JP2019047032A - Printed board - Google Patents

Abstract

To provide a printed board using a spring member mounted to a sub-substrate, in which the sub-substrate can be stably and effectively mounted to a slit of a main substrate and a load on a solder that bonds between conductive patterns of the main substrate and the sub-substrate can be reduced.SOLUTION: One end side of a spring member mounted to a sub-substrate of a printed board is fixed to a terminal portion of the sub-substrate, and the other end side is a free end. When the sub-substrate is inserted in a main substrate thereby to be assembled, the other end side is in a state of being pressed against the surface of the sub-substrate, and, after the completion of the insertion operation, the spring member and the terminal portion of the main substrate are solder-bonded.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a printed board configured by combining a main board and a sub board, and more particularly to a printed board that can stably and efficiently attach the sub board to the main board.

  The miniaturization of products is also progressing in the field of electronic circuits. When a sub board is provided on a printed circuit board for the purpose of small signals, the sub board is directly attached to the main board without using a connector or the like when fixing the sub board to the main board of the printed circuit board. The method of inserting into is known.

  However, the mounting grooves (slits) opened in the main board for inserting the sub board need to prevent “rattle” at the joint portion between the two when the sub board is attached. For this purpose, it is desirable to minimize the gap (clearance) between the slit of the main board and the surface of the sub board. However, because there is a tolerance in each of the slits of the main board, that is, the size of the opening and the plate thickness of the sub board, there is no choice but to design with a certain gap. Cause "rattle".

  When the sub-board is soldered to the main board, the “gap” gap is fixed by the solder. However, when the entire printed circuit board as a product vibrates, the sub board also vibrates. However, in the structure in which the sub board is inserted into the slit of the main board, when the sub board vibrates, the impact is concentrated on the soldering portion. Therefore, in order to avoid such a situation, it is possible to prevent “rattle” between the main board and the sub board when vibration occurs, and to bond the conductive pattern between the sub board and the main board. It is necessary to reduce the impact (stress) on the solder to improve the product life and quality.

  In Patent Document 1, terminal pads for soldering to a mother board (main board) are provided on both front and back surfaces of the lower part of the auxiliary board (sub board), and the auxiliary board (sub board) is formed in a slit in the mother board (main board). A structure is disclosed in which is inserted and connected directly. The slit has a first slit width portion for soldering with the auxiliary substrate (sub-substrate) and a first portion for holding the auxiliary substrate (sub-substrate) substantially perpendicular to the mother substrate (main substrate). A portion having a width of 2 slits is provided, the first slit width A is larger than the second slit width, and the second slit width is approximately equal to or less than the thickness of the auxiliary substrate (sub-substrate).

  In Patent Document 2, a mounting hole is provided in a joint portion between a sub board and a main board, plug pins are passed through the sub board in a perpendicular state, the plug pins and a wiring pattern of the sub board are soldered, and a mounting hole of the main board is provided. A structure for increasing the mechanical strength of a printed circuit board (wiring board) by soldering each wiring pattern of the connecting piece inserted through the main board and the main board is disclosed.

  Also, Cited Document 3 discloses a configuration similar to Cited Document 2, and a jumper wire is disposed instead of a terminal on the sub board terminal portion, and both sides of the sub board are soldered, thereby main of the sub board. A device that increases mechanical strength while preventing erroneous insertion of the attachment to the substrate is disclosed.

JP 2004-153178 A Japanese Patent Laid-Open No. 5-198911 Japanese Unexamined Patent Publication No. 5-198910

  It can be considered that the problem of “rattle” can be solved by the one disclosed in Patent Document 1 described above. However, since there are many parts that are equal to or less than the thickness of the sub board, when the sub board is inserted into the slit of the main board, the burden of press-fitting operation is increased, or the interference parts of the slit are damaged. Another problem is that it becomes easier to do.

  Further, the problem that the load on the solder connecting the sub board and the main board due to the vibration of the sub board becomes large cannot be solved.

  In the structure disclosed in the cited document 2, there arises a problem that the number of steps for specially processing the sub-substrate insertion openings (slits) of the sub-substrate and the main substrate increases.

  Similarly, in the cited document 3, there is a problem that the number of steps for specially processing the opening of the main substrate increases.

  Therefore, the present invention provides a printed circuit board that can reduce the burden of the coupling operation of the sub board and the main board as much as possible, and can also reduce the load on the solder connecting the conductive patterns of the main board and the sub board. The purpose is to provide.

The object of the present invention is to provide a main board on which electronic components are arranged,
In a printed circuit board comprising: a sub-board that plays an auxiliary role for the main board; and a spring member made of a conductive material attached to a terminal portion of the sub-board.
The sub board is adapted to be combined with the main board by being inserted into a slit that forms an opening provided in the main board,
One end side of the spring member is fixed to the terminal portion of the sub board, and the other end side is a free end. When the sub board is inserted into the main board and combined, the other end side is the main board. Is in pressure contact with the surface of
This can be achieved by a printed circuit board in which the spring member and the terminal portion of the main board are solder-bonded after the insertion operation is completed.

  In this preferred embodiment, the spring member has a cut and raised structure, and the spring member is formed by cutting and raising a metal material.

The spring member has a front end in the direction of insertion of the sub board into the main board fixed to a terminal portion of the sub board, a rear end is a free end, and the rear end is a surface of the sub board. Is spaced beyond the width of the slit,
When the sub board is inserted into the main board, the rear end side of the spring member is displaced to a position close to the surface of the sub board by the pressure applied from the side surface of the slit, and the sub board is inserted into the slit. Enable operation,
After the sub board is inserted into the main board, the rear end side of the spring member may be configured to return from the surface of the sub board to a position exceeding the width of the slit. In this way, the sub-board inserted into the slit of the main board does not reverse and return from the slit after insertion.

  In another aspect, the spring member has a bent structure, and can be configured by bending the metal member.

  According to the present invention, in a printed board having a main board and a sub board, and inserting the sub board into a slit provided in the main board, when a load such as vibration or impact is applied to the printed board, the main board and the sub board are arranged. Shaking with the substrate can be effectively suppressed. At the same time, the spring member is attached to the terminal portion of the sub-board and soldering is performed including the spring member. Therefore, it is possible to reduce the stress load of the solder connecting the conductive patterns of the board and the sub-board.

It is a perspective view which shows the main board | substrate and sub board | substrate which comprise the printed circuit board concerning one Example of this invention. It is an enlarged view of the insertion part of the sub-board | substrate of FIG. It is a perspective view of the spring member of FIG. It is sectional drawing which shows the state which inserted the sub board | substrate in the main board | substrate in the printed circuit board of FIG. It is a figure which shows the state after soldering of sectional drawing of FIG. It is explanatory drawing of the spring member concerning another Example. It is explanatory drawing which shows the mounting state of the spring member of FIG. It is explanatory drawing which shows the mounting state of the spring member of FIG. It is explanatory drawing of the spring member concerning another Example. It is explanatory drawing of the spring member concerning another Example. It is explanatory drawing of the spring member concerning another Example.

  Hereinafter, the present invention will be described based on examples with reference to the drawings. Referring to FIG. 1, a perspective view from the component surface side of the main board 20 and the sub board 30 constituting the printed board 10 is shown. FIG. 1 shows a state of the sub-board 30 that is about to be inserted into the rectangular slit 21 of the main board 20 from the component surface side. The sub-board 30 of this example is generally longer than the length of the slit 21 in the longitudinal direction. And the front-end | tip of the center part by the side of the insertion of the sub board | substrate 30 has a protruding shape, and the protruding part is smaller than the length of the slit 21 in the longitudinal direction.

  This protruding portion constitutes an insertion portion 31 of the sub-board 30 that is inserted into the slit 21 of the main board 20. In other words, both sides of the insertion portion 31 of the sub-board 30 form shoulder portions 32, 32 projecting outward. The width of the slit 21 is set slightly larger than the thickness of the sub-board 30 as a whole in consideration of the efficiency of insertion work.

  As shown in FIG. 2, a plurality of conductive patterns 33 are formed on the side surface of the sub-board 30 of this example, and a conductive spring member 40 is attached to each conductive pattern 33. In this example, the spring member 40 is bonded to the conductive pattern 33 of the sub-board 30 by reflow solder (not shown). The spring member 40 of this example is formed by processing a rectangular flat plate 41. As shown in FIG. 3, a flat plate 41 as a raw material has a pair of cut lines 42, 42 extending in parallel along the longitudinal direction. And the one end side has the cut | interruption 43 which connects the parallel cut | interruptions 42 and 42 at right angles to the parallel cut | interruption. On the other end side, there is no cut connecting the parallel cuts, and it is in an integrated state with the flat plate 41 of the raw material. That is, a U-shaped cut is formed in the flat plate 41 of the raw material, and one end side thereof forms a free end 44 and the other end side is a fixed end 45 integrated with the raw material.

  And in this example, the one end side which forms the free end 44 is separated from the flat plate 41 of the raw material, that is, cut up and lifted away from the flat surface of the raw material. In this state, the spring member 40 of this example is attached to the conductive pattern 33 of the sub-board 30 by reflow soldering.

  In this example, conductive patterns 33 are formed on both side surfaces of the sub-board 30, and the conductive spring member 40 is attached to the conductive pattern 33 in a bonded state as described above. Before the sub board 30 is inserted into the slit of the main board 20, the spring members 40 are attached to both side surfaces of the sub board 30, and the thickness of the sub board 30 in that state, that is, The interval between the free ends 44 of the spring members 40 attached to both side surfaces is larger than the width of the slit 21.

  Therefore, when the sub-board 30 is inserted into the slit 21 of the main board 20, a part on the one end (free end 44) side of the spring member 40 moves while contacting the inner surface of the slit 21. When the insertion is completed, one end of the sub-board 30, that is, the free end 44 is returned to the original position by the elastic force. That is, it expands again beyond the width of the slit 21.

  Referring to FIG. 4, a state where the sub-board 30 is inserted into the slit 21 of the main board 20 is illustrated in a cross-sectional view.

  A conductive pattern 23 is also provided on the solder surface side of the main board 20 at a position corresponding to the conductive pattern 33 of the sub-board 30.

  Here, what is important is that the tip of the free end 44 of the spring member 40 attached to the sub-board 30 is in pressure contact with the conductive pattern 23 on the solder surface side of the main board 20. That is, in FIG. 4, the sub-board 30 pushes the solder surface of the main board 20 with the elastic force from the free end 44 of the spring member 40 upward, and counteracts against this to react to the shoulder of the sub-board 30. 32 has a structure in which the component surface side of the main board 20 is pressed downward. As a result, the sub board 30 is held by the main board 20 in such a manner that the main board 20 is sandwiched between the shoulder 32 and the free end 44 of the spring member 40 by the elastic force through the slit 21 of the main board 20. The

  In this state, the conductive pattern 23 of the main substrate 20 and the terminal portion of the conductive pattern 33 formed on the surface of the sub substrate 30 are soldered.

  FIG. 5 shows a state after soldering. Since soldering is performed on the solder surface side, the state of the printed circuit board 10 viewed from the component surface side does not change even after soldering. As shown in FIG. 5, the solder 50 integrates the spring member and connects the terminal portion of the conductive pattern 23 of the main substrate 20 and the terminal portion of the conductive pattern 33 formed on the surface of the sub substrate 30.

  As a result, the sub-board 30 is held on the main board 20 without the “rattle” which has been a problem in the past, and the conductive patterns 23 and 33 of the main board 20 and the sub-board 30 are soldered. Thus, the main board 20 of the sub board 30 can be firmly fixed. Therefore, even when vibration, impact, or the like is applied to the printed circuit board 10, the stress load applied to the solder 50 between the terminals can be effectively suppressed.

  FIG. 6 shows another embodiment of the present invention. As shown in FIG. 6, the spring member 60 of this example is made by processing a raw material of a substantially T-shaped flat plate 61. That is, the wing-like portions 62 on both sides of the T-shaped raw material are bent from the base end 63 as indicated by arrows 64. In a bent state, the back surface side of the flat plate 61 is bonded to the terminal portion of the conductive pattern of the sub-board by reflow soldering. The bending angle can be 90 degrees or more, or 90 degrees or less. In any case, before the sub board 30 is inserted into the slit 21 of the main board 20, the thickness of the sub board 30 including the free end 65 of the spring member 60 exceeds the width of the slit 21 of the main board 20. When the sub-board 30 is inserted into the slit 21 of the main board 20, the spring member 60 attached to the sub-board 30 is inserted into the slit 21 from the direction indicated by the arrow 66 in FIG. 6. At the time of insertion, the tip (free end) 65 of the wing-shaped portion 62 moves while being pressed against the surface inside the slit 21. After the insertion, the free end 65 of the spring member 60 integrated with the sub-board 30 is returned to the original position by the elastic force. That is, it expands again beyond the width of the slit 21. At this time, the main substrate 20 is preferably sandwiched between the wing-shaped portion 62 and the shoulder portion 32 of the sub substrate 30. The spring member 60 shown in FIG. 7A is bent 90 degrees or more, and the spring member 60 shown in FIG. 7B is finished in a bent state of 90 degrees or less.

  The spring members 70, 80, and 90 shown in FIGS. 8, 9, and 10 are each formed by bending a flat plate material. The spring member 70 of FIG. 8 is formed by bending an expanded portion 72 of the raw material 71 that gradually becomes wider from the top to the bottom in the drawing as indicated by an arrow 74 with a broken line 73 as a starting point. The spring member 80 in FIG. 9 is a triangular raw material 81 that gradually increases in width from the upper end to the lower side in the drawing, and a triangular portion 83 that extends from the broken line 82 of the raw material 81 to the front end is indicated by an arrow 84. It is formed by bending as follows. The bending angle may be an acute angle or an obtuse angle as in the example of FIG. 6, as long as it is in pressure contact with the slit 21 of the main substrate 20 when the sub substrate 30 is inserted.

  In the case of this example, as long as the spring member is positioned between the conductive pattern of the sub-board and the conductive pattern of the main board, the bent tip (free end) does not necessarily return after insertion, and is in a pressure contact state. It may be.

  The spring member 90 of the embodiment shown in FIG. 10 has an L-shaped cut 92 in a rectangular raw material 91 similar to that cut and raised as shown in FIG. Formed. It functions similarly to the spring member of the embodiment of FIG.

  In addition to the embodiment shown in this example, spring members having various shapes within the scope described in the claims can be used.

10 Printed circuit board 20 Main circuit board 21 Slit 32 Shoulder part 23 Conductive pattern (copper foil)
30 Sub-board 33 Terminal portion 40 of conductive pattern Spring member 41 Raw materials 42, 43 Cut 44 Free end 45 Fixed end 50 Solder 70, 80, 90 Spring member

Claims (4)

A main board on which electronic components are arranged;
In a printed board comprising: a sub-board that plays an auxiliary role for the main board; and a spring member made of a conductive material attached to the conductive pattern of the sub-board.
The sub board is adapted to be combined with the main board by being inserted into a slit that forms an opening provided in the main board,
One end side of the spring member is fixed to the conductive pattern of the sub board and the other end side is a free end. When the sub board is inserted into the main board and combined, the other end side is the main board. Is in pressure contact with the surface of
A printed circuit board in which the spring member and the conductive pattern of the main substrate are solder-bonded after the insertion operation is completed. A main board on which electronic components are arranged;
In a printed board comprising: a sub-board that plays an auxiliary role for the main board; and a spring member made of a conductive material attached to the conductive pattern of the sub-board.
The sub board is adapted to be combined with the main board by being inserted into a slit that forms an opening provided in the main board,
The spring member is fixed to the conductive pattern of the sub board on the front end side of the sub board in the main board insertion direction, the rear end side is a free end, and the rear end side of the sub board is the sub board. Spaced apart from the surface beyond the width of the slit,
When the sub board is inserted into the main board, the rear end side of the spring member is displaced to a position close to the surface of the sub board by the pressure applied from the side surface of the slit, and the sub board is inserted into the slit. Enable operation,
After the sub board is inserted into the main board, the rear end side of the spring member is configured to return from the surface of the sub board to a position exceeding the width of the slit,
A printed circuit board in which the spring member and the conductive pattern of the main board are solder-bonded after the insertion operation is completed.   The printed circuit board according to claim 1, wherein the spring member has a cut-and-raised structure.   The printed circuit board according to claim 1, wherein the spring member has a bent structure.

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