JP2018133378A - Imprint device and method of manufacturing article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint apparatus in which a supply amount of gas for replacing air is reduced to a necessary minimum. An imprint apparatus includes a holding unit that holds a template, a stage that holds a substrate, and a plurality of gas supply openings arranged so as to surround the template, between the template and the substrate. The gas is supplied through a gas supply part that supplies a gas for replacing air into the space, and a first gas recovery opening formed on the stage-side surface of the holding part so as to surround the plurality of gas supply openings. The gas supply unit supplies the gas only from a gas supply opening located in a region where the first gas recovery unit, the first region surrounded by the first gas recovery opening, and the substrate overlap. And a control unit for controlling. [Selection] Figure 2

Description

  The present invention relates to an imprint apparatus for transferring a fine pattern of a template as an original to a substrate or the like, and a method for manufacturing an article.

  There is an imprint technique as an alternative to a method for forming a fine pattern on a semiconductor device using photolithography using ultraviolet rays, X-rays, or an electron beam. The imprint technology uses a pattern on a resist by curing a mold (template) on which a fine pattern is formed by electron beam exposure, etc., with ultraviolet light while being pressed against a substrate such as a substrate coated with a resin material (resist). Transcript. It has already been shown that transfer of a fine shape of about 10 nm is possible, and in particular, it has been attracting attention as a method for creating a fine periodic structure of a magnetic recording medium, and research and development has been actively conducted in various places. .

  It is known that when a template is imprinted on a resist-coated substrate, if bubbles remain between the template and the resist on the surface of the substrate, the formed pattern is distorted. As a countermeasure, a gas such as helium or carbon dioxide that has high diffusibility or resist solubility is flown so that it does not remain between the template and the substrate, and the air in the gap between the substrate and the template is replaced. The technique to do is disclosed by patent document 1. FIG. Further, Patent Document 1 discloses a technique for reducing the remaining of the bubbles by setting the space between the template and the substrate to atmospheric pressure or less. Patent Document 2 discloses that a gas such as helium or carbon dioxide is supplied to the space between the substrate and the template while exhausting from the gas recovery port provided in the template or its periphery or the substrate stage.

Special table 2007-509769 gazette JP 2009-532245 A

  In the technique disclosed in Patent Document 2, a gas that replaces air is supplied to the entire space between the template and the substrate, so that the amount of gas supplied is large.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an imprint apparatus in which the supply amount of gas for replacing air is reduced to a necessary minimum.

  The present invention is an imprint apparatus that performs an imprint process for forming a pattern by bringing a resin applied to a substrate into contact with a template having a pattern surface and curing the resin, and a holding unit that holds the template And a stage for holding the substrate, and a gas supply unit for supplying a gas for replacing air into a space between the template and the substrate through a plurality of gas supply openings arranged so as to surround the template A first gas recovery part for recovering the gas through a first gas recovery opening formed on the stage side surface of the holding part so as to surround the gas supply openings; and the first gas recovery The gas supply unit is controlled so as to supply the gas only from the gas supply opening located in the region where the first region surrounded by the opening and the substrate overlap. And a control unit that, the, characterized in that.

  ADVANTAGE OF THE INVENTION According to this invention, the imprint apparatus which reduced the supply_amount | feed_rate of the gas for substituting with air to required minimum can be provided.

Diagram showing the outline of the imprint device The figure which shows 1st Embodiment The figure which shows 2nd Embodiment The figure which shows 3rd Embodiment The figure which shows 4th Embodiment The figure which shows 4th Embodiment The figure which shows 4th Embodiment The figure which shows 5th Embodiment The figure which shows 5th Embodiment The figure which shows 5th Embodiment The figure which shows 5th Embodiment The figure which shows 5th Embodiment The figure which shows 5th Embodiment

[First Embodiment]
About the imprint apparatus 10 using the photocuring method which performs the imprint process which forms the pattern by making the resist (resin) apply | coated to the board | substrate and a template (mold | die) and making a resist harden | cure as 1st Embodiment. explain. In addition, in each figure, about the same member, the same reference number is attached | subjected and the overlapping description is abbreviate | omitted. Here, FIG. 1 is a schematic cross-sectional view of the imprint apparatus 10. The imprint apparatus 10 includes a light source 15, an imprint mechanism 40, a template 11, a substrate 21, a stage 23 that holds the substrate 21, a resist supply port 32, and other mechanisms.

  The resist on the substrate 21 is cured by irradiating the resist with ultraviolet rays through the template 11. For this purpose, the light source 15 including a halogen lamp that generates ultraviolet rays and the illumination optical system 14 are provided. The illumination optical system 14 includes a lens for shaping and irradiating the resist surface with ultraviolet rays for exposing and curing the resist, an aperture, a shutter for switching between irradiation and light shielding, and the like.

  The template 11 has a pattern surface 12 near the center and is made of a transparent member because it needs to transmit exposure light in order to cure the resist. The imprint mechanism 40 includes a template holding unit (holding unit) 13 for holding the template 11. The template holding unit 13 has, for example, a plate shape. The imprint mechanism 40 not only moves up and down, but also has a tilt control mechanism, a posture control, and a rotation function alignment function so that the pattern surface 12 and the substrate 21 are in close contact with each other.

  The substrate 21 is a target on which a fine pattern formed on the pattern surface 12 of the template 11 is transferred and a semiconductor integrated circuit is formed through a subsequent process, and is similar to that used in a conventional semiconductor process. is there. In addition to the substrate 21, the stage 23 holds a ring-shaped same surface plate (enclosing member) 22 that surrounds the substrate 21 and has the same thickness as the substrate 21, and is movable in the x and y directions. The stage 23 can be precisely positioned and is configured to achieve superposition of fine patterns. The stage 23 has not only positioning but also a function of adjusting the posture of the surface of the substrate 21.

  The position of the stage 23 is measured by an interferometer system including a mirror 71, an interferometer 73, and an optical path 72 disposed on the end face of the stage 23. The resist is supplied onto the substrate 21 from the tank 31 through the resist supply port 32.

  The imprint apparatus 10 further includes a surface plate 24, a vibration isolator 25, a frame 26, and an alignment scope 27. The surface plate 24 supports the entire imprint apparatus 10 and forms a reference plane for the movement of the stage 23. The vibration isolator 25 has a function of removing vibration from the floor and supports the frame 26. The frame 26 supports components from the light source 15 to the template 11 located above the substrate 21. The alignment scope 27 measures the position of the alignment mark on the substrate 21, and the stage 23 is positioned based on the result.

  The substrate 21 is placed on the stage 23 by a substrate transport system (not shown). The substrate 21 is held by a vacuum chuck (not shown) configured on the stage 23. While driving the stage 23, alignment marks (not shown) on the substrate 21 are sequentially measured by the alignment scope 27, and the position of the substrate 21 is measured with high accuracy. The control unit C (not found in the figure) calculates the coordinates of each transfer position from the measurement result, and performs sequential transfer (step-and-repeat) for each predetermined shot based on the calculation result. When transfer is completed for all shots, the substrate 21 is unloaded from the stage 23 and the next substrate 21 is loaded into the stage 23.

  An imprint process for transferring the fine pattern to the substrate 21 will be described. First, the control unit C positions the stage 23 so that the shot 42 to be transferred is positioned under the resist supply port 32. Then, the control unit C drops an appropriate amount of resist onto the shot 42 from the resist supply port 32. Thereafter, the control unit C moves the stage 23 so that the shot 42 is positioned directly below the pattern surface 12, and performs positioning. After the positioning is completed, the imprint mechanism 40 lowers the template 11 and imprints the pattern surface 12 on the resist on the shot 42.

  The determination of the completion of the stamping is performed by a load sensor installed in the imprint mechanism 40. After the stamping, the control unit C irradiates ultraviolet rays to cure the resist. After the resist curing is completed, the control unit C pulls up the template 11. Then, the stage 23 is positioned so that the next shot 42 is positioned below the resist supply port 32.

  When bubbles are left between the pattern surface 12 and the resist on the substrate 21 during the imprint process, the pattern to be formed is distorted, and a transfer defect occurs depending on the degree of the remaining. For this reason, there is known a method of suppressing the generation of bubbles by replacing the air between the template 11 and the substrate 21 with a gas (purge gas) such as helium or carbon dioxide having high solubility in the resist.

  The purge gas is supplied to the space between the template 11 and the substrate 21 through the gas supply openings 43 by the gas supply unit 60. The plurality of gas supply openings 43 are arranged so as to surround the template 11. The gas supply opening 43 may be provided in a nozzle disposed so as to surround the template 11 or may be provided in the template holding unit 13.

  This embodiment is shown in FIGS. 2A to 2D. FIG. 2A shows the positional relationship between the template holding unit 13 and the same surface plate 22 when the resist is supplied from the resist supply port 32 onto the target shot 42 of the substrate 21.

  In the present embodiment, in order to supply the purge gas between the template 11 and the substrate 21, the gas supply openings 43 </ b> A to 43 </ b> D are arranged in the template holding unit 13 so as to surround the template 11. In the present embodiment, the number of gas supply openings 43A to 43D is four, but this is not restrictive. The supply operation of the gas supply openings 43 </ b> A to 43 </ b> D is controlled by the gas supply unit 60 for each gas supply opening. A first gas recovery opening 51 is arranged on the surface of the template holding unit 13 on the stage side so as to surround the gas supply openings 43A to 43D.

  On the other hand, the stage 23 is provided with a second gas recovery opening 52 so as to surround the substrate 21. The purge gas is recovered by the first gas recovery unit through the first gas recovery opening 51 and by the second gas recovery unit (numbered) through the second gas recovery opening 52. Next, a method for maintaining the purge gas at a high concentration between the template 11 and the substrate 21 or the same surface plate 22 in this embodiment will be described with reference to FIGS. 2B to 2D.

  FIG. 2B shows a state in the middle of moving the stage 23 in the −X direction in order to form a fine pattern on the shot 42 shown in FIG. 2A. At this time, the region (first region) 53 surrounded by the first gas recovery opening 51 and the region 54 (second region) surrounded by the second gas recovery opening 52 overlap. A portion formed by overlapping the region 53 and the region 54 is defined as a region (third region) 55, and the purge gas is supplied only from the gas supply opening 43B located in the region 55 (in the third region).

  In this case, the purge gas is not supplied from the gas supply openings 43A, 43C, and 43D outside the region 55. By doing so, the purge gas can be confined only in the region 55. FIG. 2C shows a state in which the stage 23 is moved further in the −X direction than in FIG. 2B and the pattern surface 12 is arranged on the shot 42. In this case, the region 55 includes three gas supply openings 43B, 43C, and 43D, and the purge gas is supplied into the region 55 from the gas supply openings 43B, 43C, and 43D.

  As a result, the stamping operation can be performed with the purge gas maintained at a high concentration under the pattern surface 12, and the purge gas can be confined in the region 55. When the imprinting is completed and the next shot is moved below the resist supply port 32, the supply of gas from all the gas supply openings 43A to 43D is stopped. The control unit C controls the gas supply unit 60 for supplying the purge gas and the first and second gas recovery units (numbers) for recovering the purge gas.

  FIG. 2D shows a state where the stage 23 is moving in the + X direction so that the stage 23 moves the next shot directly below the resist supply port 32. During this time, the gas supply from all the gas supply openings 43A to 43D is stopped. As the stage 23 moves in the + X direction, the range of the region 55 is narrowed, and the purge gas contained in the region 55 is recovered in the first gas recovery opening 51 or the second gas recovery opening 52. After the stamping, the purge gas contained in the region 55 is quickly recovered at the first gas recovery opening 51 or the second gas recovery opening 52 by stopping the gas supply from all the gas supply openings 43A to 43D. I can do it.

  By reliably confining the purge gas only in the region 55 by the above-described method, the purge gas can be prevented from leaking to the optical path of the interferometer 73 or the like. In addition, since the purge gas can be prevented from leaking, the supply amount of the purge gas can be reduced. Further, since the leakage of purge gas can be reduced without relying on the same surface plate 22, the same surface plate 22 can be reduced in size. As a result, the weight applied to the stage 23 can be reduced, and the footprint of the imprint apparatus 10 can be reduced.

  In the present embodiment, the embodiment provided with the second gas recovery opening 52 has been described. However, a purge gas supply method when the second gas recovery opening 52 is not provided will be described using FIG. 2E. In this case, if there is no substrate 21 or the same surface plate 22 directly under the gas supply openings 43A to 43D, the purge gas supplied from the gas supply openings 43A to 43D will diffuse directly into the imprint apparatus 10.

  Therefore, in order to reduce the consumption and diffusion of the purge gas, the purge gas is supplied from the region 53 surrounded by the first gas recovery opening 51 and the gas supply opening 43B located in the region 55 where the substrate 21 overlaps. The gas supply is controlled by the gas supply unit 60 shown in FIG. The purge gas is not supplied from the other gas supply openings 43A, 43C, and 43D. By doing so, it is possible to provide an imprint apparatus that reduces the consumption and diffusion of the purge gas when the second gas recovery opening 52 is not provided.

[Second Embodiment]
The imprint apparatus according to the second embodiment basically takes over the first embodiment, and only different points from the first embodiment will be described. FIG. 3A shows an XZ sectional view of FIG. 2C. This shows that the purge gas supplied from the gas supply opening 43 is recovered by the first and second gas recovery openings 51 and 52 and confined under the template 11. In FIG. 3A, the distance between the template holding unit 13 and the substrate 21 or the same surface plate 22 is A.

  When the distance A is narrowed by the configuration of the imprint apparatus 10, the negative pressure generated at the first gas recovery opening 51 and the second gas recovery opening 52 affects each other's gas recovery operation, and purge gas is injected into the region 55. It becomes difficult to confine. In order to solve the above-described problem, the negative pressure generated at the first gas recovery opening 51 and the second gas recovery opening 52 is suppressed. In this embodiment, as shown to FIG. 3B, the shape of the template holding | maintenance part 13 and the same surface board 22 is changed.

  A distance B shown in FIG. 3B is generated so that a region having a large distance between the surface of the template holding unit 13 and the surface of the stage 23 is generated on the outer peripheral portion (outside the first region) on the first gas recovery opening 51 side. Steps are provided. In this way, even if the distance A between the template holding unit 13 and the substrate 21 or the same surface plate 22 is narrowed, the first gas recovery opening 51 is not affected by the negative pressure generated in the second gas recovery opening 52. Through which the purge gas can be recovered. Further, a step of a distance C shown in FIG. 3B is provided on the outer peripheral portion of the same surface plate 22 on the second gas recovery opening 52 side.

  That is, the distance between the surface of the stage 23 and the surface of the template holder 13 on the outer peripheral portion (outside the second region) on the second gas recovery opening 52 side is such that the surface of the substrate 21 or the same plate 22 and the template holder 13. A region larger than the distance from the surface is generated. By doing so, even if the distance A between the template holding unit 13 and the substrate 21 or the same surface plate 22 is narrowed, the second gas recovery opening 52 is not affected by the negative pressure generated in the first gas recovery opening 51. Through which the purge gas can be recovered.

[Third Embodiment]
The imprint apparatus according to the third embodiment basically takes over the first and second embodiments, and only differences from the first and second embodiments will be described. In the present embodiment, as shown in FIG. 4A, the first gas recovery opening 51 is divided into eight portions 51a to 51h. The second gas recovery opening 52 is also divided into eight parts 52a to 52h. The parts 51a to 51h of the first gas recovery opening 51 and the parts 52a to 52h of the second gas recovery opening 52 are purged from each part by a first gas recovery part and a second gas recovery part (gas recovery part) 61, respectively. Configured to be retrievable.

  4B shows a region (third region) 55 where a region (first region) 53 surrounded by the first gas recovery opening 51 and a region 54 (second region) surrounded by the second gas recovery opening 52 overlap. Is formed, and the purge gas is supplied into the region 55 from the gas supply opening 43B. At this time, the boundary of the region 55 is defined by the divided portions 51a to 51d of the first gas recovery opening and the divided portions 52f and 52g of the second gas recovery opening. The purge gas is recovered at the divided portions 51a to 51d of the first gas recovery opening and the divided portions 52f and 52g of the second gas recovery opening, and recovered at the other portions of the first and second gas recovery openings 51 and 52. Stop operation.

  By performing such control, the purge gas can be recovered without being affected by the negative pressure generated at the first gas recovery opening 51 and the second gas recovery opening 52 described above. Can be confined. In this way, by dividing the first and second gas recovery openings 51 and 52 into a plurality of parts, and stopping the recovery at the parts of the first and second gas recovery openings 51 and 52 that do not greatly contribute to confinement of the purge gas, It is possible to prevent the air conditioning in the imprint apparatus 10 from being disturbed. Further, vibrations generated by collecting the purge gas and energy consumed for collection can be reduced. In the present embodiment, each of the first and second gas recovery openings is divided into eight parts. However, the present invention is not limited to this, and the first and second gas recovery openings may be increased or decreased as necessary.

[Fourth Embodiment]
The imprint apparatus according to the fourth embodiment basically takes over the first to third embodiments, and only different points from the first to third embodiments will be described. In the present embodiment, when the template holding unit 13 described in the third embodiment and the substrate 21 or the same surface plate 22 are close to each other, the negative pressures of the first gas recovery opening 51 and the second gas recovery opening 52 influence each other. Show different solutions to the problem. FIG. 5 shows the configuration of this embodiment. A first air ejection opening 44 is provided on the outer periphery of the template holding unit 13 outside the first gas recovery opening 51.

  Unlike the purge gas supplied from the gas supply opening 43, the gas supplied from the first air ejection opening 44 is air that is an atmospheric gas in the imprint apparatus 10. In this way, even if the distance A between the template holding unit 13 and the substrate 21 or the same surface plate 22 is reduced, the first gas recovery opening 51 is not affected by the negative pressure generated in the second gas recovery opening 52. The purge gas can be recovered.

  A second air ejection opening 45 is provided on the outer peripheral portion of the same surface plate 22 outside the second gas recovery opening 52. Unlike the purge gas supplied from the gas supply opening 43, the gas supplied from the second air ejection opening 45 is air that is the atmospheric gas in the imprint apparatus 10. Thus, even if the distance A between the template holding unit 13 and the substrate 21 or the same surface plate 22 is narrowed, the second gas recovery opening 52 is not affected by the negative pressure generated in the first gas recovery opening 51. The purge gas can be recovered via the.

  Air is supplied by the air ejection portion 46 via the first air ejection opening 44 and the second air ejection opening 45. Moreover, as shown to FIG. 6A, you may divide | segment the 1st air ejection opening 44 and the 2nd air ejection opening 45 into several part 44a-44h, 45a-45h. In this way, as shown in FIG. 6B, air can be ejected only from the first air ejection openings 44a to 44d and the second air ejection openings 45f and 45g located near the boundary of the region 55 by the air ejection section 46. Can be configured. As a result, it is possible to prevent the air conditioning in the imprint apparatus 10 from being disturbed.

  Further, the consumption can be reduced by reducing the amount of air supplied from the first and second air ejection openings 44 and 45, and the air supplied from the first and second air ejection openings 44 and 45 is supplied. By doing so, vibrations generated can be reduced.

  In this embodiment, the structure which supplies air from the 1st air ejection opening 44 and the 2nd air ejection opening 45 was demonstrated. However, it is not always necessary to forcibly supply air from the first air ejection opening 44 and the second air ejection opening 45. As shown in FIG. 7, the first holding hole 47 may be provided in the template holding unit 13, and the second through hole 48 may be provided in the stage 23. The first and second through holes 47 and 48 communicate the space formed by the gap between the template 11 and the substrate 21 with the inside of the imprint apparatus 10.

  As a result, air, which is the atmospheric gas in the imprint apparatus 10, is templated from the first and second through holes 47 and 48 due to the negative pressure generated at the first gas recovery opening 51 and the second gas recovery opening 52. 11 can be supplied.

  As described above, in the third to fifth embodiments, when the template holding unit 13 and the substrate 21 or the same surface plate 22 are close to each other, the negative pressures of the first gas recovery opening 51 and the second gas recovery opening 52 influence each other. The solution to is shown. The solution to this problem is not limited to this, and the third to fifth embodiments may be combined. For example, the template holding unit 13 may be provided with a step according to the distance B shown in FIG. 3B, and the same plate 22 may be provided with the second air ejection opening 45 shown in FIG. 5.

[Fifth Embodiment]
The imprint apparatus of the fifth embodiment basically takes over the first to fourth embodiments, and only different points from the first to fourth embodiments will be described. In the first to fourth embodiments, by replacing the atmosphere of the region (third region) 55 shown in FIG. 2 with a gas having high solubility from air to the resist, the pattern surface 12 and the resist on the substrate 21 A method for reducing bubbles generated during the period has been described.

  In the present embodiment, a method for further reducing bubbles generated between the pattern surface 12 and the resist on the substrate 21 will be described. In the first to fourth embodiments, the atmosphere in the region (third region) 55 is replaced with a gas having high solubility from air to the resist, and the pressure is about atmospheric pressure.

  In the present embodiment, as in the first to fourth embodiments, the atmosphere in the region (third region) 55 is replaced with a gas having high solubility from air to the resist, but the pressure is set to atmospheric pressure or lower. By reducing the area (third area) 55 to atmospheric pressure or less, the effect of suppressing the generation of bubbles and the amount of gas dissolved in the resist are reduced, so the bubble disappearance time is shortened and the stamping time can be shortened. The effect can also be expected.

  In the case of the present embodiment, when the region (third region) 55 becomes atmospheric pressure or less, the stage 23 is attracted to the template holding unit 13 side. The stage 23 needs to generate a force that opposes this attractive force. As a result, a large load is generated on the drive unit of the stage 23, causing problems such as heat generation of the drive unit.

  In the present embodiment, a third gas recovery port 56 (12 openings in FIGS. 8A to 8E) is provided so as to surround the template 11 shown in FIGS. The entire region (third region) 55 is not set to atmospheric pressure or lower, and only the region under the template 11 surrounded by the third gas recovery port 56 is set to atmospheric pressure or lower. By doing so, the load on the substrate stage 23 described above can be reduced as much as possible. In the present embodiment, the number of third gas recovery ports 56 is twelve, but this is not restrictive.

  The details of the present embodiment will be described with reference to FIGS. FIG. 8A shows the positional relationship between the template holding unit 13 and the same surface plate 22 when the resist is supplied onto the target shot 42 of the substrate 21 from the resist supply port 32. In the present embodiment, the above-described third gas recovery port 56 is disposed between the template 11 of the template holding unit 13 and the gas supply openings 43A to 43D.

  In the present embodiment, the number of gas supply openings 43A to 43D is four, but this is not restrictive. The supply operation of the gas supply openings 43 </ b> A to 43 </ b> D is controlled by the gas supply unit 60 for each gas supply opening. A first gas recovery opening 51 is arranged on the surface of the template holding unit 13 on the stage side so as to surround the gas supply openings 43A to 43D. On the other hand, the stage 23 is provided with a second gas recovery opening 52 so as to surround the substrate 21. The purge gas is recovered by the first gas recovery unit 61 through the first gas recovery opening 51 and by the second gas recovery unit 62 through the second gas recovery opening 52.

  Next, regarding the method of maintaining the purge gas at a high concentration between the template 11 under the template 11 and the substrate 21 or the same surface plate 22 in the present embodiment and setting the pressure under the template 11 to be equal to or lower than the atmospheric pressure, FIGS. Use and explain.

  FIG. 8B shows a state in the middle of moving the stage 23 in the −X direction in order to form a fine pattern on the shot 42 shown in FIG. 8A. At this time, the region (first region) 53 surrounded by the first gas recovery opening 51 and the region 54 (second region) surrounded by the second gas recovery opening 52 overlap. A portion formed by overlapping the region 53 and the region 54 is defined as a region (third region) 55, and the purge gas is supplied only from the gas supply opening 43B located in the region 55 (in the third region). In this case, the purge gas is not supplied from the gas supply openings 43A, 43C, and 43D outside the region (third region) 55. By doing so, the purge gas can be confined only in the region 55 (third region).

  FIG. 8C shows a state in which the stage 23 is moved further in the −X direction than in FIG. 8B and the pattern surface 12 is arranged on the shot 42. In this case, three gas supply openings 43B, 43C, and 43D are included in the region (third region) 55, and the purge gas is supplied into the region 55 (third region) from the gas supply openings 43B, 43C, and 43D.

  At the time of imprinting, the purge gas is recovered from the third gas recovery port 56, and the area under the template 11 is set to an environment below atmospheric pressure. At this time, the purge gas is continuously supplied from the gas supply openings 43B, 43C, and 43D so that the purge gas concentration under the fine pattern 12 does not decrease. As a result, it is possible to perform the stamping operation in a state where the purge gas is maintained at a high concentration under the pattern surface 12 and the amount of the purge gas itself is reduced.

  FIG. 8F shows an XZ cross-sectional view of FIG. 8C and a pressure distribution at the time of stamping formed in the gap between the template holding unit 13 and the stage 23. The purge gas supplied from the gas supply ports 43B, 43C, and 43D is maintained at a high concentration in the region 55. Looking at the pressure distribution formed in the gap between the template holding unit 13 and the stage 23, the pressure below the template 11 is below atmospheric pressure, and is maintained lower than the surrounding pressure.

  After the stamp (imprint) is completed, exposure is performed to cure the resist. At the time of exposure, the supply of gas from all the gas supply openings 43A to 43D is stopped, and the recovery of the third gas recovery port 56 is also stopped. However, the purge gas recovery from the first and second gas recovery ports 51 and 52 is continued.

  The control unit C controls the gas supply unit 60 that supplies the purge gas and the first, second, and third gas recovery units 61, 62, and 63 that collect the purge gas. After the exposure is completed, a mold release operation is performed, and the stage 23 is moved in order to dispense the resist to the next shot position. In the present embodiment, the stage 23 is moved in the + X direction as shown in FIG. 8D. During this time, the gas supply from all the gas supply openings 43A to 43D is stopped. Further, the gas recovery at the third gas recovery port 56 is also stopped.

  As the stage 23 moves in the + X direction, the range of the region (third region) 55 narrows, and the purge gas contained in the region (third region) 55 enters the first gas recovery opening 51 or the second gas recovery opening 52. Collected.

  In the above description, the example in which the imprint operation is performed on the shot position 42 illustrated in FIG. 8A has been described. As another shot position, a method of controlling the gas supply openings 43A to 43D and the third gas recovery port 56 will be described in the case where an imprint operation is performed near the center of the substrate 21 shown in FIG. 8E. In this case, the region (third region) 55 is the same as the region (first region) 51. Since the gas supply openings 43A to 43D are located in the region (third region) 55, the purge gas is supplied from all of the gas supply openings 43A to 43D.

  At the time of imprinting, as described above, the purge gas is recovered from the third gas recovery port 56, and the area under the template 11 is set to an environment below atmospheric pressure. At this time, the purge gas is continuously supplied from all of the gas supply openings 43A to 43D so that the purge gas concentration under the fine pattern 12 does not decrease.

  In the present embodiment, the purge gas is recovered from the third gas recovery port 56 at the time of imprinting, and the region under the template 11 is positioned within the region (third region) 55 when the region is below atmospheric pressure. The purge gas is continuously supplied from the gas supply openings 43A to 43D. Thus, although the example which continues supplying purge gas at the time of a stamp (imprint) was demonstrated, it is not necessarily this limitation. If the purge gas is maintained at a sufficiently high concentration under the pattern 12 at the time of imprinting, the supply of the purge gas may be stopped.

  In the present embodiment, the example in which the gas recovery from the third gas recovery port 56 is stopped after the completion of the imprinting, and at the time of exposure and mold release is not limited to this. The gas recovery from the third gas recovery port 56 may be continued after the completion of the imprinting and at the time of exposure and release.

[Product Manufacturing Method]
A method for manufacturing a device (semiconductor integrated circuit element, liquid crystal display element, etc.) as an article includes a step of transferring (forming) a pattern onto a substrate (wafer, glass plate, film-like substrate) using the above-described imprint apparatus. . Further, the manufacturing method may include a step of etching the substrate to which the pattern is transferred. In the case of manufacturing other articles such as patterned media (recording media) and optical elements, the manufacturing method may include other processing for processing the substrate to which the pattern is transferred instead of etching. As mentioned above, although embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

10 Imprint Device 15 Light Source 40 Imprint Mechanism 11 Template 21 Substrate 23 Stage 32 Resist Supply Port

Claims (13)

An imprint apparatus that performs an imprint process for forming a pattern by contacting a resin applied to a substrate and a template having a pattern surface to cure the resin,
A holding unit for holding a template;
A stage for holding a substrate;
A gas supply unit for supplying a gas for replacing air into a space between the template and the substrate through a plurality of gas supply openings arranged to surround the template;
A first gas recovery part for recovering the gas through a first gas recovery opening formed on the stage-side surface of the holding part so as to surround the gas supply openings;

A control unit that controls the gas supply unit so as to supply the gas only from a gas supply opening located in a region where the substrate overlaps with a first region surrounded by the first gas recovery opening;
An imprint apparatus comprising: A second gas recovery unit that recovers the gas from a second gas recovery opening formed in the stage so as to surround the substrate;
When a third region is formed in which the first region and the second region surrounded by the second gas recovery opening are formed, a gas supply opening located in the third region among the plurality of gas supply openings The imprint apparatus according to claim 1, wherein the gas is supplied from only the gas.   3. The imprint apparatus according to claim 1, wherein the holding unit includes an area outside the first area where an interval between a surface of the holding part and the surface of the stage is larger than the first area. .   The stage according to any one of claims 1 to 3, wherein the stage includes a region outside the second region where a distance between the surface of the stage and the surface of the holding unit is larger than the second region. The imprint apparatus described.   A first air ejection opening formed on the surface of the holding portion so as to surround the first gas recovery opening; and a second air ejection formed on the surface of the stage so as to surround the second gas recovery opening. The imprint apparatus according to any one of claims 1 to 4, further comprising an air ejection unit that ejects air through the opening. A first through hole that has a first opening formed in the surface of the holding portion so as to surround the first gas recovery opening and penetrates the holding portion;
A second through hole having a second opening formed on the surface of the stage so as to surround the second gas recovery opening and penetrating the stage;
The imprint apparatus according to claim 1, further comprising: The first gas recovery opening and the second gas recovery opening are each divided into a plurality of parts, and the first gas recovery part and the second gas recovery part are respectively connected to each part of the first gas recovery opening and the first gas recovery opening. 2 The gas can be recovered from each part of the recovery opening,
The controller determines a boundary of the third region among the plurality of portions of the first gas recovery opening and the plurality of portions of the second recovery opening when the third region is formed. Controlling the first gas recovery unit and the second gas recovery unit so as to recover the gas only from the portion that is,
The imprint apparatus according to claim 1, wherein the apparatus is an imprint apparatus. A first air ejection opening formed on the surface of the holding portion so as to surround the first gas recovery opening; and a second air ejection formed on the surface of the stage so as to surround the second gas recovery opening. An air ejection part for ejecting air through the opening;
The first air ejection opening and the second air ejection opening are each divided into a plurality of parts, and the air ejection part is configured to air from each part of the first air ejection opening and each part of the second air ejection opening. Each can be squirted,
The control unit determines a boundary of the third region among the plurality of portions of the first air ejection opening and the plurality of portions of the second air ejection opening when the third region is formed. Controlling the air ejection portion so that air is ejected from only the outer portion of the portion,
The imprint apparatus according to claim 7. The stage includes an enclosing member that encloses the substrate held on the stage,
The imprint apparatus according to claim 5, wherein the second gas recovery opening and the second air ejection opening are formed in the surrounding member. The stage includes an enclosing member that encloses the substrate held on the stage,
The imprint apparatus according to claim 6, wherein the second gas recovery opening and the second opening are formed in the surrounding member. A third gas recovery part for recovering the gas through a third gas recovery opening between the template and the gas supply part on the stage side surface of the holding part; The said 3rd area | region is made into atmospheric pressure or less by collect | recovering the said gas by the said 3rd gas collection | recovery part at the time of stamping to 1st, The Claim 1 characterized by the above-mentioned. Imprint device.   12. The imprint apparatus according to claim 11, wherein the gas is supplied from the gas supply unit when the gas is recovered by the third gas recovery unit at the time of stamping. A step of performing imprint processing on a substrate using the imprint apparatus according to any one of claims 1 to 12,
A step of processing the substrate subjected to the imprint process in the step;
A method for producing an article comprising: