JP2019067852A - Resin sheet, and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sheet in which disintegration of a resin composition layer is suppressed and the resin composition layer can be made to follow the unevenness of an adherend surface to perform sealing, and a method for producing the resin sheet. A resin sheet 1 used for sealing electronic parts in a method for manufacturing a semiconductor device, wherein the resin sheet 1 includes a curable resin composition layer 11 and the resin composition layer 11 is cured. It is formed from a resin composition containing a sex resin, the thickness of the resin composition layer 11 is 100 μm or more and 300 μm or less, and the resin composition layer 11 is 1.0% by mass or more and 5. A resin sheet 1 containing a plastic solvent having a content of 0% by mass or less and volatilizing by heating. [Selection diagram] Fig. 1

Description

  The present invention relates to a resin sheet used for sealing an electronic component in a method of manufacturing a semiconductor device, and a method of manufacturing the sheet.

  Conventionally, in a method of manufacturing a semiconductor device, an electronic component such as a semiconductor chip is sealed using a resin sheet provided with a curable resin composition layer. For example, after laminating a resin composition layer in the resin sheet on an electronic component provided on a substrate, the resin composition layer is cured to form a cured layer, thereby sealing the electronic component. It will be.

  As an example of the said resin sheet, the resin sheet used for manufacture of the board | substrate (Hereafter, it may be mentioned "component built-in board | substrate") with which the electronic component was incorporated is disclosed by patent document 1. FIG. In particular, in the example of Patent Document 1, after a predetermined resin is melt-kneaded to prepare a kneaded product, a resin sheet is produced by forming the kneaded product into a sheet by a flat plate pressing method. Is disclosed (paragraph 0067 of Patent Document 1).

JP, 2016-219638, A

  By the way, in the conventional resin sheet, the resin composition layer becomes brittle depending on the composition of the resin composition for forming the resin composition layer, and the resin composition layer is damaged during storage, transportation, use, etc. There is a problem that the resin composition layer is easily broken, that is, the resin composition layer is easily broken. The resin sheet in which the collapse of the resin composition layer has occurred is difficult to use in the manufacture of a semiconductor device, and when such a resin sheet is used intentionally in the manufacture of a semiconductor device, sealing is good. The quality of the resulting semiconductor device is degraded. In addition, when unevenness is formed with the electronic component and the like on the adhesion surface where the resin composition layer is stuck, the resin sheet makes the resin composition follow the unevenness and enables sealing. Met.

  The present invention has been made in view of such a situation, and a resin sheet capable of suppressing the collapse of the resin composition layer and sealing the resin composition layer following the irregularities of the adhesion surface. And a method of producing the resin sheet.

  In order to achieve the above object, first, the present invention is a resin sheet used for sealing an electronic component in a method of manufacturing a semiconductor device, wherein the resin sheet is provided with a curable resin composition layer The resin composition layer is formed of a resin composition containing a curable resin, and the thickness of the resin composition layer is 100 μm or more and 300 μm or less, and the resin composition layer is The resin sheet characterized by containing the plastic solvent volatilized by heating by content of 1.0 mass% or more and 5.0 mass% or less is provided (invention 1).

  In the resin sheet according to the above invention (Invention 1), the thickness of the resin composition layer is in the above-mentioned range, and the above-mentioned content of the resin composition layer is the above-mentioned plastic solvent (hereinafter simply referred to as "plastic solvent") In some cases, the resin composition layer is less likely to collapse, and the resin composition layer is less likely to be damaged or broken during storage, transport, use, etc. Sealing can be performed by making the resin composition layer follow the irregularities of the surface. As mentioned above, the semiconductor device of the outstanding quality can be manufactured by using the said resin sheet.

  In the said invention (invention 1), it is preferable that the said resin composition layer consists of a single layer (invention 2).

  In the above inventions (Inventions 1 and 2), preferably, the resin composition contains a film-forming resin and an inorganic filler, and the film-forming resin preferably does not substantially contain a resin having an ester bond (invention) 3).

In the said invention (invention 3), it is preferable that the said inorganic filler is what was surface-treated by the surface treating agent whose minimum coverage area is less than 550 m < ² > / g (invention 4).

  In the above inventions (Inventions 1 to 4), the method of manufacturing the semiconductor device preferably includes the step of plating at least a part of the surface of a cured layer formed by curing the resin composition layer ( Invention 5).

  In the said invention (invention 1-5), it is preferable that the said semiconductor device is a component built-in board | substrate (invention 6).

  Second, the present invention is a method for producing a resin sheet used for sealing an electronic component in a method for producing a semiconductor device, wherein the resin sheet comprises a curable resin composition layer, and the resin composition The layer is formed of a resin composition containing a curable resin, and the thickness of the resin composition layer is 100 μm or more and 300 μm or less, and the resin composition layer is 1.0% by mass Above, a content of 5.0% by mass or less, containing a plasticizing solvent that volatilizes by heating, the production method is a step of applying a coating liquid of the resin composition to form a coating, and There is provided a process for producing a resin sheet, comprising the step of forming the resin composition layer by drying a coating film (Invention 7).

  In the said invention (invention 7), the said coating film is formed by one application of the coating liquid of the said resin composition, and the single layer of said (invention 2) is dried by drying the said coating film. It is preferable to include forming the resin composition layer which consists of (invention 8).

  In the said invention (invention 7 and 8), it is preferable that the coating liquid of the said resin composition contains the diluent whose boiling point is 130 degreeC or more (invention 9).

  In the resin sheet of the present invention, the collapse of the resin composition layer is suppressed during storage, transport, use, etc., and the resin composition layer can be made to follow the irregularities on the adherend surface for sealing.

It is a sectional view of a resin sheet concerning one embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described.
[Resin sheet]
FIG. 1 shows a cross-sectional view of the resin sheet 1 according to the present embodiment. As shown in FIG. 1, the resin sheet 1 according to the present embodiment includes a resin composition layer 11 and a release sheet 12 laminated on at least one surface of the resin composition layer 11. In addition, another release sheet may be further laminated on the surface of the resin composition layer 11 opposite to the release sheet 12. However, the release sheet 12 and another release sheet may be omitted.

1. Resin Composition Layer In the resin sheet 1 according to the present embodiment, the resin composition layer 11 has curability. Here, having the curability means that the resin composition layer 11 can be cured by heating or the like. That is, the resin composition layer 11 is uncured in the state of constituting the resin sheet 1. The resin composition layer 11 is preferably thermosetting. In this case, the resin composition layer 11 has a large thickness or contains a coloring agent, which makes it difficult to carry out a curing process by irradiating the resin composition layer 11 with energy rays. Also, the resin composition layer 11 can be cured well.

  In the resin sheet 1 according to the present embodiment, the resin composition layer 11 is formed of a resin composition containing a curable resin. Furthermore, in the resin sheet 1 according to the present embodiment, the thickness of the resin composition layer 11 is 100 μm or more and 300 μm or less, and the resin composition layer 11 is 1.0% by mass or more and 5.0% by mass It contains a plasticizing solvent at the following contents.

  In the resin sheet 1 according to the present embodiment, the resin composition layer 11 contains the plastic solvent at the above-described content, and the resin composition layer 11 has a sufficiently thick thickness as in the above-described range, whereby the resin composition is obtained. Even in the case where the surface to which the object layer 11 is attached has unevenness, sealing can be performed while making the resin composition layer 11 follow the unevenness.

  As mentioned above, the semiconductor device of the outstanding quality can be manufactured by using resin sheet 1 concerning this embodiment.

  The resin composition in the present embodiment contains a curable resin as described above, and preferably contains at least one of a film-forming resin, an inorganic filler, and a curing catalyst.

(1) Curable resin In the resin sheet 1 which concerns on this embodiment, when the resin composition contains curable resin, the resin composition layer 11 formed from the said resin composition can be hardened | cured favorably. The electronic component can be tightly sealed. When the resin composition layer 11 has a large thickness or contains a colorant as the curable resin, it is difficult to cure the resin composition layer 11 by irradiation with energy rays. Even from the viewpoint that the resin composition layer 11 can be cured well, a thermosetting resin is preferable. Moreover, since it becomes easy to volatilize the plastic solvent in resin composition layer 11 by heating for hardening of a thermosetting resin, the hardening layer which resin composition layer 11 hardens becomes a plastic solvent. It will not be contained. Therefore, in the semiconductor device provided with the above-mentioned hardened layer manufactured using resin sheet 1 concerning this embodiment, the bad influence by plastic solvent does not arise. The thermosetting resin is not particularly limited as long as the resin composition layer 11 can be cured, and, for example, a resin usually contained in a sealing material can be used. Specifically, epoxy resin, phenol resin, maleimide compound, melamine resin, urea resin, benzoxazine compound, acid anhydride compound, amine compound, active ester resin, cyanate ester resin and the like can be mentioned. The species can be used alone or in combination of two or more. Among these, it is preferable to use an epoxy resin, a phenol resin, or a mixture thereof, and it is preferable to use at least an epoxy resin. In addition, epoxy resin, those having a glycidyl group in a side chain such as acryl resin, and those having a high molecular weight epoxy group may also be involved in curing of the resin composition layer 11 because the epoxy group is reacted by heat. In the resin sheet 1 which concerns on this embodiment, what is a high molecular weight thing and has a function which forms the resin composition layer 11 in a sheet form is regarded as film forming resin. The weight average molecular weight of such a high molecular weight polymer is generally 25,000 or more.

  Epoxy resins generally have the property of being three-dimensional reticulated upon heating and forming a rigid cured product. As such an epoxy resin, various known epoxy resins can be used. Specifically, glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenyl novolac, cresol novolac; butanediol, polyethylene Glycidyl ethers of alcohols such as glycol and polypropylene glycol; Glycidyl ethers of carboxylic acids such as phthalic acid, isophthalic acid and tetrahydrophthalic acid; Glycidyl type in which an active hydrogen bonded to a nitrogen atom such as aniline isocyanurate is substituted with a glycidyl group or Epoxy resins of the alkyl glycidyl type; vinylcyclohexane diepoxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2- (3,4-epoxy So-called alicyclics in which an epoxy is introduced by, for example, oxidation of a carbon-carbon double bond in the molecule, such as cyclohexyl) -5,5-spiro (3,4-epoxy) cyclohexane-m-dioxane, etc. Type epoxides can be mentioned. In addition, an epoxy resin having a biphenyl skeleton, a triphenylmethane skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton and the like can also be used. These epoxy resins can be used singly or in combination of two or more. Among the epoxy resins described above, glycidyl ether of bisphenol A (bisphenol A type epoxy resin), epoxy resin having biphenyl skeleton (biphenyl type epoxy resin), epoxy resin having naphthalene skeleton (naphthalene type epoxy resin), or a combination thereof It is preferred to use.

  As a phenol resin, for example, bisphenol A, tetramethyl bisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, triphenylmethane type phenol, tetrakis phenol, novolac type phenol, cresol novolac resin, biphenylaralkyl skeleton A phenol (biphenyl type phenol) etc. are mentioned, It is preferable to use a biphenyl type phenol among these. These phenolic resins can be used singly or in combination of two or more. In addition, when using an epoxy resin as a thermosetting resin, it is preferable to use a phenol resin together from a viewpoint of the reactivity with an epoxy resin etc.

  The content of the thermosetting resin in the resin composition is preferably 10% by mass or more, particularly preferably 15% by mass or more, and further preferably 20% by mass or more. In addition, the content is preferably 60% by mass or less, particularly preferably 50% by mass or less, and further preferably 40% by mass or less. When the content is 10% by mass or more, curing of the resin composition layer 11 becomes more sufficient, and the electronic component can be sealed more firmly. In addition, when the content is 60% by mass or less, curing of the resin composition layer 11 at an unintended stage can be further suppressed, and the storage stability becomes more excellent. In the case where the resin composition is diluted to form a coating liquid, and the coating and drying are performed to form a sheet, the content of the thermosetting resin in the resin composition is the amount of components volatilized in the drying step. The contents of the other components of the resin composition are the same, based on the amount excluding.

  An energy ray curable resin may be used as the curable resin. Examples of energy ray-curable resins include resins cured by ultraviolet light, and examples of resins cured by ultraviolet light include resins having a group having a reactive double bond such as an acryloyl group or methacryloyl group in the molecule. Can be mentioned. When using an energy ray-curable resin, the resin composition preferably further contains a photopolymerization initiator. In the resin sheet 1 according to the present embodiment, the resin composition may contain both a thermosetting resin and an energy ray curable resin.

(2) Film-Forming Resin In the resin sheet 1 according to the present embodiment, the resin composition preferably further contains a film-forming resin. Thereby, it becomes easy to form the resin composition layer 11 in a sheet shape.

  It is preferable that the said film-forming resin contains resin which does not have an ester bond substantially. The use of a resin substantially having no ester bond as a film-forming resin is a process for producing a semiconductor device including a step of performing a treatment using an alkaline solution and a step of performing a plating treatment with the resin sheet 1 according to the present embodiment. It is preferable from the point which becomes suitable for a method. An example of such a manufacturing method is a method of manufacturing a component built-in substrate. In the method for manufacturing a component-embedded substrate, after laminating the resin composition layer 11 in the resin sheet 1 on the electronic component, the resin composition layer 11 is cured to form a cured layer, thereby sealing the electronic component. Do. Thereafter, a hole penetrating the hardened layer is formed, and a wire electrically connecting the electronic component to the outside through the hole is further formed. During the formation of the holes, residues of the resin constituting the cured layer (hereinafter sometimes referred to as "smear") may occur, and the smear may remain in the holes. If the wiring is formed with the smear remaining in the hole, a problem such as conduction failure of the wiring is likely to occur. Therefore, after the hole is formed and before the wiring is formed, the generated smear is removed (hereinafter referred to as “desmear Processing) is performed. As one of the methods of such a desmear process, the method of exposing the object of a process to alkaline solution exists, and it can be made to melt | dissolve a smear in an alkaline solution and to be removed with the said method.

  Here, the resin having substantially no ester bond is difficult to elute in an alkaline solution. Therefore, when using resin sheet 1 concerning this embodiment provided with resin composition layer 11 formed using resin composition containing resin which does not have ester bond substantially, in a manufacturing method of a semiconductor device mentioned above In addition, when performing a desmear process using an alkaline solution, the components in the hardened layer are difficult to elute into the alkaline solution. Furthermore, when the above-mentioned resin composition contains an inorganic filler which will be described later, and thereby the above-mentioned hardened layer contains the above-mentioned inorganic filler, the above-mentioned inorganic filler is properly released from the hardened layer into the alkaline solution. . Thus, while the part used as the matrix around the inorganic filler remains well in the alkaline solution without elution, the inorganic filler is appropriately desorbed, and as a result, minute irregularities are formed on the surface of the hardened layer. Will be present. Subsequent to the desmearing treatment, the plating treatment is performed on the surface of the hardened layer having the minute unevenness, whereby the anchor effect of the plating on the surface is exhibited well, and the fixing property of the plating in the hardened layer is excellent. (Hereafter, such an effect is also referred to as "plating fixing improvement effect."). As a result, it is possible to manufacture a semiconductor device in which the wiring is well fixed to the surface of the hardened layer.

  Examples of film-forming resins include polyvinyl acetal resins, phenoxy resins, olefin resins, polyester resins, polyurethane resins, polyester urethane resins, polyamide resins, polystyrene resins, polysiloxane resins, rubber resins And acrylic resins and the like, and these can be used singly or in combination of two or more. Examples of the resin having substantially no ester bond include polyvinyl acetal resin, phenoxy resin, olefin resin, polyurethane resin, polyamide resin, polystyrene resin, polysiloxane resin, rubber resin and the like. Among them, polyvinyl acetal resin and phenoxy resin are preferable, and polyvinyl acetal resin is more preferably used. When the resin composition contains a polyvinyl acetal resin, the coating liquid of the resin composition has a relatively high viscosity, and by coating the coating liquid, the thickness of the resin composition layer 11 described above is obtained. It becomes easy to form. In particular, since the resin composition layer 11 can also be formed by applying the coating liquid once, the resin sheet 1 can be manufactured with high productivity.

  Examples of the polyvinyl acetal resin include polyvinyl butyral obtained by reacting polyvinyl alcohol and butyraldehyde, polyvinyl formal obtained by reacting polyvinyl alcohol and formaldehyde, and polyvinyl obtained by reacting polyvinyl alcohol and acetaldehyde. The acetoacetal etc. are mentioned, These can be used individually by 1 type or in combination of 2 or more types. Among these, polyvinyl butyral is preferably used.

  The phenoxy resin is not particularly limited, but, for example, bisphenol A type, bisphenol F type, bisphenol A / bisphenol F copolymer type, bisphenol S type, bisphenol acetophenone type, novolac type, fluorene type, dicyclopentadiene type, Examples thereof include norbornene type, naphthalene type, anthracene type, adamantane type, terpene type, trimethylcyclohexane type, biphenol type and biphenyl type. Among these, it is preferable to use a bisphenol A type phenoxy resin.

  The weight average molecular weight of the resin substantially free of ester bonds is preferably 25,000 or more, and particularly preferably 50,000 or more. Further, the weight average molecular weight is preferably 600,000 or less, and particularly preferably 300,000 or less.

  The content of the film-forming resin in the resin composition is preferably 1% by mass or more, particularly preferably 3% by mass or more, and further preferably 5% by mass or more. In addition, the content is preferably 30% by mass or less, particularly preferably 20% by mass or less, and further preferably 10% by mass or less. When the content is in the above range, it becomes easier to form the resin composition layer 11 in a sheet shape.

  In the cured layer formed by curing the resin composition layer 11, the cured product of the curable resin described above has a high resistance to alkali. Therefore, by making the main component of the film-forming resin susceptible to the influence of alkali substantially not have an ester bond, it is preferable because the effect of improving the plating fixation is easily exhibited stably. The content of the resin having substantially no ester bond in the film-forming resin is preferably 75% by mass or more, more preferably 85% by mass or more, and further preferably 92% by mass or more preferable. Moreover, it is preferable that content of resin which does not have an ester bond in film forming resin substantially is 100 mass% or less.

  As resin which has an ester bond, acrylic resin, polyester resin, polyester urethane resin, etc. are mentioned. From the viewpoint of enhancing the plating fixing improvement effect, it is preferable to reduce the content of the ester bond-containing resin in the film-forming resin, and the mass of the ester bond-containing resin is 25% by mass or less Is preferably 15% by mass or less, more preferably 8% by mass or less, and particularly preferably the film-forming resin is substantially free of a resin having an ester bond.

(3) Inorganic Filler In resin sheet 1 concerning this embodiment, it is preferred that a resin composition further contains an inorganic filler. Thereby, the cured layer in which the resin composition layer 11 is cured effectively exerts excellent mechanical strength. Furthermore, when the hardened layer is subjected to a desmearing process using an alkaline solution, the inorganic filler is properly desorbed from the hardened layer, and as a result, the anchor effect of plating on the surface of the hardened layer as described above is good. The fixing property of the plating in the hardened layer is excellent.

  Examples of the inorganic filler include silica, alumina, glass, titanium oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride Examples of the filler include aluminum borate, boron nitride, crystalline silica, amorphous silica, mullite, composite oxide such as cordierite, montmorillonite, smectite, etc. Or in combination of two or more. Among these, it is preferable to use a silica filler.

  The shape of the inorganic filler may be any of granular, needle-like, plate-like, indeterminate and the like, and among them, it is preferably spherical.

  The average particle diameter of the inorganic filler is preferably 0.01 μm or more, particularly preferably 0.1 μm or more, and further preferably 0.3 μm or more. The average particle diameter of the inorganic filler is preferably 3.0 μm or less, and particularly preferably 1.0 μm or less. When the average particle diameter of the inorganic filler is in the above range, the cured layer formed by curing of the resin composition layer 11 can easily exhibit mechanical strength effectively, and the inorganic filler can be in the alkaline solution from the cured layer. It becomes moderately easy to detach. In addition, let the average particle diameter of the inorganic filler in this specification be a value measured by the dynamic light scattering method using the particle size distribution measuring apparatus (made by Nikkiso Co., Ltd., product name "Nanotrac Wave-UT 151").

  The maximum particle size of the inorganic filler is preferably 0.05 μm or more, and more preferably 0.5 μm or more. Further, the maximum particle size is preferably 5 μm or less, and particularly preferably 3 μm or less. When the maximum particle size of the inorganic filler is in the above range, the inorganic filler can be easily filled in the hardened layer, and the hardened layer has more excellent mechanical strength. In addition, let the largest particle size of the inorganic filler in this specification be a value measured by a dynamic light scattering method using a particle size distribution measuring apparatus (manufactured by Nikkiso Co., Ltd., product name “Nanotrac Wave-UT 151”).

In the resin sheet 1 which concerns on this embodiment, it is preferable that the inorganic filler is surface-treated by the surface treating agent. As a result, the dispersibility and the filling property of the inorganic filler in the resin composition are improved, and when performing a desmear treatment using an alkaline solution on the cured layer formed by curing the resin composition layer 11, The filler is easily detached from the hardened layer appropriately. In particular, the minimum coverage area of the surface treatment agent is preferably less than 550 m ² / g, particularly preferably 520 m ² / g or less, and further preferably 450 m ² / g or less. Further, the minimum covering area of the surface treatment agent is preferably 100 m ² / g or more, particularly preferably 200 m ² / g or more, and further preferably 300 m ² / g or more. When the minimum covering area of the surface treatment agent is less than 550 m ² / g, detachment of the inorganic filler from the cured layer formed by curing the resin composition layer 11 is easily generated, and as a result, in the cured layer It becomes easy to obtain the excellent fixability of plating. In addition, when the minimum covering area of the surface treatment agent is 100 m ² / g or more, the dispersibility and the filling property of the inorganic filler in the resin composition become more excellent.

  An epoxysilane, a vinylsilane, etc. are mentioned as an example of the said surface treatment agent. Among these, epoxysilane is preferably used. Specific examples of the epoxysilane include, for example, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane etc. are mentioned. Among these, it is preferable to use 3-glycidoxypropyltrimethoxysilane from the viewpoint of effectively promoting the elimination of the inorganic filler.

  Specific examples of the vinylsilane include vinyltriacetoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltrichlorosilane, vinyltris (2-methoxyethoxy) silane, and the like. Among these, it is preferable to use vinyltrimethoxysilane from the viewpoint of being able to effectively promote the detachment of the inorganic filler.

  The method for surface-treating the inorganic filler with a surface treatment agent is not particularly limited, and can be performed by a general method. For example, after a non-processed inorganic filler is stirred at normal temperature using a mixer and the surface treatment agent is sprayed thereto, the surface treatment can be performed by further stirring for a predetermined time. The stirring time after spraying is preferably, for example, 5 minutes or more and 15 minutes or less. In order to fix the surface treatment agent to the inorganic filler sufficiently, after the above operation, the inorganic filler may be removed from the mixer and left for a day or more, or a slight heat treatment may be performed. Moreover, in order to surface-treat uniformly, after spraying a surface treating agent, the organic solvent may be further added and the said stirring may be performed. As a mixer, a well-known thing can be used, For example, Blenders, such as V blender, a ribbon blender, a bubble cone blender, a Henschel mixer, mixers, such as a concrete mixer, a ball mill etc. are mentioned, Among these, using a mixer Is preferred.

  The content of the inorganic filler in the resin composition is preferably 40% by mass or more, particularly preferably 50% by mass or more, and further preferably 60% by mass or more. The content is preferably 90% by mass or less, particularly preferably 85% by mass or less, and further preferably 80% by mass or less. When the content of the inorganic filler is 40% by mass or more, a cured layer obtained by curing the resin composition layer 11 has better mechanical strength. In addition, when the content of the inorganic filler is 90% by mass or less, the resin composition layer 11 is easily cured, and a semiconductor device having better quality can be manufactured using the resin sheet 1 It becomes. In the conventional resin sheet, when the resin composition layer is formed of a resin composition containing an inorganic filler having a relatively large content as in the above range, the resin composition layer becomes brittle and stored. It becomes easy to collapse at the time of transportation, at the time of use, etc. However, in the resin sheet 1 according to the present embodiment, the thickness of the resin composition layer 11 is in the above-described range, and the resin composition layer contains the plastic solvent at the above-described content, thereby containing the inorganic filler. Even when the amount is in the above range, the collapse of the resin composition layer 11 is suppressed.

  When the inorganic filler is surface-treated with a surface treatment agent, the proportion of the inorganic filler surface-treated with the surface treatment agent is 70% by mass or more among the inorganic fillers contained in the resin composition. The content is preferably 85% by mass or more. When the ratio is in the above-mentioned range, it becomes possible to achieve both of effectively promoting the detachment of the inorganic filler from the hardened layer and the excellent mechanical strength of the hardened layer. .

(4) Curing catalyst In the resin sheet 1 which concerns on this embodiment, when a resin composition contains a thermosetting resin, it is preferable to further contain a curing catalyst. As a result, the curing reaction of the thermosetting resin can be effectively advanced, and the resin composition layer 11 can be favorably cured. Examples of curing catalysts include imidazole curing catalysts, amine curing catalysts, phosphorus curing catalysts and the like.

  Specific examples of the imidazole-based curing catalyst include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl 2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-di (hydroxymethyl) imidazole, etc. From the viewpoint of - It is preferred to use ethyl-4-methylimidazole.

  Specific examples of the amine curing catalyst include triazine compounds such as 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine, 1,8-diazabicyclo [5,4, 0] Undecene-7 (DBU), triethylenediamine, benzyldimethylamine, tertiary amine compounds such as triethanolamine and the like. Among these, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] ethyl-s-triazine is preferable.

  Further, specific examples of the phosphorus-based curing catalyst include triphenylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine and the like.

  The curing catalysts described above may be used alone or in combination of two or more.

  The content of the curing catalyst in the resin composition is preferably 0.01% by mass or more, particularly preferably 0.05% by mass or more, and further preferably 0.1% by mass or more preferable. The content is preferably 2.0% by mass or less, particularly preferably 1.5% by mass or less, and further preferably 1.0% by mass or less. When the content is in the above range, the resin composition 11 can be cured more favorably.

(5) Plastic solvent In resin sheet 1 concerning this embodiment, resin composition layer 11 contains a plastic solvent by content of 1.0 mass% or more. The plasticizing solvent coats the coating liquid of the resin composition to form a coating film as described later, and when the resin composition layer 11 is formed by drying the coating film, the coating film is dried. It will remain in the resin composition layer 11 also after that. When the resin composition layer 11 contains the plasticizing solvent at the above content, as described above, the brittleness of the resin composition layer 11 is improved, and the resin composition layer 11 becomes difficult to disintegrate, and the storage is performed. The occurrence of breakage or breakage in the resin composition layer 11 at the time of transportation, at the time of use, etc. is suppressed. Furthermore, since the resin composition layer 11 has predetermined flexibility, the resin composition layer 11 can easily cover the periphery of the electronic component sufficiently, and a cured layer formed by curing the resin composition layer 11 and an electron The formation of an air gap between components can be well suppressed. From such a viewpoint, the content of the plastic solvent of the resin composition layer 11 is preferably 1.2% by mass or more, and particularly preferably 1.5% by mass or more. On the other hand, the upper limit value of the content of the plastic solvent in the resin composition layer 11 is 5.0% by mass or less, preferably 4.5% by mass or less, and particularly preferably 4.0% by mass or less Is preferred. When the content of the plasticizing solvent in the resin composition layer 11 exceeds 5.0% by mass, it becomes difficult to form the resin composition layer 11 in a sheet form. In addition, the measuring method of content of the plastic solvent in the resin composition layer 11 is as described in the test example mentioned later.

  The plastic solvent is not limited as long as it can sufficiently improve the brittleness of the resin composition layer 11. As described above, the resin composition layer 11 is preferably formed of a resin composition containing a thermosetting resin, and in this case, the resin composition layer 11 is used for sealing the electronic component. It can be cured by heating. Here, since the plasticizing solvent is volatilized by heating, it is volatilized by the heating and is sufficiently removed from the formed hardened layer. The plastic solvent does not volatilize easily at normal temperature in order to suppress excessive release from the resin composition layer 11 at a stage prior to application to electronic parts such as storage and transport. Is preferred. Moreover, as described later, after the resin composition is diluted with a solvent to prepare a coating liquid, when the resin composition layer 11 is formed using the coating liquid, the above-mentioned plastic solvent is the above-mentioned plastic solvent. It is preferable that it is a solvent used to prepare a coating liquid.

  The above-mentioned plasticizing solvent preferably has a boiling point of 130 ° C. or higher, particularly preferably 135 ° C. or higher, and more preferably 140 ° C. or higher. The above-mentioned plasticizing solvent preferably has a boiling point of 210 ° C. or less, particularly preferably 190 ° C. or less, and more preferably 170 ° C. or less. When the boiling point of the plasticizing solvent is 130 ° C. or more, the plasticizing solvent tends to be appropriately left in the coating when the coating formed by applying the coating solution containing the plasticizing solvent is dried. It becomes easy to adjust the content of the plastic solvent in the composition layer 11 to the value described above. Furthermore, during storage or transport of the resin sheet 1, the release of the plastic solvent from the resin composition layer 11 can be effectively suppressed, and the content of the plastic solvent adjusted as described above is maintained for a long time It becomes easy to do. On the other hand, when the resin composition layer 11 is cured by heating because the boiling point of the plastic solvent is 210 ° C. or less, the plastic solvent is easily volatilized by the heating, so that the content of the plastic solvent in the hardened layer Is easy to lower enough.

  Specific examples of the plasticizing solvent include cyclohexanone (boiling point: 155.6 ° C.), dimethylformamide (boiling point: 153 ° C.), dimethyl sulfoxide (boiling point: 189.0 ° C.), ethers of ethylene glycol (cellosolve) (boiling point: And organic solvents such as ortho-xylene (boiling point: 144.4 ° C.) and the like.

(6) Other Components The resin composition in the present embodiment may further contain a plasticizer, a stabilizer, a tackifier, a colorant, a coupling agent, an antistatic agent, an antioxidant, and the like.

(7) Configuration of Resin Composition Layer The thickness of the resin composition layer 11 is 100 μm or more, preferably 105 μm or more, and particularly preferably 110 μm or more. When the thickness of the resin composition layer 11 is 100 μm or more and the resin composition layer 11 contains the plastic solvent at the above-described content, the resin composition layer 11 is less likely to be disintegrated, and , Excellent in following ability to electronic parts and the like. On the other hand, the thickness of the resin composition layer 11 is 300 μm or less, preferably 250 μm or less, and particularly preferably 200 μm or less. When the thickness of the resin composition layer 11 exceeds 300 μm, it is difficult to miniaturize and thin the semiconductor device manufactured using the resin sheet 1 according to the present embodiment. When the resin composition layer 11 is formed by laminating two or more resin composition layers, the thickness of the above resin composition layer 11 is the thickness of all the resin composition layers 11. The total thickness of the

  In the resin sheet 1 which concerns on this embodiment, it is preferable that the resin composition layer 11 consists of a single layer. Here, "consists of a single layer" means that the resin composition layer 11 is not formed by laminating a plurality of unit resin composition layers, and is composed of a single unit resin composition layer It means that. In particular, when the resin composition layer 11 is formed by applying a coating solution of a resin composition to form a coating film and then drying the coating film, the coating film is the coating solution. It means that it is formed by one-time coating. In the resin sheet 1 according to the present embodiment, when the resin composition layer 11 is formed of a single unit resin composition layer, compared to the case where the resin composition layer is formed by laminating a plurality of layers, It will be excellent in productivity. In addition, when a plurality of unit resin composition layers are laminated, there is a possibility that foreign matter or air bubbles may be caught during lamination, but such a phenomenon is caused by the resin composition layer 11 being formed of a single layer. It is possible to avoid the failure caused.

2. Release Sheet The resin sheet 1 according to the present embodiment may be provided with a release sheet 12. The configuration of the release sheet 12 is optional, and examples thereof include polyester films such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and plastic films such as polyolefin films such as polypropylene and polyethylene. It is preferable that the peeling process is given to these peeling surfaces (surface which contact | connects the resin composition layer 11 of the resin sheet 1). As a release agent used for peeling process, release agents, such as a silicone type, fluorine type, a long chain alkyl type, are mentioned, for example.

  The thickness of the release sheet 12 is not particularly limited, but is usually 20 μm or more and 250 μm or less.

3. Method of Producing Resin Sheet The resin sheet 1 according to the present embodiment is preferably produced by forming the resin composition layer 11 using the coating liquid of the resin composition described above, and in particular, the resin composition layer 11 It is preferable to form by coating the said coating liquid, forming a coating film, and drying the said coating film. For example, a coating liquid containing the above-described resin composition and optionally further solvent is prepared, and the coating liquid is coated on the release surface of the release sheet 12 to form a coating, and the coating It is preferable to produce the resin sheet 1 by drying.

  As a diluent for preparing a coating liquid, it is preferable to use also the plastic solvent which resin composition layer 11 mentioned above contains as a diluent. In this case, when drying the coating, it is preferable that the plasticizing solvent is left in the coating so that the resin composition layer 11 obtained is prepared so as to contain the plasticizing solvent having the content described above. As organic solvents other than those mentioned above as organic solvents suitably used for plasticizing solvents and preferably used as diluents, cyclohexane (boiling point: 80.7 ° C.), toluene (boiling point: 110.6 ° C.), ethyl acetate (ethyl acetate (boiling point: 110.6 ° C.) Boiling point: 77.1 ° C.), methyl ethyl ketone (boiling point: 79.6 ° C.), isopropyl alcohol (boiling point: 82.6 ° C.) and the like. The diluent may be used in combination of two or more components. The release sheet 12 may release as a process material, and may protect the resin composition layer 11 until it is used for sealing.

  As conditions for drying the formed coating film, the drying temperature is preferably 40 ° C. or more, particularly preferably 45 ° C. or more, and further preferably 50 ° C. or more. The drying temperature is preferably 130 ° C. or less, particularly preferably 125 ° C. or less, and further preferably 115 ° C. or less. The drying time is preferably 8 minutes or more, particularly preferably 10 minutes or more, and further preferably 11 minutes or more. The drying time is preferably 20 minutes or less, and more preferably 15 minutes or less. By drying under such conditions, the content of the plastic solvent in the resin composition layer 11 can be easily adjusted to the value described above. The coating may be dried while changing the drying temperature. For example, the drying time is set to 50 ° C., 70 ° C., 90 ° C. and 100 ° C., with the drying time being about 3 to 4 minutes for each temperature. It is preferable to sequentially raise and dry.

  Moreover, the resin sheet 1 which concerns on this embodiment forms a coating film by one coating of the coating liquid of the resin composition mentioned above, and is a resin composition which consists of a single layer by drying the said coating film. Preferably, the product layer 11 is formed and manufactured. When the resin composition layer 11 is formed as a single layer, the coating is formed by one application, and the coating is repeated by forming the resin composition layer 11 by drying the coating. It becomes possible to manufacture the resin sheet 1 by high productivity compared with the case where a coating film and the resin composition layer 11 are laminated in multiple layers. In addition, as described above, when the resin composition contains a polyvinyl acetal resin as a film-forming resin, the coating liquid has a relatively high viscosity, so the coating film is formed by one application as described above. It becomes easy to form and to form the thick resin composition layer 11.

  The coating described above includes a knife coating method, a die coating method, a bar coating method, a gravure coating method, a blade coating method, a roll kiss coating method and the like, and in particular, the knife coating method is preferably used. According to these coating methods, the thickness of the resin composition layer 11 can be easily formed to the above-described thickness.

  When coating is performed by a knife coating method, the coating speed is preferably 0.3 m / min or more, and particularly preferably 0.5 m / min or more. Further, the speed is preferably 30 m / min or less, and particularly preferably 15 m / min or less. By setting it as such a coating speed, it becomes easy to form the resin composition layer 11 into a thick film.

  Moreover, as a manufacturing method of the laminated body by which the peeling sheet was each laminated | stacked on both surfaces of the resin sheet 1, a coating liquid is coated on the peeling surface of one peeling sheet, a coating film is formed, and this is dried. After forming a laminate comprising the resin composition layer 11 and one release sheet, the surface of the resin composition layer 11 of the laminate opposite to the one release sheet is attached to the release surface of the other release sheet. Thus, the resin sheet 1 having a configuration of one release sheet / resin composition layer 11 / other release sheet can be obtained. In this case, at least one of the release sheets may be released as a process material, or the resin composition layer 11 may be protected until used for sealing.

  When the resin composition layer 11 is obtained by laminating a plurality of layers, the resin composition layer obtained by the above method is used as a unit resin composition layer, and a plurality of the resin composition layers are laminated to form a resin composition. The layer 11 may be obtained. In this case, there is an advantage that a thick resin composition layer 11 can be obtained by the amount of laminated unit resin composition layers.

4. Method of Using Resin Sheet The resin sheet 1 according to the present embodiment is used to seal an electronic component in a method of manufacturing a semiconductor device. For example, after laminating the resin composition layer 11 in the resin sheet 1 on an electronic component provided on a substrate or a temporary fixing material such as an adhesive sheet, the resin composition layer 11 is cured to form a cured layer. Thus, the electronic component can be sealed.

  The resin sheet 1 according to the present embodiment is preferably stored under refrigeration for substantially all or part of the period from production to use. Refrigerated storage can prevent the reaction of the curable resin contained in the resin composition layer 11 from proceeding. In addition, volatilization of the plastic solvent during storage can be suppressed. Cold storage is preferably performed at 15 ° C. or less, more preferably 0 to 12 ° C.

  In the resin sheet 1 according to the present embodiment, the resin composition layer 11 has the above-described range, and the resin composition layer 11 contains the plastic solvent in the above-described content, whereby the resin composition layer 11 is obtained. It becomes difficult for the resin composition layer to break or break in storage, transport, use and the like. Furthermore, the periphery of the electronic component can be sufficiently covered by the resin composition layer 11, and the formation of the void between the cured layer formed by curing the resin composition layer 11 and the electronic component can be well suppressed. it can. As described above, by using the resin sheet 1 according to the present embodiment, a semiconductor device of excellent quality can be manufactured.

  When the resin composition contains a thermosetting resin, the curing described above is preferably performed by heating the resin composition layer 11. Since the resin composition layer 11 in the present embodiment is formed of a resin composition containing a thermosetting resin, it can be favorably cured by heating. Moreover, since it becomes easy to volatilize the plastic solvent in the resin composition layer 11 by the said heating, the cured layer which the resin composition layer 11 hardens | cures becomes a thing which does not contain a plastic solvent substantially. Therefore, in the semiconductor device provided with the above-mentioned hardened layer manufactured using resin sheet 1 concerning this embodiment, the bad influence by plastic solvent does not arise. The heating temperature is preferably 100 ° C. or higher, and more preferably 120 ° C. or higher. Further, the temperature is preferably 240 ° C. or less, and particularly preferably 200 ° C. or less. Further, the heating time is preferably 15 minutes or more, and particularly preferably 20 minutes or more. Further, the time is preferably 300 minutes or less, and more preferably 100 minutes or less.

  Moreover, it is preferable to perform hardening of the resin composition layer 11 by the heating mentioned above in multiple steps by heat processing. The heating in this case is preferably performed in two or more separate steps, and in particular, a first heat treatment to be thermally cured at a temperature T1 and a second heat treatment to be thermally cured at a temperature T2 higher than the temperature T1. It is more preferable that the heat treatment be performed by a two-stage heating process. In this case, in the first heat treatment, the temperature T1 is preferably 100 ° C. or more and 130 ° C. or less, and the heat treatment time is preferably 15 minutes or more and 60 minutes or less. In the second heat treatment, the temperature T2 is preferably 150 ° C. or more and 220 ° C. or less, and the heat treatment time is preferably 30 minutes or more and 120 minutes or less.

When the resin composition contains an energy ray curable resin, curing of the resin composition layer 11 may be performed by irradiation of energy rays, for example, irradiation of ultraviolet rays. When ultraviolet light is irradiated, the conditions are usually an illuminance of about 50 to 500 mW / cm ² and an irradiation amount of about 100 to 2,500 mJ / cm ² . In this case, after the electronic component is laminated by the resin composition layer, a heating step for volatilizing the plastic solvent in the resin composition layer 11 may be performed before or after curing of the resin composition layer 11.

  When the resin sheet 1 which concerns on this embodiment equips only the single side | surface side of the resin composition layer 11 with the peeling sheet 12, the said peeling sheet 12 is a resin composition layer, after laminating the resin composition layer 11 on an electronic component. Peeling may be performed from the resin composition layer 11 before curing 11. Alternatively, after curing the resin composition layer 11, peeling may be performed from the formed curing layer. When the resin sheet 1 according to the present embodiment includes release sheets on both sides of the resin composition layer 11, one release sheet is released, and the exposed surface of the exposed resin composition layer 11 is laminated on the electronic component. The other release sheet may be released before or after curing of the resin composition layer 11.

  It is preferable that the manufacturing method of the semiconductor device mentioned above includes the process of making alkaline solution contact at least one part of the surface of the hardened layer formed by hardening | curing the resin composition layer 11. As shown in FIG. Preferably, the method of manufacturing a semiconductor device described above includes the step of plating at least a part of the surface of the cured layer formed by curing the resin composition layer 11. In the resin sheet 1 according to the present embodiment, when the resin composition contains a polyvinyl acetal resin as a film-forming resin and also contains an inorganic filler, as described above, the matrix component present around the inorganic filler in the hardened layer is alkaline. It becomes difficult to elute in the solution, and minute unevenness is present on the surface of the hardened layer by appropriately desorbing the inorganic filler, so that the anchor effect of plating on the surface of the hardened layer is good. Thus, the fixability of the plating in the hardened layer is excellent. Therefore, the resin sheet 1 in which the resin composition contains a polyvinyl acetal resin as a film-forming resin is suitable for use in the manufacturing method including the step of contacting an alkaline solution and the step of performing a plating treatment as described above.

  As an example of the manufacturing method including the step of contacting the alkaline solution described above and the step of performing the plating treatment described above, there is a method of manufacturing a component-embedded substrate as a semiconductor device. In the method for manufacturing a component-embedded substrate, for example, first, after laminating the resin composition layer 11 in the resin sheet 1 on the electronic component provided on the substrate, the resin composition layer 11 is cured to form a cured layer. Form Next, when the release sheet 12 is laminated on the cured layer, after the release sheet 12 is removed, the cured layer and the electronic component are viewed from the side of the cured layer opposite to the presence of the electronic component. And a hole that reaches the surface of the hardened layer on the side where the electronic component exists. Subsequently, in the step of bringing the alkaline solution into contact, the laminate of the hole-formed hardened layer, the electronic component, and the base material is brought into contact with the alkaline solution. By this treatment, the smear generated when the hole is formed is removed from the inside of the hole (desmear treatment). Subsequently, as a step of performing the above-described plating process, formation of a wiring is performed. Specifically, a plating process using a metal such as copper is performed on the surface of the hardened layer on which the holes are formed, the metal is embedded in the holes, and then an unnecessary portion of the plated metal is etched. It is possible to form the wiring as a remaining metal piece by removing it by the like. Thereafter, a multilayer substrate is formed on both surfaces of the hardened layer by a build-up method or the like, and upon completion of the formation of the wiring, a component-embedded substrate is obtained.

  It will not specifically limit, if it is an electronic component generally made into the object of sealing as an example of the electronic component mentioned above, For example, a semiconductor chip, a capacitor | condenser, etc. are mentioned. Moreover, as a semiconductor device manufactured, a component built-in substrate, a semiconductor package, etc. are mentioned, It is preferable that it is especially a component built-in substrate.

  The embodiments described above are described to facilitate the understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents that fall within the technical scope of the present invention.

  Hereinafter, the present invention will be described in more detail by showing Examples and Test Examples, but the present invention is not limited to the following Test Examples and the like.

Example 1 and Comparative Examples 1 and 2
The components shown in Table 1 were mixed and diluted with methyl ethyl ketone to obtain a coating liquid of a resin composition having a solid content concentration shown in Table 1. Obtained by coating the coating liquid on a release surface of a release film (product name: “PET 38 AL-5 *” manufactured by Lintec Corporation, product name “PET 38 AL-5 *”), one side of which was subjected to silicone release treatment, using a knife coater under the following conditions The resin coating layer was formed by drying the coated film under the following conditions. Thereafter, a second peelable film (manufactured by Lintec Corporation, product name "SP-PET 381031") is laminated on the surface of the resin composition layer not in contact with the peelable film, and the resin composition layer and two peelable sheets And a resin sheet comprising In addition, as described later, the inorganic filler is blended in the coating liquid of the resin composition in a state of being dispersed in cyclohexanone or methyl ethyl ketone as a dispersion medium. The dispersion medium remains in the resin sheet even after the formation of the resin sheet. Here, the compounding amount of the inorganic filler in Table 1 is one in which only the content of the inorganic filler is reflected, and the content of the above-mentioned dispersion medium is not reflected.
<Coating conditions using a knife coater>
Coating speed: 0.6 m / min Coating gap: 700 μm in Example 1 and Comparative Example 1, 320 μm in Comparative Example 2
<Drying conditions>
Drying temperature: 50 ° C → 70 ° C → 90 ° C → 100 ° C
Drying time: 3 minutes 20 seconds for each temperature

Here, the details of the components shown in Table 1 are as follows.
[Thermosetting resin]
Bis A type epoxy resin: Bisphenol A type epoxy resin (Mitsubishi Chemical Corporation, product name "YL 980")
Biphenyl type epoxy resin: Biphenyl type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., product name "NC-3000-L")
Naphthalene type epoxy resin: Naphthalene type epoxy resin (manufactured by DIC, product name "HP-6000")
Biphenyl-type phenolic resin: Biphenyl-type phenolic resin (manufactured by Meiwa Chemical Co., Ltd., product name "MEHC-7851-SS")
[Film forming resin]
Polyvinyl acetal resin: Polyvinyl acetal resin (manufactured by Sekisui Chemical Co., Ltd., product name "BX-5", weight average molecular weight: 130,000)
[Curing catalyst]
Imidazole-based thermosetting catalyst: 2-ethyl-4-methylimidazole (manufactured by Shikoku Kasei Co., Ltd., product name "2E4MZ")
[Inorganic filler]
Epoxysilane-treated silica filler: silica filler (manufactured by Admatex, product name "SO-C2", average particle diameter: 0.5 μm, maximum particle diameter: 2 μm, shape: spherical), 3-glycidoxypropyltrimethoxy Surface-treated using silane (Shin-Etsu Chemical Co., Ltd., product name “KBM-403”, minimum coverage area: 330 m ² / g). In Example 1 and Comparative Example 2, the one dispersed in cyclohexanone is blended with the coating liquid of the resin composition, and in Comparative Example 1, the one dispersed in methyl ethyl ketone is the coating liquid of the resin composition. Formulated into

Test Example 1 (Measurement of Thickness of Resin Composition Layer)
The thickness of the resin sheet produced in the example and the comparative example was measured using a constant pressure thickness measuring instrument (manufactured by Techlock, product name "PG-02J"), and the thickness of the release film was determined from the obtained measurement value. The thickness (μm) of the resin composition layer was calculated by subtracting the thickness. The results are shown in Table 1.

[Test Example 2] (Measurement of plastic solvent in resin composition layer)
After cutting the resin sheet manufactured by the Example and the comparative example into the size of 10 mm x 50 mm, the resin composition layer obtained by peeling a release sheet was made into the measurement sample. The measurement sample is sealed in a measurement vial, heated at 120 ° C. for 30 minutes, the generated gas is introduced into a gas chromatograph (product name “GC-2010” manufactured by SHIMAZU Co., Ltd.), and the amount of the generated gas is measured did. The said amount was made into residual solvent amount (content of the plastic solvent which has cyclohexanone as a main component) (mass%). The results are shown in Table 1.

[Test Example 3] (Evaluation of Collapse of Resin Composition Layer)
About the resin sheet manufactured by the Example and the comparative example, the resin composition layer was confirmed by visual observation, and it evaluated about disintegration of the resin composition layer based on the following references | standards.
Good: No breakage or breakage of the resin composition layer occurred.
X: At least one of breakage and breakage of the resin composition layer has occurred.

[Test Example 4] (Evaluation of Conformability of Resin Composition Layer)
Using a vacuum laminator (product name: “V130”, manufactured by Nikko Materials, Inc.) for a 2 mm × 2 mm semiconductor chip (50 μm thick) fixed on a glass plate, obtained in Examples and Comparative Examples The surface of the resin composition layer side in the prepared resin sheet was laminated. Subsequently, the resin composition layer was heated at 100 ° C. for 60 minutes and further heated at 170 ° C. for 60 minutes to be cured to form a cured layer. Then, the presence or absence of the space | gap between the said hardened layer and a semiconductor chip was confirmed visually through the glass plate, and the followability of the resin composition layer was evaluated based on the following references | standards. The results are shown in Table 1. In addition, about the comparative example 1, since evaluation of collapse of a resin composition layer was unsatisfactory, this test was not implemented.
○: There were no bubbles or floats.
X: There was at least one of air bubbles and floating.

  As mentioned above, while the collapse of the resin composition layer was controlled, the resin sheet obtained by the example was excellent in the flattery nature of a resin composition layer.

  The resin sheet according to the present invention can be suitably used for the production of a semiconductor device such as a component built-in substrate.

1 ... resin sheet 11 ... resin composition layer 12 ... release sheet

Claims (9)

A resin sheet used for sealing an electronic component in a method of manufacturing a semiconductor device,
The resin sheet comprises a curable resin composition layer,
The resin composition layer is formed of a resin composition containing a curable resin,
The thickness of the resin composition layer is 100 μm or more and 300 μm or less,
The resin sheet characterized in that the resin composition layer contains a plastic solvent which volatilizes by heating at a content of 1.0% by mass or more and 5.0% by mass or less.   The resin sheet according to claim 1, wherein the resin composition layer comprises a single layer. The resin composition contains a film-forming resin and an inorganic filler,
The resin sheet according to claim 1, wherein the film-forming resin is substantially free of a resin having an ester bond. The resin sheet according to claim 3, wherein the inorganic filler is surface-treated with a surface treatment agent having a minimum covering area of less than 550 m ² / g.   The method for manufacturing a semiconductor device according to any one of claims 1 to 4, further comprising the step of plating at least a part of the surface of a cured layer formed by curing the resin composition layer. The resin sheet as described in a term.   The resin sheet according to any one of claims 1 to 5, wherein the semiconductor device is a component built-in substrate. A method of manufacturing a resin sheet used for sealing an electronic component in a method of manufacturing a semiconductor device, comprising:
The resin sheet comprises a curable resin composition layer,
The resin composition layer is formed of a resin composition containing a curable resin,
The thickness of the resin composition layer is 100 μm or more and 300 μm or less,
The resin composition layer contains a plastic solvent that volatilizes by heating at a content of 1.0 mass% or more and 5.0 mass% or less,
The manufacturing method is characterized by comprising a step of applying a coating liquid of the resin composition to form a coating, and a step of forming the resin composition layer by drying the coating. Manufacturing method of resin sheet. The coating film is formed by a single application of a coating liquid of the resin composition,
The method for producing a resin sheet according to claim 7, comprising forming the resin composition layer consisting of the single layer according to claim 2 by drying the coating film.   The coating liquid of the said resin composition contains the diluent whose boiling point is 130 degreeC or more, The manufacturing method of the resin sheet of Claim 7 or 8 characterized by the above-mentioned.

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