JP2018530664A - An evaporation source for organic materials, an apparatus having an evaporation source for organic materials, and a method for depositing organic materials. - Google Patents

Abstract

An evaporation source (100) for depositing source material on a substrate (10) is described. The evaporation source includes an evaporation crucible (104), the evaporation crucible is configured to evaporate the source material, the evaporation source further includes a distribution unit (130) having one or more outlets (212), and the distribution unit is an evaporation crucible. One or more outlets are configured to supply source material to the substrate in the deposition direction (101), and the evaporation source is further provided with one or more openings (221). 1 cooling shield configuration (201), a heating shield configuration (202) provided at a distance from the first cooling shield configuration (201), the heating shield configuration (202) comprising one or more apertures (222) including. The first cooling shield configuration (201) is disposed between the distribution unit (130) and the heating shield configuration (202), and the evaporation source (100) is from one or more outlets (212) in the deposition direction (101). It is configured to define a path for the material through one or more openings (221) and one or more apertures (222) to the substrate. [Selection] Figure 1

Description

  Embodiments of the present disclosure relate to organic material deposition, for example, a system for depositing materials such as organic materials, a source for organic materials, and a deposition apparatus for organic materials. Embodiments of the present disclosure relate specifically to an evaporation source for organic materials, the evaporation source being for an evaporation apparatus and / or manufacturing system for manufacturing a device, particularly a device containing an organic material therein. It is.

  An organic evaporator is a tool for the manufacture of organic light emitting diodes (OLEDs). An OLED is a special light emitting diode in which a light emitting layer includes a thin film of a specific organic compound. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, cell phones, and other portable devices for displaying information. OLEDs can also be used for general space illumination. Since OLED pixels emit directly and do not require backlighting, the range of colors, brightness, and viewing angles possible with OLED displays is wider than that of conventional LCD displays. Thus, the energy consumption of an OLED display is significantly less than that of a conventional LCD display. Furthermore, the fact that OLEDs can be manufactured on flexible substrates provides further applications. For example, a typical OLED display includes a layer of organic material disposed between two electrodes, all deposited on a substrate in such a way as to form a matrix display panel with individually energizable pixels. obtain. An OLED is typically placed between two glass panels and the ends of the glass panel are sealed to encapsulate the OLEDs therein.

  Many problems are encountered when manufacturing such display devices. An OLED display or OLED lighting application includes, for example, a stack of several organic materials that evaporate in a vacuum. The organic material is subsequently deposited through a shadow mask. In order to efficiently manufacture an OLED stack, it is desirable to co-deposit or co-evaporate two or more materials (eg, host and dopant) so that a mixed / doped layer is produced. Furthermore, it must be taken into account that there are several process conditions for the evaporation of very delicate organic materials.

  In order to deposit the material on the substrate, the material is heated until the material evaporates. A tube directs the evaporated material through the nozzle to the substrate. Recently, the accuracy of the deposition process has increased, and for example, it has become possible to provide very small pixel sizes. In one process, a mask is used to define a pixel as the evaporated material passes through the mask opening. However, the shadowing effect of the mask and the spread of the evaporated material make it difficult to further increase the accuracy and predictability of the evaporation process.

  In view of the above, it is beneficial to increase the accuracy and predictability of the evaporation process in order to produce devices with high quality and accuracy.

  In view of the above, an evaporation source, a deposition apparatus and a method for depositing evaporated material on a substrate are provided according to the independent claims. Further advantages, features, aspects and details are evident from the dependent claims, the description herein and the accompanying drawings.

  According to one aspect of the present disclosure, an evaporation source is provided for depositing material on a substrate. The evaporation source includes an evaporation crucible, the evaporation crucible is configured to evaporate the material, the evaporation source further includes a distribution unit having one or more outlets, the distribution unit being in fluid communication with the evaporation crucible, the one or more outlets being A first cooling shield configuration configured to supply material to the substrate in the deposition direction and the evaporation source further including one or more openings, spaced from the first cooling shield configuration. Including a heat shield configuration provided, the heat shield configuration includes one or more apertures, the first cooling shield configuration is disposed between the distribution unit and the heat shield configuration, and the evaporation source is one or more in the deposition direction. Is configured to define a path for the material from the outlet to the substrate through the one or more openings and the one or more apertures.

  According to another aspect of the present disclosure, a deposition apparatus is provided that includes one or more evaporation sources according to embodiments described herein.

  According to another aspect of the present disclosure, a deposition apparatus is provided that includes one or more evaporation sources according to embodiments described herein. The evaporation source includes an evaporation crucible, the evaporation crucible is configured to evaporate the material, the evaporation source further includes a distribution unit having one or more outlets, the distribution unit being in fluid communication with the evaporation crucible, the one or more outlets being A first cooling shield configuration configured to supply material to the substrate in the deposition direction and the evaporation source further including one or more openings, spaced from the first cooling shield configuration. Including a heat shield configuration provided, the heat shield configuration includes one or more apertures, the first cooling shield configuration is disposed between the distribution unit and the heat shield configuration, and the evaporation source is one or more in the deposition direction. Is configured to define a path for the material from the outlet to the substrate through the one or more openings and the one or more apertures.

  According to a further aspect of the present disclosure, a method for depositing material on a substrate is provided. The method includes evaporating the material and applying the evaporated material to the substrate, wherein applying the evaporated material to the substrate provides the evaporated material in the deposition direction through one or more outlets of the dispensing unit. And evaporating material through one or more openings of the first cooling shield configuration and one or more apertures of the heating shield configuration.

  The present disclosure is also directed to an apparatus for performing the method, including an apparatus portion for performing the method of the present disclosure. The method may be performed by hardware components, a computer programmed with appropriate software, any combination of the two, or any other method. Furthermore, the present disclosure is also directed to a method of operating the described apparatus. This includes methods for performing all functions of the device.

  In order that the above features of the present disclosure may be understood in detail, a more specific description of the present disclosure, briefly outlined above, may be obtained by reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described in the following description.

FIG. 3 shows a schematic diagram of an evaporation source, according to embodiments herein. FIG. 4 shows a schematic diagram of an evaporation source according to further embodiments herein. FIG. 3 shows a schematic diagram of a portion of an evaporation source, according to embodiments described herein. FIG. 3 shows a schematic diagram of a portion of an evaporation source, according to embodiments described herein. FIG. 6 shows a schematic diagram of another evaporation source, according to embodiments described herein. FIG. 4 shows a schematic side view of an evaporation source according to embodiments herein. FIG. 4 shows a schematic side view of an evaporation source according to embodiments herein. FIG. 6 shows a schematic top view of an evaporation source according to further embodiments herein. FIG. 4 shows a schematic top view of an evaporation source according to still further embodiments herein. FIG. 3 shows a schematic top view of a deposition apparatus for depositing source material in a vacuum chamber, according to embodiments described herein. FIG. 3 shows a schematic block diagram illustrating a method of depositing source material on a substrate according to embodiments described herein. FIG. 3 shows a schematic block diagram illustrating a method of depositing source material on a substrate according to embodiments described herein.

  Reference will now be made in detail to various embodiments of the disclosure, one or more examples of which are illustrated. Within the following description of the drawings, the same reference numbers refer to the same components. In the following, only the differences with respect to the individual embodiments are described. Each example is provided by way of explanation of the disclosure, but is not intended to limit the disclosure. Further, features illustrated and described as part of one embodiment may be used in other embodiments or used in combination with other embodiments. Thereby, yet another embodiment is created. This description is intended to include such modifications and variations.

In this disclosure, the term “source material” may be understood as a material that is evaporated and deposited on the surface of a substrate. For example, in the embodiments described herein, the evaporated material deposited on the surface of the substrate can be an organic source material. Non-limiting examples of organic materials include one or more of the following. That is, ITO, NPD, Alq ₃ , quinacridone, Mg / AG, starburst material, and the like.

  In the present disclosure, the term “fluid communication” is understood to mean that two elements in fluid communication can exchange fluid via a connection, allowing fluid flow between the two elements. obtain. In one example, the fluid communication element may include a hollow structure through which fluid can flow. According to certain embodiments, at least one of the fluidly communicating elements can be a tube-like element.

  In this disclosure, the term “evaporation source” may be understood as a configuration that supplies a source material to be deposited on a substrate. In particular, the evaporation source can be configured to supply a source material to be deposited on a substrate in a vacuum chamber, such as a vacuum deposition chamber of a deposition apparatus. According to certain embodiments described herein, the evaporation source can be configured to evaporate the source material to be deposited on the substrate. For example, the evaporation source comprises an evaporator or crucible, the crucible evaporates the raw material to be deposited on the substrate, the evaporation source further comprises a distribution unit, the distribution unit in particular in the direction towards the substrate through one or more outlets, for example. Release the evaporated material.

  In this disclosure, the term “crucible” may be understood as a device or container that supplies or contains a source material to be deposited. Typically, the crucible can be heated to evaporate the source material to be deposited on the substrate. According to embodiments herein, the crucible can be in fluid communication with a distribution unit to which source material evaporated by the crucible can be carried.

  The “distribution unit” or “distribution pipe” may be a unit for supplying evaporated raw material. In particular, the distribution unit may be configured to supply the source material evaporated from the crucible through one or more outlets to the substrate. A “distribution unit” or “distributor” may include one or more outlets. The “distribution unit” or “distributor” can be, for example, an elongated tube so that the outlet is away from or not directly adjacent to the crucible.

  In this disclosure, the term “cooling shield configuration” may be understood as a shield configuration configured to be actively cooled. In particular, the cooling shield configuration described herein can be configured to be cooled to the condensation temperature of the source material to be deposited on the substrate, as described herein. For example, the cooling shield configuration described herein may be configured to be cooled to a temperature of less than 50 ° C, particularly less than 40 ° C, more particularly less than 30 ° C, such as approximately 20 ° C. .

  In this disclosure, the term “heat shield configuration” may be understood as a shield configuration configured to be actively heated. In particular, the heat shield configuration described herein is configured to be actively heated to a temperature corresponding to the evaporation temperature of the source material to be deposited on the substrate, as described herein. Can be done. It should be understood that the heat shield configuration described herein can also be configured to be actively heated to a temperature above the evaporation temperature of the source material to be deposited on the substrate.

  In the present disclosure, the term “deposition direction” may be understood as the main release direction of evaporated source material supplied through one or more outlets of the distribution unit, as described herein. In particular, the deposition direction described herein can be understood as a direction falling within a range of +/− 20 degrees with respect to the horizontal.

  FIG. 1 shows a schematic diagram of an evaporation source 100 according to an embodiment herein. In particular, as illustrated in FIG. 1, the evaporation source 100 includes an evaporation crucible 104 configured to evaporate the source material. Further, the evaporation source 100 includes a distribution unit 130 having one or more outlets 212. Distribution unit 130 is in fluid communication with evaporation crucible 104. One or more outlets 212 of the distribution unit 130 are configured to supply source material to the substrate 10 in the deposition direction 101. Further, the evaporation source 100 includes a first cooling shield configuration 201 that includes one or more openings 221. As exemplarily shown in FIG. 1, the evaporation source 100 further includes a heating shield configuration 202 disposed at a distance from the first cooling shield configuration 201. Heat shield arrangement 202 includes one or more apertures 222. The first cooling shield configuration 201 is disposed between the distribution unit 130 and the heating shield configuration 202. Further, according to the embodiment herein illustrated by way of example in FIG. 1, the evaporation source 100 includes one or more openings 221 and one or more apertures 222 from one or more outlets 212 in the deposition direction 101. It is configured to define a path for the source material through the substrate 10.

  Thus, by providing an evaporation source according to embodiments described herein, for example, the incident angle of evaporated source material supplied to the substrate through the mask is limited to reduce the shadowing configuration of the mask. As can be done, a predetermined discharge angle behind the heat shield arrangement in the deposition direction can be provided. Thus, improved resolution of the source material deposited on the substrate can be achieved. In addition, beneficially, the evaporation source according to the embodiments described herein can include one or more apertures and one of the dispensing units in a heat shield configuration so that stable deposition process conditions can be maintained over time. It also provides for the suppression or even avoidance of these clogging outlets. This is because the evaporated source material that does not pass through one or more apertures in the heat shield configuration is back confused to the first cooling shield configuration where the evaporated source material condenses, thereby causing a back mess. This is because the source material can be collected on the first cooling shield configuration. Thus, the one or more apertures in the heat shield configuration and the one or more outlets of the dispensing unit remain clean throughout the deposition process.

  As exemplarily shown in FIG. 1, the one or more apertures 222 of the heat shield configuration 202 provide a discharge angle (θ) of the evaporated source material supplied through one or more outlets 212 of the distribution unit 130. Can be limited. Thus, according to the embodiments described herein, the heat shield arrangement 202 is configured to delimit the distribution cone or plume 318 of evaporated source material that is dispensed toward the substrate 10. It should be understood that it can be configured as follows. In particular, the heat shield configuration 202 may be configured to block at least a portion of the evaporated source material, as exemplarily shown in FIG. 1, by a dotted arrow reflected from the heat shield configuration 202. In general, one or more apertures 222 of the heat shield configuration 202 may be arranged to align with one or more outlets 212 of the dispensing unit 130 in the deposition direction 101. In particular, the one or more apertures 222 of the heat shield configuration 202 have a predetermined emission angle (θ) behind the heat shield configuration 202, ie, when evaporated source material passes through the one or more apertures 222. Configured and arranged to be provided. In other words, the heat shield arrangement 202 is 30 centimeters from the main discharge direction (also referred to herein as the deposition direction) of evaporated source material supplied from any of the one or more outlets 212 of the distribution unit 130. It can be adapted to block evaporated source material having a predetermined emission angle (θ) above 50 degrees, in particular above 40 degrees, for example above 45 degrees. Thus, by providing an evaporation source according to the embodiments described herein, the shadowing effect caused by a mask provided in front of the substrate is reduced, thereby reducing the source material deposited on the substrate. Improved resolution can be realized.

  According to embodiments, which can be combined with any other embodiment described herein, the heat shield arrangement 202 is configured to be heated to a first temperature. In particular, the first temperature at which the heat shield structure 202 can be heated can correspond to the evaporation temperature of the source material to be deposited. For example, the heat shield configuration 202 may include a heating element. The heating element may be installed or attached in a heat shield configuration. Additionally or alternatively, the heating element may be disposed within a heat shield configuration. For example, the heating element can be a thermoelectric heating device. Thus, by providing a heat shield arrangement that is heated to above the evaporation temperature of the source material to be deposited, the molecules of the evaporated source material that have left the one or more outlets, for example, the nozzle, are heated at a large angle. Impinges on the wall around one or more apertures, but cannot adhere to the heat shield configuration. As a result, the one or more apertures in the heat shield configuration remain clean throughout the deposition process, and clogging of the one or more apertures in the heat shield configuration can be avoided.

  According to the embodiments described herein, the heat shield arrangement is heated to an evaporation temperature of about 100 ° C. to about 600 ° C., in particular to an evaporation temperature of about 150 ° C. to about 450 ° C. Can be configured. In certain embodiments, the heat shield configuration may include, for example, a material that is chemically inert to the evaporated organic material. According to certain embodiments, the heat shield configuration comprises at least one material selected from the group consisting of stainless steel, quartz crystal glass, Ta, Ti, Nb, DLC, and graphite, or It may include a coating using at least one of the materials. Thus, accumulation of evaporated source material on the heat shield configuration can be prevented.

  As illustrated by way of example in FIG. 1, according to an embodiment that may be combined with any other embodiment described herein, the first cooling shield configuration 201 is one of the distribution units 130. It may be configured to surround the above outlet 212 from the side. In particular, the first cooling shield configuration 201 can be configured to be actively cooled to the condensation temperature of the source material to be deposited. Accordingly, the first cooling shield configuration is configured to collect evaporated source material that has been confused backward from the heating shield configuration. In addition, beneficially, one or more outlets of the dispensing unit remain clean throughout the deposition process, avoiding clogging of the one or more outlets of the dispensing unit, thereby ensuring stable deposition process conditions over time. Can be maintained.

  According to certain embodiments, which may be combined with other embodiments described herein, the first cooling shield configuration 201 includes a cooling fluid, such as air, nitrogen, water, or other suitable cooling fluid. May be provided by one or more metal plates having conduits for For example, a conduit for the cooling fluid may be attached to the first cooling shield configuration or provided within the first cooling shield configuration. Additionally or alternatively, the first cooling shield configuration may include a thermoelectric cooling device or any other cooling device suitable for the first cooling shield configuration. According to certain embodiments, the first cooling shield configuration may include at least one material selected from the group consisting of: That is, Cu, Ta, Ti, Nb, DLC, and graphite (eg, covered with Ni plating). Further, the first cooling shield configuration may include a coating using at least one of these materials.

  In accordance with an embodiment that may be combined with any other embodiment described herein, one or more outlets 212 of the dispensing unit 130 may be connected to the dispensing unit as exemplarily shown in FIG. It can be provided in the heating wall 135. For example, the heating wall 135 can include a heating element. The heating element can be installed or attached to the heating wall 135. Additionally or alternatively, the heating element may be located within the heating wall 135 of the dispensing unit. For example, the heating element can be a thermoelectric heating device. In particular, the heating wall 135 is configured to be heated to a second temperature substantially corresponding to the first temperature to which the heating shield arrangement is heated. Accordingly, the heated wall and the heated shield configuration can be configured to have substantially equal thermal expansion. Thereby, the one or more outlets of the dispensing unit, which can be connected to the heating wall, remain aligned with the one or more apertures of the heating shield arrangement throughout the deposition process.

  According to certain embodiments, which can be combined with any other embodiment described herein, the heat shield arrangement 202 and the heating wall 135 of the dispensing unit 130 exhibit substantially equal thermal expansion. It is configured. For example, the heat shield configuration 202 and the heating wall 135 of the dispensing unit 130 can be made from the same material. Additionally or alternatively, as described above, the heat shield structure 202 and / or the heating wall 135 of the dispensing unit 130 is heated so that the thermal expansion of the heat shield structure 202 and the thermal expansion of the heating wall 135 are equal. Heating elements may be included. For example, if the heat shield arrangement 202 is made from a material that has a higher thermal expansion than the material from which the heating wall 135 is made, to provide equal thermal expansion, the heating wall of the dispensing unit 130 135 can be heated to a higher temperature than the heat shield configuration 202. Thus, beneficially, the location of the one or more outlets of the dispensing unit that can be coupled to the heating wall remains aligned with the location of the one or more apertures of the heat shield configuration throughout the deposition process.

  Illustratively referring to FIG. 2, according to an embodiment that may be combined with any other embodiment described herein, the heat shield configuration 202 of the evaporation source 100 is connected via a coupling element 232. It can be connected to the heating wall 135 of the distribution unit 130. Thus, the alignment of the position of the one or more outlets of the dispensing unit with the position of the one or more apertures of the heat shield configuration can be improved.

  According to certain embodiments, the coupling element 232 may be configured to adjust the distance between the heating wall 135 and the heating shield configuration 202 of the dispensing unit 130. For example, the coupling element 232 can be configured to move the heat shield configuration 202 relative to the heating wall 135. Accordingly, it is understood that by adjusting the distance between the heating wall 135 of the dispensing unit 130 and the heating shield configuration 202, the emission angle (θ) of the evaporated source material behind the heating shield configuration can be adjusted. Should. For example, by increasing the distance between the heating wall 135 of the dispensing unit 130 and the heat shield configuration 202, the emission angle (θ) of the evaporated source material behind the heat shield configuration can be reduced. Thus, the shadowing effect of the mask provided between the heat shield structure and the substrate can be reduced, resulting in improved resolution of the source material deposited on the substrate.

  According to an embodiment that may be combined with any other embodiment described herein, the evaporation source 100 includes a second cooling shield configuration 203, as exemplarily shown in FIG. . In particular, the second cooling shield arrangement 203 can be arranged behind the heating shield arrangement 202 in the deposition direction 101. As exemplarily shown in FIG. 2, the second cooling shield configuration 203 is arranged to align with one or more apertures 222 of the heating shield configuration 202 in the deposition direction 101. An opening 223 is included. Thus, by providing a second cooling shield configuration that is positioned behind the heat shield configuration in the deposition direction, the thermal load on the mask 20 and / or the substrate 10 can be reduced. It can be beneficial to achieve improved resolution of the source material deposited on the substrate.

  According to embodiments that may be combined with any other embodiment described herein, one or more outlets 212 of the dispensing unit 130 may include one or more outlets, as exemplarily shown in FIG. Nozzle 125. In particular, the one or more nozzles 125 may be arranged and configured to extend along the deposition direction 101. More particularly, the one or more nozzles 125 may be arranged and configured to protrude from the one or more openings 221 of the first cooling shield configuration 201. For example, the one or more nozzles 125 may have one or more openings 221 in the first cooling shield configuration 201 by a distance of 2 mm or more, particularly 4 mm or more, more particularly 5 mm or more in the direction toward the substrate, for example, the deposition direction 101. Can protrude from. Accordingly, one or more outlets of the dispensing unit can be constrained or even removed so that stable deposition process conditions can be maintained over time.

  3A-3C illustrate a portion of an evaporation source according to embodiments described herein. As shown in FIG. 3A, the evaporation source may include a distribution unit 130 or distribution pipe 106 and an evaporation crucible 104. For example, the distribution unit 130 or distribution pipe 106 can be an elongated tube having a heating unit 215. The evaporation crucible can be a container for a source material such as an organic material to be evaporated by the crucible heating element 225.

  According to embodiments that may be combined with other embodiments described herein, multiple openings and / or outlets such as nozzles may be arranged along the length of the evaporation source. In particular, the plurality of openings and / or outlets may be arranged along the length of the distribution unit or distribution pipe. According to an alternative embodiment, one elongate opening may be provided that extends along the length of the evaporation source and / or the length of the distribution unit, for example the distribution pipe. For example, the elongated opening can be a slit.

  According to certain embodiments, which can be combined with other embodiments described herein, a distribution unit, eg, a distribution pipe, extends essentially perpendicular to the length. For example, the length of the distribution unit or distribution pipe corresponds at least to the height of the substrate to be deposited in the deposition apparatus. In many cases, the length of the dispensing unit will be at least 10% or even 20% longer than the height of the substrate to be deposited. It allows for uniform deposition at the top and / or bottom of the substrate.

  According to certain embodiments, which can be combined with other embodiments described herein, the length of the distribution unit, in particular the distribution pipe, can be 1.3 m or more, for example 2.5 m or more. As shown in FIG. 3A, according to one configuration, the evaporation crucible 104 is provided at the lower end of the distribution unit 130 or the distribution pipe 106. Usually, the raw material evaporates in the evaporation crucible 104. Evaporated source material enters the bottom of the distribution pipe and is directed essentially laterally through a plurality of openings in the distribution pipe, for example, toward a substrate that is oriented essentially vertically.

  According to certain embodiments, which may be combined with other embodiments described herein, the plurality of outlets, eg, one or more outlets of the dispensing unit, is predominantly +/− 20 degrees relative to the horizontal. Arranged to have a discharge direction. According to certain embodiments, the primary emission direction may be oriented slightly upward (eg, upward within a range of 15 degrees from horizontal, such as 3 degrees to 7 degrees upward). Similarly, the substrate may be slightly tilted so that it is substantially perpendicular to the evaporation direction so that the generation of undesirable particles can be reduced.

  FIG. 3B shows an enlarged schematic view of a portion of the evaporation source of the distribution unit 130, for example, the distribution pipe 106, which is coupled to the evaporation crucible 104. A flange unit 233 may be provided that is configured to provide a connection between the evaporation crucible 104 and the distribution pipe 106. For example, the evaporation crucible and the dispensing unit are provided as separate units that can be separated and connected or assembled with a flange unit, for example, for operation of the evaporation source.

  According to certain embodiments that may be combined with other embodiments described herein, the distribution unit 130, eg, the distribution pipe 106, has an internal cavity 210. Furthermore, a heating unit 215 can be provided for heating the distribution unit 130, in particular the distribution pipe 106. The distribution unit 130 can be heated to a temperature such that the evaporated source material supplied by the evaporation crucible 104 does not condense in the distribution unit 130, for example, the inner portion of the wall of the distribution pipe 106. As illustrated by way of example in FIG. 3B, two or more heat shields 217 may be provided around the tube of the dispensing unit 130. The heat shield is configured to reflect the thermal energy provided by the heating unit 215 back toward the internal cavity 210. Accordingly, since the heat shield 217 beneficially reduces heat loss, the energy for heating the distribution unit 130, eg, the distribution pipe 106, ie, the energy provided to the heating unit 215 may be reduced. Heat transfer to other distribution units and / or masks or substrates can be reduced. According to certain embodiments, which can be combined with other embodiments described herein, the heat shield 217 has two or more heat shield layers, eg, five or more heat shield layers, such as ten heat shield layers. A heat shield layer can be included.

  Typically, as shown in FIG. 3B, the heat shield 217 includes an opening at the location of the outlet 212 in the distribution unit 130, eg, the distribution pipe 106. The enlarged view of the evaporation source shown in FIG. 3B shows four outlets. The outlet 212 may be provided along the length direction of the distribution unit 130 or the distribution pipe 106. As described herein, distribution unit 130 or distribution pipe 106 is a straight distribution unit having a plurality of openings (also referred to herein as one or more outlets) disposed therein. In particular, it can be provided as a straight distribution pipe. For example, a distribution pipe can have one outlet. For example, the distribution pipe may have more than 30 outlets, such as 40, 50, or 54 outlets disposed along the length of the distribution unit. According to embodiments herein, the outlets can be spaced from each other. For example, the outlets can be spaced by a distance of 1 cm or more, for example a distance of 1 cm to 3 cm, such as a distance of 2 cm.

  As will be understood herein, a distribution unit, such as a distribution pipe, has a housing, a cavity, or a tube. Into it, for example, material can be fed or guided from an evaporation crucible. The dispensing unit may have a plurality of openings (or elongated slits) so that the pressure in the dispensing unit is higher than the outside of the dispensing unit. For example, the pressure in the dispensing unit can be at least an order of magnitude higher than the pressure outside the dispensing unit.

  During operation, the distribution unit 130, for example, the distribution pipe 106, is connected to the evaporation crucible 104 at the flange unit 233. The evaporation crucible 104 is configured to accept a source material to be evaporated and evaporate the source material. FIG. 3B shows a cross-sectional view through the housing of the evaporation crucible 104. A refill opening that can be closed using, for example, a plug 252, lid, cover, etc., for closing the housing of the evaporation crucible 104 in the upper portion of the evaporation crucible 104 as shown in FIG. 3B. Can be provided.

  With reference to FIG. 3B exemplarily, an outer crucible heating element 225 may be provided within the housing of the evaporation crucible 104. The outer crucible heating unit 225 may extend along at least a portion of the evaporation crucible 104 wall. According to certain embodiments that may be combined with other embodiments described herein, one or more central heating elements may be provided in addition or alternatively. FIG. 3B shows two central heating elements. The first central heating element 226 and the second central heating element 228 may include a first conductor 229 and a second conductor 230 for supplying power to the central heating element, respectively.

  According to certain embodiments described herein, heat shields such as shield 217 and shield 227 can be provided at the evaporation source. The heat shield can reduce energy loss from the evaporation source. It also reduces the overall energy consumed by the evaporation source to evaporate the source material. However, as a further aspect, particularly for the deposition of organic materials, the heat radiation emitted from the evaporation source, in particular the heat radiation directed to the mask and the substrate being deposited, can be reduced. In particular, for organic material deposition on a masked substrate, and also for display manufacturing, the substrate and mask temperatures need to be accurately controlled. Thermal radiation emanating from the evaporation source can be reduced or avoided by heat shields, such as heat shield 217 and heat shield 227, for example.

  These shields can include several shield layers to reduce heat radiation to the outside of the evaporation source. As a further option, the heat shield may include a shield layer that is actively cooled by a fluid such as air, nitrogen, water or other suitable cooling fluid. According to still further embodiments described herein, the one or more heat shields include a metal plate that surrounds a respective portion of the evaporation source, eg, surrounds the distribution pipe 106 and / or the evaporation crucible 104. be able to. According to embodiments herein, for example, the metal plate can have a thickness of 0.1 mm to 3 mm and is selected from the group consisting of ferrous alloys (SS) and non-ferrous metals (Cu, Ti, Al). At least one material selected and / or can be spaced from one another by, for example, a gap of 0.1 mm or more.

  According to certain embodiments described herein, an evaporation crucible 104 is provided below the dispensing unit 130, as exemplarily shown in connection with FIGS. 3A and 3B. . According to yet further embodiments, which may be combined with other embodiments described herein, another position in the central portion of the dispensing unit 130 or between the lower end of the dispensing unit and the upper end of the dispensing unit. A steam conduit 242 may be provided.

  FIG. 3C shows an example of an evaporation source having a distribution pipe 106 and a vapor conduit 242 provided in the central portion of the distribution pipe. The evaporated source material generated in the evaporation crucible 104 is guided to the central portion of the distribution pipe 106 through the vapor conduit 242. The evaporated raw material exits the distribution pipe 106 through a plurality of outlets 212. Distribution pipe 106 is supported by support 102 as described in connection with other embodiments described herein. According to still further embodiments herein, two or more steam conduits 242 may be provided at various locations along the length of the distribution pipe 106. The vapor conduit 242 may be connected to one evaporation crucible or may be connected to several evaporation crucibles. For example, each vapor conduit 242 may have a corresponding evaporation crucible 104. Alternatively, the evaporation crucible 104 may be in fluid communication with two or more vapor conduits 242 that are connected to the distribution pipe 106.

  As used herein, the term “distributor” may be understood as a tube for inducing and supplying evaporated source material. In particular, the distribution pipe can guide the evaporated source material from the crucible to a plurality of outlets (such as openings) in the distribution pipe. As used herein, the term “multiple outlets” typically includes at least two or more outlets. According to embodiments herein, the distribution pipe may be a first distribution pipe extending in the longitudinal direction, in particular first. In the embodiments described herein, the longitudinal direction typically refers to the length direction of the distribution pipe. In certain embodiments, the distribution pipe may include a pipe having a cylindrical shape. The cylinder may have a circular bottom shape or any other suitable bottom shape, for example a triangular shape.

  For example, the distribution pipe can be a hollow cylinder. The term “cylinder” can be generally understood as having a circular bottom shape, a circular upper shape, and a curved surface region or outline that connects the upper and lower circles. According to further or alternative embodiments, which may be combined with other embodiments described herein, the term cylinder in the mathematical sense is any bottom shape, the same top shape, and It can be further understood as having a curved surface area or outline connecting the upper and lower shapes. The cylinder does not necessarily have a circular cross section.

  FIG. 4A shows a schematic side view of a portion of an evaporation source, according to embodiments herein, that may be combined with any other embodiment described herein. As shown in FIG. 4A, one or more outlets 212 of the dispensing unit 130 are configured to supply source material to the substrate 10 in the deposition direction 101, for example, through the mask 20. In addition, a first cooling shield configuration 201 that includes one or more openings 221 collects evaporated source material blocked by a heating shield configuration 202 provided at a distance from the first cooling shield configuration 201. Is provided. Heat shield arrangement 202 includes one or more apertures 222 to limit the emission angle (θ) of the evaporated source material supplied through one or more outlets 212. Furthermore, a second cooling shield arrangement 203 is provided which is arranged behind the heating shield arrangement 202 in the deposition direction 101. The second cooling shield configuration 203 may be provided by one or more metal plates having conduits for cooling fluid, such as air, nitrogen, water, or other suitable cooling fluid. For example, a conduit for cooling fluid may be attached to the second cooling shield configuration or provided within the second cooling shield configuration. Additionally or alternatively, the second cooling shield configuration may include a thermoelectric cooling device or any other cooling device suitable for the second cooling shield configuration. As illustratively shown in FIG. 4A, the second cooling shield configuration 203 is arranged to be aligned with one or more apertures 222 of the heating shield configuration 202 in the deposition direction 101. An opening 223 is included. Thus, as shown in FIG. 4A, the evaporation source 100 is formed of a source material from one or more outlets 212 in the deposition direction 101 through one or more openings 221 and one or more openings 222 to the substrate. Is configured to define a path for. A portion of the evaporated source material supplied from the one or more outlets 212 is blocked by the heat shield structure 202. Thereby, a predetermined discharge angle (θ) behind the heat shield arrangement 202 may be provided.

  Referring to FIG. 4B exemplarily, according to one embodiment, which may be combined with other embodiments described herein, at least one outlet of one or more outlets 212, particularly one or more Each outlet may be provided with a separate heating shield configuration 202 and / or a separate second cooling shield configuration 203. For example, the one or more outlets 212 may correspond to one or more nozzles to which a separate heating shield configuration 202 and / or a separate second cooling shield configuration 203 according to embodiments described herein are provided. It can be. For example, in FIG. 5, an exemplary embodiment is shown in which one outlet 212 is provided with a separate heating shield configuration 202 and a separate second cooling shield configuration 203.

  FIG. 5 shows a schematic top view of an evaporation source according to a further embodiment herein, which may be combined with any other embodiment described herein. In order to avoid unnecessary repetition, only the differences with respect to the embodiment shown in FIGS. 1, 2 and 4 are described. The evaporation source shown in FIG. 5 includes a distribution unit 130, such as a distribution pipe 106, having a triangular cross section. The wall of the dispensing unit can be heated by a heating element 380 attached or attached to the wall. An outer shield 302 surrounding the distribution unit may be provided to reduce heat radiation from the inside of the distribution unit to the outside of the distribution unit. Typically, the outer shield 302 can be cooled. For example, the outer shield can be provided by a metal plate having a conduit for a cooling fluid, such as water, attached to the outer shield or provided within the outer shield. Additionally or alternatively, a thermoelectric cooling device or another cooling device may be provided to cool the outer shield.

  Referring to FIG. 5 by way of example, according to certain embodiments that may be combined with other embodiments described herein, additional cooling shield configurations 211 may be provided. In particular, a further cooling shield arrangement 211 may be provided at a lateral distance from around the outlet of the one or more outlets. In particular, the further cooling shield arrangement 211 may extend at least partially in the deposition direction 101, as exemplarily shown in FIG. For example, the additional cooling shield configuration 211 may be an L-shaped member having a main portion that extends in the deposition direction. Similar to the first cooling shield configuration, the additional cooling shield configuration 211 may be configured to be cooled to the condensation temperature of the source material to be deposited on the substrate, as described herein. . Thus, the evaporated source material that does not pass through the apertures of the heating shield configuration is confused backwards with respect to the further cooling shield configuration 211 and / or the first cooling shield configuration 201, and the evaporated source material condenses there. Then it is understood. Thereby, the back-distracted source material can be collected on the further cooling shield arrangement and / or the first cooling shield arrangement.

  In certain embodiments described herein, as illustrated by way of example in FIG. 5, the substrate uses evaporated source material deposited on the substrate 10 through a mask 20, eg, a shadow mask. Can be processed. For example, for high resolution deposition above 800 pixels per inch, each pixel of evaporated source material formed at the surface of the substrate was typically emitted from more than one of the outlets of the evaporation source. Formed by evaporated source material. For example, evaporated source material from 10 of one or more outlets of the evaporation source contributes to the formation of each of the pixels formed on the surface of the substrate. It should be understood that the embodiments described herein are particularly useful for the production of high resolution displays. In particular, in order to limit the emission angle (θ) of the evaporated source material in the mask, the evaporated source material is blocked according to the emission angle of the plume of the evaporated source material supplied from one or more outlets. By providing a configured evaporation source, the shadowing effect of the mask is reduced, resulting in improved resolution of the source material deposited on the substrate.

  In the embodiments described herein, “evaporated source material plume angle from one or more outlets” includes the angle of the evaporated material plume from each of any number of outlets of the evaporation source. As such, it should be understood by those skilled in the art.

  FIG. 6 shows a schematic top view of an evaporation source, according to still further embodiments herein, that may be combined with any other embodiment described herein. In order to avoid unnecessary repetition, only the differences with respect to the embodiment shown in FIG. 5 are described. FIG. 6 shows an embodiment having three distribution units, eg, three distribution pipes, provided over the evaporator control housing 402 adjacent to the distribution unit and connected to the distribution unit via insulation 479. Show. The evaporator control housing is configured to maintain atmospheric pressure within the evaporator control housing and is selected from the group consisting of switches, valves, controllers, cooling units, cooling control units, heating control units, power supplies, and measurement devices Configured to receive at least one of the elements. In embodiments herein, the components for operating the evaporation source are provided near the evaporation crucible and the distribution unit under atmospheric pressure and can move through the deposition apparatus with the evaporation source.

  In the embodiments herein, one or more outlets can be distributed along the length of each of the distribution units, eg, distribution pipes 106, 107, 108, which can be configured as distribution pipes. Each dispensing unit is in fluid communication with an evaporation crucible (not shown in FIG. 6). Each distribution unit, for example, each of the plurality of openings of the distribution pipes 106, 107, 108, has a main discharge direction 101A, 101B, 101C for the evaporated source material. Since the shape of the distribution unit is essentially triangular, the evaporation cones or plumes resulting from the three distribution units are close to each other, which can improve the mixing of the raw material from different distribution units and outlets. The heat shield configuration 202 of the exemplary embodiment shown in FIG. 6 is similar to that described in connection with FIGS. 1, 2, 4, and 5 above, and the distribution pipe, For example, a distribution cone or plume of evaporated source material supplied from each of the distribution pipes 106, 107, 108 toward the substrate 10 and / or the mask 20 is defined.

  In view of the above, the embodiments of the evaporation source described herein are configured to limit the angle of incidence of evaporated source material supplied to the substrate, for example through a mask. Should be understood. It is heated to above the evaporation temperature of the raw material to be deposited, and from the main emission direction, a predetermined emission angle (θ above 30 degrees, in particular above 40 degrees, for example above 45 degrees The incident angle of the evaporated source material supplied to the substrate is, for example, through the mask, shadowing the mask, by providing a heat shield configuration adapted to block the evaporated source material having It can be limited to reduce the effect. Thus, improved resolution of the source material deposited on the substrate can be provided. Furthermore, by providing a first cooling shield configuration configured to be cooled to the condensation temperature of the source material to be deposited and disposed around and behind one or more outlets of the distribution unit, Evaporated source material that is confused backwards from the heat shield configuration is collected, thereby preventing clogging of one or more outlets of the dispensing unit. In light of that, the evaporated source material molecules leaving the nozzle at a small angle will pass through the aperture. Molecules leaving one or more outlets, eg, nozzles, at large angles will impinge on the walls around one or more apertures in the heat shield configuration, but will not stick to the heat shield configuration. This is because the heat shield arrangement is heated above the evaporation temperature of the source material to be deposited. Instead, the molecules are back confused and impinge on a first cooling shield arrangement located around the nozzle. Thus, evaporated source material, eg, evaporated source material used for OLED production, condenses in the first cooling shield configuration. As a result, the back-confused evaporated source material is collected on the first cooling shield configuration. Thereby, the one or more apertures in the heat shield configuration and the one or more outlets of the dispensing unit remain clean, whereby clogging can be suppressed or even completely eliminated. Thus, the embodiments described herein provide stable process conditions over time.

  FIG. 7 shows a schematic top view of a deposition apparatus 150 for depositing source material in a vacuum chamber 110 that includes an evaporation source 100 according to any embodiment described herein. According to certain embodiments, which can be combined with other embodiments described herein, the evaporation source is configured for translational movement and rotation about an axis. According to exemplary embodiments herein, the evaporation source may have one or more evaporation crucibles and one or more distribution units, such as one or more distribution pipes. For example, the evaporation source shown in FIG. 7 includes two evaporation crucibles 104 and two distribution pipes 130. As shown in FIG. 7, a first substrate 121 and a second substrate 122 are provided in the vacuum chamber 110 to receive the evaporated source material.

  According to embodiments herein, a mask assembly for masking a substrate may be provided between the substrate and the evaporation source. The mask assembly may include a mask and a mask frame for holding the mask in place. In embodiments herein, one or more additional tracks may be provided to support and position the mask assembly. For example, the embodiment shown in FIG. 7 includes a first mask 133 supported by a first mask frame 131 disposed between the evaporation source 100 and the first substrate 121, the evaporation source 100, and the second source. And a second mask 134 supported by a second mask frame 132 disposed between the substrate 122 and the substrate 122. The first substrate 121 and the second substrate 122 may be supported on respective transfer tracks (not shown) in the vacuum chamber 110.

  FIG. 7 further illustrates a heat shield configuration 202 according to embodiments herein, where the heat shield configuration 202 is vaporized source material behind the heat shield configuration in the deposition direction, as described herein. In order to limit the discharge angle (θ), the vaporized raw material is cut off in accordance with the plume discharge angle of the vaporized raw material supplied from one or more outlets. In embodiments herein, if a mask is used to deposit material on a substrate, such as in an OLED manufacturing system, the mask has a cross-sectional dimension of about 30 μm or less or about 20 μm (eg, a minimum cross-section). A pixel mask having a pixel opening having a size of about 50 μm × 50 μm or less, such as a pixel opening having a dimension). In one example, the pixel mask may have a thickness of about 40 μm. Considering the mask thickness and the size of the pixel opening, a shadowing effect can appear. Due to the shadowing effect, the walls of the pixel openings in the mask cover the pixel openings with shadows. It should be understood that by providing the evaporation source described herein, the shadowing effect can be reduced. Thus, improved resolution of the source material deposited on the substrate can be achieved.

  According to the embodiments described herein, the substrate can be coated with the source material in an essentially vertical position. Normally, distribution pipes provide a source that extends essentially vertically. In the embodiments described herein, which may be combined with other embodiments described herein, the term “vertical” refers to the vertical direction, particularly when referring to the orientation of the substrate. It is understood that a deviation of 20 degrees or less, for example, 10 degrees or less is allowed. For example, this deviation can be provided because a substrate support having some deviation from the vertical direction can result in a more stable substrate position. However, the orientation of the essentially vertical substrate during the deposition of the source material is believed to be different from the orientation of the horizontal substrate. In particular, the surface of the substrate is covered by a source extending in one direction corresponding to one substrate dimension and a translational movement along the other direction corresponding to the other substrate dimension.

  The evaporation source 100 shown in FIG. 7 may be provided in the vacuum chamber 110 of the deposition apparatus 150 on a track, such as an annular track (not shown) or a linear guide 120. An orbital or linear guide 120 is configured for translational movement of the evaporation source 100. According to various embodiments, which can be combined with other embodiments described herein, a drive for translational motion can be tracked or linearly guided within the vacuum chamber 110 or combinations thereof. At 120, it can be provided in the evaporation source 100.

  FIG. 7 further shows a valve 105, for example a gate valve. The valve 105 allows vacuum sealing to an adjacent vacuum chamber (not shown in the figure). According to embodiments herein, the valve 105 may be opened for transfer of the substrate or mask into and / or out of the vacuum chamber 110.

  According to certain embodiments, which may be combined with other embodiments described herein, an additional vacuum chamber, such as maintenance vacuum chamber 111, is provided adjacent to vacuum chamber 110. The vacuum chamber 110 and the maintenance vacuum chamber 111 can be connected by a valve 109. Valve 109 is configured to open and close the vacuum seal between vacuum chamber 110 and maintenance vacuum chamber 111. According to embodiments herein, the evaporation source 100 can be transferred to the maintenance vacuum chamber 111 while the valve 109 is open. The valve can then be closed to provide a vacuum seal between the vacuum chamber 110 and the maintenance vacuum chamber 111. If the valve 109 is closed, the maintenance vacuum chamber 111 can be vented and opened for maintenance of the evaporation source 100 without breaking the vacuum in the vacuum chamber 110.

  The described material deposition apparatus can be used for a variety of applications, including, for example, applications for OLED device manufacturing including processing methods in which two or more source materials, such as two or more organic materials, are vaporized simultaneously. . In the embodiment shown in FIG. 7, two or more distribution units and corresponding evaporation crucibles are provided next to each other.

  Although the embodiment shown in FIG. 7 provides a movable evaporation source for the deposition apparatus, those skilled in the art can also apply the above-described embodiments to a deposition apparatus in which the substrate moves during processing. Will understand. For example, the substrate to be coated can be guided and driven along a stationary material deposition configuration.

Embodiments described herein relate specifically to the deposition of organic materials, for example, for the manufacture of OLED displays on large area substrates. According to certain embodiments, a large area substrate or a carrier supporting one or more substrates may have a size of at least 0.174 m ² . For example, the deposition system may have a GEN5 corresponding to a substrate of about 1.4 m ² (1.1 m × 1.3 m), a GEN 7.5 corresponding to a substrate of about 4.29 m ² (1.95 m × 2.2 m), Large, such as GEN 8.5 corresponding to about 5.7 m ² substrate (2.2 m × 2.5 m), or even GEN 10 substrate corresponding to about 8.7 m ² substrate (2.85 m × 3.05 m) It can be adapted to process an area substrate. Further next generations such as GEN11 and GEN12 and the corresponding board area can be mounted in the same way.

  According to embodiments herein, which may be combined with other embodiments described herein, the thickness of the substrate is from 0.1 to 1.8 mm, and the holding configuration for this substrate Can be adapted to the thickness of such a substrate. In particular, however, the thickness of the substrate can be about 0.9 mm or less (such as 0.5 mm or 0.3 mm). The holding arrangement is adapted to the thickness of such a substrate. In general, the substrate can be made of any material suitable for material deposition. For example, the substrate is a group consisting of glass (eg, soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite material, carbon fiber material, or any other material or combination of materials that can be coated by a deposition process. Can be made from materials selected from

  FIG. 8A shows a schematic block diagram illustrating a method 800 for depositing a source material on a substrate according to embodiments described herein. The method includes evaporating source material (810) and applying the evaporated source material to a substrate (820). In addition, attaching the evaporated source material to the substrate (820) supplies the evaporated source material in the deposition direction through one or more outlets of the distribution unit (821), and one or more of the first cooling shield configuration. Sending 822 vaporized source material through one or more apertures in the aperture and heat shield configuration. In particular, embodiments of the method of depositing source material described herein are performed by employing an evaporation source according to embodiments described herein.

  According to embodiments herein, which can be combined with other embodiments described herein, a method of depositing a source material on a substrate includes a heat shield configuration, evaporation of the source material to be deposited. Heating to a temperature or higher can be included. Thus, accumulation of evaporated source material on the heat shield configuration can be prevented. In particular, clogging of one or more apertures of the heat shield configuration can be suppressed or even eliminated completely.

  Referring to FIG. 8B exemplarily, according to a further embodiment, which may be combined with any other embodiment described herein, the method comprises evaporating source material blocked by a heat shield configuration. Collecting 830 on a first cooling shield configuration. Thus, one or more outlets of the dispensing unit remain clean throughout the deposition process and clogging of the one or more outlets of the dispensing unit can be avoided or even completely removed. Thereby, stable deposition process conditions can be maintained over a long period of time.

  Thus, in light of the foregoing, the method of depositing source material on the substrate described herein suppresses clogging of one or more apertures in the heat shield configuration and one or more outlets of the dispensing unit. Or even complete removal. Thereby, stable deposition process conditions can be realized over a long period of time. Further, embodiments of the method of depositing source material on a substrate described herein reduce shadowing effects, for example, for the production of high resolution displays, particularly high resolution OLED displays. , And provide improved resolution of the source material deposited on the substrate.

  This document uses examples to disclose the present disclosure, including the best mode, or to make and use and incorporate any device or system by those skilled in the art to implement the subject matter of the present disclosure. It is possible to implement any method that is included. Although various specific embodiments have been disclosed above, the mutually non-exclusive features of the above-described embodiments can be combined with each other. The patentable scope is defined by the claims, and other embodiments may have structural elements that do not differ from the literal words of the claims, or the literal words of the claims Including equivalent structural elements without substantial difference are intended to be within the scope of the claims.

Claims (15)

An evaporation source (100) for depositing a source material on a substrate (10),
An evaporation crucible (104) configured to evaporate the source material;
A distribution unit (130) having one or more outlets (212), in fluid communication with the evaporation crucible, such that the one or more outlets supply the source material to the substrate in a deposition direction (101). A distribution unit (130),
A first cooling shield configuration (201) with one or more openings (221), and a heating shield configuration (202) provided at a distance from the first cooling shield configuration (201); Comprising a heat shield configuration (202) with one or more apertures (222);
The first cooling shield configuration (201) is disposed between the distribution unit (130) and the heating shield configuration (202), and the evaporation source (100) is in the deposition direction (101). Configured to define a path for the source material from one or more outlets (212) through the one or more openings (221) and the one or more openings (222) to the substrate. The evaporation source (100).   The heating shield arrangement (202) is configured to be heated to a first temperature, wherein the first temperature substantially corresponds to an evaporation temperature of the source material to be deposited. The evaporation source (100) described.   The evaporation source (100) according to claim 1 or 2, wherein the first cooling shield arrangement (201) is arranged to be cooled to the condensation temperature of the source material to be deposited.   The one or more apertures (222) of the heat shield configuration (201) are arranged to be aligned with the one or more outlets (212) of the distribution unit (130) in the deposition direction (101). The evaporation source (100) according to any one of claims 1 to 3.   The first cooling shield configuration (201) according to any one of claims 1 to 4, wherein the first cooling shield configuration (201) is configured to surround the one or more outlets (212) of the distribution unit (130) from the side. The evaporation source (100) described.   The evaporation source (100) according to any one of the preceding claims, wherein the one or more outlets (212) of the distribution unit (130) are provided in a heating wall (135) of the distribution unit. ).   The evaporation source (100) according to claim 6, wherein the heat shield arrangement (202) and the heating wall (135) of the distribution unit (130) are configured to exhibit substantially equal thermal expansion. .   Evaporation source (100) according to claim 6 or 7, wherein the heat shield arrangement (202) is connected to the heating wall (135) of the distribution unit (130) via a connecting element (232). .   The connection element (232) according to claim 8, configured to adjust the distance between the heating wall (135) of the distribution unit (130) and the heating shield arrangement (202). Evaporation source (100).   Evaporation source according to any one of the preceding claims, wherein a second cooling shield configuration (203) is provided in the deposition direction (101) behind the heating shield configuration (202). (100).   One or more apertures arranged such that the second cooling shield configuration (203) is aligned with the one or more apertures (222) of the heating shield configuration (202) in the deposition direction (101) The evaporation source (100) according to claim 10, comprising a section (223).   The one or more outlets (212) of the distribution unit (130) extend along the deposition direction (101) and the one or more openings (221) of the first cooling shield configuration (201) The evaporation source (100) according to any one of the preceding claims, wherein the evaporation source (100) is one or more nozzles (125) protruding from the nozzle.   A deposition apparatus (150) for depositing a source material in a vacuum chamber, the deposition apparatus (150) comprising one or more evaporation sources (100) according to any one of the preceding claims. ). A method (800) of depositing a source material on a substrate, comprising:
Evaporating the source material (810) and attaching the evaporated source material to the substrate (820), and attaching the evaporated source material to the substrate (820),
Supplying the evaporated source material in the deposition direction through one or more outlets of the distribution unit (821), and the evaporation through one or more openings of the first cooling shield configuration and one or more apertures of the heating shield configuration. Depositing source material (800), including sending the source material (822).   The method (800) of depositing a source material according to claim 14, further comprising collecting (830) a portion of the evaporated source material blocked by the heat shield configuration on the first cooling shield configuration. .

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