JP2018119206A - 大気圧プラズマコーティング装置 - Google Patents
大気圧プラズマコーティング装置 Download PDFInfo
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- JP2018119206A JP2018119206A JP2017107939A JP2017107939A JP2018119206A JP 2018119206 A JP2018119206 A JP 2018119206A JP 2017107939 A JP2017107939 A JP 2017107939A JP 2017107939 A JP2017107939 A JP 2017107939A JP 2018119206 A JP2018119206 A JP 2018119206A
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- 239000011248 coating agent Substances 0.000 title claims abstract description 85
- 238000000576 coating method Methods 0.000 title claims abstract description 85
- 239000002243 precursor Substances 0.000 claims abstract description 83
- 238000010586 diagram Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/32—Plasma torches using an arc
- H05H1/34—Details, e.g. electrodes, nozzles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Nozzles (AREA)
- Coating By Spraying Or Casting (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (10)
- 管状電極と、前記管状電極の下に設けられ、且つプラズマを噴射するために配置され、噴口及び滑らかな輪郭を有し、また前記滑らかな輪郭の外径が前記管状電極から前記噴口へ次第に縮小するノズルと、を含む大気圧プラズマ発生器と、
前記管状電極及び前記ノズルに隣設され、且つコーティング前駆体が前記滑らかな輪郭に沿って前記噴口の前に流れるように、前記ノズルの前記滑らかな輪郭にコーティング前駆体を噴射するために配置される少なくとも1つの前駆体フィード治具と、
を備える大気圧プラズマコーティング装置。 - 前記大気圧プラズマ発生器は、前記管状電極内に設けられる棒状電極を更に含む請求項1に記載の大気圧プラズマコーティング装置。
- 前記滑らかな輪郭は、流線形輪郭である請求項1乃至請求項2のいずれか1項に記載の大気圧プラズマコーティング装置。
- 前記少なくとも1つの前駆体フィード治具は、前記ノズル及び/又は前記管状電極の外に環設される複数の前駆体フィード治具を含む請求項1乃至請求項3のいずれか1項に記載の大気圧プラズマコーティング装置。
- 前記前駆体フィード治具の間に同一の間隔を有する請求項4に記載の大気圧プラズマコーティング装置。
- 前記少なくとも1つの前駆体フィード治具は、前記ノズル及び/又は前記管状電極の外に環設される環状前駆体フィード治具である請求項1乃至請求項3のいずれか1項に記載の大気圧プラズマコーティング装置。
- 前記環状前駆体フィード治具は、環状流路を有する請求項6に記載の大気圧プラズマコーティング装置。
- 前記環状流路は、前記ノズル及び/又は前記管状電極に対向する環状の開口を有する請求項7に記載の大気圧プラズマコーティング装置。
- 前記環状流路は、前記ノズル及び/又は前記管状電極に対向する複数の開口を有する請求項7に記載の大気圧プラズマコーティング装置。
- 前記開口の間に同じ間隔を有する請求項9に記載の大気圧プラズマコーティング装置。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106103033A TWI598465B (zh) | 2017-01-25 | 2017-01-25 | 常壓電漿鍍膜裝置 |
| TW106103033 | 2017-01-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018119206A true JP2018119206A (ja) | 2018-08-02 |
| JP6385524B2 JP6385524B2 (ja) | 2018-09-05 |
Family
ID=60719304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017107939A Expired - Fee Related JP6385524B2 (ja) | 2017-01-25 | 2017-05-31 | 大気圧プラズマコーティング装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6385524B2 (ja) |
| CN (1) | CN108342713B (ja) |
| TW (1) | TWI598465B (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240116224A (ko) * | 2023-01-20 | 2024-07-29 | 주식회사 플라즈맵 | 지그를 포함하는 플라즈마 처리장치 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108611623B (zh) * | 2018-06-28 | 2020-07-31 | 中国科学院电工研究所 | 抑制固体介质材料二次电子产额的喷涂镀膜装置及方法 |
| TWI666339B (zh) * | 2018-08-21 | 2019-07-21 | 馗鼎奈米科技股份有限公司 | 電漿鍍膜裝置 |
| CN109267037A (zh) * | 2018-11-21 | 2019-01-25 | 新疆大学 | 常压等离子体增强化学气相沉积方法及采用该方法的设备 |
| TWI686106B (zh) * | 2019-01-25 | 2020-02-21 | 國立清華大學 | 場發射手持式常壓電漿產生裝置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000096247A (ja) * | 1998-09-22 | 2000-04-04 | Komatsu Ltd | 表面処理装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0385564A (ja) * | 1989-08-30 | 1991-04-10 | Canon Inc | 画像形成装置 |
| JP3649378B2 (ja) * | 1999-08-26 | 2005-05-18 | シャープ株式会社 | プラズマ処理装置およびプラズマ処理方法 |
| GB0208261D0 (en) * | 2002-04-10 | 2002-05-22 | Dow Corning | An atmospheric pressure plasma assembly |
| CN2735710Y (zh) * | 2004-09-11 | 2005-10-19 | 石家庄钢铁股份有限公司 | 一种等离子体驱动装置 |
| CN101163370A (zh) * | 2006-10-10 | 2008-04-16 | 馗鼎奈米科技股份有限公司 | 等离子导引机构及应用该导引机构的等离子放电装置 |
| GB0717430D0 (en) * | 2007-09-10 | 2007-10-24 | Dow Corning Ireland Ltd | Atmospheric pressure plasma |
| US20090142511A1 (en) * | 2007-11-29 | 2009-06-04 | Haley Jr Robert P | Process and apparatus for atmospheric pressure plasma enhanced chemical vapor deposition coating of a substrate |
| US10167556B2 (en) * | 2014-03-14 | 2019-01-01 | The Board Of Trustees Of The University Of Illinois | Apparatus and method for depositing a coating on a substrate at atmospheric pressure |
-
2017
- 2017-01-25 TW TW106103033A patent/TWI598465B/zh active
- 2017-03-17 CN CN201710161397.6A patent/CN108342713B/zh active Active
- 2017-05-31 JP JP2017107939A patent/JP6385524B2/ja not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000096247A (ja) * | 1998-09-22 | 2000-04-04 | Komatsu Ltd | 表面処理装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240116224A (ko) * | 2023-01-20 | 2024-07-29 | 주식회사 플라즈맵 | 지그를 포함하는 플라즈마 처리장치 |
| KR102895963B1 (ko) | 2023-01-20 | 2025-12-04 | 주식회사 플라즈맵 | 지그를 포함하는 플라즈마 처리장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6385524B2 (ja) | 2018-09-05 |
| CN108342713B (zh) | 2020-06-26 |
| TWI598465B (zh) | 2017-09-11 |
| TW201827625A (zh) | 2018-08-01 |
| CN108342713A (zh) | 2018-07-31 |
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