JP2018118189A - Discharge device, discharge method, resin molding device, and resin molded product manufacturing method - Google Patents

Abstract

An object of the present invention is to reduce the time required for a discharge step of a fluid resin such as a liquid resin. A dispenser as a discharge device includes a syringe that is a storage unit that stores a liquid resin that is a fluid resin, a mechanism that includes at least a plunger that is an extrusion mechanism that pushes out the liquid resin, and a syringe. A discharge unit 17 connected to the discharge unit 20 for discharging the liquid resin 32, an elastically deformable tube 36 attached to the discharge unit 17, a clamper 18 movable across the tube 36, and a movement amount of the clamper 18 are controlled. And a control unit 31. [Selection diagram] FIG.

Description

  The present invention relates to a discharge device, a discharge method, a resin molding device, and a method for manufacturing a resin molded product that discharge a fluid resin such as a liquid resin onto a discharge target.

  Conventionally, a semiconductor chip mounted on a substrate is resin-sealed using a solid resin such as a granular resin or a sheet resin or a liquid resin. For example, in Patent Document 1, as a technique for resin sealing using a liquid resin, a dispenser that is a liquid resin discharge device is used to discharge the liquid resin from a nozzle attached to the tip of the dispenser onto the substrate. It is described to do. And as FIG. 3-6 of patent document 1 shows, measuring the weight of the board | substrate before and behind liquid resin discharge using a weight measuring apparatus is proposed. The weight of the discharged resin can be calculated by measuring the substrate weight before and after the discharge. If the discharged resin weight is within the allowable range, the process proceeds to the next step. When the discharge resin weight is out of the allowable value range, the corrected resin discharge amount (= target discharge resin weight−discharge resin weight) is calculated and additional discharge is performed.

JP 2003-165133 A

  However, the discharge device disclosed in Patent Document 1 has the following problems. When the liquid resin is used, there is a possibility that a liquid resin dripping phenomenon may occur from the discharge port of the nozzle when the discharge of the liquid resin is stopped. In particular, when a highly viscous liquid resin is used, a dripping phenomenon occurs remarkably. The liquid resin in a dripping state hangs downward as a residual resin from the discharge port. When the dripping phenomenon occurs, the process waits until the residual resin naturally falls and the dripping state is resolved. Therefore, depending on the properties of the resin or the progress of curing, the dripping elimination time becomes longer, and therefore it may take a very long time to complete the liquid resin discharge process. In order to measure the weight of the substrate after discharging the liquid resin, it is necessary to wait until the liquid resin discharging step is completed. Therefore, it takes a very long time to determine whether or not the target discharge resin weight has been discharged, and the productivity of the discharge device is significantly reduced.

  The present invention solves the above-described problems, and provides a discharge device, a discharge method, a resin molding device, and a method for manufacturing a resin molded product that can shorten the time required for the discharge process of a fluid resin such as a liquid resin. The purpose is to do.

  In order to solve the above problems, a discharge device according to the present invention includes a storage unit that stores a fluid resin, an extrusion mechanism that extrudes the fluid resin, and a discharge unit that is connected to the storage unit and discharges the fluid resin. An elastically deformable tube attached to the discharge unit, a clamper movable with the tube interposed therebetween, and a control unit for controlling the movement amount of the clamper.

  In order to solve the above-described problem, the discharge method according to the present invention is configured to flow from an elastically deformable tube attached to the discharge unit connected to the storage unit by extruding the fluid resin stored in the storage unit. And an extruding step of extruding residual resin remaining in the tube by moving the clamper downward while sandwiching the tube with the clamper.

  According to the present invention, it is possible to shorten the time required for the discharge process of a fluid resin such as a liquid resin.

In the resin molding apparatus of Embodiment 1, it is a top view which shows the outline | summary of an apparatus. (A) is a schematic top view of the dispenser used in the resin molding apparatus shown by FIG. 1, (b) is an enlarged view of the discharge part shown by (a). (A) is the sectional view on the AA line of the dispenser shown by FIG. 2, (b) is sectional drawing on the BB line. (A)-(d) is a schematic sectional drawing which shows the operation | movement which discharges liquid resin using the dispenser shown by FIG. 2, and the operation which handles the residual resin in a tube. (A)-(c) is a schematic sectional drawing which shows the process of resin-molding using the resin-molding apparatus shown by FIG. (A)-(b) is a schematic sectional drawing which shows the modification of the dispenser used in Embodiment 2. FIG. (A)-(c) is a schematic sectional drawing which shows the modification and operation | movement of a dispenser used in Embodiment 3. FIG. (A)-(C) are the schematic which shows the resin amount of the liquid resin which remains in a syringe in the conventional dispenser, respectively. (A)-(C) are the schematic which shows the resin amount of the liquid resin which remains in the syringe of the dispenser of this invention in Embodiment 4, respectively. (A)-(c) is the schematic which shows the stroke amount which moves a clamper in Embodiment 4 using the dispenser shown in Embodiment 1 according to the resin amount of the liquid resin which remains in a syringe. It is. In the resin molding apparatus of Embodiment 5, it is a top view which shows the outline | summary of an apparatus. (A)-(d) is a schematic sectional drawing which shows the process of discharging liquid resin on a release film using the resin molding apparatus shown by FIG. It is the schematic which shows the state of the liquid resin discharged on the release film, (a) is a top view, (b) is CC sectional view taken on the line. (A)-(c) is a schematic sectional drawing which shows the process of supplying the liquid resin on the mold release film shown by FIG. 13 to a shaping | molding die, and resin-molding.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably. In the present application documents, the term “liquid” means that it is liquid at room temperature and has fluidity, and the degree of fluidity, in other words, the degree of viscosity does not matter. Further, in this application document, “resin molded product” means a product including at least a resin-molded resin portion, and a chip mounted on a substrate as described later is resin-molded by a molding die and resin-sealed. It is expression of the concept containing the sealed substrate of the form made.

Embodiment 1
(Configuration of resin molding equipment)
The structure of the resin molding apparatus of Embodiment 1 which concerns on this invention is demonstrated with reference to FIG. A resin molding apparatus 1 shown in FIG. 1 is a resin molding apparatus using a compression molding method. In the first embodiment, for example, a case where a liquid resin that is a fluid resin is used as a resin material as a target for resin molding of a substrate on which a semiconductor chip is mounted is shown. Examples of the “substrate” include a general substrate such as a glass epoxy substrate, a ceramic substrate, a resin substrate, and a metal substrate, and a lead frame.

  The resin molding apparatus 1 includes a substrate supply / storage module 2, three molding modules 3A, 3B, and 3C, and a resin supply module 4 as components. The substrate supply / storage module 2, the molding modules 3A, 3B, and 3C, and the resin supply module 4, which are constituent elements, can be attached to and detached from each other and exchanged with each other. be able to.

  The substrate supply / storage module 2 includes a pre-sealing substrate supply unit 6 for supplying the pre-sealing substrate 5, a sealed substrate storage unit 8 for storing the sealed substrate 7, the pre-sealing substrate 5 and the sealing. A substrate platform 9 that delivers the stopped substrate 7 and a substrate transport mechanism 10 that transports the pre-sealing substrate 5 and the sealed substrate 7 are provided. The predetermined position S1 is a position to stand by when the substrate transport mechanism 10 does not operate.

  Each molding module 3 </ b> A, 3 </ b> B, 3 </ b> C is provided with a lower mold 11 that can be raised and lowered, and an upper mold (not shown, see FIG. 5) that is disposed to face the lower mold 11. The upper mold and the lower mold 11 together form a mold. Each of the molding modules 3A, 3B, and 3C includes a mold clamping mechanism 12 that clamps and opens the upper mold and the lower mold 11 (a circular portion indicated by a two-dot chain line in the drawing). The lower mold 11 is provided with a cavity 13 that is a space in which a liquid resin that is a resin material is supplied and cured. The lower mold 11 is provided with a release film supply mechanism 14 for supplying a long release film. Here, a configuration in which the cavity 13 is provided in the lower mold 11 will be described. However, the cavity may be provided in the upper mold, or may be provided in both the upper mold and the lower mold.

  The resin supply module 4 is provided with a dispenser 15 that is a discharge device that discharges a liquid resin into a mold (cavity 13) and a resin transport mechanism 16 that transports the dispenser 15. The dispenser 15 includes a discharge unit 17 that discharges a liquid resin at the tip. The discharger 17 is provided with a clamper 18 that is movable with an elastically deformable tube (see FIGS. 2 to 3) attached to the discharger 17 interposed therebetween. The structure of the dispenser 15, the discharge part 17, and the clamper 18 will be described in detail in the part referring to FIGS. The predetermined position R1 is a position to stand by in a state where the resin transport mechanism 16 (including the dispenser 15) does not operate.

  The dispenser 15 shown in FIG. 1 is a one-component dispenser that uses a liquid resin in which a main agent and a curing agent are mixed in advance. For example, a thermosetting silicone resin or epoxy resin is used as the main agent. A two-component mixing type dispenser that mixes and uses a main agent and a curing agent when discharging a liquid resin can also be used.

  The resin supply module 4 is provided with a control unit CTL that controls the operation of the resin molding apparatus 1. The control unit CTL controls the transport of the pre-sealing substrate 5 and the sealed substrate 7, the transport of the dispenser 15, the discharge of the liquid resin, the heating of the molding die, and the opening and closing of the molding die. In other words, the control unit CTL controls each operation in the substrate supply / storage module 2, the molding modules 3A, 3B, 3C, and the resin supply module 4.

  The control unit CTL may be disposed at any position, and may be disposed in at least one of the substrate supply / storage module 2, the molding modules 3A, 3B, 3C, and the resin supply module 4, or outside the modules. It can also be arranged. Further, the control unit CTL can be configured as a plurality of control units separated at least in part according to the operation to be controlled.

(Composition of dispenser)
With reference to FIGS. 2-3, the structure of the dispenser 15 used in the resin molding apparatus 1 shown in FIG. 1 is demonstrated. As shown in FIG. 2, the dispenser 15 includes an extrusion mechanism 19 that extrudes the liquid resin, a syringe 20 that stores the liquid resin, a connecting portion 21 that connects the syringe 20 and the nozzle, and a nozzle 22 that discharges the liquid resin. With. The dispenser 15 is integrally configured by connecting the extrusion mechanism 19, the syringe 20, the connecting portion 21, and the nozzle 22. The syringe 20 or nozzle 22 can be replaced with another syringe or nozzle depending on the respective application.

  The push-out mechanism 19 is fixed to a servo motor 23, a ball screw 24 rotated by the servo motor 23, a slider 25 attached to a ball screw nut (not shown), which converts rotational motion into linear motion, and a tip of the slider 25. And a rod 26 having an insertion hole therein and a plunger 27 attached to the tip of the rod 26. The ball screw 24 is supported by a ball screw bearing 28. For example, the slider 25 moves in the Y direction along a guide rail 29 provided on the base of the push-out mechanism 19. As the servo motor 23 rotates, the plunger 27 moves in the Y direction via the ball screw 24, slider 25, and rod 26, respectively.

  The servo motor 23 is a motor that can control the rotation of the motor. The servo motor 23 has an encoder 30 which is a rotation detector that monitors the rotation of the motor. The encoder 30 detects the rotation angle and rotation speed of the servo motor 23 and feeds back to the control unit 31. The control unit 31 controls the rotation of the servo motor 23 based on the feedback signal from the encoder 30. By controlling the rotation of the servo motor 23, position control, speed control, torque control, and the like of the plunger 27 can be performed with high accuracy. In addition, the control part 31 may be integrated in the control part CTL of the resin molding apparatus 1 shown in FIG. 1, and may be provided independently of the control part CTL.

  The syringe 20 in which the liquid resin 32 is stored is connected to the push-out mechanism 19 by a syringe mounting screw 33. The plunger 27 is inserted into the syringe 20 so that the outer diameter of the plunger 27 matches the inner diameter of the syringe 20. Around the plunger 27, an O-ring (not shown) which is a sealing material is attached. By controlling the rotation of the servo motor 23, the movement amount (stroke amount) of the plunger 27 is controlled. The discharge amount of the liquid resin 32 discharged from the dispenser 15 (discharge portion 17) is set by the product of the inner cross-sectional area of the syringe 20 and the movement amount of the plunger 27. By exchanging the syringe 20, the amount of the liquid resin 32 stored in the dispenser 15 can be arbitrarily set.

  As shown in FIGS. 2B and 3, the discharge portion 17 includes a nozzle 22 having a discharge port 34, a joint 35 attached to the discharge port 34, and an elastically deformable tube fitted into the joint 35. 36. As a material of the joint 35, for example, heat-resistant polyethylene, polypropylene, polyvinylidene fluoride (PVDF), or the like is used. As the tube 36, for example, silicone rubber or fluororubber having flexibility and heat resistance is used.

  As shown in FIG. 2A and FIG. 3, in the dispenser 15, clampers 18 that can move with the tube 36 interposed are provided on both sides of the tube 36. The clamper 18 includes a pair of roller support members 37 and 38. The roller support member 37 includes, for example, one bar-shaped member 37a along the Y direction, two bar-shaped members 37b connected to both ends of the bar-shaped member 37a along the X direction, and each bar-shaped member 37b connected to the Z-direction. And two rod-shaped members 37c along the line. Similarly, the roller support member 38 is connected to one rod-shaped member 38a along the Y direction, two rod-shaped members 38b connected to both ends of the rod-shaped member 38a along the X direction, and the respective rod-shaped members 38b. It is comprised by the two rod-shaped members 38c along a direction.

  Rollers 39 and 40 are rotatably attached to roller support members 37 and 38 constituting the clamper 18, respectively. That is, the rollers 39 and 40 are rotatably supported by the roller support members 37 and 38, respectively. The roller 39 is fitted into a rod-shaped member 37a constituting the clamper 18, moved in the X direction by the rod-shaped member 37b, and moved in the Z direction by the rod-shaped member 37c. Similarly, the roller 40 is fitted into the rod-shaped member 38a constituting the clamper 18, moved in the X direction by the rod-shaped member 38b, and moved in the Z direction by the rod-shaped member 38c.

  As shown in FIG. 3, the two rod-shaped members 37 c constituting the clamper 18 are connected to the connection member 41. The connecting member 41 is connected to a moving mechanism 42 that moves the roller support member 37 in the X direction, and is connected to a moving mechanism 43 that moves the bar-shaped member 37 in the Z direction. Similarly, the two rod-shaped members 38 c constituting the clamper 18 are connected to the connection member 44. The connecting member 44 is connected to a moving mechanism 45 that moves the rod-shaped member 38 in the X direction, and is connected to a moving mechanism 46 that moves the rod-shaped member 38 in the Z direction.

  The moving mechanisms 42, 43, 45, 46 are configured by a combination of a drive source and a transmission member. For example, a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a rod, or the like is used as the moving mechanism. The moving mechanism is not limited to the above-described configuration, and may be any configuration that can move the roller support members 37 and 38 in the X direction and the Z direction, respectively.

  As shown in FIG. 2A and FIG. 3, the liquid resin 32 stored in the syringe 20 is pushed out by the plunger 27, and the resin passage 47 formed in the connecting portion 21 and the discharge formed in the nozzle 22. It discharges downward from the discharge part 17 via the tube 36 inserted in the exit 34 and the joint 35, respectively.

(Liquid resin discharge method and resin molded product manufacturing method)
Hereinafter, the liquid resin discharging method and the resin molded product manufacturing method will be described together with the description of the operation of the resin molding apparatus 1 including the dispenser 15 which is a discharging apparatus. After describing the discharge method using the dispenser 15, a method for manufacturing a resin molded product using the overall resin molding apparatus 1 will be described.

(Liquid resin discharge method (extrusion process and handling process)
2-4, the dispenser 15 includes a step of extruding the liquid resin 32 and a step of excluding the residual resin remaining in the tube 36 by the clamper 18, that is, a discharge method including an extruding step of the liquid resin and an excluding step. (Discharge process) will be described.

  As shown in FIG. 2A, in the extrusion process, the servo motor 23 is rotated to move the plunger 27 in the −Y direction via the ball screw 24, the slider 25, and the rod 26. By moving the plunger 23 in the −Y direction, the liquid resin 32 stored in the syringe 20 is pressed, and the liquid resin 32 is pushed out in the −Y direction.

  As shown in FIG. 3 and FIG. 4A, the liquid resin 32 pushed out by the plunger 27 passes downward from the discharge part 17 (the tip of the tube 36) via the connecting part 21, the nozzle 22, and the tube 36, respectively. Discharged.

  By starting the discharge of the dispenser 15 (starting the pushing operation of the plunger 27), the liquid resin is discharged from the discharge portion 17 (the tip of the tube 36) onto the discharge target. When the plunger 27 presses the liquid resin 32, pressure is applied to the liquid resin 32 in the syringe 20, and the resin pressure of the liquid resin 32 increases. Even if the discharge of the dispenser 15 is stopped (the pushing operation of the plunger 27 is stopped), the liquid resin 32 in the syringe 20 maintains the state where the resin pressure is increased. Until the resin pressure of the liquid resin 32 in the syringe 20 reaches atmospheric pressure, the discharge of the liquid resin from the discharge unit 17 to the discharge target is continued by the resin pressure of the liquid resin 32. As a so-called dripping phenomenon, the liquid resin hangs down from the discharge portion 17 to the discharge target (discharge continues).

  In order to make the handling process in the discharge process of the liquid resin easy to understand, as shown in FIG. 4A, the liquid stored in the syringe 20 is conveniently stored immediately after the pushing operation of the plunger 27 is stopped. The resin is called the liquid resin 32, the liquid resin remaining in the tube 36 is called the residual resin 48, and the liquid resin hanging from the tip of the tube 36 is called the dripping resin 49.

  4A to 4D, by using the clamper 18 provided in the discharge portion 17 of the dispenser 15, the residual resin 48 remaining in the tube 36 and the tip of the tube 36 hang down. A handling process in which the dripping resin 49 is handled to complete the discharge at an early stage will be described.

  First, as shown in FIG. 4A, in the state where the dripping phenomenon occurs by stopping the discharge of the dispenser 15 (stopping the pushing operation of the plunger 27), for example, the pushing operation of the plunger 27 is stopped. 5 seconds after that, the clamper 18 is lowered to a predetermined position outside the tube 36. Specifically, the rollers 39 and 40 are stopped at predetermined positions outside the tube 36 by lowering the roller support members 37 and 38 using the moving mechanisms 43 and 46 (see FIG. 3B).

  Next, as shown in FIG. 4B, the tube 36 is sandwiched from both sides by the clamper 18. Specifically, the roller support member 37 is moved in the −X direction using the moving mechanism 42 (see FIG. 3B), and the roller is moved using the moving mechanism 45 (see FIG. 3B). The support member 38 is moved in the + X direction. Thus, the tube 36 is sandwiched from both sides by the roller 39 and the roller 40, and the passage of the liquid resin (residual resin 48) in the tube 36 is closed.

  Next, as shown in FIG. 4C, the clamper 18 is lowered by a predetermined stroke amount with the tube 36 sandwiched from both sides by the clamper 18 (rollers 39, 40). Specifically, the roller support members 37 and 38 are lowered using the moving mechanisms 43 and 46 (see FIG. 3B). While the tube 36 is sandwiched between the rollers 39 and 40, the rollers 39 and 40 are lowered while being rotated. As a result, the residual resin 48 remaining downward from the position where the tube 36 is sandwiched by the rollers 39, 40 and the dripping resin 49 hanging down from the tip of the tube 36 are forcibly handled by the clamper 18.

  For example, when a low-viscosity liquid resin is used by the process of handling the liquid resin by the clamper 18, the clamper 18 is lowered to hang down from the residual resin 48 remaining in the tube 36 and the tip of the tube 36. Almost all of the dripping resin 49 can be handled. Further, when a high viscosity liquid resin is used, a slight amount of string-like residual resin 50 may remain as shown in FIG. However, since this string-like residual resin 50 falls in a short time, there is no significant time loss. By performing the liquid resin handling process by the clamper 18, the liquid resin can be discharged at an early stage. As described above, the discharge process can be completed.

  After the state where the string-like residual resin 50 is connected to the discharge target is eliminated, a dish-shaped resin receiving member is disposed below the string-like residual resin 50, and the string-like resin is received by the resin receiving member. In a state where the residual resin 50 is received, the dispenser 15 may be moved relative to the discharge target and retracted as described later.

  Next, as shown in FIG. 4D, the clamper 18 is moved away from the tube 36 and returned to the original position. As a result, the tube 36 is released from the elastically deformed state and returns to the initial state. The tube 36 returns to the initial state filled with the liquid resin 32 as time passes. In the vicinity of the lower end portion of the tube 36, there may be a space where the liquid resin 32 does not exist due to the surface tension of the liquid resin 32.

(Production method of resin molded products)
With reference to FIG. 1 and FIG. 5, the manufacturing method of the resin molded product in the case of resin-sealing the semiconductor chip with which the resin molding apparatus 1 was mounted | worn with a board | substrate is demonstrated. The case where the molding module 3B is used as the operation of the resin molding apparatus 1 will be described.

  First, as shown in FIG. 1, the pre-sealing substrate 5 on which a plurality of semiconductor chips 51 (see FIG. 5A) is mounted is sealed with the surface on which the semiconductor chips 51 are mounted facing down. The pre-sealing substrate 5 is sent from the front substrate supply unit 6 to the substrate mounting unit 9. Next, the substrate transport mechanism 10 is moved from the predetermined position S <b> 1 in the −Y direction to receive the pre-sealing substrate 5 from the substrate platform 9. The substrate transport mechanism 10 is returned to the predetermined position S1.

  Next, for example, the substrate transport mechanism 10 is moved in the + X direction to the predetermined position M1 of the molding module 3B. Next, in the molding module 3 </ b> B, the substrate transport mechanism 10 is moved in the −Y direction and stopped at a predetermined position C <b> 1 above the lower mold 11. Next, the substrate transport mechanism 10 is raised and the pre-sealing substrate 5 is fixed to the mold surface of the upper mold 52 by suction or clamping (see FIG. 5A). The upper mold 52 and the lower mold 11 together constitute a molding mold 53. The substrate transport mechanism 10 is returned to the predetermined position S1 of the substrate supply / storage module 2.

  Next, in the molding module 3 </ b> B, a long release film 54 (see FIG. 5A) is supplied from the release film supply mechanism 14 to the lower mold 11. Next, the release film 54 is adsorbed along the mold surface of the cavity 13 by an adsorption mechanism (not shown) provided in the lower mold 11.

  Next, the dispenser 15 is moved in the −X direction to the predetermined position M1 of the molding module 3B using the resin transport mechanism 16. Next, in the molding module 3B, the resin transport mechanism 16 is moved in the −Y direction to stop the dispenser 15 at a predetermined position C1 above the lower mold 11 (see FIG. 5A).

  As shown in FIG. 5A, the dispenser 15 is disposed at a predetermined position between the upper mold 52 and the lower mold 11 by the resin transport mechanism 16. The liquid resin 32 is discharged from the discharge portion 17 provided at the tip of the dispenser 15 into the cavity 13. In this case, the cavity 13 of the lower mold 11 is a discharge target from which the liquid resin 32 is discharged. Residual resin 48 in the tube 36 attached to the discharge part 17 and the dripping resin 49 hanging down from the tip of the tube 36 are handled by the clamper 18 (see FIG. 4). By this discharge process, the liquid resin can be discharged into the cavity 13 at an early stage. Using the resin transport mechanism 16, the dispenser 15 is returned to the predetermined position M1.

  Next, as shown in FIG. 5B, the liquid resin 32 is heated and melted to produce a fluid resin 55 having a reduced viscosity. The lower mold 11 is raised using the mold clamping mechanism 12 (see FIG. 1), and the upper mold 52 and the lower mold 11 are clamped. By clamping the mold, the semiconductor chip 51 mounted on the pre-sealing substrate 5 is immersed in the fluid resin 55 generated in the cavity 13. At this time, a predetermined resin pressure can be applied to the fluid resin 55 in the cavity 13 using a cavity bottom member (not shown) provided in the lower mold 11.

  In the process of clamping, the inside of the cavity 13 may be sucked using a vacuuming mechanism (not shown). As a result, air remaining in the cavity 13 or bubbles contained in the fluid resin 55 are discharged to the outside of the mold 53. In addition, the inside of the cavity 13 is set to a predetermined degree of vacuum.

  Next, using a heater (not shown) provided in the lower mold 11, the fluid resin 55 is heated for a time required to cure the fluid resin 55. The fluid resin 55 is cured to form the cured resin 56. As a result, the semiconductor chip 51 mounted on the pre-sealing substrate 5 is resin-sealed with the cured resin 56 molded corresponding to the shape of the cavity 13. In this way, the resin molding process can be performed.

  Next, as shown in FIG. 5C, after the fluid resin 55 is cured, the upper mold 52 and the lower mold 11 are opened using the mold clamping mechanism 12. On the mold surface of the upper mold 52, a resin molded product 57 (sealed substrate 7) sealed with resin is fixed.

  Next, the substrate transport mechanism 10 is moved from a predetermined position S1 of the substrate supply / storage module 2 to a predetermined position C1 above the lower mold 11 to receive the sealed substrate 7. Next, the substrate transport mechanism 10 is moved to deliver the sealed substrate 7 to the substrate platform 9. The sealed substrate 7 is stored in the sealed substrate storage portion 8 from the substrate mounting portion 9. At this stage, resin sealing is completed.

  The resin molded product 57 (sealed substrate 7) may be cut into each region where the semiconductor chip 51 is mounted, so that each of the cut regions may be a product. Further, by cutting a part of the region where the semiconductor chip 51 is mounted, the part of the region may become a product. Furthermore, the resin molded product 57 itself may be one product.

(Function and effect)
The dispenser 15 that is the discharge device of the present embodiment includes a syringe 20 that is a storage unit that stores a liquid resin 32 that is a fluid resin, a mechanism that includes at least a plunger 27 that is an extrusion mechanism that extrudes the liquid resin 32, and a syringe. 20, a discharge unit 17 that discharges the liquid resin 32, an elastically deformable tube 36 attached to the discharge unit 17, a clamper 18 that is movable with the tube 36 interposed therebetween, and a movement amount of the clamper 18 is controlled. The control unit 31 is provided.

  With such a configuration, the tube 36 attached to the discharge portion 17 of the dispenser 15 is sandwiched by the clamper 18 and the clamper 18 is lowered so that the residual resin 48 remaining in the tube 36 is forced by the clamper 18. Can be handled. Thereby, the liquid resin can be discharged from the discharge portion 17 of the dispenser 15 at an early stage. That is, it is possible to shorten the time required for the discharge process of the fluid resin such as the liquid resin. Therefore, it is possible to improve the productivity of the resin molded product manufactured by performing the discharge process of the fluid resin.

  The discharge method of the present embodiment is an elastically deformable tube 36 attached to the discharge unit 17 connected to the syringe 20 by extruding a liquid resin 32 that is a fluid resin stored in the syringe 20 that is a storage unit. And an extruding step for extruding the residual resin 48 remaining in the tube 36 by sandwiching the tube 36 between the clampers 18 and moving the clamper 18 downward.

  According to this method, the resin 36 remaining in the tube 36 is forcibly handled by the clamper 18 by sandwiching the tube 36 attached to the discharge portion 17 of the dispenser 15 with the clamper 18 and lowering the clamper 18. be able to. Thereby, the liquid resin can be discharged from the discharge portion 17 of the dispenser 15 at an early stage. That is, it is possible to shorten the time required for the discharge process of the fluid resin such as the liquid resin. Therefore, the productivity of the resin molded product manufactured by discharging the fluid resin can be improved.

  According to the present embodiment, the elastically deformable tube 36 is attached to the discharge portion 17 of the dispenser 15. On both sides of the tube 36, a clamper 18 is provided that is movable with the tube 36 interposed therebetween. Even if a dripping phenomenon occurs from the discharge portion 17 of the dispenser 15, the resin 36 that hangs down from the tip of the tube 36 and the residual resin 48 remaining in the tube 36 by sandwiching the tube 36 with the clamper 18 and lowering the clamper 18. The resin 49 can be forcibly handled by the clamper 18.

  According to the present embodiment, instead of waiting for the liquid resin remaining in the discharge portion 17 of the dispenser 15 to hang down, it is forcibly handled using the clamper 18. Thereby, the time for discharging the liquid resin can be shortened. Therefore, the production efficiency of the dispenser 15 can be improved. And the productivity of the resin molding apparatus 1 can be improved.

  According to the present embodiment, the residual resin 48 remaining in the tube 36 and the dripping resin 49 hanging down from the tip of the tube 36 are forcibly handled by the clamper 18, and the time required for the discharge process can be shortened. . Accordingly, it is possible to suppress the dripping resin 49 from being scattered on the component parts around the cavity 13 that is the discharge target by leaving the dripping resin 49 left. Therefore, it can suppress that the resin molding apparatus 1 is contaminated with the scattered resin. Moreover, it can suppress that the resin which scattered is hardened | cured and the malfunctioning of the resin molding apparatus 1 generate | occur | produces.

  According to the present embodiment, the liquid resin can be discharged into the cavity 13 at an early stage without leaving the dripping resin 49 for a long time using the clamper 18. Therefore, it is possible to suppress variations in the distribution and thickness of the liquid resin supplied into the cavity 13. Thereby, the dispersion | variation in the resin thickness of the resin molded product 57 resin-sealed can be reduced. In addition, appearance defects such as flow marks can be reduced.

  In this embodiment, after the dispenser 15 stops the discharge operation (the plunger 27 stops the pushing operation), the clamper 18 sandwiches the tube 36 and the residual resin 48 in the tube 36 is handled. However, the operation of clamping the tube 36 by the clamper 18 may be performed at the same time as the plunger 27 stops the pushing operation, or may be performed just before the plunger 27 stops the pushing operation.

  In the present embodiment, the configuration including the substrate supply / storage module 2, the three molding modules 3 </ b> A, 3 </ b> B, and 3 </ b> C and the resin supply module 4 has been described as the resin molding apparatus 1. The resin molding apparatus is not limited to this configuration, and may be any apparatus that has at least a molding die, a discharge device that discharges a liquid resin, and a mold clamping mechanism that clamps the molding die and has a function of performing resin molding. good.

[Embodiment 2]
(Dispenser modification 1)
With reference to FIG. 6, the dispenser used in Embodiment 2 is demonstrated. The difference from the first embodiment is that the structure of the clamper is changed in the dispenser. Since other configurations are the same as those in the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 6, in the dispenser 58, clampers 59 are provided on both sides of the tube 36 so as to be movable with the tube 36 interposed therebetween. The clamper 59 is constituted by a pair of roller support members 60 and 61. The roller support member 60 includes a single bar-shaped member 60a along the Y direction, a single bar-shaped member 60b connected to one end of the bar-shaped member 60a along the X direction, and a single bar-shaped member 60b connected along the Z direction along the Z direction. The rod-shaped member 60c. Similarly, the roller support member 61 is connected to one bar-shaped member 61a along the Y direction, one bar-shaped member 61b connected to one end of the bar-shaped member 61a along the X direction, and connected to the bar-shaped member 61b in the Z direction. It is comprised by the one bar-shaped member 61c which follows.

  Similarly to the first embodiment, rollers 39 and 40 are rotatably attached to roller support members 60 and 61 constituting the clamper 59, respectively. That is, the rollers 39 and 40 are rotatably supported by the roller support members 60 and 61, respectively. The roller 39 is fitted into a rod-shaped member 60a constituting the clamper 59, moved in the X direction by the rod-shaped member 60b, and moved in the Z direction by the rod-shaped member 60c. Similarly, the roller 40 is fitted into a bar-shaped member 61a constituting the clamper 59, moved in the X direction by the bar-shaped member 61b, and moved in the Z direction by the bar-shaped member 61c.

  One rod-shaped member 60 c constituting the clamper 59 is connected to the connection member 62. The connecting member 62 is connected to a moving mechanism 42 that moves the roller support member 60 in the X direction, and is connected to a moving mechanism 43 that moves the roller support member 60 in the Z direction. Similarly, one bar-shaped member 61 c constituting the clamper 59 is connected to the connection member 63. The connecting member 63 is connected to a moving mechanism 45 that moves the roller support member 61 in the X direction, and is connected to a moving mechanism 46 that moves the roller support member 61 in the Z direction.

  The operation of sandwiching the tube 36 from both sides by the clamper 59 and lowering the rollers 39 and 40 while rotating is the same as in the first embodiment. Therefore, as in the first embodiment, the residual resin 48 remaining in the tube 36 can be forcibly handled by the clamper 59. Thereby, the liquid resin can be discharged from the discharge part 17 of the dispenser 59 at an early stage.

  According to the present embodiment, in the dispenser 58, the roller support members 60 and 61 constituting the clamper 59 are configured by one bar-shaped member 60a, 60b, 60c and 61a, 61b, 61c, respectively. Therefore, the structure of the clamper 59 can be further simplified, and the cost of the dispenser 58 can be reduced.

  In the present embodiment, in the dispenser 58, the roller support members 60 and 61 (specifically, the rollers 39 and 40) constituting the clamper 59 are arranged in parallel, and the tube 36 is sandwiched from both sides. For example, the tube 36 may be sandwiched between roller support members (rollers) that are open on both sides around a fulcrum, such as scissors. With such a configuration, it is possible to simplify the operation of the clamper and further simplify the movement mechanism of the clamper.

[Embodiment 3]
(Dispenser modification 2)
With reference to FIG. 7, the dispenser used in Embodiment 3 is demonstrated. The difference from the first embodiment is that, in the dispenser, regarding the clamper, a roller support member and a roller are provided on one side, and a fixed plate fixed to the discharge unit is provided on the other side. Since other configurations are the same as those in the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 7, in the dispenser 64, the discharge unit 65 includes a nozzle 22 having a discharge port 34, a joint 35 attached to the discharge port 34, and an elastically deformable tube 36 fitted into the joint 35. And a fixed plate 66 fixed to the nozzle 22. The fixed plate 66 and the tube 36 are disposed in the discharge portion 65 so as to be in contact with each other.

  On the opposite side of the fixed plate 66, a clamper 67 that is movable with the tube 36 interposed therebetween is provided. The clamper 67 is configured using the same roller support member 37 shown in the first embodiment. The roller support member 37 is connected to both ends of the bar member 37a along the Y direction, two bar members 37b along the X direction connected to both ends of the bar member 37a, and connected to the respective bar members 37b along the Z direction. It is comprised by the two rod-shaped members 37c. The fixed plate 66 can also be considered to function as a clamper.

  A roller 39 is rotatably attached to the roller support member 37 constituting the clamper 67. That is, the roller 39 is rotatably supported by the roller support member 37. The roller 39 is fitted into a rod-shaped member 37a constituting the clamper 67, moves in the X direction by the rod-shaped member 37b, and moves in the Z direction by the rod-shaped member 37c. Since the configuration and operation of the connecting member 41 and the moving mechanisms 42 and 43 are the same as those in the first embodiment, description thereof is omitted.

  With reference to FIG.7 (c), the process of handling the residual resin which remains in the tube 36 with the clamper 67 is demonstrated. First, the clamper 67 is lowered to a predetermined position outside the tube 36 using the moving mechanism 43. Next, the clamper 67 is moved in the −X direction using the moving mechanism 42, and the tube 36 is sandwiched between the clamper 67 (roller 39) and the fixed plate 66. Next, the clamper 67 is lowered while the tube 36 is sandwiched between the clamper 67 and the fixing plate 66. Thus, the residual resin remaining downward from the position where the tube 36 is sandwiched by the roller 39 and the dripping resin hanging down from the tip of the tube 36 are forcibly handled.

  According to the present embodiment, in the dispenser 64, the fixed plate 66 is fixed to the discharge portion 65, and the clamper 67 that can move with the tube 36 interposed is provided on the opposite side of the fixed plate 66. By sandwiching the tube 36 between the fixing plate 66 and the clamper 67 and lowering the roller 39 while rotating it, the residual resin remaining in the tube 36 can be forcibly handled by the clamper 67. Thereby, the liquid resin can be discharged from the discharge portion 65 of the dispenser 64 at an early stage.

  According to the present embodiment, the dispenser 64 is provided with the clamp plate 67 and the clamper 67 that can move with the fixing plate 66 and the tube 36 interposed therebetween. Since the clamper 67 is provided only on one side, the number of moving mechanisms can be halved compared to the first embodiment. Therefore, the configuration of the clamp mechanism including the clamper can be further simplified, and the cost of the dispenser 64 can be further reduced.

[Embodiment 4]
Embodiment 4 demonstrates the structure which controls the movement amount which moves a clamper by a control part corresponding to the residual amount of fluid resin in a storage part in the said embodiment. Also, a method for controlling the movement amount of the clamper in accordance with the remaining amount of the fluid resin in the storage portion in the handling step will be described.

  Moreover, in the said embodiment, the case where it discharges with respect to several discharge target object, in other words, the case where a series of an extrusion process and a handling process are repeated in multiple times is demonstrated. Here, the amount of movement of the clamper is controlled by the control unit in accordance with the remaining amount of the fluid resin in the storage unit. Further, the storage amount of the fluid resin in the storage unit is an amount corresponding to a plurality of discharge objects, and the movement amount of the clamper by the control unit is a different method for at least two of the plurality of discharge objects. .

(Comparative example)
Prior to the description of this embodiment, as a comparative example, variations in the amount of discharged resin in a conventional dispenser will be described.

  In the conventional dispenser, when the amount of discharged resin after a certain time from the start of discharge is examined, the amount of discharged resin discharged to the discharge object differs according to the amount of liquid resin in the syringe.

  This phenomenon will be described with reference to FIG. As shown in FIG. 8, the conventional dispenser is not provided with the tube 36 and the clamper 18. 8A shows a state in which the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is larger than the others, and FIG. 8B shows the resin amount of the liquid resin 32 remaining in the syringe 20. FIG. 8C shows a state where the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is small compared to the others.

  In any of FIGS. 8A to 8C, the plunger 27 is pushed out with the same movement amount, and the liquid resin 32 in the syringe 20 is discharged from the discharge port of the discharge unit 17, and if the time has passed sufficiently, A resin amount corresponding to the amount of movement of the plunger 27 is discharged.

  However, when the amount of discharged resin after a relatively short time has elapsed after the pushing operation of the plunger 27 is stopped, for example, in the case of FIGS. 8A to 8C, (A) is the most. Less, (C) was the most, and (B) was between them.

  This phenomenon is considered as follows. For example, in any state of FIGS. 8A to 8C, when the plunger 27 is pushed out with the same movement amount, the liquid resin 32 in the syringe 20 is compressed and stress is generated in the syringe 20. This stress is reduced by discharging the liquid resin 32 from the discharge port of the discharge unit 17. Even when the pushing operation of the plunger 27 is stopped, the liquid resin 32 tries to return to the original state from the compressed state, so that the resin discharge from the discharge portion 17 is continued.

  Here, the time until the compressed liquid resin 32 returns to the original state, that is, the time until the stress in the syringe 20 generated by the pushing operation of the plunger 27 is eliminated is the time for the liquid resin 32 remaining in the syringe 20. Depends on the amount of resin. In this case, for example, in the case of FIGS. 8A to 8C, (A) is the longest, (C) is the shortest, and (B) is between them.

  Therefore, the resin amount of the liquid resin 32 discharged from the discharge port of the discharge portion 17 in a fixed time from the start of the pushing operation of the plunger 27 to the time before the stress in the syringe 20 generated by this operation disappears. Also depends on the amount of liquid resin 32 remaining in the syringe 20. For example, in the case of FIGS. 8A to 8C, the discharge resin amount at this fixed time is the smallest (A), the largest (C), and the (B) between them. Become.

  As described above, when the conventional dispenser of the comparative example is used, even if the movement amount of the plunger 27 in the pushing operation of the plunger 27 is set constant, the actual discharge resin amount is the liquid resin in the syringe 20. It turned out to be dependent on the remaining amount of 32. Then, it can be understood that a considerable amount of time is required to discharge the set discharge amount (weight) due to the occurrence of the dripping phenomenon. As described above, when a conventional dispenser is used, it takes a very long time to discharge the set liquid resin discharge amount.

(Preliminary experiment)
Next, as a preliminary experiment, with reference to FIGS. 9 to 10, for example, even when the resin amount of the liquid resin 32 remaining in the syringe 20 is changed using the dispenser 15 shown in FIG. A method for discharging a constant discharge amount set from 17 at an early stage will be described.

  As shown in the first embodiment, the tube 36 attached to the discharge unit 17 of the dispenser 15 is sandwiched by the clamper 18 and the clamper 18 is lowered, so that the residual resin 48 remaining in the tube 36 and the tip of the tube 36 are removed. The dripping resin 49 that hangs down can be forcibly handled by the clamper 18.

  However, as described with reference to FIG. 8, it has been found that the discharge amount of the liquid resin discharged from the discharge portion 17 of the dispenser depends on the resin amount of the liquid resin 32 remaining in the syringe 20. In the present embodiment, the discharge unit 17 is controlled by controlling the position at which the tube 36 is sandwiched by the clamper 18 and the stroke amount for moving the clamper 18 in accordance with the resin amount of the liquid resin 32 remaining in the syringe 20. A method for discharging a predetermined discharge amount set from the above at an early stage will be described.

  As shown in FIGS. 9 to 10, for example, in the dispenser 15, the state in which the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is larger than the other (A), the liquid resin remaining in the syringe 20. The state in which the value of the resin amount of 32 is medium compared to the other (B), and the state of the resin amount of the liquid resin 32 remaining in the syringe 20 is smaller than the other (C). The position where the clamper 18 is lowered to sandwich the tube 36 and the stroke amount for moving the clamper 18 are adjusted. Each of FIGS. 9A to 9C corresponds to FIGS. 8A to 8C.

  As shown in FIG. 10A, in the state (A) where the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is larger than the others (A), the clamper 18 is lowered to the position P1, and the tube 36 Is inserted. In this state, the clamper 18 is lowered by a predetermined stroke amount L1 from the position P1 to the position P4 at the lower end of the tube 36, and the residual resin 48 remaining in the tube 36 and the dripping resin dripping from the tip of the tube 36. 49 is forcibly handled by the clamper 18.

  Similarly, as shown in FIG. 10 (b), in the state (B) in which the amount of the liquid resin 32 remaining in the syringe 20 is medium compared with the other, the clamper 18 is moved to the position P2. The tube 36 is sandwiched by lowering. In this state, the clamper 18 is lowered from the position P2 to the position P4 at the lower end of the tube 36 by a predetermined stroke amount L2, and the residual resin 48 in the tube 36 and the dripping resin 49 hanging from the tube 36 are removed. To force it out. In this case, the relationship between the stroke amounts L2 and L1 for lowering the clamper 18 is L2 <L1.

  Similarly, as shown in FIG. 10C, when the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is smaller than the other (C), the clamper 18 is lowered to the position P3. And sandwich the tube 36. In this state, the clamper 18 is lowered from the position P3 to the position P4 at the lower end of the tube 36 by a predetermined stroke amount L3, and the residual resin 48 in the tube 36 and the dripping resin 49 hanging from the tube 36 are removed. To force it out. In this case, the relationship between the stroke amounts L3, L2, and L1 for lowering the clamper 18 is L3 <L2 <L1.

  Here, the position P4 at which the lowering of the clamper 18 in the state where the tube 36 is sandwiched is stopped is the same, and the stroke amount for moving the clamper 18 is changed by changing the position where the clamper 18 sandwiches the tube 36. Is preferred. If it does so, it can reduce that the state after handling operation | movement varies, and the stable discharge process can be performed. Therefore, it becomes possible to discharge a predetermined discharge amount (weight) set from the discharge unit 17 of the dispenser 15 at an early stage. Thereby, even if the resin amount of the liquid resin 32 remaining in the syringe 20 changes, a constant and constant discharge amount can be discharged early.

(Device configuration)
In the present embodiment, any of the configurations of the first to third embodiments can be adopted, but here, a case where the dispenser 15 of the first embodiment is used will be described in correspondence with the explanation of the preliminary experiment.

  In the apparatus configuration, the difference from the first embodiment is that the control unit 31 (see FIG. 2) moves the clamper 18 in accordance with the remaining amount of the liquid resin 32 that is the flowable resin in the syringe 20 that is the storage unit. It is a point that controls the amount of movement. Furthermore, the storage amount of the liquid resin 23 in the syringe 20 is an amount corresponding to a plurality of discharge objects, and the movement amount of the clamper 18 by the control unit 31 is different from at least two of the plurality of discharge objects. This is also different from the first embodiment.

(Liquid resin discharge method)
The difference from the first embodiment in the liquid resin discharge method is that, for example, a movement amount for moving the clamper 18 corresponding to the remaining amount of the liquid resin 32 in the syringe 20 experimentally in advance as in the preliminary experiment, for example. Is set in advance.

  Thereafter, when the discharge process is performed on a plurality of discharge objects, for example, similarly to the preliminary experiment, each corresponds to (A), (B), (C) in FIGS. Discharge to discharge object.

  Since the liquid resin 32 is discharged onto a plurality of discharge objects, the extrusion process and the handling process of the liquid resin 32 are repeated a plurality of times. At this time, for example, similarly to the preliminary experiment, the stroke amount of the clamper 18 in a plurality of handling steps is varied corresponding to (A), (B), and (C) in FIGS.

  Here, when the amount of discharged resin is controlled with high accuracy, the stroke amount of the clamper 18 may be varied for each discharge target, that is, for each discharge step. If accuracy is not required for controlling the amount of discharged resin, at least two discharge objects, that is, at least two discharge processes can be performed without changing the stroke amount of the clamper 18 for each discharge object, that is, for each discharge process. On the other hand, the stroke amount of the clamper 18 may be varied.

  The method for manufacturing the resin molded product is basically the same as that of the first embodiment, and a plurality of discharge processes corresponding to a plurality of discharge objects may be performed as described herein. At this time, the number of resin molding steps can be the same as the number of discharge objects or the number of discharge steps.

  In the present embodiment, the amount of movement for moving the clamper is controlled in accordance with the remaining amount of the fluid resin in the syringe that is the reservoir. Further, the storage amount that is the remaining amount of the fluid resin in the syringe that is the storage portion is an amount corresponding to the plurality of discharge objects, and the movement amount of the clamper by the control unit is at least two of the plurality of discharge objects. Is different.

  In the present embodiment, in the handling step, the movement amount of the clamper is controlled in accordance with the remaining amount of the fluid resin in the syringe that is the reservoir. Further, the extrusion process and the handling process are repeated a plurality of times, and the amount of movement of the clamper is made different for at least two of the plurality of handling processes.

  More specifically, according to the present embodiment, the elastically deformable tube 36 is attached to the discharge portion 17 of the dispenser 15, and the clamper 18 that is movable with the tube 36 interposed is provided on both sides of the tube 36. The positions P1, P2, P3 at which the clamper 18 sandwiches the tube 36 and the stroke amounts L1, L2, L3 for moving the clamper 18 are controlled by the resin amount of the liquid resin 32 remaining in the syringe 20, respectively. As a result, even if the amount of the liquid resin 32 remaining in the syringe 20 changes, a certain liquid resin can be discharged from the discharge portion 17. Therefore, a certain liquid resin can be stably and quickly discharged from the discharge portion 17 without depending on the resin amount of the liquid resin 32 remaining in the syringe 20. That is, in addition to shortening the time required for the discharge process of the fluid resin such as the liquid resin, it is possible to increase the accuracy of the discharge amount of the fluid resin. Therefore, it is possible to improve the productivity and the stability of the quality of the resin molded product manufactured by discharging the fluid resin.

  In the present embodiment, the resin amount of the liquid resin 32 remaining in the syringe 20 is divided into three stages (A), (B), and (C), and the positions P1, P2, P3, and the positions where the clamper 18 sandwiches the tube 36. The stroke amounts L1, L2, and L3 for moving the clamper 18 were controlled in three stages. However, the position of the clamper 18 sandwiching the tube 36 and the clamper 18 by further finely dividing the resin amount of the liquid resin 32 remaining in the syringe 20 according to the storage amount of the liquid resin stored in the syringe 20. Further, the stroke amount for moving each may be further finely controlled.

  The diameter and length of the tube 36 attached to the discharge part 17 of the dispenser 15 can be arbitrarily set. If the diameter of the tube 36 is large, the liquid resin can be discharged early. By reducing the diameter of the tube 36 and increasing the length of the tube 36 to increase the stroke amount for moving the clamper 18, the volume of crushing the tube 36 can be controlled with higher accuracy. Therefore, the discharge amount of the discharged liquid resin can be controlled with higher accuracy. The diameter and length of the tube 36 can be optimized in consideration of productivity, the viscosity of the liquid resin, the discharge amount, and the like.

[Embodiment 5]
With reference to FIGS. 11-14, the structure of the resin molding apparatus of Embodiment 5 and the manufacturing method of a resin molded product are demonstrated. The difference from the resin molding apparatus 1 of the first embodiment is that the object to be resin-molded is a circular wafer, and the liquid resin is discharged from the discharge object to the molding die. That is. Since other configurations and operations are the same as those of the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

(Configuration of resin molding equipment)
With reference to FIG. 11, the structure of the resin molding apparatus of Embodiment 5 is demonstrated. As shown in FIG. 11, the resin molding apparatus 68 includes a wafer supply / storage module 69, three molding modules 3A, 3B, and 3C, and a resin supply module 4 as components. The wafer supply / storage module 69, the molding modules 3A, 3B, and 3C, and the resin supply module 4, which are constituent elements, can be attached to and detached from each other and exchanged with each other. be able to.

  The wafer supply / storage module 69 includes a pre-sealing wafer supply unit 71 that supplies a pre-sealing wafer 70, a sealed wafer storage unit 73 that stores a sealed wafer 72, a pre-sealing wafer 70, and a sealing A wafer placement unit 74 that delivers the stopped wafer 72 and a wafer transfer mechanism 75 that transfers the pre-sealing wafer 70 and the sealed wafer 72 are provided. In addition, as a wafer before sealing, for example, a wafer in which a plurality of semiconductor chips are mounted on a wafer as a support member, a wafer in which a semiconductor pre-process (diffusion process and wiring process) is completed, or a wafer in which a semiconductor pre-process is completed There are wafers on which rewiring is formed.

  Each molding module 3A, 3B, 3C is provided with a lower mold 11 that can be moved up and down, and an upper mold 52 (see FIG. 14) arranged to face the lower mold 11. The upper mold 52 and the lower mold 11 together constitute a molding mold 53. Each of the molding modules 3A, 3B, and 3C includes a mold clamping mechanism 12 that clamps and opens the upper mold 52 and the lower mold 11 (a circular portion indicated by a two-dot chain line in the drawing). A circular cavity 76 is provided in the lower mold 11 to be a space where the liquid resin is supplied and cured.

  The resin supply module 4 is provided with a table 77 and a release film supply mechanism 78 for supplying a release film (see FIG. 12) to the table 77. On the release film supplied to the table 77, a resin containing frame 79 having a circular through hole is placed. The release film and the resin housing frame 79 are integrated to form a resin housing portion (see FIG. 12) that houses the liquid resin discharged from the dispenser 15 (see FIG. 2). The resin supply module 4 is provided with a dispenser 15 that discharges the liquid resin into the resin container, a moving mechanism 80 that moves the dispenser 15, and a resin conveyance mechanism 81 that conveys the resin container. The dispenser 15 is the same as the dispenser shown in the first embodiment. As in the first embodiment, the discharger 17 of the dispenser 15 is provided with a clamper 18. In the present embodiment, the release film or the resin container placed on the table 77 is a discharge target for discharging the liquid resin.

  As the release film supply mechanism 78, a release film supply mechanism that supplies a long (roll-shaped) release film to the table 77, or a release film that supplies a release film cut into a strip shape to the table 77. A mold film supply mechanism is used.

  The wafer supply / storage module 69 is provided with a control unit CTL that controls the operation of the resin molding apparatus 68. The control unit CTL controls the transfer of the pre-sealing wafer 70 and the sealed wafer 72, the movement of the dispenser 15, the discharge of the liquid resin, the heating of the mold, the opening and closing of the mold.

(Production method of resin molded products)
Referring to FIGS. 12 to 14, a liquid resin is discharged to a resin container (release film) that is an object to be discharged, and the liquid resin discharged to the resin container is supplied to a mold to produce a resin molded product. How to do will be described.

  First, as shown in FIG. 12A, for example, a long release film 82 is supplied from a release film supply mechanism 78 (see FIG. 11) to a table 77 and cut into a predetermined size. To do. Next, the resin containing frame 79 having the circular through hole 83 is placed on the release film 82. In this state, the release film 82 and the resin housing frame 79 are integrated to form a resin housing portion 84 that houses the liquid resin. Next, using the moving mechanism 80, the dispenser 15 is moved to a predetermined position above the resin container 84. In this case, although the case where the dispenser 15 is moved above the resin accommodating portion 84 using the moving mechanism 80 is shown, the table 77 may be moved below the dispenser 15. Any structure that relatively moves the dispenser 15 and the resin container 84 may be used.

Next, as shown in FIG. 12B, the liquid resin 85 is discharged from the resin discharge portion 17 (tube 36) of the dispenser 15 toward the resin storage portion 84 (release film 82). The liquid resin 85 is discharged into the through hole 83 included in the resin housing portion 84. As a pattern shape for discharging the liquid resin 85, for example, as shown in FIG. 13A, it is preferable to discharge the liquid resin 85 in a spiral pattern shape so as to correspond to the circular through hole 83. .
In this case, the liquid resin 85 is discharged spirally from the central portion toward the outer peripheral portion. Conversely, the liquid resin 85 may be discharged spirally from the outer peripheral portion toward the central portion.

  The pattern shape for discharging the liquid resin 85 is not limited to the spiral pattern shape. In addition to this, it is possible to arbitrarily set the shape corresponding to the shape of the through hole 83 included in the resin accommodating portion 84, such as concentric circles and dispersed dots. It is preferable that the liquid resin 85 has a pattern shape such that the liquid resin 85 is arranged as evenly as possible in the resin accommodating portion 84.

  Next, as shown in FIG. 12C, after the discharge of the dispenser 15 is stopped (the pushing operation of the plunger 27 is stopped), the residual resin 48 in the tube 36 attached to the discharge portion 17 of the dispenser 15. And the dripping resin 49 that hangs down from the tip of the tube 36 is handled using the clamper 18 (see FIG. 4). On the release film 82, the liquid resin 85 discharged spirally is disposed (see FIG. 13A). In this case, the resin container 84 whose bottom surface is constituted by the release film 82 is the discharge target.

  Next, as shown in FIG. 12D, the release film 82 is adsorbed to the resin containing frame 79 by an adsorption groove (not shown) provided on the bottom surface of the resin containing frame 79. Using the resin transport mechanism 81, the resin housing portion 84 in a state where the resin housing frame 79, the release film 82, and the liquid resin 85 spirally discharged are integrated is lifted from the table 77.

  Next, as shown in FIG. 14A, the wafer transfer mechanism 75 (see FIG. 11) is used to suck or hold the unsealed wafer 70 on which the semiconductor chip 86 is mounted on the mold surface of the upper mold 52. Secure with a clamp. Next, the resin container 84 is transported to a predetermined position between the upper mold 52 and the lower mold 11 using the resin transport mechanism 81. In the resin accommodating portion 84, the liquid resin 85 is accommodated in the through hole 83 closed by the resin accommodating frame 79 and the release film 82. Next, the resin transport mechanism 81 is lowered to place the resin container 84 on the lower mold 11. In this state, the spiral liquid resin 85 discharged on the release film 82 is disposed above the cavity 76.

  Next, as shown in FIG. 14B, the release film 82 is adsorbed along the mold surface of the cavity 76 by an adsorption mechanism (not shown) provided in the lower mold 11. As a result, the release film 82 and the liquid resin 85 are collectively supplied to the cavity 76. Next, using a heater (not shown) provided in the lower mold 11, the liquid resin 85 is heated and melted to generate a fluid resin 87 having a reduced viscosity.

  Next, as shown in FIG. 14C, the lower mold 11 is raised by the mold clamping mechanism 12 (see FIG. 11), and the upper mold 52 and the lower mold 11 are clamped. By clamping the mold, the semiconductor chip 86 mounted on the pre-sealing wafer 70 is immersed in the fluid resin 87.

  Next, the fluid resin 87 is cured using a heater provided in the lower mold 11 to form a cured resin 88. As a result, the semiconductor chip 86 mounted on the pre-sealing wafer 70 is resin-sealed with the cured resin 88 molded corresponding to the shape of the cavity 76. At this stage, a resin molded product 89 (sealed wafer 72) sealed with resin is manufactured. Using the wafer transfer mechanism 75 (see FIG. 11), the resin molded product 89 is housed in the sealed wafer housing portion 73 (see FIG. 11).

  According to the present embodiment, the elastically deformable tube 36 is attached to the discharge portion 17 of the dispenser 15. On both sides of the tube 36, a clamper 18 is provided that is movable with the tube 36 interposed therebetween. By sandwiching the tube 36 with the clamper 18 and lowering the clamper 18, residual resin remaining in the tube 36 and dripping resin hanging from the tip of the tube 36 can be forcibly handled by the clamper 18.

  According to the present embodiment, the liquid resin 85 is discharged to the resin container 84 (release film 82) that is a discharge object, and the liquid resin 85 that is stored in the resin container 84 is provided in the lower mold 11. 76 is supplied for resin molding. Since the liquid resin 85 is not directly discharged into the cavity 76, the liquid resin 85 discharged onto the release film 82 is not affected by the heat from the heater provided in the mold. Therefore, the liquid resin 85 can be prevented from starting to cure while the liquid resin 85 is being discharged onto the release film 82. Thereby, the dispersion | variation in which the liquid resin 85 discharged on the release film 82 hardens | cures can be suppressed, and the dispersion | variation in the resin thickness of a resin molded product can be reduced.

  In each embodiment, liquid resin is discharged toward the discharge target from a discharge portion provided in the dispenser. In Embodiment 1, the form which discharges the liquid resin 32 to the cavity 13 by making the cavity 13 provided in the lower mold | type 11 into the discharge object was demonstrated. In the fifth embodiment, the mode in which the liquid resin 85 is discharged onto the release film 82 using the release film 82 (resin housing portion 84) placed on the table 77 as the discharge target has been described.

  As a discharge target, in addition to the cavity and the release film, the liquid resin can be discharged onto a substrate on which a semiconductor chip is mounted, a wafer on which the semiconductor chip is mounted, a wafer in which a semiconductor pre-process is completed, and the like. In these cases, the discharge target from which the liquid resin is discharged is supplied to the mold and molded. The liquid resin is melted in a cavity provided in the mold, and is cured corresponding to the shape of the cavity.

  In each embodiment, the 1 liquid type dispenser which uses the liquid resin produced | generated by previously mixing the main ingredient and the hardening | curing agent was shown. The present invention is not limited to this, and even when a two-component mixing type dispenser is used in which the main agent and the curing agent are mixed and used in actual use, the same effects as those of the embodiments can be obtained.

  In each embodiment, the resin molding apparatus used when resin-sealing a semiconductor chip and the manufacturing method of a resin molded product were demonstrated. The target for resin sealing may be a semiconductor chip such as an IC or a transistor, a non-semiconductor chip that does not use a semiconductor, or a chip group in which a semiconductor chip and a non-semiconductor chip are mixed. The present invention can be applied when one or a plurality of chips mounted on a substrate, a wafer, or the like is resin-sealed with a cured resin.

  In addition, the present invention is not limited to the case where an electronic component is sealed with a resin, but the present invention is applied to a case where an optical component such as a lens, a reflector (reflecting plate), a light guide plate, an optical module, and other resin molded products are manufactured by resin molding. Can be applied.

  As described above, the discharge device according to the embodiment includes the storage unit that stores the fluid resin, the extrusion mechanism that extrudes the fluid resin, the discharge unit that is connected to the storage unit and discharges the fluid resin, and the discharge unit. It is configured to include an attached elastically deformable tube, a clamper that is movable with the tube interposed therebetween, and a control unit that controls the amount of movement of the clamper.

  According to this configuration, by holding the elastically deformable tube attached to the discharge portion of the discharge device with the clamper and lowering the clamper, the residual resin remaining in the tube can be handled by the clamper. Therefore, it is possible to shorten the time required for the discharge process of the fluid resin such as the liquid resin, and it is possible to improve the productivity of the resin molded product manufactured by discharging the fluid resin.

  Furthermore, in the discharge device of the above-described embodiment, the control unit is configured to control the movement amount for moving the clamper in accordance with the remaining amount of the fluid resin in the storage unit.

  According to this configuration, even if the remaining amount of the fluid resin remaining in the storage unit changes, the constant fluid resin can be discharged. Therefore, it is possible to increase the accuracy of the discharge amount of the fluid resin, and it is possible to improve the quality stability of the resin molded product manufactured by discharging the fluid resin.

  Furthermore, in the discharge device of the above-described embodiment, the storage amount of the fluid resin in the storage unit is an amount corresponding to a plurality of discharge objects, and the movement amount of the clamper by the control unit is among the plurality of discharge objects. It has a different configuration for at least two.

  According to this configuration, even if the remaining amount of the fluid resin in the storage unit changes, the constant fluid resin can be discharged. Therefore, it is possible to increase the accuracy of the discharge amount of the fluid resin, and it is possible to improve the quality stability of the resin molded product manufactured by discharging the fluid resin.

  Furthermore, the ejection device according to the above-described embodiment is configured to include a first drive mechanism that moves the clamper in the horizontal direction and a second drive mechanism that moves the clamper in the vertical direction.

  According to this configuration, the tube can be sandwiched by the clamper using the first drive mechanism. The clamper can be moved by a predetermined amount using the second drive mechanism. Therefore, the residual resin remaining in the tube can be handled by the clamper.

  Further, in the discharge device according to the above-described embodiment, the clamper includes a rotating roller, and the residual resin remaining in the tube is handled by the roller moving down while the clamper sandwiches the tube.

  According to this configuration, the resin remaining in the tube can be handled by the roller descending while rotating.

  The resin molding apparatus according to the embodiment is configured to include any one of the above-described discharge devices.

  According to this configuration, it is possible to shorten the time required for the discharge process of the fluid resin such as the liquid resin, and it is possible to improve the productivity of the resin molded product manufactured by discharging the fluid resin.

  The ejection method of the above embodiment is an extruding step of ejecting the fluid resin from an elastically deformable tube attached to the ejection unit connected to the storage unit by extruding the fluid resin stored in the storage unit; And a handling step of handling the residual resin remaining in the tube by moving the clamper downward while sandwiching the tube with the clamper.

  According to this method, the fluid resin can be discharged early by the clamper. Therefore, it is possible to shorten the time required for the discharge process of the fluid resin such as the liquid resin, and it is possible to improve the productivity of the resin molded product manufactured by discharging the fluid resin.

  Furthermore, the discharge method of the above embodiment controls the movement amount of the clamper in the handling step in accordance with the remaining amount of the fluid resin in the storage unit.

  According to this method, even if the remaining amount of the fluid resin remaining in the storage portion changes, the constant fluid resin can be discharged. Therefore, it is possible to increase the accuracy of the discharge amount of the fluid resin, and it is possible to improve the quality stability of the resin molded product manufactured by discharging the fluid resin.

  Further, in the ejection method of the above embodiment, the extrusion process and the handling process are repeated a plurality of times, and the movement amount of the clamper is made different for at least two of the plurality of handling processes.

  According to this method, even if the remaining amount of the fluid resin in the storage unit changes, the constant fluid resin can be discharged. Therefore, it is possible to increase the accuracy of the discharge amount of the fluid resin, and it is possible to improve the quality stability of the resin molded product manufactured by discharging the fluid resin.

  The method for producing a resin molded product of the above embodiment includes a mold clamping step of clamping the mold with the fluid resin discharged by any one of the above-described discharge methods being supplied to the mold.

  According to this method, a resin molded product can be manufactured stably, and productivity can be improved.

  The present invention is not limited to each of the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. It is.

DESCRIPTION OF SYMBOLS 1,68 Resin molding apparatus 2 Substrate supply / storage module 3A, 3B, 3C Molding module 4 Resin supply module 5 Pre-sealing substrate 6 Pre-sealing substrate supply unit 7 Sealed substrate 8 Sealed substrate storage unit 9 Substrate mounting Place 10 Substrate transport mechanism 11 Lower mold 12 Clamping mechanism 13, 76 Cavity (Discharge target)
14 Release film supply mechanism 15, 58, 64 Dispenser (discharge device)
16 Resin transport mechanism 17, 65 Discharge unit 18, 59, 67 Clamper 19 Extrusion mechanism 20 Syringe (storage unit)
21 connecting portion 22 nozzle 23 servo motor 24 ball screw 25 slider 26 rod 27 plunger (push-out mechanism)
28 Ball screw bearing 29 Guide rail 30 Encoder 31 Control unit 32, 85 Liquid resin (flowable resin)
33 Screw 34 Discharge port 35 Joint 36 Tube 37, 38 Roller support member 37a, 37b, 37c, 38a, 38b, 38c Bar-shaped member 39, 40 Roller 41, 44 Connection member 42, 45 Moving mechanism (first moving mechanism)
43, 46 Movement mechanism (second movement mechanism)
47 Resin passage 48 Residual resin 49 Drip resin 50 Threaded residual resin 51, 86 Semiconductor chip 52 Upper mold 53 Mold 54 Mold release film 55, 87 Flowable resin 56, 88 Cured resin 57, 89 Resin molded product 60 , 61 Roller support member 60a, 60b, 60c, 61a, 61b, 61c Rod-like member 62, 63 Connection member 66 Fixed plate 69 Wafer supply / storage module 70 Wafer before sealing 71 Wafer supply part before sealing 72 Sealed wafer 73 Sealed wafer storage unit 74 Wafer mounting unit 75 Wafer transfer mechanism 77 Table 78 Release film supply mechanism 79 Resin storage frame 80 Movement mechanism 81 Resin transfer mechanism 82 Release film (discharge target)
83 Through-hole 84 Resin container (discharge target)
S1, R1, M1, C1 Predetermined position CTL controller A, B, C State of liquid resin in syringe P1, P2, P3, P4 Position L1, L2, L3 Stroke amount (movement amount)

Claims (10)

A reservoir for storing the fluid resin;
An extrusion mechanism for extruding the fluid resin;
A discharge unit connected to the storage unit and discharging the flowable resin;
An elastically deformable tube attached to the discharge part;
A clamper movable across the tube;
A discharge device comprising: a control unit that controls a movement amount of the clamper.   The discharge device according to claim 1, wherein the control unit controls a movement amount for moving the clamper in accordance with a remaining amount of the fluid resin in the storage unit. The storage amount of the fluid resin in the storage portion is an amount corresponding to a plurality of discharge objects,
3. The ejection device according to claim 1, wherein an amount of movement of the clamper by the control unit is different for at least two of the plurality of ejection objects. A first drive mechanism for moving the clamper in a horizontal direction;
The ejection device according to any one of claims 1 to 3, further comprising a second drive mechanism that moves the clamper in a vertical direction. The clamper includes a rotating roller,
5. The discharge device according to claim 1, wherein the roller moves downward while the clamper sandwiches the tube, thereby handling residual resin remaining in the tube. 6.   A resin molding apparatus comprising the discharge device according to claim 1. Extruding the flowable resin from an elastically deformable tube attached to the discharge unit connected to the storage unit by extruding the flowable resin stored in the storage unit;
A discharging method including a handling step of handling residual resin remaining in the tube by moving the clamper downward by sandwiching the tube with a clamper.   The discharge method according to claim 7, wherein in the handling step, a movement amount of the clamper is controlled in accordance with a remaining amount of the fluid resin in the storage unit.   The discharge method according to claim 7 or 8, wherein the extruding step and the handling step are repeated a plurality of times, and the movement amount of the clamper is made different for at least two of the plurality of handling steps.   A method for producing a resin molded product comprising a step of resin molding in a state where the fluid resin discharged by the discharge method according to any one of claims 7 to 9 is supplied to a mold.

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