[go: up one dir, main page]

JP2019071748A - Power transmission unit - Google Patents

Power transmission unit Download PDF

Info

Publication number
JP2019071748A
JP2019071748A JP2017197659A JP2017197659A JP2019071748A JP 2019071748 A JP2019071748 A JP 2019071748A JP 2017197659 A JP2017197659 A JP 2017197659A JP 2017197659 A JP2017197659 A JP 2017197659A JP 2019071748 A JP2019071748 A JP 2019071748A
Authority
JP
Japan
Prior art keywords
power transmission
substrate
coil
shield member
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017197659A
Other languages
Japanese (ja)
Other versions
JP6649925B2 (en
Inventor
アントニー ガフ
Ngahu Antony
アントニー ガフ
良平 西崎
Ryohei Nishizaki
良平 西崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP2017197659A priority Critical patent/JP6649925B2/en
Priority to US16/151,869 priority patent/US10825606B2/en
Priority to DE102018217314.1A priority patent/DE102018217314A1/en
Priority to CN201811178555.XA priority patent/CN109660033B/en
Publication of JP2019071748A publication Critical patent/JP2019071748A/en
Application granted granted Critical
Publication of JP6649925B2 publication Critical patent/JP6649925B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2871—Pancake coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/70—Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
    • H02J2105/37—

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)
  • Regulation Of General Use Transformers (AREA)

Abstract

【課題】少なくとも基板から発生する磁界が外部に漏洩することを抑制できる電力伝送ユニットを提供する。【解決手段】電力伝送ユニットは、電力伝送コイル２０と、基板１０と、基板シールド部材８０とを備える。電力伝送コイル２０は、相手側電力伝送コイルと非接触により電力を伝送する。基板１０は、板状に形成され、電力伝送コイル２０に対向して設けられ、電力伝送コイル２０に電気的に接続され、電力伝送コイル２０との間で電流が流れる。基板シールド部材８０は、板状に形成され、基板１０の電力伝送コイル２０とは反対側に設けられ、磁界を遮蔽する。【選択図】図５A power transmission unit capable of suppressing at least leakage of a magnetic field generated from a substrate to the outside is provided. The power transmission unit includes a power transmission coil, a substrate, and a substrate shield member. The power transmission coil 20 transmits power without contact with the counterpart power transmission coil. The substrate 10 is formed in a plate shape, is provided to face the power transmission coil 20, is electrically connected to the power transmission coil 20, and a current flows between the power transmission coil 20. The substrate shield member 80 is formed in a plate shape and is provided on the opposite side of the substrate 10 from the power transmission coil 20 to shield the magnetic field. [Selection] Figure 5

Description

本発明は、電力伝送ユニットに関する。   The present invention relates to a power transfer unit.

従来、電力伝送ユニットとして、例えば、特許文献１には、非接触で電力を供給する給電システムが開示されている。この給電システムは、電力を供給する給電側共鳴コイルと、当該給電側共鳴コイルにより発生する漏洩磁界を遮蔽する給電側シールドケースとを備えている。   BACKGROUND ART Conventionally, as a power transfer unit, for example, Patent Document 1 discloses a power supply system for supplying power in a contactless manner. The feed system includes a feed resonance coil for supplying power and a feed shield case for shielding a leakage magnetic field generated by the feed resonance coil.

特開２０１４−１１３０２１号公報JP, 2014-130021, A

ところで、上述の特許文献１に記載の給電システムは、例えば、給電側共鳴コイルに接続される基板に電流が流れ、当該電流により発生する磁界が外部に漏洩することを抑制する点で、更なる改善の余地がある。   By the way, in the feed system described in Patent Document 1 described above, for example, the current flows to the substrate connected to the feed side resonance coil, and the magnetic field generated by the current is further suppressed in suppressing the leakage to the outside. There is room for improvement.

そこで、本発明は、上記に鑑みてなされたものであって、少なくとも基板から発生する磁界が外部に漏洩することを抑制できる電力伝送ユニットを提供することを目的とする。   Then, this invention is made in view of the above, Comprising: It aims at providing the electric power transmission unit which can suppress that the magnetic field generate | occur | produced from a board | substrate leaks outside at least.

上述した課題を解決し、目的を達成するために、本発明に係る電力伝送ユニットは、相手側電力伝送コイルと非接触により電力を伝送する電力伝送コイルと、板状に形成され、前記電力伝送コイルに対向して設けられ、前記電力伝送コイルに電気的に接続され、前記電力伝送コイルとの間で電流が流れる基板と、板状又は膜状に形成され、前記基板の前記電力伝送コイルとは反対側に設けられ、磁界を遮蔽する第１シールド部材と、を備えることを特徴とする。   In order to solve the problems described above and achieve the object, the power transfer unit according to the present invention is formed in a plate shape with a power transfer coil that transfers power without contact with the other power transfer coil, and the power transfer A substrate provided opposite to a coil, electrically connected to the power transmission coil, and having a substrate through which current flows with the power transmission coil, and a plate or film formed, the power transmission coil of the substrate And a first shield member provided on the opposite side and shielding a magnetic field.

上記電力伝送ユニットにおいて、板状に形成され、前記第１シールド部材と前記基板との間に設けられ、磁性材料を含んで構成される磁性部材を備えることが好ましい。   The power transmission unit preferably includes a magnetic member which is formed in a plate shape, is provided between the first shield member and the substrate, and includes a magnetic material.

上記電力伝送ユニットにおいて、前記磁性部材は、前記電力伝送コイルと前記基板とが対向する対向方向に交差する交差方向において、当該磁性部材の前記交差方向に沿って延在する側の端部が、前記第１シールド部材の前記交差方向に沿って延在する側の端部よりも前記第１シールド部材の中央側に位置することが好ましい。   In the power transmission unit, an end of the magnetic member extends along the cross direction of the magnetic member in a cross direction crossing the opposite direction in which the power transfer coil and the substrate face each other, It is preferable to be located in the center side of the said 1st shield member rather than the edge part of the side extended along the said cross direction of a said 1st shield member.

上記電力伝送ユニットにおいて、前記第１シールド部材は、前記基板と同等の大きさに形成されることが好ましい。   In the power transmission unit, preferably, the first shield member is formed to have the same size as the substrate.

上記電力伝送ユニットにおいて、軸線周りに環状に形成され、内側に設けられる前記電力伝送コイルにより発生する磁界を遮蔽するシールド壁部を有する第２シールド部材を備え、前記シールド壁部は、前記軸線に交差する交差方向に対向する壁面の間隔が、前記相手側電力伝送コイルに向けて広くなるように形成されていることが好ましい。   The power transmission unit includes a second shield member formed in an annular shape around an axis and having a shield wall that shields a magnetic field generated by the power transmission coil provided inside, and the shield wall is formed on the axis. It is preferable that the distance between the wall surfaces facing each other in the intersecting direction is made wider toward the other power transmission coil.

本発明に係る電力伝送ユニットは、基板の電力伝送コイルとは反対側に設けられ磁界を遮蔽する第１シールド部材を備えるので、少なくとも基板から発生する磁界が外部に漏洩することを抑制できる。   The power transmission unit according to the present invention includes the first shield member provided on the opposite side of the substrate to the power transmission coil to shield the magnetic field, so that it is possible to suppress the leakage of at least the magnetic field generated from the substrate to the outside.

図１は、実施形態１に係る電力伝送ユニットの構成例を示す斜視図である。FIG. 1 is a perspective view showing a configuration example of a power transfer unit according to the first embodiment. 図２は、実施形態１に係る電力伝送ユニットの構成例を示す分解斜視図である。FIG. 2 is an exploded perspective view showing a configuration example of the power transfer unit according to the first embodiment. 図３は、実施形態１に係るアウターケースを取り外した状態の電力伝送ユニットの構成例を示す斜視図である。FIG. 3 is a perspective view showing a configuration example of the power transmission unit in a state in which the outer case according to the first embodiment is removed. 図４は、実施形態１に係る電力伝送ユニットの構成例を示す裏面側の斜視図である。FIG. 4 is a perspective view of the back side showing a configuration example of the power transfer unit according to the first embodiment. 図５は、実施形態１に係る電力伝送ユニットにおける図３のＭ−Ｍ断面図である。FIG. 5 is a cross-sectional view taken along a line MM in FIG. 3 in the power transfer unit according to the first embodiment. 図６は、実施形態１に係る送電側及び受電側の電力伝送ユニットを示す断面図である。FIG. 6 is a cross-sectional view showing the power transmission unit on the power transmission side and the power reception side according to the first embodiment. 図７は、比較例に係る電力伝送ユニットの磁界を示す図である。FIG. 7 is a diagram showing the magnetic field of the power transfer unit according to the comparative example. 図８は、実施形態１に係る電力伝送ユニットの磁界を示す図である。FIG. 8 is a diagram showing a magnetic field of the power transfer unit according to the first embodiment. 図９は、実施形態２に係る電力伝送ユニットの要部の構成例を示す断面図である。FIG. 9 is a cross-sectional view showing a configuration example of main parts of the power transmission unit according to the second embodiment. 図１０は、実施形態２に係る電力伝送ユニットの磁界を示す図である。FIG. 10 is a diagram showing a magnetic field of the power transfer unit according to the second embodiment. 図１１は、比較例としての実施形態１に係る電力伝送ユニットの渦電流による損失を示す図である。FIG. 11 is a diagram illustrating the loss due to the eddy current of the power transfer unit according to the first embodiment as a comparative example. 図１２は、実施形態２に係る電力伝送ユニットの渦電流による損失を示す図である。FIG. 12 is a diagram illustrating the loss due to the eddy current of the power transfer unit according to the second embodiment. 図１３は、実施形態２に係る基板と電力伝送コイルとの間隔の一例を示す図である。FIG. 13 is a diagram illustrating an example of the distance between the substrate and the power transmission coil according to the second embodiment. 図１４は、実施形態３に係る電力伝送ユニットの要部の構成例を示す断面図である。FIG. 14 is a cross-sectional view showing a configuration example of main parts of the power transmission unit according to the third embodiment. 図１５は、比較例としての実施形態２に係る電力伝送ユニットの要部の磁界を示す図である。FIG. 15 is a diagram showing the magnetic field of the main part of the power transmission unit according to the second embodiment as a comparative example. 図１６は、実施形態３に係る電力伝送ユニットの要部の磁界を示す図である。FIG. 16 is a diagram showing the magnetic field of the main part of the power transmission unit according to the third embodiment. 図１７は、実施形態１、２、３に係る電力伝送ユニットの電力伝送効率のシミュレーション結果を示す図である。FIG. 17 is a diagram illustrating simulation results of the power transfer efficiency of the power transfer unit according to the first, second, and third embodiments.

本発明を実施するための形態（実施形態）につき、図面を参照しつつ詳細に説明する。以下の実施形態に記載した内容により本発明が限定されるものではない。また、以下に記載した構成要素には、当業者が容易に想定できるもの、実質的に同一のものが含まれる。さらに、以下に記載した構成は適宜組み合わせることが可能である。また、本発明の要旨を逸脱しない範囲で構成の種々の省略、置換又は変更を行うことができる。   A mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, the components described below include those which can be easily conceived by those skilled in the art and those which are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or modifications of the configuration can be made without departing from the scope of the present invention.

〔実施形態１〕
実施形態に係る電力伝送ユニット１について説明する。電力伝送ユニット１は、非接触で電力を伝送し且つ信号を無線通信するユニットである。電力伝送ユニット１は、電力を送電する送電側、又は、電力を受電する受電側として機能する。電力伝送ユニット１は、例えば、図示しない車両に設けられた蓄電池を充電する場合に使用される。この場合、受電側の電力伝送ユニット１は、例えば、車両の底面部に設置され、車両の蓄電池に接続される。また、送電側の電力伝送ユニット１は、例えば、図示しない充電ステーションの地面に設置され、電源に接続される。送電側の電力伝送ユニット１は、受電側の電力伝送ユニット１と対向した状態で、電源から供給される電力を磁気共鳴等により受電側の電力伝送ユニット１に送電する。受電側の電力伝送ユニット１は、送電側の電力伝送ユニット１から送電された電力を受電し、受電した電力を車両の蓄電池に出力する。以下の説明において、電力伝送ユニット１は、送電側と受電側とにおいて主要な構成が同等の構成であるので、特段断りがない限り、送電側と受電側とを区別することなく説明する。 Embodiment 1
The power transmission unit 1 according to the embodiment will be described. The power transmission unit 1 is a unit that wirelessly transmits power and wirelessly communicates signals. The power transmission unit 1 functions as a power transmission side that transmits power or a power reception side that receives power. The power transmission unit 1 is used, for example, when charging a storage battery provided in a vehicle (not shown). In this case, the power transmission unit 1 on the power receiving side is installed, for example, on the bottom of the vehicle and connected to the storage battery of the vehicle. Also, the power transmission unit 1 on the power transmission side is installed, for example, on the ground of a charging station (not shown) and connected to a power source. The power transmission unit 1 on the power transmission side transmits power supplied from the power source to the power transmission unit 1 on the power receiving side by magnetic resonance or the like in a state of facing the power transmission unit 1 on the power receiving side. The power transmission unit 1 on the power reception side receives the power transmitted from the power transmission unit 1 on the power transmission side, and outputs the received power to the storage battery of the vehicle. In the following description, since the power transmission unit 1 has the same main configuration on the power transmission side and the power reception side, the power transmission side and the power reception side will be described without distinction unless otherwise noted.

電力伝送ユニット１は、図１、図２、図３に示すように、基板１０と、電力伝送コイル２０と、フェライト３０と、第２シールド部材としてのコイルシールド部材４０と、通信部としての通信カプラ５０と、インナー部材としてのインナーケース６０と、アウター部材としてのアウターケース７０と、第１シールド部材としての基板シールド部材８０とを備える。   As shown in FIG. 1, FIG. 2 and FIG. 3, the power transmission unit 1 communicates as a communication unit with the substrate 10, the power transmission coil 20, the ferrite 30, the coil shield member 40 as the second shield member and A coupler 50, an inner case 60 as an inner member, an outer case 70 as an outer member, and a substrate shield member 80 as a first shield member are provided.

ここで、軸線方向は、軸線Ｘに沿った方向である。軸線方向の上側は、電力伝送コイル２０側であり、軸線方向の下側は、基板１０側である。また、軸線方向は、対向方向とも称する。交差方向は、軸線方向に交差する方向である。直交方向は、軸線方向に直交する方向である。   Here, the axial direction is a direction along the axis X. The upper side in the axial direction is the power transmission coil 20 side, and the lower side in the axial direction is the substrate 10 side. Moreover, the axial direction is also referred to as a facing direction. The crossing direction is a direction crossing the axial direction. The orthogonal direction is a direction orthogonal to the axial direction.

基板１０は、電子回路を形成するものである。基板１０は、いわゆるプリント回路基板（Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ Ｂｏａｒｄ）である。基板１０は、例えば、エポキシ樹脂、ガラスエポキシ樹脂、紙エポキシ樹脂やセラミック等の絶縁性の材料からなる絶縁層に銅箔等の導電性部材によって配線パターン（プリントパターン）が形成される。基板１０は、例えば、矩形の板状に形成され、共振用コンデンサ等の種々の電子部品１１が実装される実装面１０ａと、当該実装面１０ａとは反対側の裏面１０ｂとを有する。基板１０は、実装面１０ａに実装された種々の電子部品１１を配線パターンにより電気的に接続する。基板１０は、軸線方向において電力伝送コイル２０に対向して設けられる。基板１０は、電力伝送コイル２０に電気的に接続され、当該電力伝送コイル２０との間で高周波電流が流れる。   The substrate 10 forms an electronic circuit. The board 10 is a so-called printed circuit board (Printed Circuit Board). In the substrate 10, a wiring pattern (print pattern) is formed of a conductive member such as copper foil on an insulating layer made of an insulating material such as epoxy resin, glass epoxy resin, paper epoxy resin, or ceramic. The substrate 10 is formed, for example, in a rectangular plate shape, and has a mounting surface 10a on which various electronic components 11 such as a resonance capacitor are mounted, and a back surface 10b opposite to the mounting surface 10a. The substrate 10 electrically connects various electronic components 11 mounted on the mounting surface 10 a by a wiring pattern. The substrate 10 is provided to face the power transmission coil 20 in the axial direction. The substrate 10 is electrically connected to the power transmission coil 20, and a high frequency current flows between the substrate 10 and the power transmission coil 20.

電力伝送コイル２０は、相手側電力伝送コイル２０Ａと非接触で電力を伝送するコイルである。電力伝送コイル２０は、共振用コンデンサと共にＬＣ共振回路を構成する。電力伝送コイル２０は、例えば、共振用コンデンサに直列に接続される。電力伝送コイル２０は、例えば、導体線２１が軸線Ｘ周りに渦巻状に設けられたコイル巻線部２２と、導体線２１の巻始め側の端部である巻始め端部２３と、巻始め端部２３とコイル巻線部２２との間の部分である中間部２４と、導体線２１の巻終り側の端部である巻終り端部２５とを備える。導体線２１は、例えば、複数の導体素線を撚り合せたリッツ線である。コイル巻線部２２は、軸線方向に交差する交差方向に沿って内側から外側に向けて複数回巻き回され渦巻状に形成された部分である。典型的には、コイル巻線部２２は、軸線方向に直交する直交方向に沿って内側から外側に向けて複数回巻き回される。中間部２４は、導体線２１がコイル巻線部２２の内側から外側に横断する部分である。中間部２４は、例えば、軸線方向に沿って圧縮され接着部材によりコイル巻線部２２に固定される。巻始め端部２３及び巻終り端部２５は、軸線方向から視た場合、コイル巻線部２２の外側に位置する。巻始め端部２３及び巻終り端部２５は、基板１０に電気的に接続される。   The power transmission coil 20 is a coil that transmits power without contact with the counterpart power transmission coil 20A. The power transmission coil 20 constitutes an LC resonance circuit together with a resonance capacitor. The power transmission coil 20 is, for example, connected in series to a resonance capacitor. The power transmission coil 20 has, for example, a coil winding portion 22 in which a conductor wire 21 is spirally provided around an axis X, a winding start end 23 which is an end portion on the winding start side of the conductor wire 21, and a winding start An intermediate portion 24 which is a portion between the end 23 and the coil winding portion 22 and a winding end 25 which is an end of the conductor wire 21 on the winding end side. The conductor wire 21 is, for example, a litz wire in which a plurality of conductor strands are twisted. The coil winding portion 22 is a portion formed in a spiral shape by being wound a plurality of times from the inside to the outside along a cross direction crossing the axial direction. Typically, the coil winding portion 22 is wound a plurality of times from the inside to the outside along the orthogonal direction orthogonal to the axial direction. The middle portion 24 is a portion where the conductor wire 21 traverses from the inside to the outside of the coil winding portion 22. The middle portion 24 is compressed, for example, along the axial direction and fixed to the coil winding portion 22 by an adhesive member. The winding start end 23 and the winding end 25 are located outside the coil winding 22 when viewed from the axial direction. The winding start end 23 and the winding end 25 are electrically connected to the substrate 10.

フェライト３０は、磁性材料を含む部材であり、例えば、酸化鉄と金属との複合酸化物である。フェライト３０は、例えば、矩形の板状に形成され、電力伝送コイル２０と同等の大きさに形成される。フェライト３０は、軸線方向において電力伝送コイル２０に対向して設けられる。フェライト３０は、電力伝送コイル２０により発生する磁力を通過させて磁力の損失を抑制する。   The ferrite 30 is a member containing a magnetic material, and is, for example, a composite oxide of iron oxide and metal. The ferrite 30 is formed, for example, in a rectangular plate shape, and is formed to have the same size as the power transmission coil 20. The ferrite 30 is provided to face the power transmission coil 20 in the axial direction. The ferrite 30 allows the magnetic force generated by the power transmission coil 20 to pass and suppresses the loss of the magnetic force.

コイルシールド部材４０は、ノイズ等の原因となる余分な電力伝送コイル２０の磁力（漏洩磁界）を遮蔽する部材である。コイルシールド部材４０は、例えば、銅やアルミ等の導電性の高い金属により形成される。コイルシールド部材４０は、軸線Ｘ周りに環状に形成されたシールド壁部４１を備え、軸線方向の両側が開口される。シールド壁部４１は、例えば、長尺状の板部材が軸線Ｘ周りに１周巻き回されて形成されるが、この形成方法に限定されない。シールド壁部４１は、軸線方向から視た場合、略矩形状に形成されており、４つの角部が丸みを有する。シールド壁部４１は、図３、図５等に示すように、交差方向に沿う位置で電力伝送コイル２０及びフェライト３０を囲うように設けられる。つまり、シールド壁部４１は、電力伝送コイル２０及びフェライト３０を囲うように外側に位置し、且つ、交差方向から視た場合、電力伝送コイル２０及びフェライト３０と重なるように設けられる。   The coil shield member 40 is a member that shields the magnetic force (leakage magnetic field) of the extra power transmission coil 20 that causes noise and the like. The coil shield member 40 is formed of, for example, a highly conductive metal such as copper or aluminum. The coil shield member 40 includes a shield wall portion 41 formed annularly around the axis X, and both sides in the axial direction are opened. The shield wall portion 41 is formed, for example, by winding a long plate member around the axis X, but is not limited to this method. The shield wall portion 41 is formed in a substantially rectangular shape when viewed from the axial direction, and four corner portions have roundness. The shield wall portion 41 is provided so as to surround the power transmission coil 20 and the ferrite 30 at a position along the cross direction, as shown in FIGS. That is, the shield wall portion 41 is provided outside so as to surround the power transmission coil 20 and the ferrite 30 and provided so as to overlap the power transmission coil 20 and the ferrite 30 when viewed from the cross direction.

シールド壁部４１は、相手側電力伝送コイル２０Ａ側に向けて末広がり形状に形成される。つまり、シールド壁部４１は、交差方向に対向する壁面４１ａの間隔Ｐが、軸線方向の一方側（下側）から他方側（上側）に向けて広くなるように形成される（図５、図６参照）。これにより、シールド壁部４１は、電力伝送コイル２０の磁力線（磁束線）が直交することを抑制することができる。従って、シールド壁部４１は、電力伝送コイル２０による磁界の変動を打ち消す磁界を発生させる渦電流が流れることを抑制できるので、電力伝送効率の低下を抑制することができる。また、シールド壁部４１は、軸線方向に沿って切断した切断部４１ｂが、シールド壁部４１の外側に湾曲した弧状に形成される。これにより、シールド壁部４１は、渦電流が流れることをより抑制することができる。   The shield wall portion 41 is formed in a diverging shape toward the other power transmission coil 20A. That is, the shield wall portion 41 is formed such that the distance P between the wall surfaces 41a opposed in the cross direction becomes wider from one side (lower side) to the other side (upper side) in the axial direction (FIG. 5, FIG. 6). Thereby, shield wall part 41 can control that a line of magnetic force (magnetic flux line) of electric power transmission coil 20 crosses at right angles. Therefore, the shield wall portion 41 can suppress the flow of an eddy current that generates a magnetic field that cancels out the fluctuation of the magnetic field due to the power transmission coil 20, and therefore can suppress the reduction of the power transmission efficiency. Further, in the shield wall portion 41, a cutting portion 41b cut along the axial direction is formed in an arc shape curved to the outside of the shield wall portion 41. Thereby, the shield wall portion 41 can further suppress the flow of the eddy current.

通信カプラ５０は、信号を送受信するアンテナである。通信カプラ５０は、軸線Ｘ周りに環状に形成される。通信カプラ５０は、例えば、アンテナ線５１が軸線Ｘ周りに複数回（例えば３回）螺旋状に巻き回されて形成される。通信カプラ５０は、アンテナ線５１の巻始め側の端部である第１端部５２とアンテナ線５１の巻終り側の端部である第２端部５３とが基板１０に電気的に接続される。通信カプラ５０は、軸線方向から視た場合、略矩形状に形成される。通信カプラ５０は、交差方向に沿う位置で電力伝送コイル２０を囲うように設けられる。つまり、通信カプラ５０は、電力伝送コイル２０を囲うように外側に位置する。通信カプラ５０は、交差方向において電力伝送コイル２０との間にコイルシールド部材４０が設けられる。これにより、コイルシールド部材４０は、電力伝送コイル２０による磁力が通信カプラ５０に影響することを抑制できる。従って、通信カプラ５０は、特性が変化することを抑制することが可能となり信号の損失を抑制することができるので、通信品質が低下することを抑制できる。   The communication coupler 50 is an antenna that transmits and receives a signal. The communication coupler 50 is annularly formed around the axis X. The communication coupler 50 is formed, for example, by spirally winding the antenna wire 51 around the axis X a plurality of times (for example, three times). In the communication coupler 50, a first end 52, which is an end on the winding start side of the antenna wire 51, and a second end 53, which is an end on the winding end of the antenna wire 51, are electrically connected to the substrate 10. Ru. The communication coupler 50 is formed in a substantially rectangular shape when viewed from the axial direction. The communication coupler 50 is provided to surround the power transmission coil 20 at a position along the cross direction. That is, the communication coupler 50 is located outside so as to surround the power transmission coil 20. The communication coupler 50 is provided with a coil shield member 40 between it and the power transmission coil 20 in the cross direction. Thereby, the coil shield member 40 can suppress that the magnetic force by the power transmission coil 20 affects the communication coupler 50. Therefore, the communication coupler 50 can suppress the change of the characteristics and can suppress the loss of the signal, so that the deterioration of the communication quality can be suppressed.

インナーケース６０は、アウターケース７０の内部に収容される部材である。インナーケース６０は、絶縁性の合成樹脂等により形成され、例えば、周知の射出成形によって成形される。インナーケース６０は、相手側電力伝送コイル２０Ａと電力伝送可能に、基板１０、電力伝送コイル２０、及び、フェライト３０の相対位置を規定し、さらに、相手側通信カプラ５０Ａと通信可能に、コイルシールド部材４０及び通信カプラ５０の相対位置を規定する。そして、インナーケース６０は、基板１０、電力伝送コイル２０、フェライト３０、コイルシールド部材４０、及び、通信カプラ５０が組み付けられる。これにより、電力伝送ユニット１は、基板１０、電力伝送コイル２０、及び、フェライト３０、コイルシールド部材４０、及び、通信カプラ５０を含む構成部品がインナーケース６０に位置決めされて組み付けられた状態で、当該インナーケース６０をアウターケース７０に収容することができる。従って、電力伝送ユニット１は、例えば、直接、アウターケース７０の内側に構成部品を組み付ける場合と比較し、構成部品の相対位置を容易且つ正確に規定することができると共に構成部品を容易に保持することができる。これにより、電力伝送ユニット１は、相手側電力伝送ユニット２の構成部品との相対位置も正確に規定することができる。   The inner case 60 is a member housed inside the outer case 70. The inner case 60 is formed of an insulating synthetic resin or the like, and is formed by, for example, known injection molding. Inner case 60 defines the relative positions of substrate 10, power transmission coil 20, and ferrite 30 so as to transmit power with partner power transmission coil 20A, and can further communicate with partner communication coupler 50A, coil shield The relative position of the member 40 and the communication coupler 50 is defined. The inner case 60 is assembled with the substrate 10, the power transmission coil 20, the ferrite 30, the coil shield member 40, and the communication coupler 50. Thus, in the power transmission unit 1, components including the substrate 10, the power transmission coil 20, the ferrite 30, the coil shield member 40, and the communication coupler 50 are positioned and assembled in the inner case 60, The inner case 60 can be accommodated in the outer case 70. Therefore, the power transmission unit 1 can easily and accurately define the relative positions of the components and easily hold the components, as compared to, for example, directly assembling the components inside the outer case 70. be able to. As a result, the power transfer unit 1 can also accurately define the relative position with respect to the components of the other power transfer unit 2.

インナーケース６０は、支持板６１と、立設壁部６２と、収容室６３と、複数の連結部材６４とを備える。支持板６１は、軸線Ｘに交差するように設けられる。立設壁部６２は、支持板６１から立設され軸線Ｘ周りに環状に設けられる。立設壁部６２は、軸線方向から視た場合、略矩形状に形成される。立設壁部６２は、外周の形状が通信カプラ５０の内周の形状と同等の形状である。立設壁部６２は、例えば、通信カプラ５０が外面に巻き回されることにより当該通信カプラ５０を装着する。立設壁部６２は、内周の形状がコイルシールド部材４０の外周の形状と同等の形状である。立設壁部６２は、内側にコイルシールド部材４０の外面を支持する湾曲形状の支持部６２ａを備える。立設壁部６２は、コイルシールド部材４０を支持部６２ａにより支持して装着する。立設壁部６２は、例えば、コイルシールド部材４０を粘着テープ等（図示せず）により支持部６２ａに貼り付けて当該コイルシールド部材４０を装着する。立設壁部６２は、軸線方向の上側の縁部に切欠き部６１ａが設けられる。切欠き部６１ａは、立設壁部６２の軸線方向の上側の縁部の一部が切り込まれることにより形成される。これにより、切欠き部６１ａは、ポッティング材やモールド材をインナーケース６０の内部まで流れ込みやすくすることができる。   The inner case 60 includes a support plate 61, an upright wall portion 62, a storage chamber 63, and a plurality of connection members 64. The support plate 61 is provided to intersect the axis X. The erected wall portion 62 is erected from the support plate 61 and provided annularly around the axis X. The standing wall portion 62 is formed in a substantially rectangular shape when viewed from the axial direction. The standing wall portion 62 has a shape similar to that of the inner periphery of the communication coupler 50 in the outer periphery. The standing wall portion 62 mounts the communication coupler 50 by, for example, the communication coupler 50 being wound around the outer surface. The standing wall portion 62 has a shape similar to the shape of the outer periphery of the coil shield member 40 in the shape of the inner periphery. The upright wall portion 62 includes a curved support portion 62 a that supports the outer surface of the coil shield member 40 inside. The upright wall portion 62 mounts the coil shield member 40 supported by the support portion 62a. For example, the standing wall portion 62 attaches the coil shield member 40 to the support portion 62 a with an adhesive tape or the like (not shown) and mounts the coil shield member 40. The standing wall portion 62 is provided with a notch 61a at the upper edge in the axial direction. The notch 61 a is formed by cutting a part of the upper edge in the axial direction of the standing wall 62. Thereby, the notch 61a can easily make the potting material and the molding material flow into the inner case 60.

収容室６３は、直方体形状に形成され、立設壁部６２の内側に設けられる。収容室６３は、電力伝送コイル２０を収容する空間部６３ａと、電力伝送コイル２０を空間部６３ａに挿入する挿入口６３ｂと、電力伝送コイル２０の温度を計測し、且つ、アウターケース７０の間に存在する異物（例えば金属異物）を検知するためのサーミスタ１１ｂを取り付ける取付部６３ｃとを備える。収容室６３は、電力伝送コイル２０が挿入口６３ｂから空間部６３ａに挿入され、挿入された電力伝送コイル２０が空間部６３ａに収容される。収容室６３は、空間部６３ａに収容された電力伝送コイル２０の温度を計測し、且つ、アウターケース７０の間に存在する異物を検知するためのサーミスタ１１ｂが取付部６３ｃに取り付けられる。なお、インナーケース６０は、電力伝送コイル２０を挿入口６３ｂから空間部６３ａに挿入できるようにするために、挿入口６３ｂ側の一部６０ａが本体部６０ｂから分離可能に構成される。   The storage chamber 63 is formed in a rectangular parallelepiped shape, and is provided inside the standing wall portion 62. The accommodation chamber 63 measures the temperature of the power transmission coil 20, and measures the temperature of the power transmission coil 20, and a space 63 a for housing the power transmission coil 20, an insertion port 63 b for inserting the power transmission coil 20 into the space 63 a. And a mounting portion 63c for mounting a thermistor 11b for detecting a foreign substance (for example, a metal foreign substance) present in the In the accommodation chamber 63, the power transmission coil 20 is inserted into the space 63a from the insertion port 63b, and the inserted power transmission coil 20 is accommodated in the space 63a. The storage chamber 63 measures the temperature of the power transmission coil 20 stored in the space portion 63a, and a thermistor 11b is attached to the mounting portion 63c for detecting a foreign object existing between the outer cases 70. The inner case 60 is configured such that a part 60a on the insertion port 63b side is separable from the main body 60b so that the power transmission coil 20 can be inserted into the space 63a from the insertion port 63b.

各連結部材６４は、インナーケース６０と基板１０とを連結する棒状の部材である。各連結部材６４は、インナーケース６０の軸線方向の下側から当該軸線方向に沿って基板１０側に延在する。各連結部材６４は、基板１０側の端部が当該基板１０に固定されることにより、インナーケース６０と基板１０とを所定の間隔をあけて連結する。各連結部材６４は、例えば、基板１０側の端面にネジ孔が設けられる。各連結部材６４は、このネジ孔にボルトが締結され基板１０側の端面とボルトとにより基板１０を挟持することでインナーケース６０と基板１０とを連結する。なお、インナーケース６０と基板１０との連結方法は、上記の方法に限定されない。   Each connection member 64 is a rod-like member that connects the inner case 60 and the substrate 10. Each connecting member 64 extends from the lower side in the axial direction of the inner case 60 toward the substrate 10 along the axial direction. Each connecting member 64 connects the inner case 60 and the substrate 10 at a predetermined interval by fixing the end on the substrate 10 side to the substrate 10. Each connecting member 64 is provided, for example, with a screw hole at the end face on the substrate 10 side. Each connecting member 64 connects the inner case 60 and the substrate 10 by holding the substrate 10 between the end face of the substrate 10 and the bolt by fastening a bolt in the screw hole. In addition, the connection method of the inner case 60 and the board | substrate 10 is not limited to said method.

アウターケース７０は、インナーケース６０を覆う筐体である。アウターケース７０は、絶縁性の合成樹脂等により形成され、例えば、周知の射出成形によって成形される。アウターケース７０は、例えば、軸線方向の上側に設けられるアッパーケース７１と、軸線方向の下側に設けられるロアーケース７２とを備える。アウターケース７０は、アッパーケース７１とロアーケース７２とが軸線方向に組み付けられることで箱形状に形成される。アウターケース７０は、基板１０に設けられたコネクタ接続部１１ａを露出するコネクタ開口部７３が設けられる。アウターケース７０は、基板１０、電力伝送コイル２０、フェライト３０、コイルシールド部材４０、及び、通信カプラ５０がインナーケース６０に組み付けられた状態で、アッパーケース７１及びロアーケース７２により当該インナーケース６０全体を覆う。   The outer case 70 is a housing that covers the inner case 60. The outer case 70 is formed of an insulating synthetic resin or the like, and is formed by, for example, a known injection molding. The outer case 70 includes, for example, an upper case 71 provided on the upper side in the axial direction, and a lower case 72 provided on the lower side in the axial direction. The outer case 70 is formed in a box shape by assembling the upper case 71 and the lower case 72 in the axial direction. The outer case 70 is provided with a connector opening 73 that exposes the connector connection portion 11 a provided on the substrate 10. The outer case 70 includes the substrate 10, the power transmission coil 20, the ferrite 30, the coil shield member 40, and the communication coupler 50 assembled to the inner case 60. Cover the

基板シールド部材８０は、基板１０や当該基板１０に接続される配線に流れる高周波電流により発生する漏洩磁界（以下、基板漏洩磁界とも称する。）を遮蔽する金属板である。基板シールド部材８０は、例えば、銅やアルミ等の導電性の高い金属により形成される。基板シールド部材８０は、例えば、矩形の板状に形成され、基板１０と同等の大きさに形成される。基板シールド部材８０は、基板１０の電力伝送コイル２０とは反対側、つまり、基板１０の裏面１０ｂに設けられる。基板シールド部材８０は、基板１０の裏面１０ｂに当接した状態で組み付けられる。基板シールド部材８０は、例えば、基板１０の裏面１０ｂに重ねられた状態で、各連結部材６４のネジ孔にボルトが締結される。この締結により、基板シールド部材８０及び基板１０は、各連結部材６４の基板１０側の端面とボルトとにより挟持される。この結果、基板シールド部材８０は、基板１０の裏面１０ｂに当接した状態で組み付けられる。この構成により、基板シールド部材８０は、基板シールド部材８０と基板１０とを当接して連結するので、電力伝送ユニット１の軸線方向の長さを相対的に短くすることができ、電力伝送ユニット１の大型化を抑制できる。なお、基板シールド部材８０は、基板１０の裏面１０ｂと離間させた状態、つまり基板１０の裏面１０ｂとの間に空気層を設けた状態で組み付けてもよい。この構成により、基板シールド部材８０は、電力伝送ユニット１の軸線方向の長さが相対的に長くなるが、空気層により渦電流の発生を抑制することができる。   The substrate shield member 80 is a metal plate that shields a leakage magnetic field (hereinafter also referred to as a substrate leakage magnetic field) generated by a high frequency current flowing through the substrate 10 and the wiring connected to the substrate 10. The substrate shield member 80 is formed of, for example, a highly conductive metal such as copper or aluminum. The substrate shield member 80 is formed, for example, in a rectangular plate shape, and is formed in the same size as the substrate 10. The substrate shield member 80 is provided on the opposite side of the substrate 10 to the power transmission coil 20, that is, on the back surface 10 b of the substrate 10. The substrate shield member 80 is assembled in a state of being in contact with the back surface 10 b of the substrate 10. For example, in a state where the substrate shield member 80 is superimposed on the back surface 10 b of the substrate 10, a bolt is fastened to a screw hole of each connection member 64. By this fastening, the substrate shield member 80 and the substrate 10 are held between the end surface of each connecting member 64 on the substrate 10 side and the bolt. As a result, the substrate shield member 80 is assembled in a state of being in contact with the back surface 10 b of the substrate 10. With this configuration, since the substrate shield member 80 abuts and connects the substrate shield member 80 and the substrate 10, the axial length of the power transmission unit 1 can be relatively shortened. Can be suppressed. The substrate shield member 80 may be assembled in a state of being separated from the back surface 10 b of the substrate 10, that is, in a state in which an air layer is provided between the substrate shield member 80 and the back surface 10 b of the substrate 10. By this configuration, although the length of the substrate shield member 80 in the axial direction of the power transmission unit 1 becomes relatively long, generation of eddy current can be suppressed by the air layer.

以上のように、実施形態１に係る電力伝送ユニット１は、電力伝送コイル２０と、基板１０と、基板シールド部材８０とを備える。電力伝送コイル２０は、相手側電力伝送コイル２０Ａと非接触により電力を伝送する。基板１０は、板状に形成され、電力伝送コイル２０に対向して設けられ、電力伝送コイル２０に電気的に接続され、電力伝送コイル２０との間で高周波電流が流れる。基板シールド部材８０は、板状に形成され、基板１０の電力伝送コイル２０とは反対側に設けられ、磁界を遮蔽する。   As described above, the power transfer unit 1 according to the first embodiment includes the power transfer coil 20, the substrate 10, and the substrate shield member 80. The power transfer coil 20 transfers power without contact with the other power transfer coil 20A. The substrate 10 is formed in a plate shape, is provided to face the power transmission coil 20, is electrically connected to the power transmission coil 20, and a high frequency current flows with the power transmission coil 20. The substrate shield member 80 is formed in a plate shape, is provided on the side of the substrate 10 opposite to the power transmission coil 20, and shields the magnetic field.

この構成により、電力伝送ユニット１は、基板シールド部材８０により基板１０や当該基板１０に接続される配線に流れる高周波電流により発生する基板漏洩磁界を遮蔽することができる。この遮蔽により、電力伝送ユニット１は、基板漏洩磁界が当該電力伝送ユニット１のアウターケース７０の外側に漏洩することを抑制できる。この抑制により、電力伝送ユニット１は、基板漏洩磁界が外部の電子機器や金属部品等に与える影響を抑制することができる。例えば、図７は、比較例に係る電力伝送ユニット３の磁界を示す図であり、磁界の分布を図示している。比較例に係る電力伝送ユニット３は、基板シールド部材８０を備えていない以外は、実施形態１に係る電力伝送ユニット１と同等の構成である。比較例に係る電力伝送ユニット３は、図７に示すように、基板漏洩磁界がアウターケース７０の外側に広く分布していることが分かる。これに対して、実施形態１に係る電力伝送ユニット１及び相手側電力伝送ユニット２は、基板シールド部材８０を備えるので、図８に示すように、電力伝送ユニット３と比較して基板漏洩磁界がアウターケース７０の外側に分布することを抑制できることが分かる。   With this configuration, the power transmission unit 1 can shield the substrate leakage magnetic field generated by the high frequency current flowing in the substrate 10 and the wiring connected to the substrate 10 by the substrate shield member 80. By this shielding, the power transmission unit 1 can suppress the leakage of the substrate leakage magnetic field to the outside of the outer case 70 of the power transmission unit 1. By this suppression, the power transmission unit 1 can suppress the influence of the substrate leakage magnetic field on the external electronic devices, metal parts, and the like. For example, FIG. 7 is a figure which shows the magnetic field of the electric power transmission unit 3 which concerns on a comparative example, and has shown the distribution of the magnetic field. The power transmission unit 3 according to the comparative example has the same configuration as the power transmission unit 1 according to the first embodiment except that the substrate shielding member 80 is not provided. In the power transfer unit 3 according to the comparative example, as shown in FIG. 7, it can be seen that the substrate leakage magnetic field is widely distributed outside the outer case 70. On the other hand, since the power transmission unit 1 and the counterpart power transmission unit 2 according to the first embodiment are provided with the substrate shield member 80, as shown in FIG. It can be seen that distribution outside the outer case 70 can be suppressed.

上記電力伝送ユニット１において、基板シールド部材８０は、基板１０と同等の大きさに形成される。この構成により、電力伝送ユニット１は、基板漏洩磁界がアウターケース７０の外側に分布することを効果的に抑制できる。   In the power transmission unit 1, the substrate shield member 80 is formed to have the same size as the substrate 10. With this configuration, power transmission unit 1 can effectively suppress the substrate leakage magnetic field from being distributed to the outside of outer case 70.

上記電力伝送ユニット１において、軸線Ｘ周りに環状に形成され、内側に設けられる電力伝送コイル２０により発生する磁界を遮蔽するシールド壁部４１を有するコイルシールド部材４０を備える。シールド壁部４１は、軸線Ｘに交差する交差方向に対向する壁面４１ａの間隔Ｐが、相手側電力伝送コイル２０Ａに向けて広くなるように形成される。この構成により、コイルシールド部材４０は、電力伝送コイル２０の磁力線とシールド壁部４１の壁面４１ａとが直交することを抑制できる。従って、コイルシールド部材４０は、渦電流が発生することを抑制でき、電力伝送効率の低下を抑制できる。このように、コイルシールド部材４０は、他の部品を追加することなく簡易な構成により電力伝送効率の低下を抑制できる。また、コイルシールド部材４０は、当該コイルシールド部材４０の発熱を抑制できる。   The power transmission unit 1 includes a coil shield member 40 having a shield wall portion 41 formed annularly around the axis X and shielding a magnetic field generated by the power transmission coil 20 provided inside. The shield wall portion 41 is formed such that the distance P between the wall surfaces 41a opposed in the cross direction crossing the axis X becomes wider toward the other power transmission coil 20A. With this configuration, the coil shield member 40 can suppress that the magnetic lines of force of the power transmission coil 20 and the wall surface 41 a of the shield wall 41 are orthogonal to each other. Therefore, the coil shield member 40 can suppress the generation of the eddy current, and can suppress the reduction in the power transmission efficiency. As described above, the coil shield member 40 can suppress a decrease in power transmission efficiency with a simple configuration without adding other components. Further, the coil shield member 40 can suppress the heat generation of the coil shield member 40.

〔実施形態２〕
次に、実施形態２に係る電力伝送ユニット１Ａ及び相手側電力伝送ユニット２Ａについて説明する。なお、電力伝送ユニット１Ａと相手側電力伝送ユニット２Ａとは、同等の構成であるため、相手側電力伝送ユニット２Ａの説明は省略する。また、実施形態２は、実施形態１と同等の構成要素には同じ符号を付し、その詳細な説明を省略する。電力伝送ユニット１Ａは、磁性部材９０を備える点で実施形態１と異なる。電力伝送ユニット１Ａは、図９に示すように、基板シールド部材８０と基板１０との間に磁性部材９０が設けられる。磁性部材９０は、磁性材料を含む部材であり、例えば、酸化鉄と金属との複合酸化物である。磁性部材９０は、例えば、矩形の板状に形成され、基板シールド部材８０と同等の大きさに形成される。磁性部材９０は、軸線方向において基板シールド部材８０と基板１０との間に挟まれる。基板シールド部材８０、磁性部材９０、及び、基板１０は、同じ向きで積層され、積層された状態で矩形の平板形状を成す。基板シールド部材８０、磁性部材９０、及び、基板１０は、軸線方向から視て、それぞれの端部が揃っている。つまり、基板シールド部材８０、磁性部材９０、及び、基板１０は、軸線方向から視て、基板シールド部材８０の交差方向の端部８１と磁性部材９０の交差方向の端部９１と基板１０の交差方向の端部１２とがそれぞれ揃った状態で積層される。 Second Embodiment
Next, the power transmission unit 1A and the counterpart power transmission unit 2A according to the second embodiment will be described. In addition, since the power transmission unit 1A and the other power transmission unit 2A have the same configuration, the description of the other power transmission unit 2A will be omitted. Further, in the second embodiment, the same components as in the first embodiment will be assigned the same reference numerals and detailed explanations thereof will be omitted. The power transmission unit 1A is different from the first embodiment in that a magnetic member 90 is provided. In the power transfer unit 1A, as shown in FIG. 9, the magnetic member 90 is provided between the substrate shield member 80 and the substrate 10. The magnetic member 90 is a member containing a magnetic material, and is, for example, a composite oxide of iron oxide and metal. The magnetic member 90 is formed, for example, in a rectangular plate shape, and is formed in the same size as the substrate shield member 80. The magnetic member 90 is sandwiched between the substrate shield member 80 and the substrate 10 in the axial direction. The substrate shield member 80, the magnetic member 90, and the substrate 10 are stacked in the same direction, and in a stacked state, form a rectangular flat plate shape. The end portions of the substrate shield member 80, the magnetic member 90, and the substrate 10 are aligned when viewed from the axial direction. That is, when viewed from the axial direction, the substrate shield member 80, the magnetic member 90, and the substrate 10 cross the end portion 81 in the cross direction of the substrate shield member 80 and the end portion 91 in the cross direction of the magnetic member 90 The end portions 12 of the direction are stacked in alignment with each other.

磁性部材９０は、例えば、基板シールド部材８０及び基板１０に当接した状態で積層され組み付けられる。磁性部材９０は、例えば、基板シールド部材８０と基板１０とに挟まれた状態で、上述の各連結部材６４のネジ孔にボルトが締結される。この締結により、基板シールド部材８０、磁性部材９０、及び、基板１０は、各連結部材６４の基板１０側の端面とボルトとにより挟持される。この結果、磁性部材９０は、基板シールド部材８０と基板１０との間に挟まれた状態で組み付けられる。   The magnetic members 90 are stacked and assembled in a state of being in contact with the substrate shield member 80 and the substrate 10, for example. For example, in a state where the magnetic member 90 is sandwiched between the substrate shield member 80 and the substrate 10, bolts are fastened to the screw holes of the above-described connection members 64. By this fastening, the substrate shield member 80, the magnetic member 90, and the substrate 10 are held between the end surface of each connecting member 64 on the substrate 10 side and the bolt. As a result, the magnetic member 90 is assembled in a state of being sandwiched between the substrate shield member 80 and the substrate 10.

以上のように、実施形態２に係る電力伝送ユニット１Ａは、板状に形成され、基板シールド部材８０と基板１０との間に設けられ、磁性材料を含んで構成される磁性部材９０を備える。この構成により、電力伝送ユニット１Ａにおいて、磁性部材９０は、基板１０に流れる高周波電流により発生する磁力（磁界）を通過させて当該磁力が基板シールド部材８０に及ぶことを抑制する。この抑制により、電力伝送ユニット１Ａは、図１０に示すように、実施形態１の電力伝送ユニット１（図８）と比較して、基板漏洩磁界がアウターケース７０の外側に分布することをより抑制できることが分かる。また、電力伝送ユニット１Ａは、磁性部材９０により基板シールド部材８０に渦電流が発生することを抑制できる。ここで、実施形態１に係る電力伝送ユニット１は、磁性部材９０を備えていないので、基板漏洩磁界が基板シールド部材８０に分布する傾向にある。実施形態１に係る電力伝送ユニット１は、この基板漏洩磁界の分布により、基板シールド部材８０に渦電流が発生し、図１１に示すように、渦電流による損失（渦電流損）が相対的に大きくなる。これに対して、実施形態２に係る電力伝送ユニット１Ａは、磁性部材９０を備えているので、基板漏洩磁界が基板シールド部材８０に分布することを抑制できる。実施形態２に係る電力伝送ユニット１Ａは、この抑制により基板シールド部材８０に渦電流が発生することを抑制できる。この結果、実施形態２に係る電力伝送ユニット１Ａは、図１２に示すように、渦電流による損失を実施形態１の電力伝送ユニット１よりも小さくすることができ、電力伝送効率を向上できる。ここで、図１３は、実施形態２に係る基板１０と電力伝送コイル２０との間隔の一例を示す図である。図１３において、Ｌは、インダクタンスであり、Ｒは、抵抗値であり、Ｑは、品質係数（Ｑｕａｌｉｔｙ Ｆａｃｔｏｒ）であり、κは、結合係数である。比較例としての実施形態１に係る電力伝送ユニット１は、図１３に示すように、基板１０と電力伝送コイル２０との間隔が１５ｍｍ程度の場合、基板１０と電力伝送コイル２０との間隔が２０ｍｍ程度の場合よりも、品質係数Ｑが低下することが分かる。これは、基板１０と電力伝送コイル２０とが近づくため、基板シールド部材８０に発生する渦電流が増加するためである。実施形態２に係る電力伝送ユニット１Ａは、磁性部材９０により基板シールド部材８０に発生する渦電流を抑制するので、インダクタンスＬを増加することができ抵抗値Ｒを下げることができる。この結果、実施形態２に係る電力伝送ユニット１Ａは、基板１０と電力伝送コイル２０との間隔を１５ｍｍ程度とした場合でも、品質係数Ｑの低下を抑制することができる。この抑制により、実施形態２に係る電力伝送ユニット１Ａは、電力伝送効率の低下を抑制すると共に基板シールド部材８０の渦電流による発熱を抑制した上で、基板１０と電力伝送コイル２０と間隔を狭くすることができるので、ユニットの大型化を抑制することができる。なお、図１３において、基板１０の電子部品１１を接続する線材及び電力伝送コイル２０による損失は、ほとんど変化が見られなかった。   As described above, the power transmission unit 1A according to the second embodiment is formed in a plate shape, is provided between the substrate shield member 80 and the substrate 10, and includes the magnetic member 90 configured to include a magnetic material. With this configuration, in the power transfer unit 1A, the magnetic member 90 allows the magnetic force (magnetic field) generated by the high frequency current flowing through the substrate 10 to pass through, and prevents the magnetic force from reaching the substrate shield member 80. By this suppression, as shown in FIG. 10, the power transmission unit 1A further suppresses the substrate leakage magnetic field from being distributed outside the outer case 70, as compared with the power transmission unit 1 of the first embodiment (FIG. 8). I know what I can do. Further, the power transmission unit 1A can suppress the generation of an eddy current in the substrate shield member 80 by the magnetic member 90. Here, since the power transmission unit 1 according to the first embodiment does not include the magnetic member 90, the substrate leakage magnetic field tends to be distributed to the substrate shield member 80. In the power transmission unit 1 according to the first embodiment, an eddy current is generated in the substrate shield member 80 due to the distribution of the substrate leakage magnetic field, and as shown in FIG. 11, the loss (eddy current loss) due to the eddy current is relatively growing. On the other hand, since the power transmission unit 1A according to the second embodiment includes the magnetic member 90, distribution of the substrate leakage magnetic field to the substrate shield member 80 can be suppressed. The power transmission unit 1A according to the second embodiment can suppress the generation of the eddy current in the substrate shield member 80 by this suppression. As a result, as shown in FIG. 12, the power transfer unit 1A according to the second embodiment can make the loss due to the eddy current smaller than that of the power transfer unit 1 of the first embodiment, and can improve the power transfer efficiency. Here, FIG. 13 is a view showing an example of the distance between the substrate 10 and the power transfer coil 20 according to the second embodiment. In FIG. 13, L is an inductance, R is a resistance value, Q is a quality factor, and κ is a coupling factor. In the power transfer unit 1 according to the first embodiment as a comparative example, as shown in FIG. 13, when the distance between the substrate 10 and the power transfer coil 20 is about 15 mm, the distance between the substrate 10 and the power transfer coil 20 is 20 mm It can be seen that the quality factor Q is lower than in the case of the degree. This is because the eddy current generated in the substrate shield member 80 increases because the substrate 10 and the power transmission coil 20 approach each other. In the power transmission unit 1A according to the second embodiment, since the eddy current generated in the substrate shield member 80 is suppressed by the magnetic member 90, the inductance L can be increased and the resistance value R can be reduced. As a result, the power transmission unit 1A according to the second embodiment can suppress the decrease in the quality factor Q even when the distance between the substrate 10 and the power transmission coil 20 is approximately 15 mm. By this suppression, the power transmission unit 1A according to the second embodiment suppresses the decrease of the power transmission efficiency and suppresses the heat generation due to the eddy current of the substrate shield member 80, and narrows the distance between the substrate 10 and the power transmission coil 20. As a result, the enlargement of the unit can be suppressed. In addition, in FIG. 13, the loss by the wire which connects the electronic component 11 of the board | substrate 10, and the power transmission coil 20 hardly changed.

〔実施形態３〕
次に、実施形態３に係る電力伝送ユニット１Ｂ及び相手側電力伝送ユニット２Ｂについて説明する。なお、電力伝送ユニット１Ｂと相手側電力伝送ユニット２Ｂとは、同等の構成であるため、相手側電力伝送ユニット２Ｂの説明は省略する。また、実施形態３は、実施形態１、２と同等の構成要素には同じ符号を付し、その詳細な説明を省略する。電力伝送ユニット１Ｂは、基板シールド部材８０に対する磁性部材９０Ａのサイズが小さい点で実施形態２と異なる。電力伝送ユニット１Ｂは、図１４に示すように、磁性部材９０Ａの交差方向に沿って延在する側の端部９１が、基板シールド部材８０の交差方向に沿って延在する側の端部８１よりも内側に位置する。つまり、磁性部材９０Ａは、当該磁性部材９０Ａの端部９１が、基板シールド部材８０の端部８１よりも基板シールド部材８０の中央側、つまり軸線Ｘ側に位置する。言い換えると、基板シールド部材８０は、当該基板シールド部材８０の端部８１が、磁性部材９０Ａの端部９１よりも外側に突出している。また、電力伝送ユニット１Ｂは、磁性部材９０Ａが基板シールド部材８０よりも軸線Ｘ周りの外形が小さく形成され、軸線方向から視た場合、磁性部材９０Ａが基板シールド部材８０の内側に位置するともいえる。この構成により、電力伝送ユニット１Ｂは、基板１０と基板シールド部材８０との間に設けられた空気層であるギャップＧが形成される。 Third Embodiment
Next, the power transmission unit 1B and the counterpart power transmission unit 2B according to the third embodiment will be described. In addition, since the power transmission unit 1B and the other power transmission unit 2B have the same configuration, the description of the other power transmission unit 2B will be omitted. Further, in the third embodiment, the same components as those in the first and second embodiments are given the same reference numerals, and the detailed description thereof will be omitted. The power transmission unit 1B is different from the second embodiment in that the size of the magnetic member 90A with respect to the substrate shield member 80 is small. In the power transmission unit 1B, as shown in FIG. 14, the end 91 on the side extending along the cross direction of the magnetic members 90A is the end 81 on the side extending along the cross direction of the substrate shield member 80. Located more inside than. That is, in the magnetic member 90A, the end 91 of the magnetic member 90A is positioned closer to the center of the substrate shield member 80 than the end 81 of the substrate shield member 80, that is, the axis X side. In other words, in the substrate shielding member 80, the end 81 of the substrate shielding member 80 protrudes outside the end 91 of the magnetic member 90A. In the power transmission unit 1B, the magnetic member 90A is smaller than the substrate shield member 80 in the outer shape around the axis X, and it can be said that the magnetic member 90A is located inside the substrate shield member 80 when viewed from the axial direction. . With this configuration, in the power transfer unit 1B, a gap G, which is an air layer provided between the substrate 10 and the substrate shield member 80, is formed.

以上のように、実施形態３に係る電力伝送ユニット１Ｂにおいて、磁性部材９０Ａは、電力伝送コイル２０と基板１０とが対向する対向方向（軸線方向）に交差する交差方向において、当該磁性部材９０Ａの交差方向に沿って延在する側の端部９１が、基板シールド部材８０の交差方向に沿って延在する側の端部８１よりも基板シールド部材８０の中央側に位置する。この構成により、電力伝送ユニット１Ｂは、基板１０と基板シールド部材８０との間にギャップＧを形成することができる。この構成により、電力伝送ユニット１Ｂは、基板１０の端部１２において、基板漏洩磁界がギャップＧよりも磁性部材９０Ａを優先して通過する。つまり、電力伝送ユニット１Ｂは、基板１０の端部１２において、基板漏洩磁界が基板１０の端部１２よりも内側に分布しやすくなる。ここで、実施形態２に係る電力伝送ユニット１Ａは、ギャップＧが設けられていないので、図１５に示すように、基板漏洩磁界が基板１０の端部１２から外側に相対的に広く分布する。これに対して、実施形態３に係る電力伝送ユニット１Ｂは、ギャップＧが設けられているので、図１６に示すように、実施形態２に係る電力伝送ユニット１Ａよりも、基板漏洩磁界が基板１０の端部１２から外側に分布することを抑制することができる。   As described above, in the power transfer unit 1B according to the third embodiment, the magnetic member 90A is the same as the magnetic member 90A in the cross direction in which the power transfer coil 20 and the substrate 10 cross in the opposing direction (axial direction). The end 91 extending along the cross direction is located closer to the center of the substrate shield member 80 than the end 81 extending along the cross direction of the substrate shield member 80. With this configuration, the power transmission unit 1B can form the gap G between the substrate 10 and the substrate shield member 80. With this configuration, in the power transmission unit 1B, the substrate leakage magnetic field passes through the magnetic member 90A prior to the gap G at the end 12 of the substrate 10. That is, in the power transmission unit 1 </ b> B, the substrate leakage magnetic field is more likely to be distributed inside the end 12 of the substrate 10 at the end 12 of the substrate 10. Here, in the power transfer unit 1A according to the second embodiment, since the gap G is not provided, the substrate leakage magnetic field is relatively widely distributed outward from the end 12 of the substrate 10 as shown in FIG. On the other hand, in the power transmission unit 1B according to the third embodiment, since the gap G is provided, the substrate leakage magnetic field is higher than that of the power transmission unit 1A according to the second embodiment as shown in FIG. It is possible to suppress the distribution from the end 12 of the

次に、図１７を参照して、上記実施形態１〜３に係る電力伝送ユニット１、１Ａ、１Ｂの電力伝送効率のシミュレーション結果について説明する。ここで、図１７及び以下の式（１）〜（３）において、Ｌは、インダクタンスであり、Ｒは、抵抗値であり、Ｑは、品質係数であり、κは、結合係数であり、ｆは、非接触給電における電力の周波数であり、ηは、電力伝送効率であり、ηmaxSSは、最大の電力伝送効率を示す。品質係数Ｑは、以下の式（１）により求められる。電力伝送効率ηは、以下の式（２）に示すように、結合係数κと品質係数Ｑとの積に比例する。最大の電力伝送効率ηmaxSSは、以下の式（３）により求められる。 Next, simulation results of the power transfer efficiency of the power transfer units 1, 1A, and 1B according to the first to third embodiments will be described with reference to FIG. Here, in FIG. 17 and the following equations (1) to (3), L is an inductance, R is a resistance value, Q is a quality factor, κ is a coupling factor, and f is Is the frequency of the power in contactless power feeding, η is the power transfer efficiency, and η max SS indicates the maximum power transfer efficiency. The quality factor Q is obtained by the following equation (1). The power transfer efficiency η is proportional to the product of the coupling coefficient と and the quality factor Q, as shown in the following equation (2). The maximum power transfer efficiency η maxSS is obtained by the following equation (3).

Figure 2019071748
Figure 2019071748

Figure 2019071748
Figure 2019071748

Figure 2019071748
Figure 2019071748

図１７に示すように、品質係数Ｑは、実施形態３に係る電力伝送ユニット１Ｂが最も良好であり、次に、実施形態２に係る電力伝送ユニット１Ａが良好であり、その次に、比較例に係る電力伝送ユニット３が良好であることが分かる。実施形態１に係る電力伝送ユニット１は、上述のように基板シールド部材８０によって比較例に係る電力伝送ユニット３よりも基板漏洩磁界を抑制することができる。しかしながら、実施形態１に係る電力伝送ユニット１は、基板シールド部材８０に渦電流が発生するために、品質係数Ｑが比較例に係る電力伝送ユニット３よりも悪化している。結合係数κは、実施形態１〜３及び比較例において多少差が見られるものの略同じ値である。実施形態２に係る電力伝送ユニット１Ａは、磁性部材９０により、実施形態１に係る電力伝送ユニット１と比較して、基板シールド部材８０の渦電流の損失を大きく抑制できることが分かる。実施形態３に係る電力伝送ユニット１Ｂも、磁性部材９０Ａにより、実施形態１に係る電力伝送ユニット１と比較して、基板シールド部材８０の渦電流の損失を大きく抑制できることが分かる。また、アウターケース７０から軸線方向において２５ｍｍ程度離れた箇所の基板漏洩磁界は、実施形態３に係る電力伝送ユニット１Ｂが最も少なく、次に、実施形態２に係る電力伝送ユニット１Ａが少なく、その次に、実施形態１に係る電力伝送ユニット１が少なく、比較例に係る電力伝送ユニット３が最も多いことが分かる。以上のように、実施形態１〜３に係る電力伝送ユニット１、１Ａ、１Ｂは、比較例に係る電力伝送ユニット３よりも基板漏洩磁界を抑制することができることが分かる。また、実施形態２、３に係る電力伝送ユニット１Ａ、１Ｂは、比較例に係る電力伝送ユニット３よりも品質係数Ｑを向上させることができるので、電力伝送効率がよいことが分かる。また、実施形態２、３に係る電力伝送ユニット１Ａ、１Ｂは、比較例に係る電力伝送ユニット３よりも品質係数Ｑを向上させることができるので、電力伝送コイル２０の巻き数を減らすことができ、小型化することができる。   As shown in FIG. 17, the quality factor Q is the best for the power transfer unit 1B according to the third embodiment, next is the power transfer unit 1A for the second embodiment, and then the comparative example. It can be seen that the power transfer unit 3 according to is good. The power transmission unit 1 according to the first embodiment can suppress the substrate leakage magnetic field more than the power transmission unit 3 according to the comparative example by the substrate shield member 80 as described above. However, in the power transmission unit 1 according to the first embodiment, the quality factor Q is worse than that of the power transmission unit 3 according to the comparative example because an eddy current is generated in the substrate shield member 80. The coupling coefficient κ is substantially the same value although there is a slight difference in the first to third embodiments and the comparative example. It is understood that the power transmission unit 1A according to the second embodiment can largely suppress the loss of the eddy current of the substrate shield member 80 by the magnetic member 90 as compared to the power transmission unit 1 according to the first embodiment. Also in the power transfer unit 1B according to the third embodiment, it is understood that the eddy current loss of the substrate shield member 80 can be largely suppressed by the magnetic member 90A as compared with the power transfer unit 1 according to the first embodiment. In addition, the substrate leakage magnetic field at a location about 25 mm away from the outer case 70 in the axial direction is the smallest in the power transfer unit 1B according to the third embodiment, and next is the smallest in the power transfer unit 1A according to the second embodiment. In addition, it is understood that the number of the power transmission units 1 according to the first embodiment is small, and the number of the power transmission units 3 according to the comparative example is the largest. As described above, it can be seen that the power transmission units 1, 1A, and 1B according to the first to third embodiments can suppress the substrate leakage magnetic field more than the power transmission unit 3 according to the comparative example. Further, since the power transmission units 1A and 1B according to the second and third embodiments can improve the quality factor Q more than the power transmission unit 3 according to the comparative example, it is understood that the power transmission efficiency is high. In addition, since the power transmission units 1A and 1B according to the second and third embodiments can improve the quality factor Q more than the power transmission unit 3 according to the comparative example, the number of turns of the power transmission coil 20 can be reduced. , Can be miniaturized.

〔変形例〕
次に、実施形態１〜３の変形例について説明する。電力伝送ユニット１、１Ａ、１Ｂは、基板１０に高周波電流が流れる例について説明したが、これに限定されず、低周波電流が流れる場合に適用してもよい。 [Modification]
Next, modifications of the first to third embodiments will be described. The power transmission units 1, 1A and 1B have been described as to the case where the high frequency current flows in the substrate 10. However, the present invention is not limited to this, and may be applied to the case where the low frequency current flows.

また、基板シールド部材８０は、板状の金属板である例について説明したが、これに限定されず、例えば、膜状の金属層であってもよい。この場合、基板シールド部材８０は、例えば、金属の蒸着により基板１０の裏面１０ｂや磁性部材９０に膜状に形成される。   Moreover, although the board | substrate shield member 80 demonstrated the example which is a plate-shaped metal plate, it is not limited to this, For example, a film-form metal layer may be sufficient. In this case, the substrate shield member 80 is formed in a film shape on the back surface 10 b of the substrate 10 or the magnetic member 90 by, for example, vapor deposition of metal.

また、基板シールド部材８０は、基板１０と同等の大きさに形成される例について説明したが、これに限定されず、基板１０よりも大きくても小さくてもよい。基板シールド部材８０は、基板１０よりも小さい場合、基板１０の高周波電流が流れる部分を覆っていることが好ましい。   In addition, although the example in which the substrate shield member 80 is formed to have the same size as the substrate 10 has been described, the present invention is not limited thereto, and may be larger or smaller than the substrate 10. When the substrate shield member 80 is smaller than the substrate 10, the substrate shield member 80 preferably covers the portion of the substrate 10 through which the high frequency current flows.

また、インナーケース６０は、各連結部材６４をスペーサとして機能させてもよい。スペーサは、インナーケース６０に設けられる電力伝送コイル２０及び通信カプラ５０と基板１０との間隔を調整することで、電力伝送コイル２０及び通信カプラ５０と基板１０との干渉を防止する。   In addition, the inner case 60 may cause each connecting member 64 to function as a spacer. The spacer adjusts the distance between the power transmission coil 20 and the communication coupler 50 provided on the inner case 60 and the substrate 10 to prevent interference between the power transmission coil 20 and the communication coupler 50 and the substrate 10.

１、１Ａ、１Ｂ 電力伝送ユニット
２０Ａ 相手側電力伝送コイル
１０ 基板
２０ 電力伝送コイル
４０ コイルシールド部材（第２シールド部材）
４１ シールド壁部
４１ａ 壁面
８０ 基板シールド部材（第１シールド部材）
８１、９１ 端部
９０、９０Ａ 磁性部材
Ｐ 間隔
Ｘ 軸線 1, 1A, 1B power transmission unit 20A other side power transmission coil 10 substrate 20 power transmission coil 40 coil shield member (second shield member)
41 Shield wall 41a Wall 80 Substrate shield member (first shield member)
81, 91 end 90, 90A magnetic member P distance X axis

Claims (5)

相手側電力伝送コイルと非接触により電力を伝送する電力伝送コイルと、
板状に形成され、前記電力伝送コイルに対向して設けられ、前記電力伝送コイルに電気的に接続され、前記電力伝送コイルとの間で電流が流れる基板と、
板状又は膜状に形成され、前記基板の前記電力伝送コイルとは反対側に設けられ、磁界を遮蔽する第１シールド部材と、
を備えることを特徴とする電力伝送ユニット。 A power transmission coil for transmitting power without contact with the other power transmission coil;
A substrate formed in a plate shape, disposed opposite to the power transfer coil, electrically connected to the power transfer coil, and having a current flowing with the power transfer coil;
A first shield member formed in a plate shape or a film shape, provided on the opposite side of the power transmission coil of the substrate, and shielding a magnetic field;
A power transfer unit comprising: 板状に形成され、前記第１シールド部材と前記基板との間に設けられ、磁性材料を含んで構成される磁性部材を備える請求項１に記載の電力伝送ユニット。   The power transmission unit according to claim 1, further comprising a magnetic member formed in a plate shape, provided between the first shield member and the substrate, and configured to include a magnetic material. 前記磁性部材は、前記電力伝送コイルと前記基板とが対向する対向方向に交差する交差方向において、当該磁性部材の前記交差方向に沿って延在する側の端部が、前記第１シールド部材の前記交差方向に沿って延在する側の端部よりも前記第１シールド部材の中央側に位置する請求項２に記載の電力伝送ユニット。   The magnetic member has an end on the side extending along the crossing direction of the magnetic member in a cross direction crossing the opposite direction in which the power transmission coil and the substrate face each other is the one of the first shield member. The power transfer unit according to claim 2, wherein the power transfer unit is located on the center side of the first shield member than an end of the side extending along the cross direction. 前記第１シールド部材は、前記基板と同等の大きさに形成される請求項１〜３のいずれか１項に記載の電力伝送ユニット。   The power transmission unit according to any one of claims 1 to 3, wherein the first shield member is formed to have a size equal to that of the substrate. 軸線周りに環状に形成され、内側に設けられる前記電力伝送コイルにより発生する磁界を遮蔽するシールド壁部を有する第２シールド部材を備え、
前記シールド壁部は、前記軸線に交差する交差方向に対向する壁面の間隔が、前記相手側電力伝送コイルに向けて広くなるように形成されている請求項１〜４のいずれか１項に記載の電力伝送ユニット。 A second shield member formed in an annular shape around an axis and having a shield wall that shields a magnetic field generated by the power transmission coil provided inside;
The said shield wall part is formed so that the space | interval of the wall surface which opposes the cross direction which intersects the said axis line may become wide toward the said other party power transmission coil. Power transmission unit.
JP2017197659A 2017-10-11 2017-10-11 Power transmission unit Active JP6649925B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017197659A JP6649925B2 (en) 2017-10-11 2017-10-11 Power transmission unit
US16/151,869 US10825606B2 (en) 2017-10-11 2018-10-04 Power transmission unit
DE102018217314.1A DE102018217314A1 (en) 2017-10-11 2018-10-10 The power transmission unit
CN201811178555.XA CN109660033B (en) 2017-10-11 2018-10-10 power transfer unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017197659A JP6649925B2 (en) 2017-10-11 2017-10-11 Power transmission unit

Publications (2)

Publication Number Publication Date
JP2019071748A true JP2019071748A (en) 2019-05-09
JP6649925B2 JP6649925B2 (en) 2020-02-19

Family

ID=65816762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017197659A Active JP6649925B2 (en) 2017-10-11 2017-10-11 Power transmission unit

Country Status (4)

Country Link
US (1) US10825606B2 (en)
JP (1) JP6649925B2 (en)
CN (1) CN109660033B (en)
DE (1) DE102018217314A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024511633A (en) * 2021-03-30 2024-03-14 アップル インコーポレイテッド Magnetic configurations for wireless power transfer and communication in electronic devices

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109792161B (en) * 2016-10-13 2022-06-10 三菱电机株式会社 Non-contact power transmission device and non-contact power transmission system
US12249839B2 (en) 2022-08-09 2025-03-11 Apple Inc. Wireless power transfer structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006180695A (en) * 2004-12-23 2006-07-06 Samsung Electronics Co Ltd Power generation apparatus and power generation method
JP2012161110A (en) * 2011-01-28 2012-08-23 Panasonic Corp Power supply module of non-contact power supply device, usage method of power supply module of non-contact power supply device, and manufacturing method of power supply module of non-contact power supply device
JP2012186472A (en) * 2011-02-19 2012-09-27 Lequio Power Technology Corp Power supply device and power reception/supply device
WO2013118745A1 (en) * 2012-02-06 2013-08-15 株式会社Ihi Non-contact power supply system
JP2014220953A (en) * 2013-05-10 2014-11-20 株式会社東海理化電機製作所 Coil device and non-contact charger
US20150077052A1 (en) * 2002-06-10 2015-03-19 City University Of Hong Kong Battery Charging System

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5690642B2 (en) * 2011-04-22 2015-03-25 矢崎総業株式会社 Resonance type non-contact power feeding system, power transmission side device of resonance type non-contact power feeding system, and in-vehicle charging device
JP6091262B2 (en) 2012-11-01 2017-03-08 矢崎総業株式会社 Power feeding unit, power receiving unit, and power feeding system
JP6007410B2 (en) * 2012-12-26 2016-10-12 パナソニックＩｐマネジメント株式会社 Induction heating cooker
DE102013101150A1 (en) * 2013-02-05 2014-08-21 Conductix-Wampfler Gmbh Coil unit and device for inductive transmission of electrical energy

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150077052A1 (en) * 2002-06-10 2015-03-19 City University Of Hong Kong Battery Charging System
JP2006180695A (en) * 2004-12-23 2006-07-06 Samsung Electronics Co Ltd Power generation apparatus and power generation method
JP2012161110A (en) * 2011-01-28 2012-08-23 Panasonic Corp Power supply module of non-contact power supply device, usage method of power supply module of non-contact power supply device, and manufacturing method of power supply module of non-contact power supply device
JP2012186472A (en) * 2011-02-19 2012-09-27 Lequio Power Technology Corp Power supply device and power reception/supply device
WO2013118745A1 (en) * 2012-02-06 2013-08-15 株式会社Ihi Non-contact power supply system
JP2014220953A (en) * 2013-05-10 2014-11-20 株式会社東海理化電機製作所 Coil device and non-contact charger

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024511633A (en) * 2021-03-30 2024-03-14 アップル インコーポレイテッド Magnetic configurations for wireless power transfer and communication in electronic devices
JP7654823B2 (en) 2021-03-30 2025-04-01 アップル インコーポレイテッド Magnetic configurations for wireless power transfer and communication in electronic devices
US12463464B2 (en) 2021-03-30 2025-11-04 Apple Inc. Magnetics configurations for wireless power transfer and communications in electronic device

Also Published As

Publication number Publication date
CN109660033B (en) 2022-04-29
US20190108940A1 (en) 2019-04-11
CN109660033A (en) 2019-04-19
DE102018217314A1 (en) 2019-04-11
JP6649925B2 (en) 2020-02-19
US10825606B2 (en) 2020-11-03

Similar Documents

Publication Publication Date Title
US10777892B2 (en) Antenna
US9953762B2 (en) Contactless connector, contactless connector system, and a manufacturing method for the contactless connector
CN101047058B (en) coil parts
JP5880797B2 (en) Camera module and electronic equipment
US11515084B2 (en) Magnetic component and wireless power-transferring device including the same
KR101153580B1 (en) Line filter and flat panel display device using thLine filter and flat panel display device using the same e same
JP6571292B2 (en) Antenna device for HF and LF operation
JPWO2014119194A1 (en) Wireless power transmission system
CN117223191A (en) Charging coil for hearing aid charger
JP6649925B2 (en) Power transmission unit
US11876305B2 (en) Electronic apparatus
US10872722B2 (en) Shield member and power transmission unit
JP2016506618A (en) Non-contact connector
WO2022007706A1 (en) Winding assembly, on-board charger, and vehicle
US11309125B2 (en) Power transmission unit and power transmission coil
CN105493344A (en) Device and method for combined signal transmission or for combined signal and energy transmission
JP6968583B2 (en) Power transmission unit
JP6687182B1 (en) Antenna device and electronic device
JP6968584B2 (en) Power transmission unit
JP6597431B2 (en) Antenna device and communication device
US10141772B2 (en) Communication device
US20250023392A1 (en) Wireless power receiver device
JP4021746B2 (en) Circuit board mounting structure for power supply coil components
JP2019004020A (en) Power transmission coil and manufacturing method thereof
JP6239176B1 (en) Antenna module

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190117

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191028

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191105

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191220

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200114

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200117

R150 Certificate of patent or registration of utility model

Ref document number: 6649925

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250