JP2019050432A - Light transmitting member, method for manufacturing the same, light emitting device, and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a translucent member which realizes even better chromaticity and color reproducibility by a simple method, a method for manufacturing the same, and a light emitting device and a method for manufacturing the same. A light-transmitting member including a light-reflecting sheet having a through-hole and a color-converting material layer made of a color-converting material and a cured translucent resin in the through-hole. For this translucent member, a sheet is prepared, a through hole is formed in the sheet, the sheet is provided with a light reflection function, and the through hole is filled with a translucent resin containing a color conversion material and cured. It can be produced by forming a color conversion material layer. Further, a light emitting device provided with such a translucent member. [Selection diagram] FIG. 1B

Description

  The present invention relates to a translucent member and a method of manufacturing the same, and a light emitting device and a method of manufacturing the same.

2. Description of the Related Art With the improvement of the quality of light emitting diodes in recent years, they are used in various forms in general lighting field, in-vehicle lighting field and the like.
For example, as a light emitting device, a light emitting device in which a circuit board is integrated is proposed, and further downsizing and thinning are further achieved.
Further, by using a light emitting diode realizing high output, high luminance and the like in combination with various color conversion materials, improvement in chromaticity and color reproducibility is achieved (Patent Documents 1 to 4).

JP 2012-119407 A Japanese Patent Application Publication No. 2012-527742 JP, 2013-197279, A WO2008 / 044759

However, achieving both chromaticity and color reproducibility while achieving downsizing and thinning has become increasingly difficult in recent years in which there is a tendency for opportunities for using weak color conversion materials to increase.
The present invention provides a light transmitting member that achieves better chromaticity and color reproducibility by a simple method while maintaining miniaturization and thinning, a method of manufacturing the same, a light emitting device, and a method of manufacturing the same. With the goal.

The present application includes the following inventions.
(1) A light reflective sheet having a through hole,
A light transmitting member comprising a color conversion material layer composed of a color conversion material and a cured light transmitting resin in the through hole.
(2) (a) Prepare a sheet,
(B) forming a through hole in the sheet;
(C) give the sheet a light reflecting function,
(D) A light transmitting resin containing a color conversion material is filled in the through holes and cured to form a color conversion material layer (e) the sheet for each of the through holes or for a plurality of through hole groups A method of manufacturing a translucent member, comprising:
(3) (A) The light transmitting member manufactured by the above method is fixed on the light emitting element so that the color conversion material layer is disposed on the light emitting element,
(B) A method of manufacturing a light emitting device, which comprises covering the side surface of the light emitting element with a light reflecting member.
(4) light emitting element,
A light transmitting member disposed on the light emitting element;
And a light reflecting member covering the side surface of the light emitting element, wherein the light emitting device includes:
The light transmitting member includes a light reflective sheet having a through hole, and a color conversion material layer formed of a color conversion material and a cured light transmitting resin in the through hole.
A light emitting device, wherein the color conversion material layer is fixed on the light emitting element so as to be disposed on the light emitting element.

According to the present invention, it is possible to realize better chromaticity and color reproducibility by a simple method while maintaining downsizing and thinning.

It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the translucent member of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the translucent member of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the translucent member of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the translucent member of this invention. It is a schematic plan view which shows one Embodiment of the light transmission member of this invention. It is a schematic plan view which shows another embodiment of the light transmission member of this invention. It is a X-X 'sectional view taken on the line of a translucent member of Drawing 2B. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light transmission member of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light transmission member of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light transmission member of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light transmission member of this invention. It is a schematic plan view which shows another embodiment of the light transmission member of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light transmission member of this invention. It is a schematic plan view which shows another embodiment of the light transmission member of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light-emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light-emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light-emitting device of this invention. It is a schematic sectional drawing which shows one Embodiment of the light emitting element or light-emitting device of this invention. It is a schematic sectional drawing which shows another one Embodiment of the light emitting element or light-emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light emitting element or light-emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light emitting element or light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing process side view which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing process side view which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a vertical side view of FIG. 15B.

In the present application, the size, positional relationship, and the like of members illustrated in each drawing may be exaggerated for the sake of clarity. In the following description, the same names and symbols indicate the same or the same members, and the detailed description will be appropriately omitted. The contents described in one embodiment and one embodiment can be used for another embodiment and other embodiments.

[Translucent member]
The light transmitting member of the present invention comprises a sheet and a color conversion material layer. The light transmitting member preferably has an appropriate strength and is self-supporting. Therefore, it is not necessary to be rigid,
It is preferable that the color conversion material layer be flexible to such an extent that it can be held without damage.
The sheet and the color conversion material layer are at least one side of them, for example, the upper surface is flush, that is,
There can be no level difference in the upper surface of both and it can be flat (refer to figure 2C). Here, the absence of a flush or step means that one of them is not positively processed in the form of projecting from the other, and irregularities of about several tens of μm, preferably about several tens of μm are acceptable. Intended to be As a result, the dimensions of the color conversion material layer and hence the light transmitting member can be stabilized, and the assembly to other members can be made favorable. In addition, a lens or the like can be easily formed on the upper surface of the color conversion material layer.

Alternatively, the color conversion material layer may be concave and / or convex with respect to the upper surface and / or the lower surface of the sheet (see light transmitting members 10A to 10H in FIG. 8). In the case of making the color conversion material layer concave, an effect such as light collection can be exhibited. Moreover, when making it convex with respect to the lower surface of a sheet | seat, the adhesiveness or adhesiveness with respect to the light emitting element to apply can be improved.
When making it convex with respect to the upper surface of a sheet | seat, the taking-out efficiency of light can be improved.

The light transmitting member may have a flat shape, for example, without being positively subjected to processing such as bending or bending, in addition to the thickness of the light transmitting member itself. Thereby, the space occupied by the light transmitting member itself can be minimized. Alternatively, the top surface of the color conversion material layer may be in the shape of a so-called micro lens, fly eye lens, or the like having a concavo-convex shape in the thickness direction of the light transmitting member itself (refer to light transmitting member 10K in FIG. 8). By this, according to the use of a light transmission member, when using for a backlight, for example, the coupling efficiency with a light-guide plate can be improved.

The light transmitting member may be provided with one color conversion material layer in one sheet, or may be provided with a plurality of color conversion material layers in one sheet. The size of the light transmitting member in the case of a single color conversion material layer is preferably slightly larger than the size of the light emitting element or the like to be applied, and examples thereof include 0.1 to 200 × 0.1 to 200 mm. The size in the case of a plurality of color conversion material layers can be appropriately set according to the size, the number, and the like of the color conversion material layers described later.

The outer peripheral portion of the color conversion material layer of the light transmitting member may be subjected to shape processing for through holes and fitting. When the size of the light transmitting member is relatively large and long, it is preferable to provide a shape for positioning and fitting. Accordingly, it is possible to assemble or join the light emitting element and the light emitting device described later without positional deviation.

(Sheet)
The sheet is a substrate that supports the color conversion material layer. This sheet is light reflective. Here, the light reflectivity is preferably 60% or more, more preferably 70%, 80% or 90% or more, with respect to the light emitted from the light emitting element.
The sheet may be a light reflective sheet which itself has light reflecting properties in the entire process of producing the light transmitting member, or light reflecting properties may be imparted in any process of producing the light transmitting member. ,
As a result, it may be a light reflective sheet.

The sheet is formed of a light reflective material, other than the light reflective material, for example,
It may be made of either a translucent material or a light absorbing material.

As light reflective materials, metals, light reflective materials (eg, titanium dioxide, silicon dioxide, etc.)
Zinc dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, various rare earth oxides (for example, yttrium oxide, gadolinium oxide), colorants, etc. may be mentioned. Metals and light reflective materials are
The sheet itself may be used, or the particulate one may be formed into a sheet by a binder (for example, resin).

For example, about 10 to 95% by weight, preferably about 20 to 80% by weight, of the light reflective material described above in a single layer or laminate of metal or dielectric material, resin, inorganic material, glass, etc. The sheet | seat which shape | molded what contained by about 30-70 weight%, more preferably about 30-60 weight% is mentioned. Furthermore, those obtained by coating the surfaces of these metals or dielectrics and resin sheets with a metal film or a light reflective material, and the like can be mentioned. With such a composition, it can be freely and easily formed into a sheet with an appropriate shape. Moreover, the strength can be secured. Furthermore, sufficient resistance can be secured even in temperature change in filling and curing of the light-transmitting resin described later.

Ag, Al, Cu, Au, Pt, Pd, Rh, and metal films having these reflective properties
A single layer film or a laminated film of Ni, W, Mo, Cr, Ti or an alloy of these may be mentioned. The dielectric film is not particularly limited, and includes a single layer film or a laminated film of those used in the relevant field. For example, it is a lamination of SiO ₂ / Nb ₃ O ₅ or the like.
Examples of the base resin include thermosetting resins, thermoplastic resins, modified resins thereof, and hybrid resins containing one or more of these resins. Specifically, epoxy resin, modified epoxy resin (silicone modified epoxy resin etc.), silicone resin, modified silicone resin (epoxy modified silicone resin etc.), hybrid silicone resin, polyimide (PI), modified polyimide resin, polyamide (PA) , Polyethylene terephthalate resin, polybutylene terephthalate (PBT), GF reinforced polyethylene terephthalate (GF)
-PET), polycyclohexane terephthalate resin, polyphthalamide (PPA), polycarbonate (PC), polyphenylene sulfide (PPS), polysulfone (P
SF), polyether sulfone (PES), modified polyphenylene ether (m-PPE)
), Polyetheretherketone (PEEK), polyetherimide (PEI), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, urea resin, BT resin, polyurethane resin, polyacetal (POM), super High molecular weight polyethylene (UHPE), syndiotactic polystyrene (SPS), amorphous polyarylate (P
AR), fluorine resin, unsaturated polyester and the like.
Examples of the inorganic material include single-layer films or multilayer films containing ceramics such as aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, zinc oxide or mixtures thereof or low-temperature fired ceramics.

Among the above-mentioned resins, examples of the translucent material include translucent ones, glass, dielectrics and the like. Examples of the light absorbing material include the above-described ceramics, paper, fibers, pulp, carbon, dielectrics, and composite materials such as glass epoxy. The light absorbing material may have a light conversion function.
When the sheet is formed of the light-transmitting material and / or the light-absorbing material, the light reflecting property provided in the manufacturing process of the light-transmitting member is, for example, a light reflecting property of the sheet surface and the inner surface of the through hole described later. It is preferred that it is covered with a material. The surface of the sheet is preferably the entire surface of the front and back and the side, but at least part of the side surface of the through light facing the light emitting element and in contact with the color conversion material layer It may not be coated.

The sheet may be formed of any material, or may contain a diffusing agent or a light scattering material (barium sulfate, titanium dioxide, aluminum oxide, silicon oxide or the like) or the like.
In addition, glass cloth and fillers (glass fibers, fibrous fillers such as wollastonite, inorganic fillers such as carbon and silicon oxide), etc. used in the field of BGA mounting for semiconductors, etc., in order to ensure heat dissipation, strength, etc. May be contained.

Among them, it is preferable to use a light reflective sheet formed of a light reflective material containing a light reflective substance and a resin, because the sheet is easily available.
The thickness of the sheet can be appropriately set depending on the material to be used and the like, but preferably is a thickness that can ensure appropriate strength and light reflectance. For example, several tens of μm to 1 mm
The degree may be mentioned, preferably about several tens of μm to about 500 μm, and more preferably about 100 to 300 μm.

The sheet may partially contain a light emitting material in addition to the light reflective substance and the transparent resin. In particular, when the size of the through hole of the color conversion material sheet is smaller than the light emitting element, the effect of reducing the blue light from the light emitting element can be reduced.

The size of the through hole in a plan view is not particularly limited, and, for example, several hundred μm to
A size of several mm × several hundreds μm to several mm, a size of several hundred μs to 1 mm × several hundreds μm to about 1 mm, or a size corresponding to this area may be mentioned. The shape of the through hole in a plan view is not particularly limited, and examples thereof include a circular shape, an elliptical shape, a polygonal shape, and the like.
Among them, a quadrangle that is similar to the planar shape of the light emitting element is preferable.
The through holes may have the same shape and size in the thickness direction of the sheet, or may have different shapes and sizes from one surface to the other (in FIG. 8, the light transmitting member 10I, 1
See 0J). For example, an elliptical frustum, a square frustum, etc. may be mentioned.
The size and shape of the through hole correspond to the size and shape of the color conversion material layer.

When a plurality of through holes are arranged in one sheet, the distance is not particularly limited, and it is preferable to set the distance such that the sheets do not break due to the arrangement of the through holes. For example, intervals of about 0.01 to several mm can be mentioned. In addition, the arrangement may be randomly arranged or may be arranged in a ring (see FIG. 9, light transmitting member 100A) are regularly arranged in the row and / or column direction. Is preferred (see FIG. 1D, FIG. 2A).

(Color conversion material layer)
In the through holes, a color conversion material layer is formed without an air gap, and the color conversion material layer is made of the color conversion material and a cured translucent resin. However, the above-mentioned diffusing agent or light scattering material, glass cloth, filler and the like may be contained in the color conversion material layer.

As the color conversion material, those known in the art can be used. For example, a cerium-activated yttrium aluminum garnet (YAG) -based phosphor, a cerium-activated lutetium aluminum garnet (LAG) -based phosphor, a europium and / or a chromium-activated nitrogen-containing calcium aluminosilicate (CaO-Al ₂ O ₃ -S
Examples include iO ₂ ) phosphors, europium-activated silicate ((Sr, Ba) ₂ SiO ₄ ) phosphors, β sialon phosphors, KSF phosphors (K ₂ SiF ₆ : Mn), and the like.
Further, it may be a crystal or a sintered body of a phosphor, or a sintered body of a phosphor and a binder of an inorganic substance.
Thus, a light emitting device for emitting mixed color light (for example, white light) of primary light and secondary light of visible wavelength, and a light emitting device for emitting secondary light of visible wavelength by being excited by primary light of ultraviolet light it can.

The color conversion material may be, for example, a so-called nanocrystal, a luminescent material referred to as a quantum dot. As these materials, semiconductor materials such as II-VI, III-V, IV
Group VI semiconductors, specifically, ZnS, CdS, CdSe, InAgS ₂ , InCuS ₂ ,
Core-shell _{CdS x Se 1-x / ZnS} , include highly dispersed nano-sized particles of GaP and the like. InP, InAs, InAsP, InGaP, ZnTe, ZnSeTe, ZnSnP
, ZnSnP ₂ may be used.
In the present embodiment, a color conversion material having problems with heat resistance, water resistance, and environmental gas can be effectively used. Specifically, a color conversion material which can not withstand heat and / or moisture of processing of assembling a light emitting device described later, for example, a KSF phosphor which is easily deteriorated by water of a dicer, quantum dots which are weak to heating at reflow The light transmitting member is cut in advance with a laser or the like, the sizes are aligned, and fixed directly to the singulated light emitting elements, and after secondary mounting by reflow, the light transmitting element is fixed to the light emitting elements on the secondary mounting substrate The color conversion material can be effectively used without impairing the characteristics and the like.

In particular, when the light emitting device is used as a backlight of a liquid crystal display, a color conversion material (for example, KSF phosphor) which is excited by blue light and emits red light, and a color conversion material (for example, β sialon phosphor) which emits green light It is preferable to use Thereby, the color reproduction range of the display using the light emitting device can be expanded. Among other things, KSF has sharper emission spectrum peaks than other red color conversion materials (eg, CASN or SCASN). Therefore, when light is extracted through a color filter, light in a portion of low visibility among red is reduced, and light passing through a polychromatic (for example, green) color filter is reduced. As a result, green and red having high color purity can be obtained, and the color reproducibility of the liquid crystal can be improved.

The color conversion material may be used in any form such as, for example, crushed, spherical, hollow and porous particle sizes. The color conversion material preferably has, for example, a central particle size of 50 μm or less, 30 μm or less, 10 μm or less, or the like. The central particle size is: F.I. S. S. S. N
It refers to the particle size obtained by the air permeation method in o (Fisher Sub Sieve Sizer's No).

The color conversion material is preferably contained in an amount of about 10 to 90% by weight based on the total weight of the color conversion material layer.

The translucent resin which comprises a color conversion material layer can be selected and used out of translucent resin among resin mentioned above. Among them, it is preferable to select one which is less in expansion and contraction due to curing or temperature change. Moreover, when resin is used as a constituent material of a light-reflective sheet, it is preferable to use the same thing as the resin. Thereby, the adhesiveness of both can be ensured and the stable translucent member can be manufactured.

By arranging the color conversion material layer in the through holes formed in the light reflective sheet, in other words, by arranging the color conversion material layer to be surrounded by the light reflective sheet. Thus, it is possible to provide a translucent member that can easily and easily provide good separation of the light emitting device (that is, the boundary between the light emitting region and the non-light emitting region is clear) with high accuracy.
In particular, when using a color conversion material which hardly absorbs light or reduces light absorption in the color conversion material layer, the ratio of the color conversion material in the color conversion material layer is increased or the amount of color conversion material is secured. It is necessary to make the color conversion material layer relatively thick. Even if it is a translucent resin containing a relatively large amount of color conversion material, and even if it becomes necessary to control the film thickness to secure the amount of color conversion material, these can be easily obtained by the above-mentioned configuration. It is possible to satisfy the requirements of the invention, to obtain a high quality light transmitting member, and to be used for manufacturing a high quality light emitting device.

(Functional membrane)
The light transmitting member may have its upper surface or lower surface, particularly the upper surface or lower surface of the color conversion material layer, protected for the purpose of moisture resistance, corrosion resistant gas, reinforcement or the like. Specifically, one or more functional films having functions such as protection, moisture resistance, and reinforcement may be disposed in a single layer or a laminated structure (in FIG. 8,
See translucent member 10L).
For example, this functional film may be made of any material as long as it has translucency and can be made of the above-described resin or the like. A filler or the like may be added to the resin for reinforcement or the like. Specifically, films such as SiOx and Al ₂ O ₃ having high gas barrier properties, epoxy resins, silicone epoxy hybrid resins, fluorocarbon resins, parylene gas barrier films and the like can be mentioned.

In addition, since the light transmitting member, in particular, one light transmitting member having one color conversion material layer is very small, in order to secure its own strength, a glass plate or the like is disposed on the upper surface Good,
A translucent resin etc. may be apply | coated to an upper surface, and the further process for reinforcement may be given.

[Method 1 for producing a translucent member]
The translucent member prepares the following steps: (a) a sheet,
(B) forming a through hole in this sheet,
(C) Give the sheet a light reflection function,
(D) A light transmissive resin containing a color conversion material may be filled in the through holes and cured to form a color conversion material layer. Also, optionally
(E) cutting the sheet every through hole or every plurality of through holes;
(F) forming a functional film,
(G) Depending on the light conversion performance of the through holes including the individual color conversion material layers on the sheet, it is possible to carry out the step of selecting luminous flux or color tone.

(A) Preparation of sheet First, prepare a sheet. As described above, the sheet herein may be formed of a light reflecting material, or may be formed of a light reflecting material other than the light reflecting material, for example, a light transmitting material or a light absorbing material. Good.
The sheet can be formed, for example, by a method known in the field of plastic processing such as injection molding, extrusion molding, thermoforming, compression molding, and the like.

(B) Formation of through holes The through holes are formed in the sheet. The formation of the through holes may utilize any of the methods known in the art. Laser light irradiation or depiction, punching, pressing, etching, blasting and the like can be mentioned.
In particular, by processing the through hole by laser light irradiation, the through hole can be formed with good accuracy. Lasers are a CO ₂ laser, a fundamental wave of a solid state laser, a second harmonic, a third harmonic, and
A double wave etc. can be used. The wavelength is preferably infrared.
After the formation of the through holes, it is preferable to burn and remove smears and the like by washing.
In the preparation of the sheet in the step (a), the light-reflecting material, the light-transmissive material or the light-absorbing material is molded using a mold having asperities corresponding to the through holes, etc. The formation of the through holes may be performed simultaneously.

(C) Addition of Light Reflecting Function to Sheet The light reflecting function may be added to the sheet at the time of forming the sheet. That is, step (a)
And step (c) may be performed simultaneously. Moreover, after forming a through-hole in the sheet | seat using materials other than light-reflective material (process (b)), you may add a light-reflection function to a sheet separately.

When the light reflecting function is added to the sheet simultaneously with the formation of the sheet, as described above, the sheet may be formed of a light reflecting material (second light reflecting material). For example, a method of forming a metal film, a dielectric film as a sheet, a method of forming a light transmitting resin, an inorganic material, a material containing the light reflective substance described above in glass or the like into a sheet, these metal films or dielectrics The surface of a body film and a sheet | seat, the method of coat | covering a metal or a light reflective substance, etc. are mentioned.

When providing a light reflecting function to a sheet after forming the through hole, the inner surface of the through hole and the surface of the sheet are known in the field such as plating, various moldings, spray, ink jet, vapor deposition, printing, ALD method etc. There is a method of coating a light reflective material using any method. The light reflective material is preferably coated as thin as possible. The thickness of the coating of the light reflective material is preferably, for example, about several tens of μm or less.

As described above, even if the reflective side wall is physically difficult to form due to the miniaturization of the light emitting device,
A light reflecting function can be easily added to the sheet, and by using this, light from the light emitting device can be introduced or distributed to the necessary part. As a result, the utilization efficiency of light can be improved, and an efficient light emitting device can be obtained.

(D) Formation of Color Conversion Material Layer A translucent resin containing a color conversion material is filled in the through holes and cured to form a color conversion material layer.
As a method of filling the light transmitting resin containing the color conversion material into the through holes, any method known in the art, for example, various methods such as potting, molding, printing, spray, etc. can be used. . In this case, after the translucent resin is cured, it is preferable that the upper surface of the color conversion material layer be filled so as to be flush with the upper surface of the sheet.

The curing of the translucent resin can be appropriately set according to the type of resin used. For example,
Method of standing or leaving for a predetermined time, method of blowing cold air, method of heating (several tens to hundreds of tens of degrees C.
And energy radiation (X-ray, ultraviolet light, visible light, etc.).

When forming a plurality of color conversion material layers on one sheet, the same color conversion material may not be used for all the color conversion material layers, and a plurality of color conversion materials may be used. In this case, RGB can be realized using one light transmitting member by arranging the color conversion materials regularly.

(E) Cutting of sheet When a plurality of through holes are formed in the sheet in the step (a) and a plurality of color conversion material layers are formed in the step (d), the sheet may be cut after the step (d) Good. The cutting of the sheet is not particularly limited, and it may be cut into any form as long as the sheet, in particular, a sheet having light reflectivity is disposed substantially all around the color conversion material layer.
For the cutting, a sheet cutting method known in the art, for example, blade dicing, laser dicing, cutter scribing and the like can be used. The cutting may be performed for each color conversion material layer such that one color conversion material layer is disposed in one sheet. For example, 0. Several μm
It may be cut into a size of about several millimeters.
Alternatively, the plurality of color conversion material layer groups may be cut so that a plurality of color conversion material layers are disposed in one sheet. In this case, for example, it is preferable to cut the color conversion material layer every about 5 to 20, more preferably every about 7 to 15, and more preferably every 8 to 12. These color conversion material layers are preferably arranged in a line, for example, 0. Several μm to 5 cm
, 0. Cutting to a size of several μm to several cm is mentioned.

The cutting method can be appropriately selected according to the properties of the color conversion material, the filler and the resin material used. For example, when using a color conversion material that is weak to moisture, it is preferable to select laser dicing. If a heat-sensitive color conversion material is used, it is preferable to select blade dicing. In the case of being sensitive to both moisture and heat, direct exposure of the color conversion material to moisture and / or heat can be avoided if the color conversion material layer is not cut directly. Moreover, since it is a sheet form, additional processing of functional films, such as a protective film, can be implemented easily.

[Method 2 for producing a translucent member]
The light transmitting member can also be manufactured by the following process.
(D ') curing the translucent resin containing a color conversion material to form a color conversion material layer,
(A ′) A resin layer having a light reflection function is formed in the form of a sheet or a laminate on the outer peripheral side of the color conversion material layer.

(D ': formation of color conversion material layer)
In the formation of the color conversion material layer here, the material for forming the color conversion material layer described above is formed into an island shape, for example, on the sheet using various methods such as potting, printing, and spraying.
In order to form the color conversion material layer in an island shape, a mask or the like having an opening at a portion where the color conversion material layer is to be formed can be used. Also, self alignment using hydrophilicity and water repellency can be used. Only one or more color conversion material layers may be formed. In the case of forming a plurality of layers, it is preferable to form the color conversion material layers apart from each other.

(A ': formation of sheet)
As a material which comprises the resin layer shape | molded to a sheet form or lamination form, the material which comprises the sheet mentioned above can be used. The material is melted or dissolved in a solvent to give fluidity, which is formed into a sheet or laminate so as to surround the side of the color conversion material layer. The side surfaces of the color conversion material layer here preferably surround all the side surfaces.
When a plurality of color conversion material layers are formed in the previous step, it is preferable to integrally form all of the outer peripheral side surfaces with respect to all or a group of color conversion material layers.

The material here is preferably the above-described light-reflecting material, but as long as the resin layer can have a light-reflecting function as a result. Therefore, for example, when using a material other than the light reflective material as the material for forming the resin layer, as described above, the metal or the light reflective material is on the side surface of the color conversion material layer, preferably on all the side surfaces. It is preferable to coat the substance. Specifically, there may be mentioned a method of coating a metal or a light reflective substance using any method known in the art such as plating, spraying, vapor deposition, printing, ALD method and the like.

Specifically, when spraying, a silicone resin containing a high concentration of titanium dioxide is sprayed directly onto the island-shaped color conversion material layer, and then a silicone resin containing a low concentration of titanium dioxide is compression molded. It is molded into a sheet. Optionally, the surface on which the titanium dioxide is sprayed is cut by a grinder to remove the titanium dioxide-containing layer. In other words,
On the outer peripheral side of the color conversion material layer, a resin layer having a light reflection function is formed in a laminated manner.

Except the above-mentioned, it can carry out in the same way as the process performed by manufacturing method 1 of a translucent member, and may add an arbitrary process.

(F) Formation of functional film In the method of manufacturing a light transmitting member described above, the functional film described above may be formed. These films can be formed by an ALD method, a sputtering method, a vapor deposition method, a CVD method, or the like.

(G) Sorting of luminous flux or color tone The light conversion performance by the color conversion material layer formed in the through hole is measured. In this case, the sorted light-transmissive member can be mounted on a light-emitting element that emits a specific wavelength in a sheet-like or individual-changed state before or after step (e). As a result, particularly when the luminous flux or the color tone is measured in advance in a sheet state, it is expected to improve the yield of the light emitting device.

[Method of manufacturing light emitting device]
The light emitting device is
(A) Fix the above-mentioned light transmitting member on the light emitting element so that the color conversion material layer is disposed on the light emitting element;
(B) It can form by coat | covering the side of a light emitting element by a light reflection member.
Step (A) Step (B) is preferably carried out in this order, but these steps may be carried out simultaneously or in reverse. In addition, it is preferable to optionally mount the light emitting element on the substrate of the light emitting device before and after the step (A), particularly before the step (A). Here, one light emitting element may be mounted on one substrate, or a plurality of light emitting elements may be mounted on a plurality of substrates,
A plurality of light emitting elements may be mounted on one substrate.
Furthermore, in the case of mounting a plurality of light emitting elements on one substrate, optionally, after the step (B),
A separation step may be performed for each light emitting device. That is, the light emitting element or the light emitting element and the light transmitting member whose side surfaces are covered with the light reflecting material may be separated.
By performing the step (B), the separation for each light emitting device, and the step (A) in this order, it is possible to minimize the load applied to the color conversion material and the like in the assembly process of the light emitting device.
The light emitting element used here may be mounted on a substrate on which a terminal is formed, as described later.

(A) Fixing of Light-Transmitting Member and Light-Emitting Element The light-transmitting member formed by the method described above is fixed to the upper surface of the light-emitting element. That is, the light transmitting member is disposed on the light extraction surface side of the light emitting device. It is preferable that a part of the upper surface of the light emitting element is in direct contact with the light transmitting member, and more preferably in close contact.
The number of light transmitting members used here may be one or more. In addition, one or more light emitting elements may be used here. That is, the light emitting device manufactured by the present invention may include only one light emitting element or may include a plurality of light emitting elements. With such a configuration, the number of light emitting elements and the combination of lighting / non-lighting can be selected, and various light distributions and color tones can be controlled.

One light-transmissive member may be fixed to the upper surface of a plurality of light-emitting elements, but from the viewpoint of securing separation, one light-transmissive member, in particular, one color conversion material layer is one light-emitting element It is preferable to fix on top. Thereby, light leakage in an unintended direction of the light emitting element can be reliably prevented. As a result, by the above-described simple manufacturing method, it is possible to further improve the cut-off property of each light emitting element.
When a plurality of light emitting elements are mounted on a substrate, it is preferable to collectively fix a light transmitting member in which a plurality of color conversion material layers are disposed at positions corresponding to the light emitting elements.

As a light emitting element used here, any of light emitting elements generally used in the relevant field can be used. For example, the blue, the green light emitting element, ZnSe, nitride semiconductor _{(In X Al Y Ga 1-} XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), those using a semiconductor layer such as GaP Examples of red light emitting elements include those using semiconductor layers such as GaAlAs and AlInGaP.
The light emitting element is usually formed by laminating a semiconductor layer on a substrate for growing an insulating semiconductor such as sapphire, but the substrate for semiconductor growth may be finally removed.
The light emitting element may have an electrode disposed on the opposite side of the semiconductor layer, but preferably has an electrode disposed on the same side. Thereby, it can mount in the face-down form which joins an electrode with respect to a board | substrate. However, the light emitting element may have a face-down structure having a growth substrate, a face-down structure or a vertical structure not having a growth substrate, a face-up structure having a growth substrate, a face-up structure having no growth substrate, or the like.

It is preferable to use a light emitting element that is equal to or smaller than the outer edge of the color conversion material layer in plan view (FIG. 5C). Thus, all of the light emitted from the light emitting element can be efficiently introduced into the color conversion material layer, and the light extraction of the light emitting device can be improved. However, in plan view, the light emitting element may be equivalent to (approximately the same as the outer edge) or larger than the outer edge of the color conversion material layer. Even in this case, by covering the side surface of the light emitting element with a light reflecting member to be described later, it is possible to form a light emitting device having a uniform emission color and excellent in alignment chromaticity and having good separation.

The light emitting element 14 is preferably smaller than the outer edge of the light transmitting member 10 (FIG. 5C, FIG. 12A).
~ 12 C). Accordingly, the outer edge of the light transmitting member can be disposed outside the outer edge of the light emitting element, and as described above, it is possible to form a well-defined light emitting device with uniform emission color and excellent alignment chromaticity. The through holes in the conversion material layer may be either reversely tapered or tapered from the element side toward the light extraction surface (FIGS. 12B and 12C).
Note that a light emitting element larger than the outer edge of the light transmitting member in plan view may be used. In this case, by covering the side surface of the light emitting element and the upper surface of the light emitting element (and the side surface of the light transmitting member) with a light reflecting member described later, the emission color is uniform. It is possible to form a good light emitting device. The through holes of the color conversion material layer are preferably reverse-tapered from the element side to the light extraction surface.

Fixation of the translucent member to the upper surface of the light emitting element can be performed by, for example, a translucent adhesive member. The adhesive member is not particularly limited as long as it can ensure the above-described light transmittance and can fix the light-transmissive member to the light emitting element. In addition, materials that are not easily degraded by light are preferable. For example, silicone-based adhesives, epoxy-based adhesives, silicone-epoxy hybrid-based adhesives and the like can be mentioned.

The color conversion material layer or sheet surface can be used as the adhesive member itself. That is, the color conversion material layer or sheet itself may be made adhesive, or the adhesiveness of the color conversion material layer or sheet may be used.
The adhesive member can be formed in a fillet shape that extends from the outer edge of the upper surface of the light emitting element to the outer edge of the lower surface of the light transmitting member when using a light emitting element whose outer edge is smaller than the light transmitting member in plan view. Also,
When using a light emitting element whose outer edge is larger than that of the light transmitting member in plan view, a fillet-shaped adhesive member can be formed which extends from the outer edge of the lower surface of the light transmitting member to the outer edge of the upper surface of the light emitting element. here,
From the viewpoint of forming a light emitting device with a clear appearance, it is preferable to dispose the outer edge of the adhesive member inside the outer edge of the light transmitting member or to cover the outer edge of the adhesive member with a light reflecting member described later.

The light transmitting member is fitted to the structure of a light source device such as a light emitting element, a light emitting device, a light source, etc., by utilizing the irregularities on the sheet simultaneously processed when forming the through holes described above, the processed cross section, etc. Alternatively, the light emitting element may be mechanically mounted by partial adhesion or the like.

As described above, the light emitting element is preferably mounted on the substrate. The substrate here is not particularly limited, and may be a substrate having a so-called positive and negative pair of terminals for mounting one light emitting element, or a substrate having a wiring pattern for mounting a plurality of light emitting elements. It may be.
In any of the substrates, the substrate has, for example, an insulating base material and a conductive terminal or wiring pattern formed on the surface thereof. Base materials and materials for forming terminals or wiring patterns,
The shape, size and the like can be appropriately selected according to the form of the light emitting device to be obtained.

The light emitting element may be face up mounted such that the growth substrate side (opposite to the electrode formation side) of the light emitting element is bonded onto the substrate, but it is preferable to mount the light emitting element on the substrate by flip chip mounting.
In the case of face-up mounting, for example, a part of the wire may be embedded by disposing the above-mentioned translucent adhesive member (resin etc.) on the light emitting element, and the translucent member may be disposed thereon it can. As will be described later, in order to increase the light extraction of the upper surface of the light emitting element, the side surface of the light emitting element transparent portion such as sapphire can be covered with a reflecting member in advance in step (C) before mounting the light transmitting member. The transparent portion of the element and the reflective material may be tapered with a transparent material.

The mounting of the light emitting element on the substrate is usually performed via a bonding member. Here, as the connecting member, for example, tin-bismuth type, tin-copper type, tin-silver type, gold-tin type solder, Au and Sn
A eutectic alloy such as an alloy mainly composed of Au and Si, an alloy mainly composed of Au and Si, or a conductive paste such as silver, gold or palladium, a bump, AC
An anisotropic conductive material such as P and ACF, a brazing material of a low melting point metal, a conductive adhesive combining these, a conductive composite adhesive and the like can be mentioned.
In the case of flip chip mounting, the electrodes of the light emitting element can be directly connected to the wiring pattern of the substrate via these materials.

When a plurality of light emitting elements are mounted on one or more substrates, a plurality of light transmitting members may be arranged on one support before step (A), or this arrangement may be substituted. Alternatively, a translucent member provided with a plurality of color conversion material layers may be used.
The support is not particularly limited, and it is preferable to use a peelable pressure-sensitive adhesive tape or sheet, a temporary tacking material for a semiconductor, a temporary tackable material that can be patterned, and the like. A plurality of light transmitting members can be simultaneously mounted and fixed to a plurality of light emitting elements by using a support. As a result, the manufacturing process can be simplified. In addition, the manufacturing process can be simplified even by using a light transmitting member provided with a plurality of color conversion material layers.
A printed wiring board, a printed circuit board, or the like wired for mounting various components such as lighting, LED, ZD, etc., which can actually be used as a light source can also be used directly.

(B) Coating with Light Reflecting Member The side surface of the light emitting element is coated with a light reflecting member.
The light reflecting member can be formed using the light reflecting material described above. In particular, it is preferable to use one in which a light reflective material is contained in a resin or an inorganic material, in view of the easiness and simplicity of the coating. The resin can be selected from the above-mentioned thermosetting resin, thermoplastic resin, modified resin thereof, hybrid resin containing one or more kinds of these resins, and the like. The inorganic material can also be selected from the materials mentioned above. Among them, it is preferable to use a translucent resin, and from the viewpoint of adhesiveness with the translucent member, etc., the material constituting the translucent member, particularly the same material as the material constituting the sheet, especially the same resin Is preferred.

The light reflecting member may be indirectly covered via a space or the like as long as it covers the side surface of the light emitting element, but it may be disposed directly, that is, in contact with the side surface of the light emitting element preferable. By coating in this manner, light emitted from the light emitting element can be distributed more efficiently in a specific direction.
The side surface of the light emitting element to be coated may be a part, but preferably it is the entire side surface. Here, the side surface of the light emitting element mainly refers to the side surface of the semiconductor layer constituting the light emitting element, but when the electrode is disposed, the side surface of the electrode may be disposed.

Further, as described above, since the light emitting element is usually mounted on the substrate, it is preferable to cover the side surface of the light emitting element with the surface of the substrate with the light reflecting member. Furthermore, when there is a space between the semiconductor layer and the substrate, the space may be covered (embedded) by the light reflecting member. The same material may be used as the light reflecting member in all of these portions (semiconductor layer side surface, electrode side surface, and between the semiconductor layer and the substrate), or different materials may be used.

In the case of using the same material as the light reflecting member described above as the light reflecting member, the side surface of the light emitting element can be covered by using potting, transfer molding, compression molding or the like. By these methods, the side surfaces of the light emitting element can be easily coated. In addition, the light reflecting member can be simply and accurately disposed precisely below the light transmitting member. In particular, when the step (B) is performed after the step (A), the side surface of the light emitting element may be covered so that the upper surface of the light reflecting member is easily and surely matched with the lower surface of the light transmitting member. it can.
In addition, the side surface of the light emitting element and the side surface of the light transmissive member can be coated so that the upper surface of the light reflection member matches the upper surface of the light transmissive member.
As a light reflection member, the same material (for example, the same resin) as the material constituting the light transmission member described above
In the case where is used, on a substrate on which a plurality of light emitting elements are arrayed, the plurality of light emitting elements can be collectively and easily integrally covered by the light reflecting member.

As the light reflecting member, a molded article in which the portion corresponding to the light emitting element is hollow may be used. In this case, the molded body of the light reflecting member is previously disposed on the substrate, and then the light emitting element to which the light transmitting member is fixed is disposed on the light reflecting member so that the electrode of the light emitting element contacts the wiring of the substrate. You may press it. It is preferable to use such a molded body having a height corresponding to the height of the light emitting element. Thereby, while covering the side of a light emitting element can be performed simply, a light reflection member is simply and only under the light transmission member (that is, without covering the side of a light transmission member), simply and certainly, It can be arranged accurately. Further, the upper surface of the light reflecting member can be easily and reliably aligned with the lower surface of the light transmitting member. In this case, step (B) can be performed prior to step (A).
The molded body is preferably fixed to the above-described substrate using an adhesive or the like.

When a plurality of light emitting elements are mounted on one substrate, and when one light transmitting member is fixed on a plurality of light emitting elements, a plurality of light transmitting elements respectively corresponding on a plurality of light emitting elements In the case where the member is fixed, etc., the light transmitting member, the light reflecting member, and / or the substrate, etc. are separated for each light emitting element or for each light emitting element of one group after the step (B). May,
It does not have to be separated. By this, it is possible to obtain a light emitting device with intended orientation, brightness, size and the like. The separation in this case can be performed using blade dicing, laser dicing or the like.

[Light-emitting device]
The light emitting device of the present invention mainly includes a light emitting element, a light transmitting member, and a light reflecting member.
The light transmitting member may be the one described above, and is fixed on the light emitting element such that the color conversion material layer is disposed on the light emitting element. The color conversion material layer is preferably in contact with part of the top surface of the light emitting element, and more preferably in close contact.
Preferably, the outer edge of the light emitting element coincides with the outer edge of the color conversion material layer in plan view, or is disposed inside the color conversion material layer.
In the case where one light emitting device includes a plurality of light emitting elements, a plurality of light emitting elements can be formed by such a light transmitting member by using a light reflective sheet provided with a plurality of color conversion material layers as the light transmitting member. It can be configured integrally.

In one light emitting device, the light emitting element may be one or plural. In the latter case, it is preferable that the light transmitting member includes a plurality of color conversion material layers, and the color conversion material layer is disposed at a position corresponding to each of the light emitting elements and fixed on the light emitting elements. Thus, it is possible to obtain a light emitting device with good line-off performance. In addition, the plurality of color conversion material layers may include the same color conversion material, or may include different color conversion materials.

The light emitting element may or may not be mounted on the substrate on which the terminal is formed. For example, in the case where one light emitting device includes a plurality of light emitting elements, the plurality of light emitting elements can be integrally configured by a substrate on which such a terminal is formed.

The upper surface of the light reflecting member may coincide with the lower surface of the light transmitting member, or the light reflecting member may coincide with the upper surface of the light transmitting member so as to cover the side surface of the light transmitting member.
When one light emitting device includes a plurality of light emitting elements, the light reflecting member substrate can integrally configure the plurality of light emitting elements.

By providing such a configuration, the light emitting device can have high accuracy very easily and easily.
In particular, when using a color conversion material or the like which hardly absorbs light or decreases light absorption for the color conversion material layer in the light transmitting member, the ratio of the color conversion material in the color conversion material layer may be increased Although it is necessary to make the color conversion material layer relatively thick to secure the amount of material, even if it is a translucent resin containing a relatively large amount of color conversion material, the amount of color conversion material is also secured To do
Even if film thickness control is required, these requirements can be easily satisfied, and high quality light emitting devices can be obtained.

Hereinafter, the light transmitting member and the light emitting device of the present invention, and the method for manufacturing them will be described in detail.
Embodiment 1: Translucent Member and Method of Manufacturing the Same First, as shown in FIG. 1A, a light reflective sheet 11 is prepared.
The light reflective sheet 11 is made of a silicone resin and TiO ₂ which is a 60% by weight light reflective material.
In the form of a sheet having a thickness of 200 μm.
A plurality of 1.1 × 0.2 mm substantially rectangular through holes 11 a are formed in the matrix direction in the light reflective sheet 11.

Next, as shown in FIG. 1B, in the through holes 11a, a KSF phosphor with a particle diameter of about 20 μm, a β sialon phosphor with a particle diameter of about 12 μm, and a translucent resin (silicone resin) of 18% by weight and 26 respectively. % By weight, 56% by weight, and the resulting slurry is filled by potting and cured. Curing of the translucent resin is performed by heating for 240 minutes in an oven heated to 150 ° C. Thus, the color conversion material layer 12 is formed. This color conversion material layer 12
There is almost no dent in the center of the through hole 11a, and it becomes substantially flush with the light reflective sheet 11.

As shown in FIG. 1C, the light reflective sheet 11 including the color conversion material layer 12 is cut in the longitudinal direction X of the light reflective sheet, and for example, five color conversion material layers 12 in the row direction shown in FIG. The light transmission member 100 in which the

Furthermore, as shown in FIG. 1D, it is also possible to form the light-transmissive member 10 having one color conversion material layer 12 shown in FIG. 2B by singulating in the direction Y orthogonal to the longitudinal direction X. This light transmitting member 10
For example, the top view is a rectangle of 1.8 × 0.3 mm.
The cutting here is performed by a dicer with reduced amount of water used.

In such a light transmitting member 10, the upper surfaces of the sheet and the color conversion material layer are flush, that is, there is no difference in level on the upper surfaces of both of them. As a result, the dimensions of the color conversion material layer and hence the light transmitting member can be stabilized, and the assembly to other members can be made favorable.

Modification Example 1: Light-Transmitting Member As shown in FIG. 9 instead of the light-transmitting member 100 shown in FIG. 2A, a plurality of color conversion material layers 12X are arranged in a ring in one light reflective sheet 11X. It may be done.

Modification 2: Translucent Member Translucent members 10A to 10H shown in FIG. 8 instead of the translucent member 10 shown in FIGS. 2B and 2C.
, 10M, the color conversion material layers 12A to 12H, 12M may be concave and / or convex with respect to the upper surface and / or the lower surface of the sheet 11, respectively. When the upper surface and / or the lower surface of the color conversion material layer is recessed with respect to the upper surface and / or the lower surface of the sheet, an effect such as light collection can be exhibited. When the upper surface and / or the lower surface of the color conversion material layer is convex with respect to the upper surface and / or the lower surface of the sheet, adhesion or adhesiveness to the light emitting element to be applied can be improved. Furthermore, when making it convex with respect to the upper surface of a sheet | seat, light extraction efficiency can be improved.
In particular, when the upper surface and / or the lower surface of the color conversion material layer of the light transmitting member has a curved surface, a linear light source,
It is advantageous to use a translucent member in a large area.

Modified Example 3: Translucent Member As shown in the translucent members 10I and 10J of FIG. 8, the through holes 11 of the sheets 11I and 11J.
The shape of aI and 11aJ may be tapered or reverse tapered from the front surface to the bottom surface of the sheet.

Modified Example 4: Light Transmitting Member As shown in a light transmitting member 10K of FIG. 8, even in the shape of a so-called fly eye lens or the like, the upper surface of the color conversion material layer 12K has an uneven shape in the thickness direction of the light transmitting member 10K itself. Good. By this, according to the use of a light transmission member, when using for a backlight, for example, the coupling efficiency with a light-guide plate can be improved.

Modified Example 5: Light-Transmitting Member As shown in the light-transmitting member 10L of FIG. 8, for example, a moisture-proof film may be disposed on the upper surface. In addition, as shown in a light transmitting member 10N of FIG. 8, for example, a transparent film may be disposed on the upper surface. Thereby, when using the color conversion material which is easy to absorb moisture or the color conversion material which becomes fragile due to moisture absorption, the characteristic deterioration of the light transmitting member can be prevented.

Embodiment 2: Translucent Member and Method of Manufacturing the Same First, as shown in FIG. 3A, a sheet 21 made of glass epoxy prepreg and having a thickness of 200 μm is prepared.
A plurality of 1.1 × 0.2 mm substantially rectangular through holes 21 a are formed in the sheet 21 in the matrix direction by laser processing, and desmeared.

Subsequently, as shown in FIG. 3B, the sheet 21 having the through holes 21a is immersed in a primer solution containing Pd fine particles to form a seed layer which can be plated on the entire surface of the sheet, then electroless Ni plating, electrolysis An Ag film is formed to a thickness of about several μm by Ag plating. Here, the entire surface of the sheet 21 refers to all of the inner surface of the through hole 21 a and the front and back surfaces and the side surface of the sheet 21.

Next, as shown in FIG. 3C, in the through holes 21a, a KSF phosphor with a particle diameter of about 20 μm, a β sialon phosphor with a particle diameter of about 12 μm and a translucent resin (silicone resin) of 20% by weight and 30% respectively. % By weight, 50% by weight, the resulting slurry is filled by potting and cured. Thus, the color conversion material layer 12 was formed. This color conversion material layer 12 is
There is almost no dent in the center of the through hole 11a, and it becomes substantially flush with the light reflective sheet 21.

As shown in FIG. 3D, the light reflective sheet 21 including the color conversion material layer 12 is singulated in the longitudinal direction X of the light reflective sheet and in the direction Y orthogonal to the longitudinal direction X, and the color conversion material shown in FIG. Layer 12
The light transmission member 20 which has one is formed. A light reflecting film made of Ag is formed on the front and back surfaces of the light transmitting member 20 and the inner surface of the through hole 21a.

Modified Example 6 Manufacturing Method of Light Transmissive Member As shown in FIG. 10A, for example, the color conversion material layer 42 is formed on the sheet 40. Here, a plurality of color conversion material layers 42 are formed, and the color conversion material layers 42 are respectively formed in an island shape with a space.
Next, as shown in FIG. 10B, a light reflecting resin layer 4 containing 60% by weight of TiO ₂ which is a light reflecting substance in a silicone resin so as to cover only the entire side surface of the color conversion material layer 42
1 is formed by, for example, a compression molding method.
Thereafter, the light transmitting member 100 can be obtained by peeling the sheet 40.
It can manufacture by the method similar to the translucent member of Embodiment 1 except having mentioned above.
Thereby, the same effect as the manufacturing method of the light transmission member of Embodiment 1 is obtained.

Modified Example 7 Manufacturing Method of Light Transmissive Member As shown in FIG. 10A, after forming the color conversion material layer 42 on the sheet 40, as shown in FIG. 11A, the mask 44 is formed on the upper surface of the color conversion material layer 42 Do. The light reflection film 43 is formed on the color conversion material layer 42 through the masks 44. Here, for example, a film containing 80% by weight of TiO ₂ which is a light reflective material is formed on a silicone resin by a spray method.
Thereafter, as shown in FIG. 11B, the light reflecting film 43 formed on the mask 44 is formed.
Is removed by blasting or the like to expose the upper surface of the color conversion material layer 42.
As shown in FIG. 11C, the color conversion material layer 42 is coated so as to cover the side surface of the color conversion material layer 42.
In the meantime, a light reflective resin layer 41 is formed, which contains 30% by weight of TiO ₂ which is a light reflective material in a silicone resin.
Subsequently, the light transmitting member 100B can be obtained by peeling the sheet 40. Here, in the light transmitting member 100 </ b> B, the light reflecting film 43 is disposed on all the side surfaces of the color conversion material layer 42 and also on one surface of the light reflecting resin layer 41 between the color conversion material layers 42.
It can manufacture by the method similar to the translucent member of Embodiment 1 and the modification 7 except having mentioned above.
Thereby, the same effect as the manufacturing method of the light transmission member of Embodiment 1 and modification 7 is obtained.

Embodiment 3: Light Emitting Device and Method of Manufacturing the Same First, as shown in FIG. 5A, the light emitting element 14 is mounted on the substrate 16 by face-down mounting using solder. Do.
The light emitting element 14 has a size of, for example, 1100 × 200 × 300 μm. The outer shape of the upper surface of the light emitting element 14 is equal to or slightly smaller than the outer shape of the color conversion material layer 12 of the light transmitting member 10.

As shown in FIG. 5B, the light transmitting member 10 obtained in Embodiment 1 is formed on the upper surface of the light emitting element 14.
Place and secure with a translucent adhesive member. In the light transmitting member 10, the outer edge of the color conversion material layer 12 is
It is fixed on the light emitting element 14 so as to be disposed slightly outside the outer edge of the light emitting element 14.

Next, as shown in FIG. 5C, the light reflecting member 15 is discharged to the lower side of the light transmitting member 10 to cover all the side surfaces of the light emitting element 14 with the light reflecting member 15 utilizing its fluidity.
The light reflecting member 15 is made of silicone resin, silica, and titanium oxide 2 to 2 respectively.
. It is formed to be contained at 5% by weight and 40 to 50% by weight.
The light reflecting member 15 is disposed only below the light transmitting member 10, and the upper surface thereof is the light transmitting member 1.
It corresponds to the lower surface of 0. In addition, the space between the light emitting element 14 and the substrate 16
Is covered. Thus, light emitted from the light emitting element 14 toward the substrate 16 can be introduced to the light transmitting member 10 which is not covered by the light reflecting member 15. As a result, it is possible to obtain a light emitting device with good line-off performance.

Embodiment 4: Light Emitting Device and Method of Manufacturing the Same First, as shown in FIG. 6A, the plurality of color conversion material layers 12 shown in FIG. 2A obtained in Embodiment 1
The translucent member 100 provided with
Next, as shown in FIG. 6B, the color conversion material layer 1 of the light transmitting member 100 is formed on one substrate 36.
A plurality of light emitting elements 14 were regularly arranged and mounted so as to correspond to the second position.
Subsequently, as shown in FIG. 6C, the light transmitting members 100 are collectively mounted on the light emitting elements 14 such that the outer edges of the color conversion material layers 12 are respectively disposed outside the outer edges of the light emitting elements 14. ,
Fix all at once.
Next, as shown in FIG. 6D, between the light transmitting member 100 and the substrate 36, the light transmitting member 10 is
By discharging the light reflecting member 15 below 0, all the side surfaces of the plurality of light emitting elements 14 are integrally covered utilizing its fluidity.
In this manner, a light emitting device in which five light emitting elements are arranged in a row can be obtained.

Furthermore, as shown in FIG. 6E, using the dicer at the cutting position C between the light emitting elements 14 so that the side surface of the light reflecting member 15 is exposed, the substrate 36, the light reflecting member 15 and the light transmitting member The sheet 11 of 100 can be cut to obtain a light emitting device provided with one light emitting element.

The light transmitting member and the light emitting device can be manufactured with high accuracy and simplicity by the manufacturing method as described above.
In addition, the obtained light emitting device can distribute light emitted from each light emitting element to the light extraction surface with certainty regardless of the number of light emitting elements mounted. Therefore, it is possible to obtain a light-emitting device with good cut-off performance.

Embodiment 5: Light Emitting Device and Method of Manufacturing the Same First, as shown in FIG. 7A, a plurality of light emitting elements 14 are regularly arranged and mounted on one substrate 36.
Further, as shown in FIG. 7B, a plurality of the substrates shown in FIG. 4 obtained in Embodiment 2 at positions respectively corresponding to the light emitting elements 14 arranged on the substrate 36 on the peelable pressure-sensitive adhesive sheet as the support 37. The light transmitting member 20 provided with the color conversion material layer 12 is prepared. The color conversion material layer 12 here may contain the same color conversion material or may contain different color conversion materials.
Subsequently, as shown in FIG. 7C, the light transmitting members 20 are collectively placed on the light emitting elements 14 so that the outer edges of the color conversion material layer 12 are disposed outside the outer edges of the light emitting elements 14. Fix it collectively.

Next, as shown in FIG. 7D, the light reflection member 15 is discharged to the lower side of the light transmission member 20 while the light transmission member 20 is attached to the support 37, so that the fluidity is utilized. All sides of each of the plurality of light emitting elements 14 are integrally covered. In this case, below the light transmitting member 20,
The lower surface of the light transmitting member 20 and the upper surface of the light reflecting member 15 coincide with each other. At the side of the light transmitting member 20, the upper surface of the light transmitting member 20 and the upper surface of the light reflecting member 15 coincide with each other.

Thereafter, as shown in FIG. 7E, the support 37 is peeled off from the light transmitting member 20. By this,
The support 37 serves as a mask of the light reflecting member 15, and the light reflecting member 15 can be disposed mainly below the light transmitting member 20.
Subsequently, as shown in FIG. 7F, the substrate 36 and the light reflecting member 15 are cut using a dicer at the cutting position C so that the side surface of the light reflecting member 15 is exposed between the light emitting elements 14. ,
A light emitting device is obtained.
Except for the above, the method is substantially the same as that of the fourth embodiment.
Also in such a light emitting device, the same effect as in the fourth embodiment can be obtained.

Embodiment 6: Light Emitting Device and Method of Manufacturing the Same In the method of manufacturing a light emitting device according to this embodiment,
The side of the light emitting element is covered with a light reflecting member, and then cut for each light emitting device, and then
The light transmitting member described above is fixed on the light emitting element such that the color conversion material layer is disposed on the light emitting element.

The coating of the side surface of the light emitting element with the light reflecting member and the cutting of each light emitting device are described, for example, in FIG.
It may be performed in any form shown in FIG. 13D. That is, as shown in FIG. 13A, in the light emitting element 14A formed by the semiconductor stacked body 31 stacked on the sapphire substrate as the semiconductor growth substrate, the electrodes 32 are disposed on the same surface side, and the semiconductor of the light emitting element 14A. The side surface of the laminate and the surface of the semiconductor laminate between the electrodes may be covered with the light reflecting member 33.
As shown in FIG. 13B, after forming a semiconductor laminate on a sapphire substrate which is a semiconductor growth substrate, a light emitting element 1 constituted by a semiconductor laminate 34 from which the sapphire substrate is removed
In 4B, the electrodes 32 may be disposed on the same surface side, and the light emitting element 14B may be reinforced by the reinforcing material 36a. The reinforcing material 36a preferably has light reflectivity. As shown in FIG. 13C, regardless of the presence or absence of the sapphire substrate which is a semiconductor growth substrate, in the light emitting element 14C composed of the semiconductor laminate, the electrodes 32 are arranged on the same surface side, and the substrate 36 having terminals is provided. The light emitting element 14C is mounted in a tight manner, the electrode 32 of the light emitting element 14C is connected to the terminal of the substrate 36 by the wire 35, and the side surface of the semiconductor laminate of the light emitting element 14C is covered with the light reflecting member 33. It is also good. As shown in FIG. 13D, regardless of the presence or absence of the sapphire substrate which is a semiconductor growth substrate, the electrodes 32 are not disposed on the same side but are disposed on different sides in the light emitting device 14D formed of the semiconductor laminate. Has a vertical type structure mounted on a substrate 36 having terminals, one electrode 32 of the light emitting element 14C is connected to the terminal of the substrate 36 by a wire 35 and the other electrode is soldered to the terminal of the light emitting element 14D. The side surface of the semiconductor laminate may be covered with the light reflecting member 33.

For example, as shown in FIG. 14A, a plurality of light emitting elements 14A provided with light reflecting members 33 and divided into individual light emitting devices are mounted on the mounting substrate 50 of a light source device actually used such as a linear light source. Join. In this case, for example, the light emitting element 14A is joined in a top view type so as to emit light in the direction of the arrow.
Thereafter, as shown in FIG. 14B, a translucent member 100 having a plurality of color conversion material layers 12 is obtained.
As shown in FIG. 14C, the color conversion material layer 12 is fixed so as to be disposed on the light emitting element 14A by an adhesive member or a fitting, respectively. Thus, a light emitting device in which a plurality of light emitting elements 14A are arrayed can be obtained.
Subsequently, the mounting substrate 50 and the sheet 11 of the light transmitting member 100 may be optionally cut between the light emitting elements 14A using a dicer or the like to obtain a light emitting device including one light emitting element.

As described above, by fixing the light transmitting member after the secondary mounting of the light emitting element, it is possible to avoid the heat history of the element mounting in the assembly process and the curing of the resin. In addition, it is possible to avoid heat history such as solder reflow at the time of secondary mounting.

Modification 8: Method of Manufacturing Light Emitting Device In this modification, for example, as shown in FIG. 15A, the light emitting element 14A is joined to be a side view type so as to emit light in the direction of the arrow.
Thereafter, as shown in FIGS. 15B and 15C, the light transmitting member 100 having the plurality of color conversion material layers 12 is disposed by the adhesive members on the light emitting surface of the light emitting element 14A. And fix the mounting substrate 50 substantially perpendicularly. Thus, a light emitting device in which a plurality of light emitting elements 14A are arrayed can be obtained.

The manufacturing method of the light transmitting member and the light emitting device according to the present invention includes the light sources of various display devices, light sources for illumination, light sources for various indicators, light sources for vehicles, light sources for displays, light sources for liquid crystals, light sources for backlight of liquid crystals, traffic lights, vehicles It can be used to manufacture various light sources such as parts, channel letters for signs, etc.

10, 10A to 10N, 20, 100, 100A, 100B Translucent members 11, 11I, 11J Light reflective sheets 11a, 11aI, 11aJ, 21a Through holes 12, 12I, 12J, 12K, 42 color conversion material layer 13 Film 14, 14A to 14D Light emitting element 15 Light reflecting member 16, 36 Substrate 17 Moisture barrier film 18 Second film 21 Sheet 31 Semiconductor laminate laminated on sapphire substrate 32 Electrode 33 Light reflecting member 34 Semiconductor laminate 35 Wire 36a Reinforcement Material 37 Support 40 Sheet 41 Light Reflective Resin Layer 43 Light Reflective Film 44 Mask 50 Mounting Board

Claims (31)

A light reflective sheet having a through hole;
A light transmitting member comprising a color conversion material layer composed of a color conversion material and a cured light transmitting resin in the through hole. The translucent member according to claim 1, wherein at least one surface of the light reflective sheet and the color conversion material layer is flush. The light transmitting member according to claim 1, wherein the light reflective sheet is formed of a light reflective material. The light reflective sheet is formed of a translucent material or a light absorbing material, and
The light transmitting member according to claim 1 or 2, wherein the surface of the light reflective sheet and the inner surface of the through hole are coated with a light reflective material.   The light transmitting member according to claim 4, wherein the light absorbing material has a light conversion function. The light reflective sheet is made of a light reflective material including a light reflective material and a resin,
The light transmitting member according to any one of claims 1 to 5, wherein a resin forming the light transmitting resin forming the color conversion material layer is the same resin as a resin forming the light reflecting sheet. The light reflective sheet has a plurality of the through holes and the color conversion material layer.
The translucent member as described in any one of the above. (A) Prepare a sheet,
(B) forming a through hole in the sheet;
(C) give the sheet a light reflecting function,
(D) In the through holes, a translucent resin containing a color conversion material is filled and cured to form a color conversion material layer,
(E) The manufacturing method of the translucent member including cutting the said sheet | seat for every said through-hole or every several through-hole group. The method for producing a light-transmissive member according to claim 8, wherein in the step (d), the color conversion material layer is formed so that the upper surface of the cured light-transmissive resin is flush with at least one surface of the sheet. The method according to claim 8 or 9, wherein the steps (a) and (c) are performed simultaneously to prepare a sheet formed of a light reflective material. The method according to claim 8 or 9, wherein in the step (c), the surface of the sheet and the inner surface of the through hole are covered with a second light reflective material. In step (c), coating is performed by plating, spraying or inkjet.
The manufacturing method of the translucent member as described in 0. Forming a plurality of through holes in the sheet in the step (a);
The light transmitting member according to any one of claims 8 to 12, further comprising, after the step (d), between (e) and protecting the color conversion material layer from humidity and corrosive gas. Production method. (D ') curing the translucent resin containing a color conversion material to form a color conversion material layer,
(A ′) A manufacturing method of a light transmitting member including forming a resin layer having a light reflecting function in a laminated shape on an outer peripheral side surface of the color conversion material layer. Forming a plurality of color conversion material layers apart from each other in step (d ');
The method according to claim 14, wherein in the step (a ′), a resin layer having a light reflection function is integrally formed on the outer peripheral side surface of the plurality of color conversion material layers. (A) The light transmitting member manufactured by the method according to any one of claims 8 to 15 is fixed on the light emitting element such that the color conversion material layer is disposed on the light emitting element,
(B) A method of manufacturing a light emitting device, which comprises covering the side surface of the light emitting element with a light reflecting member. In the step (A), using the light emitting element which is equal to or smaller than the outer edge of the color conversion material layer in plan view,
In the step (B), the light transmissive member is fixed on the light emitting element such that the outer edge of the light emitting element coincides with the outer edge of the color conversion material layer or is disposed inside the outer edge of the color conversion material layer A method of manufacturing a light emitting device according to claim 16. The method for manufacturing a light emitting device according to claim 16, wherein in the step (B), the side surface of the light transmitting member is further covered with the light reflecting member. Before and after the step (A), the light emitting element is mounted on a substrate,
The method for manufacturing a light emitting device according to any one of claims 16 to 18, wherein in the step (B), the light reflecting member is covered from the side surface of the light emitting element to the surface of the substrate. Before and after the step (A), the light emitting element is mounted on a substrate,
The method for manufacturing a light emitting device according to any one of claims 16 to 19, wherein in the step (B), the light reflecting member is covered from the side surface of the light transmitting member to the surface of the substrate. Before and after the step (A), a plurality of the light emitting elements are mounted on one substrate.
The manufacturing method of the light-emitting device as described in any one of these. 22. The light emitting device according to claim 21, wherein, in the step (A), a plurality of light transmitting members in which a plurality of color conversion material layers are arranged at positions corresponding to the plurality of mounted light emitting elements Production method. The method for manufacturing a light emitting device according to any one of claims 16 to 22, wherein in the step (B), the upper surface of the light reflecting member is made to coincide with the lower surface of the light transmitting member. The method for manufacturing a light emitting device according to any one of claims 16 to 22, wherein in the step (B), the upper surface of the light reflecting member is made to coincide with the upper surface of the light transmitting member. A light emitting element,
A light transmitting member disposed on the light emitting element;
And a light reflecting member covering the side surface of the light emitting element, wherein the light emitting device includes:
The light transmitting member includes a light reflective sheet having a through hole, and a color conversion material layer formed of a color conversion material and a cured light transmitting resin in the through hole.
A light emitting device, wherein the color conversion material layer is fixed on the light emitting element so as to be disposed on the light emitting element. 26. The light emitting device according to claim 25, wherein at least one surface of the light reflective sheet and the color conversion material layer is flush. The light emitting device according to claim 25 or 26, wherein the outer edge of the light emitting element coincides with the outer edge of the color conversion material layer in plan view, or is disposed inside the color conversion material layer. A plurality of the light emitting elements are arranged,
The light transmitting member comprises a plurality of color conversion material layers;
The light emitting device according to any one of claims 25 to 27, wherein the color conversion material layer is disposed at a position corresponding to each of the light emitting elements and fixed on the light emitting element. The light emitting device according to any one of claims 25 to 28, wherein an upper surface of the light reflecting member coincides with a lower surface of the light transmitting member. The light emitting device according to any one of claims 25 to 28, wherein an upper surface of the light reflecting member coincides with an upper surface of the light transmitting member. The light emitting device according to any one of claims 25 to 30, wherein the light emitting element is a face down structure having a growth substrate, a face down structure not having a growth substrate, or a vertical structure.