JP2018128488A - Electrooptical device and electronic apparatus - Google Patents

Abstract

To provide an electro-optical device and an electronic apparatus capable of improving the reliability of a connection portion between a mounting substrate and an extension substrate connected to an electro-optical panel. In a first mounting board 51 and a second mounting board 52, a first driving IC 21 and a second driving IC 22 are mounted on a first flexible wiring board 31 and a second flexible wiring board 32 in the electro-optical device 1. Has been. A first extension board 41 and a second extension board 42 made of a flexible wiring board are connected to the ends of the first mounting board 51 and the second mounting board 52, and the connection portions 418 and 428 are connected to the first side on both sides. A protective film 91 and a second protective film 92 are affixed. The first protective film 91 and the second protective film 92 extend to a position that covers the first driving IC 21 and the second driving IC 22. [Selection] Figure 4

Description

  The present invention relates to an electro-optical device including an electro-optical panel to which a mounting substrate is connected, and an electronic apparatus including the electro-optical device.

  In an electro-optical device such as a liquid crystal display device or an organic electroluminescence device, a structure in which a mounting substrate in which a driving IC is mounted on a flexible wiring substrate is connected to an electro-optical panel is often employed. In addition, an extension board made of a flexible wiring board is connected to the driving IC of the mounting board on the side opposite to the electro-optical panel side by an ACF (Anisotropic Conductive Film) or the like. Has been proposed (see Patent Document 1).

JP 2009-251182 A

  However, when the mounting board and the extension board are connected by ACF or the like, the connection portion between the mounting board and the extension board is not sufficiently moisture-resistant, and insulation between terminals cannot be ensured in a high temperature and high humidity bias state. There is a problem.

  In view of the above problems, an object of the present invention is to provide an electro-optical device and an electronic apparatus that can increase the reliability of a connection portion between a mounting substrate and an extension substrate connected to an electro-optical panel. is there.

  In order to solve the above problems, an electro-optical device according to the present invention includes an electro-optical panel, a flexible wiring board whose end is connected to the electro-optical panel, and a driving IC mounted on one surface of the flexible wiring board. A mounting board, an extension board composed of a flexible wiring board having one end bonded to the end of the mounting board opposite to the electro-optical panel side with respect to the driving IC, the mounting board, and the mounting board And a protective film affixed so as to cover at least one of the one surface side and the other surface side opposite to the one surface.

  In the present invention, since the extension board is connected to the mounting board, the expensive flexible wiring board used for the mounting board can be shortened. Therefore, the cost can be reduced. Moreover, since the connection part of a mounting board | substrate and an extension board | substrate is covered with the protective film, the intensity | strength of the connection part of a mounting board | substrate and an extension board | substrate, moisture resistance, etc. can be improved. Therefore, the reliability of the connection portion between the mounting board and the extension board can be increased.

  In this invention, the said protective film can employ | adopt the aspect which has covered the said connection part on the said other surface side.

  In this invention, the said protective film can employ | adopt the aspect which has covered the said connection part on the said one surface side. In this case, it is preferable to extend from the connecting portion to a position covering the driving IC. According to this aspect, since the connection portion between the flexible wiring board used for the mounting substrate and the driving IC can be protected by the protective film, the reliability of the mounting substrate can be improved.

  In the present invention, the protective film can adopt an aspect having insulation and moisture resistance. According to this aspect, the insulation and moisture resistance of the connection portion between the mounting substrate and the extension substrate can be improved.

  In the present invention, the electro-optical panel includes a holder that supports the electro-optical panel from both sides in the thickness direction, the holder supporting the electro-optical panel from one side in the thickness direction, and the electro-optical panel. A second heat sink plate that overlaps from one side in the thickness direction of the electro-optic panel on a portion of the mounting board on which the driving IC is mounted; It is possible to adopt a mode in which a portion of the mounting substrate on which the driving IC is mounted has a second heat radiating plate portion overlapping from the other side in the thickness direction of the electro-optical panel. According to this aspect, the heat generated in the driving IC can be released to the first heat radiating plate portion and the second heat radiating plate portion.

  In the present invention, the gap on the one surface side and the other surface between the first heat radiating plate portion and the second heat radiating plate portion with respect to the portion of the mounting substrate on which the driving IC is mounted. A mode in which a filler that fills the gap on the side is arranged can be adopted. According to this aspect, the heat generated in the driving IC can be efficiently transmitted to the first heat radiating plate portion and the second heat radiating plate portion.

  In the present invention, it is possible to adopt a mode in which a plurality of the mounting boards are connected to one side of the electro-optical panel in a state where they are overlapped in the thickness direction.

  In the present invention, an embodiment in which two mounting substrates are connected to the electro-optical panel can be employed as the plurality of mounting substrates.

  The electro-optical device according to the invention can be used in various electronic apparatuses. When the electronic apparatus is a projection display device, the projection display device includes a light source unit that emits light supplied to the electro-optical device, a projection optical system that projects light modulated by the electro-optical device, and have.

It is explanatory drawing which shows typically a mode that the one aspect | mode of the electro-optical apparatus to which invention was applied was seen from the diagonal direction. FIG. 2 is an exploded perspective view of the electro-optical device 1 shown in FIG. 1 with a holder removed from the electro-optical panel. It is explanatory drawing which shows typically planar structure, such as an electro-optical panel shown in FIG. It is explanatory drawing which shows typically a mode that the electro-optical panel etc. shown in FIG. 1 were cut | disconnected along the electro-optical panel and the 2nd flexible wiring board. It is explanatory drawing when the connection part of the mounting board | substrate shown in FIG. 2 and an extension board | substrate is seen from the one surface side of a mounting board | substrate. It is explanatory drawing when the connection part of the mounting board | substrate shown in FIG. 2 and an extension board | substrate is seen from the other surface side of a mounting board | substrate. FIG. 2 is a cross-sectional view schematically showing a state where the electro-optical device shown in FIG. 1 is cut along the line AA ′. FIG. 2 is a cross-sectional view schematically showing a state where the electro-optical device shown in FIG. 1 is cut along the line BB ′. FIG. 2 is an explanatory diagram illustrating an aspect of an electrical configuration of the electro-optical device illustrated in FIG. 1. 1 is a schematic configuration diagram of a projection display device using an electro-optical device to which the present invention is applied.

  Embodiments of the present invention will be described with reference to the drawings. In the drawings to be referred to in the following description, the members are reduced in scale and the number of members is reduced in order to make the members and the like large enough to be recognized on the drawings. Hereinafter, each direction is expressed using an orthogonal coordinate system including an x-axis, a y-axis, and a z-axis.

[Configuration of the electro-optical device 1]
(Basic configuration)
FIG. 1 is an explanatory diagram schematically illustrating a state in which one aspect of an electro-optical device 1 to which the present invention is applied is viewed from an oblique direction. FIG. 2 is an exploded perspective view of the electro-optical device 1 shown in FIG. 1 with the holder 70 removed from the electro-optical panel 100. FIG. 3 is an explanatory diagram schematically showing a planar configuration of the electro-optical panel 100 and the like shown in FIG. FIG. 4 is an explanatory diagram schematically showing a state in which the electro-optical panel 100 and the like shown in FIG. 1 are cut along the electro-optical panel 100 and the second flexible wiring board 32. 2 and 3 show fewer terminals and wires. 2, 3, and 4, illustrations of a terminal that connects the driving IC and the flexible wiring board, a terminal that connects the flexible wiring board and the extension board, and the like are omitted.

  1, 2, 3, and 4, the electro-optical device 1 includes an electro-optical panel 100, a plurality of mounting substrates 5 connected to one side of the electro-optical panel 100, and the electro-optical panel 100 having a thickness. The holder 70 is supported from both sides in the direction (z direction). The electro-optical device 1 is a liquid crystal device used as a later-described light valve or the like, and the electro-optical device 1 includes a liquid crystal panel as the electro-optical panel 100.

  In the electro-optical panel 100, a counter substrate 102 on which a common electrode (not shown) or the like is formed is bonded to a device substrate 101 on which a pixel electrode 118 or the like is formed by a sealing material (not shown). In the electro-optical panel 100, a liquid crystal layer (not shown) is provided in a region surrounded by the sealing material. The electro-optical panel 100 of this embodiment is a transmissive liquid crystal panel. Therefore, a light-transmitting substrate such as a heat-resistant glass or a quartz substrate is used for the element substrate 101 and the counter substrate 102.

  In the electro-optical panel 100, a region where the pixel electrodes 118 are arranged in the x direction and the y direction is the pixel region 110, and in the electro-optical panel 100, a region overlapping the pixel region 110 is a display region. The element substrate 101 has a protruding portion 105 protruding in the y direction from the counter substrate 102, and includes a plurality of image signal input first terminals 161 along the edge (one side 105 a) of the protruding portion 105. Are arranged at a predetermined pitch. In the overhanging portion 105, a plurality of terminals including the second terminals 162 for inputting image signals are arranged at a predetermined pitch at a position opposite to the pixel region 110 with the first terminal 161 interposed therebetween. Accordingly, the first terminal 161 and the second terminal 162 are arranged along the edge of the element substrate 101 at positions shifted in the y direction. In FIGS. 2 and 3, the first mounting board 51 and the second mounting board 52 are shifted in the x direction so that the configurations of the first mounting board 51 and the second mounting board 52 can be easily understood. In the embodiment, the positions of the first terminal 161 and the second terminal 162 in the x direction are the same. However, as shown in FIGS. 2 and 3, the first terminal 161 and the second terminal 162 may be shifted by ½ pitch in the x direction. The first terminal 161 is connected to the first mounting substrate 51 and includes an image signal input terminal. The second terminal 162 is connected to the second mounting substrate 52 and includes an image signal input terminal.

  In the electro-optical panel 100, the light source light La (see FIG. 1 and the like) incident from the counter substrate 102 side is modulated while being emitted from the element substrate 101 side, and is emitted as display light. The electro-optical panel 100 includes a dust-proof glass disposed so as to overlap with at least one of a surface of the counter substrate 102 opposite to the element substrate 101 side and a surface of the element substrate 101 opposite to the counter substrate 102 side. Yes. In the present embodiment, the electro-optical panel 100 includes a first dust-proof glass 103 disposed on the surface of the counter substrate 102 opposite to the element substrate 101 side with an adhesive or the like, and the counter substrate 102 of the element substrate 101. A second dust-proof glass 104 is disposed on the surface opposite to the side, and is disposed so as to overlap with an adhesive or the like.

(Configuration of holder 70)
As shown in FIGS. 1 and 2, the holder 70 includes a metal first holder member 71 that supports the electro-optical panel 100 from one side z <b> 1 in the thickness direction, and the electro-optical panel 100 on the other side in the thickness direction. and a metal second holder member 72 supported from z2. The first holder member 71 and the second holder member 72 are coupled by, for example, a method of fastening bolts (not shown) in holes 711 and 721 formed in the first holder member 71 and the second holder member 72. ing. The first holder member 71 and the second holder member 72 are formed with openings 712 and 722 that allow light source light and display light to pass therethrough at positions overlapping the display region (pixel region 110) of the electro-optical panel 100. .

  The holder 70 includes a metal first heat dissipating plate portion 73 disposed on the y-direction side where the mounting substrate 5 extends with respect to the first holder member 71, and a mounting substrate with respect to the second holder member 72. 5 is a metal second heat sink plate 74 located on the y-direction side where 5 extends, and the first heat sink plate 73 and the second heat sink plate 74 face each other in the z direction. ing.

  In this embodiment, the first heat radiating plate portion 73 is formed separately from the first holder member 71, and the second heat radiating plate portion 74 is formed integrally with the second holder member 72. Accordingly, the first heat radiating plate portion 73 is fixed to the second heat radiating plate portion 74 by the fixing member 75 in a state where the plurality of mounting boards 5 are sandwiched between the first heat radiating plate portion 74. Radiation fins 730 are formed on the surface of the first heat radiating plate portion 73 opposite to the second heat radiating plate portion 74 from a plurality of ridges extending in the y direction in parallel with each other in the x direction. On the surface opposite to the first heat radiating plate portion 73 of the heat radiating plate portion 74, heat radiating fins 740 are formed from a plurality of ridges extending in the y direction in a state of being parallel in the x direction.

(Configuration of mounting substrate 5)
2, 3, and 4, in the electro-optical device 1 of the present embodiment, the element substrate 101 includes a plurality of mounting substrates 5 (COF (Chip On Film) in which a driving IC is mounted on a flexible wiring substrate. The mounting flexible wiring board) is connected to one side of the electro-optical panel 100 (one side 105a of the element substrate 101) in a state of being overlapped with each other. In this embodiment, the two mounting substrates 5 are connected to the electro-optical panel 100 in a state where they overlap each other. More specifically, on the element substrate 101, the first mounting substrate 51 in which the first driving IC 21 is mounted on the first flexible wiring substrate 31 and the second driving IC 22 are mounted on the second flexible wiring substrate 32. The second mounting substrate 52 is connected to the electro-optical panel 100 in a state where it overlaps in the z direction. Accordingly, an image signal or the like is output from the first driving IC 21 and the second driving IC 22 to the electro-optical panel 100 via the first flexible wiring board 31 and the second flexible wiring board 32. In the first mounting substrate 51 and the second mounting substrate 52, other than the first driving IC 21 and the second driving IC 22, on the opposite side of the first driving IC 21 and the second driving IC 22 from the electro-optical panel 100. The electronic components 516 and 526 are mounted. The electronic components 516 and 526 are electronic components such as capacitors.

  A plurality of first output electrodes 313 are formed on the end portion 311 of the first flexible wiring substrate 31 so as to overlap with the element substrate 101, and each of the plurality of first output electrodes 313 is connected to the first terminal 161 or the like. Has been. A plurality of second output electrodes 323 are formed on the end portion 321 of the second flexible wiring board 32 so as to overlap with the element substrate 101, and each of the plurality of second output electrodes 323 has a second terminal 162 or the like. It is connected to the.

  The first flexible wiring board 31 and the second flexible wiring board 32 have any rectangular planar shape. Each of the first driving IC 21 and the second driving IC 22 has a rectangular planar shape. Further, the first driving IC 21 and the second driving IC 22 have the same configuration in which the width (dimension in the y direction), the length (dimension in the x direction), the circuit configuration, and the like are equal to each other. In addition, the first mounting board 51 and the second mounting board 52 are mounted on the first flexible wiring board 31 and the second flexible wiring board 32, the mounting positions of the first driving IC 21 and the second driving IC 22, and the first flexible wiring board. 31 and the second flexible wiring board 32 are equal in width (dimension in the x direction), length (dimension in the y direction), wiring pattern, and the like.

  The first flexible wiring board 31 and the second flexible wiring board 32 connected to the electro-optical panel 100 are not displaced in the x direction and are displaced in the y direction. A part of the second flexible wiring board 32 overlaps the first flexible wiring board 31 and is connected to the electro-optical panel 100. In the present embodiment, the first flexible wiring board 31 and the second flexible wiring board 32 are not displaced in the x direction, but the first terminals 161 and the second terminals 162 are arranged with a ½ pitch deviation. Corresponding to them, the first terminals 161 may be connected with a shift of 1/2 pitch (1/2 pitch of the second terminal 162). The first flexible wiring board 31 and the second flexible wiring board 32 overlap over a wide range in the x direction. Further, the deviation in the y direction between the first flexible wiring board 31 and the second flexible wiring board 32 is a deviation between the position where the first terminals 161 are arranged and the position where the second terminals 162 are arranged. . Therefore, the first flexible wiring board 31 and the second flexible wiring board 32 overlap over a wide range in the y direction.

  The first driving IC 21 is mounted on the element substrate 101 side from the center C1 in the length direction (y direction) of the first flexible wiring board 31 or the center C1. The second driving IC 22 is mounted on the element substrate 101 side from the center C2 in the length direction (y direction) of the second flexible wiring board 32 or the center C2. In this embodiment, the first driving IC 21 is mounted at a position that is biased toward the element substrate 101 from the center C1 in the length direction (y direction) of the first flexible wiring board 31. The second driving IC 22 is mounted at a position deviated toward the element substrate 101 from the center C2 in the length direction (y direction) of the second flexible wiring board 32.

  Further, both the first driving IC 21 and the second driving IC 22 are arranged in a region where the first flexible wiring board 31 and the second flexible wiring board 32 overlap. Accordingly, at least a part of the first driving IC 21 is mounted on the first flexible wiring board 31 at a position overlapping the second flexible wiring board 32, and at least a part of the second driving IC 22 is the first flexible wiring board 31. It is mounted on the second flexible wiring board 32 at a position that overlaps with. Further, the first driving IC 21 and the second driving IC 22 partially overlap each other. On the other hand, the electronic component 516 mounted on the first flexible wiring board 31 and the electronic component 526 mounted on the second flexible wiring board 32 do not overlap.

  As the first flexible wiring board 31 and the second flexible wiring board 32, a single-sided wiring board and a double-sided wiring board can be used. In this embodiment, single-sided wiring boards are used for the first flexible wiring board 31 and the second flexible wiring board 32. Accordingly, the output electrodes (the first output electrode 313 and the second output electrode 323), the first driving IC 21 and the one surface 316, 326 (see FIG. 4) of the first flexible wiring substrate 31 and the second flexible wiring substrate 32 are provided. Mounting electrodes, wirings, etc. (not shown) of the second driving IC 22 are formed. The first flexible wiring board 31 and the second flexible wiring board 32 may be either a single-layer board in which the wiring is made of the same metal layer or a multilayer board in which the wiring is made up of a plurality of metal layers. However, in this embodiment, single-layer substrates are used for the first flexible wiring substrate 31 and the second flexible wiring substrate 32.

(Configuration of extension board)
In the first mounting substrate 51, one end 411 of the first extension substrate 41 is connected to an end 312 of the first flexible wiring substrate 31 opposite to the element substrate 101 side with respect to the first driving IC 21. In addition, the first end 412 side which is the other end of the first extension substrate 41 extends to the side opposite to the element substrate 101 side. The first extension board 41 is made of a flexible wiring board, and a plurality of first wirings 415 extend from the first end 412 toward the one end 411. A plurality of electrodes (not shown) formed on the end portion 312 of the first flexible wiring board 31 are connected to a plurality of electrodes (not shown) formed on one end 411 of the first extension board 41. . A first end 412 of the first extension board 41 is formed in a straight line, and a first plug 419 of a board-to-board connector is configured.

  In the second mounting substrate 52, one end 421 of the second extension substrate 42 is connected to an end 322 opposite to the element substrate 101 side with respect to the second driving IC 22 of the second flexible wiring substrate 32. In addition, the second end 422 side which is the other end of the second extension substrate 42 extends to the side opposite to the element substrate 101 side. A plurality of electrodes (not shown) formed on the end portion 322 of the second flexible wiring board 32 are connected to a plurality of electrodes (not shown) formed on one end 421 of the second extension board 42. The electrodes formed on the second flexible wiring board 32 and the electrodes formed on the second extension board 42 are connected. The second extension board 42 is made of a flexible wiring board, and a plurality of second wirings 425 extend from the second end 422 toward the one end 421. The second end 422 of the second extension substrate 42 is formed in a straight line, and a second plug 429 of a board-to-board connector is configured.

  Here, the dimension of the first flexible wiring board 31 in the y direction is shorter than the dimension of the first extension board 41 in the y direction, and the dimension of the second flexible wiring board 32 in the y direction is the y direction of the second extension board 42. Shorter than As the first extension board 41 and the second extension board 42, a single-sided wiring board and a double-sided wiring board can be used. In this embodiment, double-sided wiring boards are used for the first extension board 41 and the second extension board 42.

  The first extension board 41 and the second extension board 42 configured as described above are bent in a direction in which at least one extension board is separated from the other extension board, and as a result, the first end portion of the first extension board 41 is bent. 412 and the second end portion 422 of the second extension substrate 42 extend on the same straight line L without overlapping each other. In this embodiment, the first extension board 41 bends obliquely and linearly in a direction away from the second extension board 42 at an intermediate position in the length direction, and the second extension board 42 has a first position at an intermediate position in the length direction. The first extension board 41 and the second extension board 42 are formed in a substantially symmetrical plane shape so that the first extension board 41 and the second extension board 42 are linearly bent obliquely in a direction away from the first extension board 41.

  Here, the end 312 of the first flexible wiring board 31 and the end 322 of the second flexible wiring board 32 are shifted in the y direction. For this reason, the first extension board 41 and the second extension board 42 have different lengths. In this embodiment, the end portion 312 of the first flexible wiring board 31 is located closer to the element substrate 101 than the end portion 322 of the second flexible wiring board 32. For this reason, the first extension board 41 is longer than the second extension board 42 by an amount corresponding to the shift amount in the y direction between the end 312 of the first flexible wiring board 31 and the end 322 of the second flexible wiring board 32. . Accordingly, the first end portion 412 of the first extension substrate 41 and the second end portion 422 of the second extension substrate 42 do not overlap with each other and extend on a straight line L parallel to the edge in the y direction of the element substrate 101. Exist.

  In this state, the first plug 419 formed on the first end 412 of the first extension board 41 is coupled to the first socket 619 formed on the wiring board 60 made of a rigid board, and the second extension board 42 The second plug 429 formed on the second end 422 is coupled to the second socket 629 formed on the wiring substrate 60 made of a rigid substrate. The wiring board 60 inputs various power supplies and various signals from the upper circuit to the first driving IC 21 via the first extension board 41 and the first flexible wiring board 31. As a result, the first driving IC 21 outputs various signals to the element substrate 101 via the first flexible wiring substrate 31. In addition, the wiring board 60 inputs various power sources and various signals from the upper circuit to the second driving IC 22 via the second extension board 42 and the second flexible wiring board 32. As a result, the second driving IC 22 outputs various signals to the element substrate 101 via the second flexible wiring substrate 32.

  In this embodiment, double-sided wiring boards are used as the first extension board 41 and the second extension board 42. Accordingly, a part of the first wiring 415 and the second wiring 425 is formed on one side of the first extension board 41 and the second extension board 42, and the other part of the first wiring 415 and the second wiring 425 is provided on the other side. Alternatively, a ground wiring may be formed. In addition, a conductive pattern to which a ground potential is applied may be formed on the entire other surfaces of the first extension substrate 41 and the second extension substrate 42.

(Configuration of protective film)
FIG. 5 is an explanatory diagram when the connection portion between the mounting board 5 and the extension boards (41, 42) shown in FIG. 2 is viewed from one side of the mounting board 5. FIG. 6 is an explanatory view of the connection portion between the mounting board 5 and the extension boards (41, 42) shown in FIG.

  As shown in FIGS. 4, 5, and 6, the connection surface 418 between the first mounting substrate 51 and the first extension substrate 41 has one surface 316 side and the other surface 317 side opposite to the one surface 316. The 1st protective film 91 is stuck so that at least one may be covered. The second protective film covers the connection portion 428 between the second mounting substrate 52 and the second extension substrate 42 so as to cover at least one of the one surface 326 side and the other surface 327 side opposite to the one surface 326. 92 is affixed.

  As shown in FIGS. 4 and 5, in this embodiment, as the first protective film 91, a protective film 911 that covers the connection portion 418 between the first mounting substrate 51 and the first extension substrate 41 from the other surface 317 side is provided. ing. Further, as the second protective film 92, a protective film 921 that covers the connection portion 428 between the second mounting substrate 52 and the second extension substrate 42 from the other surface 327 side is provided.

  4 and 6, in this embodiment, as the first protective film 91, a protective film 912 that covers the connection portion 418 between the first mounting substrate 51 and the first extension substrate 41 from the one surface 316 side is provided. The protective film 912 extends from the connection portion 418 to a position that covers the first driving IC 21. Further, as the second protective film 92, a protective film 922 that covers the connection portion 428 between the second mounting substrate 52 and the second extension substrate 42 from the one surface 326 side is provided, and the protective film 922 is provided from the connection portion 428. It extends to a position covering the second driving IC 22.

  Here, the first protective film 91 (protective films 911 and 612) and the second protective film 92 (protective films 921 and 622) are made of an adhesive film including a film of polyester, polyimide, polyethylene terephthalate, etc. Has moisture resistance.

(Heat dissipation structure)
FIG. 7 is a cross-sectional view schematically showing a state where the electro-optical device 1 shown in FIG. 1 is cut along the line AA ′. FIG. 8 is a cross-sectional view schematically showing a state where the electro-optical device 1 shown in FIG. 1 is cut along the line BB ′.

  4, in the electro-optical device 1 of the present embodiment, flexible wiring boards (first flexible wiring board 31 and second flexible wiring board) used for a plurality of mounting boards 5 (first mounting board 51 and second mounting board 52). 32) and the sum of the thicknesses of the driving ICs (the first driving IC 21 and the second driving IC 22) are equal to or less than the thickness t of the electro-optical panel 100. Therefore, as shown in FIGS. 7 and 8, the driving ICs (the first driving IC 21 and the second driving IC 22) are mounted on the plurality of mounting boards 5 (the first mounting board 51 and the second mounting board 52). The 1st heat sink part 73 and the 2nd heat sink part 74 are arrange | positioned at the both sides of the thickness direction (z direction) of the part currently performed. Here, the first heat radiating plate portion 73 and the second heat radiating plate portion 74 are connected to the connection portion 418 between the first mounting board 51 and the first extension board 41 and between the second mounting board 52 and the second extension board 42. The portion 428 is overlapped from both sides in the thickness direction.

  In the present embodiment, a driving IC (first driving board) for the mounting board 5 (the first mounting board 51 and the second mounting board 52) is provided between the first heat sink plate 73 and the second heat sink plate 74. Fillers that fill the gaps on the one side 316, 326 side and the gaps on the other side 317, 327 side with respect to the portion where the IC 21 and the second driving IC 22) are mounted are arranged. Therefore, the heat generated in the first driving IC 21 and the second driving IC 22 can be efficiently released from the first heat radiating plate portion 73 and the second heat radiating plate portion 74.

  In the present embodiment, an adhesive layer 81 (filler) is provided between the other surface 317 of the first flexible wiring board 31 of the first mounting board 51 and the second heat radiating plate portion 74, and the first flexible wiring board 31. The other surface 317 is bonded to the second heat radiating plate portion 74. The adhesive layer 81 fixes the first mounting substrate 51 to the second heat dissipation plate portion 74 and promotes heat dissipation of the first driving IC 21. On the one surface 316 side of the first flexible wiring substrate 31 of the first mounting substrate 51, between the protective film 912 (first protective film 91) and the other surface 327 of the second flexible wiring substrate 32 of the second mounting substrate 52. Is provided with a heat transfer sheet 82 (filler) made of a silicone sheet or the like. An adhesive layer 83 (filler) is provided between the first surface 316 side of the second flexible wiring substrate 32 of the second mounting substrate 52 and the first heat radiating plate portion 73, and a protective film 922 (second protective film). 92) is bonded to the first heat sink 73. The adhesive layer 83 fixes the second mounting substrate 52 to the first heat radiating plate portion 73 and promotes heat radiation of the second driving IC 22.

(Electrical configuration of the electro-optical device 1)
FIG. 9 is an explanatory diagram showing an aspect of the electrical configuration of the electro-optical device 1 shown in FIG. As shown in FIG. 9, the electro-optical panel 100 includes a pixel area 110 (display area), a scanning line driving circuit 130, a data line selection circuit 150 (selection circuit), n image signal lines 160, and n images. Signal input terminals (first terminal 161 and second terminal 162), k selection signal lines 140, k selection signal input terminals 145, a plurality of power supply terminals 171, 172, 173, and a power supply terminal 171 , 172, 173 corresponding to the power supply lines 174, 175, 176. n is an integer of 1 or more, and k is an integer of 2 or more. In the embodiment shown in FIG. 7, k = 4. These elements are formed on the element substrate 101 shown in FIG. In the element substrate 101, a data line selection circuit 150 is formed along one side of the peripheral portion of the pixel region 110, and the scanning line driving circuit 130 is formed along another side that intersects the side where the data line selection circuit 150 is formed. Is formed.

  The first driving IC 21 and the second driving IC 22 are clock signals input from an external upper circuit (not shown) via the first flexible wiring board 31 and the second flexible wiring board 32 (see FIG. 2), An image signal indicating an image to be displayed on the electro-optical panel 100 is output in accordance with the control signal, image data, and the like. The electro-optical panel 100 displays an image based on a clock signal and an image signal input from the first driving IC 21, the first flexible wiring board 31, the second driving IC 22, and the second flexible wiring board 32. The first driving IC 21 and the second driving IC 22 have the same configuration, and output the same signal other than the image signal.

  The pixel area 110 is an area for displaying an image. The pixel region 110 includes m scanning lines 112, (k × n) data lines 114, and (m × k × n) pixels 111. m is an integer of 1 or more. The pixel 111 includes a pixel electrode 118. The pixels 111 are provided corresponding to the intersections of the scanning lines 112 and the data lines 114, and are arranged in a matrix of m rows × (k × n) columns. The scanning line 112 is a signal line that transmits the scanning signals Y1, Y2, Y3... Ym, and is provided along the row direction (x direction) from the scanning line driving circuit 130. The data line 114 is a signal line for transmitting a data signal, and is provided from the data line selection circuit 150 along the column direction (y direction).

  In the pixel region 110, k × m pixels 111 corresponding to k (columns) data lines 114 form one pixel group (block). For example, a first pixel group 111h in which a plurality (k columns) of first pixel columns 111e in which a plurality (m) of first pixels 111a are arrayed in the y direction is arranged, and a plurality (m There are provided a second pixel group 111i in which a plurality of (k columns) second pixel columns 111f in which a plurality of second pixels 111b are arrayed in the y direction are arranged. Here, the pixels 111 belonging to the same pixel group are connected to the same image signal line 160 via the data line selection circuit 150. Accordingly, the electro-optical panel 100 includes n (columns) divided into n blocks by n (columns) image signal lines 160 or n image signal input terminals (first terminal 161 and second terminal 162). ) Pixel group.

  The scanning line driving circuit 130 selects a row in which data is written from the plurality of pixels 111 arranged in a matrix. Specifically, the scanning line driving circuit 130 outputs a scanning signal for selecting one scanning line 112 from the plurality of scanning lines 112. The scanning line driving circuit 130 supplies scanning signals Y1, Y2, Y3,... Ym to the scanning lines 112 in the first row, the second row, the third row,. The scanning signals Y1, Y2, Y3,... Ym are, for example, signals that sequentially become high level.

  The data line selection circuit 150 selects a column (pixel column) of the pixels 111 into which an image signal is written in each pixel group. Specifically, the data line selection circuit 150 selects at least one data line 114 from the k data lines 114 belonging to the pixel group according to the selection signals SEL [1] to SEL [k]. To do. The data lines 114 are connected to one image signal line 160 one by one by the data line selection circuit 150 in units of k. In this embodiment, the data line selection circuit 150 includes n demultiplexers 151 corresponding to each of the n pixel groups.

  The image signal line 160 connects between the image signal input terminals (the first terminal 161 and the second terminal 162) and the data line selection circuit 150. The image signal line 160 is connected to the image signal S (S [1]) input from the first flexible wiring board 31 and the second flexible wiring board 32 via the image signal input terminals (the first terminal 161 and the second terminal 162). ˜S [n]) are transmitted to the data line selection circuit 150 and correspond to n image signal input terminals (first terminal 161 and second terminal 162) or n pixel groups, respectively. N columns (books) are provided. The image signal S is a signal indicating data written to the pixel 111. Here, “image” refers to a still image or a moving image. One image signal line 160 is connected to k data lines 114 via a data line selection circuit 150. Therefore, in the image signal S, the data supplied to these k data lines 114 is time-division multiplexed.

  The selection signal line 140 connects between the selection signal input terminal 145 and the demultiplexer 151 of the data line selection circuit 150. The selection signal lines 140 (140 [1] to 140 [k]) are connected to the selection signals SEL (SEL [1] to SEL [k]) input from the selection signal input terminals 145 (145 [1] to 145 [k]). ) And k lines are provided. The selection signal SEL is a signal that sequentially becomes a high level.

  The image signal input terminals (first terminal 161 and second terminal 162) are terminals to which the first flexible wiring board 31 and the second flexible wiring board 32 are connected, and the image signal S [j] is supplied (j Is an integer satisfying 1 ≦ j ≦ n). In this example, an image signal input terminal (first terminal) corresponding to the odd-numbered image signal lines 160 of the first column, the third column, the fifth column,..., The (2t−1) column from the first driving IC 21. 161 and the second terminal 162) are supplied with image signals S [1], S [3], S [5],... S [2t-1] (t is an integer of 1 ≦ t ≦ n / 2). . Further, from the second driving IC 22, the image signal input terminals (the first terminal 161 and the second terminal) corresponding to the image signal lines 160 in the even-numbered columns of the second column, the fourth column, the sixth column,. The image signals S [2], S [4], S [6],... S [2t] are supplied to the terminal 162). The image signal S is a so-called data signal, and analog signals having different waveforms corresponding to image display are supplied to the image signal input terminals (the first terminal 161 and the second terminal 162).

  The selection signal input terminal 145 is a terminal connected to the first flexible wiring board 31 and the second flexible wiring board 32, and is supplied with a selection signal SEL consisting of a pulse signal. The selection signal SEL is a timing signal for selecting the data line 114 in the data line selection circuit 150. The selection signal input terminal 145 includes a terminal to which the first flexible wiring board 31 is connected and a terminal to be connected to the second flexible wiring board 32, and the first driving IC 21 of the first flexible wiring board 31 and The selection signal SEL is supplied from both or one of the second driving ICs 22 of the second flexible wiring board 32. In this embodiment, the selection signal SEL having the same waveform is supplied to the selection signal input terminal 145 corresponding to each of the first flexible wiring board 31 and the second flexible wiring board 32. Accordingly, the selection signal input terminal 145 is shown without distinguishing the terminal connected to the first flexible wiring board 31 and the terminal connected to the second flexible wiring board 32, but the first flexible wiring board 31. As a terminal to be connected to and a terminal to be connected to the second flexible wiring board 32, the first terminal 161 and the second terminal 162 may be distinguished.

  The power supply terminal 171, the power supply terminal 172, and the power supply terminal 173 are terminals connected to the first flexible wiring board 31 and the second flexible wiring board 32, and do not pass through the first driving IC 21 and the second driving IC 22. In addition, a power supply voltage is supplied from the upper circuit through the first flexible wiring board 31 and the second flexible wiring board 32. The power supply voltage is a voltage used as a power supply in the electro-optical panel 100, and is a DC voltage in this example. The power supply terminal 171 is a terminal for supplying the voltage LCCOM, the power supply terminal 172 is a terminal for supplying the voltage VSSY, and the power supply terminal 173 is a terminal for supplying the voltage VDDY. The voltage LCCOM is a voltage that becomes a reference potential of a voltage applied to the liquid crystal layer. The voltage VSSY is a voltage that becomes a power supply potential on the low voltage side in the scanning line driving circuit 130. The voltage VDDY is a voltage that becomes a power supply potential on the high voltage side in the scanning line driving circuit 130. The power terminals 171, 172, and 173 are shown without distinguishing between the terminal connected to the first flexible wiring board 31 and the terminal connected to the second flexible wiring board 32, but the first flexible wiring board 31. As a terminal to be connected to and a terminal to be connected to the second flexible wiring board 32, the first terminal 161 and the second terminal 162 may be distinguished.

  The power supply terminals 171, 172, and 173 may be provided on both sides in the x direction. This is because it corresponds to a configuration in which one scanning line driving circuit 130 is provided on each of the left and right sides of the element substrate 101. In this embodiment, since only one scanning line driving circuit 130 is configured, the power supply terminals 172 and 173 are provided only on one side in the x direction.

  In the present embodiment, the image signal S [j] includes data written to the pixels 111 in the [k × j−k + 1] to [k × j] columns, which are k pixels 111 of the corresponding pixel group. Time division multiplexed. When S [j] is an odd number S [2t−1], the data is supplied from the first driving IC 21 to the data line 114 of the odd number pixel group. When S [j] is even-numbered S [2t], it is supplied from the second driving IC 22 to the data line 114 of the even-numbered pixel group. According to such a configuration, since the two driving ICs of the first driving IC 21 and the second driving IC 22 are used, the number of pixels is doubled in one cycle compared to the case of using one driving IC. On the other hand, data can be written. As described above, by arranging the first terminal 161 and the second terminal 162, the small electro-optical device 1 having high definition and high quality can be realized.

(Main effects of this form)
As described above, in the electro-optical device 1 of the present embodiment, the plurality of mounting boards 5 are the first flexible wiring boards formed on the end portions 312 and 322 of the first flexible wiring board 31 and the second flexible wiring board 32, respectively. The extension board 41 and the second extension board 42 are connected. Therefore, since the first flexible wiring board 31 and the second flexible wiring board 32 used for the mounting board 5 can be shortened, the cost can be reduced.

  In addition, the connection portion 418 between the first mounting substrate 51 and the first extension substrate 41 and the connection portion 428 between the second mounting substrate 52 and the second extension substrate 42 are provided with a first protective film having insulation and moisture resistance. Since it is covered with 91 and the 2nd protective film 92, the intensity | strength of the connection parts 418 and 418, moisture resistance, insulation, etc. can be improved. Therefore, the reliability of the connection portions 418 and 418 can be increased. In addition, since the protective film 912 (first protective film 91) and the protective film 922 (second protective film 92) cover the first driving IC 21 and the second driving IC 22, the first driving IC 21 and the first driving IC 21 The connecting portion between the flexible wiring board 31 and the connecting portion between the second driving IC 22 and the second flexible wiring board 32 can be protected. Therefore, the reliability of the mounting substrate 5 (the first mounting substrate 51 and the second mounting substrate 52) can be increased.

  In particular, the first driving IC 21 is mounted on the first flexible wiring board 31 at a position at least partially overlapping the second flexible wiring board 32, and the second driving IC 22 is at least partially mounted on the first flexible wiring board 31. Are mounted on the second flexible wiring board 32 so that the first driving IC 21 and the second driving IC 22 are close to the element substrate 101. Therefore, when connecting the first extension board 41 and the second extension board 42 to the first flexible wiring board 31 and the second flexible wiring board 32, the expensive first flexible wiring board 31 and the second flexible wiring board 32 are used. Can be significantly shortened. Therefore, the cost of the first flexible wiring board 31 on which the first driving IC 21 is mounted and the second flexible wiring board 32 on which the second driving IC 22 is mounted can be reduced.

  The plurality of mounting boards 5 (the first mounting board 51 and the second mounting board 52) connected to the electro-optical panel 100 are the sizes of the flexible wiring boards (the first flexible wiring board 31 and the second flexible wiring board 32). Since all the configurations including the mounting positions of the driving ICs (the first driving IC 21 and the second driving IC 22) are the same, it is not necessary to prepare a plurality of types of mounting boards 5. Therefore, the cost can be reduced.

  In addition, a part of each of the driving ICs (the first driving IC 21 and the second driving IC 22) of the plurality of mounting boards 5 overlap each other in the thickness direction. For this reason, since the driving ICs, which are heat sources, are collected, it is easy to take a heat dissipation measure using the first heat radiating plate portion 73 and the second heat radiating plate portion 74.

  The first driving IC 21 is mounted on the center of the length direction of the first flexible wiring board 31 or on the element substrate 101 side from the center, and the second driving IC 22 is the length of the second flexible wiring board 32. It is mounted on the element substrate 101 side from the center of the direction or from the center. For this reason, the analog signals output from the first driving IC 21 and the second driving IC 22 to the element substrate 101 are unlikely to deteriorate. Since each of the plurality of mounting boards 5 is a single-sided wiring board, the cost can be reduced.

  In addition, since the first end 412 of the first extension board 41 and the second end 422 of the second extension board 42 extend on the same straight line L without overlapping each other, the first extension board 41 When connecting the first end portion 412 and the second end portion 422 of the second extension board 42 to the upper circuit or the like, it is easy to work. For example, when the first end 412 of the first extension board 41 and the second end 422 of the second extension board 42 overlap each other, the first end 412 is turned over and the second end 422 is connected to the second end of the connector. Although it is necessary to insert into the socket 629, according to this form, the 2nd end part 422 can be inserted in the 2nd socket 629 of a connector, without taking this effort. Further, since the first end portion 412 and the second end portion 422 extend on the same straight line L, the first socket 619 and the second socket 629 can be linearly arranged on the wiring board 60. . Therefore, the operation of inserting the first end portion 412 and the second end portion 422 into the first socket 619 and the second socket 629 can be efficiently performed.

[Other embodiments]
In the embodiment described above, the case where there are two mounting substrates 5 is illustrated, but the present invention may be applied to the case where there are three or more mounting substrates 5. In the above embodiment, the electro-optical device 1 is a liquid crystal device, but the present invention may be applied when the electro-optical device 1 is an organic electroluminescence device.

[Example of mounting on electronic devices]
An electronic apparatus using the electro-optical device 1 according to the above-described embodiment will be described. FIG. 10 is a schematic configuration diagram of a projection display device (electronic apparatus) using the electro-optical device 1 to which the present invention is applied. A projection display device 2100 illustrated in FIG. 10 is an example of an electronic apparatus using the electro-optical device 1. In the projection display device 2100, the electro-optical device 1 is used as a light valve, and high-definition and bright display is possible without increasing the size of the device. As shown in this figure, a lamp unit 2102 (light source unit) having a white light source such as a halogen lamp is provided inside the projection display device 2100. The projection light emitted from the lamp unit 2102 is converted into three primary colors of R (red), G (green), and B (blue) by three mirrors 2106 and two dichroic mirrors 2108 arranged inside. To be separated. The separated projection light is guided to the light valves 100R, 100G, and 100B corresponding to the respective primary colors. B light has a longer optical path than other R and G colors. Therefore, in order to prevent the loss, light of B color is guided through a relay lens system 2121 having an incident lens 2122, a relay lens 2123, and an output lens 2124. It is burned.

  In the projection display device 2100, three sets of liquid crystal devices including the electro-optical device 1 are provided corresponding to each of R color, G color, and B color. The configuration of the light valves 100R, 100G, and 100B is the same as that of the electro-optical panel 100 described above, and is connected to the upper circuit in the projection display device 2100 via the first extension board 41 and the second extension board 42, respectively. Is done. Image signals that specify the gradation levels of the primary color components of R, G, and B are supplied from the external upper circuit, processed by the upper circuit in the projection display device 2100, and light valves 100R, 100G. And 100 are driven respectively. The lights modulated by the light valves 100R, 100G, and 100B are incident on the dichroic prism 2112 from three directions. In the dichroic prism 2112, the R and B light beams are reflected at 90 degrees, and the G light beam is transmitted. Accordingly, after the primary color images are combined, a color image is projected onto the screen 2120 by the projection lens group 2114 (projection optical system).

(Other projection display devices)
In addition, about a projection type display apparatus, you may comprise the LED light source etc. which radiate | emit the light of each color as a light source part, and supply each color light radiate | emitted from this LED light source to another liquid crystal device. .

(Other electronic devices)
The electronic apparatus including the electro-optical device 1 to which the present invention is applied is not limited to the projection display device 2100 of the above embodiment. For example, you may use for electronic devices, such as a projection type HUD (head-up display), a direct view type HMD (head mounted display), a personal computer, a digital still camera, and a liquid crystal television.

DESCRIPTION OF SYMBOLS 1 ... Electro-optical apparatus, 5 ... Mounting board, 21 ... 1st drive IC, 22 ... 2nd drive IC, 31 ... 1st flexible wiring board, 32 ... 2nd flexible wiring board, 41 ... 1st extension Substrate, 42 ... second extension substrate, 51 ... first mounting substrate, 52 ... second mounting substrate, 60 ... wiring substrate, 70 ... holder, 71 ... first holder member, 72 ... second holder member, 73 ... first Heat radiating plate part, 74 ... second heat radiating plate part, 81, 83 ... adhesive layer (filler), 82 ... heat transfer sheet, 91 ... first protective film, 92 ... second protective film, 100 ... electro-optical panel, 100B, 100G, 100R ... light valve, 101 ... element substrate, 102 ... counter substrate, 105 ... overhang, 110 ... pixel region, 111 ... pixel, 112 ... scan line, 114 ... data line, 118 ... pixel electrode, 130 ... Scanning line drive times , 140 ... selection signal line, 145 ... selection signal input terminal, 150 ... data line selection circuit, 151 ... demultiplexer, 160 ... image signal line, 161 ... first terminal, 162 ... second terminal, 311, 312, 321 322: end portion, 313: first output electrode, 323: second output electrode, 412: first end portion, 415: first wiring, 419: first plug, 422: second end portion, 425: second Wiring, 429, second plug, 516, 526, electronic component, 619, first socket, 629, second socket, 730, 740, radiating fin, 911, 812, 921, 922, protective film, 2100, projection display Device, 2102 ... Lamp unit (light source unit), 2114 ... Projection lens group (projection optical system), C1, C2 ... Center, L ... Straight line.

Claims (10)

An electro-optic panel;
A flexible wiring board having an end connected to the electro-optic panel, and a mounting board on which a driving IC is mounted on one surface of the flexible wiring board;
An extension board composed of a flexible wiring board having one end bonded to an end opposite to the electro-optical panel side with respect to the driving IC of the mounting board;
A protective film affixed so as to cover at least one of the one surface side and the other surface side that is the surface opposite to the one surface, the connecting portion of the mounting substrate and the extension substrate;
An electro-optical device comprising: The electro-optical device according to claim 1.
The electro-optical device, wherein the protective film covers the connection portion on the other surface side. The electro-optical device according to claim 1,
The electro-optical device, wherein the protective film covers the connection portion on the one surface side. The electro-optical device according to claim 3.
The electro-optical device, wherein the protective film extends on the one surface side from the connection portion to a position covering the driving IC. The electro-optical device according to any one of claims 1 to 4,
The electro-optical device, wherein the protective film has insulating properties and moisture resistance. The electro-optical device according to any one of claims 1 to 5,
A holder for supporting the electro-optic panel from both sides in the thickness direction;
The holder includes a first holder member that supports the electro-optical panel from one side in the thickness direction, a second holder member that supports the electro-optical panel from the other side in the thickness direction, and the drive of the mounting substrate. A first heat radiating plate portion overlapping from one side in the thickness direction of the electro-optical panel on a portion where the IC for mounting is mounted, and a thickness of the electro-optical panel on a portion where the driving IC of the mounting substrate is mounted And a second heat radiating plate portion overlapping from the other side in the vertical direction. The electro-optical device according to claim 6.
Between the first heat radiating plate portion and the second heat radiating plate portion, a gap on the one surface side and a gap on the other surface side with respect to a portion of the mounting substrate on which the driving IC is mounted. An electro-optical device, wherein a filling material to be filled is arranged. The electro-optical device according to any one of claims 1 to 7,
An electro-optical device, wherein the plurality of mounting substrates are connected to one side of the electro-optical panel in a state where the mounting substrates overlap in the thickness direction. The electro-optical device according to claim 8.
An electro-optical device, wherein two mounting boards are connected to the optical panel as the plurality of mounting boards.   An electronic apparatus comprising the electro-optical device according to claim 1.