JP2018200997A - Method for manufacturing light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress a change in viscosity of a resin. SOLUTION: A step of preparing a syringe containing a resin material containing a liquid resin and particles, and a step of arranging the syringe in an atmosphere of a humidity of 20% or less and a temperature of 0 ° C. or higher and 5 ° C. or lower. A method for manufacturing a light emitting device, comprising a step of arranging a substrate on which a light emitting element is placed below the syringe, and a step of discharging a liquid resin material from a nozzle discharge port to coat the light emitting element. [Selection diagram] Fig. 5

Description

  The present disclosure relates to a method for manufacturing a light emitting device.

  As a light-emitting device such as an LED (Light Emitting Diode) using a semiconductor light-emitting element (hereinafter also referred to as “light-emitting element”), a light-emitting device in which the light-emitting element is covered with a resin is known.

  The resin is formed by discharging a certain amount of liquid resin contained in a syringe from a needle and applying it to a desired position, followed by curing. In order to suppress an increase in the viscosity of the liquid resin in the syringe, for example, it is known that the liquid resin is kept constant at 20 ° C. or less (for example, Patent Documents 1 and 2).

Japanese Patent Laid-Open No. 2001-24011 Japanese Patent Laid-Open No. 10-12642

  However, when particles such as phosphor particles are included in the liquid resin, even if the resin is stored at a temperature as low as about 20 ° C. and the resin viscosity is suppressed, the particles will sink in the liquid resin over time.

Embodiments of the present invention include the following configurations.
A step of preparing a syringe containing a resin material containing a liquid resin and particles, a step of placing the syringe in an atmosphere having a humidity of 20% or less, and a temperature of 0 ° C. or more and 5 ° C. or less; A method of manufacturing a light-emitting device, comprising: a step of arranging a substrate on which a light-emitting element is placed; and a step of covering a light-emitting element by discharging a liquid resin material from a discharge port of a nozzle.

  As described above, the particles in the liquid resin can be prevented from settling with time.

FIG. 1 is a schematic cross-sectional view illustrating an example of a light-emitting device obtained by the method for manufacturing a light-emitting device according to the embodiment. FIG. 2 is a schematic side view illustrating an example of a syringe used in the method for manufacturing a light emitting device according to the embodiment. FIG. 3 is a schematic diagram illustrating an example of a main part of a coating apparatus used in the method for manufacturing a light emitting device according to the embodiment. FIG. 4A is a schematic perspective view illustrating an example of an assembly of substrates used in the method for manufacturing a light emitting device according to the embodiment. FIG. 4B is a schematic top view in which a part of the substrate assembly shown in FIG. 4A is enlarged. FIG. 4C is a schematic cross-sectional view of the assembly of substrates shown in FIG. 4B. FIG. 5 is a schematic diagram illustrating an example of a method for manufacturing the light emitting device according to the embodiment. FIG. 6 is a schematic diagram illustrating an example of a method for manufacturing the light emitting device according to the embodiment. FIG. 7 is a schematic cross-sectional view illustrating an example of an assembly of light emitting devices obtained by the method for manufacturing a light emitting device according to the embodiment.

  A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the manufacturing method of the light-emitting device for materializing the technical idea of this invention, and this invention does not limit the manufacturing method of a light-emitting device below.

The light emitting device manufacturing method according to the present embodiment includes a step of preparing a syringe containing a liquid resin material, a step of placing the syringe in an atmosphere of a humidity of 20% or less, and a temperature of 0 ° C. or more and 5 ° C. or less. And a step of disposing a substrate on which the light emitting element is placed below the syringe, and a step of covering the light emitting element by discharging a liquid resin material from the discharge port of the nozzle.
Hereinafter, each step will be described in detail.

  FIG. 1 is a schematic cross-sectional view illustrating an example of a light-emitting device 10 obtained by the method for manufacturing a light-emitting device according to the embodiment. The light emitting device 10 includes a light emitting element 14, a substrate 11, and a wire 15. The substrate 11 includes an insulating base material 13 and a conductive member 12. Further, a sealing member 16 that covers the light emitting element 14 and the wire 15 is provided.

  The light emitting device 10 as described above can be obtained by the following manufacturing method.

(Process to prepare syringe)
FIG. 2 is a side view showing an example of the syringe 21. The syringe 21 has a cylindrical shape, and a nozzle 22 is attached to the tip (lower end). A liquid resin material 16 a is accommodated in the syringe 21. The resin material 16 a in the syringe 21 can be discharged from the discharge port 22 a at the tip of the nozzle 22. The resin material 16 a is a member that becomes the sealing member 16 in the light emitting device 10.

  Examples of the capacity of the syringe 21 include 10 ml to 100 ml. As the capacity increases, the number of light emitting devices that can be applied increases, and the number of times the syringe is replaced can be reduced. However, the larger the capacity, the longer the time until the resin material 16a is used up, and the more easily affected by time. According to the method for manufacturing a light emitting device according to the present embodiment, even when the capacity of the syringe 21 is large, it is possible to suppress sedimentation of particles such as phosphor particles and a diffusing material over time in the resin material 16a.

  The syringe 21 can be made of resin, glass, or metal. In particular, a transparent or translucent resin-made syringe 21 in which the inside of the syringe 21 can be visually recognized is preferable. Since such a syringe 21 made of resin is durable and hard to break, it is also preferable in terms of easy handling.

  The nozzle 22 is a cylindrical member made of metal or resin having a diameter smaller than that of the syringe 21. The inner diameter of the nozzle 22 can be, for example, 10 μm to 1000 μm. The discharge port 22a of the nozzle 22 is circular, for example.

  The resin material is a liquid member before becoming a sealing member of the light emitting device. The resin material may include only the resin, or a phosphor that converts light from the light emitting element into different light in the resin. As the resin, a resin having a light-transmitting property capable of transmitting light from the light-emitting element and light resistance not easily deteriorated by them is preferable.

  As a specific material of the light-transmitting resin, it is possible to transmit light from a light emitting element such as a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition. An insulating resin composition having excellent translucency can be given. In addition, a silicone resin, an epoxy resin, a urea resin, a fluororesin, and a hybrid resin containing at least one of these resins can be used.

Examples of the phosphor include oxide-based, sulfide-based, and nitride-based phosphors. For example, when a gallium nitride-based light-emitting element that emits blue light is used as the light-emitting element, YAG-based, LAG-based, SiAlON-based (β sialon) that emits yellow to green light by absorbing blue light, SGS phosphor, blue Single or combination of phosphors such as BAM phosphors that emit light, SCASN, CASN, and potassium fluoride silicate activated by manganese (KSF phosphor; K ₂ SiF ₆ : Mn), sulfide phosphors Is mentioned.

  As the phosphor, a particulate material can be used. The shape of the phosphor is not particularly limited, but is preferably, for example, a spherical shape or a shape similar thereto. The phosphor is, for example, particles having an average particle diameter of about 3 μm to 30 μm. Here, the average particle diameter can be defined by D50. The average particle diameter of the phosphor can be measured by, for example, a laser diffraction scattering method, an image analysis method (scanning electron microscope (SEM), transmission electron microscope (TEM)), or the like. For example, a SALD series (for example, SALD-3100) manufactured by Shimadzu Corporation can be used as the particle size measuring apparatus of the laser diffraction scattering method. The image analysis method conforms to, for example, JIS-Z8827-1: 2008. For example, the resin member contains 1 part by weight to 200 parts by weight. In addition to such materials, additives such as coloring materials, light diffusing materials, light reflecting materials, and various fillers can be included as desired. In the case where the resin material includes the above-described phosphor or additive, the variation in the light emission characteristics of the light emitting device can be reduced by making it difficult for the viscosity to change.

(Step of placing the syringe)
FIG. 3 is a schematic view illustrating a main part of the coating apparatus 20 used in the method for manufacturing the light emitting device according to the embodiment. The application device 20 can include one or a plurality of syringes 21. FIG. 3 shows an example in which five syringes 21 are provided. By pressurizing the syringe 21 from above the syringe 21, the liquid resin material 16 a can be discharged from the discharge port 22 a at the tip of the nozzle 22.

  A cold insulator 24 is disposed around the syringe 21. The cold insulation unit 24 is a member for holding the syringe 21 in a cooled state. The temperature of the syringe 21 is controlled to 5 ° C. or less by the cold insulator. The temperature of the syringe 21 is preferably 5 ° C. or lower and 0 ° C. or higher. By keeping the temperature of the syringe 21 in such a low temperature range, the viscosity of the liquid resin material 16a can be increased, and the particles in the liquid resin material 16a can be prevented from settling with time. .

  The cold insulation unit 24 may include a cooling pipe that circulates a liquid or gas as a refrigerant. For example, the cooling pipe can be arranged so as to wind the side surface of each syringe 21. Or you may arrange | position in the refrigerator which can accommodate the some syringe 21, and may circulate a liquid or gas as a refrigerant | coolant. Examples of the liquid refrigerant include water, liquid nitrogen, and antifreeze. In addition, examples of gaseous refrigerants include chlorofluorocarbon and air. Or the compressed air cooled using the Peltier device can also be used. Using these refrigerants, the temperature is controlled so that the inside of the cold insulation unit 24 is 5 ° C. or less.

  The nozzle 22 attached to the tip of the syringe 21 is disposed away from the cold insulation unit 24. Thereby, the viscosity of the resin material 16a in the nozzle 22 can be made lower than that of the resin material 16a in the syringe 21. A heater 25 may be attached to the nozzle 22. The heater 25 can control the temperature of the nozzle 22 so as to be 20 ° C. to 40 ° C. The heater 25 can be, for example, an electric wire wound around the side surface of the nozzle 22. The nozzle 22 can be heated by energizing this electric wire. Or you may warm the jig | tool etc. which fix the syringe 21 and the nozzle 22 with a heater.

  The above-described cold insulation unit 24 and syringe 21 are held in the storage unit 23. The container 23 is a container that can be sealed so that the humidity inside the container 23 can be kept at 20% or less. In addition to the syringe 21 held in the above-described cold insulation unit 24, a nozzle 22 attached to the syringe 21 is also arranged in the storage unit 23. Further, a base 26 on which a substrate can be placed is disposed below the syringe 21.

  Since the cold insulation unit 24 is controlled to 5 ° C. or less, condensation tends to occur on the surface of the syringe 21 in the cold insulation unit 24. Therefore, generation | occurrence | production of dew condensation can be suppressed by making the humidity in the accommodating part 23 into 20% or less of air (dry air). In particular, when the heater 25 is attached to the nozzle 22 attached to the syringe 21, the condensation formed on the surface of the syringe 21 becomes easy to flow as water. Therefore, there is a possibility that water droplets transmitted through the nozzle 22 are dropped together with the resin material 16a. Like this Embodiment, the humidity in the accommodating part 23 shall be 20% or less, generation | occurrence | production of dew condensation can be suppressed and it can suppress that water mixes in the resin material 16a.

(Process of placing a syringe on a substrate on which a light emitting element is placed)
First, a substrate on which a light emitting element is placed is prepared, and a syringe is disposed above the substrate. FIG. 4A is a schematic perspective view showing the substrate 11A on which the light emitting element 14 is placed. The light-emitting device is often handled as an aggregate of a plurality of light-emitting devices in the process until it is finally separated into individual pieces. Therefore, the substrate 11A used here exemplifies an aggregate of substrates of a plurality of light emitting devices. In addition, you may use the board | substrate separated into pieces beforehand. 4B is a schematic top view in which the substrate 11A of FIG. 4A is partially enlarged. 4C is a schematic cross-sectional view of FIG. 4B.

  The substrate 11A includes an insulating base material 13A and a conductive member 12A serving as a pair of electrodes. Here, as the substrate 11A, a resin package including a molding resin as the base material 13A and a lead as the conductive member 12A is illustrated. For the substrate 11A, for example, a ceramic package using a ceramic as the base material 13A and a wiring member as the conductive member 12A can be used. Further, the substrate 11A can use a glass epoxy package using glass epoxy as the base material 13A and a wiring member as the conductive member 12A.

  As shown in FIG. 4C, the substrate 11A includes a recess S. The light emitting element 14 is placed on the bottom surface in the recess S. The light emitting element 14 is bonded onto the substrate 11A using a conductive or insulating bonding member. The light emitting element 14 is electrically connected to the conductive member 12 </ b> A through the wire 15. Note that the wire 15 is not always essential, and for example, flip chip bonding may be performed using a conductive bonding member.

  The substrate 11A on which the light emitting element 14 is placed may be prepared by purchasing the substrate 11A on which the light emitting element 14 is placed, or the substrate 11A and the light emitting element 14 are prepared and placed on the substrate 11A. You may prepare through the process of mounting the light emitting element 14. FIG. In a normal process, a plurality of light emitting elements 14 are placed on one substrate 11A. That is, a plurality of light-emitting devices are formed using one substrate, and individual light-emitting devices can be obtained by cutting an assembly of such light-emitting devices into pieces.

  The light emitting element 14 includes a semiconductor layer and an electrode. The semiconductor layer includes, for example, a p-type semiconductor layer, a light emitting layer, and an n-type semiconductor layer. Further, an element substrate may be provided. Furthermore, a p-electrode and an n-electrode are provided.

The semiconductor layer is, for _{example, In X Al Y Ga 1-} X-Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) nitride compound such as a semiconductor is preferably used.

  As shown in FIG. 5, the substrate 11 </ b> A on which the light emitting element is placed is placed on a base 26 disposed in the accommodating portion 23 in the coating apparatus 20. The substrate 11A is placed with the opening of the recess S facing upward. On the board | substrate 11A, the syringe 21 and the nozzle 22 attached to the front-end | tip are arrange | positioned. The discharge port 22a of the nozzle 22 is disposed so as to face the recess S.

(Process for covering the light emitting element by discharging a liquid resin material)
FIG. 6 is a schematic view showing a process of covering the light emitting element 14 by discharging the liquid resin material 16 a from the discharge port of the nozzle 22. In this embodiment, the board | substrate 11 is equipped with the recessed part S, and the resin material 16a is supplied in this recessed part S. FIG. By heating the resin material 16a with the heater 25 to reduce the viscosity, the resin material 16a supplied into the concave portion S can be quickly expanded into the concave portion S as compared with a case where the resin material 16a is supplied in a high viscosity state without being heated. it can. In particular, when a step is provided on the upper side (near the opening) of the recess S, the resin material having a high viscosity stops at the step, and the resin material may not easily spread throughout the recess S. Therefore, by reducing the viscosity, the liquid resin can be easily spread on the upper side of such a step, and the resin material can be spread throughout the recess S.

  Through the above-described steps, a light emitting device assembly 10A as shown in FIG. 7 can be obtained. The light emitting device 10 shown in FIG. 1 can be obtained by cutting the light emitting device assembly 10A.

  The light emitting device according to the present disclosure can be used in various light emitting devices such as an illumination light source, various indicator light sources, an in-vehicle light source, a display light source, a liquid crystal backlight light source, a sensor light source, and a traffic light.

DESCRIPTION OF SYMBOLS 10, 10A ... Light-emitting device 11, 11A ... Board | substrate 12, 12A ... Conductive member 13, 13A ... Base material 14 ... Light-emitting element 15 ... Wire 16 ... Sealing resin 16a ... Liquid resin material 20 ... Coating apparatus 21 ... Syringe 22 ... Nozzle 22a ... Discharge port 23 ... Accommodating part 24 ... Cold insulation part 25 ... Heater 26 ... Base

Claims (4)

Preparing a syringe containing a resin material containing a liquid resin and particles;
Placing the syringe in an atmosphere having a humidity of 20% or less and a temperature of 0 ° C. or more and 5 ° C. or less;
Placing a substrate on which a light emitting element is placed below the syringe;
And a step of covering the light emitting element by discharging the liquid resin material from a discharge port of a nozzle at a lower end of the syringe.   The manufacturing method of the light-emitting device according to claim 1, wherein the discharge port of the nozzle is heated to 20 ° C. or more.   The method for manufacturing a light emitting device according to claim 1, wherein the particles include phosphor particles.   The method for manufacturing a light emitting device according to claim 1, wherein the particles include a diffusing material.

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