JP2018128336A - Gyro sensor, electronic device, and moving object - Google Patents

Abstract

A gyro sensor capable of reducing the influence of a quadrature with a simple configuration is provided. A first signal generation unit that generates a second drive signal that is 180 degrees out of phase with the first drive signal and the first drive signal, and vibrates according to the first drive signal and the second drive signal. And generating a signal having the same phase as the first drive signal or the second drive signal, a movable detector that is displaced according to the angular velocity, a fixed detector disposed opposite to the movable detector, and A gyro sensor comprising: a second signal generation unit applied to the fixed detection unit. [Selection] Figure 14

Description

  The present invention relates to a gyro sensor, an electronic device, and a moving object.

  In recent years, a gyro sensor that detects angular velocity using a silicon MEMS (Micro Electro Mechanical System) technology has been developed. Gyro sensors are rapidly spreading to applications such as a camera shake correction function of a digital still camera (DSC), an automobile navigation system, and a motion sensing function of a game machine.

  In such a gyro sensor, the detection vibration may be excited along with the driving vibration (quadture).

  In the gyro sensor, the driving vibration of the vibrating body is ideally perpendicular to the detection direction, and the vibrating body is not displaced in the detection direction unless an angular velocity is input. However, the displacement component in the detection direction when the vibrator vibrates due to the asymmetry of the structure that occurs in the manufacturing process (for example, when the cross-sectional shape that should originally be square or rectangular is formed into a parallelogram, etc.) May occur (vibration leakage). This is called quadrature.

  Further, in the gyro sensor, when the driving frequency and the detection frequency of the vibrating body are slightly shifted, vibration due to the quadrature of the vibrating body obtains a gain due to a resonance phenomenon (resonance gain). Therefore, the amplitude of the vibration due to the quadrature of the vibrating body becomes large, and its influence cannot be ignored.

  Here, the resonance phenomenon refers to a phenomenon in which, when a vibration is applied to the vibrating body from the outside, the amplitude rapidly increases as the applied vibration approaches the resonance frequency of the vibrating body. The gain obtained by this resonance is called resonance gain. That is, the vibration due to the quadrature of the vibrating body is amplified in resonance with the driving vibration.

  For example, in the gyro sensor of Patent Document 1, in order to suppress the movement of the proof mass in the orthogonal direction (vibration due to quadrature) when the proof mass vibrates back and forth above the detection electrode, the orthogonal direction of the proof mass. A plurality of orthogonal steering voltage members are provided for electrostatically compensating for the movement of the motor.

JP 2007-304099 A

  However, in the gyro sensor of Patent Document 1, a plurality of orthogonal direction steering voltage members must be provided, and there is a problem that the configuration of the element becomes complicated.

  An object of some aspects of the present invention is to provide a gyro sensor that can reduce the influence of quadrature with a simple configuration. Another object of some embodiments of the present invention is to provide an electronic device and a moving body including the gyro sensor.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
The gyro sensor according to this application example is
A first signal generation unit that generates a first drive signal and a second drive signal that is 180 degrees out of phase with the first drive signal;
A movable detector that vibrates in accordance with the first drive signal and the second drive signal and is displaced in accordance with an angular velocity;
A fixed detector disposed opposite to the movable detector;
A second signal generation unit that generates a signal having the same phase as the first drive signal or the second drive signal and applies the signal to the fixed detection unit;
including.

  In such a gyro sensor, the second signal generation unit can apply the first drive signal or a signal having the same phase as the second drive signal to the fixed detection unit, thereby suppressing vibration due to the quadrature of the movable detection unit. Furthermore, in such a gyro sensor, for example, vibration due to the quadrature can be suppressed without adding a member such as an electrode for suppressing vibration due to the quadrature of the movable detection unit. Therefore, such a gyro sensor can reduce the influence of the quadrature with a simple configuration.

[Application Example 2]
In the gyro sensor according to this application example,
The second signal generation unit may include a selection unit that selects one of the first drive signal and the second drive signal input from the first signal generation unit.

  In such a gyro sensor, a signal for suppressing vibration due to the quadrature can be generated according to the vibration pattern due to the quadrature of the movable detection unit.

[Application Example 3]
In the gyro sensor according to this application example,
The second signal generator is
You may have the voltage adjustment part which adjusts the voltage of either the said 1st drive signal and the said 2nd drive signal which were input.

  In such a gyro sensor, a signal having the same phase as that of the first drive signal or the second drive signal and having a desired amplitude can be generated.

[Application Example 4]
In the gyro sensor according to this application example,
A substrate,
A first fixed drive electrode and a second fixed drive electrode fixed to the substrate;
A movable drive electrode disposed between the first fixed drive electrode and the second fixed drive electrode;
A vibrating body to which the movable drive electrode is connected;
Including
The vibrating body vibrates when the first driving signal is applied to the first fixed driving electrode and the second driving signal is applied to the second fixed driving electrode,
The movable detection unit may be connected to the vibrating body.

  In such a gyro sensor, an angular velocity can be obtained from a signal based on a change in capacitance between the movable detection unit and the fixed detection unit.

[Application Example 5]
In the gyro sensor according to this application example,
Two movable detectors are provided,
Two fixed detection units are provided,
One first fixed detection part of the two fixed detection parts is arranged to face one first movable detection part of the two movable detection parts,
The other second fixed detector of the two fixed detectors is disposed opposite to the other second movable detector of the two movable detectors,
The first movable detection unit and the second movable detection unit may vibrate in mutually opposite phases according to the first drive signal and the second drive signal.

  In such a gyro sensor, the detection signal from the first fixed detection unit and the detection signal from the second fixed detection unit can be differentially amplified, so that the Coriolis signal can be detected with high accuracy.

[Application Example 6]
In the gyro sensor according to this application example,
Two second signal generation units are provided,
One of the two second signal generation units generates a signal having the same phase as the first drive signal or the second drive signal and applies the signal to the first fixed detection unit,
The other of the two second signal generation units may generate a signal having the same phase as the first drive signal or the second drive signal and apply it to the second fixed detection unit.

  Such a gyro sensor can reduce the influence of the quadrature with a simple configuration even when the two movable detection units are provided.

[Application Example 7]
The electronic device according to this application example is
Includes any of the above gyro sensors.

  Such an electronic device can include a gyro sensor that can reduce the influence of the quadrature with a simple configuration.

[Application Example 8]
The mobile object according to this application example is
Includes any of the above gyro sensors.

  Such a moving body can include a gyro sensor that can reduce the influence of the quadrature with a simple configuration.

The top view which shows a sensor device typically. Sectional drawing which shows a sensor device typically. Sectional drawing which shows a sensor device typically. The graph which shows an example of the vibration by the quadrature of the flap plate for a detection. The figure for demonstrating operation | movement of a sensor device. The figure for demonstrating operation | movement of a sensor device. The figure for demonstrating the mode of the vibration by the quadrature of the flap plate for a detection. The figure for demonstrating the mode of the vibration by the quadrature of the flap plate for a detection. The figure for demonstrating the mode of the vibration by the quadrature of the flap plate for a detection. The graph which shows the signal given to a fixed detection electrode. The graph which shows an example of the vibration of the flap plate for a detection. The figure for demonstrating the mode of a vibration of the flap plate for a detection. The figure for demonstrating the mode of a vibration of the flap plate for a detection. The functional block diagram of the gyro sensor which concerns on this embodiment. The functional block diagram of the gyro sensor which concerns on the modification of this embodiment. The functional block diagram of the electronic device which concerns on this embodiment. The figure which shows typically an example of the external appearance of the smart phone which is an example of an electronic device. The figure which shows typically an example of the external appearance of the portable apparatus which is an example of an electronic device. The top view which shows typically an example of the moving body of this embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are essential constituent requirements of the present invention.

1. 1. First embodiment 1.1. Sensor Device First, the sensor device 1 included in the gyro sensor 100 according to the present embodiment will be described with reference to the drawings. FIG. 1 is a plan view schematically showing a sensor device 1 included in the gyro sensor 100 according to the present embodiment. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1 schematically showing the sensor device 1 included in the gyro sensor 100 according to the present embodiment. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1 schematically showing the sensor device 1 included in the gyro sensor 100 according to the present embodiment. In FIGS. 1 to 3, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other.

  As illustrated in FIGS. 1 to 3, the sensor device 1 includes a substrate 10, a lid 20, and a functional element 102. For convenience, the substrate 10 and the lid 20 are omitted in FIG.

  The material of the substrate 10 is, for example, glass or silicon. The substrate 10 has a first surface 12 and a second surface 14 facing in the opposite direction to the first surface 12. A recess 16 is provided in the first surface 12. The recess 16 constitutes the cavity 2. A post portion 18 is provided on the bottom surface (surface of the substrate 10 defining the recess 16) 17 of the recess 16. The post portion 18 is a member for supporting the functional element 102.

  The lid 20 is provided on the substrate 10 (on the + Z axis direction side of the substrate 10). The material of the lid 20 is, for example, silicon. The lid 20 is bonded to the first surface 12 of the substrate 10. The substrate 10 and the lid 20 may be joined by anodic bonding. In the illustrated example, a recess is formed in the lid 20, and the recess constitutes the cavity 2.

  In addition, the joining method of the board | substrate 10 and the cover body 20 is not specifically limited, For example, joining by low melting glass (glass paste) may be sufficient and joining by solder may be sufficient. Alternatively, the substrate 10 and the lid 20 may be joined by forming a metal thin film (not shown) at each joint portion of the substrate 10 and the lid 20 and eutectically bonding the metal thin films to each other. .

The functional element 102 is provided on the first surface 12 side of the substrate 10. The functional element 102 is bonded to the substrate 10 by, for example, anodic bonding or direct bonding. The functional element 102 is accommodated in the cavity 2 formed by the substrate 10 and the lid 20. The cavity 2 is desirably in a reduced pressure state. Thereby, it can suppress that the vibration of the functional element 102 attenuate | damps by air viscosity.

  The functional element 102 includes two structures 112 (a first structure 112a and a second structure 112b). As shown in FIG. 1, the two structures 112 are provided side by side in the X-axis direction so as to be symmetric with respect to a virtual straight line α parallel to the Y-axis.

  The structure 112 includes a fixed portion 30, a drive spring portion 32, a vibrating body 34, a movable drive electrode 36, a fixed drive electrode 38 (first fixed drive electrode), and a fixed drive electrode 39 (second fixed drive electrode). And a detection flap plate 40, a beam portion 42, a movable detection electrode 44 (an example of a movable detection portion), and a fixed detection electrode 46 (an example of a fixed detection portion). The drive spring portion 32, the vibrating body 34, the movable drive electrode 36, the detection flap plate 40, the beam portion 42, and the movable detection electrode 44 are separated from the substrate 10.

  The fixing unit 30 is fixed to the substrate 10. The fixing portion 30 is bonded to the first surface 12 of the substrate 10 by, for example, anodic bonding. For example, four fixing portions 30 are provided for one structure 112. In the illustrated example, the structures 112a and 112b use the + X-axis direction fixing portion 30 of the first structure 112a and the −X-axis side fixing portion 30 of the second structure 112b as a common fixing portion. . The common fixing part 30 is provided on the post part 18, for example.

  The drive spring portion 32 connects the fixed portion 30 and the vibrating body 34. The drive spring portion 32 is configured by a plurality of beam portions 33. A plurality of beam portions 33 are provided corresponding to the number of fixed portions 30. The beam portion 33 extends in the X-axis direction while reciprocating in the Y-axis direction. The beam portion 33 (drive spring portion 32) can smoothly expand and contract in the X-axis direction, which is the vibration direction of the vibrating body 34.

  The vibrating body 34 is, for example, a rectangular frame in plan view. A side surface of the vibrating body 34 in the X-axis direction (for example, a side surface having a perpendicular line parallel to the X-axis) is connected to the drive spring portion 32. The vibrating body 34 can vibrate in the X-axis direction by the movable drive electrode 36 and the fixed drive electrodes 38 and 39. A movable drive electrode 36, a drive spring portion 32 (beam portion 33), and a beam portion 42 are connected to the vibrating body 34.

  The movable drive electrode 36 is connected to the vibrating body 34. In the illustrated example, four movable drive electrodes 36 are provided for one structure 112, and the two movable drive electrodes 36 are located on the + Y axis direction side of the vibrating body 34, and the other two movable drives. The electrode 36 is located on the −Y axis direction side of the vibrating body 34. As shown in FIG. 1, the movable drive electrode 36 has a comb tooth including a trunk portion extending from the vibrating body 34 in the Y-axis direction and a plurality of branch portions extending from the trunk portion in the X-axis direction. It may have a shape.

  The fixed drive electrodes 38 and 39 are fixed to the substrate 10. The fixed drive electrodes 38 and 39 are bonded to the first surface 12 of the substrate 10 by, for example, anodic bonding. The fixed drive electrodes 38 and 39 are provided to face the movable drive electrode 36, and the movable drive electrode 36 is disposed between the fixed drive electrodes 38 and 39. As shown in FIG. 1, when the movable drive electrode 36 has a comb-like shape, the fixed drive electrodes 38 and 39 may have a comb-like shape corresponding to the movable drive electrode 36. The movable drive electrode 36 and the fixed drive electrodes 38 and 39 are electrodes for vibrating the vibrating body 34.

  The detection flap plate 40 is connected (supported) to the vibrating body 34 via the beam portion 42. A side surface in the X-axis direction (for example, a side surface having a perpendicular line parallel to the X-axis) of the detection flap plate 40 is connected to the beam portion 42. The detection flap plate 40 is provided inside the frame-shaped vibrating body 34 in plan view. The detection flap plate 40 has a plate shape. In the illustrated example, the shape of the detection flap plate 40 is rectangular in plan view.

  The beam portion 42 connects the vibrating body 34 and the detection flap plate 40. In the illustrated example, two beam portions 42 are provided in one structure 112. In one structure 112, the two beam portions 42 and the portion of the detection flap plate 40 sandwiched between the two beam portions 42 constitute a rotating shaft portion 41. The rotating shaft portion 41 has a rotating shaft Q and can be torsionally deformed. By this torsional deformation, the detection flap plate 40 can be displaced in the Z-axis direction. That is, the detection flap plate 40 has a rotation axis Q (has a part of the rotation axis Q) and can be displaced in the Z-axis direction (in the thickness direction of the substrate 10). In the illustrated example, the rotation axis Q is parallel to the X axis.

  The movable detection electrode 44 is provided on the detection flap plate 40. The movable detection electrode 44 is a portion of the detection flap plate 40 that overlaps the fixed detection electrode 46 in plan view. The movable detection electrode 44 forms a capacitance with the fixed detection electrode 46.

  The fixed portion 30, the drive spring portion 32, the vibrating body 34, the movable drive electrode 36, the detection flap plate 40, the beam portion 42, and the movable detection electrode 44 are integrally provided. The materials of the fixed portion 30, the drive spring portion 32, the vibrating body 34, the movable drive electrode 36, the fixed drive electrodes 38 and 39, the detection flap plate 40, the beam portion 42, and the movable detection electrode 44 are, for example, phosphorus, boron, etc. This is silicon imparted with conductivity by being doped with impurities.

  The fixed detection electrode 46 is fixed to the substrate 10. The fixed detection electrode 46 is provided on the substrate 10 (on the bottom surface 17 of the recess 16). In the illustrated example, the shape of the fixed detection electrode 46 is a rectangle in plan view. The fixed detection electrode 46 is disposed to face the detection flap plate 40. The fixed detection electrode 46 is disposed so as to form a capacitance with the detection flap plate 40.

  The material of the fixed detection electrode 46 is, for example, aluminum, gold, or ITO (Indium Tin Oxide). By using a transparent electrode material such as ITO as the fixed detection electrode 46, foreign matter or the like existing on the fixed detection electrode 46 can be easily visually recognized from the second surface 14 side of the substrate 10.

1.2. Operation of Sensor Device Next, the operation of the sensor device 1 will be described.

  When a voltage is applied between the movable drive electrode 36 and the fixed drive electrodes 38 and 39 by a power source (not shown), an electrostatic force can be generated between the movable drive electrode 36 and the fixed drive electrodes 38 and 39. Thereby, the vibrating body 34 can be vibrated in the X-axis direction. At this time, the drive spring portion 32 expands and contracts in the X-axis direction.

  Specifically, a constant bias voltage Vdc is applied to the movable drive electrode 36. Further, the first drive signal V1 is applied to the fixed drive electrode 38 via a drive wiring (not shown). Further, the second drive signal V2 is applied to the fixed drive electrode 39 through a drive wiring (not shown). The first drive signal V1 and the second drive signal V2 are alternating voltages having the same frequency, and the second drive signal V2 is 180 degrees out of phase with the first drive signal V1. The first drive signal V1 and the second drive signal V2 are, for example, alternating voltages with the same potential and the same amplitude.

  As shown in FIG. 1, in the first structure 112a, the fixed drive electrode 38 is arranged on the −X axis direction side of the movable drive electrode 36, and the fixed drive electrode 39 is on the + X axis direction side of the movable drive electrode 36. Has been placed. In the second structure 112b, the fixed drive electrode 38 is disposed on the + X axis direction side of the movable drive electrode 36, and the fixed drive electrode 39 is disposed on the −X axis direction side of the movable drive electrode 36. Therefore, the first driving signal V1 and the second driving signal V2 cause the vibrating body 34 of the first structure 112a and the vibrating body 34 of the second structure 112b to have opposite phases (that is, a state in which the phase is shifted by 180 degrees). And can be vibrated along the X-axis at a predetermined frequency.

  Thus, the vibrating body 34 vibrates in the X-axis direction according to the first drive signal V1 and the second drive signal V2. Therefore, the movable detection electrode 44 connected to the vibrating body 34 also vibrates in the X-axis direction according to the first drive signal V1 and the second drive signal V2, similarly to the vibrating body 34. Specifically, the movable detection electrode 44 (an example of the first movable detector) of the first structure 112a and the movable detection electrode 44 (an example of the second movable detector) of the second structure 112b are the first drive. In response to the signal V1 and the second drive signal V2, they vibrate in mutually opposite phases.

  When an angular velocity ωy around the Y axis is applied to the sensor device 1 in a state where the vibrating body 34 performs the above vibration (drive vibration), a Coriolis force is exerted. As a result, the detection flap plate 40 of the first structure 112a and the detection flap plate 40 of the second structure 112b are displaced in the Z-axis direction (along the Z-axis) in opposite directions. The detection flap plate 40 repeats this operation while receiving Coriolis force (detection vibration).

  As the detection flap plate 40 is displaced in the Z-axis direction, the distance between the movable detection electrode 44 and the fixed detection electrode 46 changes. Therefore, the capacitance between the movable detection electrode 44 and the fixed detection electrode 46 changes. By detecting the amount of change in capacitance between the movable detection electrode 44 and the fixed detection electrode 46, the angular velocity ωy about the Y axis can be obtained.

  In the sensor device 1, by applying a voltage between the movable detection electrode 44 and the fixed detection electrode 46, the amount of change in capacitance between the movable detection electrode 44 and the fixed detection electrode 46 can be detected. .

  Specifically, a constant bias voltage Vdc is applied to the movable detection electrode 44. Further, a ground voltage (reference voltage) Vgnd or a constant potential is applied to the fixed detection electrode 46. As a result, the amount of change in capacitance between the movable detection electrode 44 and the fixed detection electrode 46 can be detected.

  The fixed detection electrode 46 is supplied with a compensation signal Vcomp in addition to the ground voltage Vgnd.

  The compensation signal Vcomp supplied to the fixed detection electrode 46 is an AC voltage having the same frequency as the first drive signal V1 and the second drive signal V2. As will be described later, the compensation signal Vcomp is an AC voltage having the same phase as that of the first drive signal V1 and the same phase as that of the second drive signal V2, depending on two vibration patterns by the quadrature of the detection flap plate 40. There are cases where the AC voltage is. By providing the compensation signal Vcomp to the fixed detection electrode 46, the influence of the quadrature can be reduced. Hereinafter, the compensation signal Vcomp will be described.

  First, the operation of the detection flap plate 40 of the first structure 112a when the compensation signal Vcomp is not applied to the fixed detection electrode 46 will be described. In the following, it is assumed that no angular velocity is applied to the sensor device 1.

  FIG. 4 shows the vibration caused by the quadrature of the detection flap plate 40 of the first structure 112a (displacement in the Z-axis direction of the free end of the detection flap plate 40) when the compensation signal Vcomp is not applied to the fixed detection electrode 46. It is a graph which shows an example of d).

  5 and 6 are diagrams for explaining the operation of the sensor device 1. 5 shows the operation of the sensor device 1 at time t1, and FIG. 6 shows the operation of the sensor device 1 at time t3.

  FIGS. 7 to 9 are diagrams for explaining the state of vibration due to the quadrature of the detection flap plate 40 when the compensation signal Vcomp is not applied to the fixed detection electrode 46. 7 shows the state of the detection flap plate 40 at time t1, FIG. 8 shows the state of the detection flap plate 40 at time t2, and FIG. 9 shows the state of the detection flap plate 40 at time t3. Is shown.

At time t1, the first drive signal V1 = V1 _t1 is applied to the fixed drive electrode 38, and the second drive signal V2 = V2 _t1 is applied to the fixed drive electrode 39 (where V1 _t1 <V2 _t1 ). Thereby, as shown in FIG. 5, the vibrating body 34 of the first structure 112a moves in the −X axis direction, and the vibrating body 34 of the second structure 112b moves in the + X axis direction. At this time, the detection flap plate 40 of the first structure 112a is displaced by −dquad−d0 in the Z-axis direction by the quadrature as shown in FIG.

  The displacement d = dquad is the magnitude of the displacement (amplitude) in the Z-axis direction due to the quadrature of the detection flap plate 40. Further, the displacement d = d0 is the magnitude of the displacement in the Z-axis direction in the initial state of the detection flap plate 40 (a state in which vibration due to the quadrature is not excited). That is, the displacement d = d0 is the magnitude of the displacement in the Z-axis direction of the detection flap plate 40 at time t2 shown in FIG.

At time t3, the first drive signal V1 = V1 _t3 is applied to the fixed drive electrode 38, and the second drive signal V2 = V2 _t3 is applied to the fixed drive electrode 39 (where V1 _t3 > V2 _t3 ). Thereby, as shown in FIG. 6, the vibrating body 34 of the first structure 112a moves in the + X-axis direction, and the vibrating body 34 of the second structure 112b moves in the −X-axis direction. At this time, as shown in FIG. 9, the detection flap plate 40 of the first structure 112a is displaced by dquad-d0 in the Z-axis direction by the quadrature.

  Next, the operation of the detection flap plate 40 of the first structure 112a when the compensation signal Vcomp is supplied to the fixed detection electrode 46 will be described.

  FIG. 10 is a graph showing a voltage Vgnd + Vcomp applied to the fixed detection electrode 46 of the first structure 112a and a voltage Vdc− (Vgnd + Vcomp) applied between the movable detection electrode 44 and the fixed detection electrode 46. FIG. 11 is a graph showing an example of the vibration of the detection flap plate 40 of the first structure 112a when the compensation signal Vcomp is given to the fixed detection electrode 46 of the first structure 112a. FIG. 12 and FIG. 13 are diagrams for explaining how the detection flap plate 40 vibrates when the compensation signal Vcomp is applied to the fixed detection electrode 46. FIG. 12 shows the state of the detection flap plate 40 at time t1, and FIG. 13 shows the state of the detection flap plate 40 at time t3.

  In the example shown in FIG. 10, the compensation signal Vcomp is an AC voltage having the same phase as that of the second drive signal V2. By applying the compensation signal Vcomp to the fixed detection electrode 46, a voltage Vdc− (Vgnd + Vcomp) is applied between the movable detection electrode 44 and the fixed detection electrode 46.

  At time t1, as shown in FIG. 5, the vibrating body 34 of the first structure 112a moves in the −X axis direction, and the vibrating body 34 of the second structure 112b moves in the + X axis direction. At this time, the detection flap plate 40 of the first structure 112a is displaced by −dquad−d0 + dcomp in the Z-axis direction as shown in FIG. That is, the displacement (amplitude) in the Z-axis direction due to the quadrature of the detection flap plate 40 is suppressed by + dcomp (where dcomp> 0). This is because the voltage Vdc− (Vgnd + Vcomp) applied between the movable detection electrode 44 and the fixed detection electrode 46 becomes smaller than the voltage Vdc−Vgnd when the compensation signal Vcomp is not applied at time t1. is there. That is, when the compensation signal Vcomp is supplied to the fixed detection electrode 46, the electrostatic force (the electrostatic force acting between the movable detection electrode 44 and the fixed detection electrode 46 compared with the case where the compensation signal Vcomp is not supplied at the time t1 ( This is because the electrostatic attractive force is small.

  At time t3, as shown in FIG. 6, the vibrating body 34 of the first structure 112a moves in the + X axis direction, and the vibrating body 34 of the second structure 112b moves in the −X axis direction. At this time, the detection flap plate 40 of the first structure 112a is displaced by dquad-d0-dcomp in the Z-axis direction as shown in FIG. That is, the displacement in the Z-axis direction due to the quadrature of the detection flap plate 40 is suppressed by −dcomp. This is because the voltage Vdc− (Vgnd + Vcomp) applied between the movable detection electrode 44 and the fixed detection electrode 46 becomes larger than the voltage Vdc−Vgnd when the compensation signal Vcomp is not applied at time t3. is there. That is, when the compensation signal Vcomp is applied to the fixed detection electrode 46, the electrostatic force acting between the movable detection electrode 44 and the fixed detection electrode 46 is compared with the case where the compensation signal Vcomp is not applied at time t3 ( This is because the electrostatic attractive force is increased.

  Therefore, by applying the compensation signal Vcomp having the same phase as the second drive signal V2 to the fixed detection electrode 46, the vibration due to the quadrature of the detection flap plate 40 can be suppressed as shown in FIG. As described above, the fixed detection electrode 46 is supplied with the compensation signal Vcomp (see FIG. 10) having the same phase as the drive signal having the opposite phase to the vibration due to the quadrature of the detection flap plate 40 (see FIG. 4). The vibration due to the quadrature of the flap plate 40 can be suppressed.

  In the sensor device 1, the resonance frequency (detection frequency) of the detection flap plate 40 and the resonance frequency (drive frequency) of the vibrating body 34 are slightly shifted. Therefore, when the compensation signal Vcomp having the same frequency as the second drive signal V2 (that is, the same frequency as the drive frequency) is given to the fixed detection electrode 46, the electrostatic force is multiplied by the resonance gain by the resonance phenomenon. Therefore, vibration due to the quadrature of the detection flap plate 40 can be suppressed with a small compensation signal Vcomp.

  The resonance phenomenon is the amplitude of the vibration of the detection flap plate 40 as the applied vibration approaches the resonance frequency of the detection flap plate 40 when vibration is applied to the detection flap plate 40 from the outside. Refers to a phenomenon in which the value increases rapidly. A gain obtained by this resonance is called a resonance gain. In this embodiment, by using this resonance phenomenon, the magnitude (voltage amplitude) of the compensation signal Vcomp can be reduced as compared with the case where the resonance phenomenon is not used.

The detection signal (alternating current) output from the fixed detection electrode 46 is a quadrature based on a Coriolis signal that is an angular velocity component based on the Coriolis force acting on the sensor device 1 and a self-vibration component (quadrature) based on the driving vibration of the sensor device 1. Signal (leakage signal). The quadrature signal and the Coriolis signal included in the detection signal output from the fixed detection electrode 46 are 90 degrees out of phase. Therefore, when detecting the Coriolis signal, Veff = Vdc−Vgnd (see FIG. 10) is applied between the movable detection electrode 44 and the fixed detection electrode 46. Therefore, even if the compensation signal Vcomp is given to the fixed detection electrode 46, the influence on the detection of the angular velocity is small. Further, for example, it is easy to remove the signal based on the compensation signal Vcomp from the detection signal output from the fixed detection electrode 46.

  In the above description, when the vibrating body 34 of the first structure 112a moves in the −X axis direction, the detection flap plate 40 is displaced in the −Z axis direction, and when the vibrating body 34 moves in the + X axis direction, the detection is performed. The case where the flap plate 40 is displaced in the + Z-axis direction (first vibration pattern) has been described. Note that the detection flap plate 40 may move in the opposite direction due to a quadrature. That is, when the vibrating body 34 of the first structure 112a moves in the −X axis direction, the detection flap plate 40 is displaced in the + Z axis direction, and when the vibrating body 34 moves in the + X axis direction, the detection flap plate There is a case in which 40 is displaced in the −Z-axis direction (second vibration pattern). This is because the asymmetry of the structure of the sensor device 1 in the manufacturing process is not uniform, and the asymmetry of the structure differs for each element.

  When the detection flap plate 40 of the first structure 112a vibrates in the second vibration pattern due to the quadrature, the compensation signal Vcomp applied to the fixed detection electrode 46 of the first structure 112a has the same phase as the first drive signal V1. AC voltage.

  In the above description, the compensation signal Vcomp applied to the fixed detection electrode 46 of the first structure 112a has been described. However, the compensation signal Vcomp is also applied to the fixed detection electrode 46 of the second structure 112b. Thereby, the vibration by the quadrature of the flap plate 40 for detection of the 2nd structure 112b can be suppressed.

  For example, when the vibrating body 34 of the second structure 112b moves in the + X-axis direction, the detection flap plate 40 is displaced in the −Z-axis direction, and the vibrating body 34 of the second structure 112b moves in the −X-axis direction. In this case, when the detection flap plate 40 is displaced in the + Z-axis direction, the compensation signal Vcomp applied to the fixed detection electrode 46 of the second structure 112b is an AC voltage having the same phase as the second drive signal V2.

  When the vibrating body 34 of the second structure 112b moves in the + X-axis direction, the detection flap plate 40 is displaced in the + Z-axis direction, and the vibrating body 34 of the second structure 112b moves in the -X-axis direction. In this case, when the detection flap plate 40 is displaced in the −Z-axis direction, the compensation signal Vcomp applied to the fixed detection electrode 46 of the second structure 112b is an AC voltage having the same phase as the first drive signal V1.

1.3. Next, a method for manufacturing the sensor device 1 will be described.

  First, a glass substrate is prepared, the said glass substrate is patterned, the recessed part 16 and the post part 18 are formed, and the board | substrate 10 is formed.

  Next, the fixed detection electrode 46 is formed on the bottom surface 17 of the recess 16. Next, a silicon substrate is bonded to the first surface 12 of the substrate 10 by anodic bonding, and the silicon substrate is ground and thinned, and then patterned into a predetermined shape to form the functional element 102. Through the above steps, the fixed portion 30, the drive spring portion 32, the vibrating body 34, the movable drive electrode 36, the fixed drive electrodes 38 and 39, the detection flap plate 40, the beam portion 42, the movable detection electrode 44, and the fixed detection electrode 46. Can be formed.

Next, the substrate 10 and the lid 20 are bonded (for example, anodic bonding), and the functional element 102 is accommodated in the cavity 2 formed by the substrate 10 and the lid 20.

  Through the above steps, the sensor device 1 can be manufactured.

1.4. Next, the configuration of the gyro sensor 100 will be described with reference to the drawings. FIG. 14 is a functional block diagram of the gyro sensor 100.

  The gyro sensor 100 includes the sensor device 1 described above, a drive circuit 110 (an example of a first signal generation unit), a detection circuit 120, a bias voltage application unit 130, and compensation signal generation circuits 140A and 140B (second signal generation). An example of a unit).

  The drive circuit 110 generates a first drive signal V1 and a second drive signal V2, outputs the first drive signal V1 to the fixed drive electrode 38, and outputs the second drive signal V2 to the fixed drive electrode 39. For example, the drive circuit 110 generates drive signals V1 and V2 based on signals from monitor electrodes (not shown) that detect the vibration state of the vibrating body 34, and supplies the drive signals V1 and V2 to the fixed drive electrodes 38 and 39. May be output. The drive circuit 110 may output the drive signals V1 and V2 to drive the sensor device 1, and may receive the feedback signal from the sensor device 1 to excite the sensor device 1.

  The detection circuit 120 includes an amplification circuit 122, a synchronous detection circuit 124, a filter circuit 126, and an amplification circuit 128.

  A detection signal output from the fixed detection electrode 46 (also referred to as “fixed detection electrode 46A”) of the first structure 112a and a fixed detection electrode 46 (also referred to as “fixed detection electrode 46B”) of the second structure 112b. The detection signal includes a Coriolis signal and a quadrature signal. The detection circuit 120 extracts a Coriolis signal from signals output from the fixed detection electrodes 46A and 46B.

  When the vibrating body 34 of the sensor device 1 vibrates, a current based on the capacitance change is output from the fixed detection electrodes 46 </ b> A and 46 </ b> B and input to the amplifier circuit 122. The amplifier circuit 122 converts and amplifies the current based on the capacitance change output from the fixed detection electrodes 46A and 46B into a voltage, and outputs the voltage to the synchronous detection circuit 124 as an AC voltage signal. The amplifier circuit 122 includes, for example, a Q / V converter (charge amplifier).

  For example, the synchronous detection circuit 124 extracts a Coriolis signal by synchronously detecting signals from the fixed detection electrodes 46A and 46B based on a signal from the monitor electrode (not shown) described above. The Coriolis signal extracted by the synchronous detection circuit 124 is input to the filter circuit 126.

  The filter circuit 126 is composed of a low-pass filter that removes a high-frequency component from the Coriolis signal and converts it to a DC voltage signal. The filter circuit 126 outputs the output signal to the amplifier circuit 128.

  The amplifier circuit 128 amplifies the input signal and outputs a voltage signal based on the angular velocity.

  The bias voltage application unit 130 applies the bias voltage Vdc to the vibrating body 34. The bias voltage application unit 130 applies the bias voltage Vdc to the vibrating body 34 via the fixed unit 30. Since the vibrating body 34 is integrated with the movable drive electrode 36 and the movable detection electrode 44 (detection flap plate 40), the bias voltage Vdc is also applied to the movable drive electrode 36 and the movable detection electrode 44.

  The compensation signal generation circuit 140A generates a signal (compensation signal Vcomp) having the same phase as the first drive signal V1 or the second drive signal V2, and applies it to the fixed detection electrode 46A. The compensation signal generation circuit 140A includes a selection circuit 142 (an example of a selection unit) and a voltage adjustment circuit 144 (an example of a voltage adjustment unit).

  The selection circuit 142 selects one of the first drive signal V1 and the second drive signal V2 input from the drive circuit 110.

  As described above, the vibration due to the quadrature of the detection flap plate 40 has two vibration patterns. The compensation signal Vcomp is determined according to the two vibration patterns as to whether it has the same phase as the first drive signal V1 or the same phase as the second drive signal V2.

  For example, whether the phase of the compensation signal Vcomp is the same as the phase of the first drive signal V1 by inspecting in advance which vibration pattern is caused by the quadrature vibration of the detection flap plate 40 or the second drive signal It can be determined whether the phase is the same as that of V2. Based on the result of this inspection, the selection circuit 142 is controlled to be in a state where one of the first drive signal V1 and the second drive signal V2 input from the drive circuit 110 is selected.

  The voltage adjustment circuit 144 adjusts the voltage of the first drive signal V1 or the second drive signal V2 input from the selection circuit 142 and has the same phase as the first drive signal V1 or the second drive signal V2. A signal (compensation signal Vcomp) is generated. Hereinafter, a case where the first drive signal V1 is selected by the selection circuit 142 will be described.

  For example, when the selection circuit 142 selects the first drive signal V1, the voltage adjustment circuit 144 adjusts the voltage (amplitude) of the first drive signal V1 to generate the compensation signal Vcomp. For example, the voltage adjustment circuit 144 attenuates the first drive signal V1 with a predetermined attenuation rate to generate the compensation signal Vcomp. The magnitude (voltage amplitude) of the compensation signal Vcomp can be appropriately set according to the desired performance of the gyro sensor 100. The magnitude (voltage amplitude) of the compensation signal Vcomp is set to such a magnitude that, for example, the amplitude of the vibration by the quadrature of the detection flap plate 40 is less than or equal to a predetermined amplitude (preferably the amplitude is zero).

  The voltage adjustment circuit 144 applies the compensation signal Vcomp to the fixed detection electrode 46A using the ground voltage Vgnd as a reference.

  Similar to the compensation signal generation circuit 140A, the compensation signal generation circuit 140B generates a signal (compensation signal Vcomp) having the same phase as the first drive signal V1 or the second drive signal V2, and applies the signal to the fixed detection electrode 46B. The compensation signal generation circuit 140B includes a selection circuit 142 and a voltage adjustment circuit 144. The configuration of the compensation signal generation circuit 140B is the same as the configuration of the compensation signal generation circuit 140A described above, and a description thereof is omitted.

  Here, when the compensation signal Vcomp is not applied to the fixed detection electrodes 46A and 46B, the detection flap plate 40 vibrates due to the quadrature (see FIG. 4). The amplitude of vibration by this quadrature is very large compared to the amplitude of vibration by Coriolis force (for example, it may be several thousand times to several tens of thousands times or more at 1 dps (degree / sec)). For this reason, the quadrature signal included in the detection signal becomes large, and the signal may be saturated in the first stage amplifier circuit 122 of the detection circuit 120.

On the other hand, when the compensation signal Vcomp is given to the fixed detection electrodes 46A and 46B, vibration due to the quadrature of the detection flap plate 40 can be suppressed. Therefore, the quadrature signal included in the detection signal can be reduced (or the quadrature signal can be eliminated), and signal saturation in the amplifier circuit 122 can be made difficult to occur.

  When the compensation signal Vcomp is applied to the fixed detection electrodes 46A and 46B, the detection signal includes a signal obtained by applying the compensation signal Vcomp to the fixed detection electrodes 46A and 46B. However, the magnitude of the signal included in the detection signal due to the provision of the compensation signal Vcomp is extremely small compared to, for example, the quadrature signal included in the detection signal when the compensation signal Vcomp is not provided. As described above, this is because the magnitude (voltage amplitude) of the compensation signal Vcomp can be reduced by utilizing the resonance phenomenon. Therefore, even when the compensation signal Vcomp is supplied to the fixed detection electrodes 46A and 46B, the signal saturation of the amplifier circuit 122 hardly occurs.

  The gyro sensor 100 has the following features, for example.

  In the gyro sensor 100, the compensation signal generation circuits 140A and 140B generate a compensation signal Vcomp having the same phase as the first drive signal V1 or the second drive signal V2 and apply it to the fixed detection electrodes 46A and 46B. Therefore, the gyro sensor 100 can suppress vibration due to the quadrature of the detection flap plate 40. Therefore, the influence of quadrature can be reduced. In the gyro sensor 100, vibration due to the quadrature can be suppressed without adding a member such as an electrode for suppressing vibration due to the quadrature of the detection flap plate 40. Therefore, in the gyro sensor 100, the influence of the quadrature can be reduced with a simple configuration.

  As described above, there are two vibration patterns in the vibration due to the quadrature of the detection flap plate 40. In the gyro sensor 100, the compensation signal generation circuits 140A and 140B have a selection circuit 142 that selects one of the first drive signal V1 and the second drive signal V2 input from the drive circuit 110. Therefore, in the gyro sensor 100, the compensation signal Vcomp can be generated by the compensation signal generation circuits 140A and 140B in accordance with the vibration pattern by the quadrature of the detection flap plate 40. Therefore, the influence of the quadrature can be reduced regardless of which vibration pattern is caused by the quadrature of the detection flap plate 40.

  In the gyro sensor 100, the compensation signal generation circuits 140A and 140B include a voltage adjustment circuit 144 that adjusts one of the first drive signal V1 and the second drive signal V2 input from the selection circuit 142. Therefore, the compensation signal generation circuits 140A and 140B can generate the compensation signal Vcomp having the same phase as the input first drive signal V1 or the second drive signal V2 and having a desired magnitude (voltage amplitude). it can.

  In the gyro sensor 100, the vibrating body 34 vibrates in the X-axis direction when the first drive signal V1 is applied to the fixed drive electrode 38 and the second drive signal V2 is applied to the fixed drive electrode 39, The movable detection electrode 44 is connected to the vibrating body 34 and is displaced in the Z-axis direction according to the angular velocity. Therefore, in the gyro sensor 100, the angular velocity ωy about the Y axis can be obtained from the current based on the capacitance change between the movable detection electrode 44 and the fixed detection electrode 46.

In the gyro sensor 100, two movable detection electrodes 44 are provided, and two fixed detection electrodes 46 are provided. One fixed detection electrode 46A (an example of the first fixed detection unit) of the two fixed detection electrodes 46 is connected to the movable detection electrode 44 of the first structure 112a of one of the two movable detection electrodes 44. Opposed to each other. The other fixed detection electrode 46B (an example of the second fixed detection unit) of the two fixed detection electrodes 46 is connected to the movable detection electrode 44 of the other second structure 112b of the two movable detection electrodes 44. Opposed to each other. Further, the movable detection electrode 44 of the first structure 112a and the movable detection electrode 44 of the second structure 112b vibrate in opposite phases according to the first drive signal V1 and the second drive signal V2. Therefore, since the gyro sensor 100 can differentially amplify the detection signal from the fixed detection electrode 46A and the detection signal from the fixed detection electrode 46B, the Coriolis signal can be detected with high accuracy.

  In the gyro sensor 100, two compensation signal generation circuits (a compensation signal generation circuit 140A and a compensation signal generation circuit 140B) are provided. The compensation signal generation circuit 140A (one of the two compensation signal generation circuits 140A and 140B) generates the compensation signal Vcomp and applies it to the fixed detection electrode 46A. The compensation signal generation circuit 140B (the other of the two compensation signal generation circuits 140A and 140B) generates the compensation signal Vcomp and applies it to the fixed detection electrode 46B. Therefore, even if the gyro sensor 100 includes two detection flap plates 40 (movable detection electrodes 44), the influence of the quadrature can be reduced with a simple configuration.

  In the above description, the example in which the first drive signal V1 and the second drive signal V2 are sine waves having opposite phases is described. However, the first drive signal V1 and the second drive signal V2 are rectangular waves having opposite phases. It may be. In this case, the compensation signal Vcomp may be a sine wave or a rectangular wave.

  In the above description, the example in which the sensor device 1 is a gyro sensor that detects the angular velocity ωy around the Y axis has been described. However, the sensor device 1 may be a sensor device that detects the angular velocity around the Z axis. In the sensor device 1 that detects the angular velocity around the Z axis, for example, when the angular velocity ωz around the Z axis is applied to the sensor device 1 in a state where the vibrating body 34 is vibrating in the X axis direction, the movable detection electrode becomes Y Displace in the axial direction. In the gyro sensor 100 including such a sensor device 1, the influence of the quadrature can be reduced by applying the compensation signal Vcomp having the same phase as the drive signal to the fixed detection electrode facing the movable detection electrode.

1.5. Next, a gyro sensor according to a modification of the present embodiment will be described with reference to the drawings. FIG. 15 is a functional block diagram of a gyro sensor 200 according to a modification of the present embodiment. Hereinafter, in the gyro sensor 200 according to this modification, members having the same functions as the constituent members of the gyro sensor 100 described above are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the gyro sensor 100 described above, the compensation signal generation circuits 140A and 140B are configured to include the selection circuit 142 as shown in FIG. On the other hand, in the gyro sensor 200, the compensation signal generation circuits 140A and 140B do not include the selection circuit 142 as shown in FIG.

  In the present modification, the sensor device 1 is prepared in advance so that the vibration due to the quadrature of the detection flap plate 40 of the first structure 112a and the second structure 112b has the first vibration pattern. Therefore, the second drive signal V2 is input from the drive circuit 110 to the compensation signal generation circuit 140A, and the first drive signal V1 is input from the drive circuit 110 to the compensation signal generation circuit 140B.

In the compensation signal generation circuit 140A, the voltage adjustment circuit 144 adjusts the voltage of the second drive signal V2 input thereto, and generates a compensation signal Vcomp having the same phase as the second drive signal V2. The compensation signal generation circuit 140A applies the generated compensation signal Vcomp to the fixed detection electrode 46A. Similarly, the compensation signal generation circuit 140B adjusts the voltage of the first drive signal V1 input in the voltage adjustment circuit 144 to generate a compensation signal Vcomp having the same phase as the first drive signal V1. The compensation signal generation circuit 140B applies the generated compensation signal Vcomp to the fixed detection electrode 46B.

  In addition, as the sensor device 1, you may prepare beforehand that the vibration by the quadrature of the flap plate 40 for a detection of the 1st structure 112a and the 2nd structure 112b is a 2nd vibration pattern. In this case, although not shown, the first drive signal V1 is input to the compensation signal generation circuit 140A, and the second drive signal V2 is input to the compensation signal generation circuit 140B.

  Further, as the sensor device 1, the vibration due to the quadrature of the detection flap plate 40 of the first structure 112a is the first vibration pattern, and the vibration due to the quadrature of the detection flap plate 40 of the second structure 112b is the second vibration pattern. You may prepare what is a vibration pattern. Further, as the sensor device 1, the vibration due to the quadrature of the detection flap plate 40 of the first structure 112a is the second vibration pattern, and the vibration due to the quadrature of the detection flap plate 40 of the second structure 112b is the first vibration pattern. You may prepare what is a vibration pattern. In these cases as well, the drive signals V1 and V2 corresponding to the vibration pattern are input to the compensation signal generation circuits 140A and 140B.

  In the gyro sensor 200 according to this modification, since the compensation signal generation circuits 140A and 140B do not include the selection circuit 142, the influence of the quadrature can be reduced with a simpler configuration.

2. Next, an electronic device according to the present embodiment will be described with reference to the drawings. FIG. 16 is a functional block diagram of the electronic apparatus 1000 according to the present embodiment.

  The electronic device 1000 includes a gyro sensor according to the present invention. Below, the case where the gyro sensor 100 is included as a gyro sensor which concerns on this invention is demonstrated.

  The electronic device 1000 further includes an arithmetic processing unit (CPU) 1020, an operation unit 1030, a ROM (Read Only Memory) 1040, a RAM (Random Access Memory) 1050, a communication unit 1060, and a display unit 1070. Note that the electronic device of the present embodiment may have a configuration in which some of the components (each unit) in FIG. 16 are omitted or changed, or other components are added.

  The arithmetic processing unit 1020 performs various types of calculation processing and control processing in accordance with programs stored in the ROM 1040 or the like. Specifically, the arithmetic processing device 1020 performs various processes according to the output signal of the gyro sensor 100 and the operation signal from the operation unit 1030, the process of controlling the communication unit 1060 to perform data communication with the external device, A process of transmitting a display signal for displaying various information on the display unit 1070 is performed.

  The operation unit 1030 is an input device including operation keys, button switches, and the like, and outputs an operation signal corresponding to an operation by the user to the arithmetic processing device 1020.

  The ROM 1040 stores programs, data, and the like for the arithmetic processing unit 1020 to perform various calculation processes and control processes.

The RAM 1050 is used as a work area of the arithmetic processing unit 1020, and programs and data read from the ROM 1040, data input from the gyro sensor 100,
Data input from the operation unit 1030, calculation results executed by the arithmetic processing unit 1020 according to various programs, and the like are temporarily stored.

  The communication unit 1060 performs various controls for establishing data communication between the arithmetic processing device 1020 and an external device.

  The display unit 1070 is a display device configured by an LCD (Liquid Crystal Display) or the like, and displays various types of information based on a display signal input from the arithmetic processing device 1020. The display unit 1070 may be provided with a touch panel that functions as the operation unit 1030.

  Various electronic devices can be considered as such an electronic device 1000, for example, personal computers (for example, mobile personal computers, laptop personal computers, tablet personal computers), mobile terminals such as smartphones and mobile phones, Digital still cameras, inkjet discharge devices (for example, inkjet printers), storage area network devices such as routers and switches, local area network devices, mobile terminal base station devices, televisions, video cameras, video recorders, car navigation devices, Real-time clock device, pager, electronic organizer (including communication function), electronic dictionary, calculator, electronic game device, game controller, word processor Workstations, videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical equipment (for example, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), fish detectors, various types Measurement equipment, instruments (for example, vehicle, aircraft, ship instruments), flight simulator, head mounted display, motion trace, motion tracking, motion controller, PDR (pedestrian position measurement), and the like.

  FIG. 17 is a diagram illustrating an example of the appearance of a smartphone that is an example of the electronic apparatus 1000. A smartphone that is the electronic apparatus 1000 includes a button as the operation unit 1030 and an LCD as the display unit 1070.

  FIG. 18 is a diagram illustrating an example of an appearance of an arm-mounted portable device (wearable device) that is an example of the electronic device 1000. The wearable device that is the electronic device 1000 includes an LCD as the display unit 1070. The display unit 1070 may be provided with a touch panel that functions as the operation unit 1030.

  In addition, the mobile device that is the electronic device 1000 includes a position sensor such as a GPS receiver (GPS), and can measure the movement distance and movement locus of the user.

3. Next, the moving body according to the present embodiment will be described with reference to the drawings. FIG. 19 is a top view schematically showing an automobile as the moving body 1100 according to the present embodiment.

  The moving body according to the present embodiment includes the gyro sensor according to the present invention. Below, the mobile body containing the gyro sensor 100 is demonstrated as a gyro sensor which concerns on this invention.

The mobile body 1100 according to the present embodiment further includes a controller 1120 that performs various controls such as an engine system, a brake system, and a keyless entry system, a controller 1130, a controller 1140, a battery 1150, and a backup battery 1160. Yes. Note that the mobile body 1100 according to the present embodiment may be configured such that some of the components (each unit) illustrated in FIG. 12 are omitted or changed, or other components are added.

  As such a moving body 1100, various moving bodies are conceivable, and examples thereof include automobiles (including electric automobiles), airplanes such as jets and helicopters, ships, rockets, and artificial satellites.

  In addition, this invention is not limited to embodiment mentioned above, A various deformation | transformation implementation is possible within the range of the summary of this invention.

  As an example, in the present embodiment, the detection flap plate is cantilevered by the beam portion 42, but in addition to this, the detection flap plate 40 is supported by the vibrating body 34 with an elastic body, for example, at four locations, The main surface of the detection flap plate 40 may be configured to be displaced in the Z-axis direction in a state along the XY plane.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 1 ... Sensor device, 2 ... Cavity, 10 ... Board | substrate, 12 ... 1st surface, 14 ... 2nd surface, 16 ... Recessed part, 17 ... Bottom surface, 18 ... Post part, 20 ... Lid body, 30 ... Fixing part, 32 DESCRIPTION OF SYMBOLS ... Drive spring part, 33 ... Beam part, 34 ... Vibrating body, 36 ... Movable drive electrode, 38 ... Fixed drive electrode, 39 ... Fixed drive electrode, 40 ... Detection flap board, 41 ... Rotating shaft part, 42 ... Beam part , 44, movable detection electrode, 46, fixed detection electrode, 46 A, fixed detection electrode, 46 B, fixed detection electrode, 100, gyro sensor, 102, functional element, 110, drive circuit, 112, structure, 112 a, first structure 112b ... second structure 120 ... detection circuit 122 ... amplification circuit 124 ... synchronous detection circuit 126 ... filter circuit 128 ... amplification circuit 130 ... bias voltage application unit 140A ... compensation signal generation circuit 1 DESCRIPTION OF SYMBOLS 0B ... Compensation signal generation circuit 142 ... Selection circuit 144 ... Voltage adjustment circuit 200 ... Gyro sensor 1000 ... Electronic device 1020 ... Arithmetic processing unit 1030 ... Operation part 1040 ... ROM 1050 ... RAM 1060 ... Communication Part, 1070 ... display part, 1100 ... moving body, 1120 ... controller, 1130 ... controller, 1140 ... controller, 1150 ... battery, 1160 ... battery for backup

Claims (8)

A first signal generation unit that generates a first drive signal and a second drive signal that is 180 degrees out of phase with the first drive signal;
A movable detector that vibrates in accordance with the first drive signal and the second drive signal and is displaced in accordance with an angular velocity;
A fixed detector disposed opposite to the movable detector;
A second signal generation unit that generates a signal having the same phase as the first drive signal or the second drive signal and applies the signal to the fixed detection unit;
Including gyro sensor. In claim 1,
The gyro sensor, wherein the second signal generation unit includes a selection unit that selects one of the first drive signal and the second drive signal input from the first signal generation unit. In claim 1 or 2,
The second signal generator is
A gyro sensor having a voltage adjusting unit that adjusts a voltage of any one of the input first driving signal and the second driving signal. In any one of Claims 1 thru | or 3,
A substrate,
A first fixed drive electrode and a second fixed drive electrode fixed to the substrate;
A movable drive electrode disposed between the first fixed drive electrode and the second fixed drive electrode;
A vibrating body to which the movable drive electrode is connected;
Including
The vibrating body vibrates when the first driving signal is applied to the first fixed driving electrode and the second driving signal is applied to the second fixed driving electrode,
The movable detection unit is a gyro sensor connected to the vibrating body. In any one of Claims 1 thru | or 4,
Two movable detectors are provided,
Two fixed detection units are provided,
One first fixed detection part of the two fixed detection parts is arranged to face one first movable detection part of the two movable detection parts,
The other second fixed detector of the two fixed detectors is disposed opposite to the other second movable detector of the two movable detectors,
The gyro sensor in which the first movable detection unit and the second movable detection unit vibrate in mutually opposite phases according to the first drive signal and the second drive signal. In claim 5,
Two second signal generation units are provided,
One of the two second signal generation units generates a signal having the same phase as the first drive signal or the second drive signal and applies the signal to the first fixed detection unit,
The other of the two second signal generation units generates a signal having the same phase as the first drive signal or the second drive signal and applies the signal to the second fixed detection unit.   An electronic apparatus comprising the gyro sensor according to claim 1.   A moving body comprising the gyro sensor according to claim 1.