 carbon atoms containing one or more selected from the group consisting of a hydroxyl group and an amino group is at least selected from the group consisting of a hydroxyl group and an amino group described above Those in which at least one hydrogen atom of a linear alkyl group or linear alkenyl group having 6 to 30 carbon atoms which does not contain 1 type is substituted by at least 1 type selected from the group consisting of a hydroxyl group and an amino group are mentioned .

  In addition, as described above, a hydroxyl group and an amino group are substituents in a hydrocarbon group. Among them, as a substituent, it is preferable to include a hydroxyl group. By containing a hydroxyl group, a hydrogen bond can be formed with an amide bond in the polyamide. Thereby, the physical properties (the hardness of a molded object, an external appearance, etc.) in the molded object using the polyamide resin composition of this embodiment can be improved more.

A chain alkyl group or chain alkenyl group having 6 to 30 carbon atoms containing at least one selected from the group consisting of a hydroxyl group and an amino group in R ^11c and R ^12c is a group consisting of a hydroxyl group and an amino group as a substituent It may contain one or more selected from at least one selected from more.

Among them, from the viewpoint of heat resistance, each of R ^11c and R ^12c is preferably a C6 to C15 chained alkyl group or a chained alkenyl group which may contain one or more hydroxyl groups, and one hydroxyl group is preferred. It is more preferable that it is a C6-C12 chain | strand-shaped alkyl group or chain | strand-shaped alkenyl group which may be contained above.

[R ^21c and R ^22c ]
Each of R ^21c and R ^22c independently represents a linear alkyl group having 6 to 30 carbon atoms or a linear alkenyl group which may contain at least one selected from the group consisting of an amino group and a carboxy group. R ^21c and R ^22c may be the same or different. Among them, R ^21c and R ^22c are preferably identical because they are easy to synthesize.

^Examples of the chain alkyl group or chain alkenyl group having 6 to 30 carbon atoms which does not contain one or more of at least one selected from the group consisting of amino group and carboxy group in R ^21c and R ^22c include the above R ^11c and The same as those exemplified for R ^12c can be mentioned.

  The linear alkyl group or linear alkenyl group having 6 to 30 carbon atoms containing one or more selected from the group consisting of amino group and carboxy group is selected from the group consisting of the above-mentioned amino group and carboxy group In which at least one hydrogen atom of a linear alkyl group or linear alkenyl group having 6 to 30 carbon atoms which does not contain at least one selected from the group consisting of an amino group and a carboxy group is substituted Can be mentioned.

  Also, as described above, the amino group and the carboxy group are substituents in a hydrocarbon group. Among them, as a substituent, it is preferable to include an amino group. By containing an amino group, a hydrogen bond can be formed with the amide bond in the polyamide. Thereby, the physical properties (the hardness of a molded object, an external appearance, etc.) in the molded object using the polyamide resin composition of this embodiment can be improved more.

A chain alkyl group or chain alkenyl group having 6 to 30 carbon atoms containing at least one selected from the group consisting of a hydroxyl group and an amino group in R ^21c and R ^22c is a group consisting of a hydroxyl group and an amino group as a substituent It may contain one or more selected from at least one selected from more.

Among them, from the viewpoint of heat resistance, each of R ^21c and R ^22c is preferably a linear alkyl group having 6 to 15 carbon atoms or a linear alkenyl group which may contain one or more amino groups, and It is more preferable that it is a C6-C12 chained alkyl group or chained alkenyl group which may contain one or more.

[N ^{11 c} , n ^{12 c} , n ^{13 c} , n ^{21 c} , n ^{22 c} and n ^{23 c} ]
n ^{11 c} , n ^{12 c} , n ^{13 c} , n ^{21 c} , n ^{22 c} and n ^{23 c} are the number of repetition of methylene groups. n ^{11 c} , n ^{12 c} , n ^{13 c} , n ^{21 c} , n ^{22 c} and n ^{23 c} are each independently an integer of 2 or more and 10 or less.

In addition, at least one member selected from the group consisting of n ³¹ , n ³² , n ⁴¹ , n ⁵¹ and n ⁶¹ , which is the repeating number of methylene groups in the (A) polyamide described above, a compound (Ic) and a compound The difference between the repeating number of methylene groups in II-c) and at least one selected from the group consisting of n ^11c , n ^12c , n ^13c , n ^21c , n ^22c and n ^23c is preferably 3 or less, It is more preferably 2 or less, still more preferably 1 or less, and particularly preferably 0. When the difference is less than or equal to the above upper limit, the compatibility between the (A) polyamide and the (B) compound becomes higher, and the plasticization time at the time of molding becomes more stable. In addition, the amount of chips generated is further reduced, and the viscosity reduction effect at the time of melting is further enhanced.

For example, in the case where the polyamide resin composition of the present embodiment contains a polyamide obtained from a diamine and a dicarboxylic acid (a polyamide having a structure (III)) and the compound (I-c), n ³¹ and n ^{11 c combination,} a combination of ^{n 31} and ^{n 12c,} and a combination of ^{n 31} and ^{n 13c,} and a combination of ^{n 32} and ^{n 11c,} and a combination of ^{n 32} and ^{n 12c,} there may be a combination of ^{n 32} and ^{n 13c} .

For example, in this embodiment the polyamide resin composition, a polyamide obtained from a diamine and a dicarboxylic acid (polyamide having the structure (III)), if it contains a compound (II-c) ^is of ^{n 31} and ^{n 21c combination,} a combination of ^{n 31} and ^{n 22c,} and a combination of ^{n 31} and ^{n 23c,} and a combination of ^{n 32} and ^{n 21c,} and a combination of ^{n 32} and ^{n 22c,} there may be a combination of ^{n 32} and ^{n 23c} .

For example, when the polyamide resin composition of the present embodiment contains a polyamide obtained from a lactam or an ω-aminocarboxylic acid (a polyamide having a structure (VI)) and the compound (Ic), n ⁶¹ and n There may be a combination of ^{11 c,} a combination of n ⁶¹ and n ^{12 c} , and a combination of n ⁶¹ and n ^{13 c} .

For example, the polyamide resin composition of this embodiment is a copolymer of polyamide obtained from diamine and dicarboxylic acid (polyamide having structure (III)) and polyamide obtained from lactam (polyamide having structure (VI)) When the polyamide and the compound (I-c) are contained, the combination of n ³¹ and n ^{11 c} , the combination of n ³¹ and n ^{12 c} , the combination of n ³¹ and n ^{13 c} , the combination of n ³² and n ^{11 c} , a combination of ^{n 32} and ^{n 12c,} and a combination of ^{n 32} and ^{n 13c,} and a combination of ^{n 61} and ^{n 11c,} and a combination of ^{n 61} and ^{n 12c,} there may be a combination of ^{n 61} and ^{n 13c.}

For example, when the polyamide resin composition of the present embodiment contains two or more types of polyamides or two or more types of (B) compounds, n ³¹ , n ³² , n ⁴¹ , n ⁵¹ and n ⁶¹ and n ^{11 c} , N ^12c , n ^13c , n ^21c , n ^22c and n ^23c .

Especially, it is preferable that the difference in any one of the following (ic)-(iv-c) is the said range. In addition, it is particularly preferable that the difference between (ic) or (ii-c) is 0, or the difference between (iii-c) or (iv-c) is 1 or less.
(Ic) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the (A) polyamide, and the above n ^{21 c} , the above n ^{22 c} and the above n ^{23 c in} the above (B) compound The difference from at least one more selected;
(Ii-c) a group consisting of at least one selected from the group consisting of the above n ³² and the above n ⁵¹ in the above (A) polyamide, and the above n ^{11 c} , the above n ^{12 c} and the above n ^{13 c in} the above (B) compound The difference from at least one more selected;
(Iii-c) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^11c , the n ^12c and the n ^{13c in the} (B) compound;
(Iv-c) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^21c , the n ^22c and the n ^{23c in the} (B) compound

[ ^{M 11c} and m ^21c ]
m ^{11 c} and m ^{21 c} are the repeat number of the unit in parentheses. m ^{11 c} and m ^{21 c} are each independently an integer of 0 or more and 2 or less. Among them, m ^{11 c} and m ^{21 c} are each preferably 1 because they are easy to synthesize and have good compatibility with polyamide.

Preferred examples of the compound (I-c) include ethylenebisstearate, 1,4-butylenebisstearate, 1,6-hexamethylenebisstearate, ethylenebismontanate, 1,4 -Butylene bis montanate, 1,6-hexamethylene bis montanate, ethylene bis behenate, 1,4-butylene bis behenate, 1,6-hexamethylene bis behenate, ethylene bis laurate And 1,4-butylene bis laurate, 1,6-hexamethylene bis laurate and the like.
As preferred compounds (II-c), for example, diisodecyl adipate, bis (2-ethylhexyl) adipate, diisononyl = adipate, dihexane-1-yl = adipate, decan-1-yl = octan-1-yl = Adipate, dioctan-l-yl = adipate, decan-l-yl = hexane-l-yl = adipate, didecan-l-yl = adipate, hexyl = octyl adipate and the like.
In addition, these compounds are only an example of preferable compound (Ic) and compound (II-c), and preferable compound (Ic) and compound (II-c) are not limited to these.

Among them, as the compound (I-c), 1,4-butylenebisstearate, 1,4-butylenebismontanate, 1,4-butylenebisbehenate or 1,4-butylenebislaurate Is preferred.
Among them, bis (2-ethylhexyl) adipate is preferable as the compound (II-c).

(Method for producing compound (Ic) and compound (II-c))
The compound (B) contained in the polyamide resin composition of the present embodiment is, for example, a compound (Ic), a linear diol having 2 to 10 carbon atoms, and a saturated fatty acid having 6 to 30 carbon atoms Or it can manufacture by carrying out the condensation reaction of C6 or more and 30 or less unsaturated fatty acid.

  Examples of the linear diol having 2 to 10 carbon atoms include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, and the like. Examples include 7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol and the like. These linear diols may be used alone or in combination of two or more.

  Examples of the saturated fatty acid having 6 to 30 carbon atoms include caproic acid, enanthate, caprylic acid, pelargonic acid, capric acid, caprylic acid, lauric acid, tridecylic acid, myristic acid, pentadecylic acid, palmitic acid, margaric acid, stearic acid Nonadecylic acid, arachidic acid, henicosic acid, behenic acid, tricosylic acid, lignoceric acid, serotic acid, montanic acid, melisic acid and the like.

  The unsaturated fatty acid having 6 to 30 carbon atoms may be a fatty acid having one unsaturated bond, and specifically, for example, myristoleic acid, palmitoleic acid, sabienic acid, oleic acid, elaidic acid, There may be mentioned vaccenic acid, gadeuric acid, eicosenic acid, erucic acid, nervonic acid and the like.

  Among them, the unsaturated fatty acid having 6 to 30 carbon atoms is preferably an unsaturated fatty acid having 12 to 30 carbon atoms from the viewpoint of the heat resistance of the compound (B), and is unsaturated having 15 to 30 carbon atoms. It is more preferable that it is a saturated fatty acid.

  Also, for example, when the compound (B) is a compound (II-c), a dicarboxylic acid having 4 to 12 carbon atoms, a saturated monohydric alcohol having 6 to 30 carbon atoms, or 6 to 30 carbon atoms It can be produced by condensation reaction with an unsaturated monohydric alcohol of

  Examples of the dicarboxylic acids having 4 to 12 carbon atoms include succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid and the like. These dicarboxylic acids may be used alone or in combination of two or more.

  Examples of the saturated alcohol having 6 to 30 carbon atoms include 1-hexanol, 2-hexanol, 3-hexanol, 4-methyl-1-pentanol, 4-methyl-2-pentanol, 2-methyl-2 -Pentanol, 3-methyl-2-pentanol, 2-methyl-3-pentanol, 3-methyl-3-pentanol, 2,3-dimethyl-2-butanol, 3,3-dimethyl-1-butanol 3,3-Dimethyl-2-butanol, 1-heptanol, 2-heptanol, 3-heptanol, 4-heptanol, 3-ethyl-3-pentanol, 2,4-dimethyl-3-pentanol, 2,4 -Dimethyl-2-pentanol, 2,3-dimethyl-2-pentanol, 2,3-dimethyl-3-pentanol, 2,2-dimethyl-3-pen Nole, 2,3,3-trimethyl-2-butanol, 2,3,3-trimethyl-3-pentanol, 2,2-diethyl-1-pentanol, 1-octanol, 2-octanol, 7-methyl- 1-octanol, 2-ethyl-1-hexanol, 3,5,5-trimethyl-1-hexanol, 2-methyl-2-hexanol, 3-methyl-3-hexanol, 1-nonanol, 2-nonanol, 3- Nonanol, 4-nonanol, 5-nonanol, 2,6-dimethyl-4-heptanol, 3,5-dimethyl-4-heptanol, 1-decanol, 1-undecanol, 1-dodecanol, 1-tridecanol, 1-tetradec Nord, 1-pentadecanol, 1-hexadecanol, 1-heptadecanol, 1-octadecanol, 1- Nadecanol, 1-eicosanol, 1-henicosanol, 1-docosanol, 1-tricosanol, 1-tetracosanol, 1-pentacosanol, 1-hexacosanol, 1-heptacosanol, 1-octacosanol, 1-nonacosanol, 1- Triacontanol etc. are mentioned.

  The unsaturated monohydric alcohol having 6 to 30 carbon atoms may be a monohydric alcohol having one unsaturated bond. Specific examples of the unsaturated monohydric alcohol having 6 to 30 carbon atoms include trans-2-hexenol, cis-3-hexenol, heptenol, octenol, nonenol, decenol, undecenol, dodecenol, tridecenol and isotride. Cenol, 1-Hexylheptenol, Tetradecenol, Pentadecenol, Hexadecenol, Hexapdecenol, Octadecenol, 1-Methylheptadecenol, Isooctadecenol, Nonadecenol, Eicenol, Docosenol, Tricosenol, Tetracosenol, Pentacosenol, Hexacosene, Heptacosenoles, octacosenoles, nonacosenoles, triaconsenoles, etc. may be mentioned.

  Among them, from the viewpoint of the heat resistance of the compound (B), the saturated alcohol having 6 to 30 carbon atoms or the unsaturated alcohol having 6 to 30 carbon atoms is a saturated or unsaturated alcohol having 6 to 15 carbon atoms. It is preferably, and more preferably a saturated or unsaturated alcohol having 6 to 12 carbon atoms.

[Content of (B) Compound]
In the polyamide resin composition of the present embodiment, the content of the compound (B) is 0.5 parts by mass or more and 3 parts by mass with respect to 100 parts by mass of the polyamide (A) from the viewpoint of extrusion productivity and impact resistance. It is preferable that it is the following and it is more preferable that it is 0.6 to 2 mass parts.

<(C) Inorganic filler>
The polyamide resin composition of the present embodiment may further contain (C) an inorganic filler in addition to the (A) polyamide and the (B) compound.

  (C) As the inorganic filler, for example, inorganic salt, glass fiber, cellulose, glass flake, glass bead, carbon fiber, whisker, mica, clay, talc, kaolin, magnesium hydroxide, magnesium sulfate and fibers thereof, silica, oxidized Examples thereof include titanium, calcium carbonate, fly ash (coal ash), potassium titanate, wollastonite, thermally conductive materials, conductive metal fibers, conductive metal flakes and the like. One or more of these inorganic fillers may be contained in combination.

  Moreover, as said glass fiber, a long glass fiber, a chopped strand glass fiber, flat glass fiber etc. are mentioned, for example. One or more of these glass fibers may be contained in combination.

  Moreover, as said carbon fiber, a carbon long fiber, a chopped strand carbon fiber, etc. are mentioned, for example. One or more of these carbon fibers may be contained in combination.

  Among them, the (C) inorganic filler is at least one selected from the group consisting of glass fiber, glass flake, glass bead, carbon fiber, talc, mica, kaolin, wollastonite, calcium carbonate and potassium titanate. Is preferred. Further, in view of mechanical strength, appearance, whiteness and the like of the polyamide resin composition of the present embodiment, glass fibers or carbon fibers are more preferable.

  As a preferable shape of glass fiber or carbon fiber, a cross section may be a perfect circle shape, and flat shape may be sufficient. The flat cross section includes, for example, a rectangular shape, an oval shape close to a rectangular shape, an oval shape, and a bowl shape having a narrow central portion in the longitudinal direction. Flatness is expressed by D2 / D1 when the major axis of the fiber cross section is D2 and the minor axis of the fiber cross section is D1. It is preferable that D2 / D1 is 1 or more and 5 or less.

  These inorganic fillers may be those treated with a surface treatment agent, those treated with an organic salt using an ammonium salt or the like using an intercalation method, or those treated with a resin as a binder.

  Examples of the surface treatment agent include silane coupling agents, copolymers of maleic anhydride and unsaturated monomers, titanate coupling agents, aliphatic carboxylic acids, and aliphatic metal salts.

  The silane coupling agent is not particularly limited, but any silane coupling agent generally used for surface treatment of glass fibers can be used. Such a silane coupling agent is not particularly limited. Specifically, for example, an aminosilane coupling agent, an epoxysilane coupling agent, a methacryloxysilane coupling agent, a vinylsilane coupling agent, etc. Can be mentioned. These silane coupling agents may be used alone or in combination of two or more.

  Examples of the aminosilane coupling agent include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, N-β (aminoethyl) γ -Aminopropyl trimethoxysilane, N-beta (aminoethyl) gamma-aminopropyl triethoxysilane, etc. are mentioned.

  Examples of the epoxysilane coupling agent include γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropyltriethoxysilane.

  Examples of the methacryloxysilane coupling agent include γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, and γ-methacryloxypropyltriethoxysilane. Can be mentioned.

  Examples of the vinylsilane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, and vinyltris (β-methoxyethoxy) silane.

  Among them, as the silane coupling agent, an aminosilane coupling agent is preferable from the viewpoint of affinity to polyamide, and γ-aminopropyltriethoxysilane or N-β (aminoethyl) γ-aminopropyltriethoxysilane is more preferable. .

The copolymer of maleic anhydride and the unsaturated monomer is not particularly limited, and specifically, for example, styrene, α-methylstyrene, butadiene, isoprene, chloroprene, 2,3-dichlorobutadiene, Copolymers of unsaturated monomers such as 1,3-pentadiene and cyclooctadiene with maleic anhydride can be mentioned. These unsaturated monomers may be used alone or in combination of two or more.
Among them, butadiene or a copolymer of styrene and maleic anhydride is preferable as the copolymer of maleic anhydride and the unsaturated monomer.

In addition, two types of copolymers of maleic anhydride and unsaturated monomer, such as a copolymer of maleic anhydride and butadiene and a copolymer of maleic anhydride and styrene, are used. In the case of the above mixture, a focusing agent may be further used.
The copolymer of maleic anhydride and the unsaturated monomer preferably has an average molecular weight of 2,000 or more.
In the copolymer of maleic anhydride and the unsaturated monomer, the mixing ratio of maleic anhydride and the unsaturated monomer is not particularly limited.
In addition to the copolymer of maleic anhydride and unsaturated monomer, an acrylic copolymer or urethane polymer may be used in combination.

  As said resin used as a binder, a urethane resin, an epoxy resin, etc. are mentioned, for example.

  In the polyamide resin composition of the present embodiment, the content of the (C) inorganic filler is preferably 5 parts by mass or more and 240 parts by mass or less, and 10 parts by mass or more and 200 parts by mass with respect to 100 parts by mass of the (A) polyamide. The content is more preferably 50 parts by mass or less and still more preferably 30 parts by mass or more and 150 parts by mass or less, particularly preferably 40 parts by mass or more and 100 parts by mass or less and 50 parts by mass or more and 60 parts by mass or less Is most preferred. When the content of the (C) inorganic filler is in the above range, mechanical strength, appearance, and whiteness of the polyamide resin composition of the present embodiment can be made better.

<(D) Copper compound>
The polyamide resin composition of the present embodiment may further contain (D) a copper compound in addition to the (A) polyamide and the (B) compound.

  The copper compound (D) is not particularly limited. For example, a copper halide compound, copper acetate, copper propionate, copper benzoate, copper adipate, copper terephthalate, copper isophthalate, copper salicylate, Examples thereof include copper nicotinate, copper stearate, and a copper complex salt in which copper is coordinated to a chelating agent. One of these may be contained alone, or two or more may be contained in combination.

  Examples of the copper halide compounds include copper iodide, cuprous bromide, cupric bromide, cuprous chloride and the like.

  Examples of the chelating agent include ethylenediamine, ethylenediaminetetraacetic acid and the like.

  Among them, the (D) copper compound is preferably at least one selected from the group consisting of a halogenated copper compound and copper acetate, more preferably a halogenated copper compound, copper iodide and the like More preferably, it is at least one selected from the group consisting of monocopper. When these are used, a polyamide resin composition is obtained which is more excellent in weather resistance and which can more effectively suppress metal corrosion of the screw or cylinder part during extrusion (hereinafter sometimes simply referred to as "metal corrosion"). Be

  In the polyamide resin composition of the present embodiment, the content of the (D) copper compound is preferably 0.001 parts by mass or more and 0.2 parts by mass or less with respect to 100 parts by mass of the (A) polyamide, and 0 The content is more preferably not less than 0.05 parts by mass and not more than 0.15 parts by mass, and still more preferably not less than 0.01 parts by mass and not more than 0.1 parts by mass. When the content of the copper compound (D) is within the above range, the weather resistance is further improved, and the precipitation of copper and metal corrosion tend to be able to be suppressed more effectively.

  In addition, the content of the copper element contained in the (D) copper compound is 0.001 parts by mass or more with respect to 100 parts by mass of the (A) polyamide from the viewpoint of improving the weather resistance of the polyamide resin composition. The amount is preferably 0.005 parts by mass or more, and more preferably 0.005 parts by mass or more and 0.05 parts by mass or less.

<(E) halide>
The polyamide resin composition of the present embodiment may further contain (E) a halide in addition to the (A) polyamide and the (B) compound.

  The (E) halide is preferably at least one selected from the group consisting of alkali metal halides and alkaline earth metal halides.

The halide (E) is not particularly limited, and specifically, for example, potassium iodide, potassium bromide, sodium iodide, sodium bromide, lithium bromide, lithium iodide, lithium bromide, lithium chloride Calcium iodide, calcium bromide, magnesium iodide, magnesium bromide and the like. These halides may be contained alone or in combination of two or more.
Among them, as the (E) halide, potassium iodide, potassium bromide, sodium iodide or sodium bromide is preferable from the viewpoint of improving weatherability and suppressing metal corrosion, and potassium iodide or bromide is preferable. More preferably, it is potassium.

  In the polyamide resin composition of the present embodiment, the content of the (E) halide is preferably 0.05 parts by mass to 5 parts by mass with respect to 100 parts by mass of the (A) polyamide, 0.1 It is more preferable that it is a mass part or more and 2 mass parts or less, and it is further more preferable that it is 0.1 mass part or more and 0.5 mass part or less. When the content of the halide (E) is within the above range, the weather resistance can be further improved, and copper deposition and metal corrosion can be more effectively suppressed.

  Further, in the polyamide resin composition of the present embodiment, the content of the halogen element contained in the (E) halide is more preferably 100 parts by mass of the (A) polyamide from the viewpoint of further improving the weather resistance of the polyamide resin composition. And 0.03 parts by mass or more and 4 parts by mass or less, more preferably 0.06 parts by mass or more and 1.5 parts by mass or less, and more preferably 0.06 parts by mass or more and 0.4 parts by mass or less Is more preferred.

Further, in the polyamide resin composition of the present embodiment, the content ratio of the (D) copper compound to the (E) halide is represented by a molar ratio of a halogen element to a copper element (halogen element / copper element). The halogen element / copper element is preferably 2/1 or more and 50/1 or less, more preferably 5/1 or more and 30/1 or less, and further preferably 5/1 or more and 20/1 or less. preferable.
Here, when the (D) copper compound is a copper halide, for example, the halogen element means the total of the halogen element derived from the copper halide and the halogen element derived from the (E) halide.
When the molar ratio of the halogen element to the copper element (halogen element / copper element) is equal to or more than the above lower limit, the weather resistance tends to be further improved. On the other hand, when the molar ratio (halogen element / copper element) is less than or equal to the above upper limit, corrosion of the screw or the like of the molding machine tends to be more effectively prevented without substantially impairing mechanical physical properties such as toughness. .

<(F) Fatty acid metal salt>
The polyamide resin composition of the present embodiment may further contain (F) a fatty acid metal salt in addition to the (A) polyamide and the (B) compound.

  Examples of (F) fatty acid metal salts include sodium salts, lithium salts, calcium salts, magnesium salts, zinc salts and aluminum salts of fatty acids having 9 or more carbon atoms, and one of these fatty acid metal salts may be contained, Two or more may be combined and included.

  Examples of the fatty acid having 9 or more carbon atoms include capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, behenic acid, cerotic acid, montanic acid, melisic acid, oleic acid, erucic acid and the like.

  Among them, calcium stearate, aluminum stearate, calcium montanate or sodium montanate is preferably used as the (F) fatty acid metal salt because of its high effect.

  In the polyamide resin composition of the present embodiment, the content of the metal salt of fatty acid (F) is preferably 0.005 parts by mass or more and 2 parts by mass or less with respect to 100 parts by mass of the polyamide (A). More preferably, it is at least 05 parts by mass and at most 2 parts by mass. When the compounding amount of the (F) fatty acid metal salt is equal to or more than the above lower limit value, there is a tendency that a better molded product appearance can be obtained. Moreover, it exists in the tendency which can prevent more effectively bleed out during shaping | molding by being below the said upper limit.

<(G) Other components>
In addition to (A) polyamide and (B) compound, the polyamide resin composition of this embodiment may further add (G) other components as needed.

  (G) Other components are not particularly limited. For example, phenol-based heat stabilizers, phosphorus-based heat stabilizers, amine-based heat stabilizers, sulfur-based heat stabilizers, ultraviolet light absorbers, photodegradation inhibitors, plastic Agents, lubricants, crystal nucleating agents, mold release agents, flame retardants, colorants, stains, pigments, other thermoplastic resins (olefin elastomers etc.) and the like. Here, the above-described (G) other components have greatly different properties. Therefore, a person skilled in the art can easily set suitable contents for each of the above-mentioned (G) other components.

  Moreover, you may add the component for disperse | distributing (D) copper compound and (E) halide in (A) polyamide in the extent which does not impair the objective of this invention. As the component, for example, as a lubricant, a higher fatty acid (such as lauric acid), a higher fatty acid metal salt of a higher fatty acid and a metal (such as aluminum), a higher fatty acid amide (such as ethylene bis stearylamide), waxes (such as polyethylene wax) And organic compounds having at least one amide group.

«Method for producing polyamide resin composition»
The polyamide resin composition of the present embodiment comprises (A) a polyamide, (B) a compound, and if necessary, (C) an inorganic filler, (D) a copper compound, (E) a halide, and (F) a fatty acid metal. A salt and (G) other components can be mix | blended and it can manufacture with a melt kneader.

  As a method of supplying various components contained in the polyamide resin composition of the present embodiment to a melt kneader, all the components may be supplied to the same supply port at one time, and various components may be supplied from different supply ports. You may

  As a specific mixing method, for example, a method of mixing (A) polyamide and (B) compound, supplying to a melt kneader, and kneading may be mentioned.

  The melt-kneader is not particularly limited, and a known device such as a melt-kneader such as a single-screw or twin-screw extruder, a Banbury mixer, or a mixing roll can be used. Among them, a twin-screw extruder is preferably used as the melt-kneader.

«Molded body»
The molded body of the present embodiment is formed by injection molding of the polyamide resin composition of the above-described embodiment.

  The molded object of this embodiment is obtained by shape | molding the polyamide resin composition mentioned above using a general purpose injection molding machine.

  The molded article of the present embodiment has less foaming and is excellent in mechanical properties. Therefore, the molded article of the present embodiment is suitably used as various parts such as for automobile, machine industry, for electric and electronics, for housing equipment, for industrial materials, for industrial materials, for daily use and household goods etc. can do.

  Specifically, the molded body of the present embodiment can be suitably used, for example, for parts of an automobile engine room and sliding parts.

  The parts of the automobile engine room include, for example, air intake manifold, intercooler inlet, exhaust pipe cover, inner bush, bearing retainer, engine mount, cylinder head cover, resonator, throttle body, chain cover, thermostat housing, outlet pipe, radiator tank , Oil generators, delivery pipes and the like.

  Examples of the sliding component include a gear, a cam, and a bearing of an electric power steering.

  Hereinafter, the present invention will be more specifically described by examples and comparative examples, but the present invention is not limited to these examples. The raw materials used in Examples and Comparative Examples, methods of measuring physical properties, and methods of evaluation are shown below.

<Raw materials>
[(A) polyamide compound]
A-1: Polyamide 66 (viscosity number VN: 124) (polyamide in which n31 = 6 and n32 = 4 in the general formula (III) above)
A-2: Polyamide 66 (viscosity number VN: 146) (polyamide in which n31 = 6 and n32 = 4 in the general formula (III) above)
A-3: Polyamide 6 (viscosity number VN: 114) (polyamide in which n61 = 5 in the above general formula (VI))
A-4: polyamide 610 (viscosity number VN: 115) (polyamide in which n31 = 6 and n32 = 8 in the general formula (III) above)

[(B) compound]
B-a-1: N, N'-distearyl adipic acid amide (manufactured by Nippon Kasei Co., Ltd., trade name "Suripax (registered trademark) ZSA") (in the above general formula (II-a), n ^21a = n ^22a = bisamide compounds in which n ^23a = 4, m ^21a = 0, and R ^21a = R ^22a = C ₁₇ H ₃₅ )
B-a-2: N, N'-distearyl sebacic acid amide (manufactured by Nippon Kasei Co., Ltd., trade name "Suripax (registered trademark) ZSS") (in the above general formula (II-a), n ^21a = n ^22a = bisamide compounds in which n ^23a = 8, m ^21a = 0, and R ^21a = R ^22a = C ₁₇ H ₃₅ )
B-a-3: hexamethylene bis-stearic acid amide (manufactured by Nippon Kasei Co., Ltd., trade name "Suripax (registered trademark) ZHS") (n ^{11 a} = n ^{12 a} = n ^{13 a} = 6 in the above general formula (I-a) , M ^11a = 0 and R ^11a = R ^12a = C ₁₇ H ₃₅ )
B-a-4: Ethylenebisstearylamide (Kao Co., Ltd., trade name "Kaowax EB-P") (n ^11a = n ^12a = n ^13a = 2, m ^11a = in the above general formula (I-a) A bisamide compound in which 0 and R ^11a = R ^12a = C ₁₇ H ₃₅ )
B-b-1: N, N'- bis (2- hydroxyethyl) adipic acid amide ( ^n21b = ^n22b = ^n23b = 4 in the above general formula (II-b), ^m21b = 0, and Bisamide compounds in which R ^{21 b} = R ^{22 b} = (CH ₂ ) ₂ OH)
B-b-2: N, N'-hexamethylene bis (3-hydroxy) propionic acid amide (wherein ^n11b = ^n12b = ^n13b = 6, ^m11b = 0 in the above general formula (I-b), and , R ^{11 b} = R ^{12 b} = (CH ₂ ) ₃ OH)
B-b-3: Hexamethylene bis (12-hydroxy) stearic acid amide (manufactured by Nippon Kasei Co., Ltd., trade name "Suripax ZHH") (n ^{11 b} = n ^{12 b} = n ¹³ b in the above general formula (I-b) 6, m ^{11 b} = 0, and a bisamide compound in which R ^{11 b} = R ^{12 b} = (CH ₂ ) ₁₀ CHOHC ₆ H ₁₃ )
B-b-4: ethylenebisstearylamide (Kao Co., Ltd., trade name "Kaowax EB-P") (n ^{11 b} = n ^{12 b} = n ^{13 b} = 2 in the above general formula (I-b), m ^{11 b} = A bisamide compound in which 0 and R ^{11 b} = R ^{12 b} = C ₁₇ H ₃₅ )
B-c-1: bis (2-ethylhexyl) adipate (trade name "DOA" manufactured by J-Plus Co., Ltd.) (n ^{21 c} = n ^{22 c} = n ^{23 c} = 4 in the above general formula (II-c) ^21c = 0 and ester compounds of R ^21c = R ^22c = C ₈ H ₁₇ )
B-c-2: diisononyl = adipate (J-PLUS Co., Ltd., trade name ^{"DINA") (n 21c = n 22c =} n 23c = 4 in the general formula ^{(II-c), m 21c} = 0 and R ^{21 c} = R ^{22 c} = ester compound of C ₉ H ₁₉ )
B-c-3: bis (2-ethylhexan-1-yl) = phthalate (trade name "DOP" manufactured by Jay Plus Co., Ltd. (ester compound wherein the ester group is aromatic)
B-c-4: stearyl stearate (manufactured by Wako Pure Chemical Industries, trade name "stearyl stearate") (monoester compound)

(C) Inorganic filler C-1: Glass fiber (manufactured by Nippon Electric Glass Co., Ltd., trade name "ECS03T-275H")

(D) Copper compound D-1: Copper iodide (CuI) (manufactured by Wako Pure Chemical Industries, Ltd., trade name "copper iodide (I)")

(E) Halide E-1: potassium iodide (KI) (manufactured by Wako Pure Chemical Industries, Ltd., trade name "potassium iodide")

(F) Fatty acid metal salt F-1: calcium stearate (manufactured by NOF Corporation, trade name "calcium stearate G")

<Synthesis Method of Compound (B-b-1) and Compound (B-b-2)>
The compound (B-b-1) and the compound (B-b-2), which are compounds containing a hydroxyl group, are known literatures (Reference 1: "Masao et al.," Esters from monoethanolamine and dibasic acid as raw materials Synthesis of amide polymers, Industrial Chemical Journal, Vol. 65, No. 1, pp. 78-81, 1962. Reference 2: "Narayanan RK et al.," Robust fibrillar nanocatalysts based on silver nanoparticle-entrappedpolymeric Hydrogels. ”, Applied catalysis A: General, Vol. 483, pp. 31-40, 2014.“). The specific synthesis method is described in detail below.

Synthesis Example 1 Synthesis of Compound (B-b-1) A 1-liter Ar-substituted four-necked flask is equipped with a reflux condenser and a side pipe for distilling off by-product ethanol, and diethyl adipate (Tokyo Chemical Industry Co., Ltd.) (250.0 g, 1.24 mol) were added. Then, 2-aminoethanol (377.53 g, 6.18 mol, manufactured by Tokyo Chemical Industry Co., Ltd.) was slowly added while stirring (300 rpm) with a mechanical stirrer. Subsequently, it heated with the aluminum block so that it might become 150 degreeC. After 1 hour, the heating was stopped, and the precipitation of a white solid was confirmed in the course of natural cooling to room temperature. 500 mL of 2-propanol (made by Kishida Chemical Co., Ltd.) (it abbreviates as "IPA" hereafter) was added, the reaction liquid was made into the slurry state, and this was vacuum-filtrated. After washing the solid with 700 mL of IPA on the filter, the white solid was recovered. Then, it was dried under reduced pressure at 80 ° C. for 5 hours to obtain a white solid (yield 244.55 g, 85.2%).
Next, 1.0 L of ethanol (manufactured by Kishida Chemical Co., Ltd.) was added to a 5-L four-necked flask, and the white solid was slowly added while stirring (200 rpm) with a mechanical stirrer. After washing with 0.6 L of ethanol, the mixture was heated by a mantle heater and completely dissolved at an internal temperature of 60 ° C. Then, the heating was stopped and in the state, it naturally cooled to room temperature. Then, it was immersed in an ice bath. Then, after the internal temperature reached 4 ° C., the precipitated white solid was collected by filtration. Then, it dried under reduced pressure at 80 ° C. for 12 hours to obtain a compound (B-b-1) as a white solid (yield: 226.18 g, 78.7%).
The obtained white solid was measured using ¹ H-NMR (Nippon Denshi Co., Ltd., JNM-ECZR, heavy solvent: methanol-d4), MALDI-TOF-MS (Shimadzu Corporation, MALDI-7090) It was judged that the compound (B-b-1) was obtained from the chart which was done and obtained.

Synthesis Example 2 Synthesis of Compound (B-b-2) After Degassing, Ar-substituted 3 L Four-necked Flask Beta-propiolactone (manufactured by Tokyo Chemical Industry Co., Ltd., 310.07 g, 4.303 mol) ) And 2-propanol (215 mL) were added. Then, it was immersed in an ice bath and cooled to an internal temperature of 0.2 ° C. while stirring (300 rpm) with a mechanical stirrer. Separately, IPA (800 mL) was poured into a 1 L beaker and stirred with a magnetic stirrer, and 1,6-hexamethylenediamine (250.47 g, 2.151 mol) was added. Then, the mixture was heated to 50 ° C. with a mantle heater while bubbling with Ar, and the 1,6-hexamethylenediamine-containing IPA solution was stirred. Then, the heated and stirred 1,6-hexamethylenediamine diamine-containing IPA solution was poured into a 1 L dropping funnel, and added dropwise to the above 3 L four-necked flask under an ice bath over 2 hours. Twenty-four hours after the dropwise addition, the cloudy reaction liquid was filtered under reduced pressure, and the precipitated white solid was recovered.
Next, the obtained white solid was poured into 1.5 L of IPA, suspended and washed, and the solid was recovered by vacuum filtration. Then, the residue was dried under reduced pressure at 80 ° C. for 24 hours to obtain Compound (B-b-2) as a white solid (yield 446.32 g, 79.1%).
The obtained white solid was measured using ¹ H-NMR (manufactured by Nippon Denshi Co., Ltd., JNM-ECZR, heavy solvent: DMSO-d6), MALDI-TOF-MS (manufactured by Shimadzu Corporation, MALDI-7090) It was judged that the compound (B-b-2) was obtained from the chart which was done and obtained.

<Method of measuring physical properties>
[Physical Properties 1] Sulfuric Acid Viscosity Number The viscosity number of the polyamide was measured according to ISO 307 using 96% sulfuric acid to measure the viscosity number VN.

<Evaluation method 1>
[Evaluation 1-1] Extruder torque When the polyamide resin composition was melt-kneaded by an extruder in Examples and Comparative Examples, the load applied to the motor of the extruder was measured as a ratio (%) of the output current to the rated current. .

[Evaluation 1-2] Notched Charpy Impact Strength Pellets of the polyamide resin composition obtained in Examples and Comparative Examples using an injection molding machine (PS-40E, manufactured by Nissei Resin Co., Ltd.) were formed into a thickness of 4 mm by ISO molding Molded into pieces. At that time, the cylinder temperature was set to 290 ° C. (270 ° C. in Example 1-5 and Comparative Example 1-2), the mold temperature 80 ° C., the injection and holding time 25 seconds, and the cooling time 15 seconds. The notched Charpy impact strength was measured according to ISO 179/1 eA using the obtained molded piece.

[Evaluation 1-3] Weld strength Pellets of the polyamide resin composition obtained in Examples and Comparative Examples were melted from both ends in the length direction using an injection molding machine (PS-40E, manufactured by Nissei Resin Co., Ltd.) The resin was molded into a 4 mm thick ISO molded piece so that the resin flowed in and a weld was formed at the central portion in the length direction. At that time, the cylinder temperature was set to 290 ° C. (270 ° C. in Example 1-5 and Comparative Example 1-2), the mold temperature 80 ° C., the injection and holding time 25 seconds, and the cooling time 15 seconds. The obtained molded piece was subjected to a tensile test under a condition of a distance between chucks of 50 mm and a tensile speed of 5 mm / min to determine the tensile strength.

[Evaluation 1-4] Thin-walled molding flowability Pellets of the polyamide resin composition were molded into flat plates of 60 mm × 60 mm × 1 mm thickness using an injection molding machine (PS-40E, manufactured by Nissei Resin Industry Co., Ltd.) . At that time, the cylinder temperature was set to 290 ° C. (270 ° C. in Example 1-5 and Comparative Example 1-2), the mold temperature 80 ° C., the injection speed 20%, the injection time 10 seconds, and the cooling time 12 seconds. With respect to the obtained flat plate, the lowest injection pressure capable of full filling was measured to evaluate thin molding flowability.

<Production of Polyamide Resin Composition 1>
[Examples 1-1 to 1-4, 1-6, 1-7 and Comparative Examples 1-1, 1-3]
A twin-screw extruder (ZSK-40MC, manufactured by Copellion Co., Ltd.) having an upstream feed port provided in the first barrel from the upstream side of the extruder and a downstream feed port was used. The twin screw extruder had an L / D (extruder cylinder length / extruder cylinder diameter) = 48 (barrel number: 12). In the twin-screw extruder, the number of barrels (5 barrels) was set at 310 ° C. from the barrel having the upstream supply port to the barrel in front of the barrel having the downstream supply port. In addition, the barrel from the downstream side supply port to the final barrel (number of barrels: 7) was set at 290 ° C. Moreover, it set to 350 rpm of screw rotation speed, and 120 kg / hour of discharge amount.

  Under such conditions, (A) polyamide, (B) compound and, if necessary, (D) copper compound (E) from the upstream side supply port so as to obtain the compounding amounts described in Table 1 below. The halide and (F) higher fatty acid metal salt were supplied, and the (C) inorganic filler was supplied from the downstream side supply port. Subsequently, the pellet of each resin composition was manufactured by melt-kneading these. Evaluation was performed according to the above evaluation method 1 using pellets of the obtained resin composition. The results are shown in Table 1.

[Example 1-5 and Comparative Example 1-2]
The barrel from the barrel having the upstream feed port to the barrel in front of the barrel from the downstream feed port is set at 280 ° C., and the barrel from the downstream feed port to the final barrel is set at 230 ° C. The pellet of the resin composition was obtained using the method similar to 1-1-4, 1-6, 1-7, and Comparative Example 1-1, 1-3. Evaluation was performed according to the above evaluation method 1 using pellets of the obtained resin composition. The results are shown in Table 1.

  From Table 1, 100 parts by mass of polyamide (A-1), and 0.8 parts by mass of compound (Ba-1), compound (Ba-2), or compound (Ba-3), Examples 1-1, 1-4 and 1-6, which are polyamide resin compositions containing 55 parts by mass of inorganic filler (C-1), contain 100 parts by mass of polyamide (A-1), and a compound (Ba) -4) It is excellent in extrusion productivity and thin-walled molding fluidity than comparative example 1-1 which is a polyamide resin composition containing 0.8 mass part and 55 mass parts of inorganic fillers (C-1), and is obtained. The impact resistance and strength of the molded article were also good.

  Example 1 which is a polyamide resin composition containing 100 parts by mass of polyamide (A-2), 0.8 parts by mass of compound (Ba-1), and 55 parts by mass of inorganic filler (C-1) Comparative Example 3 is a polyamide resin composition containing 100 parts by mass of polyamide (A-2), 0.8 parts by mass of compound (Ba-4), and 55 parts by mass of inorganic filler (C-1) The extrusion productivity and thin-walled moldability were superior to those in Example 1-3, and the impact resistance and strength of the obtained molded article were also good.

  Example 1 which is a polyamide resin composition containing 100 parts by mass of polyamide (A-3), 0.8 parts by mass of compound (Ba-2) and 55 parts by mass of inorganic filler (C-1) Comparative Example 5 is a polyamide resin composition containing 100 parts by mass of polyamide (A-3), 0.8 parts by mass of compound (Ba-4) and 55 parts by mass of inorganic filler (C-1) The extrusion productivity and thin-walled molding flowability were superior to those of Example 1-2, and the impact resistance and strength of the obtained molded article were also good.

  Furthermore, Examples 1-5 which are polyamide resin compositions containing polyamide (A-3) are Examples 1-1 and 1- 1 which are polyamide resins containing polyamide (A-1) or polyamide (A-2). Thin molding flowability was more excellent than 3. It is presumed that this is due to the low viscosity number of the polyamide.

<Evaluation method 2>
[Evaluation 2-1] Thermal Aging Resistance The pellets of the polyamide resin composition obtained in Examples and Comparative Examples were treated with an injection molding machine (PS-40E, manufactured by Nissei Resin Co., Ltd.) in accordance with ISO 3167. A multi-purpose test piece of type A was molded. The conditions of the injection molding machine were set to injection plus pressure holding time 25 seconds, cooling time 15 seconds, mold temperature 80 ° C., and molten resin temperature 290 ° C. Using the obtained molded piece, in accordance with ISO 527, a tensile test was performed at a tensile speed of 5 mm / min to measure the tensile strength (unit: MPa). Furthermore, the multipurpose test piece A was heat-aged at 180 ° C. for a predetermined time (500 hours, 1000 hours and 1500 hours) in a hot air circulating oven. After cooling this at 23 ° C. for 24 hours or more, a tensile test was performed at a tensile speed of 5 mm / min in accordance with ISO 527 to measure the tensile strength (unit: MPa) after heat aging.

[Evaluation 2-2] Creep Properties The multi-purpose test piece of type A molded in evaluation 1 was used to conduct a tensile creep test while applying a tensile stress of 60 MPa at 120 ° C. using a servo creep tester. The amount of distortion (unit:%) after 1000 hours was calculated using the following formula (i). In the following formula (i), “L0” indicates the length of the dumbbell test piece before the test, and “L1” indicates the length of the dumbbell test piece after the test.

  Strain (%) = {L1−L0) / L0} × 100 (i)

[Evaluation 2-3] Appearance of molded body The pellets of the polyamide resin composition obtained in Examples and Comparative Examples were 60 × 60 × 2 mm using an injection molding machine (PS-40E, manufactured by Nissei Resin Co., Ltd.) A thick flat plate-shaped piece was formed. The conditions of the injection molding machine were set to an injection speed at which the mold temperature was 80 ° C., the molten resin temperature was 290 ° C., and the filling time was 1 second. The 60-degree gloss of the obtained flat plate-shaped piece was measured (unit: GU).

[Evaluation 2-4] Extruder productivity (torque)
When melt-kneading the polyamide resin composition with an extruder in Examples and Comparative Examples, the load applied to the motor of the extruder was measured as a ratio (%) of the output current to the rated current.

[Evaluation 2-5] Flowability Pellets of the polyamide resin composition obtained in Examples and Comparative Examples were injection molded (FN-3000, manufactured by Nissei Resin Co., Ltd.), and a spiral of 10 mm in width and 2 mm in thickness. It molded using a flow mold and measured spiral flow length (unit: cm). The conditions of the injection molding machine were a mold temperature of 80 ° C., a molten resin temperature of 290 ° C., and an injection pressure of 70 MPa.

<Production of Polyamide Resin Composition 2>
[Examples 2-1 to 2-8 and Comparative Examples 2-1 to 2-3]
A twin-screw extruder (ZSK-40MC, manufactured by Copellion Co., Ltd.) having an upstream feed port provided in the first barrel from the upstream side of the extruder and a downstream feed port was used. The twin screw extruder had an L / D (extruder cylinder length / extruder cylinder diameter) = 48 (barrel number: 12). In the twin-screw extruder, the number of barrels (5 barrels) was set at 310 ° C. from the barrel having the upstream supply port to the barrel in front of the barrel having the downstream supply port. In addition, the barrel from the downstream side supply port to the final barrel (number of barrels: 7) was set at 290 ° C. Moreover, it set to 350 rpm of screw rotation speed, and 120 kg / hour of discharge amount.

  Under such conditions, (A) polyamide, (B) compound, (D) copper compound, (E) halide, and (F) from the upstream side supply port so as to obtain the compounding amounts described in Table 1 below. 2.) A higher fatty acid metal salt was supplied, and (C) inorganic filler was supplied from the downstream side supply port. Subsequently, the pellet of each resin composition was manufactured by melt-kneading these. Evaluation was performed according to the above evaluation method 2 using pellets of the obtained resin composition. The results are shown in Table 2.

  From Table 2, a polyamide comprising 100 parts by mass of polyamide (A-1) and 1.6 parts by mass of compound (B-b-1), compound (B-b-2) or compound (B-b-3) Examples 2-1 to 2-3 and 2-5, which are resins, are a polyamide resin containing 100 parts by mass of polyamide (A-1) and 1.6 parts by mass of compound (B-b-4) A molded article having better heat aging resistance and creep properties and a better appearance than those of Example 2-1 was obtained. In addition, with regard to the processing performance of the resin composition, in Examples 2-1 to 2-3 and 2-5, the load applied to the motor of the extruder is lower than in Comparative Example 2-1, and the extrusion productivity is excellent. The liquidity was also high.

  Further, 80 parts by mass of polyamide (A-1) and 20 parts by mass of polyamide (A-3), compound (B-b-1), compound (B-b-2) or compound (B-b-3) 1 Examples 2-2, 2-4 and 2-6, which are polyamide resins containing 6 parts by mass, contain 80 parts by mass of polyamide (A-1) and 20 parts by mass of polyamide (A-3), and a compound (B) -B-4 A molded article excellent in heat aging resistance and creep characteristics and excellent in appearance was obtained as compared with Comparative Example 2-2 which is a polyamide resin containing 1.6 parts by mass. Further, with regard to the processing performance of the resin composition, the load applied to the motor of the extruder is lower than that of Comparative Example 2-2 in Examples 2-2, 2-4 and 2-6, and the extrusion productivity is excellent. The liquidity was also high.

  A polyamide resin containing 100 parts by mass of polyamide (A-1), 1.6 parts by mass of compound (B-b-1) or compound (B-b-3), and fatty acid metal salt (F-1) Examples 2-7 and 2-8, each of which contains 100 parts by mass of polyamide (A-1), 1.6 parts by mass of compound (B-b-4), and fatty acid metal salt (F-1) The molded object which was excellent in the heat-resistant aging property and a creep characteristic and whose external appearance was favorable rather than Comparative Example 2-3 which is a polyamide resin was obtained. Further, with regard to the processing performance of the resin composition, Example 2-7 and Example 2-8 have a lower load on the motor of the extruder than Comparative Example 2-3, and excellent extrusion productivity, and flowability It was also high.

  Furthermore, Examples 2-1 to 2-4 and 2-7, which are polyamide resins containing the compound (B-b-1) or the compound (B-b-2), contain the compound (B-b-3) A molded article having better heat aging resistance and a better appearance than those of Examples 2-5, 2-6 and 2-8, which are polyamide resins, was obtained. Further, with regard to the processing performance of the resin composition, Examples 2-1 to 2-4 and 2-7 had higher fluidity than Examples 2-5, 2-6, and 2-8.

<Evaluation method 3>
[Evaluation 3-1] Extruder torque When the polyamide resin composition was melt-kneaded by an extruder in Examples and Comparative Examples, the load applied to the motor of the extruder was measured as a ratio (%) of the output current to the rated current. .

[Evaluation 3-2] Plasticization time stability Pellets of the polyamide resin composition obtained in Examples and Comparative Examples using an injection molding machine (PS-40E, manufactured by Nissei Resin Co., Ltd.) were formed into a thickness of 4 mm by ISO molding Pieces were molded 100 shots. At that time, the cylinder temperature is set to 290 ° C. (270 ° C. in Example 3-5 and Comparative Example 3-3), the mold temperature is 80 ° C., the injection and holding time is 25 seconds, the cooling time is 15 seconds, and the plasticization time is Stability was assessed by standard deviation.

[Evaluation 3-3] Chip generation amount
1 kg of pellets of the polyamide resin composition obtained in Examples and Comparative Examples was sifted for 1 minute using a 40-mesh sieve (opening: 0.425 mm), and the amount of chips dropped was measured.

[Evaluation 3-4] Thin-walled molding flowability Pellets of the polyamide resin composition were molded into a flat plate of 60 mm × 60 mm × 1 mm thickness using an injection molding machine (PS-40E, manufactured by Nissei Resin Industry Co., Ltd.) . At that time, the cylinder temperature was set to 290 ° C. (270 ° C. in Example 3-5 and Comparative Example 3-3), the mold temperature 80 ° C., the injection speed 20%, the injection time 10 seconds, and the cooling time 12 seconds. With respect to the obtained flat plate, the lowest injection pressure capable of full filling was measured to evaluate thin molding flowability.

<Production of Polyamide Resin Composition 3>
[Examples 3-1 to 3-4, 3-6 and Comparative Examples 3-1 to 3-2]
A twin-screw extruder (ZSK-40MC, manufactured by Copellion Co., Ltd.) having an upstream feed port provided in the first barrel from the upstream side of the extruder and a downstream feed port was used. The twin screw extruder had an L / D (extruder cylinder length / extruder cylinder diameter) = 48 (barrel number: 12). In the twin-screw extruder, the number of barrels (5 barrels) was set at 310 ° C. from the barrel having the upstream supply port to the barrel in front of the barrel having the downstream supply port. In addition, the barrel from the downstream side supply port to the final barrel (number of barrels: 7) was set at 290 ° C. Moreover, it set to 350 rpm of screw rotation speed, and 120 kg / hour of discharge amounts.

  Under such conditions, (A) polyamide, (B) compound and, if necessary, (D) copper compound (E) from the upstream side supply port so as to obtain the compounding amounts described in Table 1 below. The halide and (F) higher fatty acid metal salt were supplied, and the (C) inorganic filler was supplied from the downstream side supply port. Subsequently, the pellet of each resin composition was manufactured by melt-kneading these. Evaluation was performed according to the above evaluation method 3 using pellets of the obtained resin composition. The results are shown in Table 3.

[Example 3-5 and Comparative Example 3-3]
The temperature is set to 280 ° C. from the barrel having the upstream supply port to the barrel in front of the barrel having the downstream supply port, and Example 3 to 230 ° C. from the barrel having the downstream supply port to the final barrel. The pellet of the resin composition was obtained using the method similar to 1-3-4, 3-6 and comparative example 3-1, 3-2. Evaluation was performed according to the above evaluation method 3 using pellets of the obtained resin composition. The results are shown in Table 3.

  From Table 3, Examples 3-1 and 3-4, which are polyamide resin compositions containing polyamide (A-1) and compound (B-c-1) or compound (B-c-2), are polyamides (A) -1) and plasticization time stability at the time of molding, as compared with Comparative Examples 3-1 and 3-2, which are polyamide resin compositions containing the compound (B-c-3) or the compound (B-c-4) The reduction of powder generation and the extrusion productivity were excellent. Moreover, Example 3-1 and 3-4 were also favorable about thin molding flowability compared with Comparative Example 3-1 and 3-2.

  Moreover, Example 3-5 which is a polyamide resin composition containing a polyamide (A-4) and a compound (Bc-2) is a polyamide containing a polyamide (A-4) and a compound (Bc-3) The plasticization time stability at the time of molding, the ability to reduce the amount of chips generated, and the extrusion productivity were superior to Comparative Example 3-3, which is a resin composition. Moreover, Example 3-5 was also favorable about thin molding flowability compared with Comparative Example 3-3.

  Furthermore, Example 3-1 which is a polyamide resin composition containing polyamide (A-1) is Examples 3-3 and 3 which is a polyamide resin composition containing polyamide (A-2) or (A-4). The plasticization time stability at the time of shaping | molding, the reduction property of a chip generation amount, and extrusion productivity were more excellent than -5. Moreover, Example 3-1 was also more favorable about thin molding flowability than Examples 3-3 and 3-5.

  The polyamide resin composition of the present embodiment is suitably used for molded articles such as automobile parts and the like which are required to have impact resistance and the like.

Claims (13)

(A) polyamide,
(B) a compound represented by the following general formula (I-a), a compound represented by the following general formula (II-a), a compound represented by the following general formula (I-b), the following general formula (II) At least one compound selected from the group consisting of a compound represented by -b), a compound represented by the following general formula (I-c), and a compound represented by the following general formula (II-c) ,
A polyamide resin composition containing

(In the general formula (I-a), R ^11a and R ^12a each independently represent a linear alkyl group or a linear alkenyl group having 6 to 30 carbon atoms. N ^11a , n ^12a and n ^13a are each independently Is an integer from 3 to 10. m ^11a is an integer from 0 to 2)

(In the general formula (II-a), R ^21a and R ^22a are each independently a linear alkyl group or a linear alkenyl group having 6 to 30 carbon atoms. N ^21a , n ^22a and n ^23a are each independently Is an integer of 3 to 10. m ^21a is an integer of 0 to 2).

(In the general formula (I-b), R ^11b and R ^12b are each independently a linear alkyl having 2 to 22 carbon atoms which may contain one or more at least one selected from the group consisting of a hydroxyl group and an amino group At least one of R ^11b and R ^12b contains at least one selected from the group consisting of a hydroxyl group and an amino group, and n ^11b , n ^12b and n ^13b are each independently 4 or more and 12 or more. It is an integer below, m ^{11 b} is an integer of 0 or more and 2 or less.)

(In General Formula (II-b), R ^21b and R ^22b are each independently a linear alkyl having 2 to 22 carbon atoms which may contain one or more selected from the group consisting of a hydroxyl group and a carboxy group And at least one of R ^21b and R ^22b contains one or more selected from the group consisting of a hydroxyl group and a carboxy group, n ^21b , n ^22b and n ^23b are each independently 4 or more and 12 or more. It is the following integer: m ^{21 b} is an integer of 0 or more and 2 or less.)

(In the general formula (I-c), R ^11c and R ^12c are each independently a linear alkyl having 6 to 30 carbon atoms which may contain at least one selected from the group consisting of a hydroxyl group and an amino group And n ^11c , n ^12c and n ^13c are each independently an integer of 2 or more and 10 or less, and m ^11c is an integer of 0 or more and 2 or less)

(In the general formula (II-c), R ^21c and R ^22c are each independently a chain of 6 to 30 carbon atoms which may contain one or more at least one selected from the group consisting of an amino group and a carboxy group N ^21c , n ^22c and n ^23c each independently represent an integer of 2 or more and 10 or less, and m ^21c is an integer of 0 or more and 2 or less) The structure in which the (A) polyamide is represented by the following general formula (III), the structure represented by the following general formula (IV), the structure represented by the following general formula (V), and the following general formula (VI) The polyamide resin composition according to claim 1, comprising at least one structure selected from the group consisting of the structures represented by:

(In the general formula (III), n ³¹ and n ³² are each independently an integer of 4 or more and 11 or less)

(In the general formula (IV), n ⁴¹ is an integer of 4 or more and 11 or less. Ar is an arylene group.)

(In the general formula (V), n ⁵¹ is an integer of 4 or more and 11 or less. Ar is an arylene group.)

(In the general formula (VI), n ⁶¹ is an integer of 4 or more and 11 or less). Wherein ^{n 31} is a number of repetitions of the methylene group in the (A) polyamide, wherein ^{n 32,} wherein ^{n 41,} at least one selected from the group consisting of the ^{n 51} and the ^{n 61,} wherein (B) in the compound wherein ^{n 11a} is a repetition number of methylene groups, wherein ^{n 12a,} the ^{n 13a,} the ^{n 21a,} the ^{n 22a,} the ^{n 23a,} the ^{n 11b,} the ^{n 12b,} the ^{n 13b,} the ^{n 21b,} the ^{n 22b} the ^{n 23b,} the ^{n 11c,} the ^{n 12c,} the ^{n 13c,} the ^{n 21c,} the ^{n 22c} and at least one difference selected from the group consisting of the ^{n 23c} is less than or equal to 3, to claim 2 The polyamide resin composition as described. Any of the following (ia) to (iv-a), (ib) to (iv-b), and (ic) to (iv-c) has a difference of 3 or less. The polyamide resin composition according to claim 2 or 3.
(Ia) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the above (A) polyamide, and the above n ^12a , the above n ^{21 a} and the above n ²³ a in the above (B) compound The difference from at least one more selected;
(Ii-a) at least one selected from the group consisting of the n ³² and the n ⁵¹ in the (A) polyamide, the n ^11a in the compound (B), the n ^12a , the n ^13a and the n ^21a , a difference from at least one selected from the group consisting of the above n ^22a and the above n ^23a ;
(Iii-a) a group consisting of the above n ⁶¹ in the above (A) polyamide, the above n ^11a in the above (B) compound, the above n ^12a , the above n ^13a , the above n ^21a , the above n ^21a , the above n ^22a and the above n ^23a The difference from at least one more selected;
(Iv-a) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^12a in the compound (B), the n ^21a and the n ^23a ;
(I-b) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the (A) polyamide, the above n ^{12 b} in the above compound (B), the above n ^{21 b} and the above n ^{23 b} The difference from at least one more selected;
(Ii-b) a group consisting of at least one selected from the group consisting of the above n ³² and the above n ⁵¹ in the above (A) polyamide, and the above n ^{11 b} , the above n ^{13 b} and the above n ^{22 b in} the above (B) compound The difference from at least one more selected;
(Iii-b) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^11b , the n ^13b and the n ^{22b in the} (B) compound;
(Iv-b) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^12b , the n ^21b and the n ^{23b in the} (B) compound;
(Ic) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the (A) polyamide, and the above n ^{21 c} , the above n ^{22 c} and the above n ^{23 c in} the above (B) compound The difference from at least one more selected;
(Ii-c) a group consisting of at least one selected from the group consisting of the above n ³² and the above n ⁵¹ in the above (A) polyamide, and the above n ^{11 c} , the above n ^{12 c} and the above n ^{13 c in} the above (B) compound The difference from at least one more selected;
(Iii-c) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^11c , the n ^12c and the n ^{13c in the} (B) compound;
(Iv-c) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^21c , the n ^22c and the n ^{23c in the} (B) compound The difference between the following (ia), (ii-a), (ib), (ii-b), (ic) or (ii-c) is 0 or the following (iii) The difference between any one of -a), (iv-a), (iii-b), (iv-b), (iii-c) or (iv-c) is 1 or less. The polyamide resin composition according to any one of the preceding claims.
(Ia) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the above (A) polyamide, and the above n ^12a , the above n ^{21 a} and the above n ²³ a in the above (B) compound The difference from at least one more selected;
(Ii-a) at least one selected from the group consisting of the n ³² and the n ⁵¹ in the (A) polyamide, the n ^11a in the compound (B), the n ^12a , the n ^13a and the n ^21a , a difference from at least one selected from the group consisting of the above n ^22a and the above n ^23a ;
(Iii-a) a group consisting of the above n ⁶¹ in the above (A) polyamide, the above n ^11a in the above (B) compound, the above n ^12a , the above n ^13a , the above n ^21a , the above n ^21a , the above n ^22a and the above n ^23a The difference from at least one more selected;
(Iv-a) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^12a in the compound (B), the n ^21a and the n ^23a ;
(I-b) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the (A) polyamide, the above n ^{12 b} in the above compound (B), the above n ^{21 b} and the above n ^{23 b} The difference from at least one more selected;
(Ii-b) a group consisting of at least one selected from the group consisting of the above n ³² and the above n ⁵¹ in the above (A) polyamide, and the above n ^{11 b} , the above n ^{13 b} and the above n ^{22 b in} the above (B) compound The difference from at least one more selected;
(Iii-b) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^11b , the n ^13b and the n ^{22b in the} (B) compound;
(Iv-b) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^12b , the n ^21b and the n ^{23b in the} (B) compound;
(Ic) a group consisting of at least one selected from the group consisting of the above n ³¹ and the above n ⁴¹ in the (A) polyamide, and the above n ^{21 c} , the above n ^{22 c} and the above n ^{23 c in} the above (B) compound The difference from at least one more selected;
(Ii-c) a group consisting of at least one selected from the group consisting of the above n ³² and the above n ⁵¹ in the above (A) polyamide, and the above n ^{11 c} , the above n ^{12 c} and the above n ^{13 c in} the above (B) compound The difference from at least one more selected;
(Iii-c) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^11c , the n ^12c and the n ^{13c in the} (B) compound;
(Iv-c) a difference between the n ⁶¹ in the (A) polyamide and at least one selected from the group consisting of the n ^21c , the n ^22c and the n ^{23c in the} (B) compound   The polyamide according to any one of claims 1 to 5, wherein the viscosity number of the (A) polyamide measured with sulfuric acid having a mass fraction of 96% according to ISO 307 is 100 mL / g or more and 135 mL / g or less. Resin composition.   The polyamide resin composition according to any one of claims 1 to 6, further comprising (C) an inorganic filler.   The (C) inorganic filler is at least one selected from the group consisting of glass fibers, glass flakes, glass beads, carbon fibers, talc, mica, kaolin, wollastonite, calcium carbonate and potassium titanate. The polyamide resin composition as described in 7.   The (C) inorganic filler is at least one selected from the group consisting of glass fibers and carbon fibers, the fiber cross section is at least one selected from the group consisting of circular and elliptical, and the cross section is short The polyamide resin composition according to claim 7 or 8, wherein the ratio of the major axis to the major axis is 1 or more and 5 or less.   The polyamide resin composition according to any one of claims 1 to 9, further comprising (D) a copper compound.   The polyamide resin composition according to any one of claims 1 to 10, further comprising (E) at least one compound selected from the group consisting of alkali metal halides and alkaline earth metal halides.   The polyamide resin composition according to any one of claims 1 to 11, further comprising (F) a fatty acid metal salt.   The molded object formed by injection-molding the polyamide resin composition as described in any one of Claims 1-12.