JP2018507565A - ナノダイオードを備える変調装置 - Google Patents
ナノダイオードを備える変調装置 Download PDFInfo
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- JP2018507565A JP2018507565A JP2017551387A JP2017551387A JP2018507565A JP 2018507565 A JP2018507565 A JP 2018507565A JP 2017551387 A JP2017551387 A JP 2017551387A JP 2017551387 A JP2017551387 A JP 2017551387A JP 2018507565 A JP2018507565 A JP 2018507565A
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/211—Gated diodes
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
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- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6738—Schottky barrier electrodes
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- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/675—Group III-V materials, Group II-VI materials, Group IV-VI materials, selenium or tellurium
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- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/113—Isolations within a component, i.e. internal isolations
- H10D62/115—Dielectric isolations, e.g. air gaps
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
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- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/82—Heterojunctions
- H10D62/824—Heterojunctions comprising only Group III-V materials heterojunctions, e.g. GaN/AlGaN heterojunctions
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- H—ELECTRICITY
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- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
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- Electrodes Of Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (9)
- U字形に嵌合するT字形状の少なくとも1つのナノダイオードを含み、このナノダイオードのチャネル(31,41,42,43,44,45)が前記U字形に貫入する前記T字形の脚部である、基板(1)上に作成された変調装置であって、
前記チャネルの少なくとも一部の上方に跨る少なくとも1つの導電線(37,47)を含むことを特徴とする、変調装置。 - 並置した複数のナノダイオードを含み、
前記線(47)は全ての前記チャネル(41,42,43,44,45)を跨ぐことを特徴とする請求項1に記載の装置。 - 前記チャネル(31,41,42,43,44,45)と前記線(37,47)との間に、誘電材料の層が挿間されていることを特徴とする請求項1又は2に記載の装置。
- 前記基板(1)がシリコン製であることを特徴とする請求項1〜3のいずれか一項に記載の装置。
- 前記ナノダイオードが、AlGaN/GaNヘテロ構造(2,3)に形成されていることを特徴とする請求項1〜4のいずれか一項に記載の装置。
- 前記線(37,47)が、金とモリブデンとの混合物で作られていることを特徴とする請求項1〜5のいずれか一項に記載の装置。
- 前記線(37,47)が、導電性を有する多層から作られていることを特徴とする請求項1〜5のいずれか一項に記載の装置。
- 前記導電性を有する多層が、チタン/プラチナ/金で作られていることを特徴とする請求項7に記載の装置。
- 請求項1〜8のいずれか一項に記載の装置を制御する方法であって、前記線(37,47)に給電する工程を含むことを特徴とする方法。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1463140 | 2014-12-22 | ||
| FR1463140A FR3030886B1 (fr) | 2014-12-22 | 2014-12-22 | Dispositif de modulation comportant une nano-diode |
| PCT/IB2015/059623 WO2016103111A1 (fr) | 2014-12-22 | 2015-12-15 | Dispositif de modulation comportant une nano-diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018507565A true JP2018507565A (ja) | 2018-03-15 |
| JP6730307B2 JP6730307B2 (ja) | 2020-07-29 |
Family
ID=52627456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017551387A Expired - Fee Related JP6730307B2 (ja) | 2014-12-22 | 2015-12-15 | ナノダイオードを備える変調装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10340371B2 (ja) |
| EP (1) | EP3238269B8 (ja) |
| JP (1) | JP6730307B2 (ja) |
| CA (1) | CA2971328A1 (ja) |
| FR (1) | FR3030886B1 (ja) |
| WO (1) | WO2016103111A1 (ja) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140636A (ja) * | 1992-10-28 | 1994-05-20 | Sony Corp | 量子細線トランジスタとその製法 |
| JPH08102537A (ja) * | 1994-09-30 | 1996-04-16 | Nec Corp | 単一電子素子とその製造方法 |
| JP2004534388A (ja) * | 2001-04-20 | 2004-11-11 | ビーティージー・インターナショナル・リミテッド | ナノ・エレクトロニック・デバイスと回路 |
| JP2007180510A (ja) * | 2005-12-01 | 2007-07-12 | Sharp Corp | 半導体装置 |
| JP2008172035A (ja) * | 2007-01-12 | 2008-07-24 | Univ Of Fukui | ショットキーダイオード |
| WO2014134490A1 (en) * | 2013-02-28 | 2014-09-04 | Massachusetts Institute Of Technology | Improving linearity in semiconductor devices |
| JP2014170934A (ja) * | 2013-02-28 | 2014-09-18 | Power Integrations Inc | ヘテロ構造パワートランジスタおよびヘテロ構造半導体装置を作製する方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7005775B2 (en) * | 2001-05-09 | 2006-02-28 | Chang Feng Wan | Microfabricated torsional drive utilizing lateral electrostatic force |
| GB0415995D0 (en) * | 2004-07-16 | 2004-08-18 | Song Aimin | Memory array |
| ATE526691T1 (de) * | 2005-05-09 | 2011-10-15 | Pragmatic Printing Ltd | Elektronische vorrichtungen |
| WO2007072405A2 (en) * | 2005-12-22 | 2007-06-28 | Nxp B.V. | Semiconductor device with recessed field plate and method of manufacturing the same |
| CN102024888B (zh) * | 2009-12-30 | 2012-01-25 | 比亚迪股份有限公司 | 一种发光二极管及其制作方法 |
| US8927397B2 (en) * | 2013-02-07 | 2015-01-06 | International Business Machines Corporation | Diode structure and method for gate all around silicon nanowire technologies |
| US9659973B2 (en) * | 2014-03-14 | 2017-05-23 | Innolux Corporation | Display device |
-
2014
- 2014-12-22 FR FR1463140A patent/FR3030886B1/fr not_active Expired - Fee Related
-
2015
- 2015-12-15 EP EP15820282.0A patent/EP3238269B8/fr active Active
- 2015-12-15 US US15/537,973 patent/US10340371B2/en active Active
- 2015-12-15 CA CA2971328A patent/CA2971328A1/fr active Pending
- 2015-12-15 JP JP2017551387A patent/JP6730307B2/ja not_active Expired - Fee Related
- 2015-12-15 WO PCT/IB2015/059623 patent/WO2016103111A1/fr not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140636A (ja) * | 1992-10-28 | 1994-05-20 | Sony Corp | 量子細線トランジスタとその製法 |
| JPH08102537A (ja) * | 1994-09-30 | 1996-04-16 | Nec Corp | 単一電子素子とその製造方法 |
| JP2004534388A (ja) * | 2001-04-20 | 2004-11-11 | ビーティージー・インターナショナル・リミテッド | ナノ・エレクトロニック・デバイスと回路 |
| JP2007180510A (ja) * | 2005-12-01 | 2007-07-12 | Sharp Corp | 半導体装置 |
| JP2008172035A (ja) * | 2007-01-12 | 2008-07-24 | Univ Of Fukui | ショットキーダイオード |
| WO2014134490A1 (en) * | 2013-02-28 | 2014-09-04 | Massachusetts Institute Of Technology | Improving linearity in semiconductor devices |
| JP2014170934A (ja) * | 2013-02-28 | 2014-09-18 | Power Integrations Inc | ヘテロ構造パワートランジスタおよびヘテロ構造半導体装置を作製する方法 |
Non-Patent Citations (1)
| Title |
|---|
| PAUL SANGARE ET AL.: "Experimental demonstration of direct terahertz detection at room-temperature in AlGaN/GaN asymmetric", JOURNAL OF APPLIED PHYSICS, vol. 113, JPN7019003401, 15 January 2013 (2013-01-15), US, pages 1 - 6, ISSN: 0004136907 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3238269B1 (fr) | 2020-08-12 |
| US10340371B2 (en) | 2019-07-02 |
| WO2016103111A1 (fr) | 2016-06-30 |
| CA2971328A1 (fr) | 2016-06-30 |
| EP3238269B8 (fr) | 2021-01-20 |
| FR3030886B1 (fr) | 2017-03-10 |
| US20170352748A1 (en) | 2017-12-07 |
| EP3238269A1 (fr) | 2017-11-01 |
| JP6730307B2 (ja) | 2020-07-29 |
| FR3030886A1 (fr) | 2016-06-24 |
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