JP2019079619A - Method for manufacturing organic el display panel - Google Patents

Abstract

To provide a method for manufacturing an organic EL display panel capable of reducing generation of color mixture caused by a defective part of a bank and occurrence of a display failure caused by repair of the bank.SOLUTION: A method for manufacturing an organic EL display panel comprises the steps of: preparing a substrate; forming a plurality of long banks extending on the substrate in a column direction; detecting a defective part in the bank; determining whether or not bank trimming for removing a part of the bank is necessary for the defective part; performing bank trimming for removing a periphery of the defective part of the bank when the bank trimming is determined to be necessary; re-forming the bank for the region removed by the bank trimming; and forming a light-emitting layer by applying an ink containing an organic light-emitting material in a space between the plurality of banks.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a method of manufacturing an organic EL display panel in which organic EL (Electro Luminescence) elements utilizing an electroluminescence phenomenon of an organic material are arranged in a matrix, and in particular to a process of forming a bank.

  In recent years, organic EL display panels have been put to practical use as light emitting display devices. In the organic EL display panel, each organic EL element has a basic structure in which a light emitting layer containing an organic light emitting material is disposed between a pair of electrodes of an anode and a cathode, and when driven, between the pair of electrodes It is a current-driven light emitting element generated as a result of recombination of holes injected from the anode to the light emitting layer and electrons injected from the cathode to the light emitting layer when a voltage is applied.

In the manufacture of the organic EL display panel, the substrate is partitioned by banks, and a light emitting layer is formed in each partition. The bank is formed by patterning in a bank shape by a photolithographic method using a photosensitive thermosetting resin, and heating and baking.
In order to form a light emitting layer, a wet method is often used in which an ink for forming a light emitting layer containing a polymer material or a low-molecular-weight thin film-forming property is applied to a concave space by an inkjet method or the like. According to this wet method, the organic functional layer including the light emitting layer can be relatively easily formed even in a large panel.

  For example, in Patent Document 1, a plurality of elongated banks extending in the column direction are formed on a substrate, and a light emitting layer is formed by applying an ink containing an organic light emitting material in the gaps between the plurality of banks. A method of manufacturing a line bank type organic EL display panel has been proposed. According to the line bank method, since the ink can flow in the gap along the bank, the variation in film thickness at the time of ink application is made uniform by the flow of ink, and a light emitting layer with a uniform film thickness is formed. be able to. As a result, it is possible to manufacture an organic EL display panel with less luminance unevenness.

Unexamined-Japanese-Patent No. 2007-234232 JP 2017-33813 A

If there is a defect in the bank, the ink applied in the gap may intrude into the adjacent gap through the defect and a mixed color area may be generated where inks of different luminescent colors are mixed. In particular, in the line bank method, mixed color ink flows along a bank, which may cause a display failure over a plurality of pixels.
As a repair method for a defective portion of a line bank, for example, Patent Document 2 discloses a technique for suppressing display defects by forming a weir surrounding the defective portion in the gap on both sides of the defective portion.

  By forming a weir surrounding the defect in the gap on both sides of the defect, it is possible to suppress the spread of mixed color areas where inks of different emission colors are mixed beyond the weir, and reduce display defects due to light emission defects. It is thought that it can be done. However, when a weir is provided, a color mixing area may be generated inside the weir, and display defects may occur such as a sub-pixel at a position where the weir is provided may not emit light properly.

  An object of the present disclosure is to provide a method of manufacturing an organic EL display panel capable of reducing the occurrence of display defects caused by color mixing caused by defective portions of banks and repair of the banks.

  In a method of manufacturing an organic EL display panel according to an aspect of the present disclosure, a step of preparing a substrate, a step of forming a plurality of elongated banks extending in the column direction on the substrate, and detecting a defective portion in the bank Step of determining the necessity of bank trimming for removing a part of the bank with respect to the defective portion, and bank trimming for removing the periphery of the defective portion of the bank when it is determined that the bank trimming is necessary. Forming a light emitting layer by applying an ink containing an organic light emitting material to a gap between a plurality of banks. And.

  According to the method of manufacturing an organic EL display panel according to the above aspect, it is possible to reduce the occurrence of display defects caused by color mixing caused by defective portions of the banks and repair of the banks.

It is a schematic block diagram which shows the structural example of the organic electroluminescence display which concerns on embodiment. FIG. 1 is a partial plan view schematically showing a display panel according to an embodiment. It is the partially expanded sectional view which cut | disconnected the display panel which concerns on embodiment by the AA 'line of FIG. It is a schematic process drawing which shows the manufacturing process of the display panel which concerns on embodiment. (A) is a model perspective view which shows an example of the defect part which arises in a bank. (A) It is a model perspective view showing another example of the defective part which arose in the bank by the foreign material, (b) is a model perspective view showing another example of the defective part which arose in the bank by the foreign material. c) is a schematic perspective view showing an example of a defective portion produced in the bank due to breakage. It is a schematic block diagram which shows an example of the manipulator apparatus used for repair of a bank. It is a figure which shows the mode of a foreign material removal process typically. It is a figure which shows typically the cut-in position set around the defect part. It is a figure which shows the mode of bank trimming typically. It is a schematic block diagram which shows an example of the dispenser apparatus used for repair of a bank. It is a figure which shows typically the application position set to the trimmed area | region of the bank. It is a figure which shows typically a mode that a bank repair material is apply | coated to an application position. It is a figure which shows the bank after repair typically. It is a figure which shows typically a mode that repair parts are installed in the trimmed area | region of a bank. It is a figure explaining the judgment standard in the processing which judges the necessity of performing bank trimming. It is a figure which shows typically the application position set to the trimmed area | region of the bank. It is a figure which shows typically a mode that a bank repair material is apply | coated to an application position. It is a figure which shows an example of the nozzle shape of a dispenser apparatus. It is a figure explaining the subject of bank re-formation processing by application of bank repair material. It is a figure explaining the modification of the bank trimming process in, when performing the bank re-formation process by application of a bank repair material. It is a figure explaining the modification of bank re-formation processing and bank trimming processing by installation of repair parts.

<Overview of the Invention>
(1) A method of manufacturing an organic EL display panel according to a first aspect of the present disclosure includes the steps of: preparing a substrate; forming a plurality of elongated banks extending in the column direction on the substrate; A step of detecting a defective portion in the bank, a step of determining the necessity of bank trimming for removing a part of the bank with respect to the defective portion, and the bank trimming when it is determined that the bank trimming is necessary. A step of performing bank trimming to remove the periphery of the defect, a step of re-forming the bank to the area removed by the bank trimming, and an ink containing an organic light emitting material in the gap between the plurality of banks Forming a light emitting layer by applying a light emitting material.

According to the method of manufacturing an organic EL display panel according to the first aspect, it is possible to reduce the occurrence of display defects caused by color mixing caused by defective portions of the banks and repair of the banks.
(2) The method of manufacturing an organic EL display panel according to the second aspect of the present disclosure is the method of manufacturing an organic EL display panel according to the first aspect, wherein the step of forming the bank bakes the patterned bank material The step of determining the necessity of the bank trimming, including the step, is characterized in that when foreign matter adheres to the bank prior to the step of baking the bank material, it is determined that the bank trimming is necessary. I assume.

According to the method of manufacturing an organic EL display panel according to the second aspect, the bank trimming and the re-formation of the bank are performed on the foreign matter seized in the bank by the baking process, and the bank is repaired so that the color mixture does not occur. it can.
(3) In the method of manufacturing an organic EL display panel according to the third aspect of the present disclosure, in the method of manufacturing an organic EL display panel according to the first aspect, the step of determining the necessity of the bank trimming is the width of the bank It is characterized in that it is determined that the bank trimming is necessary when the ratio of the size of the defective area of the bank to the above is greater than or equal to a predetermined threshold value.

According to the method of manufacturing an organic EL display panel according to the third aspect, bank trimming and re-formation of a bank are performed on a partially deficient bank to repair the bank so that color mixing does not occur. it can.
(4) In the method of manufacturing an organic EL display panel according to the fourth aspect of the present disclosure, in the method of manufacturing an organic EL display panel according to the first aspect, when it is determined that bank trimming is unnecessary, the defect In the case where the part is a deletion of the bank and the bank is divided due to the deletion, the method further includes the step of re-forming the bank with respect to the deletion area of the bank.

According to the method of manufacturing an organic EL display panel according to the fourth aspect, it is possible to repair the bank so that color mixing does not occur by re-forming the bank with respect to the bank divided due to the defect.
(5) In the method of manufacturing an organic EL display panel according to the fifth aspect of the present disclosure, in the method of manufacturing an organic EL display panel according to any one of the first to fourth aspects, the bank is thermally cured It is characterized in that a metallic bank repair material is applied to the area from which the bank has been removed by the bank trimming and baking is performed.

According to the method of manufacturing an organic EL display panel according to the fifth aspect, it is possible to repair the bank so that color mixing does not occur by using dispenser application, an inkjet method, or the like.
(6) In the method of manufacturing an organic EL display panel according to the sixth aspect of the present disclosure, in the method of manufacturing an organic EL display panel according to any one of the first to fourth aspects, the bank formation is performed in advance It is characterized in that it is performed by installing a bank repair part formed in a shape in an area where the bank is removed by the bank trimming.

According to the manufacturing method of the organic EL display panel according to the sixth aspect, since the repair is performed using the repair parts which are already in shape, the repair is performed without breaking the shape of the repaired portion without depending on the characteristics of the paste. It is possible.
(7) In the method of manufacturing an organic EL display panel according to the seventh aspect of the present disclosure, in the method of manufacturing an organic EL display panel according to the fifth aspect, in the bank trimming, part of the area where the bank is removed The method further comprises forming a guard portion for suppressing the outflow of the bank repair material in a region of the gap between the plurality of banks to which the organic light emitting material is applied when the bank repair material is applied. I assume.

According to the method of manufacturing an organic EL display panel according to the seventh aspect, it is possible to suppress the collapse of the shape of the bank repair material caused by the application point of the bank repair material.
(8) A method of manufacturing an organic EL display panel according to an eighth aspect of the present disclosure is the method of manufacturing an organic EL display panel according to the fifth aspect, wherein the bank trimming removes the bank of the bank. When the bank repair material is applied to a portion in contact with the area, a groove is formed to which the bank repair material flows.

According to the method of manufacturing an organic EL display panel according to the eighth aspect, it is possible to suppress the collapse of the shape of the bank repair material caused by the application point of the bank repair material.
(9) In the method of manufacturing an organic EL display panel according to the ninth aspect of the present disclosure, in the method of manufacturing an organic EL display panel according to the sixth aspect, the bank repair parts have unevenness in both column direction ends in plan view. In the bank trimming, the shapes of both ends in the column direction of the portion where the banks are removed in plan view correspond to the shapes of both ends in the column direction of the bank repair parts, Cutting the bank.

According to the method of manufacturing an organic EL display panel according to the ninth aspect, positional deviation of the installation position of the bank repair part can be suppressed.
(10) In the method of manufacturing an organic EL display panel according to a tenth aspect of the present disclosure, in the method of manufacturing an organic EL display panel according to the fifth aspect, the bank repair material is coated by removing the bank by the bank trimming. The bank repair material is dropped onto a plurality of application points set in a different area, and the plurality of application points are stretched in the column direction in the area where the bank is removed by the defective area or the bank trimming. It is characterized in that it is set at each intersection point of one or more straight lines and a plurality of straight lines extending in the row direction.

According to the method of manufacturing an organic EL display panel according to the tenth aspect, it is possible to repair the bank so as not to cause color mixing by using a dispenser application, an inkjet method, or the like.
(11) In the method of manufacturing an organic EL display panel according to an eleventh aspect of the present disclosure, in the method of manufacturing an organic EL display panel according to the tenth aspect, the plurality of application points have banks removed by the bank trimming. An application point set on each of straight lines at both ends in the row direction, among the straight lines in the column direction, is set at the intersections of three or more straight lines in the column direction and straight lines in the row direction in the region. When the first application point and the other application points are the second application point, after the bank repair material is dropped to the first application point, the bank repair material is dropped to the second application point. I assume.

According to the method of manufacturing an organic EL display panel according to the eleventh aspect, it is possible to reduce the breakage of the shape of the bank repair material which may occur when the bank is re-formed by using a dispenser application, an inkjet method, or the like.
(12) A method of manufacturing an organic EL display panel according to a twelfth aspect of the present disclosure is the method of manufacturing an organic EL display panel according to the eleventh aspect, including repairing the first bank repair material dropped onto the first application point The first bank repair material is characterized by having a viscosity higher than that of the second bank repair material, when the bank repair material to be dropped to the second application point is used as the material and the second bank repair material is used as the material.

According to the method of manufacturing an organic EL display panel according to the twelfth aspect, it is possible to reduce the breakage of the shape of the bank repair material that may occur when the bank is re-formed by using a dispenser application, an inkjet method, or the like.
(13) In the method of manufacturing an organic EL display panel according to a thirteenth aspect of the present disclosure, in the method of manufacturing the organic EL display panel according to the tenth aspect, the plurality of application points have banks removed by the bank trimming. The nozzle shape set for each of the intersections of one column direction straight line and a plurality of row direction straight lines in the region and used for dropping the bank repair material is an elliptical or rectangular shape with the major axis in the row direction. It is characterized in that it is either.

According to the method of manufacturing an organic EL display panel according to the thirteenth aspect, it is possible to reduce the breakage of the shape of the bank repair material which may occur when the bank is re-formed by using a dispenser application, an inkjet method, or the like.
Embodiment
[Overall Configuration of Organic EL Display Device]
FIG. 1 is a schematic block diagram showing the configuration of an organic EL display device 1 having a display panel 100 according to the embodiment.

  As shown in FIG. 1, the organic EL display device 1 includes a display panel 100 and a drive control unit 101 connected thereto. The display panel 100 is a panel utilizing an electroluminescence phenomenon of an organic material, and as shown in FIG. 2, a plurality of light emitting elements (organic EL elements) 10 are arranged in a matrix on a substrate. The drive control unit 101 includes four drive circuits 102 to 105 and a control circuit 106.

The arrangement of the drive control unit 101 with respect to the display panel 100 is not limited to this.
[Configuration of organic EL display panel]
FIG. 2 is a plan view schematically showing a schematic configuration as viewed from the display surface side of the display panel 100. As shown in FIG. FIG. 3 is a partially enlarged cross-sectional view of the display panel 100 taken along line AA ′ of FIG. The display panel 100 is a so-called top emission type, and the Z direction side is a display surface.

The configuration of the display panel 100 will be described with reference to FIGS.
As shown in FIG. 3, the display panel 100 mainly includes the base substrate 11, the pixel electrode 12, the hole injection layer 13, the first bank 14, the organic light emitting layer 15, the electron transport layer 16, and the common electrode 17. A sealing layer 18 is provided.
The hole injection layer 13, the organic light emitting layer 15, and the electron transport layer 16 correspond to a functional layer, and the functional layer is sandwiched between the pixel electrode 12 and the common electrode 17.

The light emitting elements 10R, 10G, and 10B each having the organic light emitting layer 15 corresponding to any of the red (R), green (G), and blue (B) light emission colors are sub-pixels, as shown in FIG. Sub-pixels are arranged in a matrix.
In addition, in FIG. 2, the state which removed the electron carrying layer 16, the common electrode 17, and the sealing layer 18 is shown.

[Base substrate]
The base substrate 11 includes a substrate body 11 a, a TFT (thin film transistor) layer 11 b, and an interlayer insulating layer 11 c.
The substrate body portion 11a is a portion to be a base material of the display panel 100, and can be formed of any of insulating materials such as non-alkali glass, soda glass, polycarbonate resin, polyester resin, and alumina.

The TFT layer 11b is provided for each sub-pixel on the surface of the substrate body 11a, and a pixel circuit including a thin film transistor element is formed in each of the sub-pixels.
The interlayer insulating layer 11c is formed on the TFT layer 11b. The interlayer insulating layer 11 c is made of an organic insulating material such as polyimide resin, acrylic resin, novolac type phenol resin, or an inorganic insulating material such as SiO (silicon oxide) or SiN (silicon nitride). And even if there is a step on the top surface of the TFT layer 11b, it has the function of suppressing the influence on the underlying surface on which the pixel electrode 12 is formed.

[Pixel electrode]
The pixel electrode 12 is a pixel electrode provided individually for each sub-pixel on the base substrate 11, and, for example, Ag (silver), Al (aluminum), aluminum alloy, Mo (molybdenum), APC (silver, palladium) , Copper alloy) and the like, and made of a light reflective conductive material. In the present embodiment, the pixel electrode 12 is an anode.

A known transparent conductive film may be further provided on the surface of the pixel electrode 12. As a material of the transparent conductive film, for example, indium tin oxide (ITO) or indium zinc oxide (IZO) can be used. The transparent conductive film is interposed between the pixel electrode 12 and the hole injection layer 13 and has a function of improving the adhesion between the layers.
[Hole injection layer]
The hole injection layer 13 is made of, for example, an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir) or PEDOT. It is a layer of conductive polymer material such as (mixture of polythiophene and polystyrene sulfonic acid). Among the above, the hole injection layer 13 made of metal oxide has a function of injecting and transporting holes to the organic light emitting layer 15 in a stable manner or by assisting the generation of the holes.

[bank]
A plurality of strip-shaped first banks 14 are provided in parallel on the surface of the hole injection layer 13 in a plan view extending along the Y direction (first direction). The first bank 14 is made of an insulating organic material (for example, an acrylic resin, a polyimide resin, a novolac phenolic resin, etc.).

The cross section of each first bank 14 is trapezoidal as shown in FIG. 3 and gaps 20 (20R, 20G, 20B) partitioned by the first banks 14 are formed between the first banks 14. A plurality of pixel electrodes 12 are arranged in the Y direction at the bottom of each gap 20, and a hole injection layer 13, an organic light emitting layer 15, and an electron transport layer 16 as functional layers are formed thereon.
The first bank 14 functions as a structure that separates the light emitting elements 10 adjacent to each other in the X direction and prevents the applied ink from overflowing when the organic light emitting layer 15 is formed by a wet method. .

The second bank 24 is lower in height than the first bank 14 (see FIG. 7) and is formed between the pixel electrode 12 and the pixel electrode 12 adjacent in the Y direction in each gap 20 and adjacent in the Y direction The light emitting elements 10 are partitioned. That is, the display panel 100 is an organic EL display panel having a so-called line bank.
The positions of the plurality of second banks 24 formed in the Y direction are the same in each of the plurality of gaps 20. Each second bank 24 extends in the X direction (second direction), passes below the first bank 14, is connected to the adjacent second bank 24, and extends in the X direction. Accordingly, the entire first bank 14 and the second bank 24 are formed in a grid shape on the base substrate 11 (see FIG. 2).

[Organic light emitting layer]
The organic light emitting layer 15 is a site where carriers (holes and electrons) recombine to emit light, and includes an organic material corresponding to any color of R, G, and B.
The organic light emitting layer 15 is formed in a groove-shaped gap (refer to the gaps 20R, 20G, and 20B in FIG. 7) extending in the Y direction partitioned by the first bank 14 described above.

A gap 20R shown in FIG. 7 is a gap in which a red light emitting layer is formed and a red light emitting element 10R is formed, and a gap 20G and a gap 20B are green and blue light emitting layers respectively formed. , And blue light emitting elements 10G and 10B are formed.
Accordingly, the organic light emitting layers 15 having different colors are disposed with the first bank 14 interposed therebetween.

  As a material of the organic light emitting layer 15, for example, polyparaphenylene vinylene (PPV), polyfluorene, oxinoid compound, perylene compound, coumarin compound, azacoumarin compound, oxazole compound, oxadiazole compound, perinone compound, pyrrolopyrrole compound, naphthalene Compound, anthracene compound, fluorene compound, fluoranthene compound, tetracene compound, pyrene compound, coronene compound, quinolone compound and azaquinolone compound, pyrazoline derivative and pyrazolone derivative, rhodamine compound, chrysene compound, phenanthrene compound, cyclopentadiene compound, stilbene compound, diphenylquinone Compounds, styryl compounds, butadiene compounds, dicyanomethylenepyran compounds, dicyanomethylenethiopyran compounds , Fluorescein compounds, pyrilium compounds, thiapyrilium compounds, selenapyrilium compounds, telluropyrilium compounds, aromatic aldadiene compounds, oligophenylene compounds, thioxanthene compounds, cyanine compounds, acridine compounds, metal complexes of 8-hydroxyquinoline compounds, 2-bipyridine compounds Metal complexes of Schiff salts, complexes of Schiff salts and Group III metals, fluorescent materials such as oxine metal complexes, and rare earth complexes.

[Electron transport layer]
The electron transport layer 16 has a function of transporting electrons injected from the common electrode 17 to the organic light emitting layer 15, and, for example, oxadiazole derivative (OXD), triazole derivative (TAZ), phenanthroline derivative (BCP, Bphen) and the like.
[Common electrode]
The common electrode 17 is formed of a light transmitting material having conductivity, such as ITO or IZO, for example, and provided over all the sub-pixels.

In the present embodiment, the common electrode 17 is a cathode.
[Sealing layer 18]
The sealing layer 18 is provided to protect the hole injection layer 13, the organic light emitting layer 15, the electron transport layer 16, and the common electrode 17 from moisture and oxygen.
Although not shown, a black matrix, a color filter or the like may be formed on the sealing layer 18.

[Method of manufacturing display panel]
FIG. 4 is a schematic process diagram showing a manufacturing process of the display panel 100. As shown in FIG.
A method of manufacturing the display panel 100 will be described based on the process chart of FIG. 4 with reference to FIG.
First, the TFT layer 11b is formed on the substrate body 11a (step S1).

Subsequently, the interlayer insulating layer 11c is formed on the TFT layer 11b by a photoresist method using an organic material having excellent insulating properties to fabricate the base substrate 11 (step S2). The thickness of the interlayer insulating layer 11c is, for example, about 4 μm. Although not shown in the cross-sectional view of FIG. 3 and the process diagram of FIG. 4, when the interlayer insulating layer 11 c is formed, the contact hole 2 (see FIG. 2) is formed.
Next, the pixel electrode 12 made of a metal material with a thickness of about 400 nm is formed on the base substrate 11 for each sub-pixel by vacuum evaporation or sputtering (step S3).

Subsequently, a hole injection layer 13 is formed by uniformly depositing tungsten oxide on the base substrate 11 and the pixel electrode 12 by sputtering or the like (step S4).
Next, the second bank 24 and the first bank 14 are formed by photolithography as follows (step S5).
First, a bank material (for example, a photosensitive photoresist material) for forming the second bank 24 is uniformly applied on the hole injection layer 13.

Thereafter, a photomask having an opening matched to the pattern of the second bank 24 is overlaid on the applied bank material layer, and exposed by UV irradiation. Then, the second bank 24 is formed by removing the uncured excess bank material with a developer.
Next, a bank material (for example, a negative photosensitive resin composition) for forming the first bank 14 is uniformly applied on the substrate on which the second bank 24 is formed.

On the bank material layer, a mask having an opening matched to the pattern of the first bank 14 to be formed is overlaid and exposed from above the mask. Thereafter, the excess bank material is washed out with an alkaline developer to pattern the bank material to form a pattern of the first bank.
Next, the occurrence of a defect in the unbaked first bank 14a on which the pattern is formed is checked (step S6), and if there is a defect, the defect is repaired.

Thereafter, the patterned unbaked first and second banks are heated and fired to form the first bank 14 and the second bank 24. This baking is performed, for example, by heating the unbaked first and second banks at a temperature of 150 ° C. to 210 ° C. for 60 minutes.
Next, the defect portion 3 in the first bank 14 on which the pattern is formed is detected (step S6). The detection of the defect portion 3 is performed, for example, by pattern inspection of the surface image of the photographed substrate. The surface image of the substrate is photographed, for example, after applying and then exposing the bank material before applying the bank material in step S5 and after developing and baking.

It is determined whether or not the detected defective portion 3 is a removable foreign object, and if the defective portion 3 is a removable foreign object, foreign object removal processing is performed (step S7). The determination processing as to whether or not the defective portion 3 is a removable foreign object and the foreign material removal processing will be described later.
When the defective portion 3 is not a removable foreign object, or after the foreign object removal processing, it is determined whether the bank trimming processing is necessary (step S8), and it is determined that the bank trimming processing is necessary. In this case, bank trimming processing is performed (step S9). The determination process as to whether or not the bank trimming process is necessary, and the bank trimming process will be described later.

After the bank trimming process, a bank re-formation process is performed to re-form a portion where the bank has been removed by the bank trimming process (step S10). The bank re-formation process will be described later.
Subsequently, the ink for forming the organic light emitting layer 15 is applied to the gap 20 between the adjacent first banks 14. This ink is a mixture of an organic material forming the organic light emitting layer 15 and a solvent, and is applied to each of the gaps 20 by an inkjet method. Then, the solvent contained in the applied ink layer 15a is evaporated and dried, and if necessary, the organic light emitting layer 15 is formed in the gaps 20 by heating and baking (step S11).

Next, on the organic light emitting layer 15 and the first bank 14, a material forming the electron transport layer 16 is deposited by vacuum evaporation to form the electron transport layer 16 (step S12).
Then, a material such as ITO or IZO is deposited by sputtering or the like to form the common electrode 17 (step S13).
Then, a light transmitting material such as SiN or SiON is formed on the surface of the common electrode 17 by sputtering or CVD to form the sealing layer 18 (step S14).

The display panel 100 is completed through the above steps.
[Defective part 3]
The defective portion 3 present in the first bank 14 will be described.
The defective portion 3 is a foreign matter present in the first bank 14 or a portion where a part of the first bank 14 is lost.

The foreign matter is, for example, metal pieces derived from the manufacturing apparatus, dust and the like present in the air. And dust and dirt are often fiber pieces.
In the example shown in FIG. 5, the foreign matter adheres on one first bank 14 to form a defective portion 3.
The defective portion 3 is not limited to the case where foreign matter adheres on the first bank 14 as described above. For example, as in the example shown in FIG. 6A, the foreign matter enters one first bank 14, and the foreign matter penetrates the wall surface of the first bank 14 to the adjacent gap 20 to form the defect 3 and the like. Sometimes it is. Further, in the example shown in FIG. 6B, the foreign matter enters under the one first bank 14, and the foreign matter penetrates to the adjacent gap 20 to form the defect portion 3. As described above, even when foreign matter is present in or below the first bank 14, if the adhesion between the foreign matter and the bank material is poor, a gap is created, and an ink flow passage can be made. When the foreign matter is a fiber piece, the foreign matter itself absorbs the ink, and the foreign matter itself serves as a flow passage of the ink. Therefore, this causes color mixing between the ink layers formed in the adjacent gaps sandwiching the foreign matter.

  Furthermore, in the example shown in FIG. 6C, a part of the first bank 14 is lost and becomes the defect part 3. Such defects in the first bank 14 are generated, for example, in the step of exposure to the bank material layer, where the portions which were not sufficiently exposed and not sufficiently polymerized are washed away in the next development step. Even when defects occur in this manner, color mixing occurs between ink layers formed in adjacent gaps through the defects.

As described above, a portion where foreign matter or defects occur in the first bank 14 causes color mixing of inks of different light emission colors to cause a light emission color defect, so this portion is regarded as the defective portion 3.
[Determination process of whether or not the defective portion 3 is a removable foreign object]
In the present embodiment, the defective portion 3 being “removable foreign matter” is a foreign matter which can be removed by using the manipulator device 300 described later and the defective portion 3 is a first foreign matter after being removed. The liquid repellence of the bank 14 is not a foreign substance which falls. The foreign matter which the defect portion 3 can remove by using the manipulator device 300 is a foreign matter adhering on the first bank 14 as shown in FIG. The foreign matter which reduces the liquid repellency of the first bank 14 after removal is, for example, a foreign matter which has been burned in the first bank 14, and if it is forcibly removed, the first bank is damaged and the liquid repellant of the first bank 14 is eliminated. It is a foreign body that loses its character. It can be determined from the timing at which the foreign matter has adhered to the first bank 14 whether it is a foreign matter adhering to the first bank 14 or not and whether it is a foreign matter sticking to the first bank 14 or not. It is. For example, it can be determined that the foreign matter attached after the developing step in the bank formation step (step S5) of the above-described manufacturing step is the foreign matter attached on the first bank 14. Further, it can be determined that the foreign matter attached prior to the firing step is the foreign matter seized to the first bank 14.

In the present embodiment, the foreign matter is not detected from the surface image of the substrate taken prior to the firing step, and the foreign matter is capable of removing foreign matter detected from the surface image of the substrate taken after the firing step. judge.
Foreign substance removal processing
The foreign substance removal processing will be described. FIG. 7 is a schematic configuration view showing an example of the manipulator device 300 used for the foreign matter removal processing. In the manipulator apparatus 300, a table 302 on which the base substrate 11 is mounted, a table 303 on which the repair parts 5 and the like are mounted, a head unit 310 to which an imaging element 311 is attached, and a probe 321 It has two arm parts 320 attached.

The head unit 310 can be moved in the X direction and the Y direction according to an instruction from the controller 330. Then, while moving the imaging element along the upper surface of the base substrate 11 placed on the table 302, image data of the upper surface of the base substrate 11 can be acquired, and the acquired image can be displayed on the monitor 340.
The two arm units 320 can move independently in the X direction, Y direction and Z direction according to the instruction of the controller 330, and change the attitude of the probe 321 around the X axis, Y axis and Z axis It is possible to As a result, with respect to the base substrate 11 placed on the table 302 and the repair part 5 placed on the table 303, it is possible to make the probe 321 take any posture in any direction and distance. In the present embodiment, the probe 321 is made of tungsten.

FIG. 8 is a diagram showing how the manipulator device 300 is operated to remove foreign matter on the first bank 14. First, as shown in FIG. 8A, the arm portion 320 is operated to move the probe 321 onto the table 302, the attitude of the probe 321 is controlled, and the position on the substrate 11 placed on the table 302 is increased. The probe 321 is brought into contact with or pierced by the foreign matter attached to one bank 14. Subsequently, as shown in FIG. 8B, the arm portion 320 is operated to pull up the probe 321, and the removal of the foreign matter on the first bank 14 is completed.
[Determination process whether bank trimming process is necessary]
In the present embodiment, a bank trimming process for removing a part of the first bank 14 is performed on a foreign matter which can not be removed appropriately by the above-described foreign matter removing process or a defect generated in the first bank 14. The first bank 14 is repaired by performing a bank re-formation process of re-forming the normal first bank 14 with respect to the removed bank area.

Therefore, in the present embodiment, the bank trimming process is required to detect a foreign substance that can not be removed appropriately by the foreign substance removal process, or to detect a defect in the first bank 14. In the present embodiment, it is necessary to perform the bank trimming process on foreign substances detected in the surface image of the substrate taken prior to the baking process and defects of the first bank 14 detected after the baking process. It is determined that
[Bank trimming process]
The bank trimming process will be described.

  FIG. 9 is a view showing a cutting position set around the defect portion 3. As shown in the figure, in the groove space 20 adjacent to both sides of the first bank 14 having the defect portion 3, a point A1 separated by a distance a1 in the Y direction with respect to the central portion of the foreign object 3, and the Y direction The point A2 separated by the distance a2 in the opposite direction is set as the cutting position. Here, the distance a1 and the distance a2 may be the same or different, but an appropriate length so that the entire defect 3 is sandwiched between the points A1 and A2 and is not too large. Set to

FIGS. 10A to 10D are diagrams showing how the manipulator device 300 is operated to remove a part of the first bank 14.
First, as shown in FIG. 10A, the arm portion 320 is operated to move the probe 321 onto the table 302, and the attitude of the probe 321 is controlled to set the cutting position A1 set in the first bank 14. And cut A2. Subsequently, as shown in FIG. 10B, the attitude of the probe 321 is controlled to set the first bank 14 and the base in the Z direction between the incised position A1 and the incised position A2 of the bank 14 in the Y direction. Insert between the substrates 11. Next, as shown in FIG. 10C, the arm portion 320 is operated to lift the probe 321, and a portion including the defective portion 3 between the cut position A1 and the cut position A2 of the first bank 14 , And defect portion 14x). Thereafter, as shown in FIG. 10 (d), the attitude of the probe 321 is controlled to grip the defective portion 14x, the arm portion 320 is operated to pull up the probe 321, and the defective portion 14x is removed from the bank 14 Complete the trimming process.
[Bank reform process]
FIG. 11 is a schematic configuration view showing an example of the dispenser device 200 used for the bank re-forming process. The dispenser device 200 includes, on a base 201, a table 202 on which the base substrate 11 is placed, and a head unit 210 to which a dispenser 212 is attached. The table 202 can be moved in the Y direction based on an instruction from the controller 230, and the head unit 210 can be moved in the X direction and the Z direction according to an instruction from the controller 230. Therefore, the dispenser 212 attached to the head unit 210 is directed by the controller 230 to the base substrate 11 above the base substrate 11 placed on the table 202 in the X, Y, and Z directions. You can move relative to

The dispenser 212 included in the dispenser device 200 has a tank for storing a paste-like bank repair material attached to the nozzle 213 at its tip, and can adjust the air pressure in the tank to apply the bank repair material. There is.
Adjustment of the air pressure in the tank of the dispenser 212 is made based on a control signal from the controller 230.

  In the storage unit 231 of the controller 230 of the dispenser device 200, the detected position of the defective portion 3 and the position (trimming position) of the portion removed by the bank trimming are stored. The dispenser device 200 applies the bank repair material with reference to the position of the defect portion 3 stored in the storage unit 231 and the trimming position. Here, the bank repair material is applied to a plurality of positions set in the portion (trimming area 14 a) removed by the bank trimming of the first bank 14.

FIG. 12 is a view showing the application position set in the trimming area 14a. As shown in the figure, a plurality of application points P1, P2,..., P10 are set at predetermined intervals along the center line L1 of the first bank 14 in the trimming area 14a.
FIGS. 13 (a) to 13 (e) are diagrams showing that the bank repair material is sequentially applied to the application points P1, P2,.

First, as shown in FIGS. 13 (a) and 13 (b), the nozzle 213 is positioned at the application point P1, and the nozzle 213 is moved downward to bring the nozzle 213 close to the application point P1 to adjust the air pressure in the tank. Then, the bank repair material is applied to the application point P1.
The bank repair material has fluidity until it is applied, but the mountain shape is maintained after application, and as shown in FIG. 13C, a bank repair material pile is formed at the application point P1. Subsequently, as shown in FIG. 13D, the nozzle 213 is pulled up and moved to the application point P2, and the nozzle 213 is moved downward to bring the nozzle 213 close to the application point P2 to adjust the air pressure in the tank. The bank repair material is applied to the application point P2. As a result, as shown in FIG. 13E, the peak of the bank repair material formed at the application point P2 is connected to the peak of the bank repair material formed at the application point P1. In this manner, a pile of bank repair material is continuous in the trimming area 14a.

  The above process is repeated, and the bank repair material is applied to the application points P1 to P10 to fill the trimming area 14a with the bank repair material. The bank repair material is thermosetting, and after the trimming area 14a is filled with the bank repair material, the bank repair portion 5 is formed as shown in FIG. Complete the remodeling process.

The bank repair material is not thermosetting, has photo-curing properties, and may be cured by UV irradiation treatment instead of heat baking treatment.
In addition, as a bank repair material, the composition of the resin hardened | cured by adding light and heat can be used.
As resin, the curable resin which has ethylenic double bonds, such as a (meth) acroyl group, an allyl group, a vinyl group, a vinyloxy group, is mentioned, for example.

Moreover, you may add the crosslinking agent which bridge | crosslinks with respect to resin, for example, an epoxy compound and a polyisocyanate compound.
Moreover, you may use the fluorinated polymer in which the fluorine is introduce | transduced in this resin structure. By introducing fluorine into the resin of the repair material, it is possible to impart wrinkle inkability to the ridge portion 50 to be formed. Alternatively, various base ink agents may be added to the resin. The addition amount of the ink repellent agent is 0.01 to 10 wt%. By setting the addition amount of the ink repellent agent in this range, the storage stability of the resin composition is good, and the ink repellency of the ridge portion 50 to be formed is also good.

In addition, you may use the same thing as the bank material which forms the 1st bank 14 as a repair material.
If necessary, a solvent and a photopolymerization initiator may be appropriately added to the resin composition constituting the repair material.
The solvent has solubility in a resin, and one or more solvents having a boiling point of about 150 to 250 ° C. may be used.

As a photoinitiator, various commercially available photoinitiators can be used.
[effect]
According to the manufacturing method of the organic EL display panel of the present embodiment, the occurrence of display defects caused by color mixing caused by the defective portion of the bank and the repair of the bank is reduced as compared with the conventional repair method of the bank provided with wrinkles can do.
[Modification]
Although the display panel 100 according to the embodiment has been described, the present disclosure is not limited at all to the above embodiment except for the essential characteristic components. For example, an embodiment obtained by applying various modifications to those skilled in the art to the embodiment, and an embodiment realized by arbitrarily combining components and functions in each embodiment without departing from the spirit of the present invention. Are also included in the present disclosure. Below, the modification of the display panel 10 is demonstrated as an example of such a form.

<Modification 1>
In the above-described embodiment, the bank re-formation process is performed by applying the bank repair material to the trimming area 14a by the dispenser device, but the bank re-formation process is not limited to this.
The bank re-forming process may be performed, for example, by applying a bank repair material to the trimming area 14 a by an inkjet method.

Further, the bank re-formation process may be performed by installing the repair part 6 in the trimming area 14a.
The bank re-formation processing for installing the repair part 6 in the trimming area 14a will be described in detail.
Similar to the method of applying the bank repair material to the trimming area 14a by the above-described dispenser device, a plurality of application positions are set, and the adhesive paste is applied to the set application positions.

After applying the bonding paste, the repair part 6 is placed on the portion to which the paste is applied.
FIG. 15 is a view showing installation of the repair part 6 in the trimming area to which the bonding paste is applied, using the manipulator device 300 of FIG. 7.
First, as shown in FIG. 15A, the arm portion 320 is operated to move the probe 321 onto the table 303, the attitude of the probe 321 is controlled, and the repair part 6 placed on the table 303 is gripped. Do. Subsequently, as shown in FIG. 15B, the adhesive paste on the base substrate 11 on which the repair part 6 is placed on the table 302 by operating the arm part 320 while holding the repair part 6 by the probe 321 Move to the position where it was applied. Next, as shown in FIG. 15C, the arm part 320 is operated to move the probe 321 downward to bring the repair part 6 into contact with the adhesive paste applied onto the base substrate 11. Subsequently, as shown in FIG. 15 (d), the attitude of the probe 321 is controlled to separate from the repair part 6, and the arm part 320 is operated to move the probe 321 above the repair part 6 and then downward. The repair part 6 is moved and pressed against the base substrate 11. After that, as shown in FIG. 15E, the arm portion 320 is operated to pull up the probe 321, and the installation of the repair part 6 on the base substrate 11 is completed.

According to this bank re-forming method, the amount of paste used can be reduced by applying the paste-like repair material as compared with the case of re-forming the bank. This can reduce the occurrence of paste bleeding and overflow.
In addition, since the repair parts 6 which are already in shape are used, it is possible to re-form a bank having high flatness and high water repellency, without depending on the characteristics of the paste, and the shape is hard to be broken.

<Modification 2> In the above embodiment, the bank trimming process is always performed when the defective portion 3 of the first bank 14 is defective. However, the bank trimming is performed according to the size of the defective portion. It may be determined whether to perform the process.
FIG. 16 is a view schematically showing a defect generated in a bank. For example, as shown in FIG. 16A, when the ratio of the length X2 in the X direction of the defective portion to the width X1 of the bank is smaller than a predetermined value (for example, 0.5), the bank trimming process is unnecessary. It may be determined that Then, as shown in FIG. 16B, when the ratio of the X direction length X2 of the defective portion to the width X1 of the bank is larger than a predetermined value (for example, 0.5), the bank trimming process is necessary. It may be determined that

Further, as shown in FIG. 16C, when the first bank 14 is broken due to a defect and separated into two regions, the bank repair material is applied to the defective region without performing the bank trimming process. A bank reform process may be performed.
<Modification 3> In the above-described embodiment, the bank refinishing process applies the bank repair material to the trimming area 14a by the dispenser device 200. Usually, the dispenser apparatus 200 applies a bank repair material using a nozzle 213 having a circular nozzle hole 213a as shown in FIG. 19A. In addition, the diameter of the nozzle hole 213a of the nozzle 213 shown to Fig.19 (a) shall be the same as the width | variety (X direction) of the 1st bank 14. As shown in FIG. Here, in the cross-sectional shape obtained by cutting the first bank 14 along a line parallel to the X direction, when the height / width is very small, the application is performed by the nozzle 213 of the nozzle hole 213a as shown in FIG. However, there is a problem that it is difficult to achieve both the height and the width of the applied bank repair material, and the difference between the shape and the first bank 14 is likely to occur.

Here, with respect to the above-described problem, a method for making it difficult for the cross-sectional shape cut by a line parallel to the X direction to be different from the first bank 14 with respect to the bank repair material applied using the dispenser device 200. explain.
FIG. 17 is a view showing an example of the application position set in the trimming area 14a. As shown in the figure, a plurality of straight lines L1, L2, L3 and L4 extending in the Y direction are set in the trimming area 14a. Further, a plurality of straight lines l1, l2, ..., l10 extending in the X direction are set in the trimming area 14a. Further, application points P1, P2,..., P10 are set at intersections of a straight line L1 extending in the Y direction and a plurality of straight lines l1, l2,. Similarly, in each of the straight lines L2, L3, and L4 extending in the Y direction, application points are set at intersections with a plurality of straight lines l1, l2, ..., l10 extending in the X direction.

  Then, as shown in FIG. 19B, using the circular nozzle 213 having a small nozzle hole 213a, the application points P1, P2,..., P10 set on L1 are similar to those in FIG. Apply bank repair material by the method. The bank repair material is also applied to the application point set on L2, the application point set on L3, and the application point set on L4 in order. The diameter of the nozzle hole 213a of the nozzle 213 in FIG. 19B is smaller than the width of the first bank 14 and is substantially the same as the height of the first bank 14.

As described above, a plurality of application points are set in the X direction using the nozzle 213 having a small nozzle hole 213a, and the bank repair material is coated to form a line parallel to the applied bank repair material in the X direction. The height and width of the cut cross-sectional shape can easily be made to the desired dimensions.
Here, although the number of straight lines extending in the Y direction set in the trimming area 14a is four (L1-l4), the number may be any number as long as it is three or more, and the X of the trimming area 14a It may be set appropriately according to the length of the direction.

Similarly, the number of straight lines extending in the X direction set in the trimming area 14a is ten (11-110), but the number may be any number as long as it is one or more. It may be set appropriately according to the length.
<Modification 4> In the modification 3 described above, the method of applying the bank repair material by setting a plurality of application points in the X direction using the nozzle 213 having a small nozzle hole 213a has been described. Similar to the third modification, the fourth modification is a method of setting a plurality of application points in the X direction and applying the bank repair material using the nozzle 213 having a small nozzle hole 213a. An effective method for making the height and width of the cross-sectional shape cut by a line parallel to the X direction of the bank repair material into desired dimensions will be described.

FIGS. 18 (a) to 18 (d) are diagrams showing that a bank repair material is sequentially applied to a plurality of set application points.
First, using the nozzle 213 in which the tank is filled with the bank repair material A, as shown in FIG. 18A, the bank repair material A is applied to the application point on the straight line L1. After the bank repair material A is applied to each application point on the straight line L1, the bank 213 is applied to the application point on the straight line L4 as shown in FIG. Apply the repair material A.

  After applying the bank repair material A to each application point on the straight line L4, the nozzle is replaced, and using the nozzle 213 in which the bank repair material B is filled in the tank, as shown in FIG. 18C, on the straight line L2. The bank repair material B is applied to the application point of After the bank repair material B is applied to each application point on the straight line L2, the bank 213 is applied to the application point on the straight line L3 as shown in FIG. Apply the repair material B. The bank repair portion 5 is formed by applying the bank repair material B to each application point on the straight line L3.

The characteristic portions in the method described with reference to FIG. 18 are the first to the application points set to the outermost straight lines L1 and L4 among the plurality of straight lines extending in the Y direction in the trimming area 14a. The bank repair material A was applied, and then the bank repair material B was applied to the application points set to L2 and L3 between the straight lines L1 and L4.
The bank repair material A preferably has a viscosity higher than that of the bank repair material B, and the bank repair material B preferably has a higher liquid repellency than the bank repair material A.

By applying the high-viscosity bank repair material A to the outside first, the shape of the completed bank repair portion 5 can be stabilized. Thereafter, by applying a highly liquid repellent bank repair material B on the inside, the completed bank repair section 5 effectively exhibits the function of blocking the flow of the ink containing the organic light emitting material and suppressing the color mixing. Becomes possible.
<Modification 5> Even when coating is performed by the nozzle 213 of the nozzle hole 213a as shown in FIG. 19 (a), it is difficult to achieve both height and width of the applied bank repair material, resulting in a difference in shape from the first bank 14 The point of having the problem of being easy is as described in the third modification.

  On the other hand, for example, as shown in FIG. 19C, the bank repair material is applied by applying the bank repair material with the nozzle hole 213a having an elliptical shape and the major diameter being parallel to the X direction. The difference between the width and height in the cross section cut by a plane parallel to the X direction and the width and height in the cross section cut by a plane parallel to the X direction of the first bank 14 hardly occurs. The major diameter of the nozzle hole 213a of the nozzle 213 in FIG. 19C is substantially the same as the width of the first bank 14, and the minor diameter of the nozzle hole 213a is substantially the same as the height of the first bank 14. I assume.

  Similarly, for example, as shown in FIG. 19 (d), a bank repair material is applied by using a nozzle 213 having a rectangular nozzle hole 213a and setting the long side parallel to the X direction, thereby applying the bank repair material. The difference between the width and height in the cross section cut by a plane parallel to the X direction and the width and height in the cross section cut by a plane parallel to the X direction of the first bank 14 does not easily occur. The length of the long side of the nozzle hole 213a of the nozzle 213 of FIG. 19 (d) is substantially the same as the width of the first bank 14, and the length of the short side of the nozzle hole 213a is the same as that of the first bank 14. It shall be almost the same as the height.

<Modification 6> FIG. 20 is a diagram for explaining the subject of bank re-formation processing using the dispenser device 200. As shown in FIG.
As shown in FIG. 20A, of the plurality of application points (P1-P10) set in the trimming area 14a, the distance between the application point P1 at the end and the upper side of the first bank 14 close to P1 is Assume Y1. Although not shown, the distance between the application point P10 and the lower side of the first bank 14 close to P10 is also Y1.

If Y1 is too small, the bank repair material overflows when the bank repair material is applied, and the end 5a of the bank repair portion 5 becomes thick as shown in FIG. 20 (b).
Conversely, if Y1 is too large, as shown in FIG. 20C, the end 5a of the bank repair portion 5 becomes thinner.
As described above, if the position of the application point in the trimming area 14a is not set appropriately, there is a problem that the shape of the completed bank repair portion 5 is broken.

  Therefore, at the time of the bank trimming process, for example, as shown in FIG. 21A, by removing the bank while leaving the guard portion 14b, the degree of collapse of the shape of the bank repair portion 5 due to the position of the application point It is possible to suppress For example, even if Y1 is too small, the movement of the bank repair material in the X direction is suppressed by the guard portion 14b, and it is possible to prevent the end of the bank repair portion 5 from becoming thick. Further, even if Y1 is too large, the end of the trimming area 14b is also narrowed by the guard portion 14b, so that the entire trimming area 14b can be filled with the bank repair material.

Further, as shown in FIG. 21B, the groove portion 14C may be formed in a portion of the first bank 14 in contact with the trimming area 14a during the bank trimming process. By forming the groove portion 14C, even if Y1 is too small, the overflowed bank repair material flows into the groove portion 14C, and it is possible to prevent the end portion 5a of the bank repair portion 5 from becoming thick.
<Modification 7> In the modification 1 described above, the method of performing the bank re-formation processing by installing the repair part 6 has been described. Here, a method for making positional deviation of repair parts less likely to occur in the method of bank re-formation processing by installing the repair parts 6 will be described.

  As shown in FIG. 22 (a), the repair parts 6 are formed in advance so that both ends in the Y direction of the repair parts 6 have triangular asperities. Then, as shown in FIG. 22A, when removing the bank in the bank trimming process, the shape of the portion of the first bank 14 in contact with the trimming area 14a corresponds to the unevenness on both ends of the repair part 6 in the Y direction. Cut out the bank as you do. That is, when the repair part 6 is installed, the part facing the convex part in the repair part 6 opposes the concave part in the repair part 6 so that it is concave in the first bank 14 Bank trimming processing is performed so that the portion is convex in the first bank 14. Thus, as shown in FIG. 22 (b), when the repair part 6 is installed in the bank re-formation process, it is prevented from being installed out of alignment, or the position of the repair part after installation is prevented from shifting. Is possible.

  Similarly, as shown in FIG. 22C, repair parts 6 are formed in advance so that both ends in the Y direction of repair parts 6 have arc-shaped irregularities. Then, as shown in FIG. 22C, when removing the bank in the bank trimming process, the shape of the portion of the first bank 14 in contact with the trimming area 14a corresponds to the unevenness on both ends of the repair part 6 in the Y direction. Cut out the bank as you do. That is, when the repair part 6 is installed, the part facing the convex part in the repair part 6 opposes the concave part in the repair part 6 so that it is concave in the first bank 14 Bank trimming processing is performed so that the portion is convex in the first bank 14. As a result, as shown in FIG. 22 (d), when the repair part 6 is installed in the bank re-formation process, it is prevented from being installed out of alignment or that the position of the repair part after installation is shifted. Is possible.

  INDUSTRIAL APPLICABILITY The present invention is applicable to, for example, an organic EL display device used for various display devices for home or public facilities, or for business use, television devices, displays for portable electronic devices, and the like.

REFERENCE SIGNS LIST 1 organic EL display device 3 defective portion 5 bank repair portion 6 repair part 10 organic EL element 11 base substrate 14 first bank 15 organic light emitting layer 20 gap 24 second bank 100 display panel 200 dispenser device 213 nozzle 300 manipulator device 321 probe

Claims (13)

Preparing the substrate;
Forming a plurality of elongated banks extending in the column direction on the substrate;
Detecting a defect in the bank;
Determining the necessity of bank trimming for removing a part of the bank with respect to the defective portion;
Performing bank trimming for removing the periphery of the defective portion of the bank when it is determined that the bank trimming is necessary;
Re-forming a bank on the area removed by the bank trimming;
Forming a light emitting layer by applying an ink containing an organic light emitting material to the gaps between the plurality of banks. The step of forming the bank includes the step of baking the patterned bank material,
In the step of determining the necessity of the bank trimming, it is determined that the bank trimming is necessary when foreign matter adheres to the bank prior to the step of baking the bank material. Panel manufacturing method. The step of determining the necessity of the bank trimming determines that the bank trimming is necessary when the ratio of the size of the defective area of the bank to the width of the bank is equal to or more than a predetermined threshold value. Manufacturing method of organic EL display panel. When it is determined that the bank trimming is not necessary, and the defective portion is a defect of the bank, and the bank is divided due to the defect, the bank is re-executed with respect to the defective region of the bank. The method of manufacturing an organic EL display panel according to claim 1, further comprising the step of forming. The organic EL display according to any one of claims 1 to 4, wherein the formation of the bank is performed by applying a thermosetting bank repair material to a region from which the bank is removed by the bank trimming and baking it. Panel manufacturing method. The organic EL device according to any one of claims 1 to 4, wherein the re-formation of the bank is performed by installing a bank repair part, which is formed in a bank shape in advance, in a region where the bank is removed by the bank trimming. Display panel manufacturing method. In the bank trimming, when applying the bank repair material to a part of the area where the bank is removed, the bank repair material is applied to the area of the gap between the plurality of banks where the organic light emitting material is applied. The manufacturing method of the organic electroluminescent display panel of Claim 5 which forms the guard part for suppressing flowing out. The organic EL display according to claim 5, wherein when the bank repair material is applied to a portion of the bank in contact with the area removed by the bank trimming, the groove portion into which the bank repair material flows is formed. Panel manufacturing method. The bank repair parts have a shape in which both ends in the column direction have unevenness in plan view,
In the bank trimming, the bank is cut out so that the shape of both ends in the column direction of the portion where the bank is removed in plan view corresponds to the shape of both ends in the column direction of the bank repair parts. 6 organic EL display panel manufacturing method. The application of the bank repair material is performed by dropping the bank repair material on a plurality of application points set in the area where the bank is removed by the bank trimming,
The plurality of application points are set at intersection points between one or more straight lines extending in the column direction and a plurality of straight lines extending in the row direction in the defective area or the area where the bank is removed by the bank trimming. 5 method of manufacturing an organic EL display panel. The plurality of application points are set at intersections of three or more column-direction straight lines and a plurality of row-direction straight lines in an area from which the bank is removed by the bank trimming.
When the application point set on the straight line at both ends in the row direction among the three or more straight lines in the column direction is the first application point, and the other application points are the second application point, to the first application point The method of manufacturing an organic EL display panel according to claim 10, wherein the bank repair material is dropped onto the second application point after the bank repair material is dropped. When the bank repair material to be dropped to the first application point is a first bank repair material and the bank repair material to be dropped to the second application point is a second bank repair material, the first bank repair material is The method for manufacturing an organic EL display panel according to claim 11, wherein the viscosity is higher than that of the second bank repair material. The plurality of application points are set at intersections of one straight line in the column direction and a plurality of straight lines in the row direction in the region from which the bank is removed by the bank trimming,
The method of manufacturing an organic EL display panel according to claim 10, wherein a nozzle shape used for dropping the bank repair material is either an elliptical shape or a rectangular shape with the major axis in the row direction.

Images