JP2018107389A - Printed circuit board assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board conjugate in which fit tolerance is set, and bond strength of first and second printed boards is increased stably.SOLUTION: A through hole 3 arranged in a first printed board 1 includes a first hole 3A extending in a first direction A, and a second hole 3B continuous to the first hole 3A and having a width in a second direction B wider than that of the first hole 3A. Width of the through hole 3 in the first direction A is wider than the wider in the first direction A of the insertion part 6 a second printed board 2 inserted into the through hole 3. The second printed board 2 includes a second wiring pattern 5 forming the opposite ends in the second direction B of the second insertion part 6B inserted into the second hole 3B of the insertion part 6. The width W1 in the first direction A of the second wiring pattern 5 is narrower than the width in the first direction A of the second hole 3B. The width W5 in the second direction B of the second insertion part 6B is wider than the width in the second direction B of the first hole 3A. The first and second wiring patterns 4, 5 are solder joined.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a printed circuit board assembly, and in particular, a first printed circuit board in which a through hole is arranged and a second printed circuit board partially inserted into the through hole of the first printed circuit board are electrically connected. The present invention relates to a printed circuit board assembly.

  Japanese Unexamined Patent Application Publication No. 2011-86664 discloses a printed circuit board assembly including a first printed circuit board (second circuit board) and a second circuit board (first circuit board). The first printed circuit board is formed with an accommodation groove for accommodating a part (connection end) of the second printed circuit board. A land is formed on the part of the second printed circuit board. A half through hole is formed in the inner wall surface of the accommodation groove of the first printed circuit board. In a state where the part of the second printed board is housed in the housing groove of the first printed board, the land and the half through hole are electrically connected by the solder fillet. The planar shape of the receiving groove has a longitudinal direction.

  In JP 2011-86664 A, the length dimension of the receiving groove may be set to be the same as the length dimension of the connection end, or may be set slightly smaller. It is disclosed that it may be set large.

JP 2011-86664 A

  However, in the printed circuit board assembly described in Japanese Patent Application Laid-Open No. 2011-86664, the fitting tolerance and the variation in the relative position of the second printed circuit board with respect to the first printed circuit board due to the fitting tolerance are not considered. .

  In the printed circuit board assembly, it is necessary to set a fitting tolerance between the first printed circuit board and the second printed circuit board in consideration of manufacturing variation due to processing accuracy with respect to the printed circuit board. The width of the receiving groove in the longitudinal direction is wider than the width of the part of the second printed circuit board in the longitudinal direction, and the width of the receiving groove in the short direction is larger than the width of the part of the second printed circuit board in the short direction. Also needs to be widespread. The fitting tolerance may be set relatively large from the viewpoint of suppressing the manufacturing cost. When the fitting tolerance is set, the relative position of the second printed circuit board with respect to the first printed circuit board is allowed to vary within the range of the fitting tolerance.

  On the other hand, when the fitting tolerance between the first printed circuit board and the second printed circuit board is set, the shape and size of the solder fillet that joins between them is determined by the second printed circuit board relative to the first printed circuit board. It changes according to the variation of the relative position of. For example, when the fitting tolerance is set in the longitudinal direction of the receiving groove, the second printed circuit board easily shifts to one side in the longitudinal direction of the receiving groove with respect to the first printed circuit board. The size of the solder fillet formed on one side in the longitudinal direction tends to be smaller than the size of the solder fillet formed on the other side.

  In particular, in the printed circuit board assembly described in Japanese Patent Application Laid-Open No. 2011-86664, the dimensions of the land, the receiving groove, and the half through hole are not specified, and at least one of the lands when the fitting tolerance is set. There is a possibility that the portion is disposed in the accommodation groove. In this case, the dimension of the solder fillet formed on one side in the longitudinal direction in the half through hole is much smaller than the dimension of the solder fillet formed on the other side.

  That is, in the conventional printed circuit board assembly, when the fitting tolerance is set, a solder fillet having a relatively small size and a solder fillet having a relatively large size can be formed. Thermal stress concentrates on a solder fillet having a relatively small size, and cracks are likely to occur. Therefore, the conventional printed circuit board assembly has a problem that the bonding strength between the first printed circuit board and the second printed circuit board is not stable when the fitting tolerance is set.

  The present invention has been made to solve the above-described problems. A main object of the present invention is to provide a printed circuit board assembly in which a fitting tolerance is set and the bonding strength between the first printed circuit board and the second printed circuit board is stably increased.

  The printed circuit board assembly according to the present invention includes a first printed circuit board in which a through hole is arranged, and a second printed circuit board including an insertion portion 6 inserted in the through hole. The through hole has a first hole portion arranged so as to extend along the first direction when the first printed circuit board is viewed in plan, and a second direction that is continuous with the first hole portion and intersects the first direction. And a second hole having a width wider than the width of the first hole in the second direction. The width of the through hole in the first direction is wider than the width of the insertion portion in the first direction. The first printed circuit board includes a first wiring pattern that forms an inner peripheral surface of the second hole. The insertion part of the second printed circuit board includes a second wiring pattern constituting at least one end in the second direction of the second insertion part inserted into the second hole. The width of the second wiring pattern in the first direction is narrower than the width of the second hole portion in the first direction. The width of the second insertion portion in the second direction is wider than the width of the first hole in the second direction. The first wiring pattern and the second wiring pattern are bonded by a conductive bonding member.

  According to the present invention, it is possible to provide a printed circuit board assembly in which a fitting tolerance is set and the bonding strength between the first printed circuit board and the second printed circuit board is stably increased.

1 is a perspective view showing a printed circuit board assembly according to Embodiment 1. FIG. 3 is a cross-sectional view perpendicular to the first direction of the printed circuit board assembly according to Embodiment 1. FIG. It is the top view which looked at the 1st printed circuit board of the printed circuit board joined body concerning Embodiment 1 from the 3rd direction. It is the top view which looked at the 2nd printed circuit board of the printed circuit board zygote concerning Embodiment 1 from the 2nd direction. It is the top view which looked at the printed circuit board joined body concerning Embodiment 1 from the 3rd direction. It is the top view which looked at the 1st printed circuit board of the printed circuit board joined body concerning Embodiment 2 from the 3rd direction. It is the top view which looked at the modification of the printed circuit board joined body concerning Embodiment 1 and 2 from the 3rd direction.

Embodiment 1 FIG.
<Configuration of printed circuit board assembly>
As shown in FIGS. 1 to 5, the printed circuit board assembly 100 according to the first embodiment includes a first printed circuit board 1 and a second printed circuit board 2.

  As shown in FIGS. 1 to 3, the first printed circuit board 1 has a first surface 1 </ b> A. For convenience of explanation, two directions that are along the first surface 1A and are orthogonal to each other are referred to as a first direction A and a second direction B (see FIG. 1). A direction orthogonal to the first direction A and the second direction B is referred to as a third direction C (see FIG. 1). A through hole 3 is arranged on the first surface 1 </ b> A of the first printed circuit board 1.

  As shown in FIGS. 1 and 3, the through hole 3 includes, for example, a plurality of first hole portions 3A and a plurality of second hole portions 3B connected to the plurality of first hole portions 3A. Two first hole portions 3A adjacent in the first direction A among the plurality of first hole portions 3A are connected via one second hole portion 3B. Two second hole portions 3B adjacent to each other in the first direction A among the plurality of second hole portions 3B are connected through one first hole portion 3A.

  As shown in FIG. 3, each of the plurality of first holes 3 </ b> A is arranged to extend along the first direction A when the first printed circuit board 1 is viewed in plan. In other words, the width in the first direction A of each first hole 3A is wider than the width in the second direction B of each first hole 3A. The width of each of the plurality of second holes 3B in the second direction B is wider than the width of each of the plurality of first holes 3A in the second direction B.

  As shown in FIGS. 1 to 3, the first printed circuit board 1 includes a first wiring pattern 4 constituting the inner peripheral surface of the second hole 3 </ b> B. For example, the first wiring pattern 4 is in contact with the second hole 3B on the portion constituting the inner peripheral surface of the second hole 3B and on the surface located on the opposite side of the first surface 1A and the first surface 1A. And a portion formed on the region. The first wiring pattern 4 has an arbitrary pattern shape on these surfaces. For example, the first wiring pattern 4 does not constitute the inner peripheral surface of the first hole portion 3A, and is not formed on a region in contact with the first hole portion 3A on the first surface 1A. The width of the second hole 3B in the second direction B is a distance between the first wiring patterns 4 arranged so as to face each other in the second direction B in the second hole 3B.

  As shown in FIGS. 1, 2, and 4, the second printed circuit board 2 has a second surface 2 </ b> A. The second printed circuit board 2 is arranged such that the second surface 2A is along the first direction A and the third direction C. In other words, the second printed circuit board 2 is arranged so as to be orthogonal to the first printed circuit board 1. The second printed circuit board 2 includes an insertion portion 6 that is inserted into the through hole 3 of the first printed circuit board 1. The insertion part 6 is a part inserted in the through hole 3 in the method for manufacturing the printed circuit board assembly 100 than the part, and a part disposed in the through hole 3 in the printed circuit board assembly 100 and the part To the one end of the second printed circuit board 2 in the third direction C (the lower end in FIGS. 1 and 4). The insertion part 6 has a first insertion part 6A inserted into the first hole 3A and a second insertion part 6B inserted into the second hole 3B.

  As shown in FIGS. 1, 2, 4, and 5, the second printed circuit board 2 further includes a second wiring pattern 5 that constitutes at least one end in the second direction B of the second insertion portion 6B. . The second wiring pattern 5 is formed on, for example, the second surface 2A and a surface located on the side opposite to the second surface 2A. The second wiring pattern 5 formed on the second surface 2A is electrically insulated from, for example, the second wiring pattern 5 formed on the surface opposite to the second surface 2A. For example, the second wiring patterns 5 are arranged at intervals in the first direction A.

  As shown in FIG. 2, each of two sides that are not connected to the base material of the second printed circuit board 2 among the four sides extending in the third direction C of the second wiring pattern 5 formed on the second surface 2A. For example, constitutes one end and the other end in the first direction A of one end portion in the second direction B of the second insertion portion 6B. Of the four sides extending in the third direction C of the second wiring pattern 5 formed on the surface opposite to the second surface 2A, each of the two sides not connected to the base material of the second printed circuit board 2 is For example, one end and the other end in the first direction A of the other end portion in the second direction B of the second insertion portion 6B are formed. From a different point of view, the surface extending in the first direction A and the third direction C and the surface extending in the second direction B and the third direction C of the second wiring pattern are more than the inner peripheral surface of the second hole 3B. It arrange | positions in the position near the center of the 2nd hole 3B.

  The second wiring pattern 5 formed on the second surface 2A and the second wiring pattern 5 formed on the surface opposite to the second surface 2A are, for example, the mother of the second printed circuit board 2. It is formed so as to have a line-symmetric shape with the material in between. As shown in FIG. 5, the shape of the second wiring pattern 5 when viewed from the third direction C is, for example, a rectangular shape. The width of the second wiring pattern 5 in the first direction A is longer than the width of the second wiring pattern 5 along the second direction B, for example.

  As shown in FIGS. 1 and 4, the second wiring pattern 5 is arranged in the first direction A with a gap. The second wiring pattern 5 is not formed in the first insertion portion 6 </ b> A that is inserted into the first hole 3 </ b> A of the insertion portion 6. As shown in FIGS. 1, 2, and 5, the portion of the second printed circuit board 2 where the second wiring pattern 5 is not formed is the first hole 3 </ b> A, and the second printed circuit board 2 has the second wiring pattern 5. The portions in which are formed are respectively inserted into the second hole portions 3B. For example, the second wiring pattern 5 may be in direct contact with the first wiring pattern 4.

  As shown in FIGS. 1 and 2, the first wiring pattern 4 and the second wiring pattern 5 are joined by a conductive joining member. The material constituting the conductive bonding member may be any material having conductivity and capable of mechanically and electrically connecting the first wiring pattern 4 and the second wiring pattern 5. For example, the solder 7 It is. The solder 7 has a fillet shape. The size of the solder 7 formed on one side in the first direction A with respect to the second wiring pattern 5 is the size of the solder 7 formed on the other side in the first direction A with respect to the second wiring pattern 5. It is equivalent to the size. The size of the solder 7 formed on the first surface 1A of the first printed circuit board 1 is the same as the size of the solder 7 formed on the surface of the first printed circuit board 1 opposite to the first surface 1A. Is equivalent. In FIG. 5, the solder 7 is not shown.

  The first printed circuit board 1 and the second printed circuit board 2 have a fitting tolerance. The width of the insertion portion 6 of the second printed circuit board 2 in the first direction A is less than the width of the through hole 3 of the first printed circuit board 1 in the first direction A, and the first printed circuit board 1 has a fitting tolerance. The through hole 3 is narrower than the width in the first direction A. The width of the first insertion portion 6A in the second direction is, for example, less than the width of the first hole 3A in the second direction, and the width of the second insertion portion 6B in the second direction is, for example, the second direction of the second hole 3B. Is less than the width.

  As shown in FIGS. 1, 2, 3 and 5, the width W1 of the second wiring pattern 5 in the first direction A is the width W2 of the second hole 3B in the first direction A (see FIG. 3). Narrower than. The width W1 (see FIG. 5) of the second wiring pattern 5 in the first direction A is the width of the first direction A at both ends in the second direction B of the portion of the insertion portion 6 where the second wiring pattern 5 is formed. Equal to width. The width W2 in the first direction A of the second hole 3B refers to the length of the string formed by the inner peripheral surface of the second hole 3B when viewed from the third direction C. In other words, the width W2 in the first direction A of the second hole 3B is, when viewed from the third direction C, from one end to the other end in the first direction A of the inner peripheral surface of the second hole 3B. Refers to the distance.

  As shown in FIGS. 3 and 5, the width W3 in the second direction B of the first insertion portion 6A inserted into the first hole 3A in the insertion portion 6 of the second printed circuit board 2 (see FIG. 5). Is less than or equal to the width W4 (see FIG. 3) of the first hole 3A in the second direction B, and preferably smaller than the width W4 of the first hole 3A in the second direction B by the fitting tolerance. The width W3 in the second direction B of the first insertion portion 6A inserted into the first hole 3A of the insertion portion 6 of the second printed circuit board 2 is, for example, the second of the insertion portions 6 of the second printed circuit board 2. It is equal to the width in the second direction B of the portion where the wiring pattern 5 is not formed, for example, equal to the thickness of the base material of the second printed circuit board 2.

  As shown in FIGS. 3 and 5, the width W5 in the second direction B of the second insertion portion 6B inserted into the second hole 3B of the insertion portion 6 of the second printed circuit board 2 (see FIG. 5). Is narrower than the width W6 (see FIG. 3) in the second direction B of the second hole 3B. The width W5 in the second direction B of the second insertion portion 6B inserted into the second hole 3B of the insertion portion 6 of the second printed circuit board 2 is the second wiring of the insertion portion 6 of the second printed circuit board 2. It is equal to the width in the second direction B of the portion where the pattern 5 is formed. The width W5 in the second direction B of the second insertion portion 6B inserted in the second hole portion 3B of the insertion portion 6 is the first insertion portion 6A inserted in the first hole portion 3A of the insertion portion 6. The width W3 in the second direction B is wider than the width W4 in the second direction B of the first hole 3A.

  The width W5 in the second direction B of the portion where the second wiring pattern 5 is formed in the insertion portion 6 of the second printed circuit board 2 is, for example, the thickness of the base material of the second printed circuit board 2 and the second surface 2A. It is equal to the sum of the thickness of the second wiring pattern 5 above and the thickness of the second wiring pattern 5 on the surface located on the opposite side to the second surface 2A.

  As shown in FIG. 5, the second wiring pattern 5 and the second wiring pattern 5 in the first direction A between the inner peripheral surface of the second hole 3 </ b> B located on one side in the first direction A with respect to the second wiring pattern 5. Let the shortest distance be the first distance L1. The shortest distance in the first direction A between the second wiring pattern 5 and the inner surface of the second hole 3B located on the other side in the first direction A with respect to the second wiring pattern 5 is the second distance L2. To do. The sum of the first distance L1 and the second distance L2 is equal to or less than the width W1 of the second wiring pattern 5 in the first direction A. The first distance L1 and the second distance L2 are the shortest distances in the first direction A between the one end in the second direction B of the second insertion portion 6B and the second hole 3B.

  The second wiring pattern 5 of the second printed circuit board 2 is arranged on a line segment that passes through the center of the second hole 3B of the first printed circuit board 1 in the first direction A and extends in the second direction B. Preferably, the center of the second wiring pattern 5 in the first direction A is arranged on a line segment that passes through the center of the second hole 3B of the first printed circuit board 1 in the first direction A and extends in the second direction B. ing. In other words, preferably the first distance L1 is equal to the second distance L2.

  The shortest distance in the second direction B between the second insertion portion 6B and the inner peripheral surface of the second hole 3B located on one side in the second direction B with respect to the second insertion portion 6B is a third distance L3. To do. The shortest distance in the second direction B between the second insertion portion 6B and the inner peripheral surface of the second hole 3B located on the other side in the second direction B with respect to the second insertion portion 6B is a fourth distance L4. To do. As shown in FIG. 5, the sum of the third distance L3 and the fourth distance L4 is the width W4 of the first hole 3A in the second direction B and the width W3 of the first insertion portion 6A in the second direction B. Smaller than the difference.

  Preferably, the base material of the second printed circuit board 2 is disposed on a line segment that passes through the center of the second hole 3B of the first printed circuit board 1 in the second direction B and extends in the first direction A. In other words, preferably the third distance L3 is equal to the fourth distance L4.

  As shown in FIGS. 1 and 3, for example, a plurality of (for example, three) through holes 3 that are not connected to each other are arranged in the first printed circuit board 1. Each of the plurality of through holes 3 is disposed, for example, in the first direction A so as to be spaced apart from each other. The first through-hole 3 disposed in the center of the first printed circuit board 1 in the first direction A includes, for example, a plurality of first hole portions 3A disposed so as to be continuous with the first direction A as described above. A plurality of second holes 3B. Each of the second through hole 3 and the third through hole 3 disposed so as to sandwich the first through hole 3 disposed in the center of the first printed circuit board 1 in the first direction A is, for example, It includes two first holes 3A and one second hole 3B. Each of the first hole portion 3A and the second hole portion 3B of the first through hole 3, the second through hole 3, and the third through hole 3 has the configuration described above.

  As shown in FIG. 1 and FIG. 4, the second printed circuit board 2 includes a plurality of (for example, three) insertion portions 6 that are spaced apart from each other in the first direction A, for example. In the first insertion portion 6 disposed in the center of the second printed circuit board 2 in the first direction A, for example, a plurality of second wiring patterns 5 are disposed as described above. The plurality of second wiring patterns 5 of the first insertion portion 6 are arranged in the first direction A with an interval. Each of the second insertion part 6 and the third insertion part 6 arranged so as to sandwich the first insertion part 6 arranged in the center of the second printed circuit board 2 in the first direction A is, for example, One second wiring pattern 5 is provided. Each of the 1st insertion part 6, the 2nd insertion part 6, and the 3rd insertion part 6 has the structure mentioned above. The first insertion portion 6 is inserted into the first through hole 3, the second insertion portion 6 is inserted into the second through hole 3, and the third insertion portion 6 is inserted into the third through hole. ing. Each first wiring pattern 4 of the first through hole 3 and each second wiring pattern 5 of the first insertion portion 6 are joined by solder 7. Similarly, the first wiring pattern 4 of the second through hole 3 and the second wiring pattern 5 of the second insertion portion 6 are joined by solder 7. The first wiring pattern 4 of the third through hole 3 and the second wiring pattern 5 of the third insertion portion 6 are joined by solder 7.

  A first notch 8 that partitions the first insertion part 6 and the second insertion part 6 is formed between the first insertion part 6 and the second insertion part 6. In the first and second cutouts 8, the first printed circuit board 1 located between the first hole 3 </ b> A of the first insertion part 6 and the first hole 3 </ b> A of the second insertion part 6. Is arranged. Similarly, a second notch portion 8 that partitions the first insertion portion 6 and the third insertion portion 6 is formed between the first insertion portion 6 and the third insertion portion 6. ing. In the first and third cutouts 8, the first printed circuit board 1 is located between the first hole 3 </ b> A of the first insertion part 6 and the first hole 3 </ b> A of the third insertion part 6. Is arranged.

<Method for producing printed circuit board assembly>
Next, a method for manufacturing a printed circuit board assembly will be described.

  First, the first printed circuit board 1 and the second printed circuit board 2 are prepared. The first printed circuit board 1 and the second printed circuit board 2 are configured as described above. That is, the first printed circuit board 1 is provided with the through hole 3 including the first hole 3A and the second hole 3B. The 1st printed circuit board 1 contains the 1st wiring pattern 4 which comprises the internal peripheral surface of the 2nd hole 3B. The second printed circuit board 2 includes a second wiring pattern 5 that constitutes at least one end in the second direction B of the second insertion portion 6B of the insertion portion 6. The first printed circuit board 1 and the second printed circuit board 2 have a fitting tolerance. The first printed circuit board 1 and the second printed circuit board 2 are formed so that the widths W1 to W6 and the distances L1 to L4 satisfy the relationship described above. The through hole 3 may be formed by any method, and is formed by, for example, laser processing. The 1st wiring pattern 4 and the 2nd wiring pattern 5 should just be formed by arbitrary methods, for example, are formed by plating.

  Next, the second printed circuit board 2 is inserted into the through hole 3 of the first printed circuit board 1. The first insertion portion 6A in which the second wiring pattern 5 is not disposed in the insertion portion 6 of the second printed circuit board 2 is inserted into the first hole 3A of the first printed circuit board 1. The second insertion portion 6B in which the second wiring pattern 5 is disposed in the insertion portion 6 of the second printed circuit board 2 is inserted into the second hole 3B of the first printed circuit board 1.

  Next, the first wiring pattern 4 of the first printed circuit board 1 and the second wiring pattern 5 of the second printed circuit board 2 are joined by the solder 7. The solder 7 is formed to have a fillet shape. The solder 7 is formed by, for example, a flow method or a reflow method. In this way, the printed circuit board assembly 100 is manufactured.

<Effect>
As described above, the printed circuit board assembly 100 includes the first printed circuit board 1 in which the through hole 3 is arranged and the second printed circuit board 2 including the insertion portion 6 inserted in the through hole 3. The through-hole 3 is connected to the first hole 3 </ b> A, which is arranged so as to extend along the first direction A when the first printed circuit board 1 is viewed in plan, and the first direction A And a second hole 3B having a width in the second direction B that intersects with the first hole 3A is wider than that of the first hole 3A. The width of the through hole 3 in the first direction A is wider than the width of the insertion portion 6 in the first direction A. The 1st printed circuit board 1 contains the 1st wiring pattern 4 which comprises the internal peripheral surface of the 2nd hole 3B. The second printed circuit board 2 includes a second wiring pattern 5 that constitutes at least one end (for example, both ends) in the second direction B of the second insertion portion 6B of the insertion portion 6. The width W1 in the first direction A of the second wiring pattern 5 is narrower than the width W2 in the first direction A of the second hole 3B. The width W5 in the second direction B of the second insertion portion 6B of the insertion portion 6 is wider than the width W4 in the second direction B of the first hole portion 3A. The first wiring pattern 4 and the second wiring pattern 5 are joined by solder 7.

  As shown in FIG. 5, in the printed circuit board assembly 100, the width W1 of the second wiring pattern 5 in the first direction A is narrower than the width W2 of the second hole 3B in the first direction A, and the second wiring. The pattern 5 constitutes at least one end of the second insertion portion 6B of the insertion portion 6 in the second direction B. Therefore, the 2nd insertion part 6B in which the 2nd wiring pattern 5 is arrange | positioned among the insertion parts 6 of the 2nd printed circuit board 2 can be inserted in the 2nd hole 3B.

  Furthermore, in the printed circuit board assembly 100, the width W5 in the second direction B of the second insertion portion 6B of the insertion portion 6 is wider than the width W4 in the second direction B of the first hole portion 3A. Therefore, according to the printed circuit board assembly 100, the second insertion portion 6B of the insertion portion 6 is not disposed in the first hole portion 3A even when the fitting tolerance is set to be relatively large from the viewpoint of suppressing the manufacturing cost. . Specifically, when the second printed circuit board 2 is inserted into the through hole 3 of the first printed circuit board 1 in the method for manufacturing the printed circuit board assembly 100, the second printed circuit board 2 is relative to the first printed circuit board 1. When the position changes in the first direction A by a predetermined amount or more, the second wiring pattern 5 can come into contact with the inner peripheral surface of the second hole 3B.

  Therefore, according to the printed circuit board assembly 100, the relative position in the first direction A of the second printed circuit board 2 with respect to the first printed circuit board 1 is compared with the conventional printed circuit board assembly in which the fitting tolerance is set. The variation is suppressed. As a result, the shape and size of the fillet of the solder 7 that joins the first wiring pattern 4 and the second wiring pattern 5 is at least in the first direction A as compared with the conventional printed circuit board assembly in which the fitting tolerance is set. Further, the deviation in each direction of the third direction C is suppressed. That is, in the printed circuit board assembly 100, the size of the solder 7 formed on one side in the first direction A with respect to the second wiring pattern 5 and the other side in the first direction A with respect to the second wiring pattern 5. The difference between the size of the solder 7 formed on the substrate is smaller than that of the conventional printed circuit board assembly. Furthermore, in the printed circuit board assembly 100, the size of the solder 7 formed on the first surface 1A of the first printed circuit board 1 and the surface located on the opposite side of the first surface 1A of the first printed circuit board 1 are arranged. The difference from the size of the formed solder 7 is smaller than that of the conventional printed circuit board assembly.

  As a result, the printed circuit board assembly 100 is more stable in the bonding strength between the first printed circuit board and the second printed circuit board while the fitting tolerance is set, as compared with the conventional printed circuit board assembly in which the fitting tolerance is set. Has been raised.

  As shown in FIG. 5, in the printed circuit board assembly 100, the second wiring pattern 5 and the second hole portion 3 </ b> B located on one side in the first direction A with respect to the second wiring pattern 5 are arranged. The first direction between the first distance L1 as the shortest distance in one direction A and the second wiring pattern 5 and the second hole 3B located on the other side of the first direction A with respect to the second wiring pattern 5 The sum of A and the second distance L2 as the shortest distance is equal to or less than the width W1 of the second wiring pattern 5 in the first direction A.

  Such a printed circuit board assembly 100 includes the printed circuit board assembly 100 in which the sum of the first distance L1 and the second distance L2 exceeds the width W1 in the first direction A of the second wiring pattern 5 and the conventional printed circuit board connection. Compared with the body, the relative position variation in the first direction A of the second printed circuit board 2 with respect to the first printed circuit board 1 is suppressed. As a result, the deviation of the shape and size of the solder 7 that can occur according to the variation is suppressed. As a result, such a printed circuit board assembly 100 includes the printed circuit board assembly 100 in which the sum of the first distance L1 and the second distance L2 exceeds the width W1 in the first direction A of the second wiring pattern 5 and the conventional printed circuit board assembly 100. Compared with the printed circuit board assembly, the bonding strength between the first printed circuit board 1 and the second printed circuit board 2 is stably increased.

  As shown in FIG. 5, in the printed circuit board assembly 100, the sum of the third distance L3 and the fourth distance L4 is equal to the width W4 of the first hole 3A in the second direction B and the first insertion portion 6A. The difference from the width W3 in the second direction B is smaller.

  In this way, even when the fitting tolerance in the second direction B is set to be relatively large, the second printed circuit board 2 is inserted into the through hole 3 of the first printed circuit board 1 in the method for manufacturing the printed circuit board assembly 100. When the relative position in the second direction B of the second printed circuit board 2 with respect to the first printed circuit board 1 is changed by a predetermined amount when the first printed circuit board 1 is inserted, the second wiring pattern 5 is formed on the inner peripheral surface of the second hole 3B. Can touch. Specifically, each of the two sides that are not connected to the base material of the second printed circuit board 2 among the four sides extending in the third direction C of the second wiring pattern 5 formed on the second surface 2A, and the second Of the four sides extending in the third direction C of the second wiring pattern 5 formed on the surface opposite to the second surface 2A, each of the two sides not connected to the base material of the second printed circuit board 2 is It can come into contact with the inner peripheral surface of the second hole 3B.

  As shown in FIG. 5, in the printed circuit board assembly 100, when the first printed circuit board 1 is viewed in plan, the second wiring pattern 5 is located at the center of the second hole 3 </ b> B rather than the first wiring pattern 4. It is arranged at a close position. The first wiring pattern 4 and the second wiring pattern 5 may be joined via the solder 7. In other words, the first wiring pattern 4 and the second wiring pattern 5 may not be directly connected but may be indirectly connected via the solder 7.

  In such a printed circuit board assembly 100, compared to the case where the first wiring pattern 4 and the second wiring pattern 5 are directly connected, the deformation or vibration of the first printed circuit board 1 or the second printed circuit board 2 is caused. The stress applied to the first wiring pattern 4 and the second wiring pattern 5 when the relative positional relationship between the first wiring pattern 4 and the second wiring pattern 5 changes can be reduced. In this case, stress is applied to the solder 7, but in the printed circuit board bonded body 100, at least the deviation of the solder 7 in each direction of the first direction A and the third direction C is suppressed. It is suppressed that stress concentrates on the part and cracks occur in the solder 7. That is, in the printed circuit board assembly 100 as described above, the occurrence of cracks in each of the first wiring pattern 4, the second wiring pattern 5, and the solder 7 is suppressed.

  As shown in FIGS. 1 and 2, in the printed circuit board assembly 100, the first wiring pattern 4 and the second wiring pattern 5 can be joined by the fillet-shaped solder 7. Therefore, compared with the case where the 1st wiring pattern 4 and the 2nd wiring pattern 5 are joined by the solder 7 which does not comprise the fillet, the joining strength of the 1st wiring pattern 4 and the 2nd wiring pattern 5 is improved. It has been.

  As shown in FIG. 5, in the printed circuit board assembly 100, the first direction A of the second wiring pattern 5 when the first printed circuit board 1 is viewed in plan even when the fitting tolerance is set. The center line C1 extending in the second direction B through the center of the second hole 3B may be disposed so as to overlap the center line C2 extending in the second direction B through the center in the first direction A of the second hole 3B. In this case, the shape and size of the fillet of the solder 7 that joins the first wiring pattern 4 and the second wiring pattern 5 are axisymmetric with respect to the center line of the second hole 3B in at least the first direction A, and It can be axisymmetric with respect to the center line of the second hole 3B in the third direction. Such a printed circuit board assembly 100 is more stable in bonding strength between the first printed circuit board and the second printed circuit board while the fitting tolerance is set as compared with the conventional printed circuit board assembly in which the fitting tolerance is set. Has been raised.

Embodiment 2. FIG.
Next, a printed circuit board assembly according to Embodiment 2 will be described with reference to FIG. The printed circuit board assembly according to the second embodiment basically has the same configuration as the printed circuit board assembly 100 according to the first embodiment, but the width W2 of the second hole 3B in the first direction A is the first. It differs in that it is wider than the width W6 of the second hole 3B in the second direction B.

  When the first printed circuit board 1 is viewed in plan, the planar shape of the second hole 3B is, for example, an ellipse. The planar shape of the second hole 3B may be, for example, an elliptical shape or a rectangular shape. The width W2 (major axis) in the first direction A of the second hole 3B is, for example, 8 mm. The width W6 (minor axis) in the second direction B of the second hole 3B is, for example, 1 mm.

  Even in this case, the printed circuit board assembly according to the second embodiment has basically the same configuration as the printed circuit board assembly 100 according to the first embodiment. There is an effect.

  Furthermore, the printed circuit board assembly 100 according to the second embodiment includes, for example, the first surface 1A of the first printed circuit board 1 and the first wiring patterns 4 formed on the surface opposite to the first surface 1A. It is suitable for a printed circuit board assembly in which a large current of about 10 A is passed. When a large current of about 10 A flows through the first wiring pattern 4, either the width W2 of the second hole 3B in the first direction A or the width W6 of the second hole 3B in the second direction B is a predetermined length. It is preferable that it is more than this. This is to suppress the temperature rise of the first wiring pattern 4 and the solder 7 due to the increase in the density of the current flowing through the first wiring pattern 4.

  However, when the planar shape of the second hole 3B is a perfect circle, either the width W2 of the second hole 3B in the first direction A or the width W6 of the second hole 3B in the second direction B is predetermined. The width W6 in the second direction B of the second hole 3B is equal to or greater than a predetermined length, and the distance in the second direction B between the first wiring pattern 4 and the second wiring pattern 5 Becomes longer. Therefore, for example, when the solder 7 is formed by a flow method, the solder 7 is hardly spread on the first surface 1A of the first printed circuit board 1 through the second hole 3B and is formed on the first surface 1A. The amount of solder 7 is smaller than the amount of solder 7 formed on the surface opposite to the first surface 1A. As a result, the bonding strength between the first wiring pattern 4 on the first surface 1A and the solder 7 is higher than the bonding strength between the first wiring pattern 4 on the surface opposite to the first surface 1A and the solder 7. become weak.

  On the other hand, according to the printed circuit board assembly according to Embodiment 2, the width W2 of the second hole 3B in the first direction A is wider than the width W6 of the second hole 3B in the second direction B. A large current of about 10 A can flow through the first wiring pattern 4. Furthermore, according to the printed circuit board assembly, the distance in the second direction B between the first wiring pattern 4 and the second wiring pattern 5 can be set to such an extent that the solder 7 can sufficiently wet. . Therefore, the amount of the solder 7 formed on the first surface 1A is not smaller than the amount of the solder 7 formed on the surface located on the opposite side to the first surface 1A. As a result, the bonding strength between the first wiring pattern 4 on the first surface 1A and the solder 7 is the same as the bonding strength between the first wiring pattern 4 on the surface opposite to the first surface 1A and the solder 7. Can be of a degree. That is, according to the printed circuit board assembly according to the second embodiment, a large current of about 10 A can flow through the first wiring pattern 4 and the bonding strength between the first printed circuit board 1 and the second printed circuit board 2 is high. Stablely raised.

<Modification>
Next, a modified example of the printed circuit board assembly according to Embodiment 1 and Embodiment 2 will be described.

  In the first embodiment and the second embodiment, the first printed circuit board 1 is formed so as to be line-symmetric with respect to a center line extending along the first direction A through the center of the through hole 3 in the second direction B. Yes. In the first and second embodiments, the second printed circuit board 2 is formed so as to be symmetric with respect to a center line extending along the first direction A through the center in the second direction B. However, the present invention is not limited to this, and the first printed circuit board 1 in the first and second embodiments has a center line extending along the first direction A through the center of the through hole 3 in the second direction B. You may form so that it may not become line symmetry. Similarly, in the first embodiment and the second embodiment, the second printed circuit board 2 is formed so as not to be line-symmetric with respect to a center line passing through the center in the second direction B and extending along the first direction A. May be.

  In the first embodiment and the second embodiment, the first printed circuit board 1 is formed so as to be line-symmetric with respect to a center line extending along the first direction A through the center of the through hole 3 in the second direction B. Yes. However, the present invention is not limited to this, and each of the plurality of second hole portions 3B in the first and second embodiments may have different shapes and dimensions.

  In the first embodiment and the second embodiment, among the plurality of second hole portions 3B, the intervals in the first direction A between the two second hole portions 3B adjacent in the first direction A are equal to each other. However, the present invention is not limited to this, and in the first and second embodiments, the first direction A between two second hole portions 3B adjacent in the first direction A among the plurality of second hole portions 3B. The intervals in may be different from each other.

  In the first embodiment and the second embodiment, the first printed circuit board 1 is provided with a plurality of through holes 3, and the second printed circuit board 2 includes a plurality of insertion portions 6. However, the present invention is not limited to this. It is not a thing. In the first printed circuit board 1, for example, only one through hole 3 having the same configuration as the first through hole 3 may be arranged. The second printed circuit board 2 may include only one insertion portion 6 having the same configuration as the first insertion portion 6 described above, for example.

  In the first and second embodiments, each of the plurality of through holes 3 of the first printed circuit board 1 may include a plurality of first hole portions 3A and a plurality of second hole portions 3B. Each of the plurality of insertion portions 6 of the second printed circuit board 2 may have a plurality of second wiring patterns 5.

  As shown in FIG. 5, in the first and second embodiments, the width W <b> 1 of the second wiring pattern 5 in the first direction A is wider than the width (thickness) of the second wiring pattern 5 in the second direction B. However, the configuration of the second wiring pattern 5 is not limited to this. As shown in FIG. 7, the width of the second wiring pattern 5 in the first direction A may be narrower than the width (thickness) of the second wiring pattern 5 in the second direction B. Even the printed circuit board assembly including the second wiring pattern 5 has the same configuration as that of the printed circuit board assembly in the first and second embodiments with respect to the other configurations. The same effect as the printed circuit board assembly in 2 and 2 can be obtained.

  Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 1st printed circuit board, 1A 1st surface, 2nd 2nd printed circuit board, 2A 2nd surface, 3 Through-hole (1st through-hole, 2nd through-hole, 3rd through-hole), 3A 1st hole 3B 2nd hole part, 4 1st wiring pattern, 5 2nd wiring pattern, 6 insertion part (1st insertion part, 2nd insertion part, 3rd insertion part), 6A 1st insertion part, 6B 1st 2 Insertion part, 7 Solder, 8 Notch, 100 Printed circuit board assembly.

Claims (6)

A first printed circuit board in which a through hole is disposed;
A second printed circuit board including the insertion portion 6 inserted into the through hole,
The through-hole is connected to the first hole and extends in the first direction when the first printed circuit board is viewed in plan, and intersects the first direction. And a second hole having a width in the second direction wider than the width of the first hole in the second direction,
The width of the through hole in the first direction is wider than the width of the insertion portion in the first direction,
The first printed circuit board includes a first wiring pattern constituting an inner peripheral surface of the second hole portion,
The insertion part of the second printed circuit board includes a second wiring pattern formed in a second insertion part inserted in the second hole part,
The width of the second wiring pattern in the first direction is narrower than the width of the second hole in the first direction,
The width of the second insertion portion in the second direction is wider than the width of the first hole in the second direction, and
A printed circuit board assembly comprising a conductive bonding member that bonds the first wiring pattern and the second wiring pattern. The shortest distance in the first direction between the second wiring pattern and the inner peripheral surface of the second hole located on one side in the first direction with respect to the second wiring pattern is defined as a first distance. ,
The shortest distance in the first direction between the second wiring pattern and the inner peripheral surface of the second hole located on the other side in the first direction with respect to the second wiring pattern is defined as a second distance. ,
2. The printed circuit board assembly according to claim 1, wherein a sum of the first distance and the second distance is equal to or less than a width of the second wiring pattern in the first direction. The width of the through hole in the second direction is wider than the width of the insertion portion in the second direction,
The shortest distance in the second direction between the second insertion portion and the inner peripheral surface of the second hole located on one side in the second direction with respect to the second insertion portion is defined as a third distance. ,
The shortest distance in the second direction between the second insertion portion and the inner peripheral surface of the second hole located on the other side in the second direction with respect to the second insertion portion is a fourth distance. ,
The sum of the third distance and the fourth distance is the width of the first hole portion in the second direction and the second direction of the first insertion portion inserted into the first hole portion of the insertion portion. The printed circuit board assembly according to claim 1, wherein the printed circuit board assembly is smaller than a difference from the width of the printed circuit board.   The printed circuit board assembly according to any one of claims 1 to 3, wherein the first wiring pattern and the second wiring pattern are bonded via the conductive bonding member.   The printed circuit board assembly according to any one of claims 1 to 4, wherein a width of the second hole portion in the first direction is wider than a width of the second hole portion in the second direction. When the first printed circuit board is viewed in plan, the center line extending in the second direction through the center in the first direction of the second wiring pattern passes through the center in the first direction of the second hole. The printed circuit board assembly according to claim 1, wherein the printed circuit board assembly is disposed so as to overlap with a center line extending in the second direction.

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