JP2018133236A - Surface mount contact - Google Patents

Abstract

A surface mount contact with reduced electrical contact resistance at a contact portion of a contact piece is provided. A base portion 11 having a mounting surface portion 113 mounted on a grounding pattern 21 of a substrate 2 and a base end 120 on the base portion 11 and extending in a protruding state with a predetermined width dimension to an object. And an elastically deformable contact portion 12 in electrical contact. The contact portion 12 has a plurality of contact pieces 121 arranged in parallel in the width direction and bent in the length direction, and each contact piece 121 elastically contacts the object independently. [Selection] Figure 1

Description

  The present invention relates to a surface mount contact that is surface-mounted on a substrate or the like and makes electrical contact with a conductive member.

  As a surface mount contact formed by bending a conductive plate material such as metal, a joint for surface mounting with solder or the like on the surface of the substrate, and an elastically deformable contact piece projecting upward from the joint There is something with. For example, the contact of Patent Document 1 is independent of a solder joint portion whose lower surface is a solder joint surface, an elastic contact portion connected to one end of the solder joint portion and folded upward, and the solder joint portion. Thus, the suction portion is connected and partly formed in parallel with the solder joint surface.

  Also, the grounding terminal of Patent Document 2 has almost the same configuration, and a spring contact connected to one end of the substrate portion and folded upward, and the spring contact is raised from the substrate portion independently from the upper surface of the substrate portion. It is the structure provided with the engagement wall formed in parallel with the part. Although Patent Document 2 is mounted on a substrate or the like with screws or the like, it is the same as Patent Document 1 in terms of mounting on the surface of the substrate or the like.

Japanese Patent No. 5246806 Utility Model Registration No. 3064756

  In each of the techniques of Patent Documents 1 and 2, the contact piece or the portion where the spring contact comes into contact with the conductive member is configured as one piece. That is, Patent Documents 1 and 2 are configured as one strip-shaped contact piece or spring contact. In addition, Patent Document 2 proposes one strip-shaped contact piece that is configured as two contact pieces having a parallel structure having a slit at the center portion. The contact portion has a structure equivalent to one piece in which the tips of two contact pieces are connected.

  Therefore, although specific examples will be described later, when the contact part of the contact piece or the spring contact and the contact part of the conductive member are not parallel to each other but inclined, The contact is made at one point (contact), and the contact area is smaller than the contact at a line or surface. Since contact pieces and spring contacts have elasticity, it is possible to improve the contact area by elastically deforming them so that they follow even if there is a certain degree of inclination with the conductive member. However, there is still a limit, and it is inevitable that the contact resistance at the time of contact with the conductive member, that is, the electrical contact resistance increases.

  An object of the present invention is to provide a surface mount contact with reduced electrical contact resistance at a contact portion in a contact piece.

  The present invention has a base portion having a mounting surface portion mounted on a grounding pattern or the like of a board, and a base end on the base portion, and is extended from the base end to a protruding state with a predetermined width dimension. A surface-mount contact having an elastically deformable contact portion that contacts electrically, wherein the contact portion has a plurality of contact pieces arranged in parallel and bent in a length direction, and each contact piece is independent And elastically contacting the object. Here, the elastic contact means that the contact piece comes into contact with the object with an elastic force.

  In the present invention, it is preferable that the contact piece is bent in a U shape, and the vicinity of the bent top is configured as an abutting portion that elastically contacts the object.

  According to the present invention, by arranging a plurality of contact pieces in parallel, each contact piece is independently elastically contacted with the conductive member. Therefore, even when an inclination or the like occurs between the conductive members, the contact pieces are brought into electrical contact with each other, increasing the contact area as a whole of the contact pieces and reducing the electrical contact resistance.

The external appearance perspective view which looked at the contact of embodiment from the one end side. The external appearance perspective view which looked at the contact of embodiment from the other end side. The top view, BB sectional drawing, and bottom view of the contact of embodiment. The perspective view of a part of contact of an embodiment. The front view explaining the effect | action of the contact of embodiment. The schematic side view explaining the effect | action of the contact of embodiment. The perspective view of a part of contact of a modification.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of a surface mount contact (hereinafter referred to as a contact) according to an embodiment of the present invention, and FIG. 2 is an external perspective view as viewed from the opposite side. The contact 1 is formed of a conductive metal plate, and is surface-mounted by a reflow method using a conductive brazing material such as solder on a ground pattern 21 of a printed wiring board 2 provided in various devices. Further, although not shown here, a conductive member such as a liquid crystal display panel, which will be described later, is disposed at the upper position of the printed wiring board 2, and the conductive pads provided on the lower surface of the conductive member are The contact is brought into contact with the upper surface of the contact 1 for electrical contact. As a result, the conductive pad of the conductive member is electrically connected to the ground pattern 21 of the printed wiring board 2 through the contact 1.

  3A to 3C are (a) a plan view, (b) a cross-sectional view taken along line BB, and (c) a bottom view of the contact 1. Referring to FIGS. 1 to 3, the contact 1 is made of, for example, a rectangular metal plate having a required width and length, and a conductive metal plate having a required elasticity and having a required elasticity (FIG. 3A). In the left-right direction). The contact 1 includes a base portion 11 mounted on the ground pattern 21 of the printed wiring board 2 and a contact portion 12 projecting upward from the base portion 11 in FIG. In the following, the vertical direction is based on FIG.

  The base 11 part has a planar upper surface part 111. One end side (the right side in FIG. 1) of the upper surface portion 111 is bent at a substantially right angle downwards over the entire width, and is further bent at a substantially right angle toward the inside at a portion having a predetermined height. On the other end side (the left side in FIG. 1) of the upper surface portion 111, two notches 111a in which both side regions in the width direction are notched with a predetermined width dimension are provided. Arms 112 sandwiched in the direction are provided. The arm portion 112 is bent at a substantially right angle toward the lower end with its tip extended to the other end with a required dimension, and further bent at a substantially right angle toward the inside at a predetermined height. ing.

  With this configuration, the base portion 11 is formed on the upper surface portion 111, the first mounting surface portion 113 bent in an L shape on one end side of the upper surface portion 111, and the arm portion 112 on the other end side. The second mounting surface portion 114 is bent in an L shape. The lower end surfaces of the two mounting surface portions 113 and 114 are configured to be located on the same plane, and are configured as mounting surfaces that can be surface mounted on the ground pattern 21 of the printed wiring board 2. The portions corresponding to the mounting surfaces of the first and second mounting surface portions 113 and 114 are filled with diagonal lines in FIG. Accordingly, the first mounting surface portion 113 and the second mounting surface portion 114 are disposed in two independent regions.

  The contact portion 12 includes a pair of contact pieces 121 having a base end 120 on the first mounting surface portion 113 of the base portion 11, and each contact piece 121 is formed at the distal end edge portion of the first mounting surface portion 113. It has proximal ends that are spaced apart from each other with the arm portion 112 sandwiched in the width direction. Each contact piece 121 has the same shape, and extends obliquely upward from one base end 120 toward one end so as to sandwich the arm portion 112 in the width direction, and is U-shaped downward at a predetermined portion 122. It is comprised as the contact piece 121 bent by. In particular, each contact piece 121 is bent so as to rise at an obtuse angle from the base end 120 toward the other end side, and then bent in a convex shape toward one end side at the portion 121a, and further at the other end side at the portion 121b. It is bent into a gentle convex shape toward the surface to be generally S-shaped and extended to the predetermined portion.

  The two contact pieces 121 are extended in a parallel state with an interval between the arm portions 112 interposed therebetween. The predetermined portion 122 of each contact piece 121, that is, the top portion bent in a U-shape or the vicinity thereof is configured as a contact portion 122 with the above-described conductive member. Further, as shown in part in FIG. 4, the tip of each contact piece 121 extends to a position lower than the upper surface portion 111 and is connected in the width direction by a connection locking piece 123. The connection locking piece 123 is disposed on the lower surface side of the arm portion 112.

  The two contact pieces 121 are designed to satisfy the electrical conductivity required for the contacts. That is, the total width dimension obtained by adding the width dimensions of both contact pieces 121 is set to a predetermined dimension required for the contact, and the required width dimension of each contact piece 121 is approximately 2. It is formed in one part.

  The base end 120 of the contact piece 121 is disposed at the edge of the first mounting surface portion 113. As seen from the entire base portion 11, as shown by a one-dot chain line L1 in FIG. The first mounting surface portion 113 and the second mounting surface portion 114 occupy a central region of a planar region surrounded by an envelope that envelops the region along the outer periphery. In other words, the first mounting surface portion 113 and the second mounting surface portion 114 are disposed at portions other than the end portions of the rectangular planar region surrounding the first mounting surface portion 113 and the second mounting surface portion 114.

  In the contact 1 according to the first embodiment having the above-described configuration, solder or the like is applied to the surface of the ground pattern 21 of the printed wiring board 2 shown in FIG. 1 in each of the first and second mounting surface portions 113 and 114 of the base portion 11. It is implemented by the reflow method used. At this time, a surface mounting method by vacuum suction may be applied by utilizing the fact that the upper surface portion 111 is a flat surface, but is not particularly limited thereto. As shown also in FIG. 5, the base portion 11 is bonded to the ground pattern 21 in these regions by surface mounting on the mounting surfaces of the first and second mounting surface portions 113 and 114.

  As shown in FIG. 5, the contact 1 mounted in this manner contacts a conductive pad P provided on a conductive member such as a liquid crystal display panel disposed above. When the conductive pad P moves downward, it comes into contact with the contact portion 122 at the highest position of the two contact pieces 121. Due to this contact, as shown by the solid line in FIG. 5, each contact piece 121 is elastically deformed downward, and good contact with the conductive pad P is performed by contact by the elastic return force.

  At this time, since each contact piece 121 is bent in a U-shape as a whole, it is easy to be deformed, and the impact when the conductive pad P abuts on each contact piece 121 is alleviated, and damage to the contact piece 121 is small. Further, each contact piece 121 is elastically deformed with the base end 120 or a part 121a slightly above it as a fulcrum, so that a large deformation stroke in the vertical direction can be taken, and the contact piece 121, the conductive pad P, Even in the case where there is a variation in the interval dimension, contact with low electrical contact resistance is ensured.

  Further, since the two contact pieces 121 are elastically deformed independently and come into contact with the conductive pad P, even when a step PS in a direction perpendicular to the paper surface of FIG. The contact pieces 121 are reliably brought into contact with the conductive pads P, and the electric contact resistance is reduced.

  Further, when the contact surface of the conductive pad P is inclined with respect to each contact piece 121, particularly when the conductive pad P is inclined in the width direction, FIG. 6A shows a side view as viewed from one end side. As described above, the two contact pieces 121 are elastically deformed independently and come into contact with the conductive pad P. Therefore, the conductive pad P comes into contact with each contact portion 122 of the two contact pieces 121. Incidentally, when it is configured with one contact piece 121x as in Patent Documents 1 and 2, contact is made at one point 122x as shown in FIG. 6B. Thereby, the electrical contact resistance in the whole contact 1 is reduced.

  Moreover, since each contact piece 121 is a half of the required width dimension as described above, each contact piece 121 is more easily elastically deformed. As a result, as shown in FIG. 6A, each contact piece 121 is elastically deformed so as to follow the inclined surface of the conductive pad P, and can be brought into contact with a line or a surface. An effect of reducing contact resistance is obtained.

  On the other hand, when each contact piece 121 comes into contact with the conductive pad P and is elastically deformed downward, a stress is generated in the contact piece 121, and this stress is applied to the first mounting surface portion 113 at the base end 120 of the contact piece 121. Added to. This stress is dispersed by the first mounting surface portion 113 and further applied from the first mounting surface portion 113 to the second mounting surface portion 114 through the upper surface portion 111. That is, since the base end 120 of each contact piece 121 is positioned at the central portion of the plane region that envelops the region occupied by the first and second mounting surface portions 113 and 114, the stress is applied from the base end 120 to the first mounting surface portion. It is transmitted from the entire region 113 to the second mounting surface portion 114.

  As a result, the stress generated in each contact piece 121 acts in a distributed manner on each part of the first and second mounting surface parts 113 and 114, and stresses directed in different directions cancel each other. In particular, the mounting surface portion 113 can be prevented from concentrating on a portion where the stress is biased, damage to the mounting surface portions 113 and 114 or the base portion 11 is alleviated, and the mounting reliability is improved.

  Incidentally, both Patent Documents 1 and 2 have a configuration in which the elastic contact portion and the spring contact are bent so as to rise from one end of the solder joint portion or the substrate portion, in other words, from the end portion of the substrate portion. Therefore, when the elastic contact portion or the spring contact comes into electrical contact with the counterpart member and the elastic contact portion or the spring contact is bent, the stress caused by the bending is connected to the elastic contact portion or the spring contact. It is easy to concentrate on one end of the board part and the board part. As a result, a moment force having the one end as an action point is generated in the solder joint part or the board part, and the solder joint part or the board part is deformed or the joint part or the board part is peeled off. The reliability of the receiver, contact and grounding terminal may be reduced. In particular, in the case of the contacts of Patent Documents 1 and 2, since the contact piece is bent at an acute angle from the base portion, when the contact piece is deformed downward, upward stress is applied to the end portion of the mounting surface portion by the action of the lever. It may act and damage the mounting surface.

  Furthermore, since the first mounting surface portion 113 and the second mounting surface portion 114 are disposed in independent regions, the stress generated in one of the mounting surface portions hardly affects the other mounting surface portion. Therefore, even if the stress is biased to one mounting surface part and becomes susceptible to damage, the stress is not concentrated on the other mounting surface part, and the other mounting surface part can be prevented from being damaged, By maintaining the mounting on these mounting surfaces, the mounting reliability of the entire contact 1 is improved.

  Since the connection locking piece 123 provided at the tip of each contact piece 121 is inserted into the lower surface side of the arm portion 112 of the base portion 11, when each contact piece 121 is about to be deformed upward, for example, When a jig or the like is caught on any one of the contact pieces 121 and an external force is applied upward, the connection locking piece 123 comes into contact with the lower surface of the arm portion 112 and the contact piece 121 is deformed upward. Is prevented. In particular, the connection locking piece 123 connects the tips of the two contact pieces 121, and the arm portion 112 has the second mounting surface portion 114 joined to the printed wiring board 2. The effect of preventing the contact piece 121 from being deformed upward by the contact with the arm portion 112 can be further enhanced.

  Further, when the contact piece 121 is deformed upward, or when deformed in the horizontal direction toward one end side, that is, toward the upper surface portion 111, a part of the surface directed to the upper side of the contact piece 121 is cut off. Since it abuts against the edge of the notch 111a, deformation in these directions is also prevented.

  Even when the contact piece 121 is about to be deformed upward in this way, the stress applied from the contact piece 121 to the first mounting surface portion 113 is in the plane area of the entire mounting surface portion including the second mounting surface portion 114. Since it is applied to the substantially central portion, the stress is distributed toward the first and second mounting surface portions 113 and 114, and biased stress does not concentrate on the first and second mounting surface portions 113 and 114. .

  Further, when a force in the width direction is applied to the contact piece 121, the connecting locking piece 123 at the tip is moved in the width direction on the lower surface side of the arm portion 112, and both side edges at the tip of the pair of contact pieces 121 are arm portions. Since the two outer edges of 112 are in contact with each other, deformation of the contact piece 121 in the width direction is prevented.

  Here, the engaging pieces at the tips of the contact pieces 121 may be independent from each other. For example, as shown in FIG. 7, the contact pieces 121 are formed as L-shaped locking pieces 124 in which the tips of the contact pieces 121 face each other, and the tips of the locking pieces 124 are formed on the lower surface side of the arm portion 112. It is inserted. Thus, by making the latching piece 124 independent, the elastic deformation of each contact piece 121, in particular, the elastic deformation when following the conductive member is facilitated, and the effect of reducing electrical contact resistance is enhanced.

  In the present invention, the position of the base end of the contact piece, “the central part of the planar region occupied by the base portion”, when specifying the planar region surrounding (enveloping) the base portion as a region having a simple shape such as a rectangle, It means that it is a part excluding the end parts such as corners and ends of the planar area, and does not necessarily mean the geometric center position of the planar area.

  The present invention is not limited to the configuration and shape of the embodiment. In particular, the bent shape constituting the contact portion is not limited to the U shape, and may be an arc shape or a polygonal shape. The present invention can also be applied to a contact having a contact portion having a configuration in which three or more contact pieces are arranged in parallel. Further, the present invention can also be applied to contacts having different planar shapes from the base part or the mounting surface part.

DESCRIPTION OF SYMBOLS 1 Surface mount contact 11 Base part 12 Contact part 111 Upper surface part 112 Arm part 113 1st mounting surface part 114 2nd mounting surface part 120 Base end 121 Contact piece 122 Contact part 123 Connection locking piece 124 Locking piece L1 Envelope (plane region)

Claims (5)

  A base portion having a mounting surface portion to be mounted on a grounding pattern of the substrate, and a base end on the base portion, and extending in a protruding state with a predetermined width dimension from the base end to be in electrical contact with an object An elastically deformable contact portion, wherein the contact portion has a plurality of contact pieces arranged in parallel and bent in the length direction, and each contact piece is independent of the object. Surface mount contact characterized by elastic contact with objects.   The surface-mount contact according to claim 1, wherein each contact piece is bent in a U shape, and a portion near the bent top is configured as a contact portion that electrically contacts the object.   The surface mount contact according to claim 1 or 2, wherein a base end of the contact piece is disposed at a central portion of a planar region occupied by the base portion.   The said base part has an arm part extended between the width directions of these contact pieces, and each said contact piece equips the front-end | tip with the locking piece inserted by the lower surface side of the said arm part. The surface mount contact according to any one of 1 to 3. The surface mount contact according to claim 1, wherein the base portion and the contact portion are formed by bending a single metal plate.

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