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JP2019067891A - Board mounting structure - Google Patents

Board mounting structure Download PDF

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Publication number
JP2019067891A
JP2019067891A JP2017191065A JP2017191065A JP2019067891A JP 2019067891 A JP2019067891 A JP 2019067891A JP 2017191065 A JP2017191065 A JP 2017191065A JP 2017191065 A JP2017191065 A JP 2017191065A JP 2019067891 A JP2019067891 A JP 2019067891A
Authority
JP
Japan
Prior art keywords
substrate
waterproof
lower case
electronic device
rib
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017191065A
Other languages
Japanese (ja)
Inventor
史智 三舩
Fumitomo Mifune
史智 三舩
雅大 田牧
Masahiro Tamaki
雅大 田牧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saxa Inc
Original Assignee
Saxa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saxa Inc filed Critical Saxa Inc
Priority to JP2017191065A priority Critical patent/JP2019067891A/en
Publication of JP2019067891A publication Critical patent/JP2019067891A/en
Pending legal-status Critical Current

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  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

To provide a board mounting structure allows a board to be easily attached to a housing of an electronic device without by a waterproof function being impaired pressing of a waterproof member by equal pressing force even when there are individual differences in the dimensions of the waterproof components.SOLUTION: A board mounting structure 1 to an electronic device 10 includes a lower case 5 of the electronic device, a first substrate 4 attached to the lower case, and a waterproof component 6 having a waterproof member 6a mounted on a first substrate and inserted into a through hole 5a of the lower case. The lower case includes a locking wall 5b for receiving repulsive force of the waterproof member via the first substrate and a rib 5c engaged with the first substrate, and the first substrate includes a pressing end face 4a for pressing the locking wall in a one-side area 41 of the peripheral side opposite to the through hole of the lower case and a notch 4b having a width larger than the diameter of the rib and engaged with the rib in an other-side area 42 of the peripheral edge for positioning.SELECTED DRAWING: Figure 1

Description

本発明は、電子機器への基板の取付構造、特に、防水を必要とする電子部品が搭載され
た基板を電子機器に取り付ける取付構造に関する。
The present invention relates to a mounting structure of a substrate to an electronic device, and more particularly to a mounting structure for mounting a substrate on which an electronic component requiring waterproofing is mounted to the electronic device.

従来より、防水構造を有する電子部品が搭載された基板を電子機器の筐体へ取り付ける
取付構造が知られている(例えば、特許文献1参照)。特許文献1は、ホルダーを用いる
ことなくコネクタを仮止めすることのできる防水コネクタ構造として、フレキシブル基板
に防水コネクタを搭載し、このフレキシブル基板を電子機器の筐体に取り付ける際に防水
コネクタを筐体の取付孔に挿入して、フレキシブル基板の両側部にある規制部を筐体の開
口部側に押し付けて取り付けることにより、防水機能を損なうことなくかつ容易に取り付
ける発明を開示している。
DESCRIPTION OF RELATED ART Conventionally, the attachment structure which attaches the board | substrate with which the electronic component which has a waterproof structure was mounted to the housing | casing of an electronic device is known (for example, refer patent document 1). Patent document 1 mounts a waterproof connector on a flexible substrate as a waterproof connector structure which can temporarily fix a connector without using a holder, and when the flexible substrate is attached to a housing of an electronic device, the housing is a waterproof connector This invention discloses an invention which is easily attached without impairing the waterproof function by inserting into the mounting hole of the above and pressing the regulation parts on both sides of the flexible substrate against the opening side of the casing.

しかしながら、防水コネクタに設けられた防水部材やフレキシブル基板は、通常、製造
過程に生じる個体差があるものであり、僅かながら寸法が異なるのが一般的である。その
ため、規制部によって完全に押し付けられると、個体によっては、必ずしも均等な押圧力
で防水部材が押圧されず防水機能が十分になされない場合があるという問題があった。
However, the waterproof members and flexible substrates provided in the waterproof connector usually have individual differences that occur in the manufacturing process, and generally have slightly different dimensions. Therefore, there is a problem that the waterproof member may not be pressed by an even pressing force depending on the individual and the waterproof function may not be sufficiently performed if completely pressed by the restricting portion.

特許第6088958号公報Patent No. 6088958

本発明は、かかる課題に鑑みなされたものであり、防水部材を有する防水部品に寸法上
の個体差があっても、均等な押圧力で防水部材が押圧されて防水機能を損なうことなく、
かつ、容易に電子機器の筐体に基板を取り付けられる基板の取付構造を提供することを目
的とする。
The present invention has been made in view of the above problems, and even if there are individual differences in the dimensions of the waterproof part having the waterproof member, the waterproof member is pressed with an equal pressing force and the waterproof function is not impaired.
In addition, it is an object of the present invention to provide a mounting structure of a substrate in which the substrate can be easily attached to the housing of the electronic device.

上記した課題を解決するために、本発明は、以下の態様によって把握される。
(1)本発明に係る態様は、電子機器への基板の取付構造であって、前記電子機器のロア
ケースと、前記ロアケースに取り付けられる第1基板と、前記第1基板に搭載され、前記
ロアケースの貫通孔に嵌入される防水部材を有する防水部品と、を備え、前記ロアケース
が、前記第1基板を介して前記防水部材の反発力を受け止める係止壁と、前記第1基板に
係合するリブとを有し、前記第1基板が、前記ロアケースの前記貫通孔からみて反対側の
周縁の一方側領域において前記係止壁を押圧する押圧端面と、前記リブの径よりも大きな
幅を有し、前記周縁の他方側領域において前記リブに係合して位置決めをする切欠きとを
有する、ことを特徴とする。
In order to solve the above-mentioned subject, the present invention is grasped by the following modes.
(1) An aspect according to the present invention is an attachment structure of a substrate to an electronic device, which is a lower case of the electronic device, a first substrate attached to the lower case, and the first substrate mounted on the first substrate A waterproof component having a waterproof member fitted into the through hole, and a locking wall for receiving the repulsive force of the waterproof member via the first substrate, and a rib engaged with the first substrate , And the first substrate has a pressing end face for pressing the locking wall in one region of the peripheral side opposite to the through hole of the lower case, and a width larger than the diameter of the rib. And a notch engaging with and positioning the rib in the other side region of the peripheral edge.

(2)上記(1)に記載の構成において、前記防水部材が前記貫通孔に挿入されて前記第
1基板が前記ロアケースに仮止めされた状態で、前記防水部品が上方から第2基板によっ
て押圧される。
(2) In the configuration described in (1), the waterproof component is pressed from above by the second substrate in a state where the waterproof member is inserted into the through hole and the first substrate is temporarily fixed to the lower case. Be done.

(3)上記(1)又は(2)に記載の構成において、前記防水部品がイヤホンジャックで
あり、前記第1基板がイヤホンジャック基板である。
(3) In the configuration described in (1) or (2), the waterproof component is an earphone jack, and the first substrate is an earphone jack substrate.

本発明によれば、防水部材を有する防水部品に寸法上の個体差があっても、均等な押圧
力で防水部材が押圧されて防水機能を損なうことなく、かつ、容易に電子機器の筐体に基
板を取り付けられる基板の取付構造を提供することができる。
According to the present invention, even if the waterproof parts having the waterproof members have individual differences in dimensions, the housing of the electronic device can be easily without the waterproof members being pressed by the equal pressing force and the waterproof function being impaired. Can provide a mounting structure of the substrate on which the substrate can be mounted.

本発明の実施形態に係る基板の取付構造を適用した電子機器の一例を分解して示す斜視図である。It is a perspective view which disassembles and shows an example of the electronic device which applied the attachment structure of the substrate concerning an embodiment of the present invention. 図1の基板の取付構造を拡大して示す平面図であって、(a)は取付構造の全体を拡大して、(b)は(a)の範囲Bをさらに拡大して、それぞれ示す。It is a top view which expands and shows the attachment structure of the board | substrate of FIG. 1, Comprising: (a) expands the whole attachment structure, (b) expands further the range B of (a), and shows it, respectively. 図2(a)のA−A線断面を拡大して示す断面図である。It is sectional drawing which expands and shows the AA line cross section of Fig.2 (a). 図2(a)の基板の取付構造を拡大して示す斜視図である。It is a perspective view which expands and shows the attachment structure of the board | substrate of FIG. 2 (a).

以下、添付図面を参照して、本発明の実施形態について詳細に説明するが、各図におい
て、同一符号は同一又は対応する部分を示す。また、本発明は、以下の説明からも明らか
なようにこれらの実施形態に限定されるものではなく、発明の要旨の範囲内において当業
者であれば種々の変形が可能である。
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the respective drawings, the same reference numerals denote the same or corresponding parts. Further, the present invention is not limited to these embodiments as is apparent from the following description, and various modifications can be made by those skilled in the art within the scope of the invention.

(電子機器の全体構成)
まず、本実施形態に係る基板の取付構造1を備える電子機器について、説明する。以下
では、電子機器10がコードレス電話子機である場合について説明するが、これに限られ
るものではない。電子機器10は、例えば、スマートフォン、携帯電話機、タブレット型
端末、音楽プレーヤ、ゲーム機などであってもよい。
(Whole structure of electronic equipment)
First, an electronic device provided with the substrate attachment structure 1 according to the present embodiment will be described. Although the case where the electronic device 10 is a cordless handset is described below, the present invention is not limited to this. The electronic device 10 may be, for example, a smartphone, a mobile phone, a tablet terminal, a music player, a game machine, or the like.

電子機器10は、アッパケース2と、第2基板3と、第1基板4と、ロアケース5を備
えている。アッパケース2には、操作に必要な各種ボタン2aや液晶画面2bなどが設け
られている。第2基板3には、送受信に必要な回路(不図示)が設けられている。第1基
板4には、防水部品6及び基板間コネクタ7が搭載されている。ロアケース5には、第1
基板4及び第2基板3のほかにもバッテリや各種電子部品等を収容する構造が施されてい
る。なお、第1基板4は、本実施形態に係る基板の取付構造1において防水構造が付与さ
れる基板を、第2基板3は、電子機器10の機能を発揮する回路を有する主基板である。
The electronic device 10 includes an upper case 2, a second substrate 3, a first substrate 4, and a lower case 5. The upper case 2 is provided with various buttons 2a necessary for operation, a liquid crystal screen 2b, and the like. The second substrate 3 is provided with a circuit (not shown) necessary for transmission and reception. The waterproof component 6 and the inter-substrate connector 7 are mounted on the first substrate 4. In the lower case 5, the first
In addition to the substrate 4 and the second substrate 3, a structure for housing a battery, various electronic components, and the like is provided. The first substrate 4 is a substrate on which the waterproof structure is provided in the mounting structure 1 of the substrate according to the present embodiment, and the second substrate 3 is a main substrate having a circuit that exhibits the function of the electronic device 10.

(基板の取付構造)
基板の取付構造1は、上記の要素のうち、ロアケース5と、ロアケース5に取り付けら
れる第1基板4と、第1基板4に搭載された防水部品6とから構成される。
(Mounting structure of board)
The mounting structure 1 of the substrate is composed of the lower case 5, the first substrate 4 attached to the lower case 5, and the waterproof component 6 mounted on the first substrate 4 among the above elements.

ロアケース5には、その壁面51に、防水部品6を嵌入するための貫通孔5aが設けら
れている。貫通孔5aは、詳しくは後述するように、断面視において、ロアケース5の外
側から内側に向かって階段状に拡径している。ロアケース5の貫通孔5aの内側には、後
述するように、第1基板4を介して防水部品6の防水部材6aの反発力を受け止める係止
壁5bと、第1基板4に係合するリブ5cが設けられている。
In the lower case 5, a through hole 5 a for inserting the waterproof component 6 is provided on the wall surface 51 thereof. The through hole 5a has a diameter increasing in a stepwise manner from the outer side to the inner side of the lower case 5 in a sectional view as described later in detail. Inside the through hole 5a of the lower case 5, as will be described later, a locking wall 5b for receiving the repulsive force of the waterproof member 6a of the waterproof component 6 through the first substrate 4 and a rib engaged with the first substrate 4 5c is provided.

第1基板4には、防水部品6、基板間コネクタ7及び当該基板に関する回路(不図示)
が搭載されている。図1では、防水部品6がイヤホンジャックである場合を示しており、
その場合、図示しない回路はイヤホンジャック回路となる。なお、防水部品6としては、
イヤホンジャックに限られるものではなく、それ以外にも、例えば、ミニUSB端子、U
SB端子などの種々のコネクタ類を採用することができる。
The first substrate 4 includes a waterproof part 6, an inter-board connector 7 and a circuit (not shown) related to the board
Is mounted. FIG. 1 shows the case where the waterproof part 6 is an earphone jack,
In that case, the circuit not shown becomes an earphone jack circuit. As waterproof part 6,
Not limited to the earphone jack, other than that, for example, mini USB terminal, U
Various connectors such as SB terminals can be employed.

第1基板4は、ロアケース5の貫通孔5aからみて反対側の周縁の一方側領域41と、
同じく周縁の他方側領域42を含む。一方側領域41は基板間コネクタ7が搭載されてい
る側、他方側領域42は防水部品6が搭載されている側である。なお、ここでは、一方側
領域41が他方側領域42よりもロアケース5の内側に突出している態様を図示している
が、第1基板4の形状は、図示されたものに限られない。
The first substrate 4 has one side region 41 of the peripheral edge on the opposite side when viewed from the through hole 5 a of the lower case 5,
It also includes the other side region 42 of the periphery. The one side area 41 is the side on which the inter-board connector 7 is mounted, and the other side area 42 is the side on which the waterproof component 6 is mounted. In addition, although the aspect which one side area | region 41 protrudes inside the lower case 5 rather than the other side area | region 42 is illustrated here, the shape of the 1st board | substrate 4 is not restricted to what was shown in figure.

第1基板4は、基板間コネクタ7が搭載されている一方側領域41に、ロアケース5の
係止壁5bを押圧する押圧端面4aを有している。また、第1基板4は、防水部品6が搭
載されている他方側領域42に、ロアケース5のリブ5cに係合して位置決めをする切欠
き4bを有している。切欠き4bは、リブ5cの径よりもわずかに大きい幅に形成されて
いる。
The first substrate 4 has a pressing end surface 4 a for pressing the locking wall 5 b of the lower case 5 in the one side region 41 where the inter-substrate connector 7 is mounted. In addition, the first substrate 4 has a notch 4 b in the other side area 42 where the waterproof component 6 is mounted, which engages with the rib 5 c of the lower case 5 for positioning. The notch 4b is formed in a width slightly larger than the diameter of the rib 5c.

防水部品6は、ロアケース5の貫通孔5aに挿入される突出部6bと、第1基板4上に
載置される基体部6cを有しており、突出部6bと基体部6cの間には防水部材6aが設
けられている。防水部材6aとしては、O−リングが好適に用いられ、その材質は、種々
のシリコーンゴムや樹脂などの中から、防水機能を発揮し、かつ、本実施形態に係る基板
の取付構造1に求められる反発力を考慮して、必要十分な弾性を有するものを選択すれば
よい。
The waterproof component 6 has a projecting portion 6 b inserted into the through hole 5 a of the lower case 5 and a base portion 6 c mounted on the first substrate 4, and between the projecting portion 6 b and the base portion 6 c A waterproof member 6a is provided. As the waterproof member 6a, an O-ring is suitably used, and the material thereof exhibits a waterproof function out of various silicone rubbers and resins, and is required for the mounting structure 1 of the substrate according to the present embodiment. The one having the necessary and sufficient elasticity may be selected in consideration of the repulsive force.

上述したような構成の下、図2(a)は、第1基板4をロアケース5に取り付けた状態
を平面視で示している。第1基板4に搭載された防水部品6の突出部6bは、ロアケース
5の貫通孔5aに挿入され、防水部材6aは貫通孔5aの内部に位置する。第1基板4の
一方側領域41の押圧端面4aはロアケース5の係止壁5bを押圧するとともに、他方側
領域42の切欠き4bはロアケース5のリブ5cと係合する。
Under the configuration as described above, FIG. 2A shows the state in which the first substrate 4 is attached to the lower case 5 in a plan view. The protrusion 6b of the waterproof component 6 mounted on the first substrate 4 is inserted into the through hole 5a of the lower case 5, and the waterproof member 6a is located inside the through hole 5a. The pressing end face 4 a of the one side area 41 of the first substrate 4 presses the locking wall 5 b of the lower case 5, and the notch 4 b of the other side area 42 engages with the rib 5 c of the lower case 5.

前述したとおり、切欠き4bは、図2(b)に図2(a)の領域Bを拡大して示すよう
に、リブ5cの径よりもわずかに大きい幅に形成されており、リブ5cに対し「遊び」を
有している。これにより、防水部品6の寸法上の個体差が「遊び」に吸収され、防水部材
6aが貫通孔5aに対して均等に押圧されるように位置決めが自動調整されて、安定した
状態で仮止めされることとなる。
As described above, the notch 4b is formed to have a width slightly larger than the diameter of the rib 5c, as shown in FIG. 2 (b) with the region B of FIG. 2 (a) enlarged. I have a "play" against. Thereby, the individual differences in the dimensions of the waterproof component 6 are absorbed by the "play", and the positioning is automatically adjusted so that the waterproof member 6a is uniformly pressed against the through hole 5a, and temporarily fixed in a stable state It will be done.

防水部品6と貫通孔5aの構成について、図3を用いてさらに説明する。図3は、図2
(a)のA−A線断面を示している。ロアケース5の貫通孔5aは、前述したように、内
側に向かって階段状に拡径しており、図3に示すように、径が相対的に小さい外口5a1
と、径が相対的に大きい内口5a2とから構成されている。
The configuration of the waterproof component 6 and the through hole 5a will be further described with reference to FIG. Figure 3 shows
The AA line cross section of (a) is shown. As described above, the diameter of the through hole 5a of the lower case 5 is increased stepwise toward the inside, and as shown in FIG. 3, the outer opening 5a1 having a relatively small diameter.
And an inner opening 5a2 having a relatively large diameter.

他方、第1基板4に搭載される防水部品6は、前述したように、貫通孔5aに挿入され
る突出部6bと、第1基板4に搭載される基体部6cとを有しており、突出部6bと基体
部6cの間には防水部材6aが設けられている。より具体的には、図3に示すように、防
水部材6aは、二条のフランジ部6d1,6d2の間に嵌め込まれており、防水部材6a
の径は、フランジ部6d1,6d2よりも大きい径に構成される。防水部品6の上面は、
第2基板3(図1参照)によって押圧されている。
On the other hand, as described above, the waterproof component 6 mounted on the first substrate 4 has the protrusion 6 b inserted into the through hole 5 a and the base portion 6 c mounted on the first substrate 4. A waterproof member 6a is provided between the projecting portion 6b and the base portion 6c. More specifically, as shown in FIG. 3, the waterproof member 6a is fitted between the two flange portions 6d1 and 6d2, and the waterproof member 6a is
The diameter of the diameter is larger than the diameter of the flanges 6d1 and 6d2. The upper surface of the waterproof part 6 is
It is pressed by the second substrate 3 (see FIG. 1).

防水部品6の突出部6bの径は貫通孔5aの外口5a1の径に実質的に対応するととも
に、フランジ部6d1,6d2の径は貫通孔5aの外口5a1の径よりも大きく、かつ、
内口5a2の径よりも小さく構成される。そして、防水部材6aの径は内口5a2の径よ
りも大きく構成される。これにより、防水部品6の突出部6bがロアケース5の貫通孔5
aに嵌入されると、外側のフランジ部6d1が外口5a1と内口5a2の境界に係止され
るとともに、防水部材6aが内口5a2の内壁面を押圧する状態となる。そうすると、白
抜き矢印Y1で示すように、防水部品6にはロアケース5の内側に向かう反発力が発生す
る。
The diameter of the protrusion 6b of the waterproof component 6 substantially corresponds to the diameter of the outer opening 5a1 of the through hole 5a, and the diameters of the flanges 6d1 and 6d2 are larger than the diameter of the outer opening 5a1 of the through hole 5a,
The diameter is smaller than the diameter of the inner opening 5a2. The diameter of the waterproof member 6a is larger than the diameter of the inner opening 5a2. Thereby, the projecting portion 6 b of the waterproof component 6 is the through hole 5 of the lower case 5.
When it is inserted into a, the outer flange 6d1 is engaged with the boundary between the outer opening 5a1 and the inner opening 5a2, and the waterproof member 6a presses the inner wall surface of the inner opening 5a2. Then, as shown by the white arrow Y1, a repulsive force toward the inside of the lower case 5 is generated in the waterproof component 6.

この反発力は、図4に示すように処理される。まず、第1基板4は、防水部品6の防水
部材6aの反発により、X−X方向(ロアケース5の幅方向)及びZ−Z方向(ロアケー
ス5の厚み方向)には自動調整され、貫通孔5aに対してその中央に位置決めされた状態
で仮止めされる。この状態では、Y−Y方向(ロアケース5の長手方向)については、防
水部品6ひいては第1基板4は、白抜き矢印Y1で示すように、防止部材6aの反発によ
ってロアケース5の内側に押し戻される。
This repulsive force is processed as shown in FIG. First, the first substrate 4 is automatically adjusted in the X-X direction (the width direction of the lower case 5) and the Z-Z direction (the thickness direction of the lower case 5) by the repulsion of the waterproof member 6a of the waterproof component 6, It is temporarily fixed in a state where it is positioned at the center to 5a. In this state, in the YY direction (longitudinal direction of lower case 5), waterproof component 6 and thus first substrate 4 are pushed back to the inside of lower case 5 by repulsion of prevention member 6a as shown by white arrow Y1. .

ここで、防水部材6の基体部6cの上面を押し込むと、前述したとおり、第1基板4の
一方端領域41の押圧端面4aが防水部材6aの反発力を上回るようにロアケース5の係
止壁5bを押圧し、他方端領域の切欠き4bがロアケース5のリブ5cに係合して、それ
ぞれに生ずる白抜き矢印Y2,Y3で示す応力によって、Y−Y方向が固定される。また
、第2基板3が防水部品6を押圧することによって、第1基板4を電子機器10のZ−Z
方向に固定される。
Here, when the upper surface of the base portion 6c of the waterproof member 6 is pushed in, as described above, the locking wall of the lower case 5 so that the pressing end surface 4a of the one end region 41 of the first substrate 4 exceeds the repulsive force of the waterproof member 6a. The notch 4b of the other end region is engaged with the rib 5c of the lower case 5 by pressing 5b, and the YY direction is fixed by the stress shown by the outlined arrows Y2 and Y3 respectively. In addition, when the second substrate 3 presses the waterproof component 6, the first substrate 4 can be moved along the ZZ of the electronic device 10.
It is fixed in the direction.

切欠き4bは、前述したとおり、リブ5cの径よりもわずかに大きい幅に形成されてい
る。これにより、貫通孔5a、防水部材6a、防水部品6及び/又は第1基板4の寸法上
の個体差があっても、その個体差をリブ5cと切欠き4bの間の間隙で吸収することによ
り、防水部品6の防水部材6aの反発力によって防水部材6aが均等に押圧される状態に
自動調整され、安定した状態で固定される。このような構造により、防水部品6は、確実
に防水することができる。
As described above, the notch 4b is formed to have a width slightly larger than the diameter of the rib 5c. Thereby, even if there are individual differences in the dimensions of the through hole 5a, the waterproof member 6a, the waterproof component 6, and / or the first substrate 4, the individual differences are absorbed by the gap between the rib 5c and the notch 4b. Thus, the repelling force of the waterproofing member 6a of the waterproofing part 6 automatically adjusts the waterproofing member 6a to a state in which the waterproofing member 6a is uniformly pressed, and is fixed in a stable state. With such a structure, the waterproof component 6 can be reliably waterproofed.

(実施形態の効果)
以上のような構成としたことから、本実施形態に係る電子機器への基板の取付構造1は
、以下のような効果を奏する。
(1)第1基板4に搭載される防水機能を有する防水部品6a(電子部品)に寸法上の個
体差があった場合でも、第1基板4が遊びをもった状態で仮止めされ、防水部材6aの反
発力により完全な位置決めがなされるような構造としたため、防水部材6aが均等に押圧
され、簡単かつ確実に第1基板4をロアケース5に取り付けられることができる。
(2)第1基板4は、防水部材6aの反発力を利用して固定されることから、ネジ止めな
どの固定部材が不要であり、電子機器10の小型化を図ることができる。
(3)さらに、電子機器10に第1基板4を取り付けた際には、第2基板3が防水部品6
を押圧することによって、第1基板4を電子機器10の厚み方向に固定することができる

(4)さらに、防水部品6をイヤホンジャックとした場合、イヤホンジャックに効果的な
キャップレス防水を施すことができる。
(Effect of the embodiment)
Since it is set as the above structures, the attachment structure 1 of the board | substrate to the electronic device which concerns on this embodiment has the following effects.
(1) Even when there is an individual difference in size in the waterproof component 6a (electronic component) having a waterproof function mounted on the first substrate 4, the first substrate 4 is temporarily fixed with play and waterproof Since the complete positioning is achieved by the repulsive force of the member 6a, the waterproof member 6a can be uniformly pressed, and the first substrate 4 can be attached to the lower case 5 easily and reliably.
(2) The first substrate 4 is fixed by utilizing the repulsive force of the waterproof member 6a, so that a fixing member such as a screw is not necessary, and the electronic device 10 can be miniaturized.
(3) Furthermore, when the first substrate 4 is attached to the electronic device 10, the second substrate 3 is a waterproof component 6.
By pressing the first substrate 4, the first substrate 4 can be fixed in the thickness direction of the electronic device 10.
(4) Furthermore, when the waterproof part 6 is an earphone jack, an effective capless waterproof can be given to the earphone jack.

以上、実施形態について説明したが、本発明は、具体的な実施形態に限定されるもので
はなく、種々の変更を行ったものも含まれるものであり、そのことは、当業者にとって特
許請求の範囲の記載から明らかである。
As mentioned above, although embodiment was described, this invention is not limited to a specific embodiment, What variously changed is included, This is a claim for those skilled in the art. It is clear from the description of the range.

1…基板の取付構造
2…アッパケース
2a…ボタン、2b…液晶画面
3…第2基板
4…第1基板
41…一方端側の周縁、42…他方端側の周縁、4a…押圧端面、4b…切欠き
5…ロアケース
5a…貫通孔、5a1…外口、5a2…内口、5b…係止壁、5c…リブ
6…防水部品
6a…防水部材、6b…突出部、6c…基体部、6d1…外側のフランジ部、6d2…
内側のフランジ部
7…基板間コネクタ
10…電子機器(コードレス電話子機)
DESCRIPTION OF SYMBOLS 1 ... Mounting structure of substrate 2 ... Upper case 2a ... Button, 2b ... Liquid crystal screen 3 ... 2nd substrate 4 ... 1st substrate 41 ... Peripheral edge on one end side 42: Peripheral edge on the other end side 4a ... Pressed end face, 4b ... Notch 5 ... Lower case 5a ... Through hole, 5a 1 ... Outside opening, 5a 2 ... Inside opening 5b ... Locking wall, 5c ... Rib 6 ... Waterproofing part 6a ... Waterproofing member, 6b ... Projection part, 6c ... Base part, 6d 1 ... outside flange, 6d2 ...
Inner flange 7 ... Board to board connector 10 ... Electronic equipment (cordless telephone handset)

Claims (3)

電子機器への基板の取付構造であって、
前記電子機器のロアケースと、
前記ロアケースに取り付けられる第1基板と、
前記第1基板に搭載され、前記ロアケースの貫通孔に嵌入される防水部材を有する防水
部品と、を備え、
前記ロアケースが、前記第1基板を介して前記防水部材の反発力を受け止める係止壁と
、前記第1基板に係合するリブとを有し、
前記第1基板が、前記ロアケースの前記貫通孔からみて反対側の周縁の一方側領域にお
いて前記係止壁を押圧する押圧端面と、前記リブの径よりも大きな幅を有し、前記周縁の
他方側領域において前記リブに係合して位置決めをする切欠きとを有する、ことを特徴と
する基板の取付構造。
Mounting structure of the substrate to the electronic device,
A lower case of the electronic device;
A first substrate attached to the lower case;
A waterproof component mounted on the first substrate and having a waterproof member fitted into the through hole of the lower case;
The lower case has a locking wall for receiving the repulsive force of the waterproof member via the first substrate, and a rib engaged with the first substrate.
The first substrate has a pressing end surface for pressing the locking wall in one region of the peripheral side opposite to the through hole of the lower case, and a width larger than the diameter of the rib, and the other of the peripheral side And a notch for engaging and positioning the rib in the side area.
前記防水部材が前記貫通孔に挿入されて前記第1基板が前記ロアケースに仮止めされた
状態で、前記防水部品が上方から第2基板によって押圧されることを特徴とする請求項1
に記載の基板の取付構造。
The waterproof component is pressed from above by the second substrate in a state where the waterproof member is inserted into the through hole and the first substrate is temporarily fixed to the lower case.
Mounting structure of the substrate described in.
前記防水部品がイヤホンジャックであり、前記第1基板がイヤホンジャック基板である
ことを特徴とする請求項1又は2に記載の基板の取付構造。
The substrate mounting structure according to claim 1 or 2, wherein the waterproof part is an earphone jack, and the first substrate is an earphone jack substrate.
JP2017191065A 2017-09-29 2017-09-29 Board mounting structure Pending JP2019067891A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017191065A JP2019067891A (en) 2017-09-29 2017-09-29 Board mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017191065A JP2019067891A (en) 2017-09-29 2017-09-29 Board mounting structure

Publications (1)

Publication Number Publication Date
JP2019067891A true JP2019067891A (en) 2019-04-25

Family

ID=66339836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017191065A Pending JP2019067891A (en) 2017-09-29 2017-09-29 Board mounting structure

Country Status (1)

Country Link
JP (1) JP2019067891A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010136068A (en) * 2008-12-04 2010-06-17 Mitsumi Electric Co Ltd Circuit board support structure and antenna apparatus
JP2013131545A (en) * 2011-12-20 2013-07-04 Panasonic Corp Portable terminal and jack
JP2015032619A (en) * 2013-07-31 2015-02-16 矢崎総業株式会社 Electrical equipment housing with replaceable connector
JP2015088808A (en) * 2013-10-29 2015-05-07 京セラ株式会社 Electronic equipment with waterproof connector structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010136068A (en) * 2008-12-04 2010-06-17 Mitsumi Electric Co Ltd Circuit board support structure and antenna apparatus
JP2013131545A (en) * 2011-12-20 2013-07-04 Panasonic Corp Portable terminal and jack
JP2015032619A (en) * 2013-07-31 2015-02-16 矢崎総業株式会社 Electrical equipment housing with replaceable connector
JP2015088808A (en) * 2013-10-29 2015-05-07 京セラ株式会社 Electronic equipment with waterproof connector structure

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