JP2019079941A - Substrate division device and substrate division method - Google Patents

Abstract

To provide a substrate division device capable of supplying and cutting of a substrate, and carrying-out of the cut pieces efficiently in parallel.SOLUTION: A substrate division device of the present invention includes a turntable having first and second stages, a supply mechanism for supplying an uncut substrate to the turntable, and a cutting mechanism for cutting the uncut substrate, and a carry-out mechanism for carrying-out the cut substrate. The turntable turns so that the first stage stops at the supply position and the carry-out position, respectively. The second stage is located at the carry-out position when the first stage is stopping at the supply position, and located at the supply position when the first stage is stopping at the carry-out position. The supply mechanism and the cutting mechanism are provided while matching to the supply position, and carry-out mechanism is provided while matching to the carry-out position. The first and second stages receive the uncut substrate from the supply mechanism, respectively, at the supply position, and move the cut substrate from the supply position to the carry-out position.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a substrate dividing apparatus and a substrate dividing method, and more particularly to a turntable type substrate dividing apparatus and a substrate dividing method using the same.

  2. Description of the Related Art Conventionally, it has been practiced to cut a multi-chamfered substrate on which electronic components are mounted into individual pieces of the substrate to obtain a desired piece-mounted assembly.

  As a cutting device for such a multi-chamfered substrate, it is provided at a rotating stand that rotates and stops 180 degrees at a time, a supply conveyer and a conveyer provided at one stopping position of the rotating stand, and the other stopping position of the rotating stand. Two cutting processing mechanisms are provided on the rotating table at an interval of 180 degrees, and the rotating table is rotated by 180 degrees to transport the substrate between the feeding conveyor and the conveying conveyor and the cutting processing mechanism. There is known a turntable-type substrate cutting apparatus provided with a station (Patent Documents 1 and 2).

  The substrate cutting apparatus of Patent Documents 1 and 2 conveys the multiple-chamfered substrate supplied from one of the supply conveyors to one of the stations to the cutting processing mechanism by rotating the rotation table by 180 degrees at the same time. The cut individual substrate pieces placed on the other station are transported from the cutting processing mechanism to the transfer conveyor, and the other emptyed station is thereby supplied with a new multi-faceted substrate from the supply conveyor It is configured to

JP-A-5-198915 JP 7-9397A

  However, in the substrate cutting devices of Patent Documents 1 and 2, the rotary table is supplied between the supply of the substrates with multiple chamfers by the supply conveyor and the removal of the individual cut pieces of the substrate by the transfer conveyor. There is a problem that it is necessary to make a total of one rotation (360 degrees rotation) per substrate, resulting in poor efficiency and long processing time.

  The present invention has been made in view of the above problems, and provides a substrate dividing apparatus and a substrate dividing method capable of efficiently performing supply and cutting of a substrate and carrying out of cut pieces in parallel. The purpose is to

  A substrate dividing apparatus according to the present invention comprises a turntable having a first stage and a second stage spaced apart in the rotational direction, a supply mechanism for supplying an uncut substrate to the turntable, and the turntable. A cutting mechanism for cutting the cut uncut substrate and dividing it into pieces and frame pieces, and a carry-out mechanism for carrying out the pieces of the cut substrate cut by the cutting mechanism from the turn table, The turntable is configured to be rotatable such that the first stage is stopped at the supply position and at the discharge position different from the supply position, and the second stage is in a state where the first stage is stopped at the supply position. And the first stage is positioned at the supply position when the first stage is stopped at the discharge position. The feeding mechanism and the cutting mechanism are provided in alignment with the feeding position, and the carry-out mechanism is provided in alignment with the unloading position, and the first stage and the second stage are respectively provided with the feeding The uncut substrate can be received from the supply mechanism at a position, and the cut substrate cut by the cutting mechanism can be moved from the supply position to the carry-out position. .

  A substrate dividing method according to the present invention includes: a turntable configured to be rotatable between at least a supply position and a discharge position; a supply mechanism and a cutting mechanism provided in alignment with the supply position; and alignment with the discharge position Method of dividing a substrate by using a substrate dividing device including an unloading mechanism provided for forming a substrate, the substrate supplying step of supplying an uncut substrate from the supply mechanism to the turn table, the substrate supplying step Then, after the substrate cutting step of cutting the uncut substrate supplied to the turntable by the cutting mechanism and the substrate cutting step, the turntable is rotated to cut the cut substrate cut by the cutting mechanism A substrate position changing process for moving to a carry-out position, and a substrate carry-out process for carrying out the cut substrate by the carry-out mechanism after the substrate position change process Hints, in parallel with the substrate unloading step, characterized in that it start a new said substrate supplying step.

  As described above, according to the present invention, supply and cutting of the substrate and unloading of the cut pieces can be performed in parallel in the same time zone, so efficient parallel processing can be performed. A substrate dividing apparatus and a substrate dividing method can be provided.

It is a schematic diagram which shows an example of a board | substrate. It is a top view showing one embodiment of the substrate division device concerning the present invention. It is a front view of a substrate dividing device concerning this embodiment. It is an enlarged plan view which shows the structure in the supply position of the board | substrate division apparatus which concerns on this embodiment. It is an enlarged front view which shows the structure in the supply position of the board | substrate division apparatus which concerns on this embodiment. It is B-B 'sectional drawing of FIG. It is A-A 'sectional drawing of FIG. It is a schematic diagram regarding FIG. 7 which shows the cutting | disconnection operation | movement of the board | substrate division apparatus which concerns on this embodiment. It is a flowchart which shows operation | movement of the board | substrate division apparatus which concerns on this embodiment.

  Hereinafter, preferred embodiments for carrying out the present invention will be described using the drawings. The following embodiments do not limit the invention according to each claim, and all combinations of features described in the embodiments are not necessarily essential to the solution means of the invention. .

  FIG. 1: is a schematic diagram which shows an example of the board | substrate S cut | disconnected by the board | substrate division apparatus 1 which concerns on this embodiment. As shown in FIG. 1, the substrate S includes a plurality of pieces P, a frame piece F, and a joint J connecting the frame piece F and the pieces P.

  The schematic configuration of the substrate dividing device 1 according to the present embodiment will be described with reference to FIGS. 2 and 3. The substrate dividing device 1 according to the present embodiment is a device that divides the substrate S into the individual pieces P and the frame pieces F by cutting the joint J of the substrate S supplied from the upstream device 2.

  As shown in FIGS. 2 and 3, the substrate dividing apparatus 1 includes a turntable 10, a housing 12, a transfer auxiliary conveyor 15 (supply mechanism), a circulation conveyor 17 (circulation mechanism), a cutting robot 20 (cutting mechanism), An unloading robot 40 (loading mechanism), a control device 60, and a sensor 70 are provided.

  The upstream apparatus 2 is an apparatus for supplying the substrate S to the substrate dividing apparatus 1 and includes an upstream conveyor 16 and a support base 161 on which the upstream conveyor 16 is placed. The upstream conveyor 16 is configured to supply the substrate S to the transfer auxiliary conveyor 15 of the substrate dividing apparatus 1.

  In the present specification, the upstream device 2 side (left side from the housing 12 in FIGS. 2 and 3) in the X-axis direction is “upstream” with the housing 12 as a symmetry axis when the substrate dividing device 1 is viewed in plan The side of the circulating conveyor 17 (right side of the housing 12 in FIGS. 2 and 3) may be referred to as “downstream side”. The supply position is a position at which the uncut substrate S is supplied on the turntable 10 and the substrate S is cut by the cutting robot 20, that is, the movable range of the cutting robot 20 on the turntable 10. Further, the unloading position refers to a position where the individual pieces P are transported from the turntable 10 by the unloading robot 40, that is, a movable range of the unloading robot 40 on the turntable 10. In the substrate dividing apparatus 1 according to the present embodiment, the supply position and the carry-out position are disposed to face each other via the rotation shaft 11 of the turntable 10.

  As shown in FIGS. 2 and 3, the turntable 10 has a disk shape, and has a rotating shaft 11 at the center of the lower surface of the turntable 10. The turntable 10 is rotated by rotating the rotating shaft 11 by a motor (not shown). As shown in FIG. 3, the rotating shaft 11 is rotatably coupled to the housing 12. The turntable 10 is not limited to the disk shape, but various mechanisms can be adopted as long as it is a mechanism that can rotate around the rotation shaft 11.

  On the upper surface of the turntable 10, support bases 131a and 131b arranged so as to face each other via the rotary shaft 11 of the turntable 10 (in a positional relationship of point symmetry centering on the rotary shaft 11) are arranged Conveyors 13a and 13b (first and second stages) are placed on pedestals 131a and 131b, respectively. In other words, the pair of conveyors 13 a and 13 b face each other via the rotation shaft 11 of the turntable 10. As a result, the pair of conveyors 13a and 13b are mutually exchangeable in position by the rotation of the turntable 10 by 180 °. Further, the conveyors 13a and 13b are disposed on the turntable 10 so as to drive in both the X-axis normal and reverse directions.

  The turntable 10 rotates so that the conveyors 13a and 13b stop at the supply position and the discharge position, respectively. Thus, with the conveyors 13a and 13b, with the one conveyor 13a (first stage) stopped at the supply position, the other conveyor 13b (second stage) is located at the delivery position, and one conveyor 13a Is stopped at the delivery position, and the other conveyor 13b is disposed to be at the supply position.

  As shown in FIG. 2, the conveyors 13a and 13b have a conveyor surface consisting of two rows of belts, the frame piece F of the substrate S is mounted on each belt, and the pieces P and joints J are positioned between the belts. It has become. Thereby, damage to the belt when cutting the joint J can be prevented.

  The support bases 131a and 131b have a positioning mechanism (not shown) for stopping the substrate S supplied from the upstream apparatus 2 at the supply position. The positioning mechanism is, for example, a stopper (not shown) for positioning the substrate S in the X-axis direction by protruding in the Z-axis direction at the end adjacent to the housing 12 (the tip side in the supply direction of the substrate S). And a pressing means (clamping means) provided so as to be movable back and forth along a direction orthogonal to the supply direction of the substrate S, and pressing the side portion of the substrate S to position the substrate S in the Y axis direction. You may have. By providing the positioning mechanism, the substrate S can be positioned to be a position suitable for cutting.

  The transfer auxiliary conveyor 15 is provided at a position between the upstream conveyor 16 of the upstream device 2 and the conveyor 13a or 13b at the supply position, and supplies the substrate S supplied from the upstream device 2 to the conveyor 13a or 13b at the supply position. It is a conveyor for As shown in FIG. 2 and FIG. 3, the transfer auxiliary conveyor 15 is mounted on the support base 151.

  The substrate dividing device 1 may be configured to supply the substrate S directly to the conveyor 13a or 13b at the supply position from the upstream conveyor 16 of the upstream device 2 without providing the transfer auxiliary conveyor 15.

  The circulating conveyor 17 is a conveyor for conveying the pieces P carried out from the conveyor 13 b or 13 a at the carrying out position. As shown in FIG. 2, the circulating conveyors 17 are arranged such that four linear conveyors constitute each side of a rectangle. In FIG. 2, only one side of the circulating conveyor 17 is not shown. On the circulating conveyor 17, trays 18 for conveying the pieces P conveyed out of the conveyor 13 at the unloading position one by one circulate. In the example of FIG. 2, the tray 18 circulates counterclockwise. The number of trays 18 is the time when the circulation conveyor 17 makes a round (the period time), and the irregularity generation allowance value in the downstream apparatus after taking out (collect the tray 18 on which the individual pieces P which are defective products are placed) It is determined appropriately depending on the number of possible operations. Here, the tray 18 of the present embodiment, which transports in units of individual pieces P, can increase the number of required pieces compared to the trays that transport in units of substrate S, but it is possible to significantly reduce the manufacturing cost. As a result, the equipment cost can be reduced. In addition, the tray 18 is not limited to the structure which conveys the piece P one by one, It is also possible to set it as the structure which can accommodate and carry out the several piece P per tray.

  At connection points on each side of the circulating conveyor 17, pushers (not shown) for moving the trays 18 to conveyors forming adjacent sides are respectively provided. Further, instead of providing a pusher, the tray 18 can be configured to circulate by providing a curved conveyor at the connection point of each side of the circulating conveyor 17. Further, the circulation conveyor 17 may be formed by one conveyor capable of forming a curve, as long as the tray 18 circulates, and is not limited to the rectangular arrangement shown in FIG.

  Further, the circulating conveyor 17 is provided with a positioning mechanism (not shown) for temporarily stopping the movement of the tray 18 at a suitable position when unloading the pieces P onto the tray 18 flowing through the circulating conveyor 17. There is. The positioning mechanism of the circulating conveyor 17 is provided so as to be able to move forward and backward along the direction orthogonal to the advancing direction of the tray 18, and pressing means for pressing the side portion of the tray 18 to stop the movement of the tray 18 Although clamp means etc. can be employ | adopted, it is not limited to this, A various structure is employable.

  Although illustration is abbreviate | omitted, the downstream apparatus which receives the piece P from the tray 18 is provided in the X-axis direction downstream side of the circulation conveyor 17. As shown in FIG.

  The cutting robot 20 is provided in alignment with the supply position, and cuts the joint J of the substrate S supplied to the conveyor 13a or 13b stopped at the supply position to obtain the individual pieces P and the frame pieces F. is there. The cutting robot 20 is provided on the upstream side of the substrate dividing apparatus 1 and configured to be movable in three axial directions at the supply position. The cutting robot 20 includes a cutter 31 for cutting the joint J of the substrate S.

  The carry-out robot 40 is a device which is provided in alignment with the carry-out position, and sucks or grips the piece P of the cut substrate S from the conveyor 13 b or 13 a stopped at the carry-out position. The unloading robot 40 is provided on the downstream side of the substrate dividing apparatus 1 and is configured to be capable of moving the upper portions of the conveyor 13 b or 13 a at the unloading position and the circulating conveyor 17 in three axial directions. The unloading robot 40 includes a transfer head 41 capable of adsorbing or gripping the pieces P of the cut substrate S, and is configured to unload the pieces P from the conveyor 13 b or 13 a at the unloading position to the circulating conveyor 17. .

  The detailed configurations of the cutting robot 20 and the unloading robot 40 will be described later.

  Although not shown, the substrate dividing apparatus 1 includes a driver for rotating the turntable 10, a driver for driving the cutting robot 20 and the unloading robot 40 in three axial directions, and a pair of conveyors 13a and 13b. A driver for driving the auxiliary transfer conveyor 15 and the circulation conveyor 17 and wiring and circuits for connecting the respective components are provided. In addition, the upstream device 2 includes a driver for driving the upstream conveyor 16, various wirings, and a circuit.

  The control device 60 is connected to the turntable 10 of the substrate dividing device 1, the pair of conveyors 13a and 13b, the transfer auxiliary conveyor 15, the circulating conveyor 17, the cutting robot 20, and the driver for driving the unloading robot 40 Control these operations by sending.

  Further, the control device 60 is connected to the substrate dividing device 1 and the upstream device 2 and is configured to be able to communicate substrate supply information between the substrate dividing device 1 and the upstream device 2. The substrate supply information is information indicating the presence or absence of the uncut substrate S that can be supplied to the substrate dividing device 1. Note that “connection” among the substrate dividing device 1, the upstream device 2 and the control device 60 does not necessarily indicate that each component is physically connected by wiring or the like, but data between each component It means that it can send and receive signals, and it doesn't matter whether it is wired or wireless.

  The control device 60 transmits a request signal for substrate supply information to the upstream device 2. The upstream device 2 receives the substrate supply information request signal and transmits the substrate supply information to the control device 60. The control device 60 receives substrate supply information from the upstream device 2 and, when there is a substrate S that can be supplied, transmits a drive command to the driver for driving the transfer auxiliary conveyor 15. In the present embodiment, after transmitting the request signal to the upstream device 2, the control device 60 transmits a drive command to the driver based on the substrate supply information received from the upstream device 2 (so-called both) Although not limited to this, the control device 60 unilaterally transmits a substrate receivable signal to the upstream device 2 in a state where the substrate S can be received, and the signal is received. The upstream device 2 may be configured to supply the substrate S to the transfer auxiliary conveyor 15 (so-called one-way communication configuration).

  The sensor 70 is connected to the control device 60, and is provided at a position where the substrate S passing through the transfer auxiliary conveyor 15 can be detected. When the sensor 70 detects a substrate S supplied from the upstream conveyor 16 of the upstream device 2 and passing through the transfer auxiliary conveyor 15, the sensor 70 transmits a detection signal to the control device 60. When the control device 60 receives the detection signal from the sensor 70, the control device 60 transmits a drive command to the driver that drives the conveyor 13a or 13b at the supply position.

  In addition, the control device 60 uses substrate information indicating the information related to the substrate S such as the shape of the substrate S and the number of the individual pieces P stored in advance, the position of the joint J, or the substrate information Based on the substrate information, the cutting operation of the cutting robot 20 by the cutter 31 and the unloading operation of the individual pieces P by the transfer head 41 are determined based on the substrate information in advance or each time, and the driving command is transmitted to each driver. It is preferable that the controller 60 store and maintain a plurality of substrate types at the same time and select from among the plurality of substrate types at the time of setup change.

  Next, with reference to FIGS. 4 and 5, the configuration of the cutting robot 20 of the substrate dividing apparatus 1 will be described in detail.

  The cutting robot 20 includes two rows of frames 21 extending in the X-axis direction so as to bridge the housing 12 and the columns 121, a guide rail 22 provided on the upper surface of each frame 21, and the X-axis direction along each guide rail 22. The sliders 23 are movable on the sliders 23 so as to bridge the sliders 23, and a frame 24 extending in the Y-axis direction, a guide rail 25 provided on the X-axis side of the frame 24 and extending in the Y-axis direction. A slider 27 movable in the Y-axis direction along the guide rail 25 and a frame 27 extending in the Z-axis direction, a guide rail provided on a side surface of the frame 27 in the X-axis direction and extending in the Z-axis direction 28, a slider 29 movable in the Z-axis direction along the guide rails 28, a rotary actuator 30 provided on the slider 29, a rotor Rotating member 32 provided on the output shaft of the actuator 30 comprises a cutter 31 attached to the rotating member 32.

  The cutting robot 20 is provided with the sliders 23, 26 and 29 respectively moving in three axial directions, so that the cutter 31 can move in three axial directions. Further, the direction of the cutter 31 can be changed by rotating the rotating member 32. From the viewpoint of changing the direction of the cutter 31, the rotating member 32 can rotate 90 ° at least in the XY plane, and more preferably can rotate 360 °.

  The cutting robot 20 drives the sliders 23 and 26 with a driver (not shown) based on the substrate information indicating the information on the substrate S to move the cutter 31 in the XY plane so that the cutter 31 is positioned above the joint J. The joint J of the substrate S is cut by rotating the rotary member 32 in accordance with the direction of J to change the direction of the cutter 31, and driving the slider 29 to lower the cutter 31 in the Z-axis direction. When cutting of one joint J is completed, the cutter 31 is raised in the Z-axis direction. The cutting robot 20 cuts the joints J of the substrate S one by one by repeating the above operation.

  In the present embodiment, the cutter 31 is used as the cutting means and the direction of the cutter 31 is changed by the rotary actuator 30 and the rotating member 32. However, the present invention is not limited to this. For example, a router cutter (spin cutter) or the like may be used instead of 31. When using a router cutter, it is possible to cut the substrate S by bringing the tip of the router cutter into contact with the joint J while rotating the router cutter at high speed by the rotating member 32 when cutting the substrate S. In addition, when using a router cutter, it is necessary to use what has the capability to rotate an output shaft at high speed as compared with the rotary actuator 30 in the case of using the cutter 31 as a rotary actuator.

  As shown in FIGS. 2 and 3, the carry-out robot 40 is provided to bridge the housing 12 and the column 122. In addition, the unloading robot 40 has a configuration in which the cutter 31 of the cutting robot 20 is replaced with the transfer head 41, and the transfer head 41 can move in three axial directions, and the rotating member 32 rotates. The transfer head 41 is configured to rotate, thereby changing the direction of the piece P. The configuration common to the cutting robot 20 in the unloading robot 40 is omitted from the drawings and the detailed description.

  The unloading robot 40 moves on the XY plane so that the transfer head 41 is positioned above one individual piece P based on the substrate information indicating information on the substrate S, and rotates appropriately in accordance with the direction of the individual piece P. By rotating the member 32, the direction of the transfer head 41 is changed, and the transfer head 41 is lowered in the Z-axis direction to be in contact with the piece P, and the piece P is adsorbed or gripped. After suctioning or gripping the pieces P, the transfer head 41 is raised in the Z-axis direction and moved in the XY plane so as to be positioned above the tray 18 of the circulating conveyor 17 and rotated appropriately in accordance with the direction of the tray 18 By rotating the member 32, the direction of the transfer head 41 is changed, the transfer head 41 is lowered in the Z-axis direction, the piece P is placed on the tray 18, and the suction or the gripping is released. When the delivery of one piece P is completed, the transfer head 41 is raised in the Z-axis direction. The unloading robot 40 unloads the pieces P one by one by repeating the above operation.

  As the transfer head 41, for example, various known means such as a mechanical chuck having a gripper or a vacuum chuck having a suction pad can be adopted, so the detailed description thereof will be omitted.

  Next, with reference to FIGS. 6-8, the raising / lowering table 80 of the board | substrate dividing apparatus 1 which concerns on this Embodiment is demonstrated. 6 to 8, only the upstream side of the substrate dividing apparatus 1 is shown for simplification of the drawing. As shown in FIGS. 6-8, one conveyor 13a is stopped at the supply position. As shown in FIGS. 6 and 7, the substrate dividing apparatus 1 according to the present embodiment includes a lifting table 80 for supporting the substrate S between the belts of the conveyors 13a and 13b. The lifting table 80 is provided on each of the supports 131a and 131b, and is configured to be able to move up and down in the Z-axis direction.

  The lifting table 80 is such that the length in the Y-axis direction of the upper surface is smaller than the distance between the belts of the conveyors 13a and 13b so that the lifting table 80 does not collide with the belts of the conveyors 13a and 13b. Further, the length in the X-axis direction of the upper surface is smaller than the length in the X-axis direction of each belt of the conveyors 13a and 13b.

  At an appropriate position of the lifting table 80, the cutter 31 can enter between the individual pieces P and the individual pieces P of the substrate S and between the individual pieces P and the frame pieces F so that the joint J can be cut, A recess 81 of appropriate shape is provided. In other words, the upper surface of the lift table 80 is configured not to be in contact with the joint J when the substrate S is placed by having the recess 81. The position and the shape of the recess 81 differ depending on the type of substrate to be cut. Therefore, for example, it is preferable to configure the upper surface portion of the lifting table 80 to have a replaceable layer structure and to replace the upper layer portion according to the type of substrate to be cut at the time of setup replacement. The recess 81 may be a groove extending in the X-axis direction and / or the Y-axis direction, or may be a recess provided locally.

  Further, the lifting table 80 is provided with a reference pin (not shown) protruding in the Z-axis direction in order to position the substrate S. For example, the reference pin may be configured to engage with a pin hole provided in advance in the substrate S, or may be configured to engage with a gap between the piece P and the frame piece F. Further, the positions and the number of reference pins can be arbitrarily set according to the kind of substrate to be cut.

  The lifting table 80 is configured to be movable in the Z-axis direction by the lifting actuator 82 and moves up and down along a guide post 83 fixed to the support base 131. Further, as shown in FIG. 8, the lifting table 80 ascends until the upper surface of the substrate S is higher than the upper surface of the conveyor 13a or 13b at the supply position when the substrate S is cut.

  The lifting table 80 is configured to be capable of vacuum-sucking the substrate S at the time of cutting the substrate S at the supply position and at the time of rotation of the turntable 10 after cutting. This makes it possible to position and fix the substrate S at the time of cutting the substrate S and at the time of movement after the cutting.

  Further, the lifting table 80 releases the suction of the pieces P when the pieces P are carried out at the carry-out position. At the unloading position, after the suction by the lift table 80 is released, the positioning of the piece P is performed by the above-described reference pin.

  As shown in FIG. 8, at the time of cutting the substrate S at the supply position, the cutter 31 descends to a position at which the tip does not contact the bottom surface of the recess 81 of the lifting table 80 and cuts the joint J of the substrate S .

  Next, with reference to FIG. 9, a substrate dividing method of dividing a substrate using the substrate dividing device 1 according to the present embodiment will be described. As described above, each configuration of the substrate dividing device 1 operates by the control device 60 transmitting a drive command to the driver.

  The control device 60 first executes a substrate supply step of supplying the uncut substrate S to the turntable 10 from the transfer auxiliary conveyor 15 (supply mechanism). Specifically, in step S1, when there is a substrate S supplied from the upstream apparatus 2, the transfer auxiliary conveyor 15 and one conveyor 13a (first stage) stopped at the supply position are rotated by the turntable 10. The substrate S is supplied to the conveyor 13 a by driving in the direction toward the axis 11. Next, in step S2, the substrate S is stopped at a position suitable for cutting on the conveyor 13a.

  Next, the control device 60 executes a substrate cutting step of cutting the uncut substrate S supplied to the turntable 10 by the cutting robot 20 (cutting mechanism). Specifically, in step S3, the lift table 80 at the supply position is raised, and the substrate S is adsorbed by vacuum suction. Next, in step S4, the cutting robot 20 is driven to cut the joint J of the substrate S.

  When cutting of all joints J is completed, the control device 60 rotates the turntable 10 to change the substrate position to move the cut substrate (pieces P and frame pieces F) cut by the cutting robot 20 to the unloading position Perform the process Specifically, in step S5, the turntable 10 is rotated by 180 ° to move the conveyor 13a to the unloading position. As a result, the other conveyor 13 b (second stage) is moved to the supply position.

  After the rotation of the turntable 10, the control device 60 executes a substrate unloading step of unloading the individual pieces P by the unloading robot 40 (loading mechanism). Specifically, in step S6, the suction of the pieces P by the lifting table 80 moved to the carry-out position is released, and the carry-out robot 40 is driven to place the pieces P on the tray 18 flowing through the circulating conveyor 17. Take out one by one. The pieces P placed on the tray 18 are carried out of the circulating conveyor 17 to a downstream device (not shown). When the delivery of all the pieces P is completed, the lifting table 80 is lowered in step S7. Next, in step S8, the conveyor 13a at the unloading position is driven in a direction away from the rotation shaft 11 of the turntable 10, and the frame piece F is dropped and removed.

  In addition, when there is a supply of a new uncut substrate S from the upstream device 2, the control device 60 newly starts the above-described substrate supply process in parallel with the substrate unloading process. Specifically, at the same time as performing steps S6 to S8, in step S9, the control device 60 supplies a new uncut substrate S to the conveyor 13b at the supply position. Next, in step S10, the conveyor 13b is stopped so that the substrate S is stopped at a position suitable for cutting on the conveyor 13b. Next, in step S11, the lift table 80 is raised, and the substrate S is adsorbed by vacuum suction. Next, in step S12, the cutting robot 20 is driven to cut the joint J of the substrate S. When cutting of all the joints J is completed, in step S13, the turntable 10 is rotated by 180 °, and the conveyor 13b is moved to the unloading position. Thereby, the conveyor 13a is moved to the supply position again. When there is no supply of a new uncut substrate S from the upstream device 2, although illustration is omitted in FIG. 9, after performing steps S6 to S8 without performing step S9 and subsequent steps, It will be in the operation standby state.

  When the rotation of the turntable 10 in step S13 is completed, the control device 60 determines in step S14 whether or not there is an uncut substrate S supplied from the upstream device 2 by the sensor 70 and passing through the transfer auxiliary conveyor 15 judge. The control device 60 unilaterally transmits a substrate receivable signal to the upstream device 2 in a state where the substrate S can be received, and the upstream device 2 supplies the substrate S to the transfer auxiliary conveyor 15 in response to the signal. In the case of the configuration (a configuration of so-called one-way communication), step S14 of the determination is not executed unlike the illustration of FIG. In this case, steps S6 to S8 and steps S9 to S12 are repeatedly executed regardless of the presence or absence of the substrate S until the worker manually stops the substrate dividing apparatus 1.

  If there is an uncut substrate S (Yes), steps S6 to S8 and steps S9 to S12 are performed again simultaneously. When there is no substrate S (No), in step S15, the suction of the piece P by the lifting table 80 of the conveyor 13b moved to the unloading position is canceled as in step S6, and the unloading robot 40 is driven to circulate. The pieces P are carried out one by one onto the tray 18 flowing through the conveyor 17. Then, in steps S16 and S17, as in steps S7 and S8, when unloading of all the pieces P is completed, the lifting table 80 is lowered and the conveyor 13b is driven to drop and discard the frame piece F.

  When step S17 is completed, in step S18, it is determined by the sensor 70 whether or not there is an uncut substrate S supplied from the upstream device 2 and passing through the transfer auxiliary conveyor 15. If there is an uncut substrate S (Yes), the process returns to step S1, and steps S1 to S17 are executed again. When there is no uncut substrate S (No), the operation standby state is set. As in the case of the configuration of one-way communication, as in the case of step S14, unlike the illustration of FIG. 9, step S18 of the determination is not performed, and the operator manually performs the substrate dividing device 1 Need to stop.

  As described above, the substrate dividing apparatus 1 according to the present embodiment can efficiently perform the supply and cutting of the substrate, the unloading of the cut pieces, and the discarding of the frame pieces in parallel. Time can be shortened. In particular, by improving the time efficiency of individual pieces (small, irregular, etc.) unsuitable for conveyor conveyance after completion of cutting, the interval time for supplying individual pieces after cutting in the post process and waiting time of the post process are reduced. can do.

  The substrate dividing apparatus according to the present invention is not limited to the above embodiment, and various modifications can be made without departing from the technical concept of the present invention.

  For example, in the above-described embodiment, the cutting robot 20 and the unloading robot 40 have been described as being configured so that the cutter 31 and the transfer head 41 can be moved in three axial directions by a frame type. It can also be a multi-axis robot type. In the case of the multi-axis robot type, there is no need to provide a frame extending in three axial directions, so the size of the substrate dividing apparatus can be reduced.

  Moreover, in the above-mentioned embodiment, although the case where conveyors 13a and 13b on the turntable 10 were 1 pair was demonstrated, it can also be 2 or more pairs. In this case, the conveyor is disposed at each angle calculated by 360 ° / (number of pairs × 2). In this case, the feed position is arranged at every angle calculated by the number of 360 ° / pair, and the carry-out position is 360 ° /, so that the feed position and the carry-out position are alternately positioned in the rotational direction on each conveyor. It is arranged for each angle calculated by the number of pairs. The cutting robot 20 is provided in alignment with each supply position, and the unloading robot 40 is provided in alignment with each unloading position. Even with such a configuration, each stage can be alternately stopped at the supply position and the discharge position by rotating the turntable 10 by an angle calculated by 360 ° / (number of pairs × 2), and the substrate Supply and cutting, and unloading of the cut substrate piece can be efficiently performed in parallel. For example, in the case of two pairs of conveyors, conveyors are provided every 90 °.

  When the feed position and the carry-out position are two or more pairs, the feed position and the carry-out position may be provided to face each other via the rotary shaft 11 of the turntable 10. In this case, the plurality of supply positions and the plurality of discharge positions may be adjacent to each other in the rotational direction. The conveyors are arranged on the turntable 10 at every angle calculated by 360 ° / (number of pairs × 2) so as to be able to stop at the supply position and the discharge position. The cutting robot 20 is provided in alignment with each supply position, and the unloading robot 40 is provided in alignment with each unloading position. As described above, even when the supply position and the discharge position face each other, each stage can be alternately stopped at the supply position and the discharge position by rotating the turntable 10 by 180 °, so that the substrate is supplied and cut. And unloading of the cut substrate piece can be efficiently performed in parallel.

  Further, in the above embodiment, when the first stage 13a and the second stage 13b are stopped at the supply position, the uncut substrate S is supplied in the direction toward the rotation axis 11 of the turntable 10. Although described as being a configured conveyor, it is not limited thereto.

  In the above-described embodiment, the first stage 13a and the second stage 13b remove the frame piece F after the piece P of the cut substrate S moved from the supply position to the discharge position is unloaded by the unloading mechanism 40. Although described as being configured as possible, it is not limited to this. For example, when the substrate to be cut does not have a frame piece, the operation of removing the frame piece is unnecessary.

  In the above-described embodiment, the substrate dividing apparatus 1 is described as further including the tray 18 for loading the pieces P unloaded by the unloading mechanism 40 and the circulation mechanism 17 in which the tray circulates. It is not limited to this.

  S: substrate, P: individual piece, F: frame piece, J: joint, 1: substrate dividing device, 2: upstream device, 10: turntable, 1 · · Rotating shaft, 12 · · · Housing, 13a, 13b · · · · · · · · 15 auxiliary transfer conveyor, 16 · · · upstream conveyor, 17 · · · · · · · · · · 20 tray ······················································································································································································································································································· Robot

Claims (6)

A turntable having a first stage and a second stage spaced apart in the rotational direction;
A supply mechanism for supplying an uncut substrate to the turntable;
A cutting mechanism for cutting the uncut substrate supplied to the turntable and dividing the uncut substrate into pieces and frame pieces;
An unloading mechanism for unloading the individual pieces of the cut substrate cut by the cutting mechanism from the turntable;
The turntable is configured to be rotatable such that the first stage is stopped at a supply position and at a discharge position different from the supply position.
The second stage is located at the unloading position when the first stage is stopped at the supply position, and is located at the supply position when the first stage is stopped at the unloading position. Provided to
The supply mechanism and the cutting mechanism are provided in alignment with the supply position,
The unloading mechanism is provided in alignment with the unloading position.
The first stage and the second stage are each capable of receiving the uncut substrate from the supply mechanism at the supply position, and the cut substrate cut by the cutting mechanism from the supply position A substrate dividing device characterized in that it is movable to an unloading position. The first stage and the second stage are configured to be supplied with the uncut substrate in a direction toward the rotation axis of the turntable when stopped at the supply position. The substrate dividing device according to Item 1. The substrate dividing device according to claim 1, wherein the supply position and the discharge position are opposed to each other through a rotation axis of the turntable. The first stage and the second stage are configured to be able to remove the frame piece after the individual pieces of the cut substrate moved from the supply position to the discharge position are carried out by the carry-out mechanism. The substrate dividing device according to any one of claims 1 to 3, characterized in that A tray on which the pieces unloaded by the unloading mechanism are placed;
The substrate dividing apparatus according to any one of claims 1 to 4, further comprising: a circulation mechanism through which the tray circulates. A turntable configured to be rotatable between at least a supply position and a discharge position, a supply mechanism and a cutting mechanism provided in alignment with the supply position, and a discharge mechanism provided in alignment with the discharge position; A substrate dividing method for dividing a substrate using the provided substrate dividing device, comprising:
A substrate supply step of supplying an uncut substrate from the supply mechanism to the turntable;
A substrate cutting step of cutting the uncut substrate supplied to the turntable by the cutting mechanism after the substrate supply step;
A substrate position changing step of rotating the turn table after the substrate cutting step to move the cut substrate cut by the cutting mechanism to the unloading position;
And a substrate unloading step of unloading the cut substrate by the unloading mechanism after the substrate position changing step.
In parallel to the substrate unloading step, the substrate supply step is newly started.

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