JP2019066348A - Test equipment of electronic component and test method - Google Patents

Abstract

The present application discloses a test device and a test method of an electronic component capable of shortening a test period while maintaining the reliability of a thermal cycle test. A test apparatus for electronic components disclosed in the present application includes a temperature monitoring unit that monitors the temperature of the electronic components, a nozzle switching unit that alternately directs a heating nozzle from which warm air blows out and a cooling nozzle from which cold air blows to the electronic components. And a nozzle distance adjustment unit configured to adjust a distance between the heating nozzle and the cooling nozzle and the electronic component such that the temperature of the electronic component obtained by the temperature monitoring unit maintains a predetermined temperature gradient. [Selected figure] Figure 3

Description

  The present application relates to a test apparatus and test method for electronic components.

  Various apparatuses have been proposed as apparatuses for testing electronic components (see, for example, Patent Documents 1 to 4).

JP, 2008-309504, A JP 2007-183126 A JP, 2002-174577, A Japanese Patent Application Laid-Open No. 61-236134

There are various solder joints in electronic components. For example, BGA (Ball Grid Array)
The package is bonded to the printed circuit board through solder balls arranged in rows and columns. And the thermal stress by heat_generation | fever of the electronic component in action | operation is added to the junction part of an electronic component. Therefore, in the development of the electronic device, the electronic component to be evaluated is repeatedly heated and cooled to observe the state of the bonding portion, and a thermal cycle test or the like for confirming the reliability of the electronic component is performed.

  As a method of repeatedly heating and cooling an electronic component, for example, a method of alternately blowing cold air and warm air from a nozzle facing the electronic component, and a method of repeatedly turning on and off a heater brought into contact with the electronic component Conceivable. Then, when it is desired to complete the thermal cycle test in a short time, switching between heating and cooling is frequently repeated in a short time. However, electronic components have an acceptable design temperature gradient. Therefore, in order to enable switching between heating and cooling in a short time, realization of heating and cooling within a range that does not deviate from an acceptable design temperature gradient is desired. However, it is difficult to adjust the temperature of the electronic component as quickly as possible without departing from the design temperature gradient by controlling the temperature of the air flow blown out from the nozzle or controlling the energization of the heater in contact with the electronic component. The

  Thus, the present application discloses a test apparatus and a test method of an electronic component capable of shortening the test period while maintaining the reliability of the thermal cycle test.

  The present application discloses a test apparatus for the following electronic components. That is, the test apparatus of the electronic component disclosed in the present application includes a temperature monitoring unit that monitors the temperature of the electronic component, a nozzle switching unit that alternately directs a heating nozzle from which warm air blows and a cooling nozzle from which cold wind blows to the electronic component, And a nozzle distance adjustment unit that adjusts a distance between the heating nozzle and the cooling nozzle and the electronic component such that the temperature of the electronic component obtained by the monitoring unit maintains a predetermined temperature gradient.

  In one aspect, the present invention can shorten the test period while maintaining the reliability of the thermal cycle test.

FIG. 1 is an external perspective view of a test apparatus for testing an electronic component. FIG. 2 is an internal structural view of the test apparatus. FIG. 3 is a system configuration diagram of a test apparatus. FIG. 4 is a diagram showing a flowchart of operation contents implemented in the test apparatus. FIG. 5 is a view showing the movement of the nozzle. FIG. 6 is a diagram showing the temperature change of the electronic component. FIG. 7 is a view showing a comparative example of the temperature change of the electronic component. FIG. 8 is a graph showing the number of breaking cycles in this verification. FIG. 9 is a view showing a fracture state of a joint portion observed in an example in the present verification. FIG. 10 is a diagram showing the fracture state of the joint portion observed in the example in the present verification and the fracture state of the joint portion observed in the comparative example. FIG. 11 is a view showing the movement of the nozzle in the present modification. FIG. 12 is a diagram showing a temperature distribution of the electronic component during a period in which the upper surface of the electronic component is heated and the lower surface of the electronic component is cooled. FIG. 13 is a view showing a modified example of the test apparatus.

  Hereinafter, embodiments will be described. The embodiments shown below are merely examples, and the technical scope of the present disclosure is not limited to the following aspects.

  FIG. 1 is an external perspective view of a test apparatus 1 for testing an electronic component. The test apparatus 1 is an apparatus that performs a thermal cycle test that repeats heating and cooling of an electronic component to be tested. Therefore, the test apparatus 1 adopts a form in which the electronic component to be tested and other devices are incorporated in the rectangular case 2 so that the temperature of the electronic component to be tested changes appropriately. And in the case 2, the door for mounting the electronic component of test object on the support table 3 or checking an internal apparatus is provided in the front. The test apparatus 1 performs heating and cooling of the electronic components set on the support table 3 by the temperature control mechanisms 4U and 4B.

  FIG. 2 is an internal structural view of the test apparatus 1. The temperature control mechanism 4U heats and cools the electronic component set on the support table 3 from the upper surface side. Further, the temperature control mechanism 4B heats and cools the electronic component set on the support table 3 from the lower surface side. The temperature control mechanism 4U and the temperature control mechanism 4B are both mechanisms for blowing warm air or cold air onto the electronic components set on the support table 3 to heat or cool the electronic components, so some degree of vertical adjustment is possible. It has dimensions. Therefore, the test apparatus 1 has the support table 3 near the center in the vertical direction in the housing 2, arranges the temperature adjustment mechanism 4 U on the upper side of the support table 3, and lowers the temperature on the lower side of the support table 3. It has a structure in which the adjustment mechanism 4B is disposed. Further, the test apparatus 1 is provided on the exterior surface of the housing 2 with a control unit 5 responsible for receiving an input operation, displaying a screen, and performing various controls.

  FIG. 3 is a system configuration diagram of the test apparatus 1. The temperature adjustment mechanism 4U is controlled by the control unit 5 through the upper surface X-axis Z-axis drive unit 6U, the upper surface heating air control unit 7U1, and the upper surface cooling air control unit 7U2. The temperature adjustment mechanism 4B is controlled by the control unit 5 through the lower surface X-axis Z-axis drive unit 6B, the lower surface heating air control unit 7B1, and the lower surface cooling air control unit 7B2. Control unit 5 controls temperature adjustment mechanism 4U based on temperature data obtained from upper surface temperature monitoring unit 8U that monitors the temperature on the upper surface side of electronic component CH mounted on wiring board PT set on support table 3. Control. Further, the control unit 5 controls the temperature adjustment mechanism 4B based on temperature data obtained from the lower surface temperature monitoring unit 8B that monitors the temperature on the lower surface side of the electronic component CH mounted on the wiring substrate PT.

The temperature control mechanism 4U has a heating air unit 4U3 provided with a heating nozzle 4U5 from which warm air blows out, and a cooling air unit 4U6 provided with a cooling nozzle 4U8 from which cold air blows out in the lateral direction (X-axis direction). It has an X-axis air cylinder 4U1 that slides by a movement amount. The temperature control mechanism 4U also has a Z-axis motor 4U2 that raises and lowers the X-axis air cylinder 4U1 supporting the heating air unit 4U3 and the cooling air unit 4U6 in the vertical direction (Z-axis direction) to an arbitrary position. The heating air unit 4U3 is fixed to the X axis air cylinder 4U1 via the Z axis air cylinder 4U4. Further, the cooling air unit 4U6 is fixed to the X-axis air cylinder 4U1 via the Z-axis air cylinder 4U7. Therefore, the heating nozzle 4U5 and the cooling nozzle 4U8 can move up and down with a fixed amount of movement with respect to the X-axis air cylinder 4U1.

  The X-axis air cylinder 4U1, the Z-axis motor 4U2 and the Z-axis air cylinders 4U4 and 4U7 are connected to the control unit 5 via the upper surface X-axis and Z-axis drive unit 6U that supplies compressed air for driving and driving power for the servomotor. It is controlled. Therefore, the temperature adjustment mechanism 4U can switch the nozzle directed to the electronic component CH by the X-axis air cylinder 4U1. Further, the temperature control mechanism 4U brings the nozzle facing the electronic component CH closer to the opening of the shield plate 4U9 covering the wiring substrate PT on which the electronic component CH is mounted with the Z axis air cylinders 4U4 and 4U7, or The nozzles not facing the electronic component CH can be separated from the shielding plate 4U9 by the Z-axis air cylinders 4U4 and 4U7. Further, the temperature adjustment mechanism 4U can finely adjust the distance between the nozzle facing the electronic component CH and the electronic component CH with the Z-axis motor 4U2.

  The warm air blown out from the heating nozzle 4U5 is blown from the upper surface heating air control unit 7U1. Further, the cold air blown out from the cooling nozzle 4U8 is blown from the upper surface cooling air control unit 7U2. The top heating air control unit 7U1 and the top cooling air control unit 7U2 perform the blowing at a constant temperature during the heat cycle test by the test apparatus 1 because the test apparatus 1 is an apparatus that performs the heat cycle test of the electronic component CH at high speed. Continue with air volume.

  The temperature control mechanism 4B is basically the same as the temperature control mechanism 4U. That is, the temperature adjustment mechanism 4B includes a heating air unit 4B3 having a heating nozzle 4B5 at its tip, Z-axis air cylinders 4B4, 4B7 for moving a cooling air unit 4B6 having a cooling nozzle 4B8 at its tip, and an X-axis air cylinder 4B1. , Z-axis motor 4B2 is provided. The X-axis air cylinders 4B1 and 4B2, the Z-axis air cylinder 4B4, the Z-axis air cylinder 4B7, and the Z-axis motor 4B2 are controlled by the control unit 5 via the lower surface X-axis and Z-axis drive unit 6B. The warm air blown out from the heating nozzle 4B5 is blown from the lower surface heating air control unit 7B1, and the cold air blown out from the cooling nozzle 4B8 is blown from the lower surface cooling air control unit 7B2.

  Hereinafter, the operation contents realized in the test apparatus 1 will be described. FIG. 4 is a diagram showing a flowchart of the operation contents implemented in the test apparatus 1. Hereinafter, the operation contents realized in the test apparatus 1 will be described along the flowchart shown in FIG.

  When the wiring board PT on which the electronic component CH is mounted is set on the support table 3 and the start of the test is requested in the operation of the control unit 5, the control unit 5 defines the heating nozzles 4U5, 4B5 and the cooling nozzles 4U8, 4B8 The temperature control mechanisms 4U and 4B are controlled so as to be at the initial position of (S101). Then, the control unit 5 sends warm air to the upper surface heating air control units 7U1 and 7B1, and sends cold air to the upper surface cooling air control units 7U2 and 7B2 (S102).

  The control unit 5 monitors the temperature gradient of the electronic component CH which is changing in temperature due to the warm air or the cold air by the upper surface temperature monitoring unit 8U and the lower surface temperature monitoring unit 8B, and corresponds to the temperature gradient of the upper surface temperature monitoring unit 8U. Control of the temperature adjustment mechanism 4U and control of the temperature adjustment mechanism 4B according to the temperature gradient of the lower surface temperature monitoring unit 8B are performed.

  That is, in the case of control related to the temperature adjustment mechanism 4U, the control unit 5 determines that the temperature gradient of the electronic component CH obtained by the upper surface temperature monitoring unit 8U is determined for the electronic component CH. It is determined whether or not the "predetermined temperature gradient" in the above is underestimated (S103). For example, if the design temperature gradient defined for the electronic component CH is 4 ° C., it is determined whether the temperature gradient of the electronic component CH obtained by the upper surface temperature monitoring unit 8U is smaller than 4 ° C. When the controller 5 makes an affirmative determination in the process of step S103, the controller 5 moves the X-axis air cylinder 4U1 downward by the Z-axis motor 4U2 to bring the nozzle closer to the electronic component CH (S104). In addition, when the control unit 5 makes a negative determination in the process of step S103, the temperature gradient in design in which the temperature gradient of the electronic component CH obtained by the upper surface temperature monitoring unit 8U is determined for the electronic component CH. It is judged whether or not it is excessive with respect to (S105). When the controller 5 makes an affirmative determination in the process of step S105, the controller 5 moves the X-axis air cylinder 4U1 upward by the Z-axis motor 4U2 to move the nozzle away from the electronic component CH (S106).

  The determination of the temperature gradient in step S103 is performed based on the absolute value of the rate of change of temperature. Thus, for example, if it is determined in step S103 that the temperature gradient is too small during heating of the electronic component CH, the heating nozzle 4U5 is brought close to the electronic component CH in step S104 so that the temperature rise rate of the electronic component CH increases. The heating amount of the electronic component CH increases. Also, for example, if it is determined in step S103 that the temperature gradient is too small during cooling of the electronic component CH, the cooling nozzle 4U8 is brought close to the electronic component CH in step S104 so that the temperature drop rate of the electronic component CH increases. The amount of cooling of the electronic component CH is increased. Also, for example, if it is determined in step S105 that the temperature gradient is excessive during heating of the electronic component CH, the heating nozzle 4U5 is moved away from the electronic component CH in step S106 so that the temperature rise rate of the electronic component CH decreases. The amount of heating of the electronic component CH decreases. Also, for example, if it is determined in step S105 that the temperature gradient is excessive during cooling of the electronic component CH, the cooling nozzle 4U8 is moved away from the electronic component CH in step S106 so that the temperature drop rate of the electronic component CH decreases. The amount of cooling of the electronic component CH decreases.

  The temperature control mechanism 4B is also similar to the temperature control mechanism 4U. That is, in the case of control related to temperature adjustment mechanism 4B, control unit 5 compares the temperature gradient of electronic component CH obtained by lower surface temperature monitoring unit 8B with the designed temperature gradient defined for electronic component CH. It is determined whether the amount is too small (S103). When the controller 5 makes an affirmative determination in the process of step S103, the controller 5 moves the X-axis air cylinder 4B1 upward by the Z-axis motor 4B2 to bring the nozzle closer to the electronic component CH (S104). In addition, when the control unit 5 makes a negative determination in the process of step S103, a temperature gradient in design in which the temperature gradient of the electronic component CH obtained by the lower surface temperature monitoring unit 8B is determined for the electronic component CH. It is judged whether or not it is excessive with respect to (S105). When the controller 5 makes an affirmative determination in the process of step S105, the controller 5 moves the X-axis air cylinder 4B1 downward by the Z-axis motor 4B2 to move the nozzle away from the electronic component CH (S106).

While executing the series of processes (S103 to S106), the control unit 5 determines whether the electronic component CH has reached a predetermined switching temperature (S107). Further, the control unit 5 determines whether the electronic component CH has a failure while executing the series of processes (S103 to S106) (S108). The determination as to whether or not the electronic component CH has a failure can be made based on, for example, the change in the electrical resistance value of the solder bump that electrically connects the electronic component CH and the wiring substrate PT. Then, during the period from when the test of the electronic component CH is started to when the positive determination is made in step S108, the control unit 5 sets the nozzle for directing the electronic component CH to the electronic component CH every time the electronic component CH reaches a predetermined switching temperature. Switching is performed (S109). That is, for example, while heating the electronic component CH with the heating nozzles 4U5 and 4B5, the control unit 5 has a predetermined high temperature side defined as a switching temperature when shifting from the heating process to the cooling process in the thermal cycle test of the electronic component CH. When the electronic component CH reaches the switching temperature, the temperature control mechanisms 4U and 4B execute the operation of switching the nozzles directed to the electronic component CH from the heating nozzles 4U5 and 4B5 to the cooling nozzles 4U8 and 4B8. Further, for example, while cooling the electronic component CH with the cooling nozzles 4U8 and 4B8, the control unit 5 has a predetermined low temperature side defined as a switching temperature when shifting from the cooling process to the heating process in the thermal cycle test of the electronic component CH. When the electronic component CH reaches the switching temperature, the temperature control mechanisms 4U and 4B execute the operation of switching the nozzles directed to the electronic component CH from the cooling nozzles 4U8 and 4B8 to the heating nozzles 4U5 and 4B5.

  That is, in the test apparatus 1, while the series of processes from step S103 to step S109 is repeatedly performed and the electronic component CH repeats temperature rise and temperature drop, the temperature of the electronic component CH rises with a constant temperature gradient. Feedback control is performed to repeat the temperature drop.

  FIG. 5 is a view showing the movement of the nozzle. In the test apparatus 1, for example, while the electronic component CH is being heated, adjustment of the distance between the heating nozzle 4U5, 4B5 and the electronic component CH is performed so that the temperature of the electronic component CH becomes constant. (See FIG. 5 (A)). Then, in the test apparatus 1, when step S109 is executed, first, the Z-axis air cylinders 4U4 and 4B4 operate to separate the heating nozzles 4U5 and 4B5 from the electronic component CH (see FIG. 5B). Next, the X-axis air cylinders 4U1 and 4B1 operate, and the heating nozzles 4U5 and 4B5 and the cooling nozzles 4U8 and 4B8 slide (see FIG. 5C). Next, the Z-axis air cylinders 4U7 and 4B7 operate, and the cooling nozzles 4U8 and 4B8 approach the electronic component CH (see FIG. 5D).

  In addition, since the temperature difference between the temperature of the air flow blown out from the nozzle and the electronic component CH is relatively large immediately after the switching of the nozzle, the temperature gradient of the electronic component CH may become excessive if the nozzle is not separated from the electronic component CH. There is. Therefore, immediately after the nozzle is switched, the Z-axis motor 4U2 raises the X-axis air cylinder 4U1 and returns it to the initial position so that the distance between the nozzle and the electronic component CH is at least about 50 mm, for example. It is preferable that the Z-axis motor 4B2 lowers the X-axis air cylinder 4B1 and returns it to the initial position.

  FIG. 6 is a diagram showing the temperature change of the electronic component CH. In the test device 1, feedback control is performed so that the electronic component CH repeats temperature rise and drop with a constant temperature gradient while the electronic component CH repeats temperature rise and temperature drop. Therefore, as shown in FIG. 6, for example, the electronic component CH repeats the temperature rise and the temperature drop with a constant temperature gradient between the high temperature side switching temperature and the low temperature side switching temperature.

  FIG. 7 is a view showing a comparative example of the temperature change of the electronic component CH. If feedback control for making the temperature gradient constant is not performed, the amount of heat that the electronic component CH takes away from the air flow is large immediately after the nozzle switching where the temperature difference between the temperature of the air flow blown out from the nozzle and the electronic component CH is relatively large. Therefore, as the line described as “comparative example” in the graph of FIG. 7 shows, the temperature gradient of the electronic component CH immediately after the nozzle switching becomes steep (see “part A” and “part B” in FIG. 7). ). Therefore, if the thermal cycle is made short to shorten the time required for the thermal cycle test, the test deviates from the actual use state of the electronic component CH beyond the upper limit of the temperature gradient defined in the design of the electronic component CH. Results may be obtained. In this respect, in the test apparatus 1, as the line described as “Example” in the graph of FIG. 7 shows, the temperature at which the electronic component CH is constant and the temperature at which the electronic component CH is constant are constant. Since feedback control as a gradient is performed, if the thermal cycle is shortened within the range that does not deviate from the upper limit of the temperature gradient specified in the design of the electronic component CH, feedback control is performed to make the temperature gradient constant. The time required for the thermal cycle test can be significantly shortened as compared with the case where the heat cycle test is not performed.

  According to trial calculations, the test apparatus 1 changes the temperature of the atmosphere in the tank storing the electronic component CH and changes the temperature of the electronic component CH in about 60/60 of the required time as compared to the case where the thermal cycle test is performed. It is estimated that it is possible to finish the thermal cycle test without departing from the upper limit of the temperature gradient defined in the design. For example, if feedback control to make the temperature gradient constant is not performed, a test that requires about 60 to 75 minutes in one cycle of high temperature and low temperature is performed in general 3000 cycles in the evaluation cycle of in-vehicle electronic devices In the case of a thermal cycle test from the start to the completion of the test, a test period of about 4.2 months to 5.2 months is required, which is a problem of product development. In this respect, in the test apparatus 1, it is possible to complete the thermal cycle test in about 60 times of the required time as compared to the case where feedback control for making the temperature gradient constant is not performed, so the test period is long Problem of product development caused by

<Verification>
Since the propriety of the result of the thermal cycle test performed using the test apparatus 1 was verified, the result is shown below. In this verification, a BGA (Ball Grid Array) in which solder balls are vertically and horizontally arranged at a pitch of 0.5 mm was used on a wiring board. Moreover, in this verification, the high temperature side switching temperature was 125 degreeC, and the low temperature side switching temperature was 30 degreeC. Further, in this verification, the fracture detection of the joint was performed based on the change in the electric resistance value between both ends of the daisy chain in which the solder balls joining the BGA and the wiring substrate are connected in series. And in this verification, the test result at the time of performing a thermal cycle test by the method of changing the atmosphere temperature in the tank which stored the test article in 45 minutes for 1 cycle is made into a comparative example, 1 cycle in the test apparatus 1 of embodiment. The test results in the case of conducting the heat cycle test at 43 seconds are taken as examples.

  FIG. 8 is a graph showing the number of breaking cycles in this verification. As shown in FIG. 8, in the present verification, the number of fracture cycles in the comparative example was 495, whereas in the example, the number of fracture cycles was 468, and in both cases the fracture of the joint occurred in the same number of cycles. occured. And in the comparative example, it is necessary to change the temperature in one cycle 45 minutes since the temperature change is made in 45 minutes in one cycle, while in the example it is changed in 43 seconds in one cycle, so it is joined It took only about 5.59 hours to break the part. That is, according to this verification, the embodiment using the test apparatus 1 is about 66.4 times faster than the comparative example in which the heat cycle test is performed by changing the atmosphere temperature in the tank storing the test product. It was confirmed that it was possible to finish the thermal cycling test.

  FIG. 9 is a view showing a fracture state of a joint portion observed in an example in the present verification. Moreover, FIG. 10 is the figure which put in order and showed the fracture condition of the junction part observed by the Example in this verification, and the fracture condition of the junction part observed by the comparative example. In this verification, it was confirmed that the fracture of the joint due to the thermal cycle occurs at the solder bump of the corner portion of the BGA. And it was confirmed that the fracture condition of the joined part observed in the example is the same as the fracture condition generated in the solder bump of the corner portion of the BGA in the comparative example. Therefore, from this verification, it was confirmed that the thermal cycle test of the example matches the fracture mode generated in the thermal cycle test of the comparative example.

<Modification 1>
In the above embodiment, heating and cooling are repeated from both the upper surface side and the lower surface side of the electronic component CH in order to obtain the same test result as the thermal cycle test performed by changing the atmosphere temperature in the tank. The temperature control mechanisms 4U and 4B were provided in the test apparatus 1. However, the test apparatus 1 is not limited to such a form. In the test apparatus 1, for example, one of the temperature control mechanisms 4U and 4B may be omitted.

<Modification 2>
Further, in the above embodiment, the temperature control mechanism 4U and the temperature control mechanism 4B simultaneously heat or cool the electronic component CH. However, the test apparatus 1 is not limited to such a form. In the test apparatus 1, for example, the temperature adjustment mechanism 4B cools the electronic component CH while the temperature adjustment mechanism 4U heats the electronic component CH, and the temperature adjustment mechanism 4U cools the electronic component CH while the temperature adjustment mechanism 4U cools the electronic component CH. The adjustment mechanism 4B may heat the electronic component CH.

  FIG. 11 is a view showing the movement of the nozzle in the present modification. For example, when the test apparatus 1 is operated as follows, the temperature control mechanism 4B cools the electronic component CH while the temperature control mechanism 4U heats the electronic component CH, and the temperature control mechanism 4U operates the electronic component CH. While cooling, the temperature control mechanism 4B can heat the electronic component CH. That is, in the present modification, the heating nozzle 4U5 and the electronic component are set such that the upper surface of the electronic component CH has a constant temperature increase rate while the upper surface of the electronic component CH is heated and the lower surface of the electronic component CH is cooled. Adjustment of the distance between CH and is performed, and adjustment of the distance between heating nozzle 4B5 and electronic component CH is performed so that the lower surface of electronic component CH has a constant temperature drop rate (FIG. 11 (A)). See). Then, in the test apparatus 1, when step S109 is executed, first, the Z-axis air cylinders 4U4 and 4B7 operate to separate the heating nozzle 4U5 and the cooling nozzle 4B8 from the electronic component CH (see FIG. 11B). . Next, the X-axis air cylinders 4U1 and 4B1 operate to slide the heating nozzles 4U5 and 4B5 and the cooling nozzles 4U8 and 4B8 (see FIG. 11C). Next, the Z-axis air cylinder 4U7 and the heating nozzle 4B5 operate, and the cooling nozzle 4U8 and the heating nozzle 4B5 approach the electronic component CH (see FIG. 11D). Then, while the upper surface of the electronic component CH is cooled and the lower surface of the electronic component CH is heated, the space between the cooling nozzle 4U8 and the electronic component CH is set so that the upper surface of the electronic component CH has a constant temperature drop rate. The adjustment of the distance is performed, and the adjustment of the distance between the heating nozzle 4B5 and the electronic component CH is performed so that the lower surface of the electronic component CH has a constant temperature increase rate.

  FIG. 12 is a diagram showing a temperature distribution of the electronic component CH during a period in which the upper surface of the electronic component CH is heated and the lower surface of the electronic component CH is cooled. During a period in which the upper surface of the electronic component CH is heated and the lower surface of the electronic component CH is cooled, the temperature of the electronic component CH gradually decreases from the upper surface to the lower surface. Therefore, in the present modification in which heating and cooling are alternately performed on the upper surface side and the lower surface side of the electronic component CH, the thermal contraction difference between the electronic component CH and the wiring substrate PT is increased, and bonding of the electronic component CH is performed. The load on the part can be increased. Therefore, according to this modification, it is possible to obtain a fracture mode which can not be realized by the thermal cycle test of the comparative example which is performed by changing the atmosphere temperature in the tank.

<Modification 3>
FIG. 13 is a view showing a modified example of the test apparatus 1. The test apparatus 1 can be modified, for example, as follows. That is, the test apparatus 1 may further include, for example, a heating mechanism 9 that heats the wiring board PT at an appropriate site different from the site where the electronic component CH is mounted. The heating mechanism 9 includes, for example, a light source 9A for emitting halogen light suitable as heating light, and a noncontact temperature sensor 9B such as a radiation thermometer for measuring the temperature of a portion irradiated by the light source 9A. Preferably, the amount of current supplied to the light source 9A is increased or decreased by feedback control so that the measured value 9B matches the set value. In the case of the test apparatus 1 provided with such a heating mechanism 9, the temperature of an arbitrary one or a plurality of places of the wiring substrate PT is kept constant to reproduce the temperature distribution during actual operation of the wiring substrate PT to be evaluated. In this state, it is possible to conduct a test in which the temperature load on the electronic component CH is added.

The present application includes the following supplementary matters.
(Supplementary Note 1)
A test apparatus for testing an electronic component to be tested, wherein
A temperature monitoring unit that monitors the temperature of the electronic component;
A nozzle switching unit that alternately directs a heating nozzle from which warm air blows and a cooling nozzle from which cold air blows to the electronic component;
A nozzle distance adjustment unit configured to adjust a distance between the heating nozzle and the cooling nozzle and the electronic component such that the temperature of the electronic component obtained by the temperature monitoring unit maintains a predetermined temperature gradient; ,
Testing equipment for electronic components.
(Supplementary Note 2)
The nozzle distance adjusting unit moves the heating nozzle or the cooling nozzle away from the electronic component when the temperature gradient of the electronic component obtained by the temperature monitoring unit exceeds the predetermined temperature gradient, and the temperature monitoring unit When the temperature gradient of the obtained electronic component falls below the predetermined temperature gradient, the heating nozzle or the cooling nozzle is brought close to the electronic component.
The test apparatus of the electronic component as described in appendix 1.
(Supplementary Note 3)
The electronic component is mounted on a wiring board,
The temperature monitoring unit, the nozzle switching unit, and the nozzle distance adjusting unit are respectively provided on both sides of the wiring board.
The test apparatus of the electronic component as described in Additional remark 1 or 2.
(Supplementary Note 4)
In the nozzle switching unit, the nozzle directed to the electronic component on one side of the wiring substrate and the nozzle directed to the electronic component on the other side of the wiring substrate are heated Switching the nozzles so as to alternate between the nozzles and the cooling nozzle,
The test apparatus of the electronic component as described in Additional remark 3.
(Supplementary Note 5)
The nozzle switching unit switches nozzles to be directed to the electronic component when the temperature of the electronic component obtained by the temperature monitoring unit reaches a predetermined switching temperature.
The test apparatus of the electronic component as described in any one of appendixes 1 to 4.
(Supplementary Note 6)
The nozzle switching unit switches a nozzle directed to the electronic component by a slide mechanism that slides the heating nozzle and the cooling nozzle in the lateral direction.
The nozzle distance adjustment unit adjusts the distance between the heating nozzle and the cooling nozzle and the electronic component by an elevating mechanism that raises and lowers the heating nozzle and the cooling nozzle in the vertical direction.
The test apparatus of the electronic component as described in any one of appendixes 1 to 5.
(Appendix 7)
The electronic component is covered with a shielding plate having an opening at a portion where the electronic component is disposed,
The nozzle switching unit moves a nozzle directed to the electronic component to the opening of the shielding plate, and moves a nozzle not directed to the electronic component to the side of the opening of the shielding plate.
The test apparatus of the electronic component as described in any one of appendixes 1 to 6.
(Supplementary Note 8)
The circuit board further comprises heating means for heating a portion of the wiring board different from the portion where the electronic component is mounted.
The test apparatus of the electronic component as described in any one of appendixes 1 to 7.
(Appendix 9)
A test method for testing an electronic component to be tested, comprising:
A nozzle switching step of alternately directing a heating nozzle from which warm air is blown and a cooling nozzle from which cold air is blown to the electronic component;
Adjusting the distance between the heating nozzle and the cooling nozzle and the electronic component such that the temperature of the electronic component maintains a predetermined temperature gradient.
Test method of electronic parts.
(Supplementary Note 10)
In the nozzle distance adjusting step, when the temperature gradient of the electronic component exceeds the predetermined temperature gradient, the heating nozzle or the cooling nozzle is moved away from the electronic component, and the temperature gradient of the electronic component indicates the predetermined temperature If it is less than the slope, the heating nozzle or the cooling nozzle is brought close to the electronic component.
The test method of the electronic component as described in appendix 9.
(Supplementary Note 11)
The electronic component is mounted on a wiring board,
The nozzle switching process and the nozzle distance adjusting process are performed on both sides of the wiring substrate.
The test method of the electronic component as described in Additional remarks 9 or 10.
(Supplementary Note 12)
In the nozzle switching step, the nozzle directed to the electronic component on one side of the wiring substrate and the nozzle directed to the electronic component on the other side of the wiring substrate are heated Switching the nozzles so as to alternate between the nozzles and the cooling nozzle,
The test method of the electronic component as described in appendix 11.
(Supplementary Note 13)
The nozzle switching step switches nozzles to be directed to the electronic component when the temperature of the electronic component reaches a predetermined switching temperature.
The test method of the electronic component according to any one of appendices 9 to 12.
(Supplementary Note 14)
In the nozzle switching step, a nozzle that is directed to the electronic component is switched by a slide mechanism that slides the heating nozzle and the cooling nozzle in the lateral direction.
In the nozzle distance adjusting step, a distance between the heating nozzle and the cooling nozzle and the electronic component is adjusted by an elevating mechanism for moving the heating nozzle and the cooling nozzle up and down.
The test method of the electronic component according to any one of appendices 9 to 13.
(Supplementary Note 15)
The electronic component is covered with a shielding plate having an opening at a portion where the electronic component is disposed,
In the nozzle switching step, a nozzle directed to the electronic component is moved to the opening of the shielding plate, and a nozzle not directed to the electronic component is moved to the side of the opening of the shielding plate.
The test method of the electronic component according to any one of appendices 9 to 14.
(Supplementary Note 16)
The method further comprises a heating step of heating a portion of the wiring board different from the portion where the electronic component is mounted.
The test method of the electronic component according to any one of appendices 9 to 15.

PT ·· Wiring board: CH · · Electronic parts: 1 · · Test equipment: 2 · · Housing: 3 · · Support table: 4 U, 4 B · · Temperature adjustment mechanism: 4 U 1, 4 B 1 · · X axis air cylinder: 4 U 2 , 4B2, .. Z-axis motor: 4U3, 4B3 .. heating air unit: 4U4, 4B4, 4U7, 4B7 .. Z-axis air cylinder: 4U5, 4B5 .. heating nozzle: 4U6, 4B6 .. cooling air unit: 4U8, 4B8 ··· Cooling nozzle: 4U9, 4B9 · · · Shield plate: 5 · · Control section: 6U · · Top surface X axis Z axis drive section: 7U1 · · Top surface heating air control section: 7U2 · · Top surface cooling air control section: 8U · · Top surface temperature monitoring unit: 6B · · Bottom surface X axis Z axis drive unit: 7B 1 · · Bottom surface heating air control unit: 7BB · · Bottom surface cooling air control unit: 8B · · Bottom surface temperature monitoring unit: 9 · · Heating mechanism: 9A. Light source: 9B ·· temperature sensor

Claims (9)

A test apparatus for testing an electronic component to be tested, wherein
A temperature monitoring unit that monitors the temperature of the electronic component;
A nozzle switching unit that alternately directs a heating nozzle from which warm air blows and a cooling nozzle from which cold air blows to the electronic component;
A nozzle distance adjustment unit configured to adjust a distance between the heating nozzle and the cooling nozzle and the electronic component such that the temperature of the electronic component obtained by the temperature monitoring unit maintains a predetermined temperature gradient; ,
Testing equipment for electronic components. The nozzle distance adjusting unit moves the heating nozzle or the cooling nozzle away from the electronic component when the temperature gradient of the electronic component obtained by the temperature monitoring unit exceeds the predetermined temperature gradient, and the temperature monitoring unit When the temperature gradient of the obtained electronic component falls below the predetermined temperature gradient, the heating nozzle or the cooling nozzle is brought close to the electronic component.
The test apparatus of the electronic component of Claim 1. The electronic component is mounted on a wiring board,
The temperature monitoring unit, the nozzle switching unit, and the nozzle distance adjusting unit are respectively provided on both sides of the wiring board.
The test apparatus of the electronic component of Claim 1 or 2. In the nozzle switching unit, the nozzle directed to the electronic component on one side of the wiring substrate and the nozzle directed to the electronic component on the other side of the wiring substrate are heated Switching the nozzles so as to alternate between the nozzles and the cooling nozzle,
The test apparatus of the electronic component of Claim 3. The nozzle switching unit switches nozzles to be directed to the electronic component when the temperature of the electronic component obtained by the temperature monitoring unit reaches a predetermined switching temperature.
The test apparatus of the electronic component as described in any one of Claims 1-4. The nozzle switching unit switches a nozzle directed to the electronic component by a slide mechanism that slides the heating nozzle and the cooling nozzle in the lateral direction.
The nozzle distance adjustment unit adjusts the distance between the heating nozzle and the cooling nozzle and the electronic component by an elevating mechanism that raises and lowers the heating nozzle and the cooling nozzle in the vertical direction.
The test device of the electronic component according to any one of claims 1 to 5. The electronic component is covered with a shielding plate having an opening at a portion where the electronic component is disposed,
The nozzle switching unit moves a nozzle directed to the electronic component to the opening of the shielding plate, and moves a nozzle not directed to the electronic component to the side of the opening of the shielding plate.
The test apparatus of the electronic component as described in any one of Claims 1-6. The circuit board further comprises heating means for heating a portion of the wiring board different from the portion where the electronic component is mounted.
The test apparatus of the electronic component as described in any one of Claims 1-7. A test method for testing an electronic component to be tested, comprising:
A nozzle switching step of alternately directing a heating nozzle from which warm air is blown and a cooling nozzle from which cold air is blown to the electronic component;
Adjusting the distance between the heating nozzle and the cooling nozzle and the electronic component such that the temperature of the electronic component maintains a predetermined temperature gradient.
Test method of electronic parts.

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