JP2019075219A - Heater module - Google Patents

Abstract

To provide a heater module capable of pulling out a large number of lead wires to the outside of the heater module without confusion.SOLUTION: A heater module 1 includes a heater unit 10 having a mounting surface 11a for mounting a processing object such as a wafer, and a resistance heating element 13a for heating the processing object mounted on the mounting surface 11a, a cooling part 20 installed on the underside of the heater unit 10 while spaced apart therefrom, and a wiring board 30 abutting on the opposite side of the cooling part 20 to the side facing the heater unit 10, and to which lead wires 16, 17 pulled out from the heater unit 10 are connected. Preferably, the wiring board 30 is mounting connectors 34, 35 to which the lead wires 16, 17 can be connected removably.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heater module in which an object to be processed such as a semiconductor wafer is placed and heated from the lower surface side.

  In a semiconductor manufacturing apparatus for manufacturing semiconductor devices such as LSIs and memories, a series of film formation such as CVD or sputtering on a semiconductor wafer, coating of a resist, photolithography such as exposure and development, etching for patterning, etc. A thin film process consisting of steps is performed. In these thin film processes, since the process is generally performed with the semiconductor wafer heated to a predetermined temperature, for example, in a coater development apparatus in which photolithography is performed, the semiconductor wafer of the object to be processed is placed and heated from its lower surface. A wafer heating heater module also referred to as a susceptor is used.

  For example, as described in Patent Document 1, the above-described heater module for wafer heating supports a wafer mounting table made of a ceramic disk-shaped member having a flat wafer mounting surface on the upper surface, and supports this from the lower surface side. A resistance heating element such as an electric heating coil or a patterned metal thin film is embedded in parallel to the wafer mounting surface in the interior of the wafer mounting table. A pair of electrode terminals provided on the lower surface side of the wafer mounting table is electrically connected to both end portions of the resistance heating element, and the resistance is connected from an external power supply through the pair of electrode terminals and the lead wire thereof. Power is supplied to the heating element.

In the above-described heater module for wafer heating, it is required that the heat uniformity on the wafer mounting surface be enhanced to uniformly heat the semiconductor wafer over the entire surface so that the quality of the semiconductor device as a product does not vary. ing. Therefore, the wafer mounting surface is divided into a plurality of heating zones (multi-zones), and the temperature control of the resistance heating elements disposed in each of them is performed individually.

Japanese Patent Application Laid-Open No. 2003-17224

  As described above, the mounting surface on which an object to be processed such as a semiconductor wafer is mounted is divided into a plurality of heating zones, and temperature control of the resistance heating elements disposed in each of them is performed separately for the wafer mounting surface. A control system that controls the calorific value of the resistance heating element disposed in each heating zone with voltage or current, although it can improve the thermal uniformity, generally uses, for example, a 3-wire system for temperature detection for each heating zone as a temperature detector. Since a temperature sensor such as a temperature measuring element is provided, at least three lead wires for the temperature sensor and two lead wires for feeding a resistance heating element are drawn out from each heating zone.

  Therefore, for example, when the mounting surface is divided into 15 heating zones and a resistance heating element and a temperature sensor are arranged in each of them, a total of 75 lead wires are drawn out from the mounting table, and It takes a long time to assemble and perform maintenance work. In addition, there is also a problem that there is a possibility of connecting incorrectly because a large number of similar lead wires are mixed in a narrow space.

  The present invention has been made in view of the problems encountered in the above-described conventional heater module, and it is an object of the present invention to provide a heater module that can be pulled out of the module without causing a large number of lead wires to be complicated.

  In order to achieve the above object, the heater module according to the present invention comprises a resistance heating element having a mounting surface on which the processing object is to be mounted on the upper surface and heating the processing object mounted on the mounting surface. A heater unit, a cooling unit spaced below the heater unit, and a surface of the cooling unit opposite to a surface opposite to the heater unit, and pulled out from the heater unit. And a wiring substrate to which the lead wire is connected.

  According to the present invention, a large number of lead wires can be drawn out of the heater module without being complicated, and it is possible to prevent a short circuit due to the heat generation of the wiring board itself or the heating due to the surrounding environment.

It is a longitudinal cross-sectional view of one example of a heater module concerning the present invention. It is a top view which shows the division pattern of several heating zones on the mounting surface defined by several resistance heating elements which the heater module of FIG. 1 has.

  First, embodiments of the present invention will be listed and described. An embodiment of a heater module according to the present invention comprises a heater unit having a mounting surface on which an object to be processed is mounted on the upper surface and a resistance heating element for heating the object mounted on the mounting surface. A cooling unit installed below the heater unit and a cooling unit installed in contact with a surface of the cooling unit opposite to the surface facing the heater unit, and a lead wire drawn from the heater unit is connected And a wiring substrate. This allows the lead wires to be drawn out of the heater module without confusion. In addition, it is possible to prevent the occurrence of a short circuit due to the heat generation of the wiring board itself or the heating due to the surrounding environment.

  In the embodiment of the heater module according to the present invention, it is preferable that the wiring substrate mounts a connector to which the lead wire is detachably connected. This makes it possible to simplify the assembly and maintenance operations of the module. In the embodiment of the heater module according to the present invention, the cooling unit includes a fixed cooling plate having a refrigerant flow path, and a movable cooling plate reciprocating between the fixed cooling plate and the heater unit. It is preferable that the wiring board be attached to a surface of the fixed cooling plate opposite to the surface facing the movable cooling plate. Thereby, the heater unit can be cooled in a short time.

  Next, a specific example of the heater module for heating an object to be processed according to the present invention will be described by taking the case where the object to be processed is a semiconductor wafer as an example. As shown in FIG. 1, the heater module 1 according to one specific example of the present invention has a mounting surface 11a on which the semiconductor wafer W as the object to be processed is mounted, and is mounted on the mounting surface 11a. A heater unit 10 having a resistance heating element 13a for heating the semiconductor wafer W, a cooling unit 20 for cooling the heater unit 10, and a surface of the cooling unit 20 opposite to the surface facing the heater unit 10. And the wiring board 30 provided. The heater module 1 is housed in a stainless steel container 40 which is preferably open at the top.

  The structure of the heater unit 10 is not particularly limited as long as the semiconductor wafer W mounted on the mounting surface 11 a can be uniformly heated over the entire surface, but the heater module 1 according to one specific example of the present invention In this case, the heater unit 10 has a disk-shaped mounting table 11 provided on the upper surface with the mounting surface 11 a on which the semiconductor wafer W is mounted, and an outer diameter substantially equal to that of the mounting table 11. A disk-shaped support plate 12 for supporting the support table 11 from the lower surface side over the entire surface, and a resistance heating element 13a covered with an insulating layer sandwiched between the support table 11 and the support plate 12 The heating unit 13 has a circular thin-film shape, and is supported by a plurality of columnar legs 14 provided on the lower surface side of the support plate 12.

  The mounting table 11 is preferably made of a material having a high thermal conductivity to achieve extremely high temperature uniformity, that is, high heat uniformity over the entire surface of the mounting surface 11a, and for example, a metal such as copper or aluminum is used. More preferable. The material of the mounting table 11 may be a ceramic or ceramic complex having high rigidity (Young's modulus) such as silicon carbide, aluminum nitride, Si-SiC, Al-SiC, etc., thereby maintaining the flatness of the mounting surface 11a constantly high. In addition, since it is not necessary to increase the thickness of the mounting table 11 for the purpose of preventing the warpage of the mounting surface 11a, it is possible to reduce the heat capacity and thereby to increase the temperature rising and lowering speed.

  The material of the support plate 12 is also preferably a ceramic or ceramic composite such as silicon carbide having high rigidity (Young's modulus), aluminum nitride, Si-SiC, or Al-SiC. In particular, when the material of the mounting table 11 is metal, as described later, the mounting table 11 and the support plate 12 are overlapped with each other with the heating unit 13 interposed therebetween to mechanically couple the mechanical connection, thereby suppressing the warpage of the mounting surface 11a. As a result, the heater unit 10 having high uniformity and high flatness can be realized in the mounting surface 11a.

  The mounting table 11 and the support plate 12 are preferably mechanically coupled to each other by screwing or the like. Also, when the mounting table 11 and the support plate 12 are made of different materials, for example, the mounting table 11 and the support plate 12 can be thermally expanded in the direction of the mounting surface 11 a freely according to the respective temperatures, for example A female screw (not shown) provided on the lower surface side of the mounting table 11 by inserting a male screw (not shown) from below into an insertion hole (not shown) provided in the supporting plate 12 and penetrating in the thickness direction Preferably, for example, a bearing (not shown) is interposed between the bearing surface of the male screw and the lower surface of the support plate 12 serving as the contact portion. In this case, also in the heating portion 13, the insertion holes of the female screw portion are provided at positions corresponding to the insertion holes of the support plate 12.

  Here, the screwing portion is preferably disposed outside the effective diameter of the resistance heating element described later. By doing this, it is possible to realize a mounting table with high temperature uniformity in which local cool spots hardly occur. When the screwing portion is disposed within the effective diameter of the resistance heating element, the plurality of heating zones are adjacent between circumferentially adjacent heating zones and / or between radially adjacent heating zones. Preferably, the division pattern is axisymmetric with respect to a radial line segment of the wafer mounting surface which is disposed and passes through the arrangement position, thereby suppressing the deterioration in temperature uniformity due to the screwing portion. Can. More preferably, the screwing portion is located on the same radial line segment as the lift pin insertion hole described above, and the division pattern is line symmetrical with respect to the line segment. As described above, when there are singular points such as mechanical parts and electrical parts that interfere with any or all of the mounting table, the heating unit, and the support plate, these singular points are disposed outside the effective diameter of the resistance heating element Alternatively, by placing the heating zone between adjacent heating zones within the effective diameter and at a position that is the symmetry line of the sectional pattern, the desired function can be exhibited without compromising the temperature uniformity. . The effective diameter of the resistance heating element is the diameter of a circular area of the wafer mounting surface 11a where the resistance heating element 13a described later is disposed immediately below.

  The heating unit 13 sandwiched between the mounting table 11 and the support plate 12 has a resistance heating element 13a extending in parallel to the mounting surface 11a. The resistance heating element 13a is covered with an insulator so as to be electrically insulated from the mounting table 11 and the support plate 12 described above, and the heating portion 13 of such a form is made of, for example, a conductive material such as stainless steel foil. The resistive heating element 13a is formed by patterning the conductive metallic foil by etching or laser processing, and the lead wires 16 for feeding are connected to both ends of the resistive heating element 13a, and then the resistance heating element 13a is viewed from above and below For example, it can produce by sandwiching with heat resistant insulation sheets, such as a polyimide sheet.

  Alternatively, when it is difficult to handle the resistance heating element 13a because the line width of the circuit pattern of the resistance heating element 13a is narrow or the thickness of the conductive metal foil used for the resistance heating element 13a is difficult, etc. The base conductive metal foil and a heat resistant insulation sheet such as a polyimide sheet for electrical insulation are laminated in advance and thermocompression bonded, and after this thermocompression bonding, only the conductive metal foil is patterned by etching or the like to obtain a base By integrating the entire surface polyimide film and the pattern foil (that is, the foil-like resistance heating element 13a) and further laminating the polyimide film on the integrated foil-like resistance heating element 13a and thermocompression bonding The heating unit 13 described above may be manufactured.

  In the heating unit 13, a plurality of resistance heating elements 13a may be extended on a surface parallel to the mounting surface 11a, whereby the mounting surface 11a can be divided into a plurality of heating zones. In this case, the power supply lead wire 16 is drawn out for each heating zone. The division pattern of the plurality of heating zones defined by the plurality of resistance heating elements 13a is not particularly limited, but the disk-shaped mounting table 11 generally dissipates heat from the peripheral portion having a larger surface area than the central portion. Because there are many, in the steady state, the peripheral portion is likely to be locally low in temperature. On the other hand, when the semiconductor wafer is mounted on the mounting table, the outer diameter of the mounting table is generally larger than the diameter of the wafer. Distribution occurs. Thereafter, the temperature of the mounting table is raised to a predetermined temperature by the operation of the control system. However, since the temperature distribution is affected, the transition temperature distribution of the semiconductor wafer also becomes concentric center cooling. In order to correct such a center-cool type temperature distribution, it is preferable that the division pattern of the heating zone be concentrically divided in the radial direction. Moreover, since a load lock etc. are provided in the wall surface of the vacuum chamber by which the heater module 1 is mounted, the environment around the mounting base 11 is not uniform in the circumferential direction. Therefore, as shown in FIG. 2, it is preferable to divide the mounting surface 11a concentrically and then to divide the mounting surface 11a equally in the circumferential direction.

  That is, in the division pattern of the plurality of heating zones shown in FIG. 2, the mounting surface 11 a has a circular central portion A, an annular intermediate portion B outside the circular central portion A, and an annular portion outside the annular intermediate portion B. The circular central portion A is divided into three regions concentrically with the peripheral portion C, and the circular central portion A is equally divided into three in the circumferential direction as central fan-shaped heating zones A1 to A3, and the annular intermediate portion B is The intermediate fan-shaped heating zones B1 to B6 are equally divided into six in the circumferential direction, and the annular peripheral portion C is equally divided into six circumferentially peripheral fan-shaped heating zones C1 to C6 in the circumferential direction.

  There is no particular limitation on the circuit pattern of the resistance heating element 13a that defines each heating zone, and various circuit patterns can be used. For example, it is possible to form a circuit pattern formed in a one-stroke writing shape with a plurality of concentrically curved conductive portions and a linear conductive portion connecting adjacent ones of the curved conductive portions. In this case, the power supply lead wire 16 is connected via electrode terminals (not shown) provided at both ends of the circuit of the resistance heating element 13a.

  In the circuit pattern described above, the heat generation density may be locally different, or when divided into a plurality of heating zones, the heat generation density may be different for each heating zone. For example, as described above, since the outside diameter of the mounting table is generally larger than the diameter of the wafer, when the semiconductor wafer is mounted on the mounting table, the center portion of the mounting table is concentrically cooled concentrically at a lower temperature than the outer peripheral portion. A mold temperature distribution results. Thereafter, the temperature of the mounting table is raised to a predetermined temperature by the operation of the control system. However, since the temperature distribution is affected, the transition temperature distribution of the semiconductor wafer also becomes concentric center cooling. In order to correct such a center-cool type temperature distribution, by designing the heat density of the central fan-shaped heating zones A1 to A3 high, it is possible to further improve the transient temperature uniformity at the time of wafer placement. . The method of increasing the heat generation density can be realized by narrowing the pitch of the circuit pattern of the resistance heating element 13a or narrowing the width of the conductive wire constituting the resistance heating element 13a.

  In heating part 13, the effective area of resistance heating element 13a (that is, the separated space between adjacent heating zones from the total area of heating part 13 over the entire area parallel to mounting surface 11a, a screw, It is preferable that the ratio of the space where there is no heat generation, such as the space for insertion holes of the holes and lift pins and the space for installation of the temperature measuring sensor, that is, the ratio of the effective heat generation area is 80% or more.

  In the heater module 1 according to one embodiment of the present invention, the temperature measuring sensor 15 formed of a temperature measuring element whose resistance value is adjusted in each of the one or more heating zones is provided at the center position of the heating zone. Preferably, the resistance heating elements 13a in the heating zone are individually controlled based on the detection value of the temperature sensor 15. Here, the central position of the heating zone can be defined as a geometric central point when the shape of the heating zone is a general shape such as a circle or a triangle, and the symmetry axis in the case of line symmetry It can be defined as the midpoint of the symmetrical line segment For example, in the case of a fan-shaped heating zone as shown in FIG. 2, the center position is at the middle angular position in the circumferential direction and at the middle position in the radial direction.

  When a plurality of resistance heating elements 13a are provided, since the mounting surface 11a can be locally heated by configuring the control system as described above, the mounting surface 11a is partially formed, for example, by opening and closing the load lock. It is possible to maintain good thermal uniformity even in the case of cooling. The temperature measuring sensor 15 has, for example, a counterbore hole 11b having a size for accommodating the temperature measuring sensor 15 on the lower surface side of the mounting table 11, and an adhesive is applied to the bottom surface thereof to fix the temperature measuring sensor 15 by bonding. The temperature of the heating zone can be detected well. In this case, the lead wire 17 of the temperature measurement sensor 15 is drawn from the lower surface side of the mounting table 11. In order to suppress the heat escape from the lead wire 17, for example, the lead wire 17 is preferably brought into contact with the contact portion 17 a of the lower surface of the support plate 12.

  Below the above-mentioned heater unit 10, a cooling unit 20 for rapidly cooling the heater unit 10 is provided. The cooling unit 20 reciprocates between an abutting position indicated by a dashed dotted line abutting on the lower surface side of the support plate 12 and a separated position indicated by a solid line separating downward from the supporting plate 12 as indicated by a white arrow. It has movable movable cooling plate 21 and fixed cooling plate 22 that abuts on the lower surface side of movable cooling plate 21 at the separated position. The material of the movable cooling plate 21 and the fixed cooling plate 22 is selected from copper, aluminum, nickel, magnesium, titanium, or an alloy having at least one of them as a main component or a metal having high thermal conductivity such as stainless steel. It is preferable to do.

  The stationary cooling plate 22 described above has a refrigerant flow path 22a in which an antifreeze liquid such as a fluorine-based refrigerant cooled by a cooling device such as a chiller (not shown), air, and a refrigerant such as general-purpose water circulates. There is no particular limitation on the method of producing the stationary cooling plate 22 having the refrigerant flow passage 22a, and for example, a metal plate member is prepared as a base material of the stationary cooling plate 22, and Cu as a refrigerant flow passage is provided on the lower surface side. Etc., attach a stainless steel joint to both ends of the metal pipe, and screw the metal plate and the plate member while holding the metal pipe against the plate member with a pressure plate. It can be produced by mechanically coupling by, for example.

  In order to obtain higher thermal efficiency, a metal plate member is prepared as a base material of the fixed cooling plate 22, and for example, an annular or spiral counterbore groove is provided on the lower surface side, and is spirally formed in the counterbore groove You may install the metal pipe for refrigerant | coolant circulation. In this case, in order to maintain good heat transfer between the metal pipe and the plate-like member, it is preferable to bond and fix the surface of the metal pipe and the inner surface of the counterbore with caulks, sealants, adhesives and the like. Alternatively, two plate-shaped members of substantially the same shape and made of the same material may be prepared as a base material of the fixed cooling plate 22, and a groove serving as a flow path may be formed by machining on one of the opposing surfaces thereof. Alternatively, grooves may be formed on both of the opposing surfaces to be channels by machining. In this case, it is preferable that the two plate members be stacked and then integrated by a bonding method such as brazing.

  The movable cooling plate 21 is attached to a lift mechanism 23 composed of an air cylinder or the like. As a result, by operating the elevating mechanism 23, the movable cooling plate 21 can be reciprocated between the contact position and the separated position described above. The movable cooling plate 21 may not be provided, and the cooling plate itself having the refrigerant flow path may be reciprocated between a position where it abuts on the lower surface side of the support plate 12 and a position where it is separated from the lower surface side.

  An intervening layer (not shown) may be provided on the upper surface of the movable cooling plate 21 and the upper surface of the fixed cooling plate 22 and / or the lower surface of the support plate 12 in order to enhance the heat conductivity. The intervening layer preferably has cushioning properties (flexibility) in the thickness direction, and preferably has heat resistance. Furthermore, it is preferable to have high thermal conductivity, for example, of 1 W / m · K or more. As such a material, an inorganic sheet such as a foam metal, a metal mesh, or a graphite sheet may be used, or a resin sheet such as a fluorine resin, a polyimide resin, or a silicone resin may be used. In the case of the above-mentioned resin sheet, it becomes possible to make thermal resistance smaller by containing thermal conductive fillers, such as carbon.

  In the heater module 1 according to one specific example of the present invention, in the fixed cooling plate 22 described above, the wiring substrate 30 is in contact with the lower surface side (rear surface side) opposite to the surface facing the movable cooling plate 21. Is attached. The wiring board 30 is preferably accommodated in a wiring board counterbore 22 b provided on the lower surface side of the fixed cooling plate 22. The wiring substrate 30 includes a first wiring 32 connected to the feeding lead wire 16 and a lead wire for the temperature sensor 15 on one side of the insulating substrate 31 formed of an insulating material such as glass epoxy. It has a structure in which a second wiring 33 to be connected is formed.

  A first connector 34 is mounted at one end of the circuit of the first wiring 32 described above, and an engaging portion (not shown) provided at the tip of the lead wire 16 for feeding is attached to and removed from the first connector 34. It is connected freely. Similarly, the second connector 35 is mounted at one end of the circuit of the second wiring 33 described above, and an engagement portion (not shown) provided at the tip of the lead wire 17 of the temperature sensor 15 in the second connector 35 (Not shown) is detachably connected.

  The other end portions of the first wiring 32 and the second wiring 33 are collected at one place on the insulating substrate 31, respectively, and at these two places, a first termination collective connector 36 for the first wiring 32 and The second terminal collecting connector 37 for the second wire 33 is often mounted. Then, the first and second terminal collecting connectors 36 and 37 each have a bundle of lead wires respectively connected to the lead wires 16 and 17 through the first wiring 32 and the second wiring 33. And the engaging part (not shown) of the 2nd set leader line 38, 39 is connected detachably. With this configuration, it is possible to simplify the assembly and maintenance operations of the heater module 1, and also to pull the lead wires out of the heater module 1 without being complicated.

  There is no particular limitation on the method of manufacturing the wiring substrate 30 described above. A conductive layer is formed on both surfaces of the insulating substrate 31 by dry plating or wet plating, and then patterning is performed to obtain a desired circuit pattern. The first wiring 32 and the second wiring 33 may be formed, or the metal foil may be attached to both surfaces of the insulating substrate 31 by thermocompression bonding or the like and then patterning may be performed. Alternatively, the film formation layer of the first wiring 32 and the film formation layer of the second wiring 33 may be stacked on one surface of the insulating substrate 31 with the insulating layer interposed therebetween. In this case, in order to prevent electrical interference between the first wiring 32 and the second wiring 33, an electric shield layer is interposed between the film forming layer of the first wiring 32 and the film forming layer of the second wiring 33. Is preferred.

  As mentioned above, although the heater module of the present invention was explained taking one specific example, the present invention is not limited to the one specific example concerned, and it may be carried out in various modes within the scope of the present invention. It is possible. For example, although the heater unit described above has a structure in which the heating unit having a resistance heating element is sandwiched between the mounting table and the support plate, the present invention is not limited to this structure. It may be made a structure without a support plate by embedding it. That is, the technical scope of the present invention is the scope of the claims and the equivalents thereof.

Example 1
The heater module 1 as shown in FIG. 1 was manufactured, and the performance was evaluated by heating the semiconductor wafer mounted on the mounting surface 11a while controlling the temperature for each heating zone. Specifically, a disk-shaped copper plate 320 mm in diameter × 3 mm in thickness was first prepared as the mounting table 11. In this copper plate, a counterbore hole 11b is formed at the center position of each heat generation zone to be described later on the surface opposite to the mounting surface 11a, and a ceramic (W2 mm × D2 mm × H1 mm) three-wire The temperature measuring sensor 15 composed of a temperature measuring element was adhered and fixed using a silicone adhesive.

  Moreover, the disk shaped Si-SiC board of diameter 320 mm x thickness 3 mm was prepared as the support plate 12. As shown in FIG. The Si-SiC plate was provided with a lead wire of the temperature measuring element, a lead wire of a resistance heating element to be described later, and a through hole for inserting a fastening screw. Next, a circuit pattern was formed by etching on a stainless steel foil having a thickness of 20 μm to produce a plurality of resistance heating elements 13a, and lead wires 16 for feeding were attached to their respective end portions. The plurality of resistance heating elements 13a were covered with a polyimide sheet having a thickness of 50 μm from above and below, and thermocompression bonding was performed to prepare a film-like heating unit 13.

  The plurality of resistance heating elements 13a described above are often arranged in a plurality of heating zones divided by the pattern shown in FIG. That is, in the division pattern of FIG. 2, the circular mounting surface 11a is divided into three concentric circles of φ 120 mm, φ 246 mm and φ 302 mm into a circular central portion A, an annular intermediate portion B and an annular peripheral portion C, and further a φ 120 mm circular shape The central portion A is divided into three equal parts in the circumferential direction, and the annular intermediate part B with an outer diameter φ 246 mm and an inner diameter φ 120 mm is equally divided into six parts, and an annular peripheral part C with an outer diameter φ 302 mm and an inner diameter φ 246 mm is equally divided into six parts. did. As a result, a total of 30 power supply lead wires 16 were drawn out of the heating unit 13.

  The heating unit 13 was sandwiched between the mounting table 11 and the support plate 12 described above, and a screw was inserted into a through hole previously provided in the support plate 12 and screwed on the mounting table 11. Thereby, the heater unit 10 in which the mounting table 11 and the support plate 12 were mechanically coupled to each other was manufactured. In addition, the screw which equipped the bearing surface with the bearing was used for said screw so that the mounting base 11 and the support plate 12 might not deform | transform by thermal expansion amount difference. Three fastening screws were provided for PCD 120 mm, and six fastening screws were provided for PCD 310 mm.

  Further, in order to suppress heat escape from the lead wire 17 of the temperature measuring sensor 15, the lead wire 17 of the temperature measuring sensor 15 taken out from the support plate 12 is brought into contact with the lower surface of the support plate 12. The contact portion 17a was fixed by bonding over a length of 30 mm. In the above configuration, the three lead wires 17 of the three-wire temperature measuring element and the two lead wires 16 for feeding to the resistance heating element 13a are drawn out from each heat generation zone, so a total of 75 lead wires 16 , 17 were pulled out of the heater unit 10.

Next, as the cooling unit 20, a disk-shaped aluminum alloy plate of 320 mm in diameter × 12 mm in thickness for the movable cooling plate 21 and a disk-shaped aluminum alloy plate of 320 mm in diameter × 12 mm in thickness for the fixed cooling plate 22 And prepared. In the aluminum alloy plate for the movable cooling plate 21, a flexible silicone sheet is disposed on the upper surface side in contact with the supporting plate 12 so that the entire surface of the supporting plate 12 and the movable cooling plate 21 is in contact. On the other hand, a phosphorus-deoxidized copper pipe having an outer diameter of 6 mm and a thickness of 1 mm for the refrigerant channel 22a was attached to the lower surface of the aluminum alloy plate for the stationary cooling plate 22 using a screw. Then, joints for supplying and discharging the refrigerant were attached to both ends of the copper pipe. A counterbore hole 22b of φ 200 mm × depth 5 mm for housing a wiring board 30 described later is provided on the surface (back side) opposite to the surface facing the movable cooling plate 21 in the fixed cooling plate 22. .

  In the wiring substrate 30, a copper foil is superposed on the surface of the insulating substrate 31 made of glass epoxy and thermocompression bonded so that the outer diameter is 198 mm and the total thickness is 1.6 mm, and then the copper foil is patterned by etching. Thus, the first wiring 32 connected to the power supply lead wire 16 of the resistance heating element 13a is formed. After applying an insulating resist on the first wiring 32 in order to ensure the electrical insulation of the first wiring 32, a copper foil was superposed on the insulating resist and thermocompression-bonded. The second layer copper foil was used as a shield layer by forming a so-called solid pattern covering the entire surface of the first wiring 32 without etching. In order to ensure the electrical insulation of the shield layer, an insulating resist was applied on the shield layer, and then the copper foil on the insulating resist was overlaid and thermocompression bonded. Then, the third layer copper foil is patterned by etching to form a second wiring 33 connected to the lead wire 17 of the temperature sensor 15. In order to ensure the electrical insulation of the second wiring 33, an insulating resist was applied on the second wiring 33.

  In this manner, a wiring board 30 was produced in which the first wiring 32 and the second wiring 33 were stacked on the surface of the glass epoxy substrate via the insulating layer made of insulating resist and the shield layer. The wiring board 30 is previously provided with holes for inserting the lead wires 16 and 17 and holes for inserting structural components such as lift pins. The shield layer is electrically connected to the cooling unit 20 in order to avoid electrical interference between the layers of the second wiring 33 and the layers of the first wiring 32 which are stacked in different positions.

  As the first and second connectors 34 and 35 for connection to the feeding lead 16 and the lead 17 of the temperature sensor 15 at one end of each of the circuits of the first and second wirings 32 and 33, respectively. A commercially available connector was mounted by soldering. Further, at the other end on the opposite side, a bundle of leader lines connected to the lead wires 16 and 17 via the first and second wires 32 and 33 (first and second collective leader lines 38, 39) The first and second terminal collecting connectors 36, 37, which can be simultaneously and collectively wired, are often mounted by soldering. Further, on the surface of the wiring board 30, a route from the periphery of the counterbore 22b to the connection destination connector is drawn by silk printing so that the connection work can be performed smoothly and clearly. The total thickness including the surface mounted first and second connectors 34, 35 was 4.6 mm except for the first and second terminal collecting connectors 36, 37. The wiring board 30 produced in this manner was fixed to the bottom of the counterbore hole 22 b of the fixed cooling plate 22 by screwing.

  The cooling unit 20 made of the above two aluminum alloy plates is provided with a through hole through which the lead wire 16 for feeding, the lead wire 17 of the temperature sensor 15, and a leg portion erected from the bottom of the container described later The Further, the aluminum alloy plate for the stationary cooling plate 22 is provided with a through hole through which a rod of a lifting air cylinder of the movable cooling plate 21 described later is inserted. The above-mentioned cooling unit 20 was installed in a stainless steel container 40 having a side wall of 1.5 mm thick and an open top. An air cylinder as an elevating mechanism 23 was provided below the fixed cooling plate 22, and the rod was inserted through the above-mentioned through hole for rod insertion, and the movable cooling plate 21 was attached to the tip. Thus, the heater module 1 of the sample 1 was produced. The distance between the lower surface of the support plate 12 and the upper surface of the movable cooling plate 21 was 10 mm when the rod of the air cylinder was retracted.

  For comparison, 75 mm of lead wires 16 and 17 drawn from the heater unit 10 are wound on the surface of the fixed cooling plate 22 opposite to the surface facing the movable cooling plate 21 so that the width is 4 mm.times. A heater module of sample 2 was manufactured in the same manner as the heater module 1 of sample 1 except that grooves having a depth of 10 mm were provided by spot facing processing for each heating zone. The heater module of this sample 2 has a complicated structure because it is necessary to provide a groove in which all of the lead wire 16 for feeding and the lead wire 17 for temperature measurement sensor are mixed near the collective connector 36.

  Further, when the lead wire 16 for feeding and the lead wire 17 for the temperature measuring sensor 15 are often connected to the connectors 34 and 35, the connectors 34 and 35 are wound one by one while being wound inside the above-described countersunk groove. It was a tedious task because it needed to be connected to the Furthermore, in a route where a plurality of lead wires cross or run in parallel, a connection failure due to a connection error of the lead wires occurs, and reassembly occurs.

  Further, for comparison, a sample is prepared in the same manner as the heater module 1 of the sample 1 except that the wiring board 30 is installed on the back of the stainless steel container 40 without providing the cooling unit 20 consisting of the movable cooling plate 21 and the fixed cooling plate 22. Three heater modules were produced. The heater module of this sample 3 was able to be assembled in a short time without making a connection mistake similarly to the heater module 1 of sample 1, but a short circuit occurred on the surface of the wiring substrate 30 during the temperature rise evaluation of the heater unit. . This is because the temperature rise of the wiring board 30 is too high due to the temperature rise due to the self heating by the energization of the first wiring 32 of the wiring board 30 and the peripheral environment becoming warm due to the temperature rise of the heater, the insulation performance is lowered. It is surmised that the

  On the other hand, in the heater module 1 of the sample 1 described above, connection work is completed simply by connecting to the nearest first and second connectors 34 and 35 according to the route drawn on the wiring substrate 30, and connection errors occur. Could be assembled in a short time. In addition, since the wiring board 30 is always cooled by the flow of water to the refrigerant flow path 22a provided in the cooling unit 20, the problem of the shorting of the wiring board 30 generated in the heater module of the sample 3 does not occur.

DESCRIPTION OF SYMBOLS 1 heater module 10 heater unit 11 mounting base 11a mounting surface 12 support plate 13 heating part 13a resistance heating element 14 leg part 15 temperature measurement sensor 16 lead wire for electric power feeding 17 lead wire for temperature measurement sensor 17 a contact part 20 cooling part 21 Movable cooling plate 22 Fixed cooling plate 22a Refrigerant flow path 22b Counterbore hole for wiring board 23 Lifting mechanism 30 Wiring board 31 Insulating board 32 1st wiring 33 2nd wiring 34 1st connector 35 2nd connector 36 1st termination assembly Connector 37 second end collective connector 38 first collective leader line 39 second collective leader line 40 container A circular center part A1 to A3 central part fan-shaped heating zone B annular middle part B1 to B6 middle part fan-shaped heating zone C annular peripheral part C1 C6 Peripheral fan-shaped heating zone

Claims (3)

  A heater unit comprising a resistance heating element provided on the upper surface with a mounting surface on which an object to be processed is mounted and heating the object mounted on the mounting surface, and spaced apart from the lower side of the heater unit A heater module comprising: a cooling unit installed; and a wiring substrate which is in contact with a surface of the cooling unit opposite to the surface facing the heater unit and to which a lead wire drawn from the heater unit is connected.   The heater module according to claim 1, wherein the wiring board mounts a connector to which the lead wire is detachably connected.   The cooling unit includes a fixed cooling plate having a refrigerant flow path, and a movable cooling plate reciprocating between the fixed cooling plate and the heater unit, and in the fixed cooling plate, the movable cooling plate 3. The heater module according to claim 1, wherein the wiring substrate is attached to a surface opposite to a surface opposite to the light source.

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