JP2018508030A - 苛酷な環境のためのラベルアセンブリー - Google Patents
苛酷な環境のためのラベルアセンブリー Download PDFInfo
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- G—PHYSICS
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- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/08—Fastening or securing by means not forming part of the material of the label itself
- G09F3/10—Fastening or securing by means not forming part of the material of the label itself by an adhesive layer
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C09F3/00—Obtaining spirits of turpentine
- C09F3/02—Obtaining spirits of turpentine as a by-product in the paper-pulping process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
- B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
- B31D1/00—Multiple-step processes for making flat articles ; Making flat articles
- B31D1/02—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags
- B31D1/027—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags involving, marking, printing or coding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C1/00—Labelling flat essentially-rigid surfaces
- B65C1/02—Affixing labels to one flat surface of articles, e.g. of packages, of flat bands
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/334—Applications of adhesives in processes or use of adhesives in the form of films or foils as a label
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F2003/023—Adhesive
- G09F2003/0232—Resistance to heat
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F2003/023—Adhesive
- G09F2003/0233—Resistance to humidity
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F2003/023—Adhesive
- G09F2003/0235—Resistance to chemicals
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Labeling Devices (AREA)
Abstract
Description
本願に記載された発明は、その他および相異する実施形態を可能にし、そのいくつかの詳細は多様な観点で変形され得、これらはすべて請求された発明に属する。したがって、図面および説明は例示的なものと見なされるべきであり、限定されるものではない。
フェイス層
1,3,5−トリメチル−2,4,6−トリス(3,5−ジ−tert−ブチル−4−ヒドロキシベンジル)ベンゼン;
ペンタエリスリトールテトラキス−3(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート;
n−オクタデシル−3(3,5−ジtert−ブチル−4−ヒドロキシフェニル)プロピオネート;
4−4′−メチレンビス(4−メチル−6−tertブチルフェノール);
4,4′−チオビス(6−tert−ブチル−o−クレゾール);
2、6−ジ−tert−ブチルフェノール;
6−(4−ヒドロキシフェノキシ)−2,4−ビス(n−オクチルチオ)−1,3,5−トリアジン;
2,4,6−トリス(4−ヒドロキシ−3,5−ジ−tert−ブチル−フェノキシ)−1,3,5−トリアジン;
ジ−n−オクタデシル−3,5−ジ−tert−ブチル−4−ヒドロキシベンジルホスホネート;
2−(n−オクチルチオ)エチル−3,5−ジ−tert−ブチル−4−ヒドロキシベンゾエート;および
ソルビトールヘキサ−(3,3,5−ジ−tert−ブチル−4−ヒドロキシ−フェニル)プロピオネートを含む。
Claims (37)
- 第1フェイスおよび対向する第2フェイスを規定するフェイス層と;
前記第1フェイスと前記第2フェイスのうち少なくとも一つに配置される2段階接着剤として、第1段階で接着剤が初期に減圧接着剤(PSA)の形態であり、第2段階での切り替え時、前記接着剤が永久的な非PSA接着剤の形態であることを表わす2段階接着剤を含む、ラベルアセンブリー。 - 前記第1フェイス層と前記2段階接着剤の間に配置されたプライマー層をさらに含む、請求項1に記載のラベルアセンブリー。
- 前記2段階接着剤上に配置されたライナーをさらに含む、請求項1に記載のラベルアセンブリー。
- 前記2段階接着剤は前記フェイス層の第2フェイス上に配置され、前記フェイス層の第1フェイス上に配置されたトップコートをさらに含む、請求項1に記載のラベルアセンブリー。
- 前記2段階接着剤の切り替え温度は80℃〜240℃の範囲内である、請求項1に記載のラベルアセンブリー。
- 前記フェイス層は可視的または機械的劣化なしに90℃の熱に10分間耐え得る材料である、請求項1に記載のラベルアセンブリー。
- 前記フェイス材料は、ポリ(ビニルクロライド)(PVC)、ポリ(エチレンテレフタレート)(PET)、ポリオレフィン、ポリアミド、合成織物、合成皮革、ペーパー、繊維ガラス、ポリビニリデンフルオライド(PVF)、金属箔、セラミック、天然皮革、およびそれらの組合わせからなる群から選択される、請求項1に記載のラベルアセンブリー。
- 前記フェイス層は第1フェイス層であり、
第1フェイスおよび対向する第2フェイスを規定する第2フェイス層と;
前記第1フェイス層と前記第2フェイス層間に配置された構成要素をさらに含む、請求項1に記載のラベルアセンブリー。 - 前記第2フェイス層の第1フェイスと第2フェイスのうち少なくとも一つに配置される2段階接着剤として、第1段階で接着剤が初期に減圧接着剤(PSA)の形態であり、第2段階での切り替え時、前記接着剤が永久的な非PSA接着剤の形態であることを表わす2段階接着剤をさらに含む、請求項8に記載のラベルアセンブリー。
- 前記第2フェイス層と前記2段階接着剤の間に配置されたプライマー層をさらに含む、請求項9に記載のラベルアセンブリー。
- 前記第2フェイス層上に配置された前記2段階接着剤の切り替え温度は80℃〜240℃の範囲内である、請求項9に記載のラベルアセンブリー。
- 前記第2フェイス層は可視的または機械的劣化なしに90℃の熱に10分間耐え得る、請求項8に記載のラベルアセンブリー。
- 前記第2フェイス材料はポリ(ビニルクロライド)(PVC)、ポリ(エチレンテレフタレート)(PET)、ポリオレフィン、ポリアミド、合成織物、合成皮革、ペーパー、繊維ガラス、ポリビニリデンフルオライド(PVF)、金属箔、セラミック、天然皮革、およびそれらの組合わせからなる群から選択される、請求項8に記載のラベルアセンブリー。
- 前記構成要素は電子的構成要素である、請求項8に記載のラベルアセンブリー。
- 物品をラベリングする方法であって、
外面を有する物品を提供するステップと;
(i)第1フェイスおよび対向する第2フェイスを規定するフェイス層、および(ii)前記第1フェイスと前記第2フェイスのうち少なくとも一つに配置される2段階接着剤として、第1段階で接着剤が初期に減圧接着剤(PSA)の形態であり、第2段階での切り替え時、前記接着剤が永久的な非PSA接着剤の形態であることを表わす2段階接着剤を含むラベルアセンブリーを提供するステップと;
前記ラベルアセンブリーの接着剤を前記物品の外面に付着するステップを含む、方法。 - 前記付着は前記ラベルアセンブリーの接着剤を前記物品の外面に接触させることによって行われる、請求項15に記載の方法。
- 前記付着は前記ラベルアセンブリーの接着剤を前記物品の外面に接触させた後前記接着剤を前記第2段階に切り替えることによって行われる、請求項15に記載の方法。
- 前記切り替えは前記接着剤を80℃〜240℃範囲内の温度で加熱することによって行われる、請求項17に記載の方法。
- 前記加熱は前記ラベルアセンブリーの接着剤を前記物品の外面に接触させることとともに行われる、請求項18に記載の方法。
- 前記接触は1秒〜10分範囲内の時間の間行われる、請求項19に記載の方法。
- 前記ラベルアセンブリーは前記フェイス層と前記2段階接着剤の間に配置されたプライマー層をさらに含む、請求項15に記載の方法。
- 前記ラベルアセンブリーは前記2段階接着剤上に配置されたライナーをさらに含む、請求項15に記載の方法。
- 前記2段階接着剤は前記フェイス層の第2フェイス上に配置され、前記ラベルアセンブリーは前記フェイス層の第1フェイス上に配置されたトップコートをさらに含む、請求項15に記載の方法。
- 前記フェイス層は可視的または機械的劣化なしに90℃の熱に10分間耐え得る材料である、請求項15に記載の方法。
- 前記フェイス材料は、ポリ(ビニルクロライド)(PVC)、ポリ(エチレンテレフタレート)(PET)、ポリオレフィン、ポリアミド、合成織物、合成皮革、ペーパー、繊維ガラス、ポリビニリデンフルオライド(PVF)、金属箔、セラミック、天然皮革、およびそれらの組合わせからなる群から選択される、請求項15に記載の方法。
- 前記ラベルアセンブリーのフェイス層は第1フェイス層であり、前記ラベルアセンブリーは、iii)第2フェイス層、および(iv)前記第1フェイス層と前記第2フェイス層間に配置された構成要素をさらに含む、請求項15に記載の方法。
- 前記ラベルアセンブリーは、(v)前記第2フェイス層の第1フェイスと第2フェイスのうち少なくとも一つに配置される2段階接着剤として、第1段階で接着剤が初期に減圧接着剤(PSA)の形態であり、第2段階での切り替え時、前記接着剤が永久的な非PSA接着剤の形態であることを表わす2段階接着剤をさらに含む、請求項26に記載の方法。
- 請求項15〜請求項27のいずれか一項に記載された方法によってラベリングされた物品であって、前記物品は車両の構成要素、車両の付属品、消費財、産業財、および電子商品からなる群から選択される、ラベリングされた物品。
- 外面を有する物品;および
(i)第1フェイスおよび対向する第2フェイスを規定するフェイス層、および(ii)前記第1フェイスと前記第2フェイスのうち少なくとも一つに配置される2段階接着剤として、第1段階で接着剤が初期に減圧接着剤(PSA)の形態であり、第2段階での切り替え時、前記接着剤が永久的な非PSA接着剤の形態であることを表わす2段階接着剤を含むラベルアセンブリーを含む、ラベリングされた物品。 - 前記ラベルは前記フェイス層と前記2段階接着剤の間に配置されたプライマー層を含む、請求項29に記載のラベリングされた物品。
- 前記ラベルは前記2段階接着剤上に配置されたライナーをさらに含む、請求項29に記載のラベリングされた物品。
- 前記2段階接着剤は前記フェイス層の第2フェイス上に配置され、前記ラベルアセンブリーは前記フェイス層の第1フェイス上に配置されたトップコートをさらに含む、請求項29に記載のラベリングされた物品。
- 前記2段階接着剤の切り替え温度は80℃〜240℃の範囲内である、請求項29に記載のラベリングされた物品。
- 前記フェイス層は可視的または機械的劣化なしに90℃の熱に10分間耐え得る材料である、請求項29に記載のラベリングされた物品。
- 前記フェイス材料は、ポリ(ビニルクロライド)(PVC)、ポリ(エチレンテレフタレート)(PET)、ポリオレフィン、ポリアミド、合成織物、合成皮革、ペーパー、繊維ガラス、ポリビニリデンフルオライド(PVF)、金属箔、セラミック、天然皮革、およびそれらの組合わせからなる群から選択される、請求項29に記載のラベリングされた物品。
- 前記ラベルアセンブリーのフェイス層は第1フェイス層であり、前記ラベルアセンブリーは、(ii)第2フェイス層、および(iv)前記第1フェイス層と前記第2フェイス層間に配置された構成要素をさらに含む、請求項29に記載のラベリングされた物品。
- 前記ラベルアセンブリーは、(v)前記第2フェイス層の前記第1フェイスと前記第2フェイスのうち少なくとも一つに配置される2段階接着剤として、第1段階で前記接着剤が初期に減圧接着剤(PSA)の形態であり、第2段階での切り替え時、前記接着剤が永久的な非PSA接着剤の形態であることを表わす2段階接着剤をさらに含む、請求項36に記載のラベリングされた物品。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562112216P | 2015-02-05 | 2015-02-05 | |
| US62/112,216 | 2015-02-05 | ||
| PCT/US2016/016774 WO2016127056A1 (en) | 2015-02-05 | 2016-02-05 | Label assemblies for adverse environments |
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| JP6537620B2 JP6537620B2 (ja) | 2019-07-03 |
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| JP2017541384A Active JP6537620B2 (ja) | 2015-02-05 | 2016-02-05 | 苛酷な環境のためのラベルアセンブリー |
| JP2019072211A Active JP6789343B2 (ja) | 2015-02-05 | 2019-04-04 | 苛酷な環境のためのラベルアセンブリー |
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- 2016-02-05 US US15/016,919 patent/US11049421B2/en active Active
- 2016-02-05 ES ES16709614T patent/ES2992760T3/es active Active
- 2016-02-05 MX MX2017010047A patent/MX2017010047A/es unknown
- 2016-02-05 CA CA2975298A patent/CA2975298C/en active Active
- 2016-02-05 KR KR1020177024792A patent/KR101996828B1/ko active Active
- 2016-02-05 RU RU2017131055A patent/RU2677155C1/ru not_active IP Right Cessation
- 2016-02-05 AU AU2016215123A patent/AU2016215123B2/en not_active Ceased
- 2016-02-05 BR BR112017016860A patent/BR112017016860A2/pt not_active Application Discontinuation
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2019
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Also Published As
| Publication number | Publication date |
|---|---|
| EP3253837A1 (en) | 2017-12-13 |
| CN107207924A (zh) | 2017-09-26 |
| RU2677155C1 (ru) | 2019-01-15 |
| US20210287575A1 (en) | 2021-09-16 |
| AU2016215123A1 (en) | 2017-09-14 |
| US11049421B2 (en) | 2021-06-29 |
| WO2016127056A1 (en) | 2016-08-11 |
| AU2016215123B2 (en) | 2018-08-09 |
| US20160232821A1 (en) | 2016-08-11 |
| JP6537620B2 (ja) | 2019-07-03 |
| KR101996828B1 (ko) | 2019-07-05 |
| EP3253837B1 (en) | 2024-07-31 |
| WO2016127056A8 (en) | 2017-08-17 |
| JP2019135106A (ja) | 2019-08-15 |
| ES2992760T3 (en) | 2024-12-17 |
| CA2975298A1 (en) | 2016-08-11 |
| KR20170115571A (ko) | 2017-10-17 |
| BR112017016860A2 (pt) | 2018-03-27 |
| CA2975298C (en) | 2020-03-10 |
| CN107207924B (zh) | 2020-03-13 |
| MX2017010047A (es) | 2017-12-18 |
| JP6789343B2 (ja) | 2020-11-25 |
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