JP2018202868A - Flexible electrical conductor in thermoformed articles - Google Patents
Flexible electrical conductor in thermoformed articles Download PDFInfo
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- JP2018202868A JP2018202868A JP2018109621A JP2018109621A JP2018202868A JP 2018202868 A JP2018202868 A JP 2018202868A JP 2018109621 A JP2018109621 A JP 2018109621A JP 2018109621 A JP2018109621 A JP 2018109621A JP 2018202868 A JP2018202868 A JP 2018202868A
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- 239000004020 conductor Substances 0.000 title claims abstract description 60
- 229920000642 polymer Polymers 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims abstract description 17
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 17
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 12
- 239000004332 silver Substances 0.000 claims abstract description 12
- 238000012360 testing method Methods 0.000 claims description 10
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- 229920001519 homopolymer Polymers 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 5
- 238000003856 thermoforming Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000004049 embossing Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009661 fatigue test Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Wood Science & Technology (AREA)
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- Laminated Bodies (AREA)
Abstract
Description
本発明は、折り曲げ可能な電気導体によって横断される折り曲げ可能な領域を含有する熱成形物品に関する。 The present invention relates to a thermoformed article containing a foldable region traversed by a foldable electrical conductor.
可撓性かつ折り曲げ可能な物品に電気導体を組み込むことに関心が寄せられている。ペーストを印刷することによって導体が形成されて、導体の抵抗が熱成形または曲げの結果として許容限度よりも増加する場合、最初に形成された導体の抵抗が低くなるようにペーストの第２の層が印刷される。典型的に、これは、最初に許容可能であるが、疲れ試験下での導体の機械的制限が明らかになる。 There is interest in incorporating electrical conductors into flexible and foldable articles. If the conductor is formed by printing the paste and the resistance of the conductor increases above an acceptable limit as a result of thermoforming or bending, the second layer of paste is such that the resistance of the initially formed conductor is low. Is printed. Typically this is initially acceptable, but reveals the mechanical limitations of the conductor under fatigue testing.
抵抗の大きい変化を伴うことなく、物品の寿命中、屈曲および曲げに加えて積層、エンボス加工または熱成形を受ける物品における電気導体が必要とされている。 There is a need for electrical conductors in articles that undergo lamination, embossing or thermoforming in addition to bending and bending during the life of the article without significant changes in resistance.
本発明は、電気導体によって横断される折り曲げ可能な領域を有する熱成形物品に関する。 The present invention relates to a thermoformed article having a foldable region traversed by an electrical conductor.
本発明は、電気導体によって横断される折り曲げ可能な領域を含有する熱成形物品を提供し、電気導体は、
（ａ）基材と、
（ｂ）二層電気導体であって、
ａ．（ｉ）熱可塑性ポリウレタンと熱可塑性ポリヒドロキシエーテルとの混合物、および（ｉｉ）少なくとも２００％の伸び率パーセントと１０００ポンド／平方インチ未満の１００％伸びを達成するために必要な引張応力とを有する熱可塑性ポリウレタン、からなる群から選択されるポリマーを含むポリマー厚膜銀導体の層Ａと、
ｂ．熱可塑性ポリヒドロキシエーテルを含むポリマー厚膜銀導体の層Ｂと
を含む二層電気導体と
を含み、層Ａが下層として基材上に直接印刷され層Ｂが電気導体の上層として層Ａ上に印刷されるか、または層Ｂが下層として基材上に直接印刷され層Ａが電気導体の上層として層Ｂ上に印刷されるかのいずれかである。
The present invention provides a thermoformed article containing a foldable region traversed by an electrical conductor, the electrical conductor comprising:
(A) a substrate;
(B) a two-layer electrical conductor,
a. (I) a mixture of thermoplastic polyurethane and thermoplastic polyhydroxyether, and (ii) a percent elongation of at least 200% and a tensile stress necessary to achieve 100% elongation of less than 1000 pounds per square inch. A layer A of polymer thick film silver conductor comprising a polymer selected from the group consisting of thermoplastic polyurethanes;
b. A layer B of a polymer thick film silver conductor comprising a thermoplastic polyhydroxyether, and a layer A printed directly on the substrate as a lower layer and a layer B on the layer A as an upper layer of the electrical conductor Either printed, or layer B is printed directly on the substrate as a lower layer and layer A is printed on layer B as the upper layer of an electrical conductor.
熱成形された電気導体は、１８０°曲げ試験に供せられた後の最終抵抗Ｒfおよび１８０°曲げ試験前の初期抵抗Ｒiを有する。 The thermoformed electrical conductor has a final resistance R f after being subjected to a 180 ° bend test and an initial resistance R i before the 180 ° bend test.
一実施形態において、層Ａのポリマーは、熱可塑性ポリウレタンと熱可塑性ポリヒドロキシエーテルとの混合物を含み、比Ｒf／Ｒiは１０より小さい。 In one embodiment, the polymer of layer A comprises a mixture of thermoplastic polyurethane and thermoplastic polyhydroxy ether, and the ratio R f / R i is less than 10.
本発明は、電気導体によって横断される折り曲げ可能な領域を含有する熱成形物品に関し、電気導体は、基材と、（ｉ）熱可塑性ポリウレタンと熱可塑性ポリヒドロキシエーテルとの混合物、および（ｉｉ）少なくとも２００％の伸び率パーセントと１０００ポンド／平方インチ未満の１００％伸びを達成するために必要な引張応力とを有する熱可塑性ポリウレタン、からなる群から選択されるポリマーを含むポリマー厚膜銀導体の層Ａと、熱可塑性ポリヒドロキシエーテルを含むポリマー厚膜銀導体の層Ｂとを含む二層電気導体とを含む。 The present invention relates to a thermoformed article containing a foldable region traversed by an electrical conductor, the electrical conductor comprising (i) a mixture of a thermoplastic polyurethane and a thermoplastic polyhydroxyether, and (ii) A polymer thick film silver conductor comprising a polymer selected from the group consisting of a thermoplastic polyurethane having a percent elongation of at least 200% and a tensile stress required to achieve 100% elongation of less than 1000 pounds per square inch. A two-layer electrical conductor comprising layer A and layer B of a polymer thick film silver conductor comprising a thermoplastic polyhydroxyether.
一実施形態において、層Ａが下層として基材上に直接印刷され層Ｂが電気導体の上層として層Ａ上に印刷される。 In one embodiment, layer A is printed directly on the substrate as the lower layer and layer B is printed on layer A as the upper layer of the electrical conductor.
別の実施形態において、層Ｂが下層として基材上に直接印刷され層Ａが電気導体の上層として層Ｂ上に印刷される。 In another embodiment, layer B is printed directly on the substrate as the lower layer and layer A is printed on layer B as the upper layer of the electrical conductor.
一実施形態において、ポリマー厚膜導体の上層は、厚膜導体の下層の全長に沿って延在している。 In one embodiment, the upper layer of the polymer thick film conductor extends along the entire length of the lower layer of the thick film conductor.
別の実施形態において、ポリマー厚膜導体の上層は、厚膜導体の下層の一部分のみに沿って延在し、この部分が熱成形物品の折り曲げ可能な領域を含む。 In another embodiment, the upper layer of the polymer thick film conductor extends along only a portion of the lower layer of the thick film conductor, which portion includes a foldable region of the thermoformed article.
電気導体のための基材は、物品自体の一部分であってもよい。別の実施形態において、基材は、二層電気導体が上に印刷される別個の要素であり、その場合、基材は物品に付着される。基材は、布、特にウレタンコーティングを有する布であってもよい。 The substrate for the electrical conductor may be part of the article itself. In another embodiment, the substrate is a separate element on which a two-layer electrical conductor is printed, in which case the substrate is attached to the article. The substrate may be a cloth, in particular a cloth having a urethane coating.
二層電気導体を有する物品は、ポリマー厚膜銀ペーストを印刷することによって作製されてもよい。 Articles having a two-layer electrical conductor may be made by printing a polymer thick film silver paste.
ポリマー厚膜導体の層Ａを形成するために使用されるペーストは、典型的に、粉末またはフレークの形態の銀と、（ｉ）熱可塑性ポリウレタンと熱可塑性ポリヒドロキシエーテルとの混合物、および（ｉｉ）少なくとも２００％の伸び率パーセントと１０００ポンド／平方インチ未満の１００％伸びを達成するために必要な引張応力とを有する熱可塑性ポリウレタン、からなる群から選択されるポリマーと、溶媒とを含む。印刷後の乾燥工程は、溶媒を除去し、層Ａをもたらす。ポリマー厚膜導体の熱可塑性ポリウレタンは、ウレタンホモポリマー、ポリエステル系コポリマーおよび直鎖ヒドロキシルポリウレタンからなる群から選択される。一実施形態において、ポリマーは、熱可塑性ポリウレタンと熱可塑性ポリヒドロキシエーテルとの混合物を含む。別の実施形態において、ポリマーは、少なくとも２００％の伸び率パーセントと、１０００ポンド／平方インチ未満の１００％伸びを達成するために必要な引張応力とを有する熱可塑性ポリウレタンを含む。 The paste used to form layer A of the polymer thick film conductor is typically silver in powder or flake form, and (i) a mixture of thermoplastic polyurethane and thermoplastic polyhydroxyether, and (ii) A polymer selected from the group consisting of a thermoplastic polyurethane having a percent elongation of at least 200% and a tensile stress necessary to achieve 100% elongation of less than 1000 pounds per square inch, and a solvent. The drying step after printing removes the solvent and results in layer A. The thermoplastic polyurethane of the polymer thick film conductor is selected from the group consisting of urethane homopolymers, polyester copolymers and linear hydroxyl polyurethanes. In one embodiment, the polymer comprises a mixture of thermoplastic polyurethane and thermoplastic polyhydroxy ether. In another embodiment, the polymer comprises a thermoplastic polyurethane having a percent elongation of at least 200% and the tensile stress necessary to achieve 100% elongation of less than 1000 pounds per square inch.
ポリマー厚膜導体の層Ｂを形成するために使用されるペーストは、典型的に、粉末またはフレークの形態の銀と、熱可塑性ポリヒドロキシエーテルと、溶媒とを含む。印刷後の乾燥工程は、溶媒を除去し、層Ｂをもたらす。 The paste used to form layer B of polymer thick film conductor typically comprises silver in the form of a powder or flake, a thermoplastic polyhydroxy ether, and a solvent. The drying step after printing removes the solvent and results in layer B.
一般的には、厚膜組成物は、適切な機能特性を組成物に付与する機能相を含む。例えば、機能相は、機能相のためのキャリアとして作用する有機媒体において分散された銀などの電気機能粉末を含んでもよい。一般的には、組成物を焼いて、有機媒体のポリマーおよび溶媒をともに燃焼させて電気機能特性を付与する。しかしながら、ポリマー厚膜組成物の場合、有機媒体のポリマー部分は、乾燥後に導体組成物の構成部分として残留する。したがって、ポリマーの選択は、ポリマー厚膜導体の性質を決定するのに重要である。 In general, thick film compositions include a functional phase that imparts appropriate functional properties to the composition. For example, the functional phase may include an electrofunctional powder such as silver dispersed in an organic medium that acts as a carrier for the functional phase. In general, the composition is baked and the polymer and solvent of the organic medium are burned together to impart electrical functional properties. However, in the case of a polymer thick film composition, the polymer portion of the organic medium remains as a constituent part of the conductor composition after drying. Thus, the choice of polymer is important in determining the properties of the polymer thick film conductor.
熱可塑性ポリマーは、特定の温度を超えると成形可能になり、冷却されるときに固化し、再加熱して再成形され得、したがって加熱によって再造形され得る。 Thermoplastic polymers become moldable above a certain temperature, solidify when cooled, can be reheated and reshaped, and thus can be reshaped by heating.
熱成形は、曲げやすい温度に材料を加熱して、次に型内で特定の形状に成形する製造法である。本明細書中で用いられるとき、熱成形は、通常の熱成形ならびにスタンピングまたはモールディングによる物品上のエンボス加工ならびに熱および／または圧力による積層を意味する。 Thermoforming is a manufacturing method in which a material is heated to a temperature that is easy to bend and then molded into a specific shape in a mold. As used herein, thermoforming means normal thermoforming and embossing on articles by stamping or molding and lamination by heat and / or pressure.
いくつかの実施例を、簡単な曲げ試験を使用して試験した。層Ａのポリマーは、熱可塑性ポリウレタンと熱可塑性ポリヒドロキシエーテルとの混合物であった。一試料において、層Ａが下層として基材上に堆積され、および層Ｂが上層として層Ａ上に堆積された-基材／Ａ／Ｂ。第２の試料において層Ｂが下層として基材上に堆積され、層Ａが上層として層Ｂ上に堆積された − 基材／Ｂ／Ａ。次に、試料を熱成形した。次に、各々の試料は、各々の二層導体の抵抗を連続的にモニタしながら、直径４ｍｍの曲げ表面について最初に一方向に１８０°曲げられ、次に反対側の方向に１８０°曲げられた。これは、本明細書において１８０°曲げ試験と称されるものの一サイクルである。１８０°曲げ試験は、１２０のこのようなサイクルからなった。各々のサイクルは約１秒かかり、抵抗は、各々のサイクルについて最大値をとる。最大値は、増加するサイクル数とともに増加する。しかしながら、曲げを止めるとき、抵抗は２０秒未満でより低い抵抗に戻る。各々の試料は、試験前に初期抵抗Ｒiおよび１８０°曲げ試験の１２０サイクルに供せられた後にＲfの（元に戻った）最終抵抗を有した。基材／Ａ／Ｂ試料の初期抵抗Ｒiは０．５オームであり、抵抗比Ｒf／Ｒiは５．８であった。基材／Ｂ／Ａ試料の初期抵抗Ｒiは０．６オームであり、抵抗比Ｒf／Ｒiは８．６であった。 Several examples were tested using a simple bend test. The polymer of layer A was a mixture of thermoplastic polyurethane and thermoplastic polyhydroxy ether. In one sample, layer A was deposited on the substrate as the bottom layer, and layer B was deposited on layer A as the top layer—substrate / A / B. In the second sample, layer B was deposited as a lower layer on the substrate and layer A was deposited as an upper layer on layer B-substrate / B / A. Next, the sample was thermoformed. Each sample is then first bent 180 ° in one direction and then 180 ° in the opposite direction for a 4 mm diameter bending surface while continuously monitoring the resistance of each two-layer conductor. It was. This is one cycle of what is referred to herein as a 180 ° bend test. The 180 ° bend test consisted of 120 such cycles. Each cycle takes about 1 second and the resistance takes a maximum value for each cycle. The maximum value increases with increasing number of cycles. However, when stopping bending, the resistance returns to a lower resistance in less than 20 seconds. Each sample had an initial resistance R i prior to testing and a final resistance of R f after being subjected to 120 cycles of 180 ° bending test. The substrate / A / B sample had an initial resistance R i of 0.5 ohms and a resistance ratio R f / R i of 5.8. The substrate / B / A sample had an initial resistance R i of 0.6 ohms and a resistance ratio R f / R i of 8.6.
比較実験Ａ
比較のために同じポリマー厚膜導体の２つの層を使用して別の試料が作製された、すなわち、下層および上層の両方が層Ｂであった − 基材／Ｂ／Ｂ。次に、試料を熱成形した。試料を１８０°曲げ試験に供した。試料の初期抵抗Ｒiは０．５オームであり、抵抗比Ｒf／Ｒiは４６．１であった。
Comparative experiment A
For comparison, another sample was made using two layers of the same polymer thick film conductor, i.e. both the lower and upper layers were layer B-substrate / B / B. Next, the sample was thermoformed. The sample was subjected to a 180 ° bending test. The initial resistance R i of the sample was 0.5 ohm and the resistance ratio R f / R i was 46.1.
Claims (8)
（ａ）基材と、
（ｂ）二層電気導体であって、
ａ．（ｉ）熱可塑性ポリウレタンと熱可塑性ポリヒドロキシエーテルとの混合物、および（ｉｉ）少なくとも２００％の伸び率パーセントと１０００ポンド／平方インチ未満の１００％伸びを達成するために必要な引張応力とを有する熱可塑性ポリウレタン、からなる群から選択されるポリマーを含むポリマー厚膜銀導体の層Ａと、
ｂ．熱可塑性ポリヒドロキシエーテルを含むポリマー厚膜銀導体の層Ｂと
を含む二層電気導体と
を含み、
層Ａが下層として前記基材上に直接印刷され層Ｂが前記電気導体の上層として層Ａ上に印刷されるか、または層Ｂが下層として前記基材上に直接印刷され層Ａが前記電気導体の上層として層Ｂ上に印刷されるかのいずれかである、熱成形物品。 A thermoformed article containing a foldable region traversed by an electrical conductor, the electrical conductor comprising:
(A) a substrate;
(B) a two-layer electrical conductor,
a. (I) a mixture of thermoplastic polyurethane and thermoplastic polyhydroxyether, and (ii) a percent elongation of at least 200% and a tensile stress necessary to achieve 100% elongation of less than 1000 pounds per square inch. A layer A of polymer thick film silver conductor comprising a polymer selected from the group consisting of thermoplastic polyurethanes;
b. A two-layer electrical conductor comprising a layer B of a polymer thick film silver conductor comprising a thermoplastic polyhydroxyether, and
Layer A is printed directly on the substrate as a lower layer and layer B is printed on layer A as an upper layer of the electrical conductor, or layer B is printed directly on the substrate as a lower layer and layer A is the electric A thermoformed article that is either printed on layer B as the top layer of a conductor.
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| JP2009176728A (en) * | 2007-12-27 | 2009-08-06 | E I Du Pont De Nemours & Co | Conductive paste used for membrane touch switch |
| JP2014531490A (en) * | 2011-09-20 | 2014-11-27 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
| JP2017505984A (en) * | 2013-11-18 | 2017-02-23 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | Stretchable polymer thick film silver conductor for highly permeable substrates |
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| JP4151541B2 (en) * | 2003-09-26 | 2008-09-17 | 松下電器産業株式会社 | Wiring board and manufacturing method thereof |
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| US9245666B2 (en) * | 2011-09-20 | 2016-01-26 | E I Du Pont De Nemours And Company | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
| US10072177B2 (en) * | 2014-11-06 | 2018-09-11 | E I Du Pont De Nemours And Company | Stretchable polymer thick film compositions for thermoplastic substrates and wearables electronics |
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| JP2009176728A (en) * | 2007-12-27 | 2009-08-06 | E I Du Pont De Nemours & Co | Conductive paste used for membrane touch switch |
| JP2014531490A (en) * | 2011-09-20 | 2014-11-27 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
| JP2017505984A (en) * | 2013-11-18 | 2017-02-23 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | Stretchable polymer thick film silver conductor for highly permeable substrates |
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