JP2019075475A - Component mounting device - Google Patents

Abstract

A component mounting apparatus capable of accurately acquiring a height position around a pickup position or around a mounting position imaged by an imaging unit is provided. A component mounting apparatus (100) is capable of imaging a head unit (4) including a mounting head (42), and the vicinity of a suction position and a mounting position of a component (31) by the mounting head (42) from a plurality of directions. and an imaging unit 8 that captures a second image. Component mounting apparatus 100 matches a first template, which is a part of the first image extracted, with the second image, obtains a matching result, extracts the first template from the first image, and extracts a second template having a range smaller than that of the first template. A matching search range between the second template and the second image is set based on the obtained matching result, the second template and the second image are matched, and a first image around the pickup position or the mounting position that has been picked up is detected. Configured to obtain height position. [Selection drawing] Fig. 5

Description

  The present invention relates to a component mounting apparatus.

  Conventionally, a component mounting apparatus is known (see, for example, Patent Document 1).

  Patent Document 1 discloses a component mounting apparatus including a suction nozzle for mounting a component on a substrate, and a camera module capable of imaging the mounting position of the component by the suction nozzle from a plurality of directions. The component mounting apparatus is configured to measure a three-dimensional position (height position) of the mounting position by performing stereo measurement based on images captured from a plurality of directions.

JP, 2014-216621, A

  In the component mounting apparatus of Patent Document 1, when stereo measurement is performed based on images taken from a plurality of directions, it is considered that images taken from different directions are compared (matching) and analyzed Be

  Here, since there are a plurality of patterns having similar shapes in the periphery of the suction position of the component on the component supply unit in the component mounting apparatus and the periphery of the mount position of the component on the substrate If matching is performed using the template as a template, there is a disadvantage that false matching is likely to occur. On the other hand, when matching is performed using a wide range as a template, there is a disadvantage that errors easily occur due to the influence of feature points other than the target portion. As a result of these, it is difficult to accurately measure the three-dimensional position (height position) around the suction position or around the mounting position of the component imaged by the imaging unit in the conventional component mounting apparatus such as Patent Document 1 There is a problem that is.

  The present invention has been made to solve the problems as described above, and one object of the present invention is to accurately obtain the height position around the suction position or around the mounting position imaged by the imaging unit. To provide a mountable component mounting apparatus.

  A component mounting apparatus according to one aspect of the present invention includes a head unit including a mounting head for mounting a component on a substrate, and a head unit provided with at least one of a suction position around the component and a mounting position around the mounting head. And an imaging unit capable of imaging from a plurality of directions and imaging the first image and the second image, and matching the first image from which the part of the first image is extracted with the second image, A matching result is acquired, extracted from the first image, and a matching search range between a second template in a range smaller than the first template and the second image is set based on the acquired matching result, and It is configured to match the second image and obtain a first height position around the picked-up suction position or around the mounting position. In the present invention, the area around the suction position includes a suction position and an area around the suction position. In the present invention, the periphery of the mounting position includes the mounting position and an area around the mounting position. Further, in the present invention, the template means an image area to be compared.

  In the component mounting apparatus according to one aspect of the present invention, by configuring as described above, it is possible to set an approximate matching search range by matching the relatively large first template and the second image. Further, when matching is performed using the second template in a relatively small range, since an approximate matching search range is set, it is possible to suppress false matching. As a result, it is possible to accurately obtain the height position around the suction position or around the mounting position captured by the imaging unit. That is, it is possible to obtain a more accurate height position as compared to the case where the height position is obtained only by a template in a large range. Moreover, compared with the case where a height position is acquired only with the template of a small range, the height position of the target location can be acquired more stably.

  In the component mounting apparatus according to the above aspect, preferably, the first template and the second image are matched to obtain the second height position of the imaged position, and the matching search between the second template and the second image The range is set based on the acquired second height position, the second template and the second image are matched, and the first height position of the imaged position is acquired. According to this structure, since the second height position, which is the approximate height position, can be obtained by matching the first template and the second image, the second height, which is the approximate height position, can be obtained. Based on the position, an appropriate matching search range of the second template and the second image can be easily set.

  In this case, preferably, a matching search range between the second template and the second image is set within a predetermined range based on the second height position, based on the acquired second height position. ing. According to this configuration, the second height position is determined by matching the second template and the second image using the matching search range set within the predetermined range based on the second height position. The height position can be acquired more accurately.

  In the configuration in which the matching search range between the second template and the second image is set based on the second height position, preferably, the second template is configured such that a part of the first template is extracted There is. According to this structure, the height position of the range including the second template can be acquired as the second height position by the matching between the first template and the second image, so that the acquired second height position is obtained. Based on the above, the matching search range between the second template and the second image can be set more appropriately.

  In the configuration in which the matching search range between the second template and the second image is set based on the second height position, preferably, the height position of the substrate surface is acquired as the second height position, and A range based on the thickness of the part with reference to the height position is set as a matching search range for the second template and the second image, and the second template and the second image are matched to obtain a first height position. It is comprised so that the height position of the mounting position of the components on a board | substrate may be acquired. According to this structure, since the matching search range between the second template and the second image can be narrowed to an appropriate range, the height of the mounting position of the component on the substrate is higher than in the case of matching by a wide search range. The position can be acquired more accurately. In addition, since the matching search range of the process of acquiring the height position of the mounting position of the component can be reduced, the processing of acquiring the height position of the mounting position of the component can be speeded up accordingly.

  In the component mounting device according to the first aspect, preferably, the imaging unit is configured to be capable of imaging from a plurality of oblique directions with respect to the vertical direction. According to this structure, the imaging unit can perform imaging of the suction position or mounting position of the component while the mounting head is disposed above the suction position or mounting position of the component. Therefore, the component suction operation by the mounting head is performed. Alternatively, the component mounting operation and the imaging operation can be easily performed in parallel. Thus, it is possible to suppress an increase in the time of the component suction operation or the component mounting operation.

  In the component mounting apparatus according to the above aspect, preferably, the imaging unit includes a plurality of cameras, or a single camera and an optical system that divides the field of view of the single camera. According to this structure, an imaging position can be easily imaged from a plurality of directions by an optical system which divides the field of view of a plurality of cameras or a single camera.

  According to the present invention, as described above, it is possible to provide a component mounting apparatus capable of accurately acquiring the height position of the position imaged by the imaging unit.

FIG. 1 is a view showing the overall configuration of a component mounting apparatus according to an embodiment of the present invention. It is a side view at the time of components suction of the head unit of the component mounting apparatus by embodiment of this invention. It is a side view at the time of component mounting of the head unit of the component mounting apparatus by embodiment of this invention. It is a figure for demonstrating height position acquisition of the imaged position in the component mounting apparatus by embodiment of this invention. It is the figure which showed the 1st example of the matching in the component mounting apparatus by embodiment of this invention. It is a side view showing an example of a substrate. It is a figure for demonstrating the height position acquisition of the components in the component mounting apparatus by embodiment of this invention. It is the figure which showed the 2nd example of the matching in the component mounting apparatus by embodiment of this invention. It is a side view of the head unit of the component mounting apparatus by the modification of embodiment of this invention.

  Hereinafter, an embodiment of the present invention will be described based on the drawings.

(Configuration of component mounting device)
The configuration of the component mounting apparatus 100 according to the embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 1, the component mounting apparatus 100 is a component mounting apparatus that conveys the substrate P in the X direction by the pair of conveyors 2 and mounts the component 31 on the substrate P at the mounting operation position M.

  The component mounting apparatus 100 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, a component recognition imaging unit 7, and an imaging unit 8. And a control unit 9. The imaging unit 8 is an example of the “imaging unit” in the claims.

  The pair of conveyors 2 are disposed on the base 1 and configured to transport the substrate P in the X direction. Further, the pair of conveyors 2 is provided with a holding mechanism for holding the substrate P being conveyed at the mounting operation position M in a stopped state. Further, the pair of conveyors 2 is configured to be able to adjust the interval in the Y direction in accordance with the dimensions of the substrate P.

  The component supply unit 3 is disposed on the outer side (Y1 side and Y2 side) of the pair of conveyors 2. Further, in the component supply unit 3, a plurality of tape feeders 3a are disposed. The component supply unit 3 is configured to supply a component 31 to a mounting head 42 described later.

  The tape feeder 3a holds a reel (not shown) around which a tape holding a plurality of parts 31 at a predetermined interval is wound. The tape feeder 3a is configured to feed the component 31 from the tip of the tape feeder 3a by rotating the reel by sending out a tape holding the component 31. Here, the component 31 includes electronic components such as an IC, a transistor, a capacitor, and a resistor.

  The head unit 4 is disposed above the pair of conveyors 2 and the component supply unit 3 and has a plurality of (five) mounting heads 42 with a nozzle 41 (see FIG. 2) attached to the lower end, and a board recognition camera And 43.

  The mounting head 42 is configured to mount the component 31 on the substrate P. Specifically, the mounting head 42 is configured to adsorb the component 31 supplied by the component supply unit 3 and mount the component 31 adsorbed to the substrate P disposed at the mounting operation position M. There is. The mounting head 42 is configured to be movable up and down (movable in the Z direction), and is supplied from the tape feeder 3 a by negative pressure generated at the tip of the nozzle 41 by a negative pressure generator (not shown). The component 31 is adsorbed and held, and the component 31 is mounted (mounted) at the mounting position on the substrate P.

  The substrate recognition camera 43 is configured to capture the fiducial mark F of the substrate P in order to recognize the position and attitude of the substrate P. Then, by imaging and recognizing the position of the fiducial mark F, it is possible to accurately obtain the mounting position of the component 31 on the substrate P.

  The support 5 includes a motor 51. The support unit 5 is configured to move the head unit 4 in the X direction along the support unit 5 by driving the motor 51. Both ends of the support portion 5 are supported by a pair of rail portions 6.

  The pair of rail portions 6 is fixed on the base 1. The rail portion 6 on the X1 side includes a motor 61. The rail portion 6 is configured to move the support portion 5 along the pair of rail portions 6 in the Y direction orthogonal to the X direction by driving the motor 61. The head unit 4 is movable in the X direction along the support 5 and is movable in the Y direction along the rail 6 so that the head unit 4 is in the horizontal direction (XY direction). It is movable.

  The component recognition imaging unit 7 is fixed on the upper surface of the base 1. The component recognition imaging unit 7 is disposed outside the pair of conveyors 2 (Y1 side and Y2 side). The component recognition imaging unit 7 images the component 31 sucked by the nozzle 41 of the mounting head 42 from the lower side (Z2 side) in order to recognize the suction state (suction posture) of the component 31 prior to mounting the component 31 It is configured to Thus, the controller 9 can acquire the suction state of the component 31 suctioned to the nozzle 41 of the mounting head 42.

  The imaging unit 8 is provided in the head unit 4. Thus, the imaging unit 8 is configured to move in the horizontal direction (XY direction) together with the head unit 4 by moving the head unit 4 in the X and Y directions. Further, as shown in FIG. 2, the imaging unit 8 is configured to be able to image the component supply position 30 of the component supply unit 3 from a plurality of directions. Further, as shown in FIG. 3, the imaging unit 8 is configured to be able to image the mounting position of the substrate P from a plurality of directions. Further, as shown in FIGS. 2 and 3, the imaging unit 8 includes a plurality of cameras 81 and illuminations 82. The plurality of cameras 81 have a scissor angle and are vertically arranged. Thereby, the imaging unit 8 can image the suction position of the component 31 by the mounting head 42 and the mounting position of the component 31 by the mounting head 42 from a plurality of directions (angles). Further, the imaging unit 8 is offset from the mounting head 42 so as not to interfere with the vertical movement of the mounting head 42. Further, the imaging unit 8 is configured to be capable of imaging a position where the mounting head 42 is lowered without moving the head unit 4.

  As shown in FIG. 2, the imaging unit 8 is configured to be able to image the component supply position 30 from a plurality of oblique directions with respect to the vertical direction (Z direction). Further, as shown in FIG. 3, the imaging unit 8 is configured to be able to image the mounting position of the component 31 from a plurality of oblique directions with respect to the vertical direction (Z direction). Specifically, as shown in FIG. 4, the imaging unit 8 is configured to perform imaging from inclination angles (θL and θH) whose imaging directions are different from each other with respect to the reference plane H0. The cameras 81 of the imaging unit 8 are arranged adjacent to each other in the vertical plane (in the YZ plane) including the suction position of the component 31 with respect to the reference plane H0 or the mounting position of the component 31. In addition, the plurality of cameras 81 are arranged offset vertically.

  The imaging unit 8 is configured to capture an area around the suction position of the component 31 from a plurality of directions, and to capture a first image and a second image. Further, the imaging unit 8 is configured to capture an area around the mounting position of the component 31 from a plurality of directions, and to capture the first image and the second image. That is, the imaging unit 8 is configured to be capable of imaging from a plurality of oblique directions with respect to the vertical direction (Z direction).

  The illumination 82 is configured to emit light at the time of imaging by the camera 81. The illumination 82 is provided around the camera 81. The illumination 82 includes a light source such as a light emitting diode (LED).

  The control unit 9 includes a CPU, and performs component mounting operations such as conveyance operation of the substrate P by the pair of conveyors 2, mounting operation by the head unit 4, component recognition imaging unit 7, imaging unit 8 and imaging operation by the substrate recognition camera 43 It is configured to control the overall operation of the device 100.

  Here, in the present embodiment, the control unit 9 determines the horizontal direction (XY direction) of the component 31 at the suction position of the component 31 based on the image of the suction position of the component 31 captured from a plurality of directions by the imaging unit 8. The position and the height position in the vertical direction (Z direction) are acquired. Further, based on the images of the mounting positions of the components 31 captured by the imaging unit 8 from a plurality of directions, the control unit 9 detects the horizontal (XY direction) position and vertical direction (Z direction) of the mounting positions of the components 31. It is configured to obtain the height position.

  Specifically, as shown in FIG. 4, the control unit 9 is configured to obtain the height position H1 with respect to the reference plane H0 by stereo matching. That is, by matching the images of the suction position or the mounting position of the component 31 captured substantially simultaneously by the plurality of cameras 81, the height position and the horizontal position of the captured position are acquired. As the matching, a general matching method such as a sum of squared difference (SSD) or a sum of absolute difference (SAD) is used.

  That is, in the present embodiment, the control unit 9 is configured to acquire the height of the suction position of the component 31 and the height of the mounting position of the component 31 based on the captured images of the imaging unit 8 in a plurality of directions. ing. Specifically, as shown in FIG. 4, the control unit 9 is configured to obtain the height position H1 with respect to the reference plane H0 by stereo matching.

An object (a predetermined position of the reference plane H0) is imaged at an inclination angle θH by one camera 81, and an object is imaged at an inclination angle θL by the other camera 81. Then, by performing stereo matching between the captured image at the inclination angle θH and the captured image at the inclination angle θL, the parallax p (pixel) between the two captured images is obtained. Here, assuming that the camera resolution of the camera 81 is R (μm / pixel), the distance A (μm) can be obtained by Equation (1).
A = p × R / sin (θH−θL) (1)

Then, using the distance A obtained by the equation (1), the distance hp (μm) to the height position H1 with respect to the reference plane H0 is obtained by the equation (2).
hp = A × sin (θL) (2)

  Thus, the height position and the horizontal position in the vertical direction at the suction position or mounting position of the component 31 can be accurately determined. Note that an angular error occurs due to the deviation from the view center of the camera 81 depending on the height position and the position of the imaging target. The angular error is corrected by a previously obtained table or calculation.

  In the matching, the degree of coincidence is compared while shifting the template (first template or second template) extracted from the first image one pixel at a time on the second image. Then, the point with the highest degree of coincidence is obtained as the matching point. Parallax is determined from the determined matching point, and a three-dimensional position of the imaging position is determined.

  Further, in the present embodiment, as shown in FIG. 5, the control unit 9 is configured to match the first template from which a part of the first image is extracted with the second image, and to obtain the matching result. It is done. In addition, the control unit 9 is configured to extract from the first image and set a matching search range between the second image and the second template in a range smaller than the first template based on the acquired matching result. There is. In addition, the control unit 9 is configured to match the second template with the second image to acquire the first height position around the suction position or the mounting position that has been captured.

  Specifically, the control unit 9 is configured to match the first template and the second image, and to acquire the second height position of the imaged position. In addition, the control unit 9 is configured to set a matching search range between the second template and the second image based on the acquired second height position. In addition, the control unit 9 is configured to match the second template with the second image to acquire the first height position around the suction position or the mounting position that has been captured.

  That is, the control unit 9 acquires the second height position, which is an approximate height position, using the first template in a relatively large range. Then, based on the second height position, the control unit 9 matches the second template and the second image in a relatively small range, and acquires a target first height position.

  In addition, the control unit 9 is configured to set the matching search range of the second template and the second image within a predetermined range based on the second height position based on the acquired second height position. It is done. For example, based on the second height position, the control unit 9 takes the second image portion corresponding to the height position of the predetermined range into a second portion in consideration of the influence of the thickness of the component 31 and the warpage of the substrate P. Set as search range by template. The matching search range of the second template and the second image is smaller than the matching search range of the first template and the second image. The second template is configured to extract a part of the first template.

  Specifically, as shown in FIG. 5, the control unit 9 matches the first template extracted from the first image with the second image. At this time, a substantially entire area of the second image is set as a range in which the first template is searched on the second image. The control unit 9 acquires a second height position, which is a height position at a feature point of the first template, based on the matching result of the first template and the second image.

  The control unit 9 matches the second image, which is extracted from the first image and is a part of the first template, with the second image. At this time, the range in which the second template is searched on the second image is set based on the second height position. That is, based on the second height position, the portion of the second image corresponding to the height position where the feature point of the second template may exist is set as the matching search range.

  FIG. 6 shows an example of the substrate P. The substrate P contains epoxy glass, a resist, an electrode, and silk. Also, solder is printed (or coated) on the electrodes. The resist, the electrode, and the silk each have a thickness (size in the Z direction) of several μm to several tens of μm. That is, when it is desired to acquire the height position of the boundary B1 between the solder and the electrode, when the size of the template is increased, the boundary B2 or B3 between the silk and the resist can be recognized as a feature point. In this case, an error occurs in the acquired height position by the thickness of the resist or the electrode. That is, when the boundary B1 is disposed at a position different from the reference position on the image due to the influence of the warpage of the substrate P, when the similar pattern (the boundary B2 or B3) is in the search range, these other features Points affect when matching.

  Further, the control unit 9 is configured to determine the presence or absence of the component 31 on the substrate P by acquiring the height position of the mounting position. That is, the control unit 9 is configured to determine whether or not the component 31 is correctly mounted by measuring the height position on the substrate P captured by the imaging unit 8. In this case, as shown in FIG. 7, when similar components 31 are mounted on the substrate P, components 31 at different horizontal positions may appear at different height positions in the imaging direction. That is, when the substrate P is warped or the like and the height position is different, there is a possibility that different parts 31 are recognized.

  Therefore, in the present embodiment, the control unit 9 is configured to obtain the height position of the substrate surface as the second height position. Further, the control unit 9 is configured to set a range based on the thickness of the component 31 with reference to the height position of the substrate surface as a matching search range between the second template and the second image. Further, the control unit 9 is configured to match the second template and the second image, and obtain the height position of the mounting position of the component 31 on the substrate as the first height position.

  Specifically, as shown in FIGS. 7 and 8, the control unit 9 matches the first template extracted from the first image with the second image. At this time, a substantially entire area of the second image is set as a range in which the first template is searched on the second image. The control unit 9 acquires a second height position, which is the height position of the substrate P, based on the matching result of the first template and the second image.

  The control unit 9 matches the second image, which is extracted from the first image and is a part of the first template, with the second image. At this time, the range in which the second template is searched on the second image is set based on the second height position. That is, based on the second height position, the portion of the second image corresponding to the height position where the feature point of the second template may exist is set as the matching search range.

(Effect of the embodiment)
In the present embodiment, the following effects can be obtained.

  In the present embodiment, as described above, the component mounting apparatus 100 is configured to match the first template from which a part of the first image is extracted with the second image, and to obtain the matching result. Further, the component mounting apparatus 100 is extracted from the first image, and a matching search range between the second template and the second template in a range smaller than the first template is set based on the acquired matching result, and the second The template and the second image are matched to obtain the first height position of the imaged position. As a result, an approximate matching search range can be set by matching the first template and the second image in a relatively large range. Further, when matching is performed using the second template in a relatively small range, since an approximate matching search range is set, it is possible to suppress false matching. As a result, the height position around the suction position or around the mounting position captured by the imaging unit 8 can be accurately obtained. That is, it is possible to obtain a more accurate height position as compared to the case where the height position is obtained only by a template in a large range. Moreover, compared with the case where a height position is acquired only with the template of a small range, the height position of the target location can be acquired more stably.

  Further, in the present embodiment, as described above, the component mounting apparatus 100 matches the first template and the second image, and acquires the second height position of the imaged position, and the second template and the second The matching search range with the image is set based on the acquired second height position, the second template and the second image are matched, and the first height position of the imaged position is acquired. Do. As a result, since the second height position, which is an approximate height position, can be acquired by matching the first template and the second image, based on the second height position, which is an approximate height position. , And an appropriate matching search range between the second template and the second image can be easily set.

  Moreover, in the present embodiment, as described above, the component mounting apparatus 100 is set to the matching search range between the second template and the second image based on the acquired second height position, and the second height position as a reference. To be set within a predetermined range. Thus, by matching the second template with the second image using the matching search range set within the predetermined range based on the second height position, the accuracy is further improved with reference to the second height position. The height position can be obtained.

  Further, in the present embodiment, as described above, the second template is configured such that a part of the first template is extracted. Thus, the height position of the range including the second template can be acquired as the second height position by the matching between the first template and the second image, so that based on the acquired second height position, The matching search range between the second template and the second image can be set more appropriately.

  Further, in the present embodiment, as described above, the component mounting apparatus 100 is set to the second height position, and the height position of the substrate surface is acquired, and the range based on the thickness of the component on the basis of the height position of the substrate surface. Is set as a matching search range between the second template and the second image, the second template and the second image are matched, and the height position of the mounting position of the component 31 on the substrate is set as the first height position. Configure to get As a result, the matching search range between the second template and the second image can be narrowed to an appropriate range, so the height position of the mounting position of the component 31 on the substrate can be compared to the case of matching by a wide search range. It can be acquired more accurately. In addition, since the matching search range of the process for acquiring the height position of the mounting position of the component 31 can be reduced, the processing for acquiring the height position of the mounting position of the component 31 can be speeded up accordingly. .

  Further, in the present embodiment, as described above, the imaging unit 8 is configured to be capable of imaging from a plurality of oblique directions with respect to the vertical direction (Z direction). Thus, the imaging unit 8 can pick up the suction position or mounting position of the component 31 in a state where the mounting head 42 is disposed above the suction position or mounting position of the component 31. The operation or component mounting operation and the imaging operation can be easily performed in parallel. Thus, it is possible to suppress an increase in the time of the component suction operation or the component mounting operation.

  Further, in the present embodiment, as described above, the imaging unit 8 is provided with a plurality of cameras 81. Thereby, the imaging position can be easily imaged from a plurality of directions by the plurality of cameras 81.

(Modification)
It should be understood that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is indicated not by the above description of the embodiment but by the scope of claims, and further includes all modifications (variations) within the meaning and scope equivalent to the scope of claims.

  For example, although the above-mentioned embodiment showed an example of composition which an imaging unit contains a plurality of cameras and can picturize an imaging position from a plurality of directions, the present invention is not limited to this. In the present invention, as in the modification shown in FIG. 9, the imaging unit 8a may include a camera 81a, an illumination 82, and an optical system 83. In this case, the field of view of the single camera 81a may be divided by the optical system 83 including a lens and a mirror so that the imaging position can be imaged from a plurality of directions. The imaging unit 8a is an example of the "imaging unit" in the claims.

  Alternatively, the imaging position may be imaged from a plurality of directions by imaging while moving one camera.

  Moreover, although the example of the structure which performs a matching process by the control part was shown in the said embodiment, this invention is not limited to this. In the present invention, the matching process may be performed by an image processing unit provided separately from the control unit. In this case, the image processing unit may perform processing using a hardware configuration, or may perform processing using software.

  In the above embodiment, the control unit acquires the height position of the imaged position based on the matching processing. However, the present invention is not limited to this. In the present invention, the height position of the imaged position may be acquired based on the matching processing by a processing unit provided separately from the control unit. In this case, the processing unit may perform processing using a hardware configuration, or may perform processing using software.

  Further, in the above-described embodiment, an example of the configuration in which the imaging unit is capable of imaging both the suction position of the component and the mounting position of the component has been described, but the present invention is not limited thereto. In the present invention, the imaging unit may be capable of imaging at least one of the suction position of the component and the mounting position of the component.

  Moreover, although the example of the structure which supplies the components hold | maintained at the tape to the components supply position was shown in the said embodiment, this invention is not limited to this. In the present invention, components placed on a tray or the like may be supplied to the component supply position.

4 Head unit 8, 8a Imaging unit (imaging unit)
31 parts 42 mounting heads 81 cameras 81 a cameras 83 optical system 100 parts mounting apparatus P substrate

Claims (7)

A head unit including a mounting head for mounting a component on a substrate;
An imaging unit provided in the head unit, capable of imaging at least one of a suction position periphery and a mounting position periphery of a component by the mounting head from a plurality of directions, and imaging a first image and a second image; ,
The first template from which a portion of the first image is extracted is matched with the second image to obtain a matching result, which is extracted from the first image and is a second template in a range smaller than the first template And a matching search range with the second image is set based on the acquired matching result, the second template and the second image are matched, and the periphery of the suction position or the periphery of the mounting position imaged A component mounting apparatus configured to obtain a first height position of   The second height position of the imaged position is acquired by matching the first template and the second image, and the matching search range between the second template and the second image is acquired at the second height. The second template and the second image are set based on the height position, and the first height position around the suction position or the mounting position is obtained. The component mounting apparatus according to claim 1.   Based on the acquired second height position, a matching search range between the second template and the second image is configured to be set within a predetermined range based on the second height position. The component mounting apparatus according to claim 2.   The component mounting apparatus according to claim 2, wherein the second template is configured to extract a part of the first template.   The height position of the substrate surface is acquired as the second height position, and a range based on the thickness of the component based on the height position of the substrate surface is a matching search range between the second template and the second image. The present invention is configured to set, match the second template and the second image, and obtain the height position of the mounting position of the component on the substrate as the first height position. The component mounting apparatus of any one of 2-4.   The component mounting apparatus according to any one of claims 1 to 5, wherein the imaging unit is configured to be capable of imaging from a plurality of oblique directions with respect to the vertical direction.   The component mounting method according to any one of claims 1 to 6, wherein the imaging unit includes a plurality of cameras, or includes a single camera and an optical system that divides a field of view of the single camera. apparatus.

Images