JP2018132349A - Physical amount detector and physical amount detection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a physical quantity detector capable of maintaining high accuracy and a physical quantity detection device including the physical quantity detector. SOLUTION: A package 41 as a physical quantity detector of the present invention is a package 41 accommodating a sensor element 43 for detecting a physical quantity, and is in contact with at least a first surface 21 and a first surface 21 of the package 41. The first terminal 31 and the second terminal 31 provided on the second surface 22 and having terminals 31 and 32 electrically connected to the sensor element 43 and provided on the first surface 21. The second terminal 32 provided on the surface 22 is connected, and the first terminal 31 is a part of the first terminal 31, and the width L1 of the first terminal 31 is the first terminal 31 and the first terminal 31. It has a region shorter than the length L2 of the connection portion to which the terminal 32 of 2 is connected. [Selection diagram] FIG. 6

Description

  The present invention relates to a physical quantity detector and a physical quantity detection device including the physical quantity detector.

  Conventionally, as a physical quantity detection device, for example, as disclosed in Patent Document 1, a silicon chip in which an acceleration detection element for detecting acceleration is formed by MEMS or the like is accommodated in a ceramic package, and the ceramic package is mounted on a circuit board or the like. Attached is known. The ceramic package that accommodates the acceleration detection element is formed on at least the first surface and the second surface of the ceramic package, has a terminal electrically connected to the acceleration detection element, and is formed on the first surface. At least one part of the terminal formed on the second surface overlaps with the terminal. Therefore, the first surface or the second surface can be attached to a circuit board or the like, and the physical quantity detection device can be reduced in size (reduction in area or height).

JP 2004-37105 A

  However, since the ceramic package described in Patent Document 1 is connected to the terminal formed on the first surface and the terminal formed on the second surface, for example, the terminal formed on the first surface is connected to the ceramic package. When the terminal is mounted with solder or the like so as to face the circuit board or the like, the solder spreads along the terminal formed on the second surface, and the solder of the terminal formed on the first surface decreases, and the circuit There is a risk of poor electrical connection with the substrate and insufficient mounting strength. Similarly, when the terminals formed on the second surface are opposed to the circuit board or the like and mounted with solder or the like, there is a possibility that poor electrical connection with the circuit board or insufficient mounting strength may occur.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples or forms.

  Application Example 1 A physical quantity detector according to this application example is a physical quantity detector that houses a detection element that detects a physical quantity, and is in contact with at least the first surface of the physical quantity detector and the first surface. A second terminal and a terminal electrically connected to the detection element, the first terminal provided on the first surface and the second surface. The first terminal is connected to a part of the first terminal, the width of the first terminal is connected to the first terminal, and the second terminal is connected to the second terminal. An area shorter than the length of the connecting portion is provided.

  According to this application example, the first terminal provided on the first surface is connected to a part of the first terminal, the width of the first terminal being connected to the first terminal, and the second terminal. Since the area shorter than the length of the connection portion is provided, when mounting on the circuit board with solder or the like, the spread of the solder can be suppressed in the area where the width of the first terminal is short. It is possible to reduce poor electrical connection and insufficient mounting strength. Therefore, it is possible to provide a highly reliable physical quantity detection device that is excellent in electrical connection and mounting strength.

  Application Example 2 In the physical quantity detector according to the application example described above, it is preferable that the physical quantity detector includes a plurality of the first terminals having the same distance from the connection portion to the short region.

  According to this application example, since the plurality of first terminals having the same distance from the connection portion to the short region are provided, it is possible to improve the mounting strength on the circuit board accompanying an increase in the bonding area.

  Application Example 3 In the physical quantity detector according to the application example described above, the physical quantity detector includes a third surface and a fourth surface that are in contact with the first surface and the second surface, and is in contact with the third surface. The height from the second surface of the terminal provided on the first surface and the height from the second surface of the terminal provided on the first surface in contact with the fourth surface are: It is preferable that it is higher than the distance from the said connection part of a short area | region.

  According to this application example, since the height from the second surface of the terminal in contact with the third surface and the terminal in contact with the fourth surface is higher than the distance from the connection portion in the short region, the junction area is increased. In addition, the mounting strength on the circuit board can be improved. Further, when mounted on the circuit board, the rotation direction from the third surface to the fourth surface of the physical quantity detector or the third surface to the third surface can be increased. It is possible to suppress the inclination in the rotation direction to the surface.

  Application Example 4 In the physical quantity detector according to the application example described above, the physical quantity detector includes the second surface, the third surface, and a fifth surface that contacts the fourth surface, and faces the first terminal. It is preferable to have the 4th terminal provided in the 5th surface in the position.

  According to this application example, since the fourth terminal provided on the fifth surface is provided at a position facing the first terminal, it is possible to improve the mounting strength on the circuit board as the bonding area increases. Furthermore, when mounted on the circuit board, the inclination of the physical quantity detector from the fifth surface to the first surface can be suppressed.

  Application Example 5 A physical quantity detection device according to this application example includes the physical quantity detector described in the application example.

  According to this application example, it is possible to provide a highly reliable physical quantity detection device that is excellent in electrical connection and mounting strength.

  Application Example 6 In the physical quantity detection device according to the application example, the physical quantity detector is provided on a circuit board, and the physical quantity detector includes a detection element including a movable part extending from a fixed part, The distance between the fixed part and the second terminal is preferably longer than the distance between the movable part and the second terminal.

  According to this application example, since the distance between the fixed portion and the second terminal is longer than the distance between the movable portion and the second terminal, when the second terminal is mounted on the circuit board, the fixed portion is moved in the direction of gravity. Therefore, the weight of the detection element and the load of the movable part can be reduced, and the decrease in the strength of the detection element can be suppressed.

1 is a cross-sectional view illustrating a configuration of a physical quantity detection device according to a first embodiment of the present invention. The perspective view which decomposes | disassembles and shows the structure of the physical quantity detection apparatus which concerns on 1st Embodiment. The front view which shows the structure of the physical quantity detection sensor which concerns on 1st Embodiment. The right view which shows the structure of the physical quantity detection sensor which concerns on 1st Embodiment. The bottom view which shows the structure of the physical quantity detection sensor which concerns on 1st Embodiment. The rear view which shows the structure of the physical quantity detection sensor which concerns on 1st Embodiment. The top view which shows the internal structure of a physical quantity detection sensor. Sectional drawing which shows the internal structure of a physical quantity detection sensor. Sectional drawing which shows operation | movement of a physical quantity detection sensor. Sectional drawing which shows operation | movement of a physical quantity detection sensor. The front view which shows the structure of the physical quantity detection sensor which concerns on 2nd Embodiment. The right view which shows the structure of the physical quantity detection sensor which concerns on 2nd Embodiment. The bottom view which shows the structure of the physical quantity detection sensor which concerns on 2nd Embodiment. The rear view which shows the structure of the physical quantity detection sensor which concerns on 2nd Embodiment.

  Hereinafter, preferred examples of the physical quantity detector and the physical quantity detection device of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
[Physical quantity detector]
First, the physical quantity detection device according to the present embodiment will be described with reference to FIGS. 1 and 2, taking as an example a physical quantity detection device 100 that detects multi-axis physical quantities.
FIG. 1 is a cross-sectional view showing the configuration of the physical quantity detection device according to the first embodiment of the present invention, and FIG. 2 is an exploded perspective view showing the configuration of the physical quantity detection device. In FIG. 2, the arrangement of components is mainly shown, and the device cover 60, wiring, and the like are omitted. In each figure, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other.

  As shown in FIG. 1 and FIG. 2, the physical quantity detection device 100 includes a base substrate 10 as a circuit board that is in the shape of a square plate and is parallel to the XY plane, and a Z (+) side of the base substrate 10. A physical quantity detection sensor 40 disposed on the receiving surface 10a, which is a surface, and an apparatus cover 60 covering the physical quantity detection sensor 40 provided on the base substrate 10 are provided. The physical quantity detection sensor 40 includes a package 41 as a physical quantity detector including a package base 411 and a lid (lid body) 412 described in detail with reference to FIGS. 3 to 6, and a sensor element as a detection element described later. 43 (see FIG. 7).

  Further, the base substrate 10 and the physical quantity detection sensor 40 in the physical quantity detection device 100 are joined using solder or the like. The physical quantity detection sensor 40a is arranged with the thickness direction along the X-axis direction, the physical quantity detection sensor 40b is arranged with the thickness direction along the Y-axis direction, and the physical quantity detection sensor 40c is arranged with the thickness direction along the Z-axis direction. They are arranged and bonded to the receiving surface 10a of the base substrate 10 respectively. Therefore, as will be described later, the physical quantity detection sensor 40a detects a physical quantity (acceleration, etc.) in the X-axis direction, the physical quantity detection sensor 40b detects a physical quantity (acceleration, etc.) in the Y-axis direction, and the physical quantity detection sensor 40c is in the Z-axis direction. The physical quantity (acceleration, etc.) is detected. With such an arrangement, the physical quantity detection device 100 functions as a multi-axis physical quantity detection device.

  Here, since the two physical quantity detection sensors 40 a and 40 b are joined with the side surfaces in the thickness direction facing the receiving surface 10 a of the base substrate 10, the mounting area can be reduced. Therefore, the physical quantity detection device 100 can be downsized.

[Physical quantity detection sensor (physical quantity detector)]
Next, the physical quantity detection sensor 40 provided in the physical quantity detection device 100 according to the first embodiment of the present invention will be described with reference to FIGS.
FIG. 3 is a front view illustrating a configuration of a physical quantity detection sensor. FIG. 4 is a right side view showing the configuration of the physical quantity detection sensor. FIG. 5 is a bottom view showing the configuration of the physical quantity detection sensor. FIG. 6 is a rear view showing the configuration of the physical quantity detection sensor. 3 to 6, as three axes orthogonal to each other, an x axis, a y axis, and a z axis different from the coordinate axes used in FIGS. 1 and 2 are illustrated.

The physical quantity detection sensor 40 includes a package 41 as a physical quantity detector and a sensor element 43 (see FIG. 7) that detects the physical quantity.
The package 41 includes a package base 411 having a concave portion that accommodates the sensor element 43, and a lid (lid body) 412 that covers the concave portion in which the sensor element 43 of the package base 411 is accommodated.

  As shown in FIGS. 3 to 6, the package base 411 has a plurality of terminals 31 (first terminals) on the first surface 21, and a second surface 22 (first surface) in contact with the first surface 21. A plurality of terminals 32 (second terminals) and 33 (third terminals) are provided on the side surface when the surface 21 is viewed in plan. Further, the fifth surface 25 (the first surface 21 is a flat surface) in contact with the second surface 22, the third surface 23, and the fourth surface 24 (all of which are side surfaces when the first surface 21 is viewed in plan). On the back surface when viewed, a plurality of terminals 34 are arranged at positions facing the terminals 31 provided on the first surface 21 (positions overlapping the fifth surface 25 when the first surface 21 is viewed in plan). (Fourth terminal) is provided. The terminal 31 provided on the first surface 21 and the terminal 32 provided on the second surface 22 are connected, and the terminal 34 provided on the fifth surface 25 and the second surface 22 are provided. Terminal 33 is connected. The terminal 31 connected to the terminal 32 is electrically connected to the sensor element 43 accommodated in the package 41.

  The terminal 31 provided on the first surface 21 has a length L1 in the arrangement direction (direction along the second surface 22, width direction) of the terminal 31 in a part of the terminal 31. And a region shorter than the length L2 of the connecting portion to be connected. In other words, a part of the terminal 31 has a constricted portion that is shorter than the length L2 of the connecting portion. Further, on the first surface 21, a terminal 31 having the same distance H <b> 1 from the connection portion where the terminal 31 and the terminal 32 are connected to a region (constriction portion) having a short length L <b> 1 extends along the second surface 22. Are provided. Therefore, the bonding area can be increased and the mounting strength on the base substrate 10 can be improved.

  In the present embodiment, three terminals having the same shape as the terminal 31 are formed along the second surface 22 of the first surface 21, and the same as the terminal 31 along the surface facing the second surface 22. Three terminals having a shape are formed, and one terminal having the same shape as the terminal 31 is formed on each of the third surface 23 and the fourth surface 24 that are in contact with the first surface 21 and the second surface 22. Note that the number of terminals formed on the first surface 21 is not limited to this, and may be changed according to mounting strength and wiring (not shown) provided on the base substrate 10. .

  A part of the terminal 31 provided on the first surface 21 is provided with a region (necked portion) shorter than the length L2 of the connecting portion where the terminal 31 and the terminal 32 are connected. Therefore, as shown in FIGS. 1 and 2, when the side surfaces of the physical quantity detection sensors 40 a and 40 b are mounted on the base substrate 10, the terminals 32 provided on the second surface 22 face the receiving surface 10 a of the base substrate 10. By bonding with solder, it is possible to suppress the solder in the terminal 32 from spreading to the terminal 31 provided on the first surface 21 in a short region (necked portion).

  Further, since the terminal 34 is provided on the fifth surface 25 facing the first surface 21, the solder in the terminal 33 provided on the second surface 22 connected to the terminal 34 spreads to the terminal 34. The inclination of the physical quantity detection sensor 40a around the Y axis and the inclination of the physical quantity detection sensor 40b around the X axis, which are inclinations from the fifth surface 25 to the first surface 21 side, can be suppressed.

Next, the internal configuration of the physical quantity detection sensor 40 provided in the physical quantity detection device 100 will be described with reference to FIGS. 7 and 8.
FIG. 7 is a plan view showing the internal configuration of the physical quantity detection sensor, and FIG. 8 is a cross-sectional view showing the internal configuration of the physical quantity detection sensor. FIG. 8 shows a cross section taken along line II in FIG. 7 and FIG. 8, the same x axis, y axis, and z axis as the coordinate axes used in FIGS. 3 to 6 are illustrated as three axes orthogonal to each other.

  The physical quantity detection sensor 40 includes a package 41, an element base body 42, and a sensor element 43 as a detection element. First, the package 41 includes a concave package base 411 and a plate-shaped lid (lid body) 412. The package base 411 includes a receiving portion 417 that is formed in a concave shape on the inner side, a step portion 413 that is provided along the x-axis direction at the end of the bottom plate and fixes the element base body 42, and penetrates the bottom plate. A sealing portion 414 made of a sealing material for closing the hole and the hole, and on the surface opposite to the step portion 413 of the bottom plate (first surface 21 in FIGS. 3 to 6), Terminals 31 for connection to the base substrate 10 (circuit board) are formed. The sensor element 43 is electrically connected to the terminal 31 on the side where the terminal 34 is provided via a bonding wire, wiring (not shown) or the like. The package base 411 is formed of an aluminum oxide sintered body obtained by firing a ceramic green sheet. Aluminum oxide sintered bodies are excellent for packages, but are difficult to process. However, in this case, it can be easily formed by laminating and firing a plurality of ceramic green sheets. Note that the package base 411 can also be formed using a material such as quartz, glass, or silicon.

  The lid 412 is disposed so as to cover the element base body 42 fixed to the step portion 413 of the package base 411. The lid 412 can be made of the same material as the package base 411, or a metal such as Kovar or stainless steel. Here, since the lid 412 is preferably formed of a metal having good thermal conductivity, Kovar is used. ing. The lid 412 is bonded to the package base 411 via the seam ring 416. When the package base 411 and the lid 412 are bonded to each other, the housing portion 417 can be sealed in a reduced-pressure airtight state.

  In such a physical quantity detection sensor 40, the housing portion 417 is sealed after the package base 411 and the lid 412 are joined, the air in the housing portion 417 is removed from the hole of the sealing portion 414 and the pressure is reduced. It is performed by a method of closing with a material (sealing material). Thereby, the element base body 42 and the sensor element 43 are depressurized and sealed in the airtight housing portion 417. Note that the inside of the housing portion 417 may be filled with an inert gas such as nitrogen, helium, or argon.

  Next, the element base body 42 has a plate shape formed by etching or the like from a crystal plate, and extends in the x-axis direction and is fixed to the step portion 413 of the package base 411 with an adhesive 451. A joint portion 422 extending from the fixed portion 421 in the y-axis direction, a movable portion 423 extending from the joint portion 422 in a direction opposite to the fixed portion 421, and a fixed portion 421. A frame portion 424 extending from one end to the other end of the fixed portion 421 along the outer edge of the movable portion 423, and a mass portion 425 (425a, 425b, 425c, 425d) provided on the movable portion 423. I have. Note that the sensor element 43 is fixed to the element base body 42 from the fixed portion 421 to the movable portion 423.

  The movable portion 423 is surrounded by the frame portion 424 and the fixed portion 421, and is connected to the fixed portion 421 via the joint portion 422 and is cantilevered. The joint portion 422 is provided between the fixed portion 421 and the movable portion 423, and connects the fixed portion 421 and the movable portion 423. The joint portion 422 is formed thinner than the fixed portion 421 and the movable portion 423, and functions as an intermediate hinge when the movable portion 423 is displaced (rotated) with respect to the fixed portion 421. The mass part 425 (425a, 425b, 425c, 425d) provided in the movable part 423 is rectangular in a plan view as viewed from the z-axis direction, and the mass parts 425a, 425b are the lid 412 of the movable part 423. It arrange | positions at the side and is fixed by the junction part 452 in the left-right symmetric position centering on the sensor element 43. FIG. On the other hand, the mass portions 425c and 425d are disposed on the package base 411 side of the movable portion 423, and are fixed by the joint portions 452 so as to overlap the mass portions 425a and 425b, respectively.

  Next, the sensor element 43 includes a base fixed portion 431a fixed to the fixed portion 421 with an adhesive 450, a base movable portion 431b fixed to the movable portion 423 with an adhesive 450, and a fixed portion 431a. There is a vibrating beam portion 432 (432a, 432b) for detecting a physical quantity between the movable portion 431b and extending from the fixed portion 431a to the movable portion 431b. In this case, the vibrating beam portion 432 has a prismatic shape, and when a drive signal (AC voltage) is applied to excitation electrodes (not shown) provided in the vibrating beam portions 432a and 432b, x Bending vibration is performed along the axis so as to be separated from or close to each other. The excitation electrode is electrically connected to a terminal 31 (see FIG. 8) disposed on the movable portion 423 side by a wiring (not shown) for applying a drive signal.

  It should be noted that the distance between the base fixed portion 431 a of the sensor element 43 and the terminal 32 provided on the second surface 22 is longer than the distance between the base movable portion 431 b and the terminal 32 provided on the second surface 22. It is arranged to be. Therefore, when the second surface 22 which is a side surface is mounted on the base substrate 10, the fixed portion 431a can be positioned upward in the direction of gravity, so that the weight of the sensor element 43 and the load of the movable portion 431b are reduced. It is possible to reduce the strength of the sensor element 43.

  In this case, the sensor element 43 is formed by patterning a quartz substrate cut out at a predetermined angle from a quartz crystal or the like by a photolithography technique and an etching technique. Further, it is desirable that the sensor element 43 is made of the same material as the element base body 42 in consideration of reducing the difference in coefficient of linear expansion from the element base body 42.

Next, the operation of the physical quantity detection sensor 40 will be described with reference to FIGS.
9 and 10 are cross-sectional views showing the operation of the physical quantity detection sensor.
As shown in FIG. 9, for example, when acceleration is applied to the physical quantity detection sensor 40 in the arrow α1 direction in the + z direction, a force acts in the + z direction on the movable portion 423, and the movable portion 423 moves the joint portion 422. Displacement in the + z direction as a fulcrum. As a result, a force is applied to the physical quantity detection sensor 40 in the direction in which the base fixed portion 431a and the movable portion 431b approach each other along the y axis, and compressive stress is generated in the vibration beam portion 432 of the sensor element 43. Therefore, the resonance frequency that is the frequency at which the vibrating beam portion 432 vibrates is lowered.

  On the other hand, as shown in FIG. 10, for example, when acceleration is applied to the physical quantity detection sensor 40 in the direction of the arrow α2 in the −z direction, a force acts on the movable portion 423 in the −z direction, and the movable portion 423 The joint portion 422 is displaced in the −z direction using the fulcrum as a fulcrum. As a result, a force is applied to the physical quantity detection sensor 40 in the direction in which the base fixed portion 431a and the movable portion 431b are separated from each other along the y-axis, and tensile stress is generated in the vibration beam portion 432 of the sensor element 43. Therefore, the resonance frequency of the vibrating beam portion 432 is increased.

  The physical quantity detection sensor 40 detects the change in the resonance frequency of the sensor element 43 as described above. That is, the acceleration applied to the physical quantity detection sensor 40 is derived by converting it into a numerical value determined by a look-up table or the like in accordance with the detected change rate of the resonance frequency.

The physical quantity detection sensor 40 can also be used as an inclinometer. In the physical quantity detection sensor 40 as an inclinometer, the direction in which the gravitational acceleration is applied to the physical quantity detection sensor 40 changes according to the change in posture due to the inclination, and compressive stress or tensile stress is generated in the vibrating beam portion 432. Then, the resonance frequency of the vibrating beam portion 432 changes, and a change in posture due to the inclination is derived.
In the present embodiment, the sensor element 43 that detects acceleration is described as an example. However, the present invention is not limited to this, and the physical quantity that detects the physical quantity such as the unidirectional displacement, velocity, and angular velocity of the measurement object is not limited thereto. It may be a detection element.

  In the physical quantity detection device 100 described above, the length of the terminals 31 in the arrangement direction of the terminals 31 provided on the first surface 21 of the package 41 that accommodates the sensor element 43 is the same as that of the first surface 21. Since the terminal 31 and the terminal 32 on the second surface 22 are provided with a region shorter than the length of the connecting portion, the length of the terminal 31 on the first surface 21 when mounted on the base substrate 10 with solder or the like. Since the spread of the solder can be suppressed in a short region, it is possible to reduce poor electrical connection with the base substrate 10 and insufficient mounting strength due to insufficient solder. Therefore, it is possible to provide the physical quantity detection device 100 that is excellent in electrical connection and mounting strength and highly reliable.

  Further, since the first surface 21 of the package 41 includes a plurality of terminals 31 having the same distance H1 from the connection portion to the short region (constriction portion) along the second surface 22, the bonding area is reduced. The mounting strength on the base substrate 10 can be improved.

  Further, since the fifth surface 25 of the package 41 has the terminal 34 at a position facing the terminal 31 provided on the first surface 21, the mounting strength to the base substrate 10 is improved as the bonding area increases. Furthermore, when mounted on the base substrate 10, the inclination of the package 41 from the fifth surface 25 to the first surface 21 can be suppressed.

  In the physical quantity detection sensor 40, the distance between the base fixed portion 431 a and the terminal 32 provided on the second surface 22 is the distance between the base movable portion 431 b and the terminal 32 provided on the second surface 22. Since it is longer, when the second surface 22 which is a side surface is mounted on the base substrate 10, the fixed portion 431a can be positioned upward in the direction of gravity, so the weight of the sensor element 43 and the load of the movable portion 431b can be reduced. The load can be reduced, and the strength reduction of the sensor element 43 can be suppressed.

(Second Embodiment)
[Physical quantity detection sensor (physical quantity detector)]
Next, a physical quantity detection sensor 140 according to a second embodiment of the present invention will be described with reference to FIGS.
FIG. 11 is a front view illustrating a configuration of a physical quantity detection sensor. FIG. 12 is a right side view showing the configuration of the physical quantity detection sensor. FIG. 13 is a bottom view showing the configuration of the physical quantity detection sensor. FIG. 14 is a rear view showing the configuration of the physical quantity detection sensor.
The physical quantity detection sensor 140 of the second embodiment is different from the package 41 of the physical quantity detection sensor 40 of the first embodiment in the terminal configuration formed in the package 41a. Accordingly, the same reference numerals as those in the first embodiment are assigned to portions other than the portions different from those in the first embodiment, and description thereof is omitted.

The package 41a of the physical quantity detection sensor 140 of the second embodiment includes a package base 411a and a lid (lid body) 412.
As shown in FIGS. 11 to 14, the package base 411 a has short regions (constriction portions) on the first surface 21, the second surface 22, and the fifth surface 25, respectively, as in the first embodiment. A plurality of terminals 31, 32, 33, and 34 are provided. Further, on the first surface 21, there are provided a terminal 35 (fifth terminal) in contact with the second surface 22 and the third surface 23 and a terminal in contact with the second surface 22 and the fourth surface 24. It has been. Further, the fifth surface 25 is provided with a terminal 36 at a position facing the terminal 36 (sixth terminal), and opposed to the terminal in contact with the second surface 22 and the fourth surface 24. A terminal is provided at a position to be used.

  Note that the terminal 36 in contact with the third surface 23 and the terminal in contact with the fourth surface 24 provided on the first surface 21 are connected in a region where the height H2 from the second surface 22 is short of the terminal 31. It is formed to be higher than the distance H1 from the part. Further, the terminal 36 in contact with the third surface 23 and the terminal in contact with the fourth surface 24 provided on the fifth surface 25 are as high as the second surface 22 of the terminal 34 from the second surface 22. It is formed to be higher than the height from.

  In the package 41 a having such a configuration, the height H <b> 2 from the second surface 22 of the terminal 36 in contact with the third surface 23 and the terminal in contact with the fourth surface 24 is from the connection portion in the short region of the terminal 31. Since the distance H1 is higher than the distance H1, the mounting strength on the base substrate 10 can be improved as the bonding area increases, and further, when mounted on the base substrate 10, the third surface 23 of the package 41a is changed to the fourth surface. The inclination in the rotation direction to the surface 24 or the rotation direction from the fourth surface 24 to the third surface 23 can be suppressed. Accordingly, since the physical quantity detection sensor 140 can be mounted on the base substrate 10 in a stable posture, various physical quantities can be accurately detected.

  DESCRIPTION OF SYMBOLS 10 ... Base substrate, 10a ... Reception surface, 21 ... 1st surface, 22 ... 2nd surface, 23 ... 3rd surface, 24 ... 4th surface, 25 ... 5th surface, 31, 32, 33 , 34, 35, 36 ... terminals, 40, 40a, 40b, 40c ... physical quantity detection sensors, 41, 41a ... packages as physical quantity detectors, 42 ... element base bodies, 43 ... sensor elements as detection elements, 60 ... devices Cover: 100 ... Physical quantity detection device, 140 ... Physical quantity detection sensor, 411, 411a ... Package base, 412 ... Lid, 431a ... Fixed part, 431b ... Movable part.

Claims (6)

A physical quantity detector containing a detection element for detecting a physical quantity,
A terminal provided on at least a first surface of the physical quantity detector and a second surface in contact with the first surface and electrically connected to the detection element;
The first terminal provided on the first surface and the second terminal provided on the second surface are connected,
The first terminal is a part of the first terminal,
The physical quantity detector characterized in that the first terminal has a region in which the width of the first terminal is shorter than the length of the connection part connecting the first terminal and the second terminal.   The physical quantity detector according to claim 1, further comprising a plurality of the first terminals having equal distances from the connection portion to the short region. Having a third surface and a fourth surface in contact with the first surface and the second surface;
The height of the terminal provided on the first surface in contact with the third surface from the second surface and the second of the terminal provided on the first surface in contact with the fourth surface The physical quantity detector according to claim 1, wherein a height from the surface is higher than a distance from the connection portion of the short region. A fifth surface in contact with the second surface, the third surface, and the fourth surface;
The physical quantity detector according to claim 3, further comprising a fourth terminal provided on the fifth surface at a position facing the first terminal.   A physical quantity detection device comprising the physical quantity detector according to any one of claims 1 to 4. The physical quantity detector is provided on a circuit board;
The physical quantity detector has a detection element including a movable part extending from a fixed part,
The physical quantity detection device according to claim 5, wherein a distance between the fixed part and the second terminal is longer than a distance between the movable part and the second terminal.

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